MS5607-02BA03Barometric Pressure Sen so r, with st ain le ss ste el cap
DA5607-02BA03_018 www.meas-spec.com Sept. 26, 2012
000056071438 ECN1741 1/19
• High resolution module, 20cm
• Fast conversion down to 1 ms
• Low power, 1 µA (standby < 0.15 µA)
• QFN package 5.0 x 3.0 x 1.0 mm3
• Supply voltage 1.8 to 3.6 V
• Integrated digital pressure sensor (24 bit ΔΣ ADC)
• Operating range: 10 to 1200 mbar, -40 to +85 °C
• I2C and SPI interface up to 20 MHz
• No external components (Internal oscillator)
• Excellent long term stability
DESCRIPTION
The MS5607-02BA is a new generation of high resolution altimeter sensors from MEAS Switzerland with SPI
and I2C bus interface. This barometric pressure sensor is optimized for altimeters and variometers with an
altitude r esol uti on of 20 c m. The sensor m odule i nclud es a hig h line ar ity pressure s ens or and a n ul tr a l o w power
24 bit ΔΣ ADC with internal factory calibrated coefficients. It provides a precise digital 24 bit pressure and
temperature value and different operation modes that allow the user to optimize for conversion speed and
current consumption. A high resolution temperature output allows the implementation of an
altimeter/thermometer function without any additional sensor. The MS5607-02BA can be interfaced to virtually
any micr oc ontroller. The comm unic ation prot oc ol is s i mple, without the need of pr ogr am ming internal regi sters in
the device. Small dimensions of only 5.0 mm x 3.0 mm and a height of only 1.0 mm allow for integration in
mobile devices. This new sensor module generation is based on leading MEMS technology and latest benefits
from MEAS Switzerland proven experience and know-how in high volume manufacturing of altimeter modules,
which have been widely used for over a decade. The sensing principle employed leads to very low hysteresis
and high stability of both pressure and temperature signal.
FEATURES
FIELD OF APPLICATION TECHNICAL DATA
Mobile altimeter / barometer systems Sensor Performances (VDD = 3 V)
Bike computers
Pressure
Min
Typ
Max
Unit
Variometers
Range 10 1200 mbar
Dataloggers
ADC 24 bit
Mobile phones / GPS Resolution (1)
0.13 / 0.084 / 0.054
/ 0.036 / 0.024
mbar
FUNCTIONAL BLOCK DIAGRAM
VDD
GND
PS
SCLK
SDO
SDI/SDA
Meas. MUX
ADC
Digital
Interface
Memory
(PROM)
128 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interface IC
PGA
CSB
Accuracy 25°C, 750 mb ar -1.5 +1.5 mbar
Error band, -20°C to + 85°C
300 to 1100 mbar (2)
-2.5 +2.5 mbar
Response time (1)
0.5 / 1.1 / 2.1 / 4.1 /
8.22
ms
Long term stabilit y ±1 mbar/yr
Temperature Min Typ Max Unit
Range -40 +85 °C
Resolution
<0.01
°C
Accuracy -0.8 +0.8 °C
Notes: (1) Oversampling Rat i o: 256 / 512 / 1024 / 2048 / 4096
(2) With autozero at one pressure point
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PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Supply voltage
VDD
-0.3
+4.0
V
Storage temperature
TS
-40
+125
°C
Overpressure
Pmax
6
bar
Maximum Soldering
Temperature
Tmax 40 sec max 250 °C
ESD rating
Human Body
Model
-4 +4 kV
Latch up
JEDEC standard
No 78
-100 +100 mA
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Operating Supply voltage
VDD
1.8
3.0
3.6
V
Operating Temperature
T
-40
+25
+85
°C
Supply current
(1 sample per sec.) IDD
OSR 4096
2048
1024
512
256
12.5
6.3
3.2
1.7
0.9
µA
Peak supply current
during conversion
1.4
mA
Standby supply current
at 25°C
0.02
0.14
µA
VDD Capacitor
From VDD to GND
100
nF
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output Word
24
bit
Conversion time tc
OSR 4096
2048
1024
512
256
7.40
3.72
1.88
0.95
0.48
8.22
4.13
2.08
1.06
0.54
9.04
4.54
2.28
1.17
0.60
ms
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PERFORMANCE SPECIFICATIONS (CONTINUED)
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Operating Pressure Range
Prange
Full Accuracy
300
1100
mbar
Extended Pressure Range Pext
Linear Range of
ADC
10 1200 mbar
Total Error band, no autozero at 25°C, 700..1100 mbar
at 0..50°C, 300..1100 mbar
at -20..85°C , 300.. 1100 mbar
-1.5
-2.0
-3.5 +1.5
+2.0
+3.5 mbar
Total Error band, autozero at
one pressure poi nt
at 25°C, 700..1100 mbar
at 0..50°C, 300..1100 mbar
at -20..85°C , 300.. 1100 mbar
-0.5
-1.0
-2.5 +0.5
+1.0
+2.5 mbar
Maximum error with supply
voltage
VDD = 1.8 V … 3.6 V -2.5 +2.5 mbar
Resolution RMS
OSR 4096
2048
1024
512
256
0.024
0.036
0.054
0.084
0.130
mbar
Long-term stability
±1
mbar/yr
Reflow soldering impact
IPC/JEDEC J-STD-020C
(See application note AN808)
+0.4 mbar
Recovering time after reflow (1)
7
days
(1) Time to recovering at least 66% of the reflow impact
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Absolute Accuracy
at 25°C
-20..85°C
-40..85°C
-0.8
-2.0
-4.0
+0.8
+2.0
+4.0
°C
Maximum error with supply
voltage
VDD = 1.8 V … 3.6 V -0.5 +0.5 °C
Resolution RMS
OSR 4096
2048
1024
512
256
0.002
0.003
0.005
0.008
0.012
°C
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PERFORMANCE SPECIFICATIONS (CONTINUED)
DIGITAL INPUTS (CSB, I2C, DIN, SCLK)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Serial data cloc k SCLK
SPI protocol
20
MHz
I2C pr otocol
400
KHz
Input high volta ge
VIH
Pins CSB
80% VDD
100% VDD
V
Input low voltage
VIL
0% VDD
20% VDD
V
Input leakage cur rent Ileak25°C
Ileak85°C
at 25°C 0.15 µA
Input capacitance
CIN
6
pF
PRESSURE OUTPUTS (I2C, DOUT)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output high voltage
VOH
Isource = 1. 0 mA
80% VDD
100% VDD
V
Output low voltage
VOL
Isink = 1.0 mA
0% VDD
20% VDD
V
Load capacitan ce
CLOAD
16
pF
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FUNCTIONAL DESCRIPTION
VDD
GND
PS
SCLK
SDO
SDI/SDA
Meas. MUX
ADC
Digital
Interface
Memory
(PROM)
128 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interface IC
PGA
CSB
Figure 1: Block diagram of MS5607-02BA
GENERAL
The MS5607-02BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the
MS5607-02BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure
sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every m odule is indi viduall y factor y calibrated at t wo t em peratures and two press ures. As a result, 6 c oeff icients
necessary to compensate for process variations and temperature variations are calculated and stored in the
128-bit PROM of each module. These bits (partitioned into 6 coefficients) must be read by the microcontroller
software and used in the program converting D1 and D2 into compensated pressure and temperature values.
SERIAL INTERFACE
The MS5607-02BA has built in two t ypes of serial interfaces : SPI and I 2C. Pulling the Protocol Select pin PS to
low selects the SPI protocol, pulling PS to high activates the I2C bus protocol.
Pin PS
Mode
Pins used
High
I2C
SDA
Low
SPI
SDI, SDO, CSB
SPI MODE
The ext ernal m icrocontroll er cloc ks in the data thr ough the input SC LK (Seria l CLoc K) and SDI (Serial Data I n).
In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor
responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the
interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the
command is sent or after the end of the command execution (for example end of conversion). The best noise
perform ance from the m odule is obtained w hen the SPI bus is idle and without com munication to other devices
during the ADC conversion.
MS5607-02BA03 Barometric Pressure Sen so r, with st ain l ess st eel cap
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I2C MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDA (Serial DAta).
The sensor responds on t he same pin SDA which is bi directi onal for the I 2C bus interf ace. So this interf ace t ype
uses onl y 2 signal l ines and does not require a c hip select, which c an be favourabl e to reduce board spac e. In
I2C-Mode the com plement of the pin C SB (Chip Select) represents the LSB of the I2C address. It is possible to
use two sensors with two different addresses on the I2C bus. The pin CSB shall be connected to VDD or GND
(do not leave unconnected!).
COMMANDS
The MS5607-02BA has only five basic commands:
1. Reset
2. Read PROM (128 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
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PRESSURE AND TEMPERATURE CALCULATION
Size
[1]
[bit]
min
max
C1
Pressure sensitivity | SENS
T1
unsigned int 16
16
0
65535
46372
C2
Pressure offset | OFF
T1
unsigned int 16
16
0
65535
43981
C3
Temperature coefficient of pressure sensitivity | TCS
unsigned int 16
16
0
65535
29059
C4
Temperature coefficient of pressure offset | TCO
unsigned int 16
16
0
65535
27842
C5
Reference temperature | T
REF
unsigned int 16
16
0
65535
31553
C6
Temperature coefficient of the temperature | TEMPSENS
unsigned int 16
16
0
65535
28165
D1
Digital pressure value
unsigned int 32
24
0
16777216
6465444
D2
Digital temperature value
unsigned int 32
24
0
16777216
8077636
dT
Difference between actual and reference temperature
[2]
dT
= D2 - T
REF
=
D2
-
C5 * 2
8
signed int 32
25
-16776960
16777216
68
2000
= 20.00 °C
OFF
Offset at actual temperature
[3]
OFF
=
OFF
T1
+
TCO
*
dT =
C2
*
2
17
+
(C4
*
dT
)
/
2
6
signed int 64
41
-17179344900
25769410560
5764707214
SENS
Sensitivity at actual temperature
[4]
SENS
=
SENS
T1
+
TCS
*
dT
=
C1 * 2
16
+
(
C3
*
dT
)
/
2
7
signed int 64
41
-8589672450
12884705280
3039050829
110002
= 1100.02 mbar
Notes
[1]
[2]
[3]
[4]
Calculate temperature compensated pressure
8500
-4000
TEMP
41
Convert calibration data into coefficients (see bit pattern of W1 to W4)
Variable
Example /
Typical
Value
Recommended
variable type
Description | Equation
signed int 32
Actual temperature (-40…85°C with 0.01°C resolution)
TEMP
=
20°C
+
dT
*
TEMPSENS
=
2000
+
dT
*
C6
/
2
23
Read digital pressure and temperature data
signed int 32
Temperature compensated pressure (10…1200mbar with
0.01mbar resolution)
P
= D1 * SENS - OFF =
(D1 * SENS / 2
21
- OFF) / 2
15
min and max have to be defined
min and max have to be defined
min and max have to be defined
Maximal size of intermediate result during evaluation of variable
120000
1000
58
P
Start
Maximum values for calculation results:
P
MIN
= 10mbar P
MAX
= 1200mbar
T
MIN
= -40°C T
MAX
= 85°C T
REF
= 20°C
Read calibration data (factory calibrated) from PROM
Read digital pressure and temperature data
Calculate temperature
Calculate temperature compensated pressure
Display pr ess ure an d temperature valu e
Figure 2: Flow chart for pressure and temperature reading and software compensation.
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SECOND ORDER TEMPERATURE CO MPENS ATIO N
In order to obtain best accuracy over temperature range, particularly in low temperature, it is recommended to
compensate the non-linearity over the temperature. This can be achieved by correcting the calculated
temper ature, offs et and sensitivit y by a second order c orrection factor and will be recalcu lated with the standard
calculation. The second-order factors are calculated as follows:
Yes
No
SENS2 = 2 ⋅ (TEM P – 2000)2
SENS2 = 0
SENS = SENS - SENS2
TEMP<20°C
Low temperature
T2 = dT
2
/ 2
31
OFF2 = 0
T2 = 0
OFF2 = 61 ⋅ (TEMP – 2000)
2
/ 2
4
OFF = OFF - OFF2
TEMP = TEMP - T2
Low temperature
High temperature
Calculate pressure and temperature
TEMP<-15°C
No
Yes
SENS2 = SENS2 + 8 ⋅ (TEMP + 1500)
2
Low temperature
OFF2 = OFF2 + 15 ⋅ (TEMP + 1500)
2
Very low temperature
Figure 3: Flow chart for pressure and temperature to the optimum accuracy.
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SPI INTERFACE
COMMANDS
Size of each c ommand is 1 byte (8 bits ) as described in the tab le below. After AD C read commands the device
will return 24 bit result and after the PRO M read 16bit result. The address of the PROM is embedded inside of
the PROM read command using the a2, a1 and a0 bits.
Command by te
hex value
Bit number
0
1
2
3
4
5
6
7
Bit name
PR
M
COV
-
Typ
Ad2/
Os2
Ad1/
Os1
Ad0/
Os0
Stop
Command
Reset
0
0
0
1
1
1
1
0
0x1E
Convert D1 (OSR=256)
0
1
0
0
0
0
0
0
0x40
Convert D1 (OSR=512)
0
1
0
0
0
0
1
0
0x42
Convert D1 (OSR=1024)
0
1
0
0
0
1
0
0
0x44
Convert D1 (OSR=2048)
0
1
0
0
0
1
1
0
0x46
Convert D1 (OSR=4096)
0
1
0
0
1
0
0
0
0x48
Convert D2 (OSR=256)
0
1
0
1
0
0
0
0
0x50
Convert D2 (OSR=512)
0
1
0
1
0
0
1
0
0x52
Convert D2 (OSR=1024)
0
1
0
1
0
1
0
0
0x54
Convert D2 (OSR=2048)
0
1
0
1
0
1
1
0
0x56
Convert D2 (OSR=4096)
0
1
0
1
1
0
0
0
0x58
ADC Read
0
0
0
0
0
0
0
0
0x00
PROM Read
1
0
1
0
Ad2
Ad1
Ad0
0
0xA0 to
0xAE
Figure 4: Command structure
RESET SEQUENCE
The Res et s e que nce s ha ll be s en t o nc e af ter po wer -on to make sur e tha t th e c a li bratio n PRO M ge ts lo ade d into
the internal register. It can be also used to reset the device ROM from an unknown condition
Figure 5: Reset command sequence SPI mode 0
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Figure 6: Reset command sequence SPI mode 3
CONVERSION SEQUENC E
The conver sion com m and is used to init iate uncom pens ated press ure (D1) or uncom pens ated tem perature ( D2)
conversion. The chip select can be disabled during this time to communicate with other devices.
After the con version, using ADC read comm and the result is clock ed out with the MSB f irst. If the convers ion is
not execut ed bef ore the ADC r ead comm and, or the A DC read c omm and is r epeated, it wil l give 0 as the o utput
result. If the ADC read comm and is sent dur ing convers ion the result will be 0, t he conversion will not stop and
the final resu lt will be wrong. Convers ion sequenc e sent duri ng the alread y started c onversion proc ess will yield
incorrect result as well.
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
SDO
PS
8.22ms ADC CONVERSION
Figure 7: Conversion out sequence, Typ=d1, OSR = 4096
Figure 8: ADC Read sequence
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the
calibratio n PROM and to c alculate the calibration coefficients. T here are in total 8 addres ses resulting in a total
memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and
address 7 conta ins t he ser ial co de and CRC. T he comm and s equence is 8 b its l ong with a 16 bit resul t whic h i s
clocked with the MSB first.
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
SDO
PS
2.8ms RELOAD
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Figure 9: PROM Read sequence, address = 011 (Coefficient 3).
I2C INTERFACE
COMMANDS
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5607-02BA address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does
not have a microcontroller inside, the commands for I2C and SPI are quite similar.
RESET SEQUENCE
The res et c an be s e nt at a n y t ime. In the e vent that the r e is n ot a succes sful power on res et th is may be caus ed
by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5607-02BA to
function is to send several SCLKs followed by a reset sequence or to repeat power on reset.
1
1
1
0
1
1
CSB
0
0
0
0
0
1
1
1
1
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
cmd byte
Device Address
Device Address
command
Figure 10: I2C Reset Command
PROM READ SEQUENCE
The PROM Read command consists of two parts. First command sets up the system into PROM read mode.
The second part gets the data from the system.
1
1
1
0
1
1
CSB
0
0
1
0
1
0
0
1
1
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Conditi on
R = Read
N = Not Acknowledge
command
Device Address
Device Address
cmd byte
Figure 11: I2C Command to read memory address= 011 (Coefficient 3)
111011
CSB
10XXXXXXXX0XXXXXXXX0
S R A A N P
From Master S = Start Condition W = Write A = Acknowledge
From Slave P = Stop Condition R = Read N = Not Acknowledage
Device Address
data
data
Device Address
Memory b it 15 - 8
Memory b it 7 - 0
Figure 12: I2C answer from MS5607-02BA
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CONVERSION SEQUENC E
A convers ion can be started b y sendin g the comm and to MS5607-02BA. W hen command is sent to the s ystem
it stays busy until conver sio n is don e. When convers io n is f inished t he d ata can be acces s ed b y sendi ng a R ead
command, when an ack nowledge appears from the MS5607-02BA, 24 SCLK cycles m ay be sent to rece ive all
result bits. Every 8 bit the system waits for an acknowledge signal.
1
1
1
0
1
1
CSB
0
0
0
1
0
0
1
0
0
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
command
cmd byte
Device Address
Device Address
Figure 13: I2C Command to in i tiate a pre ssur e conversion (OSR=4096, t y p=D1)
1
1
1
0
1
1
CSB
0
0
0
0
0
0
0
0
0
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
command
Device Address
Device Address
cmd byte
Figure 14: I2C ADC read sequence
1
1
1
0
1
1
CSB
1
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
S
R
A
A
A
N
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
data
data
data
Device Address
Device Address
Data 23-16
Data 7 - 0
Data 8 - 15
Figure 15: I2C answer from MS5607-02BA
CYCLIC REDUNDANCY CHECK (CRC)
MS5607-02BA contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data
validity in memory. The application note AN520 describes in detail CRC-4 code used.
A
d
d
D
B
1
5
D
B
1
4
D
B
1
3
D
B
1
2
D
B
1
1
D
B
1
0
D
B
9
D
B
8
D
B
7
D
B
6
D
B
5
D
B
4
D
B
3
D
B
2
D
B
1
D
B
0
0
16 bit reserved for manufacturer
1
Coefficient 1 (16 bit unsigned)
2
Coefficient 2 (16 bit unsigned)
3
Coefficient 3 (16 bit unsigned)
4
Coefficient 4 (16 bit unsigned)
5
Coefficient 5 (16 bit unsigned)
6
Coefficient 6 (16 bit unsigned)
7
CRC
Figure 16: Memory PROM mapping
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APPLICATION CIRCUIT
The MS5607-02BA is a circuit that can be used in conjunction with a microcontroller in mobile altimeter
applicat ions. It is desig ned for low-voltage systems with a supply voltage of 3 V.
Figure 17: Typical application circuit with SPI / I2C proto col comm uni cat ion
MS5607-02BA
MS5607-02BA
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PIN CONFIGURATION
Pin
Name
Type
Function
1
VDD
P
Positive supply voltage
2 PS I
Protocol sele ct
PS high (VDD) I2C
PS low (GND) SPI
3 GND G Ground
4
CSB I Chip select (active low),
internal connection
5
6
SDO
O
Serial data output
7 SDI /
SDA I / IO Serial data input /
I2C data IO
8
SCLK
I
Serial data cloc k
DEVICE PACKAGE O UTL INE
Figure 18: MS5607-02BA03 package outline
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RECOMMENDED PAD LAYOUT
Pad layout for bottom side of the MS5607-02BA soldered onto printed circuit board.
SHIPPING PAC KA GE
Tape and T ape and reel
Reserved area:
Please do not route
tracks between pads
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MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering issues.
MOUNTING
The MS5607-02BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to th e l o w str ess as sembly the sens or does not s h o w pres sur e h ysteresis eff ec ts .
It is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important
for applications in watches and other special devices.
CLEANING
The MS5607-02BA has been manufactured under cleanroom conditions. It is therefore recommended to
assem ble the sens or under class 10 ’000 or b etter co nditions. Should t his not be poss ible, it is recomm ended to
protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB,
solder paste of type “no-clean” shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore
essential to ground machines and personnel properly during assembly and handling of the device. The
MS5607-02BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used
during the assembly of the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A 100 nF ceramic capacitor
must be placed as close as possible to the MS5607-02BA VDD pin. This capacitor will stabilize the power
supply during data conversion and thus, provide the highest possible accuracy.
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TYPICAL PERFORMANCE CHARACTERISTICS
Absolute Pressure Accuracy, 2nd order compensation
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
300 400 500 600 700 800 900 1000 1100
Pressure (mbar)
Pressure error (mbar)
85°C
60°C
20°C
0°C
-40°C
Pressure Error Accuracy vs temperature
-4
-3
-2
-1
0
1
2
3
4
-40 -20 020 40 60 80
Temperature (°C)
Pressure error (mbar)
Perror(1000,2nd order)
Perror(800,2nd order)
Perror(300,2nd order)
Temperature Error Accuracy vs temperature
-5
0
5
10
15
-40 -20 020 40 60 80
Temperature ( °C)
Temperature error (°C)
Temperature error (standard
calculation)
Temperature error (with 2nd
order calculation)
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TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED)
Pressure error vs supply voltage (typical)
-2.00
-1.50
-1.00
-0.50
0.00
0.50
1.00
1.50
2.00
1.8 22.2 2.4 2.6 2.8 33.2 3.4 3.6
Voltage (V)
Pressure error (mbar)
1000 mbar
Temperature error vs supply voltage (typical)
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
1.8 22.2 2.4 2.6 2.8 33.2 3.4 3.6
Voltage (V)
Temperature error (°C)
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ORDERING INFORMATION
Product Code
Product
Art. No
Delivery Form
MS5607-02BA03 Ba rometric Pressure Sensor
Thin Metal Cap MS560702BA03-00 Waffle pack
MS5607-02BA03 Ba rometric Pressure Sensor
Thin Metal Cap MS560702BA03-50 Tape and reel
FACTORY CONTACT S
NORTH AMERICA EUROPE ASIA
Measurement Specialties
45738 Northp ort Loop West
Fremont, CA 94538
Tel: +1 800 767 1888
Fax: +1 510 498 1578
e-mail: pfg.cs.amerameas-spec.com
Website: www.meas-spec.com
MEAS Switzerland Sàrl
Ch. Chapons-des-Prés 11
CH-2022 Bevaix
Tel: +41 32 847 9550
Fax: + 41 32 847 9569
e-mail: sales.chameas-spec.com
Website: www.meas-spec.com
Measurement Specialties (China), Ltd.
No. 26 Langshan Road
Shenzhen High-Tech Park (North)
Nanshan District, Shenzhen, 518057
China
Tel: +86 755 3330 5088
Fax: +86 755 3330 5099
e-mail: pfg.cs.asiaameas-spec.com
Website: www.meas-spec.com
The information in this sheet has been carefull y reviewed and is believed to be accurate; however, no responsibilit y is assumed for
inaccuracies. Furtherm ore, this inform ation does not convey to the purchaser of such devices any license under the patent rights to the
manufacturer. Measurement Specialties, Inc. reserves the right to make changes without further notice to any product herein. Measurement
Specialti es, Inc. makes no warranty, represent ation or guarant ee regarding the sui t abili t y of its product for any particular purpose, nor does
Measurement Specialti es, Inc. assume any liability arising out of the applicat i on or use of any product or circuit and specifically disclaims
any and all liabilit y, includi ng without limitation consequential or incidental damages. Typical parameters can and do vary in different
applicat i ons. All operat i ng parameters must be validated for each customer applic ation by customer’s tec hni c al experts. Measurem ent
Specialti es, Inc. does not convey any license under its patent rights nor the rights of others.
