ASMT-Ax00
1W Power LED Light Source
Data Sheet
Description
The ASMT-Ax00 series of 1W Power LEDs are high perfor-
mance energy e cient devices which can handle high
driving current and high temperatures. The exposed pad
design enables excellent heat transfer from the package
to the motherboard. An electrically isolated metal slug
option is also available.
The White Power LED is available with color temperatures
ranging from 2700K to 10000K.
The low pro le package design is suitable for a wide
variety of applications especially where height is a con-
straint and the package foot print is compatible with most
high power LEDs available in the market today.
This package is compatible with re ow soldering process.
Features
Available in Red, Red Orange, Amber, Blue, Royal Blue,
Cyan, Green, Cool White, Neutral White and Warm
White color
Energy e cient
Exposed metal slug for excellent heat transfer
Compatible with re ow soldering process
High current operation
Long operation life
Wide viewing angle at 140°
Silicone encapsulation
Non-ESD sensitive (threshold > 16 kV)
MSL 2a products
Applications
Architectural lighting
Channel backlighting
Contour lighting
Retail Display lighting
Decorative lighting
Garden lighting
2
Package Dimensions
Figure 1. ASMT-Ax00 package outline drawing.
Notes:
1. All dimensions in millimeters.
2. Metal slug is connected to anode for electrically non-isolated option.
3. Tolerance is ±0.1 mm unless otherwise speci ed.
4 . Terminal Finish: Ag plating
Part Numbering System
Note:
1. Please refer to Page 10 for selection details.
7.4
2.3
Ø 8.0
7.4
1.1
1.5
Ø 6.0
Metal Slug
Anode
Lead Lens
Cathode
Lead
Body
Metal Slug
13.8 ± 0.2
0.5
4.1 (ref:)
6.0
TOP VIEW BOTTOM VIEW
3.0 2.0
ASMT – A x 00 – x x3 x4x5x6
Packaging Option
Color Bin Selection
Maximum Flux Bin Selection
Minimum Flux Bin Selection
Dice Type
N – InGaN
A – AllnGaP
Color
R – Red
H – Red Orange
A – Amber
G – Green
C - Cyan
B – Blue
L – Royal Blue
W – Cool White
N – Neutral White
Y – Warm White
12
3
Device Selection Guide (Tj = 25°C)
Part Number Color
Luminous Flux (lm) / Radiometric Power (mW),
ΦV [1,2] Test
Current
(mA)
Dice
Technology
Electrically
Isolated
Metal Slug Min. Typ. Max.
ASMT-AR00-ARS00 Red 39.8 50.0 67.2 350 AllnGaP No [3]
ASMT-AR00-AST00 51.7 65.0 87.4
ASMT-AH00-ARS00 Red Orange 39.8 50.0 67.2 350 AllnGaP No [3]
ASMT-AA00-ARS00 Amber 39.8 50.0 67.2 350 AllnGaP No [3]
ASMT-AB00-NMP00 Blue 13.9 20.0 30.6 350 InGaN Yes
ASMT-AL00-NMP00 Royal Blue 225 mW 320 mW 435 mW 350 InGaN Yes
ASMT-AL00-NNP00 275 mW 350 mW 435 mW
ASMT-AC00-NST00 Cyan 51.7 58 87.4 350 InGaN Yes
ASMT-AG00-NST00 Green 51.7 65.0 87.4 350 InGaN Yes
ASMT-AW00-NUV00 Cool White 87.4 90.0 113.6 350 InGaN Yes
ASMT-AW00-NUW00 87.4 95.0 129.5
ASMT-AN00-NUV00 Neutral White 87.4 90.0 113.6 350 InGaN Yes
ASMT-AY00-NTU00 Warm White 67.2 80.0 99.6 350 InGaN Yes
ASMT-AY00-NTV00 67.2 85.0 113.6
Notes:
1. ΦV is the total luminous ux / radiometric power output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux and power tolerance is ±10 %
3. Electrically isolated metal slug option is also available. Please contact your Avago sale representative.
Absolute Maximum Ratings
Parameter AllnGaP InGaN InGaN Cyan Units
DC Forward Current [1] 500 500 500 mA
Peak Pulsing Current [2] 1000 1000 1000 mA
Power Dissipation 1230 1830 1980 mW
LED Junction Temperature 125 135 135 °C
Operating Ambient Temperature Range at 350mA -40 to +115 -40 to +120 -40 to +120 °C
Storage Temperature Range -40 to +120 -40 to +120 -40 to +120 °C
Soldering Temperature Refer to Figure 26
Reverse Volttage [3] Not recommended
Notes:
1. Derate linearly based on Figure 10 for AlInGaP and Figure 22 for InGaN.
2. Pulse condition duty factor = 10%, Frequency = 1 kHz.
3. Not designed for reverse bias operation
4
Optical Characteristics at 350 mA (TJ = 25 °C)
Part Number Color
Peak Wavelength,
PEAK (nm)
Dominant
Wavelength,
D [1] (nm)
Viewing Angle,
2½ [2] (°)
Luminous E ciency
(lm/W)
Typ. Typ. Typ. Typ.
ASMT-AR00-ARS00 Red 635 625 140 68
ASMT-AR00-AST00 635 625 140 88
ASMT-AH00-ARS00 Red Orange 625 615 140 68
ASMT-AA00-ARS00 Amber 598 590 140 68
ASMT-AG00-NST00 Green 519 525 140 58
ASMT-AC00-NST00 Cyan 497 500 140 49
ASMT-AB00-NMP00 Blue 454 460 140 18
ASMT-AL00-NMP00 Royal Blue 450 455 140 Not applicable
ASMT-AL00-NNP00 450 455 140 Not applicable
Part Number Color
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle,
2½ [2] (°)
Luminous E ciency
(lm/W)
Min. Max. Typ. Typ.
ASMT-AW00-NUV00 Cool White 4500 10000 140 80
ASMT-AW00-NUW00 4500 10000 140 85
ASMT-AN00-NUV00 Neutral White 3500 4500 140 80
ASMT-AY00-NTU00 Warm White 2700 3500 140 71
ASMT-AY00-NTV00 2700 3500 140 76
Notes:
1. The dominant wavelength, D, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. ½ is the o -axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (TJ = 25°C)
Dice Type
Forward Voltage, VF (Volts)
Thermal Resistance,
Rj-ms(°C/W) [1]
Min. Typ Max. Typ.
AllnGaP 1.7 2.1 2.3 10
InGaN (non-Cyan colors) 2.8 3.2 3.5 10
InGaN Cyan 3.0 3.4 3.8 10
Notes:
1. Rj-ms is Thermal Resistance from LED junction to metal slug.
5
Figure 2. Relative Intensity vs. Wavelength for Red, Red Orange and Amber. Figure 3. Relative Luminous Flux vs. Mono Pulse Current.
Figure 4. Forward Current vs. Forward Voltage. Figure 5. Radiation Pattern for Red, Red Orange and Amber.
AlInGaP
Figure 6. Maximum pulse current vs. pulse duration.
Derated based on TA = 25°C, RθJ-A = 50°C/W.
Figure 7. Maximum pulse current vs. pulse duration.
Derated based on TA = 85°C, RθJ-A = 50°C/W.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
D=tp
T
tp
IF
T
D=tp
T
tp
IF
T
D =
0.05
0.10
0.25
0.50
1.00
D =
0.05
0.10
0.25
0.50
1.00
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
530 545 560 575 590 605 620 635 650 665 680
WAVELENGTH - nm
RELATIVE INTENSITY
AMBER
RED
RED ORANGE
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0100 200 300 400 500
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
0
50
100
150
200
250
300
350
400
450
500
0 0.5 11.5 2 2.5 3
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
6
Figure 8. Relative Light Output vs. Junction Temperature. Figure 9. Forward Voltage Shift vs. Junction Temperature.
Figure 10. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125°C, RJ-A = 30°C/W, 40°C/W and 50°C/W.
Figure 11. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 125°C, RJ-MS = 10°C/W.
0
100
200
300
400
500
600
0 20406080100 120 140
AMBIENT TEMPERATURE, TA - °C
MAX ALLOWABLE DC CURRENT - mA
RθJ-A = 30°C/W
RθJ-A = 40°C/W
RθJ-A = 50°C/W
0
100
200
300
400
500
600
020406080100 120 140
METAL SLUG TEMPERATURE, TMS - °C
MAX ALLOWABLE DC CURRENT - mA
RθJ-MS = 10°C/W
0
10
20
30
40
50
60
70
80
90
100
110
120
25 50 75 100 125
AMBER
RED-ORANGE
RED
-0.3
-0.25
-0.2
-0.15
-0.1
-0.05
0
0.05
0.1
25 50 75 100 125
JUNCTION TEMPERATURE, TJ -°CJUNCTION TEMPERATURE, TJ -°C
RELATIVE LIGHT OUTPUT (%)
(NORMALIZED AT 25°C)
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 25°C)
AMBER
RED-ORANGE
RED
7
Figure 12. Relative Intensity vs. Wavelength for Cool and Warm White. Figure 13. Relative Intensity vs. Wavelength for Blue, Royal Blue, Cyan and
Green.
Figure 14. Relative Luminous Flux vs. Mono Pulse Current. Figure 15. Forward Current vs. Forward Voltage.
InGaN
Figure 16. Radiation Pattern for Blue, Royal Blue, Cyan and Green. Figure 17. Radiation Pattern for Cool White, Neutral White and Warm White.
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0100 200 300 400 500
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
0
50
100
150
200
250
300
350
400
450
500
0 0.5 11.5 2 2.5 3 3.5 4
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
GREEN
WHITE
BLUE
ROYAL BLUE
CYAN
NORMALIZED INTENSITY
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90-60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 480 580 680 780
WAVELENGTH - nm
RELATIVE INTENSITY
COOL WHITE
NEUTRAL WHITE
WARM WHITE
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
380 405 430 455 480 505 530 555 580 605 630
WAVELENGTH - nm
RELATIVE INTENSITY
GREEN
BLUE
ROYAL BLUE
CYAN
8
Figure 20. Relative Light Output vs. Junction Temperature. Figure 21. Forward Voltage Shift vs. Junction Temperature.
Figure 22. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 135°C, RJ-A = 30°C/W, 40°C/W and 50°C/W.
Figure 23. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 135°C, RJ-MS = 10°C/W.
Figure 18. Maximum pulse current vs. pulse duration.
Derated based on TA = 25°C, RθJ-A = 50°C/W.
Figure 19. Maximum pulse current vs. pulse duration.
Derated based on TA = 85°C, RθJ-A = 50°C/W.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
D=tp
T
tp
IF
T
D=tp
T
tp
IF
TD =
0.05
0.10
0.25
0.50
1.00
D =
0.05
0.10
0.25
0.50
1.00
0
100
200
300
400
500
600
0 255075100 125 150
AMBIENT TEMPERATURE, T A - °C
MAX ALLOWABLE DC CURRENT - mA
RθJ-A = 30°C/W
RθJ-A = 40°C/W
RθJ-A = 50°C/W
0
100
200
300
400
500
600
0255075100 125 150
METAL SLUG TEMPERATURE, TMS - °C
MAX ALLOWABLE DC CURRENT - mA
RθJ-MS = 10°C/W
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
110.0
120.0
25 50 75 100 125 150 -0.45
-0.35
-0.25
-0.15
-0.05
0.05
0.15
25 50 75 100 125 150
JUNCTION TEMPERATURE,TJ - °CJUNCTION TEMPERATURE,TJ - °C
RELATIVE LIGHT OUTPUT (%)
(NORMALIZED AT 25°C)
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 25°C)
GREEN
CYAN
WHITE
BLUE
ROYAL BLUE
CYAN
GREEN
WHITE
BLUE
ROYAL BLUE
9
Figure 24. Recommended soldering land pattern
Note:
For detail information on re ow soldering of Avago surface mount LEDs,
do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
Figure 25. Recommended pick and place nozzle tip.
Inner diameter = 5.8 mm.
Figure 26. Recommended Re ow Soldering
(Acc. to J-STD-020C)
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
Ø 6.40
1.10
1.60
2.65
8.80
4.38
14.10
∅5.8
10
Option Selection Details
ASMT-Ax100 – x2 x3 x4 x5 x6
x3 – Minimum Flux Bin Selection
x4 – Maximum Flux Bin Selection
x5 – Color Bin Selection
x6 – Packaging Option
Flux / Power Bin Limit [x3, x4]
Color Bin ID
Luminous Flux (lm) / Radiometric
Power (mW) at 350 mA
Min. Max.
Blue K 8.2 10.7
L 10.7 13.9
M 13.9 18.1
N 18.1 23.5
P 23.5 30.6
Other Colors Q 30.6 39.8
R 39.8 51.7
S 51.7 67.2
T 67.2 87.4
U 87.4 99.6
V 99.6 113.6
W 113.6 129.5
Royal Blue M 225.0 275.0
N 275.0 355.0
P 355.0 435.0
Tolerance for each bin limits is ±10 %
Color Bin Selection [x5]
Individual reel will contain parts from one full bin only.
Cool White
Selection Bin ID
0 Full Distribution
E VM, UM, VN and UN
F WM, VM, WN and VN
G XM, WM, XN and WN
H UN, VN, U0 and V0
J WN, VN, W0 and V0
K XN, WN, X0 and W0
L V0, U0, VP and UP
M W0, V0, WP, VP and WQ
N X0, W0, XP, WP and WQ
P Y0
Q YA
Neutral White
Selection Bin ID
0 Full Distribution
E SM, RM, S1 and R1
F TM, SM, TN and S1
G S1, R1, S0 and R0
H TN, S1, T0 and S0
J S0, R0, SA and RA
K T0, S0, TP and SA
Warm White
Selection Bin ID
0 Full Distribution
E NM, MM, N1 and M1
F PM, NM, P1 and N1
G QM, PM, Q1 and P1
H M1, N1, M0 and N0
J P1, N1, P0 and N0
K Q1, P1, Q0 and P0
L N0, M0, NA and MA
M P0, N0, PA and NA
N Q0, P0, QA and PA
Other Colors
Selection Bin ID
0 Full Distribution
Z A and B
Y B and C
W C and D
V D and E
U E and F
Q A, B and C
P B, C and D
N C, D and E
M D, E and F
11
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40
X-COORDINATE
Y-COORDINATE
10000K
7000K
6300K
Y0
YA
UM
UN
U0
UP
V0
VM
VN
VP
X0
XP
XM
XN W0
WN
WQ
WM
WP
5650K
5000K
4500K
BLACK BODY CURVE
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.38 0.40 0.42 0.44 0.46 0.48 0.50
X-COORDINATE
Y-COORDINATE
QM
PM
MM
NM
Q1
Q0
QA
P0
P1
PA
M0
M1
MA
N0
N1
NA
3050K 2850K
BLACK BODY CURVE
2700K
3500K 3250K
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.34 0.36 0.38 0.40 0.42 0.44
X-COORDINATE
Y-COORDINATE
RM
R1
R0
RA
T0
SM
S1
SA
TM
TN
TP
S0
4500K
4100K
BLACK BODY CURVE
3500K
3800K
Figure 27. Color bin structure for Cool White. Figure 28. Color bin structure for Warm White.
Figure 29. Color bin structure for Neutral White.
12
Color Bin Limit
Cool Color Limits
White (Chromaticity Coordinates)
Bin UM X 0.365 0.367 0.348 0.347
Y 0.385 0.400 0.385 0.372
Bin UN X 0.365 0.362 0.346 0.347
Y 0.386 0.372 0.359 0.372
Bin U0 X 0.362 0.360 0.344 0.346
Y 0.372 0.357 0.344 0.359
Bin UP X 0.360 0.357 0.343 0.344
Y 0.357 0.342 0.311 0.344
Bin VM X 0.329 0.329 0.348 0.347
Y 0.357 0.369 0.385 0.372
Bin VN X 0.329 0.329 0.347 0.346
Y 0.345 0.357 0.372 0.359
Bin V0 X 0.329 0.329 0.346 0.344
Y 0.331 0.345 0.359 0.344
Bin VP X 0.329 0.344 0.343 0.329
Y 0.331 0.344 0.331 0.320
Bin WM X 0.329 0.329 0.315 0.314
Y 0.369 0.357 0.344 0.355
Bin WN X 0.329 0.316 0.315 0.329
Y 0.345 0.333 0.344 0.357
Bin W0 X 0.329 0.329 0.317 0.316
Y 0.345 0.331 0.320 0.333
Bin WP X 0.329 0.329 0.318 0.317
Y 0.331 0.320 0.310 0.320
Bin WQ X 0.329 0.329 0.319 0.318
Y 0.320 0.310 0.300 0.310
Bin XM X 0.301 0.314 0.315 0.303
Y 0.342 0.355 0.344 0.333
Bin XN X 0.305 0.303 0.315 0.316
Y 0.322 0.333 0.344 0.333
Bin X0 X 0.308 0.305 0.316 0.317
Y 0.311 0.322 0.333 0.320
Bin XP X 0.308 0.317 0.319 0.311
Y 0.311 0.320 0.300 0.293
Bin Y0 X 0.308 0.283 0.274 0.303
Y 0.311 0.284 0.301 0.333
Bin YA X 0.308 0.311 0.290 0.283
Y 0.311 0.293 0.270 0.284
Tolerance: ± 0.01
Warm Color Limits
White (Chromaticity Coordinates)
Bin MM X 0.471 0.460 0.473 0.486
Y 0.451 0.430 0.432 0.455
Bin M1 X 0.460 0.453 0.467 0.473
Y 0.430 0.416 0.419 0.432
Bin M0 X 0.453 0.444 0.459 0.467
Y 0.416 0.399 0.403 0.419
Bin MA X 0.459 0.444 0.436 0.451
Y 0.403 0.399 0.384 0.389
Bin NM X 0.454 0.444 0.460 0.471
Y 0.446 0.426 0.430 0.451
Bin N1 X 0.444 0.438 0.453 0.460
Y 0.426 0.412 0.416 0.430
Bin N0 X 0.438 0.429 0.444 0.453
Y 0.412 0.394 0.399 0.416
Bin NA X 0.444 0.429 0.422 0.436
Y 0.399 0.394 0.379 0.384
Bin PM X 0.438 0.430 0.444 0.454
Y 0.440 0.421 0.426 0.446
Bin P1 X 0.430 0.424 0.438 0.444
Y 0.421 0.407 0.412 0.426
Bin P0 X 0.424 0.416 0.429 0.438
Y 0.407 0.389 0.394 0.412
Bin PA X 0.429 0.416 0.410 0.422
Y 0.394 0.389 0.374 0.379
Bin QM X 0.421 0.414 0.430 0.438
Y 0.433 0.414 0.421 0.440
Bin Q1 X 0.414 0.409 0.424 0.430
Y 0.414 0.400 0.407 0.421
Bin Q0 X 0.409 0.402 0.416 0.424
Y 0.400 0.382 0.389 0.407
Bin QA X 0.416 0.402 0.396 0.410
Y 0.389 0.382 0.367 0.374
Tolerance: ± 0.01
13
Neutral Color Limits
White (Chromaticity Coordinates)
Bin RM X 0.421 0.414 0.397 0.402
Y 0.433 0.414 0.406 0.423
Bin R1 X 0.414 0.409 0.392 0.397
Y 0.414 0.400 0.391 0.406
Bin R0 X 0.392 0.387 0.402 0.409
Y 0.391 0.374 0.382 0.400
Bin RA X 0.387 0.383 0.396 0.402
Y 0.374 0.360 0.367 0.382
Bin SM X 0.402 0.397 0.382 0.386
Y 0.423 0.406 0.397 0.413
Bin S1 X 0.397 0.392 0.378 0.382
Y 0.406 0.391 0.382 0.397
Bin S0 X 0.392 0.387 0.374 0.378
Y 0.391 0.374 0.366 0.382
Bin SA X 0.387 0.383 0.370 0.374
Y 0.374 0.360 0.351 0.366
Bin TM X 0.386 0.382 0.365 0.367
Y 0.413 0.397 0.386 0.400
Bin TN X 0.382 0.378 0.362 0.365
Y 0.397 0.382 0.372 0.386
Bin T0 X 0.378 0.374 0.360 0.362
Y 0.382 0.366 0.357 0.372
Bin TP X 0.374 0.370 0.357 0.360
Y 0.366 0.351 0.342 0.357
Tolerance: ± 0.01
Color Bin ID
Dominant Wavelength (nm)
at 350 mA
Min. Max.
Red – 620.0 635.0
Red Orange – 610.0 620.0
Amber B 587.0 589.5
C 589.5 592.0
D 592.0 594.5
E 594.5 597.0
Blue A 455.0 460.0
B 460.0 465.0
C 465.0 470.0
D 470.0 475.0
Cyan C 490.0 495.0
D 495.0 500.0
E 500.0 505.0
F 505.0 510.0
G 510.0 515.0
H 515.0 520.0
Green A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ± 1 nm
Color Bin ID
Peak Wavelength (nm) at 350 mA
Min. Max.
Royal Blue C 440.0 445.0
D 445.0 450.0
E 450.0 455.0
F 455.0 460.0
Tolerance: ±2 nm
Example
ASMT-AW00-NST00
ASMT-AW00-Nxxxx – Cool White, InGaN, Electrically
isolated Heat Sink
X3 = S – Minimum Flux Bin S
X4 = T – Maximum Flux Bin T
X5 = 0 – Full DIstribution
X6 = 0 – Tube Option
Packaging Option [x6]
Selection Option
0 Tube
1 Tape and Reel
14
Figure 30. Package tube dimensions.
17.2 ±0.1
7.3 ±0.10.4 ±0.1
3.4 ±0.1 5.0 ±0.1
8.4 ±0.1
395mm
Packing Tube – Option 0
15
Figure 32. Reel dimensions.
Tape and Reel – Option 1
Figure 31. Carrier tape dimensions.
Ø 330.0 ± 2.0
2.0 ±0.5
Ø 21.0 ±0.8
Ø 13.0 +0.5
–0.2
See Detail – 1
Detail – 1
1.8 +0.2
0.0
24.0 +0.2
0.0
100 ±0.5
Ø 1.50 +0.10
0.00
Ø 8.10 +0.10
0.00
4.00 ±0.10
2.00 ±0.10
1.75 ±0.10
24.00 ±0.30
11.50 ±0.10
12.00 ±0.10
‘AO’
8.10 ±0.10
2.55
Section 'A-A'
Section 'B-B'
B
B
A
A
‘KO’
4.50 ±0.10
0.40 ±0.05
‘BO’
14.30 ±0.10
R 0.30 Max (TYP.)
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-1640EN - September 28, 2012
DISCLAIMER: Avago’s products and software are not speci cally designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make
claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage
the product and cause premature failure. During assembly
of handling, the unit should be held on the body only.
Please refer to Avago Application Note AN 5288 for detail
information.
Moisture Sensitivity
This product is quali ed as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to re ow the LEDs per the original MSL
rating.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for un nished reel
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their
oor life of 672 hours.
E. Baking is required if:
– HIC “10%” indicator is NOT Brown and “5%” indicator
is Azure.
– The LEDs are exposed to condition of >30°C/60% RH
at any time.
– The LED oor life exceeded 672hrs.
Recommended baking condition: 60±5°C for 20hrs.
