HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Hamamatsu City, 435-8558 Japan, Telephone: (81) 053-434-3311, Fax: (81) 053-434-5184, http://www.hamamatsu.com
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Information furnished by HAMAMATSU is believed to be reliable . How ever, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. ©2003 Hamamatsu Photonics K.K.
Si PIN photodiode with preamp
S6468 series
Cat. No. KPIN1026E05
Aug. 2003 DN
■ Spectral response
-30
0.1 1 10010 1000
-10
-20
[Typ. Ta=25 ˚C, R
L
=500 Ω, C
L
=13 pF (S6468-05/-10: 3 pF), V
CC
=5 V]
0
-3
10
RELATIVE SENSITIVITY (dB)
FREQUENCY (MHz)
S6468
S6468-02
Vcc
GND
Vsignal
R
L
C
L
C
B
Vcc
■ Frequency characteristics ■ Output noise spectrum
■ Dimensional outline (unit: mm) ■ Basic connection
KPINA0001EF
KPINC0001EA
13.5
3.6 ± 0.2
2.8
PHOTOSENSITIVE
SURFACE
2.54 ± 0.2
0.45
LEAD
Vcc
GND (CASE)
V signal
5.4
±
0.2
4.7 ± 0.1
WINDOW
3.0 ± 0.1
KPINB0126EB
200
WAVELENGTH (nm)
PHOTO SENSITIVITY (mV/µW)
400 600 800 1000 1200
(Typ.Ta=25 ˚C)
0
2
4
6
8
10
12
14
16
18
20
S6468
S6468-02
KPINB0163EB
0
0.1 1 10
FREQUENCY (MHz)
OUTPUT NOISE DENSITY (nV/Hz
1/2
)
100 1000
[Typ.Ta=25 ˚C, R
L
=500 Ω, C
L
=13 pF (S6468-05/-10: 3 pF), Vcc=5 V]
10
20
30
40
50
60
70
80
90
100
S6468
S6468-02
KPINB0164EB
● ESD
S6468 series may be damaged or their performance may deteriorate by such factors as electro static discharge from the human body,
surge voltages from measurement equipment, leakage voltages from soldering irons and packing materials, etc. As a countermeasure
against electro static discharge, the device, operator, work place and measuring jigs must all be set at the same potential. The following
precautions must be observed during use:
· To protect the device from electro static discharge which accumulate on the operator or the operator's clothes, use a wrist strap or similar
tools to ground the operator's body via a high impedance resistor (1 MΩ).
· A semiconductive sheet (1 MΩ to 100 MΩ) should be laid on both the work table and the floor in the work area.
· When soldering, use an electrically grounded soldering iron with an isolation resistance of more than 10 MΩ.
· For containers and packing, use of a conductive material or aluminum foil is effective. When using an antistatic material, use one with a
resistance of 0.1 MΩ/cm2 to 1 G Ω/cm2.
● Wiring
· RL and CL are total resistive load and capacitive load viewed from the V signal terminal. When connecting a cable or circuit to the latter stage
of the basic connection diagram, the cable or circuit resistance and capacitance should also be taken into account. They should be used
in accordance with the recommended operating conditions: RL≥500 Ω and CL ≤ 13 pF.
· A bypass capacitor (CB=0.01 µF to 0.1 µF ceramic) is connected between the Vcc lead and the GND lead.
· The lead length should be less than 20 mm.
· If electric current or voltage is applied in reverse polarity to an electronic device such as a preamplifier, this can degrade device performance
or destroy the device. Always check the wiring and dimensional outline to avoid misconnection.
Precautions for use