BAV21WS - DIODES INC - Product.Network

February, 2019 − Rev. 13

1Publication Order Number:

BAS21HT1/D

BAS21H

High Voltage

Switching Diode

Features

•NSV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MAXIMUM RATINGS

Rating Symbol Value Unit

Continuous Reverse Voltage VR250 V

Repetitive Peak Reverse Voltage VRRM 250 V

Peak Forward Current IF200 mA

Repetitive Peak Forward Current IFRM 500 mA

Non−Repetitive Peak Forward Surge

Current, 60 Hz

IFSM(surge) 2.5 A

Non−Repetitive Peak Forward Current

(Square Wave, TJ = 25°C prior to

surge)

t = 1 ms

t = 10 ms

t = 100 ms

t = 1 ms

t = 1 s

IFSM

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Total Device Dissipation FR−5 Board,

(Note 1) TA = 25°C

Derate above 25°C

PD200

1.57

mW/°C

Thermal Resistance,

Junction−to−Ambient

RqJA 635 °C/W

Junction and Storage Temperature

Range

TJ, Tstg −55 to

+150

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 Minimum Pad

HIGH VOLTAGE

SWITCHING DIODE

Device Package Shipping†

ORDERING INFORMATION

SOD−323

CASE 477

STYLE 1

CATHODE

ANODE

www.onsemi.com

MARKING

DIAGRAM

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

BAS21HT1G,

NSVBAS21HT1G

SOD−323

(Pb−Free) 3000 / Tape & Reel

JS M G

JS = Device Code

M = Date Code*

G= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending up-

on manufacturing location.

BAS21HT3G,

NSVBAS21HT3G

SOD−323

(Pb−Free)

10000 / Tape &

Reel

BAS21H

www.onsemi.com

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Max Unit

OFF CHARACTERISTICS

Reverse Voltage Leakage Current

(VR = 200 Vdc)

(VR = 200 Vdc, TJ = 150°C)

−

0.1

100

mAdc

Reverse Breakdown Voltage

(IBR = 100 mAdc)

V(BR) 250 −Vdc

Forward Voltage

(IF = 100 mAdc)

(IF = 200 mAdc)

−

1000

1250

Diode Capacitance

(VR = 0, f = 1.0 MHz)

CD−5.0 pF

Reverse Recovery Time

(IF = IR = 30 mAdc, RL = 100 W)

trr −50 ns

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 30 mA.

Notes: 2. Input pulse is adjusted so IR(peak) is equal to 30 mA.

Notes: 3. tp » trr

+10 V 2.0 k

820 W

0.1 mF

D.U.T.

100 mH

0.1 mF

50 W OUTPUT

PULSE

GENERATOR

50 W INPUT

SAMPLING

OSCILLOSCOPE

trtpt

10%

90%

trr t

iR(REC) = 3.0 mA

OUTPUT PULSE

(IF = IR = 30 mA; MEASURED

at iR(REC) = 3.0 mA)

INPUT SIGNAL

Figure 1. Recovery Time Equivalent Test Circuit

BAS21H

www.onsemi.com

TYPICAL CHARACTERISTICS

Figure 2. Forward Voltage Figure 3. Reverse Leakage

FORWARD CURRENT (mA)

7000

REVERSE CURRENT (nA)

REVERSE VOLTAGE (V)

5000

3000

6000

4000

5 10 20 50 100 200

TA = −55°C

300

TA = 155°C

TA = 25°C

TA = −55°C

1 10 100 1000

200

400

600

800

1000

1200

FORWARD VOLTAGE (mV)

155°C

25°C

Figure 4. Diode Capacitance

VR, REVERSE VOLTAGE (V)

6543210

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Cd, DIODE CAPACITANCE (pF)

Figure 5. Maximum Non−repetitive Peak

Forward Current as a Function of Pulse

Duration, Typical Values

Tp (mSec)

10.10.010.001

IFSM (A)

Based on square wave currents

TJ = 25°C prior to surge

BAS21H

www.onsemi.com

PACKAGE DIMENSIONS

SOD−323

CASE 477−02

ISSUE H

1.60

0.063

0.63

0.025

0.83

0.033

2.85

0.112

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

STYLE 1:

PIN 1. CATHODE

2. ANODE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS SPECIFIED PER L/F DRAWING

WITH SOLDER PLATING.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

5. DIMENSION L IS MEASURED FROM END OF RADIUS.

NOTE 3

12bE

CNOTE 5

DIM MIN NOM MAX

MILLIMETERS

A0.80 0.90 1.00

A1 0.00 0.05 0.10

A3 0.15 REF

b0.25 0.32 0.4

C0.089 0.12 0.177

D1.60 1.70 1.80

E1.15 1.25 1.35

0.08

2.30 2.50 2.70

0.031 0.035 0.040

0.000 0.002 0.004

0.006 REF

0.010 0.012 0.016

0.003 0.005 0.007

0.062 0.066 0.070

0.045 0.049 0.053

0.003

0.090 0.098 0.105

MIN NOM MAX

INCHES

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

BAS21HT1/D

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