CPC2014N - Zilog - Product.Network

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

DS-CPC2014N-R03 1

CPC2014N

Dual Single-Pole

8-Pin SOIC OptoMOS® Relay

Part # Description

CPC2014N 8-Pin SOIC (50/tube)

CPC2014NTR 8-Pin SOIC (2000/reel)

Parameter Rating Units

Blocking Voltage 60 VP

Load Current 400 mArms / mADC

On-Resistance (max) 2 

LED Current to operate 2 mA

Applications

Features

Description

Ordering Information

Pin Configuration

• Security

• Passive Infrared Detectors (PIR)

• Data Signalling

• Sensor Circuitry

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Medical Equipment—Patient/Equipment Isolation

• Aerospace

• Industrial Controls

• Designed for use in Security Systems Complying

with EN50130-4

• 1500Vrms Input/Output Isolation

• TTL/CMOS Compatible Input

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Immune to Radiated EM Fields

• SMD Pick & Place, Wave Solderable

• Tape & Reel Version Available

• Small 8-Pin SOIC Package

The CPC2014N is a miniature device with two

independent 1-Form-A solid state relays in an

8-Pin SOIC package that employs optically coupled

MOSFET technology to provide 1500Vrms of

input/output isolation.

Optically coupled outputs that use the patented

OptoMOS architecture are controlled by a highly

efficient GaAIAs infrared LED.

The CPC2014N uses IXYS Integrated Circuits

Division’s state of the art, double-molded vertical

construction packaging to produce one of the world’s

smallest relays. The CPC2014N offers substantial

board space savings over the competitor’s larger 8-Pin

SOIC relay.

Switching Characteristics

of Normally Open (Form A) Devices

Approvals

• UL Certified Component: File E76270

• CSA Certified Component: Certificate 1172007

• EN/IEC 60950-1 Certified Component:

TUV Certificate B 10 05 49410 006

Form-A

ILOAD

10%

90%

ton toff

+ Control

– Control

Load

+ Control

– Control

Load

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2R03

CPC2014N

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Absolute Maximum Ratings @ 25°C

Parameter Ratings Units

Blocking Voltage 60 VP

Reverse Input Voltage 5 V

Input Control Current

Peak (10ms)

50 mA

Input Power Dissipation 70 mW

Total Power Dissipation 1600 mW

Isolation Voltage, Input to Output 1500 Vrms

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

1 Derate linearly 5mW / ºC

Parameter Conditions Symbol Min Typ Max Units

Output Characteristics

Load Current

Continuous 1IF=2mA IL- - 400 mArms / mADC

Peak t <10ms ILPK - - ±1 AP

On-Resistance 2IL=400mA RON --2 

Off-State Leakage Current VL=60VPILEAK --1 µA

Switching Speeds

Turn-On IF=5mA, VL=10V ton - 0.47 2 ms

Turn-Off toff - 0.22 1

Output Capacitance VL=50V, f=1MHz COUT -40 - pF

Capacitance, Input to Output - --1 - pF

Input Characteristics

Input Control Current to Activate 3IL=400mA IF- 0.25 2 mA

Input Control Current to Deactivate - IF0.1 0.2 - mA

Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V

Reverse Input Current VR=5V IR- - 10 µA

1 Load current derates linearly from 400mA @ 25oC to 200mA @80oC, and must be derated for both poles operating simultaneously.

2 Measurement taken within 1 second of on-time.

3 For applications requiring high temperature operation (greater than 60oC) a LED drive current of 4mA is recommended.

Electrical Characteristics @ 25°C

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PERFORMANCE DATA*

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written speciﬁ cations, please

contact our application department.

LED Forward Voltage (V)

1.250 1.255 1.260 1.265 1.270 1.275

Device Count (N)

Typical LED Forward Voltage Drop

(N=50, IF=5mA, TA=25ºC)

Turn-On (ms)

0.35 0.40 0.45 0.50 0.55 0.60 0.65

Device Count (N)

Typical Turn-On Time

(N=50, IF=5mA, IL=100mA, TA=25ºC)

Turn-Off (ms)

0.55 0.65 0.75 0.85 0.95 1.05

Device Count (N)

Typical Turn-Off Time

(N=50, IF=5mA, IL=100mA, TA=25ºC)

LED Current (mA)

0.16 0.18 0.20 0.22 0.24 0.26 0.28

Device Count (N)

Typical IF for Switch Operation

(N=50, IL=400mA, TA=25ºC)

LED Current (mA)

0.16 0.18 0.20 0.22 0.24 0.26

Device Count (N)

Typical IF for Switch Dropout

(N=50, IL=400mA, TA=25ºC)

On-Resistance (:)

0.505 0.510 0.515 0.520 0.525 0.530 0.535

Device Count (N)

Typical On-Resistance Distribution

(N=50, IF=1mA, IL=400mA, TA=25ºC)

Blocking Voltage (VP)

63.5 64.0 64.5 65.0 65.5 66.0 66.5

Device Count (N)

Typical Blocking Voltage Distribution

(N=50, TA=25ºC)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Forward Voltage (V)

1.0

1.1

1.2

1.3

1.4

1.5

1.6

Typical LED Forward Voltage Drop

vs. Temperature

IF=50mA

IF=20mA

IF=10mA

IF=5mA

IF=2mA

LED Forward Current (mA)

Turn-On (ms)

05 1015202530354045

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

Typical Turn-On vs. LED Forward Current

(IL=80mA)

LED Forward Current (mA)

Turn-Off (ms)

05 1015202530354045

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Typical Turn-Off vs. LED Forward Current

(IL=80mA)

INTEGRATED CIRCUITS DIVISION

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4R03

CPC2014N

PERFORMANCE DATA*

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written speciﬁ cations, please

contact our application department.

Turn-On (ms)

-40

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-20 0 20 40 60 80 100

Temperature (ºC)

IF=5mA

IF=10mA

Typical Turn-On vs. Temperature

(IL=80mA)

Turn-Off (ms)

-40

0.60

0.55

0.50

0.45

0.40

0.35

0.30

0.25

0.20

0.15

0.10

-20 0 20 40 60 80 100

Typical Turn-Off vs. Temperature

(IL=80mA)

Temperature (ºC)

IF=5mA

IF=10mA

-40

0.9

0.8

0.7

0.6

0.5

0.4

0.3

-20 0 20 40 60 80 100

Steady State

On-Resistance (:)

Temperature (ºC)

IF=5mA

IF=10mA

Typical On-Resistance vs. Temperature

(IL=200mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Current (mA)

0.16

0.20

0.24

0.28

0.32

0.36

Typical IF for Switch Operation

vs. Temperature

(IL=200mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Current (mA)

0.28

Typical IF for Switch Dropout

vs. Temperature

(IL=200mA)

0.36

0.24

0.20

0.16

0.32

Load Voltage (V)

-0.3 -0.2 -0.1 0.0 0.1 0.2 0.3

Load Current (mA)

-500

-400

-300

-200

-100

100

200

300

400

500

Typical Load Current vs. Load Voltage

with One Pole Operating

(IF=2mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Load Current (mA)

100

200

300

400

500

Maximum Load Current vs. Temperature

with One Pole Operating

(IF=2mA)

Blocking Voltage (VP)

-40

-20 0 20 40 60 80 100

Typical Blocking Voltage

vs. Temperature

Temperature (ºC)

Leakage (µA)

-40

0.016

0.014

0.012

0.010

0.008

0.006

0.004

0.002

-20 0 20 40 60 80 100

Typical Leakage vs. Temperature

Measured Across Pins 5&6 and 7&8

(VL=60V)

Temperature (ºC)

Time

10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s

Load Current (mA)

100

200

300

400

500

600

700

800

900

1000

1100

Energy Rating Curve

(IF=2mA)

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Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to

the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product

evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper

operation of our devices when handled according to the limitations and information in that standard as well as to any

limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according

to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Rating

CPC2014N MSL 3

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020

must be observed.

Device Maximum Temperature x Time

CPC2014N 260ºC for 30 seconds

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to

remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as

an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary

if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.

Cleaning methods that employ ultrasonic energy should not be used.

INTEGRATED CIRCUITS DIVISION

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its

products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC2014N-R03

OptoMOS® is a registered trademark of IXYS Integrated Circuits Division

12/17/2012

For additional information please visit our website at: www.ixysic.com

CPC2014N

MECHANICAL DIMENSIONS

CPC2014N

CPC2014NTR Tape & Reel

Dimensions

(inches)

PCB Land Pattern

2.184 MAX

(0.086 MAX)

0.838 ± 0.102

(0.033 ± 0.004) 0.381 ± 0.051

(0.015 ± 0.002)

Lead to Package Standoff

MIN 0.0254 (0.001)

(MAX 0.102 (0.004)

0.432 ± 0.127

(0.017 ± 0.005)

0.203 ± 0.025

(0.008 ± 0.001)

1.016 ± 0.025

(0.040 ± 0.001)

5.60

(0.22)

1.30

(0.051)

0.55

(0.022)

2.54

(0.100)

9.347 ± 0.203

(0.368 ± 0.008)

6.096 ± 0.102

(0.240 ± 0.004)

3.810 ± 0.051

(0.150 ± 0.002)

2.540 TYP

(0.100 TYP)

Pin 1

NOTES:

1. All dimensions in millimeters

2. 10 sprocket hole pitch cumulative tolerance ± 0.20.

3. Carrier camber is within 1mm in 250mm.

4. Tape material : Black Conductive Polystyrene Alloy.

5. All dimensions meet EIA-481-C requirements.

6. Thickness : 0.30 ± 0.05mm.

7. Component load per 13” reel : 2000 pcs.

7.50 ± 0.10

16.00 ± 0.30

1.75 ± 0.10 8.00 ± 0.104.00 ± 0.10

2.00 ± 0.10

9.65 ± 0.106.50

1.20

2.85 ± 0.10

2.35 ± 0.10

6.55 ± 0.10

3.50

Ø1.50

+0.1, -0

Ø1.50 MIN

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)