INTEGRATED CIRCUITS DATA SHEET TDA8541 1 W BTL audio amplifier Product specification Supersedes data of 1997 Feb 19 1998 Apr 01 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 FEATURES GENERAL DESCRIPTION * Flexibility in use The TDA8541(T) is a one channel audio power amplifier for an output power of 1 W with an 8 load at a 5 V supply. The circuit contains a BTL amplifier with a complementary PNP-NPN output stage and standby/mute logic. The TDA8541T comes in an 8 pin SO package and the TDA8541 in an 8 pin DIP package. * Few external components * Low saturation voltage of output stage * Gain can be fixed with external resistors * Standby mode controlled by CMOS compatible levels * Low standby current * No switch-on/switch-off plops APPLICATIONS * High supply voltage ripple rejection * Portable consumer products * Protected against electrostatic discharge * Personal computers * Outputs short-circuit safe to ground, VCC and across the load * Telephony. * Thermally protected. QUICK REFERENCE DATA SYMBOL PARAMETER VCC supply voltage Iq quiescent current Istb standby current CONDITIONS VCC = 5 V MIN. TYP. MAX. UNIT 2.2 5 18 V - 8 12 mA - - 10 A Po output power THD = 10%; RL = 8 ; VCC = 5 V 1 1.2 - W THD total harmonic distortion Po = 0.5 W - 0.15 - % SVRR supply voltage ripple rejection 50 - - dB ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA8541T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TDA8541 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 1998 Apr 01 2 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 BLOCK DIAGRAM PINNING SYMBOL PIN DESCRIPTION MODE 1 operating mode select (standby, mute, operating) SVR 2 half supply voltage, decoupling ripple rejection IN+ 3 positive input IN- 4 negative input OUT- 5 negative loudspeaker terminal VCC 6 supply voltage handbook, halfpage TDA8541 - IN- IN+ 4 3 5 - + OUT- R VCC 6 R 20 k SVR - - 8 OUT+ 20 k MODE 7 ground OUT+ 8 positive loudspeaker terminal + 2 1 GND handbook, halfpage STANDBY/MUTE LOGIC MODE 1 SVR 2 8 OUT+ 7 GND TDA8541 7 IN+ 3 6 VCC IN- 4 5 OUT- GND MGB972 MGB971 Fig.2 Pin configuration. Fig.1 Block diagram. FUNCTIONAL DESCRIPTION Mode select pin The TDA8541(T) is a BTL audio power amplifier capable of delivering 1 W output power to an 8 load at THD = 10% using a 5 V power supply. Using the MODE pin the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism. The gain can be set within a range from 6 dB to 30 dB by external feedback resistors. The device is in standby mode (with a very low current consumption) if the voltage at the MODE pin is >(VCC - 0.5 V), or if this pin is floating. At a MODE voltage level of less than 0.5 V the amplifier is fully operational. In the range between 1.5 V and VCC - 1.5 V the amplifier is in mute condition. The mute condition is useful to suppress plop noise at the output, caused by charging of the input capacitor. Power amplifier The power amplifier is a Bridge Tied Load (BTL) amplifier with a complementary PNP-NPN output stage. The voltage loss on the positive supply line is the saturation voltage of a PNP power transistor, on the negative side the saturation voltage of an NPN power transistor. The total voltage loss is <1 V and with a 5 V supply voltage and an 8 loudspeaker an output power of 1 W can be delivered. 1998 Apr 01 3 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT -0.3 +18 V -0.3 VCC + 0.3 V - 1 A -55 +150 C operating ambient temperature -40 +85 C Vpsc AC and DC short-circuit safe voltage - 10 V Ptot total power dissipation SO8 - 0.8 W DIP8 - 1.2 W VCC supply voltage VI input voltage IORM repetitive peak output current Tstg storage temperature Tamb operating non-operating QUALITY SPECIFICATION In accordance with "SNW-FQ-611-E". The number of the quality specification can be found in the "Quality Reference Handbook". The handbook can be ordered using the code 9397 750 00192. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER CONDITIONS VALUE UNIT TDA8541T (SO8) 160 K/W TDA8541 (DIP8) 100 K/W thermal resistance from junction to ambient in free air DC CHARACTERISTICS VCC = 5 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC supply voltage operating 2.2 5 18 V Iq quiescent current RL = ; note 1 - 8 12 mA Istb standby current VMODE = VCC - - 10 A VO DC output voltage note 2 - 2.2 - V VOUT+ - VOUT- differential output voltage offset - - 50 mV IIN+, IIN- input bias current - - 500 nA VMODE input voltage mode select V IMODE input current mode select operating 0 - 0.5 mute 1.5 - VCC - 1.5 V standby VCC - 0.5 - VCC V 0 < VMODE < VCC - 20 A - Notes 1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. 2. The DC output voltage with respect to ground is approximately 0.5 x VCC. 1998 Apr 01 4 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 AC CHARACTERISTICS VCC = 5 V; Tamb = 25 C; RL = 8 ; f = 1 kHz; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise specified. SYMBOL Po PARAMETER output power CONDITIONS 1 1.2 - W 0.9 - W - 0.15 0.3 % note 1 differential input impedance Vno noise output voltage SVRR supply voltage ripple rejection Vo output voltage in mute condition UNIT 0.6 Po = 0.5 W closed loop voltage gain MAX. THD = 10% total harmonic distortion Gv TYP. THD = 0.5% THD Zi MIN. 6 - 30 dB - 100 - k note 2 - - 100 V note 3 50 - - dB note 4 40 - - dB note 5 - - 200 V Notes 1. Gain of the amplifier is 2 x R2/R1 in test circuit of Fig.3. 2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance of RS = 0 at the input. 3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. 4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. 5. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise. 1998 Apr 01 5 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 TEST AND APPLICATION INFORMATION SE application Test conditions Tamb = 25 C if not specially mentioned, VCC = 7.5 V, f = 1 kHz, RL = 4 , Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. Because the application can be either Bridge-Tied Load (BTL) or Single-Ended (SE), the curves of each application are shown separately. The SE application diagram is shown in Fig.13. For Tamb = 60 C the maximum total power dissipation is: The capacitor value of C3 in combination with the load impedance determines the low frequency behaviour. The total harmonic distortion as a function of frequency was measured with low-pass filter of 80 kHz. The value of capacitor C2 influences the behaviour of the SVRR at low frequencies, increasing the value of C2 increases the performance of the SVRR. 150 - 60 ---------------------- = 0.9 W . 100 General remark The thermal resistance = 100 K/W for the DIP8 envelope; the maximum sine wave power dissipation for Tamb = 25 C is: 150 - 25 ---------------------- = 1.25 W . 100 The frequency characteristic can be adapted by connecting a small capacitor across the feedback resistor. To improve the immunity of HF radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor (56 k); this creates a low-pass filter. BTL application Tamb = 25 C if not specially mentioned, VCC = 5 V, f = 1 kHz, RL = 8 , Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. The BTL application diagram is shown in Fig.3. The quiescent current has been measured without any load impedance. The total harmonic distortion as a function of frequency was measured with a low-pass filter of 80 kHz. The value of capacitor C2 influences the behaviour of the SVRR at low frequencies, increasing the value of C2 increases the performance of the SVRR. The figure of the mode select voltage (Vms) as a function of the supply voltage shows three areas; operating, mute and standby. It shows, that the DC-switching levels of the mute and standby respectively depends on the supply voltage level. 1998 Apr 01 6 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 BTL APPLICATION handbook, full pagewidth VCC C1 R2 R1 56 k 6 IN- 1 F 11 k 4 5 IN+ Vin OUT- 3 RL TDA8541 SVR C2 47 F 100 F 100 nF 2 8 MODE OUT+ 1 7 GND MBH881 R2 Gain = 2 x -------R1 Fig.3 BTL application. MGD876 15 MGD877 10 handbook, halfpage handbook, halfpage Iq (mA) THD (%) (1) 10 1 5 10-1 10-2 10-2 0 0 4 8 12 20 16 VCC (V) 1 Po (W) f = 1 kHz, Gv = 20 dB. (1) VCC = 5 V, RL = 8 . (2) VCC = 9 V, RL = 16 . RL = . Fig.4 Iq as a function of VCC. 1998 Apr 01 10-1 (2) Fig.5 THD as a function of Po. 7 10 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 MGD878 10 MGD879 -20 handbook, halfpage handbook, halfpage THD (%) SVRR (dB) 1 -40 (1) (2) (1) (2) 10-1 -60 10-2 10 103 102 104 f (Hz) (3) -80 10 105 102 103 104 f (Hz) 105 VCC = 5 V, 8 , Rs = 0 , Vi = 100 mV. (1) Gv = 30 dB. (2) Gv = 20 dB. (3) Gv = 6 dB. Po = 0.5 W, Gv = 20 dB. (1) VCC = 5 V, RL = 8 . (2) VCC = 9 V, RL = 16 . Fig.6 THD as a function of frequency. Fig.7 SVRR as a function of frequency. MGD880 2.5 MGD881 2 handbook, halfpage handbook, halfpage Po (W) 2 P (W) 1.5 (1) (2) 1.5 (1) (2) 1 1 0.5 0.5 0 0 0 4 8 VCC (V) 12 0 8 VCC (V) 12 (1) RL = 8 . (2) RL = 16 . THD = 10%. (1) RL = 8 . (2) RL = 16 . Fig.9 Fig.8 Po as a function of VCC. 1998 Apr 01 4 8 Worst case power dissipation as a function of VCC. NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 MGD882 1.6 MGD883 10 o (V) 1 handbook, halfpage handbook, V halfpage P (W) (1) 1.2 10-1 10-2 0.8 (1) (2) (3) (2) 10-3 10-4 0.4 10-5 10-6 10-1 0 0 0.5 1 1.5 2 Po (W) 2.5 Fig.10 P as a function of Po. MGL070 16 Vms (V) 12 standby 8 mute 4 operating 0 8 12 VP (V) 16 Fig.12 Vms as a function of VP. 1998 Apr 01 Vms (V) Fig.11 Vo as a function of Vms. handbook, halfpage 4 10 Band-pass = 22 Hz to 22 kHz. (1) VCC = 3 V. (2) VCC = 5 V. (3) VCC = 12 V. Sine wave of 1 kHz. (1) VCC = 9 V, RL = 16 . (2) VCC = 5 V, RL = 8 . 0 1 9 102 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 SE APPLICATION handbook, full pagewidth VCC C1 R2 R1 110 k 6 IN- 1 F 11 k 4 IN+ Vin 5 3 470 F 2 MODE C3 OUT- TDA8541 SVR C2 47 F 100 F 100 nF 8 1 RL OUT+ 7 GND MBH882 Gain = R2 -------R1 Fig.13 SE application. MGD884 10 MGD885 10 handbook, halfpage handbook, halfpage THD (%) THD (%) 1 1 (1) (1) (2) 10-1 10-1 (3) (2) (3) 10-2 10-2 10-1 1 Po (W) 10-2 10 10 f = 1 kHz, Gv = 20 dB. (1) VCC = 7.5 V, RL = 4 . (2) VCC = 9 V, RL = 8 . (3) VCC = 12 V, RL = 16 . 103 104 f (Hz) 105 Po = 0.5 W, Gv = 20 dB. (1) VCC = 7.5 V, RL = 4 . (2) VCC = 9 V, RL = 8 . (3) VCC = 12 V, RL = 16 . Fig.14 THD as a function of Po. 1998 Apr 01 102 Fig.15 THD as a function of frequency. 10 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 MGD886 -20 MGD887 2 handbook, halfpage handbook, halfpage Po (W) SVRR (dB) 1.6 -40 (1) (3) (2) 1.2 (1) 0.8 (2) -60 (3) -80 10 102 0.4 103 104 f (Hz) 0 105 0 VCC = 7.5 V, RL = 4 , Rs = 0 , Vi = 100mV. (1) Gv = 24 dB. (2) Gv = 20 dB. (3) Gv = 0 dB. 4 8 12 VCC (V) 16 (1) THD = 10%, RL = 4 . (2) THD = 10%, RL = 8 . (3) THD = 10%, RL = 16 . Fig.16 SVRR as a function of frequency. Fig.17 Po as a function of VCC. MGD888 1.6 MGD889 1.2 handbook, halfpage handbook, halfpage P (W) (1) P (W) (2) 1.2 0.8 (3) (1) (2) (3) 0.8 0.4 0.4 0 0 0 4 8 12 VCC (V) 16 0 (1) RL = 4 . (2) RL = 8 . (3) RL = 16 . 0.8 1.2 Po (W) 1.6 (1) VCC = 7.5 V, RL = 4 . (2) VCC = 12 V, RL = 16 . (3) VCC = 9 V, RL = 8 . Fig.18 Worst case power dissipation as a function of VCC. 1998 Apr 01 0.4 Fig.19 Power dissipation as a function of Po. 11 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 handbook, full pagewidth a. Top view. 6.8 k MS 6.8 k 1 IN 1 F 11 k 8 TDA8541 4 5 OUT+ OUT- 56 k 100 nF 47 F 100 F +VP MBH920 b. Component side. Fig.20 Printed-circuit board layout (BTL and SE). 1998 Apr 01 12 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 PACKAGE OUTLINES SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 1998 Apr 01 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 13 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.02 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT97-1 050G01 MO-001 SC-504-8 1998 Apr 01 14 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 SOLDERING Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE * The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998 Apr 01 15 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe 1998 Apr 01 16 NXP Semiconductors Product specification 1 W BTL audio amplifier TDA8541 Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 1998 Apr 01 17 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com (c) NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545102/00/05/pp18 Date of release: 1998 Apr 01 Document order number: 9397 750 03352