LW Q38G
1Version 1.4 | 2018-03-29
Produktdatenblatt | Version 1.1
www.osram-os.com
LW Q38G
CHIPLED® 0603
Applications
—Electronic Equipment —Gaming, Amusement, Gambling
Features:
—Package: SMT package 0603, colored diused resin
—Chip technology: InGaN on Sapphire
—Typ. Radiation: 150° (horizontal), 130° (vertical)
—Color: Cx = 0.3, Cy = 0.28 acc. to CIE 1931 (● white)
—Optical ecacy: 36 lm/W
—Corrosion Robustness Class: 3B
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
LW Q38G
3Version 1.4 | 2018-03-29
Maximum Ratings
Parameter Symbol Values
Operating Temperature Top min.
max.
-40 °C
85 °C
Storage Temperature Tstg min.
max.
-40 °C
85 °C
Junction Temperature Tjmax. 95 °C
Forward current
TA = 25 °C
IFmax. 15 mA
Surge Current
t ≤ 10 µs; D = 0.005 ; TA = 25 °C
IFS max. 100 mA
Reverse voltage 2)
TA = 25 °C
VRmax. 5 V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD 2 kV
LW Q38G
4Version 1.4 | 2018-03-29
Characteristics
IF = 5 mA; TA = 25 °C
Parameter Symbol Values
Chromaticity Coordinate 3) Cx
Cy
typ.
typ.
0.3
0.28
Viewing angle at 50 % IV
values for 0°, 90°
2
φ
typ.
typ.
150 °
130 °
Forward Voltage 4)
IF = 5 mA
VFmin.
typ.
max.
2.60 V
2.85 V
3.10 V
Reverse current 2)
VR = 5 V
IRtyp.
max.
0.01 µA
10 µA
Real thermal resistance junction/ambient 5), 6) RthJA real max. 650 K / W
Real thermal resistance junction/solderpoint 5) RthJS real max. 370 K / W
LW Q38G
5Version 1.4 | 2018-03-29
Brightness Groups
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 5 mA IF = 5 mA IF = 5 mA
min. max. typ.
IvIv
Φ
V
Q1 71 mcd 90 mcd 240 mlm
Q2 90 mcd 112 mcd 300 mlm
R1 112 mcd 140 mcd 380 mlm
R2 140 mcd 180 mcd 480 mlm
S1 180 mcd 224 mcd 610 mlm
S2 224 mcd 280 mcd 760 mlm
T1 280 mcd 355 mcd 950 mlm
T2 355 mcd 450 mcd 1210 mlm
Forward Voltage Groups
Group Forward Voltage 4) Forward Voltage 4)
IF = 5 mA IF = 5 mA
min. max.
VFVF
3X 2.60 V 2.70 V
3Y 2.70 V 2.80 V
3Z 2.80 V 2.90 V
4X 2.90 V 3.00 V
4Y 3.00 V 3.10 V
LW Q38G
6Version 1.4 | 2018-03-29
OHA12327
520 530
540
550
560
570
580
590
600
610
620
630
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.10.2 0.30.4 0.5 0.6 0.70.8 0.9
510
500
490
480
470
450
460
0.25
0.20
+
E
Cy
Cx
Cx
Cy
0.22
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.21
0.23
0.25
0.27
0.29
0.31
0.33
0.35
0.37
0.39
0.41
0.26
0.27
0.28
0.29
0.30
0.31
0.32
0.33
0.34
0.35
0.36
0.37
3K
4K
5K
6K
3L
4L
5L
6L
+
Chromaticity Coordinate Groups 3)
Color Chromaticity Groups
Group Cx Cy
3K 0.2730 0.2270
0.2660 0.2320
0.2800 0.2520
0.2860 0.2440
3L 0.2660 0.2320
0.2580 0.2390
0.2730 0.2610
0.2800 0.2520
4K 0.2860 0.2440
0.2800 0.2520
0.2910 0.2680
0.2960 0.2590
Group Cx Cy
4L 0.2800 0.2520
0.2730 0.2610
0.2850 0.2790
0.2910 0.2680
5K 0.2960 0.2590
0.2910 0.2680
0.3100 0.2970
0.3130 0.2840
5L 0.2910 0.2680
0.2850 0.2790
0.3070 0.3120
0.3100 0.2970
Group Cx Cy
6K 0.3130 0.2840
0.3100 0.2970
0.3300 0.3300
0.3300 0.3100
6L 0.3100 0.2970
0.3070 0.3120
0.3300 0.3470
0.3300 0.3300
LW Q38G
7Version 1.4 | 2018-03-29
Group Name on Label
Example: Q1-3K-3X
Brightness Color chromaticity Forward Voltage
Q1 3K 3X
LW Q38G
8Version 1.4 | 2018-03-29
40
0
380
20
60
80
rel
I
100
%
nm
λ
OHL03547
430 480 530 580 630 680 730 780 830
λ
V
Relative Spectral Emission 7)
Irel = f (
λ
); IF = 5 mA; TA = 25 °C
OHL03539
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
vertical
horizontal
horizontal
vertical
Radiation Characteristics 7)
Irel = f (
ϕ
); TA = 25 °C
LW Q38G
9Version 1.4 | 2018-03-29
OHL03549
(5 mA)
V
V
I
I
I
F
1
10
10-1
100
5
210
10 510mA10
Relative Luminous Intensity 7), 8)
Iv/Iv(5 mA) = f(IF); TA = 25 °C
2.5
1
10
102
5
OHL02359
100
3 3.5 4 4.5 V 5
5
mA
V
F
F
I
Forward current 7), 8)
IF = f(VF); TA = 25 °C
LW Q38G
1
15
2
4
6
8
10
12
I
F
[
mA
]
0.24
0.26
0.28
0.30
0.32
Cx
Cy
:Cx
:Cy
Chromaticity Coordinate Shift 7)
∆
Cx,
∆
Cy = f(IF); TA = 25 °C
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10 Version 1.4 | 2018-03-29
-60
0-40 -20 020
V (25 ˚C)
I
I
V
˚C6040
T
j
100
OHL02725
0.2
0.4
0.6
0.8
1.0
1.4
Relative Luminous Intensity 7)
Iv/Iv(25 °C) = f(Tj); IF = 5 mA
OHL03548
T
j
-40
-0.20 -200 20 40 ˚C60 100-60
V
V
F
∆
-0.15
-0.10
-0.05
0
0.05
0.10
0.15
0.20
0.30
Forward Voltage 7)
∆
VF = VF - VF(25 °C) = f(Tj); IF = 5 mA
-0.015
OHL03551
-20-60 -40 200 40 60
j
T
˚C 100
-0.010
-0.005
0
0.005
0.010
0.015
CyCx,∆∆ Cy
Cx
Chromaticity Coordinate Shift 7)
∆
Cx,
∆
Cy = f(Tj); IF = 5 mA
LW Q38G
11 Version 1.4 | 2018-03-29
0
0˚C
T
I
F
mA
OHL03587
T
S
T
A
temp. ambient
T
temp. solder point
S
T
A
20 40 60 80 100
2
4
6
8
10
12
14
16
20
Max. Permissible Forward Current
IF = f(T)
0-5
F
I
A
t
p
s
OHL03589
-4
10 -3
10 -2
10 -1
10 0
10 1
10 2
1010
0.01
0.1
0.02
0.05
0.005
D
=
T
t
T
D
=
P
P
t
I
F
0.2
0.3
0.5
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.11
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TA = 85 °C
0-5
F
I
A
t
p
s
OHL03588
-4
10 -3
10 -2
10 -1
10 0
10 1
10 2
1010
0.01
0.1
0.02
0.05
0.005
D
=
T
t
T
D
=
P
P
t
I
F
0.2
0.3
0.5
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.11
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TA = 25 °C
LW Q38G
14 Version 1.4 | 2018-03-29
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Prole Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the specied peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulllment for the whole T-range
LW Q38G
15 Version 1.4 | 2018-03-29
Taping 9)
OHAY3540
±0.1 (0.004)
0.88 (0.035)
±0.1 (0.004)
4 (0.157)
±0.1 (0.004)
1.5 (0.059) ±0.05 (0.002)
2 (0.079)
±0.05 (0.002)
3.5 (0.138)
±0.1 (0.004)
1.75 (0.069)
±0.1 (0.004)
1.75 (0.069)
8 (0.315) ±0.2 (0.008)
A
C
±0.03 (0.001)
0.23 (0.009)
±0.1 (0.004)
4 (0.157) ±0.05 (0.002)
0.5 (0.020)
LW Q38G
17 Version 1.4 | 2018-03-29
Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 9)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
LW Q38G
19 Version 1.4 | 2018-03-29
Chip Technology:
1: TSN
3: standard InGaN
4: AlGaAs
6: standard InGalP
E: ThinGaN & package with 8 kV
ESD stability
G: NOTA, Powerflip, ThinGaN
´
Encapsulant Type / Lens Properties
1: focusing lens (=20°)
7: clear resin or white volume conversion
8: white volume conversion
9: clear resin
Wavelength Emission Color Color coordinates according
(λdom typ.) CIE 1931/Emission color:
B: 470 nm blue W: white
S: 633 nm super red
T: 528 nm true green
Y: 587 nm yellow
A: 617 nm amber
R/J: 625 nm red
H: 645 nm hyper-red
O: 606 nm orange
G: 570 nm green
L: Light
emitting
diode
Package Type
Q: CHIPLED 0603 / 0402
R: CHIPLED 0805
N: CHIPLED 1206 /
CHIPLED with lens
Lead / Package Properties
1: footprint: 0603 / height: 0.6 mm
3: footprint: 0603 / height: 0.35 mm
9: standard
H: footprint: 0402 / height: 0.35 mm
Type Designation System
L B Q H 9 G
LW Q38G
20 Version 1.4 | 2018-03-29
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specied in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from
these devices. As a matter of principle, however, it should be mentioned that intense light sources have a
high secondary exposure potential due to their blinding eect. As is also true when viewing other bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal lled materials including silver.
Metal lled materials can be aected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-
duction, and use. LEDs that showed visible discoloration when tested using the described tests above did
show no performance deviations within failure limits during the stated test duration. Respective failure limits
are described in the IEC60810.
Based on very short life cycle times in chip technology this component is subject to frequent adaption to the
latest chip technology.
For further application related informations please visit www.osram-os.com/appnotes
LW Q38G
21 Version 1.4 | 2018-03-29
Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please nd the latest version on the OSRAM OS webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales oce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-specic request between OSRAM OS and Buyer and/or Customer.
LW Q38G
22 Version 1.4 | 2018-03-29
Glossary
1) Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of
±11 %.
2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3) Chromaticity coordinate groups: Chromaticity coordinate groups are tested at a current pulse duration
of 25 ms and a tolerance of ±0.01.
4) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of
±0.1 V.
5) Thermal Resistance: Rth max is based on statistic values (6
σ
).
6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad)
7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only reect statistical gures. These do not nec-
essarily correspond to the actual parameters of each single product, which could dier from the typical
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical
improvements, these typ. data will be changed without any further notice.
8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher dier-
ences between single LEDs within one packing unit.
9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specied with ±0.1 and
dimensions are specied in mm.
10) Tape and Reel: All dimensions and tolerances are specied acc. IEC 60286-3 and specied in mm.
LW Q38G
23 Version 1.4 | 2018-03-29
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
