DSPIC33FJ16MC304-H/ML - Microchip Technology, Inc.

dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304

Data Sheet

High-Performance,

16-bit Digital Signal Controllers

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

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arising from this information and its use. Use of Microchip

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hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

PIC32 logo, rfPIC and UNI/O are registered trademarks of

Microchip Te chnology Incorporated in the U.S.A. and other

countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT,

chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,

dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,

FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,

Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,

MPLINK, mTouch, Omniscient C ode Generation, PICC,

PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,

rfLAB, Select Mode, Total Endurance, TSHARC,

UniWinDriver, WiperLock and ZENA are trademarks of

Microchip Te chnology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip T echnology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-61341-370-8

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:200 9 certif ication for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in Calif ornia

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microper ipher als, nonvol ati le memo ry and

analog product s. In addition, Microchip ’s quality system for th e design

and manufacture of development systems is ISO 9001:2000 certified.

dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304

Operating Range:

• Up to 40 MIPS operation (@ 3.0-3.6V):

- Industrial temperature range (-40°C to +85 °C)

- Extended temperature range (-40°C to +125°C)

• Up to 20 MIPS operation (@ 3.0-3.6V)

- High temperature range (-40°C to +150°C)

High-Performance DSC CPU:

• Modified Harvard architecture

• C compiler optimized instruction set

• 16-bit wide data path

• 24-bit wide instructions

• Linear program memory addressing up to 4M

instruction words

• Linear data memory addressing up to 64 Kbytes

• 83 base instructions: mostly 1 word/1 cycle

• Two 40-bit accumulators with rounding and

saturation options

• Flexible and powerful addre ssing modes:

-Indirect

- Modulo

- Bit-reversed

• Software stack

• 16 x 16 fractional/integer multiply operations

• 32/16 and 16/16 divide operations

• Single-cycle multiply and accumulate:

- Accumulator write back for DSP operations

- Dual data fetch

• Up to ±16-bit shifts for up to 40-bit data

Timers/Capture/Compare/PWM:

• Timer/Counters, up to three 16-bit timers

- Can pair up to make one 32-bit timer

- One timer runs as Real-Time Clock with

external 32.768 kHz oscillator

- Programmable prescale r

• Input Capture (up to four channels):

- Capture on up, down or both ed ges

- 16-bit capture input functions

- 4-deep FIFO on each captur e

• Output Compare (up to two channels):

- Single or Dual 16-Bit Compare mode

- 16-bit Glitchle ss PWM mode

Interrupt Controller:

• 5-cycle latency

• Up to 26 available interrupt sources

• Up to three external interrupts

• Seven programmable priority levels

• Four processor exceptions

Digital I/O:

• Peripheral pin Select functionality

• Up to 35 programmable digital I/O pins

• Wake-up/Interrupt-on-Change for up to 31 pins

• Output pins can drive from 3.0V to 3.6V

• Up to 5.5V output with open drain configuration on

5V tolerant pins with external pull-up

• 4 mA sink on all I/O pin s

On-Chip Flash and SRAM:

• Flash program memory (up to 32 Kbytes)

• Data SRAM (2 Kbytes)

• Boot and General Security for program Flash

System Management:

• Flexible clock options:

- External, crystal, resonator, internal RC

- Fully integrated Phase-Locked Loop (PLL)

- Extremely low jitter PLL

• Power-up Timer

• Oscillator Start-up Timer/Stabilizer

• Watchdog Timer with its own RC oscillator

• Fail-Safe Clock Monitor

• Reset by multiple sources

Power Management:

• On-chip 2.5V voltage regulator

• Switch between clock sources in real time

• Idle, Sleep and Doze modes with fast wake-up

High-Performance, 16-bit Digital Signal Controllers

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Motor Control Peripherals:

• 6-channel 16-bit Motor Control PWM:

- Three duty cycle generators

- Independent or Complementary mode

- Programmable dea d time and output polarity

- Edge-aligned or center-aligned

- Manual output override control

- One Fault input

- Trigger for ADC conversions

- PWM frequency for 16-bit resolution

(@ 40 MIPS) = 1220 Hz for Edge-Aligned

mode, 610 Hz for Center-Aligned mode

- PWM frequen cy for 11-bit resolution

(@ 40 MIPS) = 39.1 kHz for Edge-Aligned

mode, 19.55 kHz for Center-Aligned mode

• 2-channel 16-bit Motor Control PWM:

- One duty cycle generator

- Independent or Complementary mode

- Programmable dea d time and output polarity

- Edge-aligned or center-aligned

- Manual output override control

- One Fault input

- Trigger for ADC conversions

- PWM frequency for 16-bit resolution

(@ 40 MIPS) = 1220 Hz for Edge-Aligned

mode, 610 Hz for Center-Aligned mode

- PWM frequen cy for 11-bit resolution

(@ 40 MIPS) = 39.1 kHz for Edge-Aligned

mode, 19.55 kHz for Center-Aligned mode

• Quadrature Encoder Interface module:

- Phase A, Phase B and index pulse input

- 16-bit up/down position counter

- Count di rection status

- Position Measurement (x2 and x4) mode

- Programmable digital noise filters on inputs

- Alternate 16-bit Timer/Counter mode

- Interrupt on position counter rollover/underflow

Analog-to-Digital Converters (ADCs):

• 10-bit, 1.1 Msps or 12-bit, 500 ksps conversion:

- Two and four simultaneous samples (10-bit ADC)

- Up to nine input channels with auto-scanning

- Conversion start can be manual or

synchronized with one of four trigger sources

- Conversion possible in Sleep mode

- ±2 LSb max integral nonlinearity

- ±1 LSb max differential nonlinearity

CMOS Flash Technology:

• Low-power, high-speed Flash technology

• Fully static design

• 3.3V (±10%) operating voltage

• Industrial and Extended temperature

• Low power consumpt io n

Communication Modules:

• 4-wire SPI:

- Framing supports I/O interface to simple

codecs

- Supports 8-bit and 16-bit data

- Supports all serial clock formats and

sampling modes

•I

2C™:

- Full Multi-Master Slave mode support

- 7-bit and 10-bit addressing

- Bus collision detection and arbitration

- Integrated signal conditioning

- Slave address masking

•UART:

- Interrupt on address bit detect

- Interrupt on UART error

- Wake-up on Start bit from Sleep mode

- 4-character TX and RX FIFO bu ffers

- LIN bus support

-IrDA

® encoding and decoding in hardware

- High-Speed Baud mode

- Hardware Fl ow Control with CTS and RTS

Packaging:

• 28-pin SPDIP/SOIC/SSOP/QFN-S

• 44-pin QFN/TQFP

Note: See Table 1 for the exact peripheral

features per device.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 Product Families

The device names, pin counts, memory sizes and

peripheral availability of each device are listed below.

The following pages show their pinout diagrams.

TABLE 1: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 CONTROLLER FAMILIES

Device Pins

Program Flash Memory (Kbyte)

RAM (Kbyte)

Remappable Peripherals

10-Bit/12-Bit ADC

I2C™

I/O Pins

Packages

Remappable Pins

16-bit Timer

Input Capture

Output Compare

Standard PW M

Motor Control PWM

Quadrature Encoder

Interface

UART

External Interrupts(3)

SPI

dsPIC33FJ32MC202 28 32 2 16 3(1) 426ch

(2)

2ch(2) 1 1 3 1 1ADC,

6 ch 121

SPDIP

SOIC

SSOP

QFN-S

dsPIC33FJ32MC204 44 32 2 26 3(1) 426ch

(2)

2ch(2) 1 1 3 1 1ADC,

9 ch 135QFN

TQFP

dsPIC33FJ16MC304 44 16 2 26 3(1) 426ch

(2)

2ch(2) 1 1 3 1 1ADC,

9 ch 135QFN

TQFP

Note 1: Only two out of three timers are remappable.

2: Only PWM fault inputs are remappable.

3: Only two out of three interrupts are remappable.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Pin Diagrams

dsPIC33FJ32MC202

MCLR

VSS

VDD

AN0/VREF+/CN2/RA0

AN1/VREF-/CN3/RA1

AVDD

AVSS

PGED1/AN2/C2IN-/RP0(1)/CN4/RB0

PGEC3/ASCL1/RP6(1)/CN24/RB6

SOSCO/T1CK/CN0/RA4

SOSCI/RP4(1)/CN1/RB4 VSS

OSC2/CLKO/CN29/RA3

OSC1/CLKI/CN30/RA2 VCAP

INT0/RP7/CN23/RB7

TDO/PWM2L1/SDA1/RP9(1)/CN21/RB9

TCK/PWM2H1/SCL1/RP8(1)/CN22/RB8

AN5/RP3(1)/CN7/RB3

AN4/RP2(1)/CN6/RB2

PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1

PWM1L1/RP15(1)/CN11/RB15

PWM1H1/RP14(1)/CN12/RB14

PWM1L2/RP13(1)/CN13/RB13

PWM1H2/RP12(1)/CN14/RB12

PGED2/TDI/PWM1H3/RP10(1)/CN16/RB10

PGEC2/TMS/PWM1L3/RP11(1)/CN15/RB11

PGED3/ASDA1/RP5(1)/CN27/RB5

28-PIN SPDIP, SOIC, SSOP

28-Pin QFN-S(2)

10 11

12 13 14 15

716

232425262728

dsPIC33FJ32MC202

MCLR

VSS

VDD AN0/VREF+/CN2/RA0

AN1/VREF-/CN3/RA1

AVDD

AVSS

PGED1/EMUD1/AN2/C2IN-/RP0(1)/CN4/RB0

PGEC3/EMUC3/ASCL1/RP6(1)/CN24/RB6

SOSCO/T1CK/CN0/RA4

SOSCI/RP4/CN1/RB4

VSS

OSC2/CLKO/CN29/RA3

OSC1/CLKI/CN30/RA2 VCAP

INT0/RP7(1)/CN23/RB7

TDO/PWM2L1/SDA1/RP9(1)/CN21/RB9

TCK/PWM2H1/SCL1/RP8(1)/CN22/RB8

AN5/RP3(1)/CN7/RB3

AN4/RP2(1)/CN6/RB2

PGEC1/EMUC1/AN3/C2IN+/RP1(1)/CN5/RB1

PWM1L1/RP15(1)/CN11/RB15

PWM1H1/RP14(1)/CN12/RB14

PWM1L2/RP13(1)/CN13/RB13

PWM1H2/RP12(1)/CN14/RB12

PGED2/EMUD2/TDI/PWM1H3/RP10(1)/CN16/RB10

PGEC2/EMUC2/TMS/PWM1L3/RP11(1)/CN15/RB11

PGED3/EMUD3/ASDA1/RP5(1)/CN27/RB5

Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available

peripherals.

2: The metal plane at the bottom of the device is not connected to any pins and is recommended to

be connected to VSS externally.

= Pins are up to 5V tolerant

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Pin Diagrams (Continued)

44-Pin QFN(2)

44434241403938373635

12131415161718192021

232

dsPIC33FJ32MC204

PGEC1/EMUC1/AN3/C2IN+/RP1(1)/CN5/RB1

PGED1/EMUD1/AN2/C2IN-/RP0(1)/CN4/RB0

AN1/VREF-/CN3/RA1

AN0/VREF+/CN2/RA0

MCLR

TMS/RA10

AVDD

AVSS

PWM1L1/RP15(1)/CN11/RB15

PWM1H1/RP14(1)/CN12/RB14

TCK/RA7

SCL1/RP8(1)/CN22/RB8

INT0/RP7/CN23/RB7

PGEC3/EMUC3/ASCL1/RP6(1)/CN24/RB6

PGED3/EMUD3/ASDA1/RP5(1)/CN27/RB5

VDD

TDI/RA9

SOSCO/T1CK/CN0/RA4

VSS

RP21(1)/CN26/RC5

RP20(1)/CN25/RC4

RP19(1)/CN28/RC3

PWM1H2/RP12(1)/CN14/RB12

PGEC2/EMUC2/PWM1L3/RP11(1)/CN15/RB11

PGED2/EMUD2/PWM1H3/RP10(1)/CN16/RB10

VCAP

VSS

RP25/CN19/RC9

RP24/CN20/RC8

PWM2L1/RP23(1)/CN17/RC7

PWM2H1/RP22(1)/CN18/RC6

SDA1/RP9(1)/CN21/RB9

PWM1L2/RP13(1)/CN13/RB13

AN4/RP2(1)/CN6/RB2

AN5/RP3(1)/CN7/RB3

AN6/RP16(1)/CN8/RC0

AN7/RP17(1)/CN9/RC1

AN8/RP18(1)/CN10/RC2

SOSCI/RP4(1)/CN1/RB4

VDD

VSS

OSC1/CLKI/CN30/RA2

OSC2/CLKO/CN29/RA3

TDO/RA8

dsPIC33FJ16MC304

= Pins are up to 5V tolerant

Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available

peripherals.

2: The metal plane at the bottom of the device is not connected to any pins and is recommended to

be connected to VSS externally.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Pin Diagrams (Continued)

SCL1/RP8(1)/CN22/RB8

INT0/RP7(1)/CN23/RB7

PGEC3/EMUC3/ASCL1/RP6(1)/CN24/RB6

PGED3/EMUD3/ASDA1/RP5(1)/CN27/RB5

VDD

TDI/RA9

SOSCO/T1CK/CN0/RA4

VSS

RP21(1)/CN26/RC5

RP20(1)/CN25/RC4

RP19/(1)CN28/RC3

PGEC1/EMUC1/AN3/C2IN+/RP1(1)/CN5/RB1

PGED1/EMUD1/AN2/C2IN-/RP0(1)/CN4/RB0

AN1/VREF-/CN3/RA1

AN0/VREF+/CN2/RA0

MCLR

TMS/RA10

AVDD

AVSS

PWM1L1/RP15(1)/CN11/RB15

PWM1H1/RP14(1)/CN12/RB14

PWM1H2/RP12(1)/CN14/RB12

PGEC2/EMUC2/PWM1L3/RP11(1)/CN15/RB11

PGED2/EMUD2/PWM1H3/RP10(1)/CN16/RB10

VCAP

VSS

RP25(1)/CN19/RC9

RP24(1)/CN20/RC8

PWM2L1/RP23(1)/CN17/RC7

PWM2H1/RP22(1)/CN18/RC6

SDA1/RP9(1)/CN21/RB9

AN4/RP2(1)/CN6/RB2

AN5/RP3(1)/CN7/RB3

AN6/RP16(1)/CN8/RC0

AN7/RP17(1)/CN9/RC1

AN8/RP18(1)/CN10/RC2

SOSCI/RP4(1)/CN1/RB4

VDD

VSS

OSC1/CLKI/CN30/RA2

OSC2/CLKO/CN29/RA3

TDO/RA8

44-Pin TQFP

PWM1L2/RP13(1)/CN13/RB13

TCK/RA7

dsPIC33FJ32MC204

dsPIC33FJ16MC304

Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available

peripherals.

= Pins are up to 5V tolerant

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Table of Content s

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Product Families.................................................................................................. 5

1.0 Device Overview ........................................................................................................................................................................ 11

2.0 Guidelines for Getting Started with 16-bit Digital Signal Controllers .......................................................................................... 17

3.0 CPU............................................................................................................................................................................................ 21

4.0 Memory Organization................................................................................................................................................................. 33

5.0 Flash Program Memory.............................................................................................................................................................. 59

6.0 Resets ....................................................................................................................................................................................... 65

7.0 Interrupt Controller ................................................................. .................................................................................................... 73

8.0 Oscillator Configuration............................................................................................................................................. ............... 105

9.0 Power-Saving Features............................................................................................................................................................ 115

10.0 I/O Ports................................................................................................................................................................................... 121

11.0 Timer1...................................................................................................................................................................................... 147

12.0 Timer2/3 feature ............................................... ....................................................................................................................... 149

13.0 Input Capture............................................................................................................................................................................ 155

14.0 Output Compare....................................................................................................................................................................... 157

15.0 Motor C ontrol PWM Module..................................................................................................................................................... 161

16.0 Quadrature Encoder Interface (QEI) Module ........................................................................................................................... 175

17.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 181

18.0 Inter-Integrated Circuit™ (I2C™).............................................................................................................................................. 187

19.0 Universal Asynchronous Receiver Transmitter (UART)........................................................................................................... 195

20.0 10-bit/12-bit Analog-to-Digital Converter (ADC)....................................................................................................................... 201

21.0 Special Features ...................................................................................................................................................................... 213

22.0 Instruction Set Summary.......................................................................................................................................................... 221

23.0 Development Support............................................................................................................................................................... 229

24.0 Electrical Characteristics.......................................................................................................................................................... 233

25.0 High Temperature Electrical Characteristics............................................................................................................................ 281

26.0 Packaging Information.............................................................................................................................................................. 291

Appendix A: Revision History............................................................................................................................................................. 305

Index ................................................................................................................................................................................................. 317

The Microchip Web Site..................................................................................................................................................................... 321

Customer Change Notification Service.............................................................................................................................................. 321

Customer Support.............................................................................................................................................................................. 321

Reader Response.............................................................................................................................................................................. 322

Product Identification System ............................................................................................................................................................ 323

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TO OUR VALUED CUSTOMERS

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If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via

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Most Current Data Sheet

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http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.

The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current

devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of

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To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site; http://www.microchip.com

• Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are

using.

Customer Notific at ion Syst em

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

1.0 DEVICE OVERVIEW

This document contains device-specific information for

the following Digital Signal Controller (DSC) devices:

• dsPIC33FJ32MC202

• dsPIC33FJ32MC204

• dsPIC33FJ16MC304

The dsPIC33F devices contain extensive Digital Signal

Processor (DSP) functionality with a high performance

16-bit microcontroller (MCU) architecture.

Figure 1-1 shows a genera l block diagram of the core

and peripheral modules in the

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

family of devices. Table 1-1 lists the functions of the

various pins shown in the pinout diagrams.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices. It is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”. Please see the Microchip web

site (www.microchip.com) for the latest

dsPIC33F/PIC24H Family Reference

Manual sections.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 1-1: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 BLOCK DIAGRAM

OSC1/CLKI

OSC2/CLKO

VDD, VSS

Timing

Generation

MCLR

Power-up

Timer

Oscillator

Start-up Timer

Power-on

Reset

Watchdog

Timer

Brown-out

Reset

Precision

Reference

Band Gap

FRC/LPRC

Oscillators

Regulator

Voltage

VCAP

IC1,2,7,8 I2C1

PORTA

Note: Not all pins or features are implemented on all device pinout configurations. See “Pin Diagrams” for the specific pins

and features present on each device.

Instruction

Decode and

Control

PCH PCL

Program Counter

16-bit ALU

Instruction Reg

PCU

16 x 16

W Register Array

ROM Latch

EA MUX

Interrupt

Controller

PSV and Table

Data Access

Control Block

Stack

Control

Logic

Loop

Control

Logic

Data Latch

Address

Latch

Address Latch

Program Memory

Data Latch

Literal Data

16 16

Data Latch

Address

Latch

X RAM Y RAM

Y Data Bus

X Data Bus

DSP Engine

Divide Support

Control Signa ls

to Various Blocks

ADC1

Timers

PORTB

Address Generator Units

1-3

CNx

UART1 OC/

PWM1-2

QEI

PWM

2 Ch

PWM

6 Ch

Remappable

Pins

PORTC

SPI1

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 1-1: PINOUT I/O DESCRIPTIONS

Pin Name Pin

Type Buffer

Type PPS Description

AN0-AN8 I Analog No Analog input channels.

CLKI

CLKO I

OST/CMOS

—No

No External clock source input. Always associated with OSC1 pin function.

Oscillator crystal output. Connects to crystal or resonator in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

Always associated with OSC2 pin function.

OSC1

OSC2

I/O

ST/CMOS

—

Oscillator crystal input. ST buffer when configured in RC mode; CMOS

otherwise.

Oscillator crystal output. Connects to crystal or resonator in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

SOSCI

SOSCO I

OST/CMOS

—No

No 32.768 kHz low-power oscillator crystal input; CMOS otherwise.

32.768 kHz low-power oscillator crystal output.

CN0-CN30 I ST No Change notification inputs.

Can be software programmed for internal weak pull-ups on all inputs.

IC1-IC2

IC7-IC8 I

IST

ST Yes

Yes Capture inputs 1/2.

Capture inputs 7/8.

OCFA

OC1-OC2 I

OST

—Yes

Yes Compare Fault A input (for Compare Channels 1 and 2).

Comp ar e output s 1 th ro ug h 2.

INT0

INT1

INT2

Yes

External interrupt 0.

External interrupt 1.

External interrupt 2.

RA0-RA4

RA7-RA10 I/O ST No

No PORTA is a bidirectional I/O port.

RB0-RB15 I/O ST No PORTB is a bidirectional I/O port.

RC0-RC9 I/O ST No PORTC is a bidirectional I/O port.

T1CK

T2CK

T3CK

Yes

Timer1 external clock input.

Timer2 external clock input.

Timer3 external clock input.

U1CTS

U1RTS

U1RX

U1TX

—

Yes

UART1 clear to send.

UART1 ready to send.

UART1 receive.

UART1 transmit.

SCK1

SDI1

SDO1

SS1

I/O

—

Yes

Synchronous serial clock input/output for SPI1.

SPI1 data in.

SPI1 data out.

SPI1 slave synchronization or frame pulse I/O.

SCL1

SDA1

ASCL1

ASDA1

I/O

Synchronous serial clock input/output for I2C1.

Synchronous serial data input/output for I2C1.

Alternate synchronous serial clock input/output for I2C1.

Alternate synchronous serial data input/output for I2C1.

TMS

TCK

TDI

TDO

—

JTAG Test mode select pin.

JTAG test clock input pin.

JTAG test data input pin.

JTAG test data output pin.

Legend: CMOS = CMOS compatible input or output; Analog = Analog input; P = Power

ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input

PPS = Peripheral Pin Select

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

INDX

QEA

QEB

UPDN

CMOS

Yes

Quadrature Encoder Index Pulse input.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

Position Up/Down Counter Direction State.

FLTA1

PWM1L1

PWM1H1

PWM1L2

PWM1H2

PWM1L3

PWM1H3

FLTA2

PWM2L1

PWM2H1

—

Yes

PWM1 Fault A input.

PWM1 Low output 1.

PWM1 High output 1.

PWM1 Low output 2.

PWM1 High output 2.

PWM1 Low output 3.

PWM1 High output 3.

PWM2 Fault A input.

PWM2 Low output 1.

PWM2 High output 1.

PGED1

PGEC1

PGED2

PGEC2

PGED3

PGEC3

I/O

Data I/O pin for programming/debugging communication channel 1.

Clock input pin for programming/debugging communication channe l 1.

Data I/O pin for programming/debugging communication channel 2.

Clock input pin for programming/debugging communication channe l 2.

Data I/O pin for programming/debugging communication channel 3.

Clock input pin for programming/debugging communication channe l 3.

MCLR I/P ST No Master Clear (Reset) input. This pin is an active-low Reset to the device.

AVDD P P No Positive supply for analog modules. This pin must be connected at all times.

AVSS P P No Ground reference for analog modules.

VDD P — No Positive supp ly for peripheral logic and I/O pins.

VCAP P — No CPU logic filter capacitor connection.

VSS P — No Ground reference for logic and I/O pins.

VREF+ I Analog No Analog voltage reference (high) input.

VREF- I Analog No Analog voltage reference (low) input.

TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin

Type Buffer

Type PPS Description

Legend: CMOS = CMOS compatible input or output; Analog = Analog input; P = Power

ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input

PPS = Peripheral Pin Select

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

1.1 Referenced Sources

This device data sheet is based on the following

individual chapters of the “dsPIC33F/PIC24H Family

Reference Manual”. These documents should be

considered as the general reference for the operation

of a particular module or device feature.

• Section 1. “Introduction” (DS70197)

•Section 2. “CPU” (DS70204)

•Section 3. “Data Memory” (DS70202)

•Section 4. “Program Memory” (DS70202)

•Section 5. “Flash Programming” (DS70191)

•Section 7. “Oscillator” (DS70186)

•Section 8. “Reset” (DS70192)

•Section 9. “Watchdog Timer and Power-Saving Modes” (DS70196)

•Section 10. “I/O Ports” (DS70193)

•Section 11. “Timers” (DS70205)

•Section 12. “Input Capture” (DS70198)

•Section 13. “Output Compare” (DS70209)

•Section 14. “Motor Control PWM” (DS70187)

•Section 15. “Quadrature Encoder Inter face (QE I)” (DS70208)

•Section 16. “Analog-to-Digital Converter (ADC)” (DS70183)

•Section 17. “UART” (DS70188)

•Section 18. “Serial Peripheral Interface (SPI)” (DS70 206)

•Section 19. “Inter-Integrated Circuit™ (I2C™)” (DS70195)

•Section 23. “CodeGuard™ Security” (DS70199)

•Section 25. “Device Configuration” (DS70194)

•Section 32. “Interrupts (Part III)” (DS70214)

Note 1: To access the documents listed below,

browse to the documentation section of

the dsPIC33FJ32MC204 product page of

the Microchip web site

(www.microchip.com) or select a family

reference manual section from the

following list.

In addition to parameters, features, and

other documentation, the resulting page

provides links to the related family

reference manual sections.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

2.0 GUIDELINES FOR GETTING

STARTED WITH 16-BIT

DIGITAL SIGNAL

CONTROLLERS

2.1 Basic Connection Requirements

Getting started with the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of 16-bit Digital Signal

Controllers (DSCs) require s attention to a minimal set

of device pin connections before proceeding with

development. The following is a list of pin names, which

must always be connected:

• All VDD and VSS pins

(see Section 2.2 “Decoupling Capacitors”)

• All AVDD and AVSS pins (even if the ADC modu le is

not used)

(see Section 2.2 “Decoupling Capacitors”)

•V

CAP

(see Section 2.3 “CPU Logic Filter Cap a citor

Connection (VCAP)”)

•MCLR

(see Section 2.4 “Master Clear (MCLR) Pin”)

• PGECx/PGEDx pins used for In-Circuit Serial

Programming™ (ICSP™) and debugging purposes

(see Section 2.5 “ICSP Pins”)

• OSC1 and OSC2 pins when external oscillator

source is used

(see Section 2.6 “External Oscillato r Pin s”)

Additionally, the following pins may be required:

•V

REF+/VREF- pins used when external voltage

reference for ADC module is implemented

2.2 Decoupling Capacitors

The use of decoupling capacitors on every pair of

power supply pins, such as VDD, VSS, AVDD and

AVSS is required.

Consider the following criteria when using decoupling

capacitors:

•Value and type of capacitor: Recommendation

of 0.1 µF (100 nF), 10-20V. This capacitor should

be a low-ESR and have a resonance frequency in

the range of 20 MHz and higher. It is

recommended that ceramic capacitors be used.

•Placement on the printed circuit board: The

decoupling capacitors should be placed as close

to the pins as possible. It is recommended to

place the capacitors on the same side of the

board as the device. If space is constricted, the

capacitor can be placed on another layer on the

PCB using a via; however, ensure that the trace

length from the pin to the capacitor is within

one-quarter inch (6 mm) in length.

•Handling high freque nc y nois e : If the board is

experiencing high frequency noise, upward of

tens of MHz, add a second ceramic-type capacitor

in parallel to the above described decoupling

capacitor. The value of the second capacitor can

be in the range of 0.01 µF to 0.001 µF. Place this

second capacitor next to the primary decoupling

capacitor. In high-spe ed circuit designs, consider

implementing a decade pair of capacitances as

close to the power and ground pins as possible.

For example, 0.1 µF in parallel with 0.001 µF.

•Maximizing performance: On the board layout

from the power supply circuit, run the power and

return traces to the decoupling capacitors first,

and then to the device pins. This ensures that the

decoupling capacitors are first in the power chain.

Equally important is to keep the trace length

between the capacitor and the power pins to a

minimum thereby reducing PCB track inductance.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 fami ly of devi ces . It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Note: The AVDD and AVSS pins must be

connected independent of the ADC

voltage reference source.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 2-1: RECOMMENDED

MINIMUM CONNECT I ON

2.2.1 TANK CAPACITORS

On boards with power traces running longer than six

inches in length, it is suggested to use a tank capacitor

for integrated circuits including DSCs to supply a local

power source. The value of the tank capacitor should

be determined based on the trace resistance that con-

nects the power supply source to the device, and the

maximum current drawn by the device in the applica-

tion. In other words, select the tank capacitor so that it

meets the acceptable voltage sag at the device. T ypical

values range from 4.7 µF to 47 µF.

2.3 CPU Logic Filter Capacitor

Connection (VCAP)

A low-ESR (<5 Ohms) capacitor is required on the

VCAP pin, which is used to stabilize the voltage

regulator output voltage. The VCAP pin must not be

connected to VDD, and must have a capacitor between

4.7 µF a nd 10 µF, 16V connected to ground. The typ e

can be ceramic or tantalum. Refer to Section 24.0

“Electrical Characteristics” for additional

information.

The placement of this capacitor should be close to th e

VCAP. It is recommended that the trace length not

exceed one-quarter inch (6 mm). Refer to Section 21.2

“On-Chip Voltage Regulator” for det ails.

2.4 Master Clear (MCLR) Pin

The MCLR pin provides for two specific device

functions:

• Devic e Re set

• Device programming and debugging

During device programming and debugging, the

resistance and capacitance that can be added to the

pin must be considered. Device programmers and

debuggers drive the MCLR pin. Consequently,

specific voltage levels (VIH and VIL) and fast signal

transitions must not be adversely affected. Therefore,

specific values of R and C will need to be adjusted

based on the application a nd PCB requirements.

For example, as shown in Figure 2-2, it is

recommended that capacitor C is isolated from the

MCLR pin during programming and debugging

operations.

Place the components shown in Figure 2-2 within

one-quarter inch (6 mm) from the MCLR pin.

FIGURE 2-2: EXAMPLE OF MCLR PIN

CONNECTIONS

dsPIC33F

VDD

VSS

VDD

VSS

VDD

AVDD

AVSS

VDD

VSS

0.1 µF

Ceramic 0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

VDD

MCLR

0.1 µF

Ceramic

VCAP

10 Ω

10 µF

Note 1: R≤ 10 kΩ is recommended. A suggested

starting value is 10 kΩ. Ensure that the MCLR

pin VIH and VIL specifications are met.

2: R1 ≤ 470W will limit any current flowing into

MCLR from the external capacitor C, in the

event of MCLR pin breakdown, due to Elec-

trostatic Discharge (ESD) or Electrical

Overstress (EOS). Ensure that the MCLR pin

VIH and VIL specifications are met.

VDD

MCLR

dsPIC33F

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

2.5 ICSP Pins

The PGECx and PGEDx pins are used for In-Circuit

Serial Programming (ICSP) and debugging purposes.

It is recommended to keep the trace length between

the ICSP connector and the ICSP pins on the device as

short as possible. If the ICSP connector is expected to

experience an ESD event, a series resistor is

recommended, with the value in the range of a few tens

of Ohms, not to exceed 100 Ohms.

Pull-up resistors, series diodes and capacitors on the

PGECx and PGEDx pins are not recommended as they

will interfere with the programmer/d ebugger commu ni-

cations to the device. If such discrete components are

an application requirement, they should be removed

from the circuit during programming and debugging.

Alternatively, refer to the AC/DC characteristics and

timing requirements information in the respective

device Fl ash programming spe cification for information

on capacitive loading limits and pin input voltage high

(VIH) and input low (VIL) requirements.

Ensure that the “Communication Ch annel Sele ct” (i.e .,

PGECx/PGEDx pins) programmed into the device

matches the physical connections for the ICSP to

MPLAB® ICD 2, MPLAB ICD 3 or MPLAB REAL ICE™

in-circuit emulator.

For more information on MPLAB ICD 2, MPLAB IC D 3

or MPLAB REAL ICE™ in-circuit emulator connection

requirements, refer to the following documents that are

available on the Mi crochip web site .

•“MPLAB® ICD 2 In-Circuit Debugger User’s

Guide” DS51331

•“Using MPLAB® ICD 2” (poster) DS51265

•“MPLAB® ICD 2 Design Advisory” DS51566

•“Using MPLAB® ICD 3” (poster) DS51765

•“MPLAB® ICD 3 Design Advisory” DS51764

•“MPLAB® REAL ICE™ In-Circuit Emulator User’s

Guide” DS51616

•“Using MPLAB® REAL ICE™ In-Circuit Emulator”

(poster) DS51749

2.6 External Oscillator Pins

Many DSCs have options for at least two oscilla tors: a

high-frequency primary oscillator and a low-frequency

secondary oscillator (refer to Section 8.0 “Oscillator

Configuration” for details).

The oscillator circuit should be placed on the same

side of the board as the device. Also, place the

oscillator circuit close to the respective oscillato r pins,

not exceeding one-half inch (12 mm) distance

between them. The load capacitors should be placed

next to the oscillator itself, on the same side of the

board. Use a grounded copper pour around the

oscillator circuit to isolate them from surrounding

circuits. The grounded copper pour should be routed

directly to the MCU ground. Do not run any signal

traces or power traces inside the ground pour. Also, if

using a two-sided board, avoid any traces on the

other side of the board where the crystal is placed. A

suggested layout is shown in Figure 2-3.

FIGURE 2-3: SUGGESTED PLACEMENT

OF THE OSCILLATOR

CIRCUIT

Main Oscillator

Guard Ring

Guard Trace

Secondary

Oscillator

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

2.7 Oscillator Value Conditions on

Device Start-up

If the PLL of the target device is enabled and

configured for the device start-up oscillator, the

maximum oscillator source frequency must be limited

to ≤ 8 MHz for start-up with PLL enabled. This means

that if the external oscillator frequency is outside this

range, the application must start-up in FRC mode first.

The default PLL settings after a POR with an oscillator

frequency outside this range will violate the device

operating speed.

Once the device powers up, the application firmware

can initialize the PLL SFRs, CLKDIV and PLLDBF to a

suitable value, and then perform a clock switch to the

Oscillator + PLL clock source. Note that clock switching

must be enabled in the device Configuration word.

2.8 Configuration of Analog and

Digital Pins During ICSP

Operations

If MPLAB ICD 2, MPLAB ICD 3 or MPLAB REAL ICE™

in-circuit emulator is selected as a debugger, it auto-

matically initializes all of the A/D input pins (ANx) as

“digit al” pins, by set ting all bit s in the AD1PC FGL regis-

ter.

The bits in the registers that correspond to the A/D pins

that are initialized by MPLAB ICD 2, MPLAB ICD 3 or

MPLAB REAL ICE™ in-circuit emulator, must not be

cleared by the user application firmware; otherwise,

communication errors will result between the debugger

and the device.

If your application needs to use certain A/D pins as

analog input pins during the debug session, the user

application must clear the corresponding bits in the

AD1PCFGL register during initialization of the ADC

module.

When MPLAB ICD 2, MPLAB ICD 3 or MPLAB REAL

ICE™ in-circuit emulator is used as a programmer, the

user application firmware must correctly configure the

AD1PCFGL register. Automatic initialization of this

Failure to correctly configure the register(s) will result in

all A/D pins being recognized as analog input pins,

resulting in the port value being read as a logic ‘0’,

which may affect user application functionality.

2.9 Unused I/Os

Unused I/O pi ns should be configured as outputs and

driven to a logic-low state.

Alternatively, connect a 1k to 10k resistor between VSS

and the unused pins.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

3.0 CPU

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

CPU module has a 16-bit (data) modified Harvard

architecture with an enhanced instruction set, including

significant support for DSP. The CPU has a 24-bit

instruction word with a variable length o pcode field. The

Program Counter (PC) is 23 bits wide and addresses up

to 4M x 24 bits of user program memory space. The

actual amount of program memory implemented varies

by device. A single-cycle instruction prefetch mechanism

is used to help maintain throughput and provides

predictable execution. All instructions execute in a singl e

cycle, with the exception of instructions that change the

program flow, the double-word move ( MOV.D) instruction

and the table instructions. Overhead-free program loop

constructs are supported using the DO and REPEAT

instructions, both of which are interruptible at any point.

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

devices have sixteen, 16-bit working registers in the

programmer’s model. Each of the working registers can

serve as a data, address or address offset register. Th e

16th working register (W15) operates as a software S tack

Pointer (SP) for interrupts and calls.

There are two classes of instruction in the

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices: MCU and DSP. These two instruction cl asses

are seamlessly integrated into a single CPU. The

instruction set includes many addressing modes and is

designed for optimum C compiler efficiency. For most

instructions, the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 is capable of executing a data (or

program data) memory read, a working register (data)

read, a data memory write and a program (i nstructio n)

memory read per instruction cycle. As a result, three

parameter instructions can be supported, allowing

A + B = C operations to be executed in a single cycle.

A block diagram of the CPU is shown in Figure 3-1, and

the programmer’s model for the

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 is

shown in Figure 3-2.

3.1 Data Addressing Overview

The data space can be addressed as 32K words or

64 Kbytes a nd is split into two blocks, referred to as X

and Y data memory. Each memory block has its own

independent Address Generation Unit (AGU). The

MCU class of instructions operates solely through the

X memory AGU, which accesses the entire memory

map as one linear data space. Certain DSP instructions

operate through the X and Y AGUs to support dual

operand reads, which splits the data address space

into two parts. The X and Y data space boundary is

device-specific.

Overhead-free circular buffers (Modulo Addressing

mode) are supported in b oth X an d Y ad dress spaces.

The Modulo Addressing removes the software

boundary checking overhead for DSP algorithms.

Furthermore, the X AGU circular addressing can be

used with any of the MCU class of instructions. The X

AGU also supports Bit-Reversed Addressing to greatly

simplify input or o utput data reordering for ra dix-2 FF T

algorithms.

The upper 32 Kbytes of the data space memory map

can optionally be mapped into program space at any

16K program word boundary defined by the 8-bit

Program Space Visibility Page register (PSVPAG). The

program-to-data-space mapping feature lets any

instruction access program space as if it were data

space.

3.2 DSP Engine Overview

The DSP engine features a high-speed 17-bit by 17-bit

multiplier, a 40-bit ALU, two 40-bit saturating

accumulators and a 40-bit bidirectional barrel shifter.

The barrel shifter is capable of shifting a 40-bit value up

to 16 bits right or left, in a single cycle. The DSP

instructions operate seamlessly with all other

instructions and have been designed for optimal

real-time performance. The MAC instruction and other

associated i nstructions can concurrentl y fetch two da ta

operands from memory while multiplying two W

registers and accumulating and optionally saturating

the result in the same cycle. This instruction

functionality requires that the RAM data space be split

for these instructions and linear for all others. Data

space partitioning is achieved in a transparent and

flexible manner through dedicating certain working

registers to each address space.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 fami ly of devi ces . It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 2. “CPU” (DS70204) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

3.3 Special MCU Features

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

features a 17-bit by 17-bit single-cycle multiplier that is

shared by both the MCU ALU and DSP engine. The

multiplier can perform signed, unsigned and mixed-sign

multiplication. Using a 17-bit by 17-bit multiplier for 16-bit

by 16-bit multiplication not only allows you to perform

mixed-sign multiplication, it also achieves accurate results

for special operatio ns, such as (-1. 0) x (-1. 0).

The dsPIC33FJ32MC202/204 a nd dsPIC33FJ16MC304

supports 16/16 and 32/16 divide operations, both

fractional and integer. All divide instructions are iterative

operations. They must be executed within a REPEAT loop,

resulting in a total execution time of 19 instruction cycles.

The divide operation can be interrupted during any of

those 19 cycles without loss of data.

A 40-bit barrel shifter is used to perform up to a 16-bit

left or right shift in a single cycle. The barrel shifter can

be used by both MCU and DSP instructions.

FIGURE 3-1: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 CPU CORE BLOCK DIAGRAM

Instruction

Decode and

Control

PCH PCL

Program C o unter

16-bit ALU

Instruction Reg

PCU

16 x 16

W Register Array

ROM Latch

EA MUX

Interrupt

Controller

Stack

Control

Logic

Loop

Control

Logic

Data Latch

Address

Latch

Control Signals

to Various Blocks

Literal Data

16 16

To Peripheral Modules

Data Latch

Address

Latch

X RAM Y RAM

Address Generator Units

Y Data Bus

X Data Bus

DSP Engine

Divide Support

PSV and Table

Data Access

Control Block

Program Memory

Data Latch

Address Latch

16 16

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 3-2: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 PROGRAMMER’S MODEL

PC22 PC0

7 0

D0D15

Program Counter

Data Table Page Address

STATUS Register

Working Registers

DSP Operand

Registers

W10

W11

W12/DSP Offset

W13/DSP Write Back

W14/Frame Pointer

W15/Stack Pointer

DSP Address

Registers

AD39 AD0AD31

DSP

Accumulators ACCA

ACCB

7 0Program Space Visibility Page Address

OA OB SA SB

RCOUNT

15 0REPEAT Loop Counter

DCOUNT

15 0DO Loop Counter

DOSTART

22 0 DO Loop Start Address

IPL2 IPL1

SPLIM Stack Pointer Limit Register

AD15

SRL

PUSH.S Shadow

DO Shadow

OAB SAB

15 0Core Configuration Register

Legend

CORCON

DA DC RA N

TBLPAG

PSVPAG

IPL0 OV

W0/WREG

SRH

DO Loop End Address

DOEND

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

3.4 CPU Control Registers

R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0

OA OB SA(1) SB(1) OAB SAB DA DC

bit 15 bit 8

R/W-0(3) R/W-0(3) R/W-0(3) R-0 R/W-0 R/W-0 R/W-0 R/W-0

IPL<2:0>(2) RA N OV Z C

bit 7 bit 0

Legend:

C = Clear only bit R = Readable bit U = Unimplemented bit, read as ‘0’

S = Set only bit W = Writable bi t -n = Value at POR

‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 OA: Accumulator A Overflow Status bit

1 = Accumulator A overflowed

0 = Accumulator A has not overflowed

bit 14 OB: Accumulator B Overflow Status bit

1 = Accumulator B overflowed

0 = Accumulator B has not overflowed

bit 13 SA: Accumulator A Saturation ‘Sticky’ Status bit(1)

1 = Accumulator A is saturated or has been saturated at some time

0 = Accumulator A is not saturated

bit 12 SB: Accumulator B Saturation ‘Sticky’ Status bit(1)

1 = Accumulator B is saturated or has been saturated at some time

0 = Accumulator B is not saturated

bit 11 OAB: OA || OB Combined Accumulator Overfl o w Status bit

1 = Accumulators A or B have overflowed

0 = Neither Accumulators A or B have overflowed

bit 10 SAB: SA || SB Combined Accumulato r ‘Sticky’ Status bit

1 = Accumulators A or B are saturated or have been saturated at some time in the past

0 = Neither Accumulator A or B are saturated

Note: This bit may be read or cleared (not set). Clearing this bit will clear SA and SB.

bit 9 DA: DO Loop Active bit

1 = DO loop in progress

0 = DO loop not in progress

bit 8 DC: MCU ALU Half Carry/Borrow bit

1 = A carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data)

of the result occurred

0 = No carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized

data) of the result occurred

Note 1: This bit can be read or cleared (not set).

2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority

Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when

IPL<3> = 1.

3: The IPL<2:0> Status bits are read-only when NSTDIS = 1 (INTCON1<15>).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2)

111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled

110 = CPU Interrupt Priority Level is 6 (14)

101 = CPU Interrupt Priority Level is 5 (13)

100 = CPU Interrupt Priority Level is 4 (12)

011 = CPU Interrupt Priority Level is 3 (11)

010 = CPU Interrupt Priority Level is 2 (10)

001 = CPU Interrupt Priority Level is 1 (9)

000 = CPU Interrupt Priority Level is 0 (8)

bit 4 RA: REPEAT Loop Active bit

1 = REPEAT loop in progress

0 = REPEAT loop not in progress

bit 3 N: MCU ALU Negative bit

1 = Result was negative

0 = Result was non-negative (zero or positive)

bit 2 OV: MCU ALU Overflow bit

This bit is used for signed arithmetic (2’s complement). It indicates an overflow of a magnitude that

causes the sign bit to change state.

1 = Overflow occurred for signed arithmeti c (in this arithmetic operation)

0 = No overflow occurred

bit 1 Z: MCU ALU Zero bit

1 = An operation that affects the Z bit has set it at some time in the past

0 = The most recent operation that affects the Z bit has cleared it (i.e., a non-zero result)

bit 0 C: MCU ALU Carry/Borrow bit

1 = A carry-out from the Most Significant bit of the result occurred

0 = No carry-out from the Most Significant bit of the result occurred

Note 1: This bit can be read or cleared (not set).

2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority

Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when

IPL<3> = 1.

3: The IPL<2:0> Status bits are read-only when NSTDIS = 1 (INTCON1<15>).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-0 R/W-0 R-0 R-0 R-0

— — —USEDT

(1) DL<2:0>

bit 15 bit 8

R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R/W-0 R/W-0 R/W-0

SATA SATB SATDW ACCSAT IPL3(2) PSV RND IF

bit 7 bit 0

Legend: C = Clear only bit

R = Readable bit W = Writable bit -n = Value at POR ‘1’ = Bit is set

0’ = Bit is cleared ‘x = Bit is unknown U = Unimp lemented bit, read as ‘0’

bit 15-13 Unimplemented: Read as ‘0’

bit 12 US: DSP Multiply Unsigned/Signed Control bit

1 = DSP engine multiplies are unsigned

0 = DSP engine multiplies are signed

bit 11 EDT: Early DO Loop Termination Control bit(1)

1 = Terminate executing DO loop at end of current loop iteration

0 = No effect

bit 10-8 DL<2:0>: DO Loop Nesting Level Status bits

111 = 7 DO loops active

•

001 = 1 DO loop active

000 = 0 DO loops active

bit 7 SATA: ACCA Saturation Enable bit

1 = Accumulator A saturation enable d

0 = Accumulator A saturation disabled

bit 6 SATB: ACCB Saturation Enable bit

1 = Accumulator B saturation enable d

0 = Accumulator B saturation disabled

bit 5 SATDW: Data Space Write from DSP Engine Saturation Enable bit

1 = Data space write saturation enabled

0 = Data space write saturation disabled

bit 4 ACCSAT: Accumulator Saturation Mode Select bit

1 = 9.31 saturation (super saturation)

0 = 1.31 saturation (normal saturation)

bit 3 IPL3: CPU Interrupt Priority Level Status bit 3(2)

1 = CPU interrupt priority level is greater than 7

0 = CPU interrupt priority level is 7 or less

bit 2 PSV: Program Space Visibility in Data Space Enable bit

1 = Program space visible in data space

0 = Program space not visible in data space

bit 1 RND: Rounding Mode Select bit

1 = Biased (conventional) rounding enabled

0 = Unbiased (convergent) rounding enabled

bit 0 IF: Integer or Fractional Multiplier Mode Select bit

1 = Integer mode enabled for DSP multiply ops

0 = Fractional mode enabled for DSP multiply ops

Note 1: This bit will always read as ‘0’.

2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

3.5 Arithmetic Logic Unit (ALU)

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

ALU is 16 bits wide and is capable of addition, subtraction,

bit shifts and logic operations. Unless otherwise

mentioned, arithmetic operations are 2’s complement in

nature. Depending on th e operation, the ALU can affect

the values of the Carry (C), Zero (Z), Negative (N),

Overflow (OV) and Digit Carry (DC) Status bits in the SR

Digit Borrow bits, respectively , for subtraction operations.

The ALU can perform 8-bit or 16-bit operations,

depending on the mode of the instruction that is used.

Data for the ALU operation can come from the W

addressing mode of the instruction. Likewise, output

data from the ALU can be written to the W register array

or a data memory location.

Refer to the “16-bit MCU and DSC Programmer’s Ref-

erence Manual” (DS70157) for information on the SR

bits affected by each instruction.

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

CPU incorporates hardware support for both

multiplication and division. This includes a dedicated

hardware multiplier and support hardware for

16-bit-divisor division.

3.5.1 MULTIPLIER

Using the high-speed 17-bit x 17-bit multiplier of the

DSP engine, the ALU supports unsigned, signed or

mixed-sign operation in several MCU multiplication

modes:

• 16-bit x 16-bit signed

• 16-bit x 16-bit unsigned

• 16-bit signed x 5-bit (literal) unsigned

• 16-bit unsigned x 16-bit unsigned

• 16-bit unsigned x 5-bit (literal) unsigned

• 16-bit unsigned x 16-bit signed

• 8-bit unsigned x 8-bit unsigned

3.5.2 DIVIDER

The divide block supports 32-bit/16-bit and 16-bit/16-bit

signed and unsigned integer divide operations with the

following data sizes:

1. 32-bit signed/16-bit signed divide

2. 32-bit unsigned/16-bit unsigned divide

3. 16-bit signed/16-bit signed divide

4. 16-bit unsigned/16-bit unsigned divide

The quotient for all divide instructions ends up in W0

and the remainder in W1. 16-bit signed and unsigned

DIV instructions can specify any W register for both the

16-bit divisor (Wn) and any W register (aligned) pair

(W(m + 1):Wm) for the 32-bit dividend. The divide

algorithm takes one cycle per bit of divisor, so both

32-bit/16-bit and 16-bit/16-bit instructions take the

same number of cycles to execute.

3.6 DSP Engine

The DSP engine consists of a high-speed 17-bit x

17-bit multiplier, a barrel shifter and a 40-bit

adder/subtracter (with two target accumulators, round

and saturation logic).

The dsPIC33FJ32MC202/204 a nd dsPIC33FJ16MC304

is a single-cycle instruction flow architecture; therefore,

concurrent operation of the DSP engine with MCU

instruction flow is not possible. However , some MCU ALU

and DSP engine resources can be used concurrently by

the same instruction (e.g., ED, EDAC).

The DSP engine can also perform inherent accumula-

tor-to-accumulator operations that require no additional

data. These instructions are ADD, SUB and NEG.

The DSP engine has options selected through bits in

the CPU Core Control register (CORCON), as listed

below:

• Fractional or integer DSP multip ly (IF)

• Signed or unsigned DSP multiply (US)

• Conventional or convergent rounding (RND)

• Automatic saturation on/off for ACCA (SATA)

• Automatic saturation on/off for ACCB (SATB)

• Automatic saturation on/off for writes to data

memory (SATDW)

• Accumulator Saturation mode selection (ACCSAT)

A block diagram of the DSP engine is shown in

Figure 3-3.

TABLE 3-1: DSP INSTRUCTIONS

SUMMARY

Instruction Algebraic

Operation ACC Write

Back

CLR A = 0 Yes

ED A = (x - y)2No

EDAC A = A + (x – y)2No

MAC A = A + (x * y) Yes

MAC A = A + x2No

MOVSAC No change in A Yes

MPY A = x • y No

MPY A = x2No

MPY.N A = – x • y No

MSC A = A – x • y Yes

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 3-3: DSP ENGINE BLOCK DIAGRAM

Zero Backfill

Sign-Extend

Barrel

Shifter

40-bit Accumulator A

40-bit Accumulator B Round

Logic

X Data Bus

To/From W Array

Adder

Saturate

Negate

16 16

40 40

Y Data Bus

Carry/Borrow Out

Carry/Borrow In

Multiplier/Scaler

17-bit

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

3.6.1 MULTIPLIER

The 17-bit x 17-bit multiplier is capable of signed or

unsigned operation and can multiplex its output using a

scaler to support either 1.31 fractional (Q31) or 32-bit

integer results. Unsigned operands are zero-extende d

into the 17th bit of the multiplier input value. Signed

operands are sign-extended into the 17th bit of the

multiplier input value . The output of the 17 -bit x 17-bit

multiplier/scaler is a 33-b it value that is sign-extended

to 40 bits. Integer data is inherently represented as a

signed 2’s complement value, where the Most

Significant bit (MSb) is defined as a sign bit. The range

of an N-bit 2’s complement integer is -2N-1 to 2N-1 - 1.

• For a 16-bit integer , the dat a range is -32768

(0x8000) to 32767 (0x7FFF) including 0.

• For a 32-bit integer , the dat a range is

-2,147,483,648 (0x8000 0000) to 2,147,483,647

(0x7FFF FFFF).

When the multiplier is configure d for fractional multipli-

cation, the data is represented as a 2’s complement

fraction, where the MSb is defined as a sign bit and the

radix point is implied to lie just after the sign bit (QX

format). The range of an N-bit 2’s complement fraction

with this implied radix point is -1.0 to (1 - 21-N). For a

16-bit fraction, the Q15 data range is -1.0 (0x8000) to

0.999969482 (0x7FFF) including 0 and has a precision

of 3.01518x10-5. In Fractional mode, the 16 x 16 multi-

ply operation generates a 1.31 product th at has a pre-

cision of 4.65661 x 10-10.

The same multiplier is used to support the MCU multi-

ply instructions, which include integer 16-bit signed,

unsigned and mixed sign multiply ope rations.

The MUL instruction can be directed to use byte or

word-sized operands. Byte operands will direct a 16-bit

result, and word operands will direct a 32-bit result to

the specified register(s) in the W array.

3.6.2 DATA ACCUMULATORS AND

ADDER/SUBTRACTER

The data accumulator consists of a 40-bit

adder/subtracter with automatic sign extension logic. It

can select one of two accumulators (A or B) as its

pre-accumulation source and post-accumulation

destination. For the ADD and LAC instructions, the data

to be accumulated or lo aded can be optionally scaled

using the barrel shifter prior to accumulation.

3.6.2.1 Adder/Subtracter, Overflow and

Saturation

The adder/subtracter is a 40-bi t a dder with an option al

zero input into one side, and either true or complement

data into the other input.

• In the case of addition, the Carry/Borrow input is

active-high and the other input is true data (not

complemented).

• In the case of subtraction, the Carry/Borrow input

is active-low and the other input is complemented.

The adder/subtracter generates Overflow Status bits,

SA/SB and OA/OB, which are latched and reflected in

the STATUS register:

• Overflow from bit 39: this is a catastrophic

overflow in which the sign of the accumulator is

destroyed.

• Overflow into guard bits 32 through 39: this is a

recoverable overflow. This bit is set whenever all

the guard bits are not identical to each other.

The adder has an additional saturation block that

controls accumulator data saturation, if selected. It

uses the result of the adder, the Overflow Status bits

described previously and the SAT<A:B>

(CORCON<7:6>) and ACCSAT (CORCON<4>) mode

control bits to determine when and to what value to

saturate.

Six STATUS register bits support saturation and

overflow:

• OA: ACCA overflowed into guard bits

• OB: ACCB overflowed into guard bits

• SA: ACCA saturated (bit 31 overflow and

saturation)

ACCA overflowed into guard bits and saturated

(bit 39 overflow and saturation)

• SB: ACCB saturated (bit 31 overflow and

saturation)

ACCB overflowed into guard bits and saturated

(bit 39 overflow and saturation)

• OAB: Logical OR of OA and OB

• SAB: Logical OR of SA and SB

The OA and OB bits are modified each time data

passes through the adder/subtracter. When set, they

indicate that the most recent ope ration has overflowed

into the accumulator guard bits (bits 32 through 39).

The OA and OB bits can also optionally generate an

arithmetic warning trap when set and the

corresponding Overflow Trap Flag Enable bits (OV A TE,

OVBTE) in the INTCON1 register are set (refer to

Section 7.0 “Interrupt Controller”). This allows the

user application to take immediate action, for example,

to correct system gain.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

The SA and SB bits are modified each time data

passes through the adder/subtracter, but can only be

cleared by the user application. When set, they indicate

that the accumulator has overflowed its maximum

range (bit 31 for 32-bit saturation or bit 39 for 40-bit

saturation) and will be saturated (if saturation is

enabled). When saturation is not enabled, SA and SB

default to bit 39 overflow and thus indicate that a

catastrophic overflow has occurred. If the COVTE bit in

the INTCON1 register is set, SA and SB bits will gener-

ate an arithmetic warning trap when saturation is

disabled.

The Overflow and Satura tion Status bits can optionally

be viewed in the STATUS Reg ister (SR) as the l ogical

OR of OA and OB (in bit OAB) and the logical OR of SA

and SB (in bit SAB). Programmers can check one bit in

the STATUS register to det ermine if eit her accumula tor

has overflowed, or one bit to determine if either

accumulator has saturated. This is useful for complex

number arithmetic, which typically uses both

accumulators.

The device supports three Saturation and Overflow

modes:

• Bit 39 Overflow and Saturation:

When bit 39 overflow and satura tion occu rs, the

saturation logic loads the maximally positive 9.31

(0x7FFFFFFFFF) or maximally negative 9.31 value

(0x8000000000) into the target accumulator. The

SA or SB bit is set and rema ins set until cleared by

the user application. This condi tion is referred to as

‘super saturation’ and provides protecti on against

erroneous dat a or unexpecte d algorith m probl ems

(such as gain calculation s).

• Bit 31 Overflow and Saturation:

When bit 31 overflow and saturati on occu rs, the

saturation logic then loads the maxi mally positive

1.31 value (0x007FFFF FFF) or maximally nega-

tive 1.31 value (0x0080000000) into the target

accumulator. The SA or SB bit is set and remains

set until cleared by the user application. When

this Saturation mode is in effect, the guard bits are

not used, so the OA, OB or OAB bits are never

set.

• Bit 39 Catastro ph i c Overflow:

The bit 39 Overflow Status bit from the adder is

used to set the SA or SB bit, which remains set

until cleared by the user application. No saturation

operation is performed, and the accumulator is

allowed to overflow, destroying its sign. If the

COVTE bit in the INTCON1 register is set, a

catastrophic overflow can initiate a trap exception.

3.6.3 ACCUMULATOR ‘WRITE BACK’

The MAC class of instructions (with the exception of

MPY, MPY.N, ED and EDAC) can optionally write a

rounded version of the high word (bits 31 through 16)

of the accumulator that is not targeted by the instruction

into data space memory. The write is performed across

the X bus into combined X and Y address space. The

following addressing modes are supported:

• W13, Register Direct:

The rounded contents of the non-target

accumulator are written into W13 as a

1.15 fraction.

• [W13] + = 2, Register Indirect with Post-Increment:

The rounded contents of the non-target

accumulator are written into the address pointed

to by W13 as a 1.15 fraction. W13 is then

incremented by 2 (for a word write).

3.6.3.1 Round Logic

The round logic is a combi nation al block that pe rforms

a conventional (biased) or convergent (unbiased)

round function during an accumulator write (store). The

Round mode is determined by the state of the RND bit

in the CORCON register. It generates a 16-bit, 1.15

data value that is passed to the data space write

saturation logic. If rounding is not indicated by the

instruction, a truncated 1.15 data value is stored and

the least significant word (lsw) is simply discarded.

Conventional rounding zero-extends bit 15 of the

accumulator and adds it to the ACCxH word (bits 16

through 31 of the accumulator).

• If the ACCxL word (bits 0 thro ugh 15 of the

accumulator) is between 0x8000 and 0xFFFF

(0x8000 included), ACCxH is incremented .

• If ACCxL is between 0x0000 and 0x7FFF, ACCxH

is left unchanged.

A consequence of this algorithm is that over a

succession of random rounding operations, the value

tends to be biased slightly positive.

Convergent (or unbiased) rounding operates in the

same manner as conventi onal rounding, except when

ACCxL equals 0x8000. In this case, the Least

Significant bit (bit 16 of the accumulator) of ACCxH is

examined:

• If it is ‘1’, ACCxH is incremented.

• If it is ‘0’, ACCxH is not modified.

Assuming that bit 16 is effectively random in nature,

this scheme removes any rounding bias that may

accumulate.

The SAC and SAC.R instructions store either a

truncated (SAC), or rounded (SAC.R) version of the

contents of the target accumulator to data memory via

the X bus, subject to data saturation (see

Section 3.6.3.2 “Data Space Write Saturation”). For

the MAC class of instructions, the accumulator

write-back operation functions in the same manner,

addressing combined MCU (X and Y) data space

though the X bus. For this class of instructions, the data

is always subject to rounding.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

3.6.3.2 Data Sp ace Write Saturation

In addition to adder/subtracter saturation, writes to data

space can also be saturated, but without affecting the

contents of the source accumulator. The data space

write saturation logic block accepts a 16-bi t, 1.15 frac-

tional value from the round logic block as its input,

together with overflow status from the original source

(accumulator) and the 16-bit round adder . These inputs

are combined an d used to select the appropriate 1.15

fractional value as output to write to data space

memory.

If the SATDW bit in th e CORCON register is set, data

(after rounding or truncation) is tested for overflow and

adjusted accordingly:

• For input data greater than 0x007FFF, data writ-

ten to memory is forced to the maximum positive

1.15 value, 0x7FFF.

• For input data less than 0xFF8000, data written to

memory is forced to the maximum negative 1.15

value, 0x8000.

The Most Significant bit of the source (bit 39) is used to

determine the sign of the operand being tested.

If the SATDW bit in the CORCON register is not set, the

input data is always passed through unmodified under

all conditions.

3.6.4 BARREL SHIFTER

The barrel shifter can perform up to 16-bit arithmetic or

logic right shifts, or up to 16-bit left shifts in a single

cycle. The source can be either of the two DSP accu-

mulators or the X bus (to support multi-bit shifts of

The shifter requires a signed binary value to determine

both the magnitude (number of bits) and direction of the

shift operation. A positive value shifts the operand right.

A negative value shifts the operand left. A value o f ‘0’

does not modify the operand.

The barrel shifter is 40 bits wide, thereby obtaining a

40-bit result for DSP shift operations and a 16-bit result

for MCU shift operations. Data from the X bus is pre-

sented to the barrel shifter between bit positions 16 and

31 for right shifts, and between bit positions 0 and 16

for left shifts.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.0 MEMORY ORGANIZATION

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

architecture features separate program and data memory

spaces and buses. This architecture also allows the direct

access of program memory from the data space during

code execution.

4.1 Program Address Space

The program address memory space of the

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices is 4M instructions. The space is addressable

by a 24-bit value derived either from the 23-bit Program

Counter (PC) during program execution, or from table

operation or data space remapping as described in

Section 4.6 “Interfacing Program and Data Memory

Spaces”.

User application access to the program memory space

is restricted to the lower half of the address range

(0x000000 to 0x7FFFFF). T he exception is the use of

TBLRD/TBLWT operations, which use TBLPAG<7> to

permit access to the Configuration bits and Device ID

sections of the configuration memory space.

The memory maps for the dsPIC33FJ32MC202/204

and dsPIC33FJ16MC304 devices are shown in

Figure 4-1.

FIGURE 4-1: PROGRAM MEMORY MAPS FOR dsPIC33FJ 32MC202/204 and dsPIC33FJ16MC304

DEVICES

Note: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of devices. It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 4. “Program Memory”

(DS70202) of the “dsPIC33F/PIC24H

Family Reference Manual”, which is avail-

able from the Microchip web site

(www.microchip.com).

Reset Address

0x000000

0x0000FE

0x000002

0x000100

Device Configuration

User Program

Flash Memory

0x005800

0x0057FE

(11264 instructions)

0x800000

0xF80000

Registers

0xF80017

0xF80018

DEVID (2)

0xFEFFFE

0xFF0000

0xFFFFFE

0xF7FFFE

Unimplemented

(Read ‘

’s)

GOTO

Instruction

0x000004

Reserved

0x7FFFFE

Reserved

0x000200

0x0001FE

0x000104

Alternate Vector Table

Reserved

Interrupt Vector Table

dsPIC33FJ32MC202/204

Configuration Memory Space User Memory Space

Reset Address

0x000000

0x0000FE

0x000002

0x000100

Device Configuration

User Program

Flash Memory

0x002C00

0x002BFE

(5632 instructions)

0x800000

0xF80000

Registers

0xF80017

0xF80018

DEVID (2)

0xFEFFFE

0xFF0000

0xFFFFFE

0xF7FFFE

Unimplemented

(Read ‘

’s)

GOTO

Instruction

0x000004

Reserved

0x7FFFFE

Reserved

0x000200

0x0001FE

0x000104

Altern ate Vector Table

Reserved

Interrupt Vector Table

dsPIC33FJ16MC304

Configuration Memory Space User Memory Space

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.1.1 PROGRAM MEMORY

ORGANIZATION

The program memory space is organized in

word-addressable blocks. Although it is treated as

24 bits wide, it is more appropriate to think of each

address of the program memory as a lower and upp er

word, with the upper byte of the upper word being

unimplemented. The lower word always has an even

address, while the upper word has an odd address

(Figure 4-2).

Program memory addresses are always word-aligned

on the lower word, an d addresses are incremented or

decremented by two during code execution. This

arrangement provides compatibility with data memory

space addressing and makes data in the program

memory space accessible.

4.1.2 INTERRUPT AND TR AP VECTORS

All dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices reserve the addresses between 0x00000 and

0x000200 for hard-coded program execution vectors.

A hardware Reset vector is provided to redirect code

execution from the default value of the PC on device

Reset to the actual start of code. A GOTO instruction is

programmed by the user application at 0x000000, with

the actual address for the start of code at 0x000002.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices also have two interrupt vector tables, located

from 0x000004 to 0x0000FF and 0x000100 to

0x0001FF. These vector tables allow each of the

device interrupt sources to be handled by separate

Interrupt Service Routines (ISRs). A more detailed

discussion of the interrupt vector tables is provided in

Section 7.1 “Interrupt Vector Table”.

FIGURE 4-2: PROGRAM MEMORY ORGANIZATION

0816

PC Address

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ Byte

(read as ‘0’)

least significant word

most significant word

Instruction Width

0x000001

0x000003

0x000005

0x000007

msw

Address (lsw Address)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.2 Data Addre ss Space

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

CPU has a separate 16-bit-wide data memory space. The

data space is accessed using separate Address

Generation Units (AGUs) for read and write operations.

The data memory maps is shown in Figure 4-3.

All Effective Addresses (EAs) in the data memory space

are 16 bit s wide and point to bytes within the d ata space.

This arrangement gives a data space address range of

64 Kbytes or 32K words. The lower half of the data

memory space (that is, when EA<15> = 0) is used for

implemented memory addresses, while the upper half

(EA<15> = 1) is reserved for the Program Space

Visibility area (see Section 4.6.3 “Reading Data from

Program Memory Using Program Space Visibility”).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices implement up to 2 Kbytes of data memory.

Should an EA point to a location outside of this area, an

all-zero word or byte will be returned.

4.2.1 DATA SPACE WIDTH

The data memory space is organized in byte

addressable, 16-bit wide blocks. Data is aligned in data

memory and registers as 16-bit words, but all data

space EAs resolve to bytes. The Least Significant

Bytes (LSBs) of each word have even addresses, while

the Most Significant Bytes (MSBs) have odd

addresses.

4.2.2 DATA MEMORY ORGANIZATION

AND ALIGNMENT

To maintain backward compatibility with PIC® MCU

devices and improve data space memory usage

efficiency, the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 instruction set supports both

word and byte operations. As a consequence of byte

accessibility, all effective address calculations are

internally scaled to step through word-aligned memory .

For example, the core recognizes that Post-Modified

a value of Ws + 1 for byte operations and Ws + 2 for

word operations.

Data byte reads will read the complete word that

contains the byte, using the LSB of any EA to

determine which byte to select. The selected byte is

placed onto the LSB of the data path. That is, data

memory and registers are organized as two parallel

byte-wide entities with shared (word) address decode

but separate write lines. Data byte writes only write to

the corresponding side of the array or register that

matches the byte a dd re ss.

All word accesses must be aligned to an even address.

Misaligned word data fetches are not supported, so

care must be taken when mixing byte and word

operations, or translating from 8-bit MCU code. If a

misaligned read or write is attempted, an address error

trap is generated. If the error occurred on a read, the

instruction underway is completed. If the error occurred

on a write, the instruction is executed but the write does

not occur. In either case, a trap is then executed,

allowing the system and/or user application to examine

the machine state prior to execution of the address

Fault.

All byte loads into any W register are loaded into the

Least Significant Byte. The Most Significant Byte is not

modified.

A sign-extend instruction (SE) is provided to allow user

applications to translate 8-bit signed data to 16-bit

signed values. Alternatively, for 16-bit unsigned data,

user applications can clear the MSB of any W register

by executing a zero-extend (ZE) instruction on the

appropriate address.

4.2.3 SFR SPACE

The first 2 Kbytes of the Near Data S pace, from 0x0000

to 0x07FF, is primarily occupied by Special Function

Registers (SFRs). These are used by the

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

core and peripheral modules for controlling the

operation of the device.

SFRs are distributed among the modules that they

control, and are generally grouped together by module.

Much of the SFR space contains unused addresses;

these are read as ‘0’.

4.2.4 NEAR DATA SPACE

The 8 Kbyte area between 0x0000 and 0x1FFF is

referred to as the near data space. Locations in this

space are directly addressable via a 13-bit absolute

address field within all memory direct instructions.

Additionally , the whole data space is addressable using

MOV instructions, which support Memory Direct

Addressing mode with a 16-bit address field, or by

using Indirect Addressing mode using a working

Note: The actual set of peripheral features and

interrupts varies by the device. Refer to

the corresponding device tables and

pinout diagrams for device-specific

information.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 4-3: DATA MEMORY MAP FOR dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

DEVICES WITH 2 KB RAM

0x0000

0x07FE

0x0FFE

0xFFFE

LSB

Address

16 bits

LSbMSb

MSB

Address

0x0001

0x07FF

0xFFFF

Optionally

Mapped

into Program

Memory

0x0801 0x0800

0x1000

2 Kbyte

SFR Space

2 Kbyte

SRAM Space

0x8001 0x8000

SFR Space

X Data RA M (X)

X Data

Unimplemented (X)

Y Data RAM (Y)

0x0BFE

0x0C00

0x0BFF

0x0001

0x0FFF

0x1001

0x1FFF 0x1FFE

0x2001 0x2000

8 Kbyte

Near Data

Space

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.2.5 X AND Y DATA SPACES

The core has two data spaces, X and Y. These data

spaces can be considered either separate (for some

DSP instructions), or as one unified linear address

range (for MCU instructions). The data spaces are

accessed using two Address Generation Units (AGUs)

and separate data paths. This feature allows certain

instructions to concurrently fetch two words from RAM,

thereby enabling efficient execu tion of DSP al gorithms

such as Finite Impulse Response (FIR) filtering and

Fast Fourier Transform (FFT).

The X data space is used by all instructions and

supports all addressing modes. X data space has

separate read and write data buses. The X read data

bus is the read data path for all instructions that view

data space as combined X and Y address space. It is

also the X data prefetch path for the dual operand DSP

instructions (MAC class).

The Y data space is used in concert with the X data

space by the MAC class of instructions (CLR, ED,

EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide

two concurrent data read paths.

Both the X and Y data spaces support Modulo

Addressing mode for all instructions, subject to

addressing mode restrictions. Bit-Reversed Addressing

mode is only supported for writes to X data sp ace.

All data memory writes, including in DSP instructions,

view data space as combined X and Y address space.

The boundary between the X and Y data spaces is

device-dependent and is not user-programmable.

All effective addresses are 16 bits wide and point to

bytes within the data space. Therefore, the data space

address range is 64 Kbytes , or 32K words, though the

implemented memory locations vary by device.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-1: CPU CORE REGISTERS MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

WREG0 0000 Working Register 0

0000

WREG1 0002 Working Register 1

0000

WREG2 0004 Working Register 2

0000

WREG3 0006 Working Register 3

0000

WREG4 0008 Working Register 4

0000

WREG5 000A Working Register 5

0000

WREG6 000C W orking Register 6

0000

WREG7 000E Working Register 7

0000

WREG8 0010 Working Register 8

0000

WREG9 0012 Working Register 9

0000

WREG10 0014 Working Register 10

0000

WREG11 0016 Working Register 11

0000

WREG12 0018 Working Register 12

0000

WREG13 001A Working Register 13

0000

WREG14 001C W orking Register 14

0000

WREG15 001E Working Register 15

0800

SPLIM 0020 S t ack Pointer Limit Register

xxxx

ACCAL 0022 Accumulator A Low Word Register

0000

ACCAH 0024 Accumulator A High Word Register

0000

ACCAU 0026 Accumulator A Upper Word Register

0000

ACCBL 0028 Accumulator B Low Word Register

0000

ACCBH 002A Accumulator B High Word Register

0000

ACCBU 002C Accumulator B Upper Word Register

0000

PCL 002E Program Counter Low Word Register

0000

PCH 0030 — — — — — — — — Program Counter High Byte Register

0000

TBLPAG 0032 — — — — — — — — Table Page Address Pointer Register

0000

PSVPAG 0034 — — — — — — — — Program Memory Visibility Page Address Pointer Register

0000

RCOUNT 0036 Repeat Loop Counter Register

xxxx

DCOUNT 0038 DCOUNT<15:0> xxxx

DOSTARTL 003A DOSTARTL<15:1> 0xxxx

DOSTARTH 003C

— — — — — — — — — —

DOSTARTH<5:0> 00xx

DOENDL 003E DOENDL<15:1> 0xxxx

DOENDH 0040

— — — — — — — — — —

DOENDH 00xx

SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C

0000

CORCON 0044 — — — US EDT DL<2:0>

SATA SATB SATDW ACCSAT IPL3 PSV RND IF

0020

MODCON 0046 XMODEN YMODEN

— —

BWM<3:0> YWM<3:0> XWM<3:0> 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

XMODSRT 0048 XS<15:1> 0xxxx

XMODEND 004A XE<15:1> 1xxxx

YMODSRT 004C YS<15:1> 0xxxx

YMODEND 004E YE<15:1> 1xxxx

XBREV 0050 BREN XB<14:0> xxxx

DISICNT 0052 —

— Disable Interrupts Counter

xxxx

TABLE 4-1: CPU CORE REGISTERS MAP (CONTINUED)

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-2: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ32MC202

SFR

Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

CNEN1

0060 CN15IE CN14IE CN13IE CN12IE CN11IE

———

CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE

0000

CNEN2

0062

—

CN30IE CN29IE

—

CN27IE

— —

CN24IE CN23IE CN22IE CN21IE

— — — —

CN16IE

0000

CNPU1

0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE

———

CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE

0000

CNPU2

006A

—

CN30PUE CN29PUE

—

CN27PUE

— —

CN24PUE CN23PUE CN22PUE CN21PUE

— — — —

CN16PUE

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

TABLE 4-3: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ32MC204 and dsPIC33FJ16MC304

SFR

Name SFR

Addr Bit 15Bit 14Bit 13Bit 12Bit 11Bit 10Bit 9Bit 8Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0All

Resets

CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE

0000

CNEN2 0062 — CN30IE CN29IE CN28IE CN27IE CN26IE CN25IE CN24IE CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE

0000

CNPU1 0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE

0000

CNPU2 006A — CN30PUE CN29PUE CN28PUE CN27PUE CN26PUE CN25PUE CN24PUE CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-4: INTERRUPT CONTROLLER REGISTER MAP

SFR

Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE SFTACERR DIV0ERR — MATHERR ADDRERR STKERR OSCFAIL —0000

INTCON2 0082 ALTIVT DISI — — — — — — — — — — — INT2EP INT1EP INT0EP 0000

IFS0 0084 — — AD1IF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF T2IF OC2IF IC2IF — T1IF OC1IF IC1IF INT0IF 0000

IFS1 0086 ——INT2IF — — — — —IC8IFIC7IF—INT1IFCNIF—MI2C1IFSI2C1IF0000

IFS3 008A FLTA1IF — — — — QEIIF PWM1IF — — — — — — — — — 0000

IFS4 008C — — — — — FLTA2IF PWM2IF — — — — — — —U1EIF—0000

IEC0 0094 —— AD1IE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE T2IE OC2IE IC2IE — T1IE OC1IE IC1IE INT0IE 0000

IEC1 0096 ——INT2IE — — — — —IC8IEIC7IE— INT1IE CNIE — MI2C1IE SI2C1IE 0000

IEC3 009A FLTA1IE — — — —QEIIEPWM1IE— — — — — — — — — 0000

IEC4 009C — — — — — FLTA2IE PWM2IE — — — — — — —U1EIE—0000

IPC0 00A4 — T1IP<2:0> — OC1IP<2:0> — IC1IP<2:0> — INT0IP<2:0> 4444

IPC1 00A6 — T2IP<2:0> — OC2IP<2:0> — IC2IP<2:0> — — — — 4440

IPC2 00A8 — U1RXIP<2:0> — SPI1IP<2:0> — SPI1EIP<2:0> — T3IP<2:0> 4444

IPC3 00AA — — — — — — — — — AD1IP<2:0> — U1TXIP<2:0> 0044

IPC4 00AC — CNIP<2:0> — — — — — MI2C1IP<2:0> — SI2C1IP<2:0> 4044

IPC5 00AE —IC8IP<2:0> —IC7IP<2:0>— — — — — INT1IP<2:0> 4404

IPC7 00B2 — — — — — — — — — INT2IP<2:0> — — — — 0040

IPC14 00C0 — — — — —QEIIP<2:0>— PWM1IP<2:0> — — — — 0440

IPC15 00C2 —FLTA1IP<2:0> — — — — — — — — — — — — 4000

IPC16 00C4 — — — — — — — — — U1EIP<2:0> — — — — 0040

IPC18 00C8 — — — — —FLTA2IP<2:0>— PWM2IP<2:0> — — — — 0440

INTTREG 00E0 — — — —ILR<3:0> — VECNUM<6:0> 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-5: TIMER REGISTER MAP

SFR

Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

TMR1 0100 T imer1 Register

0000

PR1 0102 Period Register 1

FFFF

T1CON 0104 TON

—

TSIDL

— — — — — —

TGATE TCKPS<1:0>

—

TSYNC TCS

—

0000

TMR2 0106 T imer2 Register

0000

TMR3HLD 0108 T imer3 Holding Register (for 32-bit timer operations only)

xxxx

TMR3 010A T imer3 Register

0000

PR2 010C Period Register 2

FFFF

PR3 010E Period Register 3

FFFF

T2CON 0110 TON

—

TSIDL

— — — — — —

TGATE TCKPS<1:0> T32

—

TCS

—

0000

T3CON 0112 TON

—

TSIDL

— — — — — —

TGATE TCKPS<1:0>

— —

TCS

—

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

TABLE 4-6: INPUT CAPTURE REGISTER MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

IC1BUF 0140 Input 1 Capture Register

xxxx

IC1CON 0142

— —

ICSIDL

— — — — —

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

0000

IC2BUF 0144 Input 2 Capture Register

xxxx

IC2CON 0146

— —

ICSIDL

— — — — —

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

0000

IC7BUF 0158 Input 7 Capture Register

xxxx

IC7CON 015A

— —

ICSIDL

— — — — —

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

0000

IC8BUF 015C Input 8 Capture Register

xxxx

IC8CON 015E

— —

ICSIDL

— — — — —

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

TABLE 4-7: OUTPUT COMPARE REGISTER MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

OC1RS 0180 Output Compare 1 Secondary Register

xxxx

OC1R 0182 Output Compare 1 Register

xxxx

OC1CON 0184

— —

OCSIDL

— — — — — — — —

OCFLT OCTSEL OCM<2:0>

0000

OC2RS 0186 Output Compare 2 Secondary Register

xxxx

OC2R 0188 Output Compare 2 Register

xxxx

OC2CON 018A

— —

OCSIDL

— — — — — — — —

OCFLT OCTSEL OCM<2:0>

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-8: 6-OUTPUT PWM1 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

P1TCON 01C0 PTEN —PTSIDL— — — — — PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0>

0000 0000 0000 0000

P1TMR 01C2 PTDIR PWM Timer Count Value Register

0000 0000 0000 0000

P1TPER 01C4 — PWM Time Base Period Register

0000 0000 0000 0000

P1SECMP 01C6 SEVTDIR PWM Special Event Compare Register

0000 0000 0000 0000

PWM1CON1

01C8 — — — — —PMOD3PMOD2PMOD1— PEN3H PEN2H PEN1H — PEN3L PEN2L PEN1L

0000 0000 1111 1111

PWM1CON2

01CA — — — — SEVOPS<3:0> — — — — — IUE OSYNC UDIS

0000 0000 0000 0000

P1DTCON1 01CC DTBPS<1:0> DTB<5:0> DTAPS<1:0> DTA<5:0>

0000 0000 0000 0000

P1DTCON2 01CE — — — — — — — — — — DTS3A DTS3I DTS2A DTS2I DTS1A DTS1I

0000 0000 0000 0000

P1FLTACON 01D0 —— FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L FLTAM — — — — FAEN3 FAEN2 FAEN1

0000 0000 0000 0000

P1OVDCON 01D4 —— POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L —— POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L

1111 1111 0000 0000

P1DC1 01D6 PWM Duty Cycle #1 Register

0000 0000 0000 0000

P1DC2 01D8 PWM Duty Cycle #2 Register

0000 0000 0000 0000

P1DC3 01DA PWM Duty Cycle #3 Register

0000 0000 0000 0000

Legend: u = uninitialized bit, — = unimplemented, read as ‘0’

TABLE 4-9: 2-OUTPUT PWM2 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

P2TCON 05C0 PTEN —PTSIDL— — — — — PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> 0000 0000 0000 0000

P2TMR 05C2 PTDIR PWM T i mer Count Value Register 0000 0000 0000 0000

P2TPER 05C4 — PWM Time Base Period Regi ster 0000 0000 0000 0000

P2SECMP 05C6 SEVTDIR PWM Special Event Comp are Register 0000 0000 0000 0000

PWM2CON1 05C8 — — — — — — —PMOD1———PEN1H— — — PEN1L 0000 0000 1111 1111

PWM2CON2 05CA — — — — SEVOPS<3:0> — — — — — IUE OSYNC UDIS 0000 0000 0000 0000

P2DTCON1 05CC DTBPS<1:0> DTB<5:0> DTAPS<1:0> DTA<5:0> 0000 0000 0000 0000

P2DTCON2 05CE — — — — — — — — — — — — — —DTS1ADTS1I0000 0000 0000 0000

P2FLTACON 05D0 — — — — — — FAOV1H FAOV1L FLTAM — — — — — —FAEN10000 0000 0000 0000

P2OVDCON 05D4 — — — — — — POVD1H POVD1L —————— POUT1H POUT1L 1111 1111 0000 0000

P2DC1 05D6 PWM Duty Cycle #1 Register 0000 0000 0000 0000

Legend: u = uninitialized bit, — = unimplemented, read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-10: QEI1 REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit

10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

QEI1CON 01E0 CNTERR —QEISIDL INDEX UPDN QEIM<2:0> SWPAB PCDOUT TQGATE TQCKPS<1:0> POSRES TQCS UPDN_SRC 0000 0000 0000 0000

DFLT1CON 01E2 — — — — — IMV<1:0> CEID QEOUT QECK<2:0> — — — — 0000 0000 0000 0000

POS1CNT 01E4 Position Counter<15:0> 0000 0000 0000 0000

MAX1CNT 01E6 Maximum Count<15:0> 1111 1111 1111 1111

Legend: u = uninitialized bit, — = unimplemented, read as ‘0’

TABLE 4-11: I2C1 REGISTER MAP

SFR Name SFR

Addr Bit 15Bit 14Bit 13Bit 12Bit 11Bit 10Bit 9Bit 8Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0 All

Resets

I2C1RCV 0200 — ——————— Receive Register

0000

I2C1TRN 0202 — ——————— T ransmit Register

00FF

I2C1BRG 0204 — —————— Baud Rate Generator Register

0000

I2C1CON 0206 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN

1000

I2C1STAT 0208 ACKSTAT TRSTAT ——— BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF

0000

I2C1ADD 020A — ————— Address Register

0000

I2C1MSK 020C — ————— Address Mask Register

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

TABLE 4-12: UART1 REGISTER MAP

SFR Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

U1MODE 0220 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD URXINV BRGH PDSEL<1:0> STSEL

0000

U1STA 0222 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA

0110

U1TXREG 0224 — — — — — — — UART T r ansmit Register

xxxx

U1RXREG 0226 — — — — — — — UART Receive Register

0000

U1BRG 0228 Baud Rate Generator Prescaler

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

TABLE 4-13: SPI1 REGISTER MAP

SFR

Name SFR

Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

SPI1STAT 0240 SPIEN — SPISIDL —————— SPIROV — — — — SPITBF SPIRBF

0000

SPI1CON1 0242 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE<2:0> PPRE<1:0>

0000

SPI1CON2 0244 FRMEN SPIFSD FRMPOL — — — — — — — — — — — FRMDLY —

0000

SPI1BUF 0248 SPI1 Tr ansmit and Receive Buf fer Register

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-14: ADC1 REGISTER MAP FOR dsPIC33FJ32MC202

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Reset

ADC1BUF0 0300 ADC Data Buffer 0 xxxx

ADC1BUF1 0302 ADC Data Buffer 1 xxxx

ADC1BUF2 0304 ADC Data Buffer 2 xxxx

ADC1BUF3 0306 ADC Data Buffer 3 xxxx

ADC1BUF4 0308 ADC Data Buffer 4 xxxx

ADC1BUF5 030A ADC Data Buffer 5 xxxx

ADC1BUF6 030C ADC Data Buffer 6 xxxx

ADC1BUF7 030E ADC Data Buffer 7 xxxx

ADC1BUF8 0310 ADC Data Buffer 8 xxxx

ADC1BUF9 0312 ADC Data Buffer 9 xxxx

ADC1BUFA 0314 ADC Data Buffer 10 xxxx

ADC1BUFB 0316 ADC Data Buff er 11 xxxx

ADC1BUFC 0318 ADC Data Buffer 12 xxxx

ADC1BUFD 031A ADC Data Buffer 13 xxxx

ADC1BUFE 031C ADC Data Buf fer 14 xxxx

ADC1BUFF 031E ADC Data Buffer 15 xxxx

AD1CON1 0320 ADON —ADSIDL —— AD12B FORM<1:0> SSRC<2:0> — SIMSAM ASAM SAMP DONE 0000

AD1CON2 0322 VCFG<2:0> —— CSCNA CHPS<1:0> BUFS — SMPI<3:0> BUFM ALTS 0000

AD1CON3 0324 ADRC — — SAMC<4:0> ADCS<7:0> 0000

AD1CHS123 0326 — — — — — CH123NB<1:0> CH123SB — — — — — CH123NA<1:0> CH123SA 0000

AD1CHS0 0328 CH0NB —— CH0SB<4:0> CH0NA —— CH0SA<4:0> 0000

AD1PCFGL 032C — — — — — — — — — — PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000

AD1CSSL 0330 — — — — — — — — — — CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-15: ADC1 REGISTER MAP FOR dsPIC33FJ32MC204 AND dsPIC33FJ16MC304

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

ADC1BUF0 0300 ADC Data Buffer 0 xxxx

ADC1BUF1 0302 ADC Data Buffer 1 xxxx

ADC1BUF2 0304 ADC Data Buffer 2 xxxx

ADC1BUF3 0306 ADC Data Buffer 3 xxxx

ADC1BUF4 0308 ADC Data Buffer 4 xxxx

ADC1BUF5 030A ADC Data Buffer 5 xxxx

ADC1BUF6 030C ADC Data Buffer 6 xxxx

ADC1BUF7 030E ADC Data Buffer 7 xxxx

ADC1BUF8 0310 ADC Data Buffer 8 xxxx

ADC1BUF9 0312 ADC Data Buffer 9 xxxx

ADC1BUFA 0314 ADC Data Buf fe r 10 xxxx

ADC1BUFB 0316 ADC Data Buffer 11 xxxx

ADC1BUFC 0318 ADC Data Buffer 12 xxxx

ADC1BUFD 031A ADC Data Buffer 13 xxxx

ADC1BUFE 031C ADC Data Buf fer 14 xxxx

ADC1BUFF 031E ADC Data Buffer 15 xxxx

AD1CON1 0320 ADON —ADSIDL —— AD12B FORM<1:0> SSRC<2:0> — SIMSAM ASAM SAMP DONE 0000

AD1CON2 0322 VCFG<2:0> —— CSCNA CHPS<1:0> BUFS — SMPI<3:0> BUFM ALTS 0000

AD1CON3 0324 ADRC — — SAMC<4:0> ADCS<7:0> 0000

AD1CHS123 0326 — — — — — CH123NB<1:0> CH123SB — — — — — CH123NA<1:0> CH123SA 0000

AD1CHS0 0328 CH0NB —— CH0SB<4:0> CH0NA —— CH0SA<4:0> 0000

AD1PCFGL 032C — — — — — — — PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000

AD1CSSL 0330 — — — — — — — CSS8 CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-16: PERIPHERAL PIN SELECT INPUT REGISTER MAP

File

Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

RPINR0 0680 — — — INT1R<4:0> — — — — — — — — 1F00

RPINR1 0682 — — — — — — — — — — —INT2R<4:0>001F

RPINR3 0686 — — —T3CKR<4:0>— — —T2CKR<4:0>1F1F

RPINR7 068E — — — IC2R<4:0> — — — IC1R<4:0> 1F1F

RPINR10 0694 — — — IC8R<4:0> — — — IC7R<4:0> 1F1F

RPINR11 0696 — — — — — — — — — — —OCFAR<4:0>001F

RPINR12 0698 — — — — — — — — — — —FLTA1R<4:0>001F

RPINR13 069A — — — — — — — — — — —FLTA2R<4:0>001F

RPINR14 069C — — — QEB1R<4:0> — — —QEA1R<4:0>1F1F

RPINR15 069E — — — — — — — — — — — INDX1R<4:0> 001F

RPINR18 06A4 — — — U1CTSR<4:0> — — —U1RXR<4:0>1F1F

RPINR20 06A8 — — —SCK1R<4:0>— — —SDI1R<4:0>1F1F

RPINR21 06AA — — — — — — — — — — — SS1R<4:0> 001F

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-17: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ32MC202

File

Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 B i t 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

RPOR0 06C0 — — — RP1R<4:0> ——— RP0R<4:0> 0000

RPOR1 06C2 — — — RP3R<4:0> ——— RP2R<4:0> 0000

RPOR2 06C4 — — — RP5R<4:0> ——— RP4R<4:0> 0000

RPOR3 06C6 — — — RP7R<4:0> ——— RP6R<4:0> 0000

RPOR4 06C8 — — — RP9R<4:0> ——— RP8R<4:0> 0000

RPOR5 06CA — — —RP11R<4:0>——— RP10R<4:0> 0000

RPOR6 06CC — — —RP13R<4:0>——— RP12R<4:0> 0000

RPOR7 06CE — — —RP15R<4:0>——— RP14R<4:0> 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-18: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ32MC204 AND dsPIC33FJ16 MC304

File

Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets

RPOR0 06C0 — — — RP1R<4:0> — — — RP0R<4:0> 0000

RPOR1 06C2 — — — RP3R<4:0> — — —RP2R<4:0>

0000

RPOR2 06C4 — — — RP5R<4:0> — — —RP4R<4:0>

0000

RPOR3 06C6 — — — RP7R<4:0> — — —RP6R<4:0>

0000

RPOR4 06C8 — — — RP9R<4:0> — — —RP8R<4:0>

0000

RPOR5 06CA — — —RP11R<4:0>— — — RP10R<4:0> 0000

RPOR6 06CC — — —RP13R<4:0>— — — RP12R<4:0> 0000

RPOR7 06CE — — —RP15R<4:0>— — — RP14R<4:0> 0000

RPOR8 06D0 — — —RP17R<4:0>— — — RP16R<4:0> 0000

RPOR9 06D2 — — —RP19R<4:0>— — — RP18R<4:0> 0000

RPOR10 06D4 — — —RP21R<4:0>— — — RP20R<4:0> 0000

RPOR11 06D6 — — —RP23R<4:0>— — — RP22R<4:0> 0000

RPOR12 06D8 — — —RP25R<4:0>— — — RP24R<4:0> 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-19: PORTA REGISTER MAP FOR dsPIC33FJ32MC202

File

Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets

TRISA 02C0

— — — — — — — — — — —

TRISA4 TRISA3 TRISA2 TRISA1 TRISA0

001F

PORTA 02C2

— — — — — — — — — — — RA4 RA3 RA2 RA1 RA0

xxxx

LATA 02C4

— — — — — — — — — — — LATA4 LATA3 LATA2 LATA1 LATA0

xxxx

ODCA 02C6

— — — — — — — — — — —

ODCA4 ODCA3 ODCA2 ODCA1 ODCA0

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-20: PORTA REGISTER MAP FOR dsPIC33FJ32MC204 AND dsPIC33FJ16MC304

File

Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets

TRISA 02C0

— — — — — TRISA10 TRISA9 TRISA8 TRISA7 — —

TRISA4 TRISA3 TRISA2 TRISA1 TRISA0

079F

PORTA 02C2

— — — — — RA10 RA9 RA8 RA7 —— RA4 RA3 RA2 RA1 RA0

xxxx

LATA 02C4

— — — — — LAT10 LAT8 LAT8 LAT7 —— LATA4 LATA3 LATA2 LATA1 LATA0

xxxx

ODCA 02C6

— — — — — ODCA10 ODCA9 ODCA8 ODCA7 — —

ODCA4 ODCA3 ODCA2 ODCA1 ODCA0

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-21: PORTB REGISTER MAP

File

Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets

TRISB 02C8 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB6 TRISB5 TRISB1 TRISB0

FFFF

PORTB 02CA RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB6 RB5 RB1 RB0

xxxx

LATB 02CC LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB6 LATB5 LATB1 LATB0

xxxx

ODCB 02CE

ODCB15 ODCB14 ODCB13 ODCB12 ODCB11 ODCB10 ODCB9 ODCB8 ODCB7 ODCB6 ODCB5 ODCB4 ODCB6 ODCB5 ODCB1 ODCB0

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for 100-pin devices.

TABLE 4-22: PORTC REGISTER MAP FOR dsPIC33FJ32MC20 4 AND dsPIC33FJ16MC304

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets

TRISC 02D0

— — — — — —

TRISC9 TRISC8 TRISC7

TRISC6 TRISC5

TRISC4

TRISC6 TRISC5

TRISC1 TRISC0 03FF

PORTC 02D2

— — — — — —

RC9 RC8 RC7

RC6 RC5

RC4

RC6 RC5

RC1 RC0 xxxx

LATC 02D4

— — — — — —

LATC9 LATC8 LATC7

LATC6 LATC5

LATC4

LATC6 LATC5

LATC1 LATC0 xxxx

ODCC 02D6

— — — — — —

ODCC9 ODCC8 ODCC7

ODCC6 ODCC5

ODCC4

ODCC6 ODCC5

ODCC1 ODCC0 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

TABLE 4-23: SYSTEM CONTROL REGISTER MAP

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

RCON 0740 TRAPR IOPUWR ———— CM VREGS EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR

xxxx

(1)

OSCCON 0742 —COSC<2:0>— NOSC<2:0> CLKLOCK IOLOCK LOCK —CF— LPOSCEN OSWEN 0300

(2)

CLKDIV 0744 ROI DOZE<2:0> DOZEN FRCDIV<2:0> PLLPOST<1:0> — PLLPRE<4:0> 3040

PLLFBD 0746 — — — — — — — PLLDIV<8:0> 0030

OSCTUN 0748 — — — — — — — — — —TUN<5:0>0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.

Note 1: RCON register Reset values dependent on type of Reset.

2: OSCCON register Reset values depen dent on the FOSC Configuration bits and by type of Reset.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-24: NVM REGISTER MAP

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

NVMCON 0760 WR WREN WRERR —————— ERASE ——NVMOP<3:0>

0000

(1)

NVMKEY 0766

———————— NVMKEY<7:0>

0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

Note 1: Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset.

TABLE 4-25: PMD REGISTER MAP

File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All

Resets

PMD1 0770 — — T3MD T2MD T1MD QEIMD PWM1MD —I2C1MD —U1MD —SPI1MD — — AD1MD 0000

PMD2 0772 IC8MD IC7MD — — — —IC2MDIC1MD— — — — — —OC2MDOC1MD0000

PMD3 0774 — — — — — — — — — — —PWM2MD— — — — 0000

Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in he xadecimal.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.2.6 SOFTWARE STACK

In addition to its use as a working register, the W15

dsPIC33FJ16MC304 devices is also used as a

software Stack Pointer. The Stack Pointer always

points to the first available free word and grows from

lower to higher addresses. It predecrements for stack

pops and post-increments for stack pushes, as shown

in Figure 4-4. For a PC push during any CALL

instruction, the MSb of the PC is zero-extended before

the push, ensuring that the MSb is always clear.

The Stack Pointer Limit register (SPLIM) associated

with the S t ack Pointer sets an upper address boundary

for the stack. SPLIM is uninitialized at Reset. As is the

case for the Stack Pointer, SPLIM<0> is forced to ‘0’

because all stack operations must be word-aligned.

Whenever an EA is generated using W15 as a source

or destination pointer, the resulting address is

compared with the value in SPLIM. If the contents of

the Stack Pointer (W15) and the SPLIM register are

equal and a push operation is performed, a stack error

trap will not occur. The stack error trap will occur on a

subsequent push operation. For example, to cause a

stack error trap when the stack grows beyond address

0x1000 in RAM, initialize the SPLIM with the value

0x0FFE.

Similarly, a St ack Pointer underflow (stack error) trap is

generated when the Stack Pointer address is found to

be less than 0x0800. This prevents the stack from

interfering with the Special Function Register (SFR)

space.

A write to the SPLIM register should not be immediately

followed by an indirect read operation using W15.

FIGURE 4-4: CALL STACK FRAME

4.2.7 DATA RAM PROTECTION FEATURE

The dsPIC33F product family supports Data RAM

protection features that enable segments of RAM to be

protected when used in conjunction with Boot and

Secure Code Segment Security . BSRAM (Secure RAM

segment for BS) is accessible only from the Boot

Segment Flash code when enabled. SSRAM (Secure

RAM segment for RAM) is accessible only from the

Secure Segment Flash code when enabled. See

Table 4-1 for an overvie w of the BSRAM and SSRAM

SFRs.

4.3 Instruction Addressing Modes

The addressing modes shown in Table 4-26 form the

basis of the addressing modes optimized to support the

specific features of individual instructions. The

addressing modes provided in the MAC class of

instructions differ from those in the other instruction

types.

4.3.1 FILE REGISTER INSTRUCTIONS

Most file register instructions use a 13-bit address field

(f) to directly address data present in the first 8192

bytes of data memory (near data space). Most file

which is denoted as WREG in these instructions. The

destination is typically either the same file register or

WREG (with the exception of the MUL instruction),

which writes the result to a regist er or register p air. The

MOV instruction allows additional flexibility and can

access the entire data space.

4.3.2 MCU INSTRUCTIONS

The three-operand MCU instructions are of the form:

Operand 3 = Operand 1 <function> Operand 2

where Operand 1 is always a workin g register (that is,

the addressing mode can only be register direct), which

is referred to as Wb. Operand 2 can be a W register,

fetched from data memory, or a 5-bit literal. The result

location can be either a W register or a data memory

location. The following addressing modes are

supported by MCU instructions:

• Register Direct

• Register Indirect

• Register Indirect Post-Modified

• Register Indirect Pre-Modified

• 5-bit or 10-bit Literal

Note: A PC push during exception processing

concatenates the SRL register to the MSb

of the PC prior to the push.

PC<15:0>

000000000

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Toward

Higher Address

0x0000

PC<22:16>

POP : [--W15]

PUSH : [W15++]

Note: Not all instructions support all the

addressing modes given above. Individ-

ual instructions can support different

subsets of th es e addressing mod e s .

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 4-26: FUNDAMENTAL ADDRESSING MODES SUPPORTED

4.3.3 MOVE AND ACCUMULATOR

INSTRUCTIONS

Move instructions and the DSP accumulator class of

instructions provide a greater degree of addressing

flexibility than other instructions. In addition to the

addressing modes supported by most MCU

instructions, move and accumulator instructions also

support Register Indirect with Register Offset

Addressing mode, also referred to as Register Indexed

mode.

In summary, the following addressing modes are

supported by move and accumulator instructions:

• Register Direct

• Register Indirect

• Register Indirect Post-modified

• Register Indirect Pre-modified

• Register Indirect with Register Offset (Indexed)

• Register Indirect with Literal Offset

• 8-bit Literal

• 16-bit Literal

4.3.4 MAC INSTRUCTIONS

The dual source operand DSP instructions (CLR, ED,

EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred

to as MAC instructions, use a simplified set of addressing

modes to allow the user application to effectively

manipulate the data pointers through register indirect

tables.

The two-source operand prefetch registers must be

members of the set {W8, W9, W10, W11}. For data

reads, W8 and W9 are always directed to the X RAGU,

and W10 and W11 a re always directed to the Y AGU.

The effective addresses generated (before and after

modification) must, therefore, be valid addresses within

X data space for W8 and W9 and Y data space for W10

and W11.

In summary, the following addressing modes are

supported by the MAC class of instructions:

• Register Indirect

• Register Indirect Post-Modified by 2

• Register Indirect Post-Modified by 4

• Register Indirect Post-Modified by 6

• Register Indirect with Register Offset (Indexed)

4.3.5 OTHER INSTRUCTIONS

Besides the addressing modes outlined previously , some

instructions use literal constants of various sizes. For

example, BRA (branch) instructions use 16-bit signed

literals to specify the branch destination directly, whereas

the DISI instruction uses a 14-bit unsigned literal field. In

some instructions, such as ADD Acc, the source of an

operand or result is implied by the opcode itself. Certain

operations, such as NOP, do not have any operands.

Addressing Mode Description

File Register Direct The address of the file register is specified explicitly.

or decremented) by a constant value.

to form the EA.

(Register Indexed) The sum of Wn and Wb forms the EA.

Note: For the MOV instructions, the addressing

mode specified in the instruction can differ

for the source and destination EA.

However, the 4-bit Wb (Register Offset)

field is shared by both source and

destination (but typically only used by

one).

Note: Not all instructions support all the

addressing modes given above. Individual

instructions may support different subsets

of these addressing modes.

Note: Register Indirect with Register Offset

Addressing mode is availab le only for W9

(in X space) and W11 (in Y space).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.4 Modulo Addressing

Modulo Addressing mode is a method of providing an

automated means to support circular data buffers using

hardware. The objective is to remove the need for

software to perform data address boundary checks

when executing tightly looped code, as is typical in

many DSP algorithms.

Modulo Addressing can operate in either data or program

space (since the data pointer mechanism is essentially

the same for both). One circular buffer can be supported

in each of the X (which also provides the pointers into

program space) and Y data spaces. Modulo Addressing

can operate on any W register pointer. However, it is not

advisable to use W14 or W15 for Modulo Addressing

since these two registers are used as the Stack Frame

Pointer and S t ack Pointer, respectively.

In general, any particular circular buffer can be

configured to operate in only one direction as there are

certain restrictions on the buffer start address (for incre-

menting buffers), or end address (for decrementing

buffers), based upon the direction of the buffer.

The only exception to the usage restrictions is for

buffers that have a power-of-two length. As these

buffers satisfy the start and end address criteria, they

can operate in a bidirectional mode (that is, address

boundary checks are performed on both the lower and

upper address boundaries).

4.4.1 START AND END ADDRESS

The Modulo Addressing scheme requires that a

starting and ending address be specified and loaded

into the 16-bit Modulo Buffer Address registers:

XMODSRT, XMODEND, YMODSRT and YMODEND

(see Table 4-1).

The length of a circular buffer is not directly specified. It

is determined by the difference between the

corresponding start and end addresses. The maximum

possible length of the circular buffer is 32K words

(64 Kbytes).

4.4.2 W ADDRESS REGISTER

SELECTION

The Modulo and Bit-Reversed Addressing Control

as a W register field to specify the W Address registers.

The XWM and YWM fields select the registers that will

operate with Modulo Addressing:

•If XWM = 15, X RAGU and X WAGU Modulo

Addressing is disabled.

•If YWM = 15, Y AGU Modulo Addressing is

disabled.

The X Address Space Pointer W register (XWM), to

which Modulo Addressing is to be appli ed, is stored in

MODCON<3:0> (see Table 4-1). Modulo Addressing is

enabled for X data space when XWM is set to any value

other than ‘15’ and the XMODEN bit is set at

MODCON<15>.

The Y Address Space Pointer W register (YWM) to

which Modulo Addressing i s to be applied is stored in

MODCON<7:4>. Modulo Addressing is enabled for Y

data space when YWM is set to any value other than

‘15’ and the YMODEN bit is set at MODCON<14>.

FIGURE 4-5: MODULO ADDRESSING OPERATION EXAMPLE

Note: Y space Modulo Addressing EA

calculations assume word-sized data

(LSb of every EA is always clear).

0x1100

0x1163

Start Addr = 0x1100

End Addr = 0x1163

Length = 0x0032 words

Byte

Address

MOV #0x1100, W0

MOV W0, XMODSRT ;set modulo start address

MOV #0x1163, W0

MOV W0, MODEND ;set modulo end address

MOV #0x8001, W0

MOV W0, MODCON ;enable W1, X AGU for modulo

MOV #0x0000, W0 ;W0 holds buffer fill value

MOV #0x1110, W1 ;point W1 to buffer

DO AGAIN, #0x31 ;fill the 50 buffer locations

MOV W0, [W1++] ;fill the next location

AGAIN: INC W0, W0 ;increment the fill value

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.4.3 MODULO ADDRESSING

APPLICABILITY

Modulo Addressing can be applied to the Effective

Address (EA) calculation associated with any W

equal to:

• The upper boundary addresses for incrementing

buffers

• The lower boundary addresses for decrementing

buffers

It is important to realize that the address boundaries

check for addresses less than or greater than the upper

(for incrementing buffers) and lower (for decrementing

buffers) boundary addresses (not just equal to).

Address changes can, therefore, jump beyond

boundaries and still be adjusted correctly.

4.5 Bit-Reversed Addressing

Bit-Reversed Addressing mode is intended to simplify

data re-ordering for radix-2 FFT algorithms. It is

supported by the X AGU for data writes only.

The modifier, which can be a constant value or register

contents, is regarded as having its bit order reversed. The

address source and destination are kep t in normal order.

Thus, the only operand requiri ng reversal is the modifier.

4.5.1 BIT-REVERSED ADDRESSING

IMPLEMENTATION

Bit-Reversed Addressing mode is enabled in any of

these situations:

• BWM bits (W register selection) in the MODCON

cannot be accessed using Bit-Reversed

Addressing)

• The BREN bit is set in the XBREV register

• The addressing mode used is Register Indirect

with Pre-Increment or Post-Increment

If the length of a bit-reversed buffer is M = 2N bytes,

the last ‘N’ bits of the data buffer start address must

be zeros.

XB<14:0> is the Bit-Reversed Address modifier, or

‘pivot point’, which is typically a constant. In the case of

an FFT computation, its value is equal to half of the FFT

data buffer size.

When enabled, Bit-Reversed Addressing is executed

only for Register Indirect with Pre-Increment or

Post-Increment Addressing and word-sized data

writes. It will not function for any other addressing

mode or for byte-sized data, and normal addresses are

generated instead. When Bit-Reversed Addressing is

active, the W Address Pointer is always added to the

address modifier (XB), and the offset associated with

the Register Indirect Addressing mode is ignored. In

addition, as word-sized data is a requirement, the LSb

of the EA is ignored (and always clear).

If Bit-Reversed Addressing has already been enabled

by setting the BREN bit (XBREV<15>), a write to the

XBREV register should not be immediately followed by

an indirect read operation using the W register that has

been designated as the bit-reversed pointer.

Note: The modulo corrected effective address is

written back to the register only when

Pre-Modify or Post-Modify Addressing

mode is used to compute the effective

address. When an address of fset (such as

[W7 + W2]) is used, Modulo Address

correction is performed but the contents of

the register remain unchanged.

Note: All bit-reversed EA calculations assume

word-sized data (LSb of every EA is

always clear). The XB value is scaled

accordingly to generate compatible (byte)

addresses.

Note: Modulo Addressing and Bit-Reversed

Addressing should not be enabled

together. If an application attempts to do

so, Bit-Reversed Addressing will assume

priority when active for the X WAGU and X

WAGU, Modulo Addressing will be

disabled. However , Modulo Addressing will

continue to function in the X RAGU.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 4-6: BIT-REVERSED ADDRESS EXAMPLE

TABLE 4-27: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)

b3 b2 b1 0

b2 b3 b4 0

Bit Locations Swapped Left-to-Right

Around Center of Binary Value

Bit-Reversed Address

XB = 0x0008 for a 16-Word Bit-Reversed Buffer

b7 b6 b5 b1

b7 b6 b5 b4

b11 b10 b9 b8

b15 b14 b13 b12

Sequential Address

Pivot Point

Normal Address Bit-Reversed Address

A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal

0000 00000 0

0001 11000 8

0010 20100 4

0011 31100 12

0100 40010 2

0101 51010 10

0110 60110 6

0111 71110 14

1000 80001 1

1001 91001 9

1010 10 0101 5

1011 11 1101 13

1100 12 0011 3

1101 13 1011 11

1110 14 0111 7

1111 15 1111 15

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.6 Interfacing Program and Data

Memory Spaces

The dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 architecture uses a 24-bit-wide

program space and a 16-bit-wide data space. The

architecture is also a modified Harvard scheme,

meaning that data can also be present in the program

space. To use this data successfully, it must be

accessed in a way that preserves the alignment of

information in both spaces.

Aside from normal execution, the

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

architecture provides two methods by which program

space can be accessed during operati on:

• Using table instructions to access individual bytes

or words anywhere in the program space

• Remapping a portion of the program space into

the data space (Program Space Visibility)

Table instructions allow an application to read or write

to small areas of the program memo ry. This capability

makes the method ideal for accessing data tables that

need to be updated periodically. It also allows access

to all bytes of the program word. The remapping

method allows an application to access a large block of

data on a read-only basis, which is ideal for look-ups

from a large table of static data. The application can

only access the least significant word of the program

word.

4.6.1 ADDRESSING PROGRAM SPACE

Since the address ranges for the data and program

spaces are 16 and 24 bits, respectively, a method is

needed to create a 23-bit or 24-bit program address

from 16-bit data registers. The solution depends on the

interface method to be used.

For table operations, the 8-bit Table Page register

(TBLPAG) is used to define a 32K word region within

the program space. This is concatenated with a 16-bit

EA to arrive at a full 24-bit program space address. In

this format, the Most Significant bit of TBLPAG is used

to determine if the operation occurs in the user memory

(TBLPAG<7> = 0) or the configuration memory

(TBLPAG<7> = 1).

For remapping operations, the 8-bit Program Space

Visibility register (PSVPAG) is used to define a

16K word page in the program space. When the Mo st

Significant bit of the EA is ‘1’, PSVP AG is concatenated

with the lower 15 bits of the EA to form a 23-bit program

space address. Unlike table operations, this limits

remapping operations strictly to the user memory area.

Table 4-28 and Figure 4-7 show how the program EA is

created for table operations and remapping accesses

from the data EA. Here, P<23:0> refers to a program

space word, and D<15:0> refers to a data space word.

TABLE 4-28: PROGRAM SPACE ADDRESS CONSTRUCTION

Access Type Access

Space Program Space Address

<23> <22:16> <15> <14:1> <0>

Instruction Access

(Code Execution) User 0PC<22:1> 0

0xx xxxx xxxx xxxx xxxx xxx0

TBLRD/TBLWT

(Byte/Word Read/Write) User TBLPAG<7:0> Data EA<15:0>

0xxx xxxx xxxx xxxx xxxx xxxx

Configuration TBLPAG<7:0> Data EA<15:0>

1xxx xxxx xxxx xxxx xxxx xxxx

Program Space Visibility

(Block Remap/Read) User 0PSVPAG<7:0> Data EA<14:0>(1)

0 xxxx xxxx xxx xxxx xxxx xxxx

Note 1: Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of

the address is PSVPAG<0>.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 4-7: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION

0Program Counter

23 bits

PSVPAG

8 bits

15 bits

Program Counter(1)

Select

TBLPAG

8 bits

16 bits

Byte Select

1/0

User/Configuration

Table Operations(2)

Program Space Visibility(1)

Space Select

24 bits

23 bits

(Remapping)

1/0

Note 1: The Least Significant bit (LSb) of program space addresses is always fixed as ‘0’ to

maintain word alignment of data in the program and data spaces.

2: Table operations are not required to be word-aligned. Table read operations are permitted

in the configuration memory space.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.6.2 DATA ACCESS FROM PROGRAM

MEMORY USING TABLE

INSTRUCTIONS

The TBLRDL and TBLWTL instructions offer a direct

method of reading or writing the lower word of any

address within the program space without going

through data space. The TBLRDH and TBLWTH

instructions are the only method to read or write the

upper 8 bits of a program space word as data.

The PC is incremented by two for each successive

24-bit program word. This allows program memory

addresses to directly map to data space addresses.

Program memory can thus be regarded as two

16-bit-wide word address spaces, residing side by side,

each with the same address range. TBLRDL and

TBLWTL access the space that contains the least

significant data word. TBLRDH and TBLWTH access the

space that contains the upper data byte.

Two table instructions are provided to move byte or

word-sized (16-bit) data to and from program space.

Both function as either byte or word operati ons.

•TBLRDL (Table Read Low):

- In Word mode, this instruction maps the

lower word of the program space

location (P<15:0>) to a data address

(D<15:0>).

- In Byte mode, either the upper or lower byte

of the lower program word is mapped to the

lower byte of a data address. The upper byte

is selected when Byte Select is ‘1’; th e lower

byte is selected when it is ‘0’.

•TBLRDH (Table Read High):

- In W ord mode, this instruction maps the entire

upper word of a program address (P<23:16>)

to a data address. Note that D<15:8>, the

‘phantom byte’, will always be ‘0’.

- In Byte mode, this instruction maps the upper

or lower byte of the program word to D<7:0>

of the data address, in the TBLRDL instruc-

tion. The data is always ‘0’ when the upper

‘phantom’ byte is selected (Byte Select = 1).

In a similar fashion, two table instructions, TBLWTH

and TBLWTL, are used to write individual bytes or

words to a program space address. The details of

their operation are explained in Section 5.0 “Flash

Program Memory”.

For all table operations, the area of program memory

space to be accessed is determined by the Table Page

memory space of the device, including user and

configuration spaces. When TBLP AG<7> = 0, the table

page is located in the user memory space. When

TBLPAG<7> = 1, the page is located in configuration

space.

FIGURE 4-8: ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS

081623

00000000

‘Phantom’ Byte

TBLRDH.B (Wn<0> = 0)

TBLRDL.W

TBLRDL.B (Wn<0> = 1)

TBLRDL.B (Wn<0> = 0)

23 15 0

TBLPAG

0x000000

0x800000

0x020000

0x030000

Program Space

The address for the table operation is determined by th e data EA

within the page defined by the TBLPAG register.

Only read operations are shown; wr ite operations are also valid in

the user memory area.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

4.6.3 READING DATA FROM PROGRAM

MEMORY USING PROGRAM SPACE

VISIBILITY

The upper 32 Kbytes of data space may optionally be

mapped into any 16K word page of the program space.

This option provides transparent access to stored

constant data from the data space without the need to

use special instructions (such as TBLRDL/H).

Program space access through the data space occurs

if the Most Significant bit of the data space EA is ‘1’ and

program space visibility is enabled by settin g the PSV

bit in the Core Control register (CORCON<2>). The

location of the program memory space to be mapped

into the data space is determined by the Program

Space Visibility Page register (PSVPAG). This 8-bit

16K words in program space. In effect, PSVPAG

functions as the upper 8 bits of the program memory

address, with the 15 bits of the EA functioning as the

lower bits. By incrementing the PC by 2 for each

program memory word, the lower 15 bits of data space

addresses directly map to the lower 15 bits in the

corresponding program space addresses.

Data reads to this area add a cycle to the instruction

being executed, since two program memory fetches

are required.

Although each data space address 8000h and higher

maps directly into a corresponding program memory

address (see Figure 4-9), onl y the lower 16 bits of the

24-bit program word are used to contain the data. The

upper 8 bits of any program space location used as

data should be programmed with ‘1111 1111’ or

‘0000 0000’ to force a NOP. This prevents possible

issues should the area of code ever be accidentally

executed.

For operations that use PSV and are executed outside

a REPEAT loop, the MOV and MOV.D instructions

require one instruction cycle in addition to the specified

execution time. All other instructions require two

instruction cycles in addition to the specified execution

time.

For operations that use PSV, and are executed inside

a REPEAT loop, these instances require two instruction

cycles in addition to the specified execution time of the

instruction:

• Execution in the first iteration

• Execution in the last iteration

• Execution prior to exiting th e loop due to an

interrupt

• Execution upon re-entering the loop after an

interrupt is serviced

Any other iteration of the REPEAT loop will allow the

instruction using PSV to access data, to execute in a

single cycle.

FIGURE 4-9: PROGRAM SPACE VISIBILITY OPERATION

Note: PSV access is temporarily disabled during

table reads/writes.

23 15 0

PSVPAG Data Spa ce

Program Space

0x0000

0x8000

0xFFFF

02 0x000000

0x800000

0x010000

0x018000

When CORCON<2> = 1 and EA<15> = 1:

The data in the page

designated by

PSVPAG is mapped

into the upper half of

the data memory

space...

Data EA<14:0>

...while the lower 15 bits

of the EA specify an

exact address within

the PSV area. This

corresponds exactly to

the same lower 15 bits

of the actual program

space address.

PSV Area

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

5.0 FLASH PROGRAM MEMORY

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

devices contain internal Flash program memory for

storing and executing application code. The memory is

readable, writable and erasable during norma l operation

over the entire VDD range.

Flash memory can be pro grammed in tw o w ays :

• In-Circuit Serial Programming™ (ICSP™)

programming capability

• Run-T ime Self-Programming (RTSP)

ICSP allows a dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 device to be serially programmed

while in the end application circuit. This is done with

two lines for programming clock and programming data

(one of the alternate programming pin pairs:

PGECx/PGEDx), and three other lines for power (VDD),

ground (VSS) and Master Clear (MCLR). This allows

customers to manufacture boards with unprogrammed

devices and then program the digital signal controller

just before shipping the product. This also allows the

most recent firmware or a custom firmware to be pro-

grammed.

RTSP is accomplished using TBLRD (table read) and

TBLWT (table write) instructions. With RTSP, the user

application can write program memory data either in

blocks or ‘rows’ of 64 instructions (192 bytes) at a time

or a single program memory word , and erase p rogram

memory in blocks or ‘pages’ of 512 instructions (1536

bytes) at a time.

5.1 Table Instructions and Flash

Programming

Regardless of the method used, all programming of

Flash memory is done with the table read and table

write instructions. These allow direct read and write

access to the program memory space from the data

memory while the devi ce is in no rmal operating mode.

The 24-bit target address in the program memory is

formed using bits <7:0> of the TBLP AG register and the

Effective Address (EA) from a W register specified in

the table instruction, as shown in Figure 5-1.

The TBLRDL and the TBLWTL instructions are used to

read or write to bits <15:0> of program memory.

TBLRDL and TBLWTL can access program memory in

both Word and Byte modes.

The TBLRDH and TBLWTH instructions are used to read

or write to bits <23:16> of program memory. TBLRDH

and TBLWTH can also access program memory in Word

or Byte mode.

FIGURE 5-1: ADDRESSING FOR TABLE REGISTERS

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices. It is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

5. “Flash Programming” (DS70191) of

the “dsPIC33F/PIC24H Family Refer-

ence Manual” which is available from the

Microchip web site (www.microchip.com)

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Program Counter

24 bits

Program Counter

TBLPAG Reg

8 bits

Working Reg EA

16 bits

Byte

24-bit EA

1/0

Select

Using

Tabl e Instruction

Using

User/Configuration

Space Select

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

5.2 RTSP Operation

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

Flash program memory array is organized into rows of 64

instructions or 192 bytes. RTSP allows the user

application to erase a page of memory, which consists of

eight rows (512 instructions) at a time, and to program

one row or one word at a time. Table 24-12 shows typical

erase and programming times. The 8-row erase pages

and single row write rows are edge-aligned from the

beginning of program memory, on boundaries of 1536

bytes and 192 bytes, respectively.

The program memory implements holding buffers that

can contain 64 instructions of programming data. Prior

to the actual programming operation, the write data

must be loaded into the buffers sequentially. The

instruction words loaded must always be from a group

of 64 boundary.

The basic sequence for RTSP programming is to set up

a Table Pointer, then do a series of TBLWT instructions

to load the buffers. Programming is performed by

setting the control bits in the NVMCON register. A total

of 64 TBLWTL and TBLWTH instructions are re quired

to load the instructions.

All of the table write operat ions are single-word writes

(two instruction cycles) because only the buffers are

written. A programming cycle is required for

programming each row.

5.3 Programming Operations

A complete programming sequence is necessary for

programming or erasing the internal Flash in RTSP

mode. The processor stalls (waits) until the

programming operation is finished.

The programming time depe nds on the FRC accuracy

(see Table 24-18, “AC Characteristics: Internal RC

Accuracy”) and the value of the FRC Oscillator Tuning

calculate the minimum and maximum values for the

Row Write Time, Page Erase Time, and Word Write

Cycle Time parameters (see Table 24-12, “DC

Characteristics: Program Memory”).

EQUATION 5-1: PROGRAMMING TIME

For example, if the device is operating at +125°C, the

FRC accuracy will be ±5%. If the TUN<5:0> bits (see

write time is equal to Equation 5-2.

EQUATION 5-2: MINIMUM ROW WRITE

TIME

The maximum row write time is equal to Equation 5-3.

EQUATION 5-3: MAXIMUM ROW WRITE

TIME

Setting the WR bit (NVMCON<15>) starts the opera-

tion, and the WR bit is automatically cleared when the

operation is finished.

5.4 Control Registers

Two SFRs are used to read and write the program

Flash memory: NVMCON and NVMKEY.

The NVMCON register (Register 5-1) controls which

blocks are to be erased, which memory type is to be

programmed and the start of the programming cycle.

NVMKEY is a write-only register that is used for write

protection. To start a programming or erase sequence,

the user application must consecutively write 0x55 and

0xAA to the NVMKEY register. Refer to Section 5.3

“Programming Operations” for further details.

7.37 MHz FRC Accuracy()%FRC Tuning()%××

----------------------------------------------------------------------------------------------------------------------------

TRW 11064 Cycles

7.37 MHz 10.05+()1 0.00375–()××

------------------------------------------------------------------------------------------------ 1.435ms==

TRW 11064 Cycles

7.37 MHz 10.05–()1 0.00375–()××

------------------------------------------------------------------------------------------------1.586ms==

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/SO-0(1) R/W-0(1) R/W-0(1) U-0 U-0 U-0 U-0 U-0

WR WREN WRERR — — — — —

bit 15 bit 8

U-0 R/W-0(1) U-0 U-0 R/W-0(1) R/W-0(1) R/W-0(1) R/W-0(1)

— ERASE ——NVMOP<3:0>

(2)

bit 7 bit 0

Legend: SO = Settable Only bit

R = Readable bit W = Writable bit U = Unimp lemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 WR: Write Control bit

1 = Initiates a Flash memory program or erase opera tion. The operation is self-ti med and the bit is

cleared by hardware once operation is complete

0 = Program or erase operation is complete and inactive

bit 14 WREN: Write Enable bit

1 = Enable Flash program/erase operations

0 = Inhibit Flash program/erase operations

bit 13 WRERR: Write Sequence Error Flag bit

1 = An improper program or erase sequence attempt or termination has occurred (bit is set

automatically on any set attempt of the WR bit)

0 = The program or erase operation completed normally

bit 12-7 Unimplemented: Read as ‘0’

bit 6 ERASE: Erase/Program Enable bit

1 = Perform the erase ope ration specified by NVMOP<3:0> on the next WR co mmand

0 = Perform the program operation specified by NVMOP<3:0> on the next WR command

bit 5-4 Unimplemented: Read as ‘0’

bit 3-0 NVMOP<3:0>: NVM Operation Select bits(2)

If ERASE = 1:

1111 = Memory bulk erase operation

1101 = Erase General Segment

1100 = Erase Secure Segment

0011 = No operation

0010 = Memory page erase operation

0001 = No operation

0000 = Erase a single Configuration register byte

If ERASE = 0:

1111 = No operation

1101 = No operation

1100 = No operation

0011 = Memory word program operation

0010 = No operation

0001 = Memory row program operation

0000 = Program a single Configuration register byte

Note 1: These bits can only be Reset on a POR.

2: All other combinations of NVMOP<3:0> are unimplemented.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0

NVMKEY<7:0>

bit 7 bit 0

Legend: SO = Settable Only bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-8 Unimplemented: Read as ‘0’

bit 7-0 NVMKEY<7:0>: Key Register (write-only) bits

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

5.4.1 PROGRAMMING ALGORITHM FOR

FLASH PROGRAM MEMORY

Programmers can program one row of p rogram Flash

memory at a time. To do this, it is necessary to erase

the 8-row erase page that contains the desired row.

The general process is:

1. Read eight rows of program memory

(512 instructions) and store in data RAM.

2. Update the program data in RAM with the

desired new data.

3. Erase the block (see Example 5-1):

a) Set the NVMOP bits (NVMCON<3:0>) to

‘0010’ to configure for block erase. Set the

ERASE (NVMCON<6>) and WREN

(NVMCON<14>) bits.

b) Write the starting address of the p age to be

erased into the TBLPAG and W registers.

c) Wr it e 0x55 to NVMKEY.

d) Write 0xAA to NVMKEY.

e) Set the WR bit (NVMCON<15>). The erase

cycle begins and the CPU stalls for the

duration of the erase cycle. When the erase is

done, the WR bit is cleared automatically.

4. Write the first 64 instructions from data RAM into

the program memory buffers (see Example 5-2).

5. Wri t e th e program block to Flash memory:

a) Set the NVMOP bits to ‘0001’ to configure

for row programming. Clear the ERASE bit

and set the WREN bit.

b) Write 0x55 to NVMKEY.

c) Write 0xAA to NVMKEY.

d) Set the WR bit. The programming cycle

begins and the CPU stalls for the duration of

the write cycle. When the write to Flash

memory is done, the WR bit is cleared

automatically.

6. Repeat steps 4 and 5, using the next available

64 instructions from the block in data RAM by

incrementing the value in TBLPAG, until all

512 instructions are written back to Flash memory .

For protection against accidental operations, the write

initiate sequence for NVMKEY must be used to allow

any erase or program operation to proceed. After the

programming command has been executed, the user

application must wait for the programming time until

programming is complete. The two instructions

following the start of the programming sequence

should be NOPs, as shown in Example 5-3.

EXAMPLE 5-1: ERASING A PROGRAM MEMORY PAGE

; Set up NVMCON for block erase operation

MOV #0x4042, W0 ;

MOV W0, NVMCON ; Initialize NVMCON

; Init pointer to row to be ERASED

MOV #tblpage(PROG_ADDR), W0 ;

MOV W0, TBLPAG ; Initialize PM Page Boundary SFR

MOV #tbloffset(PROG_ADDR), W0 ; Initialize in-page EA[15:0] pointer

TBLWTL W0, [W0] ; Set base address of erase block

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55, W0

MOV W0, NVMKEY ; Write the 55 key

MOV #0xAA, W1 ;

MOV W1, NVMKEY ; Write the AA key

BSET NVMCON, #WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

EXAMPLE 5-2: LOADING THE WRITE BUFFERS

EXAMPLE 5-3: INITIATING A PROGRAMMING SEQUENCE

; Set up NVMCON for row programming operations

MOV #0x4001, W0 ;

MOV W0, NVMCON ; Initialize NVMCON

; Set up a pointer to the first program memory location to be written

; program memory selected, and writes enabled

MOV #0x0000, W0 ;

MOV W0, TBLPAG ; Initialize PM Page Boundary SFR

MOV #0x6000, W0 ; An example program memory address

; Perform the TBLWT instructions to write the latches

; 0th_program_word

MOV #LOW_WORD_0, W2 ;

MOV #HIGH_BYTE_0, W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

; 1st_program_word

MOV #LOW_WORD_1, W2 ;

MOV #HIGH_BYTE_1, W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

; 2nd_program_word

MOV #LOW_WORD_2, W2 ;

MOV #HIGH_BYTE_2, W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

•

; 63rd_program_word

MOV #LOW_WORD_31, W2 ;

MOV #HIGH_BYTE_31, W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55, W0

MOV W0, NVMKEY ; Write the 55 key

MOV #0xAA, W1 ;

MOV W1, NVMKEY ; Write the AA key

BSET NVMCON, #WR ; Start the erase sequence

NOP ; Insert two NOPs after the

NOP ; erase command is asserted

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

6.0 RESETS

The Reset module combines all reset sources and

controls the device Master Reset Signal, SYSRST. The

following is a list of device Reset sources:

• POR: Power-on Reset

• BOR: Brown-out Reset

•MCLR

: Master Clear Pin Reset

•SWR: RESET Instruction

• WDTO: Watchdog Timer Reset

• CM: Configuration Misma tch Rese t

• TRAPR: Trap Conflict Reset

• IOPUWR: Illegal Condition Device Reset

- Illegal Opcode Reset

- Uninitialized W Register Reset

- Security Reset

A simplified block diagram of the Reset module is

shown in Figure 6-1.

Any active source of reset will make the SYSRST

signal active. On system Reset, some of the registers

associated with the CPU a nd pe ripherals a re fo rced to

a known Reset state and some are unaffected.

All types of device Reset sets a corresponding status

bit in the RCON register to indicate the type of Reset

(see Register 6-1).

A POR clears all the bits, except for the POR bit

(RCON<0>), that are set. The user appl ication can set

or clear any bit at any time during code execution. The

RCON bits only serve as status bits. Setting a p articular

Reset status bit in software does not cause a device

Reset to occur.

The RCON register also has other bits associated with

the Watchdog Timer and device power-saving states.

The function of these bits is discussed in other sections

of this manual.

FIGURE 6-1: RESET SYSTEM BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 fami ly of devi ces . It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 8. “Reset” (DS70192) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Note: Refer to the specific perip heral section or

Section 3.0 “CPU” of this manual for

Note: The status bits in the RCON register

should be cleared after they are read so

that the next RCON register value after a

device Reset is mean i n gful.

MCLR

VDD

Internal

Regulator BOR

Sleep or Idle

RESET Instruction

WDT

Module

Glitch Filter

Trap Conflict

Illegal Opcode

Uninitialized W Register

SYSRST

VDD Rise

Detect POR

Configuration Mismatch

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0

TRAPR IOPUWR — — — —CMVREGS

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1

EXTR SWR SWDTEN(2) WDTO SLEEP IDLE BOR POR

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 TRAPR: Trap Reset Flag bit

1 = A Trap Conflict Reset has occurred

0 = A Trap Conflict Reset has not occurred

bit 14 IOPUWR: Illegal Opcode or Uninitialized W Access Rese t Flag bit

1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an

Address Pointer caused a Reset

0 = An illegal opcode or uninitialized W Reset has not occurred

bit 13-10 Unimplemented: Read as ‘0’

bit 9 CM: Configuration Mismatch Flag bit

1 = A configuration mismatch Reset has occurred

0 = A configuration mismatch Reset has NOT occurred

bit 8 VREGS: Volt age Regulator St andby During Sleep bit

1 = Voltage regulator is active during Sleep

0 = Voltage regulator goes into Standby mo de during Sleep

bit 7 EXTR: External Reset (MCLR) Pin bit

1 = A Master Clear (pin) Reset has occurred

0 = A Master Clear (pin) Reset has not occurred

bit 6 SWR: Software Reset (Instruction) Flag bit

1 = A RESET instruction has been executed

0 = A RESET instruction has not been executed

bit 5 SWDTEN: Software Enable/Disable of WDT bit (2)

1 = WDT is enabled

0 = WDT is disabled

bit 4 WDTO: Watchdog Timer Time-out Flag bit

1 = WDT time-out has occurred

0 = WDT time-out has not occurred

bit 3 SLEEP: Wake-up from Sleep Flag bit

1 = Device has been in Sleep mode

0 = Device has not been in Sleep mode

bit 2 IDLE: Wake-up from Idle Flag bit

1 = Device was in Idle mode

0 = Device was not in Idle mode

Note 1: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not

cause a device Reset.

2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enab led, regardless of the

SWDTEN bit setting.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 1 BOR: Brown-out Reset Flag bit

1 = A Brown-out Reset has occurred

0 = A Brown-out Reset has not occurred

bit 0 POR: Power-on Reset Flag bit

1 = A Power-on Reset has occurred

0 = A Power-on Reset has not occurred

Note 1: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not

cause a device Reset.

2: If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the

SWDTEN bit setting.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

6.1 System Reset

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

family of devices have two types of Reset:

• Cold Reset

• Warm Reset

A cold Reset is the result of a Power-on Reset (POR)

or a Brown-out Reset (BOR). On a cold Reset, the

FNOSC configuration bits in the FOSC device

configuration register selects the device clock source.

A warm Reset is the result of all other reset sources,

including the RESET instruction. On warm Reset, the

device will continue to operate from the current clock

source as indicated by the Current Oscillator Selection

bits (COSC<2:0>) in the Oscillator Control register

(OSCCON<14:12>).

The device is kept in a Reset state until the system

power supplies have stabilized at appropriate levels

and the oscillator clock is ready. The sequence in

which this oc curs is shown in Figure 6-2.

TABLE 6-1: OSCILLATOR PARAMETERS

Oscillator Mode Oscillator

Start-up Delay Oscillator Start-up

Timer PLL Lock Time To tal Delay

FRC, FRCDIV1 6,

FRCDIVN TOSCD ——TOSCD

FRCPLL TOSCD —TLOCK TOSCD + TLOCK

XT TOSCD TOST —TOSCD + TOST

HS TOSCD TOST —TOSCD + TOST

EC ————

XTPLL TOSCD TOST TLOCK TOSCD + TOST + T LOCK

HSPLL TOSCD TOST TLOCK TOSCD + TOST + T LOCK

ECPLL — — TLOCK TLOCK

SOSC TOSCD TOST —TOSCD + TOST

LPRC TOSCD ——TOSCD

Note 1: TOSCD = Oscillator Start-up Delay (1.1 μs max for FRC, 70 μs max for LPRC). Crystal Oscillator start-up

times vary with crystal characteristics, load capacitance, etc.

2: TOST = Oscillator Start-up Timer Delay (1024 oscil lator clock period). For example, TOST = 102.4 μs for a

10 MHz crystal and TOST = 32 ms for a 32 kHz crystal.

3: TLOCK = PLL lock time (1.5 ms nominal), if PLL is enabled.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 6-2: SYSTEM RESET TIMING

Reset Run

Device Status

VDD

VPOR Vbor

VBOR

POR

BOR

SYSRST

TPWRT

TPOR

TBOR

Oscillator Clock

TOSCD TOST TLOCK

Time

FSCM TFSCM

Note 1: POR: A POR circuit holds the device in Reset when the power supply is turned on. The POR circuit is active

until VDD crosses the VPOR threshold and the delay TPOR has elapsed.

2: BOR: The on-chip voltage regulator has a BOR circuit that keeps the device in R eset until V DD crosses the

VBOR threshold and the delay TBOR has elapsed. The delay TBOR ensures the voltage regulator output

becomes stable.

3: PWRT Timer: The programmable power-up timer continues to hold the processor in Reset for a specific

period of time (TPWRT) after a BOR. The delay TPWRT ensures that the system power supplies have stabilized

at the appropriate level for full-speed operation. After the delay TPWRT has elapsed, the SYSRST becomes

inactive, which in turn enables the selected oscillator to start generating clock cycles.

4: Oscillator Delay: The total delay for the clock to be ready for various clock source selections are given in

Table 6-1. Refer to Section 8.0 “Oscillator Configuration” for more information.

5: When the oscillator clock is ready, the processor begins execution from location 0x000000. The user

application programs a GOTO instruction at the reset address, which redirects program execution to the

appropriate start-up routine.

6: The Fail-Safe Clock Monitor (FSCM), if enable d, begins to monitor th e system clock when the system clock

is ready and the delay TFSCM elapsed.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

6.2 Power-on Reset (POR)

A Power-on Reset (POR) circuit ensures the device is

reset from power-on. The POR circuit is active until

VDD crosses the VPOR threshold and the delay TPOR

has elapsed. The delay TPOR ensures the internal

device bias circuits become stable.

The device supply voltage characteristics must meet

the specified starting voltage and rise rate

requirements to generate the POR. Refer to

Section 24.0 “Electrical Characteristics” for details.

The POR status bit (POR) in the Reset Control register

(RCON<0>) is set to indicate the Power-on Reset.

6.2.1 Brown-out Reset (BOR) and

Power-up timer (PWRT)

The on-chip regulator has a Brown-out Reset (BOR)

circuit that resets the device when the VDD is too low

(VDD < VBOR) for proper device operation. The BOR

circuit keeps the device in Reset until VDD crosses

VBOR threshold and the d elay TBOR has elapsed. The

delay TBOR ensures the voltage regulator output

becomes stable.

The BOR status bit (BOR) in the Reset Control register

(RCON<1>) is set to indicate the Brown-out Reset.

The device will not run at full speed after a BOR as the

VDD should rise to acceptable levels for full-speed

operation. The PWRT provides power-up time delay

(TPWRT) to ensure that the system power supplies have

stabilized at the appropriate levels for full-speed

operation before the SYSRST is released.

The power-up timer delay (TPWRT) is programmed by

the Power-on Reset Timer Value Select bits

(FPWRT<2:0>) in the POR Configuration register

(FPOR<2:0>), which provides eight settings (from 0 ms

to 128 ms). Refer to Section 21.0 “Special Features”

for further details.

Figure 6-3 shows the typical brown-out scenarios. The

reset delay (TBOR + TPWRT) is initiated each time VDD

rises above the VBOR trip point

TABLE 6-2: OSCILLATOR DELAY

Symbol Parameter Value

VPOR POR threshold 1.8V nominal

TPOR POR extension time 30 μs maximum

VBOR BOR threshold 2.5V nominal

TBOR BOR extension time 100 μs maxim um

TPWRT Programmable power-up time delay 0-128 ms nominal

TFSCM Fail-Safe Clock Monitor Delay 900 μs maximum

Note: When the device exits the Reset

condition (begins normal operation), the

device operating parameters (voltage,

frequency, temperature, etc.) must be

within their operating ranges, other-

wise the device may not function cor-

rectly. The user application must

ensure that the delay between the time

power is first applied, and the time

SYSRST becomes inactive, is long

enough to get all operating parameters

within specification.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 6-3: BROWN-OUT SITUATIONS

6.3 External Reset (EXTR)

The external Reset i s generated by driving the MCLR

pin low . The MCLR pin is a Schmitt trigger input with an

additional glitch filter . Reset pulses that are longer than

the minimum pulse-width will generate a Reset. Refer

to Section 24.0 “Electrical Characteristics” for

minimum pulse-width specifications. The External

Reset (MCLR) Pin (EXTR) bit in the Reset Control

6.3.1 EXTERNAL SUPERVISORY CIRCUIT

Many systems have external supervisory circuits that

generate reset signals to Reset multiple de vices in the

system. This external Reset signal can be directly

connected to the MCLR pin to Reset the device when

the rest of system is Reset.

6.3.2 INTERNAL SUPERVISORY CIRCUIT

When using the internal power supervisory circuit to

Reset the device, the external reset pin (MCLR) should

be tied directly or resistively to VDD. In this case, the

MCLR pin will not be used to generate a Reset. The

external reset pin (MCLR) does not have an internal

pull-up and must not be left unconnected.

6.4 Software RESET Instruction (SWR)

Whenever the RESET instruction is executed, the

device will assert SYSRST, placing the device in a

special Reset state. This Reset state will not

re-initialize the clock. The clock source in effect prior to

the RESET instruction will remain. SYSRST is released

at the next instruction cycle, and the reset vector fetch

will commence.

The Software Reset (Instruction) Flag (SWR) bit in the

Reset Control register (RCON<6>) is set to indicate

the software Reset.

6.5 Watchdog Time-out Reset (WDTO)

Whenever a Watchdog time-out occurs, the device will

asynchronously assert SYSRST. The clock source will

remain unchanged. A WDT time-out during Sleep or

Idle mode will wake-up the processor, but will not reset

the processor.

The Watchdog Timer Time-out Flag bit (WDTO) in the

Reset Control register (RCON<4>) is set to indicate

the Watchdog Reset. Refer to Section 21.4

“Watchdog Timer (WDT)” for more information on

Watchdog Reset.

6.6 Trap Conflict Reset

If a lower-priority hard trap occurs while a

higher-priority trap is being processed, a hard trap

conflict Reset occurs. The hard traps include

exceptions of priority level 13 through level 15,

inclusive. The address error (level 13) and oscillator

error (level 14) traps fall into this category.

The Trap Reset Flag bit (TRAPR) in the Reset Control

Reset. Refer to Section 7.0 “Interrupt Controller” for

more information on trap conflict Resets.

VDD

SYSRST

VBOR

VDD

SYSRST

VBOR

VDD

SYSRST

VBOR

TBOR + TPWRT

VDD dips before PWRT expires

TBOR + TPWRT

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

6.7 Configuration Mismatch Reset

To maintain the integrity of the peripheral pin select

control registers, they are constantly monitored with

shadow registers in hardware. If an unexpected

change in any of the registers occur (such as cell

disturbances caused by ESD or other external events),

a configuration mismatch Reset occu rs.

The Configuration Mismatch Flag bit (CM) in the

Reset Control register (RCON<9>) is set to indicate

the configuration mismatch Reset. Refer to

Section 10.0 “I/O Ports” for more information on the

configuration mismatch Reset.

6.8 Illegal Condition Device Reset

An illegal condition device Reset occurs due to the

following sources:

• Illegal Opcode Reset

• Uninitialized W Registe r Reset

• Security Reset

The Illegal Opcode or Uninitialized W Access Reset

Flag bit (IOPUWR) in the Reset Control register

(RCON<14>) is set to indicate the illegal condition

device Re se t.

6.8.1 ILLEGAL OPCODE RESET

A device Reset is generated if the device attempts to

execute an illegal opcode value that is fetched from

program memory.

The illegal opcode Reset function can prevent the

device from executing program memory sections that

are used to store constant data. To take advantage of

the illegal opcode Re set, use only the lower 16 bits of

each program memory section to store the data values.

The upper 8 bits should be programmed with 3Fh,

which is an illegal opco de value.

6.8.2 UNINITIALIZED W REGISTER

RESET

Any attempts to use the uninitialized W re gister as an

address pointer will Reset the device. The W register

array (with the exception of W1 5) is cleared during all

resets and is considered uninitialized until written to.

6.8.3 SECURITY RESET

If a Program Flow Change (PFC) or Vector Flow

Change (VFC) targets a restricted location in a

protected segment (Boot and Secure Segment), that

operation will cause a security Reset.

The PFC occurs when the Program Counter is

reloaded as a result of a Call, Jump, Co mputed Jump,

Return, Return from Subroutine, or other form of

branch instruction.

The VFC occurs when the Program Counter is

reloaded with an Interrupt or Trap vector.

Refer to Section 21.8 “Code Protection and

CodeGuard™ Security” for more information on

Security Reset.

6.9 Using the RCON Status Bits

The user application can read the Reset Control regis-

ter (RCON) after any device Reset to determine the

cause of the reset.

Table 6-3 provides a summary of the reset flag bit

operation.

TABLE 6-3: RESET FLAG BIT OPERATION

Note: The configuration mismatch feature and

associated reset flag is not available on all

devices.

Note: The status bits in the RCON register

should be cleared after they are read so

that the next RCON reg ister value after a

device Reset will be meaningful.

Flag Bit Set by: Cleared by:

TRAPR (RCON<15>) Trap conflict event POR,BOR

IOPWR (RCON<14>) Illegal opcode or uninitialized

W register access or Security Reset POR,BOR

CM (RCON<9>) Configuration Mismatch POR,BOR

EXTR (RCON<7>) MCLR Reset POR

SWR (RCON<6>) RESET instruction POR,BOR

WDTO (RCON<4>) WDT time-out PWRSAV instruction,

CLRWDT instruction, POR,BOR

SLEEP (RCON<3>) PWRSAV #SLEEP instruction POR,BOR

IDLE (RCON<2>) PWRSAV #IDLE instruction POR,BOR

BOR (RCON<1>) POR, BOR —

POR (RCON<0>) POR —

Note: All Reset flag bits can be set or cleared by user software.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

7.0 INTERRUPT CONTROLLER

The dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 interrupt controller reduces the

numerous peripheral interrupt request signals to a

single interrupt request signal to the

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

CPU. It has the following features:

• Up to 8 processor exceptions and software traps

• 7 user-selectable priority levels

• Interrupt Vector Table (IVT) with up to 118 vectors

• A unique vector for each interrupt or exception

source

• Fixed priority within a specified user priority le vel

• Alternate Interrupt Vector Table (AIVT) for debug

support

• Fixed interrupt entry and return latencies

7.1 Interrupt Vector Table

The Interrupt V ector Table (IVT) is shown in Figure 7-1.

The IVT resides in program memory , starting at location

000004h. The IVT contains 126 vectors consisting of

8 non maskable trap vectors plus up to 118 sources of

interrupt. In general, each interrupt source has its own

vector. Each interrupt vector contains a 24-bit-wide

address. The value programmed into each interrupt

vector location is the starting address of the associated

Interrupt Service Routine (ISR).

Interrupt vectors are prioritized in terms of their natural

priority. This priority is linked to their position in the

vector table. Lower addresses generally have a higher

natural priority. For example, the interrupt associated

with vector 0 will take priority over interrupts at any

other vector address.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices implement up to 26 unique interrupts and 4

nonmaskable traps. These are summarized in

Table 7-1 and Table 7-2.

7.1.1 ALTERNATE INTERRUPT VECTOR

TABLE

The Alternate Interrupt Vector Table (AIVT) is located

after the IVT, as shown in Figure 7-1. Access to the

AIVT is provided by the ALTIVT control bit

(INTCON2<15>). If the ALTIVT bit is set, all interrupt

and exception processes use the alternate vectors

instead of the default vectors. The alternate vectors are

organized in the same manner as the default vectors.

The AIVT supports debugging by providing a means to

switch between an application and a support

environment without requiring the interrupt vectors to

be reprogrammed. This feature also enables switching

between applications for evaluation of different

software algorithms at run time. If the AIVT is not

needed, the AIVT should be programmed with the

same addresses used in the IVT.

7.2 Reset Sequence

A device Reset is not a true exception because the

interrupt controller is not involved in the Reset process.

The dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 device clears its registers in

response to a Reset, which forces the PC to zero. The

digital signal controller then begin s program execution

at location 0x 000000. A GOTO instruction at the Reset

address can redirect program execution to the

appropriate start-up routine.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices. It is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

32. “Interrupts (Part III)” (DS70214) of

the “dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Note: Any unimplemented or unused vector

locations in the IVT and AIVT should be

programmed with the address of a default

interrupt handler routine that contains a

RESET instruction.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 7-1: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 INTERRUPT VECTOR TABLE

Reset – GOTO Instruction 0x000000

Reset – GOTO Address 0x000002

Reserved 0x000004

Oscillator Fail Trap Vector

Address Error Trap Vector

Stack Error Trap Vector

Math Error Trap Vector

Reserved

Interrupt Vector 0 0x000014

Interrupt Vector 1

Interrupt Vector 52 0x00007C

Interrupt Vector 53 0x00007E

Interrupt Vector 54 0x000080

Interrupt Vector 116 0x0000FC

Interrupt Vector 117 0x0000FE

Reserved 0x000100

Reserved 0x000102

Reserved

Oscillator Fail Trap Vector

Address Error Trap Vector

Stack Error Trap Vector

Math Error Trap Vector

Reserved

Interrupt Vector 0 0x000114

Interrupt Vector 1

Interrupt Vector 52 0x00017C

Interrupt Vector 53 0x00017E

Interrupt Vector 54 0x000180

Interrupt Vector 116

Interrupt Vector 117 0x0001FE

Start of Code 0x000200

Decreasing Natural Order Priority

Interrupt Vector Table (IVT)(1)

Alternate Interrupt Vector Table (AIVT)(1)

Note 1: See Table 7-1 for the list of implemented interrupt vectors.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 7-1: INTERRUPT VECTORS

Vector

Number

Interrupt

Request (IRQ)

Number IVT Address AIVT Address Interrupt Source

8 0 0x000014 0x000114 INT0 – External Interrupt 0

9 1 0x000016 0x000116 IC1 – Input Capture 1

10 2 0x000018 0x000118 OC1 – Output Compare 1

11 3 0x00001A 0x00011A T1 – Timer1

12 4 0x00001C 0x00011C Reserved

13 5 0x00001E 0x00011E IC2 – Input Capture 2

14 6 0x000020 0x000120 OC2 – Output Compare 2

15 7 0x000022 0x000122 T2 – T imer2

16 8 0x000024 0x000124 T3 – T imer3

17 9 0x000026 0x000126 SPI1E – SPI1 Error

18 10 0x000028 0x000128 SPI1 – SPI1 Transfer Done

19 11 0x00002A 0x00012A U1RX – UART1 Receiver

20 12 0x00002C 0x00012C U1TX – UART1 T ransmitter

21 13 0x00002E 0x00012E ADC1 – ADC1

22 14 0x000030 0x000130 Reserved

23 15 0x000032 0x000132 Reserved

24 16 0x000034 0x0 00134 SI2C1 – I2C1 Slave Events

25 17 0x000036 0x000136 MI2C1 – I2C1 Master Events

26 18 0x000038 0x000138 Reserved

27 19 0x00003A 0x00013A Change Notification Interrupt

28 20 0x00003C 0x00013C INT1 – External Interrupt 1

29 21 0x00003E 0x00013E Reserved

30 22 0x000040 0x000140 IC7 – Input Capture 7

31 23 0x000042 0x000142 IC8 – Input Capture 8

32 24 0x000044 0x000144 Reserved

33 25 0x000046 0x000146 Reserved

34 26 0x000048 0x000148 Reserved

35 27 0x00004A 0x00014A Reserved

36 28 0x00004C 0x00014C Reserved

37 29 0x00004E 0x00014E INT2 – External Interrupt 2

38 30 0x000050 0x000150 Reserved

39 31 0x000052 0x000152 Reserved

40 32 0x000054 0x000154 Reserved

41 33 0x000056 0x000156 Reserved

42 34 0x000058 0x000158 Reserved

43 35 0x00005A 0x00015A Reserved

44 36 0x00005C 0x00015C Reserved

45 37 0x00005E 0x00015E Reserved

46 38 0x000060 0x000160 Reserved

47 39 0x000062 0x000162 Reserved

48 40 0x000064 0x000164 Reserved

49 41 0x000066 0x000166 Reserved

50 42 0x000068 0x000168 Reserved

51 43 0x00006A 0x00016A Reserved

52 44 0x00006C 0x00016C Reserved

53 45 0x00006E 0x00016E Reserved

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 7-2: TRAP VECTORS

54 46 0x000070 0x000170 Reserved

55 47 0x000072 0x000172 Reserved

56 48 0x000074 0x000174 Reserved

57 49 0x000076 0x000176 Reserved

58 50 0x000078 0x000178 Reserved

59 51 0x00007A 0x00017A Reserved

60 52 0x00007C 0x00017C Reserved

61 53 0x00007E 0x00017E Reserved

62 54 0x000080 0x000180 Reserved

63 55 0x000082 0x000182 Reserved

64 56 0x000084 0x000184 Reserved

65 57 0x000086 0x000186 PWM1 – PWM1 Period Match

66 58 0x000088 0x000188 QEI – Position Counter Compare

67 59 0x00008A 0x00018A Reserved

68 60 0x00008C 0x00018C Reserved

69 61 0x00008E 0x00018E Reserved

70 62 0x000090 0x000190 Reserved

71 63 0x000092 0x000192 FLTA1 – PWM1 Fault A

72 64 0x000094 0x000194 Reserved

73 65 0x000096 0x000196 U1E – UART1 Error

74 66 0x000098 0x000198 Reserved

75 67 0x00009A 0x00019A Reserved

76 68 0x00009C 0x00019C Reserved

77 69 0x00009E 0x00019E Reserved

78 70 0x0000A0 0x0001A0 Reserved

79 71 0x0000A2 0x0001A2 Reserved

80 72 0x0000A4 0x0001A4 Reserved

81 73 0x0000A6 0x0001A6 PWM2 – PWM2 Period Match

82 74 0x0000A8 0x0001A8 FLTA2 – PWM2 Fault A

83-125 75-117 0x0000AA-0x0000FE 0x0001AA-0x0001FE Reserved

Vector Number IVT Address AIVT Address Trap Source

0 0x000004 0x000104 Reserved

1 0x000006 0x000106 Oscillator Failure

2 0x000008 0x000108 Address Error

3 0x00000A 0x000 10A Stack Error

4 0x00000C 0x00010C Math Error

5 0x00000E 0x00010E Reserved

6 0x000010 0x000110 Reserved

7 0x000012 0x000112 Reserved

TABLE 7-1: INTERRUPT VECTORS (CONTINUED)

Vector

Number

Interrupt

Request (IRQ)

Number IVT Address AIVT Address Interrupt Source

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

7.3 Interrupt Control and Status

Registers

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices implement a total of 22 registers for the

interrupt controller:

• INTCON1

• INTCON2

•IFSx

•IECx

•IPCx

•INTTREG

7.3.1 INTCON1 AND INTCON2

Global interrupt control functions are controlled from

INTCON1 and INTCON2. INTCON1 contains the

Interrupt Nesting Disable bit (NSTDIS) as well as the

control and status flags for the processor trap sources.

The INTCON2 register controls the external interrupt

request signal behavior and the use of the Alternate

Interrupt Vector Table.

7.3.2 IFSx

The IFS registers maintain all of the interrupt request

flags. Each source of interrupt has a status bit, which is

set by the respective peripherals or external signal and

is cleared via software.

7.3.3 IECx

The IEC registers maintain all of the interrupt enable

bits. These control bits are used to individually enabl e

interrupts from the peripherals or external signals.

7.3.4 IPCx

The IPC registers are used to set the interrupt priority

level for each source of interrupt. Each user interrupt

source can be assigned to one of eight priority levels.

7.3.5 INTTREG

The INTTREG register contains the associated

interrupt vector number and the new CPU interrupt

priority level, which are latched into vector number

(VECNUM<6:0>) and Interrupt level bit (ILR<3:0>)

fields in the INTTREG register. The new interrupt

priority level is the priority of the pending interrupt.

The interrupt sources are assigned to the IFSx, IECx

and IPCx registers in the same sequence that they are

listed in Table 7-1. For example, the INT0 (External

Interrupt 0) is shown as h aving vector nu mber 8 and a

natural order priority of 0. Thus, the INT0IF bit is found

in IFS0<0>, the INT0IE bit in IEC0<0>, and the INT0IP

bits in the first position of IPC0 (IPC0<2:0>).

7.3.6 STATUS/CONTROL REGISTERS

Although they are not specifically part of the interrupt

control hardware, two of the CPU Control registers

contain bits that control interrupt functionality.

• The CPU STATUS register, SR, contains the

IPL<2:0> bits (SR<7:5>). These bits indicate the

current CPU interrupt priority level. The user can

change the current CPU priority level by writing to

the IPL bits.

• The CORCON register contains the IPL3 bit

which, together with IPL<2:0>, also indicates the

current CPU priority level. IPL3 is a read-only bit

so that trap events cannot be masked by the user

software.

All Interrupt registers are described in Register 7-1

through Register 7-24 in the following pages.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0

OA OB SA SB OAB SAB DA DC

bit 15 bit 8

R/W-0(3) R/W-0(3) R/W-0(3) R-0 R/W-0 R/W-0 R/W-0 R/W-0

IPL2(2) IPL1(2) IPL0(2) RA N OV Z C

bit 7 bit 0

Legend:

C = Clear only bit R = Readable bit U = Unimplemented bit, read as ‘0’

S = Set only bit W = Writable bi t -n = Value at POR

‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2)

111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled

110 = CPU Interrupt Priority Level is 6 (14)

101 = CPU Interrupt Priority Level is 5 (13)

100 = CPU Interrupt Priority Level is 4 (12)

011 = CPU Interrupt Priority Level is 3 (11)

010 = CPU Interrupt Priority Level is 2 (10)

001 = CPU Interrupt Priority Level is 1 (9)

000 = CPU Interrupt Priority Level is 0 (8)

Note 1: For complete register details, see Register 3-1: “SR: CPU STATUS Register”.

2: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority

Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when

IPL<3> = 1.

3: The IPL<2:0> Status bits are read-only when NSTDIS (INTCON1<15>) = 1.

U-0 U-0 U-0 R/W-0 R/W-0 R-0 R-0 R-0

— — —USEDT DL<2:0>

bit 15 bit 8

R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R/W-0 R/W-0 R/W-0

SATA SATB SATDW ACCSAT IPL3(2) PSV RND IF

bit 7 bit 0

Legend: C = Clear only bit

R = Readable bit W = Writable bit -n = Value at POR ‘1’ = Bit is set

0’ = Bit is cleared ‘x = Bit is unknown U = Unimp lemented bit, read as ‘0’

bit 3 IPL3: CPU Interrupt Priority Level Status bit 3(2)

1 = CPU interrupt priority level is greater than 7

0 = CPU interrupt priority level is 7 or less

Note 1: For complete register details, see Register 3-2: “CORCON: CORE Control Register”.

2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE

bit 15 bit 8

R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0

SFTACERR DIV0ERR — MATHERR ADDRERR STKERR OSCFAIL —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 NSTDIS: Interrupt Nesting Disable bit

1 = Interrupt nesting is disab led

0 = Interrupt nesting is ena bled

bit 14 OVAERR: Accumulator A Overflow Trap Flag bit

1 = Trap was caused by overflow of Accumulator A

0 = Trap was not caused by overflow of Accumulator A

bit 13 OVBERR: Accumulator B Overflow Trap Flag bit

1 = Trap was caused by overflow of Accumulator B

0 = Trap was not caused by overflow of Accumulator B

bit 12 COVAERR: Accumulator A Catastrophic Overflow Trap Flag bit

1 = Trap was caused by catastrophic overflow of Accumulator A

0 = Trap was not caused by catastrophic overflow of Accumulator A

bit 11 COVBERR: Accumulator B Catastrophic Overflow Trap Flag bit

1 = Trap was caused by catastrophic overflow of Accumulator B

0 = Trap was not caused by catastrophic overflow of Accumulator B

bit 10 OVATE: Accumulator A Overflow Trap Enable bit

1 = Trap overflow of Accumulator A

0 = Trap disabled

bit 9 OVBTE: Accumulator B Overflow Trap Enable bit

1 = Trap overflow of Accumulator B

0 = Trap disabled

bit 8 COVTE: Catastrophic Overflow Trap Enable bit

1 = Trap on catastrophic overflow of Accumulator A or B enabled

0 = Trap disabled

bit 7 SFTACERR: Shift Accumulator Error Status bit

1 = Math error trap was caused by an invalid accumulator shift

0 = Math error trap was not caused by an invalid accumulator shift

bit 6 DIV0ERR: Arithmetic Error Status bit

1 = Math error trap was caused by a divi d e by ze ro

0 = Math error trap was not caused by a divide by zero

bit 5 Unimplemented: Read as ‘0’

bit 4 MATHERR: Arithmetic Error Status bit

1 = Math error trap has occurred

0 = Math error trap has not occurred

bit 3 ADDRERR: Address Error Trap Status bit

1 = Address error trap has occurred

0 = Address error trap has not occurred

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 2 STKERR: Stack Error Trap Status bit

1 = Stack error trap has occurred

0 = Stack error trap has not occurred

bit 1 OSCFAIL: Oscillator Failure Trap St atus bit

1 = Oscillator failure trap has occurred

0 = Oscillator failure trap has not occurred

bit 0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0

ALTIVT DISI — — — — — —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — INT2EP INT1EP INT0EP

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ALTIVT: Enable Alternate Interrupt Vector Table bit

1 = Use alternate vector table

0 = Use standard (default) vector table

bit 14 DISI: DISI Instruction Status bit

1 = DISI instruction is active

0 = DISI instruction is not active

bit 13-3 Unimplemented: Read as ‘0’

bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit

1 = Interrupt on negative edge

0 = Interrupt on positive edge

bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit

1 = Interrupt on negative edge

0 = Interrupt on positive edge

bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit

1 = Interrupt on negative edge

0 = Interrupt on positive edge

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— AD1IF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF

bit 15 bit 8

R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

T2IF OC2IF IC2IF — T1IF OC1IF IC1IF INT0IF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 12 U1TXIF: UART1 Transmitter Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 11 U1RXIF: UART1 Receiver Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 10 SPI1IF: SPI1 Event Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 9 SPI1EIF: SPI1 Fault Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 8 T3IF: Timer3 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 7 T2IF: Timer2 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 6 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 5 IC2IF: Input Capture Channel 2 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 4 Unimplemented: Read as ‘0’

bit 3 T1IF: Timer1 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 0 INT0IF: External Interrupt 0 Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

——INT2IF— — — — —

bit 15 bit 8

R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

IC8IF IC7IF — INT1IF CNIF —MI2C1IFSI2C1IF

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 INT2IF: External Interrupt 2 Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 12-8 Unimplemented: Read as ‘0’

bit 7 IC8IF: Input Capture Channel 8 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 6 IC7IF: Input Capture Channel 7 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 5 Unimplemented: Read as ‘0’

bit 4 INT1IF: External Interrupt 1 Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 3 CNIF: Input Change Notification Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 2 Unimplemented: Read as ‘0’

bit 1 MI2C1IF: I2C1 Master Events Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 0 SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 U-0

FLTA1IF — — — — QEIIF PWM1IF —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 FLTA1IF: PWM1 Fault A Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 14-11 Unimplemented: Read as ‘0’

bit 10 QEIIF: QEI Event Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 9 PWM1IF: PWM1 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 8-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 U-0

— — — — — FLTA2IF PWM2IF —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0

— — — — — —U1EIF—

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-11 Unimplemented: Read as ‘0’

bit 10 FLTA2IF: PWM2 Fault A Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 9 PWM2IF: PWM2 Error Interrupt Enable bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 8-2 Unimplemented: Read as ‘0’

bit 1 U1EIF: UART1 Interrupt Flag Status bit

1 = Interrupt request has occurred

0 = Interrupt request has not occurred

bit 0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— AD1IE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE

bit 15 bit 8

R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

T2IE OC2IE IC2IE — T1IE OC1IE IC1IE INT0IE

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 AD1IE: ADC1 Conversion Complete Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 12 U1TXIE: UART1 Transmitter Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 11 U1RXIE: UART1 Receiver Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 10 SPI1IE: SPI1 Event Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 9 SPI1EIE: SPI1 Event Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 8 T3IE: Timer3 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 7 T2IE: Timer2 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 6 OC2IE: Output Compare Channel 2 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 5 IC2IE: Input Capture Channel 2 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 4 Unimplemented: Read as ‘0’

bit 3 T1IE: Timer1 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 0 INT0IE: External Interrupt 0 Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

——INT2IE— — — — —

bit 15 bit 8

R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

IC8IE IC7IE — INT1IE CNIE —MI2C1IESI2C1IE

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 INT2IE: External Interrupt 2 Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 12-8 Unimplemented: Read as ‘0’

bit 7 IC8IE: Input Capture Channel 8 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 6 IC7IE: Input Capture Channel 7 Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 5 Unimplemented: Read as ‘0’

bit 4 INT1IE: External Interrupt 1 Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 3 CNIE: Input Change Notification Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 2 Unimplemented: Read as ‘0’

bit 1 MI2C1IE: I2C1 Master Events Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 0 SI2C1IE: I2C1 Slave Events Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 U-0

FLTA1IE — — — — QEIIE PWM1IE —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 FLTA1IE: PWM1 Fault A Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 14-11 Unimplemented: Read as ‘0’

bit 10 QEIIE: QEI Event Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 9 PWM1IE: PWM1 Error Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 8-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 U-0

— — — — — FLA2IE PWM2IE —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0

— — — — — —U1EIE—

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-11 Unimplemented: Read as ‘0’

bit 10 FLA2IE: PWM2 Fault A Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 9 PWM2IE: PWM2 Error Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 8-2 Unimplemented: Read as ‘0’

bit 1 U1EIE: UART1 Error Interrupt Enable bit

1 = Interrupt request enabled

0 = Interrupt request not enabled

bit 0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— T1IP<2:0> —OC1IP<2:0>

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

—IC1IP<2:0>— INT0IP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11 Unimplemented: Read as ‘0’

bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7 Unimplemented: Read as ‘0’

bit 6-4 IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3 Unimplemented: Read as ‘0’

bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— T2IP<2:0> —OC2IP<2:0>

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

—IC2IP<2:0>— — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 T2IP<2:0>: Timer2 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11 Unimplemented: Read as ‘0’

bit 10-8 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7 Unimplemented: Read as ‘0’

bit 6-4 IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— U1RXIP<2:0> — SPI1IP<2:0>

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— SPI1EIP<2:0> — T3IP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11 Unimplemented: Read as ‘0’

bit 10-8 SPI1IP<2:0>: SPI1 Event Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7 Unimplemented: Read as ‘0’

bit 6-4 SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3 Unimplemented: Read as ‘0’

bit 2-0 T3IP<2:0>: Timer3 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

—AD1IP<2:0>— U1TXIP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-7 Unimplemented: Read as ‘0’

bit 6-4 AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3 Unimplemented: Read as ‘0’

bit 2-0 U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

— CNIP<2:0> — — — —

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

— MI2C1IP<2:0> — SI2C1IP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 CNIP<2:0>: Change Notification Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11-7 Unimplemented: Read as ‘0’

bit 6-4 MI2C1IP<2:0>: I2 C1 Master Events Interrupt Priori ty bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3 Unimplemented: Read as ‘0’

bit 2-0 SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0

—IC8IP<2:0>— IC7IP<2:0>

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0

— — — — — INT1IP<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11 Unimplemented: Read as ‘0’

bit 10-8 IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7-3 Unimplemented: Read as ‘0’

bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

— INT2IP<2:0> — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-7 Unimplemented: Read as ‘0’

bit 6-4 INT2IP<2:0>: External Interrupt 2 Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0

— — — — —QEIIP<2:0>

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

— PWM1IP<2:0> — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-12 Unimplemented: Read as ‘0’

bit 10-8 QEIIP<2:0>: QEI Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7 Unimplemented: Read as ‘0’

bit 6-4 PWM1IP<2:0>: PWM1 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

—FLTA1IP<2:0>— — — —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 FLTA1IP<2:0>: PWM1 Fault A Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 11-0 Unimplemented: Read as ‘0’

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

—U1EIP<2:0>— — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-7 Unimplemented: Read as ‘0’

bit 6-4 U1EIP<2:0>: UART1 Error Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — FLTA2IP<2:0>

bit 15 bit 8

U-0 R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0

— PWM2IP<2:0> — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-11 Unimplemented: Read as ‘0’

bit 8-10 FLTA2IP<2:0>: PWM2 Fault A Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 7 Unimplemented: Read as ‘0’

bit 6-4 PWM2IP<2:0>: PWM2 Interrupt Priority bits

111 = Interrupt is priority 7 (highest priority interrupt)

•

001 = Interrupt is priority 1

000 = Interrupt source is disabled

bit 3-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0

— — — —ILR<3:0>

bit 15 bit 8

U-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0

— VECNUM<6:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-12 Unimplemented: Read as ‘0’

bit 11-8 ILR<3:0>: New CPU Interrupt Priority Level bits

1111 = CPU Interrupt Priority Level is 15

•

0001 = CPU Interrupt Priority Level is 1

0000 = CPU Interrupt Priority Level is 0

bit 7 Unimplemented: Read as ‘0’

bit 6-0 VECNUM<6:0>: Vector Number of Pending Interrupt bits

0111111 = Interrupt Vector pending is number 135

•

0000001 = Interrupt Vector pending is number 9

0000000 = Interrupt Vector pending is number 8

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

7.4 Interrupt Setup Procedures

7.4.1 INITIALIZATION

To configure an interrupt source at initialization:

1. Set the NSTDIS bit (INTCON1<15>) if nested

interrupts are not desired.

2. Select the user-assigned priority level for the

interrupt source by writing the control bits in th e

appropriate IPCx register. The priority level will

depend on the specific application and type of

interrupt source. If multiple priority levels are not

desired, the IPCx register control bits for all

enabled interrupt sources can be programmed

to the same non-zero value.

3. Clear the interrupt flag status bit associated with

the peripheral in the asso ciated IFSx register.

4. Enable the interrupt source by setting the

interrupt enable control bit associated with the

source in the appropriate IECx register.

7.4.2 INTERRUPT SERVICE ROUTINE

The method used to decla re an Inte rrupt Service Ro u-

tine (ISR) and in itialize the IVT with the correct vector

address depends on the programming languag e (C or

assembler) and the language development tool suite

used to develop the application.

In general, the user application must clear the interrupt

flag in the appropriate IFSx register for the source of

interrupt that the ISR handles. Otherwise, program will

re-enter the ISR immediately after exiting the routine. If

the ISR is coded in assembly language, it must be

terminated using a RETFIE instruction to unstack the

saved PC value, SRL value and old CPU priority level.

7.4.3 TRAP SERVICE ROUTINE

A Trap Service Routine (TSR) is coded like an ISR,

except that the appropriate trap status flag in the

INTCON1 register must be cleared to avoid re-entry

into the TSR.

7.4.4 INTERRUPT DISABLE

All user interrupts can be disabled using this

procedure:

1. Push the current SR value onto the software

stack using the PUSH instruction.

2. Force the CPU to priority level 7 by inclusive

ORing the value OEh with SRL.

To enable user interrupts, the POP instruction can be

used to restore the previous SR value.

The DISI instruction provides a convenient way to

disable interrupts of priority levels 1-6 for a fixed period

of time. Level 7 interrupt sources are not disabled by

the DISI instruction.

Note: At a device Reset, the IPCx registers are

initialized such that all user interrupt

sources are assigned to priority level 4. Note: Only user interrupts with a priority level of

7 or lower can be disab led. Trap sources

(level 8-level 15) cannot be disabled.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

8.0 OSCILLATOR

CONFIGURATION The oscillator system for dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices provides:

• External and internal osci llator options as clock

sources.

• An on-chip Phase-Locked Loop (PLL) to scale the

internal operating fre quency to the required

system clock frequency.

• An internal FRC oscillator that can also be used

with the PLL, thereby allowing full-spee d

operation without any external clock generation

hardware.

• Clock switching between various clock sources.

• Programmable clock postscaler for system power

savings.

• A Fail-Safe Clock Monitor (FSCM) that detects

clock failure and takes fail-safe measures.

• A Clock Control register (OSCCON).

• Nonvolatile Configuration bits for main oscillator

selection.

A simplified diagram of th e oscillator system is shown

in Figure 8-1.

FIGURE 8-1: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 OSCILLATOR SYSTEM DIAGRAM

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices. It is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

7. “Oscillator” (DS70186) of the

dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site

(www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Note 1: See Figure 8-2 for PLL details.

2: If the Oscillator is used with XT or HS modes, an external parallel resistor with the value of 1 MΩmust be connected.

3: The term FP refers to the clock source for all of the peripherals, while FCY refers to the clock source for the CPU.

Throughout this document, FCY and FP are used interchangeably, except in the case of DOZE mode. FP and FCY will

be different when DOZE mode is used with any ratio other than 1 : 1 which is the default.

Secondary Oscillator (SOSC)

LPOSCEN

SOSCO

Timer 1

XTPLL, HSPLL,

XT, HS, EC

FRCDIV<2:0>

WDT, PWRT,

FSCM

FRCDIVN

SOSC

FRCDIV16

ECPLL, FRCPLL

NOSC<2:0> FNOSC<2:0>

Reset

FRC

Oscillator

LPRC

Oscillator

DOZE<2:0>

S1/S3

FRC

LPRC

÷16

Clock Switch

Clock Fail

÷2

TUN<5:0>

PLL(1) FCY(3)

FOSC

FRCDIV

DOZE

OSC2

OSC1 Primary Oscillator (POSC)

R(2)

POSCMD<1:0>

FP(3)

SOSCI

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

8.1 CPU Clocking System

The dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices provide seven system

clock options:

• Fast RC (FRC) Oscillator

• FRC Oscillator with PLL

• Primary (XT, HS or EC) Oscillator

• Primary Oscillator with PLL

• Secondary (LP) Oscillator

• Low-Power RC (LPRC) Oscillator

• FRC Oscillator with postscaler

8.1.1 SYSTEM CLOCK SOURCES

8.1.1.1 Fast RC

The Fast RC (FRC) internal oscillator runs at a nominal

frequency of 7.37 MHz. User software can tune the

FRC frequency. User software can optio nal ly specify a

factor (ranging from 1:2 to 1:256) by which the FRC

clock frequency is divided. This factor is selected using

the FRCDIV<2:0> bits (CLKDIV<10:8>).

8.1.1.2 Primary

The primary oscillator can u se one of the following as

its clock source:

• XT (Crystal): Crystals and ceramic resonators in

the range of 3 MHz to 10 MHz. The crystal is

connected to the OSC1 and OSC2 pins.

• HS (High-Speed Crystal): Crystals in the range of

10 MHz to 40 MHz. The crystal is connected to

the OSC1 and OSC2 pins.

• EC (External Clock): The external clock signal is

directly applied to the OSC1 pin.

8.1.1.3 Secondary

The secondary (LP) oscillator is designed for low power

and uses a 32.768 kHz crystal or ceramic resonator.

The LP oscillator uses the SOSCI and SOSCO pins.

8.1.1.4 Low-Power RC

The LPRC (Low-Power RC) internal oscIllator runs at a

nominal frequency of 32.76 8 kHz. It is also used as a

reference clock by the Watchdog Timer (WDT) and

Fail-Safe Clock Monitor (FSCM).

8.1.1.5 FRC

The clock signals generated by the FRC and primary

oscillators can be optionally applied to an on-chip

Phase Locked Loop (PLL) to provide a wide range of

output frequencies for device operation. PLL

configuration is described in Section 8.1.3 “PLL

Configuration”.

The FRC frequency depends on the FRC accuracy

(see Table 24-18) and the value of the FRC Oscillator

Tuning register (see Register 8-4).

8.1.2 SYSTEM CLOCK SELECTION

The oscillator source used at a device Power-on

Reset event is selected using Configuration bit

settings. The oscillator Configuration bit settings are

located in the Configuration registers in the program

memory. (Refer to Section 21.1 “Configuration

Bits” for further details.) The Initial Oscillator

Selection Configuration bits, FNOSC<2:0>

(FOSCSEL<2:0>), and the Primary Oscillator Mode

Select Configuration bits, POSCMD<1:0>

(FOSC<1:0>), select the oscillato r source that is used

at a Power-on Reset. The FRC primary oscillator is

the default (unprogrammed) selection.

The Configuration bits allow users to choose among 12

different clock modes, shown in Table 8-1.

The output of the oscilla tor (or the output of the PLL if

a PLL mode has been selected) FOSC is divided by 2 to

generate the device instruction clock (FCY) and the

peripheral clock time base (FP). FCY defines the

operating speed of the device, and speeds up to 40

MHz are supported by the dsPIC33FJ32MC202/204

and dsPIC33FJ16MC304 architecture.

Instruction execution speed or device operating

frequency, FCY, is given by:

EQUATION 8-1: DEVICE OPERATING

FREQUENCY

8.1.3 PLL CONFIGURATION

The primary oscillator and internal FRC oscillator can

optionally use an on-chip PLL to obtain higher speeds

of operation. The PLL provides significant flexibility in

selecting the device op erating spee d. A bl ock di agram

of the PLL is shown in Figure 8-2.

The output of the primary oscillator or FRC, denoted as

‘FIN’, is divided down by a prescale factor (N1) of 2, 3,

... or 33 before being provided to the PLL’s Voltage

Controlled Oscillator (VCO). The input to the VCO must

be selected in the range of 0.8 MHz to 8 MHz. The

prescale factor ‘N1’ is selected using the

PLLPRE<4:0> bit s (CL KD IV<4:0>).

The PLL Feedback Divisor, selected using the

PLLDIV<8:0> bits (PLLFBD<8:0>), provides a factor ‘M’,

by which the input to the VCO is multiplied. This factor

must be selected such that the resulting VCO output

frequency is in the range of 100 MHz to 200 MHz.

The VCO output is further divided by a postscale factor

‘N2.’ This factor is sel ected using the PLLPOST<1:0>

bits (CLKDIV<7:6>). ‘N2’ can be either 2, 4 or 8, and

must be selected such that the PLL output frequency

(FOSC) is in the range of 12.5 MHz to 80 MHz, which

generates device operating speeds of 6.25-40 MIPS.

FCY FOSC

-------------=

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

For a primary oscillator or FRC oscillator, output ‘ FIN’,

the PLL output ‘FOSC’ is given by:

EQUATION 8-2: FOSC CALCULATION

For example, suppose a 10 MHz crystal is being used

with the selected oscillator mode of XT with PLL.

• If PLLPRE<4:0> = 0, then N1 = 2. This yields a

VCO input of 10/2 = 5 MHz, which is within the

acceptable range of 0.8-8 MHz.

• If PLLDIV<8:0> = 0x1E, then

M = 32. This yields a VCO output of 5 x 32 = 160

MHz, which is within the 100-200 MHz range d

needed.

• If PLLPOST<1:0> = 0, then N2 = 2. This provides

a Fosc of 160/2 = 80 MHz. The resultant device

operating speed is 80/2 = 40 MIPS.

EQUATION 8-3: XT WITH PLL MODE

EXAMPLE

FIGURE 8-2: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 PLL BLOCK DIAGRAM

TABLE 8-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION

FOSC FIN M

N1N2⋅

----------------------

⎝⎠

⎛⎞

⋅=

FCY FOSC

------------- 1

---10000000 32⋅

22⋅

-------------------------------------

⎝⎠

⎛⎞

40 MIPS=⋅==

Oscillator Mode Oscillator Source POSCMD<1:0> FNOSC<2:0> See Note

Fast RC Oscillator with Divide-by-N

(FRCDIVN) Internal xx 111 1, 2

Fast RC Oscillator with Divide-by-16

(FRCDIV16) Internal xx 110 1

Low-Power RC Oscillator (LPRC) Internal xx 101 1

Secondary (T imer1) Oscillator (SOSC) Secondary xx 100 1

Primary Oscillator (HS) with PLL

(HSPLL) Primary 10 011 —

Primary Oscillator (XT) with PLL

(XTPLL) Primary 01 011 —

Primary Oscillator (EC) with PLL

(ECPLL) Primary 00 011 1

Primary Oscillator (HS) Primary 10 010 —

Primary Oscillator (XT) Primary 01 010 —

Primary Oscillator (EC) Primary 00 010 1

Fast RC Oscillator with PLL (FRCPLL) Internal xx 001 1

Fast RC Oscillator (FRC) Internal xx 000 1

Note 1: OSC2 pin function is determined by th e OSCIOFNC Configuration bit.

2: This is the default oscillator mode for an unprogrammed (erase d) device.

0.8-8.0 MH z

Here(1) 100-200 MHz

Here(1)

Divide by

2, 4, 8

Divide by

2-513

Divide by

2-33

Source (Crystal, External Clock PLLPRE XVCO

PLLDIV

PLLPOST

or Internal RC)

12.5-80 MHz

Here(1)

FOSC

Note 1: This frequency range must be satisfied at all times.

FVCO

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 R-0 R-0 R-0 U-0 R/W-y R/W-y R/W-y

— COSC<2:0> — NOSC<2:0>(2)

bit 15 bit 8

R/W-0 R/W-0 R-0 U-0 R/C-0 U-0 R/W-0 R/W-0

CLKLOCK IOLOCK LOCK —CF — LPOSCEN OSWEN

bit 7 bit 0

Legend: y = Value set from Configuration bits on POR

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-12 COSC<2:0>: Current Oscillator Selection bits (read-only)

111 = Fast RC oscillator (FRC) with Divide-by-n

110 = Fast RC oscillator (FRC) with Divide-by-16

101 = Low-Power RC oscillator (LPRC)

100 = Secondary oscillator (SOSC)

011 = Primary oscillator (XT, HS, EC) with PLL

010 = Primary oscillator (XT, HS, EC)

001 = Fast RC oscillator (FRC) with PLL

000 = Fast RC oscillator (FRC)

bit 11 Unimplemented: Read as ‘0’

bit 10-8 NOSC<2:0>: New Oscillator Selection bits(2)

111 = Fast RC oscillator (FRC) with Divide-by-n

110 = Fast RC oscillator (FRC) with Divide-by-16

101 = Low-Power RC oscillator (LPRC)

100 = Secondary oscillator (SOSC)

011 = Primary oscillator (XT, HS, EC) with PLL

010 = Primary oscillator (XT, HS, EC)

001 = Fast RC oscillator (FRC) with PLL

000 = Fast RC oscillator (FRC)

bit 7 CLKLOCK: Clock Lock Enable bit

If clock switching is enabled and FSCM is disabled, (FOSC<FCKSM> = 0b01)

1 = Clock switching is disabled, system clock source is locked

0 = Clock switching is enabled, system clock source can be modified by clock switching

bit 6 IOLOCK: Peripheral Pin Select Lock bit

1 = Peripherial pin select is locke d, write to peripheral pin select re gisters not allowed

0 = Peripherial pin select is not locked , write to peripheral pin select registers allowed

bit 5 LOCK: PLL Lock Status bit (read-onl y)

1 = Indicates that PLL is in lock, or PLL start-up timer is satisfied

0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled

bit 4 Unimplemented: Read as ‘0’

Note 1: Writes to this register require an unlock sequence . Refer to Section 7. “Oscillator” (DS70186) in the

“dsPIC33F/PIC24H Family Reference Manual” for details.

2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.

This applies to clock switches in either direction. In these instances, the appl ication must switch to FRC

mode as a transition clock source between the two PLL modes.

3: This register is reset only on a Power-on Reset (POR).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 3 CF: Clock Fail Detect bit (read/clear by application)

1 = FSCM has detected clock failure

0 = FSCM has not detected clock failure

bit 2 Unimplemented: Read as ‘0’

bit 1 LPOSCEN: Secondary (LP) Oscillator Enable bit

1 = Enable secondary oscill ator

0 = Disable seconda ry oscillator

bit 0 OSWEN: Oscillator Switch Enable bit

1 = Request oscillator switch to selection specified by NOSC<2:0> bits

0 = Oscillator switch is complete

Note 1: Writes to this register require an unlock sequence . Refer to Section 7. “Oscillator” (DS70 186) in the

“dsPIC33F/PIC24H Family Reference Manual” for details.

2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.

This applies to clock switches in eith er direction. In these instances, the application must switch to FRC

mode as a transition clock source between the two PLL modes.

3: This register is reset only on a Power-on Reset (POR).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0

ROI DOZE<2:0> DOZEN(1) FRCDIV<2:0>

bit 15 bit 8

R/W-0 R/W-1 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PLLPOST<1:0> — PLLPRE<4:0>

bit 7 bit 0

Legend: y = Value set from Configuration bits on POR

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ROI: Recover on Interrupt bit

1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1

0 = Interrupts have no effect on the DOZEN bit

bit 14-12 DOZE<2:0>: Processor Clock Reduction Select bits

111 = FCY/128

110 = FCY/64

101 = FCY/32

100 = FCY/16

011 = FCY/8 (default)

010 = FCY/4

001 = FCY/2

000 = FCY/1

bit 11 DOZEN: DOZE Mode Enable bit(1)

1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks

0 = Processor clock/peripheral clock ratio forced to 1:1

bit 10-8 FRCDIV<2:0>: Inte rnal Fast RC Oscillator Postscaler bits

111 = FRC divide by 256

110 = FRC divide by 64

101 = FRC divide by 32

100 = FRC divide by 16

011 = FRC divide by 8

010 = FRC divide by 4

001 = FRC divide by 2

000 = FRC divide by 1 (default)

bit 7-6 PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as ‘N2’, PLL postscaler)

11 = Output/8

10 = Reserved

01 = Output/4 (default)

00 = Output/2

bit 5 Unimplemented: Read as ‘0’

bit 4-0 PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as ‘N1’, PLL prescaler)

00000 = Input/2 (def a ul t)

00001 = Input/3

•

11111 = Input/33

Note 1: This bit is cle are d wh en t h e RO I bi t is set and an interrupt oc curs.

2: This register is reset only on a Power-on Reset (POR).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0

— — — — — — —PLLDIV<8>

bit 15 bit 8

R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0

PLLDIV<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-9 Unimplemented: Read as ‘0’

bit 8-0 PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as ‘M’, PLL multip lier)

000000000 = 2

000000001 = 3

000000010 = 4

•

000110000 = 50 (default)

•

111111111 = 513

Note 1: This register is reset only on a Power-on Reset (POR).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— TUN<5:0>(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-6 Unimplemented: Read as ‘0’

bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits(1)

011111 = Center frequency + 11.625% (8.23 MHz)

011110 = Center frequency + 11.25% (8.20 MHz)

•

000001 = Center frequency + 0.375% (7.40 MHz)

000000 = Center frequency (7.37 MHz nominal)

111111 = Center frequency -0.375% (7.345 MHz)

•

100001 = Center frequency -11.625% (6.52 MHz)

100000 = Center frequency -12% (6.49 MHz)

Note 1: OSCTUN functionality has been provided to help customers compensate for temperature effects on the

FRC frequency over a wide range of temperatures. The tuning step size is an approximation and is neither

characterized nor tested.

2: This register is reset only on a Power-on Reset (POR).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

8.2 Clock Switching Operation

Applications are free to switch among any of the four

clock sources (Primary, LP, FRC and LPRC) under

software control at any time. To limit the possible sid e

effects of this flexibility, dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices have a safeguard lock

built into the switch process.

8.2.1 ENABLING CLOCK SWITCHING

To enable clock switching, th e FCKSM1 Configuration

bit in the Configuration register must be programmed to

‘0’. (Refer to Section 21.1 “Configuration Bits” for

further details.) If the FCKSM1 Configuration bit is

unprogrammed (‘1’), the clock switching function and

Fail-Safe Clock Monitor function are disabled. This is

the default setting.

The NOSC control bits (OSCCON<10:8>) do not

control the clock selection when clock switching is

disabled. However, the COSC bits (OSCCON<14:12>)

reflect the clock source selected by the FNOSC

Configuration bits.

The OSWEN control bit (OSCCON<0>) has no effect

when clock switching is disa bled. It is held at ‘0’ at all

times.

8.2.2 OSCILLATOR SWITCHING

SEQUENCE

Performing a clock switch requires this basic

sequence:

1. If desired, read the COSC bits

(OSCCON<14:12>) to determine the current

oscillator source.

2. Perform the unlock seque nce to allow a write to

the OSCCON register high byte.

3. Write the appropriate value to the NOSC control

bits (OSCCON<10:8>) for the new oscillator

source.

4. Perform the unlock seque nce to allow a write to

the OSCCON register low byte.

5. Set the OSWEN bit (OSCCON<0>) to initiate

the oscillator switch.

Once the basic sequence is completed, the system

clock hardware responds automatically as follows:

1. The clock switching hardware compares the

COSC status bits with the new value of the

NOSC control bits. If they are the same, the

clock switch is a redundant operation. In this

case, the OSWEN bit is cleared automatically

and the clock switch is aborted.

2. If a valid clock switch has been initiated, the

LOCK (OSCCON<5>) and the CF

(OSCCON<3>) status bits are cleared.

3. The new oscillator is turned on by the hardware

if it is not currently running. If a crystal oscillator

must be turned on, th e hardware waits until the

Oscillator Start-up Timer (OST) expires. If the

new source is using the PLL, the hardware waits

until a PLL lock is detected (LOCK = 1).

4. The hardware waits for 10 clock cycles from the

new clock source and then performs the clock

switch.

5. The hardware clears the OSWEN bit to indicate a

successful clock transition. In addition, the NOSC

bit values are transferred to the COSC status bits.

6. The old clock source is turned off at this time,

with the exception of LPRC (if WDT or FSCM

are enabled) or LP (if LPOSCEN remains set).

8.3 Fail-Safe Clock Monitor (FSCM)

The Fail-Safe Clock Monitor (FSCM) allows the device

to continue to operate even in the event of an oscillator

failure. The FSCM function is enabled by programming.

If the FSCM function is enabled, the LPRC internal

oscillator runs at all times (except during Sleep mode)

and is not subject to control by the Watchdog Timer.

In the event of an oscillator failure, the FSCM

generates a clock failure trap event and switches the

system clock over to the FRC oscillator. Then the

application program can either attempt to restart the

oscillator or execute a controlled shutdown. The trap

can be treated a s a warm Reset by simply loading the

Reset address into the oscillator fail trap vector.

If the PLL multiplier is used to scale the system clock,

the internal FRC is also multiplied by the same factor

on clock failure. Essentially, the device switches to

FRC with PLL on a clock failure.

Note: Primary Oscillator mode has three different

submodes (XT, HS and EC), which are

determined by the POSCMD<1:0>

Configuration bits. While an application

can switch to and from Primary Oscillator

mode in software, it cannot switch among

the different primary submodes without

reprogramming the device.

Note 1: The processor continues to execute code

throughout the clock switching sequence.

Timing-sensitive code should not be

executed during this time.

2: Direct clock switches between any pri-

mary oscillator mode with PLL and

FRCPLL mode are not permitted. This

applies to clock switches in either direc-

tion. In these instances, the application

must switch to FRC mode as a transition

clock source between the two PLL modes.

3: Refer to Section 7. “Oscillator”

(DS70186) in the “dsPIC33F/PIC24H

Family Reference Manual” for details.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

9.0 POWER-SAVING FEATURES

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

devices provide the ability to manage power consumption

by selectively managing clocking to the CPU and the

peripherals. In general, a lower clock frequency and a

reduction in the number of circuits being clocked

constitutes lower consumed power.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices can manage power consumption in four different

ways:

• Clock frequency

• Instruction-based Sleep and Idle modes

• Software-controlled Doze mode

• Selective peripheral control in software

Combinations of these methods can be used to selec-

tively tailor an application’s power consumption while

still maintaining critical application features, such as

timing-sensitive communications.

9.1 Clock Frequency and Clock

Switching

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices allow a wide range of clock frequencies to be

selected under application control. If the system clock

configuration is not locked, users can choose

low-power or high-precision oscillators by simply

changing the NOSC bits (OSCCON<10:8>). The

process of changing a system clock during operation,

as well as limitations to the process, are discussed in

more detail in Section 8.0 “Oscillator

Configuration”.

9.2 Instruction-Based Power-Saving

Modes

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices have two special power-saving modes that are

entered through the execution of a special PWRSAV

instruction. Sleep mode stops clock operation and halts

all code execution. Idle mode halts the CPU and code

execution, but allows peripheral modules to continue

operation. The assembler syntax of the PWRSAV

instruction is shown in Example 9-1.

Sleep and Idle modes can be exited as a result of an

enabled interrupt, WDT time-out or a device Reset. When

the device exits these mo des, it is said to w ake-up.

9.2.1 SLEEP MODE

The following occur in Sleep mode:

• The system clock source is shut down. If an

on-chip oscillator is used, it is turned off.

• The device current consumption is reduce d to a

minimum, provided that no I/O pin is sourcing

current.

• The Fail-Safe Clock Monitor does not operate,

since the system clock source is disabled.

• The LPRC clock continues to run in Sleep mode if

the WDT is enabled.

• The WDT, if enabled, is automatically cleared

prior to entering Sleep mode.

• Some device features or peripherals may continue

to operate. This includes items such as the input

change notification on the I/O ports, or peripherals

that use an external clock input.

• Any peripheral that requires the system clock

source for its operation is disabled.

The device will wake-up from Sleep mode on any of the

these events:

• Any interrupt source that is individually enabled

• Any form of device Reset

• A WDT time-out

On wake-up from Sleep mode, the processor restarts

with the same clock source that was active when Sleep

mode was entered.

EXAMPLE 9-1: PWRSAV INSTRUCTION SYNTAX

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices. It is not

intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 9. “Watchdog Timer and

Power-Saving Modes” (DS70196) the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Note: SLEEP_MODE and IDLE_MODE are con-

stants defined in the assembler include

file for the selected device.

PWRSAV #SLEEP_MODE ; Put the device into SLEEP mode

PWRSAV #IDLE_MODE ; Put the device into IDLE mode

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

9.2.2 IDLE MODE

The following occur in Idle mode:

• The CPU stops executing instructions.

• The WDT is automatically cleared.

• The system clock source remains active. By

default, all peripheral modules continue to operate

normally from the system clock source, but can

also be selectively disabled (see Section 9.4

“Peripheral Module Disable”).

• If the WDT or FSCM is enabled, the LPRC also

remains active.

The device will wake from Idle mode on any of these

events:

• Any interrupt that is individually enabled

• Any device Reset

• A WDT time-out

On wake-up from Idle mode, the clock is reapplied to

the CPU and instruction execution will begin (2-4

cycles later), starting with the instruction following the

PWRSAV instruction, or the first instruction in the ISR.

9.2.3 INTERRUPTS COINCIDENT WITH

POWER SAVE INSTRUCTIONS

Any interrupt that coincides with the execution of a

PWRSAV instruction is held off until entry into Sleep or

Idle mode has completed. The device then wakes up

from Sleep or Idle mode.

9.3 Doze Mode

The preferred strategies for reducing power

consumption are changing clock speed and invoking

one of the power-saving modes. In some

circumstances, this may not be practical. For example,

it may be necessary for an application to maintain

uninterrupted synchronous communication, even while

it is doing nothing else. Reducing system clock spee d

can introduce communication errors, while using a

power-saving mode can stop communications

completely.

Doze mode is a simple and effective alternative method

to reduce power consumption while the device is still

executing code. In this mode, the system clock

continues to operate from the same source and at the

same speed. Peripheral modules continue to be

clocked at the same speed, while the CPU clock speed

is reduced. Synchronization between the two clock

domains is maintained, allowing the peripherals to

access the SFRs while the CPU executes code at a

slower rate.

Doze mode is enabled by setting the DOZEN bit

(CLKDIV<11>). The ratio between peripheral and core

clock speed is determined by the DOZE<2:0> bits

(CLKDIV<14:12>). There are eight possible

configurations, from 1:1 to 1:128, with 1:1 being the

default setting.

Programs can use Doze mode to selectively reduce

power consumption in event-driven applications. This

allows clock-sensitive functions, such as synchronous

communications, to continu e witho ut interruption while

the CPU idles, waiting for something to invoke an

interrupt routine. An automatic return to full-speed CPU

operation on interrupts can be enabled by setting the

ROI bit (CLKDIV<15>). By default, interrupt events

have no effect on Doze mode operation.

For example, suppose the device is operating at

20 MIPS and the CAN module has been configured for

500 kbps based on this device operating speed. If the

device is placed in Doze mode with a clock frequency

ratio of 1:4, the CAN module continues to communicate

at the required bit rate of 500 kbps, but the CPU now

starts executing instructions at a frequency of 5 MIPS.

9.4 Peripheral Module Disable

The Peripheral Module Disable registers (PMD)

provide a method to disable a peripheral module by

stopping all clock sources supplied to that module.

When a peripheral is disabled using the appropriate

PMD control bit, the peripheral is in a minimum po wer

consumption state. The control and status registers

associated with the peripheral are also disabled, so

writes to those registers will have no effect and read

values will be invalid.

A peripheral module is enabled only if both the

associated bit in the PMD register is cleared and the

peripheral is supported by the specific dsPIC® DSC

variant. If the peripheral is present in the device, it is

enabled in the PMD registe r by default.

Note: If a PMD bit is set, the corresponding

module is disabled after a delay of one

instruction cycle. Similarly, if a PMD bit is

cleared, the corresponding module is

enabled after a delay of one instruction

cycle (assuming the module control

registers are already configured to enable

module operation).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0

—— T3MD T2MD T1MD QEIMD PWM1MD —

bit 15 bit 8

R/W-0 U-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0

I2C1MD —U1MD—SPI1MD——AD1MD

(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 T3MD: Timer3 Module Disable bit

1 = T imer3 module is disabled

0 = T imer3 module is enabled

bit 12 T2MD: Timer2 Module Disable bit

1 = T imer2 module is disabled

0 = T imer2 module is enabled

bit 11 T1MD: Timer1 Module Disable bit

1 = T imer1 module is disabled

0 = T imer1 module is enabled

bit 10 QEIMD: QEI Module Disable bit

1 = QEI module is disabled

0 = QEI module is enabled

bit 9 PWM1MD: PWM1 Module Disable bit

1 = PWM1 module is disabled

0 = PWM1 module is enabled

bit 8 Unimplemented: Read as ‘0’

bit 7 I2C1MD: I2C1 Module Disable bit

1 = I2C1 module is disabled

0 = I2C1 module is enabled

bit 6 Unimplemented: Read as ‘0’

bit 5 U1MD: UART1 Module Disable bit

1 = UART1 module is disabled

0 = UART1 module is enabled

bit 4 Unimplemented: Read as ‘0’

bit 3 SPI1MD: SPI1 Module Disable bit

1 = SPI1 module is disabled

0 = SPI1 module is enabled

bit 2-1 Unimplemented: Read as ‘0’

bit 0 AD1MD: ADC1 Module Disable bit(1)

1 = ADC1 module is disabled

0 = ADC1 module is enabled

Note 1: PCFGx bits have no effect if the ADC module is disabled by setting this bit. In this case, all port pins

multiplexed with ANx will be in Digital mode.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0

IC8MD IC7MD ————IC2MDIC1MD

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0

——————OC2MDOC1MD

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 IC8MD: Input Capture 8 Module Disable bit

1 = Input Capture 8 module is disabled

0 = Input Capture 8 module is enabled

bit 14 IC7MD: Input Capture 2 Module Disable bit

1 = Input Capture 7 module is disabled

0 = Input Capture 7 module is enabled

bit 13-10 Unimplemented: Read as ‘0’

bit 9 IC2MD: Input Capture 2 Module Disable bit

1 = Input Capture 2 module is disabled

0 = Input Capture 2 module is enabled

bit 8 IC1MD: Input Capture 1 Module Disable bit

1 = Input Capture 1 module is disabled

0 = Input Capture 1 module is enabled

bit 7-2 Unimplemented: Read as ‘0’

bit 1 OC2MD: Output Compare 2 Module Disable bit

1 = Output Compare 2 modu l e is disabled

0 = Output Compare 2 module is enabl ed

bit 0 OC1MD: Output Compare 1 Module Disable bit

1 = Output Compare 1 modu l e is disabled

0 = Output Compare 1 module is enabl ed

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

————————

bit 15 bit 8

U-0 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0

— — —PWM2MD————

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4 PWM2MD: PWM2 Module Disable bit

1 = PWM2 module is disabled

0 = PWM2 module is enabled

bit 3-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

10.0 I/O PORTS

All of the device pins (except VDD, VSS, MCLR and

OSC1/CLKI) are shared among the peripherals and the

parallel I/O ports. All I/O input ports feature Schmitt

Trigger inputs for improved noise immunity.

10.1 Parallel I/O (PIO) Ports

Generally a parallel I/O port that shares a pin with a

peripheral is subservient to the peripheral. The

peripheral’s output buffer data and control signals are

provided to a pair of multiplexers. The multiplexers

select whether the peripheral or the associated port

has ownership of the output data and control signals of

the I/O pin. The logic also prevents “loop through”, in

which a port’s digital output can drive the input of a

peripheral that shares the same pin. Figure 10-1 shows

how ports are shared with other peripherals and the

associated I/O pin to which they are connected.

When a peripheral is enabled and the peripheral is

actively driving an associated pin, the use of the pin as

a general purpose output pin is disabled. The I/O pin

can be read, but the output driver for the parallel port bit

is disabled. If a peripheral is enabled, but the peripheral

is not actively driving a pin, that pin can be driven by a

port.

All port pins have three registers directly associated

with their operation as digital I/O. The data direction

or an output. If the data direction bit is a ‘1’, then the pin

is an input. All port pins are defined as inputs after a

Reset. Reads from the latch (LATx) read the latch.

Writes to the latch write the latch. Reads from the port

(PORTx) read the port pins, while writes to the port pins

write the latch.

Any bit and its associated data and control registers

that are not valid for a particular device will be

disabled. That means the corresponding LATx and

TRISx registers and the port pin will read as zeros.

When a pin is shared with another peripheral or

function that is defined as an input only, it is

nevertheless regarded as a dedicated port because

there is no other competing source of outputs.

FIGURE 10-1: BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices. It is not

intended to be a comprehensive refer-

ence source. To complement the infor-

mation in this data sheet, refer to Section

10. “I/O Ports” (DS70193) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available on Microchip

web site (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

WR LAT +

TRIS Latch

I/O Pin

WR Port

Data Bus

Data Latch

Read Port

Read TRIS

WR TRIS

Peripheral Output Data Output Enable

Peripheral Input Data

I/O

Peripheral Module

Peripheral Output Enable

PIO Module

Output Multiplexers

Output Data

Input Data

Peripheral Module Enable

Read LAT

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

10.2 Open-Drain Configuration

In addition to the PORT, LAT and TRIS registers for

data control, some port pins can also be individually

configured for either digital or open-drain output. This is

controlled by the Open-Drain Control register, ODCx,

associated with each port. Setting any of the bits con-

figures the corresponding pin to act as an open-drain

output.

The open-drain feature allows the generation of

outputs higher than VDD (e.g., 5V) on any desired 5V

tolerant pins by using external pull-up resistors. The

maximum open-drain voltage allowed is the same as

the maximum VIH specification.

See the “Pin Dia grams” section for the available pins

and their functionality.

10.3 Configuring Analog Port Pins

The AD1PCFG and TRIS registers control the opera-

tion of the analog-to-digital (A/D) port pins. The port

pins that are to function as analog inputs must have

their corresponding TRIS bit set (i nput). If the TRIS bit

is cleared (output), the digital output level (VOH or VOL)

will be converted.

The AD1PCFGL register has a default value of 0x0000;

therefore, all pins that share ANx functions are analo g

(not digital) by default.

When the PORT register is read, all pins configured as

analog input channels will read as cleared (a low level).

Pins configured as digital inputs will not convert an

analog input. Analog levels on any pin defined as a dig-

ital input (including the ANx pins) can cause the input

buffer to consume current that exceeds the device

specifications.

10.4 I/O Port Write/Read Timing

One instruction cycle is required between a port

direction change or port write operation and a read

operation of the same port. Typically this instruction

would be an NOP. Examples are shown in

Example 10-1 and Example 10-2. This also applie s to

PORT bit operations, such as BSET PORTB, # RB0,

which are single cycl e read-modify-write. All PORT bit

operations, such as MOV PORTB, W0 or BSET PORTB,

# RBx, read the pin and not the latch.

10.5 Input Change Notification

The input change notification function of the I/O ports

allows the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices to generate interrupt

requests to the processor in response to a

change-of-state on selected input pins. This feature

can detect input change-of-states even in Sleep mode,

when the clocks are disabled. Depending on the device

pin count, up to 31 external signals (CNx pin) can be

selected (enabled) for generating an interrupt request

on a change-of-state.

Four control registers are associated with the CN mod-

ule. The CNEN1 and CNEN2 registers contain the

interrupt enable control bits for each of the CN input

pins. Setting any of these bits enables a CN interrupt

for the corresponding pins.

Each CN pin also has a weak pull-up connected to it.

The pull-ups act as a current source connected to the

pin, and eliminate the need for external resistors when

push-button or keypad devices are connected. The

pull-ups are enabled separately using the CNPU1 and

CNPU2 registers, which contain the control bits for

each of the CN pins. Setting any of the control bits

enables the weak pull-ups for the corresponding pins.

EXAMPLE 10-1: PORT WRITE/READ EXAMPLE

EXAMPLE 10-2: PORT BIT OPERATIONS

Note: Pull-ups on change notification pins

should always be disabled when the port

pin is configured as a digital output.

MOV 0xFF00, W0 ; Configure PORTB<15:8> as inputs

MOV W0, TRISBB ; and PORTB<7:0> as outputs

NOP ; Delay 1 cycle

btss PORTB, #13 ; Next Instruction

Incorrect:

BSET PORTB, #RB1 ;Set PORTB<RB1> high

BSET PORTB, #RB6 ;Set PORTB<RB6> high

Correct:

BSET PORTB, #RB1 ;Set PORTB<RB1> high

NOP

BSET PORTB, #RB6 ;Set PORTB<RB6> high

NOP

Preferred:

BSET LATB, LATB1 ;Set PORTB<RB1> high

BSET LATB, LATB6 ;Set PORTB<RB6> high

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

10.6 Peripheral Pin Select

Peripheral pin select configuration enables peripheral

set selection and placement on a wide range of I/O

pins. By increasing the pinout options available on a

particular device, programmers can better tailor the

microcontroller to their entire application, rather than

trimming the application to fit the device .

The peripheral pin select configuration feature

operates over a fixed subset of digital I/O pins.

Programmers can independently map the inpu t and/or

output of most digital peripherals to any one of these

I/O pins. Peripheral pin select is performed in software,

and generally does not require the device to be

reprogrammed. Hardware safeguards are included that

prevent accidental or spurious changes to the

peripheral mapping, once it has been established.

10.6.1 AVAILABLE PINS

The peripheral pin select feature is used with a range

of up to 26 pins. The number of available pins depends

on the particular device and its pin count. Pins that

support the peripheral pin select feature include the

designation “RPn” in their full pin designation, where

“RP” designates a remappable peripheral and “n” is the

remappable pin number.

10.6.2 CONTROLLING PERIPHERAL PIN

SELECT

Peripheral pin select features are controlled through

two sets of special function registers: one to map

peripheral inputs, and one to map outputs. Because

they are separately controlled, a particular peripheral’s

input and output (if the peripheral has both) can be

placed on any selectable function pin without

constraint.

The association of a peripheral to a peripheral

selectable pin is handled in two different ways,

depending on whether an input or output is being

mapped.

10.6.2.1 Input Mapping

The inputs of the peripheral pin select options are

mapped on the basis of the peripheral. A control

will be mapped to. The RPINRx registers are used to

configure peripheral input mapp ing (see Register 10-1

through Register 10-13). Each register contains set s of

5-bit fields, with each set associated with one of the

remappable peripherals. Programming a given

peripheral’s bit field with an appropriate 5-bit value

maps the RPn pin with that value to that peripheral. For

any given device, the valid range of values for any bit

field corresponds to the maximum number of peripheral

pin selections supported by the device.

Figure 10-2 Illustrates remappable pin selection for

U1RX input.

FIGURE 10-2: REMAPPABLE MUX

INPUT FOR U1RX

Note: For input mapping only , the Peripheral Pin

Select (PPS) functionality does not have

priority over the TRISx settings. There-

fore, when configuring the RPn pin for

input, the corresponding bit in the TRISx

(i.e., set to ‘1’).

RP0

RP1

RP2

RP25

U1RX input

U1RXR<4:0>

to peripheral

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 10-1: SEL E C TAB L E INPUT SOURCES (M AP S I N PU T TO FUNCTION)(1)

Input Name Function Name Register Configuration

Bits

External Interrupt 1 INT1 RPINR0 INT1R<4:0>

External Interrupt 2 INT2 RPINR1 INT2R<4:0>

Timer2 External Clock T2CK RPINR3 T2CKR<4:0>

Timer3 External Clock T3CK RPINR3 T3CKR<4:0>

Input Capture 1 IC1 RPINR7 IC1R<4:0>

Input Capture 2 IC2 RPINR7 IC2R<4:0>

Input Capture 7 IC7 RPINR10 IC7R<4:0>

Input Capture 8 IC8 RPINR10 IC8R<4:0>

Output Compare Fault A OCFA RPINR11 OCFA R<4:0>

PWM1 Fault FLTA1 RPINR12 FLTA1R<4:0>

PWM2 Fault FLTA2 RPINR13 FLTA2R<4:0>

QEI1 Phase A QEA RPINR14 QEA1R<4:0>

QEI1 Phase B QEB RPINR14 QEB1R<4:0>

QEI1 Index INDX RPINR15 INDX1R<4:0>

UART1 Receive U1RX RPINR18 U1RXR<4:0>

UART1 Clear To Sen d U1CTS RPINR18 U1CTSR<4:0>

SPI1 Data Input SDI1 RPINR20 SDI1R<4:0>

SPI1 Clock Input SCK1 RPINR20 SCK1R<4:0>

SPI1 Slave Select Input SS1 RPINR21 SS1R<4:0>

Note 1: Unless otherwise noted, all inputs use the Schmitt inpu t buffers.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

10.6.2.2 Output Mapping

In contrast to inputs, the outputs of the peripheral pin

select options are mapped on the basis of the pin. In

this case, a control register associated with a p articular

pin dictates the peripheral output to be mapped. The

RPORx registers are used to control output mapping.

Like the RPINRx registers, each register contains sets

of 5-bit fields, with each set associated with one RPn

pin (see Register 10-14 through Register 10-26). The

value of the bit field corresponds to one of the perip h-

erals, and that peripheral’s output is mapped to the pin

(see Table 10-2 and Figure 10-3).

The list of peripherals for output mapping also includes

a null value of 00000 because of the mapping tech-

nique. This permits any given pin to remain uncon-

nected from the output of any of the pin selectable

peripherals.

FIGURE 10-3: MULTIPLEXING OF

REMAPPABLE OUTPUT

FOR RPn

TABLE 10-2: OUTPUT SELECTION FOR REMAPPABLE PIN (RPn)

RPnR<4:0>

Default

U1TX Output Enable

U1RTS Output Enable 4

UPDN Output Enable 19

OC2 Output Enable

Default

U1TX Output

U1RTS Output 4

UPDN Output 19

OC2 Output

Output Enable

Output Data RPn

Function RPnR<4:0> Output Name

NULL 00000 RPn tied to default port pin

U1TX 00011 RPn tied to UART1 T ransmit

U1RTS 00100 RPn tied to UART1 Ready To Send

SDO1 00111 RPn tied to SPI1 Data Output

SCK1OUT 01000 RPn tied to SPI1 Clock Output

SS1OUT 01001 RPn tied to SPI1 Slave Select Output

OC1 10010 RPn tied to Output Compare 1

OC2 10011 RPn tied to Output Compare 2

UPDN 11010 RPn tied to QEI direction (UPDN) status

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

10.6.3 CONTROLLING CONFIGURATION

CHANGES

Because peripheral remapping can be changed during

run time, some restrictions on peripheral remapping

are needed to prevent accidental configuration

changes. dsPIC33F devices include three features to

prevent alterations to the peripheral map:

• Control register lock sequence

• Continuous state monitoring

• Configuration bit pin select lock

10.6.3.1 Control Register Lock

Under normal operation, writes to the RPINRx and

RPORx registers are not allowed. Attempted writes

appear to execute normally, but the contents of the

registers remain unchanged. To change these

registers, they must be unlocked in hardware. The

(OSCCON<6>). Setting IOLOCK prevents writes to the

control registers; clearing IOLOCK allows writes.

To set or clear IOLOCK, a specific command sequence

must be executed:

1. Write 0x46 to OSCCON< 7 : 0 >.

2. Write 0x57 to OSCCON< 7 : 0 >.

3. Clear (or set) IOLOCK as a single operation.

Unlike the similar seq uence with the oscillator’s LOCK

bit, IOLOCK remains in one state until changed. This

allows all of the peripheral pin selects to be configure d

with a single unlock sequence followed by an update to

all control registers, then locked with a second lock

sequence.

10.6.3.2 Continuous State Monitoring

In addition to being protected from direct writes, the

contents of the RPINRx and RPORx registers are

constantly monitored in hardware by shadow registers.

If an unexpected change in any of the registers occurs

(such as cell disturbances caused by ESD or other

external events), a configuration mismatch Reset will

be triggered.

10.6.3.3 Configuration Bit Pin Select Lock

As an additional level of safety, the device can be

configured to prevent more than one write session to

the RPINRx and RPORx registers. The IOL1WAY

(FOSC<IOL1WAY>) configuration bit blocks the

IOLOCK bit from being cleared after it has been set

once. If IOLOCK remains set, the register unlock

procedure will not execute, and the peripheral pin

select control registers cannot be written to. The only

way to clear the bit and re-enable peripheral remapping

is to perform a device Reset.

In the default (unprogrammed) state, IOL1WAY is set,

restricting users to one write session. Programming

IOL1WAY allows user applications unlimited access

(with the proper use of the unlock sequence) to the

peripheral pin select registers.

Note: MPLAB® C30 provides built-in C

language functions for unlocking the

OSCCON register:

__builtin_write_OSCCONL(value)

__builtin_write_OSCCONH(value)

See MPLAB Help for more information.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

10.7 Peripheral Pin Select Registers

The dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of devices implement 21

registers for remappable peripheral configuration:

• Input Remappable Peripheral Regi sters (13)

• Output Remappable Peripheral Registers (8)

Note: Input and Output Register values can only

be changed if OSCCON[IOLOCK] = 0.

See Section 10.6.3.1 “Control Register

Lock” for a specific command sequence.

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —INT1R<4:0>

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 INT1R<4:0>: Assign External Interrupt 1 (INTR1) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —INT2R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4-0 INT2R<4:0>: Assign External Interrupt 2 (INTR2) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —T3CKR<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —T2CKR<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 T3CKR<4:0>: Assign Timer3 External Clock (T3CK) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 T2CKR<4:0>: Assign Timer2 External Clock (T2CK) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — IC2R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — IC1R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 IC2R<4:0>: Assign Input Capture 2 (IC2) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 IC1R<4:0>: Assign Input Capture 1 (IC1) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — IC8R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — IC7R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 IC8R<4:0>: Assign Input Capture 8 (IC8) to the corresponding pin RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 IC7R<4:0>: Assign Input Capture 7 (IC7) to the corresponding pin RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —OCFAR<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4-0 OCFAR<4:0>: Assign Output Capture A (OCFA) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —FLTA1R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4-0 FLTA1R<4:0>: Assign PWM1 Fault (FLTA1) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —FLTA2R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4-0 FLTA2R<4:0>: Assign PWM2 Fault (FLTA2) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —QEB1R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —QEA1R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 QEB1R<4:0>: Assign B (QEB) to the corresponding pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 QEA1R<4:0>: Assign A(QEA) to the corresponding pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — INDX1R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4-0 INDX1R<4:0>: Assign QEI INDEX (INDX) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — U1CTSR<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —U1RXR<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 U1CTSR<4:0>: Assign UART1 Clear to Send (U1CTS) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 U1RXR<4:0>: Assign UART1 Receive (U1RX) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —SCK1R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — —SDI1R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 SCK1R<4:0>: Assign SPI1 Clock Input (SCK1IN) to the corresponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 SDI1R<4:0>: Assign SPI1 Data Input (SDI1) to the corres ponding RPn pin bits

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

— — — SS1R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-5 Unimplemented: Read as ‘0’

bit 4-0 SS1R<4:0>: Assign SPI1 Slave Select Input (SS1IN) to the corresponding RPn pin bi ts

11111 = Input tied VSS

11001 = Input tied to RP25

00001 = Input tied to RP1

00000 = Input tied to RP0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP1R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP0R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP1R<4:0>: Peripheral Output Function is Assigned to RP1 Output Pin bits (see Table 10-2 fo r

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP0R<4:0>: Peripheral Output Function is Assigned to RP0 Output Pin bits (see Table 10-2 for

peripheral function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP3R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP2R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP3R<4:0>: Peripheral Output Function is Assigned to RP3 Output Pin bits (see Table 10-2 fo r

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP2R<4:0>: Peripheral Output Function is Assigned to RP2 Output Pin bits (see Table 10-2 for

peripheral function numbers)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP5R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP4R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP5R<4:0>: Peripheral Output Function is Assigned to RP5 Output Pin bits (see Table 10-2 fo r

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP4R<4:0>: Peripheral Output Function is Assigned to RP4 Output Pin bits (see Table 10-2 for

peripheral function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP7R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP6R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP7R<4:0>: Peripheral Output Function is Assigned to RP7 Output Pin bits (see Table 10-2 fo r

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP6R<4:0>: Peripheral Output Function is Assigned to RP6 Output Pin bits (see Table 10-2 for

peripheral function numbers)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP9R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP8R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP9R<4:0>: Peripheral Output Function is Assigned to RP9 Output Pin bits (see Table 10-2 fo r

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP8R<4:0>: Peripheral Output Function is Assigned to RP8 Output Pin bits (see Table 10-2 for

peripheral function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — —RP11R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP10R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP11R<4:0>: Peripheral Output Function is Assigned to RP11 Output Pin bits (see Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP10R<4:0>: Peripheral Output Function is Assigned to RP10 Output Pin bits (see Table 10-2 for

peripheral function numbers)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP13R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP12R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP13R<4:0>: Peripheral Output Function is Assigned to RP13 Output Pin bits (see Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP12R<4:0>: Peripheral Output Function is Assigned to RP12 Output Pin bits (see Table 10-2 for

peripheral function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP15R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP14R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP15R<4:0>: Peripheral Output Function is Assigned to RP15 Output Pin bits (see Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP14R<4:0>: Peripheral Output Function is Assigned to RP14 Output Pin bits (see Table 10-2 for

peripheral function numbers)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP17R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP16R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP17R<4:0>: Peripheral Output Function is Assigned to RP17 Output Pin bits (see Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP16R<4:0>: Peripheral Output Function is Assigned to RP16 Output Pin bits (see Table 10-2 for

peripheral function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP19R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP18R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP19R<4:0>: Peripheral Output Function is Assigned to RP19 Output Pin bits (see Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP18R<4:0>: Peripheral Output Function is Assigned to RP18 Output Pin bits (see Table 10-2 for

peripheral function numbers)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP21R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP20R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP21R<4:0>: Peripheral Output Function is Assigned to RP21 Output Pin bits (see Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP20R<4:0>: Peripheral Output Function is Assigned to RP20 Output Pin bits (see Table 10-2 for

peripheral function numbers)

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP23R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP22R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP23R<4:0>: Peripheral Output Function is Assigned to RP23 Output Pin bits (see Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP22R<4:0>: Peripheral Output Function is Assigned to RP22 Output Pin bits (see Table 10-2 for

peripheral function numbers)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP25R<4:0>

bit 15 bit 8

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — RP24R<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12-8 RP25R<4:0>: Peripheral Output Function is Assigned to RP25 Output Pin bits (see Table 10-2 for

peripheral function numbers)

bit 7-5 Unimplemented: Read as ‘0’

bit 4-0 RP24R<4:0>: Peripheral Output Function is Assigned to RP24 Output Pin bits (see Table 10-2 for

peripheral function numbers)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

11.0 TIMER1

The Timer1 module is a 16-bit timer, which can serve

as the time counter for the real-time clock, or operate

as a free-running interval timer/counter. Timer1 can

operate in three modes:

• 16-bit Timer

• 16-bit Synchronous Counter

• 16-bit Asynchronous Counter

Timer1 also supports these features:

• Timer gate operation

• Selectable prescaler settings

• Timer operation during CPU Idle and Sleep

modes

• Interrupt on 16-bit Period register match or falling

edge of external gate signal

Figure 11-1 presents a block diagram of the 16-bit timer

module.

To configure Timer1 for operation:

1. Set the TON bit (= 1) in the T1CON register.

2. Select the timer prescaler ratio using the

TCKPS<1:0> bits in the T1CON register.

3. Set the Clock and Gating modes using the TCS

and TGATE bits in the T1CON register.

4. Set or clear the TSYNC bit in T1CON to select

synchronous or asynchronous operation.

5. Load the timer period value into the PR1

6. If interrupts are required, set the interrupt enable

bit, T1IE. Use the priority bits, T1IP<2:0>, to set

the interrupt priority.

FIGURE 11-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 fami ly of devi ces . It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 11. “Timers” (DS70205) of the

dsPIC33F/PIC24H Family Reference

Manual, which is available from the Micro-

chip web site (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

TON

SOSCI

SOSCO/

PR1

Set T1IF

Equal Comparator

TMR1

Reset

SOSCEN

TSYNC

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

T1CK

TCS

TGATE

Sync

Gate

Sync

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

TON —TSIDL— — — — —

bit 15 bit 8

U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0

— TGATE TCKPS<1:0> —TSYNCTCS —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 TON: Timer1 On bit

1 = Starts 16-bit Timer1

0 = Stops 16-bit Timer1

bit 14 Unimplemented: Read as ‘0’

bit 13 TSIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operati on in Idle mode

bit 12-7 Unimplemented: Read as ‘0’

bit 6 TGATE: Timer1 Gated Time Accumulation Enable bit

When TCS = 1:

This bit is ignored.

When TCS = 0:

1 = Gated time accumulation enabled

0 = Gated time accumulation disable d

bit 5-4 TCKPS<1:0> Timer1 Input Clock Prescale Select bits

11 = 1:256

10 = 1:64

01 = 1:8

00 = 1:1

bit 3 Unimplemented: Read as ‘0’

bit 2 TSYNC: Timer1 External Clock Input Synchroniza tion Select bit

When TCS = 1:

1 = Synchronize external clock input

0 = Do not synchronize external clock input

When TCS = 0:

This bit is ignored.

bit 1 TCS: Timer1 Clock Source Select bit

1 = External clock from pin T1CK (on the rising edge )

0 = Internal clock (FCY)

bit 0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

12.0 TIMER2/3 FEATURE

The Timer2/3 feature has three 2-bit timers that can

also be configured as two independent 16-bit timers

with selectable operating modes.

As a 32-bit timer, the Timer2/3 feature permits

operation in three modes:

• Two Independent 16-bit timers (e.g., Timer2 and

Timer3) with all 16-bit operating modes (except

Asynchronous Counter mode)

• Single 32-bit timer (Timer2/3)

• Single 32-bit synchronous counter (Timer2/3)

The Timer2/3 feature also supports:

• Timer gate operation

• Selectable prescaler settings

• Timer operation during Idle and Sleep modes

• Interrupt on a 32-bit period register match

• T ime base for Input Capture and Output Compare

modules (Timer2 and Timer3 only)

• ADC1 event trigger (Timer2/3 only)

Individually , all eight of the 16-bit timers can function as

synchronous timers or counters. They also offer the

features listed above, except for the event tri gger. The

operating modes and enabled features are determined

by setting the appropriate bit(s) in the T2CON, T3CON

registers. T2CON registers are shown in generic form

in Register 12-1. T3CON registers are shown in

For 32-bit timer/counter opera tion, Timer2 is the least

significant word (lsw), and Timer3 is the most

significant word (msw) of the 32-bit timers.

12.1 32-bit Operation

To configure the Timer2/3 feature timers for 32-bit

operation:

1. Set the T32 cont ro l bi t.

2. Select the prescaler ratio for Timer2 using the

TCKPS<1:0> bits.

3. Set the Clock and Gating modes using the

corresponding TCS and TGATE bits.

4. Load the timer period value. PR3 contains the

most significant word of the value, while PR2

contains the least significant word.

5. If interrupts are required, set the interrupt enable

bit, T3IE. Use the priority bits, T3IP<2:0>, to set

the interrupt priority. While Timer2 controls the

timer, the interrupt appears as a Timer3

interrupt.

6. Set the corresponding TON bit.

The timer value at any point is stored in the register

pair , TMR3:TMR2, which always contains the most sig-

nificant word of the count, while TMR2 contains the

least significant word.

12.2 16-bit Operation

To configure any of the timers for individual 16-bit

operation:

1. Clear the T32 bit corresponding to that timer.

2. Select the timer prescaler ratio using the

TCKPS<1:0> bits.

3. Set the Clock and Gating modes using the TCS

and TGATE bits.

4. Load the timer period value into the PRx

5. If interrupts are required, set the interrupt enable

bit, TxIE. Use the priority bits, TxIP<2:0>, to set

the interrupt priority.

6. Set the TON bit.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 fami ly of devi ces . It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 11. “Timers” (DS70205) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip web site (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Note: For 32-bit operation, T3CON control bits

are ignored. Only T 2CON control bits are

used for setup and control. Timer2 clock

and gate inputs are used for the 32-bit

timer modules, but an interrupt is

generated with the Timer3 interrupt flags.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 12-1: TIMER2/3 (32-BIT) BLOCK DIAGRAM(1)

Set T3IF

Equal Comparator

PR3 PR2

Reset

LSbMSb

Note 1: The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective

to the T2CON register.

2: The ADC event trigger is available only on Timer2/3.

Data Bus<15:0>

TMR3HLD

Read TMR2

Write TMR2 16

TGATE

TON TCKPS<1:0>

TCY

TCS

TGATE

T2CK

ADC Event Trigger(2)

Gate

Sync Prescaler

1, 8, 64, 256

Sync

TMR3 TMR2

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 12-2: TIMER2 (16-BIT) BLOCK DIAGRAM

TON TCKPS<1:0>

Prescaler

1, 8, 64, 256

TCY TCS

TGATE

T2CK

PR2

Set T2IF

Equal Comparator

TMR2

Reset

TGATE

Gate

Sync

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

TON —TSIDL— — — — —

bit 15 bit 8

U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0

— TGATE TCKPS<1:0> T32 —TCS—

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 TON: Timer2 On bit

When T32 = 1:

1 = Starts 32-bit Timer2/3

0 = Stops 32-bit Timer2/3

When T32 = 0:

1 = Starts 16-bit Timer2

0 = Stops 16-bit Timer2

bit 14 Unimplemented: Read as ‘0’

bit 13 TSIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operati on in Idle mode

bit 12-7 Unimplemented: Read as ‘0’

bit 6 TGATE: Timer2 Gated Time Accumulation Enable bit

When TCS = 1:

This bit is ignored.

When TCS = 0:

1 = Gated time accumulation enabled

0 = Gated time accumulation disable d

bit 5-4 TCKPS<1:0>: Timer2 Input Clock Prescale Select bits

11 = 1:256

10 = 1:64

01 = 1:8

00 = 1:1

bit 3 T32: 32-bit Timer Mode Select bit

1 = Timer2 and Timer3 form a single 32-bit timer

0 = Timer2 and Timer3 act as two 16-bit timers

bit 2 Unimplemented: Read as ‘0’

bit 1 TCS: Timer2 Clock Source Select bit

1 = External clock from pin T2CK (on the rising edge )

0 = Internal clock (FCY)

bit 0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

TON(2) —TSIDL

(1) — — — — —

bit 15 bit 8

U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0

— TGATE

(2) TCKPS<1:0>(2) ——TCS

(2) —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 TON: Timer3 On bit(2)

1 = Starts 16-bit Timer3

0 = Stops 16-bit Timer3

bit 14 Unimplemented: Read as ‘0’

bit 13 TSIDL: Stop in Idle Mode bit(1)

1 = Discontinue timer operation when device enters Idle mode

0 = Continue timer operation in Idle mode

bit 12-7 Unimplemented: Read as ‘0’

bit 6 TGATE: Timer3 Gated Time Accumulation Enable bit(2)

When TCS = 1:

This bit is ignored.

When TCS = 0:

1 = Gated time accumulation enabled

0 = Gated time accumulation disabled

bit 5-4 TCKPS<1:0>: Timer3 Input Clock Prescale Select bits(2)

11 = 1:256 prescale value

10 = 1:64 prescale value

01 = 1:8 prescale value

00 = 1:1 prescale value

bit 3-2 Unimplemented: Read as ‘0’

bit 1 TCS: Timer3 Clock Source Select bit(2)

1 = External clock from T3CK pin

0 = Internal clock (FOSC/2)

bit 0 Unimplemented: Read as ‘0’

Note 1: When 32-bit timer operation is enabled (T32 = 1) in the Timer Control regist er (T2CON<3>), the TSIDL bit

must be cleared to operate the 32-bit timer in Idle mode.

2: When the 32-bit timer operation is enabled (T32 = 1) in the Timer Control register (T2CON<3>), these bits

have no effect.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

13.0 INPUT CAPTURE

The input capture module is useful in applications

requiring frequency (period) and pulse measurement.

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

devices support up to eight input capture channels.

The input capture modu le captures the 16-bit value of

the selected Time Base register when an event occurs

at the ICx pin. The events that cause a capture event

are listed below in three categories:

1. Simple Capture Event modes:

- Captu re timer value on every falling edge of

input at ICx pin

- Captu re timer value on every rising edge of

input at ICx pin

2. Capture timer value on every edge (rising and

falling).

3. Prescaler Capture Event modes:

- Captu re timer value on every 4th rising edge

of input at ICx pin

- Capture timer value on every 16th rising

edge of input at ICx pin

Each input capture channel can select one of two

16-bit timers (Timer2 or Timer3) for the time base.

The selected timer can use either an internal or

external clock.

Other operational features include:

• Device wake-up from capture pin during CPU

Sleep and Idle modes

• Interrupt on input capture event

• 4-word FIFO buffer for capture values

- Interrupt optionally generated after 1, 2, 3 or

4 buffer locations are filled

• Use of input capture to provide additional sources

of external interrupts

FIGURE 13-1: INPUT CAPTURE BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 fami ly of devi ces . It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 12. “Input Capture” (DS70198)

of the “dsPIC33F/PIC24H Family Refer-

ence Manual”, which is available f r om t h e

Microchip web si te (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

ICxBUF

ICx Pin ICM<2:0> (ICxCON<2:0>)

Mode Select

Set Flag ICxIF

(in IFSn Register)

TMR2 TMR3

Edge Detection Logic

16 16

FIFO

R/W

Logic

ICxI<1:0>

ICOV, ICBNE (ICxCON<4:3>)

ICxCON Interrupt

Logic

System Bus

From 16-bit Timers

ICTMR

(ICxCON<7>)

FIFO

Prescaler

Counter

(1, 4, 16) and

Clock Synchronizer

Note: An ‘x’ in a signal, register or bit name denotes the number of the capture channel.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

13.1 Input Capture Registers

U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

——ICSIDL— — — — —

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R-0, HC R-0, HC R/W-0 R/W-0 R/W-0

ICTMR ICI<1:0> ICOV ICBNE ICM<2:0>

bit 7 bit 0

Legend: HC = Cleared in Hardware

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 ICSIDL: Input Capture Module Stop in Idle Control bit

1 = Input capture module will halt in CPU Idle mode

0 = Input capture module will continue to ope rate in CPU Idle mode

bit 12-8 Unimplemented: Read as ‘0’

bit 7 ICTMR: Input Capture Timer Select bits

1 = TMR2 contents are captured on capture event

0 = TMR3 contents are captured on capture event

bit 6-5 ICI<1:0>: Select Number of Captures per Interru pt bits

11 = Interrupt on every fourth capture event

10 = Interrupt on every third capture event

01 = Interrupt on every second capture event

00 = Interrupt on every capture event

bit 4 ICOV: Input Capture Over flow Status Flag bit (read-only)

1 = Input capture overflow occurred

0 = No input capture overflow occurred

bit 3 ICBNE: Input Capture Buffer Empty Status bit (read-only)

1 = Input capture buffer is not empty, at least one more capture value can be read

0 = Input capture buffer is empty

bit 2-0 ICM<2:0>: Input Capture Mode Select bits

111 = Input capture functions as interrupt pin on ly when device is in Sleep or Idle mode

(Rising edge detect only, all other control bits are not applicable.)

110 = Unused (module disabled)

101 = Capture mode, every 16th rising edge

100 = Capture mode, every 4th rising edge

011 = Capture mode, every rising edge

010 = Capture mode, every falling edge

001 = Capture mode, every edge (rising and falling)

(ICI<1:0> bits do not control interrupt generation for this mode.)

000 = Input capture module turned off

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

14.0 OUTPUT COMPARE The Output Compare module can select either Timer2

or Timer3 for its time base. The module compares the

value of the timer with the value of one or two compare

registers depending on the operating mode selected.

The state of the output pin changes when the timer

value matches the compare register value. The Output

Compare module generates either a single output

pulse or a sequence of output pulses, by cha ngin g the

state of the output pin on the compare match events.

The Output Compare module can also generate

interrupts on compare match events.

The Output Compare module has multiple operating

modes:

• Active-Low One-Shot mode

• Active-Hi g h On e-Shot mode

• Toggle mode

• Delayed One-Shot mode

• Continuous Pulse mode

• PWM mode without fault protection

• PWM mode with fault protection

FIGURE 14-1: OUTPUT COMPARE MODULE BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of devices. It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 13. “Output Compare”

(DS70209) of the “dsPIC33F/PIC24H

Family Reference Manual”, which is

available from the Microchip web site

(www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

OCxR

Comparator

Output

Logic

OCM<2:0>

OCx

Set Flag bit

OCxIF

OCxRS

Mode Select

OCTSEL 01

OCFA

TMR2 TMR2

TMR3 TMR3

Rollover Rollover

Output

Logic

Output

Enable Enable

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

14.1 Output Compare Modes

Configure the Output Compare modes by setting the

appropriate Output Compare Mode bits (OCM<2:0>) in

the Output Compare Control register (OCxCON<2:0>).

Table 14-1 li sts the different bit settings for the Output

Compare modes. Figure 14-2 illustrates the output

compare operation for various modes. The user

application must disable the associated timer when

writing to the output compare control registers to avoid

malfunctions.

TABLE 14-1: OUTPUT COMPARE MODES

FIGURE 14-2: OUTPUT COMP ARE OPERATION

Note: See Section 13. “Output Compare”

(DS70209) in the “dsPIC33F/PIC24H

Family Reference Ma nual” (DS70 209) for

OCxR and OCxRS register restrictions.

OCM<2:0> Mode OCx Pin Initial State OCx Interrupt Generation

000 Module Disabled Controlled by GPIO registe r —

001 Active-Low One-Shot 0OCx Rising edge

010 Active-High One-Shot 1OCx Falling edge

011 Toggle Mode Current output is maintained OCx Rising and Falling edge

100 Delayed One-Shot 0OCx Falling edge

101 Continuous Pulse mode 0OCx Falling edge

110 PWM mode without fault

protection 0, if OCxR is zero

1, if OCxR is non-zero No interrupt

111 PWM mode with fault protection 0, if OCxR is zero

1, if OCxR is non-zero OCFA Fall ing edge for OC1 to OC4

OCxRS

TMRy OCxR

Timer is reset on

period match

Continuous Pulse Mode

(OCM = 101)

PWM Mode

(OCM = 110 or 111)

Active-Low One-Shot

(OCM = 001)

Active-High One-Shot

(OCM = 010)

Toggle Mode

(OCM = 011)

Delayed One-Shot

(OCM = 100)

Output Compare

Mode enabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

——OCSIDL — — — — —

bit 15 bit 8

U-0 U-0 U-0 R-0 HC R/W-0 R/W-0 R/W-0 R/W-0

— — — OCFLT OCTSEL OCM<2:0>

bit 7 bit 0

Legend: HC = Cleared in Hardware HS = Set in Hardware

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13 OCSIDL: Stop Outpu t Compare in Idle Mode Control bit

1 = Output Compare x will halt in CPU Idle mode

0 = Output Compare x will continue to operate in CPU Idle mode

bit 12-5 Unimplemented: Read as ‘0’

bit 4 OCFLT: PWM Fault Condition Status bit

1 = PWM Fault condition has occurred (cleared in hardware only)

0 = No PWM Fault condition has occurred

(This bit is only used when OCM<2:0> = 111.)

bit 3 OCTSEL: Output Compare Timer Select bit

1 = Timer3 is the clock source for Compare x

0 = Timer2 is the clock source for Compare x

bit 2-0 OCM<2:0>: Output Compare Mode Select bits

111 = PWM mode on OCx, Fault pin enabled

110 = PWM mode on OCx, Fault pin disabled

101 = Initialize OCx pin low, generate continuous output pulses on OCx pin

100 = Initialize OCx pin low, generate single output pulse on OCx pin

011 = Compare event toggles OCx pin

010 = Initialize OCx pin high, compare event forces OCx pin low

001 = Initialize OCx pin low, compare event forces OCx pin high

000 = Output compare channel is disabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

15.0 MOTOR CONTROL PWM

MODULE

The ds PIC33FJ32MC20 2/204 and dsPIC33FJ16MC304

device supports up to two dedicated Pulse-Width

Modulation (PWM) modules. The PWM1 module is a

6-channel PWM generator, and the PWM2 module is a

2-channel PWM generator .

The PWM module has the following features:

• Up to 16-bit resolution.

• On-the-fly PWM frequency changes.

• Edge and Center-Aligned Output modes.

• Single Pulse Generation mode.

• Interrupt support for asymmetrical updates in

Center-Aligned mode.

• Output override control for Electrically

Commutative Motor (ECM) operation or BLDC.

• Sp e ci al Even t comparat or fo r sc he d uli n g other

peripheral events.

• Fault pins to optionally drive each of the PWM

output pins to a defined state.

Duty cycle updates configurable to be immediate or

synchronized to the PWM time base.

15.1 PWM1: 6-Channel PWM Module

This module simplifies the task of generating multiple

synchronized PWM outputs. The following power and

motion control applications are supported by the PWM

module:

• 3-Phase AC Induction Motor

• Switched Reluctance (SR) Motor

• Brushless DC (BLDC) Motor

• Uninterruptible Power Supply (UPS)

This module contains three duty cycle generators,

numbered 1 through 3. The module has six PWM

output pins, numbered PWM1H1/PWM1L1 through

PWM1H3/PWM1L3. The six I/O pins are grouped into

high/low numbered pairs, denoted by the suffix H or L,

respectively. For complementary loads, the low PWM

pins are always th e complement of the corresponding

high I/O pin.

15.2 PWM2: 2-Channel PWM Module

This module provides an additional pair of

complimentary PWM outputs that can be used for:

• Independent PFC correction in a motor system

• Induction cooking

This module contains a duty cycle generator that

provides two PWM outputs, numbered

PWM2H1/PWM2L1.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of devices. It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 14. “Motor Control PWM”

(DS70187) of the “dsPIC33F/PIC24H

Family Reference Manual”, which is

available from the Microchip web site

(www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 15-1: 6-CHANNEL PWM MODULE BLOCK DIAGRAM (PWM1)

P1DC3

P1DC3 Buffer

PWM1CON1

PWM1CON2

P1TPER

Comparator

Channel 3 Dead-Time

Generator and

P1TCON

P1SECMP

Comparator Special Event Trigger

P1OVDCON

PWM Enable and Mode SFRs

PWM Manual

Control SFR

Channel 2 Dead-Time

Generator and

Channel 1 Dead-Time

Generator and

PWM

Generator 2

PWM

Generator 1

PWM Generator 3

SEVTDIR

PTDIR

P1DTCON1 Dead-Time Control SFRs

PWM1L1

PWM1H1

PWM1L2

PWM1H2

Note: Details of PWM Generator 1and PWM Generator 2 are not shown for clarity.

16-bit Data Bus

PWM1L3

PWM1H3

P1DTCON2

P1FLTACON Fault Pin Control SFRs

PWM Time Base

Output

Driver

Block

FLTA1

Override Logic

Override Lo g i c

Override Logic

Special Event

Postscaler

P1TPER Buffer

P1TMR

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 15-2: 2-CHANNEL PWM MODULE BLOCK DIAGRAM (PWM2)

P2DC1

P2DC1Buffer

PWM2CON1

PWM2CON2

P2TPER

Comparator

Channel 1 Dead-Time

Generator and

P2TCON

P2SECMP

Comparator Special Event Trigger

P2OVDCON

PWM Enable and Mode SFRs

PWM Manual

Control SFR

PWM Generator 1

SEVTDIR

PTDIR

P2DTCON1 Dead-Time Control SFRs

16-bit Data Bus

PWM2L1

PWM2H1

P2DTCON2

P2FLTACON Fault Pin Control SFRs

PWM Time Base

Output

Driver

Block

FLTA2

Override Logic

Special Event

Postscaler

P2TPER Buffer

P2TMR

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

PTEN —PTSIDL— — — — —

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 PTEN: PWM Time Base Timer Enable bit

1 = PWM time base is on

0 = PWM time base is off

bit 14 Unimplemented: Read as ‘0’

bit 13 PTSIDL: PWM Time Base Stop in Idle Mode bit

1 = PWM time base halts in CPU Idle mode

0 = PWM time base runs in CPU Idle mode

bit 12-8 Unimplemented: Read as ‘0’

bit 7-4 PTOPS<3:0>: PWM Time Base Output Post scale Select bits

1111 = 1:16 postscale

•

0001 = 1:2 post scale

0000 = 1:1 post scale

bit 3-2 PTCKPS<1:0>: PWM T im e Bas e Input Clock Prescale Select bits

11 = PWM time base input clock period is 64 TCY (1:64 prescale)

10 = PWM time base input clock period is 16 TCY (1:16 prescale)

01 = PWM time base input clock period is 4 TCY (1:4 prescale)

00 = PWM time base input clock period is TCY (1:1 prescale)

bit 1-0 PTMOD<1:0>: PWM Time Base Mode Select bits

11 = PWM time base operates in a Continuous Up/Down Count mode with interrupts for double

PWM updates

10 = PWM time base operates in a Continuous Up/Down Count mode

01 = PWM time base operates in Single Pulse mode

00 = PWM time base operates in a Free-Running mode

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PTDIR PTMR<14:8>

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PTMR<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 PTDIR: PWM Time Base Count Direction Status bit (read-only)

1 = PWM time base is counting down

0 = PWM time base is counting up

bit 14-0 PTMR <14:0>: PWM Time Base Register Count Value bits

U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— PTPER<14:8>

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PTPER<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘0’

bit 14-0 PTPER<14:0>: PWM Time Base Period Value bits

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

SEVTDIR(1) SEVTCMP<14:8>(2)

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

SEVTCMP<7:0>(2)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 SEVTDIR: Special Event Trigger Time Base Direction bit(1)

1 = A Special Event Tr igger will occur when the PWM time base is counting downward

0 = A Special Event Tr igger will occur when the PWM time base is counting upward

bit 14-0 SEVTCMP<14:0>: Special Event Compare Value bits(2)

Note 1: SEVTDIR is compared with PTDIR (PXTMR<15>) to generate the Special Event Tr igger.

2: PxSECMP<14:0> is compared with PXTMR<14:0> to generate the S pecial Event Trigger.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — PMOD3 PMOD2 PMOD1

bit 15 bit 8

U-0 R/W-1 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1

— PEN3H(1) PEN2H(1) PEN1H(1) — PEN3L(1) PEN2L(1) PEN1L(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-11 Unimplemented: Read as ‘0’

bit 10-8 PMOD3:PMOD1: PWM I/O Pair Mode bits

1 = PWM I/O pin pair is in the Independent PWM Output mode

0 = PWM I/O pin pair is in the Complementary Output mode

bit 7 Unimplemented: Read as ‘0’

bit 6-4 PEN3H:PEN1H: PWMxH I/O Enable bits(1)

1 = PWMxH pin is enabled for PWM output

0 = PWMxH pin disabled, I/O pin becomes general purpose I/O

bit 3 Unimplemented: Read as ‘0’

bit 2-0 PEN3L:PEN1L: PWMxL I/O Enable bits(1)

1 = PWMxL pin is enabled for PWM output

0 = PWMxL pin disabled, I/O pin becomes general purpose I/O

Note 1: Reset condition of the PENxH and PENxL bits depends on the value of the PWMPIN Configuration bit in

the FPOR Configuration regi ster.

2: PWM2 supports only 1 PWM I/O pin pair.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — — SEVOPS<3:0>

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — IUE OSYNC UDIS

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-12 Unimplemented: Read as ‘0’

bit 11-8 SEVOPS<3:0>: PWM Special Event Trigger Output Postscale Select bits

1111 = 1:16 postscale

•

0001 = 1:2 post scale

0000 = 1:1 post scale

bit 7-3 Unimplemented: Read as ‘0’

bit 2 IUE: Immediate Update Enable bit

1 = Updates to the active PxDC registers are immediate

0 = Updates to the active PxDC registers are synchronized to the PWM time base

bit 1 OSYNC: Output Override Synchronization bit

1 = Output overrides via the PxOVDCON register are synchronized to the PWM time base

0 = Output overrides via th e PxOVDCON register occur on next TCY boundary

bit 0 UDIS: PWM Update Disable bit

1 = Updates from Duty Cycle and Period Buffer registers are disabled

0 = Updates from Duty Cycle and Period Buffer registers are enabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

DTBPS<1:0> DTB<5:0>

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

DTAPS<1:0> DTA<5:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 DTBPS<1:0>: Dead-Time Unit B Prescale Select bits

11 = Clock period for Dead-Time Unit B is 8 TCY

10 = Clock period for Dead-Time Unit B is 4 TCY

01 = Clock period for Dead-Time Unit B is 2 TCY

00 = Clock period for Dead-Time Unit B is TCY

bit 13-8 DTB<5:0>: Unsigned 6-bit Dead-Time Value for Dead-Time Unit B bits

bit 7-6 DTAPS<1:0>: Dead-Time Unit A Prescale Select bits

11 = Clock period for Dead-Time Unit A is 8 TCY

10 = Clock period for Dead-Time Unit A is 4 TCY

01 = Clock period for Dead-Time Unit A is 2 TCY

00 = Clock period for Dead-Time Unit A is TCY

bit 5-0 DTA<5:0>: Unsigned 6-bit Dead-Time Valu e for Dead-Time Unit A bits

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— DTS3A DTS3I DTS2A DTS2I DTS1A DTS1I

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-6 Unimplemented: Read as ‘0’

bit 5 DTS3A: Dead-Time Select for PWM3 Signal Going Active bit

1 = Dead time provided from Unit B

0 = Dead time provided from Unit A

bit 4 DTS3I: Dead-Time Select for PWM3 Signal Going Inactive bit

1 = Dead time provided from Unit B

0 = Dead time provided from Unit A

bit 3 DTS2A: Dead-Time Select for PWM2 Signal Going Active bit

1 = Dead time provided from Unit B

0 = Dead time provided from Unit A

bit 2 DTS2I: Dead-Time Select for PWM2 Signal Going Inactive bit

1 = Dead time provided from Unit B

0 = Dead time provided from Unit A

bit 1 DTS1A: Dead-Time Select for PWM1 Signal Going Active bit

1 = Dead time provided from Unit B

0 = Dead time provided from Unit A

bit 0 DTS1I: Dead-Time Select for PWM1 Signal Going Inactive bit

1 = Dead time provided from Unit B

0 = Dead time provided from Unit A

Note 1: PWM2 supports only 1 PWM I/O pin pair.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L

bit 15 bit 8

R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

FLTAM — — — — FAEN3 FAEN2 FAEN1

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13-8 FAOVxH<3:1>:FAOVxL<3:1>: Fault Input A PWM Override Value bits

1 = The PWM output pin is driven active on an external Fault inpu t event

0 = The PWM output pin is driven inactive on an external Fault input event

bit 7 FLTAM: Fault A Mode bit

1 = The Fault A input pin functions in the Cycle-by-Cycle mode

0 = The Fault A input pin latches all control pins to the programmed states in PxFLTACON<13:8>

bit 6-3 Unimplemented: Read as ‘0’

bit 2 FAEN3: Fault Input A En able bit

1 = PWMxH3/PWMxL3 pin pair is controlled by Fault Input A

0 = PWMxH3/PWMxL3 pin pair is not controlled by Fault Input A

bit 1 FAEN2: Fault Input A En able bit

1 = PWMxH2/PWMxL2 pin pair is controlled by Fault Input A

0 = PWMxH2/PWMxL2 pin pair is not controlled by Fault Input A

bit 0 FAEN1: Fault Input A En able bit

1 = PWMxH1/PWMxL1 pin pair is controlled by Fault Input A

0 = PWMxH1/PWMxL1 pin pair is not controlled by Fault Input A

Note 1: PWM2 supports only 1 PWM I/O pin pair.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

—— POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L

bit 15 bit 8

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-14 Unimplemented: Read as ‘0’

bit 13-8 POVDxH<3:1>:POVDxL<3:1>: PWM Output Override bits

1 = Output on PWMx I/O pin is controlled by the PWM generator

0 = Output on PWMx I/O pin is controlled by the value in the corresponding POUTxH:POUTxL bit

bit 7-6 Unimplemented: Read as ‘0’

bit 5-0 POUTxH<3:1>:POUTxL<3:1>: PWM Manual Output bits

1 = PWMx I/O pin is driven active when the corresponding POVDxH:POVDxL bit is cleared

0 = PWMx I/O pin is driven inactive when the corresponding POVDxH:POVDxL bit is cleared

Note 1: PWM2 supports only 1 PWM I/O pin pair.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PDC1<15:8>

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PDC1<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-0 PDC1<15:0>: PWM Duty Cycle 1 Value bits

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PDC2<15:8>

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PDC2<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-0 PDC2<15:0>: PWM Duty Cycle 2 Value bits

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PDC3<15:8>

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PDC3<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-0 PDC3<15:0>: PWM Duty Cycle 3 Value bits

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

16.0 QUADRATURE ENCODER

INTERFACE (QEI) MODULE This section describes the Quadrature Encoder Inter-

face (QEI) module and associated operationa l modes.

The QEI module provides the interface to incremental

encoders for obtaining mechani cal position data.

The operational features of the QEI include:

• Three input channels for two phase signals and

index pulse

• 16-bit up/down position counte r

• Count direction status

• Position Measurement (x2 and x4) mode

• Programmable digital noise filters on inputs

• Alternate 16-bit Timer/Counter mode

• Quadrature Encoder Interface interrupts

These operating modes a re determined by setting the

appropriate bits, QEIM<2:0> in (QEIxCON<10:8>).

Figure 16-1 depicts the Quadrature Encoder Interface

block diagram.

FIGURE 16-1: QUADRATURE ENCODER INTERFACE BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of devices. It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 15. “Quadrature Encoder

Interface (QEI)” (DS70208) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

16-bit Up/Down Counter

Comparator/

Max Count Register

QEAx

INDXx

1Up/Down

Existing Pin Logic

UPDNx

QEBx

QEIM<2:0>

Mode Select

(POSCNT)

(MAXCNT)

PCDOUT

QEIIF

Event

Flag

Reset

Equal

TCY

TQCS TQCKPS<1:0>

TQGATE

QEIM<2:0>

Sleep Input

UPDN_SRC

QEIxCON<11> Zero Detect

Synchronize

Det 1, 8, 64, 256

Prescaler

Quadrature

Encoder

Interface Logic

Programmable

Digital Filter

Programmable

Digital Filter

Programmable

Digital Filter

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

16.1 Control and Status Registers

The QEI module has four user-accessible registers,

accessible in either Byte or Word mode:

• Control/S tatus Register (QEICON) – Allows

control of the QEI operation and status flags

indicating the module state.

• Digital Filter Control Register (DFLTCON) –

Allows control of the digital input filter operation.

• Position Count Register (POSCNT) – Allows

reading and writing of the 16-bit position counter.

• Maximum Count Register (MAXCNT) – Holds a

value that is compared to the POSCNT counter in

some operations.

Note: The POSCNT register allows byte

accesses. However, reading the register

in Byte mode can result in partially

updated values in subsequent reads.

Either use Word mode reads/writes, or

ensure that the counter is not counting

during Byte operations.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0

CNTERR — QEISIDL INDEX UPDN QEIM<2:0>

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

SWPAB PCDOUT TQGATE TQCKPS<1:0> POSRES TQCS UPDN_SRC

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 CNTERR: Count Error Status Flag bit

1 = Position count error has occurred

0 = No position count error has occurred

Note: CNTERR flag only applies when QEIM<2:0> = ‘110’ or ‘100’.

bit 14 Unimplemented: Read as ‘0’

bit 13 QEISIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operati on in Idle mode

bit 12 INDEX: Index Pin State Status bit (Read-Only)

1 = Index pin is High

0 = Index pin is Low

bit 11 UPDN: Position Counter Direc tion Status bit

1 = Position Counter Direction is positive (+)

0 = Position Counter Direction is negative (-)

(Read-only bit when QEIM<2:0> = ‘1XX’)

(Read/Write bit when QEIM<2:0> = ‘001’)

bit 10-8 QEIM<2:0>: Quadrature Encoder Interface Mode Select bits

111 = Quadrature Encoder Interface enabled (x4 mode) with position counter reset by match

(MAXCNT)

110 = Quadrature Encoder Interface enabled (x4 mode) with Index Pulse reset of position counter

101 = Quadrature Encoder Interface enabled (x2 mode) with position counter reset by match

(MAXCNT)

100 = Quadrature Encoder Interface enabled (x2 mode) with Index Pulse reset of position counter

011 = Unused (Module disabled)

010 = Unused (Module disabled)

001 = Starts 16-bit Timer

000 = Quadrature Encoder Interface/Timer off

bit 7 SWPAB: Phase A and Phase B Input Swap Select bit

1 = Phase A and Phase B inputs swapped

0 = Phase A and Phase B inputs not swapped

bit 6 PCDOUT: Position Counter Direction State Output Enable bit

1 = Position Counter Direction Status Output Enable (QEI logic controls state of I/O pin)

0 = Position Counter Direction Status Output Disabled (Normal I/O pin operation)

bit 5 TQGATE: Timer Gated Time Accumulation Enable bit

1 = Timer gated time accumulation enabled

0 = Timer gated time accumulation disabled

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 4-3 TQCKPS<1:0>: Timer Input Clock Prescale Select bits

11 = 1:256 prescale value

10 = 1:64 prescale value

01 = 1:8 prescale value

00 = 1:1 prescale value

(Prescaler utilized for 16-bit Timer mode only)

bit 2 POSRES: Position Counter Reset Enable bit

1 = Index Pulse resets Position Counter

0 = Index Pulse does not reset Position Counter

Note: Bit applies only when QEIM<2:0> = 100 or 110.

bit 1 TQCS: Timer Clock Source Select bit

1 = External clock from pin QEA (on the rising edge)

0 = Internal clock (TCY)

bit 0 UPDN_SRC: Position Counter Direction Selection Con trol bit

1 = QEB pin state defines position counter direction

0 = Control/Status bit, UPDN (QEICON<11>), defines timer counter (POSCNT) direction

Note: When configured for QEI mode, control bit is a ‘don’t care’.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — —IMV<1:0>CEID

bit 15 bit 8

R/W-0 R/W-0 U-0 U-0 U-0 U-0

QEOUT QECK<2:0> — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-11 Unimplemented: Read as ‘0’

bit 10-9 IMV<1:0>: Index Match Value bits – These bits allow the user application to specify the state of the

QEA and QEB input pins during an Index pul se when the POSxCNT register is to be reset.

In 4X Quadrature Count Mode:

IMV1 = Required State of Phase B input signal for match on index pulse

IMV0 = Required State of Phase A input signal for match on index pulse

In 2X Quadrature Count Mode:

IMV1 = Selects Phase input signal for Index state match (0 = Phase A, 1 = Phase B)

IMV0 = Required state of the selected Phase input signal for match on index pulse

bit 8 CEID: Count Error Interrupt Disable bit

1 = Interrupts due to count errors are disabled

0 = Interrupts due to count errors are enabl ed

bit 7 QEOUT: QEA/QEB/INDX Pin Digital Filter Output Enable bit

1 = Digital filter outputs enabled

0 = Digital filter outputs disabled (normal pin operation)

bit 6-4 QECK<2:0>: QEA/QEB/INDX Digital Filter Clock Divide Select Bits

111 = 1:256 Clock Divide

110 = 1:128 Clock Divide

101 = 1:64 Clock Divide

100 = 1:32 Clock Divide

011 = 1:16 Clock Divide

010 = 1:4 Clock Divide

001 = 1:2 Clock Divide

000 = 1:1 Clock Divide

bit 3-0 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

17.0 SERIAL PERIPHERAL

INTERFACE (SPI) The Serial Peripheral Interface (SPI) module is a syn-

chronous seri al interface useful f or communicating with

other peripheral or microcontroller devices. These

peripheral devices can be serial EEPROMs, shif t regis-

ters, display drivers, analog-to-digital converters, etc.

The SPI module is compatible with SPI and SIOP from

Motorola®.

Each SPI module consists of a 16-bit shift register,

SPIxSR (where x = 1 or 2), used for shifting data in and

out, and a buffer register, SPIxBUF. A control register,

SPIxCON, configures the module. Additionally , a status

The serial interface consists of these four pins:

• SDIx (serial data input)

• SDOx (serial data output)

• SCKx (shift clock input or output)

• SSx (active-low slave select)

In Master mode operation, SCK is a clock output. In

Slave mode, it is a clock input.

FIGURE 17-1: SPI MODULE BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of devices. It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 18. “Serial Peripheral

Interface (SPI)” (DS70206) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available on the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Internal Data Bus

SDIx

SDOx

SSx

SCKx

SPIxSR

bit 0

Shift Control

Edge

Select

FCY

Primary

1:1/4/16/64

Enable

Prescaler

Sync

SPIxBUF

Control

Transfer

Write SPIxBUF

Read SPIxBUF

SPIxCON1<1:0>

SPIxCON1<4:2>

Master Clock

Clock

Control

Secondary

Prescaler

1:1 to 1:8

SPIxRXB SPIxTXB

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0

SPIEN — SPISIDL — — — — —

bit 15 bit 8

U-0 R/C-0 U-0 U-0 U-0 U-0 R-0 R-0

— SPIROV — — — — SPITBF SPIRBF

bit 7 bit 0

Legend: C = Clearable bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 SPIEN: SPIx Enable bit

1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins

0 = Disables module

bit 14 Unimplemented: Read as ‘0’

bit 13 SPISIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operati on in Idle mode

bit 12-7 Unimplemented: Read as ‘0’

bit 6 SPIROV: Receive Overflow Flag bit

1 = A new byte/word is completely received and discarded. The user software has not read the

previous data in the SPIxBUF register

0 = No overflow has occurred.

bit 5-2 Unimplemented: Read as ‘0’

bit 1 SPITBF: SPIx Transmit Buffer Full Status bit

1 = Transmit not yet started, SPIxTXB is full

0 = Transmit started, SPIxTXB is empty

Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB.

Automatically cleared in hardware when SPIx modu le transfers data from SPIxTXB to SPIxSR.

bit 0 SPIRBF: SPIx Receive Buffer Full Status bit

1 = Receive complete, SPIxRXB is full

0 = Receive is not complete, SPIxRXB is empty

Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB.

Automatically cleared in hardware when core reads SPIxBUF locati on, reading SPIxRXB.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — DISSCK DISSDO MODE16 SMP CKE(1)

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

SSEN(2) CKP MSTEN SPRE<2:0>(3) PPRE<1:0>(3)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’

bit 12 DISSCK: Disable SCKx pin bit (SPI Master modes only)

1 = Internal SPI clock is disabled, pin functions as I/O

0 = Internal SPI clock is enabled

bit 11 DISSDO: Disable SDOx pin bit

1 = SDOx pin is not used by module; pin functions as I/O

0 = SDOx pin is controlled by the module

bit 10 MODE16: Word/Byte Communication Select bit

1 = Communication is word-wide (16 bits)

0 = Communication is byte-wide (8 bits)

bit 9 SMP: SPIx Data Input Sample Phase bit

Master mode:

1 = Input data sampled at end of data output time

0 = Input data sampled at middle of data output time

Slave mode:

SMP must be cleared when SPIx is used in Slave mode.

bit 8 CKE: SPIx Clock Edge Select bit(1)

1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6)

0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6)

bit 7 SSEN: Slave Select Enable bit (Slave mode)(2)

1 = SSx pin used for Slave mode

0 = SSx pin not used by module. Pin controlled by port function

bit 6 CKP: Clock Polarity Select bit

1 = Idle state for clock is a high level; active state is a low level

0 = Idle state for clock is a low level; active state is a high level

bit 5 MSTEN: Master Mode Enable bit

1 = Master mode

0 = Slave mode

Note 1: The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes

(FRMEN = 1).

2: This bit must be cleared when FRMEN = 1.

3: Do not set both Primary and Secondary prescalers to a value of 1:1.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 4-2 SPRE<2:0>: Secondary Prescale bits (Master mode)(3)

111 = Secondary prescale 1:1

110 = Secondary prescale 2:1

•

000 = Secondary prescale 8:1

bit 1-0 PPRE<1:0>: Primary Presca le bits (Master mode)(3)

11 = Primary prescale 1:1

10 = Primary prescale 4:1

01 = Primary prescale 16:1

00 = Primary prescale 64:1

Note 1: The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes

(FRMEN = 1).

2: This bit must be cleared when FRMEN = 1.

3: Do not set both Primary and Secondary prescalers to a value of 1:1.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0

FRMEN SPIFSD FRMPOL — — — — —

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0

— — — — — — FRMDLY —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 FRMEN: Framed SPIx Support bit

1 = Framed SPIx support enabled (SSx pin used as frame sync pulse input/output)

0 = Framed SPIx support disabled

bit 14 SPIFSD: Frame Sync Pulse Direction Control bit

1 = Frame sync pulse input (slave)

0 = Frame sync pulse output (master)

bit 13 FRMPOL: Frame Sync Pulse Polarity bit

1 = Frame sync pulse is active-high

0 = Frame sync pulse is active-low

bit 12-2 Unimplemented: Read as ‘0’

bit 1 FRMDLY: Frame Sync Pulse Edge Select bit

1 = Frame sync pulse coincides with first bit clock

0 = Frame sync pulse precedes first bit clock

bit 0 Unimplemented: This bit must not be set to ‘1’ by the user application

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

18.0 INTER-INTEGRATED

CIRCUIT™ (I2C™)

The Inter-Integrated Circuit (I2C) module provides

complete hardware support for both Slave and

Multi-Master modes of the I2C serial communication

standard, with a 16-bit interface.

The I2C module has a 2-pin in terface:

• The SCLx pin is clock

• The SDAx pin is data

The I2C module offers the following key features:

•I

2C interface supporting both Master and Slave

modes of operation

•I

2C Slave mode supports 7-bit and 10-bit

addressing

•I

2C Master mode supports 7-bit and 10-bit

addressing

•I

2C port allows bidirectional transfers between

master and slaves

• Serial clock synchronization for I2C port can be

used as a handshake mechanism to suspend and

resume serial transfer (SCLREL control)

•I

2C supports multi-master operation, detects bus

collision and arbitrates accordingly

18.1 Operating Modes

The hardware fully implements all the master and slave

functions of the I2C Standard and Fast mode

specifications, as well as 7-bit and 10-bit addressing.

The I2C module can operate either as a slave or a

master on an I2C bus.

The following types of I2C operation are supported:

•I

2C slave operation with 7-bit addressing

•I

2C slave operation with 10-bit addressing

•I

2C master operation with 7-bit or 10-bit addressing

For details about the communication sequence in each

of these modes, refer to the “dsPIC33F/PIC24H Family

Reference Manual”. Please see the Microchip web site

(www.microchip.com) for the latest dsPIC33F/PIC24H

Family Reference Manual sections.

18.2 I2C Registers

I2CxCON and I2CxSTAT are control and status

registers, respectively. The I2CxCON register is

readable and writable. The lower six bits of I2CxSTAT

are read-only. The remaining bits of the I2CSTAT are

read/write:

• I2CxRSR is the shift register used for shifting

data.

• I2CxRCV is the receive buffer and the register to

which data bytes are written, or from which data

bytes are read.

• I2CxTRN is the transmit register to which bytes

are written during a transmit operation.

• The I2CxADD register holds the slave address.

• A status bit, ADD10, indicates 10-bit Address

mode.

• The I2CxBRG acts as the Baud Rate Generator

(BRG) reload value.

In receive operations, I2CxRSR and I2CxRCV together

form a double-buffered receiver. When I2CxRSR

receives a complete byte, it is transferred to I2CxRCV,

and an interrupt pulse is generated.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of devices. It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 19. “Inter-Integrated Circuit™

(I2C™)” (DS70195) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available from the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 18-1: I2C™ BLOCK DIAG RAM (X = 1)

Internal

Data Bus

SCLx

SDAx

Shift

Match Detect

I2CxADD

Start and Stop

Bit Detect

Clock

Address Match

Clock

Stretching

I2CxTRN LSb

Shift Clock

BRG Down Counter

Reload

Control

TCY/2

Start and Stop

Bit Generation

Acknowledge

Generation

Collision

Detect

I2CxCON

I2CxSTAT

Control Logic

Read

LSb

Write

Read

I2CxBRG

I2CxRSR

Write

Read

Write

Read

Write

Read

Write

Read

Write

Read

I2CxMSK

I2CxRCV

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U -0 R/W-0 R/W- 1 HC R/W-0 R/W- 0 R/W-0 R/W-0

I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC

GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN

bit 7 bit 0

Legend: U = Unimplemented bit, read as ‘0’

R = Readable bit W = Writable bit HS = Set in hardware HC = Cleared in hard ware

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 I2CEN: I2Cx Enable bit

1 = Enables the I2Cx module and co nfigures the SDAx and SCLx pins as serial port pins

0 = Disables the I2Cx module. All I2C pins are controlled by port functions

bit 14 Unimplemented: Read as ‘0’

bit 13 I2CSIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters an Idle mode

0 = Continue module operati on in Idle mode

bit 12 SCLREL: SCLx Release Control bit (when operating as I2C slave)

1 = Release SCLx clock

0 = Hold SCLx clock low (clock stretch)

If STREN = 1:

Bit is R/W (i.e., software can write ‘0’ to initiate stretch and write ‘1’ to release clock). Hardware clear

at beginning of slave transmission. Hardware clear at end of slave reception.

If STREN = 0:

Bit is R/S (i.e., software can only write ‘1’ to release clock). Hardware clear at beginning of slave

transmission.

bit 11 IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit

1 = IPMI mode is enabled; all addresses Acknowledged

0 = IPMI mode disabled

bit 10 A10M: 10-bit Slave Address bit

1 = I2CxADD is a 10-bit slave address

0 = I2CxADD is a 7-bit slave address

bit 9 DISSLW: Disable Slew Rate Control bit

1 = Slew rate control disabled

0 = Slew rate control enabled

bit 8 SMEN: SMBus Input Levels bit

1 = Enable I/O pin thresholds compliant with SMBus specification

0 = Disable SMBus input thresholds

bit 7 GCEN: General Call Enable bit (when operating as I 2C slave)

1 = Enable interrupt when a general call address is received in the I2CxRSR

(module is enabled for reception)

0 = General call address disabled

bit 6 STREN: SCLx Clock S tretch Enable bit (when operating as I2C slave)

Used in conjunction with SCLREL bit.

1 = Enable software or receive clock stretching

0 = Disable software or receive clock stretching

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 5 ACKDT: Acknowledge Data bit (when operating as I2C master, applicable during master receive)

Value that will be transmitted when the software initiates an Acknowledge sequence.

1 = Send NACK during Acknowledge

0 = Send ACK during Acknowledge

bit 4 ACKEN: Acknowledge Sequence Enable bit

(when operating as I2C master, applicable during master recei ve)

1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit.

Hardware clear at end of master Acknowledge sequence

0 = Acknowledge sequence not in progress

bit 3 RCEN: Receive Enable bit (when operating as I2C master)

1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of maste r receiv e data byte

0 = Receive sequence not in progres s

bit 2 PEN: Stop Condition Enable bit (when operating as I2C master)

1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence

0 = Stop condition not in progress

bit 1 RSEN: Repeated Start Condition Enable bit (when operating as I2C master)

1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of

master Repeated Start sequence

0 = Repeated Start condition not in progress

bit 0 SEN: Start Condition Enable bit (when operating as I2C master)

1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence

0 = Start condition not in progress

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R-0 HSC R-0 HSC U-0 U-0 U-0 R/C-0 HS R-0 HSC R-0 HSC

ACKSTAT TRSTAT — — — BCL GCSTAT ADD10

bit 15 bit 8

R/C-0 HS R/C-0 HS R-0 HSC R/C-0 HSC R/C-0 HSC R-0 HSC R-0 HSC R-0 HSC

IWCOL I2COV D_A P S R_W RBF TBF

bit 7 bit 0

Legend: U = Unimplemented bit, read as ‘0’ C = Clear only bit

R = Readable bit W = Writable bit HS = Set in hardware HSC = Hardware set/cleared

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ACKSTAT: Acknowledge Status bit

(when operating as I2C master, applicable to master transmit operation)

1 = NACK received from slave

0 = ACK received from slave

Hardware set or clear at end of slave Acknowledge.

bit 14 TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation)

1 = Master transmit is in progress (8 bits + ACK)

0 = Master transmit is not in progress

Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge.

bit 13-11 Unimplemented: Read as ‘0’

bit 10 BCL: Master Bus Collision Detect bit

1 = A bus collision has been detected duri ng a master operation

0 = No collision

Hardware set at detection of bus collision.

bit 9 GCSTAT: General Call Status bit

1 = General call address was received

0 = General call addre ss was not received

Hardware set when address matches general call address. Hardware clear at Stop detection.

bit 8 ADD10: 10-bit Address Status bit

1 = 10-bit address was matched

0 = 10-bit address was not matched

Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection.

bit 7 IWCOL: Write Collision Detect bit

1 = An attempt to write the I2CxTRN register failed because the I2C module is busy

0 = No collision

Hardware set at occurrence of write to I2CxTRN while busy (clea red by software).

bit 6 I2COV: Receive Overflow Flag bit

1 = A byte was received while the I2CxRCV register is still holding the previous byte

0 = No overflow

Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).

bit 5 D_A: Data/Address bit (when operating as I2C slave)

1 = Indicates that the last byte received was data

0 = Indicates that the last byte received was device address

Hardware clear at device address match. Hardware set by reception of slave byte.

bit 4 P: Stop bit

1 = Indicates that a Stop bit has been detected last

0 = S t op bit was not detected last

Hardware set or clear when Start, Repeated Start or Stop detected.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 3 S: Start bit

1 = Indicates that a Start (or Repeated Start) bit has been detected last

0 = St art bit was not detected last

Hardware set or clear when Start, Repeated Start or Stop detected.

bit 2 R_W: Read/Write Information bit (when operating as I2C slave)

1 = Read – indicates data transfer is output from slave

0 = Write – indicates data transfer is input to slave

Hardware set or clear after reception of I2C device address byte.

bit 1 RBF: Receive Buffer Full Status bit

1 = Receive complete, I2CxRCV is full

0 = Receive not complete, I2CxRCV is empty

Hardware set when I2CxRCV is written with received byte. Hardware clear when software

reads I2CxRC V.

bit 0 TBF: Transmit Buffer Full Status bit

1 = Transmit in progress, I2CxTRN is full

0 = Transmit complete, I2CxTRN is empty

Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0

— — — — — — AMSK9 AMSK8

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

AMSK7 AMSK6 AMSK5 AMSK4 AMSK3 AMSK2 AMSK1 AMSK0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-10 Unimplemented: Read as ‘0’

bit 9-0 AMSKx: Mask for Address bit x Select bit

1 = Enable masking for bit x of incoming message address; bit match not required in this position

0 = Disable masking for bit x; bit match required in this position

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

19.0 UNIVERSAL ASYNCHRONOUS

RECEIVER TRANSMITTER

(UART)

The Universal Asynchronous Receiver Transmitter

(UART) module is one of the serial I/O modules

available in the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 device family. The UART is a

full-duplex asynchronous system that can

communicate with peripheral devices, such as

personal computers, LIN, and RS-232 and RS-485

interfaces. The module a lso supports a hardware flow

control option with the UxCTS and UxRTS pins and

also includes an IrDA® encoder and decoder.

The primary features of the UART module are:

• Full-Duplex, 8-bit or 9-bit Data Transmission

through the UxTX and UxRX pins

• Even, Odd or No Parity Opti ons (for 8-bit data)

• One or two stop bits

• Hardware flow control option with UxCTS an d

UxRTS pins

• Fully integrated Baud Rate Generator with 16-bit

prescaler

• Baud rates ranging from 10 Mbps to 38 bps at 40

MIPS

• 4-deep First-In First-Out (FIFO) Transmit Data

buffer

• 4-deep FIFO Receive Data buffer

• Parity, framing and buffer overrun error detection

• Support for 9-bit mode with Address Detect

(9th bit = 1)

• Transmit and Receive interrupts

• A separate interrupt for all UART error conditions

• Loopback mode for diagnostic support

• Support for sync and break charac ters

• Support for automatic baud rate detection

•IrDA

® encoder and decoder logic

• 16x baud clock output for IrDA® support

A simplified block diagram of the UART module is

shown in Figure 19-1. The UART module consists of

these key hardware elements:

• Baud Rate Generator

• Asynchronous Transmitter

• Asynchronous Receiver

FIGURE 19-1: UART SIMPLIFIED BLOCK DIAGRAM

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of devices. It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 17. “UART” (DS70188) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available on the Micro-

chip web site (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

UxRX

Hardware Flow Control

UART Receiver

UART Transmitter UxTX

Baud Rate Generator

UxRTS/BCLK

IrDA®

UxCTS

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

UARTEN(1) — USIDL IREN(2) RTSMD —UEN<1:0>

bit 15 bit 8

R/W-0 HC R/W-0 R/W-0, HC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

WAKE LPBACK ABAUD URXINV BRGH PDSEL<1:0> STSEL

bit 7 bit 0

Legend: HC = Hardware Clearable

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 UARTEN: UARTx Enabl e bi t(1)

1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0>

0 = UAR Tx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption minimal

bit 14 Unimplemented: Read as ‘0’

bit 13 USIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operation in Idle mode

bit 12 IREN: IrDA® Encoder and Decoder Enable bit(2)

1 = IrDA encoder and decoder ena bled

0 = IrDA encoder and decoder disabled

bit 11 RTSMD: Mode Selection for UxRTS Pin bit

1 =UxRTS

pin in Simplex mode

0 =UxRTS pin in Flow Control mode

bit 10 Unimplemented: Read as ‘0’

bit 9-8 UEN<1:0>: UARTx Pin Enable bits

11 = UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin controlled by port latches

10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used

01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches

00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by

port latches

bit 7 WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit

1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge; bit cleared

in hardware on following rising edge

0 = No wake-up enable d

bit 6 LPBACK: UARTx Loopback Mode Select bit

1 = Enable Loopback mode

0 = Loopback mode is disabled

bit 5 ABAUD: Auto-Baud Enab le bit

1 = Enable baud rate measurement on the next character – re quires reception of a Syn c field (55h)

before other data; cleared in hardware upon completi on

0 = Baud rate measurement disabled or completed

bit 4 URXINV: Receive Polarity Inversion bit

1 = UxRX Idle state is ‘0’

0 = UxRX Idle state is ‘1’

Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for

information on enabling the UART module for receive or transmit operation.

2: This feature is only available for the 16x BRG mode (BRGH = 0).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 3 BRGH: High Baud Rate Enable bit

1 = BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode)

0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode)

bit 2-1 PDSEL<1:0>: Parity and Data Selection bits

11 = 9-bit data, no parity

10 = 8-bit data, odd parity

01 = 8-bit data, even parity

00 = 8-bit data, no parity

bit 0 STSEL: Stop Bit Se lection bit

1 = Two Stop bits

0 = One Stop bit

Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for

information on enabling the UART module for receive or transmit operation.

2: This feature is only available for the 16x BRG mode (BRGH = 0).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 R/W-0 U-0 R/W-0 HC R/W-0 R-0 R-1

UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN(1) UTXBF TRMT

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R-1 R-0 R-0 R/C-0 R-0

URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA

bit 7 bit 0

Legend: HC = Hardware cleared C = Clear only bit

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15,13 UTXISEL<1:0>: Transmission Interrupt Mode Selection bits

11 = Reserved; do not use

10 = Interrupt when a character is transferred to the Transmit Shift Register, and as a result, the

transmit buffer becomes empty

01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit

operations are completed

00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is

at least one character open in the transmit buffer)

bit 14 UTXINV: T ransmit Polarity Inversion bit

If IREN = 0:

1 = UxTX Idle state is ‘0’

0 = UxTX Idle state is ‘1’

If IREN = 1:

1 =IrDA

® encoded UxTX Idle state is ‘1’

0 =IrDA

® encoded UxTX Idle state is ‘0’

bit 12 Unimplemented: Read as ‘0’

bit 11 UTXBRK: Transmit Break bit

1 = Send Sync Break on next transmission – S tart bit, followed by twelve ‘0’ bits, followed by Stop bit;

cleared by hardware upon completion

0 = Sync Break transmission disabled or completed

bit 10 UTXEN: Transmit Enable bit(1)

1 = Transmit enabled, UxTX pin controlled by UARTx

0 = Transmit disabled, any pending tra nsmission is aborted an d buffer is reset. UxTX pin controlled

by port

bit 9 UTXBF: Transmit Buf f er Full Status bit (read-only)

1 = Transmit buffer is full

0 = Transmit buffer is not full, at least one more character can be written

bit 8 TRMT: Transmit Shift Register Empty bit (read-only)

1 = Transmit Shif t Register is em pty and transmit buf fer is empty (the l ast transmission has comp leted)

0 = Transmit Shift Register is not empty, a transmission is in progress or queued

bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bits

11 = Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters)

10 = Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters)

0x = Interrupt is set when any character is receiv ed and transferred from the UxRSR to the receive

buffer. Receive buffer has one or more characters

Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for

information on enabling the UART module for transmit operation.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 5 ADDEN: Address Character Detect bit (bit 8 of received data = 1)

1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect

0 = Address Detect mode disabled

bit 4 RIDLE: Receiver Idle bit (read-on ly)

1 = Receiver is Idle

0 = Receiver is active

bit 3 PERR: Parity Error Status bit (read-only)

1 = Parity error has been detected for the current character (chara cter at the top of the receive FIFO)

0 = Parity error has not been detected

bit 2 FERR: Framing Error Status bit (read-only)

1 = Framing error has been detected for the current character (character at the top of the receive

FIFO)

0 = Framing error has no t been detected

bit 1 OERR: Receive Buffer Overrun Error Status bit (read/clear only)

1 = Receive buffer has overflowed

0 = Receive buffer has not overflowed. Clearing a previously set OERR bit (1→0 transition) will reset

the receiver buffer and the UxRSR to the empty state

bit 0 URXDA: Receive Buffer Data Available bit (read-only)

1 = Receive buffer has data, at least one more character can be read

0 = Receive buffer is empty

Note 1: Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for

information on enabling the UART module for transmit operation.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

20.0 10-BIT/12-BIT

ANALOG-TO-DIGITAL

CONVERTER (ADC)

The dsPIC33FJ32MC202/204 an d dsPIC33FJ16MC304

devices have up to nine Analog-to-Digital Converter

(ADC) module input channels.

The AD12B bit (AD1CON1<10>) allows each of the

ADC modules to be configured as either a 10-bit,

4 sample-and-hold ADC (default configuration), or a

12-bit, 1 sample-and-hold ADC.

20.1 Key Features

The 10-bit ADC configuration has the following key

features:

• Successive Approximation (SAR) conversion

• Conversion speeds of up to 1.1 Msps

• Up to 9 analog input pins

• External voltage reference input pins

• Simultaneous sampling of up to four analog input

pins

• Automatic Channel Scan mode

• Selectable conversion trigger source

• Selectable Buffer Fill modes

• Four result alignment options (signed/unsigned,

fractional/integer)

• Operation during CPU Sleep and Idle modes

• 16-word conversion result buffer

The 12-bit ADC configuration supports all the above

features, except:

• In the 12-bit configuration, conversion speeds of

up to 500 ksps are supported.

• There is only 1 sample-and-h old amplifier in the

12-bit configuration, so simultaneous sampling of

multiple channels is not supported.

Depending on the particular device pinout, the ADC

can have up to nine analog input pins, designated AN0

through AN8. In addition, there are two analog input

pins for external voltage reference connections. These

voltage reference inputs can be shared with other

analog input pins.

The actual number of analog input pins and external

voltage reference input configuration will depend on the

specific device. Refer to the device data sheet for

further details.

A block diagram of the ADC is shown in Figure 20-1.

20.2 ADC Initialization

To configure the ADC module:

1. Select port pins as analog inputs

(AD1PCFGH<15:0> or AD1PCFGL<15:0>).

2. Select voltage reference source to match

expected range on analog inputs

(AD1CON2<15:13>).

3. Select the analog conversion clock to match the

desired data rate with the processor clock

(AD1CON3<7:0>).

4. Determine how many sample-and-hold chan-

nels will be used (AD1CON2<9:8> and

AD1PCFGH<15:0> or AD1PCF GL<15:0>).

5. Select the appropriate sample/conversion

sequence (AD1CON1<7:5> and

AD1CON3<12:8>).

6. Select the way conversion results are presented

in the buffer (AD1CON1<9:8>).

7. Turn on the ADC module (AD1CON1<15>).

8. Configure ADC interrupt (if required):

a) Clear the AD1IF bit.

b) Select the ADC interrupt priority.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family of devices. It

is not intended to be a comprehensive

reference source. To complement the

information in this data sheet, refer to

Section 16. “Analog-to-Digital

Converter (ADC)” (DS70183) of the

“dsPIC33F/PIC24H Family Reference

Manual”, which is available on the

Microchip website (www.microchip.com).

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Note: The ADC module must be disabled before

the AD12B bit can be modified.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 20-1: ADC1 MODULE BLOCK DIAGRAM FOR dsPIC33FJ16MC304 AND

dsPIC33FJ32MC204 DEVICES

SAR ADC

S/H0

S/H1

ADC1BUF0

ADC1BUF1

ADC1BUF2

ADC1BUFF

ADC1BUFE

AN0

AN8

AN1

VREFL

CH0SB<4:0>

CH0NA CH0NB

AN0

AN3

CH123SA

VREFL

CH123SB

CH123NA CH123NB

AN6

S/H2

AN1

AN4

CH123SA

VREFL

CH123SB

CH123NA CH123NB

AN7

S/H3

AN2

AN5

CH123SA

VREFL

CH123SB

CH123NA CH123NB

AN8

CH0

CH0SA<4:0>

CHANNEL

SCAN

CSCNA

Alternate

Input Selection

VREFH VREFL

CH1(2)

CH2(2)

CH3(2)

Note 1: VREF+, VREF- inputs can be multiplexed with other analog inputs.

2: Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation.

AVDD AVSS

VREF-(1)

VREF+(1)

VCFG<2:0>

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 20-2: ADC1 MODULE BLOCK DIAGRAM FOR dsPIC33FJ32MC202 DEVICE

SAR ADC

S/H0

S/H1

ADC1BUF0

ADC1BUF1

ADC1BUF2

ADC1BUFF

ADC1BUFE

AN0

AN5

AN1

VREFL

CH0SB<4:0>

CH0NA CH0NB

AN0

AN3

CH123SA

VREFL

CH123SB

CH123NA CH123NB

S/H2

AN1

AN4

CH123SA

VREFL

CH123SB

CH123NA CH123NB

S/H3

AN2

AN5

CH123SA

VREFL

CH123SB

CH123NA CH123NB

CH1(2)

CH0

CH2(2)

CH3(2)

CH0SA<4:0>

CHANNEL

SCAN

CSCNA

Alternate

VREF+(1) AVDD AVSS

VREF-(1)

Note 1: VREF+, VREF- inputs can be multi plexed with other analog inputs.

2: Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation.

Input Selection

VREFH VREFL

VCFG<2:0>

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 20-3: ADC CONVERSION CLOCK PERIOD BLOCK DIAGRAM

ADC Internal

RC Clock(2)

TOSC(1) X2

ADC Conversion

Clock Multiplier

1, 2, 3, 4, 5,..., 64

AD1CON3<15>

TCY

TAD

AD1CON3<5:0>

Note 1: Refer to Figure 8-2 for the derivation of FOSC when the PLL is enabled. If the PLL is not used, FOSC is equal

to the clock frequency. TOSC = 1/FOSC.

2: See the ADC Electrical Characteristics for the exact RC clock value.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0

ADON —ADSIDL—— AD12B FORM<1:0>

bit 15 bit 8

R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0

HC,HS R/C-0

HC, HS

SSRC<2:0> — SIMSAM ASAM SAMP DONE

bit 7 bit 0

Legend: HC = Cleared by hardware HS = Set by hardware C = Clear only bit

R = Readable bit W = Writable bit U = Unimplemented bit, rea d as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ADON: ADC Operating Mode bit

1 = ADC module is operating

0 = ADC is off

bit 14 Unimplemented: Read as ‘0’

bit 13 ADSIDL: Stop in Idle Mode bit

1 = Discontinue module operation when device enters Idle mode

0 = Continue module operation in Idle mode

bit 12-11 Unimplemented: Read as ‘0’

bit 10 AD12B: 10-bit or 12-bit Operatio n Mode bit

1 = 12 - bit, 1-channel ADC operation

0 = 10-bit, 4-channel ADC operation

bit 9-8 FORM<1:0>: Data Output Format bits

For 10-bit operation:

11 = Signed fractional (DOUT = sddd dddd dd00 0000, where s = .NOT.d<9>)

10 = Fractional (DOUT = dddd dddd dd00 0000)

01 = Signed integer (DOUT = ssss sssd dddd dddd, where s = .NOT.d<9>)

00 = Integer (DOUT = 0000 00dd dddd dddd)

For 12-bit operation:

11 = Signed fractional (DOUT = sddd dddd dddd 0000, where s = .NOT.d<11>)

10 = Fractional (DOUT = dddd dddd dddd 0000)

01 = Signed Integer (DOUT = ssss sddd dddd dddd, where s = .NOT.d<11>)

00 = Integer (DOUT = 0000 dddd dddd dddd)

bit 7-5 SSRC<2:0>: Sample Clock Source Select bits

111 = Internal counter ends samp ling and starts conversion (auto-convert)

110 = Reserved

101 = Motor Control PW M2 interval ends sampling and starts conversion

100 = Reserved

011 = Motor Control PW M1 interval ends sampling and starts conversion

010 = GP timer 3 compare ends sampling and starts conversion

001 = Active transition on INT0 pin ends sampling and starts conversion

000 = Clearing sample bit ends sampling and starts conversion

bit 4 Unimplemented: Read as ‘0’

bit 3 SIMSAM: Simultaneous Sample Select bit (applicable only when CHPS<1:0> = 01 or 1x)

When AD12B = 1, SIMSAM is: U-0, Unimplemented, Read as ‘0’

1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x); or

Samples CH0 and CH1 simultaneously (when CHPS<1:0> = 01)

0 = Samples multiple channels individually in sequence

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 2 ASAM: ADC Sample Auto-Start bit

1 = Sampling begins immediately after last conversion. SAMP bit is auto-set

0 = Sampling begins when SAMP bit is set

bit 1 SAMP: ADC Sample Enable bit

1 = ADC sample-and-hold amplifiers are sampling

0 = ADC sample-and-hold amplifiers are holding

If ASAM = 0, software can write ‘1’ to begin sampling. Automatically set by hardware if ASAM = 1.

If SSRC = 000, software can write ‘0’ to end sampling and start conversion. If SSRC ≠ 000,

automatically cleared by hardware to end sampling and start conversion.

bit 0 DONE: ADC Conversion S tatus bit

1 = ADC conversion cycle is completed

0 = ADC conversion not started or in progress

Automatically set by hardware when ADC conversion is complete. Software can write ‘0’ to clear

DONE status (software not allowed to write ‘1’). Clearing this bit will NOT affect any operation in

progress. Automatically cleared by hardware at start of a new conversion.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0

VCFG<2:0> —— CSCNA CHPS<1:0>

bit 15 bit 8

R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

BUFS — SMPI<3:0> BUFM ALTS

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, rea d as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 VCFG<2:0>: Converter Voltage Reference Configuration bits

bit 12-11 Unimplemented: Read as ‘0’

bit 10 CSCNA: Scan Input Selections for CH0+ during Sample A bit

1 = Scan inputs

0 = Do not scan input s

bit 9-8 CHPS<1:0>: Select Channels Utilized bits

When AD12B = 1, CHPS<1:0> is: U-0, Unimplemented, Read as ‘0’

1x = Converts CH0, CH1, CH2 and CH3

01 = Converts CH0 and CH1

00 = Converts CH0

bit 7 BUFS: Buffer Fill Status bit (valid only when BUFM = 1)

1 = ADC is currently filling second half of buffer, user should access data in the first half

0 = ADC is currently filling first half of buffer, user application should access data in the second half

bit 6 Unimplemented: Read as ‘0’

bit 5-2 SMPI<3:0>: Sample/Conve rt Sequences Per Interrupt Selection bits

1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence

1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence

•

0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence

0000 = Interrupts at the completion of conversion for each sample/conve rt sequence

bit 1 BUFM: Buffer Fill Mode Select bit

1 = Starts filling first half of buffer on first interrupt and the second half of buffer on next interrupt

0 = Always starts filling buffer from the beginning

bit 0 ALTS: Alternate Input Sample Mode Select bit

1 = Uses channel input selects for Sample A on first sample and Sample B on next sample

0 = Always uses channel input selects for Sample A

ADREF+ ADREF-

000 AVDD AVSS

001 External VREF+AVSS

010 AVDD External VREF-

011 External VREF+ External VREF-

1xx AVDD AVSS

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ADRC —— SAMC<4:0>(1)

bit 15 bit 8

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ADCS<7:0>(2)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, rea d as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 ADRC: ADC Conversion Clock Source bit

1 = ADC internal RC clock

0 = Clock derived from system clock

bit 14-13 Unimplemented: Read as ‘0’

bit 12-8 SAMC<4:0>: Auto Sample Time bits(1)

11111 = 31 TAD

•

00001 = 1 TAD

00000 = 0 TAD

bit 7-0 ADCS<7:0>: ADC Conversion Clock Select bits(2)

11111111 = Reserved

•

01000000 = Reserved

00111111 = TCY · (ADCS<7:0> + 1) = 64 · TCY = TAD

•

00000010 = TCY · (ADCS<7:0> + 1) = 3 · TCY = TAD

00000001 = TCY · (ADCS<7:0> + 1) = 2 · TCY = TAD

00000000 = TCY · (ADCS<7:0> + 1) = 1 · TCY = TAD

Note 1: This bit only used if AD1CON1<7:5> (SSRC2:0) = 111.

2: This bit is not used if AD1CON3<15> (ADRC) = 1.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — CH123NB<1:0> CH123SB

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — CH123NA<1:0> CH123SA

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, rea d as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-11 Unimplemented: Read as ‘0’

bit 10-9 CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits

dsPIC33FJ32MC202 devices only:

If AD12B = 1:

11 = Reserved

10 = Reserved

01 = Reserved

00 = Reserved

If AD12B = 0:

11 = Reserved

10 = Reserved

01 = CH1, CH2, CH3 negative input is VREF-

00 = CH1, CH2, CH3 negative input is VREF-

dsPIC33FJ32MC204 and dsPIC33FJ16MC304 devices only:

If AD12B = 1:

11 = Reserved

10 = Reserved

01 = Reserved

00 = Reserved

If AD12B = 0:

11 = Reserved

10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8

01 = CH1, CH2, CH3 negative input is VREF-

00 = CH1, CH2, CH3 negative input is VREF-

bit 8 CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit

If AD12B = 1:

1 = Reserved

0 = Reserved

If AD12B = 0:

1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5

0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2

bit 7-3 Unimplemented: Read as ‘0’

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

bit 2-1 CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits

dsPIC33FJ32MC202 devices only:

If AD12B = 1:

11 = Reserved

10 = Reserved

01 = Reserved

00 = Reserved

If AD12B = 0:

11 = Reserved

10 = Reserved

01 = CH1, CH2, CH3 negative input is VREF-

00 = CH1, CH2, CH3 negative input is VREF-

dsPIC33FJ32MC204 an d dsPIC33FJ16MC304 devices only:

If AD12B = 1:

11 = Reserved

10 = Reserved

01 = Reserved

00 = Reserved

If AD12B = 0:

11 = Reserved

10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8

01 = CH1, CH2, CH3 negative input is VREF-

00 = CH1, CH2, CH3 negative input is VREF-

bit 0 CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit

If AD12B = 1:

1 = Reserved

0 = Reserved

If AD12B = 0:

1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5

0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

CH0NB —— CH0SB<4:0>

bit 15 bit 8

R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

CH0NA —— CH0SA<4:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, rea d as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 CH0NB: Channel 0 Negative Input Select for Sample B bit

1 = Channel 0 negative input is AN1

0 = Channel 0 negative input is VREF-

bit 14-13 Unimplemented: Read as ‘0’

bit 12-8 CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits

dsPIC33FJ32MC204 and dsPIC33FJ16MC304 devices only:

01000 = Channel 0 positive input is AN8

•

00010 = Channel 0 positive input is AN2

00001 = Channel 0 positive input is AN1

00000 = Channel 0 positive input is AN0

dsPIC33FJ32MC202 devices only:

00101 = Channel 0 positive input is AN5

•

00010 = Channel 0 positive input is AN2

00001 = Channel 0 positive input is AN1

00000 = Channel 0 positive input is AN0.

bit 7 CH0NA: Channel 0 Negative Input Select for Sample A bit

1 = Channel 0 negative input is AN1

0 = Channel 0 negative input is VREF-

bit 6-5 Unimplemented: Read as ‘0’

bit 4-0 CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits

dsPIC33FJ32MC204 and dsPIC33FJ16MC304 devices only:

01000 = Channel 0 positive input is AN8

•

00010 = Channel 0 positive input is AN2

00001 = Channel 0 positive input is AN1

00000 = Channel 0 positive input is AN0

dsPIC33FJ32MC202 devices only:

00101 = Channel 0 positive input is AN5

•

00010 = Channel 0 positive input is AN2

00001 = Channel 0 positive input is AN1

00000 = Channel 0 positive input is AN0

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0

— — — — — — — CSS8

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, rea d as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-9 Unimplemented: Read as ‘0’

bit 8-0 CSS<8:0>: ADC Input Scan Selection bits

1 = Select ANx for input scan

0 = Skip ANx for input scan

Note 1: On devices without 9 analog inputs, all AD1CSSL bits can be selected by the user application . However,

inputs selected for scan without a corresponding input on device converts VREFL.

2: CSSx = ANx, where x = 0 through 8.

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0

— — — — — — —PCFG8

bit 15 bit 8

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, rea d as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-9 Unimplemented: Read as ‘0’

bit 8-0 PCFG<8:0>: ADC Port Configuration Control bits

1 = Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS

0 = Port pin in Analog mode, port read input disabled, ADC samples pin voltage

Note 1: On device s w i th ou t 9 analog i n pu ts, al l PCFG bits are R/W by user sof tware. However, the PCFG bits are

ignored on ports without a corresponding input on device.

2: PCFGx = ANx, where x = 0 through 8.

3: The PCFGx bits have no effect if the ADC module is disabled by setting ADxMD bit in the PMDx Register.

In this case, all port pins multiplexed with ANx will be in Dig ital mode.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

21.0 SPECIAL FEATURES

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices include several features intended to ma ximize

application flexibility and reliability, and minimize cost

through elimination of external components. These are:

• Flexible configuration

• Watchdog T imer (WDT)

• Code Protection and CodeGuard™ Security

• JTAG Boundary Scan Interface

• In-Circuit Serial Programming™ (ICSP™)

• In-Circuit emulation

21.1 Configuration Bits

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices provide nonvolatile memory implementation

for device configuration bits. Refer to Section 25.

“Device Configuration” (DS70194) of the

“dsPIC33F/PIC24H Family Reference Manual”, for

more information on this implementation.

The Configuration bits can be programmed (read as

‘0’), or left unprogrammed (read as ‘1’), to select

various device configurations. These bits are mapped

starting at program memory location 0xF80000.

The individual Configuration bit descriptions for the

Configuration registers are shown in Table 21-2.

Note that address 0xF80000 is beyond the user program

memory space. It belongs to the configuration memory

space (0x800000-0xFFFFFF), which can only be

accessed using table reads and table writes.

The Device Configuration register map is shown in

Table 21-1.

Note: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices. It is not

intended to be a comprehensive refer-

ence source. To complement the informa-

tion in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”. Please see the Microchip web

site (www.microchip.com) for the latest

dsPIC33F/PIC24H Family Reference

Manual sections.

TABLE 21-1: DEVICE CONFIGURATION REGISTER MAP

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0xF80000 FBS — — — — BSS<2:0> BWRP

0xF80002 RESERVED — — — — — — — —

0xF80004 FGS — — — — — GSS<1:0> GWRP

0xF80006 FOSCSEL IESO — — —FNOSC<2:0>

0xF80008 FOSC FCKSM<1:0> IOL1WAY — — OSCIOFNC POSCMD<1:0>

0xF8000A FWDT FWDTEN WINDIS — WDTPRE WDTPOST<3:0>

0xF8000C FPOR PWMPIN HPOL LPOL ALTI2C —FPWRT<2:0>

0xF8000E FICD Reserved(1) JTAGEN — — —ICS<1:0>

0xF80010 FUID0 User Unit ID Byte 0

0xF80012 FUID1 User Unit ID Byte 1

0xF80014 FUID2 User Unit ID Byte 2

0xF80016 FUID3 User Unit ID Byte 3

Legend: — = unimplemented bit, read as ‘0’.

Note 1: These bits are reserved for use by development tools and must be programmed as ‘1’.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 21-2: dsPI C33F CONFIGURATION BITS DESCRIPTION

Bit Field Register RTSP

Effect Description

BWRP FBS Immediate Boot Segment Program Flash Write Protection

1 = Boot segment can be written

0 = Boot segment is write-protected

BSS<2:0> FBS Immediate dsPIC33FJ32MC202 and dsPIC33FJ32MC204 Devices Only

Boot Segment Program Flash Code Protection Size

X11 = No Boot program Flash segment

Boot space is 768 Instruction Words (except interrupt vectors)

110 = Standard security; boot program Flash segment ends at 0x0007FE

010 = High security; boot program Flash segment ends at 0x0007FE

Boot space is 3840 Instruction Words (except interrupt vectors)

101 = S t andard security; boot program Flash segment, ends at 0x001FFE

001 = High security; boot program Flash segment ends at 0x001FFE

Boot space is 7936 Instruction Words (except interrupt vectors)

100 = Standard security; boot program Flash segment ends at 0x003FFE

000 = High security; boot program Flash segment ends at 0x003FFE

BSS<2:0> FBS Immediate dsPIC33FJ16MC304 Device Only

Boot Segment Program Flash Code Protection Size

X11 = No Boot program Flash segment

Boot space is 768 Instruction Words (except interrupt vectors)

110 = Standard security; boot program Flash segment ends at 0x0007FE

010 = High security; boot program Flash segment ends at 0x0007FE

Boot space is 3840 Instruction Words (except interrupt vectors)

101 = S t andard security; boot program Flash segment, ends at 0x001FFE

001 = High security; boot program Flash segment ends at 0x001FFE

Boot space is 5376 Instruction Words (except interrupt vectors)

100 = Standard security; boot program Flash segment ends at 0x002BFE

000 = High security; boot program Flash segment ends at 0x002BFE

GSS<1:0> FGS Immediate General Segment Code-Protect bit

11 = User program memory is not code-protected

10 = Standard security

0x = High security

GWRP FGS Immediate General Segment Write-Protect bit

1 = User program memory is not write-protected

0 = User program memory is write-protected

IESO FOSCSEL Immediate Two-speed Oscillator Start-up Enable bit

1 = Start-up device with FRC, then automatically switch to the

user-selected oscillator source when ready

0 = Start-up device with user-selected oscillator source

FNOSC<2:0> FOSCSEL If clock

switch is

enabled,

RTSP

effect is

on any

device

Reset;

otherwise,

Immediate

Initial Oscillator Source Selection bits

111 = Internal Fast RC (FRC) oscillator with postscaler

110 = Internal Fast RC (FRC) oscillator with divide-by-16

101 = LPRC oscillator

100 = Secondary (LP) oscillator

011 = Primary (XT, HS, EC) oscillator with PLL

010 = Primary (XT, HS, EC) oscillator

001 = Internal Fast RC (FRC) oscillator with PLL

000 = FRC oscillator

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FCKSM<1:0> FOSC Immediate Clock Switching Mode bits

1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabl ed

01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled

00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled

IOL1WAY FOSC Immediate Peripheral pin select configuration

1 = Allow only one reconfiguration

0 = Allow multiple reconfigurations

OSCIOFNC FOSC Immediate OSC2 Pin Function bit (except in XT and HS modes)

1 = OSC2 is clock output

0 = OSC2 is general purpose digital I/O pin

POSCMD<1:0> FOSC Immediate Primary Oscillator Mode Select bits

11 = Primary oscillator disabled

10 = HS Crystal Oscillator mode

01 = XT Crystal Oscillator mode

00 = EC (External Clock) mode

FWDTEN FWDT Immediate Watchdog Timer Enable bit

1 = Watchdog Timer always enabled (LPRC oscillator cannot be disabled.

Clearing the SWDTEN bit in the RCON register will have no effect.)

0 = Watchdog T imer enabled/disabled by user software (LPRC can be dis-

abled by clearing the SWDTEN bit in the RCON register)

WINDIS FWDT Immediate Watchdog Timer Window Enable bit

1 = Watchdog Timer in Non-Window mode

0 = Watchdog Timer in Window mode

WDTPRE FWDT Immediate Watchdog Timer Prescaler bit

1 = 1:128

0 = 1:32

WDTPOST<3:0> FWDT Immediate Watchdog Timer Postscaler bits

1111 = 1:32,768

1110 = 1:16,384

•

0001 = 1:2

0000 = 1:1

PWMPIN FPOR Immediate Motor Control PWM Module Pin Mode bit

1 = PWM module pins controlled by PORT register at device Reset

(tri-stated)

0 = PWM module pins controlled by PWM module at device Reset

(configured as output pins)

TABLE 21-2: dsPIC33F CONFIGURATION BITS DESCRIPTION (CONTINUED)

Bit Field Register RTSP

Effect Description

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

HPOL FPOR Immediate Motor Control PWM High Side Polarity bit

1 = PWM module high side output pins have active-high outpu t po l ar it y

0 = PWM module high side output pins have active-low output polarity

LPOL FPOR Immediate Motor Control PWM Low Side Polarity bit

1 = PWM module low side output pins have active-high output polarity

0 = PWM module low side output pins have active-low output polarity

FPWRT<2:0> FPOR Immediate Power-on Reset Timer Value Select bits

111 = PWRT = 128 ms

110 = PWRT = 64 ms

101 = PWRT = 32 ms

100 = PWRT = 16 ms

011 = PWRT = 8 ms

010 = PWRT = 4 ms

001 = PWRT = 2 ms

000 = PWRT = Disabled

ALTI2C FPOR Immediate Alternate I2C™ pins

1 = I2C mapped to SDA1/SCL1 pins

0 = I2C mapped to ASDA1/ASCL1 pins

JTAGEN F I CD Immediate JTAG Enable bit

1 = JTAG enabled

0 = JTAG disabled

ICS<1:0> FICD Immediate ICD Communication Channel Select bits

11 = Communicate on PGEC1 and PGED1

10 = Communicate on PGEC2 and PGED2

01 = Communicate on PGEC3 and PGED3

00 = Reserved, do not use

TABLE 21-2: dsPIC33F CONFIGURATION BITS DESCRIPTION (CONTINUED)

Bit Field Register RTSP

Effect Description

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

21.2 On-Chip Voltage Regulator

The dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices power their core digital

logic at a nominal 2.5V. This can create a conflict for

designs that are required to operate at a higher typical

voltage, such as 3.3V. To simplify system design, all

devices in the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 family incorporate an on-chip

regulator that allows the device to run its core logic from

VDD.

The regulator provides power to the core from the other

VDD pins. When the regulator is enabled, a low-ESR

(less than 5 ohms) capacitor (such as tantalum or

ceramic) must be connected to the VCAP pin

(Figure 21-1). This helps to maintain the stability of the

regulator. The recommended value for the filter capac-

itor is provided in Table 24-13 located in Section 24.1

“DC Characteristics”.

On a POR, it takes approximately 20 μs for the on-chip

voltage regulator to generate an output voltage. During

this time, designated as TSTARTUP, code execution is

disabled. TSTARTUP is applied every time the device

resumes operation after any power-down.

FIGURE 21-1: CONNECTIONS FOR THE

ON-CHIP VOLTAGE

REGULATOR(1)

21.3 BOR: Brown-out Reset (BOR)

The Brown-out Reset (BOR) module is based on an

internal voltage reference circuit that monitors the reg-

ulated supply voltage VCAP. The main purpose of the

BOR module is to generate a device Reset when a

brown-out condition occurs. Brown-out conditions are

generally caused by glitches on the AC mains (for

example, missing portions of the AC cycle waveform

due to bad power transmission lines, or voltage sags

due to excessive current draw when a large inductive

load is turned on).

A BOR generates a Reset pulse, which resets the

device. The BOR selects the clock source, based on

the device Configuration bit values (FNOSC< 2:0> and

POSCMD<1:0>).

If an oscillator mode is selected, the BOR activates the

Oscillator Start-up Timer (OST). The system clock is

held until OST expires. If the PLL is u sed, the clock is

held until the LOCK bit (OSCCON<5>) is ‘1’.

Concurrently, the PWRT time-out (TPWRT) is applied

before the internal Reset is released. If TPWRT = 0 and

a crystal oscillator is being used, then a nominal delay

of TFSCM = 100 is applied. The total delay in this case

is TFSCM.

The BOR S tatus bit (RCON<1>) is set to indicate that a

BOR has occurred. The BOR circuit continues to oper-

ate while in Sleep or Idle modes and rese ts the device

should VDD fall below the BOR threshold voltage.

Note: It is important for low-ESR capacitors to

be placed as close as possible to the VCAP

pin.

Note 1: These are typical o perat in g voltages. Refer to

Table 24-13 located in Section 24.1 “DC

Characteristics” for th e fu ll o perat in g ran ges

of VDD and VCAP.

2: It is important for low-ESR capacitors to be

placed as close as possible to the VCAP pin.

3: Typical VCAP pin voltage = 2.5V when VDD ≥

VDDMIN.

VDD

VCAP

VSS

dsPIC33F

CEFC

3.3V

10 µF

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

21.4 Watchdog Timer (WDT)

For dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices, the WDT is driven by the

LPRC oscillator. When the WDT is enabled, the clock

source is also enabled.

21.4.1 PRESCALER/POSTSCALER

The nominal WDT cl ock source from LPRC is 32 kHz.

This feeds a prescaler than can be configured for either

5-bit (divide-by-32) or 7-bit (divide-by-128) operation.

The prescaler is set by the WDTPRE Configuration bit.

With a 32 kHz input, the prescaler yields a nominal

WDT time-out period (TWDT) of 1 ms in 5-bit mode, or

4 ms in 7-bit mode.

A variable postscaler divides down the WDT prescaler

output and allows for a wide range of time-out periods.

The postscaler is controlled by the WDTPOST<3:0>

Configuration bits (FWDT<3:0>), which allow the selec-

tion of 16 settings, from 1:1 to 1:32,768. Using the pres-

caler and postscaler, time-out periods ranging from

1 m s to 131 seconds can be achieved.

The WDT, prescaler and postscaler are reset:

• On any device Reset

• On the completion of a clock switch, whether

invoked by software (i.e., setting the OSWEN bit

after changing the NOSC bits) or by hardware

(i.e., Fail-Safe Clock Monitor)

• When a PWRSAV instruction is executed

(i.e., Sleep or Idle mode is entered)

• When the device exits Sleep or Idle mode to

resume normal operation

•By a CLRWDT instruction during normal execution

21.4.2 SLEEP AND IDLE MODES

If the WDT is en abled, i t will conti nue to run during Sleep

or Idle modes. When the WDT time-out occurs, the

device will wake the device and code execution will con-

tinue from where the PWRSAV instruction was executed.

The corresponding SLEEP or IDLE bits (RCON<3,2>) will

need to be cleared i n software after the device wakes up.

21.4.3 ENABLING WDT

The WDT is enabled or disabled by the FWDTEN

Configuration bit in the FWDT Configuration register.

When the FWDTEN Configuration bit is set, the WDT is

always enabled.

The WDT can be optionally controlled in software when

the FWDTEN Configuration bit has been programmed

to ‘0’. The WDT is enabled in software by setting the

SWDTEN control bit (RCON<5>). The SWDTEN

control bit is cleared on any device Reset. The software

WDT option allows the user application to enable the

WDT for critical code segments and disable the WDT

during non-critical segments for maximum power

savings.

The WDT flag bit, WDTO (RCON<4>), is not automatically

cleared following a WDT time-out. To detect subsequent

WDT events, the flag must be cleared in software.

FIGURE 21-2: WDT BLOCK DIAGRAM

Note: The CLRWDT and PWRSAV instructions

clear the prescaler and postscaler counts

when executed.

Note: If the WINDIS bit (FWDT<6>) is cleared,

the CLRWDT instruction should be executed

by the application software only during the

last 1/4 of the WDT period. This CLRWDT

window can be determined by using a timer .

If a CLRWDT instruction is executed before

this window, a WDT Reset occurs.

All Device Resets

T r ansition to New Clock Source

Exit Sleep or Idle Mode

PWRSAV Instruction

CLRWDT Instruction

WDTPRE WDTPOST<3:0>

Watchdog Timer

Prescaler

(divide by N1) Postscaler

(divide by N2)

Sleep/Idle

WDT

WDT Window Select

WINDIS

WDT

CLRWDT Instruction

SWDTEN

FWDTEN

LPRC Clock

RS RS

Wake-up

Reset

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

21.5 JTAG Interface

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

devices implement a JTAG interface, which supports

boundary scan device testing, as well as in-circuit

programming. Detailed information on this interface will

be provided in future revisions of the document.

21.6 In-Circuit Serial Programming

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

family digital signal controllers can be serially

programmed while in the end application circuit. This is

done with two lin es for clock and data and three other

lines for power, ground and the programming

sequence. Serial programming allows customers to

manufacture boards with unprogrammed devices and

then program the digital signal controller just before

shipping the product. Serial programming also allows

the most recent firmware or a custom firmware to be

programmed. Refer to the “dsPIC33F/PIC24H Flash

Programming Specification” (DS70152) document for

details about In-Circuit Serial Programming (ICSP).

Any of the three pairs of programming clock/data pins

can be used:

• PGEC1 and PGED1

• PGEC2 and PGED2

• PGEC3 and PGED3

21.7 In-Circuit Debugger

When MPLAB® ICD 2 is selected as a debugger, the

in-circuit debugging functionality is enabled. This

function allows simple debugging functions when used

with MPLAB IDE. Debugging fun ctional ity is controlled

through the PGECx (Emulation/Debug Clock) and

PGEDx (Emulation/Debug Data) pin functions.

Any of the three pairs of debugging clock/data pins can

be used:

• PGEC1 and PGED1

• PGEC2 and PGED2

• PGEC3 and PGED3

To use the in-circuit debugger function of the device,

the design must implement ICSP connections to

MCLR, VDD, VSS, and the PGECx/PGEDx pin pair. In

addition, when the feature is enabled, some of the

resources are not available for general use. These

resources include the first 80 bytes of data RAM and

two I/O pins.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

21.8 Code Protection and

CodeGuard™ Security

The dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices offer the intermediate

implementation of CodeGuard™ Security. Code Guard

Security enables multiple parties to securely share

resources (memory, interrupts and peripherals) on a

single chip. This feature helps protect individual

Intellectual Property in collaborative system designs.

When coupled with software encryption libraries, Code-

Guard™ Security can be used to securely update Flash

even when multiple IPs reside on the single chip.

The code protection features are controlled by the

Configuration registers: FBS and FGS.

Secure segment and RAM protection is not

implemented in dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices.

TABLE 21-3: CODE FLASH SECURITY

SEGMENT SIZES FOR

32 KBYTE DEVICES

TABLE 21-4: CODE FLASH SECURITY

SEGMENT SIZES FOR

16 KBYTE DEVICES

Note: Refer to Section 23. “CodeGuard™

Security” (DS70199) in the

“dsPIC33F/PIC24H Family Reference

Manual” for further informati on on usage,

configuration and operation of

CodeGuard Security.

CONFIG BITS

BSS<2:0> = x11

BSS<2:0> = x10

256

BSS<2:0> = x01

768

BSS<2:0> = x00

1792

0057FEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 11008 IW 003FFEh

004000h

0057FEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

003FFEh

004000h

GS = 10240 IW

BS = 768 IW

0057FEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

003FFEh

004000h

GS = 7168 IW

BS = 3840 IW

0057FEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 3072 IW

003FFEh

004000h

BS = 7936 IW

CONFIG BITS

BSS<2:0> = x11

BSS<2:0> = x10

256

BSS<2:0> = x01

768

BSS<2:0> = x00

1792

002BFEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 5376 IW

002BFEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 4608 IW

BS = 768 IW

002BFEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

GS = 1536 IW

BS = 3840 IW

002BFEh

0001FEh

000200h

000000h

VS = 256 IW

0007FEh

000800h

001FFEh

002000h

BS = 5376 IW

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

22.0 INSTRUCTION SET SUMMARY

The dsPIC33F in struction set is identical to th at of the

dsPIC30F.

Most instructions are a single program memory word

(24 bits). Only three instructions require two program

memory locations.

Each single-word instruction is a 24-bit word, divided

into an 8-bit opcode, which specifies the instruction

type and one or more operands, which further specify

the operation of the instruction.

The instruction set is highly ortho gonal an d is gr ouped

into five basic categories:

• Word or byte-oriented operations

• Bit-oriented operations

• Literal operations

• DSP operations

• Control operations

Table 22-1 shows the general symbols used in

describing the instructions.

The dsPIC33F instruction set summary in Table 22-2

lists all the instructions, along with the status flags

affected by each instruction.

Most word or byte-oriented W register instructions

(including barrel shift instructions) have three

operands:

• The first source operand, which is typicall y a

• The second source operand, which is typically a

• The destination of the result, which is typically a

However , word or byte-oriented file register instructions

have two operands:

• The file register specified by the value ‘f’

• The destination, which could be either the file

‘WREG’

Most bit-oriented instructions (including simple

rotate/shift instructions) have two operands:

• The W register (with or without an address

modifier) or file register (specified by the value of

‘Ws’ or ‘f’)

• The bit in the W register or file register

(specified by a literal value or indirectly by the

contents of register ‘Wb’)

The literal instructions that involve data movement can

use some of the following operands:

• A literal value to be loaded into a W register or file

• The W register or file register where the literal

value is to be loaded (specified by ‘Wb’ or ‘f’)

However, literal instructions that involve arithmetic or

logical operations use some of the following operands:

• The first source operand, which is a register ‘Wb’

without any address modifier

• The second source operand, which is a literal

value

• The destination of the result (only if not the same

as the first source operand), which is typically a

The MAC class of DSP instructions can use some of the

following operands:

• The accumulator (A or B) to be used (required

operand)

• The W registers to be used as the two operands

• The X and Y address space prefetch operations

• The X and Y address space prefetch destinations

• The accumulator write-back destination

The other DSP instructions do not involve any

multiplication and can include:

• The accumulator to be used (required)

• The source or destination operand (designated as

Wso or Wdo, respectively) with or without an

address modifier

• The amount of shift specified by a W register ‘Wn’

or a literal value

The control instructions can use some of the following

operands:

• A program memory address

• The mode of the table read and table write

instructions

Note: This data sheet summarizes the features

of the dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 devices. It is not

intended to be a comprehensive refer-

ence source. To complement the informa-

tion in this data sheet, refer to the

“dsPIC33F/PIC24H Family Reference

Manual”. Please see the Microchip web

site (www.microchip.com) for the latest

dsPIC33F/PIC24H Family Reference

Manual sections.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Most instructions are a single word. Certain

double-word instructions are designed to provide all the

required information in these 48 bits. In the second

word, the 8 MSbs are ‘0’s. If this second word is exe-

cuted as an instruction (by itself), it will execute as a

NOP.

The double-word instructions execute in two instruction

cycles.

Most single-word instructions are executed in a single

instruction cycle, unless a conditional test is true, or the

program counter is changed as a result of the

instruction. In these cases, the execution takes two

instruction cycles with the additional instruction cycle(s)

executed as a NOP. Notable exceptions are the BRA

(unconditional/computed branch), indirect CALL/GOTO,

all table reads and writes and RETURN/RETFIE

instructions, which are single-word instructions but take

two or three cycles. Certain instructions that involve skip-

ping over the subsequent instruction require either two

or three cycles if the skip is performed, depending on

whether the instruction being skippe d is a single-word or

two-word instruction. Moreover, double-word moves

require two cycles.

Note: For more details on the instruction set,

refer to the “16-bit MCU and DSC

Programmer’s Reference Manual”

(DS70157).

TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS

Field Description

#text Means literal defined by “text”

(text) Means “content of text”

[text] Means “the location addressed by text”

{ } Optional field or operation

<n:m> Register bit field

.b Byte mode selection

.d Double-Word mode selection

.S Shadow register select

.w Word mode selection (default)

Acc One of two accumulators {A, B}

AWB Accumulator write back destination address register ∈ {W13, [W13]+ = 2}

bit4 4-bit bit selection field (used in word addressed instructions) ∈ {0...15}

C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero

Expr Absolute address, label or expression (resolved by the linker)

f File register address ∈ {0x0000...0x1FFF}

lit1 1-bit unsigned literal ∈ {0,1}

lit4 4-bit unsigned literal ∈ {0...15}

lit5 5-bit unsigned literal ∈ {0...31}

lit8 8-bit unsigned literal ∈ {0...255}

lit10 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode

lit14 14-bit unsigned literal ∈ {0...16384}

lit16 16-bit unsigned literal ∈ {0...65535}

lit23 23-bit unsigned literal ∈ {0...8388608}; LSb must be ‘0’

None Field does not require an entry, can be blank

OA, OB, SA, SB DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate

PC Program Counter

Slit10 10-bit signed literal ∈ {-512...511}

Slit16 16-bit signed literal ∈ {-32768...32767}

Slit6 6-bit signed literal ∈ {-16...16}

Wb Base W register ∈ {W0..W15}

Wd Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }

Wdo Destination W register ∈

{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }

Wm,Wn Dividend, Divisor working register pair (direct addressing)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Wm*Wm Multiplicand and Multiplier working register pair for Square instructions ∈

{W4 * W4,W5 * W5,W6 * W6,W7 * W7}

Wm*Wn M ultiplicand and Multiplier working register pair for DSP instructions ∈

{W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7}

Wn One of 16 working registers ∈ {W0..W15}

Wnd One of 16 destination working registers ∈ {W0...W15}

Wns One of 16 source working registers ∈ {W0...W15}

WREG W0 (working register used in file register instructions)

Ws Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }

Wso Source W register ∈

{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }

Wx X data space prefetch address register for DSP instructions

∈{[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2,

[W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2,

[W9 + W12], none}

Wxd X data space prefetch destination register for DSP instructions ∈ {W4...W7}

Wy Y data space prefetch address register for DSP instructions

∈{[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2,

[W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2,

[W11 + W12], none}

Wyd Y data space prefetch destination register for DSP instructions ∈ {W4...W7}

TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)

Field Description

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 22-2: INSTRUCTION SET OVERVIEW

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

Words # of

Cycles Status Flags

Affected

1ADD ADD Acc Add Accumulators 1 1 OA,OB,SA,SB

ADD f f = f + WREG 1 1 C,DC,N,O V,Z

ADD f,WREG WREG = f + WREG 1 1 C,DC ,N,O V,Z

ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z

ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z

ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z

ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB

2ADDC ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z

ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z

ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z

ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z

ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z

3AND AND f f = f .AND. WREG 1 1 N, Z

AND f,WREG WREG = f .AND. WREG 1 1 N,Z

AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z

AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z

AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z

4ASR ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z

ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z

ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z

ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z

ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z

5BCLR BCLR f,#bit4 Bit Clear f 1 1 None

BCLR Ws,#bit4 Bit Clear Ws 1 1 None

6BRA BRA C,Expr Branch if Carry 1 1 (2) None

BRA GE,Expr Branch if greater than or equal 1 1 (2) None

BRA GEU,Expr Branch if unsigned greater than or equa l 1 1 (2) None

BRA GT,Expr Branch if greater than 1 1 (2) None

BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None

BRA LE,Expr Branch if less than or equal 1 1 (2) None

BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None

BRA LT,Expr Branch if less than 1 1 (2) None

BRA LTU,Expr Branch if unsigned less than 1 1 (2) None

BRA N,Expr Branch if Negative 1 1 (2) None

BRA NC,Expr Branch if Not Carry 1 1 (2) None

BRA NN,Expr Branch if Not Negative 1 1 (2) None

BRA NOV,Expr Branch if Not Overflow 1 1 (2) None

BRA NZ,Expr Branch if Not Zero 1 1 (2) None

BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None

BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None

BRA OV,Expr Branch if Overflow 1 1 (2) None

BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None

BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None

BRA Expr Branch Unconditionally 1 2 None

BRA Z,Expr Branch if Zero 1 1 (2) None

BRA Wn Computed Branch 1 2 None

7BSET BSET f,#bit4 Bit Set f 1 1 None

BSET Ws,#bit4 Bit Set Ws 1 1 None

8BSW BSW.C Ws,Wb Write C bit to Ws<Wb > 1 1 None

BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

9BTG BTG f,#bit4 Bit Toggle f 1 1 None

BTG Ws,#bit4 Bit Toggle Ws 1 1 None

10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1

(2 or 3) None

BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1

(2 or 3) None

11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1

(2 or 3) None

BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1

(2 or 3) None

12 BTST BTST f,#bit4 Bit Test f 1 1 Z

BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C

BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z

BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C

BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z

13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z

BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C

BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z

14 CALL CALL lit23 Call subroutine 2 2 None

CALL Wn Call indirect subroutine 1 2 None

15 CLR CLR f f = 0x0000 1 1 None

CLR WREG WREG = 0x0000 1 1 None

CLR Ws Ws = 0x0000 1 1 None

CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB

16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep

17 COM COM f f = f 11 N,Z

COM f,WREG WREG = f 11 N,Z

COM Ws,Wd Wd = Ws 11 N,Z

18 CP CP f Compare f with WREG 1 1 C,DC,N,OV,Z

CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z

CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C,DC,N,OV,Z

19 CP0 CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z

CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z

20 CPB CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z

CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z

CPB Wb,Ws Comp are Wb with Ws, with Borrow

(Wb - Ws - C)1 1 C,DC,N,OV,Z

21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1

(2 or 3) None

22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1

(2 or 3) None

23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1

(2 or 3) None

24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠11

(2 or 3) None

25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C

26 DEC DEC f f = f - 1 1 1 C,DC,N,OV,Z

DEC f,WREG WREG = f - 1 1 1 C,DC,N,OV,Z

DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z

27 DEC2 DEC2 f f = f - 2 1 1 C,DC,N,OV,Z

DEC2 f,WREG WREG = f - 2 1 1 C,DC,N,OV,Z

DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z

28 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

Words # of

Cycles Status Flags

Affected

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

29 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV

30 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV

31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 times 2 2 None

DO Wn,Expr Do code to PC + Expr, (Wn) + 1 times 2 2 None

32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB,

SA,SB,SAB

33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB,

SA,SB,SAB

34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None

35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C

36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C

37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C

38 GOTO GOTO Expr Go to address 2 2 None

GOTO Wn Go to indirect 1 2 None

39 INC INC f f = f + 1 1 1 C,DC,N,O V,Z

INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z

INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z

40 INC2 INC2 f f = f + 2 1 1 C ,DC ,N,O V,Z

INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z

INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z

41 IOR IOR f f = f .IOR. WREG 1 1 N,Z

IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z

IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z

IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z

IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z

42 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

43 LNK LNK #lit14 Link Frame Pointer 1 1 None

44 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z

LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z

LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z

LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z

LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z

45 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd

AWB

Multiply and Accumulate 1 1 OA,OB,OAB,

SA,SB,SAB

MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB,

SA,SB,SAB

46 MOV MOV f,Wn Move f to Wn 1 1 None

MOV f Move f to f 1 1 N,Z

MOV f,WREG Move f to WREG 1 1 None

MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None

MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None

MOV Wn,f Move Wn to f 1 1 None

MOV Wso,Wdo Move Ws to Wd 1 1 None

MOV WREG,f Move WREG to f 1 1 None

MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None

MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None

47 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Prefetch and store accumulator 1 1 None

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

Words # of

Cycles Status Flags

Affected

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

48 MPY MPY

Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

MPY

Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 O A,OB,OAB,

SA,SB,SAB

49 MPY.N MPY.N

Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multi ply Wm by Wn) to Accumulator 1 1 None

50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd

AWB

Multiply and Subtract from Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

51 MUL MUL.SS Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) 1 1 None

MUL.SU Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None

MUL.US Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None

MUL.UU Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned( Wb) *

unsigned(Ws) 1 1 None

MUL.SU Wb,#lit5,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None

MUL.UU Wb,#lit5,Wnd {Wnd + 1, Wnd} = unsigned(Wb) *

unsigned(lit5) 1 1 None

MUL f W3:W2 = f * WREG 1 1 None

52 NEG NEG Acc Negate Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

NEG f f = f + 1 1 1 C,DC,N,OV,Z

NEG f,WREG WREG = f + 1 1 1 C,DC ,N,O V,Z

NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z

53 NOP NOP No Operation 1 1 None

NOPR No Operation 1 1 None

54 POP POP f Pop f from Top-of-Stack (TOS) 1 1 None

POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None

POP.D Wnd Pop from Top-of-Stack (TOS) to

W(nd):W(nd + 1) 1 2 None

POP.S Pop Shadow Registers 1 1 All

55 PUSH PUSH f P us h f to Top- of - Stack (TOS) 1 1 Non e

PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None

PUSH.D Wns Push W(ns):W(ns + 1) to Top-of-Stack (TOS) 1 2 None

PUSH.S Push Shadow Registers 1 1 None

56 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep

57 RCALL RCALL Expr Relative Call 1 2 None

RCALL Wn Computed Call 1 2 None

58 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None

REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None

59 RESET RESET Softwa re device Reset 1 1 None

60 RETFIE RETFIE Return from interrupt 1 3 (2) None

61 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None

62 RETURN RETURN Return from Subroutine 1 3 (2) None

63 RLC RLC f f = Rotate Left throug h Ca rry f 1 1 C,N,Z

RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z

RLC Ws,Wd Wd = Rot ate Left through Carry Ws 1 1 C,N,Z

64 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N,Z

RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z

RLNC Ws,Wd Wd = Rot ate Left (No Carry) Ws 1 1 N,Z

65 RRC RRC f f = Rotate Right through Carry f 1 1 C,N,Z

RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z

RRC Ws,Wd Wd = Rot ate Right through Carry Ws 1 1 C,N,Z

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # o f

Words # of

Cycles Status Flags

Affected

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

66 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N,Z

RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z

RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z

67 SAC SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None

SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None

68 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z

69 SETM SETM f f = 0xFFFF 1 1 None

SETM WREG WREG = 0xFFFF 1 1 None

SETM Ws Ws = 0xFFFF 1 1 None

70 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB,

SA,SB,SAB

SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB,

SA,SB,SAB

71 SL SL f f = Left Shift f 1 1 C,N,OV,Z

SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z

SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z

SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z

SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z

72 SUB SUB Acc Subtract Accumulators 1 1 OA,OB,OAB,

SA,SB,SAB

SUB f f = f - WREG 1 1 C,DC,N,O V,Z

SUB f,WREG WREG = f - WREG 1 1 C,DC ,N,O V,Z

SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z

SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z

SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z

73 SUBB SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z

SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z

SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z

SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 C,DC,N,OV,Z

SUBB Wb,#lit5,Wd Wd = Wb - lit5 - (C) 1 1 C,DC,N,OV,Z

74 SUBR SUBR f f = WREG - f 1 1 C,DC,N,OV,Z

SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z

SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z

SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 C,DC,N,OV,Z

75 SUBBR SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z

SUBBR f,WREG WREG = WREG - f - (C) 1 1 C,DC,N,OV,Z

SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 C,DC,N,OV,Z

SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 C,DC,N,OV,Z

76 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None

SWAP Wn Wn = byte swap Wn 1 1 None

77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None

78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None

79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None

80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15: 0> 1 2 None

81 ULNK ULNK Unlink Frame Pointer 1 1 None

82 XOR XOR f f = f .XOR. WREG 1 1 N, Z

XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z

XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z

XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z

XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z

83 ZE ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # o f

Words # of

Cycles Status Flags

Affected

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

23.0 DEVELOPMENT SUPPORT

The PIC® microcontrollers and dsPIC® digital signal

controllers are supported with a full range of software

and hardware development tools:

• Integrated Development Environment

- MPLAB® IDE Software

• Compilers/Assemblers/Linkers

- MPLAB C Compiler for Vari ous Device

Families

- HI-TECH C for Various Device Families

- MPASMTM Assembler

-MPLINK

TM Object Linker/

MPLIBTM Object Librarian

- MPLAB Assembler/Linker/Librarian for

Various Device Families

• Simulators

- MPLAB SIM Software Simulator

• Emulators

- MPLAB REAL ICE™ In-Circuit Emulator

• In-Circuit Debuggers

- MPLAB ICD 3

- PIC kit™ 3 Debug Express

• Device Programmers

- PICkit™ 2 Programmer

- MPLAB PM3 Device Programmer

• Low-Cost Demonstration/Development Boards,

Evaluation Kits, and Starter Kits

23.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16/32-bit

microcontroller market. The MPLAB IDE is a Windows®

operating system-based application that contains:

• A single graphical interface to all de bugging tools

- Simulator

- Programmer (sold separately)

- In-Circuit Emulator (sold separately)

- In-Circuit Debugger (sold separately)

• A full-featured editor with color-coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High-level source code debugging

• Mouse over variable inspection

• Drag and drop variables from source to watch

windows

• Extensive on-line help

• Integration of select third party tools, such as

IAR C Compilers

The MPLAB IDE allows you to:

• Edit your source files (either C or assembly)

• One-touch compile or assemble, and download to

emulator and simulator tools (automatically

updates all project information)

• Debug using:

- Source files (C or assembly)

- Mixed C and assembly

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

23.2 MPLAB C Compilers for Various

Device Families

The MPLAB C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC18,

PIC24 and PIC32 families of microcontrollers and the

dsPIC30 and dsPIC33 families of digital signal control-

lers. These compilers provide powerful integration

capabilities, superior code optimization and ease of

use.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

23.3 HI-TECH C for Various Device

Families

The HI-TECH C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC

family of microcontrollers and the dsPIC family of digital

signal controllers. These compilers provide powerful

integration capabilities, omniscient code generation

and ease of us e.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

The compilers include a macro assembler, linker, pre-

processor , and one-step driver , and can run on multiple

platforms.

23.4 MPASM Assembler

The MPASM Assembler is a full-featured, universal

macro assembler for PIC10/12/16/18 MCUs.

The MPASM Assembler generates relocatable object

files for the MPLINK Object Linker , Intel® standard HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST fi les that contain source lines

and generated machine code and COFF files for

debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• User-defined macros to streamline

assembly code

• Conditional assembly for multi-purpose

source files

• Directives that allow complete control over the

assembly process

23.5 MPLINK Object Linker/

MPLIB Object Librarian

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLAB C18 C Compiler . It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB Object Librarian manages the creation and

modification of libra ry files of preco mpiled cod e. When

a routine from a library is called from a source file, only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features inclu de:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grou ping

related modules together

• Flexible creation of libraries with easy module

listing, replacement, deletion and extraction

23.6 MPLAB Assembler, Linker and

Librarian for Various Device

Families

MPLAB Assembler produces relocatable machine

code from symbolic assembly language for PIC24,

PIC32 and dsPIC devices. MPLAB C Compiler uses

the assembler to produce its object file. The assembler

generates relocatable object files that can then be

archived or linked with other relocatable object files and

archives to create an executable file . Notable features

of the assembler include:

• Support for the entire device instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich directive set

• Flexible macro language

• MPLAB IDE compatibility

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

23.7 MPLAB SIM Software Simulator

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PIC MCUs and d sPIC® DSCs on an instruction

level. On any given instruction, the data areas can be

examined or modified a nd stimuli can be applied from

a comprehensive stimulus controller. Registers can be

logged to files for further run-time analysis. The trace

buffer and logic analyzer display extend the power of

the simulator to record and track program execution,

actions on I/O, most peripherals and internal registers.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C Compilers,

and the MPASM and MPLAB Assemblers. The soft-

ware simulator offers the flexibility to develop and

debug code outside of the hardware laboratory envi-

ronment, making it an excellent, economical software

development tool.

23.8 MPLAB REAL ICE In-Circuit

Emulator System

MPLAB REAL ICE In-Circuit Emulator System is

Microchip’s next generation high-speed emulator for

Microchip Flash DSC and MCU devices. It debugs and

programs PIC® Flash MCUs and dsPIC® Flash DSCs

with the easy-to-use, powerful graphical user interface of

the MPLAB Integrated Development Environment (IDE),

included with each kit.

The emulator is connected to the design engineer ’s PC

using a high-speed USB 2.0 interface and is connected

to the target with either a connector compatible with in-

circuit debugger systems (RJ11) or with the new high-

speed, noise tolerant, Low-Voltage Differential Signal

(LVDS) interconnection (CAT5).

The emulator is field upgradable through future firmware

downloads in MPLAB IDE. In upcoming releases of

MPLAB IDE, new devices will be supported, and new

features will be added. MPLAB REAL ICE offers

significant advantages over competitive emulators

including low-cost, full-speed emulation, run-time

variable watches, trace analysis, complex breakpoints, a

ruggedized probe interface and long (up to three meters)

interconnection cables.

23.9 MPLAB ICD 3 In-Circuit Debugger

System

MPLAB ICD 3 In-Circuit Debugger System is Micro-

chip's most cost effective high-speed hardware

debugger/programmer for Microchi p Flash Digital Sig-

nal Controller (DSC) and microcontroller (MCU)

devices. It debugs and programs PIC® Flash microcon-

trollers and dsPIC® DSCs with the powerful, yet easy-

to-use graphical user interface of MPLAB Integrated

Development Environment (IDE).

The MPLAB ICD 3 In-Circuit Debugger probe is con-

nected to the design engineer's PC using a high-speed

USB 2.0 interface and is connected to the target with a

connector compatible with the MPLAB ICD 2 or MPLAB

REAL ICE systems (RJ-11). MPLAB ICD 3 supports all

MPLAB ICD 2 headers.

23.10 PICkit 3 In-Circuit Debugger/

Programmer and

PICkit 3 Debug Express

The MPLAB PICkit 3 allows debugging and program-

ming of PIC® and dsPIC® Flash microcontrollers at a

most affordable price point using the powerful graphical

user interface of the MPLAB Integrated Development

Environment (IDE). The MPLAB PICkit 3 is connected

to the design engineer's PC using a full speed USB

interface and can be connected to the target via an

Microchip debug (RJ-11) connector (compatible with

MPLAB ICD 3 and MPLAB REAL ICE). The connector

uses two device I/O pins and the reset line to imple-

ment in-circuit debugging and In-Circuit Serial Pro-

gramming™.

The PICkit 3 Debug Express include the PICkit 3, demo

board and microcontroller , hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

23.11 PICkit 2 Development

Programmer/Debugger and

PICkit 2 Debug Express

The PICkit™ 2 Development Programmer/Debugger is

a low-cost development tool with an easy to use inter-

face for programming and debugging Microchip’s Flash

families of microcontrollers. The full featured

Windows® programming interface supports baseline

(PIC10F, PIC12F5xx, PIC16F5xx), midrange

(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,

dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit

microcontrollers, and many Microchip Serial EEPROM

products. With Microchip’s powerful MPLAB Integrated

Development Environment (IDE) the PICkit™ 2

enables in-circuit debugging on most PIC® microcon-

trollers. In-Circuit-Debugging runs, halts and single

steps the program while the PIC microcontroller is

embedded in the ap plication. When halted at a break-

point, the file registers can be examined and modified.

The PICkit 2 Debug Express include the PICkit 2, demo

board and microcontroller, hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

23.12 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64) for menus and error messages and a modu-

lar, detachable socket assembly to support various

package types. The ICSP™ cable assembly is included

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Device Programmer can read, verify and program

PIC devices without a PC connection. It can also set

code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPLAB PM3 has high-speed communications and

optimized algorithms for quick programming of large

memory devices and incorporates an MMC card for file

storage and data applications.

23.13 Demonstration/Development

Boards, Evaluation Kits, and

Star ter Kits

A wide variety of demonstration, development and

evaluation boards for various PIC MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards include prototyping areas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

The boards support a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displa ys, potentiometers and additiona l

EEPROM memory.

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

In addition to the PICDEM™ and d sPICDEM™ demon-

stration/develop ment board series of circuit s, Microchip

has a line o f evaluation kit s and demons tration softwa re

for analog filter design, KEELOQ® security ICs, CAN,

IrDA®, PowerSmart battery management, SEEVAL®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

Also available are starter kits that contain everything

needed to experience the specified device. This usually

includes a single application and debug capability, all

on one board.

Check the Microchip web page (www.microchip.com)

for the complete list of demonstration, development

and evaluation kits.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

24.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 electrical characteristics.

Additional information will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family are listed below . Exposure

to these maximum rating conditions for extended periods may affect device reliability . Functional operation of the device

at these or any other conditions above the parameters indicated in the operation listings of this specification is not

implied.

Absolute Maximum Ratings(1)

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature.............................................................................................................................. -65°C to +160°C

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Vo ltage on any pin that is not 5V tolerant with respect to VSS(4) ....................................................-0.3V to (VDD + 0.3V)

Voltage on any 5V tolerant pin with respect to Vss when VDD ≥ 3.0V(4)....................................................-0.3V to +5.6V

Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(4)..................................................... -0.3V to 3.6V

Maximum current out of VSS pin..................... ......................... ......................... .............. .......................... ............300 mA

Maximum current into VDD pin(2)...........................................................................................................................250 mA

Maximum output current sunk by any I/O pin(3).............................................. .............. ......................... ...................4 mA

Maximum output current sourced by any I/O pin(3).................. ......................... .......................... .............. ................4 mA

Maximum current sunk by all ports ................. ... ... ........................................................................... .............. .......200 mA

Maximum current sourced by all ports(2)............... ......................... .............. .............. .............. ......................... ....200 mA

Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only, and functional operation of the device at those or any other conditions

above those indicated in the operation listings o f this specification i s not implied. Exposure to maximum

rating conditions for extended periods may affect device reliability.

2: Maximum allowable current is a function of devi c e maximum power dissipation (see Table 24-2).

3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, V REF-, SCLx, SDAx, PGECx

and PGEDx pins, which are able to sink/source 12 mA.

4: Refer to the “Pin Diagrams” section for 5V tolerant pins.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

24.1 DC Characteristics

TABLE 24-1: OPERATING MIPS VS. VOLTAGE

Characteristic VDD Range

(in Volts) Temp Range

(in °C)

Max MIPS

dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304

DC5 3.0-3.6V -40°C to +85°C 40

3.0-3.6V -40°C to +125°C 40

TABLE 24-2: THERMAL OPERATING CONDITIONS

Rating Symbol Min Typ Max Unit

Industrial Temperature Devices

Operating Junction Temperature Rang e TJ-40 — +125 °C

Operating Ambient Temperature Range TA-40 — +85 °C

Extended Temperature Devices

Operating Junction Temperature Rang e TJ-40 — +140 °C

Operating Ambient Temperature Range TA-40 — +125 °C

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD - Σ IOH) PDPINT + PI/OW

I/O Pin Power Dissipation:

I/O = Σ ({VDD - VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power Dissipation PDMAX (TJ - TA)/θJA W

TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic Symbol Typ Max Unit Notes

Package Thermal Resistance, 44-pin QFN θJA 32 — °C/W 1

Package Thermal Resistance, 44-pin TFQP θJA 45 — °C/W 1

Package Thermal Resistance, 28-pin SPDIP θJA 45 — °C/W 1

Package Thermal Resistance, 28-pin SOIC θJA 50 — °C/W 1

Package Thermal Resistance, 28-pin SSOP θJA 71 — °C/W 1

Package Thermal Resistance, 28 -p i n QF N - S θJA 35 — °C/W 1

Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-4: DC TEMPER ATURE AND VOLTAGE SPECIFICATIONS

DC CHARACTERISTICS

Stan dard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Operating Voltage

DC10 Supply Voltage

VDD — 3.0 — 3.6 V Industrial and Extended

DC12 VDR RAM Data Retention Voltage(2) 1.8 — — V —

DC16 VPOR VDD Start Voltage

to ensure internal

Power-on Reset signal

——VSS V—

DC17 SVDD VDD Rise Rate

to ensure internal

Power-on Reset signal

0.03 — — V/ms 0-3.0V in 0.1s

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: This is the limit to which VDD may be lowered without losing RAM data.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

DC20d 20 30 mA -40°C

3.3V 10 MIPS (3)

DC20a 19 22 mA +25°C

DC20b 19 25 mA +85°C

DC20c 19 30 mA +125°C

DC21d 28 40 mA -40°C

3.3V 16 MIPS (3)

DC21a 27 30 mA +25°C

DC21b 27 32 mA +85°C

DC21c 27 36 mA +125°C

DC22d 33 50 mA -40°C

3.3V 20 MIPS (3)

DC22a 33 40 mA +25°C

DC22b 33 40 mA +85°C

DC22c 33 50 mA +125°C

DC23d 44 60 mA -40°C

3.3V 30 MIPS (3)

DC23a 43 50 mA +25°C

DC23b 42 55 mA +85°C

DC23c 41 65 mA +125°C

DC24d 55 75 mA -40°C

3.3V 40 MIPS

DC24a 54 65 mA +25°C

DC24b 52 70 mA +85°C

DC24c 51 80 mA +125°C

Note 1: Data in “Typical” co lumn is at 3.3 V, 25°C unless otherwise stated.

2: The supply current is mainl y a function of the operating voltage and frequency. Other factors, such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have

an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1

driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VSS.

MCLR = VDD, WDT and FSCM are disabled. CPU, SRAM, program memory and data memory are

operational. No peripheral modules are operating; however, every peripheral is being clocked (PMD bits

are all zeroed).

3: These parameters are characterized, but are not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Idle Current (IIDLE): Core OFF Clock ON Base Current(2)

DC40d 7 20 mA -40°C

3.3V 10 MIPS

DC40a 6 7 mA +25°C

DC40b 6 10 mA +85°C

DC40c 6 20 mA +125°C

DC41d 10 20 mA -40°C

3.3V 16 MIPS

DC41a 8 mA +25°C9

DC41b 8 10 mA +85°C

DC41c 8 20 mA +125°C

DC42d 11 20 mA -40°C

3.3V 20 MIPS

DC42a 10 10 mA +25°C

DC42b 10 12 mA +85°C

DC42c 10 20 mA +125°C

DC43d 14 25 mA -40°C

3.3V 30 MIPS

DC43a 13 14 mA +25°C

DC43b 13 15 mA +85°C

DC43c 13 25 mA +125°C

DC44d 14 25 mA -40°C

3.3V 40 MIPS

DC44a 17 20 mA +25°C

DC44b 17 20 mA +85°C

DC44c 18 30 mA +125°C

Note 1: Data in “Typical” co lumn is at 3.3 V, 25°C unless otherwise stated.

2: Base IIDLE current is measured with core off, clock on and all modules turned off. Peripheral Module

Disable SFR registers are zeroed. All I/O pins are configured as inputs and pulled to VSS.

3: These parameters are characterized, but are not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C fo r Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Power-Down Current (IPD)(2)

DC60d 55 500 μA -40°C

3.3V Base Power-Down Current(3,4)

DC60a 63 300 μA +25°C

DC60b 85 350 μA +85°C

DC60c 146 600 μA +125°C

DC61d 8 15 μA -40°C

3.3V Watchdog Timer Current: ΔIWDT(3,5)

DC61a 2 3 μA +25°C

DC61b 2 2 μA +85°C

DC61c 3 5 μA +125°C

Note 1: Data in the Typica l column is at 3.3V, 25°C unless otherwise stated.

2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.

3: The Δ current is the additional current consumed when the module is enabled. Th is current should be

added to the base IPD current.

4: These currents are measured on the device containing the most memory in this family.

5: These parameters are characterized, but are not tested in manufacturing.

TABLE 24-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)

DC CHARACTERISTICS

Stand ard Op erating Cond itio ns: 3.0 V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter No. Typical(1,2) Max Doze

Ratio Units Conditions

DC73a 41 51 1:2 mA -40°C 3.3V 40 MIPSDC73f 20 28 1:64 mA

DC73g 19 24 1:128 mA

DC70a 40 46 1:2 mA +25°C 3.3V 40 MIPSDC70f 18 20 1:64 mA

DC70g 18 20 1:128 mA

DC71a 40 46 1:2 mA +85°C 3.3V 40 MIPSDC71f 18 25 1:64 mA

DC71g 18 20 1:128 mA

DC72a 39 55 1:2 mA +125°C 3.3V 40 MIPSDC72f 18 30 1:64 mA

DC72g 18 25 1:128 mA

Note 1: Data in the Typica l column is at 3.3V, 25°C unless otherwise stated.

2: Parameters with Doze ratios of 1:2 and 1:64 are characte rized, but ar e no t tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-9: DC CHA RACTERISTICS: I/O PIN INPUT SPECIFICATIONS

DC CHARACTERISTICS

Stand a rd Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA≤ +85°C for Industrial

-40°C ≤ TA≤+125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VIL Input Low Voltage

DI10 I/O pins VSS —0.2VDD V

DI15 MCLR VSS —0.2VDD V

DI16 I/O Pins with OSC1 or SOSCI VSS —0.2VDD V

DI18 SDAx, SCLx VSS — 0.3 VDD V SMBus disabled

DI19 SDAx, SCLx VSS — 0.8 V V SMBus enabled

VIH Input High Vo ltage

DI20 I/O Pins Not 5V Tolerant(4)

I/O Pins 5V Tolerant(4) 0.7 VDD

0.7 VDD —

—VDD

5.5 V

DI28 SDAx, SCLx 0.7 VDD — 5.5 V SMBus disabled

DI29 SDAx, SCLx 2.1 — 5.5 V SMBus enabled

ICNPU CNx Pull-up Current

DI30 50 250 400 μAVDD = 3.3V, VPIN = VSS

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: See “Pin Diagrams” for a list of digital-only and analog pins.

5: VIL source < (VSS – 0.3). Characterized but not tested.

6: Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not

tested.

7: Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.

8: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted pro-

vided the mathematical “absolute instantaneous” sum of the inpu t injection currents from all pins do not

exceed the specified limit. Characterized but not tested.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

IIL Input Leakage Current(2,3)

DI50 I/O Pins 5V Tolerant(4) ——±2μAVSS ≤ VPIN ≤ VDD,

Pin at high-impedance

DI51 I/O Pins Not 5V Tolerant(4) ——±1μAVSS ≤ VPIN ≤ VDD,

Pin at high-impedance,

-40°C ≤TA ≤+85°C

DI51a I/O Pins Not 5V Tolerant(4) ——±2μA Shared with external refer-

ence pins, -40°C ≤TA

≤+85°C

DI51b I/O Pins Not 5V Tolerant(4) ——±3.5μAVSS ≤ VPIN ≤ VDD, Pin at

high-impedance,

-40°C ≤TA ≤+125°C

DI51c I/O Pins Not 5V Tolerant(4) ——±8μA Analog pins share d with

external reference pins,

-40°C ≤TA ≤+125°C

DI55 MCLR ——±2μAVSS ≤ VPIN ≤ VDD

DI56 OSC1 — — ±2 μAVSS ≤ VPIN ≤ VDD,

XT and HS modes

TABLE 24-9: DC CHA RACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6 V

(unless otherwise stated)

Operating temperature -40°C ≤ TA≤ +85°C for Industrial

-40°C ≤ TA≤+125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: See “Pin Diagrams” for a list of digital-only and analog pins.

5: VIL source < (VSS – 0.3). Characterized but not tested.

6: Non-5V tol era n t pi n s VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not

tested.

7: Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.

8: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted pro-

vided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not

exceed the specified limit. Characterized but not tested.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

IICL Input Low Injection Current

DI60a 0 — -5(5,8) mA All pins except VDD, VSS,

AVDD, AVSS, MCLR, VCAP,

SOSCI, SOSCO, and RB14

IICH Input High Injection Current

DI60b 0 — +5(6,7,8) mA All pins except VDD, VSS,

AVDD, AVSS, MCLR, VCAP,

SOSCI, SOSCO, RB14,

and digital 5V-tolerant

designated pins

∑IICT Total Input Injection Current

DI60c (sum of all I/O and control pins) -20(9) —+20

(9) mA Absolute instantaneous

sum of all ± input injection

currents from all I/O pins

(| I

ICL + | IICH |) ≤ ∑IICT

TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)

DC CHARACTERISTICS

Stand a rd Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA≤ +85°C for Industrial

-40°C ≤ TA≤+125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: See “Pin Diagrams” for a list of digital-only and analog pins.

5: VIL source < (VSS – 0.3). Characterized but not tested.

6: Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not

tested.

7: Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.

8: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted pro-

vided the mathematical “absolute instantaneous” sum of the inpu t injection currents from all pins do not

exceed the specified limit. Characterized but not tested.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-10: DC CHARACTERISTICS: I/O PIN OUTPU T SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Indu strial

-40°C ≤ TA ≤ +125°C fo r Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

VOL Output Low Voltage

DO10 I/O ports — — 0.4 V IOL = 2 mA, VDD = 3.3V

DO16 OSC2/CLKO — — 0.4 V IOL = 2 mA, VDD = 3.3V

VOH Output High Volt a g e

DO20 I/O ports 2.40 — — V IOH = -2.3 mA, VDD = 3.3V

DO26 OSC2/CLKO 2.41 — — V IOH = -1.3 mA, VDD = 3.3V

TABLE 24-11: ELECTRICAL CHARACTERISTICS: BOR

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C fo r Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

BO10 VBOR BOR Event on VDD transition

high-to-low 2.40 — 2.55 V VDD

Note 1: Parameters are for design guidance only and are not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS

TABLE 24-12: DC CHARACTERISTICS: PROGRAM MEMORY

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Indu strial

-40°C ≤ TA ≤ +125°C fo r Extended

Param

No. Symbol Characteristic(3) Min Typ(1) Max Units Conditions

Program Flash Memory

D130 EPCell Endurance 10,000 — — E/W -40°C to +125°C

D131 VPR VDD for Read VMIN —3.6VVMIN = Minimu m operating

voltage

D132B VPEW VDD for Self-Timed Write VMIN —3.6VVMIN = Minimum operating

voltage

D134 TRETD Characteristic Retention 20 — — Year Provided no other specifications

are violated, -40°C to +125°C

D135 IDDP Supply Current during

Programming —10—mA

D136a TRW Row Write Time 1.32 — 1.74 ms TRW = 11064 FRC cycles,

TA = +85°C, See Note 2

D136b TRW Row Write Time 1.28 — 1.79 ms TRW = 11064 FRC cycles,

TA = +125°C, See Note 2

D137a TPE Page Erase Time 20.1 — 26.5 ms TPE = 168517 FRC cycles,

TA = +85°C, See Note 2

D137b TPE Page Erase Time 19.5 — 27.3 ms TPE = 168517 FRC cycles,

TA = +125°C, See Note 2

D138a TWW Word Write Cycle Time 42.3 — 55.9 μsTWW = 355 FRC cycles,

TA = +85°C, See Note 2

D138b TWW Word Write Cycle Time 41.1 — 57.6 μsTWW = 355 FRC cycles,

TA = +125°C, See Note 2

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: Other conditions: FRC = 7.37 MHz, TUN<5:0> = b'011111 (for Min), TUN<5:0> = b'100000 (for Max).

This parameter depends on the FRC accuracy (see Table 24-18) and the value of the FRC Oscillator Tun-

ing register (see Register 8-4). For complete details on calculating the Minimum and Maximum time see

Section 5.3 “Programming Operations”.

3: These parameters are assured by design, but are no t characterize d or tested in manufacturing.

Standard Operatin g Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristics Min Typ Max Units Comments

—C

EFC External Filter Capacitor

Value(1) 4.7 10 — μF Capacitor must be low

series resistance

(< 5 ohms)

Note 1: Typical VCAP voltage = 2.5V when VDD ≥ VDDMIN.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

24.2 AC Characteristics and Timing

Parameters

This section defines dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 AC characteristics and timing

parameters.

TABLE 24-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 24-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

TABLE 24-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherw ise state d)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Operating voltage VDD range as described in Table 24-1.

Param

No. Symbol Characteristic Min Typ Max Units Conditions

DO50 COSC2 OSC2/SOSC2 pin — — 15 pF In XT and HS modes when

external clock is used to drive

OSC1

DO56 CIO All I/O pins and OSC2 — — 50 pF EC mode

DO58 CBSCLx, SDAx — — 400 pF In I2C™ mode

VDD/2

VSS

RL=464Ω

CL= 50 pF for all pins except OSC2

15 pF for OSC2 output

Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-2: EXTERNAL CLOCK TIMING

Q1 Q2 Q3 Q4

OSC1

CLKO

Q1 Q2 Q3 Q4

OS20

OS25 OS30 OS30

OS40

OS41

OS31 OS31

TABLE 24-16: EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Stand ard Operating Cond ition s: 3.0 V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symb Characteristic Min Typ(1) Max Units Conditions

OS10 FIN External CLKI Frequency(4)

(External clocks allowed only

in EC and ECPLL modes)

DC — 40 MHz EC

Oscillator Crystal Frequency(5) 3.5

10 —

—

MHz

kHz

SOSC

OS20 TOSC TOSC = 1/FOSC(4) 12.5 — DC ns —

OS25 TCY Instruction Cycle Time(2,4) 25 — DC ns —

OS30 TosL,

TosH External Clock in (OSC1)(5)

High or Low Time 0.375 x TOSC — 0.625 x TOSC ns EC

OS31 TosR,

TosF External Clock in (OSC1)(5)

Rise or Fall Time ——20nsEC

OS40 TckR CLKO Rise Time(3,5) —5.2—ns—

OS41 TckF CL KO Fall Time(3,5) —5.2—ns—

OS42 GMExternal Oscillator

Transconductance(6) 14 16 18 mA/V VDD = 3.3V

TA = +25ºC

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: Instruction cycle period (TCY) equals two times the input oscillator time-base period. All speci fied values

are based on characterization data for that particular oscillator type under standard operating conditions

with the device executing code. Exc eeding these specified limits may result in an unstable oscillator

operation and/or higher than expected current consumption. All devices are tested to operate at “min.”

values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the

“max.” cycle time limit is “DC” (no clock) for all devices.

3: Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin.

4: These parameters are characterized by similarity, but are tested in manufacturing at FIN = 40 MHz only.

5: These parameters are characterized by similarity, but are not tested in manufacturing.

6: Data for this parameter is preliminary. This parameter is characterized, but is not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V)

AC CHARACTERISTICS

Stand ard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

OS50 FPLLI PLL Voltage Controlled

Oscillator (VCO) Input

Frequency Range(2)

0.8 — 8 MHz ECPLL, XTPLL modes

OS51 FSYS On-Chip VCO System

Frequency(3) 100 — 200 MHz —

OS52 TLOCK PLL Start-up Time (Lock Time)(3) 0.9 1.5 3.1 mS —

OS53 DCLK CLKO Stability (Jitter)(3) -3 0.5 3 % Measured over 100 ms

period

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance on ly

and are not tested.

2: These parameters are characterized by similari ty, but are tested in manufacturing at 7.7 MHz input only.

3: These parameters are characterized by similarity, but are not tested in manufactur ing. This specification is

based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time bases

or communication clocks use this formula:

Peripheral Clock Jitter DCLK

FOSC

Peripheral Bit Rate Clock

--------------------------------------------------------------

⎝⎠

⎛⎞

------------------------------------------------------------------------=

For example: Fosc = 32 MHz, DCLK = 3%, SPI bit rate clock, (i.e., SCK) is 2 MHz.

SPI SCK Jitter DCLK

32 MHz

2 MHz

--------------------

⎝⎠

⎛⎞

------------------------------ 3%

----------3%

--------0.75%====

TABLE 24-18: AC CHARACTERISTICS: INTERNAL RC ACCURACY

AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

Internal FRC Accuracy @ FRC Frequ ency = 7.37 MHz(1)

F20a FRC -2 — +2 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V

F20b FRC -5 — +5 % -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V

Note 1: Frequency calibrated at 25°C and 3.3V. TUN bits can be used to compensate for temperature drift.

TABLE 24-19: INTERNAL RC ACCURACY

AC CHARACTERISTICS

Standard Operatin g Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C fo r Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

LPRC @ 32.768 kHz(1,2)

F21a LPRC -15 ±6 +15 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V

F21b LPRC -40 — +40 % -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V

Note 1: Change of LPRC frequency as VDD changes.

2: LPRC impacts the Watchdog Timer Time-out Period (TWDT1). See Section 21.4 “Watchdog Timer

(WDT)” for more information.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-3: I/O TIMING CHARACTERISTICS

TABLE 24-20: I/O TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated )

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(2) Min Typ(1) Max Units Conditions

DO31 TIOR Port Output Rise Time — 10 25 ns —

DO32 TIOF Port Output Fall Time — 10 25 ns —

DI35 TINP INTx Pin High or Low Time (input) 25 — — n s —

DI40 TRBP CNx High or Low Time (input) 2 — — TCY —

Note 1: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

2: These parameters are characterized, but are not tested in manufacturing.

Note: Refer to Figure 24-1 for load conditions.

I/O Pin

(Input)

I/O Pin

(Output)

DI35

Old Value New Value

DI40

DO31

DO32

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-4: RESET, WATCHDOG TI MER, OSCILLATOR START-UP TIMER AND POWER-UP

TIMER TIMING CHARACTERISTICS

VDD

MCLR

Internal

POR

PWRT

Time-out

OSC

Time-out

Internal

Reset

Watchdog

Timer

Reset

SY11

SY10

SY20

SY13

I/O Pins

SY13

Note: Refer to Figure 24-1 for load conditions.

FSCM

Delay

SY35

SY30

SY12

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(2) Max Units Conditions

SY10 TMCLMCLR Pulse Width (low)(1) 2 — — μs -40°C to +85°C

SY11 TPWRT Power-up Timer Period(1) —2

128

— ms -40°C to +85°C

User programmable

SY12 TPOR Power-on Reset Delay(3) 31030μs -40°C to +85°C

SY13 TIOZ I/O High-Impedance from

MCLR Low or Watchdog

Timer Reset(1)

0.68 0.72 1.2 μs—

SY20 TWDT1 Watchdog Timer Time-out

Period (1) — — — ms See Section 21.4 “Watchdog

Timer (WDT)” and LPRC

parameter F21a (Table 24-21).

SY30 TOST Oscillator Start-up Time — 102 4

TOSC ——TOSC = OSC1 period

SY35 TFSCM Fail-Safe Clock Monitor

Delay(1) — 500 900 μs -40°C to +85°C

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: These parameters are characterized by similarity, but are not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-5: TIMER1, 2 AND 3 EXTERNAL CLOCK TIMING CHARACTERISTICS

Note: Refer to Figure 24-1 for load conditions.

Tx11

Tx15

Tx10

Tx20

TMRx OS60

TxCK

TABLE 24-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Indu strial

-40°C ≤ TA ≤ +125°C fo r Extended

Param

No. Symbol Characteristic(2) Min Typ Max Units Conditions

TA10 TTXH TxCK High Time Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA11 TTXL TxCK Low Ti me Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA15 TTXP TxCK Input Period Synchronous,

no prescaler TCY + 40 — — ns —

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

— — — N = prescale

value

(1, 8, 64, 256)

Asynchronous 20 — — ns —

OS60 Ft1 SOSC1/T1CK Oscillator Input

frequency Range (oscillator enabled

by setting bit TCS (T1CON<1>))

DC — 50 kHz —

TA20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY 1.5 TCY ——

Note 1: Timer1 is a Type A.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-23: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

TB10 TtxH TxCK High

Time Synchronous

mode Greater of:

20 or

(TCY + 20)/N

——ns

Must also meet

parameter TB15

N = prescale

value

(1, 8, 64, 256)

TB11 TtxL TxCK Low

Time Synchronous

mode Greater of:

20 or

(TCY + 20)/N

— — ns Must also meet

parameter TB15

N = prescale

value

(1, 8, 64, 256)

TB15 TtxP TxCK

Input

Period

Synchronous

mode Greater of:

40 or

(2 TCY + 40)/N

— — ns N = prescale

value

(1, 8, 64, 256)

TB20 TCKEXTMRL Delay from External TxCK

Clock Edge to Timer Incre-

ment

0.75 TCY + 40 — 1.75 TCY + 40 ns —

Note 1: These parameters are characterized, but are not tested in manufacturing.

TABLE 24-24: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

TC10 TtxH TxCK High

Time Synchronous TCY + 20 — — ns Must also meet

parameter TC15

TC11 TtxL TxCK Low

Time Synchronous TCY + 20 — — ns Must also meet

parameter TC15

TC15 TtxP TxCK Input

Period Synchronous,

with prescaler 2 TCY + 40 — — ns N = prescale

value

(1, 8, 64, 256)

TC20 TCKEXTMRL Delay from External TxCK

Clock Edge to Timer Incre-

ment

0.75 TCY + 40 — 1.75 TCY + 40 ns —

Note 1: These parameters are characterized, but are not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-6: TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS

TQ11

TQ15

TQ10

TQ20

QEB

POSCNT

TABLE 24-25: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6 V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

TQ10 TtQH TQCK High Time Synchronous,

with prescaler TCY + 20 — — ns Must also meet

parameter TQ15

TQ11 TtQL TQCK Low Time Synchronous,

with prescaler TCY + 20 — — ns Must also meet

parameter TQ15

TQ15 TtQP TQCP Input

Period Synchronous,

with prescaler 2 * TCY + 40 — — ns —

TQ20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY — 1.5 TCY ——

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-7: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS

FIGURE 24-8: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS

TABLE 24-26: INPUT CAPTURE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

IC10 TccL ICx Input Low Time No Prescaler 0.5 TCY + 20 — ns —

With Prescaler 10 — ns

IC11 TccH ICx Input High Time No Prescaler 0.5 TCY + 20 — ns —

With Prescaler 10 — ns

IC15 TccP ICx Input Period (TCY + 40 )/N — ns N = prescale

value (1, 4, 16)

Note 1: These parameters are characterized but not tested in manufacturing.

TABLE 24-27: OUTPUT COMP ARE MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

OC10 TccF OCx Output Fall Time — — — ns See parameter D032

OC11 TccR OCx Output Rise Time — — — ns See parameter D031

Note 1: These parameters are characterized but not tested in manufacturing.

ICx

IC10 IC11

IC15

Note: Refer to Figure 24-1 for load conditions.

OCx

OC11 OC10

(Output Compare

Note: Refer to Figure 24-1 for load conditions.

or PWM Mode)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-9: OC/PWM MODULE TIMING CHARACTERISTICS

OCFA

OCx

OC20

OC15

Active Tri-state

TABLE 24-28: SIMPLE OC/PWM MODE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

OC15 TFD Fault In put to PWM I/O

Change ——TCY + 20 ns —

OC20 TFLT Fault Input Pulse-Width TCY + 20 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-10: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS

FIGURE 24-11: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS

FLTA

PWMx

MP30

MP20

PWMx

MP11 MP10

Note: Refer to Figure 24-1 for load conditions.

TABLE 24-29: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated )

Operatin g te mperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

MP10 TFPWM PWM Output Fall Time — — — ns See parameter D032

MP11 TRPWM PWM Output Rise Time — — — ns See parameter D031

MP20 TFD Fault Input ↓ to PWM

I/O Change ——50ns —

MP30 TFH Minimum Pulse-Width 50 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-12: QEA/QEB INPUT CHARACTERISTICS

TQ30

TQ35

TQ31

QEA

(input)

TQ30

TQ35

TQ31

QEB

(input)

TQ36

QEB

Internal

TQ40TQ41

TABLE 24-30: QUADRATURE DECODER TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +8 5°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Typ(2) Max Units Conditions

TQ30 TQUL Quadrature Input Low Time 6 TCY —ns —

TQ31 TQUH Quadrature Input High Time 6 TCY —ns —

TQ35 TQUIN Quadrature Input Period 12 TCY —ns —

TQ36 TQUP Quadrature Phase Period 3 TCY —ns —

TQ40 TQUFL Fil ter Time to Recognize Low,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 3)

TQ41 TQUFH Filter Time to Recognize High,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 3)

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance onl y

and are not te ste d.

3: N = Index Channel Digital Filter Clock Divide Select bits. Refer to Section 15. “Quadrature Encoder

Interface (QEI)” (DS70208) in the “dsPIC33F/PIC24H Family Reference Manual ”. Please see the

Microchip web site for the latest dsPIC33F/PIC24H Family Reference Manual sections.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-13: QEI MODULE INDEX PULSE TIMING CHARACTERISTICS

QEA

(input)

Ungated

Index

QEB

(input)

TQ55

Index Internal

Position Coun-

ter Reset

TQ50

TQ51

TABLE 24-31: QEI INDEX PULSE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +8 5°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

TQ50 TqIL Filter Time to Recognize Low,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ51 TqiH Filter Time to Recognize High,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ55 Tqidxr Index Pulse Recognized to Position

Counter Reset (ungated index) 3 TCY —ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Alignment of index pulses to QEA and QEB is shown for position counter Reset timing only. Shown for

forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but

index pulse recognition occu rs on fa ll i n g edge.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-32: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY

FIGURE 24-14: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 0) TIMING

CHARACTERISTICS

FIGURE 24-15: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 1) TIMING

CHARACTERISTICS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extended

Maximum

Data Rate

Master

Transmit On ly

(Half-Duplex)

Master

Transmit/Receive

(Full-Duplex)

Slave

Transmit/Receive

(Full-Duplex) CKE CKP SMP

15 Mhz Table 24-33 ——0,10,10,1

9 Mhz — Table 24-34 —10,11

9 Mhz — Table 24-35 —00,11

15 Mhz — — Table 24-36 100

11 Mhz — — Table 24-37 110

15 Mhz — — Table 24-38 010

11 Mhz — — Table 24-39 000

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SP10

SP21

SP20

SP35

SP20

SP21

MSb LSb

Bit 14 - - - - - -1

SP30, SP31

Note: Refer to Figure 24-1 for load conditions.

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SP10

SP21

SP20

SP35

SP20

SP21

MSb LSb

Bit 14 - - - - - -1

SP30, SP31

Note: Refer to Figure 24-1 for load conditions.

SP36

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-33: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS

AC CHARACTERISTICS

Stan dard Operating Conditions: 3.0 V to 3.6V

(unless otherwise stated)

Operating temperature - 40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extende d

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscP Maximum SCK Frequency — — 15 MHz See Note 3

SP20 TscF SCKx Output Fall T ime — — — ns See parameter DO32

and Note 4

SP21 TscR SCKx Output Rise Time — — — ns See parameter DO31

and Note 4

SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32

and Note 4

SP31 TdoR SDOx Data Outpu t Rise Time — — — ns See parameter DO31

and Note 4

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —620ns —

SP36 TdiV2scH,

TdiV2scL SDOx Data Output Setup to

First SC Kx Edge 30 — — ns —

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPIx pins.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-16: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = X, SMP = 1) TIMING

CHARACTERISTICS

TABLE 24-34: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING

REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industria l

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscP Maximum SCK Frequency — — 9 MHz See Note 3

SP20 TscF SCKx Output Fall Time — — — ns See parameter DO32

and Note 4

SP21 TscR SCKx Output Rise Time — — — ns See parameter DO31

and Note 4

SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32

and Note 4

SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31

and Note 4

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge — 6 20 ns —

SP36 TdoV2sc,

TdoV2scL SDOx Data Output Setup to

First SCKx Edge 30 — — ns —

SP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data

Input to SCKx Edge 30 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 30 — — ns —

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this

specification.

4: Assumes 50 pF load on all SPIx pins.

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SP10

SP21

SP20

SP35

SP20

SP21

MSb LSb

Bit 14 - - - - - -1

SP30, SP31

Note: Refer to Figure 24-1 for load conditions.

SP36

SP41

MSb In LSb In

Bit 14 - - - -1

SDIx

SP40

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-17: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = X, SMP = 1) TIM ING

CHARACTERISTICS

TABLE 24-35: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING

REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industria l

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscP Maximum SCK Frequency — — 9 MHz -40ºC to +125ºC and

see Note 3

SP20 TscF SCKx Output Fall Time — — — ns See parameter DO32

and Note 4

SP21 TscR SCKx Output Rise Time — — — ns See parameter DO31

and Note 4

SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter DO32

and Note 4

SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31

and Note 4

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge — 6 20 ns —

SP36 TdoV2scH,

TdoV2scL SDOx Data Output Setup to

First SCKx Edge 30 — — ns —

SP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data

Input to SCKx Edge 30 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 30 — — ns —

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this

specification.

4: Assumes 50 pF load on all SPIx pins.

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SDIx

SP10

SP40 SP41

SP21

SP20

SP35

SP20

SP21

MSb LSb

Bit 14 - - - - - -1

MSb In LSb In

Bit 14 - - - -1

SP30, SP31

Note: Refer to Figure 24-1 for load conditions.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-18: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING

CHARACTERISTICS

SSx

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SDI

SP50

SP60

SDIx

SP30,SP31

MSb Bit 14 - - - - - -1 LSb

SP51

MSb In Bit 14 - - - -1 LSb In

SP35

SP52

SP73

SP72

SP73

SP70

SP40 SP41

Note: Refer to Figure 24-1 for load conditions.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-36: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING

REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6 V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscP Maximum SCK Input Frequency — — 15 MHz See Note 3

SP72 TscF SCKx Input Fall Time — — — ns See parameter DO32

and Note 4

SP73 TscR SCKx Input Rise Time — — — ns See parameter DO31

and Note 4

SP30 TdoF SDOx Data Output Fall T ime — — — ns See parameter DO32

and Note 4

SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31

and Note 4

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —620ns —

SP36 TdoV2scH,

TdoV2scL SDOx Data Output Setup to

First SCKx Edge 30 — — ns —

SP40 TdiV2scH,

TdiV2scL Setup Ti me of SDIx Data Input

to SCKx Edge 30 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 30 — — ns —

SP50 TssL2scH,

TssL2scL SSx ↓ to SCKx ↑ or SCKx Input 120 — — ns —

SP51 TssH2doZ SSx ↑ to SDOx Output

High-Impedance(4) 10 — 50 ns —

SP52 TscH2ssH

TscL2ssH SSx after SCKx Edge 1.5 TCY + 40 — — ns See Note 4

SP60 TssL2doV SDOx Data Output Valid after

SSx Edge ——50ns —

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must

not violate this specification.

4: Assumes 50 pF load on all SPIx pins.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-19: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING

CHARACTERISTICS

SSx

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SDI

SP50

SP60

SDIx

SP30,SP31

MSb Bit 14 - - - - - -1 LSb

SP51

MSb In Bit 14 - - - -1 LSb In

SP35

SP52

SP73

SP72

SP73

SP70

SP40 SP41

Note: Refer to Figure 24-1 for load conditions.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-37: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING

REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6 V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscP Maximum SCK Input Frequency — — 11 MHz See Note 3

SP72 TscF SCKx Input Fall Time — — — ns See parameter DO32

and Note 4

SP73 TscR SCKx Input Rise Time — — — ns See parameter DO31

and Note 4

SP30 TdoF SDOx Data Output Fall T ime — — — ns See parameter DO32

and Note 4

SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31

and Note 4

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —620ns —

SP36 TdoV2scH,

TdoV2scL SDOx Data Output Setup to

First SCKx Edge 30 — — ns —

SP40 TdiV2scH,

TdiV2scL Setup Ti me of SDIx Data Input

to SCKx Edge 30 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 30 — — ns —

SP50 TssL2scH,

TssL2scL SSx ↓ to SCKx ↑ or SCKx Input 120 — — ns —

SP51 TssH2doZ SSx ↑ to SDOx Output

High-Impedance(4) 10 — 50 ns —

SP52 TscH2ssH

TscL2ssH SSx after SCKx Edge 1.5 TCY + 40 — — ns See Note 4

SP60 TssL2doV SDOx Data Output Valid after

SSx Edge ——50ns —

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not

violate this specification.

4: Assumes 50 pF load on all SPIx pins.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-20: SPIx SLAVE MODE (FULL-DUPLEX CKE = 0, CKP = 1, SMP = 0) TIMING

CHARACTERISTICS

SSX

SCKX

(CKP = 0)

SCKX

(CKP = 1)

SDOX

SP50

SP40 SP41

SP30,SP31 SP51

SP35

MSb LSb

Bit 14 - - - - - -1

MSb In Bit 14 - - - -1 LSb In

SP52

SP73

SP72

SP73

SP70

Note: Refer to Figure 24-1 f or load conditions.

SDIX

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-38: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING

REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6 V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscP Maximum SCK Input Frequency — — 15 MHz See Note 3

SP72 TscF SCKx Input Fall Time — — — ns See parameter DO32

and Note 4

SP73 TscR SCKx Input Rise Time — — — ns See parameter DO31

and Note 4

SP30 TdoF SDOx Data Output Fall T ime — — — ns See parameter DO32

and Note 4

SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31

and Note 4

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —620ns —

SP36 TdoV2scH,

TdoV2scL SDOx Data Output Setup to

First SCKx Edge 30 — — ns —

SP40 TdiV2scH,

TdiV2scL Setup Ti me of SDIx Data Input

to SCKx Edge 30 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 30 — — ns —

SP50 TssL2scH,

TssL2scL SSx ↓ to SCKx ↑ or SCKx Input 120 — — ns —

SP51 TssH2doZ SSx ↑ to SDOx Output

High-Impedance(4) 10 — 50 ns —

SP52 TscH2ssH

TscL2ssH SSx after SCKx Edge 1.5 TCY + 40 — — ns See Note 4

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must

not violate this specification.

4: Assumes 50 pF load on all SPIx pins.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-21: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING

CHARACTERISTICS

SSX

SCKX

(CKP = 0)

SCKX

(CKP = 1)

SDOX

SP50

SP40 SP41

SP30,SP31 SP51

SP35

MSb LSb

Bit 14 - - - - - -1

MSb In Bit 14 - - - -1 LSb In

SP52

SP73

SP72

SP73

SP70

Note: Refer to Figure 24-1 for load conditions.

SDIX

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-39: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING

REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6 V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscP Maximum SCK Input Frequency — — 11 MHz See Note 3

SP72 TscF SCKx Input Fall Time — — — ns See parameter DO32

and Note 4

SP73 TscR SCKx Input Rise Time — — — ns See parameter DO31

and Note 4

SP30 TdoF SDOx Data Output Fall T ime — — — ns See parameter DO32

and Note 4

SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter DO31

and Note 4

SP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —620ns —

SP36 TdoV2scH,

TdoV2scL SDOx Data Output Setup to

First SCKx Edge 30 — — ns —

SP40 TdiV2scH,

TdiV2scL Setup Ti me of SDIx Data Input

to SCKx Edge 30 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 30 — — ns —

SP50 TssL2scH,

TssL2scL SSx ↓ to SCKx ↑ or SCKx Input 120 — — ns —

SP51 TssH2doZ SSx ↑ to SDOx Output

High-Impedance(4) 10 — 50 ns —

SP52 TscH2ssH

TscL2ssH SSx after SCKx Edge 1.5 TCY + 40 — — ns See Note 4

Note 1: These parameters are characterized, but are not tested in manufacturing.

2: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

3: The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not

violate this specification.

4: Assumes 50 pF load on all SPIx pins.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-22: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)

FIGURE 24-23: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE)

IM31 IM34

SCLx

SDAx

Start

Condition Stop

Condition

IM30 IM33

Note: Refer to Figure 24-1 for load conditions.

IM11 IM10 IM33

IM11 IM10

IM20

IM26 IM25

IM40 IM40 IM45

IM21

SCLx

SDAx

Out

Note: Refer to Figure 24-1 for load conditions.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-40: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated )

Operatin g te mperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(3) Min(1) Max Units Conditions

IM10 TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) — μs—

400 kHz mode TCY/2 (BRG + 1) — μs—

1 MHz mode(2) TCY/2 (BRG + 1) — μs—

IM11 THI:SCL Clock High Time 100 kHz mode T CY/2 (BRG + 1) — μs—

400 kHz mode TCY/2 (BRG + 1) — μs—

1 MHz mode(2) TCY/2 (BRG + 1) — μs—

IM20 TF:SCL SDAx and SCLx

Fall Time 100 kHz mode — 300 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 100 ns

IM21 TR:SCL SDAx and SCLx

Rise Time 100 kHz mode — 1000 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 300 ns

IM25 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns —

400 kHz mode 100 — ns

1 MHz mode(2) 40 — ns

IM26 THD:DAT Data Input

Hold Time 100 kHz mode 0 — μs—

400 kHz mode 0 0 .9 μs

1 MHz mode(2) 0.2 — μs

IM30 TSU:STA Start Condition

Setup Time 100 kHz mode TCY/2 (BRG + 1) — μs Only relevant for

Repeated Start

condition

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM31 THD:STA Start Condition

Hold Time 100 kHz mode TCY/2 (BRG + 1) — μs After this period the

first clock pulse is

generated

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM33 TSU:STO Stop Condition

Setup Time 100 kHz mode TCY/2 (BRG + 1) — μs—

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM34 THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) — ns —

Hold Time 400 kHz mode TCY/2 (BRG + 1) — ns

1 MHz mode(2) TCY/2 (BRG + 1) — ns

IM40 TAA:SCL Output Valid

From Clock 100 kHz mode — 3500 ns —

400 kHz mode — 10 00 ns —

1 MHz mode(2) — 400 ns —

IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be

free before a new

transmission can start

400 kHz mode 1.3 — μs

1 MHz mode(2) 0.5 — μs

IM50 CBBus Capacitive Loading — 400 pF —

IM51 TPGD Pulse Gobbler Delay 65 390 ns See Note 4

Note 1: BRG is the value of the I2C Baud Rate Generator . Refer to Section 19. “Inter-Integrated Circuit (I2C™)”

(DS70195) in the “dsPIC33F/PIC24H Family Reference Ma nual”. Please see the Microchip web site for

the latest dsPIC33F/PIC24H Family Reference Manual sections.

2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).

3: These parameters are characterized by similarity, but are not tested in manufacturing.

4: Typical value for this parameter is 130 ns.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-24: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)

FIGURE 24-25: I2Cx BUS DATA TI MING CHARACTERISTICS (SLAVE MODE)

IS31 IS34

SCLx

SDAx

Start

Condition Stop

Condition

IS30 IS33

IS30 IS31 IS33

IS11

IS10

IS20

IS26 IS25

IS40 IS40 IS45

IS21

SCLx

SDAx

Out

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-41: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param. Symbol Characteristic(2) Min Max Units Conditions

IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 — μs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 1.3 — μs Device must operate at a

minimum of 10 MHz

1 MHz mode(1) 0.5 — μs—

IS11 THI:SCL Clock High Time 100 kHz mode 4.0 — μs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 0.6 — μs Device must operate at a

minimum of 10 MHz

1 MHz mode(1) 0.5 — μs—

IS20 TF:SCL SDAx and SCLx

Fall Time 100 kHz mode — 300 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) — 100 ns

IS21 TR:SCL SDAx and SCLx

Rise Time 100 kHz mode — 1000 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) — 300 ns

IS25 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns —

400 kHz mode 100 — ns

1 MHz mode(1) 100 — ns

IS26 THD:DAT Data Input

Hold Time 100 kHz mode 0 — μs—

400 kHz mode 0 0.9 μs

1 MHz mode(1) 00.3μs

IS30 TSU:STA Start Condition

Setup Time 100 kHz mode 4.7 — μs Only relevant for Repeated

Start condition

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.25 — μs

IS31 THD:STA Start Condition

Hold Time 100 kHz mode 4.0 — μs After this period, the first

clock pulse is generated

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.25 — μs

IS33 TSU:STO Stop Condition

Setup Time 100 kHz mode 4.7 — μs—

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.6 — μs

IS34 THD:ST

OStop Condition

Hold Time 100 kHz mode 4000 — ns —

400 kHz mode 600 — ns

1 MHz mode(1) 250 ns

IS40 TAA:SCL Output Valid

From Clock 100 kHz mode 0 3500 ns —

400 kHz mode 0 1000 ns

1 MHz mode(1) 0 350 ns

IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free

before a new transmission

can start

400 kHz mode 1.3 — μs

1 MHz mode(1) 0.5 — μs

IS50 CBBus Capacitive Loading — 400 pF —

Note 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).

2: These parameters are characterized by similarity, but are not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-42: ADC MODULE SPECIFICATIONS

AC CHARACTERISTICS

Stan da r d Ope r a ting Conditions : 3. 0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+ 125°C for Extended

Param

No. Symb

ol Characteristic Min. Typ Max. Units Conditions

Device Supply

AD01 AVDD Module VDD Supply(2) Greater of

VDD – 0.3

or 3.0

— Lesser of

VDD + 0.3

or 3.6

V—

AD02 AVSS Module VSS Supply(2) VSS – 0.3 — VSS + 0.3 V —

Reference Inputs

AD05 VREFH Reference Voltage High AVSS + 2.5 — AVDD VSee Note 1

AD05a 3.0 — 3.6 V VREFH = AVDD

VREFL = AVSS = 0, see Note 2

AD06 VREFL Reference Voltage Low AVSS —AVDD – 2.5 V See Note 1

AD06a 0 — 0 V VREFH = AVDD

VREFL = AVSS = 0, see Note 2

AD07 VREF Absolute Reference

Voltage(2) 2.5 — 3.6 V VREF = VREFH - VREFL

AD08 IREF Current Drain —

—250

—550

10 μA

μAADC operating, See Note 1

ADC off, See Note 1

AD08a IAD Operating Current —

—7.0

2.7 9.0

3.2 mA

mA 10-bit ADC mode, See Note 2

12-bit ADC mode, See Note 2

Analog Input

AD12 VINH Input Voltage Range VINH(2) VINL —VREFH V This voltage reflects Sample

and Hold Channels 0, 1, 2,

and 3 (CH0-CH3), positive

input

AD13 VINL Input Voltage Range VINL(2) VREFL —AVSS + 1V V This voltage reflects Sample

and Hold Channels 0, 1, 2,

and 3 (CH0-CH3), negative

input

AD17 RIN Recommended Impedance

of Analog Voltage Source(3) —

——

—200

200 Ω

Ω10-bit ADC

12-bit ADC

Note 1: These parameters are not characterized or tested in manufacturing.

2: These parameters are characterized, but are not tested in manufacturing.

3: These parameters are assured by design, but are not characterized or tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-43: ADC MODULE SPECIFICATIONS (12-BIT MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-(3)

AD20a Nr Resolution(4) 12 data bits bits —

AD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AVSS = V REFL = 0V, A VDD

= VREFH = 3.6V

AD22a DNL Differential Nonline arity >-1 — <1 LSb VINL = AVSS = V REFL = 0V, AVDD

= VREFH = 3.6V

AD23a GERR Gain Error — 3.4 10 LSb VINL = AVSS = VREFL = 0V, AVDD

= VREFH = 3.6V

AD24a EOFF Offset Error — 0.9 5 LSb VINL = AVSS = V REFL = 0V, AVDD

= VREFH = 3.6V

AD25a — Monotonicity — — — — Guaranteed(1)

ADC Accuracy (12-bit Mode) – Measurem ents with internal VREF+/VREF-(3)

AD20a Nr Resolution(4) 12 data bits bits —

AD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AV SS = 0V, AVDD = 3.6V

AD22a DNL Differential Nonline arity >-1 — <1 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD23a GERR Gain Error — 10.5 20 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD24a EOFF Offset Error — 3.8 10 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD25a — Monotonicity — — — — Guaranteed(1)

Dynamic Performance (12-bit Mod e)(2)

AD30a THD Total Harmonic Distortion — — -75 dB —

AD31a SINAD Signal to Noise and

Distortion 68.5 69.5 — dB —

AD32a SFDR S purious Free Dynamic

Range 80 — — dB —

AD33a FNYQ Input Signal Bandwidth — — 2 50 kHz —

AD34a ENOB Effective Number of Bits 11.09 11.3 — bits —

Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

3: These parameters are characterized, but are tested at 20 ksps only.

4: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-44: ADC MODULE SPECIFICATIONS (10-BIT MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤TA ≤+125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

ADC Accuracy (10-bit Mode) – Measurements with external VREF+/VREF-(3)

AD20b Nr Resolution(4) 10 data bits bits —

AD21b INL Integral Nonlinearity -1.5 — +1.5 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD22b DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD23b GERR Gain Error — 3 6 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD24b EOFF Offset Error — 2 5 LSb VINL = AVSS = V REFL = 0V,

AVDD = VREFH = 3.6V

AD25b — Monotonicity — — — — Guaranteed(1)

ADC Accuracy (10-bit Mode) – Measurem ents with internal VREF+/VREF-(3)

AD20b Nr Resolution(4) 10 data bits bits —

AD21b INL Integral Nonlinearity -1 — +1 LSb VINL = AV SS = 0V, AVDD = 3.6V

AD22b DNL Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD23b GERR Gain Error — 7 15 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD24b EOFF Offset Error — 3 7 LSb VINL = AVSS = 0V, AVDD = 3.6V

AD25b — Monotonicity — — — — Guaranteed(1)

Dynamic Performance (10-bit Mod e)(2)

AD30b THD Total Harmonic Distortion — — -64 dB —

AD31b SINAD Signal to Noise and

Distortion 57 58.5 — dB —

AD32b SFDR Spurious Free Dynamic

Range 72 — — dB —

AD33b FNYQ Input Signal Bandwidth — — 550 kHz —

AD34b ENOB Effective Number of Bits 9.16 9.4 — bits —

Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

3: These parameters are characterized, but are tested at 20 ksps only.

4: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-26: ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS

(ASAM = 0, SSRC<2:0> = 000)

TABLE 24-45: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMEN TS

AD55

TSAMP

Clear SAMPSet SAMP

AD61

ADCLK

Instruction

SAMP

AD60

DONE

AD1IF

1 2 3 4 5 6 87

1– Software sets AD1CON. SAMP to start sampling.

2– Sampling starts after discharge period. TSAMP is described in

3– Software clears AD1CON. SAMP to start conversion.

4– Sampling ends, conversion sequence starts.

5– Convert bit 11.

9– One TAD for end of conversion.

AD50

6– Convert bit 10.

7– Convert bit 1.

8– Convert bit 0.

Execution

in the “dsPIC33F/PIC24H Family Reference Manual”.

Section 16. “Analog-to-Digital Converter (ADC)” (DS70183)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C fo r Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Clock Parameters

AD50 TAD ADC Clock Period(2) 117.6 — — ns —

AD51 tRC ADC Internal RC Oscillator

Period(2) — 250 — ns —

Conversion Rate

AD55 tCONV Conversion Time(2) — 14 TAD —ns —

AD56 FCNV Throughput Rate(2) ——500Ksps —

AD57 TSAMP Sample Time(2) 3.0 TAD —— — —

Timing Parameters

AD60 tPCS Conversion Start from Sample

Trigger(2) 2.0 TAD — 3.0 TAD — Auto convert trigger not

selected

AD61 tPSS Sample Start from Setting

Sample (SAMP) bit(2) 2.0 TAD — 3.0 TAD ——

AD62 tCSS Conversion Comp letion to

Sample St art (ASAM = 1)(2) — 0.5 TAD —— —

AD63 tDPU Time to Stabilize Analog Stage

from ADC Off to ADC On(2) ——20μs—

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz may affect linearity

performance, especially at elevated temperatures.

2: These parameters are characterized but not tested in manufacturing .

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 24-27: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS

(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)

FIGURE 24-28: ADC CONVERSION (10-BIT MODE) T IMING CHARACTERISTICS (CHP S<1:0> = 01,

SIMSAM = 0, ASAM = 1, SSRC<2: 0> = 111, SAMC<4:0> = 00001)

AD55

TSAMP

Clear SAMPSet SAMP

AD61

ADCLK

Instruction

SAMP

AD60

DONE

AD1IF

1 2 3 4 5 6 8 5 6 7

1– Software sets AD1CON. SAMP to start sampling.

2– Sampling starts after discharge period. TSAMP is described in

3– Software clears AD1CON. SAMP to start conversion.

4– Sampling ends, conversion sequence starts.

5– Convert bit 9.

8– One TAD for end of conversion.

AD50

AD55

6– Convert bit 8.

7– Convert bit 0.

Execution

in the “dsPIC33F/PIC24H Family Reference Manual”.

Section 16. “Analog-t o-Digital Converter (ADC)” (DS70183)

1 2 3 4 5 6 4 5 6 8

1– Software sets AD1CON. ADON to start AD operation.

2– Sampling starts after discharge period. TSAMP is described in

3– Convert bit 9.

4– Convert bit 8.

5– Convert bit 0.

7 3

6– One TAD for end of conversion.

7– Begin conversion of next channel.

8– Sample for time specified by SAMC<4:0>.

ADCLK

Instruction Set ADON

Execution

SAMP TSAMP

AD1IF

DONE

AD55 AD55 TSAMP AD55

AD50

Section 16. “Analog-to-Digital Converter (ADC)” (DS70183)

in the “dsPIC33F/PIC24H Family Reference Manual”.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 24-46: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditio ns: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature - 40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ(1) Max. Units Conditions

Clock Parameters

AD50 TAD ADC Clock Period(1) 76 — — ns —

AD51 tRC ADC Internal RC Oscillator

Period(1) — 250 — ns —

Conversion Rate

AD55 tCONV Conversion Time(1) —12 TAD —— —

AD56 FCNV Throughput Rate(1) ——1.1Msps —

AD57 TSAMP Sample Time(1) 2.0 TAD ——— —

Timing Parameters

AD60 tPCS Conversion Start from Sample

Trigger(1) 2.0 TAD — 3.0 TAD — Auto-Convert Trigger

not selected

AD61 tPSS Sample Start from Setting

Sample (SAMP) bit(1) 2.0 TAD — 3.0 TAD ——

AD62 tCSS Conversion Completion to

Sample Start (ASAM = 1)(1) — 0.5 TAD —— —

AD63 tDPU Time to Stabilize Analog Stage

from ADC Off to ADC On(1) ——20μs—

Note 1: These parameters are characterized but not tested in manufacturing .

2: Because the sample caps will eventually lose charge, clock rates below 10 kHz may affect linearity

performance, especially at elevated temperatures.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

25.0 HIGH TEMPERATURE ELECTRICAL CHARACTERISTICS

This section provides a n overview of dsPIC33FJ32MC202/204 and dsPIC33 FJ16MC304 electrical characteristi cs for

devices operating in an ambient temperature range of -40°C to +150°C.

The specifications between -40°C to +150°C are identical to those shown in Section 24.0 “Electrical Characteristics”

for operation between -40°C to +125°C, with the exception of the parameters listed in this section.

Parameters in this section begin with an H, which denotes High temperature. For example, parameter DC10 in

Section 24.0 “Electrical Characteristics ” is the Industrial and Extended temperature equivalent of HDC10.

Absolute maximum ratings for the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 high temperature devices are

listed below . Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional

operation of the device at these or any other conditions above the parameters indicated in the operation listings of this

specification is not implied.

Absolute Maximum Ratings(1)

Ambient temperature under bias(4) .........................................................................................................-40°C to +150°C

Storage temperature.............................................................................................................................. -65°C to +160°C

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Vo ltage on any pin that is not 5V tolerant with respect to VSS(5) ....................................................-0.3V to (VDD + 0.3V)

Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(5) .................................................... -0.3V to 3.6V

Voltage on any 5V tolerant pin with respect to VSS when VDD ≥ 3.0V(5) .................................................... -0.3V to 5.6V

Maximum current out of VSS pin..................... ......................... ......................... .............. .......................... ..............60 mA

Maximum current into VDD pin(2).............................................................................................................................60 mA

Maximum junction temperature.............................................................................................................................+155°C

Maximum output current sunk by any I/O pin(3).............................................. .............. ......................... ...................1 mA

Maximum output current sourced by any I/O pin(3).................. ......................... .......................... .............. ................1 mA

Maximum current sunk by all ports combined ........................................................................................................10 mA

Maximum current sourced by all ports combined(2) ...... ......................... .............. .............. .............. .............. .........10 mA

Note: Programming of the Flash memory is not allowed above 125°C.

Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the

device. This is a stress rating only, and functional operation of the device at those or any other conditions

above those indicated in the operation listings o f this specification i s not implied. Exposure to maximum

rating conditions for extended periods can affect device reliability.

2: Maximum allowable current is a function of devi c e maximum power dissipation (see Table 25-2).

3: Unlike devices at 125°C a nd below, the specifications in this section also apply to the CLKOUT, VREF+,

VREF-, SCLx, SDAx, PGCx and PGDx pins.

4: AEC-Q100 reliability testing for devices intended to operate at 150°C is 1,000 hours. Any design in which

the total operating time from 125°C to 150°C will be greater than 1,000 hours is not warranted without prior

written approval from Microchip Technology Inc.

5: Refer to the “Pin Diagrams” section for 5V tolerant pins.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

25.1 High Temperature DC Characteristics

TABLE 25-1: OPERATING MIPS VS. VOLTAGE

TABLE 25-2: THERMAL OPERATING CONDITIONS

TABLE 25-3: DC TEMPER ATURE AND VOLTAGE SPECIFICATIONS

TABLE 25-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

Characteristic VDD Range

(in Volts) Temperature Range

(in °C)

Max MIPS

dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304

HDC5 3.0V to 3.6V -40°C to +150°C 20

Rating Symbol Min Typ Max Unit

High Temperature Devices

Operating Junction Temperature Rang e TJ-40 — +155 °C

Operating Ambient Temperature Range TA-40 — +150 °C

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD - Σ IOH) PDPINT + PI/OW

I/O Pin Power Dissipation:

I/O = Σ ({VDD - VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power Dissipation PDMAX (TJ - TA)/θJA W

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Parameter

No. Symbol Characteristic Min Typ Max Units Conditions

Operating Voltage

HDC10 Supply Voltage

VDD — 3.0 3.3 3.6 V -40°C to +150°C

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Parameter

No. Typical Max Units Conditions

Power-Down Current (IPD)

HDC60e 250 2000 μA +150°C 3.3V Base Power-Down Current(1,3)

HDC61c 3 5 μA +150°C 3.3V Watchdog Timer Current: ΔIWDT(2,4)

Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.

2: The Δ current is the additional current consumed when the module is enabled. Th is current should be

added to the base IPD current.

3: These currents are measured on the device containing the most memory in this family.

4: These parameters are characterized, but are not tested in manufacturing.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 25-5: DC CHARACTERISTICS: DOZE CURRENT (IDD)

TABLE 25-6: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)

TABLE 25-7: DC CHA RACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS

DC CHARACTERISTICS

Stand ard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IPD)(1)

HDC20 19 35 mA +150°C 3.3V 10 MIPS

HDC21 27 45 mA +150°C 3.3V 16 MIPS

HDC22 33 55 mA +150°C 3.3V 20 MIPS

Note 1: These parameters are characterized, but are not tested in manufacturing.

DC CHARACTERISTICS

Stand ard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Parameter

No. Typical(1) Max Doze

Ratio Units Conditions

HDC72a 39 45 1:2 mA +150°C 3.3V 20 MIPSHDC72f 18 25 1:64 mA

HDC72g 18 25 1:128 mA

Note 1: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

VOL Output Low Voltage

HDO10 I/O ports — — 0.4 V IOL = 1 mA, VDD = 3.3V

HDO16 OSC2/CLKO — — 0.4 V IOL = 1 mA, VDD = 3.3V

VOH Output High Voltage

HDO20 I/O ports 2.40 — — V IOH = -1 mA, VDD = 3.3V

HDO26 OSC2/CLKO 2.41 — — V IOH = -1 mA, VDD = 3.3V

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 25-8: DC CHARACTERISTICS: PROGRAM MEMORY

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

Program Flash Memory

HD130 EPCell Endurance 10,000 — — E/W -40°C to +150°C(2)

HD134 TRETD Characteristic Retention 20 — — Year 1000 E/W cycles or less and no

other specifications are violated

Note 1: These parameters are assured by design, but are not characterized or tested in manufacturing.

2: Programming of the Flash memory is not allowed above 125°C.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

25.2 AC Characteristics and Timing

Parameters

The information contained in this section defines

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

AC characteristics and timing parameters for high

temperature devices. However, all AC timing

specifications in this section are the same as those in

Section 24.2 “AC Characteristics and Timing

Parameters”, with the exception of the parameters

listed in this section.

Parameters in this section begin with an H, which

denotes High temperature. For example, parameter

OS53 in Section 24.2 “AC Characteristics and

Timing Parameters” is the Industrial and Extended

temperature equivalent of HOS53.

TABLE 25-9: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 25-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

TABLE 25-10: PLL CLOCK TIMING SPECIFICATIONS

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherw ise stated )

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Operating voltage VDD range as described in Table 25-1.

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwis e stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

HOS53 DCLK CLKO Stability (Jitter)(1) -5 0.5 5 % Measured o v er 1 00 m s

period

Note 1: These parameters are characterized by similarity , but are not tested in manufacturing. This specification is

based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time

bases or communication clocks use this formula:

VDD/2

VSS

RL=464Ω

CL= 50 pF for all pins except OSC2

15 pF for OSC2 output

Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2

Peripheral Clock Jitter DCLK

FOSC

Peripheral Bit Rate Clock

--------------------------------------------------------------

⎝⎠

⎛⎞

------------------------------------------------------------------------=

For example: Fosc = 32 MHz, DCLK = 5%, SPI bit rate clock, (i.e., SCK) is 2 MHz.

SPI SCK Jitter DCLK

32 MHz

2 MHz

--------------------

⎝⎠

⎛⎞

------------------------------ 5%

----------5%

--------1.25%====

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 25-11: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS

TABLE 25-12: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

HSP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —1025ns —

HSP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data Input

to SCKx Edge 28 — — ns —

HSP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 35 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

CHARACTERISTICS

Stand ard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +15 0°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

HSP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge —1025ns —

HSP36 TdoV2sc,

TdoV2scL SDOx Data Output Setup to

First SCKx Edge 35 — — ns —

HSP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data Input

to SCKx Edge 28 — — ns —

HSP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 35 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing .

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 25-13: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS

TABLE 25-14: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwis e stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

HSP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge ——35ns —

HSP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Data Input

to SCKx Edge 25 — — ns —

HSP41 TscH2diL,

TscL2diL Hold Time of SDIx Dat a Input to

SCKx Edge 25 — — ns —

HSP51 TssH2doZ SSx ↑ to SDOx Output

High-Impedance 15 — 55 ns See Note 2

Note 1: These parameters are characterized but not tested in manufacturing.

2: Assumes 50 pF load on all SPIx pins.

CHARACTERISTICS

Standard Operatin g Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

HSP35 TscH2doV,

TscL2doV SDOx Data Output Valid after

SCKx Edge — — 35 ns —

HSP40 TdiV2scH,

TdiV2scL Setup Time of SDIx Dat a Input

to SCKx Edge 25 — — ns —

HSP41 TscH2diL,

TscL2diL Hold Time of SDIx Data Input

to SCKx Edge 25 — — ns —

HSP51 TssH2doZ SSx ↑ to SDOX Output

High-Impedance 15 — 55 ns See Note 2

HSP60 TssL2doV SDOx Data Output Valid after

SSx Edge — — 55 ns —

Note 1: These parameters are characterized but not tested in manufacturing .

2: Assumes 50 pF load on all SPIx pins.

TABLE 25-15: INTERNAL RC ACCURACY

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤TA≤+150°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

LPRC @ 32.768 kHz(1,2)

HF21 LPRC -70 — +70 % -40°C ≤ TA ≤ +150°C VDD = 3.0-3.6V

Note 1: Change of LPRC frequency as VDD changes.

2: LPRC accuracy impacts the Watchdog Timer Time-out Period (TWDT1). See Section 21.4 “Watchdog

Timer (WDT)” for more information.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 25-16: ADC MODULE SPECIFICATIONS

TABLE 25-17: ADC MODULE SPECIFICATIONS (12-BIT MODE)(3)

CHARACTERISTICS

Stand ard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +15 0°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

Reference Inputs

HAD08 IREF Current Drain —

—250

—600

50 μA

μAADC operating, See Note 1

ADC off, See Note 1

Note 1: These parameters are not characterized or tested in manufacturing.

2: These parameters are characterized, but are not tested in manufacturing.

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

ADC Accuracy (12-bit Mode) – Measurements with External VREF+/VREF-(1)

HAD20a Nr Resolution(3) 12 data bits bits —

HAD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD22a DNL Differential Nonlinearity > -1 — < 1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD23a GERR Gain Error -2 — 10 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD24a EOFF Offset Error -3 — 4 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

ADC Accuracy (12-bit Mode) – Measurements with Internal VREF+/VREF-(1)

HAD20a Nr Resolution(3) 12 data bits bits —

HAD21a INL Integral Nonlinearity -2 — +2 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD22a DNL Differential Nonlinearity > -1 — < 1 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD23a GERR Gain Error 2 — 20 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD24a EOFF Offset Error 2 — 10 LSb VINL = AVSS = 0V, AVDD = 3.6V

Dynamic Performance (12-bit Mode)(2)

HAD33a FNYQ Input Signal Bandwidth — — 200 kHz —

Note 1: These parameters are characterized, but are tested at 20 ksps only.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

3: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 25-18: ADC MODULE SPECIFICATIONS (10-BIT MODE)(3)

CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V (unless otherwis e stated)

Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

ADC Accuracy (10-bit Mode) – Measurements with External VREF+/VREF-(1)

HAD20b Nr Resolution(3) 10 data bits bits —

HAD21b INL Integral Nonlinearity -3 — 3 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD22b DNL Differential Nonlinearity > -1 — < 1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD23b GERR Gain Error -5 — 6 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

HAD24b EOFF Offset Error -1 — 5 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

ADC Accuracy (10-bit Mode) – Measurements with Internal V REF+/VREF-(1)

HAD20b Nr Resolution(3) 10 data bits bits —

HAD21b INL Integral Nonlinearity -2 — 2 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD22b DNL Differential Nonlinearity > -1 — < 1 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD23b GERR Gain Error -5 — 15 LSb VINL = AVSS = 0V, AVDD = 3.6V

HAD24b EOFF Offset Error -1.5 — 7 LSb VINL = AVSS = 0V, AVDD = 3.6V

Dynamic Performance (10-bit Mode)(2)

HAD33b FNYQ Input Signal Bandwidth — — 400 kHz —

Note 1: These parameters are characterized, but are tested at 20 ksps only.

2: These parameters are characterized by similarity, but are not tested in manufacturing.

3: Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 25-19: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS

TABLE 25-20: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS

CHARACTERISTICS

Stand ard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +15 0°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

Clock Parameters

HAD50 TAD ADC Clock Period(1) 147 — — ns —

Conversion Rate

HAD56 FCNV Throughput Rate(1) — — 400 Ksps —

Note 1: These parameters are characterized but not tested in manufacturing .

CHARACTERISTICS

Stand ard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +15 0°C for High Temperature

Param

No. Symbol Characteristic Min Typ Max Units Conditions

Clock Parameters

HAD50 TAD ADC Clock Period(1) 104 — — ns —

Conversion Rate

HAD56 FCNV Throughput Rate(1) ——800Ksps —

Note 1: These parameters are characterized but not tested in manufacturing .

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

26.0 PACKAGING INFORMATION

26.1 Package Marking Information

Legend: XX...X Customer-speci fi c informatio n

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next

line, thus limiting the number of available characters for customer-specific information.

28-Lead SPDIP

XXXXXXXXXXXXXXXXX

YYWWNNN

Example

dsPIC33FJ32MC

0730235

28-Lead SOI C

XXXXXXXXXXXXXXXXXXXX

YYWWNNN

Example

dsPIC33FJ32MC

0730235

202-E/SP

202-E/SO

28-Lead SSOP

XXXXXXXXXXXX

YYWWNNN

Example

33FJ32MC

202-E/SS

0730235

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

26.1 Package Marking Information (Continued)

Legend: XX...X Customer-speci fi c informatio n

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next

line, thus limiting the number of available characters for customer-specific information.

28-Lead QFN- S

XXXXXXXX

YYWWNNN

Example

33FJ32MC

202E/MM

0730235

XXXXXXXXXX

44-Lead QF N

XXXXXXXXXX

YYWWNNN

dsPIC33FJ32

Example

MC204-E/ML

0730235

44-Lea d TQ F P

XXXXXXXXXX

YYWWNNN

Example

dsPIC33FJ

32MC204

0730235

-E/PT

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

26.2 Package Details

28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e .100 BSC

Top to Seating Plane A – – .200

Molded Package Thickness A2 .120 .135 .150

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .290 .310 .335

Molded Package Width E1 .240 .285 .295

Overall Length D 1.345 1.365 1.400

Tip to Seating Plane L .110 .130 .150

Lead Thickness c .008 .010 .015

Upper Lead Width b1 .040 .050 .070

Lower Lead Width b .014 .018 .022

Overall Row Spacing § eB – – .430

NOTE 1

Microchip Technology Drawing C04-070B

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

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1XPEHURI3LQV 1 

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2YHUDOO+HLJKW $ ± ± 

0ROGHG3DFNDJH7KLFNQHVV $   

6WDQGRII $  ± ±

2YHUDOO:LGWK (   

0ROGHG3DFNDJH:LGWK (   

2YHUDOO/HQJWK '   

)RRW/HQJWK /   

)RRWSULQW / 5()

/HDG7KLFNQHVV F  ± 

)RRW$QJOH   

/HDG:LGWK E  ± 

NOTE 1 b

0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

/HDG3ODVWLF4XDG)ODW1R/HDG3DFNDJH00±[[PP%RG\>4)16@

ZLWKPP&RQWDFW/HQJWK

1RWHV

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 3DFNDJHLVVDZVLQJXODWHG

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%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV

5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\

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KWWSZZZPLFURFKLSFRPSDFNDJLQJ

8QLWV 0,//,0(7(56

'LPHQVLRQ/LPLWV 0,1 120 0$;

1XPEHURI3LQV 1 

3LWFK H %6&

2YHUDOO+HLJKW $   

6WDQGRII $   

&RQWDFW7KLFNQHVV $ 5()

2YHUDOO:LGWK ( %6&

([SRVHG3DG:LGWK (   

2YHUDOO/HQJWK ' %6&

([SRVHG3DG/HQJWK '   

&RQWDFW:LGWK E   

&RQWDFW/HQJWK /   

&RQWDFWWR([SRVHG3DG .  ± ±

EXPOSED

PAD

NOTE 1

TOP VIEW BOTTOM VIEW

0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

/HDG3ODVWLF4XDG)ODW1R/HDG3DFNDJH00±[[PP%RG\>4)16@

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KWWSZZZPLFURFKLSFRPSDFNDJLQJ

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 44

Pitch e 0.65 BSC

Overall Height A 0.80 0.90 1.00

Standoff A1 0.00 0.02 0.05

Contact Thickness A3 0.20 REF

Overall Width E 8.00 BSC

Exposed Pad Width E2 6.30 6.45 6.80

Overall Length D 8.00 BSC

Exposed Pad Length D2 6.30 6.45 6.80

Contact Width b 0.25 0.30 0.38

Contact Length L 0.30 0.40 0.50

Contact-to-Exposed Pad K 0.20 – –

DEXPOSED

PAD

NOTE 1

BOTTOM VIEW

TOP VIEW

A3 A1

Microchip Technology Drawing C04-103B

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

/HDG3ODVWLF4XDG)ODW1R/HDG3DFNDJH0/±[PP%RG\>4)1@

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KWWSZZZPLFURFKLSFRPSDFNDJLQJ

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Leads N 44

Lead Pitch e 0.80 BSC

Overall Height A – – 1.20

Molded Package Thickness A2 0.95 1.00 1.05

Standoff A1 0.05 – 0.15

Foot Length L 0.45 0.60 0.75

Footprint L1 1.00 REF

Foot Angle φ0° 3.5° 7°

Overall Width E 12.00 BSC

Overall Length D 12.00 BSC

Molded Package Width E1 10.00 BSC

Molded Package Length D1 10.00 BSC

Lead Thickness c 0.09 – 0.20

Lead Width b 0.30 0.37 0.45

Mold Draft Angle Top α11° 12° 13°

Mold Draft Angle Bottom β11° 12° 13°

NOTE 1NOTE 2

123

Microchip Technology Drawing C04-076B

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

APPENDIX A: REVISION HISTORY

Revision A (February 2007)

This is the initial released version of this document.

Revision B (May 2007)

This revision includes the following corrections and

updates:

• Minor typographical and formatting co rrections

throughout the data sheet text.

• New content:

- Addition of bullet item (16-word conversion

result buffer) (see Section 20.1 “Key

Features”)

• Updated register map information for RPINR14

and RPINR15 (see Table 4-16)

• Figure updates:

- Updated Oscillator System Diagram (see

Figure 8-1)

- Updated WDT Block Diagram (see

Figure 21-2)

• Equation update :

- Serial Clock Rate (see Equation 17-1)

• Register updates:

- Peripheral Pin Select Input Registers (see

- Update d ADC1 Input Channel 0 Select

• The following tables in Section 24.0 “Electrical

Characteristics” have been updated with

preliminary values:

- Updated Max MIPS for -40°C to +125°C

Temp Range (see Tabl e 24-1)

- Updated parameter DC18 (see Table 24-4)

- Added new parame ters for +125°C, and

updated Typical and Max values for most

parameters (see Table 24-5)

- Added new parame ters for +125°C, and

updated Typical and Max values for most

parameters (see Table 24-6)

- Added new parame ters for +125°C, and

updated Typical and Max values for most

parameters (see Table 24-7)

- Added new parame ters for +125°C, and

updated Typical and Max values for most

parameters (see Table 24-8)

- Updated parameter DI51, added parameters

DI51a, DI51b, and DI51c (see Table 24-9)

- Added Note 1 (se e Table 24-11)

- Updated parameters OS10 and OS30 (see

Table 24-16)

- Updated paramete r OS52 (see Table 24-17)

- Updated paramete r F20, added Note 2 (see

Table 24-18)

- Updated parameter F21 (see Table 24-19)

- Updated paramete r TA15 (see Table 24-22)

- Updated paramete r TB15 (see Table 24-23)

- Updated parameter TC15 (see Table 24-24)

- Updated paramete r IC15 (see Table 24-26)

- Updated parameters AD05, AD06, AD07,

AD08, AD10 through AD13 and AD17; added

parameters AD05a and AD06a; added Note

2; modified ADC Accuracy headings to

include measurement information (see

Table 24-38)

- Separated the ADC Module Specifications

table into three tables (see Table 24-38,

Table 24-39, and Table 24-40)

- Updated parameter AD50 (see Table 24-41)

- Updated parameters AD50 and AD57 (see

Table 24-42)

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Revision C (June 2008)

This revision includes minor typographical and

formatting changes throughout the data sheet text.

The major chang es are referenced by their respective

section in the following table.

TABLE A-1: MAJOR SECTION UPDATES

Section Name Update Description

“High-Performance, 16-b it Digital

Signal Controllers” Added Extended Interrupts column to Remappable Peripherals in the

Controller Families table and Note 3 (see Table 1).

Added Note 1 to all pin diagrams, which references RPn pin usag e by

remappable peripherals (see “Pin Diagrams”).

Section 1.0 “Device Overview” Changed PORTA pin name from RA15 to RA10 (see Table 1-1).

Section 4.0 “Memory Organization” Added SFR definitions (ACCAL, ACCAH, ACCAU, ACCBL, ACCBH, and

ACCBU) to the CPU Core Register Map (see Table 4-1).

Updated Reset value for CORCON (see Table 4-1).

Updated Reset values for the follo wing SFRs: IPC1, IPC3-IPC5, IPC7,

IPC16, and INTTREG (see Table 4-4).

Updated all SFR names in QEI1 Register Map (see Table 4-10).

Updated the bit range for AD1CON3 from ADCS<5:0> to ADCS<7:0>) (see

Table 4-14 and Table 4-15).

Updated the Reset value for CLKDIV in the System Control Register Ma p

(see Table 4-23).

Section 6.0 “Resets” Entire section was replaced to maintain consistency with other dsPIC33F

data sheets .

Section 8.0 “Oscillator

Configuration” Removed the first sentence of the third clock source item (External Clock) in

Section 8.1.1.2 “Primary”.

Updated the default bit values for DOZE and FRCDIV in the Clock Divisor

Added the center frequency in the OSCTUN register for the FRC T uning bits

(TUN<5:0>) value 011111 and updated the center frequency for bits value

011110 (see Register 8-4).

Section 9.0 “Power-Saving

Features” Added the following two registers:

• PMD1: Peripheral Module Disable Control Register 1

• PMD2: Peripheral Module Disable Control Register 2

• PMD3: Peripheral Module Disable Control Register 3

Section 10.0 “I/O Ports” Added paragraph and Table 10-1 to Section 10.2 “Open-Drain

Configuration”, which provides details on I/O pins and their functionality.

Removed the following sections, which are now available in the related

section of the dsPIC33F/PIC24H Family Refe rence Manual:

• 9.4.2 “Available Peripherals”

• 9.4.3.3 “Mapping”

• 9.4.5 “Considerations for Peripheral Pin Selection”

Section 14.0 “Output Compare” Replaced sections 13.1, 13.2, and 13.3 and related figures and tables with

entirely new content.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Section 15.0 “Motor Control PWM

Module” Removed the following sections, which are now avai lable in the related

section of the dsPIC33F/PIC24H Family Refe rence Manual:

• 14.3 “PWM Time Base”

• 14.4 “PWM Period”

• 14.5 “Edge-Aligned PWM”

• 14.6 “Center-Aligned PWM”

• 14.7 “PWM Duty Cycle Comparison Units”

• 14.8 “Complementary PWM Operation”

• 14.9 “Dead-Time Generators”

• 14.10 “Independent PWM Output”

• 14.11 “Single Pulse PWM Operation”

• 14.12 “PWM Output Override”

• 14.13 “PWM Output and Polarity Control”

• 14.14 “PWM Fault Pins”

• 14.15 “PWM Update Lockout”

• 14.16 “PWM Special Event Trigger”

• 14.17 “PWM Operation During CPU Sleep Mode”

• 14.18 “PWM Operation During CPU Idle Mode”

Section 16.0 “Quadrature Encoder

Interface (QEI) Module” Removed the following sections, which are now available in the related

section of the dsPIC33F/PIC24H Family Refe rence Manual:

• 15.1 “Quadrature Encoder Interface Logic”

• 15.2 “16-bit Up/Down Position Counter Mode”

• 15.3 “Position Measurement Mode”

• 15.4 “Programmable Digital Noise Filters”

• 15.5 “Alternate 16-bit Ti mer/Counter”

• 15.6 QEI Module Operation During CPU Slee p Mode”

• 15.7 “QEI Module Operation During CPU Idle Mode”

• 15.8 “Quadrature Encoder Interface Interrupts”

Section 17.0 “Serial Peripheral

Interface (SPI)” Removed the following sections, which are now availabl e in the related

section of the dsPIC33F/PIC24H Family Refe rence Manual:

• 16.1 “Interrupts”

• 16.2 “Receive Operations”

• 16.3 “Transmit Operations”

• 16.4 “SPI Setup” (retained Figure 17-1: SPI Module Block Diagra m)

TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)

Section Name Update Description

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Section 18.0 “Inter-Integrated

Circuit™ (I2C™)” Removed the following sections, which are now available in the related

section of the dsPIC33F/PIC24H Family Refe rence Manual:

• 17.3 “I2C Interrupt s”

• 17.4 “Baud Rate Generator” (retained Figure 15-1: I2C Block Diagram)

• 17.5 “I2C Modul e Addr esse s”

• 17.6 “Slave Address Masking”

• 17.7 “IPMI Support”

• 17.8 “General Call Address Support”

• 17.9 “Automatic Clock Stretch”

• 17.10 “Software Controlled Clock Stretching (STREN = 1)”

• 17.11 “Slope Co ntrol”

• 17.12 “Clock Arbitration”

• 17.13 “Multi-Master Communication, Bus Collision, and Bus Arbitration”

• 17.14 “Peripheral Pin Select Limitations”

Section 19.0 “Universal

Asynchronous Receiver Transmitter

(UART)”

Removed the following sections, which are now available in the related

section of the dsPIC33F/PIC24H Family Refe rence Manual:

• 18.1 “UART Baud Rate Generator”

• 18.2 “Transmitting in 8-bit Data Mode”

• 18.3 “Transmitting in 9-bit Data Mode”

• 18.4 “Break and Sync Transmit Sequence”

• 18.5 “Recei vi ng in 8-bit or 9-bi t Da ta Mode ”

• 18.6 “Flow Control Using UxCTS and UxRTS Pins”

• 18.7 “Infrared Support”

Removed IrDA references and Note 1, and updated the bit and bit value

descriptions for UTXINV (UxSTA<14>) in the UARTx Status and Control

Section 20.0 “10-bit/12-bit

Analog-to-Digital Converter (ADC)” Removed Equation 19-1: ADC Conversion Clock Period and Figure 19-2:

ADC Transfer Function (10-Bit Example).

Added ADC1 Module Block Diagram for dsPIC33FJ16MC304 and

dsPIC33FJ32MC204 Devices (Figure 20-1) and ADC1 Module Block

Diagram FOR dsPIC33FJ32MC202 Devices (Figure 20-2).

Added Note 2 to Figure 20-3: ADC Conversion Clock Period Block Diagram.

Updated ADC Conversion Clock Select bits in the AD1CON3 register from

ADCS<5:0> to ADCS<7:0>. Any references to these bits have also been

updated throughout this data sheet (Register 20-3).

Added device-specific information to Note 1 in the ADC1 Input Scan Select

12-10 (CSS12-CSS10) from U-0 to R/W-0.

Added device-specific information to Note 1 in the ADC1 Port Configuration

12-10 (PCFG12-PCFG10) from U-0 to R/W-0.

TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)

Section Name Update Description

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Section 21.0 “Special Features” Added FICD register information for address 0xF8000E in the Device

Configuration Register Map (see Table 21-1).

Added FICD register content (BKBUG, COE, JTAGEN, and ICS<1:0> to the

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Configuration Bits

Description (see Table 21-2).

Added a note regarding the placement of low-ESR capacitors, after the

second paragraph of Section 2 1.2 “On-Chip Voltage Regulator” and to

Figure 19-1.

Removed the words “if enabled” from the secon d sentence in the fifth

paragraph of Section 21.3 “BOR: Brown-out Reset”.

Section 24.0 “Electrical

Characteristics” Updated Max MIPS va lue for -40ºC to +125ºC temperature range in

Operating MIPS vs. Voltage (see Table 24-1).

Removed Typ value for parameter DC12 (see Table 24-4).

Updated MIPS conditions for parameters DC24c, DC44c, DC72a, DC72f

and DC72g (see Table 24-5, Table 24-6, and Table 24-8).

Added Note 4 (reference to new table containing digital-only and analog pin

information to I/O Pin Input Specifications (see Table 24-4).

Updated Typ, Min and Max values for Program Memory parameters D136,

D137 and D138 (see Table 24-12).

Updated Max value for Internal RC Accuracy parameter F21 for -40°C ≤ TA ≤

+125°C condition and added Note 2 (see Table 24-19).

Removed all values for Reset, Watchdog Timer, Oscillator Start-up Timer,

and Power-up Timer parameter SY20 and updated conditions, which now

refers to Section 21.4 “Watchdog Timer (WDT)” and LPRC parameter

F21a (see Table 24-21).

Updated Min and Typ values for parameters AD60, AD61, AD62 and AD63

and removed Note 3 (see Table 24-41).

Updated Min and Typ values for parameters AD60, AD61, AD62 and AD63

and removed Note 3 (see Table 24-42).

TABLE A-1: MAJOR SECTION UPDATES (CONTINUED)

Section Name Update Description

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Revision D (December 2008)

This revision includes minor typographical and

formatting changes throughout the data sheet text.

The major chang es are referenced by their respective

section in the following table.

TABLE A-2: MAJOR SECTION UPDATES

Section Name Update Description

“High-Performance, 16-b it Digital

Signal Controllers” Updated all pin diagrams to denote the pin voltage toleranc e (see “Pin

Diagrams”).

Section 2.0 “Guidelines for Getting

Started with 16-bit Digital Signal

Controllers”

Added new section to the data sheet that provides guidelines on getting

started with 16-bit Digital Signal Controllers.

Section 10.0 “I/O Ports” Updated 5V tolerant status for I/O pin RB4 from Yes to No (see Table 10-1).

Section 24.0 “Electrical

Characteristics” Removed the maximum value for parameter DC12 (RAM Data Retention

Voltage) in Table 24-4.

Updated typical values for Operating Current (IDD) and added Note 3 in

Table 24-5.

Updated typical and maximum values for Idle Current (IIDLE): Core OFF

Clock ON Base Current and added Note 3 in Table 24-6.

Updated typical and maximum values for Power Down Current (IPD) and

added Note 5 in Table 24-7.

Updated typical and maximum values for Doze Current (IDOZE) and added

Note 2 in Table 24-8.

Added Note 3 to Table 24-12.

Updated minimum value for Internal Voltage Regulator Specifications in

Table 24-13.

Added parameter OS42 (GM) and Notes 4, 5 and 6 to Table 24-16.

Added Notes 2 and 3 to Table 24-17.

Added Note 2 to Table 24-20.

Added Note 2 to Table 24-21.

Added Note 2 to Table 24-22.

Added Note 1 to Table 24-23.

Added Note 1 to Table 24-24.

Added Note 3 to Table 24-36.

Added Note 2 to Table 24-37.

Updated typical value for parameter AD08 (ADC in operation) and added

Notes 2 and 3 in Table 2 4-38.

Updated minimum, typical, and maximum values for parameters AD23a,

AD24a, AD30a, AD32a, AD32a and AD34a, an d added Notes 2 and 3 in

Table 24-39.

Updated minimum, typical, and maximum values for parameters AD23b,

AD24b, AD30b, AD32b, AD32b and AD34b, an d added Notes 2 and 3 in

Table 24-40.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Revision E (June 2009)

This revision includes minor typographical and

formatting changes throughout the data sheet text.

Global changes include:

• Changed all instances of OSCI to OSC1 and

OSCO to OSC2

• Changed all instances of PGCx/EMUCx and

PGDx/EMUDx (where x = 1, 2 or 3) to PGECx

and PGEDx

Changed all instances of VDDCORE and VDDCORE/VCAP

to VCAP/VDDCORE

All other major changes are referenced by their

respective section in the following table.

TABLE A-3: MAJOR SECTION UPDATES

Section Name Up date Description

“High-Performance, 16-bit Digital Signal

Controllers” Added Note 2 to the 28-Pin QFN-S and 44-Pin QFN pin

diagrams, which references pin connections to VSS.

Section 7.0 “Interrupt Controller” Updated addresses for interrupt vectors 80, 81, 82 and 83-125

(see Table 7-1).

Section 8.0 “Oscillator Configuration” Updated the Oscillator System Diagram (see Figure 8-1).

Added Note 1 to the Oscillator Tuning register (OSCTUN) (see

Section 10.0 “I/O Ports” Removed Table 10-1 and added reference to pin diagrams for I/O

pin availability and functionality.

Section 17.0 “Serial Peripheral Interface (SPI)” Added Note 2 to the SPIx Control Register 1 (see Registe r 17-2).

Section 19.0 “Universal Asynchronous

Receiver Transmitter (UART)” Updated the UTXINV bit settings in the UxSTA register and

added Note 1 (see Register 19-2).

Section 24.0 “Electrical Characteristics ” Updated th e Min value for parameter DC12 (RAM Retention

Voltage) and added Note 4 to the DC Temperature and Voltage

Specifications (see Table 24-4).

Updated the Min value for parameter DI35 (see Table 24-20).

Updated AD08 and added reference to Note 2 for parameters

AD05a, AD06a and AD08a (see Table 24-38).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Revision F (November 2009)

The revision includes the following global update:

• Added Note 2 to the shaded table that appears at

the beginning of each chapter. This new note

provides information regarding the availability of

registers and their associated bits

This revision also includes minor typographical and

formatting changes throughout the data sheet text.

All other major changes are referenced by their

respective section in the following table.

Revision G (November 2009)

This revision includes minor typographical and

formatting changes throughout the data sheet text.

All other major changes are referenced by their

respective section in the following table.

TABLE A-4: MAJOR SECTION UPDATES

Section Name Up date Description

“High-Performance, 16-bit Digital Signal

Controllers” Added information on high temperature operation (see

“Operating Range:”).

Section 10.0 “I/O Ports” Changed the reference to digital-only pins to 5V tolerant pins in

the second paragraph of Section 10.2 “Open-Drain

Configuration”.

Section 19.0 “Universal Asynchronous

Receiver Transmitter (UART)” Updated the two baud rate range features to: 10 Mbps to 38 bps

at 40 MIPS.

Section 20.0 “10-bit/12-bit Analog-to-Digital

Converter (ADC)” Updated th e ADC1 block diagrams (see Figure 20-1 and

Figure 20-2).

Section 21.0 “Special Features” Updated the second paragraph and removed the fourth

paragraph in Section 21.1 “Configuration Bits”.

Updated the Device Configuration Register Map (see Table 21-1).

Section 24.0 “Electrical Characteristics” Updated the Absolute Maximum Ratings for high temperature

and added Note 4.

Updated the SPIx Module Slave Mode (CKE = 1) Timing

Characteristics (see Figure 24-17).

Updated the Internal RC Accuracy parameter numbers (see

Table 24-18 and Table 24-19).

Section 25.0 “High Temperature Electrical

Characteristics” Added new chapter with high temperature specifications.

“Product Iden tifi ca tion System” Added the “H” definition for high temperature.

TABLE A-5: MAJOR SECTION UPDATES

Section Name Up date Description

Section 25.0 “High Temperature Electrical

Characteristics” Updated MIPS rating from 16 to 20 for high temperature devices

in “Operating Range:” and in Table 25-1: Operating MIPS vs.

Voltage.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Revision H (February 2011)

This revision includes typographical and formatting

changes throughout the data sheet text. In addition, all

instances of VDDCORE have been removed.

All other major changes are referenced by their

respective section in the following table.

TABLE A-6: MAJOR SECTION UPDATES

Section Name Up date Description

High-Performance, 16-bit Dig ital Signal

Controllers Added the SSOP package information (see “Packaging:”, Table 1,

and “Pin Diagrams”).

Section 2.0 “Guidelines for Getting Started

with 16-bit Digital Signal Controllers” Updated the title of Section 2.3 “CPU Logic Filter Capacitor

Connection (VCAP)”.

The frequency limitation for device PLL start-up conditions was

updated in Section 2.7 “Oscillator Value Conditions on Devi ce

Start-up”.

The second paragraph in Section 2.9 “Unused I/Os” was updated.

Section 3.0 “CPU” Removed references to DMA in the CPU Core Block Diagram (see

Figure 3-1).

Section 4.0 “Memory Organization” Updated the data memory reference in the third paragraph in

Section 4.2 “Data Address Space”.

All Resets values for the following SFRs in the Timer Register Map

were changed (see Table 4-5):

•TMR1

•TMR2

•TMR3

Section 8.0 “Oscillator Configuration” Added Note 3 to the OSCCON: Oscil lator Control Register (see

Added Note 2 to the CLKDIV: Clock Divisor Register (see

Added Note 1 to the PLLFBD: PLL Feedback Divisor Register (see

Added Note 2 to the OSCTUN: FRC Oscillator T uning Register (see

Section 20.0 “10-bit/12-bit Analog-to-Digital

Converter (ADC)” Updated the VREFL references in the AD C1 mod u l e bl o ck di a gra ms

(see Figure 20-1 and Figure 20-2).

Section 21.0 “Special Features” Added a new paragraph and removed the third paragraph in

Section 21.1 “Configuration Bits”.

Added the column “RTSP Effects” to the Configuration Bits

Descriptions (see Table 21-2).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Section 24.0 “Electrical Characteristics” Added the 28-pin SSOP Thermal Packaging Characteristics (see

Table 24-3).

Removed Note 4 from the DC Temperature and Voltage

Specifications (see Table 24-4).

Updated the maximum value for parameter DI19 and added

parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input

Specifications (see Table 24-9).

Updated Note 3 of the PLL Clock T iming Specifications (see

Table 24-17).

Removed Note 2 from the AC Characteristics: Internal RC Accuracy

(see Table 24-18).

Updated the characteristic description for parameter DI35 in the I/O

Timing Requirements (see Table 24-20).

Updated all SPI specifications (see Table 24-32 through Table 24-39

and Figure 24-14 through Figure 24-21).

Added Note 4 to the 12-bit mode ADC Module Specifications (see

Table 24-43).

Added Note 4 to the 10-bit mode ADC Module Specifications (see

Table 24-44).

Section 25.0 “High Temperature Electrical

Characteristics” Updated all ambient temperature and range values to +150ºC

throughout the chapter.

Updated the storage temperature and range to +160ºC.

Updated the maximum junction temperature from +145ºC to +155ºC.

Updated Note 1 in the PLL Clock Timing Specifications (see

Table 25-10).

Added Note 3 to the 12-bit Mode ADC Module Specifications (see

Table 25-17).

Added Note 3 to the 10-bit Mode ADC Module Specifications (see

Table 25-18).

Section 26.0 “Packaging Information” Added the 28-Lead SSOP package information (see Section 26.1

“Package Marking Information” and Section 26.2 “Package

Details”).

“Product Iden tifi ca tion System” Added th e “SS” definition for the SSOP package.

TABLE A-6: MAJOR SECTION UPDATES (CONTINUED)

Section Name Up date Description

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

Revision J (July 2011)

This revision includes typographical and formatting

changes throughout the data sheet text.

All other major changes are referenced by their

respective section in the following table.

TABLE A-7: MAJOR SECTION UPDATES

Section Name Up date Description

Section 21.0 “Special Features” Added Note 3 to the Connections for the On-chip Voltage Regulator

diagram (see Figure 21-1).

Section 24.0 “Electrical Characteristics ” Removed Note 3 and parameter DC10 (VCORE) from the DC

Temperature and Volt age Specifications (see Table 24-4).

Updated the Characteristics definition and Conditions fo r parameter

BO10 in the Electrical Characteristics: BOR (see Table 24-11).

Added Note 1 to the Internal Voltage Regulator Specification s (see

Table 24-13).

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

NOTES:

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

INDEX

AC Characteristics ....................................................244, 285

ADC Module..............................................................288

ADC Module (10-bit Mode).......................................289

ADC Module (12-bit Mode).......................................288

Internal RC Accuracy................................................246

Load Conditions................................................244, 285

ADCInitialization...............................................................201

Key Features.............................................................201

ADC Module

ADC1 Register Map for dsPIC33FJ32MC202 ............44

ADC1 Register Map for dsPIC33FJ32MC204 and

dsPIC33FJ16MC304 ..........................................45

Alternate Interrupt Vector Table (AIVT) ..............................73

Analog-to-Digital Converter (ADC)....................................201

Arithmetic Logic Unit (ALU).................................................27

Assembler

MPASM Assembler...................................................230

Barrel Shifter.......................................................................31

Bit-Reversed Addressing ....................................................53

Example......................................................................54

Implementation ...........................................................53

Sequence Table (16-Entry).........................................54

Block Diagrams

16-bit Timer1 Module................................................147

A/D Module.......................................................202, 203

Connections for On-Chip Voltage Regulator.............217

Device Clock.............................................................105

DSP Engine ................................................................28

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304..12

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

CPU Core ...........................................................22

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 PLL

107

Input Capture............................................................155

Output Compare .......................................................157

PLL............................................................................107

PWM Module ....................................................162, 163

Quadrature Encoder Interface ..................................175

Reset System..............................................................65

Shared Port Structure.................... ..................... ......121

SPI............................................................................181

Timer2 (16-bit) ..........................................................151

Timer2/3 (32-bit) .......................................................150

UART........................................................................195

Watchdog Timer (WDT)............................................218

C Compilers

MPLAB C18..............................................................230

Clock Switching.................................................................113

Enabling....................................................................113

Sequence..................................................................113

Code Examples

Erasing a Program Memory Page...............................63

Initiating a Programming Sequence............................64

Loading Write Buffers .................................................64

Port Write/Read ........................................................122

PWRSAV Instruction Syntax.....................................115

Code Protection ........................................................213, 220

Configuration Bits..............................................................213

Configuration Register Map.............................................. 213

Configuring Analog Port Pins............................................ 122

CPUControl Register.......................................................... 24

CPU Clocking System ...................................................... 106

PLL Configuration..................................................... 106

Selection................................................................... 106

Sources .................................................................... 106

Customer Change Notification Service............................. 321

Customer Notification Service .......................................... 321

Customer Support............................................................. 321

Data Accumulators and Adder/Subtracter.......................... 29

Data Space Write Saturation...................................... 31

Overflow and Saturation............................................. 29

Round Logic ............................................................... 30

Write Back.................................................................. 30

Data Address Space........................................................... 35

Alignment.................................................................... 35

Memory Map for dsPIC33FJ32MC202/204 and

dsPIC33FJ16MC304 Devices with 2 KBs RAM . 36

Near Data Space........................................................ 35

Software Stack ........................................................... 50

Width .......................................................................... 35

DC Characteristics............................................................ 234

Doze Current (IDOZE)................................................ 283

High Temperature..................................................... 282

I/O Pin Input Specifications ...................................... 239

I/O Pin Output........................................................... 283

I/O Pin Output Specifications.................................... 242

Idle Current (IDOZE) .................................................. 238

Idle Current (IIDLE).................................................... 237

Operating Current (IDD) ............................................ 236

Operating MIPS vs. Voltage..................................... 282

Power-Down Current (IPD)........................................ 238

Power-down Current (IPD)........................................ 282

Program Memory.............................................. 243, 284

Temperature and Voltage......................................... 282

Temperature and Voltage Specifications.................. 235

Thermal Operating Conditions.................................. 282

Development Support....................................................... 229

Doze Mode ....................................................................... 116

DSP Engine........................................................................ 27

Multiplier..................................................................... 29

Electrical Characteristics .............. .................................... 233

AC..................................................................... 244, 285

Equations

Device Operating Frequency.................................... 106

Errata.................................................................................. 10

Fail-Safe Clock Monitor .................................................... 113

Flash Program Memory...................................................... 59

Control Registers........................................................ 60

Operations.................................................................. 60

Programming Algorithm.............................................. 63

RTSP Operation......................................................... 60

Table Instructions....................................................... 59

Flexible Configuration....................................................... 213

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

High Temperature Electrical Characteristics.....................281

I/O Ports............................................................................121

Parallel I/O (PIO).......................................................121

Write/Read Timing ....................................................122

I2CAddresses.................................................................188

Operating Modes ......................................................187

Registers...................................................................187

Software Controlled Clock Stretching (STREN = 1)..188

I2C Module

I2C1 Register Map......................................................43

In-Circuit Debugger...........................................................219

In-Circuit Emulation...........................................................213

In-Circuit Serial Programming (ICSP).......................213, 219

Input Capture ....................................................................155

Registers...................................................................156

Input Change Notification..................................................122

Instruction Addressing Modes.............................................50

File Register Instructions ....................... .....................50

Fundamental Modes Supported..................................51

MAC Instructions.........................................................51

MCU Instructions ........................................................50

Move and Accumulator Instructions............................51

Other Instructions........................................................51

Instruction Set

Overview...................................................................224

Summary...................................................................221

Instruction-Based Power-Saving Modes...........................115

Idle............................................................................116

Sleep.........................................................................115

Interfacing Program and Data Memory Spaces..................55

Internal RC Oscillator

Use with WDT...........................................................218

Internet Address................................................................321

Interrupt Control and Status Registers................................77

IECx ............................................................................77

IFSx.............................................................................77

INTCON1 ....................................................................77

INTCON2 ....................................................................77

IPCx ............................................................................77

Interrupt Setup Procedures...............................................103

Initialization...............................................................103

Interrupt Disable........................................................103

Interrupt Service Routine ..........................................103

Trap Service Routine ................................................103

Interrupt Vector Table (IVT) ................................................73

Interrupts Coincident with Power Save Instructions..........116

JTAG Boundary Scan Interface ........................................213

JTAG Interface..................................................................219

Memory Organization..........................................................33

Microchip Internet Web Site..............................................321

Modulo Addressing .............................................................52

Applicability.................................................................53

Operation Example .....................................................52

Start and End Address................................................52

W Address Register Selection ....................................52

Motor Control PWM...........................................................161

Motor Control PWM Module

2-Output Register Map................................................42

6-Output Register Map for dsPIC33FJ12MC202........ 42

MPLAB ASM30 Assembler, Linker, Librarian................... 230

MPLAB Integrated Development Environment Software.. 229

MPLAB PM3 Device Programmer.................................... 232

MPLAB REAL ICE In-Circuit Emulator System ................ 231

MPLINK Object Linker/MPLIB Object Librarian................ 230

NVM Module

Open-Drain Configuration................................................. 122

Oscillator Configuration ........................ ............................ 105

Output Compare............................................................... 157

Packaging......................................................................... 291

Details....................................................................... 293

Marking............................................................. 2 91, 292

Peripheral Module Disable (PMD).................................... 116

Pinout I/O Descriptions (table)............................................ 13

PMD Module

PORTA

dsPIC33FJ16MC304.......................................... 47

PORTB

PORTC

dsPIC33FJ16MC304.......................................... 48

Power-on Reset (POR)....................................................... 70

Power-Saving Features.................................................... 115

Clock Frequency and Switching ............................... 115

Program Address Space..................................................... 33

Construction ............................................................... 55

Data Access from Program Memory Using

Program Space Visibility..................................... 58

Data Access from Program Memory

Using Table Instructions..................................... 57

Data Access from, Address Generation ..................... 56

Memory Map............................................................... 33

Table Read Instructions

TBLRDH............................................................. 57

TBLRDL.............................................................. 57

Visibility Operation...................................................... 58

Program Memory

Interrupt Vector........................................................... 34

Organization ............................................................... 34

Reset Vector............................................................... 34

PWM Time Base............................................................... 164

Quadrature Encoder Interface (QEI)................................. 175

Quadrature Encoder Interface (QEI) Module

Reader Response............................................................. 322

Registers

AD1CHS0 (ADC1 Input Channel 0 Select................ 211

AD1CHS123 (ADC1 Input Channel 1 , 2, 3 Select)... 209

AD1CON1 (ADC1 Control 1).................................... 205

AD1CON2 (ADC1 Control 2).................................... 207

AD1CON3 (ADC1 Control 3).................................... 208

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

AD1CSSL (ADC1 Input Scan Select Low)................212

AD1PCFGL (ADC1 Port Configuration Low) ............212

CLKDIV (Clock Divisor).............................................110

CORCON (Core Control)......................................26, 78

DFLTCON (QEI Control)...........................................179

I2CxCON (I2Cx Control)...........................................189

I2CxMSK (I2Cx Slave Mode Address Mask)............193

I2CxSTAT (I2Cx Status) ...........................................191

ICxCON (Input Capture x Control)............................156

IEC0 (Interrupt Enable Control 0) ...............................87

IEC1 (Interrupt Enable Control 1) ...............................89

IEC3 (Interrupt Enable Control 3) ...............................90

IEC4 (Interrupt Enable Control 4) ...............................91

IFS0 (Interrupt Flag Status 0) .....................................82

IFS1 (Interrupt Flag Status 1) .....................................84

IFS3 (Interrupt Flag Status 3) .....................................85

IFS4 (Interrupt Flag Status 4) .....................................86

INTCON1 (Interrupt Control 1)....................................79

INTCON2 (Interrupt Control 2)....................................81

INTTREG Interrupt Control and Status Register.......102

IPC0 (Interrupt Priority Control 0) ...............................92

IPC1 (Interrupt Priority Control 1) ...............................93

IPC14 (Interrupt Priority Control 14) ...........................99

IPC15 (Interrupt Priority Control 15) .........................100

IPC16 (Interrupt Priority Control 16) .........................100

IPC18 (Interrupt Priority Control 18) .........................101

IPC2 (Interrupt Priority Control 2) ...............................94

IPC3 (Interrupt Priority Control 3) ...............................95

IPC4 (Interrupt Priority Control 4) ...............................96

IPC5 (Interrupt Priority Control 5) ...............................97

IPC7 (Interrupt Priority Control 7) ...............................98

NVMCON (Flash Memory Control) .............................61

NVMKEY (Nonvolatile Memory Key) ..........................62

OCxCON (Output Compare x Control) .....................159

OSCCON (Oscillator Control)...................................108

OSCTUN (FRC Oscillator Tuning)............................112

P1DC2 (PWM Duty Cycle 2).....................................173

P1DC3 (PWM Duty Cycle 3).....................................173

PDC1 (PWM Duty Cycle 1).......................................173

PLLFBD (PLL Feedback Divisor)..............................111

PMD1 (Peripheral Module Disable Control

PMD1 (Peripheral Module Disable Control Register 1) ..

117

PMD2 (Peripheral Module Disable Control

PMD3 (Peripheral Module Disable Control

PMD3 (Peripheral Module Disable Control Register 3) ..

119

PTCON (PWM Time Base Control) ..........................164

PTMR (PWM Timer Count Value).............................165

PTPER (PWM Time Base Period)............................165

PWMxCON1 (PWM Control 1)..................................167

PWMxCON2 (PWM Control 2)..................................168

PxDTCON1 (Dead-Time Control 1) ..........................169

PxDTCON2 (Dead-Time Control 2) ..........................170

PxFLTACON (Fault A Control)..................................171

PxOVDCON (Override Control)................................172

PxSECMP (Special Event Compare)........................166

QEICON (QEI Control)..............................................177

RCON (Reset Control)................................................66

SPIxCON1 (SPIx Control 1)......................................183

SPIxCON2 (SPIx Control 2)......................................185

SPIxSTAT (SPIx Status and Control) .......................182

SR (CPU Status)...................................................24, 78

T1CON (Timer1 Control) .......................................... 148

T2CON Control)........................................................ 152

T3CON Control......................................................... 153

UxMODE (UARTx Mode) ......................................... 196

UxSTA (UARTx Status and Control) ........................ 198

Reset

Illegal Opcode....................................................... 65, 72

Trap Conflict......................................................... 71, 72

Uninitialized W Register ....................................... 65, 72

Reset Sequence................................................................. 73

Resets ................................................................................ 65

Serial Peripheral Interface (SPI)....................................... 181

Software Reset Instruction (SWR)...................................... 71

Software Simulator (MPLAB SIM) .................................... 231

Software Stack Pointer, Frame Pointer

CALLL Stack Frame................................................... 50

Special Features of the CPU............................................ 213

SPI Module

SPI1 Register Map ..................................................... 43

Symbols Used in Opcode Descriptions ............................ 222

System Control

Temperature and Voltage Specifications

AC..................................................................... 244, 285

Timer1 .............................................................................. 147

Timer2/3 ........................................................................... 149

Timing Characteristics

CLKO and I/O........................................................... 247

Timing Diagrams

10-bit ADC Conversion (CHPS<1:0> = 01, SIMSAM = 0,

ASAM = 0, SSRC<2:0> = 000).......... ............... 278

10-bit ADC Conversion (CHPS<1:0> = 01, SIMSAM = 0,

ASAM = 1, SSRC<2:0> = 111,

SAMC<4:0> = 00001)....................................... 278

12-bit ADC Conversion (ASAM = 0,

SSRC<2:0> = 000)........................................... 277

Brown-out Situations .................................................. 71

External Clock .......................................................... 245

I2Cx Bus Data (Master Mode).................................. 270

I2Cx Bus Data (Slave Mode).................................... 272

I2Cx Bus Start/Stop Bits (Master Mode)................... 270

I2Cx Bus Start/Stop Bits (Slave Mode)..................... 272

Input Capture (CAPx)............................................... 253

Motor Control PWM.................................................. 255

Motor Control PWM Fault......................................... 255

OC/PWM .................................................................. 254

Output Compare (OCx) ............................................ 253

QEA/QEB Input ........................................................ 256

QEI Module Index Pulse........................................... 257

Reset, Watchdog Timer, Oscillator Start-up Timer

and Power-up Timer......................................... 248

Timer1, 2, 3 External Clock...................................... 250

TimerQ (QEI Module) External Clock....................... 252

Timing Requirements

ADC Conversion (10-bit mode) ................................ 290

ADC Conversion (12-bit Mode) ................................ 290

CLKO and I/O........................................................... 247

External Clock .......................................................... 245

Input Capture............................................................ 253

SPIx Master Mode (CKE = 0)................................... 286

SPIx Module Master Mode (CKE = 1) ...................... 286

SPIx Module Slave Mode (CKE = 0) ........................ 287

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

SPIx Module Slave Mode (CKE = 1).........................287

Timing Specifications

10-bit ADC Conversion Requirements......................279

12-bit ADC Conversion Requirements......................277

I2Cx Bus Data Requirements (Master Mode)...........271

I2Cx Bus Data Requirements (Slave Mode).............273

Motor Control PWM Requirements...........................255

Output Compare Requirements................................253

PLL Clock..........................................................246, 285

QEI External Clock Requirements ......... ...................252

QEI Index Pulse Requirements.................................257

Quadrature Decoder Requirements..........................256

Reset, Watchdog Timer, Oscillator Start-up Timer,

Power-up Timer and Brown-out

Reset Requirements.........................................249

Simple OC/PWM Mode Requirements .....................254

Timer1 External Clock Requirements .......................250

Timer2 External Clock Requirements .......................251

Timer3 External Clock Requirements....................... 251

UART Module

UART1 Register Map.................................................. 43

Universal Asynchronous Receiver Transmitter (UART) ... 195

Using the RCON Status Bits............................................... 72

Voltage Regulator (On-Chip)............................................ 217

Watchdog Time-out Reset (WDTR).................................... 71

Watchdog Timer (WDT)............................................ 213, 218

Programming Considerations................................... 218

WWW Address ................................................................. 321

WWW, On-Line Support..................................................... 10

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

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Questions (FAQs), technical support requests,

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CUSTOMER CHANGE NOTIFICATION

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specified product family or development tool of interest.

To register, access the Microchip web site at

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“Customer Change Notification” and follow the

registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance

through several channels:

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Customers should contact their distributor,

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support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this docume nt.

Technical support is available through the web site

at: http://microchip.com/support

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our

documentation can better serve you, please FAX your comments to the Technical Publications Manager at

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Please list the following info rmation, and use this outline to pro v ide us with your comments about this document.

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DS70283JdsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you fi nd the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or mi sleading information (what and whe r e)?

7. How would you improve this document?

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Architecture: 33 = 16-bit Digital Signal Controller

Flash Memory Family: FJ = Flash program memory, 3.3V

Product Group: MC2 = Motor Control family

MC3 = Motor Control family

Pin Count: 02 = 28-pin

04 = 44-pin

Temperature Range : I = -40°C to+85°C (Industrial)

E=-40°C to+125°C (Extended)

H=-40°C to+150°C (High)

Package: SP = Skinny Plastic Dual In-Line - 300 mil body (SPDIP)

SO = Plastic Small Outline - Wide - 7.50 mil body (SOIC)

SS = Plastic Shrink Small Outline - 5.3 mm body (SSOP)

ML = Plastic Quad, No Lead Package - 8x8 mm body (QFN)

PT = Plastic Thing Qu ad Flatpack - 10x10x1 mm body (TQFP)

MM = Plastic Quad, No Lead P ackage - 6x6 mm body (QFN-S)

Examples:

a) dsPIC33FJ32MC202TE/SP:

Motor Control dsPIC33, 32 KB program

memory, 28-pin, Extended temp.,

SPDIP package.

Microchip Trademark

Architecture

Flash Memory Family

Program Memory Size (KB)

Product Group

Pin Count

Temperature Range

Package

Pattern

dsPIC 33 FJ 32 MC2 02 T E / SP - XXX

Tape and Reel Flag (if applicable)

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05/02/11