LM5020EVAL/NOPB - NATIONAL SEMICONDUCTOR

LM4570

LM4570 Single-Ended Input Motor Driver

Literature Number: SNOSAV2B

LM4570

July 28, 2009

Single-Ended Input Motor Driver

General Description

The LM4570 is a single supply motor driver for improved sen-

sory experience in mobile phones and other handheld de-

vices. The LM4570 is capable of driving up to 192mA while

operating from a 3V supply. Near rail-to-rail output swing un-

der load ensures sufficient voltage drive for most DC motors,

while the differential output drive allows the voltage polarity

across the motor to be reversed quickly. Reversing the volt-

age gives the LM4570 the ability to drive a motor both clock-

wise and counter clock-wise from a single supply.

The LM4570 features fast turn on time, and a wide input volt-

age range for precise speed control. A low power shutdown

mode minimizes power consumption.

Thermal and output short circuit protection prevents the de-

vice from being damaged during fault conditions.

Key Specifications

■ High Output Current @ VDD = 3V 192mA

■ Fast Turn On Time @ 3V 2.4ms

■ Quiescent Power Supply Current

@ 3V 1.9mA

■ Shutdown Current 0.1µA (typ)

Features

■Output Short Circuit Protection

■High Output Current Capability

■Wide Output Voltage Range

■Fast Turn on Time

■Output Short Circuit Protection

■Low Power Shutdown Mode

■Minimum external components

■Available in space-saving LLP package

Applications

■Mobile Phones

■PDAs

■Video Game Systems

Typical Application

20186326

FIGURE 1. Typical Motor Driver Application Circuit

LM4570 Single-Ended Input Motor Driver

Connection Diagrams

Leadless Leadframe Package (LLP)

LQ Package

20186325

Top View

Order Number LM4570LQ

See NS Package Number LQB08A

LLP Marking

20186327

Top View

X - One digit date code

TT - Lot traceability

G - Boomer Family

C8 - LM4570LQ

Ordering Information

Order Number Package Package DWG # Transport Media MSL Level Green Status

LM4570LQ 8–Pin LLP LQB08A 1000 units on tape and reel 1 RoHS & no Sb/Br

LM4570LQX 8–Pin LLP LQB08A 4500 units on tape and reel 1 RoHS & no Sb/Br

www.national.com 2

LM4570

Absolute Maximum Ratings (Note 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage (Note 1) 6.0V

Storage Temperature −65°C to +150°C

Voltage at Any Input Pin −0.3V ≥ to VDD +0.3V

Power Dissipation (Note 3) Internally Limited

ESD Susceptibility (Note 4) 2000V

ESD Susceptibility (Note 5) 200V

Junction Temperature (TJMAX)150°C

Thermal Resistance

θJA (LLP) 140°C/W

Operating Ratings

Temperature Range

TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ 85°C

Supply Voltage 2.4V ≤ VDD ≤ 5.5V

Electrical Characteristics VDD = 5V (Notes 1, 2)

The following specifications apply for VDD = 5V, AV-BTL = 6dB unless otherwise specified. Limits apply for TA = 25°C.

Symbol Parameter Conditions

LM4570 Units

(Limits)

Typical Limit

(Note 6) (Notes 7, 8)

IDD Quiescent Power Supply Current VIN = 0V, IL = 0A, No Load 2.5 5.5 mA (max)

VIN = 0V, IL = 0A, RL = 30Ω 2.6 5.5 mA (max)

ISD Shutdown Current VSD = GND 0.1 1.5 µA (max)

VIH Logic Input High 1.4 V (min)

VIL Logic Input Low 0.4 V (max)

VOS Output Offset Voltage 5 ±35 mV (max)

IOUT Output Current VOH, VOL ≤ 250mV 268 mA

TWU Wake-up time 2.5 ms (max)

VOH Output High Voltage RL = 30Ω specified as

|VDD - VOH|146 200 mV (max)

VOL Output Low Voltage RL = 30Ω specified as

|GND + VOH|106 200 mV (max)

Electrical Characteristics VDD = 3V (Notes 1, 2)

The following specifications apply for VDD = 3V, AV-BTL = 6dB unless otherwise specified. Limits apply for TA = 25°C.

Symbol Parameter Conditions

LM4570 Units

(Limits)

Typical Limit

(Note 6) (Notes 7, 8)

IDD Quiescent Power Supply Current VIN = 0V, IL = 0A, No Load 1.9 4 mA (max)

VIN = 0V, IL = 0A, RL = 30Ω 1.95 4

ISD Shutdown Current VSD = GND 0.1 1.0 µA (max)

VIH Logic Input High 1.4 V (min)

VIL Logic Input Low 0.4 V (max)

VOS Output Offset Voltage 5 ±35 mV (max)

IOUT Output Current VOH, VOL ≤ 200mV 192 mA

TWU Wake-up time 2.4 ms (max)

VOH Output High Voltage RL = 30Ω specified as

|VDD - VOH|90 110 mV (max)

VOL Output Low Voltage RL = 30Ω specified as

|VDD - VOH|63 110 mV (max)

3 www.national.com

LM4570

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions

which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters

where no limit is given; however, the typical value is a good indication of device performance.

Note 3: The maximum power dissipation must be de-rated at elevated temperatures and is dictated by TJMAX, θJC, and the ambient temperature TA. The maximum

allowable power dissipation is PDMAX = (TJMAX –TA)/ θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4570, TJMAX = 150°

C and the typical θJA for the LLP package is 140°C/W.

Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.

Note 5: Machine Model, 220pF–240pF discharged through all pins.

Note 6: Typicals are measured at 25°C and represent the parametric norm.

Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).

Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.

Note 9: Shutdown current is measured in a normal room environment. Exposure to direct sunlight will increase ISD by a maximum of 2μA.

www.national.com 4

LM4570

Typical Performance Characteristics

Output Low Voltage vs Load Current

VDD = 3V

20186313

Output Low Voltage vs Load Current

VDD = 5V

20186312

Output High Voltage vs Load Current

VDD = 3V

20186311

Output High Voltage vs Load Current

VDD = 5V

20186310

Output Voltage vs Input Voltage

VDD = 3V, RL = 20Ω

20186314

Output Voltage vs Input Voltage

VDD = 3V, RL = 30Ω

20186315

5 www.national.com

LM4570

Output Voltage vs Input Voltage

VDD = 5V, RL = 20Ω

20186316

Output Voltage vs Input Voltage

VDD = 5V, RL = 30Ω

20186317

Power Dissipation vs Supply Voltage

20186320

Supply Current vs Supply Voltage

20186321

Slew Rate vs Supply Voltage

RL = 30Ω

20186319

Shutdown Supply Current vs Supply Voltage

20186323

www.national.com 6

LM4570

Output Transition High to Low, Low to High

VDD = 3V, 1V/div, 400ns/div

20186306

Output Transition High to Low, Low to High

VDD = 5V, 1V/div, 1μs/div

20186307

Turn-Off Time

VDD = 5V, 2V/div, 1ms/div

20186308

Turn-On Time

VDD = 5V, 2V/div, 1ms/div

20186309

7 www.national.com

LM4570

Application Information

BRIDGE CONFIGURATION EXPLANATION

The LM4570 uses a bridged architecture that drives a load

differentially. The BTL design offers several advantages over

a single-ended design. The device outputs, VO1 and VO2,

both source and sink current, which means that the polarity

of the voltage across the motor can be reversed quickly (Fig-

ure 2). A single-ended device would need to operate from split

supplies to achieve this behavior. The ability to reverse the

voltage polarity is necessary in applications where a negative

(reverse polarity) pulse is used to quickly stop the motor. If

the drive voltage is just removed from the motor (not reversed)

then the motor will continue to spin until the residual energy

stored in the windings has dissipated.

The output voltage of the LM4570 is determined by the dif-

ference between the input voltage and VREF1 , as well as the

differential gain of the device. The output voltage is given by

the following:

VO1–VO2 = AVD(VIN–VREF1)

For input voltages that are less than the reference voltage,

the differential output voltage is negative. For input voltages

that are greater than the reference voltage, the differential

output voltage is positive. For example, when operating from

a 5V supply (VREF1 = 2.5V) and with a differential gain of 6dB,

with a 1V input, the voltage measured across VO1 and VO2 is

-3V, with a 4V input, the differential output voltage is +3V.

20186302

FIGURE 2. Voltage Polarity and Motor Direction

www.national.com 8

LM4570

GAIN SETTING

The resistors RIN and RF set the gain of the LM4570, given by:

VVD = 2 x (RF / RIN)

Where AVD is the differential gain. AVD differs from single-

ended gain by a factor of 2. This doubling is due to the

differential output architecture of the LM4570. Driving the load

differentially doubles the output voltage compared to a single-

ended output amplifier under the same conditions.

POWER DISSIPATION

The Power Dissipation vs. Supply Voltage graph in the Op-

erating Curves section shows the power dissipation of the

LM4570 with the input equal to the supply voltage, meaning

the outputs swing rail-to-rail. This configuration results in the

output devices of the LM4570 operating in the linear region,

essentially very small resistors determined by the RDS(ON) of

the output devices. Under these conditions, the power dissi-

pation is dominated by the I*R drop associated with the output

current across the RDS(ON) of the output transistors, thus the

power dissipation is very low (60mW for a 800mW output).

When the input voltage is not equal to GND or VDD, the power

dissipation of the LM4570 increases (Figure 3). Under these

conditions, the output devices operate in the saturation re-

gion, where the devices consume current in addition to the

current being steered to the load, increasing the power dissi-

pation. Power dissipation for typical motor driving applications

should not be an issue since the most of the time the device

outputs will be driven rail-to-rail.

20186328

FIGURE 3. Power Dissipation vs. Input Voltage

EXPOSED-DAP MOUNTING CONSIDERATIONS

The LM4570 is available in an 8-pin LLP package which fea-

tures an exposed DAP (die attach paddle). The exposed DAP

provides a direct thermal conduction path between the die

and the PCB, improving the thermal performance by reducing

the thermal resistance of the package. Connect the exposed

DAP to GND through a large pad beneath the device, and

multiple vias to a large unbroken GND plane. For best thermal

performance, connect the DAP pad to a GND plane on an

outside layer of the PCB. Connecting the DAP to a plane on

an inner layer will result in a higher thermal resistance. Ensure

efficient thermal conductivity by plugging and tenting the vias

with plating and solder mask, respectively.

POWER SUPPLY BYPASSING

Good power supply bypassing is critical for proper operation.

Locate both the REF1 and VDD bypass capacitors as close to

the device as possible. Typical applications employ a regula-

tor with a 10µF tantalum or electrolytic capacitor and a ce-

ramic bypass capacitor which aid in supply stability. This does

not eliminate the need for bypass capacitors near the

LM4570. Place a 1µF ceramic capacitor as close to VDD as

possible. Place a 0.1µF capacitor as close to REF1 as pos-

sible. Smaller values of CREF1 may be chosen for decreased

turn on times.

SHUTDOWN FUNCTION

The LM4570 features a low power shutdown mode that dis-

ables the device and reduces quiescent current consumption

to 0.1µA. Driving /SD Low disables the amplifiers and bias

circuitry, and drives VREF1and the outputs to GND. Connect /

SD to VDD for normal operation.

9 www.national.com

LM4570

DEMO BOARD LAYOUT

20186324

www.national.com 10

LM4570

Revision History

Rev Date Description

1.0 04/13/06 Initial release.

1.01 07/28/09 Added the Ordering Information table.

11 www.national.com

LM4570

Physical Dimensions inches (millimeters) unless otherwise noted

LLP Package

Order Number LM4570LQ

NS Package Number LQB08A

www.national.com 12

LM4570

Notes

13 www.national.com

LM4570

Notes

LM4570 Single-Ended Input Motor Driver

For more National Semiconductor product information and proven design tools, visit the following Web sites at:

Products Design Support

Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench

Audio www.national.com/audio App Notes www.national.com/appnotes

Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns

Data Converters www.national.com/adc Samples www.national.com/samples

Interface www.national.com/interface Eval Boards www.national.com/evalboards

LVDS www.national.com/lvds Packaging www.national.com/packaging

Power Management www.national.com/power Green Compliance www.national.com/quality/green

Switching Regulators www.national.com/switchers Distributors www.national.com/contacts

LDOs www.national.com/ldo Quality and Reliability www.national.com/quality

LED Lighting www.national.com/led Feedback/Support www.national.com/feedback

Voltage Reference www.national.com/vref Design Made Easy www.national.com/easy

PowerWise® Solutions www.national.com/powerwise Solutions www.national.com/solutions

Serial Digital Interface (SDI) www.national.com/sdi Mil/Aero www.national.com/milaero

Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic

Wireless (PLL/VCO) www.national.com/wireless PowerWise® Design

University

www.national.com/training

THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION

(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY

OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO

SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,

IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS

DOCUMENT.

TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT

NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL

PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR

APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND

APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE

NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.

EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO

LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE

AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY

RIGHT.

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and

whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected

to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform

can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.

National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other

brand or product names may be trademarks or registered trademarks of their respective holders.

For the most current product information visit us at www.national.com

National Semiconductor

Americas Technical

Support Center

Email: support@nsc.com

Tel: 1-800-272-9959

National Semiconductor Europe

Technical Support Center

Email: europe.support@nsc.com

National Semiconductor Asia

Pacific Technical Support Center

Email: ap.support@nsc.com

National Semiconductor Japan

Technical Support Center

Email: jpn.feedback@nsc.com

www.national.com

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265