SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 080 - *31 - B5
Part Number (Details)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
ICP-080-6
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 80 Pins (20x20) 0.5mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N3: These holes are only necessary for use with positioning pins.
Detail C
N3
N1
24.00
12.84 x 12.84
24.00
11.00
13.20
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
12mm x 12mm
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 080 - *30 - B5
Part Number (Details)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
ICP-080-6
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 80 Pins (20x20) 0.5mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N3: These holes are only necessary for use with positioning pins.
N3
N1
25.00
13.24 x 13.24
25.00
11.00
13.20
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
14.0
12.0
12mm x 12mm
2.80
max.
12.0
14.0
0.5
0.20 ±0.05 0.5
13 x 13 ±0.2
0.15 ±0,05
0.15 ±0.05
2.076
0.20 ±0.05
Detail for
Plastic Package Detail for
Ceramic Package
See Package Details Detail C
Detail C
Detail C
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: PTES, glass filled UL94V-0
Contact: Phosphor Bronze
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni
ICP-080-6
Adapter Part Number
Outline Adapter Dimensions (Reference Only)
Adapter PCB-Layout (IC149-80-*31-B5 and IC149-80-*30-B5)
Compatible Socket (Part No.)
27.00 8.08
27.00
2.4
14.50
14.50
Note: No conduits within this hatched area.
Emulation-Adapter (80 pins)
IC149-80-030-B5 (w/o pos. pins)
IC149-80-130-B5 (with pos. pins)
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. Careful attention must be taken when fixing the Adapter,
since it is made from thermoplastic material.
By exceeding the maximum torque a perfect performance can
no longer be guaranteed.
Remarks
Top View from Soldering Side
IC149 / ICP Series
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 080 - *51 - B5
Part Number (Details)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
ICP-080-7
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 80 Pins (20x20) 0.65mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N3: These holes are only necessary for use with positioning pins.
Detail C
N3
N1
28.00
15.30 x 15.30
28.00
11.00
12.60
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
Detail C
14mm x 14mm
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: PTES, glass filled UL94V-0
Contact: Phosphor Bronze
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni
ICP-080-7
Adapter Part Number
Compatible Socket (Part No.)
Note: No conduits within this hatched area.
Emulation-Adapter (80 pins)
IC149-80-051-B5 (w/o pos. pins)
IC149-80-151-B5 (with pos. pins)
Outline Adapter Dimensions (Reference Only)
28.00 8.08
28.00
2.4
16.50
16.50
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. Careful attention must be taken when fixing the Adapter,
since it is made from thermoplastic material.
By exceeding the maximum torque a perfect performance can
no longer be guaranteed.
Remarks
Adapter PCB-Layout (IC149-80-*51-B5) Top View from Soldering Side
IC149 / ICP Series
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 080 - *17 - B5
Part Number (Details)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B 5= Au over Ni
ICP-080-4
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 80 Pins (20x20) 0.65mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N3: These holes are only necessary for use with positioning pins.
N3
26.00
16.30 x 16.30
26.00
8.10
9.70
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
14mm x 14mm
14.0
17.2
0.65
17.2
14.0
3.0
15.6 • 15.6
0.15
0.3 0.8
Coding Detail C
Detail C
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: PTES, glass filled UL94V-0
Contact: Phosphor Bronze
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni
ICP-080-4
Adapter Part Number
Outline Adapter Dimensions (Reference Only)
Adapter PCB-Layout (IC149-80-*17-B5)
Compatible Socket (Part No.)
29.32 6.20
29.32
2.4
25.53
25.53
Remarks
Note: No conduits within this hatched area.
Emulation-Adapter (80 pins)
IC149-80-017-B5 (w/o pos. pins)
IC149-80-117-B5 (with pos. pins)
15.00
15.00
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. Careful attention must be taken when fixing the Adapter,
since it is made from thermoplastic material.
By exceeding the maximum torque a perfect performance can
no longer be guaranteed.
Remarks
Top View from Soldering Side
IC149 / ICP Series
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 080 - *21 - B5
Part Number (Details)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
ICP-080-5
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 80 Pins (16x24) 0.8mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N3: These holes are only necessary for use with positioning pins.
N4: The Socket may be glued to the PC Board within this area.
32.20
22.40 x 16.40
26.20
8.50
10.10
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
14mm x 20mm
21.9 • 15.9
17.2
14.0
0.8
20.0
23.2
2.7
0.15
0.65
Detail F
Detail F
Coding N3
N4
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: PTES, glass filled UL94V-0
Contact: Phosphor Bronze
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni
ICP-080-5
Adapter Part Number
Outline Adapter Dimensions (Reference Only)
Adapter PCB-Layout (IC149-80-*21-B5)
Compatible Socket (Part No.)
36.62 6.20
30.62
2.4
26.42
32.42
Note: No conduits within this hatched area.
Emulation-Adapter (80 pins)
IC149-80-021-B5 (w/o pos. pins)
IC149-80-121-B5 (with pos. pins)
21.90
15.90
N5
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. Careful attention must be taken when fixing the Adapter,
since it is made from thermoplastic material.
By exceeding the maximum torque a perfect performance can
no longer be guaranteed.
Remarks
Top View from Soldering Side
IC149 / ICP Series
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 080 - *12 - B5
Part Number (Details)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
ICP-080-3
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 80 Pins (16x24) 0.8mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized by soldering (Reflow) in these 4 areas.
N2: These holes are only necessary when fixing the Socket with screws.
N3: These holes are only necessary for use with positioning pins.
N4: The Socket may be glued to the PC Board within this area.
32.20
23.17 x 23.17
26.20
11.50
13.10
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
24.8±0.4
14mm x 20mm
22.9 • 17.0
3,05
max.
18.8±0.4
14.0±0.2
0.8
20.0±0.2
0.15
0.35
N2
N3
N4
Detail E
Detail E
Coding
1.60
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: PTES, glass filled UL94V-0
Contact: Phosphor Bronze
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni
ICP-080-3
Adapter Part Number
Outline Adapter Dimensions (Reference Only)
Adapter PCB-Layout (IC149-80-*12-B5 )
IC149 / ICP Series
Compatible Socket (Part No.)
36.62 6.20
30.62
2.4
26.42
32.42
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. Careful attention must be taken when fixing the Adapter,
since it is made from thermoplastic material.
By exceeding the maximum torque a perfect performance can
no longer be guaranteed.
Remarks
Note: No conduits within this hatched area.
Emulation-Adapter (80 pins)
IC149-80-012-B5 (w/o pos. pins)
IC149-80-112-B5 (with pos. pins)
21.90
15.90
Top View from Soldering Side
