70
Low Inductance Capacitors
Introduction
The signal integrity characteristics of a Power Delivery
Network (PDN) are becoming critical aspects of board level
and semiconductor package designs due to higher operating
frequencies, larger power demands, and the ever shrinking
lower and upper voltage limits around low operating voltages.
These power system challenges are coming from mainstream
designs with operating frequencies of 300MHz or greater,
modest ICs with power demand of 15 watts or more, and
operating voltages below 3 volts.
The classic PDN topology is comprised of a series of
capacitor stages. Figure 1 is an example of this architecture
with multiple capacitor stages.
An ideal capacitor can transfer all its stored energy to a load
instantly. A real capacitor has parasitics that prevent
instantaneous transfer of a capacitor’s stored energy. The
true nature of a capacitor can be modeled as an RLC
equivalent circuit. For most simulation purposes, it is possible
to model the characteristics of a real capacitor with one
capacitor, one resistor, and one inductor. The RLC values in
this model are commonly referred to as equivalent series
capacitance (ESC), equivalent series resistance (ESR), and
equivalent series inductance (ESL).
The ESL of a capacitor determines the speed of energy
transfer to a load. The lower the ESL of a capacitor, the faster
that energy can be transferred to a load. Historically, there
has been a tradeoff between energy storage (capacitance)
and inductance (speed of energy delivery). Low ESL devices
typically have low capacitance. Likewise, higher capacitance
devices typically have higher ESLs. This tradeoff between
ESL (speed of energy delivery) and capacitance (energy
storage) drives the PDN design topology that places the
fastest low ESL capacitors as close to the load as possible.
Low Inductance MLCCs are found on semiconductor
packages and on boards as close as possible to the load.
LOW INDUCTANCE CHIP CAPACITORS
The key physical characteristic determining equivalent series
inductance (ESL) of a capacitor is the size of the current loop
it creates. The smaller the current loop, the lower the ESL. A
standard surface mount MLCC is rectangular in shape with
electrical terminations on its shorter sides. A Low Inductance
Chip Capacitor (LICC) sometimes referred to as Reverse
Geometry Capacitor (RGC) has its terminations on the longer
side of its rectangular shape.
When the distance between terminations is reduced, the size
of the current loop is reduced. Since the size of the current
loop is the primary driver of inductance, an 0306 with a
smaller current loop has significantly lower ESL then an 0603.
The reduction in ESL varies by EIA size, however, ESL is
typically reduced 60% or more with an LICC versus a
standard MLCC.
INTERDIGITATED CAPACITORS
The size of a current loop has the greatest impact on the ESL
characteristics of a surface mount capacitor. There is a
secondary method for decreasing the ESL of a capacitor.
This secondary method uses adjacent opposing current
loops to reduce ESL. The InterDigitated Capacitor (IDC)
utilizes both primary and secondary methods of reducing
inductance. The IDC architecture shrinks the distance
between terminations to minimize the current loop size, then
further reduces inductance by creating adjacent opposing
current loops.
An IDC is one single capacitor with an internal structure that
has been optimized for low ESL. Similar to standard MLCC
versus LICCs, the reduction in ESL varies by EIA case size.
Typically, for the same EIA size, an IDC delivers an ESL that
is at least 80% lower than an MLCC.
VR
Slowest Capacitors Fastest Capacitors
Low Inductance Decoupling Capacitors
Semiconductor Product
Bulk Board-Level Package-Level Die-Level
Figure 1 Classic Power Delivery Network (PDN) Architecture
71
Low Inductance Capacitors
Introduction
LAND GRID ARRAY (LGA) CAPACITORS
Land Grid Array (LGA) capacitors are based on the first Low
ESL MLCC technology created to specifically address the
design needs of current day Power Delivery Networks (PDNs).
This is the 3rd low inductance capacitor technology
developed by AVX. LGA technology provides engineers with
new options. The LGA internal structure and manufacturing
technology eliminates the historic need for a device to be
physically small to create small current loops to minimize
inductance.
The first family of LGA products are 2 terminal devices. A
2 terminal 0306 LGA delivers ESL performance that is equal
to or better than an 0306 8 terminal IDC. The 2 terminal 0805
LGA delivers ESL performance that approaches the 0508
8 terminal IDC. New designs that would have used 8 terminal
IDCs are moving to 2 terminal LGAs because the layout is
easier for a 2 terminal device and manufacturing yield is better
for a 2 terminal LGA versus an 8 terminal IDC.
LGA technology is also used in a 4 terminal family of products
that AVX is sampling and will formerly introduce in 2008.
Beyond 2008, there are new multi-terminal LGA product
families that will provide even more attractive options for PDN
designers.
LOW INDUCTANCE CHIP ARRAYS (LICA®)
The LICA®product family is the result of a joint development
effort between AVX and IBM to develop a high performance
MLCC family of decoupling capacitors. LICA was introduced
in the 1980s and remains the leading choice of designers in
high performance semiconductor packages and high
reliability board level decoupling applications.
LICA®products are used in 99.999% uptime semiconductor
package applications on both ceramic and organic
substrates. The C4 solder ball termination option is the
perfect compliment to flip-chip packaging technology.
Mainframe class CPUs, ultimate performance multi-chip
modules, and communications systems that must have the
reliability of 5 9’s use LICA®.
LICA®products with either Sn/Pb or Pb-free solder balls are
used for decoupling in high reliability military and aerospace
applications. These LICA®devices are used for decoupling of
large pin count FPGAs, ASICs, CPUs, and other high power
ICs with low operating voltages.
When high reliability decoupling applications require the very
lowest ESL capacitors, LICA®products are the best option.
Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).
470 nF 0306 Impedance Comparison
0.001
0.01
0.1
1
1 10 100 1000
Frequency (MHz)
Impedance (ohms)
0306 2T-LGA
0306 LICC
0306 8T-IDC
0603 MLCC
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GENERAL DESCRIPTION
The key physical characteristic determining equivalent
series inductance (ESL) of a capacitor is the size of the
current loop it creates. The smaller the current loop, the
lower the ESL.
A standard surface mount MLCC is rectangular in shape
with electrical terminations on its shorter sides. A Low
Inductance Chip Capacitor (LICC) sometimes referred to
as Reverse Geometry Capacitor (RGC) has its
terminations on the longer sides of its rectangular shape.
The image on the right shows the termination differences
between an MLCC and an LICC.
When the distance between terminations is reduced, the
size of the current loop is reduced. Since the size of the
current loop is the primary driver of inductance, an 0306
with a smaller current loop has significantly lower ESL
then an 0603. The reduction in ESL varies by EIA size,
however, ESL is typically reduced 60% or more with an
LICC versus a standard MLCC.
AVX LICC products are available with a lead termination
for high reliability military and aerospace applications that
must avoid tin whisker reliability issues.
Low Inductance Capacitors (SnPb)
0612/0508/0306/0204 Tin Lead Termination “B”
HOW TO ORDER
MLCC LICC
LD18
Size
LD15 = 0204
LD16 = 0306
LD17 = 0508
LD18 = 0612
Z
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
D
Dielectric
C = X7R
D = X5R
W = X6S
105
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
M
Capacitance
Tolerance
K = ±10%
M = ±20%
A
Failure Rate
A = N/A
B
Terminations
B = 5% min lead
2
Packaging
Available
2 = 7" Reel
4 = 13" Reel
A*
Thickness
Thickness
mm (in)
0.35 (0.014)
0.56 (0.022)
0.61 (0.024)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerances
K = ±10%; M = ±20%
Operation
X7R = -55°C to +125°C
Temperature Range
X5R = -55°C to +85°C
X7S = -55°C to +125°C
Temperature Coefficient
X7R, X5R = ±15%; X7S = ±22%
Voltage Ratings
4, 6.3, 10, 16, 25 VDC
Dissipation Factor
4V,
6.3V = 6.5% max; 10V = 5.0% max;
16V = 3.5% max; 25V = 3.0% max
Insulation Resistance
100,000MΩ min, or 1,000MΩ per
(@+25°C, RVDC)
μF min.,whichever is less
0.001
0.01
0.1
1
10
1 10 100 1000
Frequency (MHz)
Impedance (Ohms)
LICC_0612
MLCC_1206
TYPICAL IMPEDANCE CHARACTERISTICS
Not RoHS Compliant
75
PREFERRED SIZES ARE SHADED
SIZE LD15 LD16 LD17 LD18
Soldering Reflow Only Reflow Only Reflow/Wave
Packaging All Paper All Paper Paper/Embossed
(L) Length mm 0.50 ± 0.05 0.81 ± 0.15 1.27 ± 0.25 1.60 ± 0.25
(in.) (0.020 ± 0.002) (0.032 ± 0.006) (0.050 ± 0.010) (0.063 ± 0.010)
(W) Width mm 1.00 ± 0.05 1.60 ± 0.15 2.00 ± 0.25 3.20 ± 0.25
(in.) (0.040 ± 0.002) (0.063 ± 0.006) (0.080 ± 0.010) (0.126 ± 0.010)
WVDC 4 6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50
Cap 1000 A A A A S S S S V S S S S V
(pF) 2200 A A A A S S S S V S S S S V
4700 A A A A S S S S V S S S S V
Cap 0.010 A A A A S S S S V S S S S V
(μF) 0.015 A A A A S S S S V S S S S W
0.022 A A A A S S S S V S S S S W
0.047 A A A S S S V A S S S S W
0.068 A A A S S S A A S S S V W
0.10 C C A A A S S V A A S S S V W
0.15 A A S S V S S S W W
0.22 A A S S A S S V V
0.47 V V A S S V
0.68 A A V V W
1.0 A A V V A
1.5 A W W
2.2 AA
3.3 A
4.7
10
WVDC 4 6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50
SIZE 0204 0306 0508 0612
Low Inductance Capacitors (SnPb)
0612/0508/0306/0204 Tin Lead Termination “B”
PHYSICAL DIMENSIONS AND
PAD LAYOUT
Wt
T
L
LW t
0612 1.60 ± 0.25 3.20 ± 0.25 0.13 min.
(0.063 ± 0.010) (0.126 ± 0.010) (0.005 min.)
0508 1.27 ± 0.25 2.00 ± 0.25 0.13 min.
(0.050 ± 0.010) (0.080 ± 0.010) (0.005 min.)
0306 0.81 ± 0.15 1.60 ± 0.15 0.13 min.
(0.032 ± 0.006) (0.063 ± 0.006) (0.005 min.)
0204 0.50 ± 0.05 1.00 ± 0.05 0.18 ± 0.08
(0.020 ± 0.002) (0.040 ± 0.002) (0.007 ± 0.003)
PHYSICAL CHIP DIMENSIONS
mm (in)
“A”CC
“B”
PAD LAYOUT DIMENSIONS mm (in)
ABC
0612 0.76 (0.030) 3.05 (0.120) .635 (0.025)
0508 0.51 (0.020) 2.03 (0.080) 0.76 (0.030)
0306 0.31 (0.012) 1.52 (0.060) 0.51 (0.020)
0204
T - See Range Chart for Thickness and Codes
LD16 - 0306
Code Thickness
A0.61 (0.024)
LD17 - 0508
Code Thickness
S0.56 (0.022)
V0.76 (0.030)
A1.02 (0.040)
LD18 - 0612
Code Thickness
S0.56 (0.022)
V0.76 (0.030)
W1.02 (0.040)
A1.27 (0.050)
Solid = X7R = X5R = X7S
mm (in.)
LD15 - 0204
Code Thickness
C0.35 (0.014)
= X6S
mm (in.) mm (in.)mm (in.)
