PASSIVES - CHIP
2
2 - 2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC650 TO HMC658
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
v01.0308
General Description
Features
Functional Diagrams
Wide Bandwidth: DC - 50 GHz
9 Attenuator Products:
0, 2, 3, 4, 6, 10, 15, & 20 dB Fixed Levels
Power Handling: +25 dBm
HMC651 & HMC658
Die Size: 0.57 x 0.45 x 0.1 mm
HMC650, HMC652, HMC653, HMC654
HMC655, HMC656 & HMC657
Die Size: 0.42 x 0.45 x 0.1 mm
Included in the HMC-DK006 Designer’s Kit
Typical Applications
The HMC650 through HMC658 are ideal for:
• Fiber Optics
• Microwave Radio
• Military & Space Hybrids
• Test & Measurement
• Scienti c Instruments
• RF / Microwave Circuit Prototyping
The HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657
/ 658 are a line of wideband  xed value 50 Ohm mat-
ched attenuator chips which offer relative attenuation
levels of 0, 2, 3, 4, 6, 10, 15 and 20 dB. These passive
though-lines and attenuators are ideal for microstrip,
hybrid, and multi-chip module applications where
extremely  at attenuation, and excellent VSWR vs.
frequency are required.
These wideband attenuators feature low inductance
on-chip vias, and require no additional ground
connections. The HMC650 through HMC658 are
backside metallized with gold, and are suitable for
eutectic or epoxy die attach. Each of the 9 products
can be purchased individually by their respective
part number or in a set of 10 each in the HMC-DK006
Fixed Attenuator Chip Designer’s Kit.
HMC651, HMC658
HMC650, HMC652, HMC653, HMC654,
HMC655, HMC656 & HMC657
PASSIVES - CHIP
2
2 - 3
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Electrical Speci cations, TA = +25° C, 50 Ohm system [1]
Part Number Attenuator Value Return Loss Attenuation Tolerance Return Loss Attenuation Tolerance Units
DC - 25 25 - 50 GHz
HMC650 Thru Line (short) 20.3 ±0.2 12.4 ±0.8 dB
HMC651 Thru Line (long) 19.0 ±0.3 12.3 ±0.9 dB
HMC652 2 dB 22.0 ±0.2 15.3 ±0.6 dB
HMC653 3 dB 23.0 ±0.2 22.1 ±0.5 dB
HMC654 4 dB 20.5 ±0.2 22.4 ±0.5 dB
HMC655 6 dB 16.5 ±0.2 17.0 ±0.6 dB
HMC656 10 dB 16.9 ±0.1 18.8 ±0.7 dB
HMC657 15 dB 20.0 ±0.4 19.7 ±1.3 dB
HMC658 20 dB 17.5 ±0.5 16.2 ±1.6 dB
Attenuation vs. Temperature
HMC652, HMC653, HMC654, HMC655
-10
-8
-6
-4
-2
0
0 5 10 15 20 25 30 35 40 45 50
ATTENUATION (dB)
FREQUENCY (GHz)
HMC654
HMC652
HMC653
HMC655
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
RF Data with Wire Bonds [1]
Return Loss
HMC652, HMC653, HMC654, HMC655
-30
-25
-20
-15
-10
-5
0
0 1020304050
RETURN LOSS (dB)
FREQUENCY (GHz)
HMC655
HMC654
HMC653
HMC652
Attenuation vs. Temperature
HMC656, HMC657, HMC658
-25
-20
-15
-10
-5
0
0 5 10 15 20 25 30 35 40 45 50
ATTENUATION (dB)
FREQUENCY (GHz)
HMC656
HMC657
HMC658
Return Loss
HMC656, HMC657, HMC658
-30
-25
-20
-15
-10
-5
0
0 1020304050
RETURN LOSS (dB)
FREQUENCY (GHz)
HMC656 HMC658
HMC657
[1] Data taken with die mounted to plate and RF probed through two 1 mil diameter wire bonds.
PASSIVES - CHIP
2
2 - 4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Return Loss
HMC652, HMC653, HMC654, HMC655
-30
-25
-20
-15
-10
-5
0
0 1020304050
RETURN LOSS (dB)
FREQUENCY (GHz)
HMC655
HMC654
HMC653
HMC652
Attenuation vs. Temperature
HMC656, HMC657, HMC658
-25
-20
-15
-10
-5
0
0 5 10 15 20 25 30 35 40 45 50
ATTENUATION (dB)
FREQUENCY (GHz)
HMC656
HMC657
HMC658
Return Loss
HMC656, HMC657, HMC658
-30
-25
-20
-15
-10
-5
0
0 1020304050
RETURN LOSS (dB)
FREQUENCY (GHz)
HMC656
HMC658 HMC657
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Attenuation vs. Temperature
HMC652, HMC653, HMC654, HMC655
-10
-8
-6
-4
-2
0
0 5 10 15 20 25 30 35 40 45 50
ATTENUATION (dB)
FREQUENCY (GHz)
HMC654
HMC652
HMC653
HMC655
RF Data with Ribbon Bonds [2]
[2] Data taken with die mounted to plate and RF probed through two 3 x 0.5 mil ribbon bonds.
PASSIVES - CHIP
2
2 - 5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Part Number HMC650 HMC651 HMC652 HMC653 HMC654 HMC655 HMC656 HMC657 HMC658 Units
RF Input Power (CW) N/A N/A 27 26 25 26 25 25 25 dBm
DC Voltage Terminated N/A N/A 5.6 5.2 4.9 5.2 4.9 4.4 4.8 V
DC Voltage Open N/A N/A 5.6 5.1 4.6 6.0 5.3 4.6 4.9 V
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Attenuation vs. Temperature
HMC656, HMC657, HMC658
-25
-20
-15
-10
-5
0
0 5 10 15 20 25 30 35 40 45 50
ATTENUATION (dB)
FREQUENCY (GHz)
HMC656
HMC657
HMC658
Return Loss
HMC652, HMC653, HMC654, HMC655
-30
-25
-20
-15
-10
-5
0
0 1020304050
RETURN LOSS (dB)
FREQUENCY (GHz)
HMC655
HMC654
HMC653
HMC652
Return Loss
HMC656, HMC657, HMC658
-30
-25
-20
-15
-10
-5
0
0 1020304050
RETURN LOSS (dB)
FREQUENCY (GHz)
HMC656
HMC658 HMC657
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Attenuation vs. Temperature
HMC652, HMC653, HMC654, HMC655
-10
-8
-6
-4
-2
0
0 5 10 15 20 25 30 35 40 45 50
ATTENUATION (dB)
FREQUENCY (GHz)
HMC654
HMC652
HMC653
HMC655
RF Data Die Only [3]
[3] Data taken with die mounted to a plate and RF probed directly on die.
PASSIVES - CHIP
2
2 - 6
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
HMC650, HMC652, HMC653, HMC654, HMC655, HMC656 HMC657
Outline Drawing
HMC651 & HMC658
NOTES:
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. TYPICAL BOND PAD IS .004” SQUARE.
3. TYPICAL BOND PAD SPACING IS .006” CENTER TO
CENTER EXCEPT AS NOTED.
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
7. DO NOT BOND ON TOP OF GROUND VIAS
8. OVERALL DIE SIZE ±0.002”
Die Packaging Information [1]
Standard Alternate
GP-5 (Gel Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
PASSIVES - CHIP
2
2 - 7
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Pad Number Function Description Interface Schematic
1, 2 RF1, RF2
This pad is DC coupled and matched to 50 Ohms.
Use DC Blocking capacitors if the input / output signals
have non-zero DC potential
GND Die bottom must be connected to RF ground.
Pad Descriptions
Assembly Diagram
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
PASSIVES - CHIP
2
2 - 8
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin  lm substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin  lm substrates must be
used, the die should be raised 0.150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate. One way to accom-
plish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
Microstrip substrates should brought as close to the die as possible in
order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protec-
tive containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD
strikes.
Transients: Suppress instrument and bias supply transients while bias
is applied. Use shielded signal and bias cables to minimize inductive
pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or  ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and  at.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy  llet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recom-
mended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on
the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 2.
0.150mm (0.005”) Thick
Moly Tab
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
PASSIVES - CHIP
2
2 - 9
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Notes:
HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658