GO2951-37CH - Gennum Corp. - Product.Network

GO2951

CWDM OPTICAL TRANSCEIVER MODULE (NON-MSA)

Datasheet name: GO2951-57365_doc1.pdf

Contact information: info@embrionix.com

www.embrionix.com

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GO2951 CWDM Optical Transceiver

Data Sheet

57365 - 1 April 2012

GO2951 CWDM Optical Transceiver

www.gennum.com

Features

• Best-in-class optical receiver sensitivity: -22dBm

(over all supported video rates with pathological data)

• Robust error free transmission of signals from 50Mbps

to 3Gbps

• Up to 50km reach in a 3Gbps CWDM installation

• Supports video pathological patterns for SD-SDI,

HD-SDI and 3G-SDI

• Hot-pluggable

•Laser disable pin

• User writeable EEPROM

• Digital diagnostics and control via I2C interface

including:

Monitoring of the laser bias current, average output

power, receive optical power, supply voltage and

temperature

Alarm reporting

Module ID polling

• Single +3.3V power supply

• RoHS compliant

• Operating temperature range: 0°C to 70°C

• 56.5mm x 13.4mm x 8.6mm SFP Package

• SMPTE 297-2006 compliant

Applications

• SMPTE 297-2006 compliant optical-to-electrical

interfaces

Description

The GO2951 is an optical transceiver module engineered

for exceptional performance in the presence of SDI

pathological patterns. The transceiver features

best-in-class optical receiver sensitivity for SMPTE 259M,

SMPTE 344M, SMPTE 292M and SMPTE 424M serial rates,

thus providing superior optical link budget and robustness.

The GO2951 contains a PIN photodiode receiver and a DFB

laser transmitter designed to provide error-free

transmission of signals from 50Mbps to 3Gbps over single

mode fiber (9/125). It is also hot-pluggable.

The GO2951 provides extensive operational status

monitoring through an I2C interface. Input optical power is

monitored in the receiver; output optical power and bias

current are monitored in the transmitter. Other operating

conditions, such as power supply and operating

temperature, are also monitored. If a monitored parameter

falls outside the pre-defined range, an alarm flag associated

with the parameter will be raised.

‘

Figure A: GO2951 Optical Transceiver Module

GO2951 CWDM Optical Transceiver

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Revision History

Contents

Features.................................................................................................................................................................1

Description...........................................................................................................................................................1

Revision History .................................................................................................................................................2

1. Functional Block Diagram..........................................................................................................................3

2. Pin Specifications ..........................................................................................................................................4

2.1 Pin Configuration .............................................................................................................................4

2.2 Pin Descriptions ................................................................................................................................ 5

2.3 Host Board Power Supply Requirements .................................................................................6

2.4 Optical Connector Requirements ................................................................................................6

3. Product Specifications .................................................................................................................................7

3.1 Absolute Maximum Ratings ..........................................................................................................7

3.2 Optical Performance Specifications ...........................................................................................7

3.3 DC Electrical Specifications ..........................................................................................................9

3.4 AC Electrical Specifications ....................................................................................................... 10

3.5 Supporting Circuit Specifications ............................................................................................ 10

3.5.1 In-Rush Current Control Circuit ................................................................................... 10

4. Digital Diagnosis......................................................................................................................................... 11

4.1 I2C Bus Interface ............................................................................................................................ 11

4.2 Serial Interface Memory Map .................................................................................................... 13

5. Application Reference Design ............................................................................................................... 21

5.1 Typical Application Circuit ........................................................................................................ 21

6. References and Relevant Standards .................................................................................................... 22

7. Package Information ................................................................................................................................. 23

7.1 Package Dimensions ..................................................................................................................... 23

7.2 PCB Layout Recommendations .................................................................................................24

7.3 Marking Information .................................................................................................................... 25

7.4 Ordering Information ................................................................................................................... 26

Version ECR Date Changes and/or Modifications

0 157039 November 2011 New document.

1 157987 April 2012 Updated extinction ratio in Table 3-2.

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1. Functional Block Diagram

Figure 1-1: GO2951 Functional Block Diagram

I2C Bus

1260 - 1620nm

Digital

Diagnostics

Laser

Driver

TX_FAULT

Differential Electrical Output

TX provision and

analog maintenance

RX input power monitoring

TOSA

RX_LOS

Laser + PINmon

ROSA

TIA + PIN

Feedback

1270 - 1610nm

Limiting

Amp

Differential Electrical Input

TX_DIS

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2. Pin Specifications

2.1 Pin Configuration

Figure 2-1 shows the host board pad configuration for the GO2951. Figure 2-3 shows the

edge connector pad configuration for the GO2951.

Figure 2-1: GO2951 Host Board Pad Configuration

Figure 2-2: GO2951 Edge Connector Pad Configuration

Towards

Bezel

Towards

ASIC

VEE_TX

VEE_RX

VEE_TX

VEE_RX

RD-

RD+

VCC_RX

VCC_TX

TD+

TD-

TX_DIS

RX_LOS

I2C DATA

I2C CLK

TX_FAULT

VEE_TX

VEE_RX

RD-

RD+

VCC_RX

VCC_TX

TD+

TD-

TX_DIS

VEE_TX

VEE_RX

RX_LOS

I2C DATA

I2C CLK

TX_FAULT

VEE_TX

Top of Board Bottom of Board

(as viewed through top of board)

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2.2 Pin Descriptions

Table 2-1 lists the pin descriptions.

Table 2-1: Pin Descriptions

Number Name Type Description Notes

1 VEE_TX Ground Transmitter ground connection 1

2 TX_FAULT Output Transmitter fault indicator (Active

high, open-drain)

–

3 NC No Connect No Connection –

4 VEE_TX Ground Transmitter ground connection 1

5I2C CLK Digital (Input) I2C Clock –

6I2C DATA Digital

(Bi-Directional)

I2C Data –

7 VEE_RX Ground Receiver ground connection 1

8 RX_LOS Output Receiver loss of signal indicator

(Active high, open-drain)

–

9 NC No Connect No Connection –

10 NC No Connect No Connection –

11 VEE_RX Ground Receiver ground connection 1

12 RD- Output Negative differential input

(AC-coupled internally)

–

13 RD+ Output Positive differential output

(AC-coupled internally)

–

14 VEE_RX Ground Receiver ground connection 1

15 VCC_RX Power Receiver power supply 2

16 VCC_TX Power Transmitter power supply 2

17 VEE_TX Ground Transmitter ground connection 1

18 TD+ Input Positive differential input

(AC-coupled internally)

–

19 TD- Input Negative differential input

(AC-coupled internally)

–

20 TX_DIS Digital (Input) Transmitter Disable. Laser is

disabled when high. Internal 6kΩ

pull-up.

–

NOTE:

1. All VEE signals are connected together inside the module.

2. VCC_TX and VCC_RX are independent supplies.

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2.3 Host Board Power Supply Requirements

The host board is required to provide a regulated and filtered power supply of 3.3V +/-

5% for the GO2951 via the on board SFP connector. Figure 2-3 shows the recommended

board supply filtering. When the host board is loaded with a resistive load in place of the

SFP module and sourcing the maximum rated current, the peak-to-peak power supply

noise measured on the SFP connector should comply to Table 2-2.

Figure 2-3: Recommended Host Board Supply Filtering

2.4 Optical Connector Requirements

An LC connector with PC/UPC polish is required for each port.

Table 2-2: Host Board Power Supply Noise Requirement at VCC_TX and

VCC_RX

Frequency (MHz) Peak-to-Peak Noise Amplitude (%)

0.02-1 2

1-10 3

VCC_Tx

GO2951 Host Board

VCC_Rx

3.3V

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3. Product Specifications

3.1 Absolute Maximum Ratings

Table 3-1 lists the absolute maximum ratings for the GO2951. Conditions exceeding the

limits listed may cause permanent damage to the device. This is a stress rating only and

functional operation of the device at these or any other conditions outside those listed

in the operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

3.2 Optical Performance Specifications

Table 3-2 lists the optical performance specifications for the transmitter of the GO2951.

Table 3-3 lists the optical performance specifications for the receiver of the GO2951.

Table 3-1: Absolute Maximum Ratings

Parameter Value

Supply Voltage 4V

Operating Case Temperature -20°C to 80°C

Storage Temperature -40°C < TSTG < 85°C

ESD tolerance on all pins ±1kV HBM

Relative Humidity (non-condensing) 5% - 95% RH

Table 3-2: Transmitter Optical Performance Specifications

Parameter Symbol Condition Min Ty p Max Units Notes

Wavelength λ– x - 6.5 x x + 6.5 nm 1

Spectral Line Width (RMS) –––0.21nm–

Average Optical Output

Power

POUT – 0 +2.5 +5 dBm –

Extinction Ratio ER – 7 – – dB –

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Optical Signal Intrinsic Jitter – 2.97Gbps, 1.485Gbps,

270Mbps PRBS

–3060ps–

2.97Gbps

SMPTE 424M

Pathological

–5070ps–

1.485Gbps

SMPTE 292M

Pathological

– 60 100 ps –

270Mbps

SMPTE 259M

Pathological

– 110 180 ps –

Optical Signal Rise Time

(20% to 80%)

tr2.97Gbps

SMPTE 424M

– – 135 ps –

Optical Signal Fall Time

(20% to 80%)

tf2.97Gbps

SMPTE 424M

– – 135 ps –

Laser Power Monitoring

Accuracy

––-1–+1dB–

NOTE

1. x = center wavelength: 1271nm, 1291nm, 1311nm, 1331nm, 1351nm, 1371nm, 1391nm, 1411nm, 1431nm, 1451nm, 1471nm, 1491nm,

1511nm, 1531nm, 1551nm, 1571nm, 1591nm, 1611nm.

Table 3-2: Transmitter Optical Performance Specifications (Continued)

Parameter Symbol Condition Min Ty p Max Units Notes

Table 3-3: Receiver Optical Performance Specifications

Parameter Symbol Condition Min Ty p Max Units Notes

Wavelength λ– 1260 – 1620 nm –

Sensitivity – ER = 9dB – -25 -22 dBm 1

Overload – – 0 – – dBm 1

Loss of Signal Asserted – 2.97Gbps PRBS

ER = 9dB

-31 – – dBm –

Loss of Signal De-asserted – 2.97Gbps PRBS

ER = 9dB

––-23dBm–

Loss of Signal Optical

Hysteresis

– 2.97Gbps PRBS

ER = 9dB

0.5 – – dB –

Maximum Back Reflection – – – – -27 dB –

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3.3 DC Electrical Specifications

Table 3-4 lists the DC electrical specifications of the GO2951. Figure 3-1 shows the

definition of the differential signal level.

Figure 3-1: Definition of Differential Signal Level

Input Power Monitoring

Accuracy

––-2–2dB–

NOTES

1. The sensitivity and the overload specifications refer to the input power levels for BER = 1E-12 against both PRBS and pathological pattern at

SMPTE 259, SMPTE 292M and SMPTE 424M rates.

Table 3-3: Receiver Optical Performance Specifications (Continued)

Parameter Symbol Condition Min Ty p Max Units Notes

Table 3-4: DC Electrical Specifications

Parameter Symbol Condition Min Ty p Max Units Notes

Operating Temperature Range TCASE –0–70°C1

Power Supply Voltage VCC – 3.13 3.3 3.47 V 1

Total Power Consumption – – – 650 940 mW –

Differential Input Data Amplitude Vp-pDiff – 0.4 – 2.4 Vpp 2

Differential Output Data Amplitude Vp-pDiff – 0.550 0.660 0.850 Vpp 3

Digital Input Low VIL –0 0.8V–

Digital Input High ViH –2 V

CC V–

NOTES

1. Outside the specified range, performance is not guaranteed.

2. Signals are AC coupled internally within the module and terminated to a 50Ω single-ended termination.

3. Each leg must be terminated to a 50Ω (single-ended) termination. Signals are AC coupled internally within the module.

DATAP

DATAN

DATAP - DATAN

V p-p

DIFF

= 2 x V

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3.4 AC Electrical Specifications

Table 3-5 lists the AC electrical specifications for the GO2951.

3.5 Supporting Circuit Specifications

3.5.1 In-Rush Current Control Circuit

Due to the hot-pluggable requirement, the GO2951 has built-in circuits to limit the

in-rush current upon hot insertion. The specifications of the in-rush limiting circuits are

summarized in Table 3-6.

Table 3-5: AC Electrical Specifications

Parameter Symbol Condition Min Max Units

Bit Rate BR – 50 3000 Mbps

Time to Initialize t_init From power on - 300 ms

Rise/Fall Time tr / tf20% to 80% - 135 ps

Tx_Disable Assert Time t_off Time from rising edge of Tx_Disable to when

the optical output falls below 10% of nominal.

–10μs

Tx_Disable Negate Time t_on Time from falling edge of Tx_Disable to when

the modulated optical output rises above 90%

of nominal.

–1ms

Rx_LOS Assert Time t_loss_on Time from Rx_LOS state to Rx_LOS assert. – 10 ms

Rx_LOS De-assert Time t_loss_off Time from non-Rx_LOS state to Rx_LOS

de-assert.

–10ms

Serial ID Clock Rate f_serial_clock – – 400 kHz

Table 3-6: In-rush Current Limiting Circuits Specifications

Parameter Value

Maximum in-rush current ramp rate 50mA/ms

Maximum in-rush current 30mA over steady state

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4. Digital Diagnosis

4.1 I2C Bus Interface

The I2C interface allow reading of diagnostic information from the module. It is

comprised of I2C DATA and I2C CLK pins. All address and data bytes are transmitted

through the I2C DATA pin. The I2C DATA and I2C CLK pins are open-collector and they

must be pulled high (4.75kΩ recommended) externally to the module. Data on the I2C

DATA pin may only change during I2C CLK 'low' time periods. Data changes during I2C

CLK 'high' periods will indicate either a START or STOP condition. Operations and

conditions are described as follows:

START Condition

The START condition is originated by the host. A high-to-low transition of I2C DATA

while I2C CLK 'high' defines a START condition that must precede any other command,

see Figure 4-1.

STOP Condition

The STOP condition is originated by the host. A low-to-high transition of I2C DATA while

I2C CLK 'high' defines a STOP condition, see Figure 4-1.

Figure 4-1: I2C START and STOP Condition

Acknowledge or ACK Condition

The acknowledge condition occurs when the I2C DATA pin is pulled 'low' during the

ninth clock pulse following an address or data byte. The module originates this

condition after it has received a block or data address. The host originates this condition

during a sequential address read operation.

Addressing Operation

The module must receive a block address following a START condition to enable a read

operation. The block address is clocked into the module MSB to LSB. There are three read

operations: current address read, random read, and sequential address read.

Note that by the convention specified in the SFP MSA, 7-bit block addresses are left

shifted by one bit when expressing them in hex. Block addresses for the different

I2C DATA

I2C CLK

STOPSTART

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memory regions are specified in Section 4.2. Block addresses A0h, A2h, and B2h would

therefore be transmitted defined as binary 1010000, 1011001 and 1011001 respectively.

Current Address Read Operation

The module has an internal register that maintains the data address used during the last

read operation, incremented by one. If the most recent data address was FFh, then the

set 'high', the module follows with an ACK condition, and the data byte located at the

current data address is serially clocked out of the module MSB to LSB. The operation is

terminated when the host does not provide an ACK condition and initiates a STOP

condition. See Figure 4-2.

Figure 4-2: I2C Current Address Read Operation

Random Address Read Operation

A random read operation requires a dummy write sequence to load in the data address.

Once the block and data addresses are clocked in by the host followed by an ACK

condition provided by the module, the host must generate another START condition. The

host now initiates a current address read operation by sending the block address with

the R/W bit set 'high'. The module provides an ACK condition and serially clocks out the

data byte. The operation is terminated when the host does not provide an ACK condition

and initiates a STOP condition. See Figure 4-3.

Figure 4-3: I2C Random Access Read Operation

Sequential Address Read Operation

The sequential address read operation is initiated by either a current address read or

random address read operation. After the host receives the first data byte, it responds

with an ACK condition. As long as the module receives the ACK condition after a data

byte is read, the host can clock out additional data bytes from the module. After the data

address reaches FFh, it resets to 00h. The operation is terminated when the host does not

provide an ACK condition and initiates a STOP condition. See Figure 4-4.

C DATA 7 65432176543210R A

Host driving data line Module driving data line

Block AddressSTART STOPRead

ACK NO ACK

Data Byte

C DATA 7 65432176543210W A

Host driving data line Module driving data line

Block AddressSTART Write

ACK

Data Address

76543217 6 5 43210R A

Block AddressSTART STOPRead

ACK NO ACK

Data Byte

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Figure 4-4: I2C Sequential Read Access Operation

4.2 Serial Interface Memory Map

Module identification and digital diagnostic monitoring information is accessible

through the memory map addresses shown in this section. The bullet items below

outline the different block addresses of the module:

• Block address A0h contains serial ID information of the module.

• Block address A2h contains alarm and warning flags, thresholds and real-time

digital diagnostic features set.

The 16-bit digital diagnostic monitoring information is internally calibrated over

Gennum’s specified operating temperature and voltage. Alarm and warning threshold

values are calibrated in the same manner and can be interpreted as defined below.

Internally measured module temperature is represented as a 16-bit signed two’s

complement value in increments of 1/256°C, yielding a total range of -128°C to +128°C.

To calculate the temperature, treat the two’s complement value as a 16-bit unsigned

integer and divide it by 256. If the result is greater or equal to 128, subtract 256 from the

result. See Table 4-1 for temperature conversion examples.

Internally measured module supply voltage is represented as a 16-bit unsigned integer

with the voltage defined as the full 16-bit value with the LSB equal to 100μV, yielding a

total range of 0 to +6.55V. To calculate the supply voltage, multiply the 16-bit unsigned

integer by 100μV.

Internally measured laser bias current is represented as a 16-bit unsigned integer with

the current defined as the full 16-bit value with the LSB equal to 2μA, yielding a total

range of 0 to 131 mA. To calculate the laser bias current, multiply the 16-bit unsigned

integer by 2μA.

C DATA 7 65432176543210R A

Host driving data line Module driving data line

Block AddressSTART STOPRead

ACK NO ACK

Data Byte (N)

76543210A

ACK

Data Byte (N+1)

76 5 43210A

ACK

Data Byte (N+M)

Table 4-1: Temperature Conversion Examples

MSB (BIN) LSB (BIN) Temperature (°C)

01000000 00000000 64°C

01000000 00001111 64.059°C

01011111 00000000 95°C

11110110 00000000 -10°C

11011000 00000000 -40°C

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Internally measured Tx and Rx optical power are represented as a 16-bit unsigned

integer with the power defined as the full 16-bit value with the LSB equal to 0.1μW,

yielding a total range of 0 to 6.5535mW (~ -40 to +8.2dBm). To calculate the Tx and Rx

optical power, multiply the 16-bit unsigned integer by 0.1μW.

Table 4-2: Modules Identification Fields

Block Address: A0h

Address Size Name Description and Value of the Field

0 1 Identifier Type of serial transceiver. 85h

1 1 Ext. Identifier Extended identifier of type of serial

transceiver. 04h

2 1 Connector Code for connector type. 07h for LC

connectors.

3 1 Standards

Compliance

41h, for SMPTE259M/344M/292M/424M and

SMPTE 297.

4-10 8 Transceiver Code Code for electronic compatibility or optical

compatibility. Not applicable for GO2951.

11 1 Encoding Code for serial encoding algorithm. Value:

03H for NRZ.

12 1 BR, Nominal Nominal bit rate, units of 100Mbps, 1Eh for

3Gbps.

13 1 Reserved Xxh

14 1 Length(9μm) -

Link length supported for standard SMF,

units of km, 1Eh for 30km (at HD-SDI).

15 1 Length(9μm) Link length supported for standard SMF,

units of 100m, 00h

16 1 Length (50μm) Link length supported for 50/125 μm fiber,

units of 10m, 00h

17 1 Length (62.5μm) Link length supported for 62.5/125 μm fiber,

units of 10 m. 00h

18 1 Length (Copper) Link length supported for copper, units of

meters. 00h

19 1 Reserved Xxh

20-35 16 Vendor name SFP with OM transceiver vendor name

(ASCII). G E N N U M

20 1 G 47h

21 1 E 45h

22 1 N 4Eh

23 1 N 4Eh

24 1 U 55h

25 1 M 4Dh

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26-35 10 – 20h for each byte

36 1 Reserved –

37-39 3 Vendor OUI SFP with OM transceiver vendor IEEE

company ID. 00 0A DF

40-55 16 Vendor PN Part number provided by SFP with OM

transceiver vendor. GO2951-XXCH

40 1 G 47h

41 1 O 4Fh

42 1 2 32h

43 1 9 39h

44 1 5 35h

45 1 1 31h

46 1 - 2Dh

47 1 X Model dependent.

48 1 X Model dependent.

49 1 C 43h

50 1 H 48h

51-55 6 – 20h

56-58 3 Reserved Reserved field.

59 1 Vendor Rev Revision level for part number provided by

vendor.

60 1 Wavelength XX for middle two digits of wavelength.

61-62 2 Reserved Xxh

63 1 CC_BASE Check code for Base ID fields. (The value of

the lower 8 bits of the sum of the contents

from address 0 to 62.)

64-65 2 Options Indicates which optional SFP with OM

signals are implemented.

64 1 – Xxh

65 1 – xx01101xh (1Ah)

66 1 BR, max Upper bit rate margin, units of %, 5h.

67 1 BR, min Lower bit rate margin, units of %, 5Fh.

68-83 16 Vendor SN Serial number provided by vendor (ASCII)

84-85 2 Year Manufacturing date code (ASCII).

Table 4-2: Modules Identification Fields (Continued)

Block Address: A0h

Address Size Name Description and Value of the Field

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86-87 2 Month Manufacturing date code (ASCII).

88-89 2 Day Manufacturing date code (ASCII).

90-91 2 Blank –

92 1 Calibration flag 28h for calibrated average output power

93 1 – F0h, Enhanced alarm/warning flags.

94 1 Reserved Xxh

95 1 CC_EXT Check code for the Extended ID fields. (The

value of the lower 8 bits of the sum of the

contents from address 64 to 94.)

96-255 160 Reserved –

Table 4-3: Alarm and Warning Thresholds

Block Address: A2h

Address Size Name Description and Value of the Field

0-1 2 Temp High Alarm MSB at lower address. 70°C case temp.

2-3 2 Temp Low Alarm MSB at lower address. 0°C case temp.

4-5 2 Temp High

Warning

MSB at lower address. 65°C case temp.

6-7 2 Temp Low

Warning

MSB at lower address. 5°C case temp.

8-9 2 Supply Voltage

High Alarm

MSB at lower address. 3.6V

10-11 2 Supply Voltage

Low Alarm

MSB at lower address. 3.0V

12-13 2 Supply Voltage

High Warning

MSB at lower address. 3.47V

14-15 2 Supply Voltage

Low Warning

MSB at lower address. 3.14V

16-17 2 Laser Bias High

Alarm

MSB at lower address. 100mA.

18-19 2 Laser Bias Low

Alarm

MSB at lower address. 5mA

20-21 2 Laser Bias High

Warning

MSB at lower address. 90mA.

22-23 2 Laser Bias Low

Warning

MSB at lower address. 10mA

Table 4-2: Modules Identification Fields (Continued)

Block Address: A0h

Address Size Name Description and Value of the Field

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24-25 2 Tx Power High

Alarm

MSB at lower address. 5.5dBm

26-27 2 Tx Power Low

Alarm

MSB at lower address. -0.5dBm

28-29 2 Tx Power High

Warning

MSB at lower address. 5dBm

30-31 2 Tx Power Low

Warning

MSB at lower address. 0dBm

32-33 2 Rx Power High

Alarm

MSB at lower address. 0dBm

34-35 2 Rx Power Low

Alarm

MSB at lower address. -24dBm

36-37 2 Rx Power High

Warning

MSB at lower address. -1dBm

38-39 2 Rx Power Low

Warning

MSB at lower address. -23dBm

40-95 56 Reserved. –

Table 4-4: Alarms and Real time Diagnostic information

Block Address: A2h

Address Size Name Description and Value of the Field

96 1 Temperature

MSB

Internally measured module temperature

(approximately equal to case temperature)

97 1 Temperature LSB Internally measured module temperature

(approximately equal to case temperature)

98 1 VCC MSB Internally measured module supply voltage

99 1 VCC LSB Internally measured module supply voltage

100 1 Laser Bias MSB Internally measured laser bias current

101 1 Laser Bias LSB Internally measured laser bias current

102 1 Tx Power MSB Internally measured Tx power

103 1 Tx Power LSB Internally measured Tx power

104 1 Rx Power MSB Internally measured Rx power

105 1 Rx Power LSB Internally measured Rx power

106-109 9 Reserved –

Table 4-3: Alarm and Warning Thresholds (Continued)

Block Address: A2h

Address Size Name Description and Value of the Field

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110 1 Tx Disable State Bit 7: State of TX_DIS input pin

Tx Disable Select Bit 6: Read/write bit that allows software

disable of laser. Writing “1” disables laser.

Reserved Bit 5-3

Tx Fault Bit 2: State of TX_FAULT output

Rx LOS Bit 1: State of RX_LOS output

Data_Ready Bit 0

111 1 Temp Update Bit 7 goes to high after a temperature

update

VCC Update Bit 6 goes to high after a VCC update

Tx bias Update Bit 5 goes to high after a Tx bias current

update

Tx power Update Bit 4 goes to high after a Tx power update

Rx power Update Bit 3 goes to high after a Rx input power

update

Reserved Bit 0 to Bit 2

112 1 Temp High Alarm

Flag

Bit 7, set when the internal temperature

exceeds the high temp alarm threshold

Temp Low Alarm

Flag

Bit 6, set when the internal temperature

goes below the low temp alarm threshold

Supply Voltage

High Alarm Flag

Bit 5, set when the internal VCC exceeds the

supply voltage high alarm threshold

Supply Voltage

Low Alarm Flag

Bit 4, set when the internal VCC goes below

the supply voltage low alarm threshold

Laser Bias High

Alarm Flag

Bit 3, set when the monitored laser bias

current exceeds the laser bias high alarm

threshold

Laser Bias Low

Alarm Flag

Bit 2, set when monitored laser bias current

goes below the laser bias low alarm

threshold

Tx Power High

Alarm Flag

Bit 1, set when the monitored Tx power

exceeds the Tx power high alarm threshold

Tx Power Low

Alarm Flag

Bit 0, set when monitored Tx power current

goes below the Tx power low alarm

threshold

Table 4-4: Alarms and Real time Diagnostic information

Block Address: A2h (Continued)

Address Size Name Description and Value of the Field

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113 1 Rx Power High

Alarm Flag

Bit 7, set when the monitored Rx power

exceeds the Rx power high alarm threshold

Rx Power Low

Alarm Flag

Bit 6, set when the monitored Rx power goes

below the Rx power low alarm threshold

Reserved Bit 0 - 5

114-115 2 Reserved –

116 1 Temp High

Warning Flag

Bit 7, set when the internal temperature

exceeds the high temp warning threshold

Temp Low

Warning Flag

Bit 6, set when the internal temperature

goes below the low temp warning threshold

Supply Voltage

High Warning

Flag

Bit 5, set when the internal VCC exceeds the

supply voltage high warning threshold

Supply Voltage

Low Warning

Flag

Bit 4, set when the internal VCC goes below

the supply voltage low warning threshold

Laser Bias High

Warning Flag

Bit 3, set when the monitored laser bias

current exceeds the laser bias high warning

threshold

Laser Bias Low

Warning Flag

Bit 2, set when monitored laser bias current

goes below the laser bias low warning

threshold

Tx Power High

Warning Flag

Bit 1, set when the monitored Tx power

exceeds the Tx power high warning

threshold

Tx Power Low

Warning Flag

Bit 0, set when monitored Tx power current

goes below the Tx power low warning

threshold

117 1 Rx Power High

Warning Flag

Bit 7, set when the monitored Rx power

exceeds the Rx power high warning

threshold

Rx Power Low

Warning Flag

Bit 6, set when the monitored Rx power goes

below the Rx power low warning threshold

Reserved Bit 0 - 5

118-127 10 Reserved –

Table 4-4: Alarms and Real time Diagnostic information

Block Address: A2h (Continued)

Address Size Name Description and Value of the Field

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Table 4-5: Writeable Area

Block Address: A2h

Address Size Name Description and Value of the Field

128-247 120 User Writeable

Area

–

248-255 8 Reserved –

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5. Application Reference Design

5.1 Typical Application Circuit

Figure 5-1: Typical Application Circuit

4.7k

VCC_3V3 Differential

VCC_3V3

TD+

TD-

VCC_3V3

VEE

TX_FAULT

VEE

C CLK

C DATA

VEE

10 11

RD- 12

VCC_TX 16

VEE 17

TD+ 18

TD- 19

TX_DIS 20

GO2951

C CLK

C DATA

4.7k

TX_DIS

From GS2975A Reclocker

RX_LOS

VEE

RD+

VEE

VCC_RX 100nF

NC Differential

RD-

RD+ To GS2975A Reclocker

100nF

VCC_3V3

10k

VCC_3V3

10k

TX_FAULT ALARM

RX_LOS ALARM

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6. References and Relevant Standards

Table 6-1: References and Relevant Standards

INF-8074i Rev 1.0 SFP (Small Formfactor Pluggable) Transceiver

SMPTE 259M-2008 SDTV Digital Signal/Data – Serial Digital Interface

SMPTE 292M-2008 1.5 Gbps Signal / Data Serial Interface

SMPTE 297-2006 Serial Digital Fiber Transmission System for SMPTE 259M, SMPTE 344M, SMPTE 292 and SMPTE

424M Signals

SMPTE 344M-2000 540 Mbps Serial Digital Interface

SMPTE 424M-2006 3 Gbps Signal/Data Serial Interface

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7. Package Information

7.1 Package Dimensions

A common mechanical outline, as shown in Figure 7-1, is used for all SFP modules.

Figure 7-1: Common SFP Package Outline

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7.2 PCB Layout Recommendations

Figure 7-2: Host PCB Layout – Part 1

Notes:

1. All dimensions in mm.

2. Datum and basic dimensions

established by customer

3. Pads and vias are chassis-ground

in 11 places

4. Through-holes and plating are optional

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Figure 7-3: Host PCB Layout – Part 2

7.3 Marking Information

Figure 7-4: GO2951 Marking Information

All dimensions in mm

Table 7-1: Marking Information

Label Code Description

XX 2-digit wavelength code

ZZZZZZZ 7-digit serial number

UUUU Laser wavelength in nanometers

YYYY Year of manufacture

WW Week of manufacture

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7.4 Ordering Information

Table 7-2: Ordering Information

Part Number Package Wavelength Temperature Range

GO2951-27CH SFP 1271nm 0°C to 70°C

GO2951-29CH SFP 1291nm 0°C to 70°C

GO2951-31CH SFP 1311nm 0°C to 70°C

GO2951-33CH SFP 1331nm 0°C to 70°C

GO2951-35CH SFP 1351nm 0°C to 70°C

GO2951-37CH SFP 1371nm 0°C to 70°C

GO2951-39CH SFP 1391nm 0°C to 70°C

GO2951-41CH SFP 1411nm 0°C to 70°C

GO2951-43CH SFP 1431nm 0°C to 70°C

GO2951-45CH SFP 1451nm 0°C to 70°C

GO2951-47CH SFP 1471nm 0°C to 70°C

GO2951-49CH SFP 1491nm 0°C to 70°C

GO2951-51CH SFP 1511nm 0°C to 70°C

GO2951-53CH SFP 1531nm 0°C to 70°C

GO2951-55CH SFP 1551nm 0°C to 70°C

GO2951-57CH SFP 1571nm 0°C to 70°C

GO2951-59CH SFP 1591nm 0°C to 70°C

GO2951-61CH SFP 1611nm 0°C to 70°C

CANADA

Suite 320, 3553 31st St. N.W.

Calgary, Alberta T2L 2K7

Canada

Phone: +1 (403) 284-2672

Fax: +1 (905) 632-2055

415 Legget Drive, Suite 200

Kanata, Ontario K2K 2B2

Canada

Phone: +1 (613) 270-0458

Fax: +1 (613) 270-0429

GERMANY

Gennum Canada Limited

Niederlassung Deutschland

München, Germany

Phone: +49 89 309040 290

Fax: +49 89 309040 293

E-mail: gennum-germany@gennum.com

INDIA

#208(A), Nirmala Plaza,

Airport Road, Forest Park Square

Bhubaneswar 751009

India

Phone: +91 (674) 65304815

Fax: +91 (674) 259-5733

JAPAN KK

Shinjuku Green Tower Building 27F

6-14-1, Nishi Shinjuku

Shinjuku-ku, Tokyo, 160-0023

Japan

Phone: +81 (03) 3349-5501

Fax: +81 (03) 3349-5505

E-mail: gennum-japan@gennum.com

Web Site: http://www.gennum.co.jp

MEXICO

Venustiano Carranza 122 Int. 1

Centro, Aguascalientes

Mexico CP 20000

Phone: +1 (416) 848-0328

NORTH AMERICA WESTERN REGION

691 South Milpitas Blvd., Suite #200

Milpitas, CA 95035

United States

Phone: +1 (408) 934-1301

Fax: +1 (408) 934-1029

E-mail: naw_sales@gennum.com

NORTH AMERICA EASTERN REGION

4281 Harvester Road

Burlington, Ontario L7L 5M4

Canada

Phone: +1 (905) 632-2996

Fax: +1 (905) 632-2055

E-mail: nae_sales@gennum.com

TAIW AN

6F-4, No.51, Sec.2, Keelung Rd.

Sinyi District, Taipei City 11052

Taiwan R.O.C.

Phone: (886) 2-8732-8879

Fax: (886) 2-8732-8870

E-mail: gennum-taiwan@gennum.com

UNITED KINGDOM

South Building, Walden Court

Parsonage Lane,

Bishop’s Stortford Hertfordshire, CM23 5DB

United Kingdom

Phone: +44 1279 714170

Fax: +44 1279 714171

2, West Point Court, Great Park Road

Bradley Stoke, Bristol BS32 4PY

Great Britain

Phone: +44 1454 462200

Fax: +44 1454 462201

SNOWBUSH IP - A DIVISION OF GENNUM

439 University Ave. Suite 1700

Toronto, Ontario M5G 1Y8

Canada

Phone: +1 (416) 925-5643

Fax: +1 (416) 925-0581

E-mail: sales@snowbush.com

Web Site: http://www.snowbush.com

DOCUMENT IDENTIFICATION

DATA SHEET

The product is in production. Gennum reserves the right to make changes to

the product at any time without notice to improve reliability, function or

design, in order to provide the best product possible.

GO2951 CWDM Optical Transceiver

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Proprietary & Confidential

Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of

the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent

infringement.

All other trademarks mentioned are the properties of their respective owners.

GENNUM and the Gennum logo are registered trademarks of Gennum Corporation.

www.gennum.com

GENNUM CORPORATE HEADQUARTERS

4281 Harvester Road, Burlington, Ontario L7L 5M4 Canada

Phone: +1 (905) 632-2996 Fax: +1 (905) 632-2055

E-mail: corporate@gennum.com www.gennum.com

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ELECTROSTATIC SENSITIVE DEVICES

DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A

STATIC-FREE WORKSTATION

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