RT9300A/B
7
DS9300A/B-05 April 2011 www.richtek.com
Applications Information
The RT9300A/B is a 4-Channel current source driver fo r
white LEDs.
Enable Input
EN powers the input of the RT9300A/B. This IC provides
an under voltage lockout (UVLO) function to prevent it from
unstable issue when startup. The UVLO threshold of input
falling voltage is set at 2.1V typically with a hysteresis
0.1V.Drive EN high to enable the device; drive EN low to
disable the device. When driven high, EN draws 350uA to
power the IC. Driving EN low forces LED1, LED2, LED3,
a nd LED4 into a high-impeda nce state.
LED Current
RT9300A/B provides a constant current for white LED.
Figure 1 shows a typical application circuit for 4 white
LEDs. Ea ch channel supports up to 20mA/15mA current
and regulates a constant current for uniform intensity . For
keypad LED application, the all channels must be
connected to LED as shown in Figure 2. In order to maintain
LED con sta nt current, the input voltage must provide the
required LED forward voltage and current source dropout
voltage. If the forward voltage of white LEDs is 3.3V, the
input voltage should be higher than 3.4V to provide enough
voltage headroom for maintaining constant brightness.
LED Brightness Dimming Control
For controlling the LED brightness, the RT9300A/B can
perform the dimming control by a pplying a PWM signal to
EN pin. When an external PWM signal is connected to
the EN pin, brightness of white LED is adjusted by the
duty cycle. The average LED current is proportional to the
PWM signal duty cycle. The magnitude of the PWM signal
must be higher than the minimum level of enable input
high level, in order to let the dimming control perform
correctly, the suggested PWM frequency ra nge is 10kHz
to 200Hz.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to a mbient. The maxi mum power dissipation ca n
be calculated by following formula :
PD(MAX) = ( TJ(MAX) - TA ) / θJA
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and
the θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9300, where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For SOT-23-6
packages, the thermal resistance θJA is 250°C/W on the
standard JEDEC 51-3 single-layer thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by following formula :
PD(MAX) = (125°C − 25°C) / (250°C/W) = 0.4W for
SOT-23-6 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal resistance
θJA. For RT9300 packages, the Figure 1 of derating curves
allows the designer to see the effect of rising ambient
temperature on the maximum power allowed.
Figure 1. Derating Curves for RT9300 Packages
0
50
100
150
200
250
300
350
400
450
500
0 255075100125
Ambient Tem perat ur e (°C)
Maxi mum Power Di ssipation (mW )
SOT-23-6
Single Layer PCB