05/2009
AWT6309
HELP2TM AWS/KPCS CDMA 3.4V/28dBm
Linear Power Amplier Module
Data Sheet - Rev 2.4
M9 Package
8 Pin 3 mm x 3 mm x 1 mm
Surface Mount Module
Figure 1: Block Diagram
FEATURES
• InGaP HBT Technology
• High Efciency:
40 % @ +28 dBm output
22 % @ +17 dBm output
• Low Quiescent Current: 15 mA
• Low Leakage Current in Shutdown Mode: <1 µA
• Internal Voltage Regulation
• Optimized for a 50 Ω System
• Low Prole Miniature Surface Mount Package:
1 mm
• CDMA 1XRTT, 1xEV-DO Compliant
• Pinout Enables Easy Phone Board Migration
From 4 mm x 4 mm Package
• RoHS-Compliant Package, 250 oC MSL-3
APPLICATIONS
• CDMA/EVDO AWS/KPCS band Wireless
Handsets and Data Devices
PRODUCT DESCRIPTION
The AWT6309 meets the increasing demands for
higher efficiency and smaller footprint in CDMA
1X handsets. The package pinout was chosen to
enable handset manufacturers to switch from a
4 mm x 4 mm PA module with few layout changes
while reducing board area requirements by 44%. The
AWT6309 uses ANADIGICS’ exclusive InGaP-Plus™
technology, which combines HBT and pHEMT devices
on the same die, to enable state-of-the-art reliability,
temperature stability, and ruggedness. The AWT6309
is part of ANADIGICS’ High-Efciency-at-Low-Power
(HELP™) family of CDMA power ampliers, which
deliver low quiescent currents and significantly
greater efciency without a costly external DAC or
DC-DC converter. Through selectable bias modes, the
AWT6309 achieves optimal efciency across different
output power levels, specically at low- and mid-
range power levels where the PA typically operates,
thereby dramatically increasing handset talk-time and
standby-time. Its built-in voltage regulator eliminates
the need for external voltage regulation components.
The 3 mm x 3 mm x 1 mm surface mount package
incorporates matching networks optimized for output
power, efciency, and linearity in a 50 Ω system.
2Data Sheet - Rev 2.4
05/2009
AWT6309
Figure 2: Pinout (X-ray Top View)
Table 1: Pin Description
PIN NAME DESCRIPTION
1 V
BATT
Battery Voltage
2RF
IN
RF Input
3 V
MODE
Mode Control Voltage
4 V
EN
PA Enable Voltage
5GND Ground
6GND Ground
7RF
OUT
RF Output
8 V
CC
Supply Voltage
Data Sheet - Rev 2.4
05/2009
AWT6309
3
ELECTRICAL CHARACTERISTICS
Table 2: Absolute Minimum and Maximum Ratings
Stresses in excess of the absolute ratings may cause permanent damage.
Functional operation is not implied under these conditions. Exposure
to absolute ratings for extended periods of time may adversely affect
reliability.
Table 3: Operating Ranges
The device may be operated safely over these conditions; however, parametric performance is guaranteed only
over the conditions dened in the electrical specications.
Notes:
(1) For operation at Vc c = +3.2 V, Po u t is derated by 0.5 dB.
PARAMETER MIN MAX UNIT
Supply Voltage (V
CC
and V
BATT
)0+5 V
Mode Control Voltage (V
MODE
)0+3.5 V
Enable Voltage (V
EN
)0+3.5 V
RF Input Power (P
IN
)-+10 dBm
Storage Temperature (T
STG
)-40 +150 °C
PARAMETER MIN TYP MAX UNIT COMMENTS
Operating Frequency (f) 1710 -1780 MHz
Supply Voltage (V
CC
and V
BATT
)+3.2 +3.4 +4.2 V
Enable Voltage (V
EN
)+2.2
0
+2.4
-
+3.1
+0.5 VPA "on"
PA "shut down"
Mode Control Voltage (V
MODE
)+2.2
0
+2.4
-
+3.1
+0.5 VLow Bias Mode
High Bias Mode
RF Output Power (P
OUT
)27.5
(1)
+28.0 -dBm
Case Temperature (T
C
)-30 -+85 °C
4Data Sheet - Rev 2.4
05/2009
AWT6309
Table 4: Electrical Specications - CDMA Operation
(TC = +25 OC, VBATT = VCC = +3.4 V, VEN = +2.4 V, 50 V system, IS-95 uplink waveform)
Notes:
1. ACPRs and Efciency Limits apply at 1745 MHz (IS-95 modulation).
PARAMETER MIN TYP MAX UNIT COMMENTS
Gain
25
12.5
12.5
27.5
14.5
14.5
30
17
17
dB
P
OUT
= +28 dBm, V
MODE
= 0 V
P
OUT
= +17 dBm, V
MODE
= +2.4 V
P
OUT
= +18 dBm, V
MODE
= +2.4 V,
V
CC
= +3.7 V
Adjacent Channel Power
at +1.25 MHz offset
Primary Channel BW = 1.23 MHz
Adjacent Channel BW = 30 kHz
-
-
-
-50
-53
-52
-46.5
-46.5
-46.5
dBc
P
OUT
= +28 dBm, V
MODE
= 0 V
P
OUT
= +17 dBm, V
MODE
= +2.4 V
P
OUT
= +18 dBm, V
MODE
= +2.4 V,
V
CC
= +3.7 V
Adjacent Channel Power
at + 1.98 MHz offset
Primary Channel BW = 1.23 MHz
Adjacent Channel BW = 30 kHz
-
-
-56
-56
-53
-53 dBc P
OUT
= +28 dBm, V
MODE
= 0 V
P
OUT
= +17 dBm, V
MODE
= +2.4 V
Adjacent Channel Power
at +2.25 MHz offset
Primary Channel BW = 1.23 MHz
Adjacent Channel BW = 30 kHz
-
-
-61
-61
-57
-57 dBc P
OUT
= +28 dBm, V
MODE
= 0 V
P
OUT
= +17 dBm, V
MODE
= +2.4 V
Power-Added Efficiency 36
17
40
22
-
-%P
OUT
= +28 dBm, V
MODE
= 0 V
P
OUT
= +17 dBm, V
MODE
= +2.4 V
Quiescent Current (Icq) -15 18 mA through V
CC
pin, V
MODE
= +2.4 V
Enable Current -0.3 0.6 mA through V
EN
pin, PA "on"
Mode Control Current -0.3 0.6 mA through V
MODE
pin, V
MODE
= +2.4 V
Battery Current -2.5 5mA through V
BATT
pin, V
MODE
= +2.4 V
Leakage Current -<1 5µA V
CC
= +4.2 V, V
EN
= 0 V,
V
MODE
= 0 V
Noise in Receive Band
-
-
-
-134
-136
-136
-132
-134
-134
dBm/Hz
1840 MHz to 1870 MHz
2110 MHz to 2155 MHz
1574 MHz to 1577 MHz
Harmonics
2fo
3fo, 4fo
-
-
-40
-55
-30
-30 dBc
Input Impedance - - 2.3:1 VSWR
Spurious Output Level
(all spurious outputs) - - -65 dBc
P
OUT
< +28 dBm
In-band load VSWR < 5:1
Out-of-band load VSWR < 10:1
Applies over all operating ranges
Load mismatch stress with no
permanent degradation or failure 8:1 - - VSWR Applies over full operating range
Data Sheet - Rev 2.4
05/2009
AWT6309
5
APPLICATION INFORMATION
To ensure proper performance, refer to all related
Application Notes on the ANADIGICS web site:
http://www.anadigics.com
Shutdown Mode
The power amplier may be placed in a shutdown
mode by applying logic low levels (see Operating
Ranges table) to both the VEN and VMODE voltages.
Table 5: Bias Control
Bias Modes
The power amplier may be placed in either a Low Bias
mode or a High Bias mode by applying the appropriate
logic level (see Operating Ranges table) to the VMODE
voltage. The Bias Control table lists the recommended
modes of operation for various applications.
Figure 3: Application Circuit
APPLICATION
P
OUT
LEVELS LOGIC V
EN
V
MODE
CDMA - low power <+17 dBm Low +2.4 V +2.4 V
CDMA - high power >+17 dBm High +2.4 V 0 V
Shutdown -Shutdown 0 V 0 V
6Data Sheet - Rev 2.4
05/2009
AWT6309
PACKAGE OUTLINE
Figure 4: M9 Package Outline - 8 Pin 3 mm x 3 mm x 1 mm Surface Mount Module
Figure 5: Branding Specication
091 091
CC = KR-for-KOREA
Data Sheet - Rev 2.4
05/2009
AWT6309
7
COMPONENT PACKAGING
Table 6: Tape & Reel Dimensions
Figure 6: Tape & Reel Packaging
PACKAGE TYPE TAPE WIDTH POCKET PITCH REEL CAPACITY MAX REEL DIA
3 mm x 3 mm x 1 mm 12 mm 4 mm 2500 7"
WARNING
ANADIGICS products are not intended for use in life support appliances, devices or systems. Use of an ANADIGICS product
in any such application without written consent is prohibited.
IMPORTANT NOTICE
ANADIGICS, Inc.
141 Mount Bethel Road
Warren, New Jersey 07059, U.S.A.
Tel: +1 (908) 668-5000
Fax: +1 (908) 668-5132
URL: http://www.anadigics.com
E-mail: Mktg@anadigics.com
ANADIGICS, Inc. reserves the right to make changes to its products or to discontinue any product at any time without notice.
The product specications contained in Advanced Product Information sheets and Preliminary Data Sheets are subject to
change prior to a product’s formal introduction. Information in Data Sheets have been carefully checked and are assumed
to be reliable; however, ANADIGICS assumes no responsibilities for inaccuracies. ANADIGICS strongly urges customers
to verify that the information they are using is current before placing orders.
Data Sheet - Rev 2.4
05/2009
8
AWT6309
ORDERING INFORMATION
ORDER NUMBER TEMPERATURE
RANGE
PACKAGE
DESCRIPTION COMPONENT PACKAGING
AWT6309RM9Q7 -30 °C to +85 °C
RoHS-Compliant 8 Pin
3 mm x 3 mm x 1 mm
Surface Mount Module
Tape and Reel, 2500 pieces per Reel
AWT6309RM9P9 -30 °C to +85 °C
RoHS-Compliant 8 Pin
3 mm x 3 mm x 1 mm
Surface Mount Module
Partial Tape and Reel