Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Electrical Characteristics
Max. Time Tripped
Ihold Itrip To Trip Power
Resistance
Dissipation
Model Amperes Ohms Amperes Seconds Watts
V max. I max.
at 23 °C at 23 °C at 23 °C at 23 °C at 23 °C
Volts Amps
Hold Trip RMin. R1Max. Typ.
MF-MSMD010 60.0 40 0.10 0.30 0.70 15.00 0.5 1.5 1.0
MF-MSMD014 60.0 40 0.14 0.34 0.40 6.50 1.5 0.15 1.0
MF-MSMD020 30.0 80 0.20 0.40 0.40 6.00 6.0 0.06 1.0
MF-MSMD030 30.0 10 0.30 0.60 0.30 3.00 8.0 0.10 1.2
MF-MSMD050 15.0 100 0.50 1.00 0.15 1.00 8.0 0.15 1.2
MF-MSMD075 13.2 100 0.75 1.50 0.11 0.45 8.0 0.20 1.2
MF-MSMD110 6.0 100 1.10 2.20 0.04 0.21 8.0 0.30 1.2
MF-MSMD125 6.0 100 1.25 2.50 0.035 0.14 8.0 0.4 1.5
MF-MSMD150 6.0 100 1.50 3.00 0.03 0.120 8.0 0.5 1.5
MF-MSMD160 8.0 100 1.60 2.80 0.035 0.099 8.0 2.0 1.5
MF-MSMD200 6.0 100 2.00 4.00 0.020 0.100 8.0 3.0 1.5
MF-MSMD260 6.0 100 2.60 5.20 0.015 0.080 8.0 5.0 1.5
Operating/Storage Temperature ........................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours....................±5 % typical resistance change
Thermal Shock ....................................................+85 °C to -40 °C, 20 times..........................±10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Environmental Characteristics
Test Test Conditions Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C ............................................................Rmin ≤R ≤R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤max. time to trip (seconds)
Hold Current....................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................MIL-STD-202F, Method 208F..........................................95 % min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number ................................CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000
TÜV Certificate Number......................R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
Test Procedures And Requirements For Model MF-MSMD Series
MF-MSMD Series - PTC Resettable Fuses
Features
■4.5 mm SMD
■Fast tripping resettable circuit protection
■Surface mount packaging for automated
assembly
■Reduced component size and resistance
■Agency recognition:
Applications
High Density Circuit Board Applications:
■Hard disk drives
■PC motherboards
■PC peripherals
■Point-of-sale (POS) equipment
■PCMCIA cards