TPD4104AK
2004-12-22 1
TOSHIBA Intelligent Power Device High Voltage Monolithic Silicon Power IC
TPD4104AK
The TPD4104AK is a DC brush less motor driver using high
voltage PWM control. It is fabricated by high voltage SOI process.
It contains level shift high-side driver, low-side driver, IGBT
outputs, FRDs and protective functions for under voltage
protection circuits and thermal shutdown circuit. It is easy to
control a DC brush less motor by just putting logic inputs from a
MPU or motor controller to the TPD4104AK.
Features
Bootstrap circuit gives simple high side power supply.
Bootstrap diodes are built in.
A dead time can be set as a minimum of 1.4 µs, and it is the
best for a Sine-wave from drive.
3-phase bridge output using IGBTs.
FRDs are built in.
Included under voltage protection and thermal shutdown.
The regulator of 7V (typ.) is built in.
Package: 23-pin HZIP.
This product has a MOS structure and is sensitive to electrostatic
discharge. When handling this product, ensure that the environment
is protected against electrostatic discharge.
Weight
HZIP23-P-1.27F : 6.1 g (typ.)
HZIP23-P-1.27G : 6.1 g (typ.)
HZIP23-P-1.27H : 6.1 g (typ.)
TPD4104AK
2004-12-22 2
Pin Assignment
Marking
HU
HV
HW
LU
LV
IS1
NC
BSU
U
VBB 1
BSV
V
BSW
W
VBB 2
NC
IS2
NC
DIAG
VCC
GND
VREG
LW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
TPD4104AK
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
JAPAN
Part No. (or abbreviation code)
TPD4104AK
2004-12-22 3
Block Diagram
Low-side
Driver
V
CC
V
REG
HU
HV
HW
LU
LV
IS1
GND
Input Control
Thermal
Shutdown
BSV
BSU
V
BB
1
BSW
U
V
W
High-side
Level Shift
Driver
21
23
1
2
3
4
5
LW 6
DIAG 20
9
12
14
11
10
13
15
7
22
Under-
voltage
Protection
Under-
voltage
Protection
Under-
voltage
Protection
Under-
voltage
Protection
7 V
Regulator
18
IS2
16
V
BB
2
TPD4104AK
2004-12-22 4
Pin Description
Pin No. Symbol Pin Description
1 HU The control terminal of IGBT by the side of U top arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
2 HV The control terminal of IGBT by the side of V top arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
3 HW The control terminal of IGBT by the side of W top arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
4 LU The control terminal of IGBT by the side of U bottom arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
5 LV The control terminal of IGBT by the side of V bottom arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
6 LW The control terminal of IGBT by the side of W bottom arm. It turns off more than by 1.5V.
It turns on more than by 3.5V.
7 IS1 IGBT emitter and FRD anode pin.
8 NC Unused pin, which is not connected to the chip internally.
9 BSU U-phase bootstrap capacitor connecting pin.
10 U U-phase output pin.
11 VBB1 U and V-phase high-voltage power supply input pin.
12 BSV V-phase bootstrap capacitor connecting pin.
13 V V-phase output pin.
14 BSW W-phase bootstrap capacitor connecting pin.
15 W -phase output pin.
16 VBB2 W-phase high-voltage power supply input pin.
17 NC Unused pin, which is not connected to the chip internally.
18 IS2 IGBT emitter and FRD anode pin.
19 NC Unused pin, which is not connected to the chip internally.
20 DIAG With the diagnostic output terminal of open drain , a pull-up is carried out by resistance.
It turns it on at the time of unusual.
21 VCC Control power supply pin.(15V typ.)
22 GND Ground pin.
23 VREG 7V regulator output pin.
TPD4104AK
2004-12-22 5
Equivalent Circuit of Input Pins
Internal circuit diagram of HU, HV, HW, LU, LV, LW input pins
Internal circuit diagram of DIAG pin
V
REG
HU/HV/HW
LU/LV/
LW
5 k
5 k
200 k
To internal circuit
6.5 V
6.5 V
6.5 V
6.5 V
2 k
DIAG
5 k
To internal circuit
26 V
TPD4104AK
2004-12-22 6
Timing Chart
HU
HV
HW
Input Voltage
LU
LV
LW
VU
Output voltage
VV
VW
TPD4104AK
2004-12-22 7
Truth Table
Input Top arm Bottom arm Mode
HU
HV
HW
LU
LV
LW
phase
phase
phase
phase
phase
phase
DIAG
Normal
ONOFF
OFF
OFF
ONOFF
OFF
ONOFF
OFF
OFF
OFF
ONOFF
OFF
ONOFF
OFF
OFF
ONOFF
OFF
ONOFF
ONOFF
OFF
OFF
OFF
OFF
ONONOFF
OFF
OFF
OFF
OFF
ONOFF
ONOFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
Thermal shutdown
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
Under voltage
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
Notes: Release of Thermal shutdown protection and under voltage protection depends release of a self-reset .
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
VBB 500 V
Power supply voltage VCC 18 V
Output current (DC) Iout 2 A
Output current (pulse) Iout 3 A
Input voltage VIN 0.5~7 V
VREG current IREG 50 mA
Power dissipation (Ta = 25°C) PC 4 W
Power dissipation (Tc = 25°C) PC 20 W
Operating temperature Tjopr 20~135 °C
Junction temperature Tj 150 °C
Storage temperature Tstg 55~150 °C
Lead-heat sink isolation voltage Vhs 1000 (1 min)
Vrms
TPD4104AK
2004-12-22 8
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min
Typ.
Max
Unit
VBB 50 280
400
Operating power supply voltage VCC 13.5
15 16.5
V
IBB VBB = 400 V 0 0.5
ICC VCC = 15 V 1 5 mA
IBS (ON) VBS = 15 V, high side ON 300
410
Current dissipation
IBS (OFF) VBS = 15 V, high side OFF 270
370
µA
VIH VIN = “H” 3.5
Input voltage VIL VIN = “L” 1.5 V
IIH VIN = 5 150
Input current IIL VIN = 0 V 100
µA
VCEsatH VCC = 15 V, IC = 1 A 2.4 3
Output saturation voltage VCEsatL VCC = 15 V, IC = 1 A 2.4 3 V
VFH IF = 1 A, high side 1.6 2.0
FRD forward voltage VFL IF = 1 A, low side 1.6 2.0 V
Regulator voltage VREG VCC = 15 V, IO = 30 mA 6.5 7 7.5 V
BSD forward voltage VF (BSD) IF = 500μA 0.9 1.2 V
Thermal shutdown temperature TSD VCC = 15 V 135
150
180
Thermal shutdown hysteresis TSD VCC = 15 V 50
VCC under voltage protection VCCUVD 10 11 12 V
VCC under voltage protection recovery
VCCUVR 10.5
11.5
12.5
V
VBS under voltage protection VBSUVD 8 9 9.5 V
VBS under voltage protection recovery
VBSUVR 8.5 9.5 10.5
V
DIAG saturation voltage VDIAGsat IDIAG=5mA 0.5 V
Output on delay time ton VBB = 280 V, IC = 1 A 1.5 3 µs
Output off delay time toff VBB = 280 V, IC = 1 A 1.2 3 µs
Dead time tdead VBB = 280 V, IC = 1 A 1.4 µs
FRD reverse recovery time trr VBB = 280 V, IC = 1 A 200
ns
TPD4104AK
2004-12-22 9
Application Circuit Example
Low-side
Driver
V
CC
V
REG
IS2
GND
Input Control
Thermal
Shutdown
BSV
BSU
V
BB
1
BSW
U
V
W
High-side
Level Shift
Driver
21
23
1
2
3
4
5
HU
HV
HW
LU
LV
LW 6
DIAG
20
9
12
14
11
10
13
15
18
22
Under-
voltage
Protection
Under-
voltage
Protection
Under-
voltage
Protection
Under
-
voltage
Protection
7 V
Regulator
15V
C
4
+C
5
Control IC
or
Microcomputer
C
1
C
2
C
3
R
R
C
6
+C
7
16
V
BB
2
7
IS1
TPD4104AK
2004-12-22 10
External Parts
Standard external parts are shown in the following table.
Part Recommended Value Purpose Remarks
C1, C2, C3 25 V/2.2 µF Bootstrap capacitor (Note 1)
R1 0.62 ± 1% (1 W) Current detection (Note 2)
C4 25 V/10 µF VCC power supply stability (Note 3)
C 25 V/0.1 µF VCC for surge absorber (Note 3)
C6 16 V/1 µF VREG power supply stability
(Note 3)
C7 16 V/1000 pF VREG for surge absorber (Note 3)
R3 5.1 k DIAG pin pull-up resistor (Note 4)
Note 1: The required bootstrap capacitance value varies according to the motor drive conditions. The capacitor is
biased by VCC and must be sufficiently derated for it.
Note 2: The following formula shows the detection current: IO = VR ÷ RIS (For VR = 0.5 V)
Do not exceed a detection current of 2 A when using this product.
(Please go from the outside in the over current protection.)
Note 3: When using this product, some adjustment is required in accordance with the use environment. When
mounting, place as close to the base of this product leads as possible to improve the ripple and noise
elimination.
Note 4: The DIAG pin is open drain. Note that when the DIAG pin is connected to a power supply with a voltage
higher than or equal to the VCC, a protection circuit is triggered so that the current flows continuously. If not
using the DIAG pin, connect to the GND.
Handling precautions
Please control the input signal in the state to which the VCC voltage is steady. Both of the order of the VBB
power supply and the VCC power supply are not cared about either.
Note that if the power supply is switched off as described above, this product may be destroyed if the
current regeneration route to the VBB power supply is blocked when the VBB line is disconnected by
a relay or similar while the motor is still running.
The excess voltage such as the voltage serge which exceed the maximum rating is added, for example, may
destroy the circuit. Accordingly, be careful of handling this product or of surge voltage in its
application environment.
TPD4104AK
2004-12-22 11
Description of Protection Function
(1) Under voltage protection
This product incorporates the under voltage protection circuit to prevent the IGBT from operating in
unsaturated mode when the VCC voltage or the VBS voltage drops.
When the VCC power supply falls to this product internal setting (VCCUVD = 11 V typ.), all IGBT
outputs shut down regardless of the input. This protection function has hysteresis. When the
VCCUVR (= 11.5 V typ.) reaches 0.5 V higher than the shutdown voltage, this product is
automatically restored and the IGBT is turned on again by the input.
When the VBS supply voltage drops (VBSUVD = 9 V typ.), the high-side IGBT output shuts down.
When the VBSUVR (= 9.5 V typ.) reaches 0.5 V higher than the shutdown voltage, the IGBT is
turned on again by the input signal.
(2) Thermal shutdown
This product incorporates the thermal shutdown circuit to protect itself against the abnormal state
when its temperature rises excessively.
When the temperature of this chip rises due to external causes or internal heat generation and the
internal setting TSD reaches 150°C, all IGBT outputs shut down regardless of the input. This
protection function has hysteresis (TSD = 50°C typ.). When the chip temperature falls to TSD
TSD, the chip is automatically restored and the IGBT is turned on again by the input.
Because the chip contains just one temperature detection location, when the chip heats up due to the
IGBT, for example, the differences in distance from the detection location in the IGBT (the source of
the heat) cause differences in the time taken for shutdown to occur. Therefore, the temperature of the
chip may rise higher than the thermal shutdown temperature when the circuit started to operate.
Safe Operating Area
Note 1: The above safe operating areas are Tj = 135°C (Figure 1) and Tc = 95°C (Figure 2). If the temperature
exceeds thsese, the safe operation areas reduce.
2.0
0
400
Peak winding current (A)
Power supply voltage VBB (V)
Figure 1 SOA at Tj = 135°C
0
2.1
0
400
Peak winding current (A)
Power supply voltage VBB (V)
Figure 2 SOA at Tc = 95°C
0
TPD4104AK
2004-12-22 12
1.6
2.0
2.4
Con
trol power supply voltage V
CC
(V)
Control power supply voltage V
CC
(V)
Consumption current I
CC
(mA)
FRD forward voltage V
F
L (V)
Junction temperature T
j
(
°
C)
V
CEsat
H T
j
IGBT saturation voltage V
CEsat
H (V)
Junction temp
erature T
j
(
°
C)
V
CEsat
L T
j
IGBT saturation voltage V
CEsat
L (V)
Junction temperature T
j
(
°
C)
V
F
H T
j
FRD forward voltage V
F
H (V)
Junction temperature T
j
(
°
C)
V
F
L T
j
V
REG
V
CC
Regulator voltage V
REG
(V)
I
CC
V
CC
IF = 1.2A
IF = 0.8A
IF = 0.4A
0
12
2.0
0.5
1.0
1.5
14 16 18
20°C
25°C
135°C
18
6.6
12
6.8
7.0
7.2
14 16
7.4 20°C
25°C
135°C
Ireg = 30 mA
1.6
20
3.6
3.2
2.8
2.4
2.0
20
60
100
140
VCC = 15 V
140
20
3.6
3.2
2.8
2.4
2.0
20
60
100
VCC = 15 V
1.6
140
IF = 1.2A
IF = 0.8 A
IF = 0.4A
0.8
20 20 60 100
1.2
1.6
2.0
2.4
0.8
1.2
140 20 20 60 100
IF = 1.6A
IF = 1.6A
IC = 0.8A
IC = 0.4A
IC = 1.2A
IC = 1.6A
IC = 0.8A
IC = 0.4A
IC = 1.2A
IC = 1.6A
TPD4104AK
2004-12-22 13
Junction temperature T
j
(
°
C)
t
ON
T
j
Output on delay time t
ON
(µs)
Junction temperature T
j
(
°
C)
t
OFF
T
j
Under voltage protection operating
voltage VCCUV (V)
Junction temperature T
j
(
°
C)
V
CC
UV T
j
Under voltage protection operating
voltage VBSUV (V)
Junction temperature T
j
(
°
C)
V
BS
UV T
j
0.5
2.0
1.0
1.5
20 20
60
100
140
VBB = 280 V
VCC = 15 V
IC = 1.0 A
High-side
Low-side
20 20
60
100
140
12.5
10.0
12.0
10.5
11.5
11.0
VCCUVD
VCCUVR
20 20
60
100
140
10.5
8.0
10.0
8.5
9.5
9.0
VBSUVD
VBSUVR
20 20
60
100
140
0.5
2.0
1.5
VBB = 280 V
VCC = 15 V
IC = 1.0 A
High-side
Low-side
1.0
Output off delay time tOFF (µs)
TPD4104AK
2004-12-22 14
I
BS
V
BS
(OFF)
Turn-on loss Wton (µJ)
Control power supply voltage
V
BS
(V)
I
BS
V
BS
(ON)
Current consumption I
BS
(ON)
(µA)
Control power supply voltage
V
BS
(V)
Current consumption I
BS
(
OF
F
)
(µA)
Junction temperature T
j
(
°
C)
Junction temperature T
j
(
°
C)
Turn-off loss Wtoff (µJ)
Wtoff Tj
Wton T
j
0
20
500
400
300
200
100
20
60
100
140
IC = 1.2A
IC = 0.8A
IC = 0.4A
500
200
300
400
20°C
25°C
135°C
100
12 14 16 18 18
100
12
200
300
400
14 16
500 20°C
25°C
135°C
0
20
100
80
60
40
20
20
60
100
140
IC = 0.4A
IC = 0.8A
IC = 1.2A
IC = 1.6A
IC = 1.6A
TPD4104AK
2004-12-22 15
Test Circuits
IGBT Saturation Voltage (U-phase low side)
FRD Forward Voltage (U-phase low side)
HU = 0 V
HV = 0 V
HW = 0 V
LU = 5 V
VM
1 A
V
CC
= 15 V
LV = 0 V
LW = 0 V
VM
1A
1. HU
2. HV
3. HW
4. LU
5. LV
6. LW
7.
IS1
8. NC
9. BSU
10. U
11. VBB1
12. BSV
13. V
14. BSW
15. W
16. VBB2
17. NC
18. IS2
21. Vcc
22. GND
23. VREG
19. NC
20. DIAG
1. HU
2. HV
3. HW
4. LU
5. LV
6. LW
7. IS1
8. NC
9. BSU
10. U
11. VBB1
12. BSV
13. V
14. BSW
15. W
16. VBB2
17. NC
18. IS2
21. Vcc
22. GND
23. VREG
1
9. NC
20. DIAG
TPD4104AK
2004-12-22 16
VCC Current Dissipation
Regulator Voltage
V
CC
= 15 V
IM
V
CC
= 15 V
30 mA
VM
1. HU
2. HV
3. HW
4. LU
5. LV
6. LW
7. IS1
8. NC
9. BSU
10. U
11. VBB1
12. BSV
13. V
14. BSW
15. W
16. VBB2
17. NC
18. IS2
21. Vcc
22. GND
23. VREG
19. NC
20. DIAG
1. HU
2. HV
3. HW
4. LU
5. LV
6. LW
7. IS1
8. NC
9. BSU
10. U
11. VBB1
12. BSV
13. V
14. BSW
15. W
16. VBB2
17. NC
18. IS2
21. Vcc
22. GND
23. VREG
19. NC
20. DIAG
TPD4104AK
2004-12-22 17
Output ON/OFF Delay Time (U-phase low side)
280
2.2 µF
HU = 0 V
HV = 0 V
HW = 0 V
LU =
V
CC
= 15 V
LV = 0 V
LW = 0 V
PG
U = 280 V
IM
t
OFF
t
ON
10%
LU
IM
10%
90%
90%
1. HU
2. HV
3. HW
4. LU
5. LV
6. LW
7. IS1
8. NC
9. BSU
10. U
11. VBB1
12. BSV
13. V
14. BSW
15. W
16. VBB2
17. NC
18. IS2
21. Vcc
22. GND
23. VREG
19. NC
20. DIAG
TPD4104AK
2004-12-22 18
VCC Under voltage Protection Operation/Recovery Voltage (U-phase low side)
*:Note:Sweeps the VCC pin voltage from 15 V to decrease and monitors the U pin voltage.
The VCC pin voltage when output is off defines the under voltage protection operating voltage.
Also sweeps from 6 V to increase. The VCC pin voltage when output is on defines the under voltage protection
recovery voltage.
VBS Under voltage Protection Operation/Recovery Voltage (U-phase high side)
*:Note:Sweeps the BSU pin voltage from 15 V to decrease and monitors the VBB pin voltage.
The BSU pin voltage when output is off defines the under voltage protection operating voltage.
Also sweeps the BSU pin voltage from 6 V to increase and change the HU pin voltage at 0 V 5 V 0 V.
The BSU pin voltage when output is on defines the under voltage protection recovery voltage.
VM
HU = 0 V
HV = 0 V
HW = 0 V
LU = 5 V
V
CC
=
LV = 0 V
LW = 0 V
U = 18 V
15 V
6 V
6 V
15 V
2 k
2 k
HU = 5 V
HV = 0 V
LU = 0 V
LV = 0 V
LW = 0 V
VM
15 V
6 V
6 V
15 V
BSU =
V
BB
= 18 V
1. HU
2. HV
3. HW
4. LU
5. LV
6. LW
7. IS1
8. NC
9. BSU
10. U
11. VBB1
12. BSV
13. V
14. BSW
15. W
16. VBB2
1
7. NC
18. IS2
21. Vcc
22. GND
23. VREG
19. NC
20. DIAG
1. HU
2. HV
3. HW
4. LU
5. LV
6. LW
7. IS1
8. NC
9. BSU
10. U
11. VBB1
12. BSV
13. V
14. BSW
15. W
16. VBB2
17. NC
18. IS2
21. Vcc
22. GND
23. VREG
19. NC
20. DIAG
HW = 0 V
VCC = 15 V
TPD4104AK
2004-12-22 19
VBS Current Consumption (U-phase high side)
LU = 0 V
HU = 0 V/ 5 V
HV = 0 V
HW = 0 V
IM
LV = 0 V
LW = 0 V
V
CC
= 15 V
BSU = 15 V
1. HU
2. HV
3. HW
4. LU
5. LV
6. LW
7. IS1
8. NC
9. B
SU
10. U
11. VBB1
12. BSV
13. V
14. BSW
15. W
16. VBB2
17. NC
18. IS2
21. Vcc
22. GND
23. VREG
19. NC
20. DIAG
TPD4104AK
2004-12-22 20
Turn-On/Off Loss (low-side IGBT + high-side FRD)
5 mH
2.2 µF
HU = 0 V
HV = 0 V
HW = 0 V
LU=
V
CC
= 15 V
LV = 0 V
LW = 0 V
PG
V
BB
/U = 280 V
IM
VM
L
Input (HU)
)
IGBT (C-E voltage)
(U-GND)
Power supply current
Wtoff
Wton
1. HU
2. HV
3. HW
4. LU
5. LV
6. LW
7. IS1
8. NC
9. BSU
10. U
11. VBB1
12. BSV
13. V
14. BSW
15. W
16. VBB2
17. NC
18. IS2
21. Vcc
22. GND
23. VREG
19. NC
20. DIAG
TPD4104AK
2004-12-22 21
Package Dimensions
Weight: 6.1 g (typ.)
TPD4104AK
2004-12-22 22
Package Dimensions
Weight: 6.1 g (typ.)
TPD4104AK
2004-12-22 23
Package Dimensions
Weight: 6.1 g (typ.)
TPD4104AK
2004-12-22 24
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices, or “TOSHIBA Semiconductor Reliability
Handbook” etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (Unintended Usage). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customers own risk.
The products described in this document are subject to the foreign exchange and foreign trade laws.
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
030619EBA
RESTRICTIONS ON PRODUCT USE