TDA3661AT-T - NXP - Product.Network

1. General description

The TDA3661 is an adjustable voltage regulator with very low dropout voltage and

quiescent current, which operates over a wide supply voltage range.

2. Features

■Output adjustable from 1.5 V to VP, 100 mA regulator

■Supply voltage range up to 45 V

■Very low quiescent current of 15 µA (typical value)

■Very low dropout voltage

■Protections:

◆Reverse polarity safe (down to −25 V without high reverse current)

◆Negative transient of 50 V (RS=10Ω, t < 100 ms)

◆Able to withstand voltages up to 18 V at the output (supply line may be

short-circuited)

◆ESD protection on all pins

◆DC short-circuit safe to ground and VP of the regulator output

◆Temperature protection (at Tj> 150 °C)

3. Quick reference data

[1] VREG = Vref × k

TDA3661

Very low dropout voltage/quiescent current adjustable voltage

regulator

Rev. 05 — 28 June 2005 Product data sheet

Table 1: Quick reference data

amb

= 25

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Supply

VPsupply voltage regulator on 3 14.4 45 V

Iqquiescent supply

current VP= 14.4 V; IREG = 0 mA - 15 30 µA

Regulator; k = 4.01929[1]

VREG output voltage 8 V ≤VP≤22 V; IREG = 0.5 mA 4.8 5.0 5.2 V

6V≤VP≤45 V; IREG = 0.5 mA 4.75 5.0 5.25 V

0.5 mA ≤IREG ≤100 mA 4.75 5.0 5.25 V

Vref reference voltage VP= 14.4 V 1.181 1.244 1.306 V

VREG(drop) dropout voltage VP= 4.5 V; IREG =50mA;

Tamb ≤85 °C- 0.18 0.3 V

Product data sheet Rev. 05 — 28 June 2005 2 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

4. Ordering information

5. Block diagram

6. Pinning information

6.1 Pinning

Table 2: Ordering information

Type number Package

Name Description Version

TDA3661AT SO8 plastic small outline package; 8 leads;

body width 3.9 mm SOT96-1

Fig 1. Block diagram

mgs579

REGULATOR

2, 3, 6, 7

GND

REG

5ADJ

BAND GAP

TDA3661 THERMAL

PROTECTION

Fig 2. Pin conﬁguration

TDA3661

REG VP

GND GND

n.c. ADJ

001aac940

Product data sheet Rev. 05 — 28 June 2005 3 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

6.2 Pin description

[1] All GND pins are connected to the lead frame and can also be used to reduce the total thermal resistance

Rth(j-a) by soldering these pins to a ground plane. The ground plane on the top side of the printed-circuit

board acts like a heat spreader.

7. Functional description

The TDA3661 is an adjustable voltage regulator with an output voltage that can be ﬁxed

by means of an external resistor divider. The regulator can deliver output currents up to

100 mA. The regulator is available in an SO8 package. The regulator is intended for

portable, mains and telephone applications. To increase the lifetime of batteries, a

specially built-in clamp circuit keeps the quiescent current of this regulator very low, in

dropout and full load conditions.

The device remains operational down to very low supply voltages (typical 2 V) and below

this voltage it switches off. A temperature protection is included which switches off the

regulator output at a junction temperature above 150 °C.

8. Limiting values

9. Thermal characteristics

Table 3: Pin description

Symbol Pin Description

REG 1 regulator output

GND 2, 3, 6 and 7 ground[1]

n.c. 4 not connected

ADJ 5 feedback input

VP8 supply voltage

Table 4: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VPsupply voltage - 45 V

VP(rp) reverse polarity supply

voltage non-operating - −25 V

Ptot total power dissipation temperature of

copper area is

25 °C

- 4.1 W

Tstg storage temperature non-operating −55 +150 °C

Tamb ambient temperature operating −40 +125 °C

Tjjunction temperature operating −40 +150 °C

Table 5: Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-c) thermal resistance from junction to case to center pins; soldered 30 K/W

Rth(j-a) thermal resistance from junction to ambient in free air; soldered 155 K/W

Product data sheet Rev. 05 — 28 June 2005 4 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

10. Characteristics

[1] The output voltage can be calculated using the following formula: where and

[2] The regulator output will follow VPif VP<V

REG +V

REG(drop)

11. Application information

11.1 Noise

The output noise is determined by the value of the output capacitor. The noise ﬁgure is

measured at a bandwidth of 10 Hz to 100 kHz; see Table 7.

Table 6: Characteristics

= 14.4 V; T

amb

=25

C; k = 4.01929

[1]

; measured with test circuit of Figure 15; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Supply voltage: pin VP

VPsupply voltage regulator operating [2] 3 14.4 45 V

Iqquiescent supply current VP= 4.5 V; IREG = 0 mA - 10 30 µA

VP= 14.4 V; IREG = 0 mA - 15 30 µA

6V≤VP≤24 V; IREG = 10 mA - 0.2 0.5 mA

6V≤VP≤24 V; IREG = 50 mA - 1.4 2.5 mA

Regulator output: pin REG

VREG output voltage 8 V ≤VP≤22 V; IREG = 0.5 mA 4.8 5.0 5.2 V

0.5 mA ≤IREG ≤ 100 mA 4.75 5.0 5.25 V

6V≤VP≤45 V; IREG = 0.5 mA 4.75 5.0 5.25 V

VREG(drop) dropout voltage VP= 4.5 V; Tamb ≤85 °C;

IREG =50mA - 0.18 0.3 V

VREG(stab) output voltage long-term

stability per 1000 h - 20 - mV

VREG(adj) output voltage adjustment

range 1.5 - VPV

∆VREG(line) line input regulation voltage 7 V ≤VP≤22 V; IREG = 0.5 mA - 1 30 mV

7V≤VP≤45 V; IREG = 0.5 mA - 1 50 mV

∆VREG(load) load output regulation

voltage 0.5 mA ≤IREG ≤50 mA - 10 50 mV

SVRR supply voltage ripple

rejection fi= 120 Hz;Vi(ripple) = 1 V (RMS);

IREG = 0.5 mA 50 60 - dB

Vref reference voltage VP= 14.4 V 1.181 1.244 1.306 V

IREG(crl) output current limit VREG > 4 V 0.17 0.3 - A

ILO(rp) output leakage current at

reverse polarity VP=−15 V; VREG =≤0.3 V - 1 500 µA

VREG Vref k×=kR1 R2+

--------------------

=R1 R2 100 kΩ≤+

Table 7: Noise ﬁgures

Output current

IREG (mA) Noise ﬁgure (µV)

C2=10µFC2=47µF C2 = 100 µF

0.5 550 320 300

50 650 400 400

Product data sheet Rev. 05 — 28 June 2005 5 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

11.2 Stability

The regulator is stabilized with an external capacitor connected to the output.

For stable operation:

1. The output capacitor ESR should not exceed 22 Ω (worst case)

2. A maximum ESR may be required; see Table 8

3. It is recommended not to use below 1 mA output current because of reduced phase

margin

4. Use electrolytic capacitors for output capacitor values of 1 µF and above.

11.3 Application circuits

The maximum output current of the regulator equals:

When Tamb =21°C, VP=14VandV

REG = 5 V (k = 4.01929) the maximum output current

equals 140 mA.

For successful operation of the IC (maximum output current capability) special attention

has to be given to the copper area required as heatsink (connected to all GND pins), the

thermal capacity of the heatsink and its ability to transfer heat to the external environment.

It is possible to reduce the total thermal resistance from 155 K/W to 50 K/W.

11.3.1 Application circuit with backup function

Sometimes, a backup function is needed to supply, for example, a microcontroller for a

short period of time when the supply voltage spikes to 0 V (or even −1 V).

This function can easily be built with the TDA3661 by using an output capacitor with a

large value. When the supply voltage is 0 V (or −1 V), only a small current will ﬂow into

pin REG from this output capacitor (a few µA).

The application circuit is given in Figure 3.

Table 8: Minimum ESR values required

IREG (mA) C2 = 100 nF C2 = 1 µF C2 = 10 µF C2 = 100 µF

1> 0 Ω> 1.5 Ω> 0 Ω> 0 Ω

5> 0 Ω> 0 Ω> 0 Ω> 0 Ω

10 > 0 Ω> 0 Ω> 0 Ω> 0 Ω

100 > 0 Ω> 0 Ω> 0 Ω> 0 Ω

IREG max() 150 Tamb

–

Rth j a–()VPVREG

–()×

----------------------------------------------------------- 150 Tamb

–

100 VP5–()×

------------------------------------mA()==

Product data sheet Rev. 05 — 28 June 2005 6 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

11.3.2 Application circuit with enable function

An enable function can easily be built with the TDA3661 by connecting a diode to pin ADJ.

When the voltage on pin ADJ is forced above 1.3 V, the output will switch off. The standby

current is equal to the quiescent current of the TDA3661.

The application circuit is given in Figure 4.

11.4 Additional application information

This section gives typical curves for various parameters measured on the TDA3661AT.

Standard test conditions are: VP= 14.4 V, Tamb =25°C and k = 4.01929.

(1) C1 is optional (to minimize supply noise only)

(2) C2 ≤4700 µF

Fig 3. Application circuit with backup function

mgs582

VP81

2, 3, 6, 7

C2(2)

TDA3661 75.1 kΩ

C1(1)

1 µFR1

24.9 kΩ

VREG

= 5 V

C1 is optional (to minimize supply noise only)

Fig 4. Application circuit with enable function

mgs583

VP81

2, 3, 6, 7

enable

TDA3661 75.1 kΩ10 µF

C1(1)

1 µFR1

24.9 kΩ

R2 D1

VREG

= 5 V

Product data sheet Rev. 05 — 28 June 2005 7 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

IREG = 0 mA.

Fig 5. Quiescent current as a function of the supply

voltage Fig 6. Quiescent current increase as a function of

high supply voltage

010 VP (V)

(µA)

20 30

mda947

010 50

20 30 VP (V)

(mA)

mda949

(1) Iq at 50 mA load.

(2) Iq at 10 mA load. IREG = 10 mA.

Fig 7. Quiescent current as a function of the

junction temperature Fig 8. Quiescent current as a function of the supply

voltage

−40 0

(1)

(2)

160

1.5

0.5

40 80 Tj (°C)

(mA)

120

mda951

0.36

0.40

0.44

0.48

10 15 VP (V)

(mA)

mda948

Product data sheet Rev. 05 — 28 June 2005 8 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

IREG = 50 mA.

Fig 9. Quiescent current as a function of the supply

voltage Fig 10. Quiescent current as a function of the output

current

1.4

1.6

1.8

10 15 VP (V)

(mA)

mda950

0 20 100

40 60 IREG (mA)

(mA)

mda952

IREG = 0 mA. IREG = 0 mA.

Fig 11. Output voltage thermal protection as a function

of the junction temperature Fig 12. Dropout voltage as a function of the output

current

−50 200

050 Tj (°C)

VREG

(V)

100 150

mda955

040 IREG (mA)

VREG(drop)

(mV)

80 120

500

400

200

100

300

mda957

Product data sheet Rev. 05 — 28 June 2005 9 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

12. Test information

12.1 Quality information

The

General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611

is applicable.

12.2 Test circuit

VP = 8 V and pulsed load IREG = 10 mA; C2 = 10 µF.

(1) SVRR at RL= 100 Ω.

(2) SVRR at RL= 500 Ω.

(3) SVRR at RL=10kΩ.

Fig 13. Fold back protection mode Fig 14. Supply voltage ripple rejection as a function of

the ripple frequency

0100

VREG

(V)

IREG (mA)

200 300

mda954

−70

−60

−50

−40

−30

mda956

SVRR

(dB)

f (Hz)

102103104105

(1)

(2)

(3)

C1 is optional (to minimize supply noise only)

Fig 15. Test circuit

mgs581

VP81

2, 3, 6, 7

VREG

= 5 V

TDA3661 75.1 kΩ10 µF

C1(1)

1 µFR1

24.9 kΩ

Product data sheet Rev. 05 — 28 June 2005 10 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

13. Package outline

Fig 16. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

99-12-27

03-02-18

Product data sheet Rev. 05 — 28 June 2005 11 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of

soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch

SMDs. In these situations reﬂow soldering is recommended.

14.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 seconds and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 °Cto270°C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

•below 225 °C (SnPb process) or below 245 °C (Pb-free process)

–for all BGA, HTSSON..T and SSOP..T packages

–for packages with a thickness ≥2.5 mm

–for packages with a thickness < 2.5 mm and a volume ≥350 mm3 so called

thick/large packages.

•below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

•Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

–larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

Product data sheet Rev. 05 — 28 June 2005 12 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

–smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

•For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

14.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270 °C and 320 °C.

14.5 Package related soldering information

[1] For more detailed information on the BGA packages refer to the

(LF)BGA Application Note

(AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C±10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible.

Table 9: Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package[1] Soldering method

Wave Reﬂow[2]

BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,

SSOP..T[3], TFBGA, VFBGA, XSON not suitable suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable[4] suitable

PLCC[5], SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended[5] [6] suitable

SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable

CWQCCN..L[8], PMFP[9], WQCCN..L[8] not suitable not suitable

Product data sheet Rev. 05 — 28 June 2005 13 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

Product data sheet Rev. 05 — 28 June 2005 14 of 16

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

15. Revision history

Table 10: Revision history

Document ID Release date Data sheet status Change notice Doc. number Supersedes

TDA3661_5 20050628 Product data sheet - 9397 750 15049 TDA3661_4

Modiﬁcations: •The format of this data sheet has been redesigned to comply with the new presentation and

information standard of Philips Semiconductors.

•Paragraph removed from Section 7

•Figure 3,Figure 4 and Figure 13 removed from the previous version

TDA3661_4 20001213 Product speciﬁcation - 9397 750 07864 TDA3661_3

TDA3661_3 20001208 Preliminary

speciﬁcation - 9397 750 07554 TDA3661_2

TDA3661_2 20000201 Preliminary

speciﬁcation - 9397 750 06797 TDA3661_1

TDA3661_1 19990920 Preliminary

speciﬁcation - 9397 750 06067 -

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

Product data sheet Rev. 05 — 28 June 2005 15 of 16

16. Data sheet status

[1] Please consult the most recently issued data sheet before initiating or completing a design.

[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

17. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

18. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

19. Trademarks

Notice — All referenced brands, product names, service names and

trademarks are the property of their respective owners.

20. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Level Data sheet status[1] Product status[2] [3] Deﬁnition

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights. Date of release: 28 June 2005

Document number: 9397 750 15049

Published in The Netherlands

Philips Semiconductors TDA3661

Very low dropout voltage/quiescent current voltage regulator

21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 3

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

9 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

11 Application information. . . . . . . . . . . . . . . . . . . 4

11.1 Noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

11.2 Stability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

11.3 Application circuits . . . . . . . . . . . . . . . . . . . . . . 5

11.3.1 Application circuit with backup function . . . . . . 5

11.3.2 Application circuit with enable function. . . . . . . 6

11.4 Additional application information. . . . . . . . . . . 6

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9

12.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9

12.2 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14.1 Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14.2 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 11

14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 11

14.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 12

14.5 Package related soldering information . . . . . . 12

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 15

17 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

18 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

20 Contact information . . . . . . . . . . . . . . . . . . . . 15