Ver
201207
FEATURES
APPLICATION
N
oise
Suppression
in
power
line
DIMENSION
DESCRIPTION
Ch
ip
Ch
ip
Ch
ip
Ch
ip
Be
ad
Be
ad
Be
ad
Be
ad
Fo
r
Fo
r
Fo
r
Fo
r
Hig
h
Hig
h
Hig
h
Hig
h
Cu
rre
nt
Cur
re
nt
Cur
re
nt
Cur
re
nt
CIS
Series
CIS
series
is
used
f
or
high
current.
(~
6A)
Part
no.
Thickness
(
mm)
Impedance
(
Ω
)±2
5%@100
MHz
DC
Res
istance
(
Ω
)
Max.
Rated
Current
(
mA)
Max.
CIS21P300
0
.9±
0.2
30
0.01
6000
CIS21J121
0
.9±
0.2
120
0.02
5000
CIS32P520
1
.3±
0.2
52
0.01
6000
CIS41P600
1
.6±
0.2/1.2±0.2
60
0.01
6000
CIS41J600
1
.6±
0.2/1.2
±
0.2
60
0.01
6000
Type
Dimension
[
mm]
L
W
t
d
21
2.0±0.
2
1.25±0
.2
0.9±0.2
0.5+0.2
-0.3
32
3.2±0.
2
2.5±0.2
1.3±
0.2
0.5±0.
3
41
4.5±0.
2
1.6±0.
2
N:1.6
±
0.2
A:1.2
±
0.2
0.5±0.3
Ver
201207
CI
S
21
P
3
00
N
E
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(1)
Chip
Beads
(2)
For
Hig
h
current(S:~6A)
(3)
Dimension
(4)
Ma
terial
Code
(5)
Nominal
impedance
(300:30
Ω
,
221:220
Ω
)
(6)
Thickness
option(N:Standard,
A:T
hinner
than
standard,
B:Thicker
tha
n
standard)
(7)
Packaging(C:paper
tape,
E:
embossed
tape)
CHARACTERISTIC
DAT
A
PRODUCT
IDENTIFICA
TION
Ver
201207
■
NOTICE
:
All
specificat
ions
are
subjec
t
to
change
without
prev
ious
notice.
Please
contact
w
ith
product
r
epresentativ
es
or
engineers
to
check
specifications.
PACKAGING
Type
Packaging
Style
Quantity(pcs/reel)
21
Embossed
Taping
4,000
32
Embossed
Taping
2,500
41
Embossed
Taping
2,000
RECOMM
ENDED
SOLDERING
CO
NDITION
REFLOW
SO
LDERING
FLOW
SOLD
ERING
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