Pins 2.54 mm (0.100 in.) Centerline BergPin Solder-to-Board Terminal Features Mating Data Application Equipment = Made from drawn square wire with a Mates with all receptacles requiring a Description Page maximum corner radius of 0.05 mm 0.64 mm (0.025 in.) square pin. BP-155 Semi . (0.002 in.) for wire wrapping. Deae cere automatic Pantograph =" Hole diameter is 0.81 mm (0.032 in.). Specifications BP-161C Semi-automatic insertion = Awide range of application machines machine 13-119 is available. =" MIL-G-45204 = MIL-P-55110 nena s Available in a variety of platings and = MIL-P-81728 = MIL-P-45209 OP ne Computer-controlled eo. erm an sel alloy with = MIL-STD-275 | MILSTDWGO 000 = GX palladium-nickel alloy wit . -B-750 gold flash), a Berg Electronics gold aa equivalent plating, ensures high cycle life and excellent solderability. Approvals and = Packaged in reels or bags of loose Certifications pieces. SAA File no. E66906 G- File no. LR46923 Technical Data Materials Contact resistance............0..0ccee eee 15 mQ max Contact.......... Drawn wire 0.64 mm (0.025 in.) square, = Withstanding voltage ................... 1000 V ac rms 3/4-hard phosphor-bronze = = Current rating Dimensions > Mated with Mini Py beeen eee 3 amp de continuous . . > Mated with Maxi PV ........... 5 amp dc continuous Corner radius ................- 0.05 mm (0.002 in.) max . PCB thickness.................0005 1.58 mm (0.062 in.) Plating . . to 3.18 mm (0.125 in.) @ Finish ........ 2c eee e ee eee 0.38 ym (15 pin.) gold over = PCB hole diameter (finished) 1.27 pm (50 pin.) nickel > 1.59 mm (0.062 in.) thick PCB ........ 0.81 +0.05 mm or 0.76 pm (30 pin.) gold over 1.27 ym (50 pin.) nickel (0.032 +0.002 in.) or 1.27 pm (50 pin.) gold over 1.27 pm (50 pin.) nickel * 2.38 mm (0.093 in.} thick PCB ........ 0.86 +0.05 mm or 0.76 pm (30 isin.) GXT over 1.27 um (50 pin.) nickel (0.034 +0.002 in.) or 3.81 pm (150 pin.) tin-lead (93/7) > 3.18 mm (0.125 in.) thick PCB ........ 0.86 +0.05 mm . A (0.034 #0.002 in.) Operating Environment . = Temperature range................0-0. -40C to +125C Mechanical Performance Packaci Contact retention force.............. 8.9--89 N (2--20 Ibf) ackaging (before soldering, staked in G-10 glass epoxy PWB) = Reels ; . at ; . Electrical Performance Antistatic bags (loose piece) = Insulation resistance.............-...0005 5000 MQ min Customer Support Materials Description Order No. Description Order No. Customer Product Drawings. .............. By Part No. Product Samples..............-02 0 cae Upon Request Product Specifications. ............-...005 BUS-12-064 13-106 BergCon Berg Electronics 1-800-237-2374 Pins 2.54 mm (0.100 in.) . . Description 0.635 mm 0.3302 mm (0.025 in.) - [ : (0.013 in.) MAX 0.0254 mm i (0.001 in.) FEF 0.9906 mm (0.039 in.) | rs + 0.127 mm He (oom) /~ (0.005 in.) .010 in. 1.5748 . {0.062 nt - 0.264 me REF fi 90 REF \ (0.010 in.) 1 pO, Ty 0.0508 mm 0.8636 mm (0.002 in.) {0.034 in.) 0.254 | L+ oor tin} T a SECTION A-A {SHOWING RETENTION AREA) casas ozs Ordering Data ONOOOO-xXXx Base number specifies plating and H4_,~ fo Dash number specifies pin length. packaging options. Package Gold GXT | Tin-Lead | 0.38 ym (15 pin.) 0.76 ym (30 pin.) =; 1.27 pm {50 pin.) 0.76 pm (30 pin.) 3.81 ym (150 in.) Reel 75409 75401 78403 75405 75404 Loase piece 76159 76151 \ 76156 76154 *Dimension H decreases by 0.38 mm (0.015 in.) for 2.39 mm (0.93 in.) PCBs and by 0.76 mm (0.030 in.) for 3.18 mm (0.125 in.) PCBs. Ordering data shown is for our standard product offering. For special sizes or high-volume orders, contact your authorized Berg Electronics representative. Berg Electronics 1-800-237-2374 BergCon 13-107