DESCRIPTION
The
μ
PG2179TB is a GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and other
L, S-band applications. This device operates with dual control voltages of 2.5 to 5.3 V. This device can operate from 0.05 to
3.0 GHz, with low insertion loss and high isolation.
This device is housed in a 6-pin super minimold package, and is suitable for high-density surface mounting.
FEATURES
•Switch control voltage : Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.)
V : cont (L) = −0.2 to +0.2 V (0 V TYP.)
•Low insertion loss : Lins1 = 0.25 dB TYP. @ f = 0.05 to 1.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
L : ins2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
L : ins3 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
L : ins4 = 0.40 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
•High isolation : ISL1 = 27 dB TYP. @ f = 0.05 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
V ,zHG 0.3 ot 0.2 = f @ .PYT Bd 42 = 2LSI : cont (H) = 3.0 V, Vcont (L) = 0 V
•handling Power : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
P : in (1 dB) = +32.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
•High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
•L, S-band digital cellular or cordless telephone
•PCS, W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
mroF gniylppuS gnikraM egakcaP rebmuN traP
μ
PG2179TB-E4-A 6-pin super minimold G4C •Embossed tape 8 mm wide
•Pin 4, 5, 6 face the perforation side of the tape
•Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
μ
PG2179TB-A
DATA SHEET
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
L, S-BAND MEDIUM POWER SPDT SWITCH
GaAs INTEGRATED CIRCUIT
μ
PG2179TB
Document No. PG10454EJ02V0DS (2nd edition)
Date Published March 2004 CP(K)
The mark shows major revised points.
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PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No. Pin Name
1 OUTPUT1
2 GND
3 OUTPUT2
4 Vcont2
5 INPUT
(Top View)
1
2
3
6
5
4
G4C
(Bottom View)
6
5
4
1
2
3
(Top View)
1
2
3
6
5
4
6 Vcont1
TRUTH TABLE
Vcont1 Vcont2 INPUT−OUTPUT1 INPUT−OUTPUT2
Low High ON OFF
High Low OFF ON
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Switch Control Voltage Vcont 6.0 Note V
P rewoP tupnI in +33 dBm
Operating Ambient Temperature TA−45 to +85 °C
Storage Temperature Tstg −55 to +150 °C
Note ⏐Vcont1 − Vcont2⏐ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter Symbol MIN. TYP. MAX. Unit
Switch Control Voltage (H) Vcont (H) 2.5 3.0 5.3 V
Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V
Data Sheet PG10454EJ02V0DS
2
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PG2179TB
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ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
L 1 ssoL noitresnI ins1 f = 0.05 to 1.0 GHz Note1 −0.25 0.45 dB
L 2 ssoL noitresnI ins2 f = 1.0 to 2.0 GHz −0.30 0.50 dB
L 3 ssoL noitresnI ins3 f = 2.0 to 2.5 GHz −0.35 0.55 dB
L 4 ssoL noitresnI ins4 f = 2.5 to 3.0 GHz −0.40 0.60 dB
zHG 0.2 ot 50.0 = f 1LSI 1 noitalosI Note1 23 27 −dB
42 02 zHG 0.3 ot 0.2 = f 2LSI 2 noitalosI −dB
LR ssoL nruteR tupnI in f = 0.05 to 3.0 GHz Note1 15 20 −dB
Output Return Loss RLout f = 0.05 to 3.0 GHz Note1 15 20 −dB
0.1 dB Loss Compression Pin (0.1 dB) 0.92+ 5.52+ zHG 0.2 = f −dBm
Input Power Note2 0.92+ 5.52+ zHG 5.2 = f −dBm
zHG 0.3 ot 5.0 = f −+29.0 −dBm
Switch Control Current Icont No signal −4 20
μ
A
Switch Control Speed tsw 50%CTL to 90/10%RF −50 500 ns
Note1. DC blocking capacitor = 1 000 pF at f = 0.05 to 0.5 GHz.
2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear
range.
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
1 dB Loss Compression
Input Power Note
Pin (1 dB) f = 0.5 to 3.0 GHz −+32.0 −dBm
3rd Order Intermodulation Intercept
Point
IIP3 f = 0.5 to 3.0 GHz, 2 tone,
5 MHz spicing
−+60.0 −dBm
Note Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear
range.
Caution When using this IC, a DC coupling capacitor must be externally attached to the I/O pins.
A DC coupling capacitor with a capacitance of 100 pF or lower is recommended when using a
frequency of 0.5 GHz or higher, and one with a capacitance of 1,000 pF is recommended when
using a frequency of less than 0.5 GHz. The ideal value changes depending on the frequency and
bandwidth used, so select a capacitor with a suitable capacitance according to the usage
conditions.
Data Sheet PG10454EJ02V0DS 3
μ
PG2179TB
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EVALUATION CIRCUIT
OUTPUT2 OUTPUT1
C
O
C
O
65
4
1
23
V
cont2
V
cont1
INPUT
C
O
1 000 pF1 000 pF
Remark CO : 0.05 to 0.5 GHz 1 000 pF
0.5 to 3.0 GHz 100 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PG10454EJ02V0DS
4
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PG2179TB
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ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
C3
C5
C1
C2
C4
G4C
6pin SMM SPDT SW
Vc2
Vc1
IN
OUT 2
OUT 1
C1
C1
C1
C2
C2
V
cont2
OUTPUT2
INPUT
OUTPUT1
V
cont1
USING THE NEC EVALUATION BOARD
Symbol Values
C1, C2, C3 100 pF
C4, C5 1 000 pF
Data Sheet PG10454EJ02V0DS 5
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PG2179TB
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TYPICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified)
0.5
0.4
0.2
0.3
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Insertion Loss L
ins
(dB)
Frequency f (GHz)
INSERTION LOSS vs. FREQUENCY
INPUT–OUTPUT1
50
40
30
–10
20
10
0
–30
–20
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Isolation ISL (dB)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
INPUT–OUTPUT1
50
10
20
30
40
–10
0
–30
–20
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Input Return Loss RL
in
(dB)
Frequency f (GHz)
INPUT RETURN LOSS vs. FREQUENCY
INPUT–OUTPUT1
50
10
20
30
40
–10
0
–30
–20
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Isolation ISL (dB)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
INPUT–OUTPUT2
50
10
20
30
40
–10
0
–30
–20
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Input Return Loss RL
in
(dB)
Frequency f (GHz)
INPUT RETURN LOSS vs. FREQUENCY
INPUT–OUTPUT2
0.5
0.4
0.3
0.2
0
0.1
–0.1
–0.2
–0.3
–0.4
–0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Insertion Loss L
ins
(dB)
Frequency f (GHz)
INSERTION LOSS vs. FREQUENCY
INPUT–OUTPUT2
Remark The graphs indicate nominal characteristics.
Data Sheet PG10454EJ02V0DS
6
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PG2179TB
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33
13
15
31
29
27
25
23
21
19
17
15 17 19 21 23 25 27 29 31 33 35
Output Power P
out
(dBm)
Input Power P
in
(dBm)
OUTPUT POWER vs. INPUT POWER
f = 2.5 GHz
23
25
27
29
31
33
13
15
17
19
21
15 17 19 21 23 25 27 29 31 33 35
Output Power P
out
(dBm)
Input Power P
in
(dBm)
OUTPUT POWER vs. INPUT POWER
f = 1.0 GHz
50
10
20
30
40
–10
0
–30
–20
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Output Return Loss RL
out
(dB)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT–OUTPUT1
50
10
20
30
40
–10
0
–30
–20
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Output Return Loss RL
out
(dB)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT–OUTPUT2
Remark The graphs indicate nominal characteristics.
Data Sheet PG10454EJ02V0DS 7
μ
PG2179TB
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Drop-In Replacement: CG2179M2
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
0.9±0.1
0.7
0 to 0.1
0.15
+0.1
–0.05
0.2
+0.1
–0.05
2.0±0.2
1.3
0.650.65
1.25±0.1
2.1±0.1
0.1 MIN.
Data Sheet PG10454EJ02V0DS
8
μ
PG2179TB
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Drop-In Replacement: CG2179M2
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
gniredloS dohteM gniredloS lobmyS noitidnoC snoitidnoC
Infrared Reflow Peak temperature (package surface temperature) : 260°C or below
ssel ro sdnoces 01 : erutarepmet kaep ta emiT
Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180°021 : C ±30 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
512 : )erutarepmet ecafrus egakcap( erutarepmet kaeP SPV °C or below
Time at temperature of 200°C or higher : 25 to 40 seconds
Preheating time at 120 to 150° sdnoces 06 ot 03 : C
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
VP215
Wave Soldering Peak temperature (molten solder temperature) : 260°C or below
ssel ro sdnoces 01 : erutarepmet kaep ta emiT
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating Peak temperature (pin temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10454EJ02V0DS 9
μ
PG2179TB
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Drop-In Replacement: CG2179M2
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
M8E 00. 4 - 0110
The information in this document is current as of March, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
Data Sheet PG10454EJ02V0DS
10
μ
PG2179TB
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Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
•Do not lick the product or in any way allow it to enter the mouth.
0401
μ
PG2179TB
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Drop-In Replacement: CG2179M2
NOTICE
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and
application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California
Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits,
software, or information.
2. California Eastern Laboratories has used reasonable care in preparing the information included in this document, but California Eastern Laboratories does
not warrant that such information is error free. California Eastern Laboratories and Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
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rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express,
implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of California Eastern Laboratories or Renesas
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for each Renesas Electronics product depends on the product’s quality grade, as indicated below. “Standard”: Computers; ofce equipment; communications
equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and
industrial robots etc. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); trafc control systems; anti-disaster systems; anti-crime
systems; and safety equipment etc. Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct
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for which the product is not intended by California Eastern Laboratories or Renesas Electronics.
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characteristics. California Eastern Laboratories shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products
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the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation
resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by
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For a complete list of sales ofces, representatives and distributors,
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