1
FEATURES DESCRIPTION
APPLICATIONS
TYPICAL APPLICATION
SYNC
GND PGND
SW
VO=3.3V
6.8 Hm
C =22 F
6.3V
Om
VIN
LBI
C =10 F
25V
Im1 Fm
V =3.8Vto17V
I
VIN
EN
VINA
PGNDGND PwPD
AGND
TPS62111
SW
LBO
PG
1MW
FB
TPS62111
EfficiencyvsOutputCurrent
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
5V
4.2V
12V
8.4V
V =3.3V
T
PFMMode
O
A=25 C
o
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
17-V, 1.5-A, SYNCHRONOUS STEP-DOWN CONVERTER
•High-Efficiency Synchronous Step-Down
The TPS6211x devices are a family of low-noiseConverter With up to 95% Efficiency
synchronous step-down dc-dc converters that areideally suited for systems powered from a 2-cell Li-ion•3.1-V to 17-V Operating Input Voltage Range
battery or from a 12-V or 15-V rail.•Adjustable Output Voltage Range From
The TPS6211x is a synchronous PWM converter with1.2 V to 16 V
integrated N- and P-channel power MOSFET•Fixed Output Voltage Options Available in
switches. Synchronous rectification is used to3.3 V and 5 V
increase efficiency and to reduce external component•Synchronizable to External Clock Signal up to
count. To achieve highest efficiency over a wide1.4 MHz
load-current range, the converter enters apower-saving, pulse-frequency modulation (PFM)•Up to 1.5-A Output Current
mode at light load currents. Operating frequency is•High Efficiency Over a Wide Load-Current
typically 1 MHz, allowing the use of small inductorRange Due to PFM/PWM Operation Mode
and capacitor values. The device can be•100% Maximum Duty Cycle for Lowest
synchronized to an external clock signal in the rangeDropout
of 0.8 MHz to 1.4 MHz. For low-noise operation, theconverter can be operated in PWM-only mode. In the•20- µ A Quiescent Current (Typical)
shutdown mode, the current consumption is reduced•Overtemperature and Overcurrent Protected
to less than 2 µ A. The TPS6211x is available in the•Available in 16-Pin QFN Package
16-pin (RSA) QFN package, and operates over afree-air temperature range of – 40 ° C to 85 ° C.
•Point-of-Load Regulation From 12-V Bus•Organizers, PDAs, and Handheld PCs•Handheld Scanners
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005 – 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PLASTIC QFN 16 PIN
(1)
LBI/LBOOUTPUT VOLTAGE MARKING(RSA) FUNCTIONALITY
TPS62110 Adjustable 1.2 V to 16 V Standard TPS62110TPS62111 3.3 V Standard TPS62111TPS62112 5 V Standard TPS62112TPS62113 Adjustable 1.2 V to 16 V Enhanced TPS62113
(1) The RSA package is available in tape and reel. Add R suffix (TPS62110RSAR) to order quantities of3000 parts per reel. Add T suffix (TPS62110RSAT) to order quantities of 250 parts per reel.
over operating free-air temperature range (unless otherwise noted)
VALUE
V
CC
Supply voltage at VIN, VINA – 0.3 V to 20 VVoltage at SW – 1 V to 20 VV
I
Voltage at EN, SYNC, LBO, PG – 0.3 V to 20 VVoltage at LBI, FB – 0.3 V to 7 VI
O
Output current at SW 2400 mAT
J
Maximum junction temperature 150 ° CT
A
Operating free-air temperature – 40 ° C to 85 ° CT
stg
Storage temperature – 65 ° C to 150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
T
A
≤25 ° C DERATING FACTOR T
A
= 70 ° C T
A
= 85 ° CPACKAGE
POWER RATING ABOVE T
A
= 25 ° C POWER RATING POWER RATING
RSA 2.5 W 25 mW/ ° C 1.375 W 1 W
(1) Based on a thermal resistance of 40 K/W soldered onto a high-K board.
MIN NOM MAX UNIT
V
CC
Supply voltage at VIN, VINA 3.1 17 VMaximum voltage at power-good, LBO, EN, SYNC 17 VT
J
Operating junction temperature – 40 125 ° C
2Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
ELECTRICAL CHARACTERISTICS
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
V
I
= 12 V, V
O
= 3.3 V, I
O
= 600 mA, EN = V
I
, T
A
= – 40 ° C to 85 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
V
I
Input voltage range 3.1 17 VI
O
= 0 mA, SYNC = GND, V
I
= 7.2 V, 20T
A
= 25 ° C
(1)I
(Q)
Operating quiescent current µ AI
O
= 0 mA, SYNC = GND, V
I
= 17 V
(1)
23 26Quiescent current with enhanced LBII
Q(LBI)
EN = V
I
, LBI = GND 10 µ Acomparator version (TPS62113 only).
EN = GND 1.5 5I
(SD)
Shutdown current µ AEN = GND, T
A
= 25 ° C, V
I
= 7.2 V 1.5 3
ENABLE
V
IH
EN high-level input voltage 1.3 VV
IL
EN low-level input voltage 0.3 VEN trip-point hysteresis 170 mVI
lkg
EN input leakage current EN = GND or V
I
, V
I
= 12 V 0.01 0.2 µ AI
(EN)
EN input current 0.6 V ≤V
(EN)
≤4 V 10 20 µ AV
(UVLO)
Undervoltage lockout threshold Input voltage falling 2.8 3 3.1 VUndervoltage lockout hysteresis 250 300 mV
POWER SWITCH
V
I
≥5.4 V; I
O
= 350 mA 165 250r
DS(ON)
P-channel MOSFET on-resistance V
I
= 3.5 V; I
O
= 200 mA 340 m Ω
V
I
= 3 V; I
O
= 100 mA 490P-channel MOSFET leakage
V
DS
= 17 V 0.1 1 µ Acurrent
P-channel MOSFET current limit V
I
= 7.2 V, V
O
= 3.3 V 2100 2400 2600 mAV
I
≥5.4 V; I
O
= 350 mA 145 200r
DS(ON)
N-channel MOSFET on-resistance V
I
= 3.5 V; I
O
= 200 mA 170 m Ω
V
I
= 3 V; I
O
= 100 mA 200N-channel MOSFET leakage
V
DS
= 17 V 0.1 2 µ Acurrent
POWER-GOOD OUTPUT, LBI, LBO
V
(PG)
Power-good trip voltage V
O
– 1.6% VV
O
ramping positive 50Power-good delay time µ sV
O
ramping negative 200V
OL
PG, LBO output-low voltage V
(FB)
= 0.8 × V
O
nominal, I
OL
= 1 mA 0.3 VI
OL
PG, LBO sink current 1 mAPG, LBO output leakage current V
(FB)
= V
O
nominal, V
(LBI)
= V
I
0.01 0.25 µ AMinimum supply voltage for valid power
3 Vgood, LBI, LBO signalV
LBI
Low-battery input trip voltage Input voltage falling 1.256 VILBI LBI input leakage current 10 100 nALow-battery input trip-point
1.5%accuracyV
LBI,HYS
Low-battery input hysteresis 25 mV
(1) Device is not switching.
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)V
I
= 12 V, V
O
= 3.3 V, I
O
= 600 mA, EN = V
I
, T
A
= – 40 ° C to 85 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OSCILLATOR
f
S
Oscillator frequency 900 1000 1100 kHzf
(SYNC)
Synchronization range CMOS-logic clock signal on SYNC pin 800 1400 kHzV
IH
SYNC high-level input voltage 1.5 VV
IL
SYNC low-level input voltage 0.3 VI
lkg
SYNC input leakage current SYNC = GND or VIN 0.01 0.2 µ ASYNC trip-point hysteresis 170 mVSYNC input current 0.6 V ≤V
(SYNC)
≤4 V 10 20 µ ADuty cycle of external clock signal 30% 90%
OUTPUT
V
O
Adjustable output voltage range TPS62110 1.153 16 VV
FB
Feedback voltage TPS62110 1.153 VFB leakage current TPS62110 10 100 nAV
I
= 3.1 V to 17 V;Feedback voltage tolerance TPS62110 – 2% 2%0 mA < I
O
< 1500 mA
(2)
V
I
= 3.8 V to 17 V;TPS62111 – 3% 3%0 mA < I
O
< 1500 mA
(2)Fixed output-voltage tolerance
(3)
V
I
= 5.5 V to 17 V;TPS62112 – 3% 3%0 mA < I
O
< 1500 mA
(2)
V
I
≥3 V (once undervoltage lockout
100voltage exceeded)
V
I
≥3.5 V 500I
O
Maximum output current mAV
I
≥4.3 V 1200V
I
≥6 V 1500Current into internal voltage divider for
5 µ Afixed voltage versions
V
I
= 7.2 V; V
O
= 3.3 V; I
O
= 600 mAηEfficiency 92%V
I
= 12 V, V
o
= 5 V, I
o
= 600 mADuty-cycle range for main switches at 1 MHz 10% 100%Minimum t
on
time for main switch 100 nsShutdown temperature 145 ° CStart-up time I
O
= 800 mA, V
I
= 12 V, V
o
= 3.3 V 1 ms
(2) The maximum output current depends on the input voltage. See the maximum output current for further restrictions on the minimuminput voltage.(3) The output voltage accuracy includes line and load regulation over the full temperature range T
A
= – 40 ° C to 85 ° C. See the No-LoadOperation section in this data sheet.
4Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
DEVICE INFORMATION
PIN ASSIGNMENT TOP VIEW
16 15 14 13
5678
1
2
3
4 9
GND
GND
FB
AGND
PGND
Exposed
Thermal
Pad
VIN
VIN
EN
PGND
SW
LBI
VINA
SW
PG
SYNC
LBO
12
11
10
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTIONNAME NO.
AGND 9 I Analog ground, connect to GND and PGNDEnable. A logic high enables the converter; logic low forces the device into shutdown mode reducing theEN 4 I
supply current to less than 2 µ A.Feedback pin for the fixed output voltage option. For the adjustable version, an external resistive dividerFB 10 I
is connected to this pin. The internal voltage divider is disabled for the adjustable version.GND 11, 12 I GroundLBI 7 I Low-battery inputLBO 6 O Open-drain, low-battery output. This pin is pulled low if LBI is below its threshold.Power good comparator output. This is an open-drain output. A pullup resistor should be connectedPG 13 O between PG and VOUT. The output goes active high when the output voltage is greater than 98.4% ofthe nominal value.PGND 1, 16 I Power ground. Connect all power grounds to this pin.Connect the inductor to this pin. This pin is the switch pin and connected to the drain of the internalSW 14, 15 O
power MOSFETS.
Input for synchronization to external clock signal. Synchronizes the converter switching frequency to anexternal clock signal with CMOS level:SYNC 5 I
SYNC = HIGH: Low-noise mode enabled, fixed frequency PWM operation is forcedSYNC = LOW (GND): Power save mode enabled, PFM/PWM Mode enabledVIN 2, 3 I Supply voltage input (power stage)VINA 8 I Supply voltage input (support circuits)Thermal pad Connect to AGND
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
_
+
_
+
_
+
_
+
_
+
REF
REF
LoadComparator
IAVG Comparator
CurrentLimitComparator
P-Channel
PowerMOSFET
Driver
Shoot-Through
Logic
Control
Logic
SoftStart
1-MHz
Oscillator
Comparator S
R
N-Channel
PowerMOSFET
ComparatorHigh
ComparatorLow
ComparatorHigh2
V(COMP)
Sawtooth
Generator
V
I
Undervoltage
Lockout
BiasSupply
_
+
ComparatorHigh
ComparatorLow
Compensation
V =1.153V
REF
R2
(SeeNote A)
R1
VI
EN
SW
FB PGND
Gm
Thermal
Shutdown
Vina
_
+
_
+
SKIP Comparator
_
+
_
+
PG
LBO
LBI GND
1.256V
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
A. For the adjustable version (TPS62110), the internal feedback divider is disabled and the FB pin is directly connectedto the internal GM amplifier.
6Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
TYPICAL CHARACTERISTICS
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
15V
12V
8.4V
V =5V
T
PWMMode
O
A=25 C
o
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
15V
12V
8.4V
V =5V
T
PFMMode
O
A=25 C
o
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
Table of Graphs
FIGURE
Efficiency vs Output current (5 V) 1, 2Efficiency vs Output current (3.3 V) 3, 4, 5Maximum output current vs Input voltage 6Efficiency vs Output current (1.8 V) 7, 8Efficiency vs Output current (1.5 V) 9, 10Line transient response 11Load transient response 12Output ripple 13Start-up timing 14Switching frequency vs Input voltage 15Quiescent current vs Input voltage 16
Graphs with V
O
= 1.8 V were taken using the circuit according to Figure 20 .
TPS62112 TPS62112EFFICIENCY EFFICIENCYvs vsOUTPUT CURRENT OUTPUT CURRENT
Figure 1. Figure 2.
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
5V
4.2V
12V
8.4V
V =3.3V
T
PWMMode
O
A=25 C
o
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
5V
4.2V
12V
8.4V
V =3.3V
T
PFMMode
O
A=25 C
o
2000
1600
1100
1800
1400
900
700
400
100
1900
1500
1000
1700
1200
1300
800
500
200
600
300
03.2 3.6 5.2
45.6 6
4.4 4.8
V -InputVoltage-V
I
I-OutputCurrent-mA
O
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
5V
12V
8.4V
V =3.3V
SYNC=1.4MHz
T
PFMMode
O
A=25 C
o
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
TPS62111 TPS62111EFFICIENCY EFFICIENCYvs vsOUTPUT CURRENT OUTPUT CURRENT
Figure 3. Figure 4.
TPS62111 TPS62111EFFICIENCY MAXIMUM OUTPUT CURRENTvs vsOUTPUT CURRENT INPUT VOLTAGE
Figure 5. Figure 6.
8Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
5V
4.2V
12V
8.4V
V =1.8V
T
PFMMode
O
A=25 C
o
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
5V
4.2V
12V
8.4V
V =1.8V
T
PWMMode
O
A=25 C
o
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
5V
4.2V
12V
8.4V
V =1.5V
T
PFMMode
O
A=25 C
o
100
0
90
70
40
20
80
50
60
30
10
0.0001 0.001 0.01 0.1 10
1
I -OutputCurrent- A
O
Efficiency-%
5V
4.2V
12V
8.4V
V =1.5V
T
PWMMode
O
A=25 C
o
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
TPS62110 TPS62110EFFICIENCY EFFICIENCYvs vsOUTPUT CURRENT OUTPUT CURRENT
Figure 7. Figure 8.
TPS62110 TPS62110EFFICIENCY EFFICIENCYvs vsOUTPUT CURRENT OUTPUT CURRENT
Figure 9. Figure 10.
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
t − Time = 2 ms/div
VI = 7.2 V to 12 V
VO = 3.3 V
ILOAD = 800 mA
TA = 25°C
C2 = 50 mV/div
C1 = 5 V/div
t − Time = 20 µs/div
VI = 8.4 V
VO = 3.3 V
ILOAD = 150 mA to 1350 mA
TA = 25°C
VO = 50 mV/div
IO = 500 mA/div
t − Time = 5 µs/div
CH1 = 20 mV/div
VI = 8.4 V, VO = 3.3 V
CH2 =
5 V/div
CH4 = 200 mA/div
ILOAD = 100 mA, TA = 25°C
t − Time = 200 µs/div
CH1 = 10 V/div
VI = 12 V, VO = 3.3 V
CH4 = 500 mA/div
ILOAD = 800 mA, TA = 25°C
CH3 = 5 V/div
CH2 = 1 V/div
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
TPS62111 TPS62111LINE TRANSIENT LOAD TRANSIENT
Figure 11. Figure 12.
TPS62111 TPS62111OUTPUT RIPPLE START-UP TIMING
Figure 13. Figure 14.
10 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
1000
970
930
940
900
980
950
910
990
960
920
37
59
48
6 10 1412 16
11 1513 17
V -InputVoltage-V
I
SwitchingFrequency-kHz
25 C
o
-40 C
o
85 C
o
V =12V
I
O
O=100mA
0
10
30
20
40
5
15
35
25
45
50
37
59
48
6 10 1412 16
11 1513 17
V -InputVoltage-V
I
QuiescentCurrent- Am
25 C
o
-40 C
o
85 C
o
SYNC
GND PGND
SW
R1
R2
VO
TDK6.8 H
SLF7032T-6R8M1R6
m
C 22 F/16V
TDK
C3225X7R1C226M
Om
VIN
LBI
C 10 F/25V
TDK
C3225X5R1E106K
Im1 Fm
261kW
Vbat
VIN
EN
VINA
PGNDGND PwPD
open
VINor
GND
AGND
TPS62110 SW
LBO
PG
1MW1MW
FB
Cff
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
SWITCHING FREQUENCY QUIESCENT CURRENTvs vsINPUT VOLTAGE INPUT VOLTAGE
Figure 15. Figure 16.
The graphs were generated using the EVM with the setup according to Figure 17 unless otherwise noted. Theoutput voltage divider was adjusted according to Table 4 . Graphs for an output voltage of 5 V and 3.3 V weregenerated using TPS62111 and TPS62112 with R1 = 0 Ωand R2 = open.
Figure 17. Test Setup
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
DETAILED DESCRIPTION
OPERATION
CONSTANT-FREQUENCY MODE OF OPERATION (SYNC = HIGH)
POWER-SAVE MODE OF OPERATION (SYNC = LOW)
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
The TPS6211x is a synchronous step-down converter that operates with a 1-MHz fixed-frequency pulse-widthmodulation (PWM) at moderate-to-heavy load currents and enters the power-save mode at light load current.
During PWM operation, the converter uses a unique fast-response voltage-mode control scheme withinput-voltage feedforward. Good line and load regulation is achieved with the use of small input and outputceramic capacitors. At the beginning of each clock cycle initiated by the clock signal (S), the P-channel MOSFETswitch is turned on, and the inductor current ramps up until the comparator trips and the control logic turns theswitch off. The switch is turned off by the current-limit comparator if the current limit of the P-channel switch isexceeded. After the dead time prevents current shoot through, the N-channel MOSFET rectifier is turned on, andthe inductor current ramps down. The next cycle is initiated by the clock signal turning off the N-channel rectifier,and turning on the P-channel switch.
The error amplifier as well as the input voltage determines the rise time of the sawtooth generator. Therefore,any change in input voltage or output voltage directly controls the duty cycle of the converter, giving a very goodline- and load-transient regulation.
In constant-frequency mode, the output voltage is regulated by varying the duty cycle of the PWM signal in therange of 100% to 10%. Connecting the SYNC pin to a voltage greater than 1.5 V forces the converter to operatepermanently in the PWM mode even at light or no-load currents. The advantage is that the converter operateswith a fixed switching frequency that allows simple filtering of the switching frequency for noise-sensitiveapplications. In this mode, the efficiency is lower compared to the power-save mode during light loads. TheN-MOSFET of the devices stays on even when the current into the output drops to zero. This prevents the devicefrom going into discontinuous mode, and the device transfers unused energy back to the input. Therefore, thereis no ringing at the output, which usually occurs in discontinuous mode. The duty cycle range inconstant-frequency mode is 100% to 10%.
It is possible to switch from forced PWM mode to the power-save mode during operation by pulling the SYNC pinLOW. The flexible configuration of the SYNC pin during operation of the device allows efficient powermanagement by adjusting the operation of the TPS6211x to the specific system requirements.
As the load current decreases, the converter enters the power-save mode of operation. During power-savemode, the converter operates with reduced switching frequency in pulse-frequency modulation (PFM), and with aminimum quiescent current to maintain high efficiency. Whenever the average output current goes below the skipthreshold, the converter enters the power-save mode. The average current depends on the input voltage. It isabout 200 mA at low input voltages and up to 400 mA with maximum input voltage. The average output currentmust be below the threshold for at least 32 clock cycles to enter the power-save mode. During the power-savemode, the output voltage is monitored with a comparator, and the output voltage is regulated to a typical valuebetween the nominal output voltage and 0.8% above the nominal output voltage. When the output voltage fallsbelow the nominal output voltage, the P-channel switch turns on. The P-channel switch is turned off as the peakswitch current is reached. The N-channel rectifier is turned on, and the inductor current ramps down. As theinductor current approaches zero, the N-channel rectifier is turned off and the switch is turned on starting thenext pulse. When the output voltage cannot be reached with a single pulse, the device continues to switch withits normal operating frequency until the comparator detects the output voltage to be 0.8% above the nominaloutput voltage. This control method reduces the quiescent current to 20 µ A (typical), and reduces the switchingfrequency to a minimum that achieves the highest converter efficiency.
12 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
V (nominal)
O
0.8%
1.6%
–1.6%
t
I
SKIP
V
I
25
»
W
(1)
SOFT START
100% DUTY-CYCLE, LOW-DROPOUT OPERATION
I O O DS(on) (L)
V min V max I max (r max R )= + +g
(2)
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
DETAILED DESCRIPTION (continued)
Figure 18. Power-Save Mode Output-Voltage Thresholds
The typical PFM (SKIP) current threshold for the TPS6211x is given by:
Equation 1 is valid for input voltages up to 7 V. For higher voltages, the skip current threshold is not increasedfurther. The converter enters the fixed-frequency PWM mode as soon as the output voltage falls below V
O
–1.6% (nominal).
The TPS6211x has an internal soft-start circuit that limits the inrush current during start-up. This preventspossible voltage drops of the input voltage when a battery or a high-impedance power source is connected to theinput of the TPS6211x.
The soft start is implemented as a digital circuit increasing the switch current in steps of 300 mA, 600 mA, 1200mA. The typical switch current limit is 2.4 A. Therefore, the start-up time depends on the output capacitor andload current. Typical start-up time with a 22- µ F output capacitor and 800-mA load current is 1 ms.
The TPS6211x offers the lowest possible input-to-output voltage difference while still maintaining operation withthe use of the 100% duty-cycle mode. In this mode, the P-channel switch is constantly turned on. This isparticularly useful in battery-powered applications to achieve the longest operation time, taking full advantage ofthe whole battery voltage range. The minimum input voltage to maintain regulation depends on the load currentand output voltage, and is calculated as:
with:
I
O
max = maximum output current plus inductor ripple currentr
DS(on)
max = maximum P-channel switch r
DS(on)R
(L)
= dc resistance of the inductorV
O
max = nominal output voltage plus maximum output-voltage tolerance
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
ENABLE
UNDERVOLTAGE LOCKOUT
SYNCHRONIZATION
POWER-GOOD COMPARATOR
LOW-BATTERY DETECTOR (Standard Version)
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
DETAILED DESCRIPTION (continued)
Logic low on EN forces the TPS6211x into shutdown. In shutdown, the power switch, drivers, voltage reference,oscillator, and all other functions are turned off. The supply current is reduced to less than 2 µ A in the shutdownmode. When the device is in thermal shutdown, the band gap is forced to be switched on even if the device is setinto shutdown by pulling EN to GND.
If an output voltage is present when the device is disabled, which could be due to an external voltage source or asuper capacitor, the reverse leakage current is specified under electrical characteristics. Pulling the enable pinhigh starts up the TPS6211x with the soft start. If the EN pin is connected to any voltage other than V
I
or GND,an increased leakage current of typically 10 µ A and up to 20 µ A can occur.
The undervoltage lockout circuit prevents the device from misoperation at low-input voltages. It prevents theconverter from turning on the switch or rectifier MOSFET under undefined conditions. The minimum input voltageto start up the TPS6211x is 3.4 V (worst case). The device shuts down at 2.8 V minimum.
If no clock signal is applied, the converter operates with a typical switching frequency of 1 MHz. It is possible tosynchronize the converter to an external clock within a frequency range from 0.8 MHz to 1.4 MHz. The deviceautomatically detects the rising edge of the first clock and synchronizes immediately to the external clock. If theclock signal is stopped, the converter automatically switches back to the internal clock and continues operation.The switchover is initiated if no rising edge on the SYNC pin is detected for a duration of four clock cycles.Therefore, the maximum delay time can be 6.25 µ s if the internal clock has its minimum frequency of 800 kHz.
If the device is synchronized to an external clock, the power-save mode is disabled, and the devices stay inforced PWM mode.
Connecting the SYNC pin to the GND pin enables the power-save mode. The converter operates in the PWMmode at moderate-to-heavy loads, and in the PFM mode during light loads, which maintains high efficiency overa wide load-current range.
The power-good (PG) comparator has an open-drain output capable of sinking 1 mA (typical). The PG is onlyactive when the device is enabled (EN = high). When the device is disabled (EN = low), the PG pin is pulled toGND.
The PG output is only valid after a 250- µ s delay when the device is enabled and the supply voltage is greaterthan the undervoltage lockout V
(UVLO)
. PG is low during the first 250 µ s after shutdown and in shutdown.
The PG pin becomes active-high when the output voltage exceeds 98.4% (typical) of its nominal value. Leavethe PG pin unconnected when not used.
The low-battery output (LBO) is an open-drain type which goes low when the voltage at the low-battery input(LBI) falls below the trip point of 1.256 V ± 1.5%. The voltage at which the low-battery warning is issued can beadjusted with a resistive divider as shown in Figure 19 . The sum of resistors (R1 + R2) as well as the sum of (R5+ R6) is recommended to be in the 100-k Ωto 1-M Ωrange for high efficiency at low output current. An externalpullup resistor can be connected to OUT, or any other voltage rail in the voltage range of 0 V to 16 V. Duringstart-up, the LBO output signal is invalid for the first 500 µ s. LBO is high-impedance when the device is disabled.If the low-battery comparator function is not used, connect LBI to ground. The low-battery detector is disabledwhen the device is disabled.
The logic level of the LBO pin is not defined for the first 500 µ s after EN is pulled high.
When the LBI is used to supervise the battery voltage and shut down the TPS62113 at low-input voltages, thebattery voltage rises when the current drops to zero. The implemented hysteresis on the LBI pin may not besufficient for all types of batteries. Figure 19 shows how an additional external hysteresis can be implemented.
14 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
SYNC
GND PGND
SW
R1
560kW
R2
300kW
VO=3.3V
6.8 Hm
C =22 F
6.3V
Om
VIN
LBI
C =10 F
25V
Im1 Fm
2
3
4
8
9
7
5
11 12 16
10
6
13
14
15
1
V =4.3Vto17V
I
VIN
EN
VINA
PGNDGND PwPD
R5
R6
AGND
TPS62110 SW
LBO
PG
R3
R7
R4
FB
Cff
10pF
ENABLE/Low-Battery Detector (Enhanced Version) TPS62113 Only
NO-LOAD OPERATION
THEORY OF OPERATION / DESIGN PROCEDURE
Inductor Selection
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
DETAILED DESCRIPTION (continued)
Figure 19. LBI With Increased Hysteresis
The TPS62113 offers an enhanced LBI functionality to provide a precise, user-programmable undervoltageshutdown. No additional supply voltage supervisor (SVS) is needed to provide this function. When the enable(EN) pin is pulled high, only the internal bandgap voltage reference is switched on to provide a reference sourcefor the LBI comparator. As long as the voltage at LBI is less than the LBI trip point, all other internal circuits areshut down, reducing the supply current to 10 µ A. As soon as input voltage at LBI rises above the LBI trip point of1.256 V, the device is completely enabled and starts switching.
When the converter operates in the forced PWM mode and there is no load connected to the output, theconverter regulates the output voltage by allowing the inductor current to reverse for a short time.
Table 1. List of Inductors
MANUFACTURER PART NO. INDUCTANCE DC RESISTANCE SATURATION CURRENT
Coilcraft MSS6132-682 6.8 µ H 65 m Ω(max) 1.5 AHA3808-AL 6.8 µ H 99 m Ω(typ) 4.4AEpcos B82462G4682M 6.8 µ H 50 m Ω(max) 1.5 ASumida CDRH5D28-6R2 6.2 µ H 33 m Ω(typ) 1.8 ASLF6028T-6R8M1R5 6.8 µ H 35 m Ω(typ) 1.5 ATDK
SLF7032T-6R8M1R6 6.8 µ H 41 m Ω(typ) 1.6 A7447789006 6.8 µ H 44 m Ω(typ) 2.75 AWurth 7447779006 6.8 µ H 33 m Ω(typ) 3.3 A744053006 6.2 µ H 45 m Ω(typ) 1.8 A
The control loop of the TPS6211x family requires a certain value for the output inductor and the output capacitorfor stable operation. As long as the nominal value of L × C ≥6.2 µ H × 22 µ F, the control loop has enough phasemargin and the device is stable. Reducing the inductor value without increasing the output capacitor (or viceversa) may cause stability problems. There are applications where it may be useful to increase the value of the
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
O
I L
L O L O
V
1
V I
I V I max I max
L f 2
-
D
D = ´ = +
´
(3)
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
output capacitor, e.g., for a low-transient output-voltage change. From a stability point of view, the inductor valuecould be decreased to keep the L × C product constant. However, there are drawbacks if the inductor value isdecreased. A low inductor value causes a high inductor ripple current, and therefore reduces the maximum dcoutput current. Table 2 gives the advantages and disadvantages when designing the inductor and outputcapacitor.
Table 2. Advantages and Disadvantages When Designing the Inductor and Output Capacitor
INFLUENCE ON STABILITY ADVANTAGE DISADVANTAGE
Less output voltage rippleIncrease Cout ( > 22 µ F) Uncritical NoneLess output voltage overshoot /undershoot during load transient
Higher output voltage rippleCritical High output voltage overshoot /Decrease Cout ( < 22 µ F) Increase inductor value > 6.8 µ H None undershoot during loadalso transient
Less gain and phase marginLess inductor current ripple More energy stored in theinductor →higher voltageovershoot during load transientHigher dc output current possible if Smaller current rise →higherIncrease L ( > 6.8 µ H) Uncritical
operated close to the current limit voltage undershoot during loadtransient →do not decrease thevalue of Cout due to theseeffectsCritical High inductor-current rippleSmall voltage overshoot / undershoot
especially at high input voltageDecrease L ( < 6.8 µ H)
Increase output capacitor value >
during load transient
and low output voltage22 µ F also
As shown in Table 2 , the inductor value can be increased to higher values. For good performance, thepeak-to-peak inductor-current ripple should be less than 30% of the maximum dc output current. Especially atinput voltages above 12 V, it makes sense to increase the inductor value in order to keep the inductor-currentripple low. In such applications, the inductor value can be increased to 10 µ H or 22 µ H. Values above 22 µ Hshould be avoided in order to keep the voltage overshoot during load transient in an acceptable range.
After choosing the inductor value, two additional inductor parameters should be considered:1. current rating of the inductor2. dc resistance
The dc resistance of the inductance directly influences the efficiency of the converter. Therefore, an inductor withlowest dc resistance should be selected for highest efficiency. In order to avoid saturation of the inductor, theinductor should be rated at least for the maximum output current plus the inductor ripple current which iscalculated as:
where:
f = Switching frequency (1000 kHz typical)L = Inductor value
ΔI
L
= Peak-to-peak inductor ripple currentI
L
(max) = Maximum inductor current
The highest inductor current occurs at maximum V
I
. A more-conservative approach is to select the inductorcurrent rating just for the maximum switch current of the TPS6211x, which is 2.4 A (typically). See Table 1 forrecommended inductors.
16 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
OUTPUT-CAPACITOR SELECTION
O
I
RMS O O
V
1V1
I (C ) V L f 2 3
-
= ´ ´
´´
(4)
O
I
O O ESR
O
V
1
V1
V V R
L f 8 C f
-æ ö
D = ´ ´ +
ç ÷
´ ´ ´
è ø
(5)
INPUT-CAPACITOR SELECTION
O O
RMS O
I I
V V
I I max 1
V V
æ ö
= ´ ´ -
ç ÷
è ø
(6)
FEEDFORWARD-CAPACITOR SELECTION
RECOMMENDED CAPACITORS
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
A 22- µF (typical) output capacitor is needed with a 6.8- µH inductor. For an output voltage greater than 5 V, a33- µF (minimum) output capacitor is required for stability. For best performance, a low-ESR ceramic outputcapacitor is needed.
Just for completeness, the RMS ripple current is calculated as:
The overall output ripple voltage is the sum of the voltage spike caused by the output capacitor ESR plus thevoltage ripple caused by charging and discharging the output capacitor:
where the highest output-voltage ripple occurs at the highest input voltage V
I
.
The nature of the buck converter is a pulsating input current; therefore, a low ESR input capacitor is required forbest input voltage filtering and for minimizing the interference with other circuits caused by high input-voltagespikes. The input capacitor should have a minimum value of 10 µ F and can be increased without any limit forbetter input-voltage filtering. The input capacitor should be rated for the maximum input ripple current calculatedas:
The worst-case RMS ripple current occurs at D = 0.5 and is calculated as: I
RMS
= I
O
/2. Ceramic capacitors showa good performance because of their low ESR value, and they are less sensitive against voltage transientscompared to tantalum capacitors. Place the input capacitor as close as possible to the input pin of the IC for bestperformance.
The feedforward capacitor (C
ff
) is needed to compensate for parasitic capacitance from the feedback pin to GND.Typically, a value of 4.7 pF to 22 pF is needed for an output voltage divider with a equivalent resistance (R1 inparallel with R2) in the 150-k Ωrange. The value can be chosen based on best transient performance and lowestoutput-voltage ripple in PFM mode.
It is recommended that only X5R or X7R ceramic capacitors be used as input/output capacitors. Ceramiccapacitors show a dc-bias effect. This effect reduces the effective capacitance when a dc-bias voltage is appliedacross a ceramic capacitor, as on the output and input capacitor of a dc/dc converter. The effect may lead to asignificant capacitance drop, especially for high input/output voltages and small capacitor packages. See themanufacturer ' s data sheet about the performance with a dc bias voltage applied. It may be necessary to choosea higher voltage rating or nominal capacitance value in order to get the required value at the operating point. Thecapacitors listed in Table 3 have been tested with the TPS62110 with good performance.
Table 3. List of Capacitors
MANUFACTURER PART NUMBER SIZE VOLTAGE CAPACITANCE TYPE
TMK316BJ106KL 1206 25 V 10 µ FTaiyo Yuden CeramicEMK325BJ226KM 1210 16 V 22 µ F
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
Table 3. List of Capacitors (continued)
MANUFACTURER PART NUMBER SIZE VOLTAGE CAPACITANCE TYPE
C3225X5R1E106M 25 V 10 µ F1210TDK C3225X7R1C226M 16 V 22 µ F CeramicC3216X5R1E106MT 1206 25 V 10 µ F
18 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
APPLICATION INFORMATION
SYNC
GND PGND
SW
R1
220kW
R2
390kW
VO=1.8V
6.8 Hm
C =2x22 F
6.3V
(SeeNote A)
Om
VIN
LBI
C =10 F
25V
Im1 Fm
2
3
4
8
9
7
5
11 12 16
10
6
13
14
15
1
V =3.5Vto17V
I
VIN
EN
VINA
PGNDGND PwPD
R5
R6
AGND
TPS62110 SW
LBO
PG
R3
1MW
R4
1MW
FB
Cff
10pF
O
O FB
FB
V
R1 R2
V V R1 R2 R2
R2 V
æ ö
+
= ´ = ´ -
ç ÷
è ø
(7)
SYNC
GND PGND
SW
VO=5V
6.8 Hm
C =22 F
10V
Om
VIN
LBI
C =10 F
25V
Im1 Fm
2
3
4
8
9
7
5
11 12 16
10
6
13
14
15
1
V =5.5Vto17V
I
VIN
EN
VINA
PGNDGND PwPD
AGND
TPS62112
SW
LBO
PG
1MW
FB
TPS62110 , TPS62111TPS62112 , TPS62113
www.ti.com
.................................................................................................................................................... SLVS585A – JULY 2005 – REVISED FEBRUARY 2009
A. For an output voltage lower than 2.5 V, an output capacitor of 33 µF or greater is recommended to improve loadtransient.
Figure 20. Standard Connection for Adjustable Version
V
FB
= 1.153 V
Table 4. Recommended Resistors
OUTPUT VOLTAGE R1 R2 NOMINAL VOLTAGE TYPICAL C
ff
9 V 680 k Ω100 k Ω8.993 V 22 pF5 V 510 k Ω150 k Ω5.073 V 10 pF3.3 V 560 k Ω300 k Ω3.305 V 10 pF2.5 V 390 k Ω330 k Ω2.515 V 10 pF1.8 V 220 k Ω390 k Ω1.803 V 10 pF1.5 V 100 k Ω330 k Ω1.502 V 10 pF
Figure 21. Standard Connection for Fixed-Voltage Version
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
SYNC
GND PGND
SW
R1
680kW
R2
100kW
VO=9V
6.8 Hm
C =33 F
16V
(SeeNote A)
Om
VIN
LBI
C =10 F
25V
Im1 Fm
2
3
4
8
9
7
5
11 12 16
10
6
13
14
15
1
V =9.3Vto17V
I
VIN
EN
VINA
PGNDGND PwPD
AGND
TPS62110 SW
LBO
PG
1MW
FB
Cff
22pF
TPS62110 , TPS62111TPS62112 , TPS62113
SLVS585A – JULY 2005 – REVISED FEBRUARY 2009 ....................................................................................................................................................
www.ti.com
A. For an output voltage greater than 5 V, an output capacitor of 33 µF minimum is required for stability.
Figure 22. Application With 9-V Output
20 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62110 TPS62111 TPS62112 TPS62113
PACKAGE OPTION ADDENDUM
www.ti.com 4-Nov-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS62110RSAR ACTIVE QFN RSA 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples
TPS62110RSARG4 ACTIVE QFN RSA 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples
TPS62110RSAT ACTIVE QFN RSA 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor
or Sales Office
TPS62110RSATG4 ACTIVE QFN RSA 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor
or Sales Office
TPS62111RSAR ACTIVE QFN RSA 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples
TPS62111RSARG4 ACTIVE QFN RSA 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples
TPS62111RSAT ACTIVE QFN RSA 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples
TPS62111RSATG4 ACTIVE QFN RSA 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples
TPS62112RSAR ACTIVE QFN RSA 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples
TPS62112RSARG4 ACTIVE QFN RSA 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples
TPS62112RSAT ACTIVE QFN RSA 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples
TPS62112RSATG4 ACTIVE QFN RSA 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples
TPS62113RSAR ACTIVE QFN RSA 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples
TPS62113RSAT ACTIVE QFN RSA 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor
or Sales Office
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Nov-2010
Addendum-Page 2
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS62110, TPS62111, TPS62112 :
•Automotive: TPS62110-Q1
•Enhanced Product: TPS62110-EP, TPS62111-EP, TPS62112-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS62110RSAR QFN RSA 16 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62110RSAT QFN RSA 16 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62111RSAR QFN RSA 16 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62111RSAT QFN RSA 16 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62112RSAR QFN RSA 16 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62112RSAR QFN RSA 16 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62112RSAT QFN RSA 16 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62113RSAR QFN RSA 16 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62113RSAR QFN RSA 16 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62113RSAT QFN RSA 16 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPS62113RSAT QFN RSA 16 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS62110RSAR QFN RSA 16 3000 367.0 367.0 35.0
TPS62110RSAT QFN RSA 16 250 210.0 185.0 35.0
TPS62111RSAR QFN RSA 16 3000 367.0 367.0 35.0
TPS62111RSAT QFN RSA 16 250 210.0 185.0 35.0
TPS62112RSAR QFN RSA 16 3000 367.0 367.0 35.0
TPS62112RSAR QFN RSA 16 3000 367.0 367.0 35.0
TPS62112RSAT QFN RSA 16 250 210.0 185.0 35.0
TPS62113RSAR QFN RSA 16 3000 367.0 367.0 35.0
TPS62113RSAR QFN RSA 16 3000 367.0 367.0 35.0
TPS62113RSAT QFN RSA 16 250 210.0 185.0 35.0
TPS62113RSAT QFN RSA 16 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
