PC3Q67QJ000F Series Mini-flat Half Pitch 4-channel Package, General Purpose Photocoupler PC3Q67QJ000F Series * 1-channel package type is also available. (model No. PC3H7J00000F Series) Description Agency approvals/Compliance PC3Q67QJ000F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4 channel Mini-flat package, Half ptich type. Input-output isolation voltage(rms) is 2.5kV. Collector-emitter voltage is 80V and CTR is 50% to 600% at input current of 5mA. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC3Q67Q) 2. Approved by VDE, DIN EN60747-5-2 ( * ) (as an option), file No. 40009162 (as model No. PC3Q67Q) 3. Package resin : UL flammability grade (94V-0) Features Applications 1. 4 channel Mini-flat Half pitch package (Lead pitch : 1.27mm) 2. Double transfer mold package (Ideal for Flow Soldering) 3. High collector-emitter voltage (VCEO : 80V) 4. Current transfer ratio (CTR : MIN. 50% at IF=5mA, VCE=5V) 5. Isolation voltage between input and output (Viso(rms) : 2.5kV) 6. Lead-free and RoHS directive compliant 1. Programmable controllers (*) DIN EN60747-5-2 : successor standard of DIN VDE0884 Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A02002EN Date Jun. 30. 2005 (c) SHARP Corporation PC3Q67QJ000F Series Internal Connection Diagram 16 15 14 13 12 11 10 9 1 3 5 7 2 4 6 8 9 11 13 15 10 12 14 16 1 2 3 4 5 6 7 Anode Cathode Emitter Collector 8 Outline Dimensions (Unit : mm) VDE option 10.30.3 1.270.25 16 16 4.40.2 PC3Q 6 7 Q 1 SHARP mark "S" Date code 9 8 PC3Q67Q 4 0.40.1 1 Primary side mark Date code 9 0.40.1 4.40.2 1.270.25 SHARP mark "S" 10.30.3 VDE Indenfication mark 8 45 0.5+0.4 -0.2 7.0+0.2 -0.7 Product mass : approx. 0.3g 0.20.05 2.60.2 0.20.05 6 5.30.3 0.10.1 0.10.1 2.60.2 Primary side mark 6 5.30.3 45 0.5+-0.4 0.2 7.0+-0.2 0.7 Product mass : approx. 0.3g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A02002EN 2 PC3Q67QJ000F Series Date code (3 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * Mark P R S T U V W X A B C ** * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D 3rd digit Week of production Week Mark 1st 1 2nd 2 3rd 3 4th 4 5, 6th 5 repeats in a 20 year cycle Country of origin Japan Rank mark There is no rank mark indicator. Sheet No.: D2-A02002EN 3 PC3Q67QJ000F Series Absolute Maximum Ratings Output Input Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation Topr Operating temperature Tstg Storage temperature *2 Isolation voltage Viso (rms) *3 Soldering temperature Tsol Rating 50 1 6 70 80 6 50 150 170 -30 to +100 -40 to +125 2.5 260 (Ta=25C) Unit mA A V mW V V mA mW mW C C kV C *1 Pulse width100ms, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF IR Reverse Current Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Cf Floating capacitance tr Rise time Response time Fall time tf Conditions IF=20mA VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=5mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=2V, IC=2mA, RL=100 MIN. - - - - 80 6 2.5 - 5x1010 - - - TYP. 1.2 - 30 - - - 5.0 0.1 1x1011 0.6 4 3 MAX. 1.4 10 250 100 - - 30.0 0.2 - 1.0 18 18 (Ta=25C) Unit V A pF nA V V mA V pF s s Sheet No.: D2-A02002EN 4 PC3Q67QJ000F Series Model Line-up Taping 1 000pcs/reel DIN EN60747-5-2 Approved Model No. PC3Q67QJ000F PC3Q67QYJ00F Package Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A02002EN 5 PC3Q67QJ000F Series Fig.2 Diode Power Dissipation vs. Ambient Temperature Fig.1 Forward Current vs. Ambient Temperature 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 -30 0 25 50 55 75 100 80 70 60 40 20 0 -30 125 0 Fig.3 Collector Power Dissipation vs. Ambient Temperature 75 100 125 Fig.4 Total Power Dissipation vs. Ambient Temperature 250 250 Total power dissipation Ptot (mW) Collector power dissipation PC (mW) 50 55 Ambient temperature Ta (C) Ambient temperature Ta (C) 200 150 100 50 0 -30 0 25 50 75 100 200 170 150 100 50 0 -30 125 Ambient temperature Ta (C) 10 000 0 25 50 75 100 125 Ambient temperature Ta (C) Fig.6 Forward Current vs. Forward Voltage Fig.5 Peak Forward Current vs. Duty Ratio 100 Pulse width100ms Ta=25C Forward current IF (mA) Peak forward current IFM (mA) 25 1 000 100 T a =50C 75C 100C 10 25C 0C - 30C 1 10 10-3 10-2 Duty ratio 10-1 0.1 1 0 0.5 1 1.5 2 Forward voltage VF (V) Sheet No.: D2-A02002EN 6 PC3Q67QJ000F Series Fig.7 Current Transfer Ratio vs. Forward Current Fig.8 Collector Current vs. Collector-emitter Voltage 500 Ta=25C Pc (max) 50 IF=30mA 20mA 400 10mA Collector current IC (mA) Current transfer ratio CTR (%) VCE=5V Ta=25C 300 200 100 40 30 5mA 20 10 1mA 0 0 0.1 1 10 100 8 2 4 6 Collector-emitter voltage VCE (V) 0 Forward current IF (mA) Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 150 0.16 IF=1mA,VCE=5V IF=20mA IC=1mA 0.14 Collector-emitter saturation voltage VCE (sat) (V) Relative current transfer ratio (%) 10 IF=5mA,VCE=5V 100 50 0.12 0.1 0.08 0.06 0.04 0.02 0 -40 -20 0 20 40 60 80 0 -30 100 Ambient temperature Ta (C) Fig.11 Collector Dark Current vs. Ambient Temperature 0 20 40 60 80 Ambient temperature Ta (C) 100 Fig.12 Response Time vs. Load Resistance 1 000 10-5 VCE=2V IC=2mA Ta=25C VCE=50V 100 Response time (s) Collector dark current ICEO (A) 10-6 10-7 10-8 10-9 tr 10 tf td ts 1 10-10 10-11 -30 0.1 0.01 0 20 40 60 80 Ambient temperature Ta (C) 100 0.1 1 10 Load resistance RL (k) 100 Sheet No.: D2-A02002EN 7 PC3Q67QJ000F Series Fig.13 Test Circuit for Response Time Fig.14 Collector-emitter Saturation Voltage vs. Forward Current RD RL Collector-emitter saturation voltage VCE (sat) (V) VCC Output Input Output Input 10% VCE td tr ts tf 90% Please refer to the conditions in Fig.12 Ta=25C 10 IC=0.5mA 8 1mA 3mA 6 5mA 7mA 4 2 0 0 2 4 6 8 Forward current IF (mA) 10 Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A02002EN 8 PC3Q67QJ000F Series Design Considerations Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Recommended Foot Print (reference) 0.8 1.27 6.3 1.5 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A02002EN 9 PC3Q67QJ000F Series Manufacturing Guidelines Soldering Method Reflow Soldering : Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A02002EN 10 PC3Q67QJ000F Series Cleaning instructions Solvent cleaning: Solvent temperature should be 45C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A02002EN 11 PC3Q67QJ000F Series Package specification Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions D J G E I X. MA H H A B C F 5 K Dimensions List A B 0.3 24.0 11.50.1 H I 0.1 10.8 0.40.05 C 1.750.1 J 3.00.1 D 12.00.1 K 7.40.1 E 2.00.1 F 4.00.1 (Unit : mm) G +0.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 330 25.51.5 e f 1.0 23 2.00.5 f a b (Unit : mm) c d 1001.0 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A02002EN 12 PC3Q67QJ000F Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E184] Sheet No.: D2-A02002EN 13