Data Sheet July 2002 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Features The FW250F1 and FW300F1 Power Modules use advanced, surface-mount technology and deliver high-quality, compact, dc-dc conversion at an economical price. Applications Size: 61.0 mm x 116.8 mm x 13.5 mm (2.40 in. x 4.60 in. x 0.53 in.) Wide input voltage range High efficiency: 79% typical Parallel operation with load sharing Output voltage set-point adjustment (trim) Thermal protection Synchronization Power good signal Output current monitor Output overvoltage and overcurrent protection Constant frequency Redundant and/or distributed power architectures Case ground pin Telecommunications Input-to-output isolation Data processing Remote sense Remote on/off Short-circuit protection Output overvoltage clamp ISO9001 Certified manufacturing facilities Options Heat sinks available for extended operation Description UL* 60950 Recognized, CSA 22.2 No. 60950-00 Certified, VDE 0805 (IEC60950, 3rd ed.) Licensed CE mark meets 73/23/EEC and 93/68/EEC directives The FW250F1 and FW300F1 Power Modules are dc-dc converters that operate over an input voltage range of 36 Vdc to 75 Vdc and provide a precisely regulated dc output. The outputs are fully isolated from the inputs, allowing versatile polarity configurations and grounding connections. The modules have maximum power ratings from 250 W to 300 W at a typical full-load efficiency of 79%. Two or more modules may be paralleled with forced load sharing for redundant or enhanced power applications. The package, which mounts on a printed-circuit board, accommodates a heat sink for high-temperature applications. * UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on selected products.) FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Data Sheet July 2002 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Input Voltage: Continuous Transient (100 ms) Symbol Min Max Unit VI VI, trans -- -- 80 100 Vdc Vdc I/O Isolation Voltage -- -- 1500 V Operating Case Temperature (See Thermal Considerations section and Figure 24.) TC -40 100 C Storage Temperature Tstg -55 125 C Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Table 1. Input Specifications Parameter Symbol Min Typ Max Unit VI 36 48 75 Vdc II, max II, max -- -- -- -- 10 12 A A Inrush Transient i2t -- -- 2.0 A2s Input Reflected-ripple Current, Peak-to-peak (5 Hz to 20 MHz, 12 H source impedance; see Figure 14.) -- -- 10 -- mAp-p Input Ripple Rejection (120 Hz) -- -- 60 -- dB Operating Input Voltage Maximum Input Current (VI = 0 V to 75 V): FW250F1 FW300F1 Fusing Considerations CAUTION: This power module is not internally fused. An input line fuse must always be used. This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a normal-blow, dc fuse with a maximum rating of 20 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data for further information. 2 Tyco Electronics Corp.. Data Sheet July 2002 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Electrical Specifications (continued) Table 2. Output Specifications Parameter Output Voltage Set Point (VI = 48 V; IO = I O, max; TC = 25 C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life; see Figure 15 and Feature Descriptions.) Output Regulation: Line (VI = 36 V to 75 V) Load (IO = IO, min to IO, max) Temperature (TC = -40 C to +100 C) Output Ripple and Noise Voltage (See Figures 7, 8, and 16.): RMS Peak-to-peak (5 Hz to 20 MHz) Output Current (At IO < IO, min, the modules may exceed output ripple specifications.): FW250F1 FW300F1 Output Current-limit Inception (VO = 90% of VO, set; see Feature Descriptions.) Output Short-circuit Current (VO = 1.0 V; indefinite duration, no hiccup mode; see Figures 3 and 4.) External Load Capacitance (total for one unit or multiple paralleled units): FW250F1 FW300F1 Efficiency (VI = 48 V; I O = IO, max; TC = 25 C; see Figures 5, 6, and 15.): FW250F1 FW300F1 Switching Frequency Dynamic Response (IO/t = 1 A/10s, VI = 48 V, TC = 25 C; tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load; see Figures 9 through 12.): Load Change from IO = 50% to 75% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Load Change from IO = 50% to 25% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Symbol VO, set Min 3.25 Typ 3.3 Max 3.35 Unit Vdc VO 3.20 -- 3.40 Vdc -- -- -- -- -- -- 0.01 0.05 15 0.1 0.2 50 % % mV -- -- -- -- -- -- 40 150 mVrms mVp-p IO IO 0.5 0.5 -- -- 50 60 A A IO, cli 103* -- 130* % IO, max -- -- -- 150 % IO, max -- -- 0 0 -- -- F F -- -- 79 79 -- -- % % -- -- 475 -- kHz -- -- -- -- 2 200 -- -- %VO, set s -- -- -- -- 2 200 -- -- %VO, set s * These are manufacturing test limits. In some situations, results may differ. Please consult your sales representative or the factory. Tyco Electronics Corp.. 3 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Data Sheet July 2002 Electrical Specifications (continued) Table 3. Isolation Specifications Parameter Isolation Capacitance Isolation Resistance Min -- 10 Typ 1700 -- Max -- -- Typ Max Unit pF m General Specifications Parameter Min Calculated MTBF (IO = 80% of IO, max; TC = 40 C) Weight 4 1,700,000 -- -- Unit hours 200 (7) g (oz.) Tyco Electronics Corp.. Data Sheet July 2002 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for further information. Parameter Remote On/Off Signal Interface (VI = 0 V to 75 V; open collector or equivalent compatible; signal referenced to VI (-) terminal; see Figure 17 and Feature Descriptions.): Logic Low--Module On Logic High--Module Off Logic Low: At Ion/off = 1.0 mA At Von/off = 0.0 V Logic High: At Ion/off = 0.0 A Leakage Current Turn-on Time (IO = 80% of IO, max; VO within 1% of steady state) Output Voltage Overshoot Output Voltage Adjustment (See Feature Descriptions.): Output Voltage Remote-sense Range Output Voltage Set-point Adjustment Range (trim) Output Overvoltage Protection (shutdown) Symbol Min Typ Max Unit Von/off Ion/off 0 -- -- -- 1.2 1.0 V mA Von/off Ion/off -- -- -- -- -- -- 30 15 50 50 V A ms -- -- 0 5 %VO, set -- -- -- 60 -- -- 0.5 115 V %VO, nom -- 4.0 -- 5.0 V IO, mon -- 0.065 -- V/A Synchronization: Clock Amplitude Clock Pulse Width Fan-out Capture Frequency Range -- -- -- -- 4.00 0.4 -- 425 -- -- -- -- 5.00 -- 1 575 V s -- kHz Overtemperature Shutdown (See Figure 24.) TC -- 105 -- C Forced Load Sharing -- -- 10 -- %IO, rated Rpwr/good Ipwr/good Rpwr/good Vpwr/good -- -- 1 -- -- -- -- -- 100 1 -- 40 mA m V Output Current Monitor (IO = IO, max, TC = 70 C) Power Good Signal Interface (See Feature Descriptions.): Low Impedance--Module Operating High Impedance--Module Off * These are manufacturing test limits. In some situations, results may differ. Tyco Electronics Corp.. 5 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Data Sheet July 2002 Characteristic Curves The following figures provide typical characteristics for the power modules. 3. 5 7 OUTP UT VO LTAGE, V O (V ) INPUT CU RRENT, II (A) 6 IO = 50 A 5 4 IO = 25 A 3 2 IO = 5 A 1 0 0 10 20 30 40 50 60 70 3. 0 2. 5 2. 0 1. 5 1. 0 V I = 75 V V I = 36 V V I = 48 V 0. 5 0. 0 80 0 10 20 INPUT VOLTAGE, V I (V) 30 40 50 60 OU TPUT CURRENT, IO (A) 8-2222 (C) Figure 3. Typical FW250F1 Output Characteristics at Room Temperature 8 3.5 7 3.0 I O = 60 A 5 4 I O = 30 A 3 2 IO = 6 A 1 2.5 2.0 1.5 V I = 48 V 1.0 V I = 36 V V I = 75 V 0.5 0.0 0 25 30 35 40 45 50 55 60 65 70 75 0 10 20 30 40 50 60 70 80 OUTPUT CURRE NT, IO (A) INPUT VOL TAGE , V I (V) 8-2223 (C) Figure 2. Typical FW300F1 Input Characteristics at Room Temperature 6 8-2224 (C) OUTPU T VOLTAGE, V O (V) INPUT CURRENT, II (A) Figure 1. Typical FW250F1 Input Characteristics at Room Temperature 6 70 8-2225 (C) Figure 4. Typical FW300F1 Output Characteristics at Room Temperature Tyco Electronics Corp.. Data Sheet July 2002 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Characteristic Curves (continued) 82 OUTPUT VOLTAGE, V O (V) (20 mV/div) VI = 3 6 V EFFI CIE NCY, (%) 80 78 V I = 48 V 76 V I = 75 V 74 72 70 5 10 15 20 25 30 35 40 45 50 OUTPUT CURRENT, IO (A ) 8-2226 (C) TIME, t (500 ns/div) 8-2227 (C) Figure 5. Typical FW250F1 Efficiency vs. Output Current at Room Temperature Figure 7. Typical FW250F1 Output Ripple Voltage at Room Temperature, 48 V Input, and 50 A Output 81 80 78 VI = 36 V V I = 36 V V I = 54 V V I = 72 V 77 76 75 74 73 72 0 10 20 30 40 50 60 OUTPUT CU RRENT, IO (A) 8-1734 (C) OUTPUT VOLTAGE, VO (V) (10 mV/div) EFFICIENCY, (% ) 79 VI = 48 V VI = 72 V Figure 6. Typical FW300F1 Efficiency vs. Output Current at Room Temperature TIME, t (500 ns/div) 8-1735 (C) Figure 8. Typical FW300F1 Output Ripple Voltage at Room Temperature and 60 A Output Tyco Electronics Corp.. 7 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Data Sheet July 2002 OUTPUT CURRENT, I O (A) OUTPUT VOLTAGE, VO (V) (10 A/div) (200 mV/div) OUTPUT CURRENT, I O (A) OUTPUT VOLTAGE, VO (V) (10 A/div) (500 mV/div) Characteristic Curves (continued) 25 A 12.5 A 30 A 15 A TIME, t (200 s/div) TIME, t (500 s/div) 8-2230 (C) 8-2228 (C) Figure 9. Typical FW250F1 Transient Response to Step Decrease in Load from 50% to 25% of Full Load at Room Temperature and 48 V Input (Waveform Averaged to Eliminate Ripple Component.) Figure 11. Typical FW300F1 Transient Response to Step Decrease in Load from 50% to 25% of Full Load at Room Temperature and 48 V Input (Waveform Averaged to Eliminate Ripple Component.) OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (10 mV/div) (200 mV/div) Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. OUTPUT CURRENT, I O (A) OUTPUT VOLTAGE, V O (V) (10 A/div) (500 mV/div) Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. 37 A 25 A TIME, t (500 s/div) 30 A TIME, t (200 s/div) 8-2229 (C) Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. Figure 10. Typical FW250F1 Transient Response to Step Increase in Load from 50% to 75% of Full Load at Room Temperature and 48 V Input (Waveform Averaged to Eliminate Ripple Component.) 8 45 A 8-2231 (C) Note: Tested with a 10 F aluminum and a 1.0 F ceramic capacitor across the load. Figure 12. Typical FW300F1 Transient Response to Step Increase in Load from 50% to 75% of Full Load at Room Temperature and 48 V Input (Waveform Averaged to Eliminate Ripple Component.) Tyco Electronics Corp.. Data Sheet July 2002 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Characteristic Curves (continued) OUTPUT VOLTAGE, VO (V) REMOTE ON/OFF, VON/OFF (V) (1 V/div) SENSE(+) SENSE(-) V I(+) SUPPLY V O(+) IO II V I() LOAD V O(-) CONTACT RESISTANCE CONTACT AND DISTRIBUTION LOSSES 8-683 (C).f Note: All measurements are taken at the module terminals. When socketing, place Kelvin connections at module terminals to avoid measurement errors due to socket contact resistance. = [ V O ( + ) - V O ( - ) ]I O ------------------------------------------------ [ V I ( + ) - V I ( - ) ]I I x 100 % Figure 15. Output Voltage and Efficiency Measurement Test Setup TIME, t (5 ms/div) COPPER STRIP 8-1736 (C) Note: Tested with a 4000 F aluminum and a 1.0 F ceramic capacitor across the load. V O (+ ) 1.0 F Figure 13. Typical FW300F1 Start-Up Transient at Room Temperature, 48 V Input, and Full Load 10.0 F SCOPE RESISTIVE LOAD V O (- ) 8-513 (C).m Note: Use a 0.1 F ceramic capacitor and a 10 F aluminum or tantalum capacitor. Scope measurement should be made using a BNC socket. Position the load between 50 mm and 76 mm (2 in. and 3 in.) from the module. Test Configurations TO OSCILLOSCOPE Figure 16. Peak-to-Peak Output Noise Measurement Test Setup LTEST VI(+) 12 H BATTERY Cs 220 F ESR < 0.1 @ 20 C, 100 kHz Design Considerations 100 F ESR < 0.3 @ 100 kHz Input Source Impedance VI(-) 8-203 Note: Measure input reflected-ripple current with a simulated source inductance (LTEST) of 12 H. Capacitor CS offsets possible battery impedance. Measure current as shown above. Figure 14. Input Reflected-Ripple Test Setup Tyco Electronics Corp.. The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the power module. For the test configuration in Figure 14, a 100 F electrolytic capacitor (ESR < 0.3 at 100 kHz) mounted close to the power module helps ensure stability of the unit. For other highly inductive source impedances, consult the factory for further application guidelines. 9 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Safety Considerations Feature Descriptions For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL1950, CSA C22.2 No. 950-95, and VDE 0805 (IEC60950, 3rd edition). Overcurrent Protection If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75 Vdc), for the module's output to be considered meeting the requirements of safety extra-low voltage (SELV), all of the following must be true: The input source is to be provided with reinforced insulation from any hazardous voltages, including the ac mains; and One VI pin and one VO pin are to be grounded or both the input and output pins are to be kept floating; and The input pins of the module are not operator accessible; and Another SELV reliability test is conducted on the whole system, as required by the safety agencies, on the combination of supply source and the subject module to verify that under a single fault, hazardous voltages do not appear at the module's output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pin and ground. To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting for an unlimited duration. At the point of current-limit inception, the unit shifts from voltage control to current control. If the output voltage is pulled very low during a severe fault, the current-limit circuit can exhibit either foldback or tailout characteristics (output-current decrease or increase). The unit operates normally once the output current is brought back into its specified range. Remote On/Off To turn the power module on and off, the user must supply a switch to control the voltage between the on/off terminal and the VI(-) terminal (Von/off). The switch can be an open collector or equivalent (see Figure 17). A logic low is Von/off = 0 V to 1.2 V, during which the module is on. The maximum Ion/off during a logic low is 1 mA. The switch should maintain a logic-low voltage while sinking 1 mA. During a logic high, the maximum Von/off generated by the power module is 15 V. The maximum allowable leakage current of the switch at Von/off = 15 V is 50 A. If not using the remote on/off feature, short the ON/OFF pin to VI(-). The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a maximum 20 A normal-blow fuse in the ungrounded lead. Data Sheet July 2002 SENSE(+) CASE SENSE(-) VO(+) Ion/off ON/OFF + Von/off - VI(+) VO(-) VI(-) 8-580 Figure 17. Remote On/Off Implementation 10 Tyco Electronics Corp.. Data Sheet July 2002 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Feature Descriptions (continued) The test results for this configuration are displayed in Figure 20. This figure applies to all output voltages. Remote Sense With an external resistor connected between the TRIM and SENSE(+) pins (Radj-up), the output voltage set point (VO, adj) increases (see Figure 21). Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections. The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table, i.e.: [VO(+) - VO(-)] - [SENSE(+) - SENSE(-)] 0.5 V The voltage between the VO(+) and VO(-) terminals must not exceed the minimum value indicated in the output overvoltage shutdown section of the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim), see Figure 18. If not using the remote-sense feature to regulate the output at the point of load, connect SENSE(+) to VO(+) and SENSE(-) to VO(-) at the module. The following equation determines the required external-resistor value to obtain a percentage output voltage change of %. % ( V O, nom ( 1 + ---------- ) - 1.225 ) 100 R adj-up = ------------------------------------------------------------------------- 205 - 2.255 k ( 1.225% ) The test results for this configuration are displayed in Figure 22. The voltage between the VO(+) and VO(-) terminals must not exceed the minimum value of the output overvoltage protection as indicated in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim). See Figure 18. If not using the trim feature, leave the TRIM pin open. SENSE(+) SENSE(-) VI(-) SUPPLY VI(+) VO(-) IO II VI(+) ON/OFF SENSE(+) LOAD VO(+) CONTACT RESISTANCE VO(+) CASE CONTACT AND DISTRIBUTION LOSSES 8-651 Figure 18. Effective Circuit Configuration for Single-Module Remote-Sense Operation Output Voltage Set-Point Adjustment (Trim) RLOAD TRIM Radj-down VI(-) SENSE(-) VO(-) 8-748 (C).b Figure 19. Circuit Configuration to Decrease Output Voltage Output voltage trim allows the user to increase or decrease the output voltage set point of a module. This is accomplished by connecting an external resistor between the TRIM pin and either the SENSE(+) or SENSE(-) pins. With an external resistor between the TRIM and SENSE(-) pins (Radj-down), the output voltage set point (VO, adj) decreases (see Figure 19). The following equation determines the required external-resistor value to obtain a percentage output voltage change of %. 205 R adj-down = ---------- - 2.255 % Tyco Electronics Corp.. k 11 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Data Sheet July 2002 ADJUSTMENT RESISTOR VALUE ( ) Feature Descriptions (continued) ADJUSTMENT RESISTOR VALUE () Output Voltage Set-Point Adjustment (Trim) (continued) 1M 100k 10M 1M 100k 10k 0 10k 2 4 6 8 10 PERCENT CHANGE IN OUTPUT VOLTAGE ( % ) 8-1172 (C).f 1k 0 10 20 30 40 PERCENT CHANGE IN OUTPUT VOLTAGE (%) 8-1171 (C).g Figure 20. Resistor Selection for Decreased Output Voltage VI (+) ON/OFF VO (+) Figure 22. Resistor Selection for Increased Output Voltage Output Overvoltage Protection The output voltage is monitored at the VO(+) and VO(-) pins of the module. If the voltage at these pins exceeds the value indicated in the Feature Specifications table, the module will shut down and latch off. Recovery from latched shutdown is accomplished by cycling the dc input power off for at least 1.0 s or toggling the primary referenced on/off signal for at least 1.0 s. SENSE(+) R adj-up CASE VI (-) TRIM R LOAD SENSE(-) V O(-) 8-715 (C).b Figure 21. Circuit Configuration to Increase Output Voltage 12 Output Current Monitor The CURRENT MON pin provides a dc voltage proportional to the dc output current of the module given in the Feature Specifications table. For example, on the FW250F1, the V/A ratio is set at 65 mV/A 10% @ 70 C case. At a full load current of 50 A, the voltage on the CURRENT MON pin is 3.25 V. The current monitor signal is referenced to the SENSE(-) pin on the secondary and is supplied from a source impedance of approximately 2 k. It is recommended that the CURRENT MON pin be left open when not in use, although no damage will result if the CURRENT MON pin is shorted to secondary ground. Directly driving the CURRENT MON pin with an external source will detrimentally affect operation of the module and should be avoided. Tyco Electronics Corp.. Data Sheet July 2002 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Feature Descriptions (continued) Overtemperature Shutdown Synchronization To provide protection in a fault condition, the unit is equipped with an overtemperature shutdown circuit. The shutdown circuit will not engage unless the unit is operated above the maximum case temperature. Recovery from overtemperature shutdown is accomplished by cycling the dc input power off for at least 1.0 s or toggling the primary referenced on/off signal for at least 1.0 s. Any module can be synchronized to any other module or to an external clock using the SYNC IN or SYNC OUT pins. The modules are not designed to operate in a master/slave configuration; that is, if one module fails, the other modules will continue to operate. SYNC IN Pin This pin can be connected either to an external clock or directly to the SYNC OUT pin of another FW250x or FW300x module. If an external clock signal is applied to the SYNC IN pin, the signal must be a 500 kHz (50 kHz) square wave with a 4 Vp-p amplitude. Operation outside this frequency band will detrimentally affect the performance of the module and must be avoided. If the SYNC IN pin is connected to the SYNC OUT pin of another module, the connection should be as direct as possible, and the VI(-) pins of the modules must be shorted together. Unused SYNC IN pins should be tied to VI(-). If the SYNC IN pin is unused, the module will operate from its own internal clock. Forced Load Sharing (Parallel Operation) For either redundant operation or additional power requirements, the power modules can be configured for parallel operation with forced load sharing (see Figure 23). For a typical redundant configuration, Schottky diodes or an equivalent should be used to protect against short-circuit conditions. Because of the remote sense, the forward-voltage drops across the Schottky diodes do not affect the set point of the voltage applied to the load. For additional power requirements, where multiple units are used to develop combined power in excess of the rated maximum, the Schottky diodes are not needed. Good layout techniques should be observed for noise immunity. To implement forced load sharing, the following connections must be made: SYNC OUT Pin This pin contains a clock signal referenced to the VI(-) pin. The frequency of this signal will equal either the module's internal clock frequency or the frequency established by an external clock applied to the SYNC IN pin. The parallel pins of all units must be connected together. The paths of these connections should be as direct as possible. All remote-sense pins should be connected to the power bus at the same point, i.e., connect all SENSE(+) pins to the (+) side of the power bus at the same point and all SENSE(-) pins to the (-) side of the power bus at the same point. Close proximity and directness are necessary for good noise immunity. When synchronizing several modules together, the modules can be connected in a daisy-chain fashion where the SYNC OUT pin of one module is connected to the SYNC IN pin of another module. Each module in the chain will synchronize to the frequency of the first module in the chain. To avoid loading effects, ensure that the SYNC OUT pin of any one module is connected to the SYNC IN pin of only one module. Any number of modules can be synchronized in this daisy-chain fashion. Tyco Electronics Corp.. 13 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Data Sheet July 2002 Feature Descriptions (continued) Thermal Considerations Forced Load Sharing (Parallel Operation) Introduction (continued) The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat-dissipating components inside the unit are thermally coupled to the case. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring the case temperature. Peak temperature occurs at the position indicated in Figure 24. When not using the parallel feature, leave the PARALLEL pin open. PARALLEL SENSE(+) SENSE(-) CASE ON/OFF VI(+) VI(-) V O(+) VO (-) V I(+) ON/OFF VI(+) VI(-) VO(+) V I(-) ON/OFF PARALLEL SENSE(+) SENSE(-) CASE MEASURE CASE TEMPER ATURE HERE SYNC IN 30.5 (1.20) VO (-) SYNC OUT CASE V O(+) VO (-) 82.6 (3.25) 8-581 (C) Figure 23. Wiring Configuration for Redundant Parallel Operation Power Good Signal The PWR GOOD pin provides an open-drain signal (referenced to the SENSE(-) pin) that indicates the operating state of the module. A low impedance (<100 ) between PWR GOOD and SENSE(-) indicates that the module is operating. A high impedance (>1 M) between PWR GOOD and SENSE(-) indicates that the module is off or has failed. The PWR GOOD pin can be pulled up through a resistor to an external voltage to facilitate sensing. This external voltage level must not exceed 40 V, and the current into the PWR GOOD pin during the low-impedance state should be limited to 1 mA maximum. 14 8-1303 (C).a Note: Top view, measurements shown in millimeters and (inches). Pin locations are for reference only. Figure 24. Case Temperature Measurement Location The temperature at this location should not exceed 100 C. The maximum case temperature can be limited to a lower value for extremely high reliability. The output power of the module should not exceed the rated power for the module as listed in the Ordering Information table. For additional information about these modules, refer to the Thermal Management for FC- and FW-Series 250 W--300 W Board-Mounted Power Modules Technical Note (TN96-009EPS). Tyco Electronics Corp.. FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Data Sheet July 2002 Thermal Considerations (continued) Heat Transfer with Heat Sinks Heat Transfer Without Heat Sinks The power modules have through-threaded, M3 x 0.5 mounting holes, which enable heat sinks or cold plates to be attached to the module. The mounting torque must not exceed 0.56 N-m (5 in.-lb.). For the screw attachment from the pin side, the recommended hole size on the customer's PWB around the mounting holes is 0.130 0.005 inches. If a larger hole is used, the mounting torque from the pin side must not exceed 0.25 N-m (2.2 in.-lbs.). Derating curves for forced-air cooling without a heat sink are shown in Figures 25 and 26. These curves can be used to determine the appropriate airflow for a given set of operating conditions. For example, if the unit with airflow along its length dissipates 20 W of heat, the correct airflow in a 40 C environment is 1.0 m/s (200 ft./min.). POW ER DISSIPAT ION, P D (W) 70 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 60 50 40 m/s m/s m/s m/s m/s m/s m/s m/s (800 (700 (600 (500 (400 (300 (200 (100 ft./ min.) ft./ min.) ft./ min.) ft./ min.) ft./ min.) ft./ min.) ft./ min.) ft./ min.) Thermal derating with heat sinks is expressed by using the overall thermal resistance of the module. Total module thermal resistance (ca) is defined as the maximum case temperature rise (TC, max) divided by the module power dissipation (PD): ( T C - TA ) C, max --------------------- = ----------------------- ca = T PD PD 30 20 10 0. 1 m/ s (20 ft./min.) NA T. CONV. 0 0 10 20 30 40 50 60 70 80 90 1 00 The location to measure case temperature (TC) is shown in Figure 24. Case-to-ambient thermal resistance vs. airflow for various heat sink configurations is shown in Figure 27 and Figure 28. These curves were obtained by experimental testing of heat sinks, which are offered in the product catalog. LOCAL AMBIENT T EMPERAT URE, TA (C) 4.5 Figure 25. Convection Power Derating with No Heat Sink; Airflow Along Width (Transverse) POW ER DISSIPAT ION, P D (W) 70 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 60 50 40 30 m/s (800 m/s (700 m/s (600 m/s (500 m/s (400 m/s (300 m/s (200 m/s (100 ft./min .) ft./min .) ft./min .) ft./min .) ft./min .) ft./min .) ft./min .) ft./min .) CASE-TO-AMBIENT THERMAL RESISTANCE, RCA (C/W) 8-1315 (C) 1 1/2 IN. HEAT SINK 1 IN. HEAT SINK 1/2 IN. HEAT SINK 1/4 IN. HEAT SINK NO HEAT SINK 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 0.5 (100) 1.0 (200) 1.5 (300) 2.0 (400) 2.5 (500) 3.0 (600) AIR VELOCITY, m/s (ft./min.) 8-1321 (C) 20 Figure 27. Case-to-Ambient Thermal Resistance Curves; Transverse Orientation 10 0.1 m/s (20 ft. /min.) NAT . CO NV. 0 0 10 20 30 40 50 60 70 80 90 1 00 LOCAL AMBIENT T EMPERATURE, TA (C) 8-1314 (C) Figure 26. Convection Power Derating with No Heat Sink; Airflow Along Length (Longitudinal) Tyco Electronics Corp.. 15 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Thermal Considerations (continued) CASE-TO-AMBIENT THERMAL RESISTANCE, RCA (C/W) 4.5 1 1/2 IN. HEAT SINK 1 IN. HEAT SINK 1/2 IN. HEAT SINK 1/4 IN. HEAT SINK NO HEAT SINK 3.5 3.0 2.5 2.0 PO WER DISSIPATION, PD (W) 60 Heat Transfer with Heat Sinks (continued) 4.0 Data Sheet July 2002 50 40 30 20 VI = 72 V VI = 54 V VI = 36 V 10 0 0 1.5 10 20 30 40 50 60 O UTPUT CURRENT, IO (A) 1.0 8-1737 (C) 0.5 0.0 0 0.5 (100) 1.0 (200) 1.5 (300) 2.0 (400) 2.5 (500) 3.0 (600) Figure 29. FW250F1 and FW300F1 Power Dissipation vs. Output Current AIR VELOCITY, m/s (ft./min.) 8-1320 (C) Figure 28. Case-to-Ambient Thermal Resistance Curves; Longitudinal Orientation These measured resistances are from heat transfer from the sides and bottom of the module as well as the top side with the attached heat sink; therefore, the case-to-ambient thermal resistances shown are generally lower than the resistance of the heat sink by itself. The module used to collect the data in Figures 27 and 28 had a thermal-conductive dry pad between the case and the heat sink to minimize contact resistance. To choose a heat sink, determine the power dissipated as heat by the unit for the particular application. Figure 29 shows typical heat dissipation for a range of output currents and three voltages for the FW250F1 and FW300F1. 16 Example If an 85 C case temperature is desired, what is the minimum airflow necessary? Assume the FW300F1 module is operating at nominal line and an output current of 50 A, maximum ambient air temperature of 40 C, and the heat sink is 0.5 inch. Solution Given: VI = 54 V IO = 50 A TA = 40 C TC = 85 C Heat sink = 0.5 inch. Determine PD by using Figure 29: PD = 42 W Tyco Electronics Corp.. Data Sheet July 2002 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Thermal Considerations (continued) Solder, Cleaning, and Drying Considerations Heat Transfer with Heat Sinks (continued) Post solder cleaning is usually the final circuit-board assembly process prior to electrical testing. The result of inadequate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures, refer to the Board-Mounted Power Modules Soldering and Cleaning Application Note (AP97-021EPS). Then solve the following equation: TC - TA) ca = (----------------------PD 85 - 40 ) ca = (----------------------42 ca = 1.07 C/W Use Figures 27 and 28 to determine air velocity for the 0.5 inch heat sink. The minimum airflow necessary for the FW250F1 module depends on heat sink fin orientation and is shown below: 2.0 m/s (400 ft./min.) (oriented along width) 3.0 m/s (600 ft./min.) (oriented along length) A more detailed model can be used to determine the required thermal resistance of a heat sink to provide necessary cooling. The total module resistance can be separated into a resistance from case-to-sink (cs) and sink-to-ambient (sa) as shown in Figure 30. TC TS cs For assistance with designing for EMC compliance, please refer to the FLTR100V10 data sheet (DS98-152EPS). Layout Considerations Custom Heat Sinks PD EMC Considerations Copper paths must not be routed beneath the power module standoffs. For additional layout guidelines, refer to the FLTR100V10 data sheet (DS98-152EPS). TA sa 8-1304 (C) Figure 30. Resistance from Case-to-Sink and Sinkto-Ambient For a managed interface using thermal grease or foils, a value of cs = 0.1 C/W to 0.3 C/W is typical. The solution for heat sink resistance is: (TC - TA) sa = ------------------------- - cs PD This equation assumes that all dissipated power must be shed by the heat sink. Depending on the userdefined application environment, a more accurate model, including heat transfer from the sides and bottom of the module, can be used. This equation provides a conservative estimate for such instances. Tyco Electronics Corp.. 17 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Data Sheet July 2002 Outline Diagram Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.), x.xx mm 0.25 mm (x.xxx in. 0.010 in.) Top View 116.8 (4.60) 61.0 (2.40) Side View S IDE LABE L* 13.5 (0.53) 1.57 0.05 (0.06 2 0.002) DIA SOLDER- PLA TED BRAS S, 11 PLACES, (VOUT, VOU T+, VIN, VIN+) 5.1 (0.20) MIN 1.02 0.05 (0.040 0.002) DIA S OLDER -P LATED BRASS , 9 PLA CES Bottom View MOUNTING INSERTS M3 x 0.5 THROUGH, 4 PLA CES 66.04 ( 2.600 ) 2 .54 (0. 100) TYP 12 .7 (0.5 0) 7 .62 (0.300) 30 .48 (1.200) 50.8 (2.00) CA SE SY NC OUT SY NC IN O N/OFF VI 2.54 (0.100) TY P SENSE SENSE+ TRIM PARALLEL CURRENT MON PWR GOOD 12.7 0 17.78 (0.50 0) (0.700 ) 22.86 (0.900) 5.1 (0.20) VO VO + 10.16 (0.400 ) 15.24 30.48 (0.600) 5.08 20.3 2 ( 1.200) (0.200 ) (0.80 0) 2 5.4 0 (1 .00 0) 35.56 (1.400 ) VI + 5.1 (0.20) 106.68 (4.2 00) 8-1650 (C) * Side label includes Tyco name, product designation, safety agency markings, input/output voltage and current ratings, and bar code. 18 Tyco Electronics Corp.. Data Sheet July 2002 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Recommended Hole Pattern Component-side footprint. Dimensions are in millimeters and (inches). MOU NTING IN SE RTS 66.04 (2 .60 0) 2 .54 (0.100) TYP 7.62 (0.300) 7.62 (0.300) 5.1 (0.20) 7.62 12 .7 (0.3 00) (0.50) 20 .32 30.48 (1.200) (0.8 00) 10.16 (0.400) 5.08 (0.200) 25 .40 35.56 (1.0 00) (1.400) VO PWR GOOD CURRENT MON PARALLEL TRIM SENSE+ SENSE 15.24 (0.600) 2.54 (0.100) TY P CA SE SYNC O UT SYNC IN ON/O FF VI 12.70 (0.500)17 .78 ( 0.700) 22.86 ( 0.9 00) 30 .48 (1.2 00) VO + VI + 50.8 (2.00) 5.1 (0.20) 10 6.68 (4.200) 8-1650 (C) Ordering Information Input Voltage Output Voltage Output Power Device Code Comcode 48 V 3.3 V 165 W FW250F1 107859886 48 V 3.3 V 198 W FW300F1 107253163 Tyco Electronics Corp.. 19 FW250F1 and FW300F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W Data Sheet July 2002 Ordering Information (continued) Table 4. Device Accessories Accessory Comcode 1/4 in. transverse kit (heat sink, thermal pad, and screws) 1/4 in. longitudinal kit (heat sink, thermal pad, and screws) 1/2 in. transverse kit (heat sink, thermal pad, and screws) 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 1 in. transverse kit (heat sink, thermal pad, and screws) 1 in. longitudinal kit (heat sink, thermal pad, and screws) 1 1/2 in. transverse kit (heat sink, thermal pad, and screws) 1 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 847308335 847308327 847308350 847308343 847308376 847308368 847308392 847308384 1/4 IN. 1/4 IN. 1/2 IN. 59.94 (2.36) 115.82 (4.56) 1 IN. 1/2 IN. 1 IN. 115.82 (4.56) 1 1/2 IN. 1 1/2 IN. 8-2831 60.45 (2.38) 8-2830 Figure 32. Transverse Heat Sink Figure 31. Longitudinal Heat Sink Europe, Middle-East and Africa Headquarters Tyco Electronics (UK) Ltd Tel: +44 (0) 1344 469 300, Fax: +44 (0) 1344 469 301 World Wide Headquarters Tyco Electronics Power Systems, Inc. 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 FAX: +1-888-315-5182 (Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900) www.power.tycoelectronics.com e-mail: techsupport1@tycoelectronics.com Central America-Latin America Headquarters Tyco Electronics Power Systems Tel: +54 11 4316 2866, Fax: +54 11 4312 9508 Asia-Pacific Headquarters Tyco Electronics Singapore Pte Ltd Tel: +65 482 0311, Fax: 65 480 9299 Tyco Electronics Corporation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. (c) 2001 Tyco Electronics Power Systems, Inc. (Mesquite, Texas) All International Rights Reserved. Printed in U.S.A. July 2002 FDS02-042EPS (Replaces DS97-519EPS) Printed on Recycled Paper