Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com December 2004
ECG009
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
The Communications Edge
TM
Product Features
x 60 – 2500 MHz
x +24 dBm P1dB
x +41 dBm Output IP3
x 19 dB Gain @ 900 MHz
x 14.5 dB Gain @ 1900 MHz
x +5V Single Positive Supply
x Available in a lead-free / green
SOT-89 Package Style
Applications
x Final stage amplifiers for
Repeaters
x Mobile Infrastructure
x DBS / WLL / W-LAN
x Defense / Homeland Security
Product Description
The ECG009 is a high dynamic range driver amplifier in a
low-cost surface mount package. The InGaP/GaAs HBT is
able to achieve high performance across a broad range with
+41 dBm OIP3 and +24 dBm of compressed 1dB power. It
is housed in a lead-free/green/RoHS-compliant SOT-89
SMT package. All devices are 100% RF and DC tested.
The ECG009 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECG009 to maintain high linearity over temperature and
operate directly off a single +5V supply. This combination
makes the device an excellent candidate for transceiver line
cards in current and next generation multi-carrier 3G base
stations.
Functional Diagram
RF IN GND
RF OUT
GND
1
2
3
4
ECG009B / ECG009B-G
Specifications (1)
Parameters Units Min Typ Max
Operational Bandwidth MHz 60 2500
Test Frequency MHz 1900
Gain dB 13.5 14.5
Input Return Loss dB 10
Output Return Loss dB 14
Output P1dB dBm +23
Output IP3 (2) dBm +39.5 +41
IS-95A Channel Power
@ -45 dBc ACPR dBm +17
Noise Figure dB 5.0
Test Frequency MHz 2140
Gain dB 12.5 14
Output P1dB dBm +23
Output IP3 (2) dBm +38.5 +40
Operating Current Range mA 130 150 170
Device Voltage V +5
1. Test conditions unless otherwise noted: 25ºC, Vsupply = +5 V, in tuned application circuit.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter Rating
Operating Case Temperature -40 to +85 qC
Storage Temperature -65 to +150 qC
RF Input Power (continuous) +15 dBm
Device Voltage +6 V
Device Current 220 mA
Junction Temperature +250 qC
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (3)
Parameters Units Typical
Frequency MHz 900 1900 2140
S21 - Gain dB 19 14.5 14
S11 - Input R.L. dB -14 -10 -25
S22 - Output R.L. dB -10 -14 -20
Output P1dB dBm +24 +23 +23
Output IP3 dBm +40 +41 +40
Noise Figure dB 5.0 5.0 6.0
Supply Bias +5 V @ 150 mA
3. Typical parameters reflect performance in a tuned application circuit: Vsupply = +5 V, I = 150
mA, +25
C
Ordering Information
Part No. Description
ECG009B ¼ Watt, High Linearity InGaP HBT Amplifier
(leaded SOT-89 Pkg)
ECG009B-G ¼ Watt, High Linearity InGaP HBT Amplifier
(lead-free/green/RoHS-compliant SOT-89 Pkg)
ECG009B-PCB900 900 MHz Evaluation Board
ECG009B-PCB1900
1900 MHz Evaluation Board
ECG009B-PCB2140
2140 MHz Evaluation Board
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com December 2004
ECG009
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
The Communications Edge
TM
Typical Device Data
S-Parameters (VDS = +5 V, IDS = 150 mA, T = 25
C, unmatched 50 ohm system)
0 0.5 1 1.5 2 2.5 3
Frequency (GHz)
Gain / Maximum Stable Gain
0
5
10
15
20
25
30
Gain (dB)
DB(|S[2,1]|) * DB(GMax) *
0
1.0 1.0-1.0
10.0
10.0
-10.0
5.0
5.0
-5.0
2.0
2.0
-2.0
3.0
3.0
-3.0
4.0
4.0
-4.0
0.2
0.2
-0.2
0.4
0.4
-0.4
0.6
0.6
-0.6
0.8
0.8
-0.8
S11
Swp Max
3.075GHz
Swp Min
0.05GHz
0
1.0 1.0-1.0
10.0
10.0
-10.0
5.0
5.0
-5.0
2.0
2.0
-2.0
3.0
3.0
-3.0
4.0
4.0
-4.0
0.2
0.2
-0.2
0.4
0.4
-0.4
0.6
0.6
-0.6
0.8
0.8
-0.8
S22
Swp Max
3.075GHz
Swp Min
0.05GHz
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency,
it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line.
The impedance plots are shown from 50 – 3000 MHz, with markers placed at 0.5 – 3.0 GHz in 0.5 GHz increments.
S-Parameters (VDS = +5 V, IDS = 150 mA, T = 25
C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 1.44 -71.35 18.67 -107.43 -25.30 130.57 -3.42 -132.45
100 -1.01 -102.10 16.10 -143.82 -26.89 82.82 -5.42 -145.23
200 -2.35 -156.70 15.24 159.95 -24.80 22.00 -6.44 -172.47
400 -2.96 150.42 14.32 109.55 -24.00 -24.57 -6.35 142.12
600 -3.56 113.16 13.83 66.55 -23.51 -58.48 -7.15 107.63
800 -4.01 81.26 13.47 27.02 -22.96 -89.08 -8.42 74.95
1000 -4.58 51.16 13.19 -12.84 -22.31 -119.55 -10.30 39.84
1200 -5.22 21.72 12.91 -52.78 -21.58 -150.97 -13.11 -1.40
1400 -5.98 -8.24 12.60 -93.63 -20.87 176.06 -16.18 -57.83
1600 -6.71 -41.43 12.24 -135.46 -20.24 141.44 -16.14 -127.84
1800 -7.42 -81.98 11.77 -178.81 -19.70 104.52 -13.17 -179.34
2000 -8.02 -134.31 11.06 135.75 -19.33 64.68 -10.19 146.77
2200 -7.75 157.10 9.90 87.20 -19.38 21.22 -7.41 119.58
2400 -5.76 83.52 7.81 36.52 -20.19 -25.27 -4.81 91.60
2600 -3.41 22.31 4.79 -11.65 -21.93 -73.51 -2.98 61.64
2800 -1.68 -27.53 1.02 -55.34 -27.05 -120.00 -1.89 31.95
3000 -1.15 -68.00 -3.17 -92.13 -29.84 -142.18 -1.47 4.86
Device S-parameters are available for download off of the website at: http://www.wj.com
Application Circuit PC Board Layout
Circuit Board Material: .014” Getek, 4 layers (other layers added for rigidity), .062” total thickness, 1 oz copper
Microstrip line details: width = .026”, spacing = .026”
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com December 2004
ECG009
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
The Communications Edge
TM
900 MHz Application Circuit (ECG009B-PCB900)
Typical RF Performance
Frequency 900 MHz
S21 – Gain 19 dB
S11 – Input Return Loss -14 dB
S22 – Output Return Loss -10 dB
Output IP3
(+11 dBm / tone, 1 MHz spacing) +40 dBm
Output P1dB +24 dBm
Noise Figure 5.0 dB
Supply Voltage +5 V
Supply Current 150 mA
Measured parameters were taken at 25
C.
CAP
C=
ID=56 pF
C4 CAP
C=
ID=56 pF
C5
RES
R=
ID=2700 Ohm
L2
CAP
C=
ID=5.6 pF
C12
DIODE1
ID= D1
RES
R=
ID=0 Ohm
L3
CAP
C=
ID=56 pF
C1
CAP
C=
ID=1000 pF
C2
CAP
C=
ID=1e5 pF
C3
IND
L=
ID=33 nH
L1
CAP
C=
ID=1.0 pF
C13
SUBCKT
NET=
ID="ECG009B"
U1
PORT
Z=
P=50 Ohm
1 PORT
Z=
P=50 Ohm
2
Vcc = +5 V
5.6 V
C12 should be placed at the silk screen
marker "F" on the WJ evaluation board.
All passive components are of size 0603 unless otherwise noted. size 1206
size 0805
The capacitor should be placed
14° @ 0.9GHz from pin 1.
C13 should be placed at the silk screen
marker "8" on the WJ evaluation board.
The capacitor should be placed
19° @ 0.9GHz from pin 3.
0.7 0.8 0.9 1 1.1
Frequency (GHz)
Application Circuit: 900 MHz
-20
-15
-10
-5
0
5
10
15
20
Magnitude (dB)
DB(|S[1,1]|) * DB(|S[2,1]|) * DB(|S[2,2]|) *
ACPR IS-95A vs. Channel Power
IS-95, 9 Ch. Forward, 30 kHz Meas BW, ±885 kHz offset
-70
-60
-50
-40
13 14 15 16 17 18
Output Channel Power (dBm)
ACPR (dBc)
freq = 0.9 GHz
1900 MHz Application Circuit (ECG009B-PCB1900)
Typical RF Performance
Frequency 1900 MHz
S21 – Gain 14.5 dB
S11 – Input Return Loss -10 dB
S22 – Output Return Loss -14 dB
Output IP3
(+11 dBm / tone, 1 MHz spacing) +41 dBm
Output P1dB +23 dBm
Noise Figure 5.0 dB
Supply Voltage +5 V
Supply Current 150 mA
Measured parameters were taken at 25
C.
CAP
C=
ID=56 pF
C4 CAP
C=
ID=56 pF
C5
IND
L=
ID=18 nH
L1
RES
R=
ID=2700 Ohm
L2
IND
L=
ID=2.7 nH
L3
CAP
C=
ID=2.4 pF
C7 CAP
C=
ID=1.2 pF
C13
DIODE1
ID= D1 CAP
C=
ID=56 pF
C1
CAP
C=
ID=1000 pF
C2
CAP
C=
ID=1e5 pF
C3
SUBCKT
NET=
ID="ECG009B"
U1
PORT
Z=
P=50 Ohm
1 PORT
Z=
P=50 Ohm
2
Vcc = +5 V
5.6 V
marker "A" on the WJ evaluation board.
C7 should be placed at the silk screen
All passive components are of size 0603 unless otherwise noted.
5° @ 1.9GHz from pin 1.
The capacitor should be placed 34° @ 1.9GHz from pin 3.
The capacitor should be placed
marker "7" on the WJ evaluation board.
C13 should be placed at the silk screen
size 1206
size 0805
1.6 1.7 1.8 1.9 2 2.1
Frequency (GHz)
Application Circuit: 1900 MHz
-20
-15
-10
-5
0
5
10
15
20
Magnitude (dB)
DB(|S[1,1]|) * DB(|S[2,1]|) * DB(|S[2,2]|) *
ACPR IS-95A vs. Channel Power
IS-95, 9 Ch. Forward, 30 kHz Meas BW, ±885 kHz offset
-70
-60
-50
-40
13 14 15 16 17 18
Output Channel Power (dBm)
ACPR (dBc)
freq = 1.9 GHz
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com December 2004
ECG009
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
The Communications Edge
TM
2140 MHz Application Circuit (ECG009B-PCB2140)
Typical RF Performance
Frequency 2140 MHz
S21 – Gain 14 dB
S11 – Input Return Loss -25 dB
S22 – Output Return Loss -20 dB
Output IP3
(+11 dBm / tone, 1 MHz spacing) +23 dBm
Output P1dB +40 dBm
Noise Figure 6.0 dB
Supply Voltage +5 V
Supply Current 150 mA
Measured parameters were taken at 25
C.
CAP
C=
ID=56 pF
C4 CAP
C=
ID=56 pF
C5
IND
L=
ID=18 nH
L1
RES
R=
ID=2700 Ohm
L2
CAP
C=
ID=1.5 pF
C12 CAP
C=
ID=0.8 pF
C13
DIODE1
ID= D1
CAP
C=
ID=1.5 pF
C6
CAP
C=
ID=56 pF
C1
CAP
C=
ID=1000 pF
C2
CAP
C=
ID=1e5 pF
C3
SUBCKT
NET=
ID="ECG009B"
U1
PORT
Z=
P=50 Ohm
1 PORT
Z=
P=50 Ohm
2
Vcc = +5 V
5.6 V
All passive components are of size 0603 unless otherwise noted. size 1206
size 0805
39° @ 2.14GHz from pin 3.
The capacitor should be placed
screen marker "6" on the WJ evaluation board.
C13 should be placed at the silk
33° @ 2.14GHz from pin 1.
The capacitor should be placed
screen marker "F" on the WJ evaluation board.
C12 should be placed at the silk
from pin 1.
C6 should be placed 19.5° @ 2.14GHz
1.9 2 2.1 2.2 2.3
Frequency (GHz)
Application Circuit: 2140 MHz
-25
-20
-15
-10
-5
0
5
10
15
Magnitude (dB)
DB(|S[1,1]|) * DB(|S[2,1]|) * DB(|S[2,2]|) *
W-CDMA ACLR vs. Channel Power
3GPP W-CDMA, Test Model 1 + 64 DPCH, ±5 MHz offset
-60
-55
-50
-45
-40
-35
12 13 14 15 16
Output Channel Power (dBm)
ACLR (dBc)
freq = 2140 MHz
70 MHz Reference Design
Typical RF Performance
Frequency 70 MHz
S21 – Gain 23.4 dB
S11 – Input Return Loss -15 dB
S22 – Output Return Loss -14 dB
Output IP3
(+11 dBm / tone, 1 MHz spacing) +44.5 dBm
Output P1dB +23.8 dBm
Noise Figure 6.5 dB
Supply Voltage +5 V
Supply Current 150 mA
Measured parameters were taken at 25
C.
CAP
C=
ID=1000 pF
C4
CAP
C=
ID=1e7 pF
C3
CAP
C=
ID=10 pF
C1
CAP
C=
ID=1000 pF
C2
CAP
C=
ID=1000 pF
C5
IND
L=
ID=470 nH
L1
RES
R=
ID=2700 Ohm
L2
CAP
C=
ID=68 pF
C9
IND
L=
ID=56 nH
L3 IND
L=
ID=33 nH
L5
RES
R=
ID=3.9 Ohm
R4
RES
R=
ID=0 Ohm
R2
SUBCKT
NET=
ID="ECG009"
U1
PORT
Z=
P=50 Ohm
1
PORT
Z=
P=50 Ohm
2
Vcc = +5 V
40 50 60 70 80 90 100
Frequency (MHz)
Measured Gain
20
22
24
26
Gain (dB)
DB(|S[2,1]|)
40 50 60 70 80 90 100
Frequency (MHz)
Measured Return Loss
-25
-20
-15
-10
-5
0
Return Loss (dB)
DB(|S[1,1]|) DB(|S[2,2]|)
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com December 2004
ECG009
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
The Communications Edge
TM
110 MHz Reference Design
Typical RF Performance
Frequency 110 MHz
S21 – Gain 21.9 dB
S11 – Input Return Loss -16 dB
S22 – Output Return Loss -12 dB
Output IP3
(+11 dBm / tone, 1 MHz spacing) +44 dBm
Output P1dB +23.8 dBm
Noise Figure 6.6 dB
Supply Voltage +5 V
Supply Current 150 mA
Measured parameters were taken at 25
C.
CAP
C=
ID=1000 pF
C4
CAP
C=
ID=1e7 pF
C3
CAP
C=
ID=10 pF
C1
CAP
C=
ID=1000 pF
C2
CAP
C=
ID=1000 pF
C5
IND
L=
ID=470 nH
L1
RES
R=
ID=2700 Ohm
L2
CAP
C=
ID=47 pF
C9
IND
L=
ID=33 nH
L3 IND
L=
ID=18 nH
L5
RES
R=
ID=3.9 Ohm
R4
RES
R=
ID=0 Ohm
R2
SUBCKT
NET=
ID="ECG009"
U1
PORT
Z=
P=50 Ohm
1
PORT
Z=
P=50 Ohm
2
Vcc = +5 V
80 90 100 110 120 130 140
Frequency (MHz)
Measured Gain
18
20
22
24
Gain (dB)
DB(|S[2,1]|)
80 90 100 110 120 130 140
Frequency (MHz)
Measured Return Loss
-25
-20
-15
-10
-5
0
Return Loss (dB)
DB(|S[1,1]|) DB(|S[2,2]|)
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com December 2004
ECG009
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
The Communications Edge
TM
ECG009B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter Rating
Operating Case Temperature -40 to +85q C
Thermal Resistance, Rth (1) 149q C / W
Junction Temperature, Tjc (2) 197q C
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85
C.
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247
C.
Product Marking
The component will be marked with an
“E009” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specification for this part is
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1A
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235
C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
1.0
10.0
100.0
1000.0
60 70 80 90 100 110 120
Tab Temperature (°C)
MTTF (million hrs)
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com December 2004
ECG009
¼ Watt, High Linearity InGaP HBT Amplifier Product Information
The Communications Edge
TM
ECG009B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter Rating
Operating Case Temperature -40 to +85q C
Thermal Resistance, Rth (1) 149q C / W
Junction Temperature, Tjc (2) 197q C
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85
C.
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247
C.
Product Marking
The component will be marked with an
“ E009G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specification for this part is
located on the website in the “ Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1A
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
1.0
10.0
100.0
1000.0
60 70 80 90 100 110 120
Tab Temperature (°C)
MTTF (million hrs)