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Data Sheet 1998-08 Preliminary
h
ttp://www.siemens.de
/
semiconductor/
C163-L
Revision History: 1998-08 Preliminary
Previous Releases: 12.95 Advance Information
Page Subjects
--- 3 V specification introduced.
2 Ordering codes removed.
3 Pin description corrected (pin 16, 17, 21, 40).
24 SSCBR removed.
26, 27 Revised description of Absolute Maximum Ratings and Operating Conditions.
36 PLL description reworked.
39, 47 t22 updated.
55 t35, t36, t59 updated.
61 t200, t203, t204, t209 updated.
Edition 1998-08
Published by Siemens AG, Bereich Halbleiter,
Marketing-Kommunikation
Balanstraße 73, D- 81541 München
© Siemens A G 1998. All Rig hts Res erve d.
Attention ple ase!
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Terms of deli very and r ight s to c hange de sign reser ved.
For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the
Siemens Compan ies an d Represen tativ es world wide.
Due to technical requirements components may contain dangerous substances. For information on the type in question
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Siemens AG i s an appr oved CECC manuf actu rer.
Packing
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For pack ing mater ial that is retu rned to us unso rted or wh ich we ar e not obl iged to accept , we shall have to invoice you
for any costs incurred.
Components used in life-support devices or systems must be express ly authorized for such purpose!
Critical components1 of the Semiconductor Group of Siemens AG, may only be used in life-support devices or systems2
with the expr ess writ te n appro val o f the Se mic onduct or Grou p of Si emen s AG.
1 A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device
or system.
2 Life support devices or systems are intended (a) to be implanted in the human body , or (b) to support and/or maintain
and sustain human life. If the
y
fail
,
it is re asona ble t o assume t hat the h ealt h of the user ma
y
be endan
g
ered.
High Performance 16-bit CPU with 4-Stage Pipeline
80 ns Instruction Cycle Time at 25 MHz CPU Clock
400 ns Multiplication (16 × 16 bit), 800 ns Division (32 / 16 bit)
Enhanced Boolean Bit Manipulation Facilities
Additional Instructions to Support HLL and Operating Systems
Register-Based Design with Multiple Variable Register Banks
Single-Cycle Context Switching Support
16 MBytes Total Linear Address Space for Code and Data
1024 Bytes On-Chip Special Function R egister Area
16-Priority-Level Interrupt System with 20 Sources, Sample-Rate down to 40 ns
8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via
Peripheral Event Controller (PEC)
Clock Generation via on-chip PLL (1:1.5/2/2.5/3/4/5), via prescaler or via direct clock input
On-Chip Memory Modules
1 KBytes On-Chip Internal RAM (IRAM)
On-Chip Peripheral Modules
Two Multi-Functional General Purpose Timer Units with 5 Timers
Two Serial Channels (Synchronous/Asynchronous and High-Speed-Synchronous)
Up to 16 MBytes External Address Space for Code and Data
Programmable External Bus C haracteristics for Different Address Ranges
Multiplexed or Demultiplexed External Address/Data Buses with 8-Bit or 16-Bit Data Bus Width
Five Programmable Chip-Select Signals
Hold- and Hold-Acknow ledge Bus Arbitration Support
Idle and Power Down Modes
Programmable Watchdog Timer and Oscillator Watchdog
Up to 77 General Purpose I/O Lines
High Speed Operation with 5 V Supply up to 25 MHz
Low Power Operation with 3 V Supply up to 12 MHz
Supported by a Large Range of Development Tools like C-Compilers, Macro-Assembler
Packages, Emulators, Evaluation Boards, HLL-Debuggers, Simulators, Logic Analyzer
Disassemblers, Programming Boards
100-Pin TQFP Package (Thin QFP)
This document describes the SAB-C163-LF, the SAB-C163-L25F and the SAF-C163-L25F.
For simplicity all versions are referred to by the term C163-L throughout this document.
C166-Family of
High-Performance CMOS 16-Bit Microcontrollers
Preliminary
C163-L 16-Bit Microcontroller
C163-L
1 1998-08
11Aug98@14:48h Intermediate Version
Semiconductor Group 2 1998-08
C163-L
Introduction
The C163-L is a derivative of the Siemens C166 family of 16-bit single-chip CMOS microcontrollers.
It combines high CP U performance (up to 1 2.5 millio n instructio ns per second ) with high p eripheral
functionality and enhanced IO-capabilities.
Figure 1
Logic Symbol
The C163-L can be operated from a 5 V power supply as well as from a 3 V power supply (25 MHz
versions C163-L25F only). Wi thin the standard s upply volta ge range of VDD = 4.5 - 5.5 V it delivers
its maximum performance at CPU clock frequencies of up to 25 MHz. Within the reduced supply
voltage range of VDD = 2.7 - 3.6 V it provides low power operation for energy sensi tive applic ations
at CPU clock frequencies of up to 12 MHz (PLL operation is not supported in this case).
Ordering Information
The ordering code for Siemens microcontrollers provides an exact reference to the required
product. This ordering code identifies:
the derivative itself, ie. its function set
the specified temperature range
the package
the type of delivery.
For the available ordering codes for the C163-L please refer to the
Product Information Microcontrollers“, which summarizes all avail able microcontrolle r variants.
C163-L
11Aug98@14:48h Intermediate Version
Semiconductor Group 3 1998-08
C163-L
Note: The ordering codes for Mask-ROM versions are defi ned for each product after verificati on of
the respective ROM code.
Pin Configuration TQFP Package
(top view)
Figure 2
P5.12/T6IN
P5.11/T5EUD
P5.10/T6EUD
P2.15/EX7IN
P2.14/EX6IN
P2.13/EX5IN
P2.12/EX4IN
P2.11/EX3IN
P2.10/EX2IN
P2.9/EX1IN
P2.8/EX0IN
P6.7/BREQ
P6.6/HLDA
P6.5/HOLD
P6.4/CS4
P6.3/CS3
P6.2/CS2
P6.1/CS1
P6.0/CS0
NMI
RSTOUT
RSTIN
VDD
VSS
P1H.7/A15
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
C163-L
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P1H.6/A14
P1H.5/A13
P1H.4/A12
P1H.3/A11
P1H.2/A10
VSS
VDD
P1H.1/A9
P1H.0/A8
P1L.7/A7
P1L.6/A6
P1L.5/A5
P1L.4/A4
P1L.3/A3
P1L.2/A2
P1L.1/A1
P1L.0/A0
P0H.7/AD15
P0H.6/AD14
P0H.5/AD13
P0H.4/AD12
P0H.3/AD11
P0H.2/AD10
P0H.1/AD9
P0H.0/AD8
P5.13/T5IN
P5.14/T4EUD
P5.15/T2EUD
VSS
XTAL1
XTAL2
VDD
P3.0
P3.1/T6OUT
P3.2/CAPIN
P3.3/T3OUT
P3.4/T3EUD
P3.5/T4IN
P3.6/T3IN
P3.7/T2IN
P3.8
P3.9
P3.10/TxD0
P3.11/RxD0
P3.12/BHE/WRH
P3.13
P3.15/CLKOUT
P4.0/A16
P4.1/A17
P4.2/A18
P4.3/A19
VSS
VDD
P4.4/A20/SSPCE1
P4.5/A21/SSPCE0
P4.6/A22/SSPDAT
P4.7/A23/SSPCLK
RD
WR/WRL
READY
ALE
EA
VDD
VSS
OWE
P0L.0/AD0
P0L.1/AD1
P0L.2/AD2
P0L.3/AD3
P0L.4/AD4
P0L.5/AD5
P0L.6/AD6
P0L.7/AD7
VDD
VSS
11Aug98@14:48h Intermediate Version
Semiconductor Group 4 1998-08
C163-L
Pin Definitions and Functions
Symbol Pin
Numb.
TQFP
Input
Out-
put
Function
P5
P5.10
P5.11
P5.12
P5.13
P5.14
P5.15
98
99
100
1
2
3
I
I
I
I
I
I
I
Port 5 is a 6-bit input-only port with Schmitt-Trigger characteristics. The
pins of Port 5 also serve as timer inputs:
T6EUD GPT2 Timer T6 External Up/Down Control Input
T5EUD GPT2 Timer T5 External Up/Down Control Input
T6IN GPT2 Timer T6 Count Input
T5IN GPT2 Timer T5 Count Input
T4EUD GPT1 Timer T4 External Up/Down Control Input
T2EUD GPT1 Timer T2 External Up/Down Control Input
XTAL1
XTAL2
5
6
I
O
Input to the oscillator amplifier and input to the internal clock generator.
Output of the oscillator amplifier circuit.
To clock the dev ice from an external source, drive XTAL1, while leav ing
XTAL2 unconnected. Minimum and maximum high/low and rise/fall
times specified in the AC Characteristics must be observed.
P3
P3.0
P3.1
P3.2
P3.3
P3.4
P3.5
P3.6
P3.7
P3.8
P3.9
P3.10
P3.11
P3.12
P3.13
P3.15
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
IO
O
I
O
I
I
I
I
O
IO
O
O
O
Port 3 is a 15-bit (P3.14 is missing) bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits. For a pin configured
as input, the output driver is put into high-impedance state. Port 3
outputs can be configured as push/pull or open drain drivers.
Some Port 3 pins also serve for alternate functions:
-
T6OUT GPT2 Timer T6 Toggle Latch Output
CAPIN GPT2 Register CAPREL Capture Input
T3OUT GPT1 Timer T3 Toggle Latch Output
T3EUD GPT1 Timer T3 Ext.Up/Down Ctrl.Input
T4IN GPT1 Timer T4 Input for
Count/Gate/Reload/Capture
T3IN GPT1 Timer T3 Count/Gate Input
T2IN GPT1 Timer T2 Input for
Count/Gate/Reload/Capture
-
-
T×D0 ASC0 Clock/Data Output (Asyn./Syn.)
R×D0 ASC0 Data Input (Asyn.) or I/O (Syn.)
BHE Ext. Memory H igh Byte Enable Signal,
WRH Ext. Memory High Byte Write Strobe
-
CLKOUT System Clock Output (=CPU Clock)
11Aug98@14:48h Intermediate Version
Semiconductor Group 5 1998-08
C163-L
P4
P4.0
P4.1
P4.2
P4.3
P4.4
P4.5
P4.6
P4.7
23
24
25
26
29
30
31
32
IO
O
O
O
O
O
O
O
O
O
IO
O
O
Port 4 is an 8-bit bidirectional I/O port. It is bit-wise programmable for
input or output via direction bits. For a pin configured as input, the
output driver is put into high-impedance state.
In case of an external bus configuration, Port 4 can be used to output
the segment address lines and it provides the SSP interface lines:
A16 Least Significant S egment Address Line
A17 Segment Address Line
A18 Segment Address Line
A19 Segment Address Line
A20 Segment Address Line,
SSPCE1 SSP Chip Enable Line 1
A21 Segment Address Line,
SSPCE0 SSP Chip Enable Line 0
A22 Segment Address Line,
SSPDAT SSP Data Input/Output Line
A23 Most Significant Segment Addr. Line
SSPCLK SSP Clock Output Line
RD 33 O External Memory Read Strobe. RD is activated for every external
instruction or data read access.
WR/
WRL 34 O External Memory Write Strobe. In WR-mode this pin is activated for
every external data write access. In WRL -mode this pin is activated for
low byte data write accesses on a 16-bit bus, and for every data write
access on an 8-bit bus. See bit WRC FG in register SYSCON for mode
selection.
READY 35 I Ready Input. When the Ready function is enabled, a high level at this
pin during an external memory access will force the inserti on of memory
cycle time waitstates until the pin returns to a low level.
ALE 36 O Address Latch Enable Output. Can be used for latching the address
into external memory or an addre ss l atch i n the multiplexed bus modes.
EA 37 I External A ccess Enable pin. A low level at this pin during and after
Reset forces the C163-L to begin instruction execution out of external
memory. A high level forces execution out of the internal ROM. The
C163-L must have this pin tied to ‘0’.
Pin Definitions and Functions (cont’d)
Symbol Pin
Numb.
TQFP
Input
Out-
put
Function
11Aug98@14:48h Intermediate Version
Semiconductor Group 6 1998-08
C163-L
PORT0
P0L.0-7
P0H.0-7 41 - 48
51 - 58
IO PORT0 consists of the tw o 8-bit bidirectional I/O ports P0L and P0H. It
is bit-wise programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-impedance state.
In case of an external bus configuration, PORT0 serves as the address
(A) and address/data (AD) bus in multiplexed bus modes and as the
data (D) bus in demultiplexed bus modes.
Demultiplexed bus modes:
Data Path Width: 8-bit 16-bit
P0L.0 – P0L.7: D0 – D7 D0 - D7
P0H.0 – P0H.7: I/O D8 - D15
Multiplexed bus modes:
Data Path Width: 8-bit 16-bit
P0L.0 – P0L.7: AD0 – AD7 AD0 - AD7
P0H.0 – P0H.7: A8 - A15 AD8 - AD15
PORT1
P1L.0-7
P1H.0-7 59 - 66
67, 68,
71 - 76
IO PORT1 consists of the tw o 8-bit bidirectional I/O ports P1L and P1H. It
is bit-wise programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-impedance state.
PORT1 is used as the 16-bit address bus (A) in demultiplexed bus
modes and also after switching from a demultiplexed bus mode to a
multiplexed bus mode.
RSTIN 79 I Reset Input with Schmitt-Trigger characteristics. A low level at this pin
for a minimum of 2 CPU clock cycles while the oscillator is running
resets the C163-L. An internal pullup resistor permits power-on reset
using only a capacitor connected to VSS.
Note: To let the reset configuration of PORT0 settle and to let the
PLL lock a reset duration of ca. 1 ms is recommended.
RST
OUT 80 O Internal Reset Indication Output. This pin is set to a low level when the
part is executing either a hardware-, a software- or a watchdog timer
reset. RSTOUT remains low until the EINIT (end of initialization)
instruction is executed.
NMI 81 I Non-Maskable Interrupt Input. A high to low transition at this pin causes
the CPU to vector to the NMI trap routine. When the PWRDN (power
down) instruction is executed, the NMI pin must be low in order to force
the C163-L to go into power down mode. If NMI is high, when PWRDN
is executed, the part will continue to run in normal mode.
If not used, pin NMI should be pulled high externally.
Pin Definitions and Functions (cont’d)
Symbol Pin
Numb.
TQFP
Input
Out-
put
Function
11Aug98@14:48h Intermediate Version
Semiconductor Group 7 1998-08
C163-L
P6
P6.0
P6.1
P6.2
P6.3
P6.4
P6.5
P6.6
P6.7
82
83
84
85
86
87
88
89
IO
O
O
O
O
O
I
I/O
O
Port 6 is an 8-bit bidirectional I/O port. It is bit-wise programmable for
input or output via direction bits. For a pin configured as input, the
output driver is put into high-impedance state. Port 6 outputs can be
configured as push/pull or open drain drivers.
The Port 6 pins also serve as bus interface signals:
CS0 Chip Select 0 Output
CS1 Chip Select 1 Output
CS2 Chip Select 2 Output
CS3 Chip Select 3 Output
CS4 Chip Select 4 Output
HOLD External Master Hold Request Input
HLDA Hold Acknowledge Output or Input
(Master mode: O, Slave mode: I)
BREQ Bus Request Output
P2
P2.8
P2.9
P2.10
P2.11
P2.12
P2.13
P2.14
P2.15
90
91
92
93
94
95
96
97
IO
I
I
I
I
I
I
I
I
Port 2 is an 8-bit bidirectional I/O port. It is bit-wise programmable for
input or output via direction bits. For a pin configured as input, the
output driver is put into high-impedance state. Port 2 outputs can be
configured as push/pull or open drain drivers.
The Port 2 pins also serve as fast external interrupt inputs:
EX0IN Fast External Interrupt 0 Input
EX1IN Fast External Interrupt 1 Input
EX2IN Fast External Interrupt 2 Input
EX3IN Fast External Interrupt 3 Input
EX4IN Fast External Interrupt 4 Input
EX5IN Fast External Interrupt 5 Input
EX6IN Fast External Interrupt 6 Input
EX7IN Fast External Interrupt 7 Input
OWE 40 I Oscillator Watchdog Enable. This pin enables the PLL when high or
disables it when low (e.g. to disable the OWD for testing purposes.
An internal pullup device holds this input high if nothing is driving it.
Note: The input voltage at pin OWE must not exceed 12.6 V.
For 3 V operation pin OWE must be driven low.
VDD 7, 28,
38, 49,
69, 78
- Digital Supply Voltage:
+ 5 V or +3 V during normal operation and idle mode.
2.5 V during power down mode
VSS 4, 27,
39, 50,
70, 77
- Digital Ground.
Pin Definitions and Functions (cont’d)
Symbol Pin
Numb.
TQFP
Input
Out-
put
Function
11Aug98@14:48h Intermediate Version
Semiconductor Group 8 1998-08
C163-L
Functional Description
The architecture of the C163-L combines advantages of both RISC and CISC processors and of
advanced peripheral subsystems in a very well-balanced way. The following block diagram gives an
overview of the different on-chip components and of the advanced, high bandwidth internal bus
structure of the C163-L.
Note: All time specifications refer to a CPU clock of 25/12 MHz for 5/3 V operation
(see definition in the AC Characteristics section).
Figure 3
Block Diagram
PLL
11Aug98@14:48h Intermediate Version
Semiconductor Group 9 1998-08
C163-L
Memory Organization
The memory space of the C163-L is configured in a Von Neumann architecture which means that
code memory, data memory, registers and I/O ports are organized within the same linear address
space which includes 16 MBytes. The entire memory space can be accessed bytewise or wordwise.
Particular portions of the on-chip memory have additionally been made directly bit addressable.
The C163-L is prepared to incorporate on-chip mask-programmable ROM, OTP or Flash memory
for code or constant data. C urrently no program memory is integrated.
1 KByte of on-chip RAM is provided as a storage for user defined variables, for the system stack,
general purpose register banks and even for code. A register bank can consist of up to 16 wordwide
(R0 to R15) and/or bytewide (RL0, RH0, …, RL7, RH7) so-called General Purpose Registers
(GPRs).
1024 bytes (2 * 512 bytes) of the address space are reserved for the Special Function Register
areas (SFR space and ESFR space). SFRs are wordwide registers which are used for controlling
and monitoring functions of the different on-chip units. Unused SFR addresses are reserved for
other/future members of the C166 family.
In order to meet the needs o f designs where more memory is required than is provi ded on c hip, u p
to 16 MBytes of external R AM and/or ROM can be connected to the microcontroller.
11Aug98@14:48h Intermediate Version
Semiconductor Group 10 1998-08
C163-L
External Bus Controller
All of the external memory accesses are performed by a particular on-chip External Bus Controller
(EBC). It can be programmed either to Single Chip Mode when no external me mory is required, or
to one of four different external memory access modes, which are as follows:
– 16-/18-/20-/24-bit Addresses, 16-bit Data, Demultiplexed
– 16-/18-/20-/24-bit Addresses, 16-bit Data, Multiplexed
– 16-/18-/20-/24-bit Addresses, 8-bit Data, Multiplexed
– 16-/18-/20-/24-bit Addresses, 8-bit Data, Demultiplexed
In the demultiplexed bus modes, addresses are output on PORT1 and data is input/output on
PORT0 or P0L, respectively. In the multiplexed bus modes both addresses and data use PORT0 for
input/output.
Important timing characteristics of the external bus interface (Memory Cycle Time, Memory Tri-
State Time, Length of ALE and Read Write Delay) have been made programmable to allow the user
the adaption of a wide range of different types of memories and external peripherals.
In addition, up to 4 independent address windows may be defined (via register pairs ADDRSELx /
BUSCONx) which allow to access different resources with different bus characteristics. These
address windows are arranged hierarchically where BUSCON4 overrides BUSCON3 and
BUSCON2 overrides BUSCON1. All accesses to locations not covered by these 4 address windows
are controlled by BUSCON0.
Up to 5 external CS signals (4 windows plus default) can be generated in order to save external glue
logic. Access to very slow memories is supported via a particular ‘Ready’ function.
A HOLD/HLDA protocol is available for bus arbitration and allows to share external resources with
other bus masters. The bus arbitration is enabled by setting bit HLDEN in register SYSCON. After
setting HLDEN once, pins P6.7...P6.5 (BREQ, HLDA, HOLD) are automatically controlled by the
EBC. In Master Mode (default after reset) the HLDA pin is an output. By setting bit DP6.7 to ’1’ the
Slave Mode is selected where pin HLDA is switched to input. This allows to directly connect the
slave controller to another master controller without glue logic.
For applications which require less than 16 MBytes of external memory space, this address space
can be restricted to 1 MByte, 256 KByte or to 64 KByte. In this case Port 4 outputs four, tw o or no
address lines at all. It outputs all 8 address lines, if an address space of 16 MBytes is used.
Note: When the on-chip SSP Module is to be u sed th e segm ent address output on Port 4 must b e
limited to 4 bits (ie. A19...A16) in order to enable the alternate function of the SSP interface
pins.
11Aug98@14:48h Intermediate Version
Semiconductor Group 11 1998-08
C163-L
Central Processing Unit (CPU)
The main core o f the CPU consists of a 4-stage instructi on pipeline, a 16-bit arithmetic and logic unit
(ALU) and dedicated SFRs. Additional hardware has been spent for a separate multipl y and d ivid e
unit, a bit-mask generator and a barrel shifter.
Based on these hard ware provisions, most of the C163-L’s instructions can be executed in just one
machine cycle which requires 80 ns at 25-MHz CPU clock. For example, shift and rotate instructions
are always processed during one machine cyc le independent of the number of bits to be shifted. All
multiple-cycle instructions have been optimized so that they can be executed very fast as well:
branches in 2 cycles, a 16 × 16 bit multiplication in 5 cycles and a 32-/16 bit division in 10 cycles.
Another pipeline optimization, the so-called ‘Jump Cache’, allows reducing the execution time of
repeatedly performed jumps in a loop from 2 cycles to 1 cycle.
Figure 4
CPU Block Diagram
11Aug98@14:48h Intermediate Version
Semiconductor Group 12 1998-08
C163-L
The CPU disposes of an actual register context consisting of up to 16 wordwide GP Rs w hich are
physically allocated within the on-chip RAM area. A Context Pointer (CP) register determi nes the
base address of the active register bank to be accessed by the CPU at a time. The number of
register banks is only restricted by the available internal RAM space. For easy parameter passing,
a register bank may overlap others.
A system stack of up to 512 words is provided as a storage for temporary data. The system stack
is allocated in the on-chip RAM area, and it is accessed by the CPU via the stack pointer (SP)
register. Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack
pointer value upon each stack access for the detection of a stack overflow or underflow.
The high perform ance offered by th e hardware implementatio n of the CPU can efficiently be utilized
by a programmer via the highly efficient C163-L instruction set which includes the following
instruction classes:
Arithmetic Instructions
Logical Instructions
Boolean Bit Manipulation Instructions
Compare and Loop Control Instructions
Shift and Rotate Instructions
Prioritize Instruction
Data Movement Instructions
System Stack Instructions
Jump and Call Instructions
Return Instructions
System Control Instructions
Miscellaneous Instructions
The basic in struction length is either 2 or 4 bytes. Possible operand types are bits, by tes and words.
A variety of direct, indirect or immediate addressing modes are provided to specify the required
operands.
11Aug98@14:48h Intermediate Version
Semiconductor Group 13 1998-08
C163-L
Interrupt System
With an interrupt response time within a range from just 200 ns to 480 ns (in case of internal
program execution), the C163-L is capable of reacting very fast to the occurence of non-
deterministic events.
The architecture of the C163-L supports several mechanisms for fast and flexible response to
service requests that can be generated from various sources internal or external to the
microcontroller. Any of these interrupt requests can be programmed to being serviced by the
Interrupt Controller or by the Peripheral Event Controller (PEC).
In contrast to a standard interrupt service where the current program execution is suspended and
a branch to the interrupt vector table is performed, just one cycle is ‘stolen’ from the current CPU
activity to perform a PEC service. A PEC service implies a single byte or word data transfer between
any two memory locations with an additional increment of either the PEC source or the destination
pointer. An individual PEC transfer counter is implicity decremented for each PEC service except
when performing in the continuous transfer mode. When this counter reaches zero, a standard
interrupt is performed to the corresponding source related vector location. PEC services are very
well suited, for example, for supporting the transmission or reception of blocks of data. The C163-
L has 8 PEC channels each of which offers such fast interrupt-driven data transfer capabilities.
A separate control reg ister which contains an in terrupt request flag, an interrupt enable fl ag a nd an
interrupt priority bitfield exists for each of the possible interrupt sources. Via its related register, each
source can be programmed to one of sixteen interrupt priority levels. Once having been accepted
by the CPU, an interrupt service ca n only be interrupted by a higher prioritize d service request. For
the standard interrupt processing, each of the possible interrupt sources has a dedicated vector
location.
Fast external interrupt inputs are provided to service external interrupts with high precision
requirements. Thes e fast interrupt inp uts feature programmabl e edge d etecti on (rising edge, fa lling
edge or both edges).
Software interrupts are supported by means of the ‘TRAP’ instruction in combination with an
individual trap (interrupt) number.
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C163-L
The following table shows all of the possible C163-L interrupt sources and the corresponding
hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers:
Source of Interrupt or
PEC Service Request Request
Flag Enable
Flag Interrupt
Vector Vector
Location Trap
Number
External Interrupt 0 CC8IR CC8IE CC8INT 00’0060H18H
External Interrupt 1 CC9IR CC9IE CC9INT 00’0064 H19H
External Interrupt 2 CC10IR CC10IE CC10INT 00’0068H1AH
External Interrupt 3 CC11IR CC11IE CC11INT 00’006CH1BH
External Interrupt 4 CC12IR CC12IE CC12INT 00’0070H1CH
External Interrupt 5 CC13IR CC13IE CC13INT 00’0074H1DH
External Interrupt 6 CC14IR CC14IE CC14INT 00’0078H1EH
External Interrupt 7 CC15IR CC15IE CC15INT 00’007CH1FH
GPT1 Timer 2 T2IR T2IE T2INT 00’0088H22H
GPT1 Timer 3 T3IR T3IE T3INT 00’008CH23H
GPT1 Timer 4 T4IR T4IE T4INT 00’0090H24H
GPT2 Timer 5 T5IR T5IE T5INT 00’0094H25H
GPT2 Timer 6 T6IR T6IE T6INT 00’0098H26H
GPT2 CAPREL Register CRIR CRIE CRINT 00’009CH27H
ASC0 Transmit S0TIR S0TIE S0TINT 00’00A8H2AH
ASC0 Transmit Buffer S0TBIR S0TBIE S0TBINT 00’011CH47H
ASC0 Receive S0RIR S0RIE S0RINT 00’00ACH2BH
ASC0 Error S0EIR S0EIE S0EINT 00’00B0H2CH
SSP Interrupt XP1IR XP1IE XP1INT 00’0104H41H
PLL Unlock / OWD XP3IR XP3IE XP3INT 00’010CH43H
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C163-L
The C163-L also provides an excellent mechanism to identify and to process exceptions or error
conditions tha t arise during run-tim e, so-cal led ‘Hardware Trap s’. Ha rdware traps c ause im mediate
non-maskable system reaction which is similar to a standard interrupt service (branching to a
dedicated vector table location). The occurence of a hardware trap is additionally signified by an
individual bit in the trap fl ag register (TFR). Except when another higher prio ritized trap service is in
progress, a hardware trap will interrupt any actual program execution. In turn, hardware trap
services can normally not be interrupted by standard or PEC interrupts.
The following table shows all of the possible exceptions or error conditions that can arise during run-
time:
Exception Condition Trap
Flag Trap
Vector Vector
Location Trap
Number Trap
Priority
Reset Functions:
Hardware Reset
Software Reset
Watchdog Timer Overflow
RESET
RESET
RESET
00’0000H
00’0000H
00’0000H
00H
00H
00H
III
III
III
Class A Hardware Traps:
Non-Maskable Interrupt
Stack Overflow
Stack Underflow
NMI
STKOF
STKUF
NMITRAP
STOTRAP
STUTRAP
00’0008H
00’0010H
00’0018H
02H
04H
06H
II
II
II
Class B Hardware Traps:
Undefined Opcode
Protected Instruction
Fault
Illegal Word Operand
Access
Illegal Instruction Access
Illegal External Bus
Access
UNDOPC
PRTFLT
ILLOPA
ILLINA
ILLBUS
BTRAP
BTRAP
BTRAP
BTRAP
BTRAP
00’0028H
00’0028H
00’0028H
00’0028H
00’0028H
0AH
0AH
0AH
0AH
0AH
I
I
I
I
I
Reserved [2CH – 3CH][0B
H – 0FH]
Software Traps
TRAP Instruction Any
[00’0000H
00’01FCH]
in steps
of 4H
Any
[00H – 7FH]Current
CPU
Priority
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C163-L
General Purpose Timer (GPT) Unit
The GPT unit represents a very flexible multifunctional timer/counter structure which may be used
for many different time related tasks such as eve nt timing and counting, puls e width and duty cycle
measurements, pulse generation, or pulse multiplication.
The GPT unit incorpor ates five 16-bit timers which are organized in two separate modules, GPT1
and GPT2. Each timer in each mo dule m ay operate independently in a number of different modes,
or may be concatenated with another timer of the same module.
Each of the three tim ers T2, T3, T4 of module GPT1 can be c onfigured individu ally for one of three
basic modes of operation, which are Timer, Gated Timer, and Counter Mode. In Timer Mode, the
input clock for a timer is derived from the C PU clock, divided by a programmable prescaler, while
Counter Mode allows a timer to be clocked in reference to external events.
Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the operation of
a timer is controlled b y the ‘gate’ lev el on an external input pin. For these purposes, each timer has
one associated p ort pin (TxIN) whi ch serves as g ate or c lock inpu t. The m axim um res oluti on of th e
timers in module GPT1 is 320 ns (@ 25 MHz CPU clock).
The count direction (up/down) for each timer is programmable by software or may additionally be
altered dynamically by an external signal on a port pin (TxEUD) to facilitate e. g. position tracking.
Figure 5
Block Diagram of GPT1
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer over-flow/
underflow. The state of this latch may be output on port a pin (T3OUT) e.g. for time out monitoring
of external hardware components, or may be used internally to clock timers T2 and T4 for
measuring long time periods with high resolution.
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In addition to their basic operating modes, timers T2 and T4 may be c onfigured as reload or capture
registers for timer T3. When used as capture or reload registers, timers T2 and T4 are stopped. The
contents of timer T3 is captured into T2 or T4 in response to a signal at their associated input pins
(TxIN). Timer T3 is reloaded with the contents of T2 or T4 triggered either by an external signal or
by a selectable state transition of its toggle latch T3OTL. When both T2 and T4 are configured to
alternately reload T3 on opposite state transitions of T3OTL with the low and high times of a PWM
signal, this signal can be constantly generated w ithout software intervention.
Figure 6
Block Diagram of GPT2
With its maximum resolution of 160 ns (@ 25 MHz), the GPT2 module provides precise event
control and time measurement. It includes two timers (T5, T6) and a capture/reload register
(CAPREL). Both timers can be clocked with an input clock which is derived from the CPU clock via
a programmable prescaler or with external si gnals. The count direction (up/down) for each timer is
programmable by software or may additionally be altered dynamically by an external signal on a
port pin (TxEUD). Timer T6 has an output toggle latch (T6OTL) which changes its state on each
timer overflow/underflow. Concatenation of the timers is supported via T6OTL.
The state of thi s latch may be used to clock ti mer T5, or it may be output on a port pin (T6OUT). The
overflows/underflows of timer T6 can additionally be used to cause a reload from the CAPREL
register. The CAPREL register may capture the contents of timer T5 based on an external signal
transition on the corresponding port pin (CAPIN ), and timer T5 may optionally be cleared after the
capture procedure. This allows absolute time differences to be measured or pulse multiplication to
be performed without software overhead.
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C163-L
Parallel Ports
The C163-L provides up to 77 I/O lines which are organized into six input/output ports and one input
port. All port lines are bit-addressable, and all input/output lines are individually (bit-wise)
programmable as inputs or outputs via directi on regis ters. The I/ O ports are true bidi rectional ports
which are switched to high impedance state when confi gured as inputs. The output drive rs of three
I/O ports can be configured (pin by pin) for push/pull operation or open-drain operation via control
registers. During the internal reset, all port pins are configured as inputs.
All port lines have programmable alternate input or output functions associated with them. PORT0
and PORT1 may be used as address and data lines when acc essing external memory, while Port 4
outputs the additional segment address bits A23/19/17...A16 in systems where segmentation is
enabled to access more than 64 KBytes of memory. Port 6 provides opti onal bus arbitration signals
(BREQ, HLD A, HOLD) and chip select signals. Port 3 includes alternate functions of timers, serial
interfaces, the optional bus control signal BHE and the system clock output (CLKOUT). Port 5 is
used for timer control signals. All port lines that are not used for these alternate functions may be
used as general purpose I/O lines.
Serial Channels
Serial communication with other microcontrollers, processors, terminals or external peripheral
components is provided by two serial interfaces with different functionality, an Asynchronous/
Synchronous Serial Channel (ASC0) and a Synchronous Serial Port (SSP).
The ASC0 is upward compatible with the serial ports of the Siemens 8-bit microcontroller families
and supports full-duplex asynchronous communication at up to 781 KBaud and half-duplex
synchronous communication at up to 3.125 MBaud @ 25 MHz CPU clock.
A dedicated baud rate generator allows to set up all standard baud rates without oscillator tuning.
For transmission, reception and error handling 4 separate interrupt vectors are provided. In
asynchronous mod e, 8- or 9-bit data frames are transmitted or received, preceded by a start bit and
terminated by one or two stop bits. For multiprocessor communication, a mechani sm to distinguis h
address from data bytes has been included (8-bit data plus wake up bit mode).
In synchronous mode, the ASC0 transmits or receives bytes (8 bits) synchronously to a shift clock
which is generated by the ASC0. The ASC0 always shifts the LSB first. A loop back option is
available for testing purposes.
A number of optional hardware error detection capabilities has been included to increase the
reliability of data transfers. A parity bit can automatically be generated on transmission or be
checked on reception. Framing error detection allows to recognize data frames with missing stop
bits. An overrun error will be generated, if the last character received has not been read out of the
receive buffer register at the time the reception of a new character is complete.
The SSP transmits 1...3 bytes or receives 1 byte after sending 1...3 bytes synchronously to a shift
clock which is ge nerated by the SSP. The SSP can start s hiftin g with the LSB or with the M SB an d
allows to select shi fting and latchi ng clock ed ges as well as the c lock polari ty. Up to two chip select
lines may be activated in order to direct data transfers to one or both of two peripheral devices.
One general interrupt vector is provided for the SSP.
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Watchdog Timer
The Watchdog Timer repr esents on e of the fail-safe mechani sms whic h have been imp lemented to
prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after a reset of the chip, and can only be disabled in the time
interval until the EINIT (end of initialization ) instruction has been executed. Thus, the chip’s sta rt-up
procedure is always monitored. The software has to be designed to service the Watchdog Timer
before it overflows. If, due to hardware or software related failur es, the software fails to do so, the
Watchdog Timer overflows and generates an internal hardware reset and pulls the RSTOUT pin low
in order to allow external hardware components to be reset.
The Watchdog Timer is a 16-bit timer, clocked with the system clock divided either by 2 or by 128.
The high byte of the W atchdog Timer register can be set to a prespecified reload value (stored in
WDTREL) in order to allow further variation of the monitored time interval. Each time it is ser viced
by the application software, the high byte of the Watchdog Timer is reloaded. Thus, time intervals
between 20 µs and 336 ms can be monitored (@ 25 MHz). The default Watchdog Timer interval
after reset is 5.24 ms (@ 25 MHz).
Oscillator Watchdog
During direct drive o r prescale r operation the Oscillator Wa tchdog (OWD) monitors th e clock signal
generated by the on-chip oscillator (either with a crystal or via external clock drive). For this
operation the PLL provides a clock signal which is used to supervise transitions on the oscillator
clock. This PLL clock is independent from the XTAL1 clock. When the expected oscillator clock
transitions are missing the OWD activates the PLL Unlock / OWD interrupt node and supplies the
CPU with the PLL clock signal. Under these circumstances the PLL will oscillate with its basic
frequency.
A low level on pin OWE disables the PLL and the OWD’s interrupt output so the clock signal is
derived from the oscillator clock in any case.
Note: The CPU clock source is only switched back to the oscillator clock after a hardware reset.
For 3 V operation pin OWE must always be low (OWD disabled) as the PLL cannot deliver an
appropriate clock signal in this case.
For 5 V operation pin OWE should only be pulled low (PLL disabled) if direct drive or prescaler
operation is configured. All other configurations (PLL factors) result in direct drive operation.
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C163-L
Instruction Set Summary
The table below lists the instructions of the C163-L in a condensed way.
The various addressing modes that can be used with a specific instruction, the operation of the
instructions, parameters for conditional execution of instructions, and the opcodes for each
instruction can be found in the “C16x Family Instruction Set Manual”.
This document also provides a detailled description of each instruction.
Instruction Set Summary
Mnemonic Description Bytes
ADD(B) Add word (byte) operands 2 / 4
ADDC(B) Add word (byte) operands with Carry 2 / 4
SUB(B) Subtract word (byte) operands 2 / 4
SUBC(B) Subtract word (byte) operands with Carry 2 / 4
MUL(U) (Un)Signed multiply direct GPR by direct GPR (16-16-bit) 2
DIV(U) (Un)Signed divide register MDL by direct GPR (16-/16-bit) 2
DIVL(U) (Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2
CPL(B) Complement direct word (byte) GPR 2
NEG(B) Negate direct word (byte) GPR 2
AND(B) Bitwise AND, (word/byte operands) 2 / 4
OR(B) Bitwise OR, (word/byte operands) 2 / 4
XOR(B) Bitwise XOR, (word/byte operands) 2 / 4
BCLR Clear direct bit 2
BSET Set direct bit 2
BMOV(N) Move (negated) direct bit to direct bit 4
BAND, BOR, BXOR AND/OR/XOR direct bit with direct bit 4
BCMP Compare direct bit to direct bit 4
BFLDH/L Bitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data 4
CMP(B) Compare word (byte) operands 2 / 4
CMPD1/2 Compare word data to GPR and decrement GPR by 1/2 2 / 4
CMPI1/2 Compare word data to GPR and increment GPR by 1/2 2 / 4
PRIOR Determine number of shift cycles to normalize direct
word GPR and store result in direct word GPR 2
SHL / SHR Shift left/right direct w ord GPR 2
ROL / ROR Rotate left/right direct word GPR 2
ASHR Arithmetic (sign bit) shift right direct word GPR 2
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C163-L
MOV(B) Move word (byte) data 2 / 4
MOVBS Move byte operand to word operand with sign extension 2 / 4
MOVBZ Move byte operand to w ord operand. with zero extension 2 / 4
JMPA, JMPI, JMPR Jump absolute/indirect/relative if condition is met 4
JMPS Jump absolute to a code segment 4
J(N)B Jump relative if direct bit is (not) set 4
JBC Jump relative and clear bit if direct bit is set 4
JNBS Jump relative and set bit if direct bit is not set 4
CALLA, CALLI, CALLR Call absolute/indirect/relative subroutine if condition is met 4
CALLS Call absolute subroutine in any code segment 4
PCALL Push direct word register onto system stack and call
absolute subroutine 4
TRAP Call interrupt service routine via immediate trap number 2
PUSH, POP Push/pop direct word register onto/from system stack 2
SCXT Push direct word register onto system stack und update
register with word operand 4
RET Return from intra-segm ent subroutine 2
RETS Return from inter-segment subroutine 2
RETP Return from intra-segment subroutine and pop direct
word register from system stack 2
RETI Return from interrupt service subroutine 2
SRST Software Reset 4
IDLE Enter Idle Mode 4
PWRDN Enter Power Down Mode
(supposes NMI-pin being low) 4
SRVWDT Service Watchdog Timer 4
DISWDT Disable Watchdog Time r 4
EINIT Signify End-of-Initialization on RSTOUT-pin 4
ATOMIC Begin ATOMIC sequence 2
EXTR Begin EXTended Register sequence 2
EXTP(R) Begin EXTended Page (and Register) sequence 2 / 4
EXTS(R) Begin EXTended Segment (and Register) sequence 2 / 4
NOP Null operation 2
Instruction Set Summary (cont’d)
Mnemonic Description Bytes
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C163-L
Special Function Registers Overview
The following table lists all SFRs which are implemented in the C163-L in alphabetical order.
Bit-addressable SFRs are m arked with the letter “ b” in column “Name”. SFRs withi n the Extended
SFR-Space (ESFRs) are marked with the letter “E” in column “Physical Address”. Registers within
on-chip X-Peripherals (SSP) are marked with the letter “X” in column “Physical Address”.
An SFR can be specifi ed via its individu al mnemonic name . Depending on the selected addres sing
mode, an SFR can be accessed via its physi cal address (using the Data Page Pointers), or via its
short 8-bit address (without using the Data Page Pointers).
Special Function Registers Overview
Name Physical
Address 8-Bit
Address Description Reset
Value
ADDRSEL1 FE18H0CHAddress Select Register 1 0000H
ADDRSEL2 FE1AH0DHAddress Select Register 2 0000H
ADDRSEL3 FE1CH0EHAddress Select Register 3 0000H
ADDRSEL4 FE1EH0FHAddress Select Register 4 0000H
BUSCON0 b FF0CH86HBus Configuration Register 0 0XX0H
BUSCON1 b FF14H8AHBus Configuration Register 1 0000H
BUSCON2 b FF16H8BHBus Configuration Register 2 0000H
BUSCON3 b FF18H8CHBus Configuration Register 3 0000H
BUSCON4 b FF1AH8DHBus Configuration Register 4 0000H
CAPREL FE4AH25HGPT2 Capture/Reload Register 0000H
CC8IC b FF88HC4HEX0IN Interrupt Control Register 0000H
CC9IC b FF8AHC5HEX1IN Interrupt Control Register 0000H
CC10IC b FF8CHC6HEX2IN Interrupt Control Register 0000H
CC11IC b FF8EHC7HEX3IN Interrupt Control Register 0000H
CC12IC b FF90HC8HEX4IN Interrupt Control Register 0000H
CC13IC b FF92HC9HEX5IN Interrupt Control Register 0000H
CC14IC b FF94HCAHEX6IN Interrupt Control Register 0000H
CC15IC b FF96HCBHEX7IN Interrupt Control Register 0000H
CP FE10H08HCPU Context Pointer Register FC00H
CRIC b FF6AHB5HGPT2 CAPREL Interrupt Control Register 0000H
CSP FE08H04HCPU Code Segment Pointer Register (read only) 0000H
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C163-L
DP0L b F100HE80HP0L Direction Control Register 00H
DP0H b F102HE81HP0H Direction Control Register 00H
DP1L b F104HE82HP1L Direction Control Register 00H
DP1H b F106HE83HP1H Direction Control Register 00H
DP2 b FFC2HE1HPort 2 Direction Control Register 0000H
DP3 b FFC6HE3HPort 3 Direction C ontrol Register 0000H
DP4 b FFCAHE5HPort 4 Direction Control Register 00H
DP6 b FFCEHE7HPort 6 Direction Control Register 00H
DPP0 FE00H00HCPU Data Page Pointer 0 Register (10 bits) 0000 H
DPP1 FE02H01HCPU Data Page Pointer 1 Register (10 bits) 0001 H
DPP2 FE04H02HCPU Data Page Pointer 2 Register (10 bits) 0002 H
DPP3 FE06H03HCPU Data Page Pointer 3 Register (10 bits) 0003 H
EXICON b F1C0HEE0HExternal Interrupt Control Register 0000H
MDC b FF0EH87HCPU Multiply Divide Control Register 0000H
MDH FE0CH06HCPU Multiply Divi de Register – High Word 0000H
MDL FE0EH07HCPU Multiply Divi de Register – Low Word 0000H
ODP2 b F1C2HEE1HPort 2 Open Drain Control Register 0000H
ODP3 b F1C6HEE3HPort 3 Open Drain Control Register 0000H
ODP6 b F1CEHEE7HPort 6 Open Drain Control Register 00H
ONES FF1EH8FHConstant Value 1’s Register (read only) FFFFH
P0L b FF00H80HPort 0 Low Register (Lower half of PORT0) 00H
P0H b FF02H81HPort 0 High Register (Upper half of PORT0) 00H
P1L b FF04H82HPort 1 Low Register (Lower half of PORT1) 00H
P1H b FF06H83HPort 1 High Register (Upper half of PORT1) 00H
P2 b FFC0HE0HPort 2 Register 0000H
P3 b FFC4HE2HPort 3 Register 0000H
P4 b FFC8HE4HPort 4 Register (8 bi ts) 00H
P5 b FFA2HD1HPort 5 Register (read only) XXXXH
Special Function Registers Overview (cont’d)
Name Physical
Address 8-Bit
Address Description Reset
Value
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C163-L
P6 b FFCCHE6HPort 6 Register (8 bits) 00H
PECC0 FEC0H60HPEC Channel 0 Control Register 0000H
PECC1 FEC2H61HPEC Channel 1 Control Register 0000H
PECC2 FEC4H62HPEC Channel 2 Control Register 0000H
PECC3 FEC6H63HPEC Channel 3 Control Register 0000H
PECC4 FEC8H64HPEC Channel 4 Control Register 0000H
PECC5 FECAH65HPEC Ch annel 5 Control Register 0000H
PECC6 FECCH66HPEC Channel 6 Control Register 0000H
PECC7 FECEH67HPEC Ch annel 7 Control Register 0000H
PSW b FF10H88HCPU Program Status Word 0000H
RP0H b F108HE84HSystem Startup Configuration Register (Rd. only) XXH
S0BG FEB4H5AHSerial Channel 0 Baud Rate Generator Reload
Register 0000H
S0CON b FFB0HD8HSerial Channel 0 Control Register 0000H
S0EIC b FF70HB8HSerial Channel 0 Error Interrupt Control Register 0000H
S0RBUF FEB2H59HSerial Channel 0 Receive Buffer Register
(read only) XXH
S0RIC b FF6EHB7HSerial Channel 0 Receive Interrupt Control
Register 0000H
S0TBIC b F19CHECEHSerial Channel 0 Transmit Buffer Interrupt Control
Register 0000H
S0TBUF FEB0H58HSerial Channel 0 Transmit Buffer Register
(write only) 00H
S0TIC b FF6CHB6HSerial Channel 0 Transmit Interrupt Control
Register 0000H
SP FE12H09HCPU System Stack Pointer Register FC00H
SSPCON0 EF00HX--- SSP Control Register 0 0000H
SSPCON1 EF02HX--- SSP Control Register 1 0000H
SSPRTB EF04HX--- SSP Receive/Transmit Buffer XXXXH
SSPTBH EF06HX--- SSP Transmit Buffer High XXXXH
STKOV FE14H0AHCPU Stack Overflow Pointer Register FA00H
Special Function Registers Overview (cont’d)
Name Physical
Address 8-Bit
Address Description Reset
Value
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C163-L
1) The system c onfiguratio n is selected durin g res et .
2) Bit WDT R ind ic at es a wa tchdog timer triggered reset .
STKUN FE16H0BHCPU Stack Underflow Pointer Register FC00H
SYSCON b FF12H89HCPU System Configuration Register 0XX0H1)
T2 FE40H20HGPT1 Timer 2 Regi ster 0000H
T2CON b FF40HA0HGPT1 Timer 2 C ontrol Register 0000H
T2IC b FF60HB0HGPT1 Timer 2 Interrupt Control Register 0000H
T3 FE42H21HGPT1 Timer 3 Regi ster 0000H
T3CON b FF42HA1HGPT1 Timer 3 C ontrol Register 0000H
T3IC b FF62HB1HGPT1 Timer 3 Interrupt Control Register 0000H
T4 FE44H22HGPT1 Timer 4 Regi ster 0000H
T4CON b FF44HA2HGPT1 Timer 4 C ontrol Register 0000H
T4IC b FF64HB2HGPT1 Timer 4 Interrupt Control Register 0000H
T5 FE46H23HGPT2 Timer 5 Regi ster 0000H
T5CON b FF46HA3HGPT2 Timer 5 C ontrol Register 0000H
T5IC b FF66HB3HGPT2 Timer 5 Interrupt Control Register 0000H
T6 FE48H24HGPT2 Timer 6 Regi ster 0000H
T6CON b FF48HA4HGPT2 Timer 6 C ontrol Register 0000H
T6IC b FF68HB4HGPT2 Timer 6 Interrupt Control Register 0000H
TFR b FFACHD6HTrap Flag Register 0000H
WDT FEAEH57HWatchdog Timer Register (read only) 0000H
WDTCON FFAEHD7HWatchdog Timer Control Register 000XH 2)
XP1IC b F18EHEC7HSSP Interrupt Control Register 0000H
XP3IC b F19EHECFHPLL/OWD Interrupt Control Register 0000H
ZEROS b FF1CH8EHConstant Value 0’s Register (read only) 0000H
Special Function Registers Overview (cont’d)
Name Physical
Address 8-Bit
Address Description Reset
Value
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Absolute Maximum Ratings
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
During absolute maximum rating overload conditions (
V
IN>
V
DD or
V
IN<
V
SS) the voltage on
V
DD pins with respect to ground (
V
SS) must not exceed the values defined by the absolute
maximum ratings.
Parameter Symbol Limit Values Unit Notes
min. max.
Storage temperature TST -65 150 °C
Voltage on VDD pins with
respect to ground (VSS)VDD -0.5 6.5 V
Voltage on any pi n with
respect to ground (VSS)VIN -0.5 VDD+0.5 V
Input current on any pin
during overload condition -10 10 mA
Absolute sum of all input
currents during overload
condition
- |100| mA
Power dissipation PDISS -1.5 W
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Operating Conditions
The following opera ting conditions must not be exc eeded in order to ensure corre ct operation of the
C163-L. All parameters specified in the following sections refer to these operating conditions,
unless otherwise noticed.
Note: Operation at reduced supply voltage is defined for the 25 MHz devices (SA*-C163L25F)
only.
Parameter Interpretation
The parameters listed in the following partly represent the characteristics of the C163-L and partly
its demands on the system. To aid in interpreting the parameters right, when evalua ting them for a
design, they are marked in column “Symbol”:
CC (Controller Characteristics):
The logic of the C163-L will provide signals with the respective timing characteristics.
SR (System Requirement):
The external system must provide signals with the respective timing characteristics to the C163-L.
1) Overload conditions occur if the standard operatings conditions are exceeded, ie. the voltage on any pin
exceeds the specified range (ie. VOV >V
DD+0.5V, except pin OWE, or VOV <V
SS-0.5V). The absolute sum of
input overload currents on all port pins may not exceed 50 mA. The supply voltage must remain within the
specified limits.
2) Not 100% te s te d, guaranteed by de s ign c haracterizat ion.
Parameter Symbol Limit Values Unit Notes
min. max.
Digital supply voltage VDD 4.5 5.5 V Active mode,
fCPUmax = 25 MHz
2.5 5.5 V PowerDown mode
Reduced digital supply
voltage VDD 2.7 3.6 V Active mode,
fCPUmax = 12 MHz
Digital ground voltage VSS 0 V R eference voltage
Overload current IOV -±5 mA Per pin 1) 2)
Absolute sum of overload
currents Σ|IOV|- 50 mA
Ambient temperature TA0 70 °C SAB-C163-L...
-40 85 °C SAF-C163-L...
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C163-L
DC Characteristics (Standard Supply Voltage Range)
(Operating Conditions apply)
Parameter Symbol Limit Values Unit Test Condition
min. max.
Input low voltage VIL SR – 0.5 0.2 VDD
– 0.1 V–
Input high voltage
(all except RSTIN and XTAL1) VIH SR 0.2 VDD
+ 0.9 VDD + 0.5 V
Input high voltage RSTIN VIH1 SR 0.6 VDD VDD + 0.5 V
Input high voltage XTAL1 VIH2 SR 0.7 VDD VDD + 0.5 V
Output low voltage
(PORT0, PORT1, Port 4, ALE, RD,
WR, BHE, CLKOUT, RSTOUT)
VOL CC 0.45 V IOL = 2.4 mA
Output low voltage
(all other outputs) VOL1 CC 0.45 V IOL1 = 1.6 mA
Output high voltage
(PORT0, PORT1, Port 4, ALE, RD,
WR, BHE, CLKOUT, RSTOUT)
VOH CC 0.9 VDD
2.4
V
VIOH = – 500 µA
IOH = – 2.4 mA
Output high voltage 1)
(all other outputs) VOH1 CC 0.9 VDD
2.4 –V
VIOH = – 250 µA
IOH = – 1.6 mA
Input leakage current (Port 5) IOZ1 CC ±200 nA 0.45 V < VIN < VDD
Input leakage current (all other) IOZ2 CC ±500 nA 0.45 V < VIN < VDD
RSTIN pullup resistor RRST CC 50 250 k
Read/Write inactive current 2) IRWH 3) –-40µAVOUT = 2.4 V
Read/Write active current 2) IRWL 4) -500 µAVOUT = VOLmax
ALE inactive current 2) IALEL 3) –40µAVOUT = VOLmax
ALE active current 2) IALEH 4) 500 µAVOUT = 2.4 V
Port 6 inactive current 2) IP6H 3) –-40µAVOUT = 2.4 V
Port 6 active current 2) IP6L 4) -500 µAVOUT = VOL1max
PORT0 configuration current 2) IP0H 3) –-10µAVIN = VIHmin
IP0L 4) -100 µAVIN = VILmax
XTAL1 input current IIL CC ±20 µA0 V < VIN < VDD
Pin capacitance 5)
(digital inputs/outputs) CIO CC 10 pF f = 1 MHz
TA = 25 °C
Power supply current
(at 5 V supply voltage) IDD5 10 +
3.5 * fCPU
mA RSTIN = VIL2
fCPU in [MHz] 6)
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1) This specif ication is not valid for ou tputs which are swit ched to open drain mode. In this case th e respective
output will floa t an d th e vo lt age results from th e ex t ernal circuitry.
2) This specif ication is only valid during Reset, or during Hold- or Adap t-mode. Por t 6 pins are only affected, if
they are used for CS output and th e open drain func tio n is not enabled.
3) The maxim um current ma y be draw n while the respective signa l line remains ina ctiv e.
4) The minimum current must be drawn in order to drive the respective signal line active.
5) Not 100% te s te d, guaranteed by de s ign c haracterizat ion.
6) The supply current is a function of the operating frequency. This dependency is illustrated in the figure below.
These parameters are tested at VDDmax and maximum CPU clock with all outputs disconnected and all inputs
at VIL or VIH.
7) This para meter is tested including leakag e curren ts. All inputs (inc luding p ins con figured as inpu ts) at 0 V to
0.1 V or at VDD – 0.1 V to VDD, VREF = 0 V, all outputs (inc luding pins con fi gured as outpu ts) dis c onnected.
Idle mode supply current
(at 5 V supply voltage) IID5 –2 +
1.1 * fCPU
mA RSTIN = VIH1
fCPU in [MHz] 6)
Power-down mode supply current
(at 5 V supply voltage) IPD5 –50µAVDD = VDDmax 7)
Parameter Symbol Limit Values Unit Test Condition
min. max.
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DC Characteristics (Reduced Supply Voltage Range)
(Operating Conditions apply)
Parameter Symbol Limit Values Unit Test Condition
min. max.
Input low voltage VIL SR – 0.5 0.8 V
Input high voltage
(all except RSTIN and XTAL1) VIH SR 1.8 VDD + 0.5 V
Input high voltage RSTIN VIH1 SR 0.6 VDD VDD + 0.5 V
Input high voltage XTAL1 VIH2 SR 0.7 VDD VDD + 0.5 V
Output low voltage
(PORT0, PORT1, Port 4, ALE, RD,
WR, BHE, CLKOUT, RSTOUT)
VOL CC 0.45 V IOL = 1.6 mA
Output low voltage
(all other outputs) VOL1 CC 0.45 V IOL1 = 1.0 mA
Output high voltage
(PORT0, PORT1, Port 4, ALE, RD,
WR, BHE, CLKOUT, RSTOUT)
VOH CC 0.9 VDD –VIOH = – 500 µA
Output high voltage 1)
(all other outputs) VOH1 CC 0.9 VDD –VIOH = – 250 µA
Input leakage current (Port 5) IOZ1 CC ±200 nA 0.45 V < VIN < VDD
Input leakage current (all other) IOZ2 CC ±500 nA 0.45 V < VIN < VDD
RSTIN pullup resistor RRST CC 50 250 k
Read/Write inactive current 2) IRWH 3) –-10µAVOUT = 2.4 V
Read/Write active current 2) IRWL 4) -500 µAVOUT = VOLmax
ALE inactive current 2) IALEL 3) –20µAVOUT = VOLmax
ALE active current 2) IALEH 4) 500 µAVOUT = 2.4 V
Port 6 inactive current 2) IP6H 3) –-10µAVOUT = 2.4 V
Port 6 active current 2) IP6L 4) -500 µAVOUT = VOL1max
PORT0 configuration current 2) IP0H 3) –-5µAVIN = VIHmin
IP0L 4) -100 µAVIN = VILmax
XTAL1 input current IIL CC ±20 µA0 V < VIN < VDD
Pin capacitance 5)
(digital inputs/outputs) CIO CC 10 pF f = 1 MHz
TA = 25 °C
Power supply current
(at 3 V supply voltage) IDD3 10 +
1.5 * fCPU
mA RSTIN = VIL2
fCPU in [MHz] 6)
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1) This specif ication is not valid for ou tputs which are swit ched to open drain mode. In this case th e respective
output will floa t an d th e vo lt age results from th e ex t ernal circuitry.
2) This specif ication is only valid during Reset, or during Hold- or Adap t-mode. Por t 6 pins are only affected, if
they are used for CS output and th e open drain func tio n is not enabled.
3) The maxim um current ma y be draw n while the respective signa l line remains ina ctiv e.
4) The minimum current must be drawn in order to drive the respective signal line active.
5) Not 100% te s te d, guaranteed by de s ign c haracterizat ion.
6) The supply current is a function of the operating frequency. This dependency is illustrated in the figure below.
These parameters are tested at VDDmax and maximum CPU clock with all outputs disconnected and all inputs
at VIL or VIH.
7) This para meter is tested including leakag e curren ts. All inputs (inc luding p ins con figured as inpu ts) at 0 V to
0.1 V or at VDD – 0.1 V to VDD, VREF = 0 V, all outputs (inc luding pins con fi gured as outpu ts) dis c onnected.
Idle mode supply current
(at 3 V supply voltage) IID3 –2 +
0.7 * fCPU
mA RSTIN = VIH1
fCPU in [MHz] 6)
Power-down mode supply current
(at 3 V supply voltage) IPD3 –30µAVDD = VDDmax 7)
Parameter Symbol Limit Values Unit Test Condition
min. max.
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Figure 7
Supply/Idle Current as a Function of Operating Frequency
I [mA]
fCPU [MHz]
510 15 25
100
50
10
IDD5max
IID5max
IDD5typ
IID5typ
20
IDD3max
IDD3typ
IID3max
IID3typ
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Testing Waveforms
Figure 8
Input Output Waveforms
Figure 9
Float Waveforms
AC inputs during testing are driven at 2.4 V for a logic ‘1’ and 0.45 V for a logic ‘0’.
Timing measurements are made at VIH min for a logic ‘1’ and VIL max for a logic ‘0’.
2.4 V
0.45 V
Test Points
1.8 V 1.8 V
0.8 V 0.8 V
For timing purposes a port pin is no longer floating when a 100 mV change from load
voltage occurs, but begins to float when a 100 mV change from the loaded VOH/VOL level occurs
(IOH/IOL = 20 mA).
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AC Characteristics
Definition of Internal Timing
The internal opera tion of the C163-L is cont rolled by the internal CPU clock fCPU. Both edges of th e
CPU clock can trigger internal (eg. pipeline) or external (eg. bus cycles) operations.
The specification of the external timing (AC Characteristics) therefore depends on the time between
two consecutive edges of the CPU clock, called “TCL” (see figure below).
Figure 10
Generation Mechanisms for the CPU Clock
The CPU clock signal can be generated via different mechanisms. The duration of TCLs and their
variation (and also the derive d external timing ) depends on the used mechanis m to generate fCPU.
This influence must be regarded when calculating the timings for the C163-L.
Note: The example for PLL operation shown in the figure above refers to a PLL factor of 4.
The used mechanism to generate the CPU clock is selected d uring reset via the logic levels on pins
P0.15-13 (P0H.7-5).
The table below associates the combinations of these three bits with the respective clock generation
mode.
TCLTCL
TCLTCL
fCPU
fOSC
fCPU
fOSC
Phase Locked Loop Operation
Direct Clock Drive
TCL TCL
fCPU
fOSC
Prescaler Operation
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Prescaler Operation
When pins P0.15-13 (P0H.7-5) equal ’001’ during reset the CPU clock is derived from the internal
oscillator (input clock signal) by a 2:1 prescaler.
The frequency of fCPU is half the frequency of fOSC and the high and low time of fCPU (ie. the duration
of an individual TCL) is defined by the period of the input clock fOSC.
The timings lis ted in the AC Characteristics that refer to TCLs therefore can be calcul ated using the
period of fOSC for any TCL.
Direct Drive
When pins P0.15-13 (P0H.7-5) equal ’011’ during reset the on-chip phase locked loop is disabled
and the CPU clock is directly driven from the internal oscillator with the input clock signal.
The frequency of fCPU direc tly follows the frequency of fOSC so the high and low time of fCPU (ie. the
duration of an individual TCL) is defined by the duty cycle of the input clock fOSC.
The timings listed below that refer to TCLs therefore must be calculated using the minimum TCL
that is possible under the respective circumstances. This minimum value can be calculated via the
following formula:
TCLmin = 1/fOSC * DCmin (DC = duty cycle)
For two consecutive TCLs the deviation caused by the duty cycle of fOSC is compensated so the
duration of 2TCL is always 1/fOSC. The minimum value TCLmin therefore has to be used only once
for timings that require an odd number of TCLs (1,3,...). Timings that require an even number of
TCLs (2,4,...) may use the formula 2TCL = 1/fOSC.
Note: The address float timings in Multiplexed bus mod e (t11 and t45) use the maximum duration of
TCL (TCLmax = 1/fOSC * DCmax) instead of TCLmin.
1) The extern al c loc k input range refers to a C PU clo ck range of 10...2 5 M Hz.
2) The maxim um frequen cy depends on the dut y cyc le of th e ex te rnal clock signal.
Direct drive is als o se lec t ed ins t ead of PLL operat ion if pin OWE = ’0’ in su ch a case.
C163-L Clock Generation Modes
P0.15-13
(P0H.7-5) CPU Frequency
fCPU = fOSC * F External Clock Input
Range 1) Notes
111 fOSC * 4 2.5 to 6.25 MHz Default configuration
110 fOSC * 3 3.33 to 8.33 MHz
101 fOSC * 2 5 to 12.5 MHz
100 fOSC * 5 2 to 5 MHz
011 fOSC * 1 1 to 25 MHz Direct drive 2)
010 fOSC * 1.5 6.66 to 16.6 MHz
001 fOSC / 2 2 to 50 MHz CPU clock via prescaler
000 fOSC * 2.5 4 to 10 MHz
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Phase Locked Loop
For all other combinations of pin s P0.15-13 (P0H.7-5) during res et the on-chip pha se locked loo p is
enabled and provides the CPU clock (see table above). The PLL multiplies the input frequency by
the factor F which is selec ted via the combination of pin s P0.15-13 (i.e. fCPU = fOSC * F). Wi th every
F’th transition of fOSC the PLL circuit synchronizes the CPU clock to the input clock. This
synchronization is done smoothely, i.e. the CPU clock frequency does not change abruptly.
Due to this adaptation to the input clock the frequency of fCPU is constantly adjusted so it is locked
to fOSC. The slight variation causes a jitter of fCPU which also effects the duration of individual TCLs.
The timings listed in the AC Characteristics that refer to TCLs therefore must be calculated using the
minimum TCL that is possible under the respective circumstances.
The actual minimum value for TCL depends on the jitter of the PLL. As the PLL is constantly
adjusting its output frequenc y so it corresponds to the applied input frequen cy (crystal or oscill ator)
the relative deviation for periods of more than one TCL is lower than for one single TCL (see formula
and figure below).
For a period of
N
* TCL the minimum value is computed using the corresponding deviation D
N
:
(
N
* TCL)min =
N
* TCLNOM - D
N
D
N
[ns] = ±(13.3 +
N
*6.3) / fCPU [MHz],
where
N
= number of consecutive TCLs and 1
N
40.
So for a period of 3 TCLs @ 25 MHz (i.e.
N
= 3): D
3
= (13.3 +
3
* 6.3) / 25 = 1.288 ns,
and (3TCL)min = 3TCLNOM - 1.288 ns = 58.7 ns (@ fCPU = 25 MHz).
This is especially important for bus cycles using waitstates and e.g. for the operation of timers, serial
interfaces, etc. For all slower operations and longer periods (e.g. pulse train generation or
measurement, lower baudrates, etc.) the deviation caused by the PLL jitter is neglectible.
Note: For all periods longer than 40 TCL the N=40 value can be used (see figure below).
Figure 11
Approximated Maximum Accumulated PLL Jitter
Note: The PLL only operates within the standard supply voltage range of VDD = 4.5 - 5.5 V.
40201051
±1
±10
±20
N
This approximated formula is valid for
1
N
40 and 10MHz fCPU 25MHz.
±26.5
Max.jitter D
N
[ns]
20 MHz
25 MHz
16 MHz
10 MHz
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AC Characteristics
External Clock Drive XTAL1 (Standard Supply Voltage Range)
(Operating Conditions apply)
AC Characteristics
External Clock Drive XTAL1 (Reduced Supply Voltage Range)
(Operating Conditions apply)
1) The minimum and maximum oscillator periods for PLL operation depend on the selected CPU clock generation
mode. Please see respective table above.
2) The clock input signal mus t re ac h th e def ined levels VIL and VIH2.
1) The clock input signal mus t re ac h th e def ined levels VIL and VIH2.
Parameter Symbol Direct Drive 1:1 Prescaler 2:1 PLL 1:N Unit
min. max. min. max. min. max.
Oscillator period tOSC SR 40 1000 20 500 60 1) 500 1) ns
High time t1SR 18 2) –6
2) 10 2) –ns
Low time t2SR 18 2) –6
2) 10 2) –ns
Rise time t3SR 10 2) –6
2) 10 2) ns
Fall time t4SR 10 2) –6
2) 10 2) ns
Parameter Symbol Direct Drive 1:1 Prescaler 2:1 PLL 1:N Unit
min. max. min. max. min. max.
Oscillator period tOSC SR 83 1000 42 500 ns
High time t1SR 361) 10 1) –––ns
Low time t2SR 36 1) 10 1) –––ns
Rise time t3SR 10 1) –6
1) ––ns
Fall time t4SR 10 1) –6
1) ––ns
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Figure 12
External Clock Drive XTAL1
Memory Cycle Variables
The timing tables below use three variables which are derived from the BUSCONx registers and
represent the special characteristics of the programmed memory cycle. The following table
describes, how these variables are to be computed.
Description Symbol Values
ALE Extension tATCL * <ALECTL>
Memory Cycle Time Waitstates tC2TCL * (15 - <MCTC>)
Memory Tristate Time tF2TCL * (1 - <MTTC>)
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AC Characteristics
Multiplexed Bus (Standard Supply Voltage Range)
(Operating Conditions apply,
CL = 100 pF)
ALE cycle time = 6 TCL + 2tA + tC + tF (120 ns at 25 MHz CPU clock without waitstates)
Parameter Symbol Max. CPU Clock
= 25 MHz Variable CPU Clock
1 / 2TCL = 1 to 25 MHz Unit
min. max. min. max.
ALE high time t5CC 10 + tA TCL - 10 + tA–ns
Address setup to ALE t6CC 4 + tA TCL - 16 + tA–ns
Address hold after ALE t7CC 10 + tA TCL - 10 + tA–ns
ALE falling edge to R D,
WR (with RW-delay) t8CC 10 + tA TCL - 10 + tA–ns
ALE falling edge to R D,
WR (no RW-delay) t9CC -10 + tA -10 + tA–ns
Address float after RD, WR
(with RW-delay) t10 CC 6–6ns
Address float after RD, WR
(no RW-delay) t11 CC –26 TCL + 6ns
RD, WR low time
(with RW-delay) t12 CC 30 + tC 2TCL - 10
+ tC
–ns
RD, WR low time
(no RW-delay) t13 CC 50 + tC 3 TCL - 10
+ tC
–ns
RD to valid data in
(with RW-delay) t14 SR 20 + tC–2TCL - 20
+ tC
ns
RD to valid data in
(no RW-delay) t15 SR 40 + tC–3TCL - 20
+ tC
ns
ALE low to valid data in t16 SR 40
+ tA + tC
–3TCL - 20
+ tA + tC
ns
Address to valid data in t17 SR 50
+ 2tA + tC
–4TCL - 30
+ 2tA + tC
ns
Data hold after RD
rising edge t18 SR00–ns
Data float after RD t19 SR 26 + tF 2TCL - 14 + tFns
Data valid to WR t22 CC 20 + tC 2TCL - 20
+ tC
–ns
Data hold after WR t23 CC 26 + tF 2TCL - 14
+ tF
–ns
ALE rising edge after RD,
WR t25 CC 26 + tF 2TCL - 14 + tF–ns
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Address hold after RD, WR t27 CC 26 + tF 2TCL - 14 + tF–ns
ALE falling edge to C S t38 CC -4 - tA10 - tA-4 - tA10 - tAns
CS low to Valid Data In t39 SR 40
+ tC + 2tA
–3TCL - 20
+ tC + 2tA
ns
CS hold after RD, WR t40 CC 46 + tF 3TCL - 14 + tF–ns
ALE fall. edge to RdCS,
WrCS (with RW delay) t42 CC 16 + tA TCL - 4
+ tA
–ns
ALE fall. edge to RdCS,
WrCS (no RW delay) t43 CC -4 + tA–-4
+ tA
–ns
Address float after RdCS,
WrCS (with RW delay) t44 CC0–0ns
Address float after RdCS,
WrCS (no RW delay) t45 CC 20 TCL ns
RdCS to Valid Data In
(with RW delay) t46 SR 16 + tC–2TCL - 24
+ tC
ns
RdCS to Valid Data In
(no RW delay) t47 SR 36 + tC–3TCL - 24
+ tC
ns
RdCS, WrCS Low Time
(with RW delay) t48 CC 30 + tC 2TCL - 10
+ tC
–ns
RdCS, WrCS Low Time
(no RW delay) t49 CC 50 + tC 3TCL - 10
+ tC
–ns
Data valid to WrCS t50 CC 26 + tC 2TCL - 14
+ tC
–ns
Data hold after RdCS t51 SR00–ns
Data float after RdCS t52 SR 20 + tF 2TCL - 20 + tFns
Address hold after
RdCS, WrCS t54 CC 20 + tF 2TCL - 20 + tF–ns
Data hold after WrCS t56 CC 20 + tF 2TCL - 20 + tF–ns
Parameter Symbol Max. CPU Clock
= 25 MHz Variable CPU Clock
1 / 2TCL = 1 to 25 MHz Unit
min. max. min. max.
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AC Characteristics
Multiplexed Bus (Reduced Supply Voltage Range)
(Operating Conditions apply,
CL = 100 pF)
ALE cycle time = 6 TCL + 2tA + tC + tF (250 ns at 12 MHz CPU clock without waitstates)
Parameter Symbol Max. CPU Clock
= 12 MHz Variable CPU Clock
1 / 2TCL = 1 to 12 MHz Unit
min. max. min. max.
ALE high time t5CC 22 + tA TCL - 20 + tA–ns
Address setup to ALE t6CC 12 + tA TCL - 30 + tA–ns
Address hold after ALE t7CC 32 + tA TCL - 10 + tA–ns
ALE falling edge to R D,
WR (with RW-delay) t8CC 32 + tA TCL - 10 + tA–ns
ALE falling edge to R D,
WR (no RW-delay) t9CC -10 + tA -10 + tA–ns
Address float after RD, WR
(with RW-delay) t10 CC 6–6ns
Address float after RD, WR
(no RW-delay) t11 CC –48 TCL + 6ns
RD, WR low time
(with RW-delay) t12 CC 63 + tC 2TCL - 20
+ tC
–ns
RD, WR low time
(no RW-delay) t13 CC 105 + tC 3 TCL - 20
+ tC
–ns
RD to valid data in
(with RW-delay) t14 SR 49 + tC–2TCL - 34
+ tC
ns
RD to valid data in
(no RW-delay) t15 SR 91 + tC–3TCL - 34
+ tC
ns
ALE low to valid data in t16 SR 93
+ tA + tC
–3TCL - 32
+ tA + tC
ns
Address to valid data in t17 SR 115
+ 2tA + tC
–4TCL - 52
+ 2tA + tC
ns
Data hold after RD
rising edge t18 SR00–ns
Data float after RD t19 SR 69 + tF 2TCL - 14 + tFns
Data valid to WR t22 CC 47 + tC 2TCL - 36
+ tC
–ns
Data hold after WR t23 CC 69 + tF 2TCL - 14
+ tF
–ns
ALE rising edge after RD,
WR t25 CC 69 + tF 2TCL - 14
+ tF
–ns
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Address hold after RD, WR t27 CC 69 + tF 2TCL - 14 + tF–ns
ALE falling edge to C S t38 CC -10 - tA10 - tA-10 - tA10 - tAns
CS low to Valid Data In t39 SR 89
+ tC + 2tA
–3TCL - 36
+ tC+2tA
ns
CS hold after RD, WR t40 CC 105 + tF 3TCL - 20 + tF–ns
ALE fall. edge to RdCS,
WrCS (with RW delay) t42 CC 36 + tA TCL - 6
+ tA
–ns
ALE fall. edge to RdCS,
WrCS (no RW delay) t43 CC -6 + tA–-6
+ tA
–ns
Address float after RdCS,
WrCS (with RW delay) t44 CC0–0ns
Address float after RdCS,
WrCS (no RW delay) t45 CC 42 TCL ns
RdCS to Valid Data In
(with RW delay) t46 SR 45 + tC–2TCL - 38
+ tCns
RdCS to Valid Data In
(no RW delay) t47 SR 87 + tC–3TCL - 38
+ tCns
RdCS, WrCS Low Time
(with RW delay) t48 CC 69 + tC 2TCL - 14
+ tC
–ns
RdCS, WrCS Low Time
(no RW delay) t49 CC 111 + tC 3TCL - 14
+ tC
–ns
Data valid to WrCS t50 CC 53 + tC 2TCL - 30
+ tC
–ns
Data hold after RdCS t51 SR00–ns
Data float after RdCS t52 SR 63 + tF 2TCL - 20 + tFns
Address hold after
RdCS, WrCS t54 CC 63 + tF 2TCL - 20 + tF–ns
Data hold after WrCS t56 CC 63 + tF 2TCL - 20 + tF–ns
Parameter Symbol Max. CPU Clock
= 12 MHz Variable CPU Clock
1 / 2TCL = 1 to 12 MHz Unit
min. max. min. max.
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Figure 13-1
External Memory Cycle: Multiplexed Bus, With Read/Write Delay, Normal ALE
Data In
Data OutAddress
Address
t
38
t
44
t
10
Address
ALE
CSx
A23-A16
(A15-A8)
BHE
BUS
Read Cycle
RD
RdCSx
BUS
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
7
t
39
t
40
t
25
t
27
t
18
t
19
t
14
t
46
t
12
t
48
t
10
t
22
t
23
t
44
t
12
t
48
t
8
t
42
t
42
t
8
t
50
t
51
t
54
t
52
t
56
11Aug98@14:48h Intermediate Version
Semiconductor Group 44 1998-08
C163-L
Figure 13-2
External Memory Cycle: Multiplexed Bus, With Read/Write Delay, Extended ALE
Data OutAddress
Data InAddress
t
38
t
44
t
10
Address
ALE
CSx
A23-A16
(A15-A8)
BHE
BUS
Read Cycle
RD
RdCSx
BUS
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
7
t
39
t
40
t
25
t
27
t
18
t
19
t
14
t
46
t
12
t
48
t
10
t
22
t
23
t
44
t
12
t
48
t
8
t
42
t
42
t
8
t
50
t
51
t
54
t
52
t
56
11Aug98@14:48h Intermediate Version
Semiconductor Group 45 1998-08
C163-L
Figure 13-3
External Memory Cycle: Multiplexed Bus, No Read/Write Delay, Normal ALE
Data OutAddress
Address Data In
t
38
Address
ALE
CSx
A23-A16
(A15-A8)
BHE
BUS
Read Cycle
RD
RdCSx
BUS
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
7
t
39
t
40
t
25
t
27
t
18
t
19
t
15
t
47
t
13
t
49
t
22
t
23
t
13
t
49
t
9
t
43
t
43
t
9
t
11
t
45
t
11
t
45
t
50
t
51
t
54
t
52
t
56
11Aug98@14:48h Intermediate Version
Semiconductor Group 46 1998-08
C163-L
Figure 13-4
External Memory Cycle: Multiplexed Bus, No Read/Write Delay, Extended ALE
Data OutAddress
Data InAddress
t
38
Address
ALE
CSx
A23-A16
(A15-A8)
BHE
BUS
Read Cycle
RD
RdCSx
BUS
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
7
t
39
t
40
t
25
t
27
t
18
t
19
t
15
t
47
t
13
t
49
t
22
t
23
t
13
t
49
t
9
t
43
t
43
t
9
t
11
t
45
t
11
t
45
t
50
t
51
t
54
t
52
t
56
11Aug98@14:48h Intermediate Version
Semiconductor Group 47 1998-08
C163-L
AC Characteristics
Demultiplexed Bus (Standard Supply Voltage Range)
(Operating Conditions apply,
CL = 100 pF)
ALE cycle time = 4 TCL + 2tA + tC + tF (80 ns at 25 MHz CPU clock without waitstates)
Parameter Symbol Max. CPU Clock
= 25 MHz Variable CPU Clock
1 / 2TCL = 1 to 25 MHz Unit
min. max. min. max.
ALE high time t5CC 10 + tA TCL - 10 + tA–ns
Address setup to ALE t6CC 4 + tA TCL - 16 + tA–ns
ALE falling edge to R D,
WR (with RW-delay) t8CC 10 + tA–TCL - 10
+ tA
–ns
ALE falling edge to R D,
WR (no RW-delay) t9CC -10 + tA–-10
+ tA
–ns
RD, WR low time
(with RW-delay) t12 CC 30 + tC 2TCL - 10
+ tC
–ns
RD, WR low time
(no RW-delay) t13 CC 50 + tC 3 TCL - 10
+ tC
–ns
RD to valid data in
(with RW-delay) t14 SR 20 + tC–2TCL - 20
+ tC
ns
RD to valid data in
(no RW-delay) t15 SR 40 + tC–3TCL - 20
+ tC
ns
ALE low to valid data in t16 SR 40
+ tA + tC
–3TCL - 20
+ tA + tC
ns
Address to valid data in t17 SR 50
+ 2tA + tC
–4TCL - 30
+ 2tA + tC
ns
Data hold after RD
rising edge t18 SR00–ns
Data float after RD rising
edge (with RW-delay 1))t20 SR 26 + tF–2TCL - 14
+ 2tA + tF 1) ns
Data float after RD rising
edge (no RW-delay 1))t21 SR 10 + tF–TCL - 10
+ 2tA + tF 1) ns
Data valid to WR t22 CC 20 + tC 2TCL - 20
+ tC
–ns
Data hold after WR t24 CC 10 + tF–TCL - 10
+ tF
–ns
ALE rising edge after RD,
WR t26 CC -10 + tF–-10
+ tF
–ns
Address hold after WR 2) t28 CC 0 + tF–0 + tF–ns
ALE falling edge to C S t38 CC -4 - tA10 - tA-4 - tA10 - tAns
11Aug98@14:48h Intermediate Version
Semiconductor Group 48 1998-08
C163-L
1) RW-delay and tA refer to the next follow ing bus cycle.
2) Read data are latched with the same clock edge that triggers the address change and the rising RD edge.
Therefore address changes befor e th e end of RD have no impa c t on read c y cle s .
CS low to Valid Data In t39 SR –40
+ tC + 2tA
–3TCL - 20
+ tC+2tA
ns
CS hold after RD, WR t41 CC 6 + tF–TCL - 14
+ tF
–ns
ALE falling edge to RdCS,
WrCS (with RW-delay) t42 CC 16 + tA TCL - 4
+ tA
–ns
ALE falling edge to RdCS,
WrCS (no RW-delay) t43 CC -4 + tA–-4
+ tA
–ns
RdCS to Valid Data In
(with RW-delay) t46 SR 16 + tC–2TCL - 24
+ tC
ns
RdCS to Valid Data In
(no RW-delay) t47 SR 36 + tC–3TCL
- 24
+ tC
ns
RdCS, WrCS Low Time
(with RW-delay) t48 CC 30 + tC 2TCL - 10
+ tC
–ns
RdCS, WrCS Low Time
(no RW-delay) t49 CC 50 + tC 3TCL - 10
+ tC
–ns
Data valid to WrCS t50 CC 26 + tC 2TCL - 14
+ tC
–ns
Data hold after RdCS t51 SR00–ns
Data float after RdCS
(with RW-delay) t53 SR 20 + tF–2TCL - 20
+ tF
ns
Data float after RdCS
(no RW-delay) t68 SR 0 + tF–TCL - 20
+ tF
ns
Address hold after
RdCS, WrCS t55 CC -6 + tF–-6 + tF–ns
Data hold after WrCS t57 CC 6 + tF TCL - 14 + tF–ns
Parameter Symbol Max. CPU Clock
= 25 MHz Variable CPU Clock
1 / 2TCL = 1 to 25 MHz Unit
min. max. min. max.
11Aug98@14:48h Intermediate Version
Semiconductor Group 49 1998-08
C163-L
AC Characteristics
Demultiplexed Bus (Reduced Supply Voltage Range)
(Operating Conditions apply,
CL = 100 pF)
ALE cycle time = 4 TCL + 2tA + tC + tF (166.7 ns at 12 MHz CPU clock without waitstates)
Parameter Symbol Max. CPU Clock
= 12 MHz Variable CPU Clock
1 / 2TCL = 1 to 12 MHz Unit
min. max. min. max.
ALE high time t5CC 22 + tA TCL - 20 + tA–ns
Address setup to ALE t6CC 12 + tA TCL - 30 + tA–ns
ALE falling edge to R D,
WR (with RW-delay) t8CC 32 + tA–TCL - 10
+ tA
–ns
ALE falling edge to R D,
WR (no RW-delay) t9CC -10 + tA–-10
+ tA
–ns
RD, WR low time
(with RW-delay) t12 CC 63 + tC 2TCL - 20
+ tC
–ns
RD, WR low time
(no RW-delay) t13 CC 105 + tC 3 TCL - 20
+ tC
–ns
RD to valid data in
(with RW-delay) t14 SR 49 + tC–2TCL - 34
+ tCns
RD to valid data in
(no RW-delay) t15 SR 91 + tC–3TCL - 34
+ tCns
ALE low to valid data in t16 SR 93
+ tA + tC–3TCL - 32
+ tA + tCns
Address to valid data in t17 SR 115
+ 2tA + tC–4TCL - 52
+ 2tA + tCns
Data hold after RD
rising edge t18 SR00–ns
Data float after RD rising
edge (with RW-delay 1))t20 SR 69 + tF–2TCL - 14
+ 2tA + tF 1) ns
Data float after RD rising
edge (no RW-delay 1))t21 SR 32 + tF–TCL - 10
+ 2tA + tF 1) ns
Data valid to WR t22 CC 47 + tC 2TCL - 36
+ tC
–ns
Data hold after WR t24 CC 32 + tF–TCL - 10
+ tF
–ns
ALE rising edge after RD,
WR t26 CC -12 + tF–-12
+ tF–ns
Address hold after WR 2) t28 CC 0 + tF–0 + tF–ns
ALE falling edge to C S t38 CC -10 - tA10 - tA *) -10 - tA10 - tA *) ns
11Aug98@14:48h Intermediate Version
Semiconductor Group 50 1998-08
C163-L
1) RW-delay and tA refer to the next follow ing bus cycle.
2) Read data are latched with the same clock edge that triggers the address change and the rising RD edge.
Therefore address changes befor e th e end of RD have no impa c t on read c y cle s .
CS low to Valid Data In t39 SR –89
+ tC + 2tA
–3TCL - 36
+ tC+2tA
ns
CS hold after RD, WR t41 CC 22 + tF–TCL - 20
+ tF
–ns
ALE falling edge to RdCS,
WrCS (with RW-delay) t42 CC 36 + tA TCL - 6
+ tA
–ns
ALE falling edge to RdCS,
WrCS (no RW-delay) t43 CC -6 + tA–-6
+ tA
–ns
RdCS to Valid Data In
(with RW-delay) t46 SR 45 + tC–2TCL - 38
+ tC
ns
RdCS to Valid Data In
(no RW-delay) t47 SR 87 + tC–3TCL
- 38
+ tC
ns
RdCS, WrCS Low Time
(with RW-delay) t48 CC 69 + tC 2TCL - 14
+ tC
–ns
RdCS, WrCS Low Time
(no RW-delay) t49 CC 111 + tC 3TCL - 14
+ tC
–ns
Data valid to WrCS t50 CC 53 + tC 2TCL - 30
+ tC
–ns
Data hold after RdCS t51 SR00–ns
Data float after RdCS
(with RW-delay) t53 SR 63 + tF–2TCL - 20
+ tF
ns
Data float after RdCS
(no RW-delay) t68 SR 22 + tF–TCL - 20
+ tF
ns
Address hold after
RdCS, WrCS t55 CC -20 + tF -20 + tF–ns
Data hold after WrCS t57 CC 26 + tF TCL - 16 + tF–ns
Parameter Symbol Max. CPU Clock
= 12 MHz Variable CPU Clock
1 / 2TCL = 1 to 12 MHz Unit
min. max. min. max.
11Aug98@14:48h Intermediate Version
Semiconductor Group 51 1998-08
C163-L
Figure 14-1
External Memory Cycle: Demultiplexed Bus, With Read/Write Delay, Normal ALE
Data Out
Data In
t
38
Address
ALE
CSx
A23-A16
A15-A0
BHE
BUS
(D15-D8)
D7-D0
Read Cycle
RD
RdCSx
Write Cycle
WrCSx
t
5
t
16
t
17
t
6
t
39
t
41
t
26
t
28
t
18
t
20
t
14
t
46
t
12
t
48
t
22
t
24
t
12
t
48
t
8
t
42
t
42
t
8
t
50
t
51
t
55
t
53
t
57
BUS
(D15-D8)
D7-D0
WR,
WRL, WRH
11Aug98@14:48h Intermediate Version
Semiconductor Group 52 1998-08
C163-L
Figure 14-2
External Memory Cycle: Demultiplexed Bus, With Read/Write Delay, Extended ALE
Data Out
Data In
t
38
Address
ALE
CSx
A23-A16
A15-A0
BHE
Read Cycle
RD
RdCSx
Write Cycle
WrCSx
t
5
t
16
t
17
t
6
t
39
t
41
t
26
t
28
t
18
t
20
t
14
t
46
t
12
t
48
t
22
t
24
t
12
t
48
t
8
t
42
t
42
t
8
t
50
t
51
t
55
t
53
t
57
BUS
(D15-D8)
D7-D0
BUS
(D15-D8)
D7-D0
WR,
WRL, WRH
11Aug98@14:48h Intermediate Version
Semiconductor Group 53 1998-08
C163-L
Figure 14-3
External Memory Cycle: Demultiplexed Bus, No Read/Write Delay, Normal ALE
Data Out
Data In
t
38
Address
ALE
CSx
A23-A16
A15-A0
BHE
Read Cycle
RD
RdCSx
Write Cycle
WrCSx
t
5
t
16
t
17
t
6
t
39
t
41
t
26
t
28
t
18
t
21
t
15
t
47
t
13
t
49
t
22
t
24
t
13
t
49
t
9
t
43
t
43
t
9
t
50
t
51
t
55
t
68
t
57
BUS
(D15-D8)
D7-D0
BUS
(D15-D8)
D7-D0
WR,
WRL, WRH
11Aug98@14:48h Intermediate Version
Semiconductor Group 54 1998-08
C163-L
Figure 14-4
External Memory Cycle: Demultiplexed Bus, No Read/Write Delay, Extended ALE
Data Out
Data In
t
38
Address
ALE
CSx
A23-A16
A15-A0
BHE
Read Cycle
RD
RdCSx
Write Cycle
WR,
WRL, WRH
WrCSx
t
5
t
16
t
17
t
6
t
39
t
41
t
26
t
28
t
18
t
21
t
15
t
47
t
13
t
49
t
22
t
24
t
13
t
49
t
9
t
43
t
43
t
9
t
50
t
51
t
55
t
68
t
57
BUS
(D15-D8)
D7-D0
BUS
(D15-D8)
D7-D0
11Aug98@14:48h Intermediate Version
Semiconductor Group 55 1998-08
C163-L
AC Characteristics
CLKOUT and READY (Standard Supply Voltage Range)
(Operating Conditions apply,
CL = 100 pF)
1) These timings are given for test purposes only, in order to assure recognition at a specific clock edge.
2) Demultiplexed bus is the worst case. For multiplexed bus 2TCL are to be added to the maximum values. This
adds even m ore time for de ac tivat ing READY.
The 2tA and tC refer to the nex t following bus cy cl e, tF refers to the current bus cycle.
Parameter Symbol Max. CPU Clock
= 25 MHz Variable CPU Clock
1 / 2TCL = 1 to 25 MHz Unit
min. max. min. max.
CLKOUT cycle time t29 CC 40 40 2TCL 2TCL ns
CLKOUT high time t30 CC 14 TCL – 6 ns
CLKOUT low time t31 CC 10 TCL – 10 ns
CLKOUT rise time t32 CC4–4ns
CLKOUT fall time t33 CC4–4ns
CLKOUT rising edge to
ALE falling edge t34 CC 0 + tA10 + tA0 + tA10 + tAns
Synchronous READY
setup time to CLKOUT t35 SR 14 14 ns
Synchronous READY
hold time after CLKOUT t36 SR44–ns
Asynchronous READY
low time t37 SR 54 2TCL + 14 ns
Asynchronous READY
setup time 1) t58 SR 14 14 ns
Asynchronous READY
hold time 1) t59 SR 44–ns
Async. READY hold time
after RD, WR high
(Demultiplexed Bus) 2)
t60 SR 00
+ 2tA + tC
+ tF 2)
0TCL - 20
+ 2tA + tC + tF
2)
ns
11Aug98@14:48h Intermediate Version
Semiconductor Group 56 1998-08
C163-L
AC Characteristics
CLKOUT and READY (Reduced Supply Voltage Range)
(Operating Conditions apply,
CL = 100 pF)
1) These timings are given for test purposes only, in order to assure recognition at a specific clock edge.
2) Demultiplexed bus is the worst case. For multiplexed bus 2TCL are to be added to the maximum values. This
adds even m ore time for de ac tivat ing READY.
The 2tA and tC refer to the nex t following bus cy cl e, tF refers to the current bus cycle.
Parameter Symbol Max. CPU Clock
= 12 MHz Variable CPU Clock
1 / 2TCL = 1 to 12 MHz Unit
min. max. min. max.
CLKOUT cycle time t29 CC 83 83 2TCL 2TCL ns
CLKOUT high time t30 CC 22 TCL – 20 ns
CLKOUT low time t31 CC 26 TCL – 16 ns
CLKOUT rise time t32 CC 16 16 ns
CLKOUT fall time t33 CC 10 10 ns
CLKOUT rising edge to
ALE falling edge t34 CC -6 + tA6 + tA-6 + tA6 + tAns
Synchronous READY
setup time to CLKOUT t35 SR 20 20 ns
Synchronous READY
hold time after CLKOUT t36 SR00–ns
Asynchronous READY
low time t37 SR 103 2TCL + 20 ns
Asynchronous READY
setup time 1) t58 SR 20 20 ns
Asynchronous READY
hold time 1) t59 SR 00–ns
Async. READY hold time
after RD, WR high
(Demultiplexed Bus) 2)
t60 SR 016
+ 2tA + tC
+ tF 2)
0TCL - 26
+ 2tA + tC + tF
2)
ns
11Aug98@14:48h Intermediate Version
Semiconductor Group 57 1998-08
C163-L
Figure 15
CLKOUT and READY
Notes
1) Cycle as programmed, including MCTC waitstates (Example shows 0 MCTC WS).
2) The leadin g edge of the respec t iv e co mmand depends on RW-delay.
3) READY sampled HIGH at th is sampling po int generates a READ Y controlled wa itst at e,
READY sampled LOW at thi s sam pling point ter mi nat es th e cu rrently running bus cycle.
4) READY may be deactivated in response to the trailing (rising) edge of the corresponding command (RD or
WR).
5) If the Asynchronous READY signal does not fulfill the indicated setup and hold times with respect to CLKOUT
(eg. because CLKOUT is not enabled), it must fulfill
t
37 in order to be safely synchronized. This is guaranteed,
if READY is removed in reponse to the co mm and (see No te 4)).
6) Multiplexe d bus modes hav e a MUX wai tstate added aft er a b us cyc le, and an addit ional MTTC waits tate may
be inserted here.
For a multiplexed bus with MTTC waitstate this delay is 2 CLKOUT cycles, for a demultiplexed bus without
MTTC waitstate this delay is zero.
7) The next external bus cycle may start here.
CLKOUT
ALE
t
30
t
34
Sync
READY
t
35
t
36
t
35
t
36
Async
READY
t
58
t
59
t
58
t
59
waitstate
READY MUX/Tristate 6)
t
32
t
33
t
29
Running cycle 1)
t
31
t
37
3) 3)
5)
Command
RD, WR
t
604)
see 6)
2)
7)
3) 3)
11Aug98@14:48h Intermediate Version
Semiconductor Group 58 1998-08
C163-L
AC Characteristics
External Bus Arbitration (Standard Supply Voltage Range)
(Operating Conditions apply,
CL = 100 pF)
AC Characteristics
External Bus Arbitration (Reduced Supply Voltage Range)
(Operating Conditions apply,
CL = 100 pF)
Parameter Symbol Max. CPU Clock
= 25 MHz Variable CPU Clock
1 / 2TCL = 1 to 25 MHz Unit
min. max. min. max.
HOLD input setup time
to CLKOUT t61 SR 20 –20 ns
CLKOUT to HLDA high
or BREQ low delay t62 CC 20 20 ns
CLKOUT to HLDA low
or BREQ high delay t63 CC 20 20 ns
CSx release t64 CC 20 20 ns
CSx drive t65 CC -4 24 -4 24 ns
Other signals release t66 CC 20 20 ns
Other signals driv e t67 CC -4 24 -4 24 ns
Parameter Symbol Max. CPU Clock
= 12 MHz Variable CPU Clock
1 / 2TCL = 1 to 12 MHz Unit
min. max. min. max.
HOLD input setup time
to CLKOUT t61 SR 34 34 ns
CLKOUT to HLDA high
or BREQ low delay t62 CC 24 24 ns
CLKOUT to HLDA low
or BREQ high delay t63 CC 24 24 ns
CSx release t64 CC 20 20 ns
CSx drive t65 CC -6 30 -6 30 ns
Other signals release t66 CC 20 20 ns
Other signals driv e t67 CC -6 30 -6 30 ns
11Aug98@14:48h Intermediate Version
Semiconductor Group 59 1998-08
C163-L
Figure 16
External Bus Arbitration, Releasing the Bus
Notes
1) The C163-L will compl et e th e cu rrently running bus cyc le before grant ing bus access.
2) This is the first possibility for BREQ to get active.
3) The CS outputs will be res is tive high (pullup ) after
t
64.
CLKOUT
HOLD
t
61
HLDA
t
63
Other
Signals
t
66
1)
CSx
(On P6.x)
t
64
1)
2)
BREQ
t
62
3)
11Aug98@14:48h Intermediate Version
Semiconductor Group 60 1998-08
C163-L
Figure 17
External Bus Arbitration, (Regaining the Bus)
Notes
1) This is the last c hance for BREQ t o tri gger the indicated regain-sequence.
Even if BRE Q is activ at ed earlier, the re gain-sequenc e is init iat ed by HOLD going high.
Please no te tha t HOLD may also be deac t iv at ed w it hout the C163-L requesting the bus .
2) The next C163-L driven bus c ycle may start here.
CLKOUT
HOLD
HLDA
Other
Signals
t
62
CSx
(On P6.x)
t
67
t
62
1)
2)
t
65
t
61
BREQ
t
63
t
62
11Aug98@14:48h Intermediate Version
Semiconductor Group 61 1998-08
C163-L
AC Characteristics
Synchronous Serial Port Timing (Standard Supply Voltage Range)
(Operating Conditions apply,
CL = 100 pF)
Parameter Symbol Max. Baudrate
= 12.5 / 10 MBd Variable Baudrate
= 0.5 to 12.5 MBd Unit
min. max. min. max.
SSP clock cycle time t200 CC 80 / 100 80 / 100 4 TC L 512 TCL ns
SSP clock high time t201 CC 30 / 40 –/ t200/2 - 10 ns
SSP clock low time t202 CC 30 / 40 / – t200/2 - 10 ns
SSP clock rise time t203 CC / – 6 / 6 6 ns
SSP clock fall time t204 CC / – 6 / 6 6 ns
CE active before shift edge t205 CC 30 / 40 / – t200/2 - 10 ns
CE inactive after latch edge t206 CC 70 / 90 90 / 110 t200 - 10 t200 + 10 ns
Write data valid after shift edge t207 CC / – 10 / 10 10 ns
Write data hold after shift edge t208 CC 0 / 0 / – 0 ns
Write data hold after latch edge t209 CC 34 / 44 46 / 56 t200/2 - 6 t200/2 + 6 ns
Read data active after latch edge t210 SR 50 / 60 / – t200/2 + 10 ns
Read data setup time before latch
edge t211 SR 20 / 20 / – 20 ns
Read data hold time after latch
edge t212 SR 0 / 0 / – 0 ns
11Aug98@14:48h Intermediate Version
Semiconductor Group 62 1998-08
C163-L
AC Characteristics
Synchronous Serial Port Timing (Reduced Supply Voltage R ange)
(Operating Conditions apply,
CL = 100 pF)
Parameter Symbol Max. Baudrate
= 6 MBd Variable Baudrate
= 0.5 to 6 MBd Unit
min. max. min. max.
SSP clock cycle time t200 CC 167 167 4 TCL 512 TCL ns
SSP clock high time t201 CC 63 t200/2 - 20 ns
SSP clock low time t202 CC 73 t200/2 - 10 ns
SSP clock rise time t203 CC 14 14 ns
SSP clock fall time t204 CC 10 10 ns
CE active before shift edge t205 CC 73 / – t200/2 - 10 ns
CE inactive after latch edge t206 CC 147 187 t200 - 20 t200 + 20 ns
Write data valid after shift edge t207 CC / – 20 20 ns
Write data hold after shift edge t208 CC -6 -6 ns
Write data hold after latch edge t209 CC 63 103 t200/2 - 20 t200/2 + 20 ns
Read data active after latch edge t210 SR 93 t200/2 + 10 ns
Read data setup time before latch
edge t211 SR 30 30 ns
Read data hold time after latch
edge t212 SR 0–0–ns
11Aug98@14:48h Intermediate Version
Semiconductor Group 63 1998-08
C163-L
Figure 18
SSP Write Timing
Figure 19
SSP Read Timing
Notes
1) The trans ition of shift and latch edge of SSPCLK is programma ble. This figure uses the fa lling edge as s hift
edge (draw n bold).
2) The bit timing is repeated for all bits to be transm it te d or rec eived.
3) The active lev el of th e c hip enable lines is programmable. This figur e us es an ac t ive low CE (draw n bold).
At the end of a transmission or reception the CE signal is disabled in single transfer mode. In continuous
transfer mode it remains ac t ive .
t
204
t
203
SSPCLK
SSPCEx
SSPDAT
t
205
t
207
t
207
t
207
t
208
t
209
t
206
1st Bit Last Bit2nd Bit
t
200
t
201
t
202
1)
3)
2)
t
211
SSPCLK
SSPCEx
SSPDAT
t
209
t
206
last Wr. Bit Lst.In Bit
1)
3)
2)
t
212
1st.In Bit
t
210
11Aug98@14:48h Intermediate Version
Semiconductor Group 64 1998-08
C163-L
Package Outlines
Figure 20
Sorts of Packing
Package outlines for tubes, trays, etc. are contained in our
Data Book “Package Information”
SMD = Surface Mounted Device Dimensions in mm
Plastic Package, P-TQFP-100-3 (SMD)
(Plastic Thin Metric Quad Flat Package)
11Aug98@14:48h Intermediate Version
Semiconductor Group 65 1998-08
C163-L
11Aug98@14:48h Intermediate Version
Semiconductor Group 66 1998-08
C163-L
Siemens Aktiengesellschaft
Published b
y