Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com www.vishay.com
Revision: 08-Mar-11 125
D/CRCW e3
Vishay
Standard Thick Film Chip Resistors
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
FEATURES
Stability R/R = 1 % for 1000 h at 70 ° C
Pure tin solder contacts on Ni barrier layer
provides compatibility with lead (Pb)-free and lead
containing soldering processes
Metal glaze on high quality ceramic
Compliant to RoHS Directive 2002/95/EC
Halogen-free according to IEC 61249-2-21 definition
AEC-Q200 qualified
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Marking: See data sheet “Surface Mount Resistor Marking” (document number 20020).
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE RATED
DISSIPATION
P70 °C
W
LIMITING
ELEMENT
VOLTAGE
Umax. AC/DC
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
RESISTANCE
RANGE
SERIES
INCH METRIC
D10/CRCW0402 0402 RR 1005M 0.063 50 ± 100
± 200
± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 1.5 A
D11/CRCW0603 0603 RR 1608M 0.10 75 ± 100
± 200
± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.0 A
D12/CRCW0805 0805 RR 2012M 0.125 150 ± 100
± 200
± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.5 A
D25/CRCW1206 1206 RR 3216M 0.25 200 ± 100
± 200
± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 3.5 A
CRCW1210 1210 RR 3225M 0.5 200 ± 100
± 200
± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 5.0 A
CRCW1218 1218 RR 3246M 1.0 200 ± 100
± 200
± 1
± 5 1R0 to 2M2 E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A
CRCW2010 2010 RR 5025M 0.75 400 ± 100
± 200
± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 6.0 A
CRCW2512 2512 RR 6332M 1.0 500 ± 100
± 200
± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A
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D/CRCW e3
Vishay Standard Thick Film Chip Resistors
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
TECHNICAL SPECIFICATIONS
PARAMETER UNIT D10/
CRCW0402 D11/
CRCW0603 D12/
CRCW0805 D25/
CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512
Rated dissipation P70 (1) W 0.063 0.1 0.125 0.25 0.5 1.0 0.75 1.0
Limiting element voltage
Umax. AC/DC V 50 75 150 200 200 200 400 500
Insulation voltage
Uins (1 min) V > 75 > 100 > 200 > 300 > 300 > 300 > 300 > 300
Insulation resistance > 109
Category temperature
range °C - 55 to + 155
Failure rate h-1 < 0.1 x 10- 9
Weight mg 0.65 2 5.5 10 16 29.5 25.5 40.5
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW0603562RFKEC
MODEL VALUE TOLERANCE TCR PACKAGING SPECIAL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
R = Decimal
K = Thousand
M = Million
0000 = Jumper
F = ± 1.0 %
J = ± 5.0 %
Z = Jumper
K = ± 100 ppm/K
N = ± 200 ppm/K
0 = Jumper
EA, EB,
EC, ED,
EE, EF,
EG, EH,
EK
Up to 2 digits
Product Description: D11/CRCW0603 100 562R 1 % ET6 e3
D11/CRCW0603 100 562R 1 % ET6 e3
MODEL TCR RESISTANCE VALUE TOLERANCE PA CK AG I N G LEAD (Pb)-FREE
D10/CRCW0402
D11/CRCW0603
D12/CRCW0805
D25/CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
± 200 ppm/K
± 100 ppm/K
10R = 10
562R = 562
10K = 10 k
1M0 = 1 M
0R0 = Jumper
± 5 %
± 1 %
ET1, ET5,
ET6, ET7,
EF4, E02,
E67, E82,
ET9
e3 = Pure tin
termination finish
C R C W 0 6 0 3 5 6 2 R F K E C
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Standard Thick Film Chip Resistors Vishay
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DIMENSIONS
PACKAGING
MODEL UNIT
PAPER TAPE ON REEL
ACC. TO IEC 60286-3, TYPE I BLISTER TAPE ON REEL
ACC. TO IEC 60286-3, TYPE II
QUANTITY PART NUMBER PRODUCT DESC. QUANTITY PART NUMBER PRODUCT DESC.
D10/CRCW0402 180 mm/7" 10 000 ED ET7
330 mm/13" 50 000 EE EF4
D11/CRCW0603
180 mm/7" 5000 EA ET1
285 mm/11.25" 10 000 EB ET5
330 mm/13" 20 000 EC ET6
D12/CRCW0805
180 mm/7" 5000 EA ET1
285 mm/11.25" 10 000 EB ET5
330 mm/13" 20 000 EC ET6
D25/CRCW1206
180 mm/7" 5000 EA ET1
285 mm/11.25" 10 000 EB ET5
330 mm/13" 20 000 EC ET6
CRCW1210
180 mm/7" 5000 EA ET1
285 mm/11.25" 10 000 EB ET5
330 mm/13" 20 000 EC ET6
CRCW1218 180 mm/7" 4000 EK ET9
CRCW2010 180 mm/7" 4000 EF E02
CRCW2512 180 mm/7" 2000 EG E67
4000 EH E82
SIZE DIMENSIONS in millimeters SOLDER PAD DIMENSIONS in millimeters
REFLOW SOLDERING WAVE SOLDERING
INCH METRIC L W H T1 T2 a b l a b l
0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.1 0.4 0.6 0.5
0603 1608 1.55 + 0.10
- 0.05 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.2 0.3 ± 0.2 0.5 0.9 1.0 0.9 0.9 1.0
0805 2012 2.0 + 0.20
- 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20
- 0.10 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3
1206 3216 3.2 + 0.10
- 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3
1210 3225 3.2 ± 0.2 2.5 ± 0.2 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2
1218 3246 3.2 + 0.10
- 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 1.05 4.9 1.9 1.25 4.8 1.9
2010 5025 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9
2512 6332 6.3 ± 0.2 3.15 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2
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D/CRCW e3
Vishay Standard Thick Film Chip Resistors
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
FUNCTIONAL PERFORMANCE
1000
100
10
1
0.1
0.01
Single Pulse
Pulse Load max. (W)
P
2512
1218
2010
1210
1206
0805
0603
0402
10
-6
Pulse Duration
i
(s)
t
10
-5
10
-4
10
-3
10
-2
10
-1
1 10 100
Maximum pulse load, single pulse; applicable if P 0 and n < 1000 and Û Ûmax.;
for permissible resistance change equivalent to 8000 h operation
1000
10
1
0.1
0.01
10
-6
Continuous Pulse
Maximum pulse load, continuous pulses; applicable if P P (ϑamb) and Û Ûmax.;
for permissible resistance change equivalent to 8000 h operation
Pulse Duration i (s)
Continuous Pulse Load
max.
(W)
t
P
100
10
-5
10
-4
10
-3
10
-2
10
-1
1 10 100
2512
1218
2010
1210
1206
0805
0603
0402
2000
200
0
10
- 6
10
- 5
10
- 4
10
- 3
10
- 2
10
- 1
110
Pulse Voltage
Maximum pulse voltage, single and continuous pulses; applicable if
P P
max.
; for permissible resistance change equivalent to 8000 h operation
Pulse Duration
i
(s)
400
600
800
1000
1200
1400
1600
1800
Pulse Voltage max. (V)
2512
2010
1206/1210/1218
0805 0603
0402
t
Û
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Standard Thick Film Chip Resistors Vishay
This datasheet is subject to change without notice.
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- 50 0 50 100 150
0
Derating
Ambient Temperature amb
Fraction of Rated Dissipation P70
50
100
70 °C
%
ϑ
10
120
Resistance Value R in Ω
Attenuation of 3rd Harmonic A3 in dB
Non-Linearity
100
80
40
60
20
0100 1K 10K 100K 1M 10M
1206, 2010
0805
0603
0402
100 1K 10K 100K 1M 10M
100
10
1
0.1
0.01
Current Noise A1 in µV/V
Current Noise
2010
1206
0805
0603
0402
Resistance Value R in Ω
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D/CRCW e3
Vishay Standard Thick Film Chip Resistors
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
SIZE 0402 to 2512
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
Stability for product types:
D/CRCW e3 1to 10 M
4.5 - Resistance - ± 1 % ± 5 %
4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown
4.13 - Short time overload
U= 2.5 x
2 x Umax.;
duration: Acc. to style
±0.25 % R + 0.050.5 % R + 0.05)
4.17.2 58 (Td) Solderability
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) C
(3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 - Temperature
coefficient
(20/- 55/20) C and
(20/125/20) C± 100 ppm/K ± 200 ppm/K
4.32 21 (Uu3)Shear
(adhesion)
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N No visible damage
4.33 21 (Uu1) Substrate bending Depth 2 mm;
3 times
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 )
4.19 14 (Na) Rapid change of
temperature
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
1000 cycles ± (1 % R + 0.05 (1 % R + 0.05 )
4.23 - Climatic sequence: -
± (1 % R + 0.05 (2 % R + 0.1 )
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic 55 °C; 90 % RH;
24 h; 1 cycle
4.23.4 1 (Aa) Cold - 55 °C; 2 h
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; 90 % RH;
24 h; 5 cycles
4.23.7 - DC load U=
4.25.1 - Endurance
at 70 °C
U= Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (1 % R + 0.05 (2 % R + 0.1 )
70 °C; 8000 h ± (2 % R + 0.1 (4 % R + 0.1 )
P70 x R
P70 x R
P70 x R
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Standard Thick Film Chip Resistors Vishay
This datasheet is subject to change without notice.
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All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
4.18.2 58 (Td) Resistance to
soldering heat
Solder bath method
(260 ± 5) C;
(10 ± 1) s
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.35 - Flamability,
needle flame test
IEC 60695-11-5;
10 s No burning after 30 s
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (1 % R + 0.05 )
4.25.3 -
Endurance at
upper category
temperature
155 °C, 1000 h ± (1 % R + 0.05 (2 % R + 0.1 )
4.40 -
Electrostatic
discharge
(human body model)
IEC 61340-3-1;
3 pos. + 3 neg.
discharges;
ESD voltage acc. to size
± (1 % R + 0.05 )
4.29 45 (XA) Component solvent
resistance
Isopropyl alcohol;
50 °C; method 2 No visible damage
4.30 45 (XA) Solvent resistance
of marking
Isopropyl alcohol;
50 °C; method 1,
toothbrush
Marking legible,
no visible damage
4.22 6 (Fc) Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz;
x, y, z 1.5 mm;
A 200 m/s2;
10 sweeps per axis
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.37 - Periodic electric
overload
U=
2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles
± (1 % R + 0.05 )
4.27 -
Single pulse high
voltage overload,
10 µs/700 µs
Û= 10 x
2 x Umax.;
10 pulses
± (1 % R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
SIZE 0402 to 2512
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
Stability for product types:
D/CRCW e3 1to 10 M
15 x P70 x R
P70 x R
Document Number: 91000 www.vishay.com
Revision: 11-Mar-11 1
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