VS-VSK.170PbF, VS-VSK.250PbF Series
www.vishay.com Vishay Semiconductors
Revision: 12-Nov-2018 3Document Number: 94417
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SWITCHING
PARAMETER SYMBOL TEST CONDITIONS VSK.170 VSK.250 UNITS
Typical delay time tdTJ = 25 °C, gate current = 1 A dIg/dt = 1 A/μs
Vd = 0.67 % VDRM
1.0
μs
Typical rise time tr2.0
Typical turn-off time tq
ITM = 300 A; dI/dt = 15 A/μs; TJ = TJ
maximum;
VR = 50 V; dV/dt = 20 V/μs; gate 0 V, 100
50 to 150
BLOCKING
PARAMETER SYMBOL TEST CONDITIONS VSK.170 VSK.250 UNITS
Maximum peak reverse and
off-state leakage current
IRRM,
IDRM
TJ = TJ maximum 50 60 mA
RMS insulation voltage VINS
50 Hz, circuit to base, all terminals shorted,
25 °C, 1 s 3000 V
Critical rate of rise of off-state voltage dV/dt TJ = TJ maximum, exponential to 67 %
rated VDRM
1000 V/μs
TRIGGERING
PARAMETER SYMBOL TEST CONDITIONS VSK.170 VSK.250 UNITS
Maximum peak gate power PGM tp 5 ms, TJ = TJ maximum 10.0 W
Maximum average gate power PG(AV) f = 50 Hz, TJ = TJ maximum 2.0
Maximum peak gate current + IGM tp 5 ms, TJ = TJ maximum 3.0 A
Maximum peak negative gate voltage - VGT tp 5 ms, TJ = TJ maximum 5.0
V
Maximum required DC gate voltage to trigger VGT
TJ = -40 °C
Anode supply = 12 V,
resistive load; Ra = 1
4.0
TJ = 25 °C 3.0
TJ = TJ maximum 2.0
Maximum required DC gate current to trigger IGT
TJ = -40 °C
Anode supply = 12 V,
resistive load; Ra = 1
350
mATJ = 25 °C 200
TJ = TJ maximum 100
Maximum gate voltage that will not trigger VGD TJ = TJ maximum, rated VDRM applied 0.25 V
Maximum gate current that willnot trigger IGD TJ = TJ maximum, rated VDRM applied 10.0 mA
Maximum rate of rise of turned-on current dI/dt TJ = TJ maximum, ITM = 400 A,
rated VDRM applied 500 A/μs
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VSK.170 VSK.250 UNITS
Junction operating and storage
temperature range TJ, TStg -40 to +130 °C
Maximum thermal resistance,
junction to case per junction RthJC DC operation 0.17 0.125
K/W
Typical thermal resistance,
case to heatsink per module RthCS Mounting surface flat, smooth and greased 0.02 0.02
Mounting
torque
± 10 %
MAGN-A-PAK to heatsink A mounting compound is recommended
and the torque should be rechecked after
a period of about 3 hours to allow for the
spread of the compound.
4 to 6 Nm
busbar to MAGN-A-PAK
Approximate weight 500 g
17.8 oz.
Case style MAGN-A-PAK