Description:
• Halogen free
• 125°C maximum total temperature operation
• 11.2 x 11.2 x 9.0mm maximum surface mount package
• Ferrite core material
• High current carrying capacity, low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 205nH to 950nH
• Current range from 11.5 to 69 amps
• Frequency range up to 2MHz
• RoHS compliant
High Current, High Frequency, Power Inductors
FLAT-PAC™ FP1109 Series
0611 BU-SB11642 Page 1 of 4 Data Sheet: 4350
SMD Device
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms,I
sat1
3I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4I
sat1: Peak current for approximately 30% rolloff at +25°C.
5I
sat2: Peak current for approximately 30% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K *L *ΔI *10-3,B
p-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1109-xxx-R
• FP1109 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then
third character = # of zeros
• “-R” suffix = RoHS compliant
Product Specifications
Part Number7OCL1± 20% (nH) FLL2Min. (nH) Irms3(Amps) Isat14@ 25°C (Amps) Isat25@ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
FP1109-R20-R 205 122 69 52 233
FP1109-R23-R 247 147 55 41 233
FP1109-R27-R 270 160 51 38 233
FP1109-R33-R 311 185 35 44 33 0.42 ±10% 233
FP1109-R47-R 463 275 27 20 233
FP1109-R58-R 548 325 22.5 17 233
FP1109-1R0-R 950 565 11.5 8.5 233
Applications:
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing
• Notebook regulators
Environmental Data:
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient plus self temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Packaging:
• Supplied in tape and reel packaging, 350 parts per reel,
13” diameter reel
Pb
HALOGEN
HF
FREE
Top View Side View Recommended Pad Layout Schematic
1
2
2.5 nom.
(2x)
1
wwllyy R
2
FP1109-xxx
3.0
(2X)
3.0
(2X)
11.4
11.2
max
11.2 max
9.0
max
4.10 ref
(2X)
2.03 ref
Front View
DDiimmeennssiioonnss -- mmmm
Section A-A
9.3
1.5 dia. +0.1/-0.0
1.5 dia. min
4.00
2.00
20.00
1.75
11.50
24.0 ±0.3
User direction of feed
11.4
11.4
1
2
16.4
17.5
2.0
FP1109-xxx
wwllyy R
0
10
20
30
40
50
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
Total Loss (W)
Temperature Rise (°C)
Part Marking: FP1109 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros wwllyy = Date code R = Revision level
Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel.
Packaging Information - mm
Temperature Rise vs.Total Loss
0611 BU-SB11642 Page 2 of 4 Data Sheet: 4350
0611 BU-SB11642 Page 3 of 4 Data Sheet: 4350
0.00001
0.0001
0.001
0.01
0.1
1
10
100
100 1000 10000
Core Loss (W)
Bp-p (Gauss)
Core Loss vs. Bp-p
1MHz
500kHz
300kHz
200kHz
100kHz
% o f OC L v s . % o f I
sat
1
0%
20%
40%
60%
80%
10 0 %
12 0 %
0% 20% 40% 60% 80% 100% 120%
% o f I 1
+125° C
- 4 0 ° C
+2 5 ° C
sat
% of OCL
Inductance Characteristics
Core Loss
0611 BU-SB11642 Page 4 of 4 Data Sheet: 4350
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
T
a
a
b
b
l
l
e
e
1
1
-
-
S
S
t
t
a
a
n
n
d
d
a
a
r
r
d
d
S
S
n
n
P
P
b
b
S
S
o
o
l
l
d
d
e
e
r
r
(
(
T
T
c
c
)
)
Volume Volume
Package mm3mm3
Thickness <350 >
_350
<2.5mm 235°C220°C
>
_2.5mm 220°C220°C
T
T
a
a
b
b
l
l
e
e
2
2
-
-
L
L
e
e
a
a
d
d
(
(
P
P
b
b
)
)
F
F
r
r
e
e
e
e
S
S
o
o
l
l
d
d
e
e
r
r
(
(
T
T
c
c
)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
A
verage ramp up rate Tsmaxto Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C217°C
Time at liquidous (tL)60-150 Seconds60-150 Seconds
Peak package body temperature (TP)*Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
A
verage ramp-down rate (Tpto Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
© 2011 Cooper Bussmann
www.cooperbussmann.com
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
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