This is information on a product in full production.
June 2016 DocID029487 Rev 1 1/11
EMIF02-02OABRY
IPAD™ automotive grade integrated protected low pass filter for
BroadR Reach™ interface
Datasheet - production data
Features
Attenuation profile compliant with
BroadR Reach™ requirements from -40 °C to
125 °C
Return loss (Sdd11) at 60 MHz: -20 dB
Components matching: 1% (between line 1
and 2)
Package:
– Dimensions: 3.0 x 3.0 mm
– Pitch: 1.1 µm
– Wettable flank QFN
AEC-Q101 compliant
Complies with the following standards
ISO 10605 (330 / 330 pF) (pins 1 and 3):
– 15 kV (air discharge)
– 15 kV (contact discharge)
ISO 7637-3 (pins 1 and 3):
– Pulse 3a: -150 V
– Pulse 3b: +100 V
MIL-STD883J (HBM) (pins 4 and 6)
–±2 kV
Description
The EMIF02-02OABRY is a highly integrated
solution designed to suppress EMI noise in
BroadR Reach™ interfaces in automotive
applications. This low pass filter includes a 15 kV
ISO10605 protection and is housed in a
3 x 3 mm² wettable flanks QFN.
Figure 1. EMIF02-02OABRY equivalent circuit
TM: IPAD is a trademark of STMicroelectronics.
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Characteristics EMIF02-02OABRY
2/11 DocID029487 Rev 1
1 Characteristics
Figure 2. BroadR Reach application schematic
Table 1. Absolute ratings (Tamb = 25 °C)
Symbol Parameter and test conditions Value Unit
VPP
External pins (pin 1 and pin 3):
IEC 61000-4-2 (330 / 150 pF)
air discharge
contact discharge
±15
±15
kV
External pins (pin 1 and pin 3):
ISO 10605 (330 / 330 pF)
air discharge
contact discharge
±15
±15
VPP Transceiver side pins: HBM (pin 4 and pin 6) ±2 kV
TLMaximum lead temperature for soldering 10 s 260 °C
Top Operating junction temperature range -40 to +125 °C
Tstg Storage temperature range -55 to +125 °C
Table 2. Electrical characteristics (Tamb = 25 °C)
Symbol Conditions Min. Typ. Max. Unit
VBR
Internal protection diode breakdown voltage,
IR = 20 mA 6V
VCL IPP = 1 A, 8/20 µs 10.5 V
RDC Serial resistance (pins 3 to 4 or 1 to 6) 12
Sdd11
From 10 MHz to 60 MHz, Tj = -40 °C to 125 °C
-20
dB
Sdd22 -20
Scd21
Sdc21
-50
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DocID029487 Rev 1 3/11
EMIF02-02OABRY Characteristics
11
Figure 3. Sdd11 differential return loss curve -external pins
Figure 4. Sdd22 differential return loss curve -transceiver side pins
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Characteristics EMIF02-02OABRY
4/11 DocID029487 Rev 1
Figure 5. Sdd21 attenuation curve
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Figure 6. ESD response to ISO 10605-
C = 330 pF, R = 330 Ω (+15 kV contact)
Figure 7. ESD response to ISO 10605-
C = 330 pF, R = 330 Ω (-15 kV contact)
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DocID029487 Rev 1 5/11
EMIF02-02OABRY Characteristics
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Figure 8. Response to ISO 7637-3 (pulse 3a)
Us = -150 V
Figure 9. Response to ISO 7637-3 (pulse 3b)
Us = +100 V
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Package information EMIF02-02OABRY
6/11 DocID029487 Rev 1
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1 QFN package information
Figure 10. QFN package outline
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DocID029487 Rev 1 7/11
EMIF02-02OABRY Package information
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Table 3. QFN package mechanical data
Ref.
Dimensions
Millimeters Inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min. Typ. Max. Min. Typ. Max.
A 0.80 0.85 0.90 0.0315 0.0335 0.0354
A1 0.00 0.02 0.05 0.00 0.0008 0.0020
A3 0.203 0.0080
b 0.45 0.50 0.55 0.0178 0.0197 0.0217
D 2.95 3.00 3.05 0.1161 0.1181 0.1201
E 2.95 3.00 3.05 0.1161 0.1181 0.1201
e 1.105 0.0436
L 0.85 0.90 0.95 0.0335 0.0354 0.0374
D2 0.60 0.70 0.80 0.0236 0.0276 0.0315
L1 0.07 0.15 0.23 0.0028 0.0060 0.0091
Dw1 0.30 0.35 0.40 0.0118 0.0138 0.0157
Dh(2) 0.10 0.0039
Dw2(2)
2. Solder filled dimples
0.50 0.55 0.60 0.0197 0.0217 0.0236
Figure 11. Footprint recommendations
(in mm)
Figure 12. Marking
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Package information EMIF02-02OABRY
8/11 DocID029487 Rev 1
Figure 13. Tape and reel outline
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DocID029487 Rev 1 9/11
EMIF02-02OABRY Recommendation on PCB assembly
11
3 Recommendation on PCB assembly
3.1 Reflow profile
Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
Maximum soldering profile corresponds to the latest IPC/JEDEC J-ST-020.
3.2 Stencil opening design
Figure 15. Recommended stencil window position in mm (inches)
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Ordering information EMIF02-02OABRY
10/11 DocID029487 Rev 1
4 Ordering information
Figure 16. Ordering information scheme
5 Revision history
Table 4. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
EMIF02-02OABRY 22BRY QFN 3x3 - 6L-
(wettable flank) 22.5 mg 3000 Tape and reel
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Table 5. Document revision history
Date Revision Changes
24-Jun-2016 1Initial release
DocID029487 Rev 1 11/11
EMIF02-02OABRY
11