Rev. 4135C–8051–04/05
1
Features
•Pin and Software Compatibility with Standard 80C51 Products and 80C51Fx/Rx/Rx+
•Plug-In Replacement of Intel’s 8xC251Sx
•C251 Core: Intel’s MCS®251 D-step Compliance
•40-byte Register File
•Registers Accessible as Bytes, Words or Dwords
•Three-stage Instruction Pipeline
•16-bit Internal Code Fetch
•Enriched C51 Instruction Set
•16-bit and 32-bit ALU
•Comp are and Con dit ion a l Jump Instructions
•Expanded Set of Move Instructions
•Linear Addressing
•1 Kbyte of On-Chip RAM
•External Memory Space (Code/Data) Programmable from 64 kilobytes to 256 kilobytes
•TSC87251G2D: 32 kilobytes of On-Chip EPROM/OTPROM
– SINGLE PULSE Programming Algorithm
•TSC83251G1D: 16 kilobytes of On-Chip Masked ROM
•TSC83251G1D: 32 kilobytes of On-Chip Masked ROM
•TSC80251G1D: ROMless Version
•Four 8-bit Parallel I/ O Ports (Ports 0, 1, 2 and 3 of the Standard 80C51)
•Serial I/O Port: Full Duplex UART (80C51 Compatible) With Independent Baud Rate
Generator
•SSLC: Synchronous Serial Link Controller
•TWI Multi-master Protocol
•µWire and SPI Master and Slave Protocols
•Three 16-bit Timers/Counters (Timers 0, 1 and 2 of the Standard 80C51)
•EWC: Event and Wave form Controller
•Compatible with Intel’s Programmable Counter Array (PCA)
•Common 16-bit Timer/Counter Reference with Fou r Possible Clock Sources (Fosc/4,
Fosc/12, Timer 1 and External Input)
•Five Modules, Each with Four Programmable Mo des:
– 16-bit Software Timer/Counter
– 16-bit Timer/Counter Capture Input and Software Pulse Measurement
– High-speed Output and 16-bit Software Pulse Width Modulation (PWM)
– 8-bit Hardware PWM Without Overhead
•16-bit Watchdog Timer/Counter Capability
•Secure 14-bit Hardware Watchdog Timer
•Power Managem ent
•Power-On Reset (Integrated on the Chip)
•Power-Off Flag (Cold and Warm Resets)
•Software Programmable System Clo c k
•Idle Mode
•Power-down Mode
•Keyboard Interrupt Interface on Port 1
•Non Maskable Interrupt Input (NMI)
•Real-Time Wait States Inputs (WAIT#/AWAIT#)
•ONCE Mode and Full Speed Real-time In-c ircuit Emulation Support (Third Party
Vendors)
•High Speed Versions:
– 4.5V to 5.5V
– 16 MHz and 24 MHz
•Typical Operating Current: 35 mA at 24 MHz
24 mA at 16 MHz
•Typical Power-down Current: 2 µA
•Low Voltage Version:
– 2.7V to 5.5V
– 16 MHz
8/16-bit
Microcontroller
with Serial
Communication
Interfaces
TSC80251G2D
TSC83251G2D
TSC87251G2D
2
TSC8x251G2D 4135C–8051–04/05
•Typical Operating Current:11 mA at 3V
•Typical Power-down Current: 1 µA
•Temperature Ranges: Commercial (0°C to +70°C), Industrial (-40°C to +85°C)
•Option: Extended Range (-55°C to +125°C)
•Packages: PDIL 40, PLCC 44 and VQFP 44, CDIL 40 and CQPJ 44 with Window
•Options: Known Good Dice and Ceramic Packages
Description
The TSC80251G2D products are derivatives of the Atmel
Microcontroller family based on the 8/16-bit
C251 Architecture.
This family of products is tailored to 8/16-bit microcontroller applications requiring an increased instruction throughput, a
reduced operating frequency or a larger addressable memory space. The architecture can provide a significant code size
reduction when compiling C programs while fully preserving the legacy of C51 assembly routines.
The TSC80251G2D derivatives are pin and software compatible with standard 80C51/Fx/Rx/Rx+ with extended on-chip
data memory (1 Kbyte RAM) and up to 256 kilobytes of external code and data. Additionally, the TSC83251G2D and
TSC87251G2D provide on-ch ip code memory: 32 kilobytes ROM and 32 kilobytes EPROM/OTPROM respectively.
They provide transparent enhancements to Intel’s 8xC251Sx family with an additional Synchronous Serial Link Controller
(SSLC supporting TWI, µWire and SPI pro tocols), a Keyboard interrupt interface, a dedicated Baud Ra te Generator for
UART, and Power Management features.
TSC80251G2D derivatives are optimized for speed and for low power consumption on a wide voltage range.
Note: 1. This Datasheet provides the technical description of the TSC80251G2D derivatives. For further information on the device
usage, please request the TSC80251 Programmer’s Guide and the TSC80251G1D Design Guide and errata sheet.
Typical Applications • ISDN Terminals
• High-Speed Modems
• PABX (SOHO)
•Line Cards
• DVD ROM and Players
• Printers
•Plotters
• Scanners
• Banking Machines
• Barcode Readers
• Smart Cards Rea d er s
• High-End Digital Monitors
• High-End Joysticks
• High-end TV’s
3
TSC8x251G2D
4135C–8051–04/05
Block Diagram
16-bit Memory Code
16-bit Memory Address
16-bit Instruction Bus
24-bit Program Counter Bus
8-bit Data Bus
24-bit Data Address Bus
8-bit Internal Bus
Peripheral Interface Unit
VDD VSS VSS1
P3(A16) P1(A17)P2(A15-8) P0(AD7-0)
RST
XTAL2
XTAL1
NMI
EA#/VPP
ALE/PROG#
PSEN# Timers 0, 1 and 2
Event and Waveform
Controller
TWI/SPI/mWire
Controller
Watchdog T imer
Power Management
Clock Unit
Clock System Prescaler
Keyboard Interface
Bus Interface Unit
CPU
PORTS 0-3
Interrupt Handler
Unit
RAM
1 Kbyte
ROM
UART
Baud Rate Generator
AWAIT#
EPROM
OTPROM
32 KB
VSS2
4
TSC8x251G2D 4135C–8051–04/05
Pin Description
Pinout Figure 1. TSC80251G2D 40-pin DIP package
Figure 2. TSC80251G2D 44-pin PLCC Package
TSC80251G2D
7
8
9
10
11
12
13
14
16
15
17
18
19
20
1
2
3
4
5
634
33
32
31
30
29
28
27
25
26
24
23
22
21
40
39
38
37
36
35P1.5/CEX2/MISO
P1.6/CEX3/SCL/SCK/WAIT#
P1.7/A17/CEX4/SDA/MOSI/WCLK
RST
P3.0/RXD
P3.1/TXD
P3.2/INT0#
P3.3/INT1#
P3.4/T0
P3.5/T1
P1.4/CEX1/SS#
P1.3/CEX0
P1.2/ECI
P1.1/T2EX
P1.0/T2 VDD
P0.0/AD0
P0.1/AD1
P0.2/AD2
P0.3/AD3
P0.4/AD4
P0.5/AD5
P0.6/AD6
P0.7/AD7
EA#/VPP
PSEN#
ALE/PROG#
P2.7/A15
P2.6/A14
P2.5/A13
P3.7/A16/RD#
XTAL2
XTAL1
VSS P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12P3.6/WR#
TSC80251G2D
P1.4/CEX1/SS#
P1.3/CEX0
P1.2/ECI
P1.1/T2EX
P1.0/T2
VSS1
VDD
P0.0/AD0
P0.1/AD1
P0.2/AD2
P0.3/AD3
P3.7/A16/RD#
XTAL2
XTAL1
VSS
VSS2
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P3.6/WR#
39
38
37
36
35
34
33
32
29
30
31
7
8
9
10
11
12
13
14
17
16
15
18
19
20
21
22
23
24
25
26
27
28
6
5
4
3
2
44
43
42
41
40
P0.4/AD4
P0.5/AD5
P0.6/AD6
P0.7/AD7
EA#/VPP
PSEN#
ALE/PROG#
NMI
P2.7/A15
P2.6/A14
P2.5/A13
P1.5/CEX2/MISO
P1.6/CEX3/SCL/SCK/WAIT#
P1.7/A17/CEX4/SDA/MOSI/WCLK
RST
P3.0/RXD
AWAIT#
P3.1/TXD
P3.2/INT0#
P3.3/INT1#
P3.4/T0
P3.5/T1
1
5
TSC8x251G2D
4135C–8051–04/05
Figure 3. TSC80251G2D 44-pin VQFP Package
TSC80251G2D
P1.4/CEX1/SS#
P1.3/CEX0
P1.2/ECI
P1.1/T2EX
P1.0/T2
VSS1
VDD
P0.0/AD0
P0.1/AD1
P0.2/AD2
P0.3/AD3
P3.7/A16/RD#
XTAL2
XTAL1
VSS
VSS2
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P3.6/WR#
33
32
31
30
29
28
27
26
23
24
25
1
2
3
4
5
6
7
8
11
10
9
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
P0.4/AD4
P0.5/AD5
P0.6/AD6
P0.7/AD7
EA#/VPP
PSEN#
ALE/PROG#
NMI
P2.7/A15
P2.6/A14
P2.5/A13
P1.5/CEX2/MISO
P1.6/CEX3/SCL/SCK/WAIT#
P1.7/A17/CEX4/SDA/MOSI/WCLK
RST
P3.0/RXD
AWAIT#
P3.1/TXD
P3.2/INT0#
P3.3/INT1#
P3.4/T0
P3.5/T1
6
TSC8x251G2D 4135C–8051–04/05
Table 1. TSC80251G2D Pin Assignment
DIP PLCC VQFP Name DIP PLCC VQFP Name
1 39 VSS1 23 17 VSS2
1 2 40 P1.0/T2 21 24 18 P2.0/A8
2 3 41 P1.1/T2EX 22 25 19 P2.1/A9
3 4 42 P1.2/ECI 23 26 20 P2.2/A10
4 5 43 P1.3/CEX0 24 27 21 P2.3/A11
5 6 44 P1.4/CEX1/SS# 25 28 22 P2.4/A12
6 7 1 P1.5/CEX2/MISO 26 29 23 P2.5/A13
7 8 2 P1.6/CEX3/SCL/SCK/WAIT# 27 30 24 P2.6/A14
8 9 3 P1.7/A17/CEX4/SDA/MOSI/WCLK 28 31 25 P2.7/A15
9 10 4 RST 29 32 26 PSEN#
10 11 5 P3.0/RXD 30 33 27 ALE/PROG#
12 6 AWAIT# 34 28 NMI
11 13 7 P3.1/TXD 31 35 29 EA#/VPP
12 14 8 P3.2/INT0# 32 36 30 P0.7/AD7
13 15 9 P3.3/INT1# 33 37 31 P0.6/AD6
14 16 10 P3.4/T0 34 38 32 P0.5/AD5
15 17 11 P3.5/T1 35 39 33 P0.4/AD4
16 18 12 P3.6/WR# 36 40 34 P0.3/AD3
17 19 13 P3.7/A16/RD# 37 41 35 P0.2/AD2
18 20 14 XTAL2 38 42 36 P0.1/AD1
19 21 15 XTAL1 39 43 37 P0.0/AD0
20 22 16 VSS 40 44 38 VDD
7
TSC8x251G2D
4135C–8051–04/05
Signals Table 2. Product Name Signal Description
Signal
Name Type Description Alternate
Function
A17 O
18th Address Bit
Output to memory as 18th external address bit (A17) in extended bus
applications, depending on the values of bits RD0 and RD1 in UCONFIG0
byte (see Table 13, Page 20).
P1.7
A16 O
17th Address Bit
Output to memory as 17th external address bit (A16) in extended bus
applications, depending on the values of bits RD0 and RD1 in UCONFIG0
byte (see Table 13, Page 20).
P3.7
A15:8(1) OAddress Lines
Upper address lines for the external bus. P2.7:0
AD7:0(1) I/O Address/Data Lines
Multiplexed lower address lines and data for the external memory. P0.7:0
ALE O
Address Latch Enable
ALE signals the start of an external bus cycle and indicates that valid
address information are available on lines A16/A17 and A7:0. An external
latch can use ALE to demultiplex the address from address/data bus.
–
AWAIT# I
Real-time Asynchronous Wait States Input
When this pin is active (low level), the memory cycle is stretched until it
becomes high. When using the Product Name as a pin-for-pin replacement
for a 8xC51 product, AWAIT# can be unconnected without loss of
compatibility or power consumption increase (on-chip pull-up).
Not available on DIP package.
–
CEX4:0 I/O PCA Input/Output pins
CEXx are input signals for the PCA capture mode and output signals for
the PCA compare and PWM modes. P1.7:3
EA# I
External Access Enable
EA# directs program memory accesses to on-chip or off-chip code memory .
For EA# = 0, all program memory accesses are off-chip.
For EA# = 1, an access is on-chip ROM if the address is within the range of
the on-chip ROM; otherwise the access is off-chip. The value of EA# is
latched at reset.
For devices without ROM on-chip, EA# must be strapped to ground.
–
ECI O PCA External Clock input
ECI is the external clock input to the 16-bit PCA timer. P1.2
MISO I/O
SPI Master Input Slave Output line
When SPI is in master mode, MISO receives data from the slave
peripheral. When SPI is in slave mode, MISO outputs data to the master
controller.
P1.5
MOSI I/O SPI Master Output Slave Input line
When SPI is in master mode, MOSI outputs data to the slave peripheral.
When SPI is in slave mode, MOSI receives data from the master controller. P1.7
INT1:0# I
External Interrupts 0 and 1
INT1#/INT0# inputs set IE1:0 in the TCON register. If bits IT1:0 in the
TCON register are set, bits IE1:0 are set by a falling edge on INT1#/INT0#.
If bits IT1:0 are cleared, bits IE1:0 are set by a low level on INT1#/INT0#.
P3.3:2
8
TSC8x251G2D 4135C–8051–04/05
NMI I
Non Maskable Interrupt
Holding this pin high for 24 oscillator periods triggers an interrupt.
When using the Product Name as a pin-for-pin replacement for a 8xC51
product, NMI can be unconnected without loss of compatibility or power
consumption increase (on-chip pull-down).
Not available on DIP package.
–
P0.0:7 I/O
Port 0
P0 is an 8-bit open-drain bidirectional I/O port. Port 0 pins that have 1s
written to them float and can be used as high impedance inputs. To avoid
any paraitic current consumption, Floating P0 inputs must be polarized to
VDD or VSS.
AD7:0
P1.0:7 I/O Port 1
P1 is an 8-bit bidirectional I/O port with internal pull-ups. P1 provides
interrupt capability for a keyboard interface. –
P2.0:7 I/O Port 2
P2 is an 8-bit bidirectional I/O port with internal pull-ups. A15:8
P3.0:7 I/O Port 3
P3 is an 8-bit bidirectional I/O port with internal pull-ups. –
PROG# I Programming Pulse input
The programming pulse is applied to this input for programming the on-chip
EPROM/OTPROM. –
PSEN# O Program Store Enable/Read signal output
PSEN# is asserted for a memory address range that depends on bits RD0
and RD1 in UCONFIG0 byte (see ). –
RD# O Read or 17th Address Bit (A16)
Read signal output to external data memory depending on the values of
bits RD0 and RD1 in UCONFIG0 byte (see Table 13, Page 20). P3.7
RST I
Reset input to the chip
Holding this pin high for 64 oscillator periods while the oscillator is running
resets the device. The Port pins are driven to their reset conditions when a
voltage greater than VIH1 is applied, whether or not the oscillator is running.
This pin has an internal pull-down resistor which allows the device to be
reset by connecting a capacitor between this pin and VDD.
Asserting RST when the chip is in Idle mode or Power-Down mode returns
the chip to normal operation.
–
RXD I/O Receive Serial Data
RXD sends and receives data in serial I/O mode 0 and receives data in
serial I/O modes 1, 2 and 3. P3.0
SCL I/O
TWI Serial Clock
When TWI controller is in master mode, SCL outputs the serial clock to
slave peripherals. When TWI controller is in slave mode, SCL receives
clock from the master controller.
P1.6
SCK I/O SPI Serial Clock
When SPI is in master mode, SCK outputs clock to the slave peripheral.
When SPI is in slave mode, SCK receives clock from the master controller. P1.6
SDA I/O TWI Serial Data
SDA is the bidirectional TWI data line. P1.7
SS# I SPI Slave Select Input
When in Slave mode, SS# enables the slave mode. P1.4
Table 2. Product Name Signal Description (Continued)
Signal
Name Type Description Alternate
Function
9
TSC8x251G2D
4135C–8051–04/05
T1:0 I/O Timer 1:0 External Clock Inputs
When timer 1:0 operates as a counter, a falling edge on the T1:0 pin
increments the count. –
T2 I/O Timer 2 Clock Input/Output
For the timer 2 capture mode, T2 is the external clock input. For the T imer 2
clock-out mode, T2 is the clock output. P1.0
T2EX I
Timer 2 External Input
In timer 2 capture mode, a falling edge initiates a capture of the timer 2
registers. In auto-reload mode, a falling edge causes the timer 2 register to
be reloaded. In the up-down counter mode, this signal determines the
count direction: 1 = up, 0 = down.
P1.1
TXD O Transmit Serial Data
TXD outputs the shift clock in serial I/O mode 0 and transmits data in serial
I/O modes 1, 2 and 3. P3.1
VDD PWR Digital Supply Voltage
Connect this pin to +5V or +3V supply voltage. –
VPP I Programming Supply Voltage
The programming supply voltage is applied to this input for programming
the on-chip EPROM/OTPROM. –
VSS GND Circuit Ground
Connect this pin to ground. –
VSS1 GND
Secondary Ground 1
This ground is provided to reduce g round bounce and improve power
supply bypassing. Connection of this pin to ground is recommended.
However , when using the TSC80251G2D as a pin-for-pin replacement for a
8xC51 product, VSS1 can be unconnected without loss of compatibility.
Not available on DIP package.
–
VSS2 GND
Secondary Ground 2
This ground is provided to reduce g round bounce and improve power
supply bypassing. Connection of this pin to ground is recommended.
However , when using the TSC80251G2D as a pin-for-pin replacement for a
8xC51 product, VSS2 can be unconnected without loss of compatibility.
Not available on DIP package.
–
WAIT# I
Real-time Synchronous Wait States Input
The real-time WAIT# input is enabled by setting RTWE bit in WCON
(S:A7h). During bus cycles, the external memory system can signal
‘system ready’ to the microcontroller in real time by controlling the WAIT#
input signal.
P1.6
WCLK O
Wait Clock Output
The real-time WCLK output is enabled by setting RTWCE bit in WCON
(S:A7h). When enabled, the WCLK output produces a square wave signal
with a period of one half the oscillator frequency.
P1.7
WR# O Write
Write signal output to external memory. P3.6
XTAL1 I
Input to the on-chip inverting oscillator amplifier
To use the internal oscillator, a crystal/resonator circuit is connected to this
pin. If an external oscillator is used, its output is connected to this pin.
XTAL1 is the clock source for internal timing.
–
Table 2. Product Name Signal Description (Continued)
Signal
Name Type Description Alternate
Function
10
TSC8x251G2D 4135C–8051–04/05
Note: The description of A15:8/P2.7:0 an d AD7:0/P0.7:0 are fo r the Non-Page mode chip con-
figuration. If the chip is configured in Page mode operation, port 0 carries the lower
address bits (A7:0) while port 2 carries the upper address bits (A15:8) and the data
(D7:0).
XTAL2 O Output of the on-chip inverting oscillator amplifier
To use the internal oscillator, a crystal/resonator circuit is connected to this
pin. If an external oscillator is used, leave XTAL2 unconnected. –
Table 2. Product Name Signal Description (Continued)
Signal
Name Type Description Alternate
Function
11
TSC8x251G2D
4135C–8051–04/05
Address Spaces The TSC80251G2D derivative s implement four different address spaces :
• On-chip RO M pr ogra m /co d e me m or y (n ot pr e sen t in ROM le ss de vic es)
• On-chip RAM data memory
• Special Function Registers (SFRs)
• Configuration array
Program/Code Memory The TSC83251G2D and TSC87251G2D implement 32 KB of on-chip program/code
memory. Figure 4 shows the split of the internal and external program /code memory
spaces. If EA# is tied to a high level, the 32-Kbyte on-chip program memory is mapped
in the lower part of segment FF: where the C251 core jumps after reset. The rest of the
program/code memory space is mapped to the external memory. If EA# is tied to a low
level, the internal prog ram/code memo ry is not used and a ll the accesse s are directed to
the external memory.
The TSC83251G2D products provide the internal p rogram/code memory in a masked
ROM memory while the TSC87251G2D products provide it in an EPROM memory. For
the TSC80251G2D products, there is no internal program/code memory and EA# must
be tied to a low level.
Figure 4. Program/Code Memory Mapping
Note: Special care should be taken when the Program Counter (PC) increments:
If the program executes exclusivel y from on-chip code memory (not from external mem-
ory), beware of executing code from the upper eight bytes of the on-chip ROM
(FF:7FF8h-FF:7FFFh). Because of its pipeline capability, the TSC80251G2D derivative
may attempt to prefetch code from external memory (at an address above FF:7FFFh)
and thereby disrupt I/O Ports 0 and 2. Fetchi ng code constants from these 8 bytes does
not affect Ports 0 and 2.
When PC reaches the end of segment FF:, it loops to the reset address FF:0000h (for
On-chip ROM/EPROM
Code Memory
Program/code
Segments
Program/code
External Memory Space
32 KBEA# = 0 EA# = 1
32 KB
32 KB
Reserved
64 KB
128 KB
FF:FFFFh
FF:8000h
FF:7FFFh
FF:0000h
FE:FFFFh
FE:0000h
FD:FFFFh
01:FFFFh
01:0000h
02:0000h
00:FFFFh
00:0000h
12
TSC8x251G2D 4135C–8051–04/05
compatibility with the C51 Architecture). When PC increments beyond the end of seg-
ment FE:, it continues at the reset address FF:0000h (linearity). When PC increments
beyond the end of segment 01:, it loops to the beginning of segment 00: (this prevents
from its going into the reserved area).
Data Me mory The TSC80251G2D derivatives implement 1 Kbyte of on-chip data RAM. Figure 5
shows the split of the internal and external data memory spaces. This memory is
mapped in the data space just over the 32 bytes of registers area (see TSC80251 Pro-
grammers’ Guide). Hence, the par t of the on-chip RAM located from 20h to FFh is bit
addressable. This on-chip RAM is not accessible through the program/code memory
space.
For faster computation with the on-chip ROM/EPROM code of the
TSC83251G2D/TSC87251G2D, its upper 16 KB are also mapped in the upper part of
the region 00: if the On-Chip Code Memory Map configuration bit is cleared (EMAP# bit
in UCONFIG1 byte, see Figure ). However, if EA# is tied to a low level, the
TSC80251G2D derivative is running as a ROMless product and the code is actually
fetched in the corresponding external memory (i.e. the upper 16 KB of the lower 32 KB
of the segment FF:). If EMAP# bit is set, the on-chip ROM is not accessible through the
region 00:.
All the accesses to the portion of the data space with no on-chip memory mapped onto
are redirected to the external memory.
Figure 5. Data Memory Mapping On-chip ROM/EPROM
Code MemoryData Segments
Data External
Memory Space
16 KB
EA# = 0 EA# = 1
32 KB
32 KB
Reserved
64 KB
ª47 KB
FF:FFFFh
FF:8000h
FF:7FFFh
FF:0000h
FE:FFFFh
FE:0000h
FD:FFFFh
01:FFFFh
01:0000h
02:0000h
00:FFFFh
00:0420h 32 bytes reg.
RAM Data
1 Kbyte
16 KB
00:C000h
00:BFFFh
EMAP# = 1
EMAP# = 0
16 KB
64 KB
13
TSC8x251G2D
4135C–8051–04/05
Special Function
Registers The Special Function Registers (SFRs) of the TSC80251G2D derivatives fall into the
categories detailed in Table 1 to Table 9.
SFRs are placed in a reserved on- chip memory region S: which is not repre sented in the
data memory mapping (Figu re 5). The rela tive addresses within S: of these SFRs are
provided together with their reset values in Table . They are upward compatible with the
SFRs of the standard 80C51 and the Intel’s 80C251Sx family. In this table, the C251
core registers are identified by Note 1 and are described in the TSC80251 Program-
mer’s Guide. The other SFRs are d escri bed in the TSC80251 G1D De sign Guid e. All the
SFRs are bit-addressable using the C251 instruction set.
Table 1. C251 Core SFRs
Note: 1. These SFRs can also be accessed by their corresponding registers in the register
file.
Table 2. I/O Port SFRs
Table 3. Timers SFRs
Mnemonic Name Mnemonic Name
ACC(1) Accumulator SPH(1) Stack Pointer High - MSB of
SPX
B(1) B Register DPL(1) Data Pointer Low byte - LSB of
DPTR
PSW Program Status Word DPH(1) Data Pointer High byte - MSB
of DPTR
PSW1 Program Status Word 1 DPXL(1) Data Pointer Extended Low
byte of DPX - Region number
SP(1) Stack Pointer - LSB of SPX
Mnemonic Name Mnemonic Name
P0 Port 0 P2 Port 2
P1 Port 1 P3 Port 3
Mnemonic Name Mnemonic Name
TL0 Timer/Counter 0 Low
Byte TMOD Timer/Counter 0 and 1
Modes
TH0 Timer/Counter 0 High
Byte T2CON Timer/Counter 2
Control
TL1 Timer/Counter 1 Low
Byte T2MOD Timer/Counter 2 Mode
TH1 Timer/Counter 1 High
Byte RCAP2L Timer/Counter 2
Reload/Capture Low
Byte
TL2 Timer/Counter 2 Low
Byte RCAP2H Timer/Counter 2
Reload/Capture High
Byte
TH2 Timer/Counter 2 High
Byte WDTRST WatchDog Timer Reset
TCON Timer/C ounter 0 and 1
Control
14
TSC8x251G2D 4135C–8051–04/05
Table 4. Serial I/O Port SFRs
Table 5. SSLC SFRs
Table 6. Event Waveform Control SFRs
Mnemonic Name Mnemonic Name
SCON Serial Control SADDR Slave Address
SBUF Serial Data Buffer BRL Baud Rate Reload
SADEN Slave Address
Mask BDRCON Baud Rate Control
Mnemonic Name Mnemonic Name
SSCON Synchronous Serial
control SSADR Synchronous Serial
Address
SSDAT Synchronous Serial
Data SSBR Synchronous Serial
Bit Rate
SSCS Synchronous Serial
Control and Status
Mnemonic Name Mnemonic Name
CCON EWC-PCA Timer/Counter Control CCAP0L EWC-PCA Compare Capture
Module 0 Low Register
CMOD EWC-PCA Timer/Counter Mode CCAP1L EWC-PCA Compare Capture
Module 1 Low Register
CL EWC-PCA Timer/Counter Low
Register CCAP2L EWC-PCA Compare Capture
Module 2 Low Register
CH EWC-PCA Timer/Counter High
Register CCAP3L EWC-PCA Compare Capture
Module 3 Low Register
CCAPM0 EWC-PCA Timer/Counter Mode 0 CCAP4L EWC-PCA Compare Capture
Module 4 Low Register
CCAPM1 EWC-PCA Timer/Counter Mode 1 CCAP0H EWC-PCA Compare Capture
Module 0 High Register
CCAPM2 EWC-PCA Timer/Counter Mode 2 CCAP1H EWC-PCA Compare Capture
Module 1 High Register
CCAPM3 EWC-PCA Timer/Counter Mode 3 CCAP2H EWC-PCA Compare Capture
Module 2 High Register
CCAPM4 EWC-PCA Timer/Counter Mode 4 CCAP3H EWC-PCA Compare Capture
Module 3 High Register
CCAP4H EWC-PCA Compare Capture
Module 4 High Register
15
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Table 7. System Management SFRs
Table 8. Interrupt SFRs
Table 9. Keyboard Interface SFRs
Mnemonic Name Mnemonic Name
PCON Power Control CKRL Clock Reload
POWM Power Management WCON Synchronous Real-Time Wait State
Control
Mnemonic Name Mnemonic Name
IE0 Interrupt Enable Control 0 IPL0 Interrupt Priority Control Low 0
IE1 Interrupt Enable Control 1 IPH1 Interrupt Priority Control High 1
IPH0 Interrupt Priority Control High 0 IPL1 Interrupt Priority Control Low 1
Mnemonic Name Mnemonic Name
P1IE Port 1 Input Interrupt Enable P1LS Port 1 Level Selection
P1F Port 1 Flag
16
TSC8x251G2D 4135C–8051–04/05
Notes: 1. These registers are described in the TSC80251 Programmer’s Guide (C251 core registers).
2. In TWI and SPI modes, SSCON is splitted in two separate registers. SSCON reset value is 0000 0000 in TWI mode and
0000 0100 in SPI mode.
3. In read and write modes, SSCS is splitted in two separate registers. SSCS reset value is 1111 1000 in read mode and 0000
0000 in write mode.
Table 10. SFR Descriptions
0/8 1/9 2/A 3/B 4/C 5/D 6/E 7/F
F8h CH
0000 0000 CCAP0H
0000 0000 CCAP1H
0000 0000 CCAP2H
0000 0000 CCAP3H
0000 0000 CCAP4H
0000 0000 FFh
F0h B(1)
0000 0000 F7h
E8h CL
0000 0000 CCAP0L
0000 0000 CCAP1L
0000 0000 CCAP2L
0000 0000 CCAP3L
0000 0000 CCAP4L
0000 0000 EFh
E0h ACC(1)
0000 0000 E7h
D8h CCON
00X0 0000 CMOD
00XX X000 CCAPM0
X000 0000 CCAPM1
X000 0000 CCAPM2
X000 0000 CCAPM3
X000 0000 CCAPM4
X000 0000 DFh
D0h PSW(1)
0000 0000 PSW1(1)
0000 0000 D7h
C8h T2CON
0000 0000 T2MOD
XXXX XX00 RCAP2L
0000 0000 RCAP2H
0000 0000 TL2
0000 0000 TH2
0000 0000 CFh
C0h C7h
B8h IPL0
X000 0000 SADEN
0000 0000 SPH(1)
0000 0000 BFh
B0h P3
1111 1111 IE1
XX0X XXX0 IPL1
XX0X XXX0 IPH1
XX0X XXX0 IPH0
X000 0000 B7h
A8h IE0
0000 0000 SADDR
0000 0000 AFh
A0h P2
1111 1111 WDTRST
1111 1111 WCON
XXXX XX00 A7h
98h SCON
0000 0000 SBUF
XXXX XXXX BRL
0000 0000 BDRCON
XXX0 0000 P1LS
0000 0000 P1IE
0000 0000 P1F
0000 0000 9Fh
90h P1
1111 1111 SSBR
0000 0000 SSCON(2) SSCS(3) SSDAT
0000 0000 SSADR
0000 0000 97h
88h TCON
0000 0000 TMOD
0000 0000 TL0
0000 0000 TL1
0000 0000 TH0
0000 0000 TH1
0000 0000 CKRL
0000 1000 POWM
0XXX XXXX 8Fh
80h P0
1111 1111 SP(1)
0000 0111 DPL(1)
0000 0000 DPH(1)
0000 0000 DPXL(1)
0000 0001 PCON
0000 0000 87h
0/8 1/9 2/A 3/B 4/C 5/D 6/E 7/F
Reserved
17
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Configuration Bytes The TSC80251G2D derivatives provide user design flexibility by configuring certain
operating features at device reset. These features fall into the following categories:
• external memory interface (Page mode, address bits, programmed wait states and
the address range for RD#, WR#, and PSEN#)
• source mode/binary mode opcodes
• selection of bytes stored on the stack by an interrupt
• mapping of the upper portion of on-chip code memory to region 00:
Two user configuration bytes UCONFIG0 (see Table 11) and UCONFIG1 (see Table
12) provide the information.
When EA# is tied to a low level, the configuration bytes are fetched from the external
address space. The TSC80251G2D derivatives reserve the top eight bytes of the mem-
ory address space (FF:FFF8h-FF:FFFFh) for an external 8-byte configuration array.
Only two bytes are actually used: UCONFIG0 at FF:FFF8h and UCONFIG1 at
FF:FFF9h.
For the mask ROM devices, configuration information is stor ed in on-chip m emory (see
ROM Verifying). When EA# is tied to a high level, the configuration information is
retrieved from the on -chip memory instead of the external addr ess space and there is no
restriction in the usag e of the external memory.
18
TSC8x251G2D 4135C–8051–04/05
Table 11. Configuration Byte 0
UCONFIG0
Notes: 1. UCONFIG0 is fetched twice so it can be properly read both in Page or Non-Page
modes. If P2.1 is cleared during the first data fetch, a Page mode configuration is
used, otherwise the subsequent fetches are performed in Non-Page mode.
2. This selection provides compatibility with the standard 80C51 hardware which is mul-
tiplexing the address LSB and the data on Port 0.
76543210
- WSA1# WSA0# XALE# RD1 RD0 PAGE# SRC
Bit Number Bit
Mnemonic Description
7-
Reserved
Set this bit when writing to UCONFIG0.
6 WSA1# Wait State A bits
Select the number of wait st ates for RD#, WR# and PSEN# signals for external
memory accesses (all regions except 01:).
WSA1# WSA0# Number of Wait States
00 3
01 2
10 1
11 0
5 WSA0#
4 XALE# Extend ALE bit
Clear to extend the duration of the ALE pulse from TOSC to 3·TOSC.
Set to minimize the duration of the ALE pulse to 1·TOSC.
3 RD1 Memory Signal Select bits
Specify a 18-bit, 17-bit or 16-bit external address bus and the usage of RD#,
WR# and PSEN# signals (see Table 13).
2 RD0
1 PAGE#
Page Mode Select bit(1)
Clear to select the faster Page mode with A15:8/D7:0 on Port 2 and A7:0 on
Port 0.
Set to select the non-Page mode(2) with A15:8 on Port 2 and A7:0/D7:0 on Port
0.
0SRC
Source Mode/Binary Mode Select bit
Clear to select the binary mode.
Set to select the source mode.
19
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Table 12. Configuration Byte 1
UCONFIG1
Notes: 1. The CSIZE is only available on EPROM/OTPROM products.
2. Two or four bytes are transparently popped according to INTR when using the RETI
instruction. INTR must be set if interrupts are used with code executing outside
region FF:.
3. Use only for Step A compatibility; set this bit when WSB1:0# are used.
76543210
CSIZE - - INTR WSB WSB1# WSB0# EMAP#
Bit
Number Bit Mnemonic Description
7
CSIZE
TSC87251G2D
On-Chip Code Memory Size bit(1)
Clear to select 16 KB of on-chip code memory (TSC87251G1D
product).
Set to select 32 KB of on-chip code memory (TSC87251G2D product).
TSC80251G2D
TSC83251G2D Reserved
Set this bit when writing to UCONFIG1.
6-
Reserved
Set this bit when writing to UCONFIG1.
5-
Reserved
Set this bit when writing to UCONFIG1.
4INTR
Interrupt Mode bit(2)
Clear so that the interrupts push two bytes onto the stack (the two lower
bytes of the PC register).
Set so that the interrupts push four bytes onto the stack (the three bytes
of the PC register and the PSW1 register).
3WSB
Wait State B bit(3)
Clear to generate one wait state for memory region 01:.
Set for no wait states for memory region 01:.
2 WSB1# Wait State B bits
Select the number of wait states for RD#, WR# and PSEN# signals for
external memory accesses (only region 01:).
WSB1# WSB0# Number of Wait States
00 3
01 2
10 1
11 0
1 WSB0#
0 EMAP#
On-Chip Code Memory Map bit
Clear to map the upper 16 KB of on-chip code memory (at FF:4000h-
FF:7FFFh) to the data space (at 00:C000h-00:FFFFh).
Set not to map the upper 16 KB of on-chip code memory (at FF:4000h-
FF:7FFFh) to the data space.
20
TSC8x251G2D 4135C–8051–04/05
Configuration Byte 1 Table 13. Address Ranges and Usage of RD#, WR# and PSEN# Signals
Notes: 1. This selection provides compatibility with the standard 80C51 hardware which has
separate external memory spaces for data and code.
RD1 RD0 P1.7 P3.7/RD# PSEN# WR# External
Memory
00A17A16
Read signal for all
external memory
locations
Write signal for all
external memory
locations 256 KB
0 1 I/O pin A16 Read signal for all
external memory
locations
Write signal for all
external memory
locations 128 KB
1 0 I/O pin I/O pin Read signal for all
external memory
locations
Write signal for all
external memory
locations 64 KB
1 1 I/O pin
Read
signal for
regions 00:
and 01:
Read signal for
regions FE: and FF:
Write signal for all
external memory
locations 2 × 64 KB(1)
21
TSC8x251G2D
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Instruction Set
Summary This section contains tables that summarize the instruction set. For each instruction
there is a short descri ption, its length in b ytes, and its execution time in states (one sta te
time is equal to two system clock cycles). There are two concurrent processes limiting
the effective instruction throughput:
• Instruction Fetch
• Instruction Execution
Table 20 to Table 32 assume code executing from on-chip memory, then the CPU is
fetching 16-bit at a time and this is never limiting the execution speed.
If the code is fetched from external memory, a pre-fetch queue will store instructions
ahead of execution to optimize the memory bandwidth usage when slower instructions
are executed. However, the effective speed may be limited depending on the average
size of instructions (for th e considered sect ion of the prog ram flow). Th e maximum a ver-
age instruction throughput is provided by Table 14 depending on the external memory
configuration (from Page Mode to Non-Page Mode and the maximum number of wait
states). If the average size of instructions is not an integer, the maximum effective
throughput is found by pondering the number of states for the neighbor integer values.
Table 14. Minimum Number of States per Instruction for given Average Sizes
If the average execution time of the considered instructions is larger than the number of
states given by Table 14, this larger value will prevail as the limiting factor. Otherwise,
the value from Table 14 must be taken. This is providing a fair estimation of the execu-
tion speed but only the actual code execution can provide the final value.
Notation for Instruction
Operands Table 15 to Table 19 provide notation for Instruction Operands.
Table 15. Notation for Direct Addressing
Average size
of Instructions
(bytes) Page Mode
(states)
Non-page Mode (states)
0 Wait
State 1 Wait
State 2 Wait States 3 Wait States 4 Wait States
1123456
224681012
3 3 6 9 12 15 18
44812162024
5 5 10 15 20 25 30
Direct
Address Description C251 C51
dir8 A direct 8-bit address. This can be a memory address (00h-7Fh) or a
SFR address (80h-FFh). It is a byte (default), word or double word
depending on the other operand. 33
dir16 A 16-bit memory address (00:0000h-00:FFFFh) used in direct
addressing. 3–
22
TSC8x251G2D 4135C–8051–04/05
Table 16. Notation for Immediate Addressing
Table 17. Notation for Bit Addressing
Table 18. Notation for Destination in Control Instructions
Immediate
Address Description C251 C51
#data An 8-bit constant that is immediately addressed in an instruction 3 3
#data16 A 16-bit constant that is immediately addressed in an instruction 3 –
#0data16
#1data16 A 32-bit constant that is immediately addressed in an instruction. The
upper word is filled with zeros (#0data16) or ones (#1data16). 3–
#short A constant, equal to 1, 2, or 4, that is immediately addressed in an
instruction. 3–
Direct
Address Description C251 C51
bit51
A directly addressed bit (bit number = 00h-FFh) in memory or an
SFR. Bits 00h-7Fh are the 128 bits in byte locations 20h-2Fh in the
on-chip RAM. Bits 80h-FFh are the 128 bits in the 16 SFRs with
addresses that end in 0h or 8h, S:80h, S:88h, S:90h,..., S:F0h,
S:F8h.
–3
bit A directly addressed bit in memory locations 00:0020h-00:007Fh or
in any defined SFR. 3
Direct
Address Description C251 C51
rel A signed (two’s complement) 8-bit relative address. The destination
is -128 to +127 bytes relative to the next instruction’s first byte. 33
addr11 An 11-bit target address. The target is in the same 2-Kbyte block of
memory as the next instruction’s first byte. –3
addr16 A 16-bit target address. The target can be anywhere within the same
64-Kbyte region as the next instruction’s first byte. –3
addr24 A 24-bit target address. The target can be anywhere within the 16-
Mbyte address space. 3–
23
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Table 19. Notation for Register Operands
Register Description C251 C51
at Ri A memory location (00h-FFh) addressed indirectly via byte registers
R0 or R1 –3
Rn
nByte register R0-R7 of the currently selected register bank
Byte register index: n = 0-7 –3
Rm
Rmd
Rms
m, md, ms
Byte register R0-R15 of the currently selected register file
Destination register
Source register
Byte register index: m, md, ms = 0-15 3–
WRj
WRjd
WRjs
at WRj
at WRj +dis16
j, jd, js
Word register WR0, WR2, ..., WR30 of the currently selected register
file
Destination register
Source register
A memory location (00:0000h-00:FFFFh) addressed indirectly
through word register WR0-WR30, is the target address for jump
instructions.
A memory location (00:0000h-00:FFFFh) addressed indirectly
through word register (WR0-WR30) + 16-bit signed (two’s
complement) displacement value
Word register index: j, jd, js = 0-30
3
–
DRk
DRkd
DRks
at DRk
at DRk +dis16
k, kd, ks
Dword register DR0, DR4, ..., DR28, DR56, DR60 of the currently
selected register file
Destination register
Source register
A memory location (00:0000h-FF:FFFFh) addressed indirectly
through dword register DR0-DR28, DR56 and DR60, is the target
address for jump instruction
A memory location (00:0000h-FF:FFFFh) addressed indirectly
through dword register (DR0-DR28, DR56, DR60) + 16-bit (two’s
complement) signed displacement value
Dword register index: k, kd, ks = 0, 4, 8..., 28, 56, 60
3
–
24
TSC8x251G2D 4135C–8051–04/05
Size and Execution Time
for Instruction Families Table 20. Summary of Add and Subtract Instructions
Notes: 1. A shaded cell denotes an instruction in the C51 Architecture.
2. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 1 to the number of states.
Add 2 if it addresses a Peripheral SFR.
3. If this instruction addresses external memory location, add N+2 to the number of
states (N: number of wait states).
AddADD <dest>, <src>dest opnd ← dest opnd + src opnd
SubtractSUB <dest>, <src>dest opnd ← dest opnd - src opnd
Add with CarryADDC <dest>, <src>(A) ← (A) + src opnd + (CY)
Subtract with BorrowSUBB <dest>, <src>(A) ← (A) - src opnd - (CY)
Mnemonic <dest>,
<src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
ADD
A, Rn Register to ACC 1 1 2 2
A, dir8 Direct address to ACC 2 1(2) 21
(2)
A, at Ri Indirect address to ACC 1 2 2 3
A, #data Immediate data to ACC 2 1 2 1
ADD/SUB
Rmd, Rms Byte register to/from byte register 3 2 2 1
WRjd, WRjs Word register to/from word register 3 3 2 2
DRkd, DRks Dword register to/from dword register 3 5 2 4
Rm, #data Immediate 8-bit data to/from byte
register 4332
WRj, #data16 Immediate 16-bit data to/from word
register 5443
DRk,
#0data16 16-bit unsigned immediate data
to/from dword register 5645
Rm, dir8 Direct address (on-chip RAM or SFR)
to/from byte register 43
(2) 32
(2)
WRj, dir8 Direct address (on-chip RAM or SFR)
to/from word register 4433
Rm, dir16 Direct address (64K) to/from byte
register 53
(3) 42
(3)
WRj, dir16 Direct address (64K) to/from word
register 54
(4) 43
(4)
Rm, at WRj Indirect address (64K) to/from byte
register 43
(3) 32
(3)
Rm, at DRk Indirect address (16M) to/from byte
register 44
(3) 33
(3)
ADDC/SU
BB
A, Rn Register to/from ACC with carry 1 1 2 2
A, dir8 Direct address (on-chip RAM or SFR)
to/from ACC with carry 21
(2) 21
(2)
A, at Ri Indirect address to/from ACC with
carry 1223
A, #data Immediate data to/from ACC with
carry 2121
25
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4. If this instruction addresses external memory location, add 2(N+2) to the number of
states (N: number of wait states).
Table 21. Summary of Increment and Decrement Instructions
Notes: 1. A shaded cell denotes an instruction in the C51 Architecture.
2. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 2 to the number of states.
Add 3 if it addresses a Peripheral SFR.
IncrementINC <dest>dest opnd ← dest opnd + 1
IncrementINC <dest>, <src>dest opnd ← dest opnd + sr c opnd
DecrementDEC <dest>dest opnd ← dest opnd - 1
DecrementDEC <dest>, <src>dest opnd ← dest opnd - src opnd
Mnemonic <dest>,
<src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
INC
DEC
A ACC by 1 1 1 1 1
Rn Register by 1 1 1 2 2
dir8 Direct address (on-chip RAM or
SFR) by 1 22
(2) 22
(2)
at Ri Indirect address by 1 1 3 2 4
INC
DEC
Rm, #short Byte register by 1, 2, or 4 3 2 2 1
WRj, #short Word register by 1, 2, or 4 3 2 2 1
INC DRk, #short Double word register by 1, 2, or 4 3 4 2 3
DEC DRk, #short Double word register by 1, 2, or 4 3 5 2 4
INC DPTR Data pointer by 1 1 1 1 1
26
TSC8x251G2D 4135C–8051–04/05
Table 22. Summary of Compare Instructions
Notes: 1. If this instruction addresses an I/O Port (Px, x = 0-3), add 1 to the number of states.
Add 2 if it addresses a Peripheral SFR.
2. If this instruction addresses external memory location, add N+2 to the number of
states (N: number of wait states).
3. If this instruction addresses external memory location, add 2(N+2) to the number of
states (N: number of wait states).
CompareCMP <dest>, <src>dest opnd - src opnd
Mnemonic <dest>,
<src>(2) Comments
Binary Mode Source Mode
Bytes States Bytes States
CMP
Rmd, Rms Register with register 3 2 2 1
WRjd,
WRjs Word register with word register 3 3 2 2
DRkd,
DRks Dword register with dword register 3 5 2 4
Rm, #data Register with immediate data 4 3 3 2
WRj,
#data16 Word register with immediate 16-bit data 5 4 4 3
DRk,
#0data16 Dword register with zero-extended 16-bit
immediate data 5 645
DRk,
#1data16 Dword register with one-extended 16-bit
immediate data 5 645
Rm, dir8 Direct address (on-chip RAM or SFR) with
byte register 43
(1) 32
(1)
WRj, dir8 Direct address (on-chip RAM or SFR) with
word register 4 433
Rm, dir16 Direct address (64K) with byte register 5 3(2) 42
(2)
WRj, dir16 Direct address (64K) with word register 5 4(3) 43
(3)
Rm, at WRj Indirect address (64K) with byte register 4 3(2) 32
(2)
Rm, at DRk Indirect address (16M) with byte register 4 4(2) 33
(2)
27
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Logical AND(1)ANL <dest>, <src>dest opnd ← dest opnd Λ src opnd
Logical OR(1)ORL <dest>, <src>dest opnd ← dest opnd ς src opnd
Logical Exclusive OR(1)XRL <dest>, <src>dest opnd ← dest opnd ∀ src opnd
Clear(1)CLR A(A) ← 0
Complement(1)CPL A(A) ← ∅ (A)
Rotate LeftRL A(A)n+1 ← (A)n, n = 0..6
(A)0 ← (A)7
Rotate Left CarryRLC A(A)n+1 ← (A)n, n = 0..6
(CY) ← (A)7
(A)0 ← (CY)
Rotate RightRR A(A)n-1 ← (A)n, n = 7..1
(A)7 ← (A)0
Rotate Right CarryRRC A(A)n-1 ← (A)n, n = 7..1
(CY) ← (A)0
(A)7 ← (CY)
Mnemonic <dest>, <src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
ANL
ORL
XRL
A, Rn register to ACC 1 1 2 2
A, dir8 Direct address (on-chip RAM or SFR) to ACC 2 1(3) 21
(3)
A, at Ri Indirect address to ACC 1 2 2 3
A, #data Immediate data to ACC 2 1 2 1
dir8, A ACC to direct address 2 2(4) 22
(4)
dir8, #data Immediate 8-bit data to direct address 3 3(4) 33
(4)
Rmd, Rms Byte register to byte register 3 2 2 1
WRjd, WRjs Word register to word register 3 3 2 2
Rm, #data Immediate 8-bit data to byte register 4 3 3 2
WRj, #data16 Immediate 16-bit data to word register 5 4 4 3
Rm, dir8 Direct address (on-chip RAM or SFR) to byte
register 43
(3) 32
(3)
WRj, dir8 Direct address (on-chip RAM or SFR) to word
register 4433
Rm, dir16 Direct address (64K) to byte register 5 3(5) 42
(5)
WRj, dir16 Direct address (64K) to word register 5 4(6) 43
(6)
Rm, at WRj Indirect address (64K) to byte register 4 3(5) 32
(5)
Rm, at DRk Indirect address (16M) to byte register 4 4(5) 33
(5)
CLR A Clear ACC 1 1 1 1
CPL A Complement ACC 1 1 1 1
RL A Rotate ACC left 1 1 1 1
RLC A Rotate ACC left through CY 1 1 1 1
RR A Rotate ACC right 1 1 1 1
RRC A Rotate ACC right through CY 1 1 1 1
28
TSC8x251G2D 4135C–8051–04/05
Notes: 1. Logical instructions that affect a bit are in Table 27.
2. A shaded cell denotes an instruction in the C51 Architecture.
3. If this instruction addresses an I/O Port (Px, x = 0-3), add 1 to the number of states. Add 2 if it addresses a Peripheral SFR.
4. If this instruction addresses an I/O Port (Px, x = 0-3), add 2 to the number of states. Add 3 if it addresses a Peripheral SFR.
5. If this instruction addresses external memory location, add N+2 to the number of states (N: number of wait states).
6. If this instruction addresses external memory location, add 2(N+2) to the number of states (N: number of wait states).
Table 23. Summary of Logical Instructions (2/2)
Note: 1. A shaded cell denotes an instruction in the C51 Architecture.
Shift Left LogicalSLL <dest><dest>0 ← 0
<dest>n+1 ← <dest>n, n = 0..msb-1
(CY) ← <dest> msb
Shift Right ArithmeticSRA <dest><dest>msb ← <dest>msb
<dest>n-1 ← <dest>n, n = msb..1
(CY) ← <dest> 0
Shift Right LogicalSRL <dest><dest>msb ← 0
<dest>n-1 ← <dest>n, n = msb..1
(CY) ← <dest> 0
SwapSWAP AA3:0 A7:4
Mnemonic <dest>,
<src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
SLL
Rm Shift byte register left through the
MSB 3221
WRj Shift word register left through the
MSB 3221
SRA Rm Shift byte register right 3 2 2 1
WRj Shift word register right 3 2 2 1
SRL Rm Shift byte register left 3 2 2 1
WRj Shift word register left 3 2 2 1
SWAP A Swap nibbles within ACC 1 2 1 2
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Table 24. Summary of Multiply, Divide and Decimal-adjust Instructions
Note: 1. A shaded cell denotes an instruction in the C51 Architecture.
MultiplyMUL AB(B:A) ← (A)×(B)
MUL <dest>, <src>extended dest opnd ← dest opnd × src opnd
DivideDIV AB(A) ← Quotient ((A) ⁄ (B))
(B) ← Remainder ((A) ⁄ (B))
DivideDIV <dest>, <src>ext. dest opnd high ← Quotient (dest opnd ⁄ src opnd)
ext. dest opnd low ← Remainder (dest opnd ⁄ src opnd)
Decimal-adjust ACCDA AIF [[(A)3:0 > 9] ∨ [(AC) = 1]]
for Addition (BCD) THEN (A)3:0 ← (A)3:0 + 6 !affects CY;
IF [[(A)7:4 > 9] ∨ [(CY) = 1]]
THEN (A)7:4 ← (A)7:4 + 6
Mnemonic <dest>,
<src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
MUL
AB Multiply A and B 1 5 1 5
Rmd, Rms Multiply byte register and byte register 3 6 2 5
WRjd, WRjs Multiply word register and word register 3 12 2 11
DIV
AB Divide A and B 1 10 1 10
Rmd, Rms Divide byte register and byte register 3 11 2 10
WRjd, WRjs Divide word register and word register 3 21 2 20
DA A Decimal adjust ACC 1 1 1 1
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Table 25. Summary of Move Instructions (1/3)
Notes: 1. A shaded cell denotes an instruction in the C51 Architecture.
2. Extended memory addressed is in the region specified by DPXL (reset value = 01h).
3. If this instruction addresses external memory location, add N+1 to the number of
states (N: number of wait states).
4. If this instruction addresses external memory location, add N+2 to the number of
states (N: number of wait states).
Move to High wordMOVH <dest>, <src>dest opnd31:16 ← src opnd
Move with Sign extensionMOVS <dest>, <src>dest opnd ← src opnd with sign extend
Move with Zero extensionMOVZ <dest>, <src>dest opnd ← src o pnd with zero extend
Move CodeMOVC A, <src>(A) ← src opnd
Move eXtendedMOVX <dest>, <src>dest opnd ← src opnd
Mnemonic <dest>,
<src>(2) Comments
Binary Mode Source Mode
Bytes States Bytes States
MOVH DRk, #data16 16-bit immediate data into upper
word of dword register 5342
MOVS WRj, Rm Byte register to word register with
sign extension 3221
MOVZ WRj, Rm Byte register to word register with
zeros extension 3221
MOVC A, at A +DPTR Code byte relative to DPTR to
ACC 16
(3) 16
(3)
A, at A +PC Code byte relative to PC to ACC 1 6(3) 16
(3)
MOVX
A, at Ri Extended memory (8-bit address)
to ACC(2) 1415
A, at DPTR Extended memory (16-bit
address) to ACC(2) 13
(4) 13
(4)
at Ri, A ACC to extended memory (8-bit
address)(2) 1414
at DPTR, A ACC to extended memory (16-bit
address)(2) 14
(3) 14
(3)
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Table 26. Summary of Move Instructions (2/3)
Notes: 1. Instructions that move bits are in Table 27.
2. Move instructions from the C51 Architecture.
3. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 1 to the number of states.
Add 2 if it addresses a Peripheral SFR.
4. Apply note 3 for each dir8 operand.
Move(1)MOV <dest>, <src>dest opnd ← src opnd
Mnemonic <dest>,
<src>(2) Comments
Binary Mode Source Mode
Bytes States Bytes States
MOV
A, Rn Register to ACC 1 1 2 2
A, dir8 D irect address (on-chip RAM or SFR)
to ACC 21
(3) 21
(3)
A, at Ri Indirect address to ACC 1 2 2 3
A, #data Immediate data to ACC 2 1 2 1
Rn, A ACC to register 1 1 2 2
Rn, dir8 Direct address (on-chip RAM or SFR)
to register 21
(3) 32
(3)
Rn, #data Immediate data to register 2 1 3 2
dir8, A ACC to direct address (on-chip RAM or
SFR) 22
(3) 22
(3)
dir8, Rn Register to direct address (on-chip
RAM or SFR) 22
(3) 33
(3)
dir8, dir8 Direct address to direct address (on-
chip RAM or SFR) 33
(4) 33
(4)
dir8, at Ri Indirect address to direct address (on-
chip RAM or SFR) 23
(3) 34
(3)
dir8, #data Immediate data to direct address (on-
chip RAM or SFR) 33
(3) 33
(3)
at Ri, A ACC to indirect address 1 3 2 4
at Ri, dir8 Direct address (on-chip RAM or SFR)
to indirect address 23
(3) 34
(3)
at Ri, #data Immediate data to indirect address 2 3 3 4
DPTR,
#data16 Load Data Pointer with a 16-bit
constant 3232
32
TSC8x251G2D 4135C–8051–04/05
Move(1)MOV <dest>, <src>dest opnd ← src opnd
Mnemonic <dest>, <src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
MOV Rmd, Rms Byte register to byte register 3 2 2 1
MOV WRjd, WRjs Word register to word register 3 2 2 1
MOV DRkd, DRks Dword register to dword register 3 3 2 2
MOV Rm, #data Immediate 8-bit data to byte register 4 3 3 2
MOV WRj, #data16 Immediate 16-bit data to word register 5 3 4 2
MOV DRk, #0data16 zero-ext 16bit immediate data to dword register 5 5 4 4
MOV DRk, #1data16 one-ext 16bit immediate data to dword register 5 5 4 4
MOV Rm, dir8 Direct address (on-chip RAM or SFR) to byte register 4 3(3) 32
(3)
MOV WRj, dir8 Direct address (on-chip RAM or SFR) to word register 4 4 3 3
MOV DRk, dir8 Direct address (on-chip RAM or SFR) to dword register 4 6 3 5
MOV Rm, dir16 Direct address (64K) to byte register 5 3(4) 42
(4)
MOV WRj, dir16 Direct address (64K) to word register 5 4(5) 43
(5)
MOV DRk, dir16 Direct address (64K) to dword register 5 6 (6) 45
(6)
MOV Rm, at WRj Indirect address (64K) to byte register 4 3(4) 32
(4)
MOV Rm, at DRk Indirect address (16M) to byte register 4 4(4) 33
(4)
MOV WRjd, at WRjs Indirect address (64K) to word register 4 4(5) 33
(5)
MOV WRj, at DRk Indirect address (16M) to word register 4 5(5) 34
(5)
MOV dir8, Rm Byte register to direct address (on-chip RAM or SFR) 4 4(3) 33
(3)
MOV dir8, WRj Word register to direct address (on-chip RAM or SFR) 4 5 3 4
MOV dir8, DRk Dword register to direct address (on-chip RAM or SFR) 4 7 3 6
MOV dir16, Rm Byte register to direct address (64K) 5 4(4) 43
(4)
MOV dir16, WRj Word register to direct address (64K) 5 5(5) 44
(5)
MOV dir16, DRk Dword register to direct address (64K) 5 7(6) 46
(6)
MOV at WRj, Rm Byte register to indirect address (64K) 4 4(4) 33
(4)
MOV at DRk, Rm Byte register to indirect address (16M) 4 5(4) 34
(4)
MOV at WRjd, WRjs Word register to indirect address (64K) 4 5(5) 34
(5)
MOV at DRk, WRj Word register to indirect address (16M) 4 6(5) 35
(5)
MOV Rm, at WRj
+dis16 Indirect with 16-bit displacement (64K) to byte register 5 6(4) 45
(4)
MOV WRj, at WRj
+dis16 Indirect with 16-bit displacement (64K) to word register 5 7(5) 46
(5)
MOV Rm, at DRk
+dis24 Indirect with 16-bit displacement (16M) to byte register 5 7(4) 46
(4)
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Notes: 1. Instructions that move bits are in Table 27.
2. Move instructions unique to the C251 Architecture.
3. If this instruction addresses an I/O Port (Px, x = 0-3), add 1 to the number of states. Add 2 if it addresses a Peripheral SFR.
4. If this instruction addresses external memory location, add N+2 to the number of states (N: number of wait states).
5. If this instruction addresses external memory location, add 2(N+1) to the number of states (N: number of wait states).
6. If this instruction addresses external memory location, add 4(N+2) to the number of states (N: number of wait states).
MOV WRj, at WRj
+dis24 Indirect with 16-bit displacement (16M) to word register 5 8(5) 47
(5)
MOV at WRj +dis16,
Rm Byte register to indirect with 16-bit displacement (64K) 5 6(4) 45
(4)
MOV at WRj +dis16,
WRj Word register to indirect with 16-bit displacement (64K) 5 7(5) 46
(5)
MOV at DRk +dis24,
Rm Byte register to indirect with 16-bit displacement (16M) 5 7(4) 46
(4)
MOV at DRk +dis24,
WRj Word register to indirect with 16-bit displacement (16M) 5 8(5) 47
(5)
34
TSC8x251G2D 4135C–8051–04/05
Table 27. Summary of Bit Instructions
Notes: 1. A shaded cell denotes an instruction in the C51 Architecture.
2. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 1 to the number of states.
Add 2 if it addresses a Peripheral SFR.
3. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 2 to the number of states.
Add 3 if it addresses a Peripheral SFR.
Clear BitCLR <dest>dest opnd ← 0
Set BitSETB <dest>dest opnd ← 1
Complement BitCPL <dest>dest opnd ← ∅ bit
AND Carry with BitANL CY, <src>(CY) ← (CY) ∧ src opnd
AND Carry with Complement of BitANL CY, /<src>(CY) ← (CY) ∧ ∅ src opnd
OR Carry with BitORL CY, <src>(CY) ← (CY) ∨ src opnd
OR Carry with Complement of BitORL CY, /<src>(CY) ← (CY) ∨ ∅ src opnd
Move Bit to CarryMOV CY, <src>(CY) ← src opnd
Move Bit from CarryMOV <dest>, CYdest opnd ← (CY)
Mnemonic <dest>,
<src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
CLR
CY Clear carry 1 1 1 1
bit51 Clear direct bit 2 2(3) 22
(3)
bit Clear direct bit 4 4(3) 33
(3)
SETB
CY Set carry 1 1 1 1
bit51 Set direct bit 2 2(3) 22
(3)
bit Set direct bit 4 4(3) 33
(3)
CPL
CY Complement carry 1 1 1 1
bit51 Complement direct bit 2 2(3) 22
(3)
bit Complement direct bit 4 4(3) 33
(3)
ANL
CY, bit51 And direct bit to carry 2 1(2) 21
(2)
CY, bit And direct bit to carry 4 3(2) 32
(2)
CY, /bit51 And complemented direct bit to
carry 21
(2) 21
(2)
CY, /bit And complemented direct bit to
carry 43
(2) 32
(2)
ORL
CY, bit51 Or direct bit to carry 2 1(2) 21
(2)
CY, bit Or direct bit to carry 4 3(2) 32
(2)
CY, /bit51 Or complemented direct bit to
carry 21
(2) 21
(2)
CY, /bit Or complemented direct bit to
carry 43
(2) 32
(2)
MOV
CY, bit51 Move direct bit to carry 2 1(2) 21
(2)
CY, bit Move direct bit to carry 4 3(2) 32
(2)
bit51, CY Move carry to direct bit 2 2(3) 22
(3)
bit, CY Move carry to direct bit 4 4(3) 33
(3)
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Table 28. Summary of Exchange, Push and Pop Instructions
Notes: 1. A shaded cell denotes an instruction in the C51 Architecture.
2. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 1 to the number of states.
Add 2 if it addresses a Peripheral SFR.
3. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 2 to the number of states.
Add 3 if it addresses a Peripheral SFR.
Exchange bytesXCH A, <src>(A) ↔ src opnd
Exchange DigitXCHD A, <src>(A)3:0 ↔ src opnd3:0
PushPUSH <src>(SP) ← (SP) +1; ((SP)) ← src opnd;
(SP) ← (SP) + size (src opnd) - 1
PopPOP <dest>(SP) ← (SP) - size (dest opnd) + 1;
dest opnd ← ((SP)); (SP) ← (SP) -1
Mnemonic <dest>,
<src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
XCH
A, Rn ACC and register 1 3 2 4
A, dir8 ACC and direct address (on-chip
RAM or SFR) 23
(3) 23
(3)
A, at Ri ACC and indirect address 1 4 2 5
XCHD A, at Ri ACC low nibble and indirect address
(256 bytes) 1425
PUSH
dir8 Push direct address onto stack 2 2(2) 22
(2)
#data Push immediate data onto stack 4 4 3 3
#data16 Push 16-bit immediate data onto
stack 5545
Rm Push byte register onto stack 3 4 2 3
WRj Push word register onto stack 3 5 2 4
DRk Push double word register onto
stack 3928
POP
dir8 Pop direct address (on-chip RAM or
SFR) from stack 23
(2) 23
(2)
Rm Pop byte register from stack 3 3 2 2
WRj Pop word register from stack 3 5 2 4
DRk Pop double word register from stack 3 9 2 8
36
TSC8x251G2D 4135C–8051–04/05
Table 29. Summary of Conditional Jump Instructions (1/2)
Notes: 1. A shaded cell denotes an instruction in the C51 Architecture.
2. States are given as jump not-taken/taken.
3. In internal execution only, add 1 to the number of states of the ‘jump taken’ if the des-
tination address is internal and odd.
Jump conditional on statusJcc rel(PC) ← (PC) + size (instr);
IF [cc] THEN (PC) ← (PC) + rel
Mnemonic <dest>,
<src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
JC rel Jump if carry 2 1/4(3) 21/4
(3)
JNC rel Jump if not carry 2 1/4(3) 21/4
(3)
JE rel Jump if equal 3 2/5(3) 21/4
(3)
JNE rel Jump if not equal 3 2/5(3) 21/4
(3)
JG rel Jump if greater than 3 2/5(3) 21/4
(3)
JLE rel Jump if less than, or equal 3 2/5(3) 21/4
(3)
JSL rel Jump if less than (signed) 3 2/5(3) 21/4
(3)
JSLE rel Jump if less than, or equal (signed) 3 2/5(3) 21/4
(3)
JSG rel Jump if greater than (signed) 3 2/5(3) 21/4
(3)
JSGE rel Jump if greater than or equal (signed) 3 2/5(3) 21/4
(3)
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Table 30. Summary of Conditional Jump Instructions (2/2)
Notes: 1. A shaded cell denotes an instruction in the C51 Architecture.
2. States are given as jump not-taken/taken.
3. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 1 to the number of states.
Add 2 if it addresses a Peripheral SFR.
4. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 2 to the number of states.
Jump if bitJB <src>, rel(PC) ← (PC) + size (instr);
IF [src opnd = 1] THEN (PC) ← (PC) + rel
Jump if not bitJNB <src>, rel(PC) ← (PC) + size (i nstr);
IF [src opnd = 0] THEN (PC) ← (PC) + rel
Jump if bit and clearJBC <dest>, rel(PC) ← (PC) + size (instr);
IF [dest opnd = 1] THEN
dest opnd ← 0
(PC) ← (PC) + rel
Jump if accumulator is zeroJZ rel(PC) ← (PC) + size (instr);
IF [(A) = 0] THEN (PC) ← (PC) + rel
Jump if accumulator is not zeroJNZ rel(PC) ← (PC) + size (instr);
IF [(A) ≠ 0] THEN (PC) ← (PC) + rel
Compare and jump if not equalCJNE <src1>, <src2>, rel(PC) ← (PC) + size (instr);
IF [src opnd1 < src opnd2] THEN (CY) ← 1
IF [src opnd1 ≥ src opnd2] THEN (CY) ← 0
IF [src opnd1 ≠ src opnd2] THEN (PC) ← (PC) + rel
Decrement and jump if not zeroDJNZ <dest>, rel(PC) ← (PC) + size (instr); dest opnd ← dest opnd -1;
IF [ϕ (Z)] THEN (PC) ← (PC) + rel
Mnemonic <dest>, <src>(1) Comments
Binary Mode(2) Source Mode (2)
Bytes States Bytes States
JB
bit51, rel Jump if direct bit is set 3 2/5(3)(6) 32/5
(3)(6)
bit, rel Jump if direct bit of 8-bit address
location is set 54/7
(3)(6) 43/6
(3)(6)
JNB
bit51, rel Jump if direct bit is not set 3 2/5(3)(6) 32/5
(3)(6)
bit, rel Jump if direct bit of 8-bit address
location is not set 54/7
(3)(6) 43/6
(3)
JBC
bit51, rel Jump if direct bit is set & clear bit 3 4/7(5)(6) 34/7
(5)(6)
bit, rel Jump if direct bit of 8-bit address
location is set and clear 57/10(5)(
6) 46/9
(5)(6)
JZ rel Jump if ACC is zero 2 2/5(6) 22/5
(6)
JNZ rel Jump if ACC is not zero 2 2/5(6) 22/5
(6)
CJNE
A, dir8, rel Compare direct address to ACC and
jump if not equal 32/5
(3)(6) 32/5
(3)(6)
A, #data, rel Compare immediate to ACC and
jump if not equal 32/5
(6) 32/5
(6)
Rn, #data, rel Compare immediate to register and
jump if not equal 32/5
(6) 43/6
(6)
at Ri, #data, rel Compare immediate to indirect and
jump if not equal 33/6
(6) 44/7
(6)
DJNZ
Rn, rel Decrement register and jump if not
zero 22/5
(6) 33/6
(6)
dir8, rel Decrement direct address and jump
if not zero 33/6
(4)(6) 33/6
(4)(6)
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TSC8x251G2D 4135C–8051–04/05
Add 3 if it addresses a Peripheral SFR.
5. If this instruction ad dresses an I/O Port (Px, x = 0- 3), add 3 to the number of states.
Add 5 if it addresses a Peripheral SFR.
6. In internal execution only, add 1 to the number of states of the ‘jump taken’ if the des-
tination address is internal and odd.
Table 31. Summary of Uncondi tional Jump Instructions
Notes: 1. A shaded cell denotes an instruction in the C51 Architecture.
2. In internal execution only, add 1 to the numb er of states if the destination address is
internal and odd.
3. Add 2 to the number of states if the destination address is external.
4. Add 3 to the number of states if the destination address is external.
Absolute jumpAJMP <src>(PC) ← (PC) +2; (PC)10:0 ← src opnd
Extended jumpEJMP <src>(PC) ← (PC) + size (instr); (PC)23:0 ← src opnd
Long jumpLJMP <src>(PC) ← (PC) + size (instr); (PC)15:0 ← src opnd
Short jumpSJMP rel(PC) ← (PC) +2; (PC) ← (PC) +rel
Jump indirectJMP at A +DPTR(PC)23:16 ← FFh; (PC)15:0 ← (A) + (DPTR)
No operationNOP(PC) ← (PC) +1
Mnemonic <dest>,
<src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
AJMP addr11 Absolute jump 2 3(2)(3) 23
(2)(3)
EJMP addr24 Extended jump 5 6(2)(4) 45
(2)(4)
at DRk Extended jump (indirect) 3 7(2)(4) 26
(2)(4)
LJMP at WRj Long jump (indirect) 3 6(2)(4) 25
(2)(4)
addr16 Long jump (direct address) 3 5(2)(4) 35
(2)(4)
SJMP rel Short jump (relative address) 2 4(2)(4) 24
(2)(4)
JMP at A +DPTR Jump indirect relative to the DPTR 1 5(2)(4) 15
(2)(4)
NOP No operation (Jump never) 1 1 1 1
39
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Table 32. Summary of Call and Return Instructions
Notes: 1. A shaded cell denotes an instruction in the C51 Architecture.
2. In internal execution only, add 1 to the number of states if the destination/return
address is internal and odd.
3. Add 2 to the number of states if the destination address is external.
4. Add 5 to the number of states if INTR = 1.
Absolute callACALL <src>(PC) ← (PC) +2; push (PC)15:0;
(PC)10:0 ← src opnd
Extended callECALL <src>(PC) ← (PC) + size (instr); push (PC)23:0;
(PC)23:0 ← src opnd
Long callLCALL <src>(PC) ← (PC) + size (instr); push (PC)15:0;
(PC)15:0 ← src opnd
Return from subroutineRETpop (PC)15:0
Extended return from subroutineERETpop (PC)23:0
Return from interruptRETIIF [INTR = 0] THEN pop (PC)15:0
IF [INTR = 1] THEN pop (PC)23:0; po p (PSW1)
Trap interruptTRAP(PC) ← (PC) + size (instr);
IF [INTR = 0] THEN push (PC)15:0
IF [INTR = 1] THEN push (PSW1); push (PC)23:0
Mnemonic <dest>,
<src>(1) Comments
Binary Mode Source Mode
Bytes States Bytes States
ACALL addr11 Absolute subroutine call 2 9(2)(3) 29
(2)(3)
ECALL at DRk Extended subroutine call (indirect) 3 14(2)(3) 213
(2)(3)
addr24 Extended subroutine call 5 14(2)(3) 413
(2)(3)
LCALL at WRj Long subroutine call (indirect) 3 10(2)(3) 29
(2)(3)
addr16 Long subroutine call 3 9(2)(3) 39
(2)(3)
RET Return from subroutine 1 7(2) 17
(2)
ERET Extended subroutine return 3 9(2) 28
(2)
RETI Return from interrupt 1 7(2)(4) 17
(2)(4)
TRAP Jump to the trap interrupt vector 2 12(4) 111
(4)
40
TSC8x251G2D 4135C–8051–04/05
Programming and Verifying Non-volatile Memory
Internal Features The internal non-volatile memory of the TS C80251G2D derivatives contains five differ-
ent areas:
• Code Memory
• Configuration Bytes
•Lock Bits
• Encryption Array
• Signature Bytes
EPROM/OTPROM Devices All the internal non-volatile memory but the Signature Bytes of the TSC872 51G2D pro d-
ucts is made of EPROM cells. The Signature Bytes of the TSC87251G2D products are
made of Mask ROM.
The TSC87251G2D products are programmed and verified in the same manner as
Atmel’s TSC87251G1A, using a SINGLE-PULSE algorithm, which pr og ra m s at
VPP = 12.75V using only one 100µs pulse per byte. This results in a programming time
of less than 10 seconds for the 32 kilobytes on-chip code memory.
The EPROM of the TSC87251G2D products in Window package is erasable by Ultra-
Violet radiation(1) (UV). UV erasure set all the EPROM memory cells to one and allows
reprogramming. The quar tz window must be covered with an opaque label(2) when the
device is in operation. This is not so much to protect the EPROM array from inadvertent
erasure, as to protect the RAM and other on-chip logic. Allowing light to impinge on the
silicon die during device operation may cause a logical malfunction.
The TSC87251G2D products in plastic package s are One Time Programmable (OTP).
An EPROM cell cannot be reset by UV o nce programmed to zero.
Notes: 1. The recommended erasure procedure is exposure to ultra-violet light (at 2537 Å) to
an integrated dose of at least 20 W-sec/cm2. Exposing the EPROM to an ultra-violet
lamp of 12000 µW/cm2 rating for 30 minutes should be sufficient.
2. Erasure of the EPROM begins to occur when th e chip i s exposed to light wavelength
shorter than 4000 Å. Since sunlight and fluorescent light have wavelength in this
range, exposure to these light sources over an extended time (1 week in sunlight or 3
years in room-level fluorescent lighting) could cause inadvertent erasure.
Mask ROM Devices All the internal non-volatile memory o f TSC83251G2D products is made of Mask ROM
cells. They can only be verified by the user, using the same algorithm as the
EPROM/OTPROM devices.
ROMless Devices The TSC80251G2D products do not include on -chip Configuration Bytes, Code Memor y
and Encryption Array. They only include Signature Bytes made of Mask ROM cells
which can be read using the same algorithm as the EPROM/OTPROM devices.
Security Features In some microcontroller applications, it is desirable that the user’s program code be
secured from unauthorized access. The TSC83251G2D and TSC87251G2D offer two
kinds of protection for program code stored in the on-chip array:
• Program code in the on-chip Code Memory is encrypted when read out for
verification if the Encryption Array isprogrammed.
• A three-level lock bit system restricts external access to the on-chip code memory.
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TSC8x251G2D
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Lock Bit System The TSC87251G2D products implement 3 levels of security for User’s program as
described in Table 33. The TSC83251G 2D products implement only the first level of
security.
Level 0 is the level of an erased part and does not enable any security features.
Level 1 locks the programming of the User’s internal Code Memory, the Configuration
Bytes and the Encryption Array.
Level 2 locks the verifying of the User’s internal Code Memory. It is always possible to
verify the Configuratio n Bytes and the Lock Bits. It is not possible to verify the Encryp -
tion Array.
Level 3 locks the external execution.
Table 33. Lock Bits Programming
Notes: 1. Returns encrypted data if Encryption Array is programmed.
2. Returns non encrypted data.
3. x means don’t care. Level 2 always enables level 1, and level 3 always enables levels
1 and 2.
The security level may be verified according to Table 34.
Table 34. Lock Bits Verifying
Note: 1. x means don’t care.
Encryption Ar ray The TSC83251G2D an d TSC87251G2D products include a 12 8-byte Encryption Array
located in non-volatile memory outside the memory address space. During verification
of the on-chip code memory, the seven low-order address bits also address the Encryp-
tion Array. As the byte of the code memory is read, it is exclusive-NOR’ed (XNOR) with
the key byte from the Encryption Array. If the Encryption Array is not programmed (still
all 1s), the user pr ogram code is pl aced on the data bus in its original, un encrypted form.
If the Encryption Array is programmed with key bytes, the user program code is
encrypted and cannot be used without knowledge of the key byte sequence.
Level Lock bits
LB[2:0] Internal
Execution External
Execution Verification Programming
External
PROM read
(MOVC)
0 000 Enable Enable Enable(1) Enable Enable(2)
1 001 Enable Enable Enable(1) Disable Disable
2 01x(3) Enable Enable Disable Disable Disable
31xx
(3) Enable Disable Disable Disable Disable
Level Lock bits Data(1)
0 xxxxx000
1 xxxxx001
2 xxxxx01x
3 xxxxx1xx
42
TSC8x251G2D 4135C–8051–04/05
To preserve the secrecy of the encryption key byte sequence, the Encryption Array can
not be verified.
Notes: 1. When a MOVC instruction is executed, the content of the ROM is not encrypted. In
order to fully protect the use r program code, the lock bit level 1 (see Table 3 3) must
always be set when encryption is used.
2. If the encryption feature is impl emented, the portion of the on-chip cod e memory that
does not contain program code should be filled with “ran dom” byte values to prevent
the encryption key sequence from being revealed.
Signature Bytes Th e TSC80251G2D derivatives contain factory-programme d Signature Bytes. These
bytes are located in non-volatile memory outside the memory address space at 30h,
31h, 60h and 61h. To r ead the Signature By tes, perform the p rocedure descr ibed in sec-
tion Verify Algorithm, using the verify signature mode (see Table 37). Signature byte
values are listed in Table 35.
Table 35. Signature Bytes (Electronic ID)
Programming Algorithm Figure 6 shows the hardware setup needed to program the TSC87251G2D
EPROM/OTPROM areas:
• The chip has to be put under reset and maintained in this state until completion of
the programming sequence.
• PSEN# and the other control signals ( ALE and Port 0) have to be set to a high level.
• Then PSEN# has to be to forced to a low level after two clock cycles or more and it
has to be maint ained in this state un til the completion of the programming se quence
(see below).
• The voltage on the EA# pin must be set to VDD.
• The programming mode is selected according to the code applied on Port 0 (see
Table 36). It has to be applied until the completion of this programming operation.
• The programming address is applied on Ports 1 and 3 which are respectively the
Most Significant Byte (MSB) and the Least Significant Byte (LSB) of the address.
• The programming data are applied on Port 2.
• The EPROM Programming is done by raising the voltage on the EA# pin to VPP,
then by generatin g a low level pulse on ALE/PROG# pin.
• The voltage on the EA# pin must be lowered to VDD before completing the
programming operation.
• It is possible to alternate programming and verifying operation (See Paragraph
Verify Algorithm). Please make sur e the voltage on the EA# pin has actually been
lowered to VDD before performing the verifying operation.
Signature Address Signature Data
Vendor Atmel 30h 58h
Architecture C251 31h 40h
Memory
32 kilobytes EPROM or
OTPROM 60h
F7h
32 kilobytes MaskROM
or ROMless 77h
Revision TSC80251G2D
derivative 61h FDh
43
TSC8x251G2D
4135C–8051–04/05
• PSEN# and the other control sig nals have to be released to complete a sequence of
programming operations or a sequence of programming and verifying operations.
Figure 6. Setup for Programming
Table 36. Programming Modes
Notes: 1. Signature Bytes are not user-programmable.
2. The ALE/PROG# pulse waveform is shown in Figure 23 page 59.
Verify Algorithm Figure 7 shows the hardware setup needed to verify the TSC87251G2D
EPROM/OTPROM or TSC83251G2D ROM areas:
• The chip has to be put under reset and maintained in this state until the completion
of the verifying sequence.
• PSEN# and the other control signals ( ALE and Port 0) have to be set to a high level.
• Then PSEN# has to be to forced to a low level after two clock cycles or more and it
has to be maint ained in this state until th e completion of the verifying sequence (see
below).
• The voltage on the EA# pin must be set to VDD and ALE must be set to a high level.
• The Verifying Mode is sele cted accordin g to the cod e a pplied on Por t 0. It has to be
applied until the completion of this verifying operation.
• The verifying address is applied on Ports 1 and 3 which are respectively the MSB
and the LSB of the address.
ROM Area(1) RST EA#/VPP PSEN
# ALE/PROG#(2) P0 P2 P1(MSB) P3(LSB)
On-chip Code
Memory 1V
PP 01 Pulse68hData
16-bit Address
0000h-7FFFh (32
kilobytes)
Configuration
Bytes 1V
PP 01 Pulse69hData
CONFIG0: FFF8h
CONFIG1: FFF9h
Lock Bits 1 VPP 0 1 Pulse 6Bh X LB0: 0001h
LB1: 0002h
LB2: 0003h
Encryption Array 1 VPP 0 1 Pulse 6Ch Data 0000h-007Fh
VDD
PSEN#
ALE/PROG#
EA#/VPP
XTAL1
VDD
4 to 12 MHz
RST
VPP
100 ms pulses
VSS/VSS1/VSS2
Mode
VDD
A[7:0]
A[14:8]
Data
P0[7:0]
P3[7:0]
P1[7:0]
P2[7:0]
TSC87251G2D
44
TSC8x251G2D 4135C–8051–04/05
• Then device is driving the data on Port 2.
• It is possible to alternate programming and verification operation (see Paragraph
Programming Algorithm). Please make sure th e voltage on the EA# pin has actually
been lowered to VDD before performing the verifying operation.
• PSEN# and the other control sig nals have to be released to complete a sequence of
verifying operations or a sequence of programming and verifying operations.
Table 37. Verifying Modes
Notes: 1. To preserve the secrecy of on-chip code memory when encrypted, the Encryption
Array can not be verified.
Figure 7. Setup for Verifying
ROM Area(1) RST EA#/VPP PSEN# ALE/PROG# P0 P2 P1(MSB) P3(LSB)
On-chip code
memory 1 1 0 1 28h Data 16-bit Address
0000h-7FFFh (32
kilobytes)
Configuration Bytes 1 1 0 1 29h Data CONFIG0: FFF8h
CONFIG1: FFF9h
Lock Bits 1 1 0 1 2Bh Data 0000 h
Signature Bytes 1 1 0 1 29h Data 0030h, 0031h, 0060h,
0061h
VDD
PSEN#
ALE/PROG#
EA#/VPP
XTAL1
VDD
4 to 12 MHz
RST
VSS/VSS1/VSS2
Mode
VDD
A[7:0]
A[14:8]
P0[7:0]
P3[7:0]
P1[7:0]
TSC8x251G2D
P2[7:0] Data
45
TSC8x251G2D
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AC Characteristics - Commercial & Industrial
AC Characteristics - External Bus Cycles
Definition of Symbols Table 38. External Bus Cycles Timing Symbol Definitions
Timings Test conditions: capacitive load on all pins = 50 pF.
Table 39 and Table 40 list the AC timing parameters for the TSC80251G2D derivatives
with no wait states. External wait states can be added by extending PSEN#/RD#/WR#
and or by extending ALE. In the se tables, No te 2 mar ks parameters affected by one ALE
wait state, and Note 3 marks parameters affected by PSEN#/RD#/WR# wait states.
Figure 8 to Figure 13 show the bus cycles with the timing parameters.
Signals Conditions
A Address H High
D Data In L Low
L ALE V Valid
Q Data Out X No Longer Valid
R RD#/PSEN# Z Floating
WWR#
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TSC8x251G2D 4135C–8051–04/05
Table 39. Bus Cycles AC Timings; VDD = 4.5 to 5.5 V, TA = -40 to 85°C
Notes: 1. Specification for PSEN# are identical to those for RD#.
2. If a wait state is added by extending ALE, add 2·TOSC.
3. If wait states are added by extending RD#/PSEN#/WR#, add 2N·TOSC (N = 1..3).
Symbol Parameter
12 MHz 16 MHz 24 MHz
UnitMin Max Min Max Min Max
TOSC 1/FOSC 83 62 41 ns
TLHLL ALE Puls e Widt h 78 58 38 ns(2)
TAVLL Address Valid to ALE Low 78 58 37 ns(2)
TLLAX Address hold after ALE Low 19 11 3 ns
TRLRH(1) RD#/PSEN# Pulse Width 162 121 78 ns(3)
TWLWH WR# Pulse Width 165 124 81 ns(3)
TLLRL(1) ALE Low to RD#/PSEN# Low 22 14 6 ns
TLHAX ALE High to Address Hold 99 70 40 ns(2)
TRLDV(1) RD#/PSEN# Low to Valid Data 146 104 61 ns(3)
TRHDX(1) Data Hold After RD#/PSEN# High 0 0 0 ns
TRHAX(1) Address Hold After RD#/PSEN#
High 000ns
TRLAZ(1) RD#/PSEN# Low to Address Float 0 0 0 ns
TRHDZ1 Instruction Float Af ter RD#/PSEN#
High 45 40 30 ns
TRHDZ2 Data Float After RD#/PSEN# High 215 165 115 ns
TRHLH1 RD#/PSEN# high to ALE High
(Instruction) 49 43 31 ns
TRHLH2 RD#/PSEN# high to ALE High
(Data) 215 169 115 ns
TWHLH WR# High to ALE High 215 169 115 ns
TAVDV1 Address (P0) Valid to Valid Data In 250 175 105 ns(2)(3)
TAVDV2 Address (P2) Valid to Valid Data In 306 223 140 ns(2)(3)
TAVDV3 Address (P0) Valid to Valid
Instruction In 150 109 68 ns(3)
TAXDX Data Hold after Address Hold 0 0 0 ns
TAVRL(1) Address Valid to RD# Low 100 70 40 ns(2)
TAVWL1 Address (P0) Valid to WR# Low 100 70 40 ns(2)
TAVWL2 Address (P2) Valid to WR# Low 158 115 74 ns(2)
TWHQX Data Hold after WR# High 90 69 32 ns
TQVWH Data Valid to WR# High 133 102 72 ns(3)
TWHAX WR# High to Address Hold 167 125 84 ns
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Table 40. Bus Cycles AC Timings; VDD = 2.7 to 5.5 V, TA = -40 to 85°C
Notes: 1. Specification for PSEN# are identical to those for RD#.
2. If a wait state is added by extending ALE, add 2·TOSC.
3. If wait states are added by extending RD#/PSEN#/WR#, add 2N·TOSC (N = 1..3).
Symbol Parameter
12 MHz 16 MHz
UnitMin Max Min Max
TOSC 1/FOSC 83 62 ns
TLHLL ALE Puls e Widt h 72 5 2 ns(2)
TAVLL Address Valid to ALE Low 71 51 ns(2)
TLLAX Address hold after ALE Low 14 6 ns
TRLRH(1) RD#/PSEN# Pulse Width 163 121 ns(3)
TWLWH WR# Pulse Width 165 124 ns(3)
TLLRL(1) ALE Low to RD#/PSEN# Low 17 11 ns
TLHAX ALE High to Address Hold 90 57 ns(2)
TRLDV(1) RD#/PSEN# Low to Valid Data 133 92 ns(3)
TRHDX(1) Data Hold After RD#/PSEN# High 0 0 ns
TRHAX(1) Address Hold After RD#/PSEN# High 0 0 ns
TRLAZ(1) RD#/PSEN# Low to Address Float 0 0 ns
TRHDZ1 Instruction Float After RD#/PSEN# High 59 48 ns
TRHDZ2 Data Float After RD#/PSEN# High 225 175 ns
TRHLH1 RD#/PSEN# high to ALE High (Instruction) 60 47 ns
TRHLH2 RD#/PSEN# high to ALE High (Data) 226 172 ns
TWHLH WR# High to ALE High 226 172 ns
TAVDV1 Address (P0) Valid to Valid Data In 289 160 ns(2)(3)
TAVDV2 Address (P2) Valid to Valid Data In 296 211 ns(2)(3)
TAVDV3 Address (P0) Valid to Valid Instruction In 144 98 ns(3)
TAXDX Data Hold after Address Hold 0 0 ns
TAVRL(1) Address Valid to RD# Low 111 64 ns(2)
TAVWL1 Address (P0) Valid to WR# Low 111 64 ns(2)
TAVWL2 Address (P2) Valid to WR# Low 158 116 ns(2)
TWHQX Data Hold after WR# High 82 66 ns
TQVWH Data Valid to WR# High 135 103 ns(3)
TWHAX WR# High to Address Hold 168 125 ns
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TSC8x251G2D 4135C–8051–04/05
Waveforms in Non-Page Mode Figure 8. External Bus Cycle: Code Fetch (Non-Page Mode)
Note: 1. The value of this parameter depends on wait states. See Table 39 and Table 40.
Figure 9. External Bus Cycle: Data Read (Non-Page Mode)
Note: 1. The value of this parameter depends on wait states. See Table 39 and Table 40.
TAVDV2(1)
TAVDV1(1)
TLLAX
TRHDZ1
TRHDX
TRHAX
TAVRL(1)
P2/A16/A17
P0
PSEN#
ALE TLHLL(1) TRLRH(1)
Instruction In
A15:8/A16/A17
TRLAZ
TLLRL(1) TRHLH1
TRLDV(1)
TAVLL(1)
TLHAX(1)
A7:0 D7:0
TAVDV2(1)
TAVDV1(1)
TLLAX
TRHAX
TRHDX
TRHDZ2
TAVLL(1)
TAVRL(1)
P2/A16/A17
P0
RD#/PSEN#
ALE TLHLL(1) TRLRH(1)
TLHAX(1)
Data In
A15:8/A16/A17
TRLAZ
TLLRL(1) TRHLH2
TRLDV(1)
D7:0A7:0
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Figure 10. External Bus Cycle: Data Wr ite (Non-Page Mode)
Note: 1. The value of this parameter depends on wait states. See Table 39 and Table 40.
Waveforms in Page Mode Figure 11. External Bus Cycle: Code Fetch (Page Mode)
Note: 1. The value of this parameter depends on wait states. See Table 39 and Table 40.
2. A page hit (i.e., a code fetch to the same 256-byte “page” as the previous code fetch)
requires one state (2·TOSC);
a page miss requires two states (4·TOSC).
3. During a sequence of page hit s, PSEN# remains low until the end of the last page-hit
cycle.
TWHLH
TAVWL2(1)
TAVWL1(1)
TLHAX(1)
TLLAX TWHQX
TWHAX
P2/A16/A17
P0
WR#
ALE TLHLL(1) TWLWH(1)
Data Out
A15:8/A16/A17
TAVLL(1) TQVWH
A7:0 D7:0
TLLAX
TAVDV2(1)
TAVDV1(1)
TLHAX(1)
TAVRL(1)
TRHDZ1
TRLAZ
TAXDX TAVDV3(1)
P0/A16/A17
P2
PSEN#(3)
ALE TLHLL(1)
A7:0/A16/A17
TAVLL(1)
TLLRL(1)
TRLDV(1)
Page Miss(2) Page Hit(2)
TRHAX
A7:0/A16/A17
D7:0 D7:0A15:8
Instruction In Instruction In
TRHDX
50
TSC8x251G2D 4135C–8051–04/05
Figure 12. External Bus Cycle: Data Re ad (Page Mode)
Note: 1. The value of this parameter depends on wait states. See Table 39 and Table 40.
Figure 13. External Bus Cycle: Data Write (Page Mode)
Note: 1. The value of this parameter depends on wait states. See Table 39 and Table 40.
AC Characteristics - Real-Time Synchronous Wait State
Definition of Symbols Table 41. Real-Time Synchronous Wait Timing Symbol Definitions
TAVDV2(1)
TAVDV1(1)
TLLAX
TRHAX
TRHDX
TRHDZ2
TAVLL(1)
TAVRL(1)
P0/A16/A17
P2
RD#/PSEN#
ALE TLHLL(1) TRLRH(1)
TLHAX(1)
Data In
A7:0/A16/A17
TRLAZ
TLLRL(1) TRHLH2
TRLDV(1)
D7:0A15:8
TWHLH
TAVWL2(1)
TAVWL1(1)
TLHAX(1)
TLLAX TWHQX
TWHAX
P0/A16/A17
P2
WR#
ALE TLHLL(1) TWLWH(1)
Data Out
A7:0/A16/A17
TAVLL(1) TQVWH
A15:8 D7:0
Signals Conditions
C WCLK L Low
R RD#/PSEN# V Valid
W WR# X No Longer Valid
YWAIT#
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Timings Tabl e 42 . Real-Time Synchronous Wait AC Timings; VDD = 2.7 to 5.5 V, TA = -40 to
85°C
Waveforms
Figure 14. Real-time Synchronous Wait State: Code Fetch/Data Read
Figure 15. Real-time Synchronous Wait State: Data Write
Symbol Parameter Min Max Unit
TCLYV Wait Clock Low to Wait Set-up 0 TOSC - 20 ns
TCLYX Wait Hold after Wait Clock Low 2W·TOSC + 5 (1+2W)·TOSC - 20 ns
TRLYV PSEN#/RD# Low to Wait Set-up 0 TOSC - 20 ns
TRLYX Wait Hold after PSEN#/RD# Low 2W·TOSC + 5 (1+2W)·TOSC - 20 ns
TWLYV WR# Low to Wait Set-up 0 TOSC - 20 ns
TWLYX Wait Hold after WR# Low 2W·TOSC + 5 (1+2W)·TOSC - 20 ns
State 1 State 2 State 3 State 1 (next cycle)
TRLYXmax
TRLYXmin
TRLYV
TCLYV
TCLYXmax
P2
RD#/PSEN#
ALE
WCLK
P0
WAIT#
TCLYXmin
RD#/PSEN# stretched
A15:8
A7:0 D7:0 stretched
A15:8 stretched
A7:0
State 1 State 2 State 3 State 1 (next cycle)
TWLYXmax
TWLYXmin
TWLYV
TCLYV
TCLYXmax
P2
RD#/PSEN#
ALE
WCLK
P0
WAIT#
TCLYXmin
WR# stretched
A7:0 D7:0 stretched
A15:8 stretched
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TSC8x251G2D 4135C–8051–04/05
AC Characteristics - Real-Time Asynchronous Wait State
Definition of Symbols Table 43. Real-Time Asynchronous Wait Timing Symbol Definitions
Timings Table 44. Real-Time Asynchronous Wait AC Timings; VDD = 2.7 to 5.5 V, TA = -40 to
85°C
Note: 1. N is the number of wait states added (N≥ 1).
Waveforms Figure 16. Real-time Asynchronous Wait State Timings
AC Characteristics - Serial Port in Shif t Register Mode
Definition of Symbols Table 45. Serial Port Timing Symbol Definitions
Signals Conditions
S PSEN#/RD#/WR# L Low
Y AWAIT# V Valid
X No Longer Valid
Symbol Parameter Min Max Unit
TSLYV PSEN#/RD#/WR# Low to Wait Set-up TOSC - 10 ns
TSLYX Wait Hold after PSEN#/RD#/WR# Low (2N-1)·TOSC + 10 ns(1)
TSLYV
TSLYX
RD#/PSEN#/WR#
AWAIT#
Signals Conditions
D Data In H High
Q Data Out L Low
XClock VValid
X No Longer Valid
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Timings Table 46. Serial Port AC Timing -Shift Register Mode; VDD = 2.7 to 5.5 V, TA = -40 to
85°C
Note: 1. For high speed versions only.
Waveforms
Figure 17. Serial Port Waveforms - Shift Register Mode
Note: 1. TI and RI are set during S1P1 of the peripheral cycle following the shift of the eight bit.
Symbol Parameter
12 MHz 16 MHz 24 MHz(1)
UnitMin Max Min Max Min Max
TXLXL Serial Port Clock Cycle Time 998 749 500 ns
TQVXH Output Data Setup to Clock Rising
Edge 833 625 417 ns
TXHQX Output Data hold after Clock Rising
Edge 165 124 82 ns
TXHDX Input Data Hold after Clock Rising
Edge 000ns
TXHDV Clock Rising Edge to Input Data
Valid 974 732 482 ns
TXLXL
TXHDV TXHDX
TQVXH
TXHQX Set TI(1)
Set RI(1)
Valid Valid Valid Valid Valid Valid Valid ValidRXD (In)
RXD (Out)
TXD
0 1 2 3 4 5 6 7
54
TSC8x251G2D 4135C–8051–04/05
AC Characteristics - SSLC: TWI Interface
Timings Table 47. TWI Interface AC Timing; VDD = 2.7 to 5.5 V, TA = -40 to 85°C
Notes: 1. At 100 kbit/s. At other bit-rates this value is inversely proportional to the bit-rate of
100 kbit/s.
2. Determined by the external bus-line capacitance and the external bus-line pull-up
resistor, this must be < 1 µs.
3. Spikes on the SDA and SCL line s with a duration of less than 3·TCLCL will be filtered
out. Maximum capacitance on bus-lines SDA and
SCL = 400 pF.
4. TCLCL = T OSC = one oscillator clock period.
Waveforms
Figure 18. TWI Waveforms
Symbol Parameter INPUT
Min Max OUTPUT
Min Max
THD; STA Start condition hold time 14·TCLCL(4) 4.0 µs(1)
TLOW SCL low time 16·TCLCL(4) 4.7 µs(1)
THIGH SCL high time 14·TCLCL(4) 4.0 µs(1)
TRC SCL rise time 1 µs-
(2)
TFC SCL fall time 0.3 µs0.3 µs(3)
TSU; DAT1 Data set-up time 250 ns 20·TCLCL(4)- TRD
TSU; DAT2 SDA set-up time (before repeated START
condition) 250 ns 1 µs(1)
TSU; DAT3 SDA set-up time (before STOP condition) 250 ns 8·TCLCL(4)
THD; DAT Data hold time 0 ns 8·TCLCL(4) - TFC
TSU; STA Repeated START set-up time 14·TCLCL(4) 4.7 µs(1)
TSU; STO STOP condition set-up time 14·TCLCL(4) 4.0 µs(1)
TBUF Bus free time 14·TCLCL(4) 4.7 µs(1)
TRD SDA rise time 1 µs -
(2)
TFD SDA fall time 0.3 µs0.3 µs(3)
TSU;STA
TSU;DAT2THD;STA THIGHTLOW
SDA
(INPUT/OUTPUT) 0.3 VDD
0.7 VDD
TBUFTSU;STO
0.7 VDD
0.3 VDD
TRD
TFD
TRC TFC
SCL
(INPUT/OUTPUT)
TSU;DAT1 THD;DAT
TSU;DAT3
START or Repeated START condition START condition
STOP condition
Repeated START condition
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AC Characteristics - SSLC: SPI Interface
Definition of Symbols Table 48. SPI Interface Timing Symbol Definitions
Signals Conditions
CClock H High
I Data In L Low
O Data Out V Valid
S SS# X No Longer Valid
Z Floating
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TSC8x251G2D 4135C–8051–04/05
Timings Table 49. SPI Interface AC Timing; VDD = 2.7 to 5.5 V, TA = -40 to 85°C
Notes: 1. Capacitive load on all pins = 200 pF in slave mode .
2. The value of this parameter depends on software.
3. Capacitive load on all pins = 100 pF in master mode.
Symbol Parameter Min Max Unit
Slave Mode(1)
TCHCH Clock Period 8 TOSC
TCHCX Clock High Time 3.2 TOSC
TCLCX Clock Low Time 3.2 TOSC
TSLCH, TSLCL SS# Low to Clock edge 200 ns
TIVCL, TIVCH Input Data Valid to Clock Edge 100 ns
TCLIX, TCHIX Input Data Hold after Clock Edge 100 ns
TCLOV, TCHOV Output Data Valid after Clock Edge 100 ns
TCLOX, TCHOX Output Data Hold Time after Clock Edge 0 ns
TCLSH, TCHSH SS# High after Clock Edge 0 ns
TIVCL, TIVCH Input Data Valid to Clock Edge 100 ns
TCLIX, TCHIX Input Data Hold after Clock Edge 100 ns
TSLOV SS# Low to Output Data Valid 130 ns
TSHOX Output Data Hold after SS# High 130 ns
TSHSL SS# High to SS# Low (2)
TILIH Input Rise Time 2 µs
TIHIL Input Fall Time 2 µs
TOLOH Output Rise time 100 ns
TOHOL Output Fall Time 100 ns
Master Mode(3)
TCHCH Clock Period 4 TOSC
TCHCX Clock High Time 1.6 TOSC
TCLCX Clock Low Time 1.6 TOSC
TIVCL, TIVCH Input Data Valid to Clock Edge 50 ns
TCLIX, TCHIX Input Data Hold after Clock Edge 50 ns
TCLOV, TCHOV Output Data Valid after Clock Edge 65 ns
TCLOX, TCHOX Output Data Hold Time after Clock Edge 0 ns
TILIH Input Data Rise Time 2 µs
TIHIL Input Data Fall Time 2 µs
TOLOH Output Data Rise time 50 ns
TOHOL Output Data Fall Time 50 ns
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Waveforms Figure 19. SPI Master Waveforms (SSCPHA = 0)
Note: 1. SS# handled by software.
Figure 20. SPI Master Waveforms (SSCPHA = 1)
Note: 1. Not Defined but normally MSB of character just received.
MISO
(input)
SCK
(SSCPOL = 0)
(output)
SS#(1)
(output)
SCK
(SSCPOL = 1)
(output)
MOSI
(output)
TCHCH
TCLCX
TCHCX
TIVCL TCLIX
TCHIX
TIVCH
TCHOV
TCLOV TCHOX
TCLOX
MSB IN BIT 6 LSB IN
MSB OUTPort Data LSB OUT Port DataBIT 6
TCHCL
TCLCH
MISO
(input)
SCK
(SSCPOL = 0)
(output)
SS#(1)
(output)
SCK
(SSCPOL = 1)
(output)
MOSI
(output)
TCHCH
TCLCX
TCHCX
TIVCL TCLIX
TCHIX
TIVCH
TCHOV
TCLOV TCHOX
TCLOX
MSB IN BIT 6 LSB IN
MSB OUTPort Data LSB OUT Port DataBIT 6
TCHCL
TCLCH
58
TSC8x251G2D 4135C–8051–04/05
Figure 21. SPI Slave Waveforms (SSCPHA = 0)
Note: 1. Not Defined but generally the LSB of the character which has just been received.
Figure 22. SPI Slave Waveforms (SSCPHA = 1)
AC Characteristics - EPROM Programming and Verifying
Definition of Symbols Table 50. EPROM Programming and Verifying Timing Symbol Definitions
TSLCL
TSLCH
TCHCL
TCLCH
MOSI
(input)
SCK
(SSCPOL = 0)
(input)
SS#
(input)
SCK
(SSCPOL = 1)
(input)
MISO
(output)
TCHCH
TCLCX
TCHCX
TIVCL TCLIX
TCHIX
TIVCH
TCHOV
TCLOV TCHOX
TCLOX
MSB IN BIT 6 LSB IN
SLAVE MSB OUT SLAVE LSB OUTBIT 6
TSLOV
(1)
TSHOX
TSHSL
TCHSH
TCLSH
TCHCL
TCLCH
MOSI
(input)
SCK
(SSCPOL = 0)
(input)
SS#
(input)
SCK
(SSCPOL = 1)
(input)
MISO
(output)
TCHCH
TCLCX
TCHCX
TIVCL TCLIX
TCHIX
TIVCH
TCLOV
TCHOV TCLOX
TCHOX
MSB IN BIT 6 LSB IN
SLAVE MSB OUT SLAVE LSB OUTBIT 6
TSLOV
(1)
TSHOX
TSHSL
TCHSH
TCLSH
TSLCL
TSLCH
Signals Conditions
A Address H High
E Enable: mode set on Port 0 L Low
G Program V Valid
Q Data Out X No Longer Valid
S Supply (VPP) Z Floating
59
TSC8x251G2D
4135C–8051–04/05
Timings Table 51. EPROM Programming AC timings; VDD = 4.5 to 5.5 V, TA = 0 to 40°C
Table 52. EPROM Verifying AC timings; VDD = 4.5 to 5.5 V, VDD = 2.7 to 5.5 V, T A = 0 to
40°C
Waveforms
Figure 23. EPROM Programming Waveforms
Symbol Parameter Min Max Unit
TOSC XTAL1 Period 83.5 250 ns
TAVGL Address Setup to PROG# low 48 TOSC
TGHAX Address Hold after PROG# low 48 TOSC
TDVGL Data Setup to PROG# low 48 TOSC
TGHDX Data Hold after PROG# 48 TOSC
TELSH ENABLE High to VPP 48 TOSC
TSHGL VPP Setup to PROG# low 10 µs
TGHSL VPP Hold after PROG# 10 µs
TSLEH ENABLE Hold after VPP 0ns
TGLGH PROG# Width 90 110 µs
Symbol Parameter Min Max Unit
TOSC XTAL1 Period 83.5 250 ns
TAVQV Address to Data Valid 48 TOSC
TAXQX Address to Data Invalid 0 ns
TELQV ENABLE low to Data Valid 0 48 TOSC
TEHQZ Data Float after ENABLE 0 48 TOSC
TSLEH
TELSH
TDVGL
TSHGL
TAVGL TGHAX
TGHDX
TGLGH TGHSL
VPP
VDD
VSS
P1 = A15:8
P3 = A7:0
P2 = D7:0
EA#/VPP
ALE/PROG#
P0 Mode = 68h, 69h, 6Bh or 6Ch
Data
Address
60
TSC8x251G2D 4135C–8051–04/05
Figure 24. EPROM Verifying Waveforms
AC Characteristics - External Clock Drive and Logic Level References
Definition of Symbols Table 53. External Clock Timing Symbol Definitions
Timings Table 54. External Clock AC Timings; VDD = 4.5 to 5.5 V, TA = -40 to +85°C
Waveforms Figure 25. External Clock Waveform
Notes: 1. During AC testing, all inputs are driven at VDD -0.5 V for a logic 1 and 0.45 V for a
logic 0.
2. T iming measurements are made on all outputs at VIH min for a logic 1 and VIL max for
a logic 0.
TEHQZ
TELQV
TAVQV TAXQX
P1 = A15:8
P3 = A7:0
P2 = D7:0
P0
Address
Mode = 28h, 29h or 2Bh
Data
Signals Conditions
CClock H High
L Low
X No Longer Valid
Symbol Parameter Min Max Unit
FOSC Oscillator Frequency 24 MHz
TCHCX High Time 10 ns
TCLCX Low Time 10 ns
TCLCH Rise Time 3 ns
TCHCL Fall Time 3 ns
0.45 V TCLCL
VDD - 0.5 VIH1
VIL
TCHCX
TCLCH
TCHCL
TCLCX
61
TSC8x251G2D
4135C–8051–04/05
Figure 26. AC Testing Input/Output Waveforms
Note: For timing purposes, a port pin is no longer floating when a 100 mV change from load
voltage occurs and begins to float when a 100 mV change from the loading VOH/VOL level
occurs with IOL/IOH = ±20 mA.
Figure 27. Float Waveforms
0.45 V
VDD - 0.5 0.2 VDD + 0.9
0.2 VDD - 0.1
VIH min
VIL max
INPUTS OUTPUTS
VLOAD
VOH - 0.1 V
VOL + 0.1 V
VLOAD + 0.1 V
VLOAD - 0.1 V Timing Reference Points
62
TSC8x251G2D 4135C–8051–04/05
Absolute Maximum Rating and Operating Conditions
Absolute Maximum Ratings
Storage Temperature......................................... -65 to +150°C
Voltage on any other Pin to VSS ........................-0.5 to +6.5 V
IOL per I/O Pin................................................................ 15 mA
Power Dissipation........................................................... 1.5 W
Ambient Temperature Under Bias
Commercial............. ... ...................... ... ... ..................0 to +70°C
Industrial.............................................................. -40 to +85°C
VDD
High Speed versions.............................................. 4.5 to 5.5 V
Low Voltage versions............................................. 2.7 to 5.5 V
*NOTICE: Stressing the device beyond the “Absolute Maxi-
mum Ratings” may cause permanent damage.
These are stress ratings only. Operation beyond
the “operating conditi ons” is not recommen ded
and extended exposure beyond the “Op erating
Conditions” may affect device reliability.
63
TSC8x251G2D
4135C–8051–04/05
DC Characteristics
High Speed Versions - Commercial & Industrial
Table 55. DC Characteristics; VDD = 4.5 to 5.5 V, TA = -40 to +85°C
Symbol Parameter Min Typical(4) Max Units Test Cond itions
VIL Input Low Voltage
(except EA#, SCL, SDA) -0.5 0.2·VDD - 0.1 V
VIL1(5) Input Low Voltage
(SCL, SDA) -0.5 0.3·VDD V
VIL2 Input Low Voltage
(EA#) 0 0.2·VDD - 0.3 V
VIH Input high Voltage
(except XTAL1, RST, SCL, SDA) 0.2·VDD + 0.9 VDD + 0.5 V
VIH1(5) Input high Voltage
(XTAL1, RST, SCL, SDA) 0.7·VDD VDD + 0.5 V
VOL Output Low Voltage
(Ports 1, 2, 3)
0.3
0.45
1.0 VIOL = 100 µA(1)(2)
IOL = 1.6 mA(1)(2)
IOL = 3.5 mA(1)(2)
VOL1
Output Low Voltage
(Ports 0, ALE, PSEN#, Port 2 in Page Mode during
External Address)
0.3
0.45
1.0 VIOL = 200 µA(1)(2)
IOL = 3.2 mA(1)(2)
IOL = 7.0 mA(1)(2)
VOH Output high Voltage
(Ports 1, 2, 3, ALE, PSEN#)
VDD - 0.3
VDD - 0.7
VDD - 1.5 VIOH = -10 µA(3)
IOH = -30 µA(3)
IOH = -60 µA(3)
VOH1 Output high Voltage
(Port 0, Port 2 in Page Mode during External Address)
VDD - 0.3
VDD - 0.7
VDD - 1.5 VIOH = -200 µA
IOH = -3.2 mA
IOH = -7.0 mA
VRET VDD data retention limit 1.8 V
IIL0 Logical 0 Input Current
(Ports 1, 2, 3) - 50 µAV
IN = 0.45 V
IIL1 Logical 1 Input Current
(NMI) + 50 µAV
IN = VDD
ILI Input Leakage Current
(Port 0) ± 10 µA0.45 V < V
IN < VDD
ITL Logical 1-to-0 Transition Current
(Ports 1, 2, 3 - AWAIT#) - 650 µAV
IN = 2.0 V
RRST RST Pull-Down Resistor 40 110 225 kΩ
CIO Pin Capacitance 10 pF TA = 25°C
IDD Operating Current 20
25
35
25
30
40 mA FOSC = 12 MHz
FOSC = 16 MHz
FOSC = 24 MHz
IDL Idle Mode Current 5
6.5
9.5
6
8
12 mA FOSC = 12 MHz
FOSC = 16 MHz
FOSC = 24 MHz
IPD Power-Down Current 2 20 µAV
RET < VDD < 5.5 V
VPP Programming supply voltage 12.5 13 V TA = 0 to +40°C
IPP Programming supply current 75 mA TA = 0 to +40°C
64
TSC8x251G2D 4135C–8051–04/05
Notes: 1. Under steady-state (non-transient) conditions, IOL must be externally limited as follow s:
Maximum IOL per port pin: 10 mA
Maximum IOL per 8-bit port:Port 0 26 mA
Ports 1-3 15 mA
Maximum Total IOL for all: Output Pins 71 mA
If IOL exceeds the test conditions, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test
conditions.
2. Capacitive loading on Ports 0 and 2 may cause spurious noise pulses above 0.4 V on the low-level outputs of ALE and Ports
1, 2, and 3. The noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins change
from high to low. In appli cations where capacitive loading exceeds 100 pF, the noise pulses o n these signals may exceed
0.8 V. It may be desirable to qualify ALE or other signals with a Schmitt Trigger or CMOS-level input logic.
3. Capacitive loading on Ports 0 and 2 causes the VOH on ALE and PSEN# to drop below the specification when the address
lines are stabilizing.
4. Typical values are obtained using VDD = 5 V and TA = 25°C. They are not tested and there is not guarantee on these values.
5. The input threshold voltage of SCL and SDA meets the TWI specification, so an input voltage below 0.3·VDD will be recog-
nized as a logic 0 while an input voltage above 0.7·VDD will be recognized as a logic 1.
Figure 28. IDD/IDL Versus Frequency; VDD = 4.5 to 5.5 V
Note: 1. The clock prescaler is not used: FOSC = FXTAL.
max Active mode (mA)
typ Active mode (mA)
max Idle mode (mA)
typ Idle mode (mA)
40
30
20
10
0
IDD/IDL (mA)
Frequency at XTAL(1) (MHz)
2 4 6 8 10 12 14 16 18 20 22 24
65
TSC8x251G2D
4135C–8051–04/05
Low Voltage Versions - Commercial & Industrial
Notes: 1. Under steady-state (non-transient) conditions, IOL must be externally limited as follow s:
Maximum IOL per port pin: 10 mA
Maximum IOL per 8-bit port: Port 0 26 mA
Ports 1-315 mA
Table 56. DC Characteristics; VDD = 2.7 to 5.5 V, TA = -40 to +85°C
Symbol Parameter Min Typical(4) Max Units Test Conditions
VIL Input Low Voltage
(except EA#, SCL, SDA) -0.5 0.2·VDD - 0.1 V
VIL1(5) Input Low Voltage
(SCL, SDA) -0.5 0.3·VDD V
VIL2 Input Low Voltage
(EA#) 0 0.2·VDD - 0.3 V
VIH Input high Voltage
(except XTAL1, RST, SCL, SDA) 0.2·VDD + 0.9 VDD + 0.5 V
VIH1(5) Input high Voltage
(XTAL1, RST, SCL, SDA) 0.7·VDD VDD + 0.5 V
VOL Output Low Voltage
(Ports 1, 2, 3) 0.45 V IOL = 0.8 mA(1)(2)
VOL1
Output Low Voltage
(Ports 0, ALE, PSEN#, Port 2 in Page
Mode during External Address) 0.45 V IOL = 1.6 mA(1)(2)
VOH Output high Voltage
(Ports 1, 2, 3, ALE, PSEN#) 0.9·VDD VI
OH = -10 µA(3)
VOH1
Output high Voltage
(Port 0, Port 2 in Page Mode during
External Address) 0.9·VDD VI
OH = -40 µA
VRET VDD data retention limit 1.8 V
IIL0 Logical 0 Input Current
(Ports 1, 2, 3 - AWAIT#) - 50 µAV
IN = 0.45 V
IIL1 Logical 1 Input Current
(NMI) + 50 µAV
IN = VDD
ILI Input Leakage Current
(Port 0) ± 10 µA 0.45 V < VIN < VDD
ITL Logical 1-to-0 Transition Current
(Ports 1, 2, 3) - 650 µAV
IN = 2.0 V
RRST RST Pull-Down Resistor 40 110 225 kΩ
CIO Pin Capacitance 10 pF TA = 25°C
IDD Operating Current
4
8
9
11
8
11
12
14
mA
5 MHz, VDD < 3.6 V
10 MHz, VDD < 3.6 V
12 MHz, VDD < 3.6 V
16 MHz, VDD < 3.6 V
IDL Idle Mode Current
0.5
1.5
2
3
1
4
5
7
mA
5 MHz, VDD < 3.6 V
10 MHz, VDD < 3.6 V
12 MHz, VDD < 3.6 V
16 MHz, VDD < 3.6 V
IPD Power-Down Current 1 10 µAV
RET < VDD < 3.6 V
66
TSC8x251G2D 4135C–8051–04/05
Maximum Total IOL for all:Output Pins71 mA
If IOL exceeds the test conditions, VOL may exceed the re lated specification. Pins are n ot guaranteed to sink current greater t han the listed test
conditions.
2. Capacitive loading on Ports 0 and 2 may cause spurious noise pulses above 0.4 V on the low-level outputs of ALE and Ports
1, 2, and 3. The noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins change
from high to low. In appli cations where capacitive loading exceeds 100 pF, the noise pulses o n these signals may exceed
0.8 V. It may be desirable to qualify ALE or other signals with a Schmitt Trigger or CMOS-level input logic.
3. Capacitive loading on Ports 0 and 2 causes the VOH on ALE and PSEN# to drop below the specification when the address
lines are stabilizing.
4. Typical values are obtained using VDD = 3 V and TA = 25°C. They are not tested and there is not guarantee on these values.
5. The input threshold voltage of SCL and SDA meets the TWI specification, so an input voltage below 0.3·VDD will be recog-
nized as a logic 0 while an input voltage above 0.7·VDD will be recognized as a logic 1.
Figure 29. IDD/IDL Versus XTAL Frequency; VDD = 2.7 to 3.6 V
Note: 1.The clock prescaler is not used: FOSC = FXTAL.
IDD, IDL and IPD Test Conditions
Figure 30. IDD Test Condition, Active Mode
max Active mode (mA)
typ Active mode (mA)
max Idle mode (mA)
typ Idle mode (mA)
15
10
5
0
IDD/IDL (mA)
Frequency at XTAL(1) (MHz)
2468 1410 12 16
VDD
XTAL2
VDD
Clock Signal
RST
VSS
TSC80251G2D
EA#
XTAL1
VDD
P0
(NC)
IDD
VDD
All other pins are unconnected
67
TSC8x251G2D
4135C–8051–04/05
Figure 31. IDL Test Condition, Idle Mode
Figure 32. IPD Test Condition, Power-Down Mode
XTAL2
VDD
Clock Signal
RST
VSS
TSC80251G2D
EA#
XTAL1
VDD
P0
(NC)
IDL
VDD
All other pins are unconnected
XTAL2
VDDRST
VSS
TSC80251G2D
EA#
XTAL1
VDD
P0
(NC)
IPD
VDD
All other pins are unconnected
68
TSC8x251G2D 4135C–8051–04/05
Packages
List of Packages •PDIL 40
• CDIL 40 with window
• PLCC 44
• CQPJ 44 with window
• VQFP 44 (10x10)
PDIL 40 - Mechanical
Outline Figure 33. Plastic Dual In Line
Table 57. PDIL Package Size
MM Inch
Min Max Min Max
A - 5.08 - .200
A1 0.38 - .015 -
A2 3.18 4.95 .125 .195
B 0.36 0.56 .014 .022
B1 0.76 1.78 .030 .070
C 0.20 0.38 .008 .015
D 50.29 53.21 1.980 2.095
E 15.24 15.87 .600 .625
E1 12.32 14.73 .485 .580
e 2.54 B.S.C. .100 B.S.C.
eA 15.24 B.S.C. .600 B.S.C.
eB - 17.78 - .700
L 2.93 3.81 .115 .150
D1 0.13 - .005 -
69
TSC8x251G2D
4135C–8051–04/05
CDIL 40 with Window -
Mechanical Outline Figure 34. Ceramic Dual In Line
Table 58. CDIL Package Size
MM Inch
Min Max Min Max
A - 5.71 - .225
b 0.36 0.58 .014 .023
b2 1.14 1.65 .045 .065
c 0.20 0.38 .008 .015
D - 53.47 - 2.105
E 13.06 15.37 .514 .605
e 2.54 B.S.C. .100 B.S.C.
eA 15.24 B.S.C. .600 B.S.C.
L 3.18 5.08 .125 .200
Q 0.38 1.40 .015 .055
S1 0.13 - .005 -
a 0 - 15 0 - 15
N40
70
TSC8x251G2D 4135C–8051–04/05
PLCC 44 - Mechanical
Outline Figure 35. Plastic Lead Chip Carrier
Table 59. PLCC Package Size
MM Inch
Min Max Min Max
A 4.20 4.57 .165 .180
A1 2.29 3.04 .090 .120
D 17.40 17.65 .685 .695
D1 16.44 16.66 .647 .656
D2 14.99 16.00 .590 .630
E 17.40 17.65 .685 .695
E1 16.44 16.66 .647 .656
E2 14.99 16.00 .590 .630
e 1.27 BSC .050 BSC
G 1.07 1.22 .042 .048
H 1.07 1.42 .042 .056
J 0.51 - .020 -
K 0.33 0.53 .013 .021
Nd 11 11
Ne 11 11
71
TSC8x251G2D
4135C–8051–04/05
CQPJ 44 with Window -
Mechanical Outline Figure 36. Ceramic Quad Pack J
Table 60. CQPJ Package Size
MM Inch
Min Max Min Max
A - 4.90 - .193
C 0.15 0.25 .006 .010
D - E 17.40 17.55 .685 .691
D1 - E1 16.36 16.66 .644 .656
e 1.27 TYP .050 TYP
f 0.43 0.53 .017 .021
J 0.86 1.12 .034 .044
Q 15.49 16.00 .610 .630
R 0.86 TYP .034 TYP
N1 11 11
N2 11 11
72
TSC8x251G2D 4135C–8051–04/05
VQFP 44 (10x10) -
Mechanical Outline Figure 37. Shrink Quad Flat Pack (Plastic)
Table 61. VQFP Package Size
MM Inch
Min Max Min Max
A - 1.60 - .063
A1 0.64 REF .025 REF
A2 0.64 REF .025REF
A3 1.35 1.45 .053 .057
D 11.90 12.10 .468 .476
D1 9.90 10.10 .390 .398
E 11.90 12.10 .468 .476
E1 9.90 10.10 .390 .398
J 0.05 - .002 6
L 0.45 0.75 .018 .030
e 0.80 BSC .0315 BSC
f 0.35 BSC .014 BSC
73
TSC8x251G2D
4135C–8051–04/05
Ordering Information
TSC80251G2D ROMless
TSC83251G1D 16
kilobytes Mask ROM
Note: 1. xxx: means ROM code, is Cxxx in case of encrypted code.
Part Number ROM Description
High Speed Versions 4.5 to 5.5 V, Commercial and Industrial
TSC80251G2D-16CB ROMless 16 MHz, Commercial 0° to 70°C, PLCC 44
TSC80251G2D-24CB ROMless 24 MHz, Commercial 0° to 70°C, PLCC 44
TSC80251G2D-24CE ROMless 24 MHz, Commercial 0° to 70°C, VQFP 44
TSC80251G2D-24IA ROMless 24 MHz, Industrial -40° to 85°C, PDIL 40
TSC80251G2D-24IB ROMless 24 MHz, Industrial -40° to 85°C, PLCC 44
AT80251G2D-24SLSUM ROMless 24 MHz, Industrial & Green -40° to 85°C, PLCC 44
Low Voltage Versions 2.7 to 5.5 V, Commercial
TSC80251G2D-L16CB ROMless 16 MHz, Commercial, PLCC 44
TSC80251G2D-L16CE ROMless 16 MHz, Commercial, VQFP 44
AT80251G2D-SLSUL ROMless 16 MHz, Industrial & Green, PLCC 44
AT80251G2D-RLTUL ROMless 16 MHz, Industrial & Green, VQFP 44
Part Number(1) ROM Description
High Speed Versions 4.5 to 5.5 V, Commercial and Industrial
TSC251G1Dxxx-16CB 16K MaskROM 16 MHz, Commercial 0° to 70°C, PLCC 44
TSC251G1Dxxx-24CB 16K MaskROM 24 MHz, Commercial 0° to 70°C, PLCC 44
TSC251G1Dxxx-24CE 16K MaskROM 24 MHz, Commercial 0° to 70°C, VQFP 44
TSC251G1Dxxx-24IA 16K MaskROM 24 MHz, Industrial -40° to 85°C, PDIL 40
TSC251G1Dxxx-24IB 16K MaskROM 24 MHz, Industrial -40° to 85°C, PLCC 44
AT251G1Dxxx-SLSUM 16K MaskROM 24 MHz, Industrial & Green -40° to 85°C, PLCC 44
Low Voltage Versions 2.7 to 5.5 V, Commercial
TSC251G1Dxxx-L16CB 16K MaskROM 16 MHz, Commercial 0° to 70°C, PLCC 44
TSC251G1Dxxx-L16CE 16K MaskROM 16 MHz, Commercial 0° to 70°C, VQFP 44
AT251G2Dxxx-SLSUL 16K MaskROM 16 MHz, Industrial & Green, PLCC 44
AT251G2Dxxx-RLTUL 16K MaskROM 16 MHz, Industrial & Green, VQFP 44
74 TSC8x251G2D 4135C–8051–04/05
TSC83251G2D 32
kilobytes MaskROM
Note: 1. xxx: means ROM code, is Cxxx in case of encrypted code.
TSC87251G2D OTPROM
Part Number(1) ROM Description
High Speed Versions 4.5 to 5.5 V, Commercial and Industrial
TSC251G2Dxxx-16CB 32K MaskROM 16 MHz, Commercial 0° to 70°C, PLCC 44
TSC251G2Dxxx-24CB 32K MaskROM 24 MHz, Commercial 0° to 70°C, PLCC 44
TSC251G2Dxxx-24CE 32K MaskROM 24 MHz, Commercial 0° to 70°C, VQFP 44
TSC251G2Dxxx-24IA 32K MaskROM 24 MHz, Industrial -40° to 85°C, PDIL 40
TSC251G2Dxxx-24IB 32K MaskROM 24 MHz, Industrial -40° to 85°C, PLCC 44
AT251G2Dxxx-SLSUM 32K MaskROM 24 MHz, Industrial & Green -40° to 85°C, PLCC 44
Low Voltage Versions 2.7 to 5.5 V, Commercial
TSC251G2Dxxx-L16CB 32K MaskROM 16 MHz, Commercial 0° to 70°C, PLCC 44
TSC251G2Dxxx-L16CE 32K MaskROM 16 MHz, Commercial 0° to 70°C, VQFP 44
AT251G2Dxxx-SLSUL 32K MaskROM 16 MHz, Industrial & Green, PLCC 44
AT251G2Dxxx-RLTUL 32K MaskROM 16 MHz, Industrial & Green, VQFP 44
Part Number ROM Description
High Speed Versions 4.5 to 5.5 V, Commercial and Industrial
TSC87251G2D-16CB 32K OTPROM 16 MHz, Commercial 0° to 70°C, PLCC 44
TSC87251G2D-24CB 32K OTPROM 24 MHz, Commercial 0° to 70°C, PLCC 44
TSC87251G2D-24CED 32K OTPROM 24 MHz, Commercial 0° to 70°C, VQFP 44
TSC87251G2D-24IA 32K OTPROM 24 MHz, Industrial -40° to 85°C, PDIL 40
TSC87251G2D-24IB 32K OTPROM 24 MHz, Industrial -40° to 85°C, PLCC 44
AT87251G2D-SLSUM 32K OTPROM 24 MHz, Industrial & Green -40° to 85°C, PLCC 44
Low Voltage Versions 2.7 to 5.5 V, Commercial
TSC87251G2D-L16CB 32K OTPROM 16 MHz, Commercial 0° to 70°C, PLCC 44
TSC87251G2D-L16CED 32K OTPROM 16 MHz, Commercial 0° to 70°C, VQFP 44
AT87251G2D-SLSXL 32K OTPROM 16 MHz, Commercial & Green, 0° to 70°C, PLCC 44
AT87251G2D-RLTXL 32K OTPROM 16 MHz, Commercial & Green, 0° to 70°C, VQFP 44
75
TSC8x251G2D
4135C–8051–04/05
Options (Please consult Atmel
sales) • ROM code encryption
• Tape & Reel or Dry Pack
• Known good dice
• Extended temperature range: -55°C to +125°C
Product Markings
ROMless versions ATMEL
Customer Part number
Part Number
YYWW . Lot Number
Mask ROM versions ATMEL
Part number
YYWW . Lot Number
OTP versions
ATMEL
Part number
YYWW . Lot Number
Printed on recycled paper.
Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard
warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibi lity for any
errors which may appear in this document , reserves the right to change devices or specifications detailed herein at any time wi thout notice, and
does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are
granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use
as critical components in life support devices or systems.
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Tel: (33) 2-40-18-18-18
Fax: (33) 2-40-18-1 9-60
ASIC/ASSP/Smart Cards
Zone Industrielle
13106 Rousset Cedex, France
Tel: (33) 4-42-53-60-00
Fax: (33) 4-42-53-6 0-01
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR , Scotland
Tel: (44) 1355-803-000
Fax: (44) 1355-2 42-743
RF/Automotive
Theresienstrasse 2
Postfach 3535
74025 Heilbronn, Germany
Tel: (49) 71-31-67-0
Fax: (49) 71-31-67-2340
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Biometrics/Imaging/Hi-Rel MPU/
High Speed Converters/RF Datacom
Avenue de Rochepleine
BP 123
38521 Saint-Egreve Cedex, France
Tel: (33) 4-76-58-30-00
Fax: (33) 4-76-58-3 4-80
e-mail
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Web Site
http://www.atmel.com
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