Connectivity and Integration
Delphi DDR2 DIMM Sockets
www.delphi.com/connect
Connection Systems
19200 Asheville Highway
P. O. Box 519, Landrum, SC 29356 U.S.A.
Tel: [1] 864.457.3824
Fax: [1] 864.457.2535
Description –
1mm centerline sockets for DDR2 DIMM
(Double Data Rate 2, Dual In-line Memory Modules). These
sockets are provided with dual eject latches for easy module
removal, voltage keys to enable proper module insertion, and
color keyed latches for visual end-user identification.
Ty pical Applications –
Desktop computers
Servers
Network routers, switches and hubs
Benefits/Features:
Flexible System . . . The 240 position socket is available in
. . . . . . . . . . . . . . several solder tail lengths to accommodate
. . . . . . . . . . . . . . various PCB thicknesses.
. . . . . . . . . . . . . . Latches are available in different colors for
. . . . . . . . . . . . . . visual identification.
Industry Standard . . Meets JEDEC MO-237C module mating
. . . . . . . . . . . . . . requirements for DDR2 DIMM.
Reliability . . . . . . . . Several gold plating options are available
. . . . . . . . . . . . . . for improved reliability.
Product Type DDR2 DIMM Sockets
To t al No. of Positions 240
Centerline Spacing 1.0 mm [.039 in.]
Orientation Vertical
Mounting Style Through Hole
Voltage 1.8 V & 2.5 V
Insertion Style Vertical
Contact Style Formed
Contact Area Plating Gold-plated (see product print for thickness)
Height Above Board 5.2 mm [.205 in.]
Housing Color Black
Latch Color White, black or blue
PCB Retention Feature Yes
Packaging Type Tray
Housing Material LCP
Applicable Soldering Process IR, vapor phase, wave
Contact Base Material Copper alloy
Latch Base Material Stainless steel
Floating Tab Material Copper alloy
Insulation Resistance 250 MΩ(initial)
Withstanding Voltage 500 VAC (initial)
Current Rating 0.5 amp max. per contact
Contact Resistance 30 mΩ(initial)
Voltage Rating 25 VAC
Temperature Range -55°C to +85°C
Normal Force 0.69 N [70 gf] min.
Contact Retention Force 4.90 N [500 gf] min.
Durability (Mating Cycles) 25
PCB Mating Force 111.20 N [25 lbf] max.
Plating (Contact Area) Gold (thickness varies per Delphi spec.)
over nickel underplating
Plating (Soldering End) 2.54 µm [100 µin.] tin-lead over nickel
underplating
Plating (Floating Tab) 2.54 µm [100 µin.] tin-lead over nickel
underplating
Underplating 1.27 µm [50 µin.] nickel
Standards JEDEC MO-237C
Approvals and Certification UL approved
Selectable Features
Other Properties
Printed on Recycled Paper © 2004 Delphi. All rights reserved. DP-04-E-136 804/3M-OG
Delphi DDR2 DIMM Sockets
Ordering Nomenclature
Voltage/Color:
1= 1.8 V - black housing/white latch
2= 2.5 V - black housing/white latch
3= 1.8 V - black housing/black latch
4= 2.5 V - black housing/black latch
5= 1.8 V - black housing/blue latch
6= 2.5 V - black housing/blue latch
Plating:
1= Gold flash
2= 0.38 µm [15 µin.] gold
Ta il Length (Dim. “B”):
1= 2.54 mm [0.100 in.]
2= 3.00 mm [0.118 in.]
15496530 – 1 3 2
Unless otherwise specified, dimensions are shown in millimeters and [inches].
