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www.rohm.com 2011.03 - Rev.B

Power Management IC Series for Automotive Body Control

High Voltage

LDO Regulators

BD3570FP, BD3570HFP, BD3571FP, BD3571HFP, BD3572FP, BD3572HFP

BD3573FP, BD3573HFP, BD3574FP, BD3574HFP, BD3575FP, BD3575HFP

●Description

BD357XFP/HFP SERIES regulators feature a high 50 V withstand-voltage and are suitable for use with onboard vehicle

microcontrollers. They offer the output current of 500 mA while limiting the quiescent current to 30μA (T YP).W ith these

devices, a ceramic capacitor can be selected at the output for stable operation, the output tolerance is within ±2% over the

wide ambient temperature range (-40 to 125℃), and the short circuit protection is folded-type to minimize generation of

heat during malfunction. These devices are developed to offer most robust power-supply design under the harsh

automotive environment. The BD357XFP/HFP Series provide ideal solutions to lower the current consumption as well as to

simplify the use with battery direct-coupled systems.

●Features

1) Ultra-low quiescent current: 30μA (TYP.)

2) Low-saturation voltage type P-chan nel DMOS output transistors

3) High output voltage precision:  2%／Iomax = 500 mA

4) Low-ESR ceramic capacitors can be used as output capacitors.

5) Vcc power supply voltage = 50 V

6) Built-in overcurrent protection circuit and thermal shutdown circuit

7) TO252-3, TO252-5, HRP5 Package

●Applications

Onboard vehicle devices (body-control, car stereos, satellite navig at ion systems, etc.)

●Line up matrix

BD3570FP/HFP BD3571FP/HFP BD3572FP/HFP BD3573FP/HFP BD3574FP/HFP BD3575FP/HFP

Output voltage 3.3V 5.0 V Variable 3.3V 5.0 V Variable

SW function －－－〇〇〇

Package FP:TO252-3,TO252-5

HFP:HRP5

●Absolute maximum ratings (Ta=25℃)

Parameter Symbol Limit Unit

Supply voltage VCC 50 ※1V

Switch Supply voltage VSW 50 ※2V

Output current IO 500 mA

Power dissipation Pd 1.2 (TO252-3) ※3W 1.3 (TO252-5) ※4

1.6 (HRP5) ※5

Operating temperature range Topr -40 to +125 ℃

Storage temperature range Tstg -55 to +150 ℃

Maximum junction

temperature Tjmax 150 ℃

※1 Not to exceed Pd and ASO.

※2 for ON/OFF SW Regulator only

※3 TO252-3: Reduced by 9.6 mW/℃ over 25 ℃, when mounted on a glass epoxy board (70 mm  70 mm  1.6 mm).

※4 TO252-5: Reduced by 10.4 mW/℃ over 25 ℃, when mounted on a glass epoxy board (70 mm  70 mm  1. 6 m m ).

※5 HRP5: Reduced by 12.8 mW/℃ over 25 ℃, when mounted on a glass epoxy board (70 mm  70 mm  1.6 mm).

No.11036EBT02

Technical Note

2/9

BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP

BD3574FP/HFP, BD3575FP/HFP

www.rohm.com 2011.03 - Rev.B

●Operating Con diti ons Parameter Symbol Min. Max. Unit

Input voltage BD3570,3572,3573,3575FP/HFP VCC 4.5 ※6 36.0 V

BD3571,3574FP/HFP VCC 5.5 ※6 36.0 V

Output current IO － 500 mA

Variable Output Voltage Range VO 2.8 12 V

※6 Please consider that the Output v oltage would be dropped (Dropout voltage) according to the output current.

●Electrical Char acteristics（Unless otherwise specified, Ta=-40 to125℃, VCC=13.2 V, SW=3V ※7, VO settings is 5V ※8）

Parameter Symbol Limit Unit Conditions

Min. Typ. Max.

Shut Down Current ※７ lshut －－ 10 μA SW=GND

Bias current lb － 30 50 μAIO=0mA

Output voltage VO VO×

0.98 VO VO×

1.02 V IO=200mA,

VO:Please refer to Product line.

ADJ Terminal voltage ※8 VADJ 1.235 1.260 1.285 V IO=200mA

Output current IO 0.5 －－ A

Dropout voltage △Vd － 0.25 0.48 V VCC=4.75V,lO=200mA ※9

Ripple rejection R.R. 45 55 － dB f=120Hz,ein=1Vrms,IO=100mA

Line Regulation Reg.I － 10 30 mV VCCD※10≦VCC≦25V

IO = 0 mA

Load Regulation Reg.L － 20 40 mV 0ｍA≦IO≦200ｍA

Swith Threshold voltage H ※７ SWH 2.0 －－ V IO=0 mA

Swith Threshold voltage L ※７ SWL －－ 0.5 V IO=0 mA

Swith Bias current ※７ SWI － 22 60 μASW=5V,lO=0mA

※7 BD3573,3574,3575FP/HFP only

※8 BD3572,3575FP/HFP only

※9 BD3571,3572,3574,3575FP/HFP only

※10 BD3570,3573FP/HFP :VCCD=5.5V

BD3571,3572,3574,3575FP/HFP :VCCD=6.5V

○This product is not designed for protection against radio active rays.

Technical Note

3/9

BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP

BD3574FP/HFP, BD3575FP/HFP

www.rohm.com 2011.03 - Rev.B

●Reference Data: BD3574 HFP（Un less oth er wise specif ie d, Ta=25℃）

Fig. 1 Total Supply Curr ent

0 5 10 15 20 25

SUPPLY VOLTAGE: VCC [V]

CIRCUIT CURRENT: ICC [μA]

Ta=25℃

Ta=125℃

Ta=-40℃

Fig. 6 Output Voltage VS

SW Input Voltage

00.511.52

SUPPLY VOLTAGE: VSW [V]

OUTPUT VOLTAGE: V

O [V]

Ta=25℃

Ta=-40℃

Ta=125℃

Fig. 9 Output Voltage VS

Temperature

4.5

4.75

5.25

5.5

-40 0 40 80 120

AMBIENT TEMPERATURE: Ta [℃]

OUTPUT VOLTAG E: V

O [V]

Fig. 7 Total Supply Curr ent

Classified by Load

100

0 100 200 300 400 500

O UTPUT CURRE NT : I O[mA]

CIRCUIT CURRENT: ICC [μA]

Fig. 8 Thermal Shutdown Circuit

100 120 140 160 180 200

AMBIENT TEMPERATURE: Ta [℃]

OUTPUT VOLTAGE: V

O [V]

Fig. 10 SW Bias current

120

0 5 10 15 20 25

SUPPLY VOLTAGE: VSW [V]

SW BIAS CURRENT: I

SW [μA]

Ta=-40℃

Ta=25℃

Ta=125℃

Fig. 11 Dropout voltage VS

Temperature

0.5

1.5

-40 0 40 80 120

AMBIENT TEMPERATURE: Ta [℃]

DROPOUT VOLTAGE:

ΔVd [V]

Fig. 12 Total Supply Curre nt

Temperature

-40 0 40 80 120

AMBIENT TEMPERATURE: Ta [℃]

CIRCUIT CURRENT: Icc [μA]

Fig. 2 Output Voltage VS

Power Supply Voltage

0 5 10 15 20 25

SUPPLY VOLTAGE: VCC [V]

OUTPUT VOLTAGE: V

O [V]

Ta=125℃

Ta=-40℃

Ta=25℃

Fig. 3 Output Voltage VS Load

0 500 1000 1500 2000

O UT PUT CURRE NT : I O [mA]

OUTPUT VOLTAGE: V

O [V]

Ta=25℃

Ta=125℃

Ta=-40℃

Fig. 4 Dropout Voltage

0 100 200 300 400 500

O UTPUT CURRE NT: IO[mA]

DROPOUT VOLTAGE:

ΔVd[V]

Ta=125℃

Ta=-40℃

Ta=25℃

Fig. 5 Ripple rejection

10 100 1000 10000 100000 1000000

FREQUENCY: f [Hz]

RIPPLE REJECTION:

R.R. [dB]

Ta=125℃

Ta=-40℃

Ta=25℃

Technical Note

4/9

BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP

BD3574FP/HFP, BD3575FP/HFP

www.rohm.com 2011.03 - Rev.B

●Block Diagram

●I/O Circuit diagram (All resistance values are typical.)

●Pin Assignments

TO252-3

TO252-5

HRP5

Pin No. Pin name Function

1 VCC Power supply pin

2 N.C. N.C. pin

3 VO Voltage output pin

Fin GND GND pin

Pin No. Pin name Function

1 VCC Power supply pin

2 SW

N.C. VO ON/OFF function pin

N.C. pin(BD3572FP only)

3 N.C. N.C. pin

4 N.C.

ADJ N.C. pin

Output voltage setting pin(BD3572,3575FP only)

5 VO Voltage output pin

Fin GND GND pin

Pin No. Pin nam e Function

1 VCC Power supply pin

2 SW

N.C. VO ON/OFF function pin (BD3573,3574,3575HFP only)

N.C. pin

3 GND GND pin

4 N.C.

ADJ N.C. pin

Output voltage setting pin(BD3572,3575HFP only)

5 VO Voltage output pin

Fin GND GND pin

123

FIN

Fig. 19

FIN

1234 5

Fig.20

Fig. 21

12 3 4 5

FIN

GND

Vcc

Vref

OCP

TSD

Fin

N.C.

Cin

Fig.13 TO252-3

Cin：0.33μF～1000μF

Co：0.1μF～1000μF

Fig.14 TO252-5

ADJ (N.C. ＊

)

GND

Vcc

Vref

OCP

TSD

Fin

Cin

＊1）

＊2）

GND

Vref

OCP

TSD

Fin

SW 2

N.C. ADJ (N.C. ＊

)

＊1）

＊2）

＊1）For Fixed Voltage Regulator only

＊2）For adjustable Voltage Regulator only

Fig.15 HRP5

Vcc1

Cin

Fig.16 2PIN[SW]

SW 210K 1K

200K

Fig.17 5PIN[VO]

BD3570,3571,3573,3574

Vcc

1992K: BD3570, BD357 3

3706K: BD3571, BD357 4

1250K

Fig.18 4.5PIN[ADJ,VO]

BD3572,BD3575

Vcc

150

Technical Note

5/9

BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP

BD3574FP/HFP, BD3575FP/HFP

www.rohm.com 2011.03 - Rev.B

●Output Voltage Adjustment

To set the output voltage insert pull-down resistor R1 between the ADJ and GND pins,

and pull-up resistor R2 between the VO and ADJ pins.

Vo = VADJ×(R1+R2) / R1 [V]

｛VADJ=1.26V(TYP.)｝

The recommended connection resistor for the ADJ-GND is 30k～150kΩ.

●Setting of Heat

TO252-3 TO252-5 HRP5

Fig. 23 Fig. 24 Fig. 25

Refer to the heat mitigation characterist ics illustrated in Figs. 23, 24 and 2 5 when using the IC in an env ironment where Ta

≧25℃. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of

the maximum junction temperature Tjmax, the elements of the IC may be deteriorated or damaged. It is necessary to give

sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damag e

and the maintenance of the reliability of the IC in long-time operation.

In order to protect the IC from thermal destruction, it is necessary to op erate the IC not in exc ess of the maximum junction

temperature Tjmax. Fig. 23 illustrates the power dissipation/heat mitigation characteristics for the TO252 package. Operate

the IC within the power dissipation Pd. The following method is used to calculate the power consumption PC (W).

Vcc : Input voltage

PC=(VCC-VO)×IO+VCC×ICC Vo : Output voltage

Power dissipation Pd≦PC Io : Load current

Icc : Total supply current

The load current IO is obtained to operate the IC within the power dissipation.

(For more information about ICC, see page 12.)

The maximum load current Iomax for the applied voltage VCC can be calculated during the thermal design process.

●Calculation exa mp le

Example: BD3571FP VCC = 12 V and VO = 5 V at Ta = 85℃

O≦89mA (ICC=30μA)

Make a thermal calculation in consideration of the above so that the whole operating temperature range will be within the

power dissipation.

The power consumption Pc of the IC in the event of shorting (i.e., if the VO and GND pins are shorted) will be obtained from

the following equation.

Pc=VCC×(ICC+Ishort) Ishort = Short current

VCC-VO

Io≦ Pd-VCC×ICC

IO≦ 0.624-12×ICC

12-5

θja=104.2℃/W→-9.6mAW/℃

25℃=1.2W→85℃=0.624W

0.4

1.2 W

0.8

1.2

1.6

2.0

25 50 75 100 125 150

IC mounted on a ROHM standard board

Substrate size: 70 mm  70 mm  1.6 mm

ja = 104.2 (°C/W)

MBIENT TEMPERA TURE: Ta [°C]

POWER DISSIPATION: Pd [W]

0.4

1.6 W

0.8

1.2

1.6

2.0

25 50 75 100 125 150

IC mounted on a ROHM standard board

Substrate size: 70 mm  70 mm  1.6 mm

ja = 78.1 (°C/W)

MBIENT TEMPERA TURE: Ta [°C]

POWER DISSIPATION: Pd [W]

0.4

1.3W

0.8

1.2

1.6

2.0

25 50 75 100 125 150

MBIENT TEMPERA TURE: Ta [℃]

POWER DISSIPATION: Pd [W]

IC mounted on a ROHM standard board

Substrate size: 70 mm  70 mm  1.6 mm

ja = 96.2 (°C/W)

Fig.22

ADJ

Technical Note

6/9

BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP

BD3574FP/HFP, BD3575FP/HFP

www.rohm.com 2011.03 - Rev.B

●Peripheral Settings for Pins and Precautions

1) VCC pins

Insert capacitors with a capacitance of 0.33μF to 1000μF between the VCC and GND pins.

The capacitance varies with the application. Be sure to design the capacitance with a suffic ient margin.

2) Capacitors for stopping oscillation for output pins

Capacitors for stopping oscillation must be placed between each output pin and the GND pin. Use a capacitor within a

capacitance range between 0.1μF and 1000μF. Since oscillation does not occur even for ESR values from 0.001Ω to

100Ω, a ceramic capacitor can be used. Abrupt input voltage and load fluctuations can affect output voltages. Output

capacitor capacitance values should be determined after sufficient testing of the actual application.

●Operation Not es

1) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may

result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when

such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a

special mode where the absolute maximum ratings may be exceeded is anticipated.

2) GND potential

Ensure a minimum GND pin potential in a ll operating conditions.

3) Setting of heat

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Pin short and mistake fitting

Use caution when orienting and positioning the IC for mounting on printed circuit boar ds. Improper mount ing may result in

damage to the IC. Shorts between output pins or bet ween output pins an d the power supply a nd GND pins cause d by the

presence of a foreign object may result in damage to the IC.

5) Actions in strong magnetic field

Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.

6) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with lo w impedance subjects the IC to stress.

Always discharge capacitors after each process or step. Be sure to turn power off when mounting or dismounting jigs at

the inspection stage. Furthermore, for countermeasures ag ainst static electricity, ground the equipm ent at the assembling

stage and pay utmost attention at the time of transportation or storing the product.

7) This monolithic IC contains P+ isolation and P substrate layers between adjacent eleme nts in order to keep them isolated.

PN junction is formed by the P layer and the N layer of each element, and a variety of parasitic elements will be

constituted.

For example, when a resistor and transistor are connected to pins as shown in F ig. 19,

 the P/N junction functions as a parasitic diode when GND>Pin A for the resistor or GND>Pin B for the transistor

(NPN).

 Similarly, when GND＞Pin B for the transistor (NPN), the parasitic diode de scribed above combines with the N

la yer of other adjacent elements to operate as a parasitic NPN transistor.

Technical Note

7/9

BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP

BD3574FP/HFP, BD3575FP/HFP

www.rohm.com 2011.03 - Rev.B

The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of

the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC

malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will

trigger the operation of parasitic elements, such as by the application of vo ltages lower than the GND (P substrate) voltage

to input pins.

Fig. 26 Example of a Simple Monolithic IC Architecture

8) Ground wiring patterns

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern of any external parts, either.

9) SW Pin

Do not apply the voltage to SW pin when the VCC is not applied.

And when the VCC is applied, the voltage of SW pin must not exceed VCC.

10) Thermal shutdown circuit (TSD)

This IC incorporates a built-in thermal sh utdown circuit for the protection from thermal destruction. T he IC should be used

within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its

power dissipation limits, the attendant rise in the chip's temperature Tj will trigger the thermal shutdown circuit to turn off

all output power elements. The circuit automatically resets once the chip's temperature Tj drops.

The thermal shutdown circuit operates if the IC is under conditions in express of the absolute maximum ratings. Never

design sets on the premise of using the thermal shutdo wn circuit. (See Fig. 8)

11) Overcurrent protection circuit (OCP)

The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This

circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current

flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other

component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.

However, the IC should not be used in applications characterized by the continuous operation or transitioning of the

protection circuits. At the time of thermal designing, keep in mind that the current capabilit y has negative characteristics to

temperatures. (See Fig. 3)

GND

P+ P+

Parasitic elemen

or transistor

substr

(Pin B

)

CBE

T ransistor (NPN)

(Pin A)

GND

N N

P+

Resistor

Parasitic element

Parasitic elements

(Pin A)

Parasitic element o

transistor

(Pin B

)

GND

Technical Note

8/9

BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP

BD3574FP/HFP, BD3575FP/HFP

www.rohm.com 2011.03 - Rev.B

●Ordering Part Number

B D 3 5 7 4 H F P - T R

ローム形名 Part number

3570：3.3V output

no include SW

3571：5.0V output

no include SW

3572：variable output

no include SW

3573：3.3V output

include SW

3574：5.0V output

include SW

3575：variable output

include SW

Package

FP ： TO252-3,

TO252-5

HFP： HRP5

Packaging and forming

specification

E2: Embossed tape and reel

(TO252-3,TO252-5)

TR: Embossed tape and reel

(HRP5)

(Unit : mm)

TO252-3

21 3

0.8

0.65 0.65

1.5

2.5

0.75

FIN

6.5±0.2

2.3±0.2 2.3±0.2

0.5±0.1

1.0±0.2

2.3±0.2

9.5±0.5

0.5±0.1

5.5±0.2 1.5±0.2

5.1+0.2

0.1 C0.5

Direction of feed

1pin

Reel ∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

( )

(Unit : mm)

TO252-5

123 54

0.8

0.5 1.27

1.5

2.5

FIN

6.5±0.2 2.3±0.2

0.5±0.1

1.0±0.2

9.5±0.5

0.5±0.1

5.5±0.2 1.5±0.2

C0.5

5.1+0.2

0.1

Direction of feed

1pin

Reel ∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

( )

Technical Note

9/9

BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP

BD3574FP/HFP, BD3575FP/HFP

www.rohm.com 2011.03 - Rev.B

Direction of feed

1pin

Reel ∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

2000pcs

( )

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(Unit : mm)

HRP5

0.08 S

(MAX 9.745 include BURR)

54321

1.905±0.1

0.835±0.2

1.523±0.15

10.54±0.13

−0.05

+0.1

0.27

4.5°

(6.5)

8.82 ± 0.1

9.395±0.125

0.73±0.1

1.72

0.08±0.05

(7.49)

8.0±0.13 1.017±0.2

1.2575

−4.5°

+5.5°

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.