2009, 2010
1. Anode
2. Cathode
3. Emitter
4. Collector
12
43
PIN CONNECTION
(Top View)
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
DESCRIPTION
The PS2561D-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor.
The PS2561D-1 is in a plastic DIP (Dual In-line Package) and the PS2561DL-1 is lead bending type (Gull-wing) for
surface mount.
The PS2561DL1-1 is lead bending type for long creepage distance.
The PS2561DL2-1 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
• Operating ambient temperature: 110°C
High Isolation voltage (BV = 5 000 Vr.m.s.)
High collector to emitter voltage (VCEO = 80 V)
High current transfer ratio (CTR = 160% TYP.)
High-speed switching (tr = 3
μ
s TYP., tf = 5
μ
s TYP.)
Ordering number of taping product: PS2561DL-1-F3 : 2 000 pcs/reel
: PS2561DL2-1-E3: 1 000 pcs/reel
• Pb-Free product
• Safety standards
UL approved: No. E72422
CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
BSI approved: No. 7112/7420
SEMKO approved: No. 903238
NEMKO approved: No. P09210868
DEMKO approved: No. 314999
FIMKO approved: No. FI 25119
DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008862 (Option)
APPLICATIONS
• Power supply
• Telephone/FAX.
• FA/OA equipment
Programmable logic controller
<R>
DATA SHEET
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
PHOTOCOUPLER
PS2561D-1,PS2561DL-1
PS2561DL1-1,PS2561DL2-1
DIP PHOTOCOUPLER
OPERATING AMBIENT TEMPERATURE 110°C NEPOC Series
Document No. PN10777EJ02V0DS (2nd edition)
Date Published January 2010 NS
Printed in Japan
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type Long Creepage Distance
PS2561D-1
3.5±0.3
4.15±0.43.2±0.4
2.54
1.25±0.15 0.50±0.10
0.25
M
4.6±0.35
6.5±0.5
0 to 15°
7.62
0.25
+0.1
–0.05
12
43
PS2561DL1-1
0 to 15°
0.25
+0.1
–0.05
10.16
2.54
0.25 M
0.50±0.1
1.25±0.15
3.85
±0.4
3.15
±0.35
3.5
±0.3 6.5±0.5
4.6±0.35
12
43
Lead Bending Type Long Creepage Distance (Gull-Wing)
PS2561DL-1
0.25
M
4.6±0.35
6.5±0.5
3.5±0.3
2.54
1.25±0.15 0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
12
43
PS2561DL2-1
0.25 M
2.54
1.25±0.15
3.5±0.3 6.5±0.5
4.6±0.35
11.8
+0.2
–0.5
0.25
+0.1
–0.05
0.25±0.2
0.9±0.25
10.16
12
43
0.15
0.15
PHOTOCOUPLER CONSTRUCTION
Parameter PS2561D-1, PS2561DL-1 PS2561DL1-1, PS2561DL2-1
Air Distance (MIN.) 7 mm 8 mm
Outer Creepage Distance (MIN.) 7 mm 8 mm
Inner Creepage Distance (MIN.) 4 mm 4 mm
Isolation Distance (MIN.) 0.4 mm 0.4 mm
<R>
Data Sheet PN10777EJ02V0DS
2
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
MARKING EXAMPLE
2561D
NR031
Assembly Lot
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
No. 1 pin
Mark
N031
R
Package
New PKG
Made in TaiwanMade in Japan
YR
Pb-Free and
Halogen Free
<R>
Data Sheet PN10777EJ02V0DS 3
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification Packing Style Safety Standard
Approval Application
Part Number *1
PS2561D-1 PS2561D-1Y-A Special version Magazine case 100 pcs Standard products PS2561D-1
PS2561DL-1 PS2561DL-1Y-A (Pb-Free and (UL, CSA, BSI, PS2561DL-1
PS2561DL1-1 PS2561DL1-1Y-A Halogen Free) NEMKO, DEMKO, PS2561DL1-1
PS2561DL2-1 PS2561DL2-1Y-A SEMKO, FIMKO PS2561DL2-1
PS2561DL-1-F3 PS2561DL-1Y-F3-A Embossed Tape 2 000 pcs/reel approved) PS2561DL-1
PS2561DL2-1-E3 PS2561DL2-1Y-E3-A Embossed Tape 1 000 pcs/reel PS2561DL2-1
PS2561D-1-V PS2561D-1Y-V-A Magazine case 100 pcs DIN EN60747-5-2 PS2561D-1
PS2561DL-1-V PS2561DL-1Y-V-A (VDE0884 Part2) PS2561DL-1
PS2561DL1-1-V PS2561DL1-1Y-V-A approved (Option) PS2561DL1-1
PS2561DL2-1-V PS2561DL2-1Y-V-A PS2561DL2-1
PS2561DL-1-V-F3 PS2561DL-1Y-V-F3-A Embossed Tape 2 000 pcs/reel PS2561DL-1
PS2561DL2-1-V-E3 PS2561DL2-1Y-V-E3-A Embossed Tape 1 000 pcs/reel PS 2561DL2-1
*1 For the application of the Safety Standard, following part number should be used.
<R>
Data Sheet PN10777EJ02V0DS
4
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Reverse Voltage VR 6 V
Forward Current (DC) IF 40 mA
Power Dissipation Derating
Δ
PD/°C 1.5 mW/°C
Power Dissipation PD 150 mW
Peak Forward Current*1 IFP 1 A
Transistor Collector to Emitter Voltage VCEO 80 V
Emitter to Collector Voltage VECO 7 V
Collector Current IC 50 mA
Power Dissipation Derating
Δ
PC/°C 1.5 mW/°C
Power Dissipation PC 150 mW
Isolation Voltage*2 BV 5 000 Vr.m.s.
Operating Ambient Temperature TA –55 to +110 °C
Storage Temperature Tstg –55 to +150 °C
*1 PW = 100
μ
s, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10777EJ02V0DS 5
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 10 mA 1.2 1.4 V
Reverse Current IR VR = 5 V 5
μ
A
Terminal Capacitance Ct V = 0 V, f = 1.0 MHz 10 pF
Transistor Collector to Emitter Dark
Current ICEO VCE = 48 V, IF = 0 mA 100 nA
IF = 5 mA, VCE = 5 V 50 160 400 % Coupled Current Transfer Ratio
(IC/IF)*1 CTR
IF = 1 mA, VCE = 5 V 10 80
Collector Saturation
Voltage VCE (sat) IF = 10 mA, IC = 2 mA 0.3 V
Isolation Resistance RI-O VI-O = 1.0 kVDC 1011 Ω
Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz 0.5 pF
Rise Time*2 tr VCC = 10 V, IC = 2 mA, RL = 100 Ω 3
μ
s
Fall Time*2 tf 5
*1 CTR rank
CTR Rank CTR (%) Conditions
80 to 160 IF = 5 mA, VCE = 5 V
H 16 and larger IF = 1 mA, VCE = 5 V
100 to 200 IF = 5 mA, VCE = 5 V
Q 20 and larger IF = 1 mA, VCE = 5 V
130 to 260 IF = 5 mA, VCE = 5 V
W 26 and larger IF = 1 mA, VCE = 5 V
200 to 400 IF = 5 mA, VCE = 5 V
L 40 and larger IF = 1 mA, VCE = 5 V
50 to 400 IF = 5 mA, VCE = 5 V
N 10 and larger IF = 1 mA, VCE = 5 V
*2 Test circuit for switching time
Input
Output
90%
10%
tr
td
tf
ts
ton toff
V
CC
V
OUT
I
F
R
L
= 100 Ω
50 Ω
In monitor
PW = 100 s
Duty cycle = 1/10
μ
Pulse Input
<R>
Data Sheet PN10777EJ02V0DS
6
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
Diode Power Dissipation P
D
(mW)
Transistor Power Dissipation P
C
(mW)
Ambient Temperature T
A
(°C)
Forward Current I
F
(mA)
Forward Voltage V
F
(V)
Collector to Emitter Dark Current I
CEO
(nA)
Ambient Temperature T
A
(°C)
Ambient Temperature T
A
(°C)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
150
100
50
0 25 50 75 100
110
125 150
1.5 mW/°C
150
100
50
25 50 75 100
110
125 1500
10 000
100 110
1 000
100
10
1
7550250–25–50
V
CE
= 48 V
1.5 mW/°C
24 V
10 V
5 V
100
1.51.41.31.21.11.00.90.80.7
50
10
5
1
0.5
0.1
0°C
–25°C
–55°C
+60°C
+25°C
T
A
= +100°C
Collector Current I
C
(mA)
Collector to Emitter Voltage V
CE
(V)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
25
10
20
02
468
I
F
= 1 mA
15
5
10
I
F
= 2 mA
I
F
= 5 mA
I
F
= 10 mA
Collector Saturation Voltage V
CE (sat)
(V)
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
Collector Current I
C
(mA)
0.1
1
10
0 0.2 0.4 0.6 0.8 1.0
I
F
= 1 mA
I
F
= 2 mA
I
F
= 5 mA
I
F
= 10 mA
Remark The graphs indicate nominal characteristics.
<R>
Data Sheet PN10777EJ02V0DS 7
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
Normalized to 1.0
at TA = 25°C,
IF = 5 mA, VCE = 5 V
Ambient Temperature TA (°C)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
50
25 0 25 50 75 100
CTR:270%
CTR:130%
Load Resistance RL (Ω)
Switching Time t ( s)
μ
SWITCHING TIME vs.
LOAD RESISTANCE
0.1
1
10
100
10 100 1 000 10 000
t
f
t
r
t
d
t
s
IC = 2 mA, VCC = 10 V,
CTR = 216%
Frequency f (kHz)
Normalized Gain GV
FREQUENCY RESPONSE
RL = 1 kΩ
300 Ω
100 Ω
IF = 5 mA,
VCE = 5 V
5
0
5
10
15
20
25
0.1 1 10 100 1 000
Load Resistance RL (kΩ)
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
μ
1
10
100
1 000
1 10 100
t
r
t
d
t
s
t
f
IF = 5 mA, VCC = 5 V,
CTR = 216%
Forward Current IF (mA)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
0
50
150
100
200
250
300
350
400
0.01 0.1 1 10 100
VCE = 5 V,
n = 5
B
C
Sample A
D
E
Remark The graphs indicate nominal characteristics.
Data Sheet PN10777EJ02V0DS
8
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
TAPING SPECIFICATIONS (UNIT : mm)
Tape Direction
PS2561DL-1-F3
Outline and Dimensions (Tape)
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
Outline and Dimensions (Reel)
Packing: 2 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
100±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10777EJ02V0DS 9
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
Tape Direction
PS2561DL2-1-E3
Outline and Dimensions (Tape)
2.05±0.1
2.0±0.1
4.0±0.1 1.55±0.1
1.75±0.1
4.4±0.2
12.35±0.15
0.38
11.5±0.1
24.0±0.3
6.6±0.2
12.0±0.1
Outline and Dimensions (Reel)
Packing: 1 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
29.5±1.0
25.5±1.0
23.9 to 27.4
Outer edge of
flange
Data Sheet PN10777EJ02V0DS
10
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm )
D
C
B
A
Part Number
PS2561DL
PS2561DL2
Lead Bending A
lead bending type (Gull-wing)
for long creepage distance (surface mount)
lead bending type (Gull-wing)
for surface mount
8.2
10.2
B
2.54
2.54
C
1.7
1.7
D
2.2
2.2
Data Sheet PN10777EJ02V0DS 11
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260°C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220°C 60 seconds or less
Time to preheat temperature from 120 to 180°C 120±30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220°C
180°C
Package Surface Temperature T (°C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260°C MAX.
120°C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
Peak temperature (lead part temperature) 350°C or below
Time (each pins) 3 seconds or less
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10777EJ02V0DS
12
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
corrector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10777EJ02V0DS 13
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (1/2) (PS2561D-1, PS2561DL-1)
Parameter Symbol Spec. Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1) 55/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM, Pd < 5 pC
UIORM
Upr
890
1 335
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC Upr 1 669 Vpeak
Highest permissible overvoltage UTR 8 000 Vpeak
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) CTI 175
Material group (DIN EN 60664-1 VDE0110 Part 1) III a
Storage temperature range Tstg –55 to +150 °C
Operating temperature range TA –55 to +110 °C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Tsi
Isi
Psi
Ris MIN.
175
400
700
109
°C
mA
mW
Ω
<R>
Data Sheet PN10777EJ02V0DS
14
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (2/2) (PS2561DL1-1, PS2561DL2-1)
Parameter Symbol Spec. Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1) 55/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM, Pd < 5 pC
UIORM
Upr
1 130
1 695
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC Upr 2 119 Vpeak
Highest permissible overvoltage UTR 8 000 Vpeak
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) CTI 175
Material group (DIN EN 60664-1 VDE0110 Part 1) III a
Storage temperature range Tstg –55 to +150 °C
Operating temperature range TA –55 to +110 °C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Tsi
Isi
Psi
Ris MIN.
175
400
700
109
°C
mA
mW
Ω
<R>
Data Sheet PN10777EJ02V0DS 15
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
The information in this document is current as of January, 2010. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products
and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC
Electronics products are not taken measures to prevent radioactive rays in the product design. When customers
use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate
sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in
order to avoid risks of the damages to property (including public or social property) or injury (including death) to
persons, as the result of defects of NEC Electronics products.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
M8E0904E
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
Data Sheet PN10777EJ02V0DS
16
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corpo ration took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. ex cis ion, etc.), and any other applic ati ons or purposes that pose a direct threat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation , the EU RoHS
Directive. Renesas Electronics assumes no lia bility for damage s or losse s occ u rring a s a re sult of your noncomplianc e with
applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.