VIN (V)
EFFICIENCY (%)
100
95
90
85
80
10 15 20 25 30
User's Guide
SNVA398AAugust 2009Revised May 2013
AN-1969 LM3424 Boost Evaluation Board
1 Introduction
This evaluation board showcases the LM3424 NFET controller used with a boost current regulator. It is
designed to drive 9 to 12 LEDs at a maximum average LED current of 1A from a DC input voltage of 10 to
26V.
The evaluation board showcases many of the LM3424 features including thermal foldback, analog
dimming, external switching frequency synchronization, and high frequency PWM dimming, among others.
There are many external connection points to facilitate the full evaluation of the LM3424 device including
inputs, outputs and test points. Refer to Table 1 for a summary of the connectors and test points.
The boost circuit can be easily redesigned for different specifications by changing only a few components
(see Alternate Designs). Note that design modifications can change the system efficiency for better or
worse.
This application note is designed to be used in conjunction with the LM3424 Constant Current N-Channel
Controller with Thermal Foldback for Driving LEDs (SNVS603) data sheet as a reference for the LM3424
boost evaluation board and for a comprehensive explanation of the device, design procedures, and
application information.
2 Key Features
Input: 10V to 26V
Output: 9 to 12 LEDs at 1A
Thermal Foldback / Analog Dimming
PWM Dimming up to 30 kHz
External Synchronization > 360 kHz
Input Under-voltage and Output Over-voltage Protection
Figure 1. Efficiency with 6 Series LEDS AT 1A
All trademarks are the property of their respective owners.
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External Connection Descriptions
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3 External Connection Descriptions
Table 1. Connectors and Test Points
Qty Name Description Application Information
J1 VIN Input Voltage Connect to positive terminal of supply voltage.
J2 GND Input Ground Connect to negative terminal of supply voltage (GND).
J3 EN Enable On/Off Jumper connected enables device.
J4 LED+ LED Positive Connect to anode (top) of LED string.
J5 LED- LED Negative Connect to cathode (bottom) of LED string.
J6 BNC Dimming Input Connect a 3V to 10V PWM input signal up to 10 kHz for PWM dimming the LED load.
J7 OUT Output with NTC Alternative connector for LED+ and LED-. Pins 4 and 11 are used for connecting an
external NTC thermistor. Refer to schematic for detailed connectivity.
TP1 SW Switch Node Test point for switch node (where Q1, D1, and L1 connect).
Voltage
TP3 SGND Signal Ground Connection for GND when applying signals to TP5, TP8, and TP9.
TP4 LED+ LED Positive Test point for anode (top) of LED string.
Voltage
TP5 nDIM Inverted Dim Signal Test point for dimming input (inverted from input signal).
TP6 VIN Input Voltage Test point for input voltage.
TP8 SYNC Synchronization Connect a 3V to 6V PWM clock signal > 500 kHz (pulse width of 100ns) to synchronize
Input the LM3424 switching frequency to the external clock.
TP9 NTC Temp Sense Input Connect a 0V to 1.24V DC voltage to analog dim the LED current.
TP10 PGND Power Ground Test point for GND when monitoring TP1, TP4, or TP6.
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SS
TGAIN
OVP
LM3424
nDIM
GND
TSENSE
TREF
DDRV
VS
DAP
GATE
EN
COMP
VIN
CSH
RT/SYNC
IS
HSN
SLOPE
VCC
HSP
D1
L1
R14
C9
R6
Q1
C7
R17
R11
R13
R5
R15
NTC
R19
R21 R22
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
R8
R7
C22
R9
R20
C12
C11
C15
Q3 PWM
R4
C4,
C5,
C6,
C17,
C19
C2,
C3,
C16,
C18,
C23
C1
R3
J3
R12
J6
TP5
R2
C8
R1
R10
3
4
5
C10
C13
C14
R25
TP3 TP10
TP8
TP6 TP1
TP4
VIN J1
GND J2
LED+
Q2
1
2
3
5
6
7
14
13
12
10
9
8
J7
4 11
LED-
J4
J5
NTC
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Schematic
4 Schematic
3
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LM3424 Pin Descriptions
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5 LM3424 Pin Descriptions
Pin Name Description Application Information
Bypass with 100 nF capacitor to GND as close to the device as
1 VIN Input Voltage possible in the circuit board layout.
Connect to > 2.4V to enable the device or to < 0.8V for low
2 EN Enable power shutdown.
3 COMP Compensation Connect a capacitor to GND to compensate control loop.
Connect a resistor to GND to set the signal current. Can also be
4 CSH Current Sense High used to analog dim as explained in the Thermal Foldback /
Analog Dimming section of the datasheet.
Connect a resistor to GND to set the switching frequency. Can
5 RT Resistor Timing also be used to synchronize external clock as explained in the
Switching Frequency section of the datasheet.
Connect a PWM signal for dimming as detailed in the PWM
Dimming section of the datasheet and/or a resistor divider from
6 nDIM Not DIM input VIN to program input under-voltage lockout (UVLO). Turn-on
threshold is 1.24V and hysteresis for turn-off is provided by
20 µA current source.
7 SS Soft-start Connect a capacitor to GND to extend start-up time.
8 TGAIN Temperature Foldback Gain Connect a resistor to GND to set the foldback slope.
Connect a resistor/ thermistor divider from VSto sense the
9 TSENSE Temperature Sense Input temperature as explained in the Thermal Foldback / Analog
Dimming section of the datasheet.
Temperature Foldback Connect a resistor divider from VSto set the temperature
10 TREF Reference foldback reference voltage.
2.45V reference for temperature foldback circuit and other
11 VSVoltage Reference external circuitry.
Connect to a resistor divider from VOto program output over-
12 OVP Over-Voltage Protection voltage lockout (OVLO). Turn-off threshold is 1.24V and
hysteresis for turn-on is provided by 20 µA current source.
13 DDRV Dimming Gate Drive Output Connect to gate of dimming MosFET.
14 GND Ground Connect to DAP to provide proper system GND
15 GATE Gate Drive Output Connect to gate of main switching MosFET.
16 VCC Internal Regulator Output Bypass with a 2.2 µF–3.3 µF, ceramic capacitor to GND.
Connect to the drain of the main N-channel MosFET switch for
17 IS Main Switch Current Sense RDS-ON sensing or to a sense resistor installed in the source of
the same device.
18 SLOPE Slope Compensation Connect a resistor to GND to set slope of additional ramp.
High-Side LED Current Sense Connect through a series resistor to the negative side of the
19 HSN Negative LED current sense resistor.
High-Side LED Current Sense Connect through a series resistor to the positive side of the LED
20 HSP Positive current sense resistor.
DAP Connect to GND and place 6 - 9 vias to bottom layer ground
DAP Thermal pad on bottom of IC
(21) pour.
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Bill of Materials
6 Bill of Materials
Qty Part ID Part Value Manufacturer Part Number
3 C1, C5, C23 0.1 µF X7R 10% 100V TDK C2012X7R2A104K
4 C2, C3, C16, C18 6.8 µF X7R 10% 50V TDK C5750X7R1H685K
4 C4, C6, C17, C19 10 µF X7R 10% 50V TDK C5750X7R1H106K
2 C7, C22 0.47 µF X7R 10% 16V MURATA GRM21BR71C474KA01L
0 C8 DNP
1 C9 2.2 µF X7R 10% 16V MURATA GRM21BR71C225KA12L
1 C10 1 µF X7R 10% 16V MURATA GRM21BR71C105KA01L
1 C11 47 pF COG/NPO 5% 50V AVX 08055A470JAT2A
1 C12 0.22 µF X7R 10% 16V MURATA GRM219R71C224KA01D
2 C13, C14 100 pF COG/NPO 5% 50V MURATA GRM2165C1H101JA01D
1 C15 1 µF X7R 10% 16V MURATA GRM21BR71C105MA01L
1 D1 Schottky 100V 12A VISHAY 12CWQ10FNPBF
4 J1, J2, J4, J5 Banana Jack KEYSTONE 575-8
1 J3 1x2 Header Male SAMTEC TSW-102-07-T-S
1 J6 BNC connector AMPHENOL 112536
1 J7 2x7 Header Male Shrouded RA SAMTEC TSSH-107-01-SDRA
1 L1 33 µH 20% 6.3A COILCRAFT MSS1278-333MLB
2 Q1, Q2 NMOS 100V 32A FAIRCHILD FDD3682
1 Q3 NMOS 60V 260mA ON-SEMI 2N7002ET1G
2 R1, R11 12.4 k1% VISHAY CRCW080512K4FKEA
0 R2 DNP
2 R3, R20 101% VISHAY CRCW080510R0FKEA
1 R4 17.4 k1% VISHAY CRCW080517K4FKEA
1 R5 1.43 k1% VISHAY CRCW08051K43FKEA
1 R6 0.041% 1W VISHAY WSL2512R0400FEA
2 R7, R8 1.0 k1% VISHAY CRCW08051K00FKEA
1 R9 0.11% 1W VISHAY WSL2512R1000FEA
1 R10 20.0 k1% VISHAY CRCW080520K0FKEA
4 R12, R13, R14, R15 10.0 k1% VISHAY CRCW080510K0FKEA
1 R17 499 k1% VISHAY CRCW0805499KFKEA
3 R19, R21, R22 49.9 k1% VISHAY CRCW080549K9FKEA
1 R25 1501% VISHAY CRCW0805150RFKEA
8 TP1, TP3, TP4, TP5, Turret Keystone 1502-2
TP6, TP8, TP9, TP10
1 U1 Boost controller NSC LM3424MH
5
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PCB Layout
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7 PCB Layout
Figure 2. Top Layer
Figure 3. Bottom Layer
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R10 = = = 19.99 k:
1 + 1.95e-8 x fSW
1.40e-10 x fSW
1 + 1.95e-8 x 360 kHz
1.40e-10 x 360 kHz
DMAX = = = 0.683
31.5V - 10V
VO - VIN-MIN 31.5V
VO
DMIN = = = 0.175
31.5V - 26V
VO - VIN-MAX 31.5V
VO
D' = 1 - D = 1 - 0.238 = 0.762
D = = = 0.238
31.5V - 24V
VO - VIN 31.5V
VO
rD = N x rLED = 9 x 325 m: = 2.925:
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Design Procedure
8 Design Procedure
8.1 Specifications
N=6
VLED = 3.5V
rLED = 325 m
VIN = 24V
VIN-MIN = 10V
VIN-MAX = 70V
fSW = 500 kHz
VSNS = 100 mV
ILED = 1A
ΔiL-PP = 700 mA
ΔiLED-PP = 12 mA
ΔvIN-PP = 100 mV
ILIM = 6A
VTURN-ON = 10V
VHYS = 3V
VTURN-OFF = 40V
VHYSO = 10V
TBK = 70°C
TEND= 120°C
tTSU = 30 ms
8.2 Operating Point
Solve for VOand rD:
(1)
(2)
Solve for D, D', DMAX, and DMIN:
(3)
(4)
(5)
(6)
8.3 Switching Frequency
Solve for RT:
(7)
7
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L1 = = = 31.7 PH
VIN x D
'iL-PP x fSW
24V x 0.238
500 mA x 360 kHz
:
k243RBIAS =
:
k49.9RR REF2 ==
REF1
6.81RGAIN=:
k
:
=
x
-
=
x-
=
k68.6
2
1
R
R
GAIN
GAIN
¸
¸
¹
·
¸
¸
¹
·
¨
¨
©
§
¨
¨
©
§
V45.2
V45.2
PA100
ICSH
+RR 2REF1REF +
-RR BIASENDNTC
-
RENDNTC
R1REF
:+:k243k71.5 :k71.5
R8 = R7 = 1 k:
R1 = 12.4 k:
R9 = 0.1:
ILED = = = 1.0A
1.24V x R8
R9 x R1 1.24V x 1.0 k:
0.1: x 1.24 k:
R8 = = = 1.0 k:
ILED x R1 x R9
1.24V 1A x 1.24 k: x 0.1:
1.24V
R9 = = = 0.1:
VSNS 100 mV
1A
ILED
R10 = 20 k:
fSW = = 360 kHz
1.40e-10 x 20.0 k: - 1.95e-8
1
fSW = 1.40e-10 x R10 - 1.95e-8
1
Design Procedure
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The closest standard resistor is 14.3 ktherefore fSW is:
(8)
The chosen component from step 2 is:
(9)
8.4 Average LED Current
Solve for RSNS:
(10)
Assume RCSH = 12.4 kand solve for RHSP:
(11)
The closest standard resistor for RSNS is actually 0.1and for RHSP is actually 1 ktherefore ILED is:
(12)
The chosen components from step 3 are:
(13)
8.5 Thermal Foldback
Using a standard 100k NTC thermistor (connected to pins 4 and ll), find the resistances corresponding to
TBK and TEND (RNTC-BK = 243 kand RNTC-END = 71.5 k) from the manufacturer's datasheet. Assuming RREF1
= RREF2 = 49.9 k, then RBIAS = RNTC-BK= 243 k.
Solve for RGAIN:
(14)
The chosen components from step 4 are:
(15)
8.6 Inductor Ripple Current
Solve for L1:
(16)
The closest standard inductor is 33 µH therefore ΔiL-PP is:
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R6 = 0.04:
=0.04:= 6.13A
ILIM = R6
245 mV 245 mV
=6A = 0.041:
R6 = ILIM
245 mV 245 mV
C4 = C6 = C17 = C19 = 10 PF
1 - 0.683
0.683 = 1.47A
1 - DMAX
DMAX
ICO-RMS = ILED x = 1A x
'iLED-PP =
= 5.7 mA
ILED x D
rD x CO x fSW
1A x 0.238
2.925: x 40 PF x 360 kHz
'iLED-PP =
CO =
= 38 PF
ILED x D
rD x 'iLED-PP x fSW
CO = 1A x 0.238
2.925: x 6 mA x 360 kHz
H331L P
=
'IL-PP x D'
ILED
1 +
= 1.32A
D'
ILED 1
12
IL-RMS = x¸
¸
¹
·
¸
¸
¹
·
x2
481 mA x 0.762
1A
1 +
0.762
1A 1
12
IL-RMS = x¸
¸
¹
·
¸
¸
¹
·
x2
'iL-PP = = = 481 mA
VIN x D
L1 x fSW
24V x 0.238
33 PH x 360 kHz
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Design Procedure
(17)
Determine minimum allowable RMS current rating:
(18)
The chosen component from step 5 is:
(19)
8.7 Output Capacitance
Solve for CO:
(20)
The closest capacitance totals 40 µF therefore ΔiLED-PP is:
(21)
Determine minimum allowable RMS current rating:
(22)
The chosen components from step 6 are:
(23)
8.8 Peak Current Limit
Solve for RLIM:
(24)
The closest standard resistor is 0.04 therefore ILIM is:
(25)
The chosen component from step 7 is:
(26)
8.9 Slope Compensation
Solve for RSLP:
9
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CIN = == 3.4 PF
'iL-PP
8 x 'vIN-PP x fSW
481 mA
8 x 50 mV x 360 kHz
C12 = 0.22 PF
C10 = 1 PF
R20 = 10:
C12 = = = 0.19 PF
1
10:xZP3 1rad
sec
10:x 520k
ZP3 = 52k rad
sec
ZP3 = (maxZP1, ZZ1) x 10 = ZZ1 x 10
x 10 = 520k rad
sec
C10 = = = 0.35 PF
1
ZP2 x 5e6:
1
0.58 x 5e6:
rad
sec
ZP2 = = = 0.58
5 x TU0
rad
sec
min(ZP1, ZZ1)5 x 5900
ZP1 =5 x 5900
17k rad
sec
TU0 = = = 5900
D' x 310V
ILED x R6 0.762 x 310V
1A x 0.04:
ZZ1 = = = 52 k
L1
rD x D'2
33 PHrad
sec
2.925: x 0.7622
ZP1 = = = 17 k
2
rD x CO
2
2.925: x 40 PFrad
sec
:
16.5RSLP k
=
=
RSLP x 1Le5.1 13
xx RRV SNSTO
= = :k5.16
Px H33e5.1 13
x:x k3.14V21 :1.0
RSLP
Design Procedure
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(27)
The chosen component from step 8 is:
(28)
8.10 Loop Compensation
ωP1 is approximated:
(29)
ωZ1 is approximated:
(30)
TU0 is approximated:
(31)
To ensure stability, calculate ωP2:
(32)
Solve for CCMP:
(33)
To attenuate switching noise, calculate ωP3:
(34)
Assume RFS = 10and solve for CFS:
(35)
The chosen components from step 9 are:
(36)
8.11 Input Capacitance
Solve for the minimum CIN:
(37)
To minimize power supply interaction a 200% larger capacitance of approximately 20 µF is used, therefore
the actual ΔvIN-PP is much lower. Since high voltage ceramic capacitor selection is limited, four 4.7 µF X7R
capacitors are chosen.
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VHYS = R5
20 PA x 17.4 k: x (1.43 k: + 10 k:)
1.43 k:
VHYS =
+ 20 PA x R13
20 PA x R4 x (R5 + R13)
+ 20 PA x 10 k: = 2.98V
R4 = R5 x (VHYS - 20 PA x R13)
20 PA x (R5 + R13)
= 17.5 k:
R4 = 1.43 k: x (3V - 20 PA x 10 k:)
20 PA x (1.43 k: + 10 k:)
D1 o 12A, 100V, DPAK
mW600mV600A1VIP FDDD =
x
=
x
=
A1II LEDMAXD ==
-
VRD-MAX = VO = 31.5V
Q1 o 32A, 100V, DPAK
PT = IT-RMS2 x RDSON = 640 mA2 x 50 m: = 20 mW
IT-RMS = ILED 1A
x D = x 0.238 = 640 mA
D' 0.762
IT-MAX = 1 - 0.683 x 1A = 2.2A
0.683
VT-MAX = VO = 31.5V
C2 = C3 = C16 = C18 = 6.8 PF
IIN-RMS = = = 139 mA
'iL-PP 481 mA
12 12
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Design Procedure
Determine minimum allowable RMS current rating:
(38)
The chosen components from step 10 are:
(39)
8.12 NFET
Determine minimum Q1 voltage rating and current rating:
(40)
(41)
A 100V NFET is chosen with a current rating of 32A due to the low RDS-ON = 50 m. Determine IT-RMS and
PT:
(42)
(43)
The chosen component from step 11 is:
(44)
8.13 Diode
Determine minimum D1 voltage rating and current rating:
(45)
(46)
A 100V diode is chosen with a current rating of 12A and VD= 600 mV. Determine PD:
(47)
The chosen component from step 12 is:
(48)
8.14 Input UVLO
Solve for RUV2:
(49)
The closest standard resistor is 150 ktherefore VHYS is:
(50)
Solve for RUV1:
11
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ms5.10t BASESSSU =
CCk28C168 OCMPBYP x
+
x:
+
x:
=
BASESSSU
t-- ILED
VO
F40
F33.0k28F2.2168t BASESSSU Px
+
Px:
+
Px:
=
V21
A1
ms1.13tSU =
CCk36C168 OCMPBYP x
+
x:
+
x:
=
SU
tILED
VO
F40
F33.0k36F2.2168tSU Px
+
Px:
+
Px:
=V21
A1
R11 = 12.4 k:
R17 = 499 k:
= 51.1V
12.4 k:
1.24V x (12.4 k: + 499 k:)
VTURN-OFF = R11
1.24V x (R11 + R17)
VTURN-OFF =
R11 = = = 12.5 k:
VTURN-OFF - 1.24V
1.24V x R17 1.24V x 499 k:
50V - 620 mV
VHYSO = R17 x 20 PA = 499 k: x 20 PA = 9.98V
R17 = == 500 k:
VHYSO 10V
20 PA20 PA
R4 = 17.4 k:
R13 = 10 k:
R5 = 1.43 k:
VTURN-ON = R5
1.24V x (1.43 k: + 10 k:)
1.43 k:
1.24V x (R5 + R13)
= 9.91V
VTURN-ON =
1.24V x R13
VTURN-ON - 1.24V = 1.42 k:
R5 = = 1.24V x 10 k:
10V - 1.24V
Design Procedure
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(51)
The closest standard resistor is 21 kmaking VTURN-ON:
(52)
The chosen components from step 13 are:
(53)
8.15 Output OVLO
Solve for ROV2:
(54)
The closest standard resistor is 499 ktherefore VHYSO is:
(55)
Solve for ROV1:
(56)
The closest standard resistor is 15.8 kmaking VTURN-OFF:
(57)
The chosen components from step 14 are:
(58)
8.16 Soft-Start
Solve for tSU:
(59)
If tSU is less than tTSU, solve for tSU-SS-BASE:
(60)
Solve for CSS:
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F1CSS P
=
SS
C=nF975
( )
10.5 ms30 ms- =
( )
BASESSSUTSU tt --
-
k20 :=k20 :
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Design Procedure
(61)
The chosen component from step 15 is:
(62)
13
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ILED (A)
VSW (V)
60
40
20
0
1.0
0.5
0.0
ILED
VSW
2 Ps/DIV
ILED (A)
VDIM (V)
10
5
0
1.0
0.0
-1.0
ILED
VDIM
4 ms/DIV
Typical Waveforms
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9 Typical Waveforms
TA= +25°C, VIN = 24V and VO= 32V.
Figure 4. Standard Operation Figure 5. 200Hz 50% PWM Dimming
TP1 Switch Node Voltage (VSW) TP5 Dim Voltage (VDIM)
LED Current (ILED) LED Current (ILED)
10 Alternate Designs
Alternate designs with the LM3429 evaluation board are possible with very few changes to the existing
hardware. The evaluation board FETs and diodes are already rated higher than necessary for design
flexibility. The input UVLO, output OVP, input and output capacitance can remain the same for the designs
shown below. These alternate designs can be evaluated by changing only R9, R10, and L1.
Table 2 gives the main specifications for four different designs and the corresponding values for R9, R10,
and L1. PWM dimming can be evaluated with any of these designs.
Table 2. Alternate Design Specifications
Specification / Design 1 Design 2 Design 3 Design 4
Component
VIN 10V 15V 20V 25V
VO14V 21V 28V 35V
fSW 600kHz 700kHz 500kHz 700kHz
ILED 2A 500mA 2.5A 1.25A
R9 0.050.20.040.08
R10 12.1 k10.2 k14.3 k10.2 k
L1 22µH 68µH 15µH 33µH
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
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