General Specifications
Flangeless Resistors
150 W
atts, 100
Model RFP-150-100RCGN
Resistive Element:
Thick film
Substrate:
Beryllium oxide ceramic
Cover:
Alumina ceramic
Lead(s):
99.99% pure silver (.005” thk)
Outline Drawing
RFP
150-100
RCGN
.150
.042
.070
.120
.125
.250
.150
.375
Flangeless Resistors
Features
•
DC - 2.0 GHz
•
150 W
atts
•
BeO Ceramic
•W
elded Silver Leads
•
Non-Nichrome Resistive
Element
•
100% T
ested
Ω
1
Sales Desk USA:
V
oice:
(8
0
0)
54
4
-
2414
Fax:
(3
15)
432-9121
Sales Desk Europe:
V
oice:
(+4
4)
23 92 232392
Fax:
(+4
4)
23 92 25
1
369
Notes:
T
olerance is ±
.010, unless otherwise specified. Operating
temperature is -55°C to +150°C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400.
All dimensions are in
inches. Lead length 0.15” minimum.
Specifications subject to change without notice.
Electrical Specifications
Resistance V
alue:
100 ohms, ±
5%
Frequency Range:
DC - 2.0 GHz
Power:
150 W
atts
Capacitance:
3.5 pF
VER. 12/5/01
Flangeless Resistors
Model RFP-150-100RCGN
T
ypical Per
formance
2
Sales Desk USA:
V
oice:
(8
0
0)
54
4
-
2414
Fax:
(3
15)
432-9121
Sales Desk Europe:
V
oice:
(+4
4)
23 92 232392
Fax:
(+4
4)
23 92 25
1
369
Power Derating
Suggested Mounting Pr
ocedures
1.
Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer
.
2.
Position device on mounting surface and solder in place
using an indalloy type or an SN63 type solder
.
3.
Solder leads in place using an SN63 type solder with a
controlled temperature iron (210°C).
MIN.
.025
(2 PLACES)
SUGGESTED STRESS RELIEF METHODS
BOARD LOWER
THAN LEAD.
WITH LEAD.
BOARD EVEN
SCALE:
SCALE:
BOARD HIGHER
THAN LEAD.
THAN LEAD.
BOARD LOWER
NOT RECOMMENDED APPLICATION
CASE TEMPERATURE —
°
C
% OF RATED POWER
150
125
100
75
50
25
100
75
25
50
0
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