Data Sheet
July 2002
FW250F1 and FW300F1 Power Modules:
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Outpu t; 165 W to 198 W
The FW250F1 and FW300F1 Power Modules use advanced,
surface-mount technology and deliver high-quality, compact,
d c-dc conver si o n at an ec on o mi ca l p rice.
Applications
■Redundant and/or distributed power architectures
■Telecommunications
■Data process ing
Options
■Heat sinks available for exten ded operation
Features
■Size: 61.0 mm x 116.8 mm x 13.5 mm
(2.40 in. x 4.60 in. x 0.53 in.)
■W ide input vol tag e range
■High efficiency: 79% typical
■Parallel operation with load s har ing
■Outp ut volt age set-point adjustm ent (trim)
■Therm al protection
■Synchronization
■Power good signal
■Outp ut current monitor
■Output overvoltage and overc urrent protection
■Constant frequency
■Case ground pin
■Input-to-ou tput isolation
■Remote sense
■Remote on/off
■Short-circuit protection
■Outp ut over voltage clamp
■ISO9001 Certified manufacturing f acilities
■
UL*
60950 Rec ognized,
CSA
† 22.2 No. 60950-00
Certif ied, VDE 0805 (IEC60950, 3rd ed.) Licensed
■CE m ark m eets 73 /23/ E EC and 93/ 68/EEC
directives‡
Description
The FW2 50F1 and FW300F 1 Power Modules are dc-dc convert ers that operate over an input voltage range of
36 Vdc to 75 Vdc and provide a precisely regulated dc output. Th e outputs are fully isolated from the inputs,
allowing versa tile polar ity configurations and grounding connections. The modules have maxi mum power rat-
ings from 250 W to 300 W at a typical full-load efficiency of 79%.
Two or more modules may be paralleled with forced load sharing f or redundant or enhanced power applications.
The package, which mounts on a printed-circui t board, accommodat es a heat sink for high-tempe rature
applications.
*
UL
is a registered trademark of Under writers Laboratories, Inc.
†
CSA
is a registere d trademark of Canadian Standards Association.
‡This product is intended for integration into end-u s e equipment. Al l the required procedures for CE marking of end-use equi pment should
be followed. (The CE mark is placed on selected products.)
2Tyco Electronics Corp..
Data Sheet
July 2002
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the devi ce is not implied at these or any other conditions in excess
of those given in the operations section s of the data s hee t. Exposure to absolute maximu m ratings for extend ed
period s can ad versely af fect device r e liabilit y.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resist ive load, and temperature
conditions.
Table 1. Input Specifications
Fusing Consideration s
CAUTION: This power module is not internally fused. An inp ut line fuse must a lways be used.
This encapsulate d power m odul e can be used in a wide varie ty of applications, ranging from simple stand-alone
operation to an integrated part of a sophisticated power archi tecture. To preser ve maximum flexibility, int ernal fus-
ing is not included; how ever, to achieve maximum safety and system protection, alwa ys use an input line fuse. The
safety agencies require a normal-bl ow, dc f use with a maximum r ating of 20 A (see Safety Considerations section).
Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same
type of fuse with a lower ra ting can be used. Refer to the fuse manufacturer’s data for further infor ma tion.
Parameter Symbol Min Max Unit
Inpu t Vo l tag e :
Continuous
Transient (100 ms) VI
VI, trans —
—80
100 Vdc
Vdc
I/O Isolation Voltage — — 1500 V
Operating Case Temperatu re
(See The rm al Considerations section and
Figure 24.)
TC–40 100 °C
Storage Temperature Tstg –55 125 °C
Parameter Symbol Min Typ Max Unit
Operating Input Voltage VI36 48 75 Vdc
Maximum Input Current (VI = 0 V to 75 V):
FW250F1
FW300F1 II, max
II, max —
——
—10
12 A
A
Inrush Trans ient i2t——2.0A
2s
Input Reflected-ripple Current, Peak-to-peak
(5 Hz to 20 MHz, 12 µH source impedance;
see Figure 14.)
——10—mAp-p
Input Ripple Rejection (120 Hz) — — 60 — dB
Tyco Electronics Corp.. 3
Data Sheet
July 2002 dc- dc Converter s; 36 to 75 Vdc Inpu t, 3.3 Vd c Out put ; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Electrical Specifications (continued)
Table 2. Output Specifications
* These are manufacturing test limits. In some situations, results may differ.
† Please consult your sales repres entative or the factory.
Parameter Symbol Min Typ Max Unit
Output Voltage Set Point
(VI = 48 V; IO = IO, max; TC = 25 °C) VO, set 3.25 3.3 3.35 Vdc
Output Voltage
(Over all operating input voltage, resistive load, and
temperature condit ions until end of lif e; see Figure 15
and Feature D escr i ptions.)
VO3.20 — 3.40 Vdc
Output Regulation:
Line (VI = 36 V to 75 V)
Load (IO = IO, min to IO, max)
Temperature (TC = –40 °C to +100 °C)
—
—
—
—
—
—
0.01
0.05
15
0.1
0.2
50
%
%
mV
Output Ripple and Noise Voltage
(See Figures 7, 8, and 16.):
RMS
Peak-to-peak (5 Hz to 20 MHz) —
——
——
—40
150 mVrms
mVp-p
Output Current
(At IO < IO, min, the modules ma y e xceed output ripple
specifications.):
FW250F1
FW300F1 IO
IO0.5
0.5 —
—50
60 A
A
Output Current-limit Inception
(VO = 90% of VO, set; see F eature Descriptions.) IO, cli 103* — 130* % IO, max
Output Short-circuit Current
(VO = 1.0 V; indefinite duration, no hiccup mode; see
Figures 3 and 4.)
———150% I
O, max
External Load Capacitance (total for one unit or
multiple paralleled units):
FW250F1
FW300F1 —
—0
0—
—†
†µF
µF
Efficiency (VI = 48 V; IO = IO, max; TC = 25 °C;
see Figures 5, 6, and 15.):
FW250F1
FW300F1 η
η—
—79
79 —
—%
%
Switching Frequency — — 475 — kHz
Dynamic Response
(∆IO/∆t = 1 A/10µs, VI = 48 V, TC = 25 °C; tested w ith
a 10 µF aluminum and a 1.0 µF ceramic capacitor
across the load; see Figures 9 through 12.):
Load Change from IO = 50% to 75% of IO, max:
Peak Deviation
Settling Time (VO < 10% of peak deviation)
Load Change from IO = 50% to 25% of IO, max:
Peak Deviation
Settling Time (VO < 10% of peak deviation)
—
—
—
—
—
—
—
—
2
200
2
200
—
—
—
—
%VO, set
µs
%VO, set
µs
4Tyco Electronics Corp..
Data Sheet
July 2002
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Electrical Specifications (continued)
Table 3. Isolation Specifications
General Specifications
Parameter Min Typ Max Unit
Isolation Capacitance — 1700 — pF
Isolation Resistance 10 — — m Ω
Parameter Min Typ Max Unit
Calculated MTBF (IO = 80% of IO, max; TC = 40 °C) 1,700,000 hours
We i ght — — 200 (7) g (oz.)
Tyco Electronics Corp.. 5
Data Sheet
July 2002 dc- dc Converter s; 36 to 75 Vdc Inpu t, 3.3 Vd c Out put ; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Feature Specifications
Unless otherwise indicated, spe cifications apply over all operating input voltage, resistive load, and temperature
conditions. See F eature Descriptions for further informati on.
Parameter Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VI = 0 V to 75 V ; open collector or equivalent
compatible; signal referenced to VI(–) terminal; see
Figure 17 and Feature Descriptions.):
Logic Low—Module On
Logic High—M odul e Off
Logic Low:
At Ion/off = 1.0 mA
At Von/off = 0. 0 V
Logic High:
At Ion/off = 0.0 µA
Leakage Current
Turn-on Time
(IO = 80% of IO, max; VO within ±1% of steady state)
Output Voltage Overshoot
Von/off
Ion/off
Von/off
Ion/off
—
—
0
—
—
—
—
—
—
—
—
—
30
0
1.2
1.0
15
50
50
5
V
mA
V
µA
ms
%VO, s et
Output Voltage A djustme nt (See Feature Descr iptions.):
Output Voltage Rem ote-se nse Range
Output Voltage Set-point Adjustment Range (trim) —
——
60 —
—0.5
115 V
%VO, nom
Output Over voltage Protection (shutdown) — 4.0 — 5.0 V
Output Current Monitor (IO = I O, max, TC = 70 °C) IO, mon — 0.065 — V/A
Synchronization:
Clock Ampl itude
Clock Pulse Width
Fan-out
Capture Frequ ency Range
—
—
—
—
4.00
0.4
—
425
—
—
—
—
5.00
—
1
575
V
µs
—
kHz
Overtemper ature Shutdown (See Figure 24.) TC— 105 — °C
Forced Load S haring — — 10 — %IO, rated
Power Good Signal Interface
(See Feature Descriptions.):
Low Impedance—Module Operating
High Impedance—Module Off
Rpwr/good
Ipwr/good
Rpwr/good
Vpwr/good
—
—
1
—
—
—
—
—
100
1
—
40
Ω
mA
mΩ
V
* These are manufacturing test limits. In some situations, results may differ.
66 Tyco Electronics Corp..
Data Sheet
July 2002dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Characteristic Curves
The followi ng figures provide typical characteristics for the power modules .
8-2222 (C)
Figure 1. Typical FW250F1 Input Characteristics at
Room Temperature
8-2223 (C)
Figure 2. Typical FW300F1 Input Characteristics at
Room Temperature
8-2224 (C)
Figure 3. Typical FW250F1 Output Characteristics
at Room Tempera ture
8-2225 (C)
Figure 4. Typical FW300F1 Output Characteristics
at Room Tempera ture
2
0
4
6
7
1
3
5
10 20 30 7040 8006050
INPUT V
O
LTAGE, VI
(
V
)
INPUTCURRENT,I
I
(A)
IO=50A
IO=25A
IO=5A
INPUTCURRENT,I
I
(A)
7
5
2
30 35 55 60 65 70
0
INPUT VOLTAGE,VI(V)
3
4
1
8
7525 45 5040
6IO=60A
IO=30A
IO=6A
1.0
0.0
2.0
3.0
3.5
0.5
1.5
2.5
10 20 30 6040 70050
OUTPUTVOLTAGE,V
O
(V)
OUTPUTCURRENT
,
IO
(
A
)
V
I
=36V
V
I
=48V
V
I
=75V
1.0
0.0
2.0
3.0
3.5
0.5
10
1.5
2.5
20030 7040
OUTPUT CURRENT, IO
(
A
)
800
OUTPUTVOLTAGE,V
O
(V)
6050
OUTPUT CURRENT, IO
(
A
)
VI=36V
VI=48V
VI=75V
Tyco Electronics Corp.. 7
Data Sheet
July 2002 dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Characteristic Curves (continued)
8-2226 (C)
Figure 5. Typical F W250F1 Effi ciency vs. Output
Current at Room Tem pe rature
8-1734 (C)
Figure 6. Typical F W300F1 Effi ciency vs. Output
Current at Room Tem pe rature
8-2227 (C)
Figure 7. Typical FW250F1 Output Ripple Voltage
at Room Tempera ture , 48 V Input, and
50 A Output
8-1735 (C)
Figure 8. Typical FW300F1 Output Ripple Voltage
at Room Temperature and 60 A Output
10 15 20 25 30 35
70
76
OUTPUT CURRENT
,
I
O
(
A
)
74
78
505
72
40 45
80
82 VI=36V
VI=48V
VI=75V
EFFICIENCY,η(%)
79
75
10 20 4030 50
72
78
OUTPUT CURRENT
,
IO
(
A
)
76
77
74
73
80
6
0
0
81
EFFICIENCY,η(%)
VI=36V
VI=54V
VI=72V
TIME, t
(
500 ns/div
)
OUTPUTVOLTAGE,V
O
(V)
(20mV/div)
TIME, t (500 ns/div)
OUTPUTVOLTAGE,V
O
(V)
(10mV/div)
VI=36V
VI=48V
VI=72V
88 Tyco Electronics Corp..
Data Sheet
July 2002dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Characteristic Curves (continued)
8-2228 (C)
Note: Tested with a 10 µF alum inum and a 1.0 µF ceramic capa citor
across the load.
Figure 9. Typical FW250 F1 Tran sient Respo nse to
Step Decrease in Load from 50% to 25%
of Full Load at Room Te mpera ture and
48 V Input (Waveform Averag ed to
Eliminate Ripple Component.)
8-2229 (C)
Note: Tested with a 10 µF alum inum and a 1.0 µF ceramic capa citor
across the load.
Figure 10. Typical FW250F1 Transient Response to
Step Increase in Load fro m 50% to 75%
of Full Load at Room Te mpera ture and
48 V Input (Waveform Averag ed to
Eliminate Ripple Component.)
8-2230 (C)
Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor
acr oss the load.
Figure 11. T ypical FW300F1 Transient Response to
Step Decrease in Load from 50% to 25%
of Full Load at Room Temperatur e and
48 V Input (Waveform Averaged to
Eliminate Ripple Component.)
8-2231 (C)
Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor
acr oss the load.
Figure 12. T ypical FW300F1 Transient Response to
Step Increase in Load from 50% to 75%
of Full Load at Room Temperatur e and
48 V Input (Waveform Averaged to
Eliminate Ripple Component.)
T
IME, t
(
500
µ
s/div
)
OUTPUTVOLTAGE,V
O
(V)
(500mV/div)
OUTPUTCURRENT,I
O
(A)
(10A/div)
25 A
12.5 A
TIME, t
(
500
µ
s
/
div
)
OUTPUTVOLTAGE,V
O
(V)
(500mV/div)
OUTPUTCURRENT,I
O
(A)
(10A/div)
25 A
37 A
T
IME, t
(
200
µ
s/div
)
OUTPUTVOLTAGE,V
O
(V)
(200mV/div)
OUTPUTCURRENT,I
O
(A)
(10A/div)
30A
15A
TIME, t
(
200
µ
s
/
div
)
OUTPUTVOLTAGE,V
O
(V)
(200mV/div)
OUTPUTCURRENT,I
O
(A)
(10mV/div)
45 A
30 A
Tyco Electronics Corp.. 9
Data Sheet
July 2002 dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Characteristic Curves (continued)
8-1736 (C)
Note: Tested with a 40 00 µ F a luminum and a 1.0 µF ceramic capaci-
tor across the load.
Figure 13. Typical FW300F1 Start -Up Transient at
Room Tem p eratu re, 48 V Input, and Full
Load
Test Configurations
8-203
Note: Measure input reflected-ripple current with a simulated source
inductance (LTEST) of 12 µH. Capacitor CS offsets possible bat-
tery impedance. Measure current as shown above.
Figure 14. Input Reflected-Ripple Test S etu p
8-68 3 (C).f
No te: A ll me as urem ents ar e take n at the mo dule termina ls. When
socketing, place Kelvin connections at modu le terminals to
avo id me as u r em e nt er ror s due to so cket con t ac t re s is ta nc e .
Figure 15. Output Voltage and Efficiency
Measurement Test Setup
8-513 (C).m
Not e: Use a 0.1 µF ce ramic capacitor and a 10 µF al uminum or
tantalum capacitor. Scope measur emen t should be made
us ing a BNC sock et. Position the load betwee n 50 mm and
76 mm (2 in. and 3 in.) from the module.
Figure 16. Peak-to-Peak Outpu t Noise
Measurement Test Setup
Design Considerations
Input Source Im pedance
The power module should be connected to a low
ac-imped anc e input source. Highly ind uc tive s ource
impedances can affect the stability of the power mod-
ule. For the test configuration in Figure 14, a 100 µF
electrolytic capacitor (ESR < 0.3 Ω at 100 kHz)
mounted c lose to the power module helps ensure sta-
bility of the unit. For other highly inductive source
impe dances, consult the factory for fu rther application
guidelines.
TIME, t (5 ms/div)
OUTPUTVOLTAGE,V
O
(V)
(1V/div)REMOTEON/OFF,V
ON/OFF
(V)
TO OSCILLOSCOPE
12 µH VI(+)
VI(-)
BATTERY
LTEST
Cs 220 µF
ESR < 0.1 Ω
@ 20 ˚C, 100 kHz 100 µF
ESR < 0.3 Ω
@ 100 kHz
VI(Ð)
VO(+)
SENSE(+)
SENSE(-)
VO(-)
VI(+) IOLOAD
CONTACT AND
DISTRIBUTION LOSSES
SUPPLY II
CONTACT
RESISTANCE
ηVO+()–VO–()[]IO
VI+()–VI–()[]II
--------------------------------------------------


x 100 %=
VO(+)
VO(-)
1.0 µF RESISTIVE
LOAD
SCOPE
COPPER STRIP
10.0 µF
1010 Tyco Electronics Corp..
Data Sheet
July 2002dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the po wer module must be
installed in compliance with the spacing and separation
requirements of the end-use saf ety agency standard,
i.e.,
UL
1950,
CSA
C22.2 No. 950-95, and VDE 0805
(IEC60950, 3rd edition).
If t he inp ut source is non-SELV (ELV or a hazardous
vol tage greater than 60 Vdc and less than or equal to
75 Vdc), for the module’s output to be considered
meeting the requiremen ts of safety ex tra-low voltage
(SELV), all of the following must be true:
■The input source is to be provid ed w ith reinforced
insulation from any hazardous voltages, including the
ac mains; and
■One VI pin and one VO pin are to be grounded or
both the input and output pins are to be kept floating;
and
■The input pins of the module are not operator acces-
sible; and
■Another SELV reliability test i s conducted on the
whole system, as required by the safety agencies, on
the combinat ion of supply source and the subje ct
module to verify that under a single fault, hazardous
voltages do not appear at the module’s output.
Note: Do not ground either of the input pins of the
module without gr ounding one of t he output pins .
This may allow a non-SELV vol tage to appear
between the output pin and ground.
The power module has ext ra-low vol tage (ELV) outputs
when all inputs are ELV.
The input to these units is to be provided with a maxi-
mum 20 A norm al-blow fuse in the ungrounded lead.
Feature Descriptions
Overcurrent Protection
To provide protection in a f ault (output overload) condi-
tion, the unit is equipped with inter nal current-limiting
circuitr y and ca n endure curren t limiting for an unlim-
ited duration. At the point of current-limit inception, the
unit shifts from vo ltage control to current control. If the
output voltage is pul led very low during a severe fault,
the current-limit circuit can exhibit either foldback or
tailout character istics (output-current decrease or
incre ase). The unit operates norm ally once the output
current is brought back into its specified range.
Remote On/Off
To turn the power module on and off , t he user must
supply a switch to control the voltage between the on/off
terminal and the VI(–) terminal (V on/off). The swit ch can be
an open collector or equiv alent (see Figure 17). A logic
lo w is V on/off = 0 V to 1.2 V, during which the module is on.
The max imum Ion/off during a logic low is 1 mA. The switch
should maintain a logic-low voltage while sinking 1 mA.
During a logic high, the maximum Von/off generated by
the power module is 15 V. The maximum allowable
leakage c urrent of the switch at Von/off = 15 V is 50 µA.
If not using the remote on/off feature, short the
ON/OFF pin to VI(–).
8-580
Figure 17. Remote On/Off Implementation
+
Ion/off
Von/off
CASE
ON/OFF
VI(+)
VI(–)
SENSE(+)
SENSE(–)
VO(+)
VO(–)
–
Tyco Electronics Corp.. 11
Data Sheet
July 2002 dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Feature Descriptions (con tinued)
Remote Sense
Remote sense minimizes the eff ects of distribution
losses by regul ating the voltage at the re mote-s ense
connections. The voltage between the remote-sense
pins and the output term inal s must not exc eed the out-
put voltage sense range given in the Feature Specifica-
tions table, i.e.:
[VO(+) – VO(– )] – [S ENSE( +) – SENSE(– ) ] ≤ 0.5 V
The voltage between the VO(+) and VO(–) term inals
must not exceed the minimum value indicated in the
output overvolt age shutdown section of the F eature
Specifications table . This limit includes any increase in
vol tage due to remote-sense compensation and output
volt age set-point adjustm ent (trim), see Figure 18.
If not using the remote-sense feature to regulate the out-
put at the point of load, connect SENSE(+) to VO(+) a n d
SENSE(–) to VO(–) at the module.
8-651
Figu re 18. Effect i ve Circui t Conf i guratio n for
Single-Modu le Remo te-Sense Op erati on
Output Voltag e Set-Point Adjustment
(Trim)
Output voltage trim allows the user to increase or
decrease the output voltage set point of a module . This
is accomplished by connecting an external resistor
between the TRIM pin and either the SENSE(+) or
SENSE(–) pins. With an ext ernal resistor between the
TRIM and SENSE(–) pins (Radj-down), the output voltage
set point (VO , adj) decreases (see Figure 19). The f ollo w-
ing equation deter m ines the required external -resistor
value to obtain a percentage output voltage c hange of
∆%.
The test results for this configuration are displayed in
Figure 20. This figure applies to all output vol tages .
Wit h an external resistor connected between the TRIM
and SENSE(+) pins (R adj-up), the output voltage set
point (VO, adj) increases (see Figure 21).
The foll owing equat ion determines the required exter-
nal-resistor value to obtain a percentage output v oltage
change of ∆%.
The test results for this configuration are displayed in
Figure 22.
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum val ue of the output over-
voltage protection as indicated in the F eature Specifi-
cations table. This limit includes any increase in voltage
due to remote-sense compensation and output vol tage
set-point adjust me nt (trim). See Figure 18.
If not using the trim feat ure, leave the TRIM pin open.
8-748 (C).b
Figure 19. Circu i t Configuration to Decrease
Output Voltage
VO(–)
SENSE(+)
SENSE(–)
VO(+)
VI(–)
VI(+) IOLOAD
CONTACT AND
DISTRIBUTION LOSSE
SUPPLY II
CONTACT
RESISTANCE
Radj-down 205
∆%
---------- 2.255–


kΩ=
Radj-up VO, nom 1∆%
100
----------+()1.225–()
1.225∆%
()
------------------------------------------------------------------------- 205 2.255
–




kΩ=
VI(+)
VI(–)
ON/OFF
CASE
VO(+)
VO(–)
SENSE(+)
TRIM
SENSE(–) Radj-down RLOAD
1212 Tyco Electronics Corp..
Data Sheet
July 2002dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Feature Descriptions (con tinued)
Output Voltag e Set-Point Adjustment
(Trim) (continued)
8-1171 (C).g
Figure 20. Resistor Selection for Decreased Output
Voltage
8-715 (C).b
Figure 21. Circuit Co nfigu ration to Increase
Output Voltage
8-117 2 (C).f
Figure 22. Resistor Selection fo r Increased Output
Voltage
Output Overvol tage Protect ion
The output voltage is monitored at the VO(+) and VO(–)
pins of the module. If the voltage at these pins e xceeds
the value indicated in the Feature Specifications ta ble,
the module will shut down and latch off. Recovery from
latched shutdown is accomplished by cycling the dc
input power off for at least 1.0 s or toggling the primary
referenced on/off signal for at least 1.0 s.
Output Current Monitor
The CURRENT MO N pin provides a dc voltage propor-
tional to the dc output current of the module given in
the Feature Specifications table. For example, on the
FW250F1, the V/A ratio is set at 65 mV/A ± 10% @
70 °C case . At a full load current of 50 A, the v oltage on
the C URRENT MON pin is 3.25 V. The current monitor
signal is referenced to the SENSE(–) pin on the sec-
ondary and is supplied from a source impedance of
approximately 2 kΩ. It is recommended that the CUR-
RENT MON pin be left open when not in use, although
no damage will re sult if the CURRENT MON pin is
shorted to secondary ground. Directly driving the CUR-
RE N T MON p in with a n extern al sour c e will d etrimen-
tally affec t operation of the module and should be
avoided.
0 10 20 30 40
1M
100k
10k
1k
ADJUSTMENT RESISTOR VALUE
PERCENT CHANGE IN OUTPUT VOLTAGE (∆%)
(Ω)
VI(+)
VI(-)
ON/OFF
CASE
VO(+)
VO(-)
SENSE(+)
TRIM
SENSE(-)
Radj-up RLOAD
0 2 4 6 10
10M
PERCENT CHANGE IN OUTPUT VOLTAGE ( )
ADJUSTMENT RESISTOR VALUE (
Ω)
1M
100k
10k 8
∆%
Tyco Electronics Corp.. 13
Data Sheet
July 2002 dc-dc Converters; 36 to 75 Vdc Inpu t, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Feature Descriptions (con tinued)
Synchronization
Any module can be synchronized to any other module
or to an ext ernal clock using th e SYNC IN or SYNC
OUT pins. The modules are not designed to operate in
a master/slav e configuration; that is, if one module fails,
the other mo dules will c ont inue to operate.
SYNC IN Pin
This pin can be connected either to an external clock or
directly to the S Y NC OUT pin of another FW250x or
FW300x module .
If an external clock signal is applied to the SYNC IN
pin, the signal must be a 50 0 kHz (±50 kH z) square
wave with a 4 Vp-p amplitude. Operation outside this
frequency band will detrimentally affect the perfor-
mance of the module and must be avoi ded.
If the SYNC IN pin is connected to the SYNC OUT pin
of another module, the c on nec tion should be as direct
as possible, and the VI(–) pins of the modu les must be
shor t ed toget her.
Unused SYNC IN pins should be tied to VI(–). If the
SYNC IN pin is unused, the m odule will operate from
its own internal clock.
SYNC OUT Pin
This pin contains a clock signal referenced to the VI(–)
pin. The frequency of this signal will equal either the
mo dul e’s int erna l c loc k fre qu enc y or t h e fr eque nc y es tab -
l i shed by an external clock appl ied to th e S YNC I N pin.
When synchronizing several modules together, the
modules can be conn ected in a daisy-chain fas hi on
where the SYNC OUT pin of one module is connected
to the SYNC IN pin of another module. Each module in
the chain will synchronize to the frequency of the fi rst
module in the chain.
To avoid loading effect s, ensure that th e SYNC OUT
pin of an y one module is connected to the SYNC IN pin
of only one module. Any numb er of modules can be
synchronized in this daisy-chain fashion.
Over temperature Shutdown
To provide protection in a f ault condition, the unit is
equipped with an o vertemperature shutdown circuit.
The shutdown circuit will not engage unless the unit is
operated above the maximum case tempe rature.
Recovery from over tem pera ture shutdown is
accom plish ed by c ycling the dc input power off for at
least 1.0 s or toggling the primary referenced on/off
signal for at least 1.0 s.
Forced Load Sharing (Parallel Operation )
For ei ther redunda nt operation or additional power
requirements, the power modules can be configured f or
parallel operation with forced load sharing (see
Figure 23). F or a typical redundant configuration,
Schot tky diodes or an equivalent should be used to
protect against short-circuit conditions. Because of the
remote sense, the f orward-voltage drops across the
Schot tky diodes do not affect the set point of the
vol tage applied to the load. For additional power
requirements, where m ultiple units are used to de velop
combined po wer in e xcess of the rated maximum, the
Schot tky diodes are not needed.
Good layout techniques should be observed f or noise
immunity. To implement forc ed load sharing, the follow-
ing connections must be made:
■The parallel pins of all unit s must be connect ed
together. The paths of these conne ctions should be
as direct as possible.
■All remote-sens e pins should be connec ted to the
power bus at the same point, i.e., connect all
SENSE(+) pins to the (+) side of the power b us at the
same point and all SENSE(–) pins to the (–) side of
the power b us at the same point. Close pro ximity and
directness are necessary for good noise immunity.
1414 Tyco Electronics Corp..
Data Sheet
July 2002
dc-d c C onverters; 3 6 to 75 V dc Inp ut, 3.3 V dc O utput ; 16 5 W to 198 W
FW250F1 and FW300F1 Power Modules:
Feature Descriptions (con tinued)
Forced Load Sharing (Parallel Operation)
(continued)
When not using the parallel feature, l eave the
PARALLEL pin open.
8-581 (C)
Figu re 23. W i rin g C on f ig uration for Redu ndant
Parallel Operation
Power Good Signal
The PWR GO OD pin provides an open-drain signal
(referenced to the SENSE(–) pin) that indicates the
operating state of the module. A low impeda nc e
(<100 Ω) between PWR GO OD and SENSE (–) indi-
cates that the module is operating. A high impedance
(>1 MΩ) between PWR GOOD and SE NSE(–) indi-
cates that the modu le is off or has failed . The PWR
GOOD pin can be pulled up through a resistor to an
external voltage to facilitate sensing. This external volt-
age le vel m ust not exceed 40 V, and the current into the
PWR GOOD pin during the low-impedance state
should be limited to 1 mA maximum.
Thermal Considerations
Introduction
The power modules operate in a variety of ther mal
environment s; however, sufficient cooling should be
provided to help ensure reliab le operation of the unit.
Heat-dissipating components inside the unit are ther-
mally coupl ed to the case. Heat is rem oved by conduc-
tion, convectio n, and radiation to the surrounding
environment . Proper cooling can be verified by mea-
suring the ca se temperature. P eak t emperature occurs
at the position indicated in F igure 24.
8-1303 (C).a
Note: Top view , measurements shown in millimeters and (inches).
Pin locations are for reference only.
Figure 24. Case T emperature Measurement
Location
The tem perat ure at thi s locat ion should no t ex ceed
100 °C. T he maximu m c as e temperatur e can be li m i t ed
to a lower value f or extr em el y high relia bi l ity. The out put
power of the modul e should not exceed the ra ted pow er
f or the modu le as lis ted i n th e Orde ring In f ormat ion tab le .
For additional inf ormation about these modules, refer to
the
Therm al Manage men t for FC- and FW-Se ries 250
W—300 W Board-Mounted Power Modules
Technical
Note (TN96-009EPS).
VO(+)
PARALLEL
SENSE(+)
SENSE(-)
VO(-)
CASE
VI(+)
ON/OFF
VI(-)
VO(+)
PARALLEL
SENSE(+)
SENSE(-)
VO(-)
CASE
VI(+)
ON/OFF
VI(-)
30.5
(1.20)
82.6
(3.25)
CASE
SYNC IN
VI(-)
VI(+) VO(+)
VO(-)
SYNC OUT
MEASURE CASE
TEMPERATURE HERE
ON/OFF
Tyco Electronics Corp.. 15
Data Sheet
July 2002 dc-dc Converters; 36 to 75 Vdc Inpu t, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Thermal Considerations (continued)
Heat Transfer Without Heat Sinks
Derating c ur ves for forc ed-air cooling without a heat
sink are shown in Figures 25 and 26. These curves can
be used to determine the appropriate airflo w f or a giv en
set of operati ng conditions. For example, if the unit wi th
airflow alo ng its length dissipates 20 W of heat, the
correct airfl ow in a 40 °C environment is 1.0 m/s
(200 ft./min.).
8-1315 (C)
Figure 25. Convection P ower Derating with No Heat
Sink; Airflow Along Width (Transverse)
8-1314 (C)
Figure 26. Convection P ower Derating with No Heat
Sink; Airflow Along Length
(Longitudinal)
Heat Tr ansf er wit h Heat Sink s
The power modules have throug h-threa ded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to be attached to the module. The mounting torque
must not exceed 0.56 N-m (5 in.-lb . ). For the scre w
attachment from the pin side , the recommended hole
size on the customer’s PWB around the mounting
holes is 0.130 ± 0.005 inches. If a larger hole is used,
the mounting torque from the pin side must not ex ceed
0.25 N-m (2.2 in.-lbs. ).
Thermal derating with heat sinks is expressed by using
the overall ther ma l resistance of the module. Total
modul e ther m al resistance (θc a) is defined as the max-
imum case temperature rise (∆TC, max) divided by the
module power dissipation (PD):
The location to measure ca se temperature (TC) is
shown in Figu re 24. Case-to-ambient ther m al resis-
tance vs. airflow for various heat sink configurations is
shown in Figure 27 and Figure 28. These curves were
obtained by experiment al testing of heat sinks, wh ich
are offered in the produc t catalog.
8-1321 (C)
Figure 27. Case-to-Ambien t Thermal Resi stance
Curves; Transverse Orientation
0 10203040 10
0
0
40
60
70
LOCAL AMBIENT TEMPERATURE, TA
(
¡C
)
POWERDISSIPATION,P
D
(W)
30
20
10
9080706050
50
4.0 m/s (800 ft./min.)
3.5 m/s (700 ft./min.)
3.0 m/s (600 ft./min.)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.5 m/s (300 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
0.1 m/s(20 ft./min.) NAT. CONV.
010203040 10
0
0
40
60
70
LOCAL A
M
BIEN
T
TE
M
PERA
T
URE, TA
(
¡C
)
POWERDISSIPATION,P
D
(W)
30
20
10
9080706050
4.0 m/s (800 ft./min.)
3.5 m/s (700 ft./min.)
3.0 m/s (600 ft./min.)
2.5 m/s (500 ft./min.)
2.0 m/s (400 ft./min.)
1.5 m/s (300 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
50
0.1 m/s (20 ft./min.) NAT. CONV.
θca ∆TCmax,
PD
---------------------TCTA–()
PD
------------------------
==
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
1.5
AIR VELOCITY, m/s
(
ft./min.
)
00.5
(100) 1.0
(200) 1.5
(300) 2.0
(400) 2.5
(500) 3.0
(600)
CASE-TO-AMBIENT THERMAL
RESISTANCE, RCA (˚C/W)
1616 Tyco Electronics Corp..
Data Sheet
July 2002dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
8-1320 (C)
Figure 28. Case-to-Ambie nt Therm al Resistance
Cu rv e s; Lon git u dina l Or ien t a t ion
These measured res istance s are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore , the
case-to-ambie nt ther ma l resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures 27 and
28 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance.
To choose a heat sink, determine the power dissipated
as heat by the unit for the par t icular application.
Figure 29 shows typical heat dissipation for a range of
output currents and three volt ages for the FW250F1
and FW300F1 .
8-1737 (C)
Figure 29. FW250F1 and FW300F1 Power
Dis si pa ti on vs. Ou t put Current
Example
If an 85 °C case temperature is desired, what is th e
minimum airflow necessary? Assume the FW300F1
modul e is operating at nominal line and an output cur-
rent of 50 A, maximum ambient air temperature of
40 °C, and th e heat sink is 0.5 inch.
Solution
Given: VI = 54 V
IO = 50 A
TA = 40 °C
TC = 8 5 °C
Heat sink = 0.5 inch.
Deter m ine PD by using Figure 29:
PD = 42 W
00.5
(100) 1.0
(200) 1.5
(300) 2.0
(400) 2.5
(500) 3.0
(600)
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
CASE-TO-AMBIENT THERMAL
RESISTANCE,
1.5
AIR VELOCITY, m/s
(
ft./min.
)
RCA (˚C/W)
10 20 30 40 50 6
0
0
50
30
20
40
0
60
10
OUTPU
T
CURREN
T
,
IO
(
A
)
POWERDISSIPATION,P
D
(W)
VI=72V
VI=54V
VI=36V
Tyco Electronics Corp.. 17
Data Sheet
July 2002 dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
Then solve the fol l owing equation:
Use Figures 27 and 28 to determ ine air veloc ity for the
0.5 inch heat sink. The minimum airfl ow necessary for
the FW250F1 module depends on heat sink fin orienta-
tion and is shown below:
■2.0 m/s (400 ft./min.) (oriented along width)
■3.0 m/s (600 ft./min.) (oriented along length)
Custom Heat Sinks
A more detailed model can be used to determine the
required ther m al resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (θcs) and
sink-to-ambient (θsa) as shown in Fi gure 30.
8-1304 (C)
Figure 30. Resistanc e from Case-to-Sink and Sink-
to-Ambient
For a manag ed interface using therm al grease or foils,
a value of θcs = 0.1 °C/W to 0.3 °C/W is typica l. The
solution for heat sink resistance is:
This equation assumes that all dissipated power mus t
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assem bly process prior to electrical testing. The result
of inadeq uate circuit-board cleaning and drying can
aff ect both the reliability of a power module and the
testability of the finished circuit-board assembly. F or
guidance on appropriate so lder ing, cleaning, and dry-
ing procedures, refer to the
Board-Mount ed Power
Modules Soldering and Cleaning
Application Note
(AP97-021EPS).
EMC Considerations
For ass istance with designing for EMC com pliance,
please re fer to the FLT R100V 10 dat a sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs. For additional layout guidelines, refer
to the FLT R100V 10 dat a sheet (DS98-152EP S).
θca TCTA–()
PD
------------------------
=
θca 85 40–()
42
------------------------
=
θca 1.07 °C/W=
PDTCTSTA
θcs θsa
→
θsa TCTA–()
PD
-------------------------θcs–=
18 Tyco Electronics Corp..
Data Sheet
July 2002
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Outline Diagram
Dim e ns io ns a r e in mi llimeter s and (inc hes) .
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.),
x.xx mm ± 0.25 mm (x. xxx i n. ± 0.010 in.)
8-1650 (C)
* S ide label includes Tyco name, product designat ion, safety agency markin gs, input/out put voltage and curren t ratings, and bar co de.
CASE
SYNC IN
ON/OFF
VIÐ
VI+
2.54 (0.100) TYP
VOÐ
VO+
SYNC OUT
SENSEÐ
SENSE+
TRIM
PARALLEL
CURRENT MON
PWRGOOD
5.1 (0.20)
50.8
(2.00)
30.48
(1.200)
22.86
(0.900)
12.7
(0.50)
5.08
(0.200)
10.16
(0.400) 15.24
(0.600)
20.32
(0.800)
25.40
(1.000)
30.48
(1.200)
35.56
(1.400)
66.04 (2.600)
MOUNTINGINSERTS
M3x 0.5 THROUGH,
4PLACES
5.1 (0.20)
2.54 (0.100) TYP
106.68 (4.200)
7.62
(0.300)
17.78
(0.700)
12.70
(0.500)
5.1 (0.20) MIN 1.57 ± 0.05 (0.062 ± 0.002) DIA
SOLDER-PLATED BRASS,
11 PLACES,
(VOUTÐ, VOUT+, VINÐ, VIN+)
1.02 ± 0.05 (0.040 ± 0.002) DIA
SOLDER-PLATED BRASS,
9PLACES
SIDE LABEL*
13.5
(0.53)
116.8 (4.60)
61.0
(2.40)
Top View
Side View
Bottom View
Tyco Electronics Corp.. 19
Data Sheet
July 2002 dc- dc Converter s; 36 to 75 Vdc Inpu t, 3.3 Vd c Out put ; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Recommended Hole Pattern
Componen t-side footprint .
Dim e ns io ns are in millim e t e rs and (in ches ).
8-1650 (C)
Ordering Information
Inpu t Voltage Outp ut Vol t age Outp ut Power Devi ce Code Co m code
48 V 3.3 V 165 W FW250F1 107859886
48 V 3.3 V 198 W FW300F1 107253163
5.1 (0.20)
10.16
(0.400)
MOUNTING INSERTS
5.1 (0.20)
2.54 (0.100) TYP
2.54 (0.100) TYP
5.08
(0.200)
15.24
(0.600)
20.32
(0.800)
25.40
(1.000)
30.48
(1.200)
35.56
(1.400)
106.68
(
4.200
)
66.04 (2.600)
50.8
(2.00)
30.48
(1.200)
22.86
(0.900)
17.78
(0.700)
12.70
(0.500)
12.7
(0.50)
7.62
(0.300)
CASE
SYNC IN
ON/OFF
VIÐ
VI+
VOÐ
VO+
SENSEÐ
SENSE+
TRIM
PARALLEL
CURRENT MON
PWR GOOD
SYNC OUT
7.62
(0.300)
7.62
(0.300)
Data Sheet
July 2002dc-dc Conver ters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Printed on
Recycled Paper
World W id e Headquarter s
Tyco Electronics Power Systems, Inc.
3000 S kyl ine Drive, Mesquit e, TX 75149, USA
+1-800-526-7819 FAX: +1-888-315-5182
(Out side U.S. A .: +1-972-284-2626, FAX: +1-972-284-2900)
www.power.tycoelectronics.com
e-m ail : te chsupport1@ty coelectro ni cs.com
Tyco Electronics Corporation reserves the right to make changes to the product(s) or information contained herein without notice. No liabili ty is assumed as a result of their use or application.
No rights under any patent accompany the sale of any such product(s) or information.
© 2001 Tyco Electronics Power Systems, Inc. (Mesquite, Texas) All International Rights Reserved.
Printed in U.S.A.
Jul y 20 02
FDS02-042EPS (Replaces DS97-519EPS)
Europe, Middle- E ast and Africa Headquarters
Tyco E lect ronics (UK ) Ltd
Tel: +44 (0) 134 4 469 300, Fax: +44 (0) 1344 469 301
Central America-Latin America Headquar ters
Tyco Electronics Power Systems
Tel : +54 11 4316 2866, Fax: +5 4 11 4312 9508
Asia-Pacific Headquar ters
Tyco Elec tro nics Singapore Pte Ltd
Tel: +65 48 2 0311, Fax: 65 480 929 9
Ordering Information (continued)
Table 4. Device Accessories
8-2830
Figure 31. Longitudinal Heat Sink
8-2831
Figure 32. Transverse Heat Sink
Accessory Comcode
1/4 in. trans verse kit (heat sin k, ther m al pad, and screws) 847308335
1/4 in. longitudinal kit (heat sink, t her m al pad, and screws) 847308327
1/2 in. trans verse kit (heat sin k, ther m al pad, and screws) 847308350
1/2 in. longitudinal kit (heat sink, t her m al pad, and screws) 847308343
1 in. transverse kit (heat sink, thermal pad, and screws) 847308376
1 in. longitudinal kit (heat sink, thermal pad, and screws) 847308368
1 1/2 in. trans verse kit (heat sink, ther ma l pad, and screws) 847308392
1 1/2 in. longitudinal kit (heat sink, ther mal pad, and screws) 847308384
1/4 IN.
1/2 IN.
1 IN.
1 1/2 IN.
60.45
115.82
(4.56)
(2.38)
1/4 IN.
1/2 IN.
1 IN.
1 1/2 IN.
115.82
(4.56)
59.94
(2.36)