
Philips Semiconductors Product specification
74F259Latch
1989 Apr 11 5
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL PARAMETER RATING UNIT
VCC Supply voltage –0.5 to +7.0 V
VIN Input voltage –0.5 to +7.0 V
IIN Input current –30 to +5 mA
VOUT Voltage applied to output in High output state –0.5 to VCC V
IOUT Current applied to output in Low output state 40 mA
Tamb Operating free-air temperature range 0 to +70 °C
Tstg Storage temperature range –65 to +150 °C
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER LIMITS UNIT
MIN NOM MAX
VCC Supply voltage 4.5 5.0 5.5 V
VIH High-level input voltage 2.0 V
VIL Low-level input voltage 0.8 V
IIK Input clamp current –18 mA
IOH High-level output current –1 mA
IOL Low-level output current 20 mA
Tamb Operating free-air temperature range 0 70 °C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL PARAMETER TEST LIMITS UNIT
CONDITIONS1MIN TYP2MAX
VOH High-level output voltage VCC = MIN, VIL = MAX, ±10%VCC 2.5 V
VIH = MIN, IOL = MAX ±5%VCC 2.7 3.4 V
VOL Low-level output voltage VCC = MIN, VIL = MAX, ±10%VCC 0.35 0.50 V
VIH = MIN, IOL = MAX ±5%VCC 0.35 0.50 V
VIK Input clamp voltage VCC = MIN, II = IIK –0.73 –1.2 V
IIInput current at maximum input voltage VCC = MAX, VI = 7.0V 100 µA
IIH High-level input current VCC = MAX, VI = 2.7V 20 µA
IIL Low-level input current VCC = MAX, VI = 0.5V –0.6 mA
IOS Short-circuit output current3 VCC = MAX –60 –150 mA
ICC Supply current (total) ICCH VCC = MAX 24 46 mA
ICCL 37 75 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. To reduce the effect of external noise during test.
4. Not more than one output should be shorted at a time. For testing IOS, the use of High-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.