MICROWAVE POWER GaAs FET TIM1414-10LA-252 PRELIMINARY MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES n HIGH POWER P1dB=39.5dBm at 13.75GHz to 14.5GHz n HIGH GAIN G1dB=5.5dB at 13.75GHz to 14.5GHz n BROAD BAND INTERNALLY MATCHED n HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS ( Ta= 25 C ) CHARACTERISTICS Output Power at 1dB SYMBOL CONDITION P1dB UNIT MIN. TYP. MAX. dBm 39.0 39.5 dB 4.5 5.5 5.0 0.8 Compression Point Power Gain at 1dB G1dB VDS= 9 V f = 13.75 to 14.5GHz Compression Point Drain Current Gain Flatness IDS1 G A dB 4.0 Power Added Efficiency add % 23 3rd Order Intermodulation IM3 dBc -42 -45 Distortion Two Tone Test Po= 29.0dBm Drain Current IDS2 (Single Carrier Level) A 4.0 5.0 Channel Temperature Rise Tch VDS X IDS X Rth(c-c) C 90 UNIT mS MIN. TYP. MAX. 2800 V -2.0 -3.5 -5.0 A 10.0 11.5 V -5 C/W 2.0 2.5 ELECTRICAL CHARACTERISTICS ( Ta= 25 C ) CHARACTERISTICS Transconductance Saturated Drain Current IDSS Gate-Source Breakdown Voltage VGSO CONDITION VDS = 3V IDS = 4.8A VDS = 3V IDS = 145mA VDS = 3V VGS= 0V IGS= -145 A Rth(c-c) Channel to Case Pinch-off Voltage Thermal Resistance SYMBOL gm VGSoff u The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use, No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product Jan. 2002 TIM1414-10LA-252 ABSOLUTE MAXIMUM RATINGS ( Ta= 25 C ) CHARACTERISTICS SYMBOL UNIT RATING Drain-Source Voltage VDS V 15 Gate-Source Voltage VGS V -5 Drain Current IDS A 11.5 Total Power Dissipation (Tc= 25 C) PT W 60.0 Channel Temperature Tch C 175 Storage Tstg C -65 +175 * Unit in mm * Gate Source Drain 2.0 MIN. 3.20.3 12.90.2 4-R3.0 2.0 MIN. PACKAGE OUTLINE (2-11C1B) 0.60.15 17.00.3 . 5.0 MAX. 2.60.3 0.2 MAX. 11.0 MAX. 1.70.3 0.1 +0.1 -0.05 21.5 MAX. HANDLING PRECAUTIONS FOR PACKAGED TYPE Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260C. 2