RTAX4000S-CG1272EV - Microsemi Corp.

May 2012 i

RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs

Radiation Performance

• SEU-Hardened Registers Eliminate the Need for Triple-Module

Redundancy (TMR)

– Immune to Single-Event Upsets (SEU) to LETTH > 37 MeV-

cm2/mg

– SEU Rate < 10-10 Errors/Bit-Day (worst case GEO)

• SRAM Upset Rate of <10-10 Errors/Bit-Day with Use of Error

Detection and Correction (EDAC) IP (included) with Integrated

SRAM Scrubber

– Single-Bit Correction, Double-Bit Detection

– Variable-Rate Background Refreshing

• Total Ionizing Dose Up to 300 krad (Si, Functional)

• Single-Event Latch-Up Immunity (SEL) to LETTH > 117 MeV-

cm2/mg

• TM1019 Test Data Available

Processing Flows

• B-Flow – MIL-STD-883B

• E-Flow – Extended Flow

• EV-Flow – Class V Equivalent Flow Processing Consistent with

MIL-PRF 38535 (RTAX-DSP only)

• V-Flow – QML Class V per MIL-PRF-38535 (RTAX-S/SL only)

Prototyping Options

• Commercial Axcelerator® Devices for Functional Verification

(RTAX™-S/SL only)

• RTAX-S/SL PROTO and RTAX-DSP PROTO Devices with

Same Functional and Timing Characteristics as Flight Unit in a

Non-Hermetic Package

• Low-Priced Reprogrammable ProASIC®3 Option for Functional

Verification (RTAX-S/SL only)

RTAX-SL Low Power Option

• Offers Up To 80% Saving of Static Current Compared to

Standard RTAX-S Device at Worst-Case Conditions

Leading-Edge Performance

• High-Performance Embedded FIFOs

• 350+ MHz System Performance

• 500+ MHz Internal Performance

• 700 Mb/s LVDS Capable I/Os

Specifications

• Up to 4 Million Equivalent System Gates or 500 k Equivalent

ASIC Gates

• Up to 20,160 SEU-Hardened Flip-Flops

• Up to 840 I/Os with SEU-Protected Input, Output, and Enable

Registers

• Up to 540 kbits Embedded SRAM

• Manufactured on 0.15 µm CMOS Antifuse Process Technology,

7 Layers of Metal

• Electrostatic Discharge (ESD) is 2,000 V (HBM MIL-STD-883,

TM3015)

Embedded Multiply/Accumulate Blocks

(RTAX-DSP Only)

• Up to 120 Multiply/Accumulate Blocks

• Fully SEU- and SET-Hardened

• 125 MHz Performance throughout Military Temperature Range

• Flexible, Cascadable Accumulate Function

Features

• Single-Chip, Nonvolatile Solution

• 1.5 V Core Voltage for Low Power

• Flexible, Multi-Standard I/Os:

– 1.5 V, 1.8 V, 2.5 V, 3.3 V Mixed Voltage Operation

– Bank-Selectable I/Os – 8 Banks per Chip

– Single-Ended I/O Standards: LVTTL, LVCMOS, 3.3 V PCI

– JTAG Boundary Scan Testing (as per IEEE 1149.1)

– Differential I/O Standards: LVPECL and LVDS

– Voltage-Referenced I/O Standards: GTL+, HSTL Class 1,

SSTL2 Class 1 and 2, SSTL3 Class 1 and 2

– Hot-Swap with Cold-Sparing Support (Except PCI)

• Embedded Memory with Variable Aspect Ratio:

– Independent, Width-Configurable Read and Write Ports

– Programmable Embedded FIFO Control Logic

– ROM Emulation Capability

• Deterministic, User-Controllable Timing

• Unique In-System Diagnostic and Debug Capability

Table 1 • RTAX Family Product Profile

Device RTAX250S/SL RTAX1000S/SL RTAX2000S/SL RTAX4000S/SL RTAX2000D/DL RTAX4000D/DL

Capacity

Equivalent System Gates

ASIC Gates

250,000

30,000

1,000,000

125,000

2,000,000

250,000

4,000,000

500,000

2,000,000

250,000

4,000,000

500,000

Modules

Combinatorial (C-cells)

1,408

2,816

6,048

12,096

10,752

21,504

20,160

40,320

9,856

19,712

18,480

36,960

Embedded RAM/FIFO (w/o EDAC)

Core RAM Blocks

Core RAM Bits (K = 1,024)

54 k

162 k

288 k

120

540 k

288 k

120

540 k

Embedded Multiply/Accumulate

Blocks – – – – 64 120

Clocks (segmentable)

Hardwired

Routed

I/Os

I/O Banks

User I/Os (maximum)

I/O Registers

198

744

418

1,548

684

2,052

840

2,520

684

2,052

840

2,520

Package

CG/LG*

624

208, 352

624

352

624, 1152

256, 352

1272

352

1272

352

1272

352

Note: *The body size of the CG1272 and LG1272 packages used on the RTAX-DSP devices is slightly larger than the body size of the

CG/LG1272 used on RTAX40 00S/S L devices.

Revision 15

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

ii Revision 15

Ordering Information

Screening Levels

Package RTAX250S/SL RTAX1000S/SL RTAX2000S/SL RTAX4000S/SL RTAX2000D/DL RTAX4000D/DL

CQ208 B, E, V, PROTO – – – – –

CQ256 – – B, E, V, PROTO – – –

CQ352 B, E, V, PROTO B, E, V, PROTO B, E, V, PROTO B, E, V, PROTO B, E, EV, PROTO B, E, EV, PROTO

CG624/LG624 B, E, V, PROTO B, E, V, PROTO B, E, V, PROTO – – –

CG1152/LG1152 – – B, E, V, PROTO – – –

CG1272/LG1272 – – – B, E, V, PROTO – –

CGD1272/LGD1272 – – – – B, E, EV, PROTO B, E, EV, PROTO

Note: B = MIL-STD-883 Class B

E = Extended Flow

EV = "V" Equivalen t Fl ow (Class V processing consist en t wit h MIL -PRF 3 853 5)

V = QML Class V per MIL-PRF-38535

PROTO = Prototype unit ; no t f or s pace f ligh t o r q uali ficat ion o f space-flight hardware .

RTAX2000S 1 CGS

Part Number

Speed Grade

Blank =Standard Speed

=Approximately 15% Faster than Standard (applies to RTAX250S/SL, RTAX1000S/SL. RTAX2000S/SL, RTAX2000D/DL FPGA Logic)1

=Approximately 10% Faster than Standard (applies to RTAX4000S/SL, RTAX4000D/DL FPGA Logic)1

Package Type

CQ =Ceramic Quad Flat Pack

CG =Ceramic Column Grid Array (RTAX-S/SL)

CGD =Ceramic Column Grid Array (RTAX-DSP)

LG =

Land Grid Array (RTAX-S/SL)

LGD =Land Grid Array (RTAX-DSP)

624 B

Package Lead Count

Screening Level

B = MIL-STD 883 Class B

E = Extended Fow

PROTO

Class V Equivalent Flow Processing Consistent with MIL-PRF-38535 (applies to RTAX-DSP only)

V = QML Class V per MIL-PRF-38535 (applies to RTAX-S/SL only)

Prototype Unit; not for Space Flight or Qualification of Space-Flight Hardware

RTAX1000S/SL

1,000,000 Equivalent System Gates

RTAX250S/SL

250,000 Equivalent System Gates

Standard Device

Low-Power Option

RTAX2000S/SL

2,000,000 Equivalent System Gates

Note: All parts in Column Grid Array packages are now supplied with only Six Sigma solder columns.

SSix Sigma Column

RTAX4000S/SL 4,000,000 Equivalent System Gates

RTAX2000D/DL 2,000,000 Equivalent System Gates

RTAX4000D/DL 4,000,000 Equivalent System Gates

D=DSP Device

DL =Low-Power Option for DSP Device

RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs

Revision 15 iii

RTAX-S/SL and RTAX-DSP Device Status

Speed Grade and Temperature Grade Matrix

Device Resources

RTAX-S/SL or RTAX-DSP Device Status

RTAX250S Production

RTAX250SL Production

RTAX1000S Production

RTAX1000SL Production

RTAX2000S Production

RTAX2000SL Production

RTAX4000S Production

RTAX4000SL Production

RTAX2000D Production

RTAX4000D Production

RTAX2000DL Production

RTAX4000DL Production

Temperature RTAX250S/SL RTAX1000S/SL RTAX2000S/SL RTAX4000S/SL RTAX2000D/DL RTAX4000D/DL

STD ✓✓ ✓ ✓✓✓

–1 ✓✓ ✓ ✓✓✓

Notes:

1. Data applies to B, E, EV, V, and PROTO flow devices.

2. Contact your Microsemi representative for availability.

User I/Os (Including Clock Buffers)

Device RTAX250S/SL RTAX1000S/SL RTAX2000S/SL RTAX4000S/SL RTAX2000D/DL RTAX4000D/DL

CQ208 115 – – – – –

CQ256 ––136– – –

CQ352 198 198 1981166 1661166

CG624/LG624 248 418 418 – – –

CG1152/LG1152 ––684– – –

CG1272/LG1272 – – – 840 – –

CGD1272/LGD1272 –– –– 684 8402

CQ = Ceramic Quad Flat Pack, CG= Ceramic Column Grid Array, and LG = Land Grid Arra y

Notes:

1. RTAX2000S/SL and RTAX2000D/DL are not pin compatible in the CQ352 package type.

2. The package overhang for RTAX4000D/DL is slightly larger than RTAX4000S/SL , but th ey are pin compatible.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

iv Revision 15

I/Os per Package

Package Device Single-Ended1Adjacent

Differential Pairs2Non-Adjacent

Differential Pairs3Total I/Os

CQ208 RTAX250S 7 41 13 115

CQ256 RTAX2000S 4 66 0 136

CQ352 RTAX250S 2 98 0 198

RTAX1000S 2 98 0 198

RTAX2000S 2 98 0 198

RTAX4000S 4 81 0 166

RTAX2000D 4 81 0 166

RTAX4000D 4 81 0 166

CG624 / LG624 RTAX250S 0 124 0 248

RTAX1000S 68 170 5 418

RTAX2000S 52 178 5 418

CG1152 / LG1152 RTAX2000S 0 342 0 684

CG1272/ LG1272 RTAX4000S 0 420 0 840

CGD1272 / LGD1272 RTAX2000D 0 342 0 684

RTAX4000D 0 420 0 840

Notes:

1. Single-ended I/Os can implement only single ended I/O standards.

2. Adjacent differential pairs are pairs of I/Os that are physically adj acent and ca n implement differential I/O standards as we ll as

single-ended I/O standards.

3. Non-adjacent differential pairs are pairs of I/Os that can implement differential I/O standards as well as single-ended I/O

standards but are not physically adjacent.

4. The total number of I/Os is calculated by adding the single-ended I/Os, double the number of adjacent differential pairs, and

double the number of non-adjacent differential pairs.

RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs

Revision 15 v

MIL-STD-883 Class B Product Flow

Table 2 • MIL-STD-883 Class B Product Flow for RTAX-S/SL and RTAX-DSP 1, 2

Step Screen Method Requirement

1 Internal Visual 2010, Condition B 100%

2 Serialization 100%

3 Temperature Cycling 1010, Condition C, 10 cycles minimum 100%

4 Constant Acceleration 2001, Y1 Orientation Only

Condition B for CQ256, CQ352, LG624, LG1152

Condition D for CQ208

Condition A3 for LG1272, LGD1272, CQ352

100%

5 Particle Impact Noise Detection 2020, Condition A 100%

6 Seal (Fine & Gross Leak Test) 1014 100%

7 Pre-Burn-In Electrical Parameters In accordance with applicable Microsemi device

specification

100%

8 Dynamic Burn-In 1015, Condition D,

160 hours at 125°C or 80 hours at 150°C minimum

100%

9 Interim (Post-Burn-In) Electrical Parameters In accordance with applicable Microsemi device

specification

100%

10 Percent Defective Allowable (PDA) Calculation 5% All Lots

11 Final Electrical Test2

a. Static Tests

(1) 25°C

(2) –55°C and +125°C

b. Functional Tests

(1) 25°C

(2) –55°C and +125°C

c. Switching Tests at 25°C

In accordance with applicable Microsemi device

specification, which includes a, b, and c:

5005, Table 1, Subgroup 1

5005, Table 1, Subgroup 2, 3

5005, Table 1, Subgroup 7

5005, Table 1, Subgroup 8a, 8b

5005, Table 1, Subgroup 9

100%

12 External Visual 2009 100%

Notes:

1. For CCGA devices, all Assembly, Screening, and TCI testing are performed at LGA level. Only QA electrical and mechanical visual are

performed after solder column attachment.

2. RTAX-S and RTAX-SL devices, as well as RTAX-D and RTAX-DL devices, have the same silicon and are distinguished by screening the ICCA

current limits at 125°C final electrical test.

3. Condition A applies to RTAX4000S/SL, RTAX2000D/DL, and RTAX4000D/DL packages only.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

vi Revision 15

Extended Flow

Table 3 • Extended Flow for RTAX-S/SL and RTAX-DSP1, 2, 3, 4

Step Screen Method Requirement

1 Destructive Bond Pull 5 2011, Condition D Extended Sample

2 Internal Visual 2010, Condition A 100%

3 Serialization 100%

4 Temperature Cycling 1010, Condition C, 10 cycles minimum 100%

5 Constant Acceleration 2001, Y1 Orientation Only

Condition B for CQ256, CQ352, LG624, LG1152

Condition D for CQ208

Condition A6 for LG1272, LGD1272, CQ352

6 Particle Impact Noise Detection 2020, Condition A 100%

7 Seal (Fine and Gross Leak Test) 1014 100%

8 Radiographic (X-Ray) 2012, One View (Y1 Orientation) Only 100%

9 Pre-Burn-In Electrical Parameters In accordance with applicable Microsemi device

specification

10 Dynamic Burn-In 1015, Condition D,

240 hours at 125°C or 120 hours at 150°C minimum

100%

11 Interim (Post-Dynamic-Burn-In) Electrical

Parameters

In accordance with applicable Microsemi device

specification

100%

12 Static Burn-In 1015, Condition C, 72 hours at 150°C or 144 hours at 125°C

minimum

100%

13 Interim (Post-Static-Burn-In) Electrical Parameters In accordance with applicable Microsemi device

specification

100%

14 Percent Defective Allowable (PDA) Calculation 5% Overall, 3% Functional Parameters at 25°C All Lots

15 Final Electrical Test4

a. Static Tests

(1) 25°C

(2) –55°C and +125°C

b. Functional Tests

(1) 25°C

(2) –55°C and +125°C

c. Switching Tests at 25°C

In accordance with applicable Microsemi device

specification, which includes a, b, and c:

5005, Table 1, Subgroup 1

5005, Table 1, Subgroup 2, 3

5005, Table 1, Subgroup 7

5005, Table 1, Subgroup 8a, 8b

5005, Table 1, Subgroup 9

100%

16 Seal (Fine and Gross Leak Test) 1014 100%

17 External Visual 2009 100%

Notes:

1. Microsemi offers Extended Flow for users requiring additional screening beyond MIL-STD-833, Class B requirement. Microsemi is offering this

Extended Flow incorporating the majority of the screening procedures as outlined in Method 5004 of MIL-STD-883, Class S.

2. The Quality Conformance Inspection (QCI) for Extended Flow devices still comply to MIL-STD-833, Class B requirement.

3. For CCGA devices, all Assembly/Screening/TCI testing are performed at LGA level. Only QA electrical and mechanical visual are perfo rmed

after solder column attachment.

4. RTAX-S and RTAX-SL devices, as well as RTAX-D and RTAX-DL devices, have the same silicon and are distinguished by screening the ICCA

current limits at 125°C final electrical test.

5. Requirement for 100% nondestructive bond pull per Method 2023 is substituted by an extensive destructive bond pull to Method 2011

Condition D on an extended sample basis.

6. Condition A applies to RTAX4000S/SL, RTAX2000D/DL, and RTAX4000D/DL packages only.

RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs

Revision 15 vii

QML Class V MIL-PRF-38535 Flow

Table 4 • QML Class V MIL-PRF-38535 Flow for RTAX-S/SL1,2

Step Screen Method Requirement

1 Destructive Bond Pull32011, Condition D Extended Sample

2 Internal Visual 2010, Condition A 100%

3 Serialization 100%

4 Temperature Cycling 1010, Condition C, 50 cycles minimum 100%

5 Constant Acceleration 2001, Y1 Orientation Only

Condition B for CQ256, CQ352, LG624, LG1152

Condition D for CQ208

Condition A4 for LG1272, LGD1272, CQ352

100%

6 Particle Impact Noise Detection 2020, Condition A 100%

7 Seal (Fine and Gross Leak Test) 1014 100%

8 Radiographic (X-Ray) 2012, One View (Y1 Orientation) Only 100%

9 Pre-Burn-In Electrical Parameters In accordance with applicable Microsemi device

specification

100%

10 Dynamic Burn-In 1015, Condition D,

240 hours at 125°C or 120 hours at 150°C minimum

100%

11 Interim (Post-Dynamic-Burn-In) Electrical Parameters In accordance with applicable Microsemi device

specification

100%

12 Static Burn-In 1015, Condition C, 72 hours at 150°C or 144 hours at

125°C minimum

100%

13 Interim (Post-Static-Burn-In) Electrical Parameters In accordance with applicable Microsemi device

specification

100%

14 Percent Defective Allowable (PDA) Calculation 5% Overall, 3% Functional Parameters at 25°C All Lots

15 Final Electrical Test2

a. Static Tests

(1) 25°C

(2) –55°C and +125°C

b. Functional Tests

(1) 25°C

(2) –55°C and +125°C

c. Switching Tests at 25°C

In accordance with applicable Microsemi device

specification, which includes a, b, and c:

5005, Table 1, Subgroup 1

5005, Table 1, Subgroup 2, 3

5005, Table 1, Subgroup 7

5005, Table 1, Subgroup 8a, 8b

5005, Table 1, Subgroup 9

100%

16 Seal (Fine and Gross Leak Test) 1014 100%

17 External Visual 2009 100%

18 Wafer Lot Specific Life Test (Group C) MIL-PRF-38535, Appendix B, sec. B.4.2.c All Wafer Lots

Notes:

1. For CCGA devices, all Assembly/Screening/TCI testing are performed at LGA level. Only QA electrical and mechanical visual are perfo rmed

after solder column attachment.

2. RTAX-S and RTAX-SL devices have the same silicon and are distinguished by screening the ICCA current limits at 125°C final ele ctrical test.

3. Requirement for 100% nondestructive bond pull per Method 2023 is substituted by an extensive destructive bond pull to Method 2011

Condition D on an extended sample basis.

4. Condition A applies to RTAX4000S/SL packages only.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

viii Revision 15

"EV" Flow (Class V Flow Equivalent Processing)

Table 5 • "EV" Flow (Class V Equivalent Flow Processing) for RTAX-DSP1, 2, 3

Step Screen Method Requirement

1 Destructive Bond Pull42011, Condition D Extended Sample

2 Internal Visual 2010, Condition A 100%

3 Serialization 100%

4 Temperature Cycling 1010, Condition C, 50 cycles minimum 100%

5 Constant Acceleration 2001, Y1 Orientation Only

Condition B for CQ256, CQ352, LG624, LG1152

Condition D for CQ208

Condition A for LG1272, LGD1272, CQ352

100%

6 Particle Impact Noise Detection 2020, Condition A 100%

7 Seal (Fine and Gross Leak Test) 1014 100%

8 Radiographic (X-Ray) 2012, One View (Y1 Orientation) Only 100%

9 Pre-Burn-In Electrical Parameters In accordance with applicable Microsemi device

specification

100%

10 Dynamic Burn-In 1015, Condition D,

240 hours at 125°C or 120 hours at 150°C minimum

100%

11 Interim (Post-Dynamic-Burn-In) Electrical Parameters In accordance with applicable Microsemi device

specification

100%

12 Static Burn-In 1015, Condition C, 72 hours at 150°C or 144 hours at

125°C minimum

100%

13 Interim (Post-Static-Burn-In) Electrical Parameters In accordance with applicable Microsemi device

specification

100%

14 Percent Defective Allowable (PDA) Calculation 5% Overall, 3% Functional Parameters at 25°C All Lots

15 Final Electrical Test3

a. Static Tests

(1) 25°C

(2) –55°C and +125°C

b. Functional Tests

(1) 25°C

(2) –55°C and +125°C

c. Switching Tests at 25°C

In accordance with applicable Microsemi device

specification, which includes a, b, and c:

5005, Table 1, Subgroup 1

5005, Table 1, Subgroup 2, 3

5005, Table 1, Subgroup 7

5005, Table 1, Subgroup 8a, 8b

5005, Table 1, Subgroup 9

100%

16 Seal (Fine and Gross Leak Test) 1014 100%

17 External Visual 2009 100%

18 Wafer Lot Specific Life Test (Group C) MIL-PRF-38535, Appendix B, sec. B.4.2.c All Wafer Lots

Notes:

1. Microsemi offers "EV" flow for users requiring full compliance to MIL-PRF-38535 class V requirement.

The "EV" process flow is expanded from the existing E-flow requirement (it still meets the full SMD requirement for current E-flow devices) with

the intention to be in full compliance to MIL-PRF-38535 Table IA and Appendix B requirement, but without the official class V certification from

DLA.

2. For CCGA devices, all Assembly/Screening/TCI testing are performed at LGA level. Only QA electrical and mechanical visual are perfo rmed

after solder column attachment.

3. RTAX-D and RTAX-DL devices have the same silicon and are distinguished by screening the ICCA current limits at 125°C final electrical test.

4. Requirement for 100% nondestructive bond pull per Method 2023 is substituted by an extensive destructive bond pull to Method 2011

Condition D on an extended sample basis.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 ix

Table of Content s

General Description

Device Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Programmable Interconnect Element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

I/O Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

Mathblock Multiply-Accumulate Function (RTAX-DSP only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

RTAX-DSP Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9

Routing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9

Global Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9

Design Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11

Low-Cost Prototyping Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11

In-System Diagnostic and Debug Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12

Detailed Specifications

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14

Module Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-83

Mathblock Timing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-93

Routing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-97

Global Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-102

Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-111

Other Architectural Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-133

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-137

Package Pin Assignments

CQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

CQ256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4

CQ352 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8

CG624/LG624 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34

CG1152/LG1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-53

CG1272/LG1272 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-65

Related Documents

Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

User’s Guides and Manuals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

White Papers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12

International Traffic in Arms Regulations (ITAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12

Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12

Revision 15 1-1

1 – General Description

RTAX-S/SL and RTAX-DSP FPGAs offer high performance at densities of up to four million equivalent

system gates for space-based applications. Based upon the Microsemi commercial Axcelerator® family,

RTAX-S/SL and RTAX-DSP have several system-level features such as embedded SRAM (with built-in

FIFO control logic), segmentable clocks, chip-wide highway routing, and carry logic.

Featuring SEU-hardened flip-flops that offer the benefits of user-implemented Triple Module Redundancy

(TMR) without the associated overhead, the RTAX-S/SL and RTAX-DSP families are the second

generation of Microsemi’s products for space applications. RTAX-S/SL and RTAX-DSP devices are

manufactured using a 0.15 µm technology at a UMC facility in Taiwan. These devices offer levels of

radiation survivability far in excess of typical CMOS devices.

Device Architecture

RTAX-S/SL architecture, derived from the highly-successful A54SX-A sea-of-modules architecture, has

been designed for high performance and total logic module utilization (Figure 1-1). Unlike traditional

FPGAs, the entire floor of the RTAX-S/SL or RTAX-DSP device is covered with a grid of logic modules,

with virtually no chip area lost to interconnect elements or routing.

Programmable Interconnect Element

The RTAX-S/SL and RTAX-DSP families use a patented metal-to-metal antifuse programmable

interconnect element that resides between the upper two layers of metal (Figure 1-2 on page 1-2). This

completely eliminates the channels of routing and interconnect resources between logic modules (as

implemented on traditional FPGAs) and enables the efficient sea-of-modules architecture. The antifuses

are normally open circuit and, when programmed, form a permanent, passive, low-impedance

connection, leading to the fastest signal propagation in the industry. In addition, the extremely small size

of these interconnect elements gives the RTAX architecture abundant routing resources.

Figure 1- 1 • Sea-of-Modu les Comparison

Switch

Matrix

Routing

Logic Block

Logic

Modules

Sea-of-Modules

Architecture

Traditional FPGA

Architecture

General Description

1-2 Revision 15

The very nature of nonvolatile antifuse technology provides excellent protection against design pirating

and cloning (FuseLock® technology). Typical cloning attempts are impossible (even if the security fuse is

left unprogrammed) as no bitstream or programming file is ever downloaded or stored in the device.

Reverse engineering is virtually impossible due to the difficulty of trying to distinguish between

programmed and unprogrammed antifuses and also due to the programming methodology of antifuse

devices (see the "Security" section on page 2-136).

Microsemi's RTAX architecture provides two types of logic modules: the register cell (R-cell) and the

combinatorial cell (C-cell). The RTAX C-cell can implement more than 4,000 combinatorial functions of

up to five inputs (Figure 1-3 on page 1-3). The C-cell contains carry logic for even more efficient

implementation of arithmetic functions. With its small size, the C-cell structure is extremely synthesis-

friendly, simplifying the overall design as well as reducing design time.

While each SEU-hardened R-cell appears as a single D-Type flip-flop to the user, each is implemented in

silicon using triple redundancy to achieve a LET threshold of greater than 60 MeV-mg/cm2. Each TMR R-

cell consist of three master-slave latch pairs, each with asynchronous self-correcting feedback paths.

The output of each latch on the master or slave side votes with the outputs of the other two latches on

that side. If one of the three latches is struck by an ion and starts to change state, the voting with the

other two latches prevents that change from feeding back and permanently latching. Care was also taken

in the layout to ensure that a single ion strike could not affect more than one latch (see the "R-Cell"

section on page 2-87 for more details).

The R-cell contains a flip-flop featuring asynchronous clear, asynchronous preset, and active-low enable

control signals (Figure 1-3 on page 1-3). The R-cell registers feature programmable clock polarity

selectable on a register-by-register basis. This provides additional flexibility (e.g., easy mapping of dual-

data-rate functions into the FPGA) while conserving valuable clock resources. The clock source for the

R-cell can be chosen from the hardwired clocks, routed clocks, or internal logic.

Two C-cells, a single R-cell, and two Transmit (TX) and two Receive (RX) routing buffers form a Cluster,

while two Clusters comprise a SuperCluster (Figure 1-4 on page 1-3). Each SuperCluster also contains

an independent Buffer (B) module, which supports buffer insertion on high-fanout nets by the place-and-

route tool, minimizing system delays while improving logic utilization.

The logic modules within the SuperCluster are arranged so that two combinatorial modules are side-by-

side, giving a C–C–R – C–C–R pattern to the SuperCluster. This C–C–R pattern enables efficient

implementation (minimum delay) of two-bit carry logic for improved arithmetic performance (Figure 1-5

on page 1-3).

Figure 1- 2 • RTAX Interconnect Elements

RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs

Revision 15 1-3

The RTAX architecture is fully fracturable, meaning that if one or more of the logic modules in a

SuperCluster are used by a particular signal path, the other logic modules are still available for use by

other paths.

Figure 1- 3 • RTAX C-Cell and R-Cell

Figure 1- 4 • RTAX SuperCluster

Figure 1- 5 • RTAX Two-Bit Carry Logic

A[0:1]

B[0:1]

D[0:3]

CFN

FCI

FCO

C-cell

PRE

CLR

CLK

(Positive Edge Triggered)

C-Cell R-Cell

CRCC C R

RX RX RX

TX TXTX

DCOUT

C-Cell C-Cell

Carry Logic

FCI

FCO

General Description

1-4 Revision 15

At the chip level, SuperClusters are organized into core tiles, which are arrayed to build up the full chip.

For example, the RTAX1000S/SL is composed of a 3×3 array of nine core tiles. Surrounding the array of

core tiles are blocks of I/O Clusters and the I/O bank ring (Tab l e 1 -1 ). Each core tile consists of an array

of 336 SuperClusters and four SRAM blocks (176 SuperClusters and three SRAM blocks for the

RTAX250S/SL). The SRAM blocks are arranged in a column on the west side of the tile (Figure 1-6).

Table 1-1 • Number of Core Tiles per Device

Device Number of Core Tiles

RTAX250S/SL 4 smaller tiles

RTAX1000S/SL 9 regular tiles

RTAX2000S/SL, RTAX2000D 16 regular tiles

RTAX4000S/SL, RTAX4000D 30 regular tiles

Figure 1- 6 • RTAX Device Architecture (RTAX1000S/SL shown)

Chip Layout

SuperCluster

I/O Structure

RAMC

Core Tile

RAM/

FIFO

RAM/

FIFO

RAM/

FIFO

RAM/

FIFO

CRCC C R

RX RX RX

TX TXTX

RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs

Revision 15 1-5

Embedded Memory

As mentioned earlier, each core tile has either three (in a smaller tile) or four (in the regular tile)

embedded SRAM blocks along the west side, and each variable-aspect-ratio SRAM block is 4,608 bits in

size. Available memory configurations are: 128x36, 256x18, 512x9, 1kx4, 2kx2 or 4kx1 bits. The

individual blocks have separate read and write ports that can be configured with different bit widths on

each port. For example, data can be written in by eight and read out by one.

In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the SRAM

block to be configured as a synchronous FIFO without using core logic modules. The FIFO width and

depth are programmable. The FIFO also features programmable ALMOST-EMPTY (AEMPTY) and

ALMOST-FULL (AFULL) flags in addition to the normal EMPTY and FULL flags. In addition to the flag

logic, the embedded FIFO control unit also contains the counters necessary for the generation of the

read and write address pointers as well as control circuitry to prevent metastability and erroneous

operation. The embedded SRAM/FIFO blocks can be cascaded to create larger configurations.

The FIFO control unit was not implemented with SEU-hardened registers. Designs requiring high SEU

tolerance should implement the FIFO control unit from hardened core logic.

SRAM structures are inherently susceptible to upsets caused by high-energy particles encountered in

space. High-energy particles can cause an SRAM cell to change state, resulting in the loss or corruption

of a valuable data bit. Also, the pipeline register in each of the memory blocks is not hardened and is

susceptible to single event-upsets.

Microsemi has enhanced the SEU tolerance of the embedded SRAM within RTAX-S/SL and RTAX-DSP

FPGAs by employing the use of two upset-mitigation techniques:

• Microsemi has developed Error Detection and Correction (EDAC) IP for use with RTAX-S/SL and

RTAX-DSP. EDAC can be accomplished by the use of SmartGen-generated Error Correcting

Codes (ECC) IP, which employs the use of shortened Hamming Codes

• A background memory-refresher, or scrubber circuitry, which has been embedded into the EDAC

IP. The embedded scrubber circuitry periodically refreshes memory in the background to ensure

that no data corruption occurs while the memory is not in use.

The use of EDAC IP combined with the embedded memory scrubber circuitry, gives RTAX-S/SL and

RTAX-DSP FPGAs an SEU radiation performance level of better than 10-10 errors/bit-day. See the

application note Using EDAC RAM for RadTolerant RTAX-S/SL FPGAs and Axcelerator FPGAs.

General Description

1-6 Revision 15

I/O Logic

The RTAX-S/SL and RTAX-DSP families of FPGAs feature a flexible I/O structure, supporting a range of

mixed voltages with its bank-selectable I/Os: 1.5 V, 1.8 V, 2.5 V, and 3.3 V. In all, RTAX-S/SL and

RTAX-DSP FPGAs support at least 14 different I/O standards (single-ended, differential, voltage-

referenced). The I/Os are organized into banks, with eight banks per device (two per side). The

configuration of these banks determines the I/O standards supported (see the "User I/Os" section on

page 2-16 for more information). All I/O standards are available in each bank.

Hot-swap and cold-sparing are supported for all I/O standards except PCI. Hot-swap (also called

hot-plug, or hot-insertion) is the operation of hot-insertion or hot-removal of a card in a powered-up

system. Cold-sparing (also called cold-swap) refers to the ability of a device to leave system data

undisturbed when the system is powered up, while the component itself is powered down, or when power

supplies are floating.

Each I/O module has an input register (InReg), an output register (OutReg), and an enable register

(EnReg) (Figure 1-7). An I/O Cluster includes two I/O modules, four RX modules, two TX modules, and a

buffer (B) module.

By design, all user flip-flops in the RTAX FPGAs are immune to SEUs including the following three

registers located in every I/O cell buffer: InReg, OutReg, and EnReg.

Figure 1- 7 • I/O Cluster Arrangement

I/O Cluster

I/O Module

CoreTile

RAM/

FIFO

RAM/

FIFO

RAM/

FIFO

RAM/

FIFO

OutReg EnRegInReg

I/O

Module

I/O

Module

RX RX RX RX

TX TX

RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs

Revision 15 1-7

Mathblock Multiply-Accumulate Function (RTAX-DSP only)

The flexible elements of the RTAX-DSP Mathblocks enable easy integration into many different signal

processing topologies, such as Fast Fourier Transforms, Inverse Fast Fourier Transforms, Finite Impulse

Response Filters, Infinite Impulse Response Filters, and Discrete Cosine Transforms. The hardwired

Mathblocks also enable acceleration of high precision single and double floating point multiplications.

Figure 1-8 shows a basic functional diagram of a Mathblock.

The Mathblocks comprise the following elements:

1. Multiplier

The multiplier operates on two signed 18-bit factors, A[17:0] and B[17:0] (Figure 1-9). The

multiplier produces a signed 36-bit output, which is provided as an input to the add/subtract

function. The output of the multiplier can optionally bypass the add/subtract function.

The multiplier can be fractured to implement two instances of signed 9x9 multiplication (Figure 1-

10).

Figure 1- 8 • RTAX-DSP Mathblock

Figure 1- 9 • RTAX-DSP Mathbloc k Multiplier Configured as Signed 18x 18

Figure 1- 10 • Mathbloc k Con figured with Two Indepe nd e nt Sign e d 9x 9 multipliers

SHIFT17

CONST[40:0]

SEL_CASC

SEL_CONST

SN-1[40:0]

SN[40:0]

OVFL

ADD_SUB

X+/-

MUX2

MUX1

>>17

[17:0]

B[17:0]

[17:0]

P[35:0]

B[17:0]

P1[17:0]

P2[17:0]

A1[8:0]

B1[8:0]

A2[8:0]

B2[8:0]

General Description

1-8 Revision 15

2. Adder/Subtractor plus MUX Control

• The adder/subtractor can perform the following functions:

– Accumulate using feedback.

– Create higher precision multipliers using the SN-1 input and the 17-bit shift function.

– Create complex DSP functions, such as FIR filters, by cascading Mathblocks together using

the SN-1 input.

– The initial value of the accumulate function can be set using the value defined on the CONST

bus.

Overflow or underflow of the add/subtract function is indicated by the OVFL output.

Figure 1-11 shows the Mathblock configured to perform multiply and accumulate functions. fabric

resources can be used to extend the accumulate width.

3. Output Register

The output of the adder/subtractor block is presented to a 41-bit output register. The register has

a clock input, an enable input, a set or reset input, and provides a 41-bit output SN[40:0] to the

exterior of the Mathblock. Signals SN[40:0] are also fed back within the Mathblock to the

accumulator multiplexer stack to enable various accumulation functions.

4. Cascading Mathblocks

Mathblocks may be cascaded together to form complex DSP structures such as FIR filters and

FFTs. Figure 1-12 shows the configuration of Mathblocks cascaded together.

Figure 1- 11 • Mathblock Configured to Perform Multiply and Accumulate Func ti ons

Figure 1- 12 • Mathblocks Cascaded Together as Part of a Complex DSP Function

SEL_CONST

CONST[40:0]

SN[40:0]

OVFL

ADD_SUB

X+/-

[17:0]

B[17:0]

CASC_CTL Cascade

MUX

Cascade

MUX

CDOUT2[40:0]

CDOUT1[40:0]

Previous Mathblock

Next Mathblock

X+/-

[17:0]

B[17:0]

[17:0]

B[17:0]

RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs

Revision 15 1-9

RTAX-DSP Architecture

The overall RTAX-DSP device architecture is shown in Figure 1-13 on page 1-10. In each core tile, there

are four Mathblocks, which are located adjacent to the SRAM/FIFO blocks. The Mathblocks are evenly

distributed across the device, to help achieve uniform performance of DSP functions.

Routing

The RTAX hierarchical routing structure ties the logic modules, the embedded memory blocks, and the I/O

modules together (Figure 1-14 on page 1-10). At the lowest level, in and between SuperClusters, there are

three local routing structures: FastConnect, DirectConnect, and CarryConnect routing. DirectConnects

provide the highest performance routing inside the SuperClusters by connecting a C-cell to the adjacent R-

cell. DirectConnects do not require an antifuse to make the connection and achieve a signal propagation

time of less than 0.1 ns.

FastConnects provide high-performance, horizontal routing inside the SuperCluster and vertical routing

to the SuperCluster immediately below it. Only one programmable connection is used in a FastConnect

path, delivering a maximum routing delay of 0.4 ns.

CarryConnects are used for routing carry logic between adjacent SuperClusters. They connect the carry-

logic FCO output of one C-cell pair to the carry-logic FCI input of the C-cell pair of the SuperCluster

below. CarryConnects do not require an antifuse to make the connection and achieve a signal

propagation time of less than 0.1 ns.

The next level contains the core tile routing. Over the SuperClusters within a core tile, both vertical and

horizontal tracks run across rows or columns, respectively. At the chip level, vertical and horizontal tracks

extend across the full length of the device, both north-to-south and east-to-west. These tracks are

composed of highway routing that extend the entire length of the device (segmented at core tile

boundaries) as well as segmented routing of varying lengths.

Global Resources

Each family member has three types of global signals available to the designer: HCLK, CLK, and

GCLR/GPSET. There are four hardwired clocks (HCLK) per device that can directly drive the clock input

of each R-cell. Each of the four routed clocks (CLK) can drive the clock, clear, preset, or enable pin of an

R-cell or any input of a C-cell (Figure 1-3 on page 1-3). Both these clocks can be segmented, allowing

significantly more than eight clock domains to be implemented in the devices.

The RTAX1000S/SL, RTAX2000S/SL, RTAX4000S/SL, RTAX2000D, and RTAX4000D devices have 12

HCLK segments per tile and 28 RCLK segments per tile. The RTAX250S/SL has 8 HCLK segments per

tile and 22 RCLK segments per tile.

General Description

1-10 Revision 15

Global clear (GCLR) and global preset (GPSET) drive the clear and preset inputs of each R-cell as well

as each I/O Register on a chip-wide basis at power-up.

Figure 1- 13 • RTAX-DSP Device Architecture Overview

Figure 1- 14 • RTAX Routing Structures

RAMC

4 k RAM/FIFO4 k RAM/FIFO4 k RAM/FIFO4 k RAM/FIFO

DSP I/F

DSP Mathblock

+/–

SEL_CONST

A[17:0]

B[17:0]

CONST[40:0]

SHIFT17

SEL_CASC

SN-1[40:0]

SN[40:0]

OVFL

ADD_SUB

MUX1

MUX2

>> 17

CRCC C R

RX RX RX

TX TXTX

Core Tile

Chip Layout

I/O Structure

SuperCluster

Mathblock

RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs

Revision 15 1-11

Design Environment

RTAX-S/SL and RTAX-DSP FPGAs are fully supported by both Microsemi Libero® Integrated Design

Environment (IDE) and Designer FPGA development software. Microsemi Libero IDE is an integrated

design manager that seamlessly integrates design tools while guiding the user through the design flow,

managing all design and log files, and passing necessary design data among tools. Additionally, Libero

IDE allows users to integrate both schematic and HDL synthesis into a single flow and verify the entire

design in a single environment (see the Libero IDE Flow diagram located on the Microsemi SoC Products

Group website). Libero IDE includes Synplify® AE from Synopsys, ViewDraw® AE from Mentor

Graphics®, ModelSim® HDL Simulator from Mentor Graphics, WaveFormer Lite™ AE from

SynaptiCAD®, and Designer software from Microsemi.

Microsemi's Designer software is a place-and-route tool and provides a comprehensive suite of backend

support tools for FPGA development. The Designer software includes the following:

• SmartTime – a world-class integrated static timing analyzer and constraints editor which support

timing-driven place-and-route

• NetlistViewer – a design netlist schematic viewer

• ChipPlanner – a graphical floorplanner viewer and editor

• SmartPower – allows the designer to quickly estimate the power consumption of a design

• PinEditor – a graphical application for editing pin assignments and I/O attributes

• I/O Attribute Editor – displays all assigned and unassigned I/O macros and their attributes in a

spreadsheet format

With the Designer software, a user can lock the design pins before layout while minimally impacting the

results of place-and-route. Additionally, the Microsemi back-annotation flow is compatible with all the

major simulators and the simulation results can be cross-probed with Silicon Explorer II, the Microsemi

integrated verification and logic analysis tool. Another tool included in the Designer software is the

SmartGen core generator, which easily creates popular and commonly used logic functions for

implementation into your schematic or HDL design.

Microsemi Designer software is compatible with the most popular FPGA design entry and verification

tools from EDA vendors, such as Mentor Graphics, Synplicity, Synopsys, and Cadence Design Systems.

The Designer software is available for both the Windows and UNIX operating systems.

Programming

Programming support is provided through Silicon Sculptor 3, a single-site programmer driven via a

PC-based GUI. Factory programming is available for high-volume production needs.

Low-Cost Prototyping Solutions

Since the enhanced radiation characteristics of radiation-tolerant devices are not required during the

prototyping phase of the design, Microsemi has developed two prototyping options for RTAX-S/SL. For early

design development and functional verification, Microsemi offers the commercial Axcelerator devices; for final

flight design verification in hardware, Microsemi offers RTAX-S PROTO devices that have the same form, fit,

and function as the flight silicon. For RTAX-DSP devices, since there are no commercial equivalent devices

with embedded Mathblocks, the preferred prototyping method is to use RTAX-DSP PROTO units.

Prototyping with Axcelerator Units

The prototyping solution using the commercial Axcelerator devices consists of two parts:

• A well-documented design flow that allows the customer to target an RTAX-S/SL design to the

equivalent commercial Axcelerator device

• A set of Microsemi Extender circuit boards that map the commercial device package to the

appropriate RTAX-S package footprint

This methodology provides the user with a cost-effective solution while maintaining the short time-to-

market associated with Microsemi FPGAs.

General Description

1-12 Revision 15

Prototyping with RTAX-S and RTAX-DSP PROTO Units

The RTAX-S and RTAX-DSP PROTO units offer a prototyping solution that can be used for final timing

verification of the flight design. The PROTO prototype units have the same timing attributes as the RTAX-

S/SL and RTAX-DSP flight units.

Prototype units are offered in non-hermetic ceramic packages. The prototype units include "PROTO" in

their part number, and "PROTO" is marked on devices to indicate that they are not intended for space

flight. They also are not intended for applications which require the quality of space-flight units, such as

qualification of space-flight hardware. RT-PROTO units offer no guarantee of hermeticity, and no MIL-

STD-883B processing. At a minimum, users should plan on using class B level devices for all

qualification activities.

The RT-PROTO units are electrically tested in a manner to guarantee their performance over the full

military temperature range. The RT-PROTO units will also be offered in -1 or standard speed grades, so

as to enable customers to validate the timing attributes of their space designs using actual flight silicon.

Prototyping with ProASIC3E Reprogrammable Units

Using Microsemi’s ProASIC3E prototyping solution offers the unique advantage of reprogrammability,

resulting in cost savings while providing faster functional verification of designs in prototype stage. This

methodology employs a footprint compatible adaptor board and an EDIF netlist and pinout convertor for

easy migration.

Please see the application note Prototyping for R TAX-S and RTAX-SL Devices for more details.

In-System Diagnostic and Debug Capabilities

The RTAX-S/SL family of FPGAs includes internal probe circuitry, allowing the designer to dynamically

observe and analyze any signal inside the FPGA without disturbing normal device operation. Up to four

individual signals can be brought out to dedicated probe pins (PRA/B/C/D) on the device. The probe

circuitry is accessed and controlled via Silicon Explorer II (Figure 1-15), the Microsemi integrated

verification and logic analysis tool that attaches to the serial port of a PC and communicates with the FPGA

via the JTAG port (see the "Silicon Explorer II Probe Interface" section on page 2-136).

In addition, Microsemi offers a Configurable Logic Analyzer Module (CLAM), which allows a real-time

verification and debug capability to be embedded into IP programmed into Microsemi FPGAs. CLAM

allows signals from the inside of the IP core to be routed to the exterior of the chip for verification

purposes.

Microsemi RTAX-S/SL and RTAX-DSP FPGAs offer enhanced capabilities beyond the successful

RTSX-SU family of radiation-tolerant FPGAs, adding embedded RAM, FIFOs, and high-speed I/Os, and

in the case of RTAX-DSP, adding embedded Mathblocks for enhanced signal processing. With the

support of a suite of robust software tools, design engineers can incorporate high gate counts and fixed

pins into an RTAX-S/SL or RTAX-DSP design yet still achieve high performance and efficient device

utilization in an SEU-hardened device.

Note: *Refer to the "Pin Descriptions" section on page 2-14 for more information.

Figure 1- 15 • Probe Setup RTAX-S/SL and RTAX-DSP

Serial

Connection

Additional 14 Channels

(Logic Analyzer)

RTAX-S/SL FPGAs

Silicon Explorer II

16-Pin

Connection

22-Pin

Connection

CH3/PRC*

CH4/PRD*

TDI*

TCK*

TMS*

PRA*

PRB*

TDO*

Revision 15 2-1

2 – Det ailed S pecifications

5 V Tolerance

3.3 V PCI and 3.3 V LVTTL (with clamp diode enabled) I/O standards directly allow 5 V tolerance. For

example, the 3.3V PCI I/O standard provides an internal clamp diode between the input pad and the

VCCI pad so that the voltage at the input pin is clamped below the absolute maximum input voltage of

4.1 V (Table 2-2 on page 2-2). An example of the input pad voltage level is shown in EQ 1:

Vinput = VCCI + Vdiode = 3.3 V + 0.7 V = 4.0 V

EQ 1

The internal VCCI clamp diode is only enabled while the device is powered on, so the voltage at the input

will not be clamped if the VCCI or VCCA are powered off. An external series resistor (~100 Ω) is required

between the input pin and the 5 V signal source to limit the current to less than 20 mA (Figure 2-1). The

100 Ω resistor was chosen to meet the input Tr/Tf requirement (Table 2-22 on page 2-26). The GND

clamp diode is available for all I/O standards and always enabled.

5 V tolerance is not allowable for VCCI greater than 3.3 V or for input signals greater than 5.0 V.

Table 2-1 • I/O Features Comparison

I/O Assignment Clamp

Diode Hot Insertion /

Cold Sparing 5 V Tolerance Input Buffer Output Buffer

3.3 V LVTTL Yes1No Yes1,2 Enabled/Disabled

3.3 V PCI Yes No Yes2Enabled/Disabled

LVCMOS 2.5 V No Yes No Enabled/Disabled

LVCMOS 1.8 V No Yes No Enabled/Disabled

LVCMOS 1.5 V (JESD8-11) No Yes No Enabled/Disabled

Voltage-Referenced Input Buffer No Yes No Enabled/Disabled

Differential, LVDS/LVPECL, Input No Yes No Enabled Disabled3

Differential, LVDS/LVPECL, Output No Yes No Disabled Enabled4

Notes:

1. Default setting for the clamp diode is set to be PCI. The LVTTL clamp diode is not enabled by default. To allow 5 V

tolerance, t he LVTTL cl amp diode need s to be enabled usi ng setting s in Design er. Hot-i nsertion and c old-sparin g are no t

supported when the clamp diode is enabled. In other words, 5 V tolerance and hot-swapping/cold-sparing cannot

coexist.

2. Can be implemented with an external resistor.

3. The OE input of the output buffer is automatically deasserted by Designer.

4. The OE input of the output buff er is automatically asserted by Designer.

Figure 2- 1 • Use of an External Resistor for 5 V Tolerance

Rext

Non-Microsemi Part Microsemi FPGA

5 V 3.3 V 3.3 V

VCCI

Clamp

Diode

GND

Clamp

Diode

Detailed Specifications

2-2 Revision 15

Operating Conditions

Absolute Maximum Conditions

Stresses beyond those listed in Ta b le 2-2 may cause permanent damage to the device. Exposure to

Absolute Maximum rated conditions for extended periods may affect device reliability. Devices should not

be operated outside the recommended operating conditions in Table 2-3.

Table 2-2 • Absolute Maximum Ratings

Symbol Parameter Limits Units

TJJunction Temperature –55 to +135 °C

VCCA AC Core Supply Voltage1–0.3 to 1.8 V

VCCA DC Core Supply Voltage –0.3 to 1.7 V

VCCI2DC I/O Supply Voltage –0.3 to 3.75 V

VREF DC I/O Reference Voltage –0.3 to 3.75 V

VI Input Voltage –0.5 to 4.1 V

VO Output Voltage –0.5 to 3.75 V

TSTG Storage Temperature –60 to +150 °C

VCCDA3Supply Voltage for Differential I/Os –0.3 to 3.75 V

Notes:

1. The AC transient VCCA limit is for radiation-induced transients less than 10 µs duration and not intended for

repetitive use. Core voltage spikes from a single event transient will not negatively affect the reliability of the

device if, for this non-repetitive event, the transient does not exceed 1.8 V at any time and the total time that

the transient exceeds 1.575 V does not exceed 10 µs in duration.

2. The absolute maximum ratings of VCCI are applicable to all I/O standards supported by the device.

3. VCCDA must be greater than or equal to the highest VCCI voltage

Table 2-3 • RTAX-S/SL and RTAX-DSP Recommended Operating Conditions

Parameter Range Military Units

Junction Temperature (TJ) –55 to +125 °C

Ambient Temperature (TA)1 –55 to +125 °C

1.5 V Core Supply Voltage 1.425 to 1.575 V

1.5 V I/O Supply Voltage 1.425 to 1.575 V

1.8 V I/O Supply Voltage 1.71 to 1.89 V

2.5 V I/O Supply Voltage 22.375 to 2.625 V

3.3 V I/O Supply Voltage 3.0 to 3.6 V

2.5 V VCCDA I/O Supply Voltage (no differential I/O used)22.375 to 2.625 V

3.3 V VCCDA I/O Supply Voltage (differential or voltage-referenced I/O used)33.0 to 3.6 V

3.3 V VPUMP Supply Voltage 3.0 to 3.6 V

Notes:

1. Ambient temperature (TA) is used for commerci al and indu stri al grades; case temp erature (TC) is used fo r

military grades.

2. Please see "VCCDA Supply Voltage" on page 2-14 more detail.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-3

Overshoot/Undershoot Limits

For AC signals, the input signal may undershoot during transitions to –1.0 V for no longer than 10% of

the period or 11 ns (whichever is smaller). Current during the transition must not exceed 95 mA.

For AC signals, the input signal may overshoot during transitions to VCCI + 1.0 V for no longer than 10%

of the period or 11 ns (whichever is smaller). Current during the transition must not exceed 95 mA.

Note: The above specification does not apply to the PCI standard. The RTAX-S/SL and RTAX-DSP PCI

I/Os are compliant to the PCI standard including the PCI overshoot/undershoot specifications.

Power-Up/Down Sequence

VCCA, VCCI, and VCCDA can be powered up or powered down in any sequence. During power-up, all

RTAX-S/SL and RTAX-DSP I/Os are tristated until they reach the state defined by the design. During

power-down, all RTAX-S/SL and RTAX-DSP I/Os are tristated.

Refer to the Board-Level Considerations for Power-Up and Power-Down of RTAX-S/SL FPGAs

application note for more information.

Calculating Power Dissipation

Table 2-4 • RTAX-S Standby Current

Device Temperature ICCA (mA) ICCI (mA) ICCDA (mA) ICCDIFFA (mA) IIH, IIL, IOZ (µA)1

RTAX4000S Typical 25ºC 75 15 15 3.13 1

125ºC 600 60 20 3.7 5

RTAX2000S Typical 25ºC 50 10 7 2.96 1

125ºC 500 35 10 3.13 5

RTAX1000S Typical 25ºC 30 10 7 2.96 1

125ºC 450 35 10 3.13 5

RTAX250S Typical 25ºC 20 5 5 2.96 1

125ºC 250 20 10 3.13 5

Notes:

1. IIH, IIL, or IOZ values are measured with inputs at the same level as VCCI for IIH and GND for IIL and IOZ.

2. Abov e v al ues are max i mum.

3. Values in the ICCDIFFA column refer to the current (in addition to ICCDA) flowing per pair through

differential amplifiers only when using differential pairs or voltage references pins.

Detailed Specifications

2-4 Revision 15

Table 2-5 • RTAX-SL Standby Current

Device Temperature ICCA (mA) ICCI (mA) ICCDA (mA) ICCDIFFA (mA) IIH , IIL, IOZ (µA)1

RTAX4000SL Typical 25ºC 40 15 15 3.13 1

125ºC 300 60 20 3.7 5

RTAX2000SL Typical 25ºC 30 10 7 3.13 1

125ºC 150 35 10 3.7 5

RTAX1000SL Typical 25ºC 20 10 7 3.13 1

125ºC 90 35 10 3.7 5

RTAX250SL Typical 25ºC 15 5 5 3.13 1

125ºC 60 20 10 3.7 5

Notes:

1. IIH, IIL, or IOZ values are measured with inputs at the same level as VCCI for IIH and GND for IIL and IOZ.

2. Abov e v al ues are max i mum.

3. Values in the ICCDIFFA column refer to the current (in addition to ICCDA) flowing per pair through

differential amplifiers only when using differential pairs or voltage references pins.

Table 2-6 • RTAX-DSP Standby Current

Device Temperature ICCA (mA) ICCI (mA) ICCDA (mA) ICCDIFFA (mA) IIH, IIL, IOZ (µA)1

RTAX4000D Typical 25ºC 75 15 15 3.13 1

125ºC 600 60 20 3.7 5

RTAX2000D Typical 25ºC 50 10 7 3.13 1

125ºC 500 35 10 3.7 5

Notes:

1. IIH, IIL, or IOZ values are measured with inputs at the same level as VCCI for IIH and GND for IIL and IOZ.

2. Abov e v al ues are max i mum.

3. Values in the ICCDIFFA column refer to the current (in addition to ICCDA) flowing per pair through

differential amplifiers only when using differential pairs or voltage references pins.

Table 2-7 • RTAX-DL Standby Current

Device Temperature ICCA (mA) ICCI (mA) ICCDA (mA) ICCDIFFA (mA) IIH, IIL, IOZ (µA)1

RTAX4000DL Typical 25ºC 40 15 15 3.13 1

125ºC 300 60 20 3.7 5

RTAX2000DL Typical 25ºC 30 10 7 3.13 1

125ºC 150 35 10 3.7 5

Notes:

1. IIH, IIL, or IOZ values are measured with inputs at the same level as VCCI for IIH and GND for IIL and IOZ.

2. Above values are maximum.

3. Values in the ICCDIFFA column refer to the current (in addition to ICCDA) flowing per pair through

differential amplifiers only when us ing differential pairs or voltage references pins.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-5

Table 2-8 • Default Cload / VCCI

CLOAD (pF) VCCI (V) PLOAD (µW/MHz) P10 (µW/MHz) PI/O (µW/MHZ)*

Single-Ende d without VREF

LVCMOS – 15 (JESD8-11) 35 1.5 78.8 49.5 128.3

LVCMOS –18 35 1.8 113.4 73.4 186.8

LVCMOS – 25 35 2.5 218.8 148.0 366.8

LVTTL 8 mA Low Slew 35 3.3 381.2 118.7 499.9

LVTTL 12 mA Low Slew 35 3.3 381.2 138.6 519.8

LVTTL 16 mA Low Slew 35 3.3 381.2 150.8 532.0

LVTTL 24 mA Low Slew 35 3.3 381.2 169.2 550.4

LVTTL 8 mA High Slew 35 3.3 381.2 130.3 511.5

LVTTL 12 mA High Slew 35 3.3 381.2 165.9 547.1

LVTTL 16 mA High Slew 35 3.3 381.2 225.1 606.3

LVTTL 24 mA High Slew 35 3.3 381.2 267.5 648.7

PCI 10 3.3 108.9 218.5 327.4

PCI-X 10 3.3 108.9 162.9 271.8

Single-Ended with VREF

SSTL2-I 30 2.5 – 171.7 171.7

SSTL2-II 30 2.5 – 148.3 148.3

SSTL3-I 30 3.3 – 327.8 327.8

SSTL3-II 30 3.3 – 288.9 288.9

HSTL-I 20 1.5 – 41.4 41.4

GTLP – 33 10 3.3 – 68.5 68.5

Differential

LVPECL – 33 N/A 3.3 – 260.6 260.6

LVDS – 25 N/A 2.5 – 145.8 145.8

Note: *PI/O = P10 + Cload * VCCI2

Detailed Specifications

2-6 Revision 15

Table 2-9 • Different Components Contributing to the Total Power Consumption in RTAX-S/SL/DSP Devices

Sym. Power Component

Device-Specific Value (in µW/MHz)

RTAX250S/SL RTAX1000S/SL RTAX2000S/SL RTAX4000S/SL RTAX2000D/DL RTAX4000D/DL

P1 Core tile HCLK power

component

85.8 227.5 378.0 700 378.0 700.0

P2 R-cell power component 0.6 0.6 0.6 0.6 0.6 0.6

P3 HCLK signal power

dissipation

7.7 23.2 31.0 50.0 31.0 50.0

P4 Core tile RCLK power

component

85.8 227.5 378.0 700 378.0 700.0

P5 R-cell power component 0.9 0.9 0.9 0.9 0.9 0.9

P6 RCLK signal power

dissipation

8.6 25.7 34.3 55.0 34.3 55.0

P7 Power dissipation due to

the switching activity on

the R-cell

1.6 1.6 1.6 1.6 1.6 1.6

P8 Power dissipation due to

the switching activity on

the C-cell

1.4 1.4 1.4 1.4 1.4 1.4

P9 Power component

associated with input

voltage

10.0 10.0 10.0 10.0 10.0 10.

P10 Power component

associated with output

voltage

See Table 2-4 and Table 2-5 on page 2-4 for per pin contribution.

P11 Power component

associated with the read

operation in the RAM

block

25.0 25.0 25.0 25.0 25.0 25.0

P12 Power component

associated with the write

operation in the RAM

block

30.0 30.0 30.0 30.0 30.0 30.0

P13 Math Block multiplier

only

–– – – 9 9

P14 Math Block multiplier

with adder

–– – – 1515

P15 Math Block multiplier

only – SIMD

–– – –5.95.9

P16 Math Block multiplier

with adder – SIMD

– – – – 10.2 10.2

P17 Math Block clock

contribution

– – – – 59.26 59.26

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-7

Ptotal = Pdc + Pac

PHCLK= (P1 + P2 * s + P3 * sqrt[s]) * Fs

PCLK = (P4 + P5 * s + P6 * sqrt[s]) * Fs

PR-cells = P7 * ms * Fs

PC-cells = P8 * mc * Fs

Pinputs = P9 * pi * Fpi

Poutputs = (P10 + Cload * VCCI2) * po * Fpo

Pmemory = P11 * Nblock * FRCLK + P12 * Nblock * FWCLK

PMathBlock = Nblock * FCLK * ( P17 (if pipe) + P13 ) when SIMD = No and Add = No

PMathBlock = Nblock * FCLK * ( P17 (if pipe) + P14 ) when SIMD = No and Add = Yes

PMathBlock = Nblock * FCLK * ( P17 (if pipe) + P15 ) when SIMD = Yes and Add = No

PMathBlock = Nblock * FCLK * ( P17 (if pipe) + P16 ) when SIMD = Yes and Add = Yes

Pdc =I

CCA * VCCA + ICCI * VCCI + ICCDA * VCCDA + ICCDIFFA * VCCDA * Nb_da_pairs

Pac =P

HCLK + PCLK + PR-cells + PC-cells + Pinputs + Poutputs + Pmemory + Pmathblock

Nb_da_pairs = number of differential pairs or voltage referenced pins used

s = number of R-cells clocked by this clock

Fs = clock frequency

s = number of R-cells clocked by this clock

Fs = clock frequency

ms = number of R-cells switching at each Fs cycle

Fs = clock frequency

mc = number of C-cells switching at each Fs cycle

Fs = clock frequency

pi = number of inputs

Fpi = average input frequency

Cload = output load (technology dependent)

VCCI = output voltage (technology dependent)

po = number of outputs

Fpo = average output frequency

Nblock = number of RAM/FIFO blocks (1 block = 4 k)

FRCLK = read-clock frequency of the memory

FWCLK = write-clock frequency of the memory

Nblock = Number of math blocks

FCLK =Clock frequency

SIMD = Mode of the math block: fractured (SIMD = Yes) or normal (SIMD = No)

Add = Configuration of the math block: multiply only (Add = No) or multiply-accumulate

(Add = Yes)

pipe = P17 should be added if the internal registers of the math block are used.

Detailed Specifications

2-8 Revision 15

Power Estimation Example

This example employs an RTAX1000S/SL shift-register design with 1,080 R-cells, one C-cell, one reset

input, and one output. This design also uses a single clock (HCLK) at 100 MHz and is operated under

room temperature.

ms = 1,080 (in a shift register 100% of R-cells are toggling at each clock cycle)

Fs = 100 MHz

s = 1,080

=> PHCLK = (P1 + P2 * s + P3 * sqrt[s]) * Fs = 163.8 mW

and Fs = 100 MHz

=> PR-cells = P7 * ms * Fs = 172.8 mW

mc = 1 (1 C-cell in this design)

and Fs = 100 MHz

=> PC-cells = P8 * mc * Fs = 0.14 mW

Fpi ~ 0 MHz

and pi= 1 (1 reset input => this is why Fpi = 0)

=> Pinputs = P9 * pi * Fpi = 0 mW

Fpo = 50 MHz

Cload = 35 pF

VCCI= 3.3 V

and po = 1

=> Poutputs = (P10 + Cload * VCCI2) * po * Fpo = 23.6 mW

No RAM/FIFO in this shift-register

=> Pmemory = 0 mW

Pac =P

HCLK + PCLK + PR-cells + PC-cells + Pinputs + Poutputs + Pmemory = 360.4 mW

Pdc =I

CCA * VCCA + ICCI * VCCI + ICCDA * VCCDA + ICCDIFFA * VCCDA * Nb_da_pairs = 101.1

Ptotal =P

dc + Pac = 360.4 mW + 101.1 mW = 461.5 mW

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-9

Thermal Characteristics

The temperature variable in Microsemi Designer software refers to the junction temperature, not the

ambient, case or board temperature. This is an important distinction because dynamic and static power

consumption causes the chip's junction temperature to be higher than the ambient, case or board

temperature. EQ 2, EQ 3, and EQ 4 show the relationship between thermal resistance, temperature, and

power.

EQ 2

EQ 3

EQ 4

Where:

θja =Thermal resistance from junction to air

θjc =Thermal resistance from junction to case

θjb =Thermal resistance from junction to board

Tj= Junction Temperature

Ta= Ambient Temperature

Tc= Case Temperature

Tb= Board Temperature

P=Power

Table 2-10 • Package Thermal Characteristics

Product Package Type θja θjc θjb Units

RTAX250S/SL CQ208 19.9 0.8 N/A C/W

CQ352 16.8 0.7 N/A C/W

CG624 13.7 TBD TBD C/W

RTAX1000S/SL CQ352 13.3 0.4 N/A C/W

CG624 10.8 5.6 4.5 C/W

RTAX2000S/SL CQ256 15.8 0.25 N/A C/W

CQ352 12.3 0.2 N/A C/W

CG624 9.7 4.3 3.5 C/W

CG1152 9.0 2.0 2.6 C/W

RTAX4000S/SL CQ352 12.3 0.2 N/A C/W

CG1272 8.0 2.0 2.2 C/W

RTAX2000D/DL CQ352 TBD TBD N/A C/W

CGD1272 TBD TBD TBD C/W

RTAX4000D/DL CQ352 TBD 0.17 N/A C/W

CGD1272 TBD TBD TBD C/W

Notes:

1. θja are estimated at still air.

2. θjc for CQFP p ackages refers to t he thermal res istance between the junction and the bott om surface of the

package.

3. θjc for CCGA packages refers to the thermal resistance between the junction and the top surface of the

package.

4. The θjb values are conduction heat transfer simulation only.

θja TjTa

–

-----------------=

θjc TjTc

–

-----------------=

θjb TjTb

–

-----------------=

Detailed Specifications

2-10 Revision 15

Calculation for Power

Sample Case 1

A sample calculation of the power dissipation allowed for an RTAX1000S/SL-CG624 in still air is shown

below. Assume that the maximum junction temperature is maintained at 110°C and the ambient

temperature is 50°C. The maximum power allowed can be estimated using EQ 5.

Tj = 110°C

Ta = 50°C

EQ 5

P = 5.55 W

Sample Case 2

A sample calculation of the power dissipation when there is no air in the environment is shown below. An

RTAX1000S/SL-CQ352 is attached to the board with a thermal adhesive between the package body. The

thermal resistance of the paste is 0.58°C/W. Since air is not present in the environment, most of the heat

will be flowing through the bottom of the package, through the thermal paste, and to the board.

Neglecting the heat flowing through the package leads, the maximum power allowed can be estimated

as shown in EQ 6 through EQ 9.

Tj = 110°C

θcb = Thermal resistance of the thermal paste from case to board (i.e., = 0.58°C/W)

Tb = 70°C

EQ 6

EQ 7

EQ 8

EQ 9

P = 40.8 W

Figure 2- 2 • Heat Flow when Air is Present

θja 10.8°C/W 110°C 50°C–

------------------------------------==

Solder Columns

Air

PCB

θjb (Total)

110°C 70°C–

------------------------------------=

θjb (Total) θjc θcb

θjc θcb

+110°C 70°C–

------------------------------------=

0.4°C/W 0.58°C/W+110°C 70°C–

------------------------------------=

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-11

The thermal resistances, shown in Table 2-10 on page 2-9, are based on the simulations done with test

conditions and test boards configurations specified in JEDEC specification JESD51.

Timing Characteristics

RTAX-S/SL and RTAX-DSP devices are manufactured in a CMOS process, therefore, device

performance varies according to temperature, voltage, and process variations. Minimum timing

parameters reflect maximum operating voltage, minimum operating temperature, and best-case

processing. Maximum timing parameters reflect minimum operating voltage, maximum operating

temperature, and worst-case processing. The derating factors shown in Table 2-11 should be applied to

all timing data contained within this datasheet.

All timing numbers listed in this datasheet represent sample timing characteristics of RTAX-S/SL and

RTAX-DSP devices. Actual timing delay values are design-specific and can be derived from the

SmartTime tool in Microsemi’s Designer software after place-and-route.

Figure 2- 3 • Heat Flow in a Vacuum

Table 2-11 • Temperature and Voltage Timing Derating Fac tors

(Normalized to Worst-Case Military, TJ = 125°C, VCCA = 1.4 V)

VCCA

Junction Temperature

–55°C –40°C 0°C 25°C 70°C 85°C 125°C

1.4 V 0.76 0.77 0.81 0.84 0.90 0.92 1.00

1.425 V 0.75 0.76 0.80 0.83 0.89 0.92 0.99

1.5 V 0.73 0.74 0.78 0.81 0.87 0.90 0.97

1.575 V 0.72 0.73 0.77 0.79 0.86 0.88 0.96

1.6 V 0.71 0.72 0.76 0.79 0.85 0.88 0.95

Notes:

1. The user can set the junction temperature in Designer software to be any integer value in the range of

–55°C to 125°C.

2. The user can set the core voltage in Designer software to be any value between 1.4V and 1.6V.

Thermal Adhesive

PCB

Detailed Specifications

2-12 Revision 15

Timing Model

Note: Timing data is for the RTAX2000S/SL, –1 speed.

Figure 2-4 • Timing Model

Combinatorial

Cell

Combinatorial

Cell

Combinatorial

Cell

Combinatorial

Cell

DQ DQ DQ

FCO

Routed Clock

LVPECL

LVDS

Hardwired or Routed Clock

Routed or Hardwired

I/O Module

(Registered) I/O Module

(Nonregistered)

I/O Module

(Non- registered)

I/O Module

(Nonregistered)

Buffer

Module

Buffer

Module

Buffer

Module

Carry Chain

I/O

LVTTL

Output Drive Strength = 4 (24mA)

High Slew Rate

HCKH

= 3.64 ns

MAX

(external) = 350 MHz

MAX

(internal) = 649 MHz

SUD

= 0.31 ns

ICLKQ

= 0.90 ns

= 1.83 ns

RD2

= 0.84 ns

= 2.00 ns

HCKL

= 3.48 ns

RCKL

= 3.55 ns

RCO

= 0.94 ns

SUD

= 0.21 ns

RD1

= 0.66 ns

= 0.95 ns

RCKL

= 3.54 ns

MAX

(external) = 350 MHz

MAX

(internal) = 649 MHz

RCO

= 0.94 ns

SUD

= 0.21 ns

BPFD

= 0.21ns

= 1.26 ns

GTL + 3.3V

OCLKQ

= 0.90 ns

SUD

= 0.31 ns

BFPD

= 0.17 ns t

= 0.95 ns t

BFPD

= 0.17 ns

PDC

= 0.69 ns t

CCY

= 0.75 ns

= 3.51 ns

= 2.45 ns

RD1

= 0.66 ns

RD2

= 0.84 ns

RD3

= 1.07 ns

RCKH

= 3.71 ns

RCKL

= 3.54 ns

LVTTL

= 1.84 ns

LVTTL

= 1.84 ns

LVTTL

= 1.84 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-13

Hardwired Clock1

Routed Clock

External Setup

=(t

DP + tRD2 + tSUD) – tHCKH

= (1.84 + 0.84 + 0.31) – 3.64

= –0.65

Clock-to-Out (Pad-to-Pad)

HCKH + tRCO + tRD1 + tPY

= 3.64 + 0.94 + 0.66 + 3.51

= 8.75 ns

1. Calculations are examples of how to calculate related parameters and do not necessary match the path represented in the

"Timing Model".

External Setup

=(t

DP + tRD2 + tSUD) – tRCKH

= (1.84 + 0.84 + 0.31) – 3.54

= –0.72 ns

Clock-to-Out (Pad-to-Pad)

RCKH + tRCO + tRD1 + tPY

= 3.71 + 0.94 + 0.66 + 3.51

= 8.82 ns

Detailed Specifications

2-14 Revision 15

I/O Specifications

Pin Descriptions

Supply Pins

GND Ground

Low supply voltage.

VCCA Supply Voltage

Supply voltage for array (1.5 V).

VCCIBx Supply Voltage

Supply voltage for I/Os. Bx is the I/O Bank ID – 0 to 7. See "User I/Os" on page 2-16 for more

information. Unused VCCIBX I/O banks may be tied to GND or can be tied to other used VCCIBX I/O

banks within the same device.

VCCDA Su pp ly Voltage

Supply voltage for the I/O differential amplifier and JTAG and probe interfaces. VCCDA is either 3.3 V or

2.5 V and must use 3.3 V when voltage-referenced and/or differential is used. Additionally, VCCDA must

be greater than or equal to any VCCI voltages (i.e. VCCDA ≥ VCCIBx).

VPUMP Supply Voltage (External Pump)

External supply voltage to drive the charge pump, which controls the isolation transistors of logic

modules. There is also an internal source which can power the charge pump. The external pump uses

less current than the internal pump. VPUMP current is included in ICCDA. As a result, the user will see

less ICCDA current with the external pump. Refer to Table 2-4 on page 2-3 for the ICCDA range.

To use the external pump, VPUMP must be 3.3 V to 3.6 V. To use the internal pump, the VCCA supply

must be powered up and VPUMP can be directly tied or through a 1K resistor to GND.

There are no power sequencing requirements on VPUMP. If VPUMP is powered before VCCA, the

device initializes with the external pump. If VPUMP is powered after VCCA, the device will initialize with

the internal pump and switch to the external pump once VPUMP reaches 3.3 V.

User-Defined Supply Pins

VREF Supply Voltage

Reference voltage for I/O banks. VREF pins are configured by the user from regular I/O pins; VREF are

not in fixed locations. There can be one or more VREF pins in an I/O bank. The user does not need to

assign VREF pins for OUTBUF and TRIBUF. VREF pins are needed only for input and bidirectional I/Os.

Global Pins

HCLKA/B/C/D Dedicated (Hardwired)

Clocks A, B, C, and D

These pins are the clock input for sequential modules. Input levels are compatible with all supported I/O

standards (there is a P/N pin pair for support of differential I/O standards). This input is directly wired to

each R-cell and offers clock speeds independent of the number of R-cells being driven. HCLK pins may

be used either as HCLK inputs or as user I/Os. If they are not being used for either purpose, Microsemi

recommends that they are tied to a known state.

CLKE/F/G/H Global Clocks E, F, G, and H

These pins are clock inputs for clock distribution networks. Input levels are compatible with all supported

I/O standards (there is a P/N pin pair for support of differential I/O standards). The clock input is buffered

prior to clocking the R-cells. CLK pins may be used either as CLK inputs or as user I/Os. If they are not

being used for either purpose, Microsemi recommends that they are tied to a known state.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-15

JTAG/Probe Pins

PRA/B/C/D2Probes A, B, C, and D

The dedicated probe pins are used to output data from any user-defined design node within the device

(controlled with Silicon Explorer II). These independent diagnostic pins can be used to allow real-time

diagnostic output of any signal path within the device. The pins’ probe capabilities can be permanently

disabled to protect programmed design confidentiality. Refer to Table 2-117 on page 2-134 for

recommendations on pin status for flight boards.

TCK2 Test Clock

Test clock input for JTAG boundary-scan testing and diagnostic probe (Silicon Explorer II).

TDI2Test Data Input

Serial input for JTAG boundary-scan testing and diagnostic probe. TDI is equipped with an internal pull-

up resistor with approximately 10 kΩ resistance.

TDO2Test Data Output

Serial output for JTAG boundary-scan testing.

TMS Test Mode Select

The TMS pin controls the use of the IEEE 1149.1 boundary-scan pins (TCK, TDI, TDO, TRST). TMS is

equipped with an internal pull-up resistor with approximately 10 kΩ resistance.

TRST Boundary Scan Reset Pin

The TRST pin functions as an active-low input to asynchronously initialize or reset the boundary scan

circuit. The TRST pin is equipped with a programmable pull-up resistor with approximately 10 kΩ

resistance. This pin must be hardwired to ground for flight.

Special Functions

NC No Connection

This pin is not connected to circuitry within the device, or to any other pin in the package. These pins can

be driven to any voltage or can be left floating with no effect on the operation of the device.

2. Microsemi recommends that you use a series terminatio n resistor on every probe connector (TDI, TCK, T DO, PRA, PRB,

PRC, and PRD). The series termination is used to prevent data transmission corruption (i.e., due to reflection from the

FPGA to the probe connector) during pr obing and reading back the checksum. With an internal setup we have seen 70-

ohm termination resistor improved the signal transmission. Since the series termination depends on the setup, Microsemi

recommends users to calculate the termination resistor for their own setup. Below is a guideline on how to calculate the

resistor value.

The resistor value should be chosen so that the sum of it and the probe signal’s driver impedance equals the effective trace

impedance.

Z0 = Rs + Zd

Z0 = trace impedance (silicon explorer’s breakout cable’s resistance + PCB trace impedance), Rs = series termination,

Zd = probe signal’s driver impedance.

The termination resistor should be placed as close as possible to the driver.

Among the probe signals, TDI, TCK, and TMS are driven by Silicon Explorer. A54SX16 is used in Silicon Explorer and

hence the driver impedances needs to be calculated from RTAX-S IBIS Models (Mixed Voltage Operation). PRA, PRB,

PRC, PRD, and TDO are driven by the FPGA and driver impedance can also be calcula ted from the IBIS Model.

Silicon explorer’s breakout cable’s resistance is usually close to 1 ohm.

Detailed Specifications

2-16 Revision 15

User I/Os3

Introduction

The RTAX-S/SL and RTAX-DSP families feature a flexible I/O structure, supporting a range of mixed

voltages (1.5 V, 1.8 V, 2.5 V, and 3.3 V) with its bank-selectable I/Os. Table 2-12 on page 2-17 contains

the I/O standards supported by the RTAX-S/SL and RTAX-DSP families.

Unused I/Os are configured as follows:

• Output buffer is disabled (with tristated value of Hi-Z)

• Input buffer is disabled (with tristated value of Hi-Z)

• No pull-up/pull-down is programmed

In Microsemi Designer Software, unused RTAX-S/SL I/Os are configured as tristate with no pull-up

resistors.

Each I/O provides programmable slew rates, drive strengths, and weak pull-up and weak pull-down

circuits. The slew rate setting is effective for both rising and falling edges.

All I/O standards are 3.3 V tolerant, and I/O standards, except 3.3 V PCI, are capable of hot insertion and

cold sparing. 3.3 V PCI is also 5 V tolerant with the aid of an external resistor (see "5 V Tolerance" on

page 2-1).

Each I/O includes three registers: an input (InReg), an output (OutReg), and an enable register (EnReg).

By design, all user flip-flops in the RTAX-S/SL and RTAX-DSP FPGAs are immune to SEUs, including

the following three registers located in every I/O cell buffer: InReg, OutReg, and EnReg.

I/Os are organized into banks, and there are eight banks per device – two per side (

Figure 2-7 on page 2-25

Each I/O bank has a common VCCI, the supply voltage for its I/Os.

For voltage-referenced I/Os, each bank also has a common reference-voltage bus, VREF. While VREF

must have a common voltage for an entire I/O bank, its location is user-selectable. In other words, any

user I/O in the bank can be selected to be a VREF

The location of the VREF pin should be selected according to the following rules:

• Any pin that is assigned as a VREF can control a maximum of eight user I/O pad locations in each

direction (16 total maximum) within the same I/O bank.

• I/O package locations listed as no-connects are counted as part of the 16 maximum. In many

cases, this leads to fewer than eight user I/O package pins in each direction being controlled by a

VREF pin.

• Dedicated I/O pins (GND, VCCI...) are not counted as part of the 16.

• The user I/O pad immediately adjacent on either side of the VREF pin may only be used as an input.

The exception is when there is a VCCI/GND pair separating the VREF pin and the user I/O pad

location.

The differential amplifier supply voltage VCCDA should be connected to 3.3 V. When neither voltage-

referenced nor differential I/Os are used, VCCDA may be connected to 2.5 V when VCCI ≤ 2.5 V in a

given I/O bank; however, it is still recommended to connect VCCDA to 3.3 V.

The user can gain access to the various I/O standards in three ways:

• Instantiate specific library macros that represent the desired specific standard

• Use generic I/O macros and then use Microsemi Designer’s PinEditor to specify the desired I/O

standards. (Please note that this is not applicable to differential standards.)

• A combination of the first two methods

3. Do not use an external resistor to pull the I/O above VCCI for a higher logic “1” voltage level. The desired higher logic “ 1”

voltage level will be degraded due to a small I/O current, which exists when the I/O is pulled up above VCCI.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-17

Please refer to the I/O Features in Axcelerator Family Devices application note and the Antifuse Macro

Library Guide for more details.

Simultaneous Switching Outputs (SSO)

Microsemi defines SSOs as any outputs that transition in phase within a 1 ns window. The

measurements made by Microsemi are based on the following worst-case conditions:

1. The switching outputs are adjacent to the quiet output on either side.

2. All unused I/O buffers are tristated so they do not help either ground or VCC.

3. A worst-case package was used.

When multiple output drivers switch simultaneously, they induce a voltage drop in the chip/package

power distribution. This simultaneous switching momentarily raises the ground voltage within the device

relative to the system ground. This apparent shift in the ground potential to a non-zero value is known as

simultaneous switching noise (SSN) or more commonly, ground bounce.

SSN becomes more of an issue in high pin count packages and when using high performance devices

such as the RTAX-S/SL and RTAX-DSP families.

Please refer to the Simultaneous Switching Noise and Signal Integrity application note for more

information.

I/O Banks and Compatibility

Since each I/O bank has its own user-assigned input reference voltage (VREF) and an input/output

supply voltage (VCCI), only I/Os with compatible standards can be assigned to the same bank.

Table 2-13 shows the compatible I/O standards for a common VREF (for voltage-referenced standards).

Similarly, Table 2-14 on page 2-18 shows compatible standards for a common VCCI.

Table 2-12 • I/O Standards Sup porte d by the RTAX-S /SL and RTAX-DSP Fa mili es

I/O Standard Input/Output Supply

Voltage (VCCI)

Input Reference

Voltage (VREF)

Board Terminatio n

Voltage (VTT)

LVTTL 3.3 N/A N/A

LVCMOS 2.5 V 2.5 N/A N/A

LVCMOS 1.8 V 1.8 N/A N/A

LVCMOS 1.5 V (JDEC8-11) 1.5 N/A N/A

3.3 V PCI 3.3 N/A N/A

GTL+ 3.3 V 3.3 1.0 1.2

GTL+ 2.5 V*2.5 1.0 1.2

HSTL Class 1 1.5 0.75 0.75

SSTL3 Class 1 and II 3.3 1.5 1.5

SSTL2 Class1 and II 2.5 1.25 1.25

LVDS 2.5 N/A N/A

LVPECL 3.3 N/A N/A

Note: * 2.5 V GTL+ is not supported across the full mili tary temp erature range.

Table 2-13 • Compatible I/O Standards for Different VREF Values

VREF Compatible St andards

1.5 V SSTL 3 (Class I and II)

1.25 V SSTL 2 (Class I and II)

1.0 V GTL+ (2.5 V and 3.3 V Outputs)

0.75 V HSTL (Class I)

Detailed Specifications

2-18 Revision 15

Table 2-15 on page 2-19 summarizes the different combinations of voltages and I/O standards that can

be used together in the same I/O bank. Note that two I/O standards are compatible if:

• Their VCCI values are identical

• Their VREF standards are identical (if applicable)

For example, if LVTTL 3.3 V (VREF = 1.0 V) is used, then the other available (i.e., compatible) I/O

standards in the same bank are GTL+ and LVPECL.

Also note that when multiple I/O standards are used within a bank, the voltage tolerance will be limited to

the minimum tolerance of all I/O standards used in the bank. For instance, when using LVCMOS2.5 (±5%

VCCI tolerance) and LVDS (±5% VCCI tolerance) within an I/O bank, the maximum voltage tolerance of

the bank will be ±5% VCCI.

Table 2-14 • Compatible I/O Standards for Different VCCI Values

VCCI1Compatible Standards VREF

3.3 V LVTTL, PCI, LVPECL, GTL+ 3.3V 1.0

3.3 V SSTL 3 (Class I and II), LVTTL, PCI, LVPECL 1.5

2.5 V LVCMOS 2.5V, GTL+ 2.5V, LVDS21.0

2.5 V LVCMOS 2.5V, SSTL 2 (Classes I and II), LVDS21.25

1.8 V LVCMOS 1.8V N/A

1.5 V LVCMOS 1.5V, HSTL Class I 0.75

Notes:

1. VCCI is used for both inputs and outputs.

2. Refer to Table 2-3 on page 2-2 for VCCI tolerances.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-19

Table 2-15 • Legal I/O Usag e Matri x

I/O Standard

LVTTL 3.3 V

LVCMOS 2.5 V

LVCMOS1.8 V

LVCMOS1.5 V (JESD8-1 1)

3.3 V PCI

GTL + (3.3 V)

GTL + (2.5 V)

HSTL Class I (1.5 V)

SSTL2 Class I & II (2.5 V)

SSTL3 Class I & II (3.3 V)

LVDS (2.5 V ±5%)

LVPECL (3.3 V)

LVTTL 3. 3V (VREF = 1.0 V) ✓–––✓✓ –––––✓

LVTTL 3. 3V(VREF = 1.5 V) ✓–––✓––––✓–✓

LVCMOS 2.5 V (VREF = 1.0 V) – ✓––––✓–––✓–

LVCMOS 2.5 V (VREF = 1.25 V) – ✓––––––✓–✓–

LVCMOS1.8 V – – ✓–––––––––

LVCMOS1.5 V (VREF = 1.75 V) (JESD8-11) – – – ✓–––✓––– –

3.3 V PCI (VREF=1.0 V) ✓–––✓✓ –––––✓

3.3 V PCI (VREF=1.5 V) ✓–––✓––––✓–✓

GTL+ (3.3 V) ✓–––✓✓ –––––✓

GTL+ (2.5 V) – ✓––––✓–––––

HSTL Class I – – – ✓–––✓––– –

SSTL2 Class I & II – ✓––––––✓–✓–

SSTL3 Class I & II ✓–––✓––––✓–✓

LVDS (VREF=1.0 V) – ✓––––✓–––✓–

LVDS (VREF=1.25 V) – ✓––––––✓–✓–

LVPECL (VREF=1.0 V) ✓–––✓✓ –––––✓

LVPECL (VREF=1.5 V) ✓–––✓––––✓–✓

Notes:

1. Note that GTL+2.5 V is not supported across the full military temperature range.

2. A "✓" indicates whether standards can be used within a bank at the same time.

Examples:

a) LVTTL can be used with 3.3 V PCI and GTL+ (3.3 V), when VREF = 1.0 V (GTL+ requiremen t).

b) LVTTL can be used with 3.3 V PCI and SSTL3 Class I and II, when VREF = 1.5 V (SSTL3 requirement).

c) LVDS VCCI = 2.5 V ±5%.

Detailed Specifications

2-20 Revision 15

I/O Clusters

Each I/O cluster incorporates two I/O modules, four RX modules and two TX modules, and a buffer

module. In turn, each I/O module contains one Input Register (InReg), one Output Register (OutReg),

and one Enable Register (EnReg) (Figure 2-5).

Using an I/O Register

To access the I/O registers, registers must be instantiated in the netlist and then connected to the I/Os.

Usage of each I/O register (register combining) is individually controlled and can be selected/deselected

using the PinEditor tool in Microsemi's Designer software. I/O register combining can also be controlled

at the device level, affecting all I/Os. Please note, the I/O register option is deselected by default in any

given design.4

In addition, Designer software provides a global option to enable/disable the usage of registers in the I/Os.

This option is design specific. The setting for each individual I/O overrides this global option. Furthermore, the

Global Set Fuse option in the Designer software, when checked, causes all I/O registers to output logic HIGH

at device power-up.

Using the Weak Pull-Up and Pull-Down Circuits

Each RTAX-S/SL/DSP I/O comes with a weak pull-up/-down circuit (refer to Table 2-21 on page 2-26).

These are weak transistors with the gates tied on, so the on resistance of the transistor emulates a

resistor. The weak pull-up and pull-down is active only after the device is powered up, and they must be

biased to be on. When the rails are coming up, they are not biased fully, so they do not behave as

resistors until the voltage is at sufficient levels to bias the transistors. The key is they really are

transistors; they are not traces of poly silicon, which is another way to do an on-chip resistor (those take

much more room).

I/O macros are provided for combinations of pull-up/-down for LVTTL, LVCMOS (2.5 V, 1.8 V, and 1.5 V)

standards. These macros can be instantiated if a keeper circuit for any input buffer is required.

Figure 2- 5 • I/O Cluster Interface

4. Please note that register combining for multi fanout nets is not supported.

EnReg

DIN YOUT

Y DCIN

OutREg

DIN YOUT

InReg

I/O CLUSTER

FPGA LOGIC CORE

OEP

UOP

UIP

Slew Rate

I/O

OEN

UON

UIN

Drive Strength

Slew Rate

Drive Strength

P PAD

N PAD

Routed Input Track

Output Track

Routed Input Track

Output Track Output Track

EnReg

DIN YOUT

Y DCIN

OutREg

DIN YOUT

InReg

I/O

REF

BSR BSR

Routed Input Track

Output Track

Routed Input Track

HCLK or

RCLK

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-21

Customizing the I/O

• A five-bit programmable input delay element is associated with each I/O. The value of this delay is

set on a bank-wide basis (Table 2-16). It is optional for each input buffer within the bank (i.e. the

user can enable or disable the delay element for the I/O). When the input buffer drives a register

within the I/O, the delay element is activated by default to ensure a zero hold-time. The default

setting for this property can be set in Designer. When the input buffer does not drive a register, the

delay element is deactivated to provide higher performance. Again, this can be overridden by

changing the default setting for this property in Designer.

• The slew-rate value for the LVTTL output buffer can be programmed and can be set to either slow

or fast.

• The drive strength value for LVTTL output buffers can be programmed as well. There are four

different drive strength values – 8 mA, 12 mA, 16 mA, or 24 mA – that can be specified in

Designer.5

Table 2-16 • Bank Wide Delay Values

–1 Std.

Bit Setting Delay (ns)

00.881.03

11.101.29

21.211.42

31.441.69

41.531.80

51.752.06

61.862.19

72.092.46

82.162.54

92.382.80

10 2.49 2.93

11 2.72 3.20

12 2.81 3.30

13 3.04 3.57

14 3.15 3.70

15 3.37 3.96

16 3.39 3.98

17 3.61 4.25

18 3.72 4.38

19 3.95 4.64

20 4.04 4.75

21 4.27 5.01

22 4.38 5.14

23 4.60 5.41

24 4.67 5.49

25 4.90 5.76

26 5.01 5.89

27 5.23 6.15

28 5.32 6.26

29 5.55 6.52

30 5.66 6.65

31 5.88 6.92

Note: Data shown in the table above was measured at VCCA = 1.425 and 125°C.

5. These values are minimum drive strengths.

Detailed Specifications

2-22 Revision 15

Using the Differential I/O Standards

Differential I/O macros should be instantiated in the netlist. The settings for these I/O standards cannot

be changed inside Designer. Note that there are no tristated or bidirectional I/O buffers for differential

standards.

Using the Voltage-Referenced I/O Standards

Using these I/O standards is similar to that of single-ended I/O standards. Their settings can be changed

in Designer.

Using DDR (Double Data Rate)

In Double Data Rate mode, new data is present on every transition of the clock signal. Clock and data

lines have identical bandwidth and signal integrity requirements, making it very efficient for implementing

very high-speed systems.

To implement a DDR, users must do the following:

1. Instantiate an input buffer (with the required I/O standard).

2. Instantiate the DDR_REG macro (Figure 2-6 on page 2-22).

3. Connect the output from the Input buffer to the input of the DDR macro.

4. DDR supports all I/O standards.

5. The DDR macro in SmartGen can be used to implement DDR.

6. Bit width and I/O standard can be chosen in SmartGen.

Macros for Specific I/O Standards

There are different macro types for any I/O standard or feature that determine the required VCCI and

VREF voltages for an I/O. The generic buffer macros require the LVTTL standard with slow slew rate and

24 mA-drive strength. LVTTL can support high slew rate but this should only be used for critical signals.

Most of the macro symbols represent variations of the six generic symbol types:

• CLKBUF: Clock Buffer

• HCLKBUF: Hardwired Clock Buffer

• INBUF: Input Buffer

• OUTBUF: Output Buffer

• TRIBUFF: Tristate Buffer

• BIBUF: Bidirectional Buffer

Other macros include the following:

• Differential I/O standard macros: The LVDS and LVPECL macros either have a pair of differential

inputs (e.g. INBUF_LVDS) or a pair of differential outputs (e.g. OUTBUF_LVPECL).

• Pull-up and pull-down variations of the INBUF, BIBUF, and TRIBUFF macros. These are available

only with TTL and LVCMOS thresholds. They can be used to model the behavior of the pull-up

and pull-down resistors available in the architecture. Whenever an input pin is left unconnected,

the output pin will either go high or low rather than unknown. This allows users to leave inputs

unconnected without having the negative effect on simulation of propagating unknowns.

Figure 2- 6 • DDR Register

DQR

CLR

PRE

CLK

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-23

• DDR_REG macro. It can be connected to any I/O standard input buffers (i.e., INBUF) to

implement a double data rate register. Designer software will map it to the I/O module in the same

way it maps the other registers to the I/O module.

Table 2-17, Table 2-18 on page 2-24, and Table 2-19 on page 2-24 list all the available macro names

differentiated by I/O standard, type, slew rate, and drive strength.

Table 2-17 • Macros for Single-Ended I/O Standards

Standard VCCI Macro Names

LVTTL 3.3 V CLKBUF, HCLKBUF

INBUF,

OUTBUF,

OUTBUF_S_8, OUTBUF_S_12, OUTBUF_S_16, OUTBUF_S_24,

OUTBUF_F_8, OUTBUF_F_12, OUTBUF_F_16, OUTBUF_F_24,

TRIBUFF,

TRIBUFF_S_8, TRIBUFF_S_12, TRIBUFF_S_16, TRIBUFF_S_24,

TRIBUFF_F_8, TRIBUFF_F_12, TRIBUFF_F_16, TRIBUFF_F_24,

BIBUF,

BIBUF_S_8, BIBUF_S_12, BIBUF_S_16, BIBUF_S_24,

BIBUF_F_8, BIBUF_F_12, BIBUF_F_16, BIBUF_F_24,

3.3V PCI 3.3 V CLKBUF_PCI, HCLKBUF_PCI,

INBUF_PCI,

OUTBUF_PCI,

TRIBUFF_PCI,

BIBUF_PCI

LVCMOS25 2.5 V CLKBUF_LVCMOS25,

HCLKBUF_LVCMOS25,

INBUF_LVCMOS25,

OUTBUF_LVCMOS25,

TRIBUFF_LVCMOS25,

BIBUF_LVCMOS25

LVCMOS18 1.8 V CLKBUF_LVCMOS18,

HCLKBUF_LVCMOS18,

INBUF_LVCMOS18,

OUTBUF_LVCMOS18,

TRIBUFF_LVCMOS18,

BIBUF_LVCMOS18

LVCMOS15

(JESD8-11)

1.5 V CLKBUF_LVCMOS15,

HCLKBUF_LVCMOS15,

INBUF_LVCMOS15,

OUTBUF_LVCMOS15,

TRIBUFF_LVCMOS15,

BIBUF_LVCMOS15

Detailed Specifications

2-24 Revision 15

Table 2-18 • I/O Macros for Differential I/O Standards

Standard VCCI Macro Names

LVPECL 3.3 V CLKBUF_LVPECL, HCLKBUF_LVPECL,

INBUF_LVPECL, OUTBUF_LVPECL

LVDS 2.5 V CLKBUF_LVDS, HCLKBUF_LVDS,

INBUF_LVDS, OUTBUF_LVDS

Table 2-19 • I/O Macros for Voltage-Referenced I/O Standards

Standard VCCI VREF Macro Names

GTL+ 3.3 V 1.0 V CLKBUF_GTP33, HCLKBUF_GTP33, INBUF_GTP33,

OUTBUF_GTP33, TRIBUFF_GTP33, BIBUF_GTP33

GTL+ 2.5 V 1.0 V CLKBUF_GTP25, HCLKBUF_GTP25, INBUF_GTP25,

OUTBUF_GTP25, TRIBUFF_GTP25, BIBUF_GTP25

SSTL2 Class I 2.5 V 1.25 V CLKBUF_SSTL2_I, HCLKBUF_SSTL2_I,

TRIBUFF_SSTL2_I, BIBUF_SSTL2_I, INBUF_SSTL2_I,

OUTBUF_SSTL2_I

SSTL2 Class II 2.5 V 1.25 V CLKBUF_SSTL2_II, HCLKBUF_SSTL2_II,

TRIBUFF_SSTL2_II, BIBUF_SSTL2_II, INBUF_SSTL2_II,

OUTBUF_SSTL2_II

SSTL3 Class I 3.3 V 1.5 V CLKBUF_SSTL3_I, HCLKBUF_SSTL3_I,

TRIBUFF_SSTL3_I, BIBUF_SSTL3_I, INBUF_SSTL3_I,

OUTBUF_SSTL3_I

SSTL3 Class II 3.3 V 1.5 V CLKBUF_SSTL3_II, HCLKBUF_SSTL3_II,

TRIBUFF_SSTL3_II, BIBUF_SSTL3_II, INBUF_SSTL3_II,

OUTBUF_SSTL3_II

HSTL Class I 1.5 V 0.75 V CLKBUF_HSTL_I, BIBUF_HSTL_I, HCLKBUF_HSTL_I,

INBUF_HSTL_I, OUTBUF_HSTL_I, TRIBUFF_HSTL_I

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-25

User I/O Naming Conventions

Due to the complex and flexible nature of the RTAX-S/SL family’s user I/Os, a naming scheme is used to

show the details of the I/O. The naming scheme explains to which bank an I/O belongs, as well as the

pairing and pin polarity for differential I/Os (Figure 2-7).

Figure 2- 7 • I/O Bank and Dedicated Pin La yo ut

Figure 2- 8 • General Naming Schemes

Corner4 Corner3

Corner1

I/O BANK 3 I/O BANK 2

I/O BANK 0

I/O BANK 5

I/O BANK 1

I/O BANK 4

I/O BANK 7 I/O BANK 6

Corner2

RTAX-S/SL/DSP GND

VCCDA

GND

VCCDA

VPUMP

GND

VCCDA

GND

VCCDA

GND

VCCDA

GND

VCCDA

GND

VCCDA

GND

VCCDA

GND

VCCA

GND

VCCA

GND

VCCA

GND

VCCA

GND

VCCA

GND

VCCA

GND

VCCI

GND

VCCI

GND GND

VCCI

GND

VCCI

GND

VCCDA

GND

VCCDA

GND

VCCDA

GND

VCCA

GND

VCCA

GND

VCCI

GND

VCCI

GND

VCCI

PRB

PRA

TDO

TDI

TCK

TMS

TRST

PRC

PRD

IOxxXBxFx

Fx refers to an

unimplemented feature

and can be ignored

Bank I/D 0 through 7,

clockwise from IOB NW

P - Positive Pin/ N- Negative Pin

Pair number in the

bank, starting at 00,

clockwise from IOB NW

IO12PB1F1 Is the positive pin of the thirteenth pair of the

first I/O bank (IOB NE). IO12PB1 combined

with IO12NB1 form a differential pair.

For those I/Os that can be employed

either as a user I/O or as a special

function, the following nomenclature

is used:

IOxxXBxFx/special_function_name

IOxxPB1Fx/CLKx This pin can be configured as a clock

input or as a user I/O

Examples:

Detailed Specifications

2-26 Revision 15

I/O Standard Electrical Specifications

Table 2-20 • Input Capacitance

Symbol Parameter Conditions Min. Max. Units

CIN Input capacitance VIN = 0, f =1.0 MHz 10 pF

CINCLK Input capacitance on HCLK and RCLK pin VIN = 0, f =1.0 MHz 10 pF

Table 2-21 • I/O Weak Pull-Up/Pull-Down Resistances1

I/O Configurati on (VCCI)

RWEAK PULL-UP (kΩ)1RWEAK PULL-DOWN (kΩ)2

Min. Max. Min. Max.

3.3 V 35 65 30 60

2.5 V 50 75 40 85

1.8 V 80 140 70 130

1.5 V 100 210 90 180

Notes:

1. R(WEAK PULL-UP-MA X) = (VCCImax – VOHspec) / IWEAK PULL-UP-MIN)

2. R(WEAK PULL-DOW N -MAX) = (VOLspec) / IWEAK PULL-DOWN-MIN)

Table 2-22 • I/O Input Rise Time and Fall Time*

Input Buffer Input Rise/Fa ll Time (Min) Input Rise/Fall Time (Max)

LVTTL No Requirement 50 ns

LVCMOS 2.5 V No Requirement 50 ns

LVCMOS 1.8 V No Requirement 50 ns

LVCMOS 1.5 V No Requirement 50 ns

PCI No Requirement 50 ns

PCIX No Requirement 50 ns

GTL+ No Requirement 50 ns

HSTL No Requirement 50 ns

SSTL2 No Requirement 50 ns

HSTL3 No Requirement 50 ns

LVDS No Requirement 50 ns

LVPECL No Requirement 50 ns

Note: *Input Rise/Fall time applies to all inputs, including clock or data. Inputs have to ramp up/down

linearly, in a monotonic way. Glitches or a plateau may cause double-clocking. They must be

avoided. For Output Rise/Fall time, refer to IBIS Models for extraction.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-27

Figure 2-9 • Input Buffer Delays

Figure 2-10 • Output Buffer Delays

YIN

INBUF

PAD

GND

Input High

0 V

VCCA

Vtrip

50% 50%

(Rising) (Falling)

Out

GND

50% 50%

TRIBUF

Out

GND

50%

10%

50%

Out

GND

50% 50%

90%

To AC test loads (shown below)

OUT Pad

VTT

tENHZ

tENZH

VOH

Vtrip

GND/VTT

VTT

VOL

tENZL tENLZ

VCCI/VTT

Vtrip Vtrip Vtrip

VOH

tPY tPY

(tDLH)(tDHL)

VCCA VCCAVCCA

VOL

Detailed Specifications

2-28 Revision 15

I/O Module Timing Characteristics

Figure 2-11 • Timing Model

Figure 2-12 • Input Register Timing Characteristics

OutReg

PRE/CLR

EnReg

PRE/CLR

InReg

PRE/CLR

CLK

(Routed or

Hardwired)

Output Register

Output Enable Register

Input Register

CLR

PRESET

CLK

SUE

SUD

ICLKQ

WASYN

HASYN

CLR

REASYN

CPWHL

CPWLH

PRESET

WASYN

HASYN

REASYN

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-29

Figure 2-13 • Output Register Timing Characteristics

Figure 2-14 • Output Enable Register Timing Characteristics

CLR

PRESET

CLK

SUE

SUD

OCLKQ

WASYN

HASYN

CLR

REASYN

CPWHL

CPWLH

PRESET

WASYN

HASYN

REASYN

CLR

PRESET

CLK

SUE

SUD

OCLKQ

WASYN

HASYN

CLR

REASYN

CPWHL

CPWLH

PRESET

WASYN

HASYN

REASYN

Detailed Specifications

2-30 Revision 15

3.3 V LVTTL

Low-Voltage Transistor-Transistor Logic is a general purpose standard (EIA/JESD) for 3.3 V applications.

It uses an LVTTL input buffer and push-pull output buffer.

AC Loadings

Table 2-23 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

–0.3 0.8 2.0 3.6 0.4* 2.4 24 –24

Note: For RTAX250S/SL-CQ352 devices only, VOL limits are 500 mV across all o perating temperatures.

Figure 2-15 • AC Test Loads

Table 2-24 • AC Waveforms, Measuring Points, and Capacitive Load

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

0 3.0 1.40 N/A 35

Note: * Measuring Point = Vtrip

R to VCCI for tplz / tpzl

R to GND for tphz / tpzh

35 pF for tpzh / tpzl

5 pF for tphz / tplz

Test Point Test Point

35 pF for tristate

R=1 k

for t

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-31

Timing Characteristics

Table 2-25 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

LVTTL I/O Module Drive Strength = 1 (8 mA) / Low Slew Rate

tDP Input buffer 1.96 1.84 2.17 ns

tPY Output buffer 16.78 15.82 18.60 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

17.65 16.64 19.56 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

16.51 15.56 18.29 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

2.55 2.41 2.83 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

3.26 3.07 3.61 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Detailed Specifications

2-32 Revision 15

LVTTL I/O Module Drive Strength = 2 (12 mA) / Low Slew Rate

tDP Input buffer 1.96 1.84 2.17 ns

tPY Output buffer 14.06 13.25 15.58 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

14.39 13.56 15.94 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

14.09 13.28 15.61 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

2.84 2.68 3.15 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

3.71 3.50 4.11 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-25 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-33

LVTTL I/O Module Drive Strength = 3 (16 mA) / Low Slew Rate

tDP Input buffer 1.96 1.84 2.17 ns

tPY Output buffer 12.78 12.04 14.16 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

13.22 12.46 14.65 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

12.79 12.05 14.17 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

3.06 2.88 3.39 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

4.19 3.95 4.64 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-25 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-34 Revision 15

LVTTL I/O Module Drive Strength = 4 (24 mA) / Low Slew Rate

tDP Input buffer 1.96 1.84 2.17 ns

tPY Output buffer 12.10 11.41 13.41 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

12.28 11.58 13.61 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

12.12 11.43 13.43 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

3.16 2.98 3.50 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

4.30 4.06 4.77 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-25 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-35

LVTTL I/O Module Drive Strength = 1 (8 mA) / High Slew Rate

tDP Input buffer 1.96 1.84 2.17 ns

tPY Output buffer 5.07 4.78 5.62 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

5.37 5.06 5.95 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

4.89 4.61 5.42 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

3.11 2.93 3.44 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

3.36 3.17 3.72 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-25 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-36 Revision 15

LVTTL I/O Module Drive Strength = 2 (12 mA) / High Slew Rate

tDP Input buffer 1.96 1.84 2.17 ns

tPY Output buffer 4.10 3.87 4.54 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

4.33 4.08 4.79 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

3.55 3.34 3.93 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

3.11 2.93 3.44 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

3.83 3.61 4.25 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-25 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-37

LVTTL I/O Module Drive Strength = 3 (16 mA) / High Slew Rate

tDP Input buffer 1.96 1.84 2.17 ns

tPY Output buffer 3.89 3.66 4.31 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

4.10 3.87 4.55 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

3.22 3.03 3.56 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

3.14 2.96 3.48 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

4.32 4.07 4.79 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-25 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-38 Revision 15

LVTTL I/O Module Drive Strength = 4 (24 mA) / High Slew Rate

tDP Input buffer 1.96 1.84 2.17 ns

tPY Output buffer 3.72 3.51 4.12 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

3.89 3.67 4.31 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

2.99 2.82 3.32 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

3.14 2.96 3.48 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

4.42 4.17 4.90 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-25 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-39

2.5 V LVCMOS

Low-Voltage Complementary Metal-Oxide Semiconductor for 2.5 V is an extension of the LVCMOS

standard (JESD8-5) used for general-purpose 2.5 V applications. It uses a 3.3 V tolerant CMOS input

buffer and a push-pull output buffer.

AC Loadings

Table 2-26 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

–0.3 0.7 1.7 3.6 0.40 2.0 12 –12

Figure 2-16 • AC Test Loads

Table 2-27 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

0 2.5 1.25 N/A 35

Note: *Measuring Point = Vtrip

R to VCCI for tplz / tpzl

R to GND for tphz / tpzh

35 pF for tpzh / tpzl

5 pF for tphz / tplz

Test Point Test Point

35 pF for tristate

R=1 k

for t

Detailed Specifications

2-40 Revision 15

Timing Characteristics

Table 2-28 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

LVCMOS25 I/O Module Drive Strength = 1 (6 mA) / Low Slew Rate

tDP Input buffer 2.26 2.13 2.51 ns

tPY Output buffer 22.98 21.66 25.46 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

24.20 22.81 26.81 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

21.72 20.47 24.07 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.13 6.72 7.90 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.19 7.72 9.07 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-41

LVCMOS25 I/O Module Drive Strength = 2 (12 mA) / Low Slew Rate

tDP Input buffer 2.26 2.13 2.51 ns

tPY Output buffer 19.19 18.09 21.26 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

20.21 19.05 22.39 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

18.47 17.40 20.46 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.13 6.72 7.90 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.19 7.72 9.07 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-28 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-42 Revision 15

LVCMOS25 I/O Module Drive Strength = 3 (16 mA) / Low Slew Rate

tDP Input buffer 2.26 2.13 2.51 ns

tPY Output buffer 17.63 16.62 19.53 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

18.56 17.50 20.57 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

16.81 15.84 18.62 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.13 6.72 7.90 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.19 7.72 9.07 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-28 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-43

LVCMOS25 I/O Module Drive Strength = 4 (24 mA) / Low Slew Rate

tDP Input buffer 2.26 2.13 2.51 ns

tPY Output buffer 16.62 15.66 18.41 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

17.49 16.49 19.38 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

16.01 15.09 17.74 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.13 6.72 7.90 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.19 7.72 9.07 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-28 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-44 Revision 15

LVCMOS25 I/O Module Drive Strength = 1 (6 mA) / High Slew Rate

tDP Input buffer 2.26 2.13 2.51 ns

tPY Output buffer 6.71 6.32 7.43 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

5.60 5.27 6.20 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

6.71 6.32 7.43 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.13 6.72 7.90 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.19 7.72 9.07 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-28 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-45

LVCMOS25 I/O Module Drive Strength = 2 (12 mA) / High Slew Rate

tDP Input buffer 2.26 2.13 2.51 ns

tPY Output buffer 4.70 4.43 5.21 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

4.34. 4.09 4.80 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

4.70 4.43 5.21 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.13 6.72 7.90 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.19 7.72 9.07 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-28 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-46 Revision 15

LVCMOS25 I/O Module Drive Strength = 3 (16 mA) / High Slew Rate

tDP Input buffer 2.26 2.13 2.51 ns

tPY Output buffer 4.14 3.91 4.59 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

4.09 3.86 4.53 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

4.14 3.91 4.59 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.13 6.72 7.90 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.19 7.72 9.07 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-28 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-47

LVCMOS25 I/O Module Drive Strength = 4 (24 mA) / High Slew Rate

tDP Input buffer 2.26 2.13 2.51 ns

tPY Output buffer 3.81 3.59 4.22 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

3.88 3.66 4.30 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

3.81 3.59 4.22 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.13 6.72 7.90 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.19 7.72 9.07 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-28 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-48 Revision 15

1.8 V LVCMOS

Low-Voltage Complementary Metal-Oxide Semiconductor for 1.8 V is an extension of the LVCMOS

standard (JESD8-5) used for general-purpose 1.8 V applications. It uses a 3.3 V tolerant CMOS input

buffer and a push-pull output buffer.

AC Loadings

Table 2-29 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

–0.3 0.35* VCCI 0.65* VCCI 3.60 0.20 VCCI – 0.2 8 –8

Figure 2-17 • AC Test Loads

Table 2-30 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

0 1.8 0.5VCCI N/A 35.00

Note: *Measuring Point = Vtrip

R to VCCI for tplz / tpzl

R to GND for tphz / tpzh

35 pF for tpzh / tpzl

5 pF for tphz / tplz

Test Point Test Point

35 pF for tristate

R=1 k

for t

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-49

Timing Characteristics

Table 2-31 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.7 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

LVCMOS18 I/O Module Drive Strength = 2 (2 mA) / Low Slew Rate

tDP Input buffer 3.78 3.56 4.19 ns

tPY Output buffer 35.85 33.79 39.72 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

37.75 35.58 41.82 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

28.28 26.65 31.33 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.47 7.04 8.27 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.36 7.88 9.26 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Detailed Specifications

2-50 Revision 15

LVCMOS18 I/O Module Drive Strength = 3 (6 mA) / Low Slew Rate

tDP Input buffer 3.78 3.56 4.19 ns

tPY Output buffer 32.95 31.06 36.51 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

34.70 32.70 38.44 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

25.80 24.32 28.59 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.47 7.04 8.27 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.36 7.88 9.26 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-31 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.7 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-51

LVCMOS18 I/O Module Drive Strength = 4 (8 mA) / Low Slew Rate

tDP Input buffer 3.78 3.56 4.19 ns

tPY Output buffer 31.55 29.73 34.95 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

33.22 31.31 36.80 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

24.65 23.23 27.31 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.47 7.04 8.27 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.36 7.88 9.26 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-31 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.7 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-52 Revision 15

LVCMOS18 I/O Module Drive Strength = 2 (2 mA) / High Slew Rate

tDP Input buffer 3.78 3.56 4.19 ns

tPY Output buffer 6.94 6.54 7.69 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

5.09 4.80 5.64 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

6.94 6.54 7.69 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.47 7.04 8.27 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.36 7.88 9.26 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-31 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.7 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-53

LVCMOS18 I/O Module Drive Strength = 3 (6 mA) / High Slew Rate

tDP Input buffer 3.78 3.56 4.19 ns

tPY Output buffer 5.89 5.55 6.52 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

4.74 4.47 5.25 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

5.89 5.55 6.52 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.47 7.04 8.27 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.36 7.88 9.26 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-31 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.7 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-54 Revision 15

LVCMOS18 I/O Module Drive Strength = 4 (8 mA) / High Slew Rate

tDP Input buffer 3.78 3.56 4.19 ns

tPY Output buffer 5.27 4.97 5.84 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

4.40 4.15 4.88 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

5.27 4.97 5.84 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.47 7.04 8.27 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.36 7.88 9.26 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-31 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.7 V, TJ = 125°C (continued)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-55

1.5 V LVCMOS (JESD8-11)

Low-Voltage Complementary Metal-Oxide Semiconductor for 1.5 V is an extension of the LVCMOS

standard (JESD8-5) used for general-purpose 1.5 V applications. It uses a 3.3 V tolerant CMOS input

buffer and a push-pull output buffer.

AC Loadings

Table 2-32 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

–0.3 0.35 VCCI 0.65 VCCI 3.60 0.40 VCCI – 0.4 8 mA –8 mA

Figure 2-18 • AC Test Loads

Table 2-33 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

0 1.5 0.5VCCI N/A 35.00

Note: *Measuring Point = Vtrip

R to VCCI for tplz / tpzl

R to GND for tphz / tpzh

35 pF for tpzh / tpzl

5 pF for tphz / tplz

Test Point Test Point

35 pF for tristate

R=1 k

for t

Detailed Specifications

2-56 Revision 15

Timing Characteristics

Table 2-34 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

LVCMOS15 I/O Module Drive Strength = 1 (2 mA) / Low Slew Rate

tDP Input buffer 4.17 3.93 4.62 ns

tPY Output buffer 64.07 60.38 70.98 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

67.46 63.58 74.74 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

47.54 44.80 52.67 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.90 7.45 8.76 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.61 8.12 9.54 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-57

LVCMOS15 I/O Module Drive Strength = 2 (4 mA) / Low Slew Rate

tDP Input buffer 4.17 3.93 4.62 ns

tPY Output buffer 56.55 53.29 62.65 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

59.55 56.12 65.97 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

40.20 37.88 44.53 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.90 7.45 8.76 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.61 8.12 9.54 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-34 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-58 Revision 15

LVCMOS15 I/O Module Drive Strength = 3 (6 mA) / Low Slew Rate

tDP Input buffer 4.17 3.93 4.62 ns

tPY Output buffer 51.89 48.90 57.49 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

54.64 51.50 60.54 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

36.96 34.84 40.95 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.90 7.45 8.76 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.61 8.12 9.54 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-34 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-59

LVCMOS15 I/O Module Drive Strength = 8 (4 mA) / Low Slew Rate

tDP Input buffer 4.17 3.93 4.62 ns

tPY Output buffer 50.09 47.20 55.49 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

52.74 49.71 58.43 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

35.21 33.18 39.01 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.90 7.45 8.76 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.61 8.12 9.54 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-34 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-60 Revision 15

LVCMOS15 I/O Module Drive Strength = 1 (2 mA) / High Slew Rate

tDP Input buffer 4.17 3.93 4.62 ns

tPY Output buffer 15.48 14.59 17.15 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

8.89 8.38 9.85 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

15.48 14.59 17.15 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.90 7.45 8.76 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.61 8.12 9.54 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-34 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-61

LVCMOS15 I/O Module Drive Strength = 2 (4 mA) / High Slew Rate

tDP Input buffer 4.17 3.93 4.62 ns

tPY Output buffer 9.68 9.12 10.73 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

6.14 5.79 6.81 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

9.68 9.12 10.73 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.90 7.45 8.76 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.61 8.12 9.54 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-34 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-62 Revision 15

LVCMOS15 I/O Module Drive Strength = 3 (6 mA) / High Slew Rate

tDP Input buffer 4.17 3.93 4.62 ns

tPY Output buffer 8.09 7.62 8.96 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

5.68 5.36 6.30 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

8.09 7.62 8.96 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

7.90 7.45 8.76 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.61 8.12 9.54 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-34 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-63

LVCMOS15 I/O Module Drive Strength = 4 (8 mA) / High Slew Rate

tDP Input buffer 4.17 3.93 4.62 ns

tPY Output buffer 7.01 6.60 7.76 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

5.19 4.89 5.75 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

7.01 6.60 7.76 ns

tENLZ Enable to Pad delay through the

Output Buffer—LOW to Z

7.90 7.45 8.76 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

8.61 8.12 9.54 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Table 2-34 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

Detailed Specifications

2-64 Revision 15

3.3 V PCI

Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI bus

applications. It uses an LVTTL input buffer and a push-pull output buffer. The input and output buffers are

5 V tolerant with the aid of external components. The RTAX-S/SL 3.3 V PCI buffer is compliant with the

PCI Local Bus Specification Rev. 2.1.

AC Loadings

Per PCI Specification except for tristate. Microsemi loading for tristate is in Figure 2-19.

Table 2-35 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

–0.3 0.3 VCCI 0.5 VCCI VCCI + 0.5 (per PCI specification)

Figure 2-19 • AC Test Loads

Table 2-36 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

(Per PCI Spec) N/A 10

Note: *Measuring Point = Vtrip

R to VCCI for t

R to GND for t

10 pF

GND

Test point for data

R = 25

35 pF for t

pzl

pzh

5 pF for t

phz

plz

R to

VCCI

for t

plz

pzl

R to GND for t

phz

pzh

Test Point

for tristate

R =1 k

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-65

Timing Characteristics

Table 2-37 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

3.3V PCI I/O Modul e Timing

tDP Input buffer 1.82 1.72 2.02 ns

tPY Output buffer 2.38 2.25 2.64 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

2.51 2.36 2.78 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

2.23 2.10 2.47 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

3.16 2.98 3.50 ns

tENHZ Enable to Pad delay through the

Output Buffer—High to Z

4.37 4.12 4.84 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

Detailed Specifications

2-66 Revision 15

Table 2-38 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

3.3 V PCI-X I/O Module Timing

tDP Input buffer 1.82 1.72 2.02 ns

tPY Output buffer 2.44 2.30 2.71 ns

tENZL Enable to Pad delay through the

Output Buffer—Z to Low

2.51 2.36 2.78 ns

tENZH Enable to Pad delay through the

Output Buffer—Z to High

2.44 2.30 2.70 ns

tENLZ Enable to Pad delay through the

Output Buffer—Low to Z

3.29 3.10 3.65 ns

tENHZ Enable to Pad delay through the

Output Buffer—HIgh to Z

3.87 3.64 4.28 ns

tIOCLKQ Sequential clock-to-Q for the input

0.95 0.90 1.05 ns

tIOCLKY Clock-to-output Y for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.21 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-67

Voltage-Referenced I/O Standards

GTL+

Gunning Transceiver Logic Plus is a high-speed bus standard (JESD8-3). It requires a differential

amplifier input buffer and an open drain output buffer. The VCCI pin should be connected to 2.5 V or 3.3

V. Note that 2.5 V GTL+ is not supported across the full military temperature range.

AC Loadings

Table 2-39 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

N/A VREF – 0.1 VREF + 0.1 N/A 0.6 NA NA NA

Note: For high temperatu re of 125°C only, VOL limits are 700 mV, for all other te mpera tures 600 mV applies.

Figure 2-20 • AC Test Loads

Table 2-40 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

VREF-0.2 VREF+0.2 VREF 1.0 10

Note: *Measuring Point = Vtrip

Test Point

10 pF

VTT

Detailed Specifications

2-68 Revision 15

Timing Characteristics

Table 2-41 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Speed 'Std.' Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

3.3 V GTL+ I/O Mod ule Timing

tDP Input buffer 2.13 2.01 2.36 ns

tPY Output buffer 1.34 1.26 1.49 ns

tICLKQ Clock-to-Q for the I/O input register 0.95 0.90 1.05 ns

tOCLKQ Clock-to-Q for the I/O output

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-69

HSTL Class I

High-Speed Transceiver Logic is a general-purpose high-speed 1.5 V bus standard (EIA/JESD8-6). The

RTAX-S/SL devices support Class I. This requires a differential amplifier input buffer and a push-pull

output buffer.

AC Loadings

Table 2-42 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

V1 Max.

VMin.

VmAmA

–0.3 VREF – 0.1 VREF + 0.1 3.6 0.4 VCC – 0.4 8 –8

Figure 2-21 • AC Test Loads

Table 2-43 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

VREF – 0.5 VREF + 0.5 VREF 0.75 20

Note: *Measuring Point = Vtrip

Test Point

20 pF

VTT

Detailed Specifications

2-70 Revision 15

Timing Characteristics

Table 2-44 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

1.5 V HSTL Class I I/O Module Timing

tDP Input buffer 2.24 2.12 2.49 ns

tPY Output buffer 5.68 5.35 6.29 ns

tICLKQ Clock-to-Q for the I/O input register 0.95 0.90 1.05 ns

tOCLKQ Clock-to-Q for the I/O output register

and the I/O enable register

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-71

SSTL2

Stub Series Terminated Logic for 2.5 V is a general-purpose 2.5 V memory bus standard (JESD8-9). The

RTAX-S/SL devices support both classes of this standard. This requires a differential amplifier input

buffer and a push-pull output buffer.

Class I

AC Loadings

Table 2-45 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

–0.3 VREF – 0.2 VREF + 0.2 3.6 VREF – 0.57 VREF + 0.57 7.6 –7.6

Figure 2-22 • AC Test Loads

Table 2-46 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

VREF – 0.75 VREF + 0.75 VREF 1.25 30

Note: *Measuring Point = Vtrip

Test Point

30 pF

VTT

Detailed Specifications

2-72 Revision 15

Timing Characteristics

Table 2-47 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

2.5 V SSTL2 Class I I/O Module Timing

tDP Input buffer 2.28 2.14 2.52 ns

tPY Output buffer 2.77 2.61 3.07 ns

tICLKQ Clock-to-Q for the I/O input register 0.95 0.90 1.05 ns

tOCLKQ Clock-to-Q for the I/O output register

and the I/O enable register

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-73

Class II

AC Loadings

Table 2-48 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

–0.3 VREF – 0.2 VREF + 0.2 3.6 VREF – 0.8 VREF + 0.8 15.2 –15.2

Figure 2-23 • AC Test Loads

Table 2-49 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

VREF – 0.75 VREF+0.75 VREF 1.25 30

Note: *Measuring Point = Vtrip

Test Point

30 pF

VTT

Detailed Specifications

2-74 Revision 15

Timing Characteristics

Table 2-50 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

2.5 V SSTL2 Class II I/O Module Timing

tDP Input buffer 2.36 2.22 2.61 ns

tPY Output buffer 2.77 2.61 3.07 ns

tICLKQ Clock-to-Q for the I/O input register 0.95 0.90 1.05 ns

tOCLKQ Clock-to-Q for the I/O output register

and the I/O enable register

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-75

SSTL3

Stub Series Terminated Logic for 3.3 V is a general-purpose 3.3 V memory bus standard (JESD8-8). The

RTAX-S/SL devices support both classes of this standard. This requires a differential amplifier input

buffer and a push-pull output buffer.

Class I

AC Loadings

Table 2-51 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

–0.3 VREF – 0.2 VREF + 0.2 3.6 VREF– 0.6 VREF + 0.6 8 –8

Figure 2-24 • AC Test Loads

Table 2-52 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

VREF-1.0 VREF+1.0 VREF 1.50 30

Note: *Measuring Point = Vtrip

Test Point

30 pF

VTT

Detailed Specifications

2-76 Revision 15

Timing Characteristics

Table 2-53 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

3.3 V SSTL3 Class I I/O Module Timing

tDP Input buffer 2.22 2.09 2.46 ns

tPY Output buffer 2.70 2.55 2.99 ns

tICLKQ Clock-to-Q for the I/O input register 0.95 0.90 1.05 ns

tOCLKQ Clock-to-Q for the I/O output register

and the I/O enable register

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-77

Class II

AC Loadings

Table 2-54 • DC Input and Output Levels

VIL VIH VOL VOH IOL IOH

Min.

VMax.

VMin.

VMax.

VMin.

VmAmA

–0.3 VREF – 0.2 VREF + 0.2 3.6 VREF – 0.8 VREF + 0.8 16 –16

Figure 2-25 • AC Test Loads

Table 2-55 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF)

VREF – 1.0 VREF + 1.0 VREF 1.50 30

Note: *Measuring Point = Vtrip

Test Point

30 pF

VTT

Detailed Specifications

2-78 Revision 15

Timing Characteristics

Table 2-56 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Sp ee d Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

3.3 V SSTL3 Class II I/O Module Timing

tDP Input buffer 2.30 2.16 2.55 ns

tPY Output buffer 2.70 2.55 2.99 ns

tICLKQ Clock-to-Q for the I/O input register 0.95 0.90 1.05 ns

tOCLKQ Clock-to-Q for the I/O output register

and the I/O enable register

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-79

Differential Standards

Physical Implementation

Implementing differential I/O standards requires the configuration of a pair of external I/O pads, resulting

in a single internal signal. To facilitate construction of the differential pair, a single I/O cluster contains the

resources for a pair of I/Os. Configuration of the I/O Cluster as a differential pair is handled by

Microsemi's Designer software when the user instantiates a differential I/O macro in the design.

Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output

tristates with these standards.

LVDS

Low-Voltage Differential Signal (ANSI/TIA/EIA-644) is a high-speed differential I/O standard. It requires

that one data bit is carried through two signal lines, so two pins are needed. It also requires an external

resistor termination. The voltage swing between these two signal lines is approximately 350 mV.

The LVDS circuit consists of a differential driver connected to a terminated receiver through a constant-

impedance transmission line. The receiver is a wide-common-mode-range differential amplifier. The

common-mode range is from 0.2 V to 2.2 V for a differential input with 400 mV swing.

To implement the driver for the LVDS circuit, drivers from two adjacent I/O cells are used to generate the

differential signals (Note that the driver is not a current-mode driver). This driver provides a nominal

constant current of 3.5 mA. When this current flows through a 100 Ω termination resistor on the receiver

side, a voltage swing of 350 mV is developed across the resistor. The direction of the current flow is

controlled by the data fed to the driver.

An external-resistor network (three resistors) is needed to reduce the voltage swing to about 350 mV.

Therefore, four external resistors are required, three for the driver and one for the receiver.

Figure 2- 26 • LVDS Circuit

Table 2-57 • DC Input and Output Levels

Parameter Description Min. Typ. Max. Units

VCCI1Supply voltage 2.375 2.5 2.625 V

VOL Output low voltage 0.9 1.075 1.25 V

VOH Output high voltage 1.25 1.425 1.6 V

VI Input voltage 0 2.925 V

VODIFF Differential output voltage 250 350 450 mV

VOCM Output common mode voltage 1.125 1.25 1.375 V

VICM2Input common mode voltage 0.2 1.25 2.2 V

VIDIFF Differential input voltage 100 350 mV

Notes:

1. ± 5%

2. Differential input voltage = ±400 mV.

140 Ω100 Ω

ZO = 50 Ω

165 Ω

–

INBUF_LVDS

OUTBUF_LVDS

FPGA FPGA

Detailed Specifications

2-80 Revision 15

AC Loadings

For AC test loads, see the above LVDS circuit.

Timing Characteristics

Table 2-58 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) Cload (pF)

1.2 – 0.125 1.2 + 0.125 1.2 N/A

Note: *Measuring Point = V trip

Table 2-59 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

LVDS I/O Module Timing

tDP Input buffer 2.12 2.00 2.35 ns

tPY Output buffer 2.70 2.54 2.99 ns

tICLKQ Clock-to-Q for the I/O input register 0.95 0.90 1.05 ns

tOCLKQ Clock-to-Q for the I/O output register and

the I/O enable register

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-81

LVPECL

Low-Voltage Positive Emitter-Coupled Logic (LVPECL) is another differential I/O standard. It requires

that one data bit is carried through two signal lines. Like LVDS, two pins are needed. It also requires

external resistor termination. The voltage swing between these two signal lines is approximately 850 mV.

The LVPECL circuit is similar to the LVDS scheme. It requires four external resistors, three for the driver

and one for the receiver. The values for the three driver resistors are different from that of LVDS, since

the output voltage levels are different. Please note that the VOH levels are 200 mV below the standard

LVPECL levels.

AC Loadings

For AC test loads, See the above LVPECL circuit.

Figure 2- 27 • LVPECL Circuit

187 Ω100 Ω

ZO = 50 Ω

100 Ω

–

INBUF_LVPECL

OUTBUF_LVPECL

FPGA FPGA

Table 2-60 • DC Input and Output Levels

Parameter Description Min. Max. Min. Max. Min. Max. Units

VCCI Supply voltage 3.0 3.3 3.6 V

VOL Output Low voltage 0.96 1.27 1.06 1.43 1.30 1.57 V

VOH Output High voltage 1.8 2.11 1.92 2.28 2.13 2.41 V

VIL Input Low voltages 0.86 2.125 0.86 2.125 0.86 2.125 V

VIH Input High voltages 1.49 2.72 1.49 2.72 1.49 2.72 V

VODIFF Differential output voltage 0.625 0.97 0.625 0.97 0.625 0.97 V

VOCM Output common mode voltage 1.762 1.98 1.762 1.98 1.762 1.98 V

VICM Input common mode voltage 1.01 2.57 1.01 2.57 1.01 2.57

VIDIFF Input differential voltage 300 – 300 – 300 – mV

Table 2-61 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V) Input High (V) Measuring Point* (V) Cload (pF)

1.6 – 0.3 1.6 + 0.3 1.6 N/A

Note: *Measuring Point = V trip

Detailed Specifications

2-82 Revision 15

Timing Characteristics

Table 2-62 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

LVPECL Output Module Timing

tDP Input buffer 1.94 1.83 2.15 ns

tPY Output buffer 2.60 2.45 2.88 ns

tICLKQ Clock-to-Q for the I/O input register 0.95 0.90 1.05 ns

tOCLKQ Clock-to-Q for the I/O output register

and the I/O enable register

0.95 0.90 1.05 ns

tSUD Data input setup 0.33 0.31 0.36 ns

tSUE Enable input setup 0.36 0.34 0.40 ns

tHD Data input hold 0.00 0.00 0.00 ns

tHE Enable input hold 0.00 0.00 0.00 ns

tCPWHL Clock pulse width High to Low 0.39 0.39 0.39 ns

tCPWLH Clock pulse width Low to High 0.39 0.39 0.39 ns

tWASYN Asynchronous pulse width 0.37 0.37 0.37 ns

tREASYN Asynchronous recovery time 0.18 0.17 0.20 ns

tHASYN Asynchronous removal time 0.00 0.00 0.00 ns

tCLR Asynchronous Clear-to-Q 0.33 0.31 0.37 ns

tPRESET Asynchronous Preset-to-Q 0.33 0.31 0.37 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-83

Module Specifications

C-Cell

Introduction

The C-cell is one of the two logic module types in the RTAX-S/SL/DSP architecture. It is the

combinatorial logic resource in the RTAX-S/SL/DSP device. The RTAX-S/SL/DSP architecture

implements a new Combinatorial Cell that is an extension of the C-cell implemented in the A54SX-A

family. The main enhancement of the new C-cell is the addition of carry-chain logic.

The C-cell can be used in a carry-chain mode to construct arithmetic functions. If carry-chain logic is not

required, it can be disabled.

The C-cell features the following (Figure 2-28):

• Eight-input MUX (data: D0-D3, select: A0, A1, B0, B1). User signals can be routed to any one of

these inputs. Any of the C-cell inputs (D0-D3, A0, A1, B0, B1) can be tied to one of the four routed

clocks (CLKE/F/G/H).

• Inverter (DB input) can be used to drive a complement signal of any of the inputs to the C-cell.

• A carry input and a carry output. The carry input signal of the C-cell is the carry output from the

C-cell directly to the north.

• Carry connect for carry-chain logic with a signal propagation time of less than 0.1 ns.

• A hardwired connection (direct connect) to the adjacent R-cell (Register Cell) for all C-cells on the

east side of a SuperCluster with a signal propagation time of less than 0.1 ns.

This layout of the C-cell (and the C-cell Cluster) enables the implementation of over 4,000 functions of up

to five bits. For example, two C-cells can be used together to implement a four-input XOR function in a

single cell delay.

The carry-chain configuration is handled automatically for the user with the extensive Microsemi macro

library. Refer to the Antifuse Macro Library Guide for a complete listing of available RTAX-S/SL macros.

Figure 2- 28 • C-Cell

D1 D3 B1B0

D0 D2 DB A1A0

CFN FCI

FCO Y

Detailed Specifications

2-84 Revision 15

T iming Model and Waveforms

Timing Characteristics

Figure 2- 29 • C-Cell Timing Model and Waveforms

Y, FCO

GND

VCCA

50% 50%

GND

50% 50%

A, B, D, FCI

tPD, tPDC

VCCA

tPD, tPDC

tPD, tPDC tPD, tPDC

Table 2-63 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Sp eed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

C-Cell Propagation Delays

tPD Any input to output 0.99 0.93 1.10 ns

tPDC Any input to carry chain output

(FCO)

0.73 0.69 0.81 ns

tPDB Any input thorough DB when 1 input

is used

1.55 1.46 1.72 ns

tCCY Input carry chain (FCI) to Y 0.80 0.75 0.88 ns

tCC Input carry chain (FCI) to carry chain

output (FCO)

0.11 0.10 0.12 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-85

Carry-Chain Logic

The RTAX-S/SL/DSP dedicated carry-chain logic offers a very compact solution for implementing

arithmetic functions without sacrificing performance.

To implement the carry-chain logic, two C-cells in a Cluster are connected together so the FCO (i.e.,

carry out) for the two bits is generated in a Carry Look-ahead scheme to achieve minimum propagation

delay from the FCI (i.e., carry in) into the two-bit Cluster. The two-bit carry logic is shown in Figure 2-30.

The FCI of one C-cell pair is driven by the FCO of the C-cell pair immediately above it. Similarly, the FCO

of one C-cell pair, drives the FCI input of the C-cell pair immediately below it (Figure 1-5 on page 1-3 and

Figure 2-31 on page 2-86).

The carry-chain logic is selected via the CFN input. When carry logic is not required, this signal is

deasserted to save power. Again, this configuration is handled automatically for the user through the

Microsemi macro library.

The signal propagation delay between two C-cells in the carry-chain sequence is 0.1 ns.

Figure 2-30 • RTAX-S/SL/DSP Two-Bit Carry Logic

DCOUT

FCO

CFN

FCI

Detailed Specifications

2-86 Revision 15

Timing Characteristics

Refer to the C-cell timing characteristics in Table 2-63 on page 2-84 for more information on carry-chain

timing.

Note: The carry-chain sequence can end on either C -cell.

Figure 2- 31 • Carry-Chain Sequencing of C-Cells

DCINDCOUT

C-cell1 C-cell2

DCOUT

R-cell1

DCIN

C-cell

(2n-1)

C-cell2n

DCOUT

R-celln

CDIN

n-2

Clusters

FCO

FCI

(2n-1)

FCI

FCO

FCI

FCO

FCI

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-87

R-Cell

Introduction

The R-cell, the sequential logic resource of the RTAX-S/SL/DSP devices, is the second logic module type in

the RTAX-S/SL/DSP family architecture. The RTAX-S/SL/DSP R-cell is an enhanced version of the A54SX-

A R-cell. It includes additional clock inputs for all eight global resources of the RTAX-S/SL/DSP architecture

as well as global presets and clears (Figure 2-32).

The main features of the R-cell include the following:

• Direct connection to the adjacent logic module through the hardwired connection DCIN. DCIN is

driven by the DCOUT of an adjacent C-cell via the Direct-Connect routing resource, providing a

connection with less than 0.1 ns of routing delay.

• The R-cell can be used as a standalone flip-flop. It can be driven by any C-cell or I/O modules

through the regular routing structure (using DIN as a routable data input). This gives the option of

using the R-cell as a 2:1 MUXed flip-flop as well.

• Provision of data enable-input (S0).

• Independent active low asynchronous clear (CLR).

• Independent active low asynchronous preset (PSET). If both CLR and PSET are low, CLR has

higher priority.

• Clock can be driven by any of the following (CKP selects clock polarity):

– One of the four high performance hardwired fast clocks (HCLKs)

– One of the four routed clocks (CLKs)

– User signals

• Global power-on clear (GCLR) and preset (GPSET), which drive each flip-flop on a chip-wide

basis.

– When the Global Set Fuse option in the Designer software is unchecked (by default), GCLR =

0 and GPSET =1 at device power-up. When the option is checked, GCLR = 1 and GPSET= 0.

Both pins are pulled HIGH when the device is in user mode.

• S0, S1, PSET, and CLR can be driven by routed clocks CLKE/F/G/H or user signals.

• DIN and S1 can be driven by user signals.

Detailed Specifications

2-88 Revision 15

As with the C-cell, the configuration of the R-cell to perform various functions is handled automatically for

the user through Microsemi's extensive macro library (please see the Macro Library Guide for a complete

listing of available RTAX-S/SL macros).

Figure 2- 32 • R-Cell

CLR

GCLR

PRE

GPRE

S1 S0

CKS

DCIN

DIN (user signals)

HCLKA/B/C/D

CLKE/F/G/H

Internal Logic

CKP

SEU

Enhanced

D-FF

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-89

SEU Hardened D Flip-Flop (DFF)

In order to meet the stringent SEU requirements of a LETTH greater than 37 MeV-cm2/mg, the internal design

of the R-cell was modified without changing the functionality of the cell. Figure 2-33 illustrates a simplified

representation of how the D flip-flop in the SuperCluster is implemented in the RTAX-S/SL/DSP architecture.

The flip-flop consists of a master and a slave latch gated by opposite edges of the clock. Each latch is

constructed by feeding back the output to the input stage. The potential problem in a space environment is

that either of the latches can change state when hit by a particle with enough energy.

To achieve the SEU requirements, the D flip-flop in the RTAX-S/SL/DSP R-cell is enhanced

(Figure 2-34). Both the master and slave "latches" are actually implemented with three latches. The

asynchronous self-correcting feedback paths of each of the three latches is voted with the outputs of the

other two latches. If one of the three latches is struck by an ion and starts to change state, the voting with

the other two latches prevents the change from feeding back and permanently latching. Care was taken

in the layout to ensure that a single ion strike could not affect more than one latch. Figure 2-35 on

page 2-90 is a simplified schematic of the test circuitry that has been added to test the functionality of all

the components of the flip-flop. The inputs to each of the three latches are independently controllable, so

the voting circuitry in the asynchronous self-correcting feedback paths can be tested exhaustively. This

testing is performed on an unprogrammed array during wafer sort, final test, and post-burn-in test. This

test circuitry cannot be used to test the flip-flops once the device has been programmed.

Figure 2- 33 • RTAX-S/SL/DSP R-cell Implementation of D Flip-Flop

Figure 2- 34 • RTAX-S/SL/DSP R-cell Implementation of D Flip-Flop Using Voter Gate Logic

CLK CLK

CLK

Voter

Gate

CLK

Detailed Specifications

2-90 Revision 15

Figure 2- 35 • RTAX-S/SL/DSP R-Cell Implementation – Test Circuitry

Tst1

CLK

Voter

Gate

Tst2

Tst3

Test

Circuitry

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-91

Timing Models and Waveforms

Timing Characteristics

Figure 2-36 • R-Cell Delays

CLR

PRESET

CLK

SUE

SUD

RCO

WASYN

HASYN

CLR

REASYN

CPWHL

CPWLH

PRESET

WASYN

HASYN

REASYN

Table 2-64 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Spee d Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

R-Cell Propagation Delays

tRCO Sequential Clock to Q 1.00 0.94 1.10 ns

tCLR Asynchronous Clear to Q 0.66 0.62 0.73 ns

tPRESET Asynchronous Preset to Q 0.79 0.75 0.88 ns

tSUD FF Data input setup 0.22 0.21 0.25 ns

tSUE FF Enable input setup 0.22 0.21 0.25 ns

tHD FF Data Hold 0.00 0.00 0.00 ns

tHE FF Enable Hold time 0.00 0.00 0.00 ns

tWASYN Asynchronous Pulse width 0.48 0.48 0.48 ns

tREASYN Asynchronous Recovery time 0.00 0.00 0.00 ns

tHASYN Asynchronous Removal time 0.00 0.00 0.00 ns

tCPWHL Clock pulse width high to low 0.35 0.35 0.35 ns

tCPWLH Clock pulse width low to high 0.36 0.36 0.36 ns

Detailed Specifications

2-92 Revision 15

Buffer Module

Introduction

An additional resource inside each SuperCluster is the Buffer (B) module (Figure 1-4 on page 1-3).

When a fanout constraint is applied to a design, the synthesis tool inserts buffers as needed. The buffer

module has been added to the RTAX-S/SL/DSP architecture to avoid logic duplication resulting from the

hard fanout constraints. The router utilizes this logic resource to save area and reduce loading and

delays on medium-to-high-fanout nets.

Timing Models and Waveforms

Timing Characteristics

Figure 2- 37 • Buffer Module Timing Model

Figure 2- 38 • Buffer Module Waveform

IN OUT

OUT

GND

50% 50%

GND

VCCA

tBFPD

Table 2-65 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/2000S/SL All

Min. Max. Min. Max. Min. Max.

tBFPD Any input to output Y 0.18 0.17 0.20 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-93

Mathblock Timing Specification

Mathblock Timing Characteristics

Table 2-66 • Mathblock with All Registers Used

Worst-Case Military Conditions VCCA = 1.425 V, TJ = 125°C

Parameter Description

Std. Speed

UnitsMin. Max.

tMSUR A, B, control register setup vs. CLK 0.36 ns

tMHR A, B, control register hold vs. CLK 0.00 ns

tMSUC Carry inputs setup vs. CLK 4.40 ns

tMHC Carry inputs hold vs. CLK 0.00 ns

tMCQR Sequential clock to output propagation delay 3.83 ns

tMPMIN CLK Minimum period 8.05 ns

Figure 2- 39 • Timing Diagram for Mathblock with All Registers Used

SUB

MSUR

= 0.36 ns

MSUR

= 0.36 ns

MHR

= 0.00 ns

MHR

= 0.00 ns

MCQR

= 3.83 ns

MPMIN

= 8.05 ns

MSUR

= 0.36 ns

MHR

= 0.00 ns

MSUR

= 0.36 ns

MHR

= 0.00 ns

MSUR

= 0.36 ns

MHR

= 0.00 ns

MSUC

= 4.40 ns

MHC

= 0.00 ns

MPMIN

= 8.05 ns

ARSHFT17

CDOUT[40:0]

OVERFLOW

SLOAD_N

SLOAD_DATA

CP[40:0]

Detailed Specifications

2-94 Revision 15

Table 2-67 • Mathblock with Output Registers Used and Input Registers Bypassed

Worst-Case Military Conditions VCCA = 1.425 V, TJ = 125°C

Parameter Description

Std. Speed

UnitsMin. Max.

tMSUO Output register setup vs. CLK15.77 ns

tMHO Output register hold vs. CLK20.00 ns

tMSUC Carry inputs setup vs. CLK 4.40 ns

tMHC Carry inputs hold vs. CLK 0.00 ns

tMCQO Sequential clock to output propagation delay 3.83 ns

tMPMIN CLK Minimum period 8.05 ns

Notes:

1. This parameter originally was named "A, B, control register setup vs. CLK."

2. This parameter originally was named "A, B, control register hold vs . CLK."

Figure 2- 40 • Timing Diagram for Mathbloc k wi th Output Registers Used and In pu t Registe r

Bypassed

SUB

tMSUO = 5.77 ns

tMHO = 0.00 ns

tMSUO = 5.77 ns

tMHO = 0.00 ns

tMSUO = 5.77 ns

tMHO = 0.00 ns

tMSUO = 5.77 ns

tMHO = 0.00 ns tMCQR = 3.83 ns

tMPMIN = 8.05 ns

tMSUC = 4.40 ns

tMHC = 0.00 ns

ARSHFT17

CDOUT[40:0]

OVERFLOW

SLOAD_N

SLOAD_DATA

CP[40:0]

tMSUO = 5.77 ns

tMHO = 0.00 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-95

Table 2-68 • Mathblock with Output Registers Bypassed and Input Registers Used

Worst-Case Military Conditions VCCA = 1.425 V, TJ = 125°C

Parameter Description

Std. Speed

UnitsMin. Max.

tMSUR A, B, control register setup vs. CLK 0.36 ns

tMHR A, B, control register hold vs. CLK 0.00 ns

tMCQI Sequential clock to output propagation delay 7.97 ns

tMPDC Carry inputs to any outputs propagation delay 7.43 ns

Figure 2- 41 • Mathblock with Output Registers Bypassed and Input Registers Used

SUB

MSUR

= 0.36 ns

MSUR

= 0.36 ns

MHR

= 0.00 ns

MHR

= 0.00 ns

MCQI

= 7.97 ns

MSUR

= 0.36 ns

MHR

= 0.00 ns

MSUR

= 0.36 ns

MHR

= 0.00 ns

MSUR

= 0.36 ns

MHR

= 0.00 ns

MPDC

= 7.43 ns

ARSHFT17

CDOUT[40:0]

OVERFLOW

SLOAD_N

SLOAD_DATA

CP[40:0]

Detailed Specifications

2-96 Revision 15

Table 2-69 • Mathblock with All Registers Bypassed

Worst-Case Military Conditions VCCA = 1.425 V, TJ = 125°C

Parameter Description

Std. Speed

UnitsMin. Max.

tMPDB A, B, control registers to any outputs propagation delay 8.69 ns

tMPDC Carry inputs to any outputs propagation delay 7.43 ns

Figure 2- 42 • Timing Diagram for Mathblock with All Registers Byp assed

SUB

MPDB

= 8.69 ns

MPDB

= 8.69 ns

MPDB

= 8.69 ns

MPDB

= 8.69 ns

MPDB

= 8.69 ns

MPDC

= 7.43 ns

ARSHFT17

CDOUT[40:0]

OVERFLOW

SLOAD_N

SLOAD_DATA

CP[40:0]

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-97

Routing Specifications

Routing Resources

The routing structure found in RTAX-S/SL/DSP devices enables any logic module to be connected to any

other logic module while retaining high performance. There are multiple paths and routing resources that

can be used to route one logic module to another, both within a SuperCluster and elsewhere on the chip.

There are four primary types of routing within the RTAX-S/SL/DSP architecture: DirectConnect,

CarryConnect, FastConnect and Vertical and Horizontal Routing.

DirectConnect

DirectConnects provide a high-speed connection between an R-cell and its adjacent C-cell (Figure 2-43).

This connection can be made from DCOUT of the C-cell to DCIN of the R-cell by configuring of the S1

line of the R-cell. This provides a connection that does not require an antifuse and has a delay of less

than 0.1 ns.

CarryConnect

CarryConnects are used to build carry chains for arithmetic functions (Figure 2-43). The FCO output of

the right C-cell of a two-C-cell Cluster drives the FCI input of the left C-cell in the two-C-cell Cluster

immediately below it. This pattern continues down both sides of each SuperCluster column.

Similar to the DirectConnects, CarryConnects can be built without an antifuse connection. This

connection has a delay of less than 0.1 ns from the FCO of one two-C-cell Cluster to the FCI of the two-

C-cell Cluster immediately below it (see the "Carry-Chain Logic" on page 2-85 for more information).

FastConnect

For high-speed routing of logic signals, FastConnects can be used to build a short distance connection

using a single antifuse (Figure 2-44 on page 2-98). FastConnects provide a maximum delay of 0.4 ns.

The outputs of each logic module connect directly to the Output Tracks within a SuperCluster. Signals on

the Output Tracks can then be routed through a single antifuse connection to drive the inputs of logic

modules either within one SuperCluster or in the SuperCluster immediately below it.

Vertical and Horizontal Routing

Vertical and Horizontal Tracks provide both local and long distance routing (Figure 2-45 on page 2-98).

These tracks are composed of both short-distance, segmented routing and across-chip routing tracks

(segmented at core tile boundaries). The short-distance, segmented routing resources can be

concatenated through antifuse connections to build longer routing tracks.

Figure 2- 43 • DirectConn e ct an d Carry Co nn e ct

Detailed Specifications

2-98 Revision 15

These short-distance routing tracks can be used within and between SuperClusters or between modules

of non-adjacent SuperClusters. They can be connected to the Output Tracks and to any logic module

input (R-cell, C-cell, Buffer, and TX module).

The across-chip horizontal and vertical routing provides long-distance, routing resources. These

resources interface with the rest of the routing structures through the RX and TX modules (Figure 2-45).

The RX module is used to drive signals from the across-chip horizontal and vertical routing to the Output

Tracks within the SuperCluster. The TX module is used to drive vertical and horizontal across-chip

routing from either short-distance horizontal tracks or from Output Tracks. The TX module can also be

used to drive signals from vertical across-chip tracks to horizontal across-chip tracks and vice versa.

Figure 2- 44 • FastConnect Routing

Figure 2- 45 • Horizontal and Vertical Tracks

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-99

Timing Characteristics

Table 2-70 • RTAX250S/SL (Worst-Case Military Conditions VCCA = 1.4 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitMin. Max. Min. Max.

Predicted Routing Delays

tDC Direct connect 0.08 0.07 ns

tFC Fast connect F01 0.24 0.29 ns

tRD1 Fanout 1 0.66 0.77 ns

tRD2 Fanout 2 0.84 0.99 ns

tRD3 Fanout 3 1.07 1.25 ns

tRD4 Fanout 4 1.38 1.62 ns

tRD5 Fanout 5 1.45 1.7 ns

tRD6 Fanout 6 2.08 2.44 ns

tRD7 Fanout 7 2.26 2.66 ns

tRD8 Fanout 8 2.44 2.87 ns

tRD9 Fanout 9 2.87 3.37 ns

tRD10 Fanout 10 3.3 3.88 ns

Table 2-71 • RTAX1000S/SL (Worst-Case Military Conditions VCCA = 1.4 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitMin. Max. Min. Max.

Predicted Routing Delays

tDC Direct connect 0.08 0.07 ns

tFC Fast connect F01 0.24 0.29 ns

tRD1 Fanout 1 0.66 0.77 ns

tRD2 Fanout 2 0.84 0.99 ns

tRD3 Fanout 3 1.07 1.25 ns

tRD4 Fanout 4 1.38 1.62 ns

tRD5 Fanout 5 1.45 1.7 ns

tRD6 Fanout 6 2.08 2.44 ns

tRD7 Fanout 7 2.26 2.66 ns

tRD8 Fanout 8 2.44 2.87 ns

tRD9 Fanout 9 2.87 3.37 ns

tRD10 Fanout 10 3.3 3.88 ns

Detailed Specifications

2-100 Revision 15

Table 2-72 • RTAX2000S/SL (Worst-Case Military Conditions VCCA = 1.4 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitMin. Max. Min. Max.

Predicted Routing Delays

tDC Direct connect 0.08 0.07 ns

tFC Fast connect F01 0.24 0.29 ns

tRD1 Fanout 1 0.66 0.77 ns

tRD2 Fanout 2 0.84 0.99 ns

tRD3 Fanout 3 1.07 1.25 ns

tRD4 Fanout 4 1.38 1.62 ns

tRD5 Fanout 5 1.45 1.70 ns

tRD6 Fanout 6 2.08 2.44 ns

tRD7 Fanout 7 2.26 2.66 ns

tRD8 Fanout 8 2.44 2.87 ns

tRD9 Fanout 9 2.87 3.37 ns

tRD10 Fanout 10 3.30 3.88 ns

Table 2-73 • RTAX2000D (Worst-Case Military Conditions VCCA = 1.4 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

Std. Speed

UnitMin. Max.

Predicted Routing Delays

tDC Direct connect 0.07 ns

tFC Fast connect F01 0.29 ns

tRD1 Fanout 1 0.77 ns

tRD2 Fanout 2 0.99 ns

tRD3 Fanout 3 1.25 ns

tRD4 Fanout 4 1.62 ns

tRD5 Fanout 5 1.70 ns

tRD6 Fanout 6 2.44 ns

tRD7 Fanout 7 2.66 ns

tRD8 Fanout 8 2.87 ns

tRD9 Fanout 9 3.37 ns

tRD10 Fanout 10 3.88 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-101

Table 2-74 • RTAX4000S (Worst-Case Military Conditions VCCA = 1.4 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitMin. Max. Min. Max.

Predicted Routing Delays

tDC Direct connect 0.06 0.07 ns

tFC Fast connect F01 0.26 0.29 ns

tRD1 Fanout 1 0.69 0.77 ns

tRD2 Fanout 2 0.89 0.99 ns

tRD3 Fanout 3 1.13 1.25 ns

tRD4 Fanout 4 1.46 1.62 ns

tRD5 Fanout 5 1.53 1.7 ns

tRD6 Fanout 6 2.20 2.44 ns

tRD7 Fanout 7 2.39 2.66 ns

tRD8 Fanout 8 2.58 2.87 ns

tRD9 Fanout 9 3.03 3.37 ns

tRD10 Fanout 10 3.49 3.88 ns

Table 2-75 • RTAX4000D (Worst-Case Military Conditions VCCA = 1.4 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

Std. Speed

UnitMin. Max.

Predicted Routing Delays

tDC Direct connect 0.07 ns

tFC Fast connect F01 0.29 ns

tRD1 Fanout 1 0.77 ns

tRD2 Fanout 2 0.99 ns

tRD3 Fanout 3 1.25 ns

tRD4 Fanout 4 1.62 ns

tRD5 Fanout 5 1.7 ns

tRD6 Fanout 6 2.44 ns

tRD7 Fanout 7 2.66 ns

tRD8 Fanout 8 2.87 ns

tRD9 Fanout 9 3.37 ns

tRD10 Fanout 10 3.88 ns

Detailed Specifications

2-102 Revision 15

Global Resources

One of the most important aspects of any FPGA architecture is its global resources or clocks. The RTAX-

S/SL family provides the user with flexible and easy-to-use global resources, without the limitations

normally found in other FPGA architectures. In addition, these global resources have been hardened to

improve SEU performance.

The RTAX-S/SL architecture contains two types of global resources, the HCLK (hardwired clock) and

CLK (routed clock). Every RTAX-S/SL device is provided with four HCLKs and four CLKs for a total of

eight clocks, regardless of device density.

Hardwired Clocks

The hardwired (HCLK) is a low-skew network that can directly drive the clock inputs of all sequential

modules (R-cells, I/O registers and embedded RAM/FIFOs) in the device with no antifuse in the path. All

four HCLKs are available everywhere on the chip.

Timing Characteristics

Table 2-76 • RTAX250S/SL (Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tHCKL Input Low to High 2.75 3.23 ns

tHCKH Input High to Low 2.94 3.45 ns

Table 2-77 • RTAX250S/SL Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

–1 Sp ee d Std. Speed

UnitsMin. Max. Min. Max.

tHPWH Minimum Pulse width High 0.77 0.77 ns

tHPWL Minimum Pulse width Low 0.26 0.26 ns

fHMAX1Maximum frequency 649 649 MHz

Note: *fHMAX = 1000 / (2*(MAX(tHPWH,tHPWL)))

Table 2-78 • RTAX1000S/SL (Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Sp ee d Std. Speed

UnitsMin. Max. Min. Max.

tHCKL Input Low to High 3.64 4.28 ns

tHCKH Input High to Low 3.47 4.08 ns

Table 2-79 • RTAX1000S/SL Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tHPWH Minimum Pulse width High 0.86 0.86 ns

tHPWL Minimum Pulse width Low 0.31 0.31 ns

fHMAX1Maximum frequency 581 581 MHz

Note: *fHMAX = 1000 / (2*(MAX(tHPWH,tHPWL)))

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-103

Table 2-80 • RTAX2000S/SL (Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tHCKL Input Low to High 3.64 4.28 ns

tHCKH Input High to Low 3.47 4.08 ns

Table 2-81 • RTAX2000S/SL Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tHPWH Minimum Pulse width High 0.77 0.77 ns

tHPWL Minimum Pulse width Low 0.26 0.26 ns

fHMAX1Maximum frequency 649 649 MHz

Note: *fHMAX = 1000 / (2*(MAX(tHPWH,tHPWL)))

Table 2-82 • RTAX4000S (Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tHCKL Input Low to High 5.67 6.28 ns

tHCKH Input High to Low 5.47 6.06 ns

Table 2-83 • RTAX4000S Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tHPWH Minimum Pulse width High TBD TBD ns

tHPWL Minimum Pulse width Low TBD TBD ns

fHMAX1Maximum frequency TBD TBD MHz

Note: *fHMAX = 1000 / (2*(MAX(tHPWH,tHPWL)))

Table 2-84 • RTAX2000D Worst-Case Military Conditions (VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

'Std.' Speed

UnitsMin. Max.

tHCKL Input Low to High 4.28 ns

tHCKH Input High to Low 4.08 ns

fHCKSW Maximum skew TBD ns

Table 2-85 • RTAX2000D Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

Std. Speed

UnitsMin. Max.

tHPWH Minimum Pulse width High 0.77 ns

tHPWL Minimum Pulse width Low 0.26 ns

fHMAX1Maximum frequency 649 MHz

Note: *fHMAX = 1000 / (2*(MAX(tHPWH,tHPWL)))

Detailed Specifications

2-104 Revision 15

Table 2-86 • RTAX4000D Worst-Case Military Conditions (VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

Std. Speed

UnitsMin. Max.

tHCKL Input Low to High 6.28 ns

tHCKH Input High to Low 6.06 ns

fHCKSW Maximum skew TBD ns

Note: *fHMAX = 1000 / (2*(MAX(tHPWH,tHPWL)))

Table 2-87 • RTAX4000D Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

Std. Speed

UnitsMin. Max.

tHPWH Minimum Pulse width High TBD ns

tHPWL Minimum Pulse width Low TBD ns

fHMAX1Maximum frequency TBD MHz

Note: *fHMAX = 1000 / (2*(MAX(tHPWH,tHPWL)))

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-105

Routed Clocks

The routed clock (CLK) is a low-skew network that can drive the clock inputs of all sequential modules in

the device (logically equivalent to the HCLK), but has the added flexibility in that it can drive the S0

(Enable), S1, PSET, and CLR input of a register (R-cells and I/O registers) as well as any of the inputs of

any C-cell in the device. This allows CLKs to be used not only as clocks, but also for other global signals

or high fanout nets. All four CLKs are available everywhere on the chip.

Timing Characteristics

Timing characteristics are shown in Table 2-88 through Table 2-95.

Table 2-88 • RTAX250S/SL (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tRCKL Input Low to High 2.77 3.25 ns

tRCKH Input High to Low 2.91 3.42 ns

tRCKSW Maximum skew – 16 Loads 1.40 1.64 ns

Maximum skew – 24 Loads 1.80 2.12 ns

Table 2-89 • RTAX250S/SL Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tRPWH Minimum Pulse width High 0.79 0.79 ns

tRPWL Minimum Pulse width Low 0.27 0.27 ns

fRMAX1Maximum frequency 633 633 MHz

Note: *fRMAX = 1000 / (2*(MAX(tRPWH,tRPWL)))

Table 2-90 • RTAX1000S/SL (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tRCKL Input Low to High 3.71 4.36 ns

tRCKH Input High to Low 3.53 4.14 ns

tRCKSW Maximum skew – 16 Loads 1.39 1.63 ns

Maximum skew – 24 Loads 1.80 2.11 ns

Maximum skew – 36 Loads 1.86 2.19 ns

Table 2-91 • RTAX1000S/SL Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

–1 Speed S td. Speed

UnitsMin. Max. Min. Max.

tRPWH Minimum Pulse width High 1.04 1.04 ns

tRPWL Minimum Pulse width Low 0.33 0.33 ns

fRMAX1Maximum frequency 481 481 MHz

Note: *fRMAX = 1000 / (2*(MAX(tRPWH,tRPWL)))

Detailed Specifications

2-106 Revision 15

Table 2-92 • RTAX2000S/SL (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Sp ee d Std. Speed

UnitsMin. Max. Min. Max.

tRCKL Input Low to High 3.71 4.36 ns

tRCKH Input High to Low 3.53 4.14 ns

tRCKSW Maximum skew – 16 Loads 1.39 1.63 ns

Maximum skew – 24 Loads 1.80 2.11 ns

Maximum skew – 36 Loads 2.11 2.48 ns

Table 2-93 • RTAX2000S/SL Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tRPWH Minimum Pulse width High 0.79 0.79 ns

tRPWL Minimum Pulse width Low 0.27 0.27 ns

fRMAX1Maximum frequency 633 633 MHz

Note: *fRMAX = 1000 / (2*(MAX(tRPWH,tRPWL)))

Table 2-94 • RTAX4000S (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tRCKL Input Low to High 5.77 6.39 ns

tRCKH Input High to Low 5.56 6.16 ns

tRCKSW Maximum skew – 16 Loads 1.47 1.62 ns

Maximum skew – 24 Loads 1.90 2.10 ns

Maximum skew – 36 Loads 1.94 2.15 ns

Table 2-95 • RTAX4000S Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

UnitsMin. Max. Min. Max.

tRPWH Minimum Pulse width High TBD TBD ns

tRPWL Minimum Pulse width Low TBD TBD ns

fRMAX1Maximum frequency TBD TBD MHz

Note: *fRMAX = 1000 / (2*(MAX(tRPWH,tRPWL)))

Table 2-96 • RTAX2000D (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

Std. Speed

UnitsMin. Max.

tRCKL Input Low to High 4.36 ns

tRCKH Input High to Low 4.14 ns

tRCKSW Maximum skew – 16 Loads 1.63 ns

Maximum skew – 24 Loads 2.11 ns

Maximum skew – 36 Loads 2.48 ns

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-107

Table 2-97 • RTAX2000D Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

Std. Speed

UnitsMin. Max.

tRPWH Minimum Pulse width High 0.79 ns

tRPWL Minimum Pulse width Low 0.27 ns

fRMAX1Maximum frequency 633 MHz

Note: *fRMAX = 1000 / (2*(MAX(tRPWH,tRPWL)))

Table 2-98 • RTAX4000D (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

'Std.' Speed

UnitsMin. Max.

tRCKL Input Low to High 6.39 ns

tRCKH Input High to Low 6.16 ns

tRCKSW Maximum skew – 16 Loads 1.62 ns

Maximum skew – 24 Loads 2.10 ns

Maximum skew – 36 Loads 2.15 ns

Table 2-99 • RTAX4000D Worst-Case MPW (VCCA = 1.575 V, VCCI = 3.6 V, TJ = 125°C)

Parameter Description

Std. Speed

UnitsMin. Max.

tRPWH Minimum Pulse width High TBD ns

tRPWL Minimum Pulse width Low TBD ns

fRMAX1Maximum frequency TBD MHz

Note: *fRMAX = 1000 / (2*(MAX(tRPWH,tRPWL)))

Detailed Specifications

2-108 Revision 15

Global Resource Distribution

At the root of each global resource is a ClockDistBuffer (CDB). There are two groups of four CDBs for every

device. One group, located at the center of the north edge (in the I/O ring) of the chip, sources the four

HCLKs. The second group, located at the center of the south edge (again in the I/O ring), sources the four

CLKs (Figure 2-46).

Regardless of the type of global resource, HCLK or CLK, each of the eight resources reach the ClockTileDist

(CTD) Cluster located at the center of every core tile with zero skew. From the ClockTileDist Cluster, all four

HCLKs and four CLKs are distributed through the core tile (Figure 2-47).

Figure 2- 46 • ClockDistBuffer Group

Figure 2- 47 • Example of HCLK and CLK Distributions on the RTAX2000S/SL

CDB Cluster

PN PN PN PN

HCLKA HCLKB HCLKC HCLKD

CLKE CLKF CLKG CLKH

CDB Cluster

HCLK CLK

CDB Cluster

ClockTileDist Cluster

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-109

The ClockTileDist Cluster contains an HCLKMux (HM) module for each of the four HCLK trees and a

CLKMux (CM) module for each of the CLK trees. The HCLK branches then propagate horizontally

through the middle of the core tile to HCLKColDist (HD) modules in every SuperCluster column. The CLK

branches propagate vertically through the center of the core tile to CLKRowDist (RD) modules in every

SuperCluster row. Together, the HCLK and CLK branches provide for a low-skew global fanout within the

core tile (Figure 2-48 and Figure 2-49).

Figure 2-48 • CTD, CD, and HD Module Layout

Figure 2-49 • HCLK and CLK Distribution within a Co re Ti le

Detailed Specifications

2-110 Revision 15

The HM and CM modules can select between:

• The HCLK or CLK source

• A local signal routed on generic routing resources

This allows each core tile to have eight clocks independent of the other core tiles in the device.

Both HCLK and CLK are segmentable, meaning that individual branches of the global resource can be

used independently.

Like the HM and CM modules, the HD and RD modules can select between:

• The HCLK or CLK source from the HM or CM module, respectively

• A local signal routed on generic routing resources

Again, an unused input can be tied to ground for power savings.

The RTAX-S/SL architecture is capable of supporting a large number of local clocks. Refer to the

RTAX-S/SL Clocki ng Resource and Implementation application note for more information.

Microsemi Designer software’s place-and-route takes advantage of the segmented clock structure found

in RTAX-S/SL devices by turning off any unused clock segments. This results in not only better

performance but also lower power consumption. Future releases of Designer will give the user greater

control over these individual clock segments.

Global Resource Access Macros

Global resources can be driven by one of three sources: external pad(s) or an internal net. These

connections can be made by using one of two types of macros: CLKBUF and CLKINT.

CLKBUF and HCLKBUF

CLKBUF (HCLKBUF) is used to drive a CLK (HCLK) from external pads. These macros can be used

either generically or with the specific I/O standard desired (e.g., CLKBUF_LVCMOS25,

HCLKBUF_LVDS, etc.) (Figure 2-50).

Package pins CLKEP and CLKEN are associated with CLKE; package pins HCLKAP and HCLKAN are

associated with HCLKA, etc.

Note that when CLKBUF (HCLKBUF) is used with a single-ended I/O standard, it must be tied to the P-

pad of the CLK (HCLK) package pin. In this case, the CLK (HCLK) N-pad can be used for user signals.

CLKINT and HCLKINT

CLKINT (HCLKINT) is used to access the CLK (HCLK) resource internally from the user signals

(Figure 2-51).

Figure 2- 50 • CLKBUF and HCLKBUF

Figure 2- 51 • CLKINT and HCLKINT

NCLKBUF

HCLKBUF

Clock

Network

CLKINT

HCLKINT

Clock

Network

Logic

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-111

Embedded Memory

The RTAX-S/SL architecture provides extensive, high-speed memory resources to the user. Each 4,608-

bit block of RAM contains its own embedded FIFO controller, allowing the user to configure each block as

either RAM or FIFO.

To meet the needs of high performance designs, the memory blocks operate in synchronous mode for

both read and write operations. However, the read and write clocks are completely independent, and

each may operate beyond 500 MHz.

No additional core logic resources are required to cascade the address and data buses when cascading

different RAM blocks. Dedicated routing runs along each column of RAM to facilitate cascading.

The RTAX-S/SL memory block includes dedicated FIFO control logic to generate internal addresses and

external flag logic (FULL, EMPTY, AFULL, AEMPTY). Since read and write operations can occur

asynchronously to one another, special control circuitry is included to prevent metastability, overflow, and

underflow. A block diagram of the memory module is illustrated in Figure 2-52.

During RAM operation, read (RA) and write (WA) addresses are sourced by user logic and the FIFO

controller is ignored. In FIFO mode, the internal addresses are generated by the FIFO controller and

routed to the RAM array by internal MUXes. Enables with programmable polarity are provided to create

upper address bits for cascading up to 16 memory blocks. When cascading memory blocks, the bussed

signals WA, WD, WEN, RA, RD, and REN are internally linked to eliminate external routing congestion.

RAM

Each memory block consists of 4,608 bits that can be organized as 128x36, 256x18, 512x9, 1kx4, 2kx2,

or 4kx1 and are cascadable to create larger memory sizes. This allows built-in bus width conversion

(Table 2-100). Each block has independent read and write ports, which enable simultaneous read and

write operations. Simultaneous read and write operations to the same address is not supported.

Figure 2- 52 • RTAX-S/SL Memory Module

RA [K:0] RD [(N-1):0]

REN

RCLK

WD [(M-1):0]

WA [J:0]

WEN

WCLK

PIPE

RW [2:0]

WW [2:0]

Detailed Specifications

2-112 Revision 15

Clocks

The RCLK and the WCLK have independent source polarity selection and can be sourced by any global

or local signal.

RAM Configurations

The RTAX-S/SL architecture allows the read side and write side of RAMs to be organized independently,

allowing for bus conversion. For example, the write side can be set to 256x18 and the read side to 512x9.

Both the write width and read width for the RAM blocks can be specified independently and changed

dynamically with the WW (write width) and RW (read width) pins. The available DxW configurations are:

128x36, 256x18, 512x9, 1kx4, 2kx2, and 4kx1. The allowable RW and WW values are shown in

Table 2-102.

When widths of one, two, and four are selected, the ninth bit is unused. For example, when writing nine-

bit values and reading four-bit values, only the first four bits and the second four bits of each nine-bit

value are addressable for read operations. The ninth bit is not accessible. Conversely, when writing four-

bit values and reading nine-bit values, the ninth bit of a read operation will be undefined.

Note that the RAM blocks employ little-endian byte order for read and write operations.

Table 2-100 • Memory Block WxD Options

Data-Word (in bits) Depth Address Bus Data Bus

1 4,096 RA/WA[11:0] RD/WD[0]

2 2,048 RA/WA[10:0] RD/WD[1:0]

4 1,024 RA/WA[9:0] RD/WD[3:0]

9 512 RA/WA[8:0] RD/WD[8:0]

18 256 RA/WA[7:0] RD/WD[17:0]

36 128 RA/WA[6:0] RD/WD[35:0]

Table 2-101 • RAM Signal Description

Signal Direction Description

WCLK Input Write clock (can be active on either edge).

WA[J:0] Input Write address bus.The value J is dependent on the RAM configuration and the

number of cascaded memory blocks. The valid range for J is from 6 to15.

WD[M-1:0] Input Write data bus. The value M is dependent on the RAM configuration and can be

1, 2, 4, 9, 18, or 36.

RCLK Input Read clock (can be active on either edge).

RA[K:0] Input Read address bus. The value K is dependent on the RAM configuration and the

number of cascaded memory blocks. The valid range for K is from 6 to 15.

RD[N-1:0] Output Read data bus. The value N is dependent on the RAM configuration and can be

1, 2, 4, 9, 18, or 36.

REN Input Read enable. When this signal is valid on the active edge of the clock, data at

location RA will be driven onto RD.

WEN Input Write enable. When this signal is valid on the active edge of the clock, WD data

will be written at location WA.

RW[2:0] Input Width of the read operation dataword.

WW[2:0] Input Width of the write operation dataword.

Pipe Input Sets the pipeline option to be on or off.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-113

Modes of Operation

There are two read modes and one write mode:

1. Read Nonpipelined (synchronous – one clock edge):

In the standard read mode, new data is driven onto the RD bus in the clock cycle immediately

following RA and REN valid. The read address is registered on the read-port active-clock edge

and data appears at read-data after the RAM access time. Setting PIPE to OFF enables this

mode.

2. Read Pipelined (synchronous – two clock edges):

The pipelined mode incurs an additional clock delay from address to data, but enables operation

at a much higher frequency. The read-address is registered on the read-port active-clock edge,

and the read data is registered and appears at RD after the second read clock edge. Setting PIPE

to ON enables this mode.

3. Write (synchronous – one clock edge):

On the write active-clock edge, the write data are written into the SRAM at the write address when

WEN is high. The setup time of the write address, write enables, and write data are minimal with

respect to the write clock.

Write and read transfers are described with timing requirements beginning in "Timing Characteristics" on

page 2-115.

Enhancing SEU Performance

SRAM structures are inherently susceptible to upsets caused by high-energy particles encountered in

space. High-energy particles can cause an SRAM cell to change state, resulting in the loss or corruption

of a valuable data bit. To allow users to achieve high levels of SEU performance, Microsemi has

developed an intellectual property (IP) core to enhance the SEU tolerance of the embedded SRAM within

RTAX-S/SL.

This IP employs two upset-mitigation techniques:

• Error Detection and Correction (EDAC)

• A background memory-refresher, or scrubber

The EDAC IP employs the use of shortened Hamming Codes to provide the user with single-error

correction/double-error detection (SEC/DED) capabilities. These shortened Hamming Codes provide the

user with an implementation that has a reduced number of logic levels and less complexity than

traditional Hamming Codes. The SmartGen-generated EDAC IP supports RAM widths of 8, 16, and 32

bits, with a variable RAM depth from 256 to 4k words.

The memory scrubber circuitry has also been embedded in the EDAC IP as an optional block. The

scrubber circuitry periodically refreshes memory in the background to ensure that no corruption of its

contents has taken place while the memory was not in use. The refresh rate can be set by the user.

The use of EDAC IP combined with the embedded memory scrubber circuitry, gives the RTAX-S/SL an

SEU radiation performance level of better than 10-10 errors/bit-day. See the application note Using EDAC

RAM for RadTolerant RTAX-S/SL FPGAs and Axcelerator FPGAs.

Table 2-102 • Allowable RW and WW Values

RW(2:0) WW(2:0) D x W

000 000 4kx1

001 001 2kx2

010 010 1kx4

011 011 512x9

100 100 256x18

101 101 128x36

11x 11x reserved

Detailed Specifications

2-114 Revision 15

Timing Model and Waveforms

Figure 2-53 • SRAM Model

Figure 2-54 • RAM Write Timing Waveforms

Figure 2-55 • RAM Read Timing Waveforms

WD RD

REN

WCLK RCLK

WEN

WCLK

tWCKP

tWxxSU tWxxHD

tWCKH tWCKL

WA<11:0>, WD<35:0>, WEN<4:0>

RCLK

RA<11:0>, REN<4:0>

RD <35:0>

tRxxSU tRxxHD

tRCKP tRCKH tRCKL

tRCK2RD2 tRCK2RD1

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-115

Timing Characteristics

Table 2-103 • One RAM Block* (Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL

RTAX4000D/DL

RTAX250/1000/

2000S/SL

RTAX2000D/DL All

Min. Max. Min. Max. Min. Max.

Write Mod e

tWDASU Write Data Setup vs. WCLK 1.51 1.42 1.67 ns

tWDAHD Write Data Hold vs. WCLK 0.31 0.29 0.34 ns

tWADSU Write Address Setup vs. WCLK 1.51 1.42 1.67 ns

tWADHD Write Address Hold vs. WCLK 0.00 0.00 0.00 ns

tWENSU Write Enable Setup vs. WCLK 1.51 1.42 1.67 ns

tWENHD Write Enable Hold vs. WCLK 0.31 0.29 0.34 ns

tWCKH WCLK Minimum High Pulse Width 0.75 0.75 0.75 ns

tWCLKL WCLK Minimum Low Pulse Width 0.88 0.88 0.88 ns

tWCKP WCLK Minimum Period 1.63 1.63 1.63 ns

Read Mode

tRADSU Read Address Setup vs. RCLK 1.13 1.06 1.25 ns

tRADHD Read Address Hold vs. RCLK 0.00 0.00 0.00 ns

tRENSU Read Enable Setup vs. RCLK 1.13 1.06 1.25 ns

tRENHD Read Enable Hold vs. RCLK 0.00 0.00 0.00 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 1.85 1.74 2.05 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 3.02 2.85 3.35 ns

tRCLKH RCLK Minimum High Pulse Width 0.77 0.77 0.77 ns

tRCLKL RCLK Minimum Low Pulse Width 0.93 0.93 0.93 ns

tRCKP RCLK Minimum Period 1.70 1.70 1.70 ns

Note: *Timing data for this single block RAM has a depth of 4,096. For all other combinations, use Microsemi's

SmartTime to ol.

Detailed Specifications

2-116 Revision 15

Table 2-104 • Two RAM Blocks* Are Cascaded (Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL

RTAX4000D/DL

RTAX250/1000/

2000S/SL

RTAX2000D/DL All

Min. Max. Min. Max. Min. Max.

Write Mod e

tWDASU Write Data Setup vs. WCLK 1.95 1.83 2.16 ns

tWDAHD Write Data Hold vs. WCLK 0.00 0.00 0.00 ns

tWADSU Write Address Setup vs. WCLK 1.95 1.83 2.16 ns

tWADHD Write Address Hold vs. WCLK 0.00 0.00 0.00 ns

tWENSU Write Enable Setup vs. WCLK 1.95 1.83 2.16 ns

tWENHD Write Enable Hold vs. WCLK 0.00 0.00 0.00 ns

tWCKH WCLK Minimum High Pulse Width 0.75 0.75 0.75 ns

tWCLKL WCLK Minimum Low Pulse Width 1.76 1.76 1.76 ns

tWCKP WCLK Minimum Period 2.51 2.51 2.51 ns

Read Mode

tRADSU Read Address Setup vs. RCLK 2.38 2.24 2.64 ns

tRADHD Read Address Hold vs. RCLK 0.00 0.00 0.00 ns

tRENSU Read Enable Setup vs. RCLK 2.38 2.24 2.64 ns

tRENHD Read Enable Hold vs. RCLK 0.00 0.00 0.00 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 2.00 1.89 2.22 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 3.16 2.98 3.50 ns

tRCLKH RCLK Minimum High Pulse Width 0.73 0.73 0.73 ns

tRCLKL RCLK Minimum Low Pulse Width 1.89 1.89 1.89 ns

tRCKP RCLK Minimum Period 2.62 2.62 2.62 ns

Note: *Timing data for two cascaded RAM blocks uses a depth of 8,192. For all other combinations, use Microsemi's

SmartTime to ol.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-117

Table 2-105 • Four RAM Blocks* Are Cascaded (Worst-Case Military Conditions VC CA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL

RTAX4000D/DL

RTAX250/1000/

2000S/SL

RTAX2000D/DL All

Min. Max. Min. Max. Min. Max.

Write Mod e

tWDASU Write Data Setup vs. WCLK 3.31 3.12 3.67 ns

tWDAHD Write Data Hold vs. WCLK 0.00 0.00 0.00 ns

tWADSU Write Address Setup vs. WCLK 3.31 3.12 3.67 ns

tWADHD Write Address Hold vs. WCLK 0.00 0.00 0.00 ns

tWENSU Write Enable Setup vs. WCLK 3.31 3.12 3.67 ns

tWENHD Write Enable Hold vs. WCLK 0.00 0.00 0.00 ns

tWCKH WCLK Minimum High Pulse Width 0.75 0.75 0.75 ns

tWCLKL WCLK Minimum Low Pulse Width 2.51 2.51 2.51 ns

tWCKP WCLK Minimum Period 3.26 3.26 3.26 ns

Read Mode

tRADSU Read Address Setup vs. RCLK 4.31 4.06 4.77 ns

tRADHD Read Address Hold vs. RCLK 0.00 0.00 0.00 ns

tRENSU Read Enable Setup vs. RCLK 4.31 4.06 4.77 ns

tRENHD Read Enable Hold vs. RCLK 0.00 0.00 0.00 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 3.30 3.11 3.66 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 3.96 3.73 4.38 ns

tRCLKH RCLK Minimum High Pulse Width 2.96 0.73 0.73 ns

tRCLKL RCLK Minimum Low Pulse Width 3.69 2.96 2.96 ns

tRCKP RCLK Minimum Period 3.69 3.69 ns

Note: *Timing data fo r fo ur cascaded RAM blocks uses a depth of 16,384. For all other combination s, use Microsemi's

SmartTime to ol.

Detailed Specifications

2-118 Revision 15

Table 2-106 • Eight RAM Blocks Are Cascaded (Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

Applies to Al l Speed Grades

Units

RTAX4000S/SL

RTAX4000D/DL

RTAX250/1000/

2000S/SL

RTAX2000D/DL

Min. Max. Min. Max.

Write Mod e

tWDASU Write Data Setup vs. WCLK 11.80 11.34 ns

tWDAHD Write Data Hold vs. WCLK 0.00 0.00 ns

tWADSU Write Address Setup vs. WCLK 11.80 11.34 ns

tWADHD Write Address Hold vs. WCLK 0.00 0.00 ns

tWENSU Write Enable Setup vs. WCLK 11.80 11.34 ns

tWENHD Write Enable Hold vs. WCLK 0.00 0.00 ns

tWCKH WCLK Minimum High Pulse Width 0.75 0.75 ns

tWCLKL WCLK Minimum Low Pulse Width 5.13 5.13 ns

tWCKP WCLK Minimum Period 5.88 5.88 ns

Read Mode

tRADSU Read Address Setup vs. RCLK 13.16 12.63 ns

tRADHD Read Address Hold vs. RCLK 0.00 0.00 ns

tRENSU Read Enable Setup vs. RCLK 13.16 12.63 ns

tRENHD Read Enable Hold vs. RCLK 0.00 0.00 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 8.46 8.19 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 10.62 10.22 ns

tRCLKH RCLK Minimum High Pulse Width 0.73 0.73 ns

tRCLKL RCLK Minimum Low Pulse Width 5.77 5.77 ns

tRCKP RCLK Minimum Period 6.50 6.50 ns

Note: *Timing data for ei ght cascaded RAM blocks use s a depth of 32,768. For all other combina tions, use Microsemi's

SmartTime to ol.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-119

Table 2-107 • Sixteen RAM Blocks Are Cascaded (Worst-Case Military Conditions VCCA = 1.425 V,

VCCI = 3.0 V, TJ = 125°C)

Parameter Description

Applies to Al l Speed Grades

Units

RTAX4000S/SL

RTAX4000D/DL

RTAX250/1000/

2000S/SL

RTAX2000D/DL

Min. Max. Min. Max.

Write Mod e

tWDASU Write Data Setup vs. WCLK 30.80 29.47 ns

tWDAHD Write Data Hold vs. WCLK 0.00 0.00 ns

tWADSU Write Address Setup vs. WCLK 30.80 29.47 ns

tWADHD Write Address Hold vs. WCLK 0.00 0.00 ns

tWENSU Write Enable Setup vs. WCLK 30.80 29.47 ns

tWENHD Write Enable Hold vs. WCLK 0.00 0.00 ns

tWCKH WCLK Minimum High Pulse Width 0.75 0.75 ns

tWCLKL WCLK Minimum Low Pulse Width 13.40 13.40 ns

tWCKP WCLK Minimum Period 14.15 14.15 ns

Read Mode

tRADSU Read Address Setup vs. RCLK 33.01 31.56 ns

tRADHD Read Address Hold vs. RCLK 0.00 0.00 ns

tRENSU Read Enable Setup vs. RCLK 33.01 31.56 ns

tRENHD Read Enable Hold vs. RCLK 0.00 0.00 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 24.56 23.58 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 25.61 24.58 ns

tRCLKH RCLK Minimum High Pulse Width 0.73 0.73 ns

tRCLKL RCLK Minimum Low Pulse Width 14.41 14.41 ns

tRCKP RCLK Minimum Period 15.14 15.14 ns

Note: Timing data for sixteen cascaded RAM blocks uses a depth of 65,536. For all other combinations, use

Microsemi's SmartTime tool.

Detailed Specifications

2-120 Revision 15

FIFO

Every memory block has its own embedded FIFO controller. Each FIFO block has one read port and one

write port. This embedded FIFO controller uses no internal FPGA logic and features:

• Glitch-free FIFO Flags

• Gray-code address counters/pointers to prevent metastability problems

• Overflow and underflow control

Both ports are configurable in various size from 4kx1 to 128x36, similar to the RAM block size. Each port

is fully synchronous.

Read and write operations can be completely independent. Data on the appropriate WD pins are written

to the FIFO on every active WCLK edge as long as WEN is high. Data is read from the FIFO and output

on the appropriate RD pins on every active RCLK edge as long as REN is asserted.

The FIFO block offers programmable Almost-Empty (AEMPTY) and Almost-Full (AFULL) flags as well as

EMPTY and FULL flags (Figure 2-56):

• The FULL flag is synchronous to WCLK. It allows the FIFO to inhibit writing when full.

• The EMPTY flag is synchronous to RCLK. It allows the FIFO to inhibit reading at the empty

condition.

Note: Microsemi recommends that the WCLK and the RCLK are in phase with each other. For more

information refer to the application note, EMPTY and FULL Flag Behaviors of the Axcelerator FIFO

Controller.

Gray code counters are used to prevent metastability problems associated with flag logic. The depth of

the FIFO is dependent on the data width and the number of memory blocks used to create the FIFO. The

write operations to the FIFO are synchronous with respect to the WCLK, and the read operations are

synchronous with respect to the RCLK.

The FIFO block may be reset to the empty state

The FIFO control unit was not implemented with SEU-hardened registers. Designs requiring high SEU

tolerance should implement the FIFO control unit from hardened core logic.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-121

Figure 2-56 • RTAX-S/SL RAM with Embedded FIFO Controller

CNT 16

AFVAL

AEVAL

> =

SUB 16

RCLK

WCLK

CLR

FWEN

FREN

DEPTH[3:0]

RD [n-1:0]

WD [n-1:0]

RCLK

WCLK

RA [J:0]

WA [J:0]

REN

WEN

FULL

AEMPTY

AFULL

EMPTY

PIPE

RW[2:0]

WW[2:0]

WIDTH[2:0]

RAM

Detailed Specifications

2-122 Revision 15

FIFO Flag Logic

The FIFO is user configurable into various depths and widths. Figure 2-57 shows the FIFO address

counter details.

• Bits 11 to 5 are active for all modes.

• As the data word size is reduced, more least-significant bits are added to the address.

• As the number of cascaded blocks increases, the number of significant bits in the address

increases.

For example, if four blocks are cascaded as a 1kx16 FIFO with each block having a 1kx4 aspect ratio,

bits 11 to 2 of the address will be used to specify locations within each RAM block, whereas bits 13 and

12 will be used to specify the RAM block.

The AFULL and AEMPTY flag threshold values are programmable. The threshold values are AFVAL and

AEVAL, respectively. Although the trigger threshold for each flag is defined with eight bits, the effective

number of threshold bits in the comparison depends on the configuration. Note that the effective number

of threshold bits corresponds to the range of active bits in the FIFO address space (Ta b le 2-108).

Note: Inactive counter bits are set to zero.

Figure 2- 57 • FIFO Address Counters

CNTR [12]

activate

FIFO Address Counters

>> REN [4:0], RAD [11:0]

>> WEN [4:0], WAD [11:0]

[12:W] [13:W]

[14:W]

[15:W]

128x36 1kx4512x9256x18

[11:5]

[11:4] [11:3]

[11:2]

[11:1] [11:0]

4kx1

2kx2

Variable Active Address Space

CNTR [15]

activate

CNTR [2]

activate

CNTR [3]

activate

CNTR [4]

activate

CNTR [11:5]

always active

CNTR [13]

activate

CNTR [14]

activate

CNTR [0]

activate

CNTR [1]

activate

Cas 16 blks

by 1

by 2

by 4

by 9

by 18

by 36

Cas 2 blks

Cas 4 blks

Cas 8 blks

Mode when

Active

Counter

Bits

R/W EN[3]

R/W ADD[0]

R/W ADD[1]

R/W ADD[2]

R/W ADD[3]

R/W ADD[7:5]

R/W ADD[11:8]

R/W EN[0]

R/W EN[1]

R/W EN[2]

R/W ADD[4]

FIFO Address

AEVAL/AFVAL[7]

not compared

AEVAL/AFVAL[3:0]

AEVAL/AFVAL[4]

AEVAL/AFVAL[5]

AEVAL/AFVAL[6]

CNTR [15:0]

Alignment of

Threshold bits

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-123

Figure 2-58 illustrates flag generation. The Verilog statements for flag assignment are:

assign AF = (DIFF[15:0] >={AFVAL[7:0],8'b00000000})?1:0;

assign AE = ({AEVAL[7:0],8'b00000000}>=DIFF[15:0])?1:0;

The number of DIFF-bits active depends on the configuration depth and width (Table 2-109). The active-

high CLR pin is used to reset the FIFO to the empty state, which sets FULL and AFULL low, and EMPTY

and AEMPTY high.

Assuming that the EMPTY flag is not set, new data is read from the FIFO when REN is valid on the active

edge of the clock. Write and read transfers are described with timing requirements in "Timing

Characteristics" on page 2-126. For more information refer to the application note, EMPTY and FULL

Flag Behaviors of the Axcelerator FIFO Con troller.

Table 2-108 • FIFO Flag Logic

Mode

Inactive

AEVAL/AFVAL

bits Inactive DIFF bits

(set to 0) DIFF comparison to

AFVAL/AEVAL

Non-cascade [7:4] [15:12] DIFF[11:8] withAE/FVAL[3:0]

Cascade 2 blocks [7:5] [15:13] DIFF[12:8] withAE/FVAL[4:0]

Cascade 4 blocks [7:6] [15:14] DIFF[13:8] withAE/FVAL[5:0]

Cascade 8 blocks [7] [15] DIFF[14:8] withAE/FVAL[6:0]

Cascade 16 blocks None None DIFF[15:8] withAE/FVAL[7:0]

Figure 2- 58 • ALMOST-EMPTY and ALMOST-FULL Logic

WCNTR

[15:0]

WCLK

RCNTR

[15:0]

RCLK

AEMPTY

AFULL

X>=Y

(16-bit)

DIFF [15:0]

AEVAL [7:0], GND [7:0] (MSB....LSB)

AFVAL [7:0], GND [7:0] (MSB....LSB)

Detailed Specifications

2-124 Revision 15

Glitch Elimination

An analog filter is added to each FIFO controller to guarantee, glitch-free FIFO-flag logic.

Overflow and Underflow Control

The counter MSB keeps track of the difference between the read address (RA) and the write address

(WA). The EMPTY flag is set when the read and write addresses are equal. To prevent underflow, the

write address is double-sampled by the read clock prior to comparison with the read address (part A in

Figure 2-59). To prevent overflow, the read address is double-sampled by the write clock prior to

comparison to the write address (part B in Figure 2-59).

FIFO Configurations

Unlike the RAM, the FIFO's write width and read width cannot be specified independently. For the FIFO,

the write and read widths must be the same. The WIDTH pins are used to specify one of six allowable

word widths, as shown in Tabl e 2 - 11 0 .

The DEPTH pins allow RAM cells to be cascaded to create larger FIFOs. The four pins allow depths of 2,

4, 8, and 16 to be specified. Table 2-100 on page 2-112 describes the FIFO depth options for various

data width and memory blocks.

Interface

Figure 2-60 shows a logic block diagram of the RTAX-S/SL FIFO module.

Table 2-109 • Number of Available Configuration Bits

Number of Blocks Block DxW Number of AEVAL/AFVAL Bits

1 1x1 4

2 1x2 4

2 2x1 5

4 1x4 4

4 2x2 5

4 4x1 6

8 1x8 4

8 2x4 5

8 4x2 6

8 8x1 7

16 1x16 4

16 2x8 5

16 4x4 6

16 8x2 7

16 16x1 8

Figure 2- 59 • Overflow and Underflow Contro l

=EMPTY

RCLK =FULL

WCLK

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-125

Cascading FIFO Blocks

FIFO blocks can be cascaded to create deeper FIFO functions. When building larger FIFO blocks, if the

word width can be fractured in a multi-bit FIFO, the fractured word configuration is recommended over a

cascaded configuration. For example, 256x36 can be configured as two blocks of 256x18. This should be

taken into account when building the FIFO blocks manually. However, when using SmartGen, the user

only needs to specify the depth and width of the necessary FIFO blocks. SmartGen automatically

configures these blocks to optimize performance.

Clock

As with RAM configuration, the RCLK and WCLK pins have independent polarity selection

Table 2-110 • FIFO Width Configurations

WIDTH(2:0) WxD

000 1x4k

001 2x2k

010 4x1k

011 9x512

100 18x256

101 36x128

11x Reserved

Figure 2- 60 • FIFO Block Diagram

DEPTH [3:0] RD [35:0]

FULL

EMPTY

AFULL

AEMPTY

WIDTH [2:0]

FWEN

FREN

PIPE

RCLK

WD [35:0]

AEVAL [7:0]

AFVAL [7:0]

WCLK

CLR

Detailed Specifications

2-126 Revision 15

Timing Characteristics

Figure 2-61 • FIFO Model

Figure 2-62 • FIFO Write Timing

FWEN

FREN

RCLK

WCLK

AFULL

EMPTY

AEMPTY

FULL

Clr

tWCKP

tWSU tWHD

tWCK2xF

tCLR2xF

tCLR2HF

tWCKH tWCKL

WCLK

CLR

WD<35:0>, FWEN

EMPTY, AEMPTY, AFULL, FULL

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-127

Figure 2-63 • FIFO Read Timing

RCLK

CLR

tRCKP

tRSU tRHD

tRCK2RD1 tRCK2RD2

tCK2xF

tCLR2xF

tCLRHF

tRCKH tRCKL

FREN

EMPTY, AEMPTY, AFULL, FULL

RD <35:0>

Detailed Specifications

2-128 Revision 15

Table 2-111 • One FIFO Block (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/

2000S/SL All

Min. Max. Min. Max. Min. Max.

FIFO Module Timing

tWSU Write Setup 15.92 15.26 17.64 ns

tWHD Write Hold 0.31 0.29 0.34 ns

tWCKH WCLK High 0.75 0.75 0.75 ns

tWCKL WCLK Low 0.88 0.88 0.88 ns

tWCKP Minimum WCLK Period 1.63 1.63 1.63 ns

tRSU Read Setup 16.25 15.32 18.01 ns

tRHD Read Hold 0.00 0.00 0.00 ns

tRCKH RCLK High 0.77 0.77 0.77 ns

tRCKL RCLK Low 0.93 0.93 0.93 ns

tRCKP Minimum RCLK period 1.70 1.70 1.70 ns

tCLR2FF Clear-to-flag (EMPTY/FULL) 2.68 2.52 2.97 ns

tCLR2AF Clear-to-flag (AEMPTY/AFULL) 6.13 5.78 6.79 ns

tCK2FF Clock-to-flag (EMPTY/FULL) 2.97 2.80 3.29 ns

tCK2AF Clock-to-flag (AEMPTY/AFULL) 7.05 6.64 7.81 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 1.85 1.74 2.05 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 3.02 3.50 4.12 ns

Note: Timing data for this single cascaded FIFO block uses a depth of 4,096. For all other combinations, please use

Microsemi's Timing software.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-129

Table 2-112 • Two FIFO Blocks Are Cascaded (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/

2000S/SL All

Min. Max. Min. Max. Min. Max.

FIFO Module Timing

tWSU Write Setup 19.21 18.10 21.28 ns

tWHD Write Hold 0.00 0.00 0.00 ns

tWCKH WCLK High 0.75 0.75 0.75 ns

tWCKL WCLK Low 1.76 1.76 1.76 ns

tWCKP Minimum WCLK Period 2.51 2.51 2.51 ns

tRSU Read Setup 20.02 18.86 22.18 ns

tRHD Read Hold 0.00 0.00 0.00 ns

tRCKH RCLK High 0.73 0.73 0.73 ns

tRCKL RCLK Low 1.89 1.89 1.89 ns

tRCKP Minimum RCLK period 2.62 2.62 2.62 ns

tCLR2FF Clear-to-flag (EMPTY/FULL) 2.68 2.52 2.97 ns

tCLR2AF Clear-to-flag (AEMPTY/AFULL) .6.13 5.78 6.79 ns

tCK2FF Clock-to-flag (EMPTY/FULL) 2.97 2.80 3.29 ns

tCK2AF Clock-to-flag (AEMPTY/AFULL) 7.05 6.64 7.81 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 2.00 1.89 2.22 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 3.16 2.98 3.50 ns

Note: Timing data for two cascaded FIFO blocks uses a depth of 8,192. For all other combinations, please use

Microsemi's Timing software.

Detailed Specifications

2-130 Revision 15

Table 2-113 • Four FIFO Blocks Are Cascaded (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/

2000S/SL All

Min. Max. Min. Max. Min. Max.

FIFO Module Timing

tWSU Write Setup 20.40 19.23 22.60 ns

tWHD Write Hold 0.00 0.00 0.00 ns

tWCKH WCLK High 0.75 0.75 0.75 ns

tWCKL WCLK Low 2.51 2.51 2.51 ns

tWCKP Minimum WCLK Period 3.26 3.26 3.26 ns

tRSU Read Setup 21.33 20.10 23.63 ns

tRHD Read Hold 0.00 0.00 0.00 ns

tRCKH RCLK High 0.73 0.73 0.73 ns

tRCKL RCLK Low 2.96 2.96 2.96 ns

tRCKP Minimum RCLK period 3.69 3.69 3.69 ns

tCLR2FF Clear-to-flag (EMPTY/FULL) 2.68 2.52 2.97 ns

tCLR2AF Clear-to-flag (AEMPTY/AFULL) 6.13 5.78 6.79 ns

tCK2FF Clock-to-flag (EMPTY/FULL) 2.97 2.80 3.29 ns

tCK2AF Clock-to-flag (AEMPTY/AFULL) 7.05 6.64 7.81 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 3.30 3.11 3.66 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 3.96 3.73 4.38 ns

Note: Timing data for four cascaded FIFO blocks uses a depth of 16,384. For all other combinations, please use

Microsemi's Timing software.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-131

Table 2-114 • Eight FIFO Blocks Are Cascaded (Worst-Case MIlitary Conditions VCCA = 1.425 V, VCCI = 3.0 V,

TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/

2000S/SL All

Min. Max. Min. Max. Min. Max.

FIFO Module Timing

tWSU Write Setup 21.59 20.35 23.92 ns

tWHD Write Hold 0.00 0.00 0.00 ns

tWCKH WCLK High 0.75 0.75 0.75 ns

tWCKL WCLK Low 5.13 5.13 5.13 ns

tWCKP Minimum WCLK Period 5.88 5.88 5.88 ns

tRSU Read Setup 22.66 21.35 25.10 ns

tRHD Read Hold 0.00 0.00 0.00 ns

tRCKH RCLK High 0.73 0.73 0.73 ns

tRCKL RCLK Low 5.77 5.77 5.77 ns

tRCKP Minimum RCLK period 6.50 6.50 6.50 ns

tCLR2FF Clear-to-flag (EMPTY/FULL) 2.68 2.52 2.97 ns

tCLR2AF Clear-to-flag (AEMPTY/AFULL) 6.13 5.78 6.79 ns

tCK2FF Clock-to-flag (EMPTY/FULL) 2.97 2.80 3.29 ns

tCK2AF Clock-to-flag (AEMPTY/AFULL) 7.05 6.64 7.81 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 4.73 4.46 5.24 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 6.89 6.49 7.63 ns

Note: Timing data for eight cascaded FIFO blocks uses a depth of 32,768. For all other combinations, please use

Microsemi's Timing software.

Detailed Specifications

2-132 Revision 15

Building RAM and FIFO Modules

RAM and FIFO modules can be generated and included in a design in two different ways:

• Using the SmartGen core generator where the user defines the depth and width of the

FIFO/RAM, and then instantiates this block into the design (please refer to the SmartGen,

FlashROM, Analog System Builder, and Flash Memory System Builder User’s Guide for more

information).

• The alternative is to instantiate the RAM/FIFO blocks manually, using inverters for polarity control

and tying all unused data bits to ground.

Table 2-115 • Sixteen FIFO Blocks are Cascaded (Worst-Case MIlitary Conditions VC CA = 1.425 V, VCCI = 3.0

V, TJ = 125°C)

Parameter Description

–1 Speed Std. Speed

Units

RTAX4000S/SL RTAX250/1000/

2000S/SL All

Min. Max. Min. Max. Min. Max.

FIFO Module Timing

tWSU Write Setup 22.80 21.49 25.27 ns

tWHD Write Hold 0.00 0.00 0.00 ns

tWCKH WCLK High 0.75 0.75 0.75 ns

tWCKL WCLK Low 13.40 13.40 13.40 ns

tWCKP Minimum WCLK Period 14.15 14.15 14.15 ns

tRSU Read Setup 23.97 22.59 26.55 ns

tRHD Read Hold 0.00 0.00 0.00 ns

tRCKH RCLK High 0.73 0.73 0.73 ns

tRCKL RCLK Low 14.41 14.41 14.41 ns

tRCKP Minimum RCLK period 15.14 15.14 15.14 ns

tCLR2FF Clear-to-flag (EMPTY/FULL) 2.68 2.52 2.97 ns

tCLR2AF Clear-to-flag (AEMPTY/AFULL) 6.13 5.78 6.79 ns

tCK2FF Clock-to-flag (EMPTY/FULL) 2.97 2.80 3.29 ns

tCK2AF Clock-to-flag (AEMPTY/AFULL) 7.05 6.64 7.81 ns

tRCK2RD1 RCLK-To-OUT (Pipelined) 16.87 15.90 18.69 ns

tRCK2RD2 RCLK-To-OUT (Non-Pipelined) 17.93 16.90 19.86 ns

Note: Timing data for sixteen cascaded FIFO blocks uses a depth of 65,536. For all other combinations, please use

Microsemi's Timing software.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-133

Other Architectural Features

Charge Pump Bypass

To reduce power consumption, the internal charge pump can be bypassed and an external power supply

voltage can be used instead. This saves the internal charge-pump operating current, resulting in no DC

current draw. The RTAX-S/SL family devices have a dedicated "VPUMP" pin that can be used to access

an external charge pump device. In normal chip operation, when using the internal charge pump, VPUMP

should be tied to GND. When the voltage level on VPUMP is set to 3.3 V, the internal charge pump is

turned off, and the VPUMP voltage will be used as the charge pump voltage. Adequate voltage regulation

(i.e., high drive, low output impedance, and good decoupling) should be used at VPUMP

JTAG

RTAX-S/SL offers a JTAG interface that is compliant with the IEEE 1149.1 standard except for the device

ID length which is 33 bits. The user can employ the JTAG interface for probing a design and executing

any JTAG public instructions as defined in the Table 2-116. The JTAG pins and probes are configured as

a LVTTL standard port. Refer to the IEEE Standard 1149.1 (JTAG) in the Axcelerator Family application

note, which also applies to the RTAX-S/SL family of devices. The JTAG pins should not be left floating

on flight systems.

Interface

The interface consists of four inputs: Test Mode Select (TMS), Test Data In (TDI), Test Clock (TCK), TAP

Controller Reset (TRST), and an output, Test Data Out (TDO). TMS, TDI, and TRST have on-chip pull-up

resistors.

TRST

The TRST pin functions as an active-low input to asynchronously initialize or reset the boundary scan

circuit. The TRST pin is equipped with a programmable pull-up resistor with approximately 10 kΩ

resistance. This pin must be hardwired to ground for flight.

TDO

TDO is normally tristated, and it is active only when the TAP controller is in the "Shift_DR" state or

"Shift_IR" state. The least significant bit of the selected register (i.e., IR or DR) is clocked out to TDO first

by the falling edge of TCK.

TAP Controller

The TAP Controller is compliant with the IEEE Standard 1149.1. It is a state machine of 16 states that

controls the Instruction Register (IR) and the Data Registers (such as Boundary-Scan Register, IDCODE,

USRCODE, BYPASS, etc.). The TAP Controller steps into one of the states depending on the sequence

of TMS at the rising edges of TCK.

Table 2-116 • JTAG Instruction Code

Instruction (IR4:IR0) Binary Code

EXTEST 00000

PRELOAD / SAMPLE 00001

INTEST 00010

USERCODE 00011

IDCODE 00100

HIGHZ 01110

CLAMP 01111

DIAGNOSTIC 10000

Reserved All others

BYPASS 11111

Detailed Specifications

2-134 Revision 15

Instruction Register (IR)

The IR has five bits (IR4 to IR0). At the TRST state, IR is reset to IDCODE. Each time when IR is

selected, it goes through "select IR-Scan," "Capture-IR," "Shift-IR," all the way through "Update-IR."

When there is no test error, the first five data bits coming out of TDO during the "Shift-IR" will be "10111."

If a test error occurs, the last three bits will contain one to three zeroes corresponding to negatively

asserted signals: "TDO_ERRORB," "PROBA_ERRORB," and "PROBB_ERRORB." The error(s) will be

erased when the TAP is at the "Update-IR" or the TRST state. When in user mode start-up sequence, if

the micro-probe has not been used, the "PROBA_ERRORB" is used as a "Power-up done successfully"

flag.

During flight, the following configurations for all JTAG and Probe pins are recommended (Table 2-117 on

page 2-134).

Table 2-117 • JTAG and Probe Pin Recommendations for Flight

JTAG and Probe

Pins Configurations

TCK • Can be hardwired to VCCDA or ground

• Can be driven to VCCDA or ground

• Must not be left unterminated

TDO Must be left unconnected

TDI • Can be hardwired or driven to VCCDA

• Can be left unconnected (equipped with internal 10 k pull-up resistor)

TMS • Can be hardwired or driven to VCCDA

• Can be left unconnected (equipped with internal 10 k pull-up resistor)

TRST Must be hardwired to ground (equipped with optional internal 10 k pull-up

resistor)

PRA/B/C/D May be left unconnected, or may be connected via pull-up or pull-down resistor

to VCCI or GND. PRA/B/C/D are in tristate mode during normal operation. In

test mode, these pins put out the logic value of the internal node they are

connected to.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-135

Data Registers (DRs)

Data registers are distributed throughout the chip. They store testing/programming vectors. The MSB of

a data register is connected to TDI, while the LSB is connected to TDO. There are different types of data

registers. Descriptions of the main registers are as follow:

1. IDCODE:

The IDCODE is a hard coded JTAG Silicon Signature. It is a hardwired device ID code, which

contains the Microsemi identity, part number, and version number in a specific JTAG format. Refer

to the IEEE Standard 1149.1 (JTAG) in the Axcelerator Family application note for more

information. The IDCODE is 33 bits in length in the following devices: RTAX250S/SL,

RTAX1000S/SL, and RTAX2000S/SL. The IDCODE is 32 bits in length in the following devices:

RTAX2000D, RTAX4000S/SL, and RTAX4000D.

2. USERCODE:

The USERCODE is a programmable JTAG register. It is a supplementary identity code for the

user to program information to distinguish different programmed parts. USERCODE fuses will

read out as "zeroes" when not programmed, so only the "1" bits need to be programmed. Refer to

the IEEE S tandard 1149.1 (JTAG) in the Axcelerator Family application note for more information.

The USERCODE physical register length is 33 bits in RTAX250S/SL, RTAX1000S/SL, and

RTAX2000S/SL devices, but is 32 bits in RTAX2000D, RTAX4000S/SL, and RTAX4000D devices.

Only 20 bits are allocated to the user. The rest of the bits are reserved.

3. Boundary-Scan Register (BSR):

Each I/O contains three BSR Cells. Each cell has a shift register bit, a latch, and two MUXes. The

boundary-scan cells are used for the Output-enable (E), Output (O), and Input (I) registers. The

bit order of the boundary-scan cells for each of them is E-O-I. The boundary-scan cells are then

chained serially to form the BSR. The length of the BSR is the number of I/Os in the die (not the

package) multiplied by three. This excludes special function pins (TRST, TCK, TMS, TDI, TDO,

PRA, PRB, PRC, PRD, and VPUMP).

4. Bypass Register (BYR):

This is the "1-bit" register. It is used to shorten the TDI-TDO serial chain in board-level testing to

only one bit per device not being tested. It is also selected for all "reserved" or unused

instructions.

Probing

Internal activities of the JTAG interface can be observed via the Silicon Explorer II probes: "PRA," "PRB,"

"PRC," and "PRD."

Detailed Specifications

2-136 Revision 15

Special Fuses

Security

Microsemi antifuse FPGAs, with FuseLock technology, offer the highest level of design security available

in a programmable logic device. Since antifuse FPGAs are live at power-up, there is no bitstream that

can be intercepted, and no bitstream or programming data is ever downloaded to the device during

power-up, thus making device cloning impossible. In addition, special security fuses are hidden

throughout the fabric of the device and may be programmed by the user to thwart attempts to reverse

engineer the device by attempting to exploit either the programming or probing interfaces. Both invasive

and noninvasive attacks against an RTAX-S/SL device that access or bypass these security fuses will

destroy access to the rest of the device (refer to the Design Security in Nonvolatile Flash and Antifuse

FPGAs white paper).

Look for this symbol to ensure your valuable IP is protected by the highest level of security in the

industry.

To ensure maximum security in RTAX-S/SL devices, it is recommended that the user program the device

security fuse (SFUS). When programmed, the Silicon Explorer II testing probes are disabled to prevent

internal probing, and the programming interface is also disabled. All JTAG public instructions are still

accessible by the user.

For more information, refer to the Implementation of Security in Actel Antifuse FPGAs application note.

Global Set Fuse

The Global Set Fuse determines if all R-cells and I/O Registers (InReg, OutReg, and EnReg) are either

cleared (register outputs set to 0) or preset (register outputs set to 1) by driving the GCLR and GPSET

inputs of all R-cells and I/O Registers ("R-Cell" on page 2-88). Default setting is to clear all registers

(GCLR = 0 and GPSET =1) at device power-up. When the GBSETFUS option is checked during FUSE

file generation, all registers are preset (GCLR = 1 and GPSET= 0). A local CLR or PRESET will take

precedence overt this setting. Both pins are pulled HIGH during normal device operation. For use details,

see Libero IDE online help.

Silicon Explorer II Probe Interface

Silicon Explorer II is an integrated hardware and software solution that, in conjunction with the Designer

tools, allows users to examine any of the internal nets (except I/O registers) of the device while it is

operating in a prototype or a production system. The user can probe up to four nodes at a time without

changing the placement and routing of the design and without using any additional device resources.

Highlighted nets in Designer’s ChipPlanner can be accessed using Silicon Explorer II in order to observe

their real time values.

Silicon Explorer II's noninvasive method does not alter timing or loading effects, thus shortening the

debug cycle. In addition, Silicon Explorer II does not require relayout or additional MUXes to bring signals

out to an external pin, which is necessary when using programmable logic devices from other suppliers.

By eliminating multiple place-and-route program cycles the integrity of the design is maintained

throughout the debug process.

Each member of the RTAX-S/SL family has four external pads: PRA, PRB, PRC, and PRD. These can be

used to bring out four probe signals from the RTAX-S/SL device. Each core tile can has up to two probe

signals. To disallow probing, the SFUS security fuse in the silicon signature has to be programmed (see

"Special Fuses" on page 2-136 for more information).

Silicon Explorer II connects to the host PC using a standard serial port connector. Connections to the

circuit board are achieved using a nine-pin D-Sub connector (Figure 1-15 on page 1-12). Once the

design has been placed-and-routed, and the RTAX-S/SL device has been programmed, Silicon Explorer

II can be connected and the Explorer software can be launched.

Figure 2- 64 • FuseLock Logo

FuseLock

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 2-137

Silicon Explorer II comes with an additional optional PC hosted tool that emulates an 18-channel logic

analyzer. Four channels are used to monitor four internal nodes, and 14 channels are available to probe

external signals. The software included with the tool provides the user with an intuitive interface that

allows for easy viewing and editing of signal waveforms.

Programming

Device programming is supported through the Silicon Sculptor 3, a single-site, robust and compact

device programmer for the PC. Up to four Silicon Sculptor 3s can be daisy-chained and controlled from a

single PC host. With standalone software for the PC, Silicon Sculptor 3 is designed to allow concurrent

programming of multiple units from the same PC when daisy-chained.

Silicon Sculptor 3 programs devices independently to achieve the fastest programming times possible.

Each fuse is verified by Silicon Sculptor 3 to ensure correct programming. Furthermore, at the end of

programming, there are integrity tests that are run to ensure that programming was completed properly.

Not only does it test programmed and nonprogrammed fuses, Silicon Sculptor 3 also provides a self-test

to test its own hardware extensively.

Programming an RTAX-S/SL device using Silicon Sculptor 3 is similar to programming any other antifuse

device. The procedure is as follows:

1. Load the AFM file.

2. Select the device to be programmed.

3. Begin programming.

When the design is ready to go to production, Microsemi offers device volume-programming services

either through distribution partners or via our In-House Programming Center.

For more details on programming the RTAX-S/SL devices, please refer to the Silicon Sculptor User’s

Guide.

Table 2-118 • FIFO Signal Description

Signal Direction Description

WCLK Input Write clock (active either edge).

FWEN Input FIFO write enable. When this signal is asserted, the WD bus data is latched

into the FIFO, and the internal write counters are incremented.

WD[N-1:0] Input Write data bus. The value N is dependent on the RAM configuration and can

be 1, 2, 4, 9, 18, or 36.

FULL Output Active high signal indicating that the FIFO is FULL. When this signal is set,

additional write requests are ignored.

AFULL Output Active high signal indicating that the FIFO is AFULL.

AFVAL Input 8-bit input defining the AFULL value of the FIFO.

RCLK Input Read clock (active either edge).

FREN Input FIFO read enable.

RD[N-1:0] Output Read data bus. The value N is dependent on the RAM configuration and can

be 1, 2, 4, 9, 18, or 36.

EMPTY Output Empty flag indicating that the FIFO is EMPTY. When this signal is asserted,

attempts to read the FIFO will be ignored.

AEMPTY Output Active high signal indicating that the FIFO is AEMPTY.

AEVAL Input 8-bit input defining the almost-empty value of the FIFO.

PIPE Input Sets the pipe option on or off.

CLR Input Active high clear input.

DEPTH Input Determines the depth of the FIFO and the number of FIFOs to be cascaded.

WIDTH Input Determines the width of the dataword / width of the FIFO, and the number of

the FIFOs to be cascaded.

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-1

3 – Package Pin Assignment s

CQ208

Note

For Package Manufacturing and Environmental information, visit the Resource center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

Ceramic

Tie Bar

208-Pin CQFP

101

102

103

104

156

155

154

153

108

107

106

105

208

207

206

205

160

159

158

157

Pin 1

Package Pin Assignments

3-2 Revision 15

CQ208

RTAX250S/SL Function Pin

Number

Bank 0

IO02NB0F0 197

IO03NB0F0 198

IO03PB0F0 199

IO12NB0F0/HCLKAN 191

IO12PB0F0/HCLKAP 192

IO13NB0F0/HCLKBN 185

IO13PB0F0/HCLKBP 186

Bank 1

IO14NB1F1/HCLKCN 180

IO14PB1F1/HCLKCP 181

IO15NB1F1/HCLKDN 174

IO15PB1F1/HCLKDP 175

IO16NB1F1 170

IO16PB1F1 171

IO24NB1F1 165

IO24PB1F1 166

IO26NB1F1 161

IO26PB1F1 162

IO27NB1F1 159

IO27PB1F1 160

Bank 2

IO29NB2F2 151

IO29PB2F2 153

IO30NB2F2 152

IO30PB2F2 154

IO31PB2F2 148

IO32NB2F2 146

IO32PB2F2 147

IO34NB2F2 144

IO34PB2F2 145

IO39NB2F2 139

IO39PB2F2 140

IO40PB2F2 141

IO41NB2F2 137

IO41PB2F2 138

IO43NB2F2 132

IO43PB2F2 134

IO44NB2F2 131

IO44PB2F2 133

Bank 3

IO45NB3F3 127

IO45PB3F3 129

IO46NB3F3 126

IO46PB3F3 128

IO48NB3F3 122

IO48PB3F3 123

IO50NB3F3 120

IO50PB3F3 121

IO55NB3F3 116

IO55PB3F3 117

IO57NB3F3 114

IO57PB3F3 115

IO59NB3F3 110

IO59PB3F3 111

IO60NB3F3 108

IO60PB3F3 109

IO61NB3F3 106

IO61PB3F3 107

Bank 4

IO62NB4F4 100

IO62PB4F4 103

IO63NB4F4 101

IO63PB4F4 102

IO64NB4F4 96

IO64PB4F4 97

IO72NB4F4 91

IO72PB4F4 92

IO74NB4F4/CLKEN 87

IO74PB4F4/CLKEP 88

IO75NB4F4/CLKFN 81

IO75PB4F4/CLKFP 82

Bank 5

IO76NB5F5/CLKGN 76

CQ208

RTAX250S/SL Function Pin

Number

IO76PB5F5/CLKGP 77

IO77NB5F5/CLKHN 70

IO77PB5F5/CLKHP 71

IO78NB5F5 66

IO78PB5F5 67

IO86NB5F5 62

IO87NB5F5 60

IO87PB5F5 61

IO88NB5F5 56

IO88PB5F5 57

IO89NB5F5 54

IO89PB5F5 55

Bank 6

IO91NB6F6 47

IO91PB6F6 49

IO92NB6F6 48

IO92PB6F6 50

IO93NB6F6 42

IO93PB6F6 43

IO94PB6F6 44

IO96NB6F6 40

IO96PB6F6 41

IO101NB6F6 35

IO101PB6F6 36

IO102PB6F6 37

IO103NB6F6 33

IO103PB6F6 34

IO105NB6F6 28

IO105PB6F6 30

IO106NB6F6 27

IO106PB6F6 29

Bank 7

IO107NB7F7 23

IO107PB7F7 25

IO108NB7F7 22

IO108PB7F7 24

IO110NB7F7 18

CQ208

RTAX250S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-3

IO110PB7F7 19

IO112NB7F7 16

IO112PB7F7 17

IO117NB7F7 12

IO117PB7F7 13

IO119NB7F7 10

IO119PB7F7 11

IO121PB7F7 7

IO122NB7F7 5

IO122PB7F7 6

IO123NB7F7 3

IO123PB7F7 4

Dedicated I/O

GND 9

GND 15

GND 21

GND 32

GND 39

GND 46

GND 51

GND 59

GND 65

GND 69

GND 90

GND 94

GND 99

GND 104

GND 113

GND 119

GND 125

GND 136

GND 143

GND 150

GND 155

GND 164

GND 169

GND 173

CQ208

RTAX250S/SL Function Pin

Number

GND 194

GND 196

GND 201

GND 208

NC 72

NC 73

NC 74

NC 75

NC 83

NC 84

NC 85

NC 86

NC 176

NC 177

NC 178

NC 179

NC 187

NC 188

NC 189

NC 190

PRA 184

PRB 183

PRC 80

PRD 79

TCK 205

TDI 204

TDO 203

TMS 206

TRST 207

VCCA 2

VCCA 14

VCCA 38

VCCA 52

VCCA 64

VCCA 93

VCCA 118

VCCA 142

CQ208

RTAX250S/SL Function Pin

Number

VCCA 156

VCCA 168

VCCA 195

VCCDA 1

VCCDA 26

VCCDA 53

VCCDA 63

VCCDA 78

VCCDA 95

VCCDA 105

VCCDA 130

VCCDA 157

VCCDA 167

VCCDA 182

VCCDA 202

VCCIB0 193

VCCIB0 200

VCCIB1 163

VCCIB1 172

VCCIB2 135

VCCIB2 149

VCCIB3 112

VCCIB3 124

VCCIB4 89

VCCIB4 98

VCCIB5 58

VCCIB5 68

VCCIB6 31

VCCIB6 45

VCCIB7 8

VCCIB7 20

VPUMP 158

CQ208

RTAX250S/SL Function Pin

Number

Package Pin Assignments

3-4 Revision 15

CQ256

Note

For Package Manufacturing and Environmental information, visit the Resource center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

Ceramic

Tie Bar

256-Pin CQFP

125

126

127

128

192

191

190

189

132

131

130

129

256

255

254

253

196

195

194

193

Pin 1

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-5

CQ256

RTAX2000S/SL Function Pin

Number

Bank 0

IO01NB0F0 248

IO01PB0F0 249

IO04NB0F0 246

IO04PB0F0 247

IO05NB0F0 242

IO05PB0F0 243

IO08NB0F0 240

IO08PB0F0 241

Bank 0

IO37NB0F3 234

IO37PB0F3 235

IO41NB0F3/HCLKAN 232

IO41PB0F3/HCLKAP 233

IO42NB0F3/HCLKBN 228

IO42PB0F3/HCLKBP 229

Bank 1 -

IO43NB1F4/HCLKCN 220

IO43PB1F4/HCLKCP 221

IO44NB1F4/HCLKDN 216

IO44PB1F4/HCLKDP 217

Bank 1

IO65NB1F6 210

IO65PB1F6 211

IO69NB1F6 208

IO69PB1F6 209

IO70NB1F6 199

IO71NB1F6 204

IO71PB1F6 205

IO73NB1F6 202

IO73PB1F6 203

IO74NB1F6 197

IO74PB1F6 198

Bank 2

IO87NB2F8 187

IO87PB2F8 188

IO89PB2F8 186

Bank 2

IO107NB2F10 184

IO107PB2F10 185

IO110NB2F10 180

IO110PB2F10 181

IO111NB2F10 178

IO111PB2F10 179

IO112NB2F10 174

IO112PB2F10 175

IO113NB2F10 172

IO113PB2F10 173

IO114NB2F10 168

IO114PB2F10 169

IO115NB2F10 166

IO115PB2F10 167

IO117NB2F10 162

IO117PB2F10 163

Bank 3

IO139NB3F13 158

IO139PB3F13 159

IO141NB3F13 154

IO141PB3F13 155

IO142NB3F13 152

IO142PB3F13 153

IO145NB3F13 148

IO145PB3F13 149

IO146NB3F13 146

IO146PB3F13 147

IO147NB3F13 140

IO147PB3F13 141

IO148NB3F13 142

IO148PB3F13 143

IO149NB3F13 136

IO149PB3F13 137

Bank 3

IO165NB3F15 135

IO167NB3F15 133

CQ256

RTAX2000S/SL Function Pin

Number

IO167PB3F15 134

Bank 4

IO181NB4F17 124

IO181PB4F17 125

IO182NB4F17 122

IO182PB4F17 123

IO183NB4F17 118

IO183PB4F17 119

IO184NB4F17 116

IO184PB4F17 117

IO190NB4F17 112

IO190PB4F17 113

IO192NB4F17 110

IO192PB4F17 111

Bank 4

IO212NB4F19/CLKEN 104

IO212PB4F19/CLKEP 105

IO213NB4F19/CLKFN 100

IO213PB4F19/CLKFP 101

Bank 5

IO214NB5F20/CLKGN 92

IO214PB5F20/CLKGP 93

IO215NB5F20/CLKHN 88

IO215PB5F20/CLKHP 89

Bank 5

IO236NB5F22 82

IO236PB5F22 83

IO238NB5F22 80

IO238PB5F22 81

IO240NB5F22 76

IO240PB5F22 77

IO242NB5F22 74

IO242PB5F22 75

IO243NB5F22 70

IO243PB5F22 71

IO244NB5F22 68

IO244PB5F22 69

CQ256

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-6 Revision 15

Bank 6

IO257PB6F24 60

IO258NB6F24 58

IO258PB6F24 59

Bank 6

IO279NB6F26 56

IO279PB6F26 57

IO280NB6F26 52

IO280PB6F26 53

IO281NB6F26 50

IO281PB6F26 51

IO282NB6F26 46

IO282PB6F26 47

IO284NB6F26 44

IO284PB6F26 45

IO285NB6F26 40

IO285PB6F26 41

IO286NB6F26 38

IO286PB6F26 39

IO287NB6F26 34

IO287PB6F26 35

Bank 7 9

IO310NB7F29 30

IO310PB7F29 31

IO311NB7F29 26

IO311PB7F29 27

IO312NB7F29 24

IO312PB7F29 25

IO315NB7F29 20

IO315PB7F29 21

IO316NB7F29 18

IO316PB7F29 19

IO317NB7F29 14

IO317PB7F29 15

IO318NB7F29 12

IO318PB7F29 13

IO320NB7F29 8

CQ256

RTAX2000S/SL Function Pin

Number

IO320PB7F29 9

Bank 7

IO341NB7F31 6

IO341PB7F31 7

Dedicated I/O

GND 1

GND 5

GND 11

GND 17

GND 23

GND 29

GND 33

GND 37

GND 43

GND 49

GND 55

GND 62

GND 64

GND 65

GND 73

GND 79

GND 85

GND 91

GND 97

GND 103

GND 109

GND 115

GND 121

GND 128

GND 129

GND 132

GND 139

GND 145

GND 151

GND 157

GND 161

GND 165

CQ256

RTAX2000S/SL Function Pin

Number

GND 171

GND 177

GND 183

GND 190

GND 192

GND 193

GND 201

GND 207

GND 213

GND 219

GND 225

GND 231

GND 239

GND 245

GND 256

PRA 227

PRB 226

PRC 99

PRD 98

TCK 253

TDI 252

TDO 250

TMS 254

TRST 255

VCCA 3

VCCA 4

VCCA 22

VCCA 42

VCCA 61

VCCA 63

VCCA 84

VCCA 108

VCCA 127

VCCA 131

VCCA 150

VCCA 170

VCCA 189

CQ256

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-7

VCCA 191

VCCA 212

VCCA 238

VCCDA 2

VCCDA 32

VCCDA 66

VCCDA 67

VCCDA 86

VCCDA 87

VCCDA 94

VCCDA 95

VCCDA 96

VCCDA 106

VCCDA 107

VCCDA 126

VCCDA 130

VCCDA 160

VCCDA 194

VCCDA 196

VCCDA 214

VCCDA 215

VCCDA 222

VCCDA 223

VCCDA 224

VCCDA 236

VCCDA 237

VCCDA 251

VCCIB0 230

VCCIB0 244

VCCIB1 200

VCCIB1 206

VCCIB1 218

VCCIB2 164

VCCIB2 176

VCCIB2 182

VCCIB3 138

VCCIB3 144

CQ256

RTAX2000S/SL Function Pin

Number

VCCIB3 156

VCCIB4 102

VCCIB4 114

VCCIB4 120

VCCIB5 72

VCCIB5 78

VCCIB5 90

VCCIB6 36

VCCIB6 48

VCCIB6 54

VCCIB7 10

VCCIB7 16

VCCIB7 28

VPUMP 195

CQ256

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-8 Revision 15

CQ352

Ceramic

Tie Bar

352-Pin CQFP

127

128

129

130

131

132

133

134

135

173

174

175

176

264

263

262

261

180

179

178

177

223

222

221

220

219

218

217

216

215

352

351

350

349

339

338

337

336

335

334

333

332

331

268

267

266

265

Pin 1

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-9

Note:

The 352-pin CQFP pin assignments for RTAX250S/SL, RTAX1000S/SL and RTAX2000S/SL are compatible except

for the following pins.

Where exceptions occur, the smaller density devices have those pins designated as No Connects (NC). Customers

are therefore recommended to layout their board targeting the larger density device, in order to preserve

interchangeability between the two devices. Note: RTAX4000S is not pin compatible with any of the smaller density

devices.

For Package Manufacturing and Environmental information, visit the Resource center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

RTAX250S/SL RTAX1000S/SL RTAX2000S/SL RTAX4000S/SL

RTAX250S/SL N/A 117, 148, 294, 327,

328

91, 117, 130, 131, 148,

174, 268, 294, 307, 308,

327, 328

Not pin compatible

RTAX1000S/SL 117, 148, 294, 327,

328

N/A 91,130, 131, 174, 268,

307, 308

Not pin compatible

RTAX2000S/SL 91, 117, 130, 131, 148,

174, 268, 294, 307,

308, 327, 328

91,130, 131, 174, 268,

307, 308

NA Not pin compatible

Package Pin Assignments

3-10 Revision 15

CQ352

RTAX250S/SL Function Pin

Number

Bank 0

IO00NB0F0 341

IO00PB0F0 342

IO01NB0F0 343

IO02NB0F0 337

IO02PB0F0 338

IO04NB0F0 335

IO04PB0F0 336

IO06NB0F0 331

IO06PB0F0 332

IO08NB0F0 325

IO08PB0F0 326

IO10NB0F0 323

IO10PB0F0 324

IO12NB0F0/HCLKAN 319

IO12PB0F0/HCLKAP 320

IO13NB0F0/HCLKBN 313

IO13PB0F0/HCLKBP 314

Bank 1

IO14NB1F1/HCLKCN 305

IO14PB1F1/HCLKCP 306

IO15NB1F1/HCLKDN 299

IO15PB1F1/HCLKDP 300

IO16NB1F1 289

IO16PB1F1 290

IO17NB1F1 295

IO17PB1F1 296

IO18NB1F1 287

IO18PB1F1 288

IO20NB1F1 283

IO20PB1F1 284

IO22NB1F1 277

IO22PB1F1 278

IO23NB1F1 281

IO23PB1F1 282

IO24NB1F1 275

IO24PB1F1 276

IO25NB1F1 271

IO25PB1F1 272

IO27NB1F1 269

IO27PB1F1 270

Bank 2

IO29NB2F2 261

IO29PB2F2 262

IO30NB2F2 259

IO30PB2F2 260

IO31NB2F2 255

IO31PB2F2 256

IO33NB2F2 249

IO33PB2F2 250

IO34NB2F2 253

IO34PB2F2 254

IO35NB2F2 247

IO35PB2F2 248

IO36NB2F2 243

IO36PB2F2 244

IO37NB2F2 241

IO37PB2F2 242

IO38NB2F2 237

IO38PB2F2 238

IO39NB2F2 235

IO39PB2F2 236

IO41NB2F2 231

IO41PB2F2 232

IO42NB2F2 229

IO42PB2F2 230

IO43NB2F2 225

IO43PB2F2 226

IO44NB2F2 223

IO44PB2F2 224

CQ352

RTAX250S/SL Function Pin

Number

Bank 3

IO45NB3F3 217

IO45PB3F3 218

IO46NB3F3 219

IO46PB3F3 220

IO47NB3F3 213

IO47PB3F3 214

IO48NB3F3 211

IO48PB3F3 212

IO49NB3F3 207

IO49PB3F3 208

IO51NB3F3 205

IO51PB3F3 206

IO52NB3F3 201

IO52PB3F3 202

IO53NB3F3 199

IO53PB3F3 200

IO54NB3F3 195

IO54PB3F3 196

IO55NB3F3 193

IO55PB3F3 194

IO56NB3F3 187

IO56PB3F3 188

IO57NB3F3 189

IO57PB3F3 190

IO59NB3F3 183

IO59PB3F3 184

IO60NB3F3 181

IO60PB3F3 182

IO61NB3F3 179

IO61PB3F3 180

Bank 4

IO62NB4F4 172

IO62PB4F4 173

IO64NB4F4 166

CQ352

RTAX250S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-11

IO64PB4F4 167

IO65NB4F4 170

IO65PB4F4 171

IO66NB4F4 164

IO66PB4F4 165

IO67NB4F4 160

IO67PB4F4 161

IO68NB4F4 158

IO68PB4F4 159

IO70NB4F4 154

IO70PB4F4 155

IO72NB4F4 152

IO72PB4F4 153

IO73NB4F4 146

IO73PB4F4 147

IO74NB4F4/CLKEN 142

IO74PB4F4/CLKEP 143

IO75NB4F4/CLKFN 136

IO75PB4F4/CLKFP 137

Bank 5

IO76NB5F5/CLKGN 128

IO76PB5F5/CLKGP 129

IO77NB5F5/CLKHN 122

IO77PB5F5/CLKHP 123

IO78NB5F5 112

IO78PB5F5 113

IO79NB5F5 118

IO79PB5F5 119

IO80NB5F5 110

IO80PB5F5 111

IO82NB5F5 106

IO82PB5F5 107

IO84NB5F5 100

IO84PB5F5 101

IO85NB5F5 104

CQ352

RTAX250S/SL Function Pin

Number

IO85PB5F5 105

IO86NB5F5 98

IO86PB5F5 99

IO87NB5F5 94

IO87PB5F5 95

IO89NB5F5 92

IO89PB5F5 93

Bank 6

IO90PB6F6 86

IO91NB6F6 84

IO91PB6F6 85

IO92NB6F6 78

IO92PB6F6 79

IO93NB6F6 82

IO93PB6F6 83

IO95NB6F6 76

IO95PB6F6 77

IO96NB6F6 72

IO96PB6F6 73

IO97NB6F6 70

IO97PB6F6 71

IO98NB6F6 66

IO98PB6F6 67

IO99NB6F6 64

IO99PB6F6 65

IO100NB6F6 60

IO100PB6F6 61

IO101NB6F6 58

IO101PB6F6 59

IO103NB6F6 54

IO103PB6F6 55

IO104NB6F6 52

IO104PB6F6 53

IO105NB6F6 48

IO105PB6F6 49

CQ352

RTAX250S/SL Function Pin

Number

IO106NB6F6 46

IO106PB6F6 47

Bank 7

IO107NB7F7 40

IO107PB7F7 41

IO108NB7F7 42

IO108PB7F7 43

IO109NB7F7 36

IO109PB7F7 37

IO110NB7F7 34

IO110PB7F7 35

IO111NB7F7 30

IO111PB7F7 31

IO113NB7F7 28

IO113PB7F7 29

IO114NB7F7 24

IO114PB7F7 25

IO115NB7F7 22

IO115PB7F7 23

IO116NB7F7 18

IO116PB7F7 19

IO117NB7F7 16

IO117PB7F7 17

IO118NB7F7 12

IO118PB7F7 13

IO119NB7F7 10

IO119PB7F7 11

IO121NB7F7 6

IO121PB7F7 7

IO123NB7F7 4

IO123PB7F7 5

Dedicated I/O

GND 1

GND 9

GND 15

CQ352

RTAX250S/SL Function Pin

Number

Package Pin Assignments

3-12 Revision 15

GND 21

GND 27

GND 33

GND 39

GND 45

GND 51

GND 57

GND 63

GND 69

GND 75

GND 81

GND 88

GND 89

GND 97

GND 103

GND 109

GND 115

GND 121

GND 133

GND 145

GND 151

GND 157

GND 163

GND 169

GND 176

GND 177

GND 186

GND 192

GND 198

GND 204

GND 210

GND 216

GND 222

GND 228

GND 234

CQ352

RTAX250S/SL Function Pin

Number

GND 240

GND 246

GND 252

GND 258

GND 264

GND 265

GND 274

GND 280

GND 286

GND 292

GND 298

GND 310

GND 322

GND 330

GND 334

GND 340

GND 345

GND 352

NC 91

NC 117

NC 124

NC 125

NC 126

NC 127

NC 130

NC 131

NC 138

NC 139

NC 140

NC 141

NC 148

NC 174

NC 268

NC 294

NC 301

CQ352

RTAX250S/SL Function Pin

Number

NC 302

NC 303

NC 304

NC 307

NC 308

NC 315

NC 316

NC 317

NC 318

NC 327

NC 328

PRA 312

PRB 311

PRC 135

PRD 134

TCK 349

TDI 348

TDO 347

TMS 350

TRST 351

VCCA 3

VCCA 14

VCCA 32

VCCA 56

VCCA 74

VCCA 87

VCCA 102

VCCA 114

VCCA 150

VCCA 162

VCCA 175

VCCA 191

VCCA 209

VCCA 233

VCCA 251

CQ352

RTAX250S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-13

VCCA 263

VCCA 279

VCCA 291

VCCA 329

VCCA 339

VCCDA 2

VCCDA 44

VCCDA 90

VCCDA 116

VCCDA 132

VCCDA 149

VCCDA 178

VCCDA 221

VCCDA 266

VCCDA 293

VCCDA 309

VCCDA 346

VCCIB0 321

VCCIB0 333

VCCIB0 344

VCCIB1 273

VCCIB1 285

VCCIB1 297

VCCIB2 227

VCCIB2 239

VCCIB2 245

VCCIB2 257

VCCIB3 185

VCCIB3 197

VCCIB3 203

VCCIB3 215

VCCIB4 144

VCCIB4 156

VCCIB4 168

VCCIB5 96

CQ352

RTAX250S/SL Function Pin

Number

VCCIB5 108

VCCIB5 120

VCCIB6 50

VCCIB6 62

VCCIB6 68

VCCIB6 80

VCCIB7 8

VCCIB7 20

VCCIB7 26

VCCIB7 38

VPUMP 267

CQ352

RTAX250S/SL Function Pin

Number

Package Pin Assignments

3-14 Revision 15

CQ352

RTAX1000S/SL Function Pin

Number

Bank 0

IO02NB0F0 341

IO02PB0F0 342

IO03PB0F0 343

IO04NB0F0 337

IO04PB0F0 338

IO08NB0F0 331

IO08PB0F0 332

IO09NB0F0 335

IO09PB0F0 336

IO24NB0F2 325

IO24PB0F2 326

IO25NB0F2 323

IO25PB0F2 324

IO30NB0F2/HCLKAN 319

IO30PB0F2/HCLKAP 320

IO31NB0F2/HCLKBN 313

IO31PB0F2/HCLKBP 314

Bank 1

IO32NB1F3/HCLKCN 305

IO32PB1F3/HCLKCP 306

IO33NB1F3/HCLKDN 299

IO33PB1F3/HCLKDP 300

IO38NB1F3 295

IO38PB1F3 296

IO54NB1F5 287

IO54PB1F5 288

IO55NB1F5 289

IO55PB1F5 290

IO56NB1F5 281

IO56PB1F5 282

IO57NB1F5 283

IO57PB1F5 284

IO59NB1F5 277

IO59PB1F5 278

IO60NB1F5 275

IO60PB1F5 276

IO61NB1F5 271

IO61PB1F5 272

IO63NB1F5 269

IO63PB1F5 270

Bank 2

IO64NB2F6 259

IO64PB2F6 260

IO67NB2F6 261

IO67PB2F6 262

IO68NB2F6 255

IO68PB2F6 256

IO69NB2F6 253

IO69PB2F6 254

IO74NB2F7 249

IO74PB2F7 250

IO75NB2F7 247

IO75PB2F7 248

IO76NB2F7 243

IO76PB2F7 244

IO77NB2F7 241

IO77PB2F7 242

IO78NB2F7 237

IO78PB2F7 238

IO79NB2F7 235

IO79PB2F7 236

IO82NB2F7 231

IO82PB2F7 232

IO83NB2F7 229

IO83PB2F7 230

IO94NB2F8 225

IO94PB2F8 226

IO95NB2F8 223

IO95PB2F8 224

CQ352

RTAX1000S/SL Function Pin

Number

Bank 3

IO96NB3F9 217

IO96PB3F9 218

IO97NB3F9 219

IO97PB3F9 220

IO99NB3F9 213

IO99PB3F9 214

IO108NB3F10 211

IO108PB3F10 212

IO109NB3F10 207

IO109PB3F10 208

IO111NB3F10 205

IO111PB3F10 206

IO112NB3F10 199

IO112PB3F10 200

IO113NB3F10 201

IO113PB3F10 202

IO115NB3F10 195

IO115PB3F10 196

IO116NB3F10 193

IO116PB3F10 194

IO117NB3F10 189

IO117PB3F10 190

IO124NB3F11 183

IO124PB3F11 184

IO125NB3F11 187

IO125PB3F11 188

IO127NB3F11 181

IO127PB3F11 182

IO128NB3F11 179

IO128PB3F11 180

Bank 4

IO130NB4F12 172

IO130PB4F12 173

IO131NB4F12 170

CQ352

RTAX1000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-15

IO131PB4F12 171

IO132NB4F12 166

IO132PB4F12 167

IO133NB4F12 164

IO133PB4F12 165

IO134NB4F12 160

IO134PB4F12 161

IO136NB4F12 158

IO136PB4F12 159

IO137NB4F12 154

IO137PB4F12 155

IO138NB4F12 152

IO138PB4F12 153

IO153NB4F14 146

IO153PB4F14 147

IO159NB4F14/CLKEN 142

IO159PB4F14/CLKEP 143

IO160NB4F14/CLKFN 136

IO160PB4F14/CLKFP 137

Bank 5

IO161NB5F15/CLKGN 128

IO161PB5F15/CLKGP 129

IO162NB5F15/CLKHN 122

IO162PB5F15/CLKHP 123

IO167NB5F15 118

IO167PB5F15 119

IO183NB5F17 110

IO183PB5F17 111

IO184NB5F17 112

IO184PB5F17 113

IO185NB5F17 104

IO185PB5F17 105

IO186NB5F17 106

IO186PB5F17 107

IO187NB5F17 98

CQ352

RTAX1000S/SL Function Pin

Number

IO187PB5F17 99

IO188NB5F17 100

IO188PB5F17 101

IO190NB5F17 94

IO190PB5F17 95

IO192NB5F17 92

IO192PB5F17 93

Bank 6

IO193PB6F18 86

IO194NB6F18 84

IO194PB6F18 85

IO196NB6F18 78

IO196PB6F18 79

IO197NB6F18 82

IO197PB6F18 83

IO198NB6F18 76

IO198PB6F18 77

IO203NB6F19 72

IO203PB6F19 73

IO204NB6F19 70

IO204PB6F19 71

IO205NB6F19 66

IO205PB6F19 67

IO206NB6F19 64

IO206PB6F19 65

IO207NB6F19 60

IO207PB6F19 61

IO208NB6F19 58

IO208PB6F19 59

IO211NB6F19 54

IO211PB6F19 55

IO212NB6F19 52

IO212PB6F19 53

IO223NB6F20 48

IO223PB6F20 49

CQ352

RTAX1000S/SL Function Pin

Number

IO224NB6F20 46

IO224PB6F20 47

Bank 7

IO225NB7F21 40

IO225PB7F21 41

IO226NB7F21 42

IO226PB7F21 43

IO237NB7F22 34

IO237PB7F22 35

IO238NB7F22 36

IO238PB7F22 37

IO240NB7F22 30

IO240PB7F22 31

IO241NB7F22 28

IO241PB7F22 29

IO242NB7F22 24

IO242PB7F22 25

IO244NB7F22 22

IO244PB7F22 23

IO245NB7F22 18

IO245PB7F22 19

IO246NB7F22 16

IO246PB7F22 17

IO249NB7F23 12

IO249PB7F23 13

IO250NB7F23 10

IO250PB7F23 11

IO256NB7F23 4

IO256PB7F23 5

IO257NB7F23 6

IO257PB7F23 7

Dedicated I/O

GND 1

GND 9

GND 15

CQ352

RTAX1000S/SL Function Pin

Number

Package Pin Assignments

3-16 Revision 15

GND 21

GND 27

GND 33

GND 39

GND 45

GND 51

GND 57

GND 63

GND 69

GND 75

GND 81

GND 88

GND 89

GND 97

GND 103

GND 109

GND 115

GND 121

GND 133

GND 145

GND 151

GND 157

GND 163

GND 169

GND 176

GND 177

GND 186

GND 192

GND 198

GND 204

GND 210

GND 216

GND 222

GND 228

GND 234

CQ352

RTAX1000S/SL Function Pin

Number

GND 240

GND 246

GND 252

GND 258

GND 264

GND 265

GND 274

GND 280

GND 286

GND 292

GND 298

GND 310

GND 322

GND 330

GND 334

GND 340

GND 345

GND 352

NC 91

NC 124

NC 125

NC 126

NC 127

NC 130

NC 131

NC 138

NC 139

NC 140

NC 141

NC 174

NC 268

NC 301

NC 302

NC 303

NC 304

CQ352

RTAX1000S/SL Function Pin

Number

NC 307

NC 308

NC 315

NC 316

NC 317

NC 318

PRA 312

PRB 311

PRC 135

PRD 134

TCK 349

TDI 348

TDO 347

TMS 350

TRST 351

VCCA 3

VCCA 14

VCCA 32

VCCA 56

VCCA 74

VCCA 87

VCCA 102

VCCA 114

VCCA 150

VCCA 162

VCCA 175

VCCA 191

VCCA 209

VCCA 233

VCCA 251

VCCA 263

VCCA 279

VCCA 291

VCCA 329

VCCA 339

CQ352

RTAX1000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-17

VCCDA 2

VCCDA 44

VCCDA 90

VCCDA 116

VCCDA 117

VCCDA 132

VCCDA 148

VCCDA 149

VCCDA 178

VCCDA 221

VCCDA 266

VCCDA 293

VCCDA 294

VCCDA 309

VCCDA 327

VCCDA 328

VCCDA 346

VCCIB0 321

VCCIB0 333

VCCIB0 344

VCCIB1 273

VCCIB1 285

VCCIB1 297

VCCIB2 227

VCCIB2 239

VCCIB2 245

VCCIB2 257

VCCIB3 185

VCCIB3 197

VCCIB3 203

VCCIB3 215

VCCIB4 144

VCCIB4 156

VCCIB4 168

VCCIB5 96

CQ352

RTAX1000S/SL Function Pin

Number

VCCIB5 108

VCCIB5 120

VCCIB6 50

VCCIB6 62

VCCIB6 68

VCCIB6 80

VCCIB7 8

VCCIB7 20

VCCIB7 26

VCCIB7 38

VPUMP 267

CQ352

RTAX1000S/SL Function Pin

Number

Package Pin Assignments

3-18 Revision 15

CQ352

RTAX2000S/SL Function Pin

Number

Bank 0

IO01NB0F0 341

IO01PB0F0 342

IO02PB0F0 343

IO04NB0F0 337

IO04PB0F0 338

IO05NB0F0 335

IO05PB0F0 336

IO08NB0F0 331

IO08PB0F0 332

IO37NB0F3 325

IO37PB0F3 326

IO38NB0F3 323

IO38PB0F3 324

IO41NB0F3/HCLKAN 319

IO41PB0F3/HCLKAP 320

IO42NB0F3/HCLKBN 313

IO42PB0F3/HCLKBP 314

Bank 1

IO43NB1F4/HCLKCN 305

IO43PB1F4/HCLKCP 306

IO44NB1F4/HCLKDN 299

IO44PB1F4/HCLKDP 300

IO48NB1F4 295

IO48PB1F4 296

IO65NB1F6 283

IO65PB1F6 284

IO66NB1F6 289

IO66PB1F6 290

IO68NB1F6 287

IO68PB1F6 288

IO69NB1F6 275

IO69PB1F6 276

IO70NB1F6 281

IO70PB1F6 282

IO71NB1F6 277

IO71PB1F6 278

IO73NB1F6 269

IO73PB1F6 270

IO74NB1F6 271

IO74PB1F6 272

Bank 2

IO87NB2F8 261

IO87PB2F8 262

IO88NB2F8 255

IO88PB2F8 256

IO89NB2F8 259

IO89PB2F8 260

IO91NB2F8 253

IO91PB2F8 254

IO99NB2F9 249

IO99PB2F9 250

IO100NB2F9 247

IO100PB2F9 248

IO107NB2F10 243

IO107PB2F10 244

IO110NB2F10 241

IO110PB2F10 242

IO111NB2F10 237

IO111PB2F10 238

IO112NB2F10 235

IO112PB2F10 236

IO113NB2F10 231

IO113PB2F10 232

IO114NB2F10 229

IO114PB2F10 230

IO115NB2F10 225

IO115PB2F10 226

IO117NB2F10 223

IO117PB2F10 224

CQ352

RTAX2000S/SL Function Pin

Number

Bank 3

IO129NB3F12 219

IO129PB3F12 220

IO132NB3F12 217

IO132PB3F12 218

IO137NB3F12 213

IO137PB3F12 214

IO139NB3F13 211

IO139PB3F13 212

IO141NB3F13 205

IO141PB3F13 206

IO142NB3F13 207

IO142PB3F13 208

IO145NB3F13 199

IO145PB3F13 200

IO146NB3F13 201

IO146PB3F13 202

IO147NB3F13 193

IO147PB3F13 194

IO148NB3F13 195

IO148PB3F13 196

IO149NB3F13 189

IO149PB3F13 190

IO161NB3F15 183

IO161PB3F15 184

IO163NB3F15 187

IO163PB3F15 188

IO165NB3F15 181

IO165PB3F15 182

IO167NB3F15 179

IO167PB3F15 180

Bank 4

IO181NB4F17 172

IO181PB4F17 173

IO182NB4F17 170

CQ352

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-19

IO182PB4F17 171

IO183NB4F17 166

IO183PB4F17 167

IO184NB4F17 164

IO184PB4F17 165

IO185NB4F17 160

IO185PB4F17 161

IO190NB4F17 158

IO190PB4F17 159

IO191NB4F17 154

IO191PB4F17 155

IO192NB4F17 152

IO192PB4F17 153

IO207NB4F19 146

IO207PB4F19 147

IO212NB4F19/CLKEN 142

IO212PB4F19/CLKEP 143

IO213NB4F19/CLKFN 136

IO213PB4F19/CLKFP 137

Bank 5

IO214NB5F20/CLKGN 128

IO214PB5F20/CLKGP 129

IO215NB5F20/CLKHN 122

IO215PB5F20/CLKHP 123

IO217NB5F20 118

IO217PB5F20 119

IO236NB5F22 110

IO236PB5F22 111

IO237NB5F22 112

IO237PB5F22 113

IO238NB5F22 104

IO238PB5F22 105

IO239NB5F22 106

IO239PB5F22 107

IO240NB5F22 100

CQ352

RTAX2000S/SL Function Pin

Number

IO240PB5F22 101

IO242NB5F22 94

IO242PB5F22 95

IO243NB5F22 98

IO243PB5F22 99

IO244NB5F22 92

IO244PB5F22 93

Bank 6

IO257PB6F24 86

IO258NB6F24 84

IO258PB6F24 85

IO261NB6F24 82

IO261PB6F24 83

IO262NB6F24 78

IO262PB6F24 79

IO265NB6F24 76

IO265PB6F24 77

IO279NB6F26 72

IO279PB6F26 73

IO280NB6F26 70

IO280PB6F26 71

IO281NB6F26 66

IO281PB6F26 67

IO282NB6F26 64

IO282PB6F26 65

IO284NB6F26 60

IO284PB6F26 61

IO285NB6F26 58

IO285PB6F26 59

IO286NB6F26 54

IO286PB6F26 55

IO287NB6F26 52

IO287PB6F26 53

IO294NB6F27 48

IO294PB6F27 49

CQ352

RTAX2000S/SL Function Pin

Number

IO296NB6F27 46

IO296PB6F27 47

Bank 7

IO300NB7F28 42

IO300PB7F28 43

IO303NB7F28 40

IO303PB7F28 41

IO310NB7F29 34

IO310PB7F29 35

IO311NB7F29 36

IO311PB7F29 37

IO312NB7F29 28

IO312PB7F29 29

IO315NB7F29 30

IO315PB7F29 31

IO316NB7F29 22

IO316PB7F29 23

IO317NB7F29 24

IO317PB7F29 25

IO318NB7F29 18

IO318PB7F29 19

IO320NB7F29 16

IO320PB7F29 17

IO334NB7F31 10

IO334PB7F31 11

IO335NB7F31 12

IO335PB7F31 13

IO338NB7F31 6

IO338PB7F31 7

IO341NB7F31 4

IO341PB7F31 5

Dedicated I/O

GND 1

GND 9

GND 15

CQ352

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-20 Revision 15

GND 21

GND 27

GND 33

GND 39

GND 45

GND 51

GND 57

GND 63

GND 69

GND 75

GND 81

GND 88

GND 89

GND 97

GND 103

GND 109

GND 115

GND 121

GND 133

GND 145

GND 151

GND 157

GND 163

GND 169

GND 176

GND 177

GND 186

GND 192

GND 198

GND 204

GND 210

GND 216

GND 222

GND 228

GND 234

CQ352

RTAX2000S/SL Function Pin

Number

GND 240

GND 246

GND 252

GND 258

GND 264

GND 265

GND 274

GND 280

GND 286

GND 292

GND 298

GND 310

GND 322

GND 330

GND 334

GND 340

GND 345

GND 352

NC 124

NC 125

NC 126

NC 127

NC 138

NC 139

NC 140

NC 141

NC 301

NC 302

NC 303

NC 304

NC 315

NC 316

NC 317

NC 318

PRA 312

CQ352

RTAX2000S/SL Function Pin

Number

PRB 311

PRC 135

PRD 134

TCK 349

TDI 348

TDO 347

TMS 350

TRST 351

VCCA 3

VCCA 14

VCCA 32

VCCA 56

VCCA 74

VCCA 87

VCCA 102

VCCA 114

VCCA 150

VCCA 162

VCCA 175

VCCA 191

VCCA 209

VCCA 233

VCCA 251

VCCA 263

VCCA 279

VCCA 291

VCCA 329

VCCA 339

VCCDA 2

VCCDA 44

VCCDA 90

VCCDA 91

VCCDA 116

VCCDA 117

VCCDA 130

CQ352

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-21

VCCDA 131

VCCDA 132

VCCDA 148

VCCDA 149

VCCDA 174

VCCDA 178

VCCDA 221

VCCDA 266

VCCDA 268

VCCDA 293

VCCDA 294

VCCDA 307

VCCDA 308

VCCDA 309

VCCDA 327

VCCDA 328

VCCDA 346

VCCIB0 321

VCCIB0 333

VCCIB0 344

VCCIB1 273

VCCIB1 285

VCCIB1 297

VCCIB2 227

VCCIB2 239

VCCIB2 245

VCCIB2 257

VCCIB3 185

VCCIB3 197

VCCIB3 203

VCCIB3 215

VCCIB4 144

VCCIB4 156

VCCIB4 168

VCCIB5 96

CQ352

RTAX2000S/SL Function Pin

Number

VCCIB5 108

VCCIB5 120

VCCIB6 50

VCCIB6 62

VCCIB6 68

VCCIB6 80

VCCIB7 8

VCCIB7 20

VCCIB7 26

VCCIB7 38

VPUMP 267

CQ352

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-22 Revision 15

CQ352

RTAX4000S/SL Function Pin

Number

Bank 0

IO02NB0F0 341

IO02PB0F0 342

IO03PB0F0 343

IO05NB0F0 337

IO05PB0F0 338

IO06NB0F0 335

IO06PB0F0 336

IO07NB0F0 331

IO07PB0F0 332

IO11NB0F0 329

IO11PB0F0 330

IO50NB0F4/HCLKAN 317

IO50PB0F4/HCLKAP 318

IO51NB0F4/HCLKBN 313

IO51PB0F4/HCLKBP 314

Bank 1

IO52NB1F6/HCLKCN 303

IO52PB1F6/HCLKCP 304

IO53NB1F6/HCLKDN 299

IO53PB1F6/HCLKDP 300

IO94NB1F10 287

IO94PB1F10 288

IO97NB1F10 281

IO97PB1F10 282

IO98NB1F10 285

IO98PB1F10 286

IO99NB1F10 275

IO99PB1F10 276

IO100NB1F10 279

IO100PB1F10 280

IO102NB1F10 273

IO102PB1F10 274

IO103NB1F10 269

IO103PB1F10 270

Bank 2

IO104NB2F12 259

IO104PB2F12 260

IO106NB2F12 253

IO106PB2F12 254

IO107NB2F12 257

IO107PB2F12 258

IO111NB2F12 251

IO111PB2F12 252

IO139NB2F16 241

IO139PB2F16 242

IO140NB2F16 245

IO140PB2F16 246

IO141NB2F16 235

IO141PB2F16 236

IO142NB2F16 239

IO142PB2F16 240

IO143NB2F16 229

IO143PB2F16 230

IO144NB2F16 233

IO144PB2F16 234

IO145NB2F16 223

IO145PB2F16 224

IO146NB2F16 227

IO146PB2F16 228

Bank 3

IO175NB3F20 213

IO175PB3F20 214

IO176NB3F20 217

IO176PB3F20 218

IO177NB3F20 207

IO177PB3F20 208

IO178NB3F20 211

IO178PB3F20 212

IO179NB3F20 205

CQ352

RTAX4000S/SL Function Pin

Number

IO179PB3F20 206

IO181NB3F20 201

IO181PB3F20 202

IO182NB3F20 199

IO182PB3F20 200

IO183NB3F20 195

IO183PB3F20 196

IO203NB3F23 189

IO203PB3F23 190

IO204NB3F23 183

IO204PB3F23 184

IO206NB3F23 187

IO206PB3F23 188

IO209NB3F23 181

IO209PB3F23 182

Bank 4

IO210NB4F24 167

IO210PB4F24 168

IO211NB4F24 173

IO213NB4F24 171

IO213PB4F24 172

IO214NB4F24 161

IO214PB4F24 162

IO215NB4F24 165

IO215PB4F24 166

IO216NB4F24 155

IO216PB4F24 156

IO217NB4F24 159

IO217PB4F24 160

IO219NB4F24 153

IO219PB4F24 154

IO260NB4F28/CLKEN 141

IO260PB4F28/CLKEP 142

IO261NB4F28/CLKFN 137

IO261PB4F28/CLKFP 138

CQ352

RTAX4000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-23

Bank 5

IO262NB5F30/CLKGN 127

IO262PB5F30/CLKGP 128

IO263NB5F30/CLKHN 123

IO263PB5F30/CLKHP 124

IO304NB5F34 111

IO304PB5F34 112

IO305NB5F34 109

IO305PB5F34 110

IO307NB5F34 103

IO307PB5F34 104

IO308NB5F34 105

IO308PB5F34 106

IO309NB5F34 97

IO309PB5F34 98

IO310NB5F34 99

IO310PB5F34 100

IO312NB5F34 93

IO312PB5F34 94

IO313NB5F34 92

Bank 6

IO314PB6F36 84

IO316NB6F36 82

IO316PB6F36 83

IO317NB6F36 78

IO317PB6F36 79

IO319NB6F36 76

IO319PB6F36 77

IO349NB6F40 66

IO349PB6F40 67

IO350NB6F40 70

IO350PB6F40 71

IO351NB6F40 60

IO351PB6F40 61

IO352NB6F40 64

CQ352

RTAX4000S/SL Function Pin

Number

IO352PB6F40 65

IO353NB6F40 54

IO353PB6F40 55

IO354NB6F40 58

IO354PB6F40 59

IO355NB6F40 48

IO355PB6F40 49

IO356NB6F40 52

IO356PB6F40 53

Bank 7

IO385NB7F44 42

IO385PB7F44 43

IO386NB7F44 38

IO386PB7F44 39

IO387NB7F44 36

IO387PB7F44 37

IO388NB7F44 32

IO388PB7F44 33

IO389NB7F44 30

IO389PB7F44 31

IO391NB7F44 26

IO391PB7F44 27

IO392NB7F44 24

IO392PB7F44 25

IO393NB7F44 20

IO393PB7F44 21

IO413NB7F47 14

IO413PB7F47 15

IO414NB7F47 8

IO414PB7F47 9

IO416NB7F47 12

IO416PB7F47 13

IO419NB7F47 6

IO419PB7F47 7

Dedicated I/O

CQ352

RTAX4000S/SL Function Pin

Number

GND 1

GND 5

GND 11

GND 17

GND 19

GND 23

GND 29

GND 35

GND 41

GND 45

GND 47

GND 51

GND 57

GND 63

GND 69

GND 73

GND 75

GND 81

GND 86

GND 88

GND 89

GND 96

GND 102

GND 108

GND 117

GND 119

GND 126

GND 132

GND 134

GND 140

GND 147

GND 149

GND 158

GND 164

GND 170

CQ352

RTAX4000S/SL Function Pin

Number

Package Pin Assignments

3-24 Revision 15

GND 176

GND 177

GND 180

GND 186

GND 192

GND 194

GND 198

GND 204

GND 210

GND 216

GND 220

GND 222

GND 226

GND 232

GND 238

GND 244

GND 248

GND 250

GND 256

GND 262

GND 264

GND 265

GND 272

GND 278

GND 284

GND 293

GND 295

GND 302

GND 308

GND 310

GND 316

GND 323

GND 325

GND 334

GND 340

CQ352

RTAX4000S/SL Function Pin

Number

GND 345

GND 352

PRA 312

PRB 311

PRC 136

PRD 135

TCK 349

TDI 348

TDO 347

TMS 350

TRST 351

VCCA 3

VCCA 4

VCCA 18

VCCA 34

VCCA 44

VCCA 56

VCCA 72

VCCA 85

VCCA 87

VCCA 101

VCCA 116

VCCA 129

VCCA 131

VCCA 148

VCCA 163

VCCA 175

VCCA 179

VCCA 193

VCCA 209

VCCA 219

VCCA 231

VCCA 247

VCCA 261

VCCA 263

CQ352

RTAX4000S/SL Function Pin

Number

VCCA 277

VCCA 292

VCCA 305

VCCA 307

VCCA 324

VCCA 339

VCCDA 2

VCCDA 16

VCCDA 46

VCCDA 74

VCCDA 90

VCCDA 91

VCCDA 113

VCCDA 114

VCCDA 115

VCCDA 118

VCCDA 120

VCCDA 121

VCCDA 122

VCCDA 130

VCCDA 133

VCCDA 143

VCCDA 144

VCCDA 145

VCCDA 146

VCCDA 150

VCCDA 151

VCCDA 152

VCCDA 174

VCCDA 178

VCCDA 191

VCCDA 221

VCCDA 249

VCCDA 266

VCCDA 268

CQ352

RTAX4000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-25

VCCDA 289

VCCDA 290

VCCDA 291

VCCDA 294

VCCDA 296

VCCDA 297

VCCDA 298

VCCDA 306

VCCDA 309

VCCDA 319

VCCDA 320

VCCDA 321

VCCDA 322

VCCDA 326

VCCDA 327

VCCDA 328

VCCDA 346

VCCIB0 315

VCCIB0 333

VCCIB0 344

VCCIB1 271

VCCIB1 283

VCCIB1 301

VCCIB2 225

VCCIB2 237

VCCIB2 243

VCCIB2 255

VCCIB3 185

VCCIB3 197

VCCIB3 203

VCCIB3 215

VCCIB4 139

VCCIB4 157

VCCIB4 169

VCCIB5 95

CQ352

RTAX4000S/SL Function Pin

Number

VCCIB5 107

VCCIB5 125

VCCIB6 50

VCCIB6 62

VCCIB6 68

VCCIB6 80

VCCIB7 10

VCCIB7 22

VCCIB7 28

VCCIB7 40

VPUMP 267

CQ352

RTAX4000S/SL Function Pin

Number

Package Pin Assignments

3-26 Revision 15

CQ352

RTAX2000D Function Pin

Number

Bank 0

IO01PB0F0 343

IO05NB0F0 341

IO05PB0F0 342

IO13NB0F1 337

IO13PB0F1 338

IO17NB0F1 335

IO17PB0F1 336

IO25NB0F2 331

IO25PB0F2 332

IO29NB0F2 329

IO29PB0F2 330

IO41NB0F3/HCLKAN 317

IO41PB0F3/HCLKAP 318

IO42NB0F3/HCLKBN 313

IO42PB0F3/HCLKBP 314

Bank 1

IO43NB1F4/HCLKCN 303

IO43PB1F4/HCLKCP 304

IO44NB1F4/HCLKDN 299

IO44PB1F4/HCLKDP 300

IO53NB1F4 287

IO53PB1F4 288

IO57NB1F5 285

IO57PB1F5 286

IO61NB1F5 281

IO61PB1F5 282

IO65NB1F6 279

IO65PB1F6 280

IO69NB1F6 275

IO69PB1F6 276

IO77NB1F7 273

IO77PB1F7 274

IO81NB1F7 269

IO81PB1F7 270

Bank 2

IO87NB2F8 259

IO87PB2F8 260

IO91NB2F8 257

IO91PB2F8 258

IO95NB2F8 253

IO95PB2F8 254

IO99NB2F9 251

IO99PB2F9 252

IO103NB2F9 245

IO103PB2F9 246

IO107NB2F10 241

IO107PB2F10 242

IO111NB2F10 239

IO111PB2F10 240

IO115NB2F10 235

IO115PB2F10 236

IO119NB2F11 233

IO119PB2F11 234

IO121NB2F11 229

IO121PB2F11 230

IO123NB2F11 227

IO123PB2F11 228

IO127NB2F11 223

IO127PB2F11 224

Bank 3

IO131NB3F12 217

IO131PB3F12 218

IO135NB3F12 213

IO135PB3F12 214

IO137NB3F12 211

IO137PB3F12 212

IO139NB3F13 207

IO139PB3F13 208

IO143NB3F13 205

CQ352

RTAX2000D Function Pin

Number

IO143PB3F13 206

IO147NB3F13 201

IO147PB3F13 202

IO151NB3F14 199

IO151PB3F14 200

IO155NB3F14 195

IO155PB3F14 196

IO159NB3F14 189

IO159PB3F14 190

IO163NB3F15 187

IO163PB3F15 188

IO167NB3F15 183

IO167PB3F15 184

IO170NB3F15 181

IO170PB3F15 182

Bank 4

IO172NB4F16 173

IO176NB4F16 171

IO176PB4F16 172

IO184NB4F17 167

IO184PB4F17 168

IO188NB4F17 165

IO188PB4F17 166

IO192NB4F17 161

IO192PB4F17 162

IO196NB4F18 159

IO196PB4F18 160

IO200NB4F18 155

IO200PB4F18 156

IO208NB4F19 153

IO208PB4F19 154

IO212NB4F19/CLKEN 141

IO212PB4F19/CLKEP 142

IO213NB4F19/CLKFN 137

IO213PB4F19/CLKFP 138

CQ352

RTAX2000D Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-27

Bank 5

IO214NB5F20/CLKGN 127

IO214PB5F20/CLKGP 128

IO215NB5F20/CLKHN 123

IO215PB5F20/CLKHP 124

IO218NB5F20 111

IO218PB5F20 112

IO228NB5F21 109

IO228PB5F21 110

IO232NB5F21 105

IO232PB5F21 106

IO236NB5F22 103

IO236PB5F22 104

IO240NB5F22 99

IO240PB5F22 100

IO246NB5F23 97

IO246PB5F23 98

IO248NB5F23 92

IO252NB5F23 93

IO252PB5F23 94

Bank 6

IO257PB6F24 84

IO258NB6F24 82

IO258PB6F24 83

IO262NB6F24 78

IO262PB6F24 79

IO266NB6F24 76

IO266PB6F24 77

IO270NB6F25 70

IO270PB6F25 71

IO274NB6F25 66

IO274PB6F25 67

IO278NB6F26 64

IO278PB6F26 65

IO282NB6F26 60

CQ352

RTAX2000D Function Pin

Number

IO282PB6F26 61

IO286NB6F26 58

IO286PB6F26 59

IO290NB6F27 54

IO290PB6F27 55

IO294NB6F27 52

IO294PB6F27 53

IO298NB6F27 48

IO298PB6F27 49

Bank 7

IO302NB7F28 42

IO302PB7F28 43

IO306NB7F28 38

IO306PB7F28 39

IO308NB7F28 32

IO308PB7F28 33

IO310NB7F29 36

IO310PB7F29 37

IO314NB7F29 30

IO314PB7F29 31

IO318NB7F29 26

IO318PB7F29 27

IO322NB7F30 24

IO322PB7F30 25

IO326NB7F30 20

IO326PB7F30 21

IO330NB7F30 14

IO330PB7F30 15

IO334NB7F31 12

IO334PB7F31 13

IO338NB7F31 8

IO338PB7F31 9

IO341NB7F31 6

IO341PB7F31 7

Dedicated I/O

CQ352

RTAX2000D Function Pin

Number

GND 1

GND 5

GND 11

GND 19

GND 23

GND 29

GND 35

GND 41

GND 47

GND 51

GND 57

GND 63

GND 69

GND 73

GND 81

GND 86

GND 88

GND 89

GND 96

GND 102

GND 108

GND 117

GND 126

GND 132

GND 134

GND 140

GND 149

GND 158

GND 164

GND 170

GND 176

GND 177

GND 180

GND 186

GND 194

CQ352

RTAX2000D Function Pin

Number

Package Pin Assignments

3-28 Revision 15

GND 198

GND 204

GND 210

GND 216

GND 222

GND 226

GND 232

GND 238

GND 244

GND 248

GND 256

GND 262

GND 264

GND 265

GND 272

GND 278

GND 284

GND 293

GND 302

GND 308

GND 310

GND 316

GND 325

GND 334

GND 340

GND 345

GND 352

NC 16

NC 17

NC 44

NC 45

NC 74

NC 75

NC 113

NC 118

CQ352

RTAX2000D Function Pin

Number

NC 119

NC 120

NC 122

NC 129

NC 143

NC 144

NC 146

NC 147

NC 151

NC 152

NC 191

NC 192

NC 219

NC 220

NC 249

NC 250

NC 289

NC 294

NC 295

NC 296

NC 298

NC 305

NC 319

NC 320

NC 322

NC 323

NC 327

NC 328

PRA 312

PRB 311

PRC 136

PRD 135

TCK 349

TDI 348

TDO 347

CQ352

RTAX2000D Function Pin

Number

TMS 350

TRST 351

VCCA 3

VCCA 87

VCCA 175

VCCA 263

VCCA 4

VCCA 18

VCCA 34

VCCA 56

VCCA 72

VCCA 85

VCCA 101

VCCA 116

VCCA 131

VCCA 148

VCCA 163

VCCA 179

VCCA 193

VCCA 209

VCCA 231

VCCA 247

VCCA 261

VCCA 277

VCCA 292

VCCA 307

VCCA 324

VCCA 339

VCCDA 2

VCCDA 46

VCCDA 90

VCCDA 91

VCCDA 114

VCCDA 115

VCCDA 121

CQ352

RTAX2000D Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-29

VCCDA 130

VCCDA 133

VCCDA 145

VCCDA 150

VCCDA 174

VCCDA 178

VCCDA 221

VCCDA 266

VCCDA 268

VCCDA 290

VCCDA 291

VCCDA 297

VCCDA 306

VCCDA 309

VCCDA 321

VCCDA 326

VCCDA 346

VCCIB0 315

VCCIB0 333

VCCIB0 344

VCCIB1 271

VCCIB1 283

VCCIB1 301

VCCIB2 225

VCCIB2 237

VCCIB2 243

VCCIB2 255

VCCIB3 185

VCCIB3 197

VCCIB3 203

VCCIB3 215

VCCIB4 139

VCCIB4 157

VCCIB4 169

VCCIB5 95

CQ352

RTAX2000D Function Pin

Number

VCCIB5 107

VCCIB5 125

VCCIB6 50

VCCIB6 62

VCCIB6 68

VCCIB6 80

VCCIB7 10

VCCIB7 22

VCCIB7 28

VCCIB7 40

VPUMP 267

CQ352

RTAX2000D Function Pin

Number

Package Pin Assignments

3-30 Revision 15

CQ352

RTAX4000D Function Pin

Number

Bank 0

IO02NB0F0 341

IO02PB0F0 342

IO03PB0F0 343

IO05NB0F0 337

IO05PB0F0 338

IO06NB0F0 335

IO06PB0F0 336

IO07NB0F0 331

IO07PB0F0 332

IO11NB0F0 329

IO11PB0F0 330

IO50NB0F4/HCLKAN 317

IO50PB0F4/HCLKAP 318

IO51NB0F4/HCLKBN 313

IO51PB0F4/HCLKBP 314

Bank 1

IO52NB1F6/HCLKCN 303

IO52PB1F6/HCLKCP 304

IO53NB1F6/HCLKDN 299

IO53PB1F6/HCLKDP 300

IO94NB1F10 287

IO94PB1F10 288

IO97NB1F10 281

IO97PB1F10 282

IO98NB1F10 285

IO98PB1F10 286

IO99NB1F10 275

IO99PB1F10 276

IO100NB1F10 279

IO100PB1F10 280

IO102NB1F10 273

IO102PB1F10 274

IO103NB1F10 269

IO103PB1F10 270

Bank 2

IO104NB2F12 259

IO104PB2F12 260

IO106NB2F12 253

IO106PB2F12 254

IO107NB2F12 257

IO107PB2F12 258

IO111NB2F12 251

IO111PB2F12 252

IO139NB2F16 241

IO139PB2F16 242

IO140NB2F16 245

IO140PB2F16 246

IO141NB2F16 235

IO141PB2F16 236

IO142NB2F16 239

IO142PB2F16 240

IO143NB2F16 229

IO143PB2F16 230

IO144NB2F16 233

IO144PB2F16 234

IO145NB2F16 223

IO145PB2F16 224

IO146NB2F16 227

IO146PB2F16 228

Bank 3

IO175NB3F20 213

IO175PB3F20 214

IO176NB3F20 217

IO176PB3F20 218

IO177NB3F20 207

IO177PB3F20 208

IO178NB3F20 211

IO178PB3F20 212

IO179NB3F20 205

CQ352

RTAX4000D Function Pin

Number

IO179PB3F20 206

IO181NB3F20 201

IO181PB3F20 202

IO182NB3F20 199

IO182PB3F20 200

IO183NB3F20 195

IO183PB3F20 196

IO203NB3F23 189

IO203PB3F23 190

IO204NB3F23 183

IO204PB3F23 184

IO206NB3F23 187

IO206PB3F23 188

IO209NB3F23 181

IO209PB3F23 182

Bank 4

IO210NB4F24 167

IO210PB4F24 168

IO211NB4F24 173

IO213NB4F24 171

IO213PB4F24 172

IO214NB4F24 161

IO214PB4F24 162

IO215NB4F24 165

IO215PB4F24 166

IO216NB4F24 155

IO216PB4F24 156

IO217NB4F24 159

IO217PB4F24 160

IO219NB4F24 153

IO219PB4F24 154

IO260NB4F28/CLKEN 141

IO260PB4F28/CLKEP 142

IO261NB4F28/CLKFN 137

IO261PB4F28/CLKFP 138

CQ352

RTAX4000D Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-31

Bank 5

IO262NB5F30/CLKGN 127

IO262PB5F30/CLKGP 128

IO263NB5F30/CLKHN 123

IO263PB5F30/CLKHP 124

IO304NB5F34 111

IO304PB5F34 112

IO305NB5F34 109

IO305PB5F34 110

IO307NB5F34 103

IO307PB5F34 104

IO308NB5F34 105

IO308PB5F34 106

IO309NB5F34 97

IO309PB5F34 98

IO310NB5F34 99

IO310PB5F34 100

IO312NB5F34 93

IO312PB5F34 94

IO313NB5F34 92

Bank 6

IO314PB6F36 84

IO316NB6F36 82

IO316PB6F36 83

IO317NB6F36 78

IO317PB6F36 79

IO319NB6F36 76

IO319PB6F36 77

IO349NB6F40 66

IO349PB6F40 67

IO350NB6F40 70

IO350PB6F40 71

IO351NB6F40 60

IO351PB6F40 61

IO352NB6F40 64

CQ352

RTAX4000D Function Pin

Number

IO352PB6F40 65

IO353NB6F40 54

IO353PB6F40 55

IO354NB6F40 58

IO354PB6F40 59

IO355NB6F40 48

IO355PB6F40 49

IO356NB6F40 52

IO356PB6F40 53

Bank 7

IO385NB7F44 42

IO385PB7F44 43

IO386NB7F44 38

IO386PB7F44 39

IO387NB7F44 36

IO387PB7F44 37

IO388NB7F44 32

IO388PB7F44 33

IO389NB7F44 30

IO389PB7F44 31

IO391NB7F44 26

IO391PB7F44 27

IO392NB7F44 24

IO392PB7F44 25

IO393NB7F44 20

IO393PB7F44 21

IO413NB7F47 14

IO413PB7F47 15

IO414NB7F47 8

IO414PB7F47 9

IO416NB7F47 12

IO416PB7F47 13

IO419NB7F47 6

IO419PB7F47 7

Dedicated I/O

CQ352

RTAX4000D Function Pin

Number

GND 1

GND 5

GND 11

GND 17

GND 19

GND 23

GND 29

GND 35

GND 41

GND 45

GND 47

GND 51

GND 57

GND 63

GND 69

GND 73

GND 75

GND 81

GND 86

GND 88

GND 89

GND 96

GND 102

GND 108

GND 117

GND 119

GND 126

GND 132

GND 134

GND 140

GND 147

GND 149

GND 158

GND 164

GND 170

CQ352

RTAX4000D Function Pin

Number

Package Pin Assignments

3-32 Revision 15

GND 176

GND 177

GND 180

GND 186

GND 192

GND 194

GND 198

GND 204

GND 210

GND 216

GND 220

GND 222

GND 226

GND 232

GND 238

GND 244

GND 248

GND 250

GND 256

GND 262

GND 264

GND 265

GND 272

GND 278

GND 284

GND 293

GND 295

GND 302

GND 308

GND 310

GND 316

GND 323

GND 325

GND 334

GND 340

CQ352

RTAX4000D Function Pin

Number

GND 345

GND 352

PRA 312

PRB 311

PRC 136

PRD 135

TCK 349

TDI 348

TDO 347

TMS 350

TRST 351

VCCA 3

VCCA 44

VCCA 87

VCCA 129

VCCA 175

VCCA 219

VCCA 263

VCCA 305

VCCA 4

VCCA 18

VCCA 34

VCCA 56

VCCA 72

VCCA 85

VCCA 101

VCCA 116

VCCA 131

VCCA 148

VCCA 163

VCCA 179

VCCA 193

VCCA 209

VCCA 231

VCCA 247

CQ352

RTAX4000D Function Pin

Number

VCCA 261

VCCA 277

VCCA 292

VCCA 307

VCCA 324

VCCA 339

VCCDA 2

VCCDA 16

VCCDA 46

VCCDA 74

VCCDA 90

VCCDA 91

VCCDA 113

VCCDA 114

VCCDA 115

VCCDA 118

VCCDA 120

VCCDA 121

VCCDA 122

VCCDA 130

VCCDA 133

VCCDA 143

VCCDA 144

VCCDA 145

VCCDA 146

VCCDA 150

VCCDA 151

VCCDA 152

VCCDA 174

VCCDA 178

VCCDA 191

VCCDA 221

VCCDA 249

VCCDA 266

VCCDA 268

CQ352

RTAX4000D Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-33

VCCDA 289

VCCDA 290

VCCDA 291

VCCDA 294

VCCDA 296

VCCDA 297

VCCDA 298

VCCDA 306

VCCDA 309

VCCDA 319

VCCDA 320

VCCDA 321

VCCDA 322

VCCDA 326

VCCDA 327

VCCDA 328

VCCDA 346

VCCIB0 315

VCCIB0 333

VCCIB0 344

VCCIB1 271

VCCIB1 283

VCCIB1 301

VCCIB2 225

VCCIB2 237

VCCIB2 243

VCCIB2 255

VCCIB3 185

VCCIB3 197

VCCIB3 203

VCCIB3 215

VCCIB4 139

VCCIB4 157

VCCIB4 169

VCCIB5 95

CQ352

RTAX4000D Function Pin

Number

VCCIB5 107

VCCIB5 125

VCCIB6 50

VCCIB6 62

VCCIB6 68

VCCIB6 80

VCCIB7 10

VCCIB7 22

VCCIB7 28

VCCIB7 40

VPUMP 267

CQ352

RTAX4000D Function Pin

Number

Package Pin Assignments

3-34 Revision 15

CG624/LG624

Note:

The 624-pin CCGA pin assignments for RTAX250S/SL, RTAX1000S/SL and RTAX2000S/SL are compatible except

for the following pins.

Where exceptions occur, the smaller density devices have those pins designated as No Connects (NC). Customers are

therefore recommended to layout their board targeting the larger density device, in order to preserve interchangeability

between the two devices. Note: RTAX4000S is not pin compatible with any of the smaller density devices.

For Package Manufacturing and Environmental information, visit the Resource center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

Table 1 • Compatibility Table for the CGA/LGA 624 Package

RTAX250S/SL RTAX1000S/SL RTAX2000S/SL

RTAX250S/SL NA A12, AD11, AE17, B15, D13 A12, A14, AA20, AB13, AD11, AD4,

AE12, B15, D13, F21, G10

RTAX1000S/SL A12, AD11, AE17, B15, D13 NA A14, AA20, AB13, AD4, AE12, F21,

G10

RTAX2000S/SL A12, A14, AA20, AB13,

AD11, AD4, AE12, B15,

D13, F21, G10

A14, AA20, AB13, AD4,

AE12, F21, G10

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-35

CG624/LG624

RTAX250S/SL Function Pin

Number

Bank 0

IO00NB0F0 C9

IO00PB0F0 C8

IO01NB0F0 B5

IO01PB0F0 B4

IO02NB0F0 D10

IO02PB0F0 D9

IO03NB0F0 A5

IO03PB0F0 A4

IO04NB0F0 H8

IO04PB0F0 H7

IO05NB0F0 A7

IO05PB0F0 A6

IO06NB0F0 H10

IO06PB0F0 H9

IO07NB0F0 B11

IO07PB0F0 B10

IO08NB0F0 J8

IO08PB0F0 J7

IO09NB0F0 A9

IO09PB0F0 B9

IO12NB0F0/HCLKAN G13

IO12PB0F0/HCLKAP G12

IO13NB0F0/HCLKBN C13

IO13PB0F0/HCLKBP C12

Bank 1

IO16NB1F1 D14

IO16PB1F1 C14

IO17NB1F1 A16

IO17PB1F1 A15

IO18NB1F1 H20

IO18PB1F1 H19

IO19NB1F1 B17

IO19PB1F1 B16

IO20NB1F1 D16

IO20PB1F1 D15

IO21NB1F1 A20

IO21PB1F1 A19

IO22NB1F1 D18

IO22PB1F1 D17

IO23NB1F1 A22

IO23PB1F1 A21

IO24NB1F1 G17

IO24PB1F1 H17

IO25NB1F1 C21

IO25PB1F1 C20

IO26NB1F1 C19

IO26PB1F1 C18

IO27NB1F1 D20

IO27PB1F1 D19

IO14NB1F1/HCLKCN G15

IO14PB1F1/HCLKCP G14

IO15NB1F1/HCLKDN B14

IO15PB1F1/HCLKDP B13

Bank 2

IO28NB2F2 J22

IO28PB2F2 H22

IO29NB2F2 L18

IO29PB2F2 K18

IO30NB2F2 F23

IO30PB2F2 E23

IO31NB2F2 J21

IO31PB2F2 J20

IO32NB2F2 E25

IO32PB2F2 D25

IO33NB2F2 M19

IO33PB2F2 M18

IO34NB2F2 H23

IO34PB2F2 G23

IO35NB2F2 L22

IO35PB2F2 K22

IO36NB2F2 G25

IO36PB2F2 F25

IO37NB2F2 L24

CG624/LG624

RTAX250S/SL Function Pin

Number

IO37PB2F2 K24

IO38NB2F2 J24

IO38PB2F2 H24

IO39NB2F2 N22

IO39PB2F2 M22

IO40NB2F2 N24

IO40PB2F2 M24

IO41NB2F2 N19

IO41PB2F2 N18

IO42NB2F2 L25

IO42PB2F2 K25

IO43NB2F2 N23

IO43PB2F2 M23

IO44NB2F2 N25

IO44PB2F2 M25

Bank 3

IO45NB3F3 R22

IO45PB3F3 P22

IO46NB3F3 R25

IO46PB3F3 P25

IO47NB3F3 R23

IO47PB3F3 P23

IO48NB3F3 Y25

IO48PB3F3 W25

IO49NB3F3 U24

IO49PB3F3 U23

IO50NB3F3 T24

IO50PB3F3 R24

IO51NB3F3 Y23

IO51PB3F3 AA23

IO52NB3F3 V23

IO52PB3F3 V24

IO53NB3F3 P20

IO53PB3F3 P19

IO54NB3F3 U25

IO54PB3F3 T25

IO55NB3F3 V22

CG624/LG624

RTAX250S/SL Function Pin

Number

Package Pin Assignments

3-36 Revision 15

IO55PB3F3 U22

IO56NB3F3 AA24

IO56PB3F3 Y24

IO57NB3F3 V20

IO57PB3F3 U20

IO58NB3F3 AB25

IO58PB3F3 AA25

IO59NB3F3 Y22

IO59PB3F3 Y21

IO60NB3F3 W22

IO60PB3F3 W23

IO61NB3F3 T18

IO61PB3F3 R18

Bank 4

IO62NB4F4 V19

IO62PB4F4 W19

IO63NB4F4 AE19

IO63PB4F4 AE20

IO64NB4F4 W18

IO64PB4F4 V18

IO65NB4F4 AC20

IO65PB4F4 AC21

IO66NB4F4 AD14

IO66PB4F4 AC14

IO67NB4F4 AD21

IO67PB4F4 AD22

IO68NB4F4 AD15

IO68PB4F4 AD16

IO69NB4F4 AD19

IO69PB4F4 AD20

IO70NB4F4 AB14

IO70PB4F4 AB15

IO71NB4F4 AD17

IO71PB4F4 AD18

IO72NB4F4 V15

IO72PB4F4 V16

IO73NB4F4 AE15

CG624/LG624

RTAX250S/SL Function Pin

Number

IO73PB4F4 AE16

IO74NB4F4/CLKEN W14

IO74PB4F4/CLKEP W15

IO75NB4F4/CLKFN AC13

IO75PB4F4/CLKFP AD13

Bank 5

IO78NB5F5 AE10

IO78PB5F5 AE11

IO79NB5F5 AD9

IO79PB5F5 AD10

IO80NB5F5 V9

IO80PB5F5 V10

IO81NB5F5 AD7

IO81PB5F5 AD8

IO82NB5F5 AB10

IO82PB5F5 AB11

IO83NB5F5 AE6

IO83PB5F5 AE7

IO84NB5F5 AB8

IO84PB5F5 AC8

IO85NB5F5 AE4

IO85PB5F5 AE5

IO86NB5F5 U13

IO86PB5F5 V13

IO87NB5F5 AC5

IO87PB5F5 AC6

IO88NB5F5 Y7

IO88PB5F5 W7

IO89NB5F5 AB7

IO89PB5F5 AC7

IO76NB5F5/CLKGN W13

IO76PB5F5/CLKGP Y13

IO77NB5F5/CLKHN AC12

IO77PB5F5/CLKHP AD12

Bank 6

IO90NB6F6 Y3

IO90PB6F6 AA3

CG624/LG624

RTAX250S/SL Function Pin

Number

IO91NB6F6 U4

IO91PB6F6 V4

IO92NB6F6 AA1

IO92PB6F6 AB1

IO93NB6F6 W2

IO93PB6F6 Y2

IO94NB6F6 V3

IO94PB6F6 W3

IO95NB6F6 R4

IO95PB6F6 T4

IO96NB6F6 W1

IO96PB6F6 Y1

IO97NB6F6 Y5

IO97PB6F6 W5

IO98NB6F6 T2

IO98PB6F6 U2

IO99NB6F6 N3

IO99PB6F6 P3

IO100NB6F6 T1

IO100PB6F6 U1

IO101NB6F6 N4

IO101PB6F6 P4

IO102NB6F6 P2

IO102PB6F6 R2

IO103NB6F6 R8

IO103PB6F6 T8

IO104NB6F6 P1

IO104PB6F6 R1

IO105NB6F6 M2

IO105PB6F6 N2

IO106NB6F6 M1

IO106PB6F6 N1

Bank 7

IO107NB7F7 H4

IO107PB7F7 J4

IO108NB7F7 K1

IO108PB7F7 L1

CG624/LG624

RTAX250S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-37

IO109NB7F7 L3

IO109PB7F7 M3

IO10NB0F0 D12

IO10PB0F0 D11

IO110NB7F7 J2

IO110PB7F7 J1

IO111NB7F7 N10

IO111PB7F7 N9

IO112NB7F7 K2

IO112PB7F7 L2

IO113NB7F7 K8

IO113PB7F7 L8

IO114NB7F7 F1

IO114PB7F7 G1

IO115NB7F7 J6

IO115PB7F7 J5

IO116NB7F7 H3

IO116PB7F7 H2

IO117NB7F7 K4

IO117PB7F7 L4

IO118NB7F7 E2

IO118PB7F7 F2

IO119NB7F7 M9

IO119PB7F7 M8

IO11NB0F0 A11

IO11PB0F0 A10

IO120NB7F7 D1

IO120PB7F7 E1

IO121NB7F7 F3

IO121PB7F7 E3

IO122NB7F7 G4

IO122PB7F7 G3

IO123NB7F7 H5

IO123PB7F7 H6

Dedicated I/O

GND K5

GND T5

CG624/LG624

RTAX250S/SL Function Pin

Number

GND V5

GND AA10

GND AA16

GND AA18

GND T21

GND K21

GND H21

GND E16

GND E10

GND E8

GND A18

GND A2

GND A24

GND A25

GND A8

GND AA21

GND AA5

GND AB22

GND AB4

GND AC10

GND AC16

GND AC23

GND AC3

GND AD1

GND AD2

GND AD24

GND AD25

GND AE1

GND AE18

GND AE2

GND AE24

GND AE25

GND AE8

GND B1

GND B2

GND B24

GND B25

CG624/LG624

RTAX250S/SL Function Pin

Number

GND C10

GND C16

GND C23

GND C3

GND D22

GND D4

GND E21

GND E5

GND H1

GND H25

GND K23

GND K3

GND L11

GND L12

GND L13

GND L14

GND L15

GND M11

GND M12

GND M13

GND M14

GND M15

GND N11

GND N12

GND N13

GND N14

GND N15

GND P11

GND P12

GND P13

GND P14

GND P15

GND R11

GND R12

GND R13

GND R14

GND R15

CG624/LG624

RTAX250S/SL Function Pin

Number

Package Pin Assignments

3-38 Revision 15

GND T23

GND T3

GND V1

GND V25

NC A12

NC A14

NC A17

NC AA11

NC AA12

NC AA14

NC AA17

NC AA19

NC AA2

NC AA20

NC AA6

NC AA8

NC AA9

NC AB13

NC AB16

NC AB17

NC AB18

NC AB19

NC AB2

NC AB24

NC AB6

NC AB9

NC AC15

NC AC17

NC AC18

NC AC19

NC AC9

NC AD11

NC AD4

NC AD5

NC AD6

NC AE12

NC AE14

CG624/LG624

RTAX250S/SL Function Pin

Number

NC AE17

NC AE21

NC AE22

NC AE9

NC B12

NC B15

NC B18

NC B19

NC B20

NC B21

NC B22

NC B6

NC B7

NC B8

NC C11

NC C17

NC C7

NC D13

NC D2

NC D24

NC D7

NC D8

NC E11

NC E12

NC E14

NC E15

NC E17

NC E18

NC E24

NC E7

NC E9

NC F10

NC F11

NC F12

NC F14

NC F15

NC F16

CG624/LG624

RTAX250S/SL Function Pin

Number

NC F17

NC F18

NC F19

NC F20

NC F21

NC F24

NC F7

NC F8

NC F9

NC G10

NC G11

NC G16

NC G18

NC G19

NC G2

NC G20

NC G21

NC G22

NC G24

NC G6

NC G7

NC G8

NC G9

NC H11

NC H12

NC H13

NC H14

NC H15

NC H16

NC H18

NC J12

NC J13

NC J14

NC J18

NC J19

NC J23

NC J25

CG624/LG624

RTAX250S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-39

NC J3

NC K13

NC K19

NC K20

NC K6

NC K7

NC L19

NC L20

NC L21

NC L23

NC L5

NC L6

NC L7

NC M17

NC M20

NC M21

NC M4

NC M5

NC M6

NC M7

NC N16

NC N17

NC N20

NC N6

NC N7

NC N8

NC P17

NC P18

NC P21

NC P24

NC P5

NC P6

NC P7

NC P8

NC P9

NC R19

NC R20

CG624/LG624

RTAX250S/SL Function Pin

Number

NC R21

NC R3

NC R5

NC R6

NC R7

NC T13

NC T19

NC T20

NC T22

NC T6

NC T7

NC U12

NC U14

NC U18

NC U19

NC U21

NC U3

NC U5

NC U6

NC U7

NC U8

NC V11

NC V12

NC V14

NC V17

NC V2

NC V21

NC V6

NC V7

NC V8

NC W10

NC W11

NC W12

NC W16

NC W17

NC W20

NC W24

CG624/LG624

RTAX250S/SL Function Pin

Number

NC W4

NC W6

NC W8

NC W9

NC Y10

NC Y11

NC Y12

NC Y14

NC Y15

NC Y16

NC Y17

NC Y18

NC Y19

NC Y20

NC Y6

NC Y8

NC Y9

PRA F13

PRB A13

PRC AB12

PRD AE13

TCK F5

TDI C5

TDO F6

TMS D6

TRST E6

VCCA F4

VCCA Y4

VCCA AB20

VCCA F22

VCCA J17

VCCA J9

VCCA K10

VCCA K11

VCCA K15

VCCA K16

VCCA L10

CG624/LG624

RTAX250S/SL Function Pin

Number

Package Pin Assignments

3-40 Revision 15

VCCA L16

VCCA R10

VCCA R16

VCCA T10

VCCA T11

VCCA T15

VCCA T16

VCCA U17

VCCA U9

VCCDA G5

VCCDA N5

VCCDA AA7

VCCDA AC11

VCCDA AA13

VCCDA AA15

VCCDA W21

VCCDA N21

VCCDA E19

VCCDA C15

VCCDA E13

VCCDA C6

VCCIB0 A3

VCCIB0 B3

VCCIB0 C4

VCCIB0 D5

VCCIB0 J10

VCCIB0 J11

VCCIB0 K12

VCCIB1 A23

VCCIB1 B23

VCCIB1 C22

VCCIB1 D21

VCCIB1 J15

VCCIB1 J16

VCCIB1 K14

VCCIB2 C24

VCCIB2 C25

CG624/LG624

RTAX250S/SL Function Pin

Number

VCCIB2 D23

VCCIB2 E22

VCCIB2 K17

VCCIB2 L17

VCCIB2 M16

VCCIB3 AA22

VCCIB3 AB23

VCCIB3 AC24

VCCIB3 AC25

VCCIB3 P16

VCCIB3 R17

VCCIB3 T17

VCCIB4 AB21

VCCIB4 AC22

VCCIB4 AD23

VCCIB4 AE23

VCCIB4 T14

VCCIB4 U15

VCCIB4 U16

VCCIB5 AB5

VCCIB5 AC4

VCCIB5 AD3

VCCIB5 AE3

VCCIB5 T12

VCCIB5 U10

VCCIB5 U11

VCCIB6 AA4

VCCIB6 AB3

VCCIB6 AC1

VCCIB6 AC2

VCCIB6 P10

VCCIB6 R9

VCCIB6 T9

VCCIB7 C1

VCCIB7 C2

VCCIB7 D3

VCCIB7 E4

CG624/LG624

RTAX250S/SL Function Pin

Number

VCCIB7 K9

VCCIB7 L9

VCCIB7 M10

VPUMP E20

CG624/LG624

RTAX250S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-41

CG624/LG624

RTAX1000S/SL Function Pin

Number

Bank 0

IO00NB0F0 F8

IO00PB0F0 F7

IO02NB0F0 G7

IO02PB0F0 G6

IO04NB0F0 E9

IO04PB0F0 D8

IO06NB0F0 G9

IO06PB0F0 G8

IO07PB0F0 B6

IO08NB0F0 F10

IO08PB0F0 F9

IO09PB0F0 C7

IO10NB0F0 H8

IO10PB0F0 H7

IO11NB0F0 D10

IO11PB0F0 D9

IO12NB0F1 B5

IO12PB0F1 B4

IO13NB0F1 A7

IO13PB0F1 A6

IO14NB0F1 C9

IO14PB0F1 C8

IO15PB0F1 B7

IO16NB0F1 A5

IO16PB0F1 A4

IO17NB0F1 A9

IO17PB0F1 B9

IO18NB0F1 D12

IO18PB0F1 D11

IO20NB0F1 B11

IO20PB0F1 B10

IO21NB0F1 A11

IO21PB0F1 A10

IO22NB0F2 H10

IO22PB0F2 H9

IO23NB0F2 E11

IO23PB0F2 F11

IO24NB0F2 D7

IO24PB0F2 E7

IO25PB0F2 B12

IO26NB0F2 H11

IO26PB0F2 G11

IO27NB0F2 C11

IO27PB0F2 B8

IO28NB0F2 J13

IO28PB0F2 K13

IO29NB0F2 J8

IO29PB0F2 J7

IO30NB0F2/HCLKAN G13

IO30PB0F2/HCLKAP G12

IO31NB0F2/HCLKBN C13

IO31PB0F2/HCLKBP C12

Bank 1

IO32NB1F3/HCLKCN G15

IO32PB1F3/HCLKCP G14

IO33NB1F3/HCLKDN B14

IO33PB1F3/HCLKDP B13

IO34NB1F3 G16

IO34PB1F3 H16

IO35NB1F3 C17

IO35PB1F3 B18

IO36NB1F3 H18

IO36PB1F3 H15

IO37NB1F3 H13

IO38NB1F3 E15

IO38PB1F3 F15

IO39NB1F3 D14

IO39PB1F3 C14

IO40NB1F3 D16

IO40PB1F3 D15

IO41NB1F4 F16

IO42NB1F4 G21

IO42PB1F4 G20

CG624/LG624

RTAX1000S/SL Function Pin

Number

IO43NB1F4 A16

IO43PB1F4 A15

IO44NB1F4 A20

IO44PB1F4 A19

IO45NB1F4 B17

IO45PB1F4 B16

IO46NB1F4 G17

IO46PB1F4 H17

IO47NB1F4 A17

IO48NB1F4 C19

IO48PB1F4 C18

IO49NB1F4 B20

IO49PB1F4 B19

IO50NB1F4 H20

IO50PB1F4 H19

IO51NB1F4 A22

IO51PB1F4 A21

IO52NB1F4 C21

IO52PB1F4 C20

IO53NB1F4 B22

IO53PB1F4 B21

IO54NB1F5 J18

IO54PB1F5 J19

IO55NB1F5 D18

IO55PB1F5 D17

IO56NB1F5 F20

IO56PB1F5 F19

IO58NB1F5 E17

IO58PB1F5 F17

IO60NB1F5 D20

IO60PB1F5 D19

IO62NB1F5 E18

IO62PB1F5 F18

IO63NB1F5 G19

IO63PB1F5 G18

Bank 2

IO64NB2F6 M17

CG624/LG624

RTAX1000S/SL Function Pin

Number

Package Pin Assignments

3-42 Revision 15

IO64PB2F6 G22

IO65NB2F6 J21

IO65PB2F6 J20

IO66NB2F6 L23

IO66PB2F6 K20

IO67NB2F6 F23

IO67PB2F6 E23

IO68NB2F6 L18

IO68PB2F6 K18

IO70NB2F6 E24

IO70PB2F6 D24

IO71NB2F6 H23

IO71PB2F6 G23

IO72NB2F6 L19

IO72PB2F6 K19

IO74NB2F7 J22

IO74PB2F7 H22

IO75NB2F7 N23

IO75PB2F7 M23

IO76NB2F7 N17

IO76PB2F7 N16

IO77NB2F7 L22

IO77PB2F7 K22

IO78NB2F7 M19

IO78PB2F7 M18

IO79NB2F7 N19

IO79PB2F7 N18

IO80NB2F7 L21

IO80PB2F7 L20

IO82NB2F7 P18

IO82PB2F7 P17

IO83NB2F7 N22

IO83PB2F7 M22

IO84NB2F7 M20

IO84PB2F7 M21

IO86NB2F8 E25

IO86PB2F8 D25

CG624/LG624

RTAX1000S/SL Function Pin

Number

IO87NB2F8 L24

IO87PB2F8 K24

IO88NB2F8 G24

IO88PB2F8 F24

IO89NB2F8 J25

IO90NB2F8 G25

IO90PB2F8 F25

IO91NB2F8 L25

IO91PB2F8 K25

IO92NB2F8 J24

IO92PB2F8 H24

IO93PB2F8 J23

IO94NB2F8 N24

IO94PB2F8 M24

IO95NB2F8 N25

IO95PB2F8 M25

Bank 3

IO96NB3F9 T18

IO96PB3F9 R18

IO97NB3F9 N20

IO97PB3F9 P24

IO98NB3F9 P20

IO98PB3F9 P19

IO99NB3F9 P21

IO100NB3F9 T22

IO100PB3F9 W24

IO101NB3F9 R22

IO101PB3F9 P22

IO102NB3F9 U19

IO102PB3F9 T19

IO104NB3F9 V20

IO104PB3F9 U20

IO105NB3F9 R23

IO105PB3F9 P23

IO106NB3F9 R19

IO106PB3F9 R20

IO107NB3F10 AB24

CG624/LG624

RTAX1000S/SL Function Pin

Number

IO108NB3F10 R25

IO108PB3F10 P25

IO109NB3F10 U25

IO109PB3F10 T25

IO110NB3F10 U24

IO110PB3F10 U23

IO112NB3F10 T24

IO112PB3F10 R24

IO113NB3F10 Y25

IO113PB3F10 W25

IO114NB3F10 V23

IO114PB3F10 V24

IO116NB3F10 AA24

IO116PB3F10 Y24

IO117NB3F10 AB25

IO117PB3F10 AA25

IO118NB3F11 T20

IO118PB3F11 R21

IO120NB3F11 W22

IO120PB3F11 W23

IO122NB3F11 V22

IO122PB3F11 U22

IO124NB3F11 Y23

IO124PB3F11 AA23

IO126NB3F11 V21

IO126PB3F11 U21

IO128NB3F11 Y22

IO128PB3F11 Y21

Bank 4

IO129NB4F12 W20

IO129PB4F12 Y20

IO131NB4F12 V19

IO131PB4F12 W19

IO133NB4F12 Y18

IO133PB4F12 Y19

IO135NB4F12 W18

IO135PB4F12 V18

CG624/LG624

RTAX1000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-43

IO137NB4F12 Y17

IO137PB4F12 AA17

IO138NB4F12 AB19

IO138PB4F12 AB18

IO139NB4F13 AA19

IO139PB4F13 U18

IO140NB4F13 AC20

IO140PB4F13 AC21

IO141NB4F13 AD17

IO141PB4F13 AD18

IO142NB4F13 AD21

IO142PB4F13 AD22

IO143NB4F13 AB17

IO143PB4F13 AC17

IO144PB4F13 AE22

IO145NB4F13 AE15

IO145PB4F13 AE16

IO146NB4F13 AD19

IO146PB4F13 AD20

IO147NB4F13 AD15

IO147PB4F13 AD16

IO148PB4F13 AE21

IO149NB4F13 AD14

IO149PB4F13 AC14

IO150NB4F13 AE19

IO150PB4F13 AE20

IO151NB4F13 V17

IO151PB4F13 W17

IO152NB4F14 AB16

IO152PB4F14 W16

IO153NB4F14 Y15

IO153PB4F14 Y16

IO155NB4F14 V15

IO155PB4F14 V16

IO156NB4F14 AB14

IO156PB4F14 AB15

IO157NB4F14 AE14

CG624/LG624

RTAX1000S/SL Function Pin

Number

IO157PB4F14 AC18

IO158NB4F14 AC15

IO158PB4F14 AC19

IO159NB4F14/CLKEN W14

IO159PB4F14/CLKEP W15

IO160NB4F14/CLKFN AC13

IO160PB4F14/CLKFP AD13

Bank 5

IO161NB5F15/CLKGN W13

IO161PB5F15/CLKGP Y13

IO162NB5F15/CLKHN AC12

IO162PB5F15/CLKHP AD12

IO163NB5F15 V9

IO163PB5F15 V10

IO164NB5F15 V11

IO164PB5F15 T13

IO165NB5F15 U13

IO165PB5F15 V13

IO167NB5F15 W11

IO167PB5F15 W12

IO168NB5F15 AB6

IO168PB5F15 AA6

IO169NB5F15 V8

IO169PB5F15 V7

IO171NB5F16 W8

IO171PB5F16 W9

IO172NB5F16 AB8

IO172PB5F16 AC8

IO173NB5F16 AA11

IO173PB5F16 Y11

IO174NB5F16 AB10

IO174PB5F16 AB11

IO175NB5F16 AC9

IO175PB5F16 AE9

IO177NB5F16 AA8

IO177PB5F16 Y8

IO178NB5F16 Y6

CG624/LG624

RTAX1000S/SL Function Pin

Number

IO178PB5F16 W6

IO179NB5F16 Y10

IO179PB5F16 W10

IO180NB5F16 Y7

IO180PB5F16 W7

IO181NB5F17 AD9

IO181PB5F17 AD10

IO182NB5F17 AE10

IO182PB5F17 AE11

IO183NB5F17 AD7

IO183PB5F17 AD8

IO184NB5F17 AB9

IO185NB5F17 AE6

IO185PB5F17 AE7

IO186NB5F17 AE4

IO186PB5F17 AE5

IO187NB5F17 AA9

IO187PB5F17 Y9

IO188NB5F17 U8

IO189NB5F17 AD5

IO189PB5F17 AD6

IO191NB5F17 AC5

IO191PB5F17 AC6

IO192NB5F17 AB7

IO192PB5F17 AC7

Bank 6

IO193NB6F18 U6

IO193PB6F18 U5

IO194NB6F18 Y3

IO194PB6F18 AA3

IO195NB6F18 V6

IO195PB6F18 W4

IO197NB6F18 R5

IO197PB6F18 U3

IO198NB6F18 P6

IO199NB6F18 Y5

IO199PB6F18 W5

CG624/LG624

RTAX1000S/SL Function Pin

Number

Package Pin Assignments

3-44 Revision 15

IO200NB6F18 V3

IO200PB6F18 W3

IO201NB6F18 T7

IO201PB6F18 U7

IO202NB6F18 V2

IO203NB6F19 W2

IO203PB6F19 Y2

IO204NB6F19 AA1

IO204PB6F19 AB1

IO205NB6F19 R6

IO205PB6F19 T6

IO206NB6F19 W1

IO206PB6F19 Y1

IO207NB6F19 T2

IO207PB6F19 U2

IO208NB6F19 T1

IO208PB6F19 U1

IO209NB6F19 AA2

IO209PB6F19 AB2

IO210NB6F19 P5

IO211NB6F19 M1

IO211PB6F19 N1

IO212NB6F19 P1

IO212PB6F19 R1

IO213NB6F19 R8

IO213PB6F19 T8

IO215NB6F20 U4

IO215PB6F20 V4

IO216NB6F20 P8

IO216PB6F20 R3

IO217NB6F20 P7

IO217PB6F20 R7

IO219NB6F20 R4

IO219PB6F20 T4

IO220NB6F20 P2

IO220PB6F20 R2

IO221NB6F20 N4

CG624/LG624

RTAX1000S/SL Function Pin

Number

IO221PB6F20 P4

IO223NB6F20 M2

IO223PB6F20 N2

IO224NB6F20 N3

IO224PB6F20 P3

Bank 7

IO225NB7F21 J2

IO225PB7F21 J1

IO226PB7F21 G2

IO227NB7F21 H3

IO227PB7F21 H2

IO229NB7F21 K2

IO229PB7F21 L2

IO230NB7F21 K1

IO230PB7F21 L1

IO231NB7F21 E2

IO231PB7F21 F2

IO232NB7F21 F1

IO232PB7F21 G1

IO233NB7F21 L3

IO233PB7F21 M3

IO234NB7F21 D1

IO234PB7F21 E1

IO235NB7F21 K4

IO235PB7F21 L4

IO236NB7F22 M6

IO237NB7F22 N8

IO237PB7F22 N7

IO238NB7F22 M5

IO239NB7F22 L6

IO239PB7F22 L5

IO240NB7F22 M4

IO241NB7F22 L7

IO241PB7F22 M7

IO242NB7F22 J3

IO243NB7F22 M9

IO243PB7F22 M8

CG624/LG624

RTAX1000S/SL Function Pin

Number

IO244NB7F22 P9

IO244PB7F22 N6

IO245NB7F22 K8

IO245PB7F22 L8

IO246NB7F22 F3

IO246PB7F22 E3

IO247NB7F23 K7

IO247PB7F23 K6

IO248NB7F23 D2

IO249NB7F23 G4

IO249PB7F23 G3

IO251NB7F23 N10

IO251PB7F23 N9

IO253NB7F23 H4

IO253PB7F23 J4

IO255NB7F23 J6

IO255PB7F23 J5

IO257NB7F23 H5

IO257PB7F23 H6

Dedicated I/O

GND K5

GND A18

GND A2

GND A24

GND A25

GND A8

GND AA10

GND AA16

GND AA18

GND AA21

GND AA5

GND AB22

GND AB4

GND AC10

GND AC16

GND AC23

GND AC3

CG624/LG624

RTAX1000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-45

GND AD1

GND AD2

GND AD24

GND AD25

GND AE1

GND AE18

GND AE2

GND AE24

GND AE25

GND AE8

GND B1

GND B2

GND B24

GND B25

GND C10

GND C16

GND C23

GND C3

GND D22

GND D4

GND E10

GND E16

GND E21

GND E5

GND E8

GND H1

GND H21

GND H25

GND K21

GND K23

GND K3

GND L11

GND L12

GND L13

GND L14

GND L15

GND M11

CG624/LG624

RTAX1000S/SL Function Pin

Number

GND M12

GND M13

GND M14

GND M15

GND N11

GND N12

GND N13

GND N14

GND N15

GND P11

GND P12

GND P13

GND P14

GND P15

GND R11

GND R12

GND R13

GND R14

GND R15

GND T21

GND T23

GND T3

GND T5

GND V1

GND V25

GND V5

NC A14

NC AA12

NC AA14

NC AA20

NC AB13

NC AD4

NC AE12

NC E12

NC E14

NC F12

NC F14

CG624/LG624

RTAX1000S/SL Function Pin

Number

NC F21

NC G10

NC H12

NC H14

NC J12

NC J14

NC U12

NC U14

NC V12

NC V14

NC Y12

NC Y14

PRA F13

PRB A13

PRC AB12

PRD AE13

TCK F5

TDI C5

TDO F6

TMS D6

TRST E6

VCCA AB20

VCCA F22

VCCA F4

VCCA J17

VCCA J9

VCCA K10

VCCA K11

VCCA K15

VCCA K16

VCCA L10

VCCA L16

VCCA R10

VCCA R16

VCCA T10

VCCA T11

VCCA T15

CG624/LG624

RTAX1000S/SL Function Pin

Number

Package Pin Assignments

3-46 Revision 15

VCCA T16

VCCA U17

VCCA U9

VCCA Y4

VCCDA A12

VCCDA AA13

VCCDA AA15

VCCDA AA7

VCCDA AC11

VCCDA AD11

VCCDA AE17

VCCDA B15

VCCDA C15

VCCDA C6

VCCDA D13

VCCDA E13

VCCDA E19

VCCDA G5

VCCDA N21

VCCDA N5

VCCDA W21

VCCIB0 A3

VCCIB0 B3

VCCIB0 C4

VCCIB0 D5

VCCIB0 J10

VCCIB0 J11

VCCIB0 K12

VCCIB1 A23

VCCIB1 B23

VCCIB1 C22

VCCIB1 D21

VCCIB1 J15

VCCIB1 J16

VCCIB1 K14

VCCIB2 C24

VCCIB2 C25

CG624/LG624

RTAX1000S/SL Function Pin

Number

VCCIB2 D23

VCCIB2 E22

VCCIB2 K17

VCCIB2 L17

VCCIB2 M16

VCCIB3 AA22

VCCIB3 AB23

VCCIB3 AC24

VCCIB3 AC25

VCCIB3 P16

VCCIB3 R17

VCCIB3 T17

VCCIB4 AB21

VCCIB4 AC22

VCCIB4 AD23

VCCIB4 AE23

VCCIB4 T14

VCCIB4 U15

VCCIB4 U16

VCCIB5 AB5

VCCIB5 AC4

VCCIB5 AD3

VCCIB5 AE3

VCCIB5 T12

VCCIB5 U10

VCCIB5 U11

VCCIB6 AA4

VCCIB6 AB3

VCCIB6 AC1

VCCIB6 AC2

VCCIB6 P10

VCCIB6 R9

VCCIB6 T9

VCCIB7 C1

VCCIB7 C2

VCCIB7 D3

VCCIB7 E4

CG624/LG624

RTAX1000S/SL Function Pin

Number

VCCIB7 K9

VCCIB7 L9

VCCIB7 M10

VPUMP E20

CG624/LG624

RTAX1000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-47

CG624/LG624

RTAX2000S/SL Function Pin

Number

Bank 0

IO00NB0F0 D7

IO00PB0F0 E7

IO01NB0F0 G7

IO01PB0F0 G6

IO02NB0F0 B5

IO02PB0F0 B4

IO04PB0F0 C7

IO05NB0F0 F8

IO05PB0F0 F7

IO06NB0F0 H8

IO06PB0F0 H7

IO11NB0F0 J8

IO11PB0F0 J7

IO12PB0F1 B6

IO13NB0F1 E9

IO13PB0F1 D8

IO15NB0F1 C9

IO15PB0F1 C8

IO16NB0F1 A5

IO16PB0F1 A4

IO17NB0F1 D10

IO17PB0F1 D9

IO18NB0F1 A7

IO18PB0F1 A6

IO19NB0F1 G9

IO19PB0F1 G8

IO20PB0F1 B7

IO23NB0F2 F10

IO23PB0F2 F9

IO26NB0F2 C11

IO26PB0F2 B8

IO27NB0F2 H10

IO27PB0F2 H9

IO28NB0F2 A9

IO28PB0F2 B9

IO30NB0F2 B11

IO30PB0F2 B10

IO31NB0F2 E11

IO31PB0F2 F11

IO33NB0F2 D12

IO33PB0F2 D11

IO34NB0F3 A11

IO34PB0F3 A10

IO37NB0F3 J13

IO37PB0F3 K13

IO38NB0F3 H11

IO38PB0F3 G11

IO40PB0F3 B12

IO41NB0F3/HCLKAN G13

IO41PB0F3/HCLKAP G12

IO42NB0F3/HCLKBN C13

IO42PB0F3/HCLKBP C12

Bank 1

IO43NB1F4/HCLKCN G15

IO43PB1F4/HCLKCP G14

IO44NB1F4/HCLKDN B14

IO44PB1F4/HCLKDP B13

IO45NB1F4 H13

IO47NB1F4 D14

IO47PB1F4 C14

IO48NB1F4 A16

IO48PB1F4 A15

IO49PB1F4 H15

IO51NB1F4 E15

IO51PB1F4 F15

IO52NB1F4 A17

IO55NB1F5 G16

IO55PB1F5 H16

IO56NB1F5 A20

IO56PB1F5 A19

IO57NB1F5 D16

IO57PB1F5 D15

IO58NB1F5 A22

CG624/LG624

RTAX2000S/SL Func tion Pin

Number

IO58PB1F5 A21

IO59NB1F5 F16

IO61NB1F5 G17

IO61PB1F5 H17

IO62NB1F5 B17

IO62PB1F5 B16

IO63NB1F5 H18

IO65NB1F6 C17

IO66PB1F6 B18

IO67NB1F6 J18

IO67PB1F6 J19

IO68NB1F6 B20

IO68PB1F6 B19

IO69NB1F6 E17

IO69PB1F6 F17

IO70NB1F6 B22

IO70PB1F6 B21

IO71PB1F6 G18

IO73NB1F6 G19

IO74NB1F6 C19

IO74PB1F6 C18

IO75NB1F6 D18

IO75PB1F6 D17

IO76NB1F7 C21

IO76PB1F7 C20

IO79NB1F7 H20

IO79PB1F7 H19

IO80NB1F7 E18

IO80PB1F7 F18

IO81NB1F7 G21

IO81PB1F7 G20

IO82NB1F7 F20

IO82PB1F7 F19

IO85NB1F7 D20

IO85PB1F7 D19

Bank 2

IO86NB2F8 F23

CG624/LG624

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-48 Revision 15

IO86PB2F8 E23

IO87NB2F8 H23

IO87PB2F8 G23

IO88NB2F8 E24

IO88PB2F8 D24

IO89NB2F8 M17

IO89PB2F8 G22

IO91NB2F8 J22

IO91PB2F8 H22

IO92NB2F8 L18

IO92PB2F8 K18

IO96NB2F9 G24

IO96PB2F9 F24

IO97NB2F9 J21

IO97PB2F9 J20

IO98PB2F9 J23

IO99NB2F9 L19

IO99PB2F9 K19

IO100NB2F9 E25

IO100PB2F9 D25

IO103PB2F9 K20

IO105NB2F9 M19

IO105PB2F9 M18

IO106NB2F9 J24

IO106PB2F9 H24

IO107NB2F10 L23

IO107PB2F10 N16

IO109NB2F10 L22

IO109PB2F10 K22

IO110NB2F10 G25

IO110PB2F10 F25

IO111NB2F10 L21

IO111PB2F10 L20

IO112NB2F10 L24

IO112PB2F10 K24

IO113NB2F10 N17

IO115NB2F10 M20

CG624/LG624

RTAX2000S/SL Function Pin

Number

IO115PB2F10 M21

IO117NB2F10 N19

IO117PB2F10 N18

IO118NB2F11 J25

IO121NB2F11 N24

IO121PB2F11 M24

IO122NB2F11 L25

IO122PB2F11 K25

IO123NB2F11 N22

IO123PB2F11 M22

IO124NB2F11 N23

IO124PB2F11 M23

IO127NB2F11 P18

IO127PB2F11 P17

IO128NB2F11 N25

IO128PB2F11 M25

Bank 3

IO129NB3F12 N20

IO130PB3F12 P24

IO131NB3F12 P21

IO133NB3F12 P20

IO133PB3F12 P19

IO138NB3F12 R23

IO138PB3F12 P23

IO139NB3F13 R22

IO139PB3F13 P22

IO141NB3F13 R19

IO142NB3F13 R25

IO142PB3F13 P25

IO143PB3F13 R21

IO145NB3F13 T18

IO145PB3F13 R18

IO146NB3F13 T24

IO146PB3F13 R24

IO147NB3F13 T20

IO147PB3F13 R20

IO148NB3F13 U25

CG624/LG624

RTAX2000S/SL Func tion Pin

Number

IO148PB3F13 T25

IO149NB3F13 T22

IO153NB3F14 U19

IO153PB3F14 T19

IO154NB3F14 Y25

IO154PB3F14 W25

IO157NB3F14 V20

IO157PB3F14 U20

IO158NB3F14 AB25

IO158PB3F14 AA25

IO160PB3F14 W24

IO161NB3F15 U24

IO161PB3F15 U23

IO162NB3F15 AA24

IO162PB3F15 Y24

IO163NB3F15 V22

IO163PB3F15 U22

IO164NB3F15 V23

IO164PB3F15 V24

IO166NB3F15 AB24

IO167NB3F15 V21

IO167PB3F15 U21

IO168NB3F15 Y23

IO168PB3F15 AA23

IO169NB3F15 W22

IO169PB3F15 W23

IO170NB3F15 Y22

IO170PB3F15 Y21

Bank 4

IO171NB4F16 AC20

IO171PB4F16 AC21

IO172NB4F16 W20

IO172PB4F16 Y20

IO173NB4F16 AD21

IO173PB4F16 AD22

IO174NB4F16 AA19

IO176NB4F16 Y18

CG624/LG624

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-49

IO176PB4F16 Y19

IO177NB4F16 AB19

IO177PB4F16 AB18

IO182NB4F17 V19

IO182PB4F17 W19

IO183PB4F17 AC19

IO184NB4F17 AB17

IO184PB4F17 AC17

IO185NB4F17 AD19

IO185PB4F17 AD20

IO187PB4F17 AC18

IO188NB4F17 Y17

IO188PB4F17 AA17

IO189PB4F17 AE22

IO191NB4F17 W18

IO191PB4F17 V18

IO192PB4F17 U18

IO195PB4F18 AE21

IO196NB4F18 AB16

IO197NB4F18 AD17

IO197PB4F18 AD18

IO198NB4F18 V17

IO198PB4F18 W17

IO199NB4F18 AE19

IO199PB4F18 AE20

IO200NB4F18 AC15

IO201NB4F18 AD15

IO201PB4F18 AD16

IO202NB4F18 Y15

IO202PB4F18 Y16

IO206NB4F19 AB14

IO206PB4F19 AB15

IO207NB4F19 AE15

IO207PB4F19 AE16

IO208PB4F19 W16

IO209NB4F19 AE14

IO210NB4F19 V15

CG624/LG624

RTAX2000S/SL Function Pin

Number

IO210PB4F19 V16

IO211NB4F19 AD14

IO211PB4F19 AC14

IO212NB4F19/CLKEN W14

IO212PB4F19/CLKEP W15

IO213NB4F19/CLKFN AC13

IO213PB4F19/CLKFP AD13

Bank 5

IO214NB5F20/CLKGN W13

IO214PB5F20/CLKGP Y13

IO215NB5F20/CLKHN AC12

IO215PB5F20/CLKHP AD12

IO216NB5F20 U13

IO216PB5F20 V13

IO217NB5F20 AE10

IO217PB5F20 AE11

IO218NB5F20 W11

IO218PB5F20 W12

IO222NB5F20 AA11

IO222PB5F20 Y11

IO223PB5F21 AE9

IO225NB5F21 AE6

IO225PB5F21 AE7

IO226NB5F21 Y10

IO226PB5F21 W10

IO227PB5F21 T13

IO228NB5F21 AB10

IO228PB5F21 AB11

IO229NB5F21 AD9

IO229PB5F21 AD10

IO230NB5F21 V11

IO233NB5F21 AD7

IO233PB5F21 AD8

IO234NB5F21 V9

IO234PB5F21 V10

IO236NB5F22 AC9

IO238NB5F22 W8

CG624/LG624

RTAX2000S/SL Func tion Pin

Number

IO238PB5F22 W9

IO239NB5F22 AE4

IO239PB5F22 AE5

IO240NB5F22 AB9

IO242NB5F22 AA9

IO242PB5F22 Y9

IO243NB5F22 AD5

IO243PB5F22 AD6

IO244NB5F22 U8

IO246NB5F23 AB8

IO246PB5F23 AC8

IO247NB5F23 AB7

IO247PB5F23 AC7

IO250NB5F23 AA8

IO250PB5F23 Y8

IO251NB5F23 V8

IO251PB5F23 V7

IO252NB5F23 Y7

IO252PB5F23 W7

IO253NB5F23 AC5

IO253PB5F23 AC6

IO254NB5F23 Y6

IO254PB5F23 W6

IO256NB5F23 AB6

IO256PB5F23 AA6

Bank 6

IO257NB6F24 Y3

IO257PB6F24 AA3

IO258NB6F24 V3

IO258PB6F24 W3

IO259NB6F24 AA2

IO259PB6F24 AB2

IO260NB6F24 V6

IO260PB6F24 W4

IO262NB6F24 U4

IO262PB6F24 V4

IO263NB6F24 Y5

CG624/LG624

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-50 Revision 15

IO263PB6F24 W5

IO268NB6F25 U6

IO268PB6F25 U5

IO269PB6F25 U3

IO272NB6F25 T2

IO272PB6F25 U2

IO273NB6F25 W2

IO273PB6F25 Y2

IO274NB6F25 R6

IO274PB6F25 T6

IO275NB6F25 T7

IO275PB6F25 U7

IO277NB6F25 V2

IO278NB6F26 R4

IO278PB6F26 T4

IO279PB6F26 R3

IO280NB6F26 R5

IO281NB6F26 AA1

IO281PB6F26 AB1

IO284NB6F26 R8

IO284PB6F26 T8

IO285NB6F26 W1

IO285PB6F26 Y1

IO286NB6F26 P2

IO286PB6F26 R2

IO287NB6F26 T1

IO287PB6F26 U1

IO288NB6F26 P5

IO290NB6F27 P6

IO291NB6F27 P1

IO291PB6F27 R1

IO292NB6F27 P7

IO292PB6F27 R7

IO293NB6F27 M1

IO293PB6F27 N1

IO294NB6F27 P8

IO296NB6F27 N3

CG624/LG624

RTAX2000S/SL Function Pin

Number

IO296PB6F27 P3

IO298NB6F27 N4

IO298PB6F27 P4

IO299NB6F27 M2

IO299PB6F27 N2

Bank 7

IO300NB7F28 P9

IO300PB7F28 N6

IO302NB7F28 M6

IO304NB7F28 N8

IO304PB7F28 N7

IO308NB7F28 M4

IO309NB7F28 L3

IO309PB7F28 M3

IO310NB7F29 N10

IO310PB7F29 N9

IO311NB7F29 K1

IO311PB7F29 L1

IO313NB7F29 M5

IO316NB7F29 L6

IO316PB7F29 L5

IO317NB7F29 K2

IO317PB7F29 L2

IO318NB7F29 K4

IO318PB7F29 L4

IO320NB7F29 J3

IO321NB7F30 J2

IO321PB7F30 J1

IO323NB7F30 L7

IO323PB7F30 M7

IO324NB7F30 M9

IO324PB7F30 M8

IO327NB7F30 F1

IO327PB7F30 G1

IO328NB7F30 K7

IO328PB7F30 K6

IO329NB7F30 D1

CG624/LG624

RTAX2000S/SL Func tion Pin

Number

IO329PB7F30 E1

IO331PB7F30 G2

IO332NB7F31 H3

IO332PB7F31 H2

IO333NB7F31 E2

IO333PB7F31 F2

IO334NB7F31 H4

IO334PB7F31 J4

IO335NB7F31 H5

IO335PB7F31 H6

IO337NB7F31 D2

IO338NB7F31 J6

IO338PB7F31 J5

IO339NB7F31 F3

IO339PB7F31 E3

IO340NB7F31 G4

IO340PB7F31 G3

IO341NB7F31 K8

IO341PB7F31 L8

Dedicated I/O

GND K5

GND A18

GND A2

GND A24

GND A25

GND A8

GND AA10

GND AA16

GND AA18

GND AA21

GND AA5

GND AB22

GND AB4

GND AC10

GND AC16

GND AC23

GND AC3

CG624/LG624

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-51

GND AD1

GND AD2

GND AD24

GND AD25

GND AE1

GND AE18

GND AE2

GND AE24

GND AE25

GND AE8

GND B1

GND B2

GND B24

GND B25

GND C10

GND C16

GND C23

GND C3

GND D22

GND D4

GND E10

GND E16

GND E21

GND E5

GND E8

GND H1

GND H21

GND H25

GND K21

GND K23

GND K3

GND L11

GND L12

GND L13

GND L14

GND L15

GND M11

CG624/LG624

RTAX2000S/SL Function Pin

Number

GND M12

GND M13

GND M14

GND M15

GND N11

GND N12

GND N13

GND N14

GND N15

GND P11

GND P12

GND P13

GND P14

GND P15

GND R11

GND R12

GND R13

GND R14

GND R15

GND T21

GND T23

GND T3

GND T5

GND V1

GND V25

GND V5

NC AA12

NC AA14

NC E12

NC E14

NC F12

NC F14

NC H12

NC H14

NC J12

NC J14

NC U12

CG624/LG624

RTAX2000S/SL Func tion Pin

Number

NC U14

NC V12

NC V14

NC Y12

NC Y14

PRA F13

PRB A13

PRC AB12

PRD AE13

TCK F5

TDI C5

TDO F6

TMS D6

TRST E6

VCCA AB20

VCCA F22

VCCA F4

VCCA J17

VCCA J9

VCCA K10

VCCA K11

VCCA K15

VCCA K16

VCCA L10

VCCA L16

VCCA R10

VCCA R16

VCCA T10

VCCA T11

VCCA T15

VCCA T16

VCCA U17

VCCA U9

VCCA Y4

VCCDA A12

VCCDA A14

VCCDA AA13

CG624/LG624

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-52 Revision 15

VCCDA AA15

VCCDA AA20

VCCDA AA7

VCCDA AB13

VCCDA AC11

VCCDA AD11

VCCDA AD4

VCCDA AE12

VCCDA AE17

VCCDA B15

VCCDA C15

VCCDA C6

VCCDA D13

VCCDA E13

VCCDA E19

VCCDA F21

VCCDA G10

VCCDA G5

VCCDA N21

VCCDA N5

VCCDA W21

VCCIB0 A3

VCCIB0 B3

VCCIB0 C4

VCCIB0 D5

VCCIB0 J10

VCCIB0 J11

VCCIB0 K12

VCCIB1 A23

VCCIB1 B23

VCCIB1 C22

VCCIB1 D21

VCCIB1 J15

VCCIB1 J16

VCCIB1 K14

VCCIB2 C24

VCCIB2 C25

CG624/LG624

RTAX2000S/SL Function Pin

Number

VCCIB2 D23

VCCIB2 E22

VCCIB2 K17

VCCIB2 L17

VCCIB2 M16

VCCIB3 AA22

VCCIB3 AB23

VCCIB3 AC24

VCCIB3 AC25

VCCIB3 P16

VCCIB3 R17

VCCIB3 T17

VCCIB4 AB21

VCCIB4 AC22

VCCIB4 AD23

VCCIB4 AE23

VCCIB4 T14

VCCIB4 U15

VCCIB4 U16

VCCIB5 AB5

VCCIB5 AC4

VCCIB5 AD3

VCCIB5 AE3

VCCIB5 T12

VCCIB5 U10

VCCIB5 U11

VCCIB6 AA4

VCCIB6 AB3

VCCIB6 AC1

VCCIB6 AC2

VCCIB6 P10

VCCIB6 R9

VCCIB6 T9

VCCIB7 C1

VCCIB7 C2

VCCIB7 D3

VCCIB7 E4

CG624/LG624

RTAX2000S/SL Func tion Pin

Number

VCCIB7 K9

VCCIB7 L9

VCCIB7 M10

VPUMP E20

CG624/LG624

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-53

CG1152/LG1152

Note

For Package Manufacturing and Environmental information, visit the Resource center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

12345678910111213141516171819202122232425262728293031323334

Package Pin Assignments

3-54 Revision 15

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

Bank 0

IO00NB0F0 D6

IO00PB0F0 C6

IO01NB0F0 H10

IO01PB0F0 H9

IO02NB0F0 F8

IO02PB0F0 G8

IO03NB0F0 A6

IO03PB0F0 B6

IO04NB0F0 C7

IO04PB0F0 D7

IO05NB0F0 K10

IO05PB0F0 J10

IO06NB0F0 F9

IO06PB0F0 G9

IO07NB0F0 F10

IO07PB0F0 G10

IO08NB0F0 E9

IO08PB0F0 E8

IO09NB0F0 J11

IO09PB0F0 K11

IO10NB0F0 C8

IO10PB0F0 D8

IO11NB0F0 K12

IO11PB0F0 J12

IO12NB0F1 G11

IO12PB0F1 H11

IO13NB0F1 G12

IO13PB0F1 H12

IO14NB0F1 A7

IO14PB0F1 B7

IO15NB0F1 H13

IO15PB0F1 J13

IO16NB0F1 C9

IO16PB0F1 D9

IO17NB0F1 F12

IO17PB0F1 F11

IO18NB0F1 E11

IO18PB0F1 E10

IO19NB0F1 F13

IO19PB0F1 G13

IO20NB0F1 A10

IO20PB0F1 A9

IO21NB0F1 K14

IO21PB0F1 K13

IO22NB0F2 B11

IO22PB0F2 B10

IO23NB0F2 C12

IO23PB0F2 C11

IO24NB0F2 A12

IO24PB0F2 A11

IO25NB0F2 H14

IO25PB0F2 J14

IO26NB0F2 D13

IO26PB0F2 D12

IO27NB0F2 F14

IO27PB0F2 G14

IO28NB0F2 E14

IO28PB0F2 E13

IO29NB0F2 B13

IO29PB0F2 B12

IO30NB0F2 C14

IO30PB0F2 C13

IO31NB0F2 H15

IO31PB0F2 J15

IO32NB0F2 A14

IO32PB0F2 B14

IO33NB0F2 K15

IO33PB0F2 L15

IO34NB0F3 D15

IO34PB0F3 D14

IO35NB0F3 A15

IO35PB0F3 B15

IO36NB0F3 B16

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO36PB0F3 A16

IO37NB0F3 G16

IO37PB0F3 G15

IO38NB0F3 D16

IO38PB0F3 C16

IO39NB0F3 K16

IO39PB0F3 L16

IO40NB0F3 D17

IO40PB0F3 C17

IO41NB0F3/HCLKAN E16

IO41PB0F3/HCLKAP F16

IO42NB0F3/HCLKBN G17

IO42PB0F3/HCLKBP F17

Bank 1

IO43NB1F4/HCLKCN G19

IO43PB1F4/HCLKCP G18

IO44NB1F4/HCLKDN E19

IO44PB1F4/HCLKDP F19

IO45NB1F4 C18

IO45PB1F4 D18

IO46NB1F4 A18

IO46PB1F4 B18

IO47NB1F4 K19

IO47PB1F4 L19

IO48NB1F4 C19

IO48PB1F4 D19

IO49NB1F4 K20

IO49PB1F4 L20

IO50NB1F4 A19

IO50PB1F4 B19

IO51NB1F4 H20

IO51PB1F4 J20

IO52NB1F4 B20

IO52PB1F4 A20

IO53NB1F4 F20

IO53PB1F4 E20

IO54NB1F5 B21

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-55

IO54PB1F5 A21

IO55NB1F5 K21

IO55PB1F5 J21

IO56NB1F5 D21

IO56PB1F5 C21

IO57NB1F5 G22

IO57PB1F5 G21

IO58NB1F5 E22

IO58PB1F5 E21

IO59NB1F5 D22

IO59PB1F5 C22

IO60NB1F5 B23

IO60PB1F5 A23

IO61NB1F5 H22

IO61PB1F5 H21

IO62NB1F5 C24

IO62PB1F5 C23

IO63NB1F5 F23

IO63PB1F5 F22

IO64NB1F6 B24

IO64PB1F6 A24

IO65NB1F6 J22

IO65PB1F6 K22

IO66NB1F6 B25

IO66PB1F6 A25

IO67NB1F6 K23

IO67PB1F6 J23

IO68NB1F6 F24

IO68PB1F6 E24

IO69NB1F6 C27

IO69PB1F6 C26

IO70NB1F6 H24

IO70PB1F6 G24

IO71NB1F6 H23

IO71PB1F6 G23

IO72NB1F6 B28

IO72PB1F6 A28

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO73NB1F6 E26

IO73PB1F6 E25

IO74NB1F6 F26

IO74PB1F6 F25

IO75NB1F6 K25

IO75PB1F6 K24

IO76NB1F7 D27

IO76PB1F7 D26

IO77NB1F7 B29

IO77PB1F7 A29

IO78NB1F7 D28

IO78PB1F7 C28

IO79NB1F7 H25

IO79PB1F7 G25

IO80NB1F7 F27

IO80PB1F7 E27

IO81NB1F7 J25

IO81PB1F7 J24

IO82NB1F7 D29

IO82PB1F7 C29

IO83NB1F7 H26

IO83PB1F7 G26

IO84NB1F7 F28

IO84PB1F7 E28

IO85NB1F7 H27

IO85PB1F7 G27

Bank 2

IO86NB2F8 J28

IO86PB2F8 J27

IO87NB2F8 M25

IO87PB2F8 L25

IO88NB2F8 L26

IO88PB2F8 K26

IO89NB2F8 G31

IO89PB2F8 F31

IO90NB2F8 H29

IO90PB2F8 G29

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO91NB2F8 K28

IO91PB2F8 K27

IO92NB2F8 J30

IO92PB2F8 H30

IO93NB2F8 L28

IO93PB2F8 L27

IO94NB2F8 K29

IO94PB2F8 J29

IO95NB2F8 K31

IO95PB2F8 J31

IO96NB2F9 J32

IO96PB2F9 H32

IO97NB2F9 M27

IO97PB2F9 M26

IO98NB2F9 L30

IO98PB2F9 K30

IO99NB2F9 N25

IO99PB2F9 N26

IO100NB2F9 M29

IO100PB2F9 L29

IO101NB2F9 L33

IO101PB2F9 L32

IO102NB2F9 K34

IO102PB2F9 K33

IO103NB2F9 N28

IO103PB2F9 M28

IO104NB2F9 M34

IO104PB2F9 L34

IO105NB2F9 P27

IO105PB2F9 N27

IO106NB2F9 M32

IO106PB2F9 M31

IO107NB2F10 P25

IO107PB2F10 P26

IO108NB2F10 N33

IO108PB2F10 M33

IO109NB2F10 P29

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-56 Revision 15

IO109PB2F10 N29

IO110NB2F10 P30

IO110PB2F10 N30

IO111NB2F10 R24

IO111PB2F10 R25

IO112NB2F10 P31

IO112PB2F10 N31

IO113NB2F10 R28

IO113PB2F10 P28

IO114NB2F10 P32

IO114PB2F10 N32

IO115NB2F10 R30

IO115PB2F10 R29

IO116NB2F10 P34

IO116PB2F10 P33

IO117NB2F10 R27

IO117PB2F10 R26

IO118NB2F11 R34

IO118PB2F11 R33

IO119NB2F11 T24

IO119PB2F11 T25

IO120NB2F11 T33

IO120PB2F11 T34

IO121NB2F11 T27

IO121PB2F11 T26

IO122NB2F11 T30

IO122PB2F11 T29

IO123NB2F11 U28

IO123PB2F11 T28

IO124NB2F11 T31

IO124PB2F11 T32

IO125NB2F11 U24

IO125PB2F11 U25

IO126NB2F11 U33

IO126PB2F11 U34

IO127NB2F11 U26

IO127PB2F11 U27

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO128NB2F11 U31

IO128PB2F11 U32

Bank 3

IO129NB3F12 V29

IO129PB3F12 U29

IO130NB3F12 V31

IO130PB3F12 V32

IO131NB3F12 V24

IO131PB3F12 V25

IO132NB3F12 W28

IO132PB3F12 V28

IO133NB3F12 W26

IO133PB3F12 V26

IO134NB3F12 W33

IO134PB3F12 V33

IO135NB3F12 W25

IO135PB3F12 W24

IO136NB3F12 W31

IO136PB3F12 W32

IO137NB3F12 Y30

IO137PB3F12 W30

IO138NB3F12 Y29

IO138PB3F12 W29

IO139NB3F13 Y27

IO139PB3F13 W27

IO140NB3F13 AA33

IO140PB3F13 Y33

IO141NB3F13 Y25

IO141PB3F13 Y24

IO142NB3F13 AA31

IO142PB3F13 Y31

IO143NB3F13 AA28

IO143PB3F13 Y28

IO144NB3F13 AA34

IO144PB3F13 Y34

IO145NB3F13 AA26

IO145PB3F13 Y26

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO146NB3F13 AA29

IO146PB3F13 AA30

IO147NB3F13 AB30

IO147PB3F13 AB29

IO148NB3F13 AB32

IO148PB3F13 AA32

IO149NB3F13 AB27

IO149PB3F13 AA27

IO150NB3F14 AC31

IO150PB3F14 AB31

IO151NB3F14 AD33

IO151PB3F14 AC33

IO152NB3F14 AC28

IO152PB3F14 AB28

IO153NB3F14 AB25

IO153PB3F14 AA25

IO154NB3F14 AD32

IO154PB3F14 AC32

IO155NB3F14 AD29

IO155PB3F14 AC29

IO156NB3F14 AE30

IO156PB3F14 AD30

IO157NB3F14 AC26

IO157PB3F14 AB26

IO158NB3F14 AH33

IO158PB3F14 AG33

IO159NB3F14 AD27

IO159PB3F14 AC27

IO160NB3F14 AG32

IO160PB3F14 AF32

IO161NB3F15 AG31

IO161PB3F15 AF31

IO162NB3F15 AF29

IO162PB3F15 AE29

IO163NB3F15 AE28

IO163PB3F15 AD28

IO164NB3F15 AG30

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-57

IO164PB3F15 AF30

IO165NB3F15 AE26

IO165PB3F15 AD26

IO166NB3F15 AJ30

IO166PB3F15 AH30

IO167NB3F15 AG28

IO167PB3F15 AF28

IO168NB3F15 AF27

IO168PB3F15 AE27

IO169NB3F15 AH29

IO169PB3F15 AG29

IO170NB3F15 AD25

IO170PB3F15 AC25

Bank 4

IO171NB4F16 AP29

IO171PB4F16 AN29

IO172NB4F16 AH26

IO172PB4F16 AH27

IO173NB4F16 AJ27

IO173PB4F16 AJ28

IO174NB4F16 AL27

IO174PB4F16 AL28

IO175NB4F16 AM28

IO175PB4F16 AM29

IO176NB4F16 AG25

IO176PB4F16 AG26

IO177NB4F16 AK26

IO177PB4F16 AK27

IO178NB4F16 AF25

IO178PB4F16 AE25

IO179NB4F16 AP28

IO179PB4F16 AN28

IO180NB4F16 AJ25

IO180PB4F16 AJ26

IO181NB4F17 AM26

IO181PB4F17 AM27

IO182NB4F17 AF24

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO182PB4F17 AE24

IO183NB4F17 AH24

IO183PB4F17 AH25

IO184NB4F17 AG23

IO184PB4F17 AG24

IO185NB4F17 AL25

IO185PB4F17 AL26

IO186NB4F17 AP25

IO186PB4F17 AP26

IO187NB4F17 AK24

IO187PB4F17 AK25

IO188NB4F17 AF23

IO188PB4F17 AE23

IO189NB4F17 AN24

IO189PB4F17 AM24

IO190NB4F17 AH22

IO190PB4F17 AH23

IO191NB4F17 AJ23

IO191PB4F17 AJ24

IO192NB4F17 AG21

IO192PB4F17 AG22

IO193NB4F18 AP23

IO193PB4F18 AP24

IO194NB4F18 AN22

IO194PB4F18 AN23

IO195NB4F18 AM23

IO195PB4F18 AL23

IO196NB4F18 AF21

IO196PB4F18 AF22

IO197NB4F18 AL22

IO197PB4F18 AM22

IO198NB4F18 AE21

IO198PB4F18 AE22

IO199NB4F18 AJ21

IO199PB4F18 AJ22

IO200NB4F18 AK21

IO200PB4F18 AK22

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO201NB4F18 AM21

IO201PB4F18 AL21

IO202NB4F18 AE20

IO202PB4F18 AD20

IO203NB4F19 AN21

IO203PB4F19 AP21

IO204NB4F19 AP20

IO204PB4F19 AN20

IO205NB4F19 AN19

IO205PB4F19 AP19

IO206NB4F19 AG20

IO206PB4F19 AF20

IO207NB4F19 AL19

IO207PB4F19 AL20

IO208NB4F19 AG19

IO208PB4F19 AF19

IO209NB4F19 AN18

IO209PB4F19 AP18

IO210NB4F19 AE19

IO210PB4F19 AD19

IO211NB4F19 AL18

IO211PB4F19 AM18

IO212NB4F19/CLKEN AJ20

IO212PB4F19/CLKEP AK20

IO213NB4F19/CLKFN AJ18

IO213PB4F19/CLKFP AJ19

Bank 5

IO214NB5F20/CLKGN AJ16

IO214PB5F20/CLKGP AJ17

IO215NB5F20/CLKHN AJ15

IO215PB5F20/CLKHP AK15

IO216NB5F20 AD16

IO216PB5F20 AE17

IO217NB5F20 AM17

IO217PB5F20 AL17

IO218NB5F20 AG16

IO218PB5F20 AF16

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-58 Revision 15

IO219NB5F20 AM16

IO219PB5F20 AL16

IO220NB5F20 AP16

IO220PB5F20 AN16

IO221NB5F20 AN15

IO221PB5F20 AP15

IO222NB5F20 AD15

IO222PB5F20 AE16

IO223NB5F21 AL14

IO223PB5F21 AL15

IO224NB5F21 AN14

IO224PB5F21 AP14

IO225NB5F21 AK13

IO225PB5F21 AK14

IO226NB5F21 AE15

IO226PB5F21 AF15

IO227NB5F21 AG14

IO227PB5F21 AG15

IO228NB5F21 AJ13

IO228PB5F21 AJ14

IO229NB5F21 AM13

IO229PB5F21 AM14

IO230NB5F21 AE14

IO230PB5F21 AF14

IO231NB5F21 AN12

IO231PB5F21 AP12

IO232NB5F21 AG13

IO232PB5F21 AH13

IO233NB5F21 AL12

IO233PB5F21 AL13

IO234NB5F21 AE13

IO234PB5F21 AF13

IO235NB5F22 AN11

IO235PB5F22 AP11

IO236NB5F22 AM11

IO236PB5F22 AM12

IO237NB5F22 AJ11

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO237PB5F22 AJ12

IO238NB5F22 AH11

IO238PB5F22 AH12

IO239NB5F22 AK10

IO239PB5F22 AK11

IO240NB5F22 AE12

IO240PB5F22 AF12

IO241NB5F22 AN10

IO241PB5F22 AP10

IO242NB5F22 AG11

IO242PB5F22 AG12

IO243NB5F22 AL9

IO243PB5F22 AL10

IO244NB5F22 AM8

IO244PB5F22 AM9

IO245NB5F23 AH10

IO245PB5F23 AJ10

IO246NB5F23 AF10

IO246PB5F23 AF11

IO247NB5F23 AJ9

IO247PB5F23 AK9

IO248NB5F23 AN7

IO248PB5F23 AP7

IO249NB5F23 AL7

IO249PB5F23 AL8

IO250NB5F23 AE10

IO250PB5F23 AE11

IO251NB5F23 AK8

IO251PB5F23 AJ8

IO252NB5F23 AH8

IO252PB5F23 AH9

IO253NB5F23 AN6

IO253PB5F23 AP6

IO254NB5F23 AG9

IO254PB5F23 AG10

IO255NB5F23 AJ7

IO255PB5F23 AK7

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO256NB5F23 AL6

IO256PB5F23 AM6

Bank 6

IO257NB6F24 AG6

IO257PB6F24 AH6

IO258NB6F24 AD9

IO258PB6F24 AE9

IO259NB6F24 AF7

IO259PB6F24 AG7

IO260NB6F24 AH3

IO260PB6F24 AH4

IO261NB6F24 AH5

IO261PB6F24 AJ5

IO262NB6F24 AE6

IO262PB6F24 AF6

IO263NB6F24 AF5

IO263PB6F24 AG5

IO264NB6F24 AD8

IO264PB6F24 AE8

IO265NB6F24 AF3

IO265PB6F24 AG3

IO266NB6F24 AC10

IO266PB6F24 AD10

IO267NB6F25 AD7

IO267PB6F25 AE7

IO268NB6F25 AD5

IO268PB6F25 AE5

IO269NB6F25 AE4

IO269PB6F25 AF4

IO270NB6F25 AB9

IO270PB6F25 AC9

IO271NB6F25 AC6

IO271PB6F25 AD6

IO272NB6F25 AB8

IO272PB6F25 AC8

IO273NB6F25 AE1

IO273PB6F25 AE2

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-59

IO274NB6F25 AA10

IO274PB6F25 AB10

IO275NB6F25 AB7

IO275PB6F25 AC7

IO276NB6F25 AD1

IO276PB6F25 AD2

IO277NB6F25 AC4

IO277PB6F25 AC3

IO278NB6F26 AA8

IO278PB6F26 AA9

IO279NB6F26 AB5

IO279PB6F26 AB6

IO280NB6F26 Y10

IO280PB6F26 Y11

IO281NB6F26 AB3

IO281PB6F26 AB4

IO282NB6F26 Y7

IO282PB6F26 AA7

IO283NB6F26 AC2

IO283PB6F26 AC1

IO284NB6F26 Y9

IO284PB6F26 Y8

IO285NB6F26 AA5

IO285PB6F26 AA6

IO286NB6F26 W10

IO286PB6F26 W11

IO287NB6F26 AA3

IO287PB6F26 AA4

IO288NB6F26 W9

IO288PB6F26 W8

IO289NB6F27 AA1

IO289PB6F27 AA2

IO290NB6F27 W6

IO290PB6F27 Y6

IO291NB6F27 W5

IO291PB6F27 Y5

IO292NB6F27 V7

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO292PB6F27 W7

IO293NB6F27 W4

IO293PB6F27 Y4

IO294NB6F27 V10

IO294PB6F27 V11

IO295NB6F27 Y1

IO295PB6F27 Y2

IO296NB6F27 W1

IO296PB6F27 W2

IO297NB6F27 V1

IO297PB6F27 V2

IO298NB6F27 V9

IO298PB6F27 V8

IO299NB6F27 U4

IO299PB6F27 V4

Bank 7

IO300NB7F28 U10

IO300PB7F28 U11

IO301NB7F28 U2

IO301PB7F28 U1

IO302NB7F28 U6

IO302PB7F28 U7

IO303NB7F28 T3

IO303PB7F28 U3

IO304NB7F28 U9

IO304PB7F28 U8

IO305NB7F28 R2

IO305PB7F28 R1

IO306NB7F28 R4

IO306PB7F28 T4

IO307NB7F28 R5

IO307PB7F28 T5

IO308NB7F28 T11

IO308PB7F28 T10

IO309NB7F28 T6

IO309PB7F28 T7

IO310NB7F29 T9

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

IO310PB7F29 T8

IO311NB7F29 N3

IO311PB7F29 P3

IO312NB7F29 P7

IO312PB7F29 R7

IO313NB7F29 P6

IO313PB7F29 R6

IO314NB7F29 M2

IO314PB7F29 N2

IO315NB7F29 N4

IO315PB7F29 P4

IO316NB7F29 R9

IO316PB7F29 R8

IO317NB7F29 N5

IO317PB7F29 P5

IO318NB7F29 R10

IO318PB7F29 R11

IO319NB7F29 L2

IO319PB7F29 L1

IO320NB7F29 N8

IO320PB7F29 P8

IO321NB7F30 M6

IO321PB7F30 N6

IO322NB7F30 P10

IO322PB7F30 P9

IO323NB7F30 L3

IO323PB7F30 M3

IO324NB7F30 M7

IO324PB7F30 N7

IO325NB7F30 K2

IO325PB7F30 K1

IO326NB7F30 G2

IO326PB7F30 H2

IO327NB7F30 L6

IO327PB7F30 L5

IO328NB7F30 N10

IO328PB7F30 N9

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-60 Revision 15

IO329NB7F30 J4

IO329PB7F30 K4

IO330NB7F30 J5

IO330PB7F30 K5

IO331NB7F30 M10

IO331PB7F30 M9

IO332NB7F31 L8

IO332PB7F31 M8

IO333NB7F31 F2

IO333PB7F31 F1

IO334NB7F31 J6

IO334PB7F31 K6

IO335NB7F31 H4

IO335PB7F31 H3

IO336NB7F31 K7

IO336PB7F31 L7

IO337NB7F31 G4

IO337PB7F31 G3

IO338NB7F31 K9

IO338PB7F31 L9

IO339NB7F31 H6

IO339PB7F31 H5

IO340NB7F31 H7

IO340PB7F31 J7

IO341NB7F31 J8

IO341PB7F31 K8

Dedicated I/O

GND A13

GND A2

GND A22

GND A27

GND A3

GND A31

GND A32

GND A33

GND A4

GND A8

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

GND AA14

GND AA15

GND AA16

GND AA17

GND AA18

GND AA19

GND AA20

GND AA21

GND AB1

GND AB13

GND AB22

GND AB34

GND AC12

GND AC23

GND AC30

GND AC5

GND AD11

GND AD24

GND AD31

GND AD4

GND AE3

GND AE32

GND AF2

GND AF33

GND AG1

GND AG27

GND AG34

GND AG8

GND AH28

GND AH7

GND AJ29

GND AJ6

GND AK12

GND AK17

GND AK18

GND AK23

GND AK30

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

GND AK5

GND AL1

GND AL11

GND AL2

GND AL24

GND AL3

GND AL31

GND AL32

GND AL33

GND AL34

GND AL4

GND AM1

GND AM10

GND AM15

GND AM2

GND AM20

GND AM25

GND AM3

GND AM31

GND AM32

GND AM33

GND AM34

GND AM4

GND AN1

GND AN2

GND AN26

GND AN3

GND AN31

GND AN32

GND AN33

GND AN34

GND AN4

GND AN9

GND AP13

GND AP2

GND AP22

GND AP27

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-61

GND AP3

GND AP31

GND AP32

GND AP33

GND AP4

GND AP8

GND B1

GND B2

GND B26

GND B3

GND B31

GND B32

GND B33

GND B34

GND B4

GND B9

GND C1

GND C10

GND C15

GND C2

GND C20

GND C25

GND C3

GND C31

GND C32

GND C33

GND C34

GND C4

GND D1

GND D11

GND D2

GND D24

GND D3

GND D31

GND D32

GND D33

GND D34

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

GND D4

GND E12

GND E17

GND E18

GND E23

GND E30

GND E5

GND F29

GND F30

GND F6

GND G28

GND G6

GND G7

GND H1

GND H34

GND J2

GND J33

GND K3

GND K32

GND L11

GND L24

GND L31

GND L4

GND M12

GND M23

GND M30

GND M5

GND N1

GND N13

GND N22

GND N34

GND P14

GND P15

GND P16

GND P17

GND P18

GND P19

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

GND P20

GND P21

GND R14

GND R15

GND R16

GND R17

GND R18

GND R19

GND R20

GND R21

GND R3

GND R32

GND T14

GND T15

GND T16

GND T17

GND T18

GND T19

GND T20

GND T21

GND U14

GND U15

GND U16

GND U17

GND U18

GND U19

GND U20

GND U21

GND U30

GND U5

GND V14

GND V15

GND V16

GND V17

GND V18

GND V19

GND V20

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-62 Revision 15

GND V21

GND V30

GND V5

GND W14

GND W15

GND W16

GND W17

GND W18

GND W19

GND W20

GND W21

GND Y14

GND Y15

GND Y16

GND Y17

GND Y18

GND Y19

GND Y20

GND Y21

GND Y3

GND Y32

NC A17

NC A26

NC AB2

NC AB33

NC AC34

NC AD17

NC AD3

NC AD34

NC AE18

NC AE31

NC AE33

NC AE34

NC AF1

NC AF17

NC AF18

NC AF34

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

NC AG2

NC AG4

NC AH1

NC AH16

NC AH19

NC AH2

NC AH31

NC AH32

NC AH34

NC AJ1

NC AJ2

NC AJ3

NC AJ31

NC AJ32

NC AJ33

NC AJ34

NC AJ4

NC AK16

NC AK19

NC AL29

NC AM19

NC AM7

NC AN13

NC AN17

NC AN25

NC AN27

NC AN8

NC AP17

NC AP9

NC B17

NC B22

NC B27

NC B8

NC D10

NC D20

NC D23

NC D25

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

NC F3

NC F32

NC F33

NC F34

NC F4

NC G1

NC G32

NC G33

NC G34

NC H16

NC H19

NC H31

NC H33

NC J1

NC J16

NC J19

NC J3

NC J34

NC K17

NC K18

NC L17

NC L18

NC M1

NC M4

NC P1

NC P2

NC R31

NC T1

NC T2

NC V3

NC V34

NC W3

NC W34

PRA J17

PRB F18

PRC AD18

PRD AH18

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-63

TCK J9

TDI F7

TDO L10

TMS H8

TRST E6

VCCA AA13

VCCA AA22

VCCA AB14

VCCA AB15

VCCA AB16

VCCA AB17

VCCA AB18

VCCA AB19

VCCA AB20

VCCA AB21

VCCA AF8

VCCA AK28

VCCA G30

VCCA G5

VCCA N14

VCCA N15

VCCA N16

VCCA N17

VCCA N18

VCCA N19

VCCA N20

VCCA N21

VCCA P13

VCCA P22

VCCA R13

VCCA R22

VCCA T13

VCCA T22

VCCA U13

VCCA U22

VCCA V13

VCCA V22

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

VCCA W13

VCCA W22

VCCA Y13

VCCA Y22

VCCDA AF26

VCCDA AF9

VCCDA AG17

VCCDA AG18

VCCDA AH14

VCCDA AH15

VCCDA AH17

VCCDA AH20

VCCDA AH21

VCCDA AK29

VCCDA AK6

VCCDA E15

VCCDA E29

VCCDA E7

VCCDA F15

VCCDA F21

VCCDA F5

VCCDA G20

VCCDA H17

VCCDA H18

VCCDA H28

VCCDA J18

VCCDA V27

VCCDA V6

VCCIB0 A5

VCCIB0 B5

VCCIB0 C5

VCCIB0 D5

VCCIB0 L12

VCCIB0 L13

VCCIB0 L14

VCCIB0 M13

VCCIB0 M14

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

VCCIB0 M15

VCCIB0 M16

VCCIB0 M17

VCCIB1 A30

VCCIB1 B30

VCCIB1 C30

VCCIB1 D30

VCCIB1 L21

VCCIB1 L22

VCCIB1 L23

VCCIB1 M18

VCCIB1 M19

VCCIB1 M20

VCCIB1 M21

VCCIB1 M22

VCCIB2 E31

VCCIB2 E32

VCCIB2 E33

VCCIB2 E34

VCCIB2 M24

VCCIB2 N23

VCCIB2 N24

VCCIB2 P23

VCCIB2 P24

VCCIB2 R23

VCCIB2 T23

VCCIB2 U23

VCCIB3 AA23

VCCIB3 AA24

VCCIB3 AB23

VCCIB3 AB24

VCCIB3 AC24

VCCIB3 AK31

VCCIB3 AK32

VCCIB3 AK33

VCCIB3 AK34

VCCIB3 V23

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

Package Pin Assignments

3-64 Revision 15

VCCIB3 W23

VCCIB3 Y23

VCCIB4 AC18

VCCIB4 AC19

VCCIB4 AC20

VCCIB4 AC21

VCCIB4 AC22

VCCIB4 AD21

VCCIB4 AD22

VCCIB4 AD23

VCCIB4 AL30

VCCIB4 AM30

VCCIB4 AN30

VCCIB4 AP30

VCCIB5 AC13

VCCIB5 AC14

VCCIB5 AC15

VCCIB5 AC16

VCCIB5 AC17

VCCIB5 AD12

VCCIB5 AD13

VCCIB5 AD14

VCCIB5 AL5

VCCIB5 AM5

VCCIB5 AN5

VCCIB5 AP5

VCCIB6 AA11

VCCIB6 AA12

VCCIB6 AB11

VCCIB6 AB12

VCCIB6 AC11

VCCIB6 AK1

VCCIB6 AK2

VCCIB6 AK3

VCCIB6 AK4

VCCIB6 V12

VCCIB6 W12

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

VCCIB6 Y12

VCCIB7 E1

VCCIB7 E2

VCCIB7 E3

VCCIB7 E4

VCCIB7 M11

VCCIB7 N11

VCCIB7 N12

VCCIB7 P11

VCCIB7 P12

VCCIB7 R12

VCCIB7 T12

VCCIB7 U12

VPUMP J26

CG1152/LG1152

RTAX2000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-65

CG1272/LG1272

Note

For Package Manufacturing and Environmental information, visit the Resource center at

http://www.microsemi.com/soc/products/solutions/package/docs.aspx.

35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 13 2

Package Pin Assignments

3-66 Revision 15

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

Bank 0

IO00NB0F0 E9

IO00PB0F0 D9

IO01NB0F0 D8

IO01PB0F0 D7

IO02NB0F0 J10

IO02PB0F0 J9

IO03NB0F0 E7

IO03PB0F0 E8

IO04NB0F0 F9

IO04PB0F0 G9

IO05NB0F0 B7

IO05PB0F0 B6

IO06NB0F0 L13

IO06PB0F0 L12

IO07NB0F0 C7

IO07PB0F0 C6

IO08NB0F0 F10

IO08PB0F0 G10

IO09NB0F0 D10

IO09PB0F0 E10

IO10NB0F0 H11

IO10PB0F0 H10

IO11NB0F0 A5

IO11PB0F0 A4

IO12NB0F1 D6

IO12PB0F1 D5

IO13NB0F1 A7

IO13PB0F1 A6

IO14NB0F1 J12

IO14PB0F1 J11

IO15NB0F1 D12

IO15PB0F1 D11

IO16NB0F1 F12

IO16PB0F1 G12

IO17NB0F1 E12

IO17PB0F1 E11

IO18NB0F1 K13

IO18PB0F1 K12

IO19NB0F1 B4

IO19PB0F1 C4

IO20NB0F1 H13

IO20PB0F1 H12

IO21NB0F2 C13

IO21PB0F2 C12

IO22NB0F2 M14

IO22PB0F2 M13

IO23NB0F2 B10

IO23PB0F2 B9

IO24NB0F2 J14

IO24PB0F2 J13

IO25NB0F2 A8

IO25PB0F2 A9

IO26NB0F2 G13

IO26PB0F2 F13

IO27NB0F2 D14

IO27PB0F2 D13

IO28NB0F2 L16

IO28PB0F2 L15

IO29NB0F2 B13

IO29PB0F2 B12

IO30NB0F2 C10

IO30PB0F2 C9

IO31NB0F2 E15

IO31PB0F2 E14

IO32NB0F2 K15

IO32PB0F2 K16

IO33NB0F3 A13

IO33PB0F3 A12

IO34NB0F3 G15

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO34PB0F3 F15

IO35NB0F3 C15

IO35PB0F3 D15

IO36NB0F3 J16

IO36PB0F3 J15

IO37NB0F3 A11

IO37PB0F3 A10

IO38NB0F3 H15

IO38PB0F3 H14

IO39NB0F3 B16

IO39PB0F3 B15

IO40NB0F3 M16

IO40PB0F3 M17

IO41NB0F3 E16

IO41PB0F3 F16

IO42NB0F4 H17

IO42PB0F4 J17

IO43NB0F4 A14

IO43PB0F4 A15

IO44NB0F4 G16

IO44PB0F4 H16

IO45NB0F4 A17

IO45PB0F4 A16

IO46NB0F4 M18

IO46PB0F4 M19

IO47NB0F4 E18

IO47PB0F4 E17

IO48NB0F4 G18

IO48PB0F4 H18

IO49NB0F4 C18

IO49PB0F4 B18

IO50NB0F4/HCLKAN J18

IO50PB0F4/HCLKAP K18

IO51NB0F4/HCLKBN D18

IO51PB0F4/HCLKBP D17

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-67

Bank 1

IO52NB1F6/HCLKCN K19

IO52PB1F6/HCLKCP J19

IO53NB1F6/HCLKDN D20

IO53PB1F6/HCLKDP D19

IO54NB1F6 H19

IO54PB1F6 G19

IO55NB1F6 B19

IO55PB1F6 C19

IO56NB1F6 M20

IO56PB1F6 M21

IO57NB1F6 E20

IO57PB1F6 E19

IO58NB1F6 H21

IO58PB1F6 G21

IO59NB1F6 A21

IO59PB1F6 A20

IO60NB1F7 H20

IO60PB1F7 J20

IO61NB1F7 A22

IO61PB1F7 A23

IO62NB1F7 D32

IO62PB1F7 D31

IO63NB1F7 F21

IO63PB1F7 E21

IO64NB1F7 J22

IO64PB1F7 J21

IO65NB1F7 B22

IO65PB1F7 B21

IO66NB1F7 H23

IO66PB1F7 H22

IO67NB1F7 D22

IO67PB1F7 C22

IO68NB1F7 K22

IO68PB1F7 K21

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO69NB1F7 A27

IO69PB1F7 A26

IO70NB1F7 F22

IO70PB1F7 G22

IO71NB1F7 E23

IO71PB1F7 E22

IO72NB1F8 L22

IO72PB1F8 L21

IO73NB1F8 A25

IO73PB1F8 A24

IO74NB1F8 C28

IO74PB1F8 C27

IO75NB1F8 D24

IO75PB1F8 D23

IO76NB1F8 J24

IO76PB1F8 J23

IO77NB1F8 B25

IO77PB1F8 B24

IO78NB1F8 F24

IO78PB1F8 G24

IO79NB1F8 A28

IO79PB1F8 A29

IO80NB1F8 M24

IO80PB1F8 M23

IO81NB1F8 B28

IO81PB1F8 B27

IO82NB1F9 H25

IO82PB1F9 H24

IO83NB1F9 C25

IO83PB1F9 C24

IO84NB1F9 K25

IO84PB1F9 K24

IO85NB1F9 A33

IO85PB1F9 A32

IO86NB1F9 G25

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO86PB1F9 F25

IO87NB1F9 E26

IO87PB1F9 E25

IO88NB1F9 J26

IO88PB1F9 J25

IO89NB1F9 D26

IO89PB1F9 D25

IO90NB1F9 E31

IO90PB1F9 E32

IO91NB1F9 A31

IO91PB1F9 A30

IO92NB1F9 H27

IO92PB1F9 H26

IO93NB1F9 C33

IO93PB1F9 B33

IO94NB1F10 G27

IO94PB1F10 F27

IO95NB1F10 E27

IO95PB1F10 D27

IO96NB1F10 L24

IO96PB1F10 L25

IO97NB1F10 C31

IO97PB1F10 C30

IO98NB1F10 F28

IO98PB1F10 G28

IO99NB1F10 B31

IO99PB1F10 B30

IO100NB1F10 J28

IO100PB1F10 J27

IO101NB1F10 E29

IO101PB1F10 E30

IO102NB1F10 D28

IO102PB1F10 E28

IO103NB1F10 D30

IO103PB1F10 D29

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

Package Pin Assignments

3-68 Revision 15

Bank 2

IO104NB2F12 L29

IO104PB2F12 L28

IO105NB2F12 D35

IO105PB2F12 D34

IO106NB2F12 H33

IO106PB2F12 J33

IO107NB2F12 F34

IO107PB2F12 F33

IO108NB2F12 G33

IO108PB2F12 G32

IO109NB2F12 M28

IO109PB2F12 M27

IO110NB2F12 K33

IO110PB2F12 K32

IO111NB2F12 K31

IO111PB2F12 K30

IO112NB2F13 K34

IO112PB2F13 J34

IO113NB2F13 N26

IO113PB2F13 M26

IO114NB2F13 K28

IO114PB2F13 K29

IO115NB2F13 H32

IO115PB2F13 J32

IO116NB2F13 G35

IO116PB2F13 G34

IO117NB2F13 M29

IO117PB2F13 M30

IO118NB2F13 E33

IO118PB2F13 D33

IO119NB2F13 M32

IO119PB2F13 M31

IO120NB2F13 E36

IO120PB2F13 D36

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO121NB2F14 N28

IO121PB2F14 N27

IO122NB2F14 L33

IO122PB2F14 L32

IO123NB2F14 N30

IO123PB2F14 N29

IO124NB2F14 K35

IO124PB2F14 J35

IO125NB2F14 P25

IO125PB2F14 N25

IO126NB2F14 H36

IO126PB2F14 G36

IO127NB2F14 N32

IO127PB2F14 N31

IO128NB2F14 N34

IO128PB2F14 M34

IO129NB2F14 P29

IO129PB2F14 P28

IO130NB2F15 N33

IO130PB2F15 M33

IO131NB2F15 R26

IO131PB2F15 R25

IO132NB2F15 K36

IO132PB2F15 J36

IO133NB2F15 R29

IO133PB2F15 R28

IO134NB2F15 N35

IO134PB2F15 M35

IO135NB2F15 F35

IO135PB2F15 F36

IO136NB2F15 M36

IO136PB2F15 L36

IO137NB2F15 T26

IO137PB2F15 T25

IO138NB2F15 P33

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO138PB2F15 P32

IO139NB2F16 R31

IO139PB2F16 R30

IO140NB2F16 P36

IO140PB2F16 N36

IO141NB2F16 T28

IO141PB2F16 T27

IO142NB2F16 R35

IO142PB2F16 R34

IO143NB2F16 T32

IO143PB2F16 T31

IO144NB2F16 T35

IO144PB2F16 T34

IO145NB2F16 T30

IO145PB2F16 T29

IO146NB2F16 R33

IO146PB2F16 R32

IO147NB2F16 V25

IO147PB2F16 U25

IO148NB2F17 T36

IO148PB2F17 R36

IO149NB2F17 U29

IO149PB2F17 U28

IO150NB2F17 U33

IO150PB2F17 T33

IO151NB2F17 W25

IO151PB2F17 Y25

IO152NB2F17 V36

IO152PB2F17 U36

IO153NB2F17 V31

IO153PB2F17 V30

IO154NB2F17 V32

IO154PB2F17 U32

IO155NB2F17 V27

IO155PB2F17 V28

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-69

IO156NB2F17 W34

IO156PB2F17 V34

Bank 3

IO157NB3F18 W29

IO157PB3F18 V29

IO158NB3F18 W35

IO158PB3F18 V35

IO159NB3F18 W30

IO159PB3F18 W31

IO160NB3F18 AA36

IO160PB3F18 Y36

IO161NB3F18 W27

IO161PB3F18 W28

IO162NB3F18 Y32

IO162PB3F18 W32

IO163NB3F18 Y28

IO163PB3F18 Y29

IO164NB3F18 AC36

IO164PB3F18 AB36

IO165NB3F18 AA26

IO165PB3F18 AA25

IO166NB3F19 AA33

IO166PB3F19 Y33

IO167NB3F19 AA32

IO167PB3F19 AA31

IO168NB3F19 AA34

IO168PB3F19 AA35

IO169NB3F19 AA29

IO169PB3F19 AA30

IO170NB3F19 AB32

IO170PB3F19 AB33

IO171NB3F19 AB31

IO171PB3F19 AB30

IO172NB3F19 AE36

IO172PB3F19 AD36

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO173NB3F19 AA27

IO173PB3F19 AA28

IO174NB3F19 AB34

IO174PB3F19 AB35

IO175NB3F20 AL35

IO175PB3F20 AL36

IO176NB3F20 AG36

IO176PB3F20 AF36

IO177NB3F20 AB25

IO177PB3F20 AB26

IO178NB3F20 AC32

IO178PB3F20 AC33

IO179NB3F20 AB29

IO179PB3F20 AB28

IO180NB3F20 AJ36

IO180PB3F20 AH36

IO181NB3F20 AC25

IO181PB3F20 AD25

IO182NB3F20 AE35

IO182PB3F20 AD35

IO183NB3F20 AC29

IO183PB3F20 AC28

IO184NB3F21 AE34

IO184PB3F21 AD34

IO185NB3F21 AE26

IO185PB3F21 AD26

IO186NB3F21 AE33

IO186PB3F21 AD33

IO187NB3F21 AD30

IO187PB3F21 AD29

IO188NB3F21 AH35

IO188PB3F21 AG35

IO189NB3F21 AD32

IO189PB3F21 AD31

IO190NB3F21 AK35

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO190PB3F21 AK36

IO191NB3F21 AE32

IO191PB3F21 AE31

IO192NB3F21 AN36

IO192PB3F21 AM36

IO193NB3F22 AD27

IO193PB3F22 AD28

IO194NB3F22 AF32

IO194PB3F22 AF33

IO195NB3F22 AE30

IO195PB3F22 AE29

IO196NB3F22 AK34

IO196PB3F22 AL34

IO197NB3F22 AE28

IO197PB3F22 AE27

IO198NB3F22 AN33

IO198PB3F22 AM33

IO199NB3F22 AH31

IO199PB3F22 AH30

IO200NB3F22 AH34

IO200PB3F22 AG34

IO201NB3F22 AF29

IO201PB3F22 AF28

IO202NB3F23 AG32

IO202PB3F23 AG33

IO203NB3F23 AG31

IO203PB3F23 AG30

IO204NB3F23 AL33

IO204PB3F23 AK33

IO205NB3F23 AK32

IO205PB3F23 AK31

IO206NB3F23 AH33

IO206PB3F23 AJ33

IO207NB3F23 AN34

IO207PB3F23 AN35

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

Package Pin Assignments

3-70 Revision 15

IO208NB3F23 AG29

IO208PB3F23 AG28

IO209NB3F23 AJ32

IO209PB3F23 AH32

Bank 4

IO210NB4F24 AM28

IO210PB4F24 AN28

IO211NB4F24 AN29

IO211PB4F24 AN30

IO212NB4F24 AH27

IO212PB4F24 AH28

IO213NB4F24 AM30

IO213PB4F24 AM29

IO214NB4F24 AL28

IO214PB4F24 AK28

IO215NB4F24 AR30

IO215PB4F24 AR31

IO216NB4F24 AF24

IO216PB4F24 AF25

IO217NB4F24 AP30

IO217PB4F24 AP31

IO218NB4F24 AL27

IO218PB4F24 AK27

IO219NB4F24 AN27

IO219PB4F24 AM27

IO220NB4F25 AJ26

IO220PB4F25 AJ27

IO221NB4F25 AT32

IO221PB4F25 AT33

IO222NB4F25 AN31

IO222PB4F25 AN32

IO223NB4F25 AT30

IO223PB4F25 AT31

IO224NB4F25 AH25

IO224PB4F25 AH26

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO225NB4F25 AN25

IO225PB4F25 AN26

IO226NB4F25 AL25

IO226PB4F25 AK25

IO227NB4F25 AM25

IO227PB4F25 AM26

IO228NB4F25 AG25

IO228PB4F25 AG24

IO229NB4F25 AR33

IO229PB4F25 AP33

IO230NB4F25 AJ24

IO230PB4F25 AJ25

IO231NB4F25 AT26

IO231PB4F25 AT27

IO232NB4F26 AE23

IO232PB4F26 AE24

IO233NB4F26 AR27

IO233PB4F26 AR28

IO234NB4F26 AH23

IO234PB4F26 AH24

IO235NB4F26 AT29

IO235PB4F26 AT28

IO236NB4F26 AK24

IO236PB4F26 AL24

IO237NB4F26 AR24

IO237PB4F26 AR25

IO238NB4F26 AF21

IO238PB4F26 AF22

IO239NB4F26 AP24

IO239PB4F26 AP25

IO240NB4F26 AP27

IO240PB4F26 AP28

IO241NB4F26 AN23

IO241PB4F26 AN24

IO242NB4F27 AG21

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO242PB4F27 AG22

IO243NB4F27 AM22

IO243PB4F27 AM23

IO244NB4F27 AK22

IO244PB4F27 AL22

IO245NB4F27 AT24

IO245PB4F27 AT25

IO246NB4F27 AH21

IO246PB4F27 AH22

IO247NB4F27 AP22

IO247PB4F27 AN22

IO248NB4F27 AJ22

IO248PB4F27 AJ23

IO249NB4F27 AR21

IO249PB4F27 AR22

IO250NB4F27 AE21

IO250PB4F27 AE20

IO251NB4F27 AM21

IO251PB4F27 AL21

IO252NB4F27 AH20

IO252PB4F27 AJ20

IO253NB4F27 AT23

IO253PB4F27 AT22

IO254NB4F28 AK21

IO254PB4F28 AJ21

IO255NB4F28 AT20

IO255PB4F28 AT21

IO256NB4F28 AE18

IO256PB4F28 AE19

IO257NB4F28 AM19

IO257PB4F28 AM20

IO258NB4F28 AK19

IO258PB4F28 AJ19

IO259NB4F28 AP19

IO259PB4F28 AR19

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-71

IO260NB4F28/CLKEN AH19

IO260PB4F28/CLKEP AG19

IO261NB4F28/CLKFN AN19

IO261PB4F28/CLKFP AN20

Bank 5

IO262NB5F30/CLKGN AG18

IO262PB5F30/CLKGP AH18

IO263NB5F30/CLKHN AN17

IO263PB5F30/CLKHP AN18

IO264NB5F30 AJ18

IO264PB5F30 AK18

IO265NB5F30 AR18

IO265PB5F30 AP18

IO266NB5F30 AE17

IO266PB5F30 AE16

IO267NB5F30 AM17

IO267PB5F30 AM18

IO268NB5F30 AJ16

IO268PB5F30 AK16

IO269NB5F30 AT16

IO269PB5F30 AT17

IO270NB5F30 AF16

IO270PB5F30 AF15

IO271NB5F30 AT15

IO271PB5F30 AT14

IO272NB5F31 AH17

IO272PB5F31 AJ17

IO273NB5F31 AL16

IO273PB5F31 AM16

IO274NB5F31 AH15

IO274PB5F31 AH16

IO275NB5F31 AR15

IO275PB5F31 AR16

IO276NB5F31 AJ14

IO276PB5F31 AJ15

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO277NB5F31 AN15

IO277PB5F31 AP15

IO278NB5F31 AG15

IO278PB5F31 AG16

IO279NB5F31 AT10

IO279PB5F31 AT11

IO280NB5F31 AL15

IO280PB5F31 AK15

IO281NB5F32 AM14

IO281PB5F32 AM15

IO282NB5F32 AE13

IO282PB5F32 AE14

IO283NB5F32 AT12

IO283PB5F32 AT13

IO284NB5F32 AP9

IO284PB5F32 AP10

IO285NB5F32 AN13

IO285PB5F32 AN14

IO286NB5F32 AN9

IO286PB5F32 AM9

IO287NB5F32 AR12

IO287PB5F32 AR13

IO288NB5F32 AL13

IO288PB5F32 AK13

IO289NB5F32 AT9

IO289PB5F32 AT8

IO290NB5F32 AH13

IO290PB5F32 AH14

IO291NB5F32 AR9

IO291PB5F32 AR10

IO292NB5F32 AJ12

IO292PB5F32 AJ13

IO293NB5F33 AP12

IO293PB5F33 AP13

IO294NB5F33 AG13

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO294PB5F33 AF13

IO295NB5F33 AP4

IO295PB5F33 AR4

IO296NB5F33 AG12

IO296PB5F33 AF12

IO297NB5F33 AM11

IO297PB5F33 AM12

IO298NB5F33 AK12

IO298PB5F33 AL12

IO299NB5F33 AN11

IO299PB5F33 AN12

IO300NB5F33 AN5

IO300PB5F33 AN6

IO301NB5F33 AT6

IO301PB5F33 AT7

IO302NB5F34 AH11

IO302PB5F34 AH12

IO303NB5F34 AT4

IO303PB5F34 AT5

IO304NB5F34 AJ10

IO304PB5F34 AJ11

IO305NB5F34 AM10

IO305PB5F34 AN10

IO306NB5F34 AK10

IO306PB5F34 AL10

IO307NB5F34 AP6

IO307PB5F34 AP7

IO308NB5F34 AK9

IO308PB5F34 AL9

IO309NB5F34 AR6

IO309PB5F34 AR7

IO310NB5F34 AH9

IO310PB5F34 AH10

IO311NB5F34 AM8

IO311PB5F34 AM7

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

Package Pin Assignments

3-72 Revision 15

IO312NB5F34 AG9

IO312PB5F34 AG8

IO313NB5F34 AN7

IO313PB5F34 AN8

Bank 6

IO314NB6F36 AF8

IO314PB6F36 AF9

IO315NB6F36 AN2

IO315PB6F36 AN3

IO316NB6F36 AH4

IO316PB6F36 AJ4

IO317NB6F36 AL3

IO317PB6F36 AL4

IO318NB6F36 AK4

IO318PB6F36 AK5

IO319NB6F36 AE10

IO319PB6F36 AE9

IO320NB6F36 AG4

IO320PB6F36 AG5

IO321NB6F36 AE11

IO321PB6F36 AD11

IO322NB6F37 AG3

IO322PB6F37 AH3

IO323NB6F37 AG7

IO323PB6F37 AG6

IO324NB6F37 AH7

IO324PB6F37 AH6

IO325NB6F37 AJ5

IO325PB6F37 AH5

IO326NB6F37 AK2

IO326PB6F37 AK3

IO327NB6F37 AE7

IO327PB6F37 AE8

IO328NB6F37 AM4

IO328PB6F37 AN4

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO329NB6F37 AD9

IO329PB6F37 AD10

IO330NB6F37 AM1

IO330PB6F37 AN1

IO331NB6F38 AE5

IO331PB6F38 AE6

IO332NB6F38 AF4

IO332PB6F38 AF5

IO333NB6F38 AD8

IO333PB6F38 AD7

IO334NB6F38 AG2

IO334PB6F38 AH2

IO335NB6F38 AC12

IO335PB6F38 AD12

IO336NB6F38 AJ1

IO336PB6F38 AK1

IO337NB6F38 AC8

IO337PB6F38 AC9

IO338NB6F38 AD3

IO338PB6F38 AE3

IO339NB6F38 AD5

IO339PB6F38 AD6

IO340NB6F39 AD4

IO340PB6F39 AE4

IO341NB6F39 AB8

IO341PB6F39 AB9

IO342NB6F39 AG1

IO342PB6F39 AH1

IO343NB6F39 AA12

IO343PB6F39 AB12

IO344NB6F39 AD2

IO344PB6F39 AE2

IO345NB6F39 AA11

IO345PB6F39 AB11

IO346NB6F39 AE1

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO346PB6F39 AF1

IO347NB6F39 AL1

IO347PB6F39 AL2

IO348NB6F39 AC4

IO348PB6F39 AC5

IO349NB6F40 AB6

IO349PB6F40 AB7

IO350NB6F40 AC1

IO350PB6F40 AD1

IO351NB6F40 AA9

IO351PB6F40 AA10

IO352NB6F40 AB2

IO352PB6F40 AB3

IO353NB6F40 AA7

IO353PB6F40 AA8

IO354NB6F40 AA2

IO354PB6F40 AA3

IO355NB6F40 AA5

IO355PB6F40 AA6

IO356NB6F40 AB4

IO356PB6F40 AB5

IO357NB6F40 W12

IO357PB6F40 Y12

IO358NB6F41 AA1

IO358PB6F41 AB1

IO359NB6F41 Y8

IO359PB6F41 Y9

IO360NB6F41 Y4

IO360PB6F41 AA4

IO361NB6F41 U12

IO361PB6F41 V12

IO362NB6F41 W1

IO362PB6F41 Y1

IO363NB6F41 W6

IO363PB6F41 W7

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-73

IO364NB6F41 W5

IO364PB6F41 Y5

IO365NB6F41 W10

IO365PB6F41 W9

IO366NB6F41 V2

IO366PB6F41 W2

Bank 7

IO367NB7F42 V8

IO367PB7F42 W8

IO368NB7F42 V3

IO368PB7F42 W3

IO369NB7F42 V9

IO369PB7F42 V10

IO370NB7F42 U1

IO370PB7F42 V1

IO371NB7F42 V7

IO371PB7F42 V6

IO372NB7F42 U5

IO372PB7F42 V5

IO373NB7F42 U9

IO373PB7F42 U8

IO374NB7F42 R1

IO374PB7F42 T1

IO375NB7F42 T11

IO375PB7F42 T12

IO376NB7F43 T4

IO376PB7F43 U4

IO377NB7F43 T8

IO377PB7F43 T7

IO378NB7F43 T3

IO378PB7F43 T2

IO379NB7F43 T5

IO379PB7F43 T6

IO380NB7F43 R5

IO380PB7F43 R4

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO381NB7F43 R6

IO381PB7F43 R7

IO382NB7F43 N1

IO382PB7F43 P1

IO383NB7F43 T10

IO383PB7F43 T9

IO384NB7F43 R3

IO384PB7F43 R2

IO385NB7F44 R12

IO385PB7F44 R11

IO386NB7F44 L1

IO386PB7F44 M1

IO387NB7F44 G2

IO387PB7F44 F2

IO388NB7F44 P5

IO388PB7F44 P4

IO389NB7F44 R8

IO389PB7F44 R9

IO390NB7F44 J1

IO390PB7F44 K1

IO391NB7F44 N12

IO391PB7F44 P12

IO392NB7F44 M2

IO392PB7F44 N2

IO393NB7F44 P9

IO393PB7F44 P8

IO394NB7F45 M3

IO394PB7F45 N3

IO395NB7F45 M11

IO395PB7F45 N11

IO396NB7F45 M4

IO396PB7F45 N4

IO397NB7F45 N5

IO397PB7F45 N6

IO398NB7F45 J2

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

IO398PB7F45 K2

IO399NB7F45 N8

IO399PB7F45 N7

IO400NB7F45 G1

IO400PB7F45 H1

IO401NB7F45 M5

IO401PB7F45 M6

IO402NB7F45 E1

IO402PB7F45 F1

IO403NB7F46 N10

IO403PB7F46 N9

IO404NB7F46 L5

IO404PB7F46 L4

IO405NB7F46 M7

IO405PB7F46 M8

IO406NB7F46 G3

IO406PB7F46 F3

IO407NB7F46 M10

IO407PB7F46 M9

IO408NB7F46 D4

IO408PB7F46 D3

IO409NB7F46 J7

IO409PB7F46 J6

IO410NB7F46 J3

IO410PB7F46 K3

IO411NB7F46 L8

IO411PB7F46 L9

IO412NB7F47 K5

IO412PB7F47 K4

IO413NB7F47 K7

IO413PB7F47 K6

IO414NB7F47 E4

IO414PB7F47 F4

IO415NB7F47 G4

IO415PB7F47 G5

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

Package Pin Assignments

3-74 Revision 15

IO416NB7F47 H4

IO416PB7F47 J4

IO417NB7F47 D2

IO417PB7F47 D1

IO418NB7F47 K8

IO418PB7F47 K9

IO419NB7F47 H5

IO419PB7F47 J5

Dedicated I/O

GND J8

GND AA13

GND AA15

GND AA17

GND AA19

GND AA21

GND AA23

GND AA24

GND AB14

GND AB16

GND AB18

GND AB20

GND AB22

GND AC11

GND AC13

GND AC15

GND AC17

GND AC19

GND AC21

GND AC23

GND AC24

GND AC26

GND AC3

GND AC30

GND AC34

GND AC7

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

GND AD13

GND AD14

GND AD16

GND AD18

GND AD19

GND AD21

GND AD23

GND AD24

GND AE15

GND AE25

GND AF10

GND AF11

GND AF14

GND AF17

GND AF20

GND AF23

GND AF26

GND AF27

GND AF3

GND AF30

GND AF34

GND AF7

GND AJ29

GND AJ3

GND AJ30

GND AJ34

GND AJ7

GND AK11

GND AK14

GND AK17

GND AK20

GND AK23

GND AK26

GND AK29

GND AK6

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

GND AK8

GND AL18

GND AL31

GND AL7

GND AM3

GND AM34

GND AP11

GND AP14

GND AP17

GND AP2

GND AP20

GND AP23

GND AP26

GND AP29

GND AP32

GND AP35

GND AP5

GND AP8

GND AR3

GND AR34

GND B3

GND B34

GND C11

GND C14

GND C17

GND C2

GND C20

GND C23

GND C26

GND C29

GND C32

GND C35

GND C5

GND C8

GND E3

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-75

GND E34

GND F30

GND F7

GND G11

GND G14

GND G17

GND G20

GND G23

GND G26

GND G29

GND G8

GND H3

GND H30

GND H34

GND H7

GND J31

GND L10

GND L11

GND L14

GND L17

GND L20

GND L23

GND L26

GND L27

GND L3

GND L30

GND L34

GND L7

GND M15

GND M25

GND N14

GND N16

GND N18

GND N19

GND N21

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

GND N23

GND N24

GND P11

GND P13

GND P14

GND P16

GND P18

GND P20

GND P22

GND P24

GND P26

GND P3

GND P30

GND P34

GND P7

GND R15

GND R17

GND R19

GND R21

GND R23

GND R27

GND T13

GND T14

GND T16

GND T18

GND T20

GND T22

GND T24

GND U11

GND U15

GND U17

GND U19

GND U21

GND U23

GND U26

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

GND U3

GND U30

GND U34

GND U7

GND V13

GND V14

GND V16

GND V18

GND V20

GND V22

GND V24

GND V33

GND V4

GND W11

GND W13

GND W15

GND W17

GND W19

GND W21

GND W23

GND W24

GND W26

GND W4

GND Y11

GND Y14

GND Y16

GND Y18

GND Y20

GND Y22

GND Y26

GND Y3

GND Y30

GND Y34

GND Y7

NC AJ8

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

Package Pin Assignments

3-76 Revision 15

NC W36

PRA F18

PRB A18

PRC AL19

PRD AT19

TCK H8

TDI F6

TDO H9

TMS F5

TRST G7

VCCA A19

VCCA AA14

VCCA AA16

VCCA AA18

VCCA AA20

VCCA AA22

VCCA AB15

VCCA AB17

VCCA AB19

VCCA AB21

VCCA AB23

VCCA AC14

VCCA AC16

VCCA AC18

VCCA AC20

VCCA AC22

VCCA AE12

VCCA AL32

VCCA AL5

VCCA AP3

VCCA AP34

VCCA AT18

VCCA C3

VCCA C34

VCCA J30

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

VCCA M12

VCCA P15

VCCA P17

VCCA P19

VCCA P21

VCCA P23

VCCA R14

VCCA R16

VCCA R18

VCCA R20

VCCA R22

VCCA T15

VCCA T17

VCCA T19

VCCA T21

VCCA T23

VCCA U14

VCCA U16

VCCA U18

VCCA U20

VCCA U22

VCCA V15

VCCA V17

VCCA V19

VCCA V21

VCCA V23

VCCA W14

VCCA W16

VCCA W18

VCCA W20

VCCA W22

VCCA W33

VCCA Y15

VCCA Y17

VCCA Y19

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

VCCA Y21

VCCA Y23

VCCDA AB10

VCCDA AB27

VCCDA AE22

VCCDA AF18

VCCDA AF19

VCCDA AH29

VCCDA AH8

VCCDA AJ28

VCCDA AJ9

VCCDA AK30

VCCDA AK7

VCCDA AL30

VCCDA AL6

VCCDA AM13

VCCDA AM24

VCCDA AM31

VCCDA AM32

VCCDA AM5

VCCDA AM6

VCCDA AN16

VCCDA AN21

VCCDA AP16

VCCDA AP21

VCCDA C16

VCCDA C21

VCCDA D16

VCCDA D21

VCCDA E13

VCCDA E24

VCCDA E5

VCCDA E6

VCCDA F19

VCCDA F31

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-77

VCCDA G30

VCCDA G31

VCCDA G6

VCCDA H28

VCCDA H29

VCCDA J29

VCCDA L18

VCCDA L19

VCCDA M22

VCCDA N13

VCCDA R10

VCCDA V11

VCCDA V26

VCCIB0 B11

VCCIB0 B14

VCCIB0 B17

VCCIB0 B5

VCCIB0 B8

VCCIB0 F11

VCCIB0 F14

VCCIB0 F17

VCCIB0 F8

VCCIB0 K11

VCCIB0 K14

VCCIB0 K17

VCCIB0 N15

VCCIB0 N17

VCCIB1 B20

VCCIB1 B23

VCCIB1 B26

VCCIB1 B29

VCCIB1 B32

VCCIB1 F20

VCCIB1 F23

VCCIB1 F26

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

VCCIB1 F29

VCCIB1 K20

VCCIB1 K23

VCCIB1 K26

VCCIB1 N20

VCCIB1 N22

VCCIB2 E35

VCCIB2 H31

VCCIB2 H35

VCCIB2 K27

VCCIB2 L31

VCCIB2 L35

VCCIB2 P27

VCCIB2 P31

VCCIB2 P35

VCCIB2 R24

VCCIB2 U24

VCCIB2 U27

VCCIB2 U31

VCCIB2 U35

VCCIB3 AB24

VCCIB3 AC27

VCCIB3 AC31

VCCIB3 AC35

VCCIB3 AF31

VCCIB3 AF35

VCCIB3 AG27

VCCIB3 AJ31

VCCIB3 AJ35

VCCIB3 AM35

VCCIB3 Y24

VCCIB3 Y27

VCCIB3 Y31

VCCIB3 Y35

VCCIB4 AD20

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

VCCIB4 AD22

VCCIB4 AG20

VCCIB4 AG23

VCCIB4 AG26

VCCIB4 AL20

VCCIB4 AL23

VCCIB4 AL26

VCCIB4 AL29

VCCIB4 AR20

VCCIB4 AR23

VCCIB4 AR26

VCCIB4 AR29

VCCIB4 AR32

VCCIB5 AD15

VCCIB5 AD17

VCCIB5 AG11

VCCIB5 AG14

VCCIB5 AG17

VCCIB5 AL11

VCCIB5 AL14

VCCIB5 AL17

VCCIB5 AL8

VCCIB5 AR11

VCCIB5 AR14

VCCIB5 AR17

VCCIB5 AR5

VCCIB5 AR8

VCCIB6 AB13

VCCIB6 AC10

VCCIB6 AC2

VCCIB6 AC6

VCCIB6 AF2

VCCIB6 AF6

VCCIB6 AG10

VCCIB6 AJ2

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

Package Pin Assignments

3-78 Revision 15

VCCIB6 AJ6

VCCIB6 AM2

VCCIB6 Y10

VCCIB6 Y13

VCCIB6 Y2

VCCIB6 Y6

VCCIB7 E2

VCCIB7 H2

VCCIB7 H6

VCCIB7 K10

VCCIB7 L2

VCCIB7 L6

VCCIB7 P10

VCCIB7 P2

VCCIB7 P6

VCCIB7 R13

VCCIB7 U10

VCCIB7 U13

VCCIB7 U2

VCCIB7 U6

VPUMP F32

CG1272/LG1272

RTAX4000S/SL Function Pin

Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-79

CG1272/LG1272

RTAX2000D Function Pin Number

Bank 0

IO00NB0F0 F10

IO00PB0F0 G10

IO01NB0F0 E7

IO01PB0F0 E8

IO02NB0F0 E9

IO02PB0F0 D9

IO03NB0F0 J12

IO03PB0F0 J11

IO04NB0F0 A7

IO04PB0F0 A6

IO05NB0F0 J10

IO05PB0F0 J9

IO06NB0F0 C7

IO06PB0F0 C6

IO07NB0F0 E12

IO07PB0F0 E11

IO08NB0F0 C10

IO08PB0F0 C9

IO09NB0F0 H13

IO09PB0F0 H12

IO10NB0F0 B4

IO10PB0F0 C4

IO11NB0F0 L13

IO11PB0F0 L12

IO12NB0F1 F12

IO12PB0F1 G12

IO13NB0F1 J14

IO13PB0F1 J13

IO14NB0F1 A5

IO14PB0F1 A4

IO15NB0F1 D12

IO15PB0F1 D11

IO16NB0F1 B10

IO16PB0F1 B9

IO17NB0F1 G13

IO17PB0F1 F13

IO18NB0F1 D14

IO18PB0F1 D13

IO19NB0F1 K15

IO19PB0F1 K16

IO20NB0F1 A11

IO20PB0F1 A10

IO21NB0F1 H15

IO21PB0F1 H14

IO22NB0F2 B7

IO22PB0F2 B6

IO23NB0F2 A8

IO23PB0F2 A9

IO24NB0F2 B13

IO24PB0F2 B12

IO25NB0F2 J16

IO25PB0F2 J15

IO26NB0F2 G15

IO26PB0F2 F15

IO27NB0F2 E15

IO27PB0F2 E14

IO28NB0F2 C15

IO28PB0F2 D15

IO29NB0F2 E18

IO29PB0F2 E17

IO30NB0F2 C13

IO30PB0F2 C12

IO31NB0F2 G16

IO31PB0F2 H16

IO32NB0F2 A14

IO32PB0F2 A15

IO33NB0F2 L16

IO33PB0F2 L15

IO34NB0F3 E16

IO34PB0F3 F16

IO35NB0F3 M18

CG1272/LG1272

RTAX2000D Function Pin Number

IO35PB0F3 M19

IO36NB0F3 A13

IO36PB0F3 A12

IO37NB0F3 G18

IO37PB0F3 H18

IO38NB0F3 A17

IO38PB0F3 A16

IO39NB0F3 M16

IO39PB0F3 M17

IO40NB0F3 C18

IO40PB0F3 B18

IO41NB0F3/HCLKAN J18

IO41PB0F3/HCLKAP K18

IO42NB0F3/HCLKBN D18

IO42PB0F3/HCLKBP D17

Bank 1

IO43NB1F4/HCLKCN K19

IO43PB1F4/HCLKCP J19

IO44NB1F4/HCLKDN D20

IO44PB1F4/HCLKDP D19

IO45NB1F4 H19

IO45PB1F4 G19

IO46NB1F4 A21

IO46PB1F4 A20

IO47NB1F4 M20

IO47PB1F4 M21

IO48NB1F4 B19

IO48PB1F4 C19

IO49NB1F4 F22

IO49PB1F4 G22

IO50NB1F4 F21

IO50PB1F4 E21

IO51NB1F4 L22

IO51PB1F4 L21

IO52NB1F4 D22

IO52PB1F4 C22

CG1272/LG1272

RTAX2000D Function Pin Number

Package Pin Assignments

3-80 Revision 15

IO53NB1F4 K22

IO53PB1F4 K21

IO54NB1F5 A22

IO54PB1F5 A23

IO55NB1F5 E20

IO55PB1F5 E19

IO56NB1F5 B22

IO56PB1F5 B21

IO57NB1F5 E23

IO57PB1F5 E22

IO58NB1F5 A25

IO58PB1F5 A24

IO59NB1F5 M24

IO59PB1F5 M23

IO60NB1F5 C28

IO60PB1F5 C27

IO61NB1F5 H23

IO61PB1F5 H22

IO62NB1F5 D24

IO62PB1F5 D23

IO63NB1F5 D26

IO63PB1F5 D25

IO64NB1F6 B25

IO64PB1F6 B24

IO65NB1F6 E27

IO65PB1F6 D27

IO66NB1F6 A27

IO66PB1F6 A26

IO67NB1F6 F24

IO67PB1F6 G24

IO68NB1F6 B28

IO68PB1F6 B27

IO69NB1F6 L24

IO69PB1F6 L25

IO70NB1F6 A28

IO70PB1F6 A29

CG1272/LG1272

RTAX2000D Function Pin Number

IO71NB1F6 E29

IO71PB1F6 E30

IO72NB1F6 B31

IO72PB1F6 B30

IO73NB1F6 E26

IO73PB1F6 E25

IO74NB1F6 A31

IO74PB1F6 A30

IO75NB1F6 K25

IO75PB1F6 K24

IO76NB1F7 D30

IO76PB1F7 D29

IO77NB1F7 G27

IO77PB1F7 F27

IO78NB1F7 A33

IO78PB1F7 A32

IO79NB1F7 J26

IO79PB1F7 J25

IO80NB1F7 D32

IO80PB1F7 D31

IO81NB1F7 H27

IO81PB1F7 H26

IO82NB1F7 C33

IO82PB1F7 B33

IO83NB1F7 F28

IO83PB1F7 G28

IO84NB1F7 D28

IO84PB1F7 E28

IO85NB1F7 E31

IO85PB1F7 E32

Bank 2

IO86NB2F8 K31

IO86PB2F8 K30

IO87NB2F8 L29

IO87PB2F8 L28

IO88NB2F8 E33

CG1272/LG1272

RTAX2000D Function Pin Number

IO88PB2F8 D33

IO89NB2F8 G33

IO89PB2F8 G32

IO90NB2F8 F35

IO90PB2F8 F36

IO91NB2F8 L33

IO91PB2F8 L32

IO92NB2F8 H32

IO92PB2F8 J32

IO93NB2F8 M32

IO93PB2F8 M31

IO94NB2F8 H36

IO94PB2F8 G36

IO95NB2F8 M28

IO95PB2F8 M27

IO96NB2F9 F34

IO96PB2F9 F33

IO97NB2F9 N30

IO97PB2F9 N29

IO98NB2F9 K33

IO98PB2F9 K32

IO99NB2F9 P29

IO99PB2F9 P28

IO100NB2F9 H33

IO100PB2F9 J33

IO101NB2F9 P33

IO101PB2F9 P32

IO102NB2F9 K36

IO102PB2F9 J36

IO103NB2F9 R29

IO103PB2F9 R28

IO104NB2F9 E36

IO104PB2F9 D36

IO105NB2F9 R31

IO105PB2F9 R30

IO106NB2F9 N34

CG1272/LG1272

RTAX2000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-81

IO106PB2F9 M34

IO107NB2F10 R33

IO107PB2F10 R32

IO108NB2F10 K35

IO108PB2F10 J35

IO109NB2F10 T28

IO109PB2F10 T27

IO110NB2F10 R35

IO110PB2F10 R34

IO111NB2F10 N28

IO111PB2F10 N27

IO112NB2F10 N35

IO112PB2F10 M35

IO113NB2F10 T32

IO113PB2F10 T31

IO114NB2F10 M36

IO114PB2F10 L36

IO115NB2F10 T30

IO115PB2F10 T29

IO116NB2F10 U33

IO116PB2F10 T33

IO117NB2F10 R26

IO117PB2F10 R25

IO118NB2F11 P36

IO118PB2F11 N36

IO119NB2F11 U29

IO119PB2F11 U28

IO120NB2F11 T35

IO120PB2F11 T34

IO121NB2F11 T26

IO121PB2F11 T25

IO122NB2F11 T36

IO122PB2F11 R36

IO123NB2F11 V31

IO123PB2F11 V30

IO124NB2F11 V32

CG1272/LG1272

RTAX2000D Function Pin Number

IO124PB2F11 U32

IO125NB2F11 V25

IO125PB2F11 U25

IO126NB2F11 V36

IO126PB2F11 U36

IO127NB2F11 V27

IO127PB2F11 V28

IO128NB2F11 W34

IO128PB2F11 V34

Bank 3

IO129NB3F12 AH33

IO129PB3F12 AJ33

IO130NB3F12 AA36

IO130PB3F12 Y36

IO131NB3F12 W30

IO131PB3F12 W31

IO132NB3F12 W35

IO132PB3F12 V35

IO133NB3F12 W27

IO133PB3F12 W28

IO134NB3F12 AC36

IO134PB3F12 AB36

IO135NB3F12 AA26

IO135PB3F12 AA25

IO136NB3F12 AA34

IO136PB3F12 AA35

IO137NB3F12 Y28

IO137PB3F12 Y29

IO138NB3F12 AA33

IO138PB3F12 Y33

IO139NB3F13 AB32

IO139PB3F13 AB33

IO140NB3F13 AB34

IO140PB3F13 AB35

IO141NB3F13 AA32

IO141PB3F13 AA31

CG1272/LG1272

RTAX2000D Function Pin Number

IO142NB3F13 AE36

IO142PB3F13 AD36

IO143NB3F13 AA27

IO143PB3F13 AA28

IO144NB3F13 Y32

IO144PB3F13 W32

IO145NB3F13 AB25

IO145PB3F13 AB26

IO146NB3F13 AE34

IO146PB3F13 AD34

IO147NB3F13 AB31

IO147PB3F13 AB30

IO148NB3F13 AE35

IO148PB3F13 AD35

IO149NB3F13 AF32

IO149PB3F13 AF33

IO150NB3F14 AG36

IO150PB3F14 AF36

IO151NB3F14 AC32

IO151PB3F14 AC33

IO152NB3F14 AH34

IO152PB3F14 AG34

IO153NB3F14 AC29

IO153PB3F14 AC28

IO154NB3F14 AJ36

IO154PB3F14 AH36

IO155NB3F14 AJ32

IO155PB3F14 AH32

IO156NB3F14 AH35

IO156PB3F14 AG35

IO157NB3F14 AE26

IO157PB3F14 AD26

IO158NB3F14 AG32

IO158PB3F14 AG33

IO159NB3F14 AD32

IO159PB3F14 AD31

CG1272/LG1272

RTAX2000D Function Pin Number

Package Pin Assignments

3-82 Revision 15

IO160NB3F14 AK35

IO160PB3F14 AK36

IO161NB3F15 AC25

IO161PB3F15 AD25

IO162NB3F15 AL35

IO162PB3F15 AL36

IO163NB3F15 AE32

IO163PB3F15 AE31

IO164NB3F15 AN33

IO164PB3F15 AM33

IO165NB3F15 AD27

IO165PB3F15 AD28

IO166NB3F15 AN36

IO166PB3F15 AM36

IO167NB3F15 AF29

IO167PB3F15 AF28

IO168NB3F15 AN34

IO168PB3F15 AN35

IO169NB3F15 AK32

IO169PB3F15 AK31

IO170NB3F15 AG31

IO170PB3F15 AG30

Bank 4

IO171NB4F16 AN31

IO171PB4F16 AN32

IO172NB4F16 AJ26

IO172PB4F16 AJ27

IO173NB4F16 AR33

IO173PB4F16 AP33

IO174NB4F16 AL28

IO174PB4F16 AK28

IO175NB4F16 AT30

IO175PB4F16 AT31

IO176NB4F16 AH25

IO176PB4F16 AH26

IO177NB4F16 AM30

CG1272/LG1272

RTAX2000D Function Pin Number

IO177PB4F16 AM29

IO178NB4F16 AH27

IO178PB4F16 AH28

IO179NB4F16 AT29

IO179PB4F16 AT28

IO180NB4F16 AF24

IO180PB4F16 AF25

IO181NB4F17 AT32

IO181PB4F17 AT33

IO182NB4F17 AK24

IO182PB4F17 AL24

IO183NB4F17 AM25

IO183PB4F17 AM26

IO184NB4F17 AG25

IO184PB4F17 AG24

IO185NB4F17 AN29

IO185PB4F17 AN30

IO186NB4F17 AL25

IO186PB4F17 AK25

IO187NB4F17 AR30

IO187PB4F17 AR31

IO188NB4F17 AF21

IO188PB4F17 AF22

IO189NB4F17 AT26

IO189PB4F17 AT27

IO190NB4F17 AE23

IO190PB4F17 AE24

IO191NB4F17 AN25

IO191PB4F17 AN26

IO192NB4F17 AJ22

IO192PB4F17 AJ23

IO193NB4F18 AN23

IO193PB4F18 AN24

IO194NB4F18 AL27

IO194PB4F18 AK27

IO195NB4F18 AP27

CG1272/LG1272

RTAX2000D Function Pin Number

IO195PB4F18 AP28

IO196NB4F18 AG21

IO196PB4F18 AG22

IO197NB4F18 AT24

IO197PB4F18 AT25

IO198NB4F18 AH21

IO198PB4F18 AH22

IO199NB4F18 AP24

IO199PB4F18 AP25

IO200NB4F18 AK22

IO200PB4F18 AL22

IO201NB4F18 AP22

IO201PB4F18 AN22

IO202NB4F18 AM22

IO202PB4F18 AM23

IO203NB4F19 AR27

IO203PB4F19 AR28

IO204NB4F19 AM21

IO204PB4F19 AL21

IO205NB4F19 AT23

IO205PB4F19 AT22

IO206NB4F19 AE21

IO206PB4F19 AE20

IO207NB4F19 AR24

IO207PB4F19 AR25

IO208NB4F19 AM19

IO208PB4F19 AM20

IO209NB4F19 AT20

IO209PB4F19 AT21

IO210NB4F19 AH20

IO210PB4F19 AJ20

IO211NB4F19 AP19

IO211PB4F19 AR19

IO212NB4F19/CLKEN AH19

IO212PB4F19/CLKEP AG19

IO213NB4F19/CLKFN AN19

CG1272/LG1272

RTAX2000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-83

IO213PB4F19/CLKFP AN20

Bank 5

IO214NB5F20/CLKGN AG18

IO214PB5F20/CLKGP AH18

IO215NB5F20/CLKHN AN17

IO215PB5F20/CLKHP AN18

IO216NB5F20 AJ18

IO216PB5F20 AK18

IO217NB5F20 AR18

IO217PB5F20 AP18

IO218NB5F20 AH17

IO218PB5F20 AJ17

IO219NB5F20 AT16

IO219PB5F20 AT17

IO220NB5F20 AM17

IO220PB5F20 AM18

IO221NB5F20 AR15

IO221PB5F20 AR16

IO222NB5F20 AL16

IO222PB5F20 AM16

IO223NB5F21 AR12

IO223PB5F21 AR13

IO224NB5F21 AE17

IO224PB5F21 AE16

IO225NB5F21 AT9

IO225PB5F21 AT8

IO226NB5F21 AG15

IO226PB5F21 AG16

IO227NB5F21 AH15

IO227PB5F21 AH16

IO228NB5F21 AM14

IO228PB5F21 AM15

IO229NB5F21 AN15

IO229PB5F21 AP15

IO230NB5F21 AL15

IO230PB5F21 AK15

CG1272/LG1272

RTAX2000D Function Pin Number

IO231NB5F21 AP12

IO231PB5F21 AP13

IO232NB5F21 AF16

IO232PB5F21 AF15

IO233NB5F21 AN13

IO233PB5F21 AN14

IO234NB5F21 AJ14

IO234PB5F21 AJ15

IO235NB5F22 AR9

IO235PB5F22 AR10

IO236NB5F22 AG13

IO236PB5F22 AF13

IO237NB5F22 AP9

IO237PB5F22 AP10

IO238NB5F22 AM8

IO238PB5F22 AM7

IO239NB5F22 AM11

IO239PB5F22 AM12

IO240NB5F22 AH11

IO240PB5F22 AH12

IO241NB5F22 AT12

IO241PB5F22 AT13

IO242NB5F22 AE13

IO242PB5F22 AE14

IO243NB5F22 AM10

IO243PB5F22 AN10

IO244NB5F22 AN9

IO244PB5F22 AM9

IO245NB5F23 AN7

IO245PB5F23 AN8

IO246NB5F23 AK12

IO246PB5F23 AL12

IO247NB5F23 AN5

IO247PB5F23 AN6

IO248NB5F23 AJ12

IO248PB5F23 AJ13

CG1272/LG1272

RTAX2000D Function Pin Number

IO249NB5F23 AT10

IO249PB5F23 AT11

IO250NB5F23 AG12

IO250PB5F23 AF12

IO251NB5F23 AR6

IO251PB5F23 AR7

IO252NB5F23 AP4

IO252PB5F23 AR4

IO253NB5F23 AT6

IO253PB5F23 AT7

IO254NB5F23 AJ10

IO254PB5F23 AJ11

IO255NB5F23 AK9

IO255PB5F23 AL9

IO256NB5F23 AH9

IO256PB5F23 AH10

Bank 6

IO257NB6F24 AH7

IO257PB6F24 AH6

IO258NB6F24 AG7

IO258PB6F24 AG6

IO259NB6F24 AN2

IO259PB6F24 AN3

IO260NB6F24 AE7

IO260PB6F24 AE8

IO261NB6F24 AJ1

IO261PB6F24 AK1

IO262NB6F24 AE10

IO262PB6F24 AE9

IO263NB6F24 AM4

IO263PB6F24 AN4

IO264NB6F24 AE5

IO264PB6F24 AE6

IO265NB6F24 AG1

IO265PB6F24 AH1

IO266NB6F24 AD8

CG1272/LG1272

RTAX2000D Function Pin Number

Package Pin Assignments

3-84 Revision 15

IO266PB6F24 AD7

IO267NB6F25 AM1

IO267PB6F25 AN1

IO268NB6F25 AD5

IO268PB6F25 AD6

IO269NB6F25 AF4

IO269PB6F25 AF5

IO270NB6F25 AD9

IO270PB6F25 AD10

IO271NB6F25 AJ5

IO271PB6F25 AH5

IO272NB6F25 AF8

IO272PB6F25 AF9

IO273NB6F25 AE1

IO273PB6F25 AF1

IO274NB6F25 AB6

IO274PB6F25 AB7

IO275NB6F25 AL1

IO275PB6F25 AL2

IO276NB6F25 AA11

IO276PB6F25 AB11

IO277NB6F25 AK4

IO277PB6F25 AK5

IO278NB6F26 AC4

IO278PB6F26 AC5

IO279NB6F26 AG3

IO279PB6F26 AH3

IO280NB6F26 AE11

IO280PB6F26 AD11

IO281NB6F26 AC1

IO281PB6F26 AD1

IO282NB6F26 AA7

IO282PB6F26 AA8

IO283NB6F26 AK2

IO283PB6F26 AK3

IO284NB6F26 AC12

CG1272/LG1272

RTAX2000D Function Pin Number

IO284PB6F26 AD12

IO285NB6F26 AB2

IO285PB6F26 AB3

IO286NB6F26 AD3

IO286PB6F26 AE3

IO287NB6F26 AG2

IO287PB6F26 AH2

IO288NB6F26 Y8

IO288PB6F26 Y9

IO289NB6F27 AA1

IO289PB6F27 AB1

IO290NB6F27 AA12

IO290PB6F27 AB12

IO291NB6F27 AA5

IO291PB6F27 AA6

IO292NB6F27 AB4

IO292PB6F27 AB5

IO293NB6F27 AA2

IO293PB6F27 AA3

IO294NB6F27 W12

IO294PB6F27 Y12

IO295NB6F27 AD2

IO295PB6F27 AE2

IO296NB6F27 W10

IO296PB6F27 W9

IO297NB6F27 W1

IO297PB6F27 Y1

IO298NB6F27 W5

IO298PB6F27 Y5

IO299NB6F27 V2

IO299PB6F27 W2

Bank 7

IO300NB7F28 V9

IO300PB7F28 V10

IO301NB7F28 U1

IO301PB7F28 V1

CG1272/LG1272

RTAX2000D Function Pin Number

IO302NB7F28 R12

IO302PB7F28 R11

IO303NB7F28 T3

IO303PB7F28 T2

IO304NB7F28 U5

IO304PB7F28 V5

IO305NB7F28 N1

IO305PB7F28 P1

IO306NB7F28 N12

IO306PB7F28 P12

IO307NB7F28 R3

IO307PB7F28 R2

IO308NB7F28 T10

IO308PB7F28 T9

IO309NB7F28 V3

IO309PB7F28 W3

IO310NB7F29 U9

IO310PB7F29 U8

IO311NB7F29 V7

IO311PB7F29 V6

IO312NB7F29 M11

IO312PB7F29 N11

IO313NB7F29 T4

IO313PB7F29 U4

IO314NB7F29 T11

IO314PB7F29 T12

IO315NB7F29 T5

IO315PB7F29 T6

IO316NB7F29 R5

IO316PB7F29 R4

IO317NB7F29 M2

IO317PB7F29 N2

IO318NB7F29 R8

IO318PB7F29 R9

IO319NB7F29 J2

IO319PB7F29 K2

CG1272/LG1272

RTAX2000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-85

IO320NB7F29 R6

IO320PB7F29 R7

IO321NB7F30 M3

IO321PB7F30 N3

IO322NB7F30 N10

IO322PB7F30 N9

IO323NB7F30 P5

IO323PB7F30 P4

IO324NB7F30 M5

IO324PB7F30 M6

IO325NB7F30 L1

IO325PB7F30 M1

IO326NB7F30 N5

IO326PB7F30 N6

IO327NB7F30 G2

IO327PB7F30 F2

IO328NB7F30 L5

IO328PB7F30 L4

IO329NB7F30 G3

IO329PB7F30 F3

IO330NB7F30 M7

IO330PB7F30 M8

IO331NB7F30 H4

IO331PB7F30 J4

IO332NB7F31 K5

IO332PB7F31 K4

IO333NB7F31 J1

IO333PB7F31 K1

IO334NB7F31 H5

IO334PB7F31 J5

IO335NB7F31 E1

IO335PB7F31 F1

IO336NB7F31 M10

IO336PB7F31 M9

IO337NB7F31 G1

IO337PB7F31 H1

CG1272/LG1272

RTAX2000D Function Pin Number

IO338NB7F31 G4

IO338PB7F31 G5

IO339NB7F31 E4

IO339PB7F31 F4

IO340NB7F31 K8

IO340PB7F31 K9

IO341NB7F31 D4

IO341PB7F31 D3

Dedicated I/O

GND AA13

GND AA15

GND AA17

GND AA19

GND AA21

GND AA23

GND AA24

GND AB14

GND AB16

GND AB18

GND AB20

GND AB22

GND AC3

GND AC7

GND AC11

GND AC13

GND AC15

GND AC17

GND AC19

GND AC21

GND AC23

GND AC24

GND AC26

GND AC30

GND AC34

GND AD14

GND AD16

CG1272/LG1272

RTAX2000D Function Pin Number

GND AD18

GND AD19

GND AD21

GND AD23

GND AF3

GND AF7

GND AF10

GND AF11

GND AF14

GND AF17

GND AF20

GND AF23

GND AF26

GND AF27

GND AF30

GND AF34

GND AJ3

GND AJ7

GND AJ29

GND AJ30

GND AJ34

GND AK6

GND AK8

GND AK11

GND AK14

GND AK17

GND AK20

GND AK23

GND AK26

GND AK29

GND AL7

GND AL18

GND AL31

GND AM3

GND AM34

GND AP2

CG1272/LG1272

RTAX2000D Function Pin Number

Package Pin Assignments

3-86 Revision 15

GND AP5

GND AP8

GND AP11

GND AP14

GND AP17

GND AP20

GND AP23

GND AP26

GND AP29

GND AP32

GND AP35

GND AR3

GND AR34

GND B3

GND B34

GND C2

GND C5

GND C8

GND C11

GND C14

GND C17

GND C20

GND C23

GND C26

GND C29

GND C32

GND C35

GND E3

GND E34

GND F7

GND F30

GND G8

GND G11

GND G14

GND G17

GND G20

CG1272/LG1272

RTAX2000D Function Pin Number

GND G23

GND G26

GND G29

GND H3

GND H7

GND H30

GND H34

GND J8

GND J31

GND L3

GND L7

GND L10

GND L11

GND L14

GND L17

GND L20

GND L23

GND L26

GND L27

GND L30

GND L34

GND M15

GND N14

GND N16

GND N18

GND N19

GND N21

GND N23

GND P3

GND P7

GND P11

GND P13

GND P14

GND P16

GND P18

GND P20

CG1272/LG1272

RTAX2000D Function Pin Number

GND P22

GND P24

GND P26

GND P30

GND P34

GND R15

GND R17

GND R19

GND R21

GND R23

GND T13

GND T14

GND T16

GND T18

GND T20

GND T22

GND T24

GND U3

GND U7

GND U11

GND U15

GND U17

GND U19

GND U21

GND U23

GND U26

GND U30

GND U34

GND V13

GND V14

GND V16

GND V18

GND V20

GND V22

GND V24

GND V33

CG1272/LG1272

RTAX2000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-87

GND W4

GND W13

GND W15

GND W17

GND W19

GND W21

GND W23

GND W24

GND Y3

GND Y7

GND Y11

GND Y14

GND Y16

GND Y18

GND Y20

GND Y22

GND Y26

GND Y30

GND Y34

NC A19

NC AA10

NC AA29

NC AA30

NC AA4

NC AA9

NC AB10

NC AB28

NC AB29

NC AB8

NC AB9

NC AC8

NC AC9

NC AD13

NC AD24

NC AD29

NC AD30

CG1272/LG1272

RTAX2000D Function Pin Number

NC AD33

NC AD4

NC AE12

NC AE15

NC AE18

NC AE19

NC AE22

NC AE25

NC AE27

NC AE28

NC AE29

NC AE30

NC AE33

NC AE4

NC AG28

NC AG29

NC AG4

NC AG5

NC AG8

NC AG9

NC AH13

NC AH14

NC AH23

NC AH24

NC AH29

NC AH30

NC AH31

NC AH4

NC AH8

NC AJ16

NC AJ19

NC AJ21

NC AJ24

NC AJ25

NC AJ28

NC AJ4

CG1272/LG1272

RTAX2000D Function Pin Number

NC AJ8

NC AK10

NC AK13

NC AK16

NC AK19

NC AK21

NC AK33

NC AK34

NC AK7

NC AL10

NC AL13

NC AL3

NC AL30

NC AL33

NC AL34

NC AL4

NC AL6

NC AM24

NC AM27

NC AM28

NC AM31

NC AM5

NC AN11

NC AN12

NC AN27

NC AN28

NC AP30

NC AP31

NC AP6

NC AP7

NC AR21

NC AR22

NC AT14

NC AT15

NC AT18

NC AT4

CG1272/LG1272

RTAX2000D Function Pin Number

Package Pin Assignments

3-88 Revision 15

NC AT5

NC B15

NC B16

NC C24

NC C25

NC C30

NC C31

NC D1

NC D10

NC D2

NC D34

NC D35

NC D5

NC D6

NC D7

NC D8

NC E10

NC E13

NC E24

NC E6

NC F25

NC F31

NC F9

NC G21

NC G25

NC G30

NC G34

NC G35

NC G9

NC H10

NC H11

NC H17

NC H20

NC H21

NC H24

NC H25

CG1272/LG1272

RTAX2000D Function Pin Number

NC H29

NC J17

NC J20

NC J21

NC J22

NC J23

NC J24

NC J27

NC J28

NC J29

NC J3

NC J34

NC J6

NC J7

NC K12

NC K13

NC K28

NC K29

NC K3

NC K34

NC K6

NC K7

NC L18

NC L8

NC L9

NC M13

NC M14

NC M25

NC M26

NC M29

NC M30

NC M33

NC M4

NC N13

NC N24

NC N25

CG1272/LG1272

RTAX2000D Function Pin Number

NC N26

NC N31

NC N32

NC N33

NC N4

NC N7

NC N8

NC P25

NC P8

NC P9

NC R1

NC R10

NC R27

NC T1

NC T7

NC T8

NC U12

NC V12

NC V26

NC V29

NC V4

NC V8

NC W11

NC W25

NC W26

NC W29

NC W33

NC W36

NC W6

NC W7

NC W8

NC Y25

NC Y4

PRA F18

PRB A18

PRC AL19

CG1272/LG1272

RTAX2000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-89

PRD AT19

TCK H8

TDI F6

TDO H9

TMS F5

TRST G7

VCCA M12

VCCA AL5

VCCA AL32

VCCA J30

VCCA AA14

VCCA AA16

VCCA AA18

VCCA AA20

VCCA AA22

VCCA AB15

VCCA AB17

VCCA AB19

VCCA AB21

VCCA AB23

VCCA AC14

VCCA AC16

VCCA AC18

VCCA AC20

VCCA AC22

VCCA AP3

VCCA AP34

VCCA C3

VCCA C34

VCCA P15

VCCA P17

VCCA P19

VCCA P21

VCCA P23

VCCA R14

VCCA R16

CG1272/LG1272

RTAX2000D Function Pin Number

VCCA R18

VCCA R20

VCCA R22

VCCA T15

VCCA T17

VCCA T19

VCCA T21

VCCA T23

VCCA U14

VCCA U16

VCCA U18

VCCA U20

VCCA U22

VCCA V15

VCCA V17

VCCA V19

VCCA V21

VCCA V23

VCCA W14

VCCA W16

VCCA W18

VCCA W20

VCCA W22

VCCA Y15

VCCA Y17

VCCA Y19

VCCA Y21

VCCA Y23

VCCDA G6

VCCDA V11

VCCDA AJ9

VCCDA AM6

VCCDA AP16

VCCDA AM13

VCCDA AN16

VCCDA AP21

CG1272/LG1272

RTAX2000D Function Pin Number

VCCDA AF19

VCCDA AN21

VCCDA AF18

VCCDA AM32

VCCDA AK30

VCCDA AB27

VCCDA G31

VCCDA H28

VCCDA C21

VCCDA M22

VCCDA D21

VCCDA L19

VCCDA F19

VCCDA D16

VCCDA C16

VCCDA E5

VCCIB0 B11

VCCIB0 B14

VCCIB0 B17

VCCIB0 B5

VCCIB0 B8

VCCIB0 F11

VCCIB0 F14

VCCIB0 F17

VCCIB0 F8

VCCIB0 K11

VCCIB0 K14

VCCIB0 K17

VCCIB0 N15

VCCIB0 N17

VCCIB1 B20

VCCIB1 B23

VCCIB1 B26

VCCIB1 B29

VCCIB1 B32

VCCIB1 F20

CG1272/LG1272

RTAX2000D Function Pin Number

Package Pin Assignments

3-90 Revision 15

VCCIB1 F23

VCCIB1 F26

VCCIB1 F29

VCCIB1 K20

VCCIB1 K23

VCCIB1 K26

VCCIB1 N20

VCCIB1 N22

VCCIB2 E35

VCCIB2 H31

VCCIB2 H35

VCCIB2 K27

VCCIB2 L31

VCCIB2 L35

VCCIB2 P27

VCCIB2 P31

VCCIB2 P35

VCCIB2 R24

VCCIB2 U24

VCCIB2 U27

VCCIB2 U31

VCCIB2 U35

VCCIB3 AB24

VCCIB3 AC27

VCCIB3 AC31

VCCIB3 AC35

VCCIB3 AF31

VCCIB3 AF35

VCCIB3 AG27

VCCIB3 AJ31

VCCIB3 AJ35

VCCIB3 AM35

VCCIB3 Y24

VCCIB3 Y27

VCCIB3 Y31

VCCIB3 Y35

CG1272/LG1272

RTAX2000D Function Pin Number

VCCIB4 AD20

VCCIB4 AD22

VCCIB4 AG20

VCCIB4 AG23

VCCIB4 AG26

VCCIB4 AL20

VCCIB4 AL23

VCCIB4 AL26

VCCIB4 AL29

VCCIB4 AR20

VCCIB4 AR23

VCCIB4 AR26

VCCIB4 AR29

VCCIB4 AR32

VCCIB5 AD15

VCCIB5 AD17

VCCIB5 AG11

VCCIB5 AG14

VCCIB5 AG17

VCCIB5 AL11

VCCIB5 AL14

VCCIB5 AL17

VCCIB5 AL8

VCCIB5 AR11

VCCIB5 AR14

VCCIB5 AR17

VCCIB5 AR5

VCCIB5 AR8

VCCIB6 AB13

VCCIB6 AC10

VCCIB6 AC2

VCCIB6 AC6

VCCIB6 AF2

VCCIB6 AF6

VCCIB6 AG10

VCCIB6 AJ2

CG1272/LG1272

RTAX2000D Function Pin Number

VCCIB6 AJ6

VCCIB6 AM2

VCCIB6 Y10

VCCIB6 Y13

VCCIB6 Y2

VCCIB6 Y6

VCCIB7 E2

VCCIB7 H2

VCCIB7 H6

VCCIB7 K10

VCCIB7 L2

VCCIB7 L6

VCCIB7 P10

VCCIB7 P2

VCCIB7 P6

VCCIB7 R13

VCCIB7 U10

VCCIB7 U13

VCCIB7 U2

VCCIB7 U6

VPUMP F32

CG1272/LG1272

RTAX2000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-91

CG1272/LG1272

RTAX4000D Func tio n Pin Number

Bank 0

IO00NB0F0 E9

IO00PB0F0 D9

IO01NB0F0 D8

IO01PB0F0 D7

IO02NB0F0 J10

IO02PB0F0 J9

IO03NB0F0 E7

IO03PB0F0 E8

IO04NB0F0 F9

IO04PB0F0 G9

IO05NB0F0 B7

IO05PB0F0 B6

IO06NB0F0 L13

IO06PB0F0 L12

IO07NB0F0 C7

IO07PB0F0 C6

IO08NB0F0 F10

IO08PB0F0 G10

IO09NB0F0 D10

IO09PB0F0 E10

IO10NB0F0 H11

IO10PB0F0 H10

IO11NB0F0 A5

IO11PB0F0 A4

IO12NB0F1 D6

IO12PB0F1 D5

IO13NB0F1 A7

IO13PB0F1 A6

IO14NB0F1 J12

IO14PB0F1 J11

IO15NB0F1 D12

IO15PB0F1 D11

IO16NB0F1 F12

IO16PB0F1 G12

IO17NB0F1 E12

IO17PB0F1 E11

IO18NB0F1 K13

IO18PB0F1 K12

IO19NB0F1 B4

IO19PB0F1 C4

IO20NB0F1 H13

IO20PB0F1 H12

IO21NB0F2 C13

IO21PB0F2 C12

IO22NB0F2 M14

IO22PB0F2 M13

IO23NB0F2 B10

IO23PB0F2 B9

IO24NB0F2 J14

IO24PB0F2 J13

IO25NB0F2 A8

IO25PB0F2 A9

IO26NB0F2 G13

IO26PB0F2 F13

IO27NB0F2 D14

IO27PB0F2 D13

IO28NB0F2 L16

IO28PB0F2 L15

IO29NB0F2 B13

IO29PB0F2 B12

IO30NB0F2 C10

IO30PB0F2 C9

IO31NB0F2 E15

IO31PB0F2 E14

IO32NB0F2 K15

IO32PB0F2 K16

IO33NB0F3 A13

IO33PB0F3 A12

IO34NB0F3 G15

IO34PB0F3 F15

IO35NB0F3 C15

CG1272/LG1272

RTAX4000D Function Pin Number

IO35PB0F3 D15

IO36NB0F3 J16

IO36PB0F3 J15

IO37NB0F3 A11

IO37PB0F3 A10

IO38NB0F3 H15

IO38PB0F3 H14

IO39NB0F3 B16

IO39PB0F3 B15

IO40NB0F3 M16

IO40PB0F3 M17

IO41NB0F3 E16

IO41PB0F3 F16

IO42NB0F4 H17

IO42PB0F4 J17

IO43NB0F4 A14

IO43PB0F4 A15

IO44NB0F4 G16

IO44PB0F4 H16

IO45NB0F4 A17

IO45PB0F4 A16

IO46NB0F4 M18

IO46PB0F4 M19

IO47NB0F4 E18

IO47PB0F4 E17

IO48NB0F4 G18

IO48PB0F4 H18

IO49NB0F4 C18

IO49PB0F4 B18

IO50NB0F4/HCLKAN J18

IO50PB0F4/HCLKAP K18

IO51NB0F4/HCLKBN D18

IO51PB0F4/HCLKBP D17

Bank 1

IO52NB1F6/HCLKCN K19

IO52PB1F6/HCLKCP J19

CG1272/LG1272

RTAX4000D Function Pin Number

Package Pin Assignments

3-92 Revision 15

IO53NB1F6/HCLKDN D20

IO53PB1F6/HCLKDP D19

IO54NB1F6 H19

IO54PB1F6 G19

IO55NB1F6 B19

IO55PB1F6 C19

IO56NB1F6 M20

IO56PB1F6 M21

IO57NB1F6 E20

IO57PB1F6 E19

IO58NB1F6 H21

IO58PB1F6 G21

IO59NB1F6 A21

IO59PB1F6 A20

IO60NB1F7 H20

IO60PB1F7 J20

IO61NB1F7 A22

IO61PB1F7 A23

IO62NB1F7 D32

IO62PB1F7 D31

IO63NB1F7 F21

IO63PB1F7 E21

IO64NB1F7 J22

IO64PB1F7 J21

IO65NB1F7 B22

IO65PB1F7 B21

IO66NB1F7 H23

IO66PB1F7 H22

IO67NB1F7 D22

IO67PB1F7 C22

IO68NB1F7 K22

IO68PB1F7 K21

IO69NB1F7 A27

IO69PB1F7 A26

IO70NB1F7 F22

IO70PB1F7 G22

CG1272/LG1272

RTAX4000D Func tio n Pin Number

IO71NB1F7 E23

IO71PB1F7 E22

IO72NB1F8 L22

IO72PB1F8 L21

IO73NB1F8 A25

IO73PB1F8 A24

IO74NB1F8 C28

IO74PB1F8 C27

IO75NB1F8 D24

IO75PB1F8 D23

IO76NB1F8 J24

IO76PB1F8 J23

IO77NB1F8 B25

IO77PB1F8 B24

IO78NB1F8 F24

IO78PB1F8 G24

IO79NB1F8 A28

IO79PB1F8 A29

IO80NB1F8 M24

IO80PB1F8 M23

IO81NB1F8 B28

IO81PB1F8 B27

IO82NB1F9 H25

IO82PB1F9 H24

IO83NB1F9 C25

IO83PB1F9 C24

IO84NB1F9 K25

IO84PB1F9 K24

IO85NB1F9 A33

IO85PB1F9 A32

IO86NB1F9 G25

IO86PB1F9 F25

IO87NB1F9 E26

IO87PB1F9 E25

IO88NB1F9 J26

IO88PB1F9 J25

CG1272/LG1272

RTAX4000D Function Pin Number

IO89NB1F9 D26

IO89PB1F9 D25

IO90NB1F9 E31

IO90PB1F9 E32

IO91NB1F9 A31

IO91PB1F9 A30

IO92NB1F9 H27

IO92PB1F9 H26

IO93NB1F9 C33

IO93PB1F9 B33

IO94NB1F10 G27

IO94PB1F10 F27

IO95NB1F10 E27

IO95PB1F10 D27

IO96NB1F10 L24

IO96PB1F10 L25

IO97NB1F10 C31

IO97PB1F10 C30

IO98NB1F10 F28

IO98PB1F10 G28

IO99NB1F10 B31

IO99PB1F10 B30

IO100NB1F10 J28

IO100PB1F10 J27

IO101NB1F10 E29

IO101PB1F10 E30

IO102NB1F10 D28

IO102PB1F10 E28

IO103NB1F10 D30

IO103PB1F10 D29

Bank 2

IO104NB2F12 L29

IO104PB2F12 L28

IO105NB2F12 D35

IO105PB2F12 D34

IO106NB2F12 H33

CG1272/LG1272

RTAX4000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-93

IO106PB2F12 J33

IO107NB2F12 F34

IO107PB2F12 F33

IO108NB2F12 G33

IO108PB2F12 G32

IO109NB2F12 M28

IO109PB2F12 M27

IO110NB2F12 K33

IO110PB2F12 K32

IO111NB2F12 K31

IO111PB2F12 K30

IO112NB2F13 K34

IO112PB2F13 J34

IO113NB2F13 N26

IO113PB2F13 M26

IO114NB2F13 K28

IO114PB2F13 K29

IO115NB2F13 H32

IO115PB2F13 J32

IO116NB2F13 G35

IO116PB2F13 G34

IO117NB2F13 M29

IO117PB2F13 M30

IO118NB2F13 E33

IO118PB2F13 D33

IO119NB2F13 M32

IO119PB2F13 M31

IO120NB2F13 E36

IO120PB2F13 D36

IO121NB2F14 N28

IO121PB2F14 N27

IO122NB2F14 L33

IO122PB2F14 L32

IO123NB2F14 N30

IO123PB2F14 N29

IO124NB2F14 K35

CG1272/LG1272

RTAX4000D Func tio n Pin Number

IO124PB2F14 J35

IO125NB2F14 P25

IO125PB2F14 N25

IO126NB2F14 H36

IO126PB2F14 G36

IO127NB2F14 N32

IO127PB2F14 N31

IO128NB2F14 N34

IO128PB2F14 M34

IO129NB2F14 P29

IO129PB2F14 P28

IO130NB2F15 N33

IO130PB2F15 M33

IO131NB2F15 R26

IO131PB2F15 R25

IO132NB2F15 K36

IO132PB2F15 J36

IO133NB2F15 R29

IO133PB2F15 R28

IO134NB2F15 N35

IO134PB2F15 M35

IO135NB2F15 F35

IO135PB2F15 F36

IO136NB2F15 M36

IO136PB2F15 L36

IO137NB2F15 T26

IO137PB2F15 T25

IO138NB2F15 P33

IO138PB2F15 P32

IO139NB2F16 R31

IO139PB2F16 R30

IO140NB2F16 P36

IO140PB2F16 N36

IO141NB2F16 T28

IO141PB2F16 T27

IO142NB2F16 R35

CG1272/LG1272

RTAX4000D Function Pin Number

IO142PB2F16 R34

IO143NB2F16 T32

IO143PB2F16 T31

IO144NB2F16 T35

IO144PB2F16 T34

IO145NB2F16 T30

IO145PB2F16 T29

IO146NB2F16 R33

IO146PB2F16 R32

IO147NB2F16 V25

IO147PB2F16 U25

IO148NB2F17 T36

IO148PB2F17 R36

IO149NB2F17 U29

IO149PB2F17 U28

IO150NB2F17 U33

IO150PB2F17 T33

IO151NB2F17 W25

IO151PB2F17 Y25

IO152NB2F17 V36

IO152PB2F17 U36

IO153NB2F17 V31

IO153PB2F17 V30

IO154NB2F17 V32

IO154PB2F17 U32

IO155NB2F17 V27

IO155PB2F17 V28

IO156NB2F17 W34

IO156PB2F17 V34

Bank 3

IO157NB3F18 W29

IO157PB3F18 V29

IO158NB3F18 W35

IO158PB3F18 V35

IO159NB3F18 W30

IO159PB3F18 W31

CG1272/LG1272

RTAX4000D Function Pin Number

Package Pin Assignments

3-94 Revision 15

IO160NB3F18 AA36

IO160PB3F18 Y36

IO161NB3F18 W27

IO161PB3F18 W28

IO162NB3F18 Y32

IO162PB3F18 W32

IO163NB3F18 Y28

IO163PB3F18 Y29

IO164NB3F18 AC36

IO164PB3F18 AB36

IO165NB3F18 AA26

IO165PB3F18 AA25

IO166NB3F19 AA33

IO166PB3F19 Y33

IO167NB3F19 AA32

IO167PB3F19 AA31

IO168NB3F19 AA34

IO168PB3F19 AA35

IO169NB3F19 AA29

IO169PB3F19 AA30

IO170NB3F19 AB32

IO170PB3F19 AB33

IO171NB3F19 AB31

IO171PB3F19 AB30

IO172NB3F19 AE36

IO172PB3F19 AD36

IO173NB3F19 AA27

IO173PB3F19 AA28

IO174NB3F19 AB34

IO174PB3F19 AB35

IO175NB3F20 AL35

IO175PB3F20 AL36

IO176NB3F20 AG36

IO176PB3F20 AF36

IO177NB3F20 AB25

IO177PB3F20 AB26

CG1272/LG1272

RTAX4000D Func tio n Pin Number

IO178NB3F20 AC32

IO178PB3F20 AC33

IO179NB3F20 AB29

IO179PB3F20 AB28

IO180NB3F20 AJ36

IO180PB3F20 AH36

IO181NB3F20 AC25

IO181PB3F20 AD25

IO182NB3F20 AE35

IO182PB3F20 AD35

IO183NB3F20 AC29

IO183PB3F20 AC28

IO184NB3F21 AE34

IO184PB3F21 AD34

IO185NB3F21 AE26

IO185PB3F21 AD26

IO186NB3F21 AE33

IO186PB3F21 AD33

IO187NB3F21 AD30

IO187PB3F21 AD29

IO188NB3F21 AH35

IO188PB3F21 AG35

IO189NB3F21 AD32

IO189PB3F21 AD31

IO190NB3F21 AK35

IO190PB3F21 AK36

IO191NB3F21 AE32

IO191PB3F21 AE31

IO192NB3F21 AN36

IO192PB3F21 AM36

IO193NB3F22 AD27

IO193PB3F22 AD28

IO194NB3F22 AF32

IO194PB3F22 AF33

IO195NB3F22 AE30

IO195PB3F22 AE29

CG1272/LG1272

RTAX4000D Function Pin Number

IO196NB3F22 AK34

IO196PB3F22 AL34

IO197NB3F22 AE28

IO197PB3F22 AE27

IO198NB3F22 AN33

IO198PB3F22 AM33

IO199NB3F22 AH31

IO199PB3F22 AH30

IO200NB3F22 AH34

IO200PB3F22 AG34

IO201NB3F22 AF29

IO201PB3F22 AF28

IO202NB3F23 AG32

IO202PB3F23 AG33

IO203NB3F23 AG31

IO203PB3F23 AG30

IO204NB3F23 AL33

IO204PB3F23 AK33

IO205NB3F23 AK32

IO205PB3F23 AK31

IO206NB3F23 AH33

IO206PB3F23 AJ33

IO207NB3F23 AN34

IO207PB3F23 AN35

IO208NB3F23 AG29

IO208PB3F23 AG28

IO209NB3F23 AJ32

IO209PB3F23 AH32

Bank 4

IO210NB4F24 AM28

IO210PB4F24 AN28

IO211NB4F24 AN29

IO211PB4F24 AN30

IO212NB4F24 AH27

IO212PB4F24 AH28

IO213NB4F24 AM30

CG1272/LG1272

RTAX4000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-95

IO213PB4F24 AM29

IO214NB4F24 AL28

IO214PB4F24 AK28

IO215NB4F24 AR30

IO215PB4F24 AR31

IO216NB4F24 AF24

IO216PB4F24 AF25

IO217NB4F24 AP30

IO217PB4F24 AP31

IO218NB4F24 AL27

IO218PB4F24 AK27

IO219NB4F24 AN27

IO219PB4F24 AM27

IO220NB4F25 AJ26

IO220PB4F25 AJ27

IO221NB4F25 AT32

IO221PB4F25 AT33

IO222NB4F25 AN31

IO222PB4F25 AN32

IO223NB4F25 AT30

IO223PB4F25 AT31

IO224NB4F25 AH25

IO224PB4F25 AH26

IO225NB4F25 AN25

IO225PB4F25 AN26

IO226NB4F25 AL25

IO226PB4F25 AK25

IO227NB4F25 AM25

IO227PB4F25 AM26

IO228NB4F25 AG25

IO228PB4F25 AG24

IO229NB4F25 AR33

IO229PB4F25 AP33

IO230NB4F25 AJ24

IO230PB4F25 AJ25

IO231NB4F25 AT26

CG1272/LG1272

RTAX4000D Func tio n Pin Number

IO231PB4F25 AT27

IO232NB4F26 AE23

IO232PB4F26 AE24

IO233NB4F26 AR27

IO233PB4F26 AR28

IO234NB4F26 AH23

IO234PB4F26 AH24

IO235NB4F26 AT29

IO235PB4F26 AT28

IO236NB4F26 AK24

IO236PB4F26 AL24

IO237NB4F26 AR24

IO237PB4F26 AR25

IO238NB4F26 AF21

IO238PB4F26 AF22

IO239NB4F26 AP24

IO239PB4F26 AP25

IO240NB4F26 AP27

IO240PB4F26 AP28

IO241NB4F26 AN23

IO241PB4F26 AN24

IO242NB4F27 AG21

IO242PB4F27 AG22

IO243NB4F27 AM22

IO243PB4F27 AM23

IO244NB4F27 AK22

IO244PB4F27 AL22

IO245NB4F27 AT24

IO245PB4F27 AT25

IO246NB4F27 AH21

IO246PB4F27 AH22

IO247NB4F27 AP22

IO247PB4F27 AN22

IO248NB4F27 AJ22

IO248PB4F27 AJ23

IO249NB4F27 AR21

CG1272/LG1272

RTAX4000D Function Pin Number

IO249PB4F27 AR22

IO250NB4F27 AE21

IO250PB4F27 AE20

IO251NB4F27 AM21

IO251PB4F27 AL21

IO252NB4F27 AH20

IO252PB4F27 AJ20

IO253NB4F27 AT23

IO253PB4F27 AT22

IO254NB4F28 AK21

IO254PB4F28 AJ21

IO255NB4F28 AT20

IO255PB4F28 AT21

IO256NB4F28 AE18

IO256PB4F28 AE19

IO257NB4F28 AM19

IO257PB4F28 AM20

IO258NB4F28 AK19

IO258PB4F28 AJ19

IO259NB4F28 AP19

IO259PB4F28 AR19

IO260NB4F28/CLKEN AH19

IO260PB4F28/CLKEP AG19

IO261NB4F28/CLKFN AN19

IO261PB4F28/CLKFP AN20

Bank 5

IO262NB5F30/CLKGN AG18

IO262PB5F30/CLKGP AH18

IO263NB5F30/CLKHN AN17

IO263PB5F30/CLKHP AN18

IO264NB5F30 AJ18

IO264PB5F30 AK18

IO265NB5F30 AR18

IO265PB5F30 AP18

IO266NB5F30 AE17

IO266PB5F30 AE16

CG1272/LG1272

RTAX4000D Function Pin Number

Package Pin Assignments

3-96 Revision 15

IO267NB5F30 AM17

IO267PB5F30 AM18

IO268NB5F30 AJ16

IO268PB5F30 AK16

IO269NB5F30 AT16

IO269PB5F30 AT17

IO270NB5F30 AF16

IO270PB5F30 AF15

IO271NB5F30 AT15

IO271PB5F30 AT14

IO272NB5F31 AH17

IO272PB5F31 AJ17

IO273NB5F31 AL16

IO273PB5F31 AM16

IO274NB5F31 AH15

IO274PB5F31 AH16

IO275NB5F31 AR15

IO275PB5F31 AR16

IO276NB5F31 AJ14

IO276PB5F31 AJ15

IO277NB5F31 AN15

IO277PB5F31 AP15

IO278NB5F31 AG15

IO278PB5F31 AG16

IO279NB5F31 AT10

IO279PB5F31 AT11

IO280NB5F31 AL15

IO280PB5F31 AK15

IO281NB5F32 AM14

IO281PB5F32 AM15

IO282NB5F32 AE13

IO282PB5F32 AE14

IO283NB5F32 AT12

IO283PB5F32 AT13

IO284NB5F32 AP9

IO284PB5F32 AP10

CG1272/LG1272

RTAX4000D Func tio n Pin Number

IO285NB5F32 AN13

IO285PB5F32 AN14

IO286NB5F32 AN9

IO286PB5F32 AM9

IO287NB5F32 AR12

IO287PB5F32 AR13

IO288NB5F32 AL13

IO288PB5F32 AK13

IO289NB5F32 AT9

IO289PB5F32 AT8

IO290NB5F32 AH13

IO290PB5F32 AH14

IO291NB5F32 AR9

IO291PB5F32 AR10

IO292NB5F32 AJ12

IO292PB5F32 AJ13

IO293NB5F33 AP12

IO293PB5F33 AP13

IO294NB5F33 AG13

IO294PB5F33 AF13

IO295NB5F33 AP4

IO295PB5F33 AR4

IO296NB5F33 AG12

IO296PB5F33 AF12

IO297NB5F33 AM11

IO297PB5F33 AM12

IO298NB5F33 AK12

IO298PB5F33 AL12

IO299NB5F33 AN11

IO299PB5F33 AN12

IO300NB5F33 AN5

IO300PB5F33 AN6

IO301NB5F33 AT6

IO301PB5F33 AT7

IO302NB5F34 AH11

IO302PB5F34 AH12

CG1272/LG1272

RTAX4000D Function Pin Number

IO303NB5F34 AT4

IO303PB5F34 AT5

IO304NB5F34 AJ10

IO304PB5F34 AJ11

IO305NB5F34 AM10

IO305PB5F34 AN10

IO306NB5F34 AK10

IO306PB5F34 AL10

IO307NB5F34 AP6

IO307PB5F34 AP7

IO308NB5F34 AK9

IO308PB5F34 AL9

IO309NB5F34 AR6

IO309PB5F34 AR7

IO310NB5F34 AH9

IO310PB5F34 AH10

IO311NB5F34 AM8

IO311PB5F34 AM7

IO312NB5F34 AG9

IO312PB5F34 AG8

IO313NB5F34 AN7

IO313PB5F34 AN8

Bank 6

IO314NB6F36 AF8

IO314PB6F36 AF9

IO315NB6F36 AN2

IO315PB6F36 AN3

IO316NB6F36 AH4

IO316PB6F36 AJ4

IO317NB6F36 AL3

IO317PB6F36 AL4

IO318NB6F36 AK4

IO318PB6F36 AK5

IO319NB6F36 AE10

IO319PB6F36 AE9

IO320NB6F36 AG4

CG1272/LG1272

RTAX4000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-97

IO320PB6F36 AG5

IO321NB6F36 AE11

IO321PB6F36 AD11

IO322NB6F37 AG3

IO322PB6F37 AH3

IO323NB6F37 AG7

IO323PB6F37 AG6

IO324NB6F37 AH7

IO324PB6F37 AH6

IO325NB6F37 AJ5

IO325PB6F37 AH5

IO326NB6F37 AK2

IO326PB6F37 AK3

IO327NB6F37 AE7

IO327PB6F37 AE8

IO328NB6F37 AM4

IO328PB6F37 AN4

IO329NB6F37 AD9

IO329PB6F37 AD10

IO330NB6F37 AM1

IO330PB6F37 AN1

IO331NB6F38 AE5

IO331PB6F38 AE6

IO332NB6F38 AF4

IO332PB6F38 AF5

IO333NB6F38 AD8

IO333PB6F38 AD7

IO334NB6F38 AG2

IO334PB6F38 AH2

IO335NB6F38 AC12

IO335PB6F38 AD12

IO336NB6F38 AJ1

IO336PB6F38 AK1

IO337NB6F38 AC8

IO337PB6F38 AC9

IO338NB6F38 AD3

CG1272/LG1272

RTAX4000D Func tio n Pin Number

IO338PB6F38 AE3

IO339NB6F38 AD5

IO339PB6F38 AD6

IO340NB6F39 AD4

IO340PB6F39 AE4

IO341NB6F39 AB8

IO341PB6F39 AB9

IO342NB6F39 AG1

IO342PB6F39 AH1

IO343NB6F39 AA12

IO343PB6F39 AB12

IO344NB6F39 AD2

IO344PB6F39 AE2

IO345NB6F39 AA11

IO345PB6F39 AB11

IO346NB6F39 AE1

IO346PB6F39 AF1

IO347NB6F39 AL1

IO347PB6F39 AL2

IO348NB6F39 AC4

IO348PB6F39 AC5

IO349NB6F40 AB6

IO349PB6F40 AB7

IO350NB6F40 AC1

IO350PB6F40 AD1

IO351NB6F40 AA9

IO351PB6F40 AA10

IO352NB6F40 AB2

IO352PB6F40 AB3

IO353NB6F40 AA7

IO353PB6F40 AA8

IO354NB6F40 AA2

IO354PB6F40 AA3

IO355NB6F40 AA5

IO355PB6F40 AA6

IO356NB6F40 AB4

CG1272/LG1272

RTAX4000D Function Pin Number

IO356PB6F40 AB5

IO357NB6F40 W12

IO357PB6F40 Y12

IO358NB6F41 AA1

IO358PB6F41 AB1

IO359NB6F41 Y8

IO359PB6F41 Y9

IO360NB6F41 Y4

IO360PB6F41 AA4

IO361NB6F41 U12

IO361PB6F41 V12

IO362NB6F41 W1

IO362PB6F41 Y1

IO363NB6F41 W6

IO363PB6F41 W7

IO364NB6F41 W5

IO364PB6F41 Y5

IO365NB6F41 W10

IO365PB6F41 W9

IO366NB6F41 V2

IO366PB6F41 W2

Bank 7

IO367NB7F42 V8

IO367PB7F42 W8

IO368NB7F42 V3

IO368PB7F42 W3

IO369NB7F42 V9

IO369PB7F42 V10

IO370NB7F42 U1

IO370PB7F42 V1

IO371NB7F42 V7

IO371PB7F42 V6

IO372NB7F42 U5

IO372PB7F42 V5

IO373NB7F42 U9

IO373PB7F42 U8

CG1272/LG1272

RTAX4000D Function Pin Number

Package Pin Assignments

3-98 Revision 15

IO374NB7F42 R1

IO374PB7F42 T1

IO375NB7F42 T11

IO375PB7F42 T12

IO376NB7F43 T4

IO376PB7F43 U4

IO377NB7F43 T8

IO377PB7F43 T7

IO378NB7F43 T3

IO378PB7F43 T2

IO379NB7F43 T5

IO379PB7F43 T6

IO380NB7F43 R5

IO380PB7F43 R4

IO381NB7F43 R6

IO381PB7F43 R7

IO382NB7F43 N1

IO382PB7F43 P1

IO383NB7F43 T10

IO383PB7F43 T9

IO384NB7F43 R3

IO384PB7F43 R2

IO385NB7F44 R12

IO385PB7F44 R11

IO386NB7F44 L1

IO386PB7F44 M1

IO387NB7F44 G2

IO387PB7F44 F2

IO388NB7F44 P5

IO388PB7F44 P4

IO389NB7F44 R8

IO389PB7F44 R9

IO390NB7F44 J1

IO390PB7F44 K1

IO391NB7F44 N12

IO391PB7F44 P12

CG1272/LG1272

RTAX4000D Func tio n Pin Number

IO392NB7F44 M2

IO392PB7F44 N2

IO393NB7F44 P9

IO393PB7F44 P8

IO394NB7F45 M3

IO394PB7F45 N3

IO395NB7F45 M11

IO395PB7F45 N11

IO396NB7F45 M4

IO396PB7F45 N4

IO397NB7F45 N5

IO397PB7F45 N6

IO398NB7F45 J2

IO398PB7F45 K2

IO399NB7F45 N8

IO399PB7F45 N7

IO400NB7F45 G1

IO400PB7F45 H1

IO401NB7F45 M5

IO401PB7F45 M6

IO402NB7F45 E1

IO402PB7F45 F1

IO403NB7F46 N10

IO403PB7F46 N9

IO404NB7F46 L5

IO404PB7F46 L4

IO405NB7F46 M7

IO405PB7F46 M8

IO406NB7F46 G3

IO406PB7F46 F3

IO407NB7F46 M10

IO407PB7F46 M9

IO408NB7F46 D4

IO408PB7F46 D3

IO409NB7F46 J7

IO409PB7F46 J6

CG1272/LG1272

RTAX4000D Function Pin Number

IO410NB7F46 J3

IO410PB7F46 K3

IO411NB7F46 L8

IO411PB7F46 L9

IO412NB7F47 K5

IO412PB7F47 K4

IO413NB7F47 K7

IO413PB7F47 K6

IO414NB7F47 E4

IO414PB7F47 F4

IO415NB7F47 G4

IO415PB7F47 G5

IO416NB7F47 H4

IO416PB7F47 J4

IO417NB7F47 D2

IO417PB7F47 D1

IO418NB7F47 K8

IO418PB7F47 K9

IO419NB7F47 H5

IO419PB7F47 J5

Dedicated I/O

GND AA13

GND AA15

GND AA17

GND AA19

GND AA21

GND AA23

GND AA24

GND AB14

GND AB16

GND AB18

GND AB20

GND AB22

GND AC3

GND AC7

GND AC11

CG1272/LG1272

RTAX4000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-99

GND AC13

GND AC15

GND AC17

GND AC19

GND AC21

GND AC23

GND AC24

GND AC26

GND AC30

GND AC34

GND AD13

GND AD14

GND AD16

GND AD18

GND AD19

GND AD21

GND AD23

GND AD24

GND AE15

GND AE25

GND AF3

GND AF7

GND AF10

GND AF11

GND AF14

GND AF17

GND AF20

GND AF23

GND AF26

GND AF27

GND AF30

GND AF34

GND AJ3

GND AJ7

GND AJ29

GND AJ30

CG1272/LG1272

RTAX4000D Func tio n Pin Number

GND AJ34

GND AK6

GND AK8

GND AK11

GND AK14

GND AK17

GND AK20

GND AK23

GND AK26

GND AK29

GND AL7

GND AL18

GND AL31

GND AM3

GND AM34

GND AP2

GND AP5

GND AP8

GND AP11

GND AP14

GND AP17

GND AP20

GND AP23

GND AP26

GND AP29

GND AP32

GND AP35

GND AR3

GND AR34

GND B3

GND B34

GND C2

GND C5

GND C8

GND C11

GND C14

CG1272/LG1272

RTAX4000D Function Pin Number

GND C17

GND C20

GND C23

GND C26

GND C29

GND C32

GND C35

GND E3

GND E34

GND F7

GND F30

GND G8

GND G11

GND G14

GND G17

GND G20

GND G23

GND G26

GND G29

GND H3

GND H7

GND H30

GND H34

GND J8

GND J31

GND L3

GND L7

GND L10

GND L11

GND L14

GND L17

GND L20

GND L23

GND L26

GND L27

GND L30

CG1272/LG1272

RTAX4000D Function Pin Number

Package Pin Assignments

3-100 Revision 15

GND L34

GND M15

GND M25

GND N14

GND N16

GND N18

GND N19

GND N21

GND N23

GND N24

GND P3

GND P7

GND P11

GND P13

GND P14

GND P16

GND P18

GND P20

GND P22

GND P24

GND P26

GND P30

GND P34

GND R15

GND R17

GND R19

GND R21

GND R23

GND R27

GND T13

GND T14

GND T16

GND T18

GND T20

GND T22

GND T24

CG1272/LG1272

RTAX4000D Func tio n Pin Number

GND U3

GND U7

GND U11

GND U15

GND U17

GND U19

GND U21

GND U23

GND U26

GND U30

GND U34

GND V4

GND V13

GND V14

GND V16

GND V18

GND V20

GND V22

GND V24

GND V33

GND W4

GND W11

GND W13

GND W15

GND W17

GND W19

GND W21

GND W23

GND W24

GND W26

GND Y3

GND Y7

GND Y11

GND Y14

GND Y16

GND Y18

CG1272/LG1272

RTAX4000D Function Pin Number

GND Y20

GND Y22

GND Y26

GND Y30

GND Y34

NC AJ8

NC W36

PRA F18

PRB A18

PRC AL19

PRD AT19

TCK H8

TDI F6

TDO H9

TMS F5

TRST G7

VCCA M12

VCCA AE12

VCCA AL5

VCCA AT18

VCCA AL32

VCCA W33

VCCA J30

VCCA A19

VCCA AA14

VCCA AA16

VCCA AA18

VCCA AA20

VCCA AA22

VCCA AB15

VCCA AB17

VCCA AB19

VCCA AB21

VCCA AB23

VCCA AC14

VCCA AC16

CG1272/LG1272

RTAX4000D Function Pin Number

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 3-101

VCCA AC18

VCCA AC20

VCCA AC22

VCCA AP3

VCCA AP34

VCCA C3

VCCA C34

VCCA P15

VCCA P17

VCCA P19

VCCA P21

VCCA P23

VCCA R14

VCCA R16

VCCA R18

VCCA R20

VCCA R22

VCCA T15

VCCA T17

VCCA T19

VCCA T21

VCCA T23

VCCA U14

VCCA U16

VCCA U18

VCCA U20

VCCA U22

VCCA V15

VCCA V17

VCCA V19

VCCA V21

VCCA V23

VCCA W14

VCCA W16

VCCA W18

VCCA W20

CG1272/LG1272

RTAX4000D Func tio n Pin Number

VCCA W22

VCCA Y15

VCCA Y17

VCCA Y19

VCCA Y21

VCCA Y23

VCCDA G6

VCCDA R10

VCCDA V11

VCCDA AB10

VCCDA AK7

VCCDA AL6

VCCDA AM13

VCCDA AH8

VCCDA AM5

VCCDA AJ9

VCCDA AP16

VCCDA AM6

VCCDA AN16

VCCDA AF18

VCCDA AF19

VCCDA AN21

VCCDA AE22

VCCDA AP21

VCCDA AM31

VCCDA AJ28

VCCDA AM32

VCCDA AM24

VCCDA AL30

VCCDA AK30

VCCDA AH29

VCCDA V26

VCCDA AB27

VCCDA H29

VCCDA H28

VCCDA E24

CG1272/LG1272

RTAX4000D Function Pin Number

VCCDA G30

VCCDA J29

VCCDA G31

VCCDA C21

VCCDA F31

VCCDA D21

VCCDA M22

VCCDA F19

VCCDA D16

VCCDA L19

VCCDA C16

VCCDA L18

VCCDA N13

VCCDA E6

VCCDA E13

VCCDA E5

VCCIB0 B11

VCCIB0 B14

VCCIB0 B17

VCCIB0 B5

VCCIB0 B8

VCCIB0 F11

VCCIB0 F14

VCCIB0 F17

VCCIB0 F8

VCCIB0 K11

VCCIB0 K14

VCCIB0 K17

VCCIB0 N15

VCCIB0 N17

VCCIB1 B20

VCCIB1 B23

VCCIB1 B26

VCCIB1 B29

VCCIB1 B32

VCCIB1 F20

CG1272/LG1272

RTAX4000D Function Pin Number

Package Pin Assignments

3-102 Revision 15

VCCIB1 F23

VCCIB1 F26

VCCIB1 F29

VCCIB1 K20

VCCIB1 K23

VCCIB1 K26

VCCIB1 N20

VCCIB1 N22

VCCIB2 E35

VCCIB2 H31

VCCIB2 H35

VCCIB2 K27

VCCIB2 L31

VCCIB2 L35

VCCIB2 P27

VCCIB2 P31

VCCIB2 P35

VCCIB2 R24

VCCIB2 U24

VCCIB2 U27

VCCIB2 U31

VCCIB2 U35

VCCIB3 AB24

VCCIB3 AC27

VCCIB3 AC31

VCCIB3 AC35

VCCIB3 AF31

VCCIB3 AF35

VCCIB3 AG27

VCCIB3 AJ31

VCCIB3 AJ35

VCCIB3 AM35

VCCIB3 Y24

VCCIB3 Y27

VCCIB3 Y31

VCCIB3 Y35

CG1272/LG1272

RTAX4000D Func tio n Pin Number

VCCIB4 AD20

VCCIB4 AD22

VCCIB4 AG20

VCCIB4 AG23

VCCIB4 AG26

VCCIB4 AL20

VCCIB4 AL23

VCCIB4 AL26

VCCIB4 AL29

VCCIB4 AR20

VCCIB4 AR23

VCCIB4 AR26

VCCIB4 AR29

VCCIB4 AR32

VCCIB5 AD15

VCCIB5 AD17

VCCIB5 AG11

VCCIB5 AG14

VCCIB5 AG17

VCCIB5 AL11

VCCIB5 AL14

VCCIB5 AL17

VCCIB5 AL8

VCCIB5 AR11

VCCIB5 AR14

VCCIB5 AR17

VCCIB5 AR5

VCCIB5 AR8

VCCIB6 AB13

VCCIB6 AC10

VCCIB6 AC2

VCCIB6 AC6

VCCIB6 AF2

VCCIB6 AF6

VCCIB6 AG10

VCCIB6 AJ2

CG1272/LG1272

RTAX4000D Function Pin Number

VCCIB6 AJ6

VCCIB6 AM2

VCCIB6 Y10

VCCIB6 Y13

VCCIB6 Y2

VCCIB6 Y6

VCCIB7 E2

VCCIB7 H2

VCCIB7 H6

VCCIB7 K10

VCCIB7 L2

VCCIB7 L6

VCCIB7 P10

VCCIB7 P2

VCCIB7 P6

VCCIB7 R13

VCCIB7 U10

VCCIB7 U13

VCCIB7 U2

VCCIB7 U6

VPUMP F32

CG1272/LG1272

RTAX4000D Function Pin Number

Revision 15 4-1

4 – Related Document s

Application Notes

Simultaneous Switching Noise and Signal Integrity

http://www.microsemi.com/soc/documents/SSN_AN.pdf

Differences Between RTAX-S/SL and Axcelerator

http://www.microsemi.com/soc/documents/RTAXS_AX_Features_AN.pdf

Using EDAC RAM for RadTolerant RTAX-S/SL FPGAs and Axcelerator FPGAs

http://www.microsemi.com/soc/documents/EDAC_AN.pdf

Prototyping for RTAX-S and RTAX-SL Devices

http://www.microsemi.com/soc/documents/PrototypingRTAXS_AN.pdf

Implementation of Security in Actel Anti fuse FPGAs

http://www.microsemi.com/soc/documents/Antifuse_Security_AN.pdf

Actel CQFP to FBGA Adapter Socket Instructions

http://www.microsemi.com/soc/documents/CCGA_FBGA_AN.pdf

Actel CCGA to FBGA Adapter Socket Instructions

http://www.microsemi.com/soc/documents/CQ352-FPGA_Adapter_AN.pdf

IEEE Standard 1149.1 (JTAG) in the Axcelerator Family

http://www.microsemi.com/soc/documents/AX_JTAG_AN.pdf

User’s Guides and Manuals

Antifuse Macro Library Guide

http://www.microsemi.com/soc/documents/libguide_UG.pdf

SmartGen, FlashROM, Analog System Builder, and Flash Memory System Builder User’s Guide

http://www.microsemi.com/soc/documents/smarttime_ug.pdf

Silicon Sculptor User’s Guide

http://www.microsemi.com/soc/documents/SiliSculptII_Sculpt3_ug.pdf

Silicon Explorer II User’s Guide

http://www.microsemi.com/soc/documents/Silexpl_UG.pdf

White Papers

Design Security in Nonvolatile Flash and Antifuse FPGAs

http://www.microsemi.com/soc/documents/DesignSecurity_WP.pdf

Understanding Actel Antifuse Device Security

http://www.microsemi.com/soc/documents/AntifuseSecurityWP.pdf

RTAX-S/SL Testing and Reliability Update

http://www.microsemi.com/soc/documents/RTAXS_Rel_Test_WP.pdf

Miscellaneous

Libero IDE flow diagram

http://www.microsemi.com/soc/products/software/libero/#flow

Revision 15 5-1

5 – Dat asheet Information

List of Changes

The following table lists critical changes that were made in each revision of the document.

Revision Changes Page

Revision 15

(May 2012)

The maximum number of I/Os for the CG/LG624 package in RTAX250S/SL was

corrected from 232 to 248 in the "Device Resources" table (SAR 34359).

iii

Table 3 • Extended Flow for RTAX-S/SL and RTAX-DSP1, 2, 3, 4 was revised to include

a reference to note 5 on the Destructive Bond Pull step, step 1. A missing step 7 was

added: Seal (Fine and Gross Leak Test). "Method 2003" was corrected to "Method 2023"

in table note 5 (SAR 37426).

"QML Class V MIL-PRF-38535 Flow" for RTAX-S/SL devices is new (SAR 36697). vii

"EV" Flow (Class V Flow Equivalent Processing) for RTAX-DSP devices has been

revised (SAR 36697). In Table 5 • "EV" Flow (Class V Equivalent Flow Processing) for

RTAX-DSP1, 2, 3, DSCC was revised to DLA in table note 1 and "Method 2003" was

corrected to "Method 2023" in table note 4 (SAR 37426).

viii

Table 2-4 • RTAX-S Standby Current was corrected. Values of ICCDIFFA for 25°C and

125°C had been reversed for all devices except RTAX4000S (SAR 38027).

2-3

Table 2-6 • RTAX-DSP Standby Current and Table 2-7 • RTAX-DL Standby Current were

updated (SAR 36920).

2-4

The "VPUMP Supply Voltage (External Pump)" pin description was updated (SAR

37032).

2-14

The last sentence of the "HCLKA/B/C/D Dedicated (Hardwired) Clocks A, B, C, and D"

pin description was revised to state that Microsemi recommends HCLK pins not being

used as HCLK inputs or I/Os be tied to a known state (SAR 38535).

2-14

Table 2-16 • Bank Wide Delay Values was incorrectly referenced in the "PRA/B/C/D

Probes A, B, C, and D" section for recommendations on pin status for flight boards. The

reference has been corrected to Table 2-117 • JTAG and Probe Pin Recommendations

for Flight (SAR 36561).

2-15

The "TRST Boundary Scan Reset Pin" section was revised to remove the parenthetical

statement, "with or without the pull-up resistor" (SAR 34131).

2-15

Values were added to the global resource timing tables for RTAX2000D and RTAX4000D

(1.425 V) in the "Hardwired Clocks" section and "Routed Clocks" section:

Table 2-84 through Ta b l e 2 - 8 6 and Table 2-96 through Table 2-98 (SAR 33519).

2-103,

2-106

Table 2-106 • Eight RAM Blocks Are Cascaded (Worst-Case Military Conditions VCCA =

1.425 V, VCCI = 3.0 V, TJ = 125°C) and Table 2-107 • Sixteen RAM Blocks Are

Cascaded (Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C)

were updated to account for cross-coupling noise (SAR 36696).

2-118,

2-119

The "TRST" section was rewritten, noting that the TRST pin must be hardwired to

ground for flight (SAR 34131).

2-133

The "Data Registers (DRs)" section was revised to note the IDCODE and USERCODE

registers have 20 bits available for programming (SAR 34512).

2-135

The "Global Set Fuse" section was revised to clarify the cleared and preset states (SARs

38536, 38541).

2-136

Datasheet Information

5-2 Revision 15

Revision 14

(September 2011)

The DL option was added to the "Ordering Information" section and product tables (SAR

33149).

ii to vii

The user I/Os for the CQ352 package in RTAX2000D and RTAX4000D were changed

from 150 to 166 in the "Device Resources" section (SAR 31157).

iii

The "RTAX-S/SL and RTAX-DSP Device Status" table was updated to note that

RTAX2000D/DL and RTAX4000D/DL have moved from Preliminary to Production status

(SAR 33353). The "Speed Grade and Temperature Grade Matrix" table and "Ordering

Information" section now reflect that these devices are available for speed grade –1

(SAR 33148).

iii

The "Programmable Interconnect Element" section and "Security" section were revised

to clarify that although no existing security measures can give an absolute guarantee,

Microsemi FPGAs implement the best security available in the industry (SAR 32865).

1-1,

2-136

Definitions and information about hot-swap and cold-swap was added to the "I/O Logic"

section (SAR 31419).

1-6

P1 and P2 in Figure 1-12 • Mathblocks Cascaded Together as Part of a Complex DSP

Function were replaced with CDOUT1 and CDOUT2 (SAR 32581).

1-8

Figure 2-1 • Use of an External Resistor for 5 V Tolerance was revised to show the VCCI

and GND clamp diodes. The explanatory text above the figure was revised as well (SAR

29699).

2-1

In Table 2-2 • Absolute Maximum Ratings, the VCCA limits were changed from "–0.3 to

1.6" to "–0.3 to 1.7" (SAR 30847).

The VI limits were changed from "–0.5 to 3.75" to "–0.5 to 4.1" (SAR 29757).

A note was added to the table for VCCI stating, "The absolute maximum ratings of VCCI

are applicable to all I/O standards supported by the device" (SAR 31241).

2-2

Values for RTAX2000D were added to Table 2-6 • RTAX-DSP Standby Current (SAR

33286). Table 2-7 • RTAX-DL Standby Current is new (SAR 33149).

2-4

In Table 2-9 • Different Components Contributing to the Total Power Consumption in

RTAX-S/SL/DSP Devices, the P1 value for RTAX4000D was corrected from 7000 to

700.0 (SAR 29953). P13 through P17 were added to the table (SAR 30059).

2-6

PMathBlock was added to the power calculation formulas (SAR 30059). 2-7

A value for θjc was added to Table 2-10 • Package Thermal Characteristics and note 4

was revised to include θjc. "Free convection = 0" was removed from "Sample Case 1"

and "Sample Case 2" (SAR 33910).

2-9, 2-10

The following text was added to the "User-Defined Supply Pins" section (SAR 24308):

The user does not need to assign VREF pins for OUTBUF and TRIBUF. VREF pins are

needed only for input and bidirectional I/Os.

2-14

In the Introduction to the "User I/Os" section, the following sentence was added to clarify

the slew rate setting (SAR 29760):

The slew rate setting is effective for both rising and falling edges.

2-16

The following sentence was added for clarification in the "Using the Weak Pull-Up and

Pull-Down Circuits" section (SAR 31246):

The weak pull-up and pull-down is active only when the device is powered-up.

Reference to Table 2-21 • I/O Weak Pull-Up/Pull-Down Resistances1 replaced the

statement of "on the order of 10 kΩ" (SAR 28695).

Additional information was added to clarify how the weak pull-up and pull-down resistors

are physically implemented (SAR 32714).

2-20

Figure 2-11 • Timing Model was replaced (SAR 33043). 2-28

Revision Changes Page

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 5-3

Revision 14

(continued)

The note in Table 2-16 • Bank Wide Delay Values was revised to reflect that the values in

the table apply not only to RTAX2000S/SL but to all RTAX-DSP and RTAX-S devices

(SAR 32491).

2-21

The description for the CINCLK parameter in Table 2-20 • Input Capacitance was changed

from "Input capacitance on clock pin" to "Input capacitance on HCLK and RCLK pin"

(SAR 31245).

2-26

In Table 2-21 • I/O Weak Pull-Up/Pull-Down Resistances1, notes 2 and 3 were corrected

to give formulas for R(WEAK PULL-UP-MAX) and R(WEAK PULL-DOWN-MAX) rather than

R(PULL-UP-MAX) and R(PULL-DOWN-MAX) and the note regarding output buffers was

removed as not applicable (SARs 29301, 32285).

2-26

Two parameter names were corrected in Figure 2-10 • Output Buffer Delays. One

occurrence of tENLZ was changed to tENZL and one occurrence of tENHZ was changed to

tENZH (SAR 33315).

2-27

The definitions for tENZL and tENHZ were corrected in Table 2-25 • Worst-Case Military

Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C through Table 2-38 • Worst-Case

Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C (SAR 33315).

Previous definitions:

tENZL – Enable to Pad delay through the Output Buffer—High to Z

tENHZ – Enable to Pad delay through the Output Buffer—Z to Low

Corrected definitions:

tENZL – Enable to Pad delay through the Output Buffer—Z to Low

tENHZ – Enable to Pad delay through the Output Buffer—High to Z

2-31

through

2-66

The minimum VIL for 1.5 V LVCMOS was corrected from –0.5 to –0.3 in Table 2-32 • DC

Input and Output Levels (SAR 34280).

2-55

The minimum VIL for 3.3 V PCI was corrected from –0.5 to –0.3 in Table 2-35 • DC Input

and Output Levels (SAR 34280).

2-64

The enable signal in Figure 2-36 • R-Cell Delays was corrected to show it is active low

rather than active high (SAR 32428).

2-91

The "Global Resource Distribution" section previously stated, "24 segments per HCLK

driving north-south and 28 segments per CLK driving east-west per core tile." This text

was removed and replaced by a reference to the RTAX-S/SL Clocking Resource and

Implementation application note (SAR 28040).

2-108

Package names used in the "Package Pin Assignments" section were revised to match

standards given in Packag e Mechanical Drawings (SAR 27395).

3-1

Bank numbers were added to the following pin tables for RTAX-DSP packages (SAR

28992):

"CQ352" for RTAX2000D

"CQ352" for RTAX4000D

"CG1272/LG1272" for RTAX2000D

"CG1272/LG1272" for RTAX4000D

3-26

3-30

3-79

3-91

Revision 13

(August 2010)

The versioning system for datasheets has been changed. Datasheets are assigned a

revision number that increments each time the datasheet is revised. The "RTAX-S/SL

and RTAX-DSP Device Status" table indicates the status for each device in the device

family.

N/A

References to "Timer" were changed to "SmartTime," which is the current name of the

tool.

N/A

The RTAX-DSP family was added to this datasheet. The RTAX2000D and RTAX4000D

devices were included in applicable tables, text, and the "Ordering Information" section.

N/A

PROTO was added to the "Screening Levels" table for RTAX-S/SL. ii

Revision Changes Page

Datasheet Information

5-4 Revision 15

Revision 13

(continued)

The "Device Resources" table was updated by including a user I/O count of 150 for the

CQ352 package, RTAX2000D. Two notes were added to the table:

1. RTAX2000S/SL and RTAX2000D are not pin compatible in the CQ352 package type.

2. The package overhang for RTAX4000D is slightly larger than RTAX4000S/SL, but they

are pin compatible.

iii

The "I/Os per Package" table was updated for CQ352 and CGD1272/LGD1272. The

column headings "Differential Pair" and "Pair" were changed to "Adjacent Differential

Pairs" and "Non-Adjacent Differential Pairs." Notes were added to the table to define

terms and state how to calculate total number of I/Os (SAR 23483).

Table 2 • MIL-STD-883 Class B Product Flow for RTAX-S/SL and RTAX-DSP 1, 2 was

revised to change the method for Step 4. CQ256 was added to Condition B and

LGD1272 was added to Condition A. Table note 3 was revised to state, "Condition A

applies to RTAX4000S/SL, RTAX2000D, and RTAX4000D packages only."

Table 3 • Extended Flow for RTAX-S/SL and RTAX-DSP1, 2, 3, 4 was revised to change

the method for Step 5. CQ256 was added to Condition B and LGD1272 was added to

Condition A. Table note 5 was revised to state, "Condition A applies to RTAX4000S/SL,

RTAX2000D, and RTAX4000D packages only."

Table 4 • QML Class V MIL-PRF-38535 Flow for RTAX-S/SL1,2 was revised to change

the method for Step 5. CQ256 was added to Condition B and LGD1272 was added to

Condition A. Table note 4 was revised to state, "Condition A applies to RTAX4000S/SL,

RTAX2000D, and RTAX4000D packages only."

vii

The "Embedded Memory" section was revised to note that the pipelined register in each

memory block is not hardened and susceptible to single-event upsets (SAR 24153).

1-5

Table 2-1 • I/O Features Comparison was revised to add a clarifying statement to the first

table note: In other words, 5 V tolerance and hot-swapping/cold-sparing cannot coexist.

Note 2 ("Can be implemented with an external resistor") was indicated as applicable for

3.3 V LVTTL.

2-1

The "5 V Tolerance" section was revised to state that the voltage at the input will not be

clamped if the VCCI or VCCA are powered off. Previously VCCI only was mentioned

(SAR 79584).

2-1

The VCCA and VI limits were revised in Table 2-2 • Absolute Maximum Ratings.2-2

The "Power-Up/Down Sequence" section was updated to add, "During power-down, all

RTAX-S/SL and RTAX-DSP I/Os are tristated (SAR 20917). A reference to the Board-

Level Considerations fo r Power-Up and Power-Down of RTAX-S/SL FPGAs application

note was included.

2-3

In Table 2-4 • RTAX-S Standby Current, ICCDIFFA was revised for RTAX2000S,

RTAX1000S, and RTAX250S at 125°C.

2-3

In Table 2-8 • Default Cload / VCCI, P10 and PI/O values for Single-Ended with VREF

voltages were updated.

2-5

The core tile RCLK power component was updated for RTAX250S/SL in Table 2-9 •

Different Components Contributing to the Total Power Consumption in RTAX-S/SL/DSP

Devices (SAR 23848).

2-6

"Convection" was changed to "free convection" in "Sample Case 1" and "Sample Case

2".

2-10

The values in Table 2-11 • Temperature and Voltage Timing Derating Factors were

updated.

2-11

The "Timing Model" was updated (SAR 79604). The calculated results in the "Hardwired

Clock" section and "Routed Clock" section were updated to match.

2-12,

2-13

The "NC No Connection" pin description was revised to state, "This pin is not connected

to circuitry within the device, or to any other pin in the package" (SAR 79409).

2-15

Revision Changes Page

RTAX-S/SL and RTAX-DSP Radiation-To lerant FPGAs

Revision 15 5-5

Revision 13

(continued)

Table 2-14 • Compatible I/O Standards for Different VCCI Values now refers to Table 2-3

• RTAX-S/SL and RTAX-DSP Recommended Operating Conditions for VCCI tolerances

rather than stating in a table note that VCCI tolerance is ±5%. The example in the

paragraphs below the table was modified to use ±5% rather than ±8% VCCI tolerance for

LVCMOS.

2-18

Figure 2-5 • I/O Cluster Interface was revised to add HCLK or RCLK (SAR 21507). 2-20

Values in the following tables were updated (note that in previous versions of this

datasheet, timing numbers were shown for VCCA at 1.4 V):

Table 2-25 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 125°C

Table 2-28 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 125°C

Table 2-29 • DC Input and Output Levels (SARs 26059, 79593)

Table 2-31 • Worst-Case Military Conditions VCCA = 1.425 V, VCCI = 1.7 V, TJ = 125°C

Table 2-32 • DC Input and Output Levels (SAR 79593)