TLP721(D4)SERIES
2002-09-25
1
TOSHIBA Photocoupler
TLP721(D4)SERIES
Attachment: Specifications for VDE0884 option: (D4)
Types: TLP721, TLP721F
Type designations for ‘ option: (D4) ’, which are tested under VDE0884 requirements.
Ex.: TLP721 (D4-GR-LF4) D4: VDE0884 option
GR: CTR rank
LF4: lead bend
Note: Use TOSHIBA standard type number for safety standard application.
Ex. TLP721 (D4-GR-LF4) TLP721
VDE0884 Isolation Characteristics
Description Symbol Rating Unit
Application classification
(DIN VDE0110 teil 1 / 01.89, table 1)
for rated mains voltage 300 Vrms
for rated mains voltage 600 Vrms
I-IV
I-III
Climatic classification
(DIN IEC68 teil 1 / 09.80) 40 / 100 / 21
Pollution degree (DIN VDE0110 teil 1 / 01.89) 2
TLP721 630
Maximum operating insulation voltage
TLP721F
VIORM
890
Vpk
TLP721 945
Input to output test voltage, method A
Vpr = 1.5×VIORM, type and sample test
t
p = 60s, partial discharge < 5pC TLP721F
Vpr
1335
Vpk
TLP721 1180
Input to output test voltage, method B
Vpr = 1.875×VIORM, 100% production test
t
p = 1s, partial discharge < 5pC TLP721F
Vpr
1670
Vpk
Highest permissible overvoltage
(transient overvoltage, tpr = 10s) VTR 6000 Vpk
Safety limiting values (max. permissible ratings in case of
fault, also refer to thermal derating curve)
current (input current IF, Psi = 0)
power (output or total power dissipation)
temperature
Isi
Psi
Tsi
300
500
150
mA
mW
°C
Insulation resistance, VIO = 500V, Ta = 25°C
V
IO = 500V, Ta = Tsi Rsi 1012
109
· This data sheet refers to TLP721 (D4, M), TLP721F (D4, M) that previously has a white-resin mold and
have been changed. When designing new products please use black mold-resin devices.
TLP721(D4)SERIES
2002-09-25
2
Insul ation Related Specifications
7.62 mm pitch
TLP721
10.16 mm pitch
TLP721F
Minimum creepage distance (*) Cr 7.0 mm 8.0 mm
Minimum clearance (*) Cl 7.0 mm 8.0 mm
Minimum insulation thickness ti 0.5 mm
Comperative tracking index
(DIN IEC112 / VDE0303, part 1) CTI 175
(VDE0110 teil 1 / 01.89 group III a)
((*) in accordance with DIN VDE0110 teil 1 / 01.89, table 2, & 4)
(*1) If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value
(e. g. at a standard distance between soldering eye centres of 7.5 mm). If this is not permissible, the user
shall take suitable measures.
(*2) This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
VDE Test sign: Marking on product for VDE0884
Marking on packing for VDE0884
Marking example:
or
Lot no.
PType name
CTR or IFT rank marking
Mark for option (D4)
1pin indication
0884
V
D E
4
TLP721(D4)SERIES
2002-09-25
3
Figure 1 Partial discharge measurement procedure according to VDE0884
destructive test for qualification and sampling tests.
Method A
(for type and sampling tests,destructive tests)
t1,t2 =1 to 10s
t3,t4 =1s
tP(measuring time for
partial discharge) =50s
tb =62s
tini =10s
Figure 2 Partial discharge measurement procedure according to VDE0884
non-destructive test for 100% inspection.
Method B
(for sample test,non-destructive test)
t3,t4 =0.1s
tP(measuring time for
partial discharge) =1s
tb =1.2s
Figure 3 Dependency of maximum safety ratings on ambient temperature
t
t4 tP t3
tb t2 tini
t1
0
V
VINITIAL (6kV)
Vpr (1335V for TLPxxxF)
(945V for TLPxxx)
VIORM
(890V for TLPxxxF)
(630V for TLPxxx)
t
t4
tP
tb
t3
V
Vpr (1670V for TLPxxxF)
(1180V for TLPxxx)
VIORM
(890V for TLPxxxF)
(630V for TLPxxx)
1000
0
200
400
600
800
Psi
(mW)
500
0
100
200
300
400
Isi
(mA)
0 25 50 75 100 125 150
Ta (°C)
175
Psi
I
si
TLP721(D4)SERIES
2002-09-25
4
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
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(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
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document shall be made at the customer’s own risk.
· Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes
are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the
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rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
000707EBC
RESTRICTIONS O N PRODUCT USE