DATA SHEET GaAs INTEGRATED CIRCUIT L, S-BAND MEDIUM POWER SPDT SWITCH DESCRIPTION 2 NU CG E 21 79 D M PG2179TB The PG2179TB is a GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and other L, S-band applications. This device operates with dual control voltages of 2.5 to 5.3 V. This device can operate from 0.05 to 3.0 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package, and is suitable for high-density surface mounting. FEATURES : Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.) T I e * Switch control voltage : Vcont (L) = -0.2 to +0.2 V (0 V TYP.) : Lins1 = 0.25 dB TYP. @ f = 0.05 to 1.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V nt : * Low insertion loss : Lins2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins3 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V O p N : Lins4 = 0.40 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL1 = 27 dB TYP. @ f = 0.05 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V lac em * High isolation : ISL2 = 24 dB TYP. @ f = 2.0 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V * Power handling : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +32.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V * High-density surface mounting : 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) APPLICATIONS SC * L, S-band digital cellular or cordless telephone Re * PCS, W-LAN, WLL and BluetoothTM etc. ORDERING INFORMATION Part Number In 6-pin super minimold Marking G4C Supplying Form * Embossed tape 8 mm wide * Pin 4, 5, 6 face the perforation side of the tape * Qty 3 kpcs/reel ro p- D D I PG2179TB-E4-A Package Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2179TB-A Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. PG10454EJ02V0DS (2nd edition) Date Published March 2004 CP(K) The mark shows major revised points. PG2179TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM 3 (Bottom View) Pin No. Pin Name 5 2 4 3 TRUTH TABLE 6 6 1 1 OUTPUT1 2 GND 5 5 2 4 4 3 Vcont1 Vcont2 INPUT-OUTPUT1 INPUT-OUTPUT2 Low High ON OFF High Low OFF ON 3 T I e Vcont2 5 INPUT 6 Vcont1 Switch Control Voltage Ratings Vcont Storage Temperature dBm TA -45 to +85 C Tstg Note Vcont1 - Vcont2 6.0 V V +33 lac em Operating Ambient Temperature Note Pin O p N Input Power 6.0 Unit nt : Symbol -55 to +150 C RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified) Symbol MIN. TYP. MAX. Unit Switch Control Voltage (H) Vcont (H) 2.5 3.0 5.3 V Switch Control Voltage (L) Vcont (L) -0.2 0 0.2 V ro p- D D I In Re SC Parameter 2 Data Sheet PG10454EJ02V0DS OUTPUT2 4 ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) Parameter 2 2 6 1 G4C 1 (Top View) NU CG E 21 79 D M (Top View) PG2179TB Symbol Insertion Loss 1 Lins1 Insertion Loss 2 Lins2 Insertion Loss 3 Lins3 Insertion Loss 4 Lins4 Isolation 1 ISL1 Isolation 2 ISL2 Input Return Loss RLin Output Return Loss RLout 0.1 dB Loss Compression Note2 Icont TYP. MAX. Unit - 0.25 0.45 dB f = 1.0 to 2.0 GHz - 0.30 0.50 dB f = 2.0 to 2.5 GHz - 0.35 0.55 dB f = 2.5 to 3.0 GHz - 0.40 0.60 dB 23 27 - dB f = 0.05 to 1.0 GHz f = 0.05 to 2.0 GHz Note1 Note1 f = 2.0 to 3.0 GHz 20 24 - dB f = 0.05 to 3.0 GHz Note1 15 20 - dB f = 0.05 to 3.0 GHz Note1 15 20 - dB f = 2.0 GHz +25.5 +29.0 - dBm f = 2.5 GHz +25.5 +29.0 - dBm f = 0.5 to 3.0 GHz - +29.0 - dBm No signal - 4 20 A 50%CTL to 90/10%RF - 50 500 ns T I e Switch Control Current MIN. Switch Control Speed tsw nt : Input Power Pin (0.1 dB) Test Conditions 2 Parameter NU CG E 21 79 D M ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified) Note1. DC blocking capacitor = 1 000 pF at f = 0.05 to 0.5 GHz. 2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear O p N range. lac em STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified) Parameter Symbol 1 dB Loss Compression Pin (1 dB) Input Power Note Point IIP3 MIN. TYP. MAX. Unit f = 0.5 to 3.0 GHz - +32.0 - dBm f = 0.5 to 3.0 GHz, 2 tone, - +60.0 - dBm 5 MHz spicing Re SC 3rd Order Intermodulation Intercept Test Conditions Note Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear range. In Caution When using this IC, a DC coupling capacitor must be externally attached to the I/O pins. A DC coupling capacitor with a capacitance of 100 pF or lower is recommended when using a ro p- D D I frequency of 0.5 GHz or higher, and one with a capacitance of 1,000 pF is recommended when using a frequency of less than 0.5 GHz. The ideal value changes depending on the frequency and bandwidth used, so select a capacitor with a suitable capacitance according to the usage conditions. Data Sheet PG10454EJ02V0DS 3 PG2179TB EVALUATION CIRCUIT OUTPUT1 CO CO 3 2 1 4 5 6 CO T I e 1 000 pF 2 NU CG E 21 79 D M OUTPUT2 Remark CO : 0.05 to 0.5 GHz 1 000 pF O p N 0.5 to 3.0 GHz 100 pF INPUT Vcont1 nt : Vcont2 1 000 pF lac em ro p- D D I In Re SC The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10454EJ02V0DS PG2179TB Vcont2 nt N :C U G2 E 17 D 9M ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vc2 2 6pin SMM SPDT SW OUTPUT2 2 C2 C C 4 OUT 2 INPUT IN C3 C1 T I e C1 G4C C1 C C C2 Vc1 SC Vcont1 OUT 1 OUTPUT1 lac em O p N 5 1 Re USING THE NEC EVALUATION BOARD Symbol Values 1 000 pF ro p- D D I C4, C5 100 pF In C1, C2, C3 Data Sheet PG10454EJ02V0DS 5 PG2179TB TYPICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified) 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 Frequency f (GHz) -30 -40 -0.3 T I e 50 SC Isolation ISL (dB) 20 10 0 -10 -20 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT-OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY INPUT-OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY Re Frequency f (GHz) 30 D D I 20 ro p- 10 50 40 In 40 Input Return Loss RLin (dB) 50 0 -10 -20 -30 30 20 10 0 -10 -20 -30 -40 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. 6 INPUT-OUTPUT2 ISOLATION vs. FREQUENCY -30 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Input Return Loss RLin (dB) -0.2 30 lac em -20 0 -0.1 Frequency f (GHz) O p N Isolation ISL (dB) -10 0.1 40 30 0 0.2 -0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 INPUT-OUTPUT1 ISOLATION vs. FREQUENCY 40 10 0.3 -0.4 -0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 20 2 0.3 Insertion Loss Lins (dB) Insertion Loss Lins (dB) 0.5 0.4 0.4 50 INPUT-OUTPUT2 INSERTION LOSS vs. FREQUENCY nt N :C U G2 E 17 D 9M 0.5 INPUT-OUTPUT1 INSERTION LOSS vs. FREQUENCY Data Sheet PG10454EJ02V0DS PG2179TB INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 50 nt N :C U G2 E 17 D 9M 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER f = 1.0 GHz 17 15 13 15 17 19 21 -10 -20 -30 -40 33 23 25 Output Power Pout (dBm) 25 19 0 OUTPUT POWER vs. INPUT POWER f = 2.5 GHz T I e 27 21 10 31 29 23 20 Frequency f (GHz) O p N Output Power Pout (dBm) 31 30 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 lac em 33 40 2 40 Output Return Loss RLout (dB) Output Return Loss RLout (dB) 50 INPUT-OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 27 29 31 33 35 29 27 25 23 21 19 17 15 13 15 17 Input Power Pin (dBm) 19 21 23 25 27 29 31 33 35 Input Power Pin (dBm) ro p- D D I In Re SC Remark The graphs indicate nominal characteristics. Data Sheet PG10454EJ02V0DS 7 PG2179TB PACKAGE DIMENSIONS NU CG E 21 79 D M 6-PIN SUPER MINIMOLD (UNIT: mm) 2 2.10.1 0.2+0.1 -0.05 0.65 0.65 1.3 2.00.2 1.250.1 8 0.15+0.1 -0.05 nt : lac em ro p- D D I In Re SC O p N 0 to 0.1 T I e 0.7 0.90.1 0.1 MIN. Data Sheet PG10454EJ02V0DS PG2179TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. NU CG E 21 79 D M methods and conditions other than those recommended below, contact your nearby sales office. Soldering Conditions Peak temperature (package surface temperature) : 10 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 3 times : 0.2%(Wt.) or below : 215C or below Preheating time at 120 to 150C : 30 to 60 seconds Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Maximum number of reflow processes Peak temperature (molten solder temperature) IR260 : 60 seconds or less Peak temperature (package surface temperature) Time at temperature of 200C or higher Wave Soldering : 260C or below Time at peak temperature Time at temperature of 220C or higher VPS Condition Symbol 2 Soldering Method Infrared Reflow For soldering : 25 to 40 seconds VP215 : 3 times : 260C or below Time at peak temperature : 10 seconds or less Maximum number of flow processes : 1 time Peak temperature (pin temperature) : 350C or below WS260 T I e Preheating temperature (package surface temperature) : 120C or below Partial Heating Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) O p N : 0.2%(Wt.) or below nt : Maximum chlorine content of rosin flux (% mass) : 3 seconds or less HS350 : 0.2%(Wt.) or below lac em ro p- D D I In Re SC Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10454EJ02V0DS 9 2 NU CG E 21 79 D M PG2179TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. nt : lac em ro p- D D I In Re SC O p N T I e * The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. 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Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. nt : lac em ro p- D D I In Re SC O p N T I e * Do not lick the product or in any way allow it to enter the mouth. 0401 NOTICE Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. 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