SN54HC74, SN74HC74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS094D – DECEMBER 1982 – REVISED JULY 2003
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
Wide Operating Voltage Range of 2 V to 6 V
D
Outputs Can Drive Up To 10 LSTTL Loads
D
Low Power Consumption, 40-µA Max ICC
D
Typical tpd = 15 ns
D
±4-mA Output Drive at 5 V
D
Low Input Current of 1 µA Max
description/ordering information
The ’HC74 devices contain two independent
D-type positive-edge-triggered flip-flops. A low
level at the preset (PRE) or clear (CLR) inputs sets
or resets the outputs, regardless of the levels of
the other inputs. When PRE and CLR are inactive
(high), data at the data (D) input meeting the setup
time requirements are transferred to the outputs
on the positive-going edge of the clock (CLK)
pulse. Clock triggering occurs at a voltage level
and is not directly related to the rise time of CLK.
Following the hold-time interval, data at the
D input can be changed without affecting the
levels at the outputs.
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP – N T ube of 25 SN74HC74N SN74HC74N
T ube of 50 SN74HC74D
SOIC – D Reel of 2500 SN74HC74DR HC74
Reel of 250 SN74HC74DT
–40°C to 85°CSOP – NS Reel of 2000 SN74HC74NSR HC74
SSOP – DB Reel of 2000 SN74HC74DBR HC74
T ube of 90 SN74HC74PW
TSSOP – PW Reel of 2000 SN74HC74PWR HC74
Reel of 250 SN74HC74PWT
CDIP – J T ube of 25 SNJ54HC74J SNJ54HC74J
–55°C to 125°CCFP – W T ube of 150 SNJ54HC74W SNJ54HC74W
LCCC – FK T ube of 55 SNJ54HC74FK SNJ54HC74FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1CLR
1D
1CLK
1PRE
1Q
1Q
GND
VCC
2CLR
2D
2CLK
2PRE
2Q
2Q
SN54HC74 ...J OR W PACKAGE
SN74HC74 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
2D
NC
2CLK
NC
2PRE
1CLK
NC
1PRE
NC
1Q
1D
1CLR
NC
2Q
2Q V
2CLR
1Q
GND
NC
SN54HC74 . . . FK PACKAGE
(TOP VIEW)
CC
NC – No internal connection
Copyright 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54HC74, SN74HC74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS094D DECEMBER 1982 REVISED JULY 2003
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS OUTPUTS
PRE CLR CLK D Q Q
L H X X H L
HLXXLH
LLXXH
H
H H HHL
H H LLH
H H L X Q0Q0
This configuration is nonstable; that is, it does not
persist when PRE or CLR returns to its inactive
(high) level.
logic diagram (positive logic)
PRE
CLK
D
CLR
Q
Q
C
C
C
C
C
C
C
C
C
C
TG
TG TG TG
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC 0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54HC74, SN74HC74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS094D DECEMBER 1982 REVISED JULY 2003
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54HC74 SN74HC74
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V
VCC = 6 V 4.2 4.2
VCC = 2 V 0.5 0.5
VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VCC = 6 V 1.8 1.8
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
t/vInput transition rise/fall time VCC = 4.5 V 500 500 ns
VCC = 6 V 400 400
TAOperating free-air temperature 55 125 40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HC74 SN74HC74
UNIT
PARAMETER
TEST
CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 1.9 1.998 1.9 1.9
IOH = 20 µA4.5 V 4.4 4.499 4.4 4.4
VOH VI = VIH or VIL 6 V 5.9 5.999 5.9 5.9 V
IOH = 4 mA 4.5 V 3.98 4.3 3.7 3.84
IOH = 5.2 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
IOL = 20 µA4.5 V 0.001 0.1 0.1 0.1
VOL VI = VIH or VIL 6 V 0.001 0.1 0.1 0.1 V
IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 6 V 4 80 40 µA
Ci2 V to 6 V 3 10 10 10 pF
SN54HC74, SN74HC74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS094D DECEMBER 1982 REVISED JULY 2003
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
TA = 25°C SN54HC74 SN74HC74
UNIT
V
CC MIN MAX MIN MAX MIN MAX
UNIT
2 V 6 4.2 5
fclock Clock frequency 4.5 V 31 21 25 MHz
6 V 0 36 0 25 0 29
2 V 100 150 125
PRE or CLR low 4.5 V 20 30 25
t
Pulse duration
6 V 17 25 21
ns
t
w
Pulse
duration
2 V 80 120 100
ns
CLK high or low 4.5 V 16 24 20
6 V 14 20 17
2 V 100 150 125
Data 4.5 V 20 30 25
t
Setu
p
time before CLK
6 V 17 25 21
ns
t
su
Setup
time
before
CLK
2 V 25 40 30
ns
PRE or CLR inactive 4.5 V 5 8 6
6 V 4 7 5
2 V 0 0 0
thHold time, data after CLK
4.5 V 0 0 0 ns
6 V 0 0 0
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO
VCC
TA = 25°C SN54HC74 SN74HC74
UNIT
PARAMETER
(INPUT) (OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 6 10 4.2 5
fmax 4.5 V 31 50 21 25 MHz
6 V 36 60 25 29
2 V 70 230 345 290
PRE or CLR Q or Q 4.5 V 20 46 69 58
td
6 V 15 39 59 49
ns
t
pd 2 V 70 175 250 220
ns
CLK Q or Q 4.5 V 20 35 50 44
6 V 15 30 42 37
2 V 28 75 110 95
ttQ or Q 4.5 V 8 15 22 19 ns
6 V 6 13 19 16
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per flip-flop No load 35 pF
SN54HC74, SN74HC74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS094D DECEMBER 1982 REVISED JULY 2003
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
th
tsu
50%
50%50% 10%10% 90% 90%
VCC
VCC
0 V
0 V
trtf
Reference
Input
Data
Input
50%
High-Level
Pulse 50% VCC
0 V
50% 50%
VCC
0 V
tw
Low-Level
Pulse
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
VCC
VOH
VOL
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-Phase
Output
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily . All input pulses are supplied by generators having the following
characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC74DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HC74DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC74DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC74DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC74NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HC74PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC74PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC74DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74HC74DR SOIC D 14 2500 333.2 345.9 28.6
SN74HC74DR SOIC D 14 2500 367.0 367.0 38.0
SN74HC74DT SOIC D 14 250 367.0 367.0 38.0
SN74HC74NSR SO NS 14 2000 367.0 367.0 38.0
SN74HC74PWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74HC74PWT TSSOP PW 14 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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