(PITCH)
CKT NO.1 MARK TRADE MARK
TERMINAL
ACTUATOR
HOUSING
FITTING NAIL
CONTACT POINT
(BOTTOM SIDE)
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC: REVISED
EC NO: 600129
DRWN:
YCHEN128
2018/04/11
CHK'D:
KTAKAHASHI
2018/04/12
APPR:
NUKITA
2018/04/13
INITIAL REVISION:
DRWN:
MUMEDA
2005/03/29
APPR:
NUKITA
2005/04/06
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52271
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1.0 FPC CONN ZIF SMT
(BOTTOM CONTACT) -LEAD FREE-
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52271-038
PSD
001
G
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 1 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/04/13 03:50:59
18
30.2 29
21.2
19.2
20
52271-1969
33
52271-2969
24
30
52271-0569
EMBOSSED PACKAGE
52271-0769
A
35
16
13
25 20
16.2
17
15
19
2122.2
28.2
26
7
29.2
23
25.2
22
21
B
27
14.2
オーダー番号 ORDER NO.
52271-2169
5.2
52271-0969
15
8
13
31
CONNECTOR SERIES NO.
23
26
52271-0669
24.2
52271-2469
29
52271-2269
20
7.2
4
7
52271-2769
12
52271-1069
17
12
10
52271-1469
52271-0869
16
11
52271-**29
19
27.2
27
17.2
52271-1869
32
16
5
24
5
29
28
11
52271-1269
9
14
19
52271-2869
23
28
12 8.2
C
6
6.2
52271-1569
9.2
9
8
20.2
52271-1669
52271-2069
10
4
26.2
15
25
14
11 6
26
52271-1369
27
12.2
13.2
11.2
28
25
18.2 52271-1769
18
13
17
30
52271-2569
52271-2369
2223.2
3
CIRCUITS
52271-0469
34
31.2
18
52271-2669
52271-3069
21
24
9
22
10.2
10
15.2
52271-1169
14
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
(WHEN ACTUATOR IS OPENED)
5
(WHEN ACTUATOR IS LOCKED)
CONTACT POINT(BOTTOM SIDE)
2
(WHEN ACTUATOR IS OPENED)
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
参考基板レイアウト
RECOMMENDED PCB
PATTERN DIMENSIONS(REF.)
コネクタ位置
(SCALE 5:1)
（ピッチ）
(PITCH)
6
（THICKNESS:0.3
±
0.05）
1.9
（0.6）
1
±
0.1
(N-1)
±
0.1
4.24.2
2.12.1
1.65
1.65
(0.3)
1.6 0.6
(0.4)
2.8
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC: REVISED
EC NO: 600129
DRWN:
YCHEN128
2018/04/11
CHK'D:
KTAKAHASHI
2018/04/12
APPR:
NUKITA
2018/04/13
INITIAL REVISION:
DRWN:
MUMEDA
2005/03/29
APPR:
NUKITA
2005/04/06
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52271
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1.0 FPC CONN ZIF SMT
(BOTTOM CONTACT) -LEAD FREE-
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52271-038
PSD
001
G
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 2 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/04/13 03:50:59
接点部までの嵌合長さ。
LENGTH TO CONTACT POINT.
2. 使用材料 MATERIAL
ハウジング : 46 NYLON、UL94V-0
HOUSING
アクチュエータ：PPS、UL94V-0
ACTUATOR
ターミナル : リン青銅(t=0.25)
TERMINAL PHOS-BRO(ｔ＝0.25)
メッキ : 接点部： 金メッキ： 0.1マイクロメートル以上
PLATING CONTACT PORTION: GOLD PLATING: 0.1 MICROMETER MIN.
: 半田付け部 : 錫メッキ： 1.0マイクロメートル以上
SOLDER PORTION: TIN PLATING: 1.0 MICROMETER MINIMUM
: 下地: ニッケルメッキ： 1.0マイクロメートル以上
UNDER PLATING：NICKEL PLATING：1.0 MICROMETER MIN.
金具 : 銅合金(t=0.25)
FITTING NAIL COPPER ALLOY(ｔ＝0.25)
メッキ : 錫メッキ ：1.0マイクロメートル以上
PLATING TIN PLATING： 1.0 MICROMETER MIN.
: 下地：ニッケルメッキ： 1.0マイクロメートル以上
UNDER PLATING: NICKEL PLATING: 1.0 MICROMETER MIN.
注記： NOTES
1
3
パターンはくり止め用金具
FITTING NAIL FOR PREVENTION OF FOOT PRINT PEELING OF P.C.B PATTERN.
4. エンボステープ梱包時はアクチュエータがロックした状態とする。
IN THE PACKAGE,ACTUATOR OF PART NO.54550-**29 SHOULD BE LOCKED.
テール及び金具の平坦度は、0.15以下とする。
TAIL AND NAIL COPLANARITY TO BE 0.15 MAXIMUM.
パターン書き込み禁止エリア。
NO FOOT PRINT AREA.
5
6
1.8
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
（仕上り厚さ: 0.3
±
0.05）
適合FPC/FFC推奨寸法
APPLICABLE FPC/FFC RECOMMENDED DIMENSION
0.3
±
0.05
補強板：ポリイミド
REINFORCE BOARD: POLYMIDE
仕上がり厚さ
THICKNESS
めっき：金めっき(0.2μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
導体部： 銅箔(35μm)
COPPER FOIL (35μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
0.3
±
0.05
仕上がり厚さ
THICKNESS
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
補強板：ポリエステル系
REINFORCE BOARD: PET
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
ベースフィルム：ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
めっき：金めっき(0.2μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
導体部： 銅箔(35μm)
COPPER FOIL (35μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
FFC構成推奨仕様
RECOMMENDED STRUCTURE OF FFC
FPC構成推奨仕様
RECOMMENDED STRUCTURE OF FPC
FPC/FFCについて：
抜き方向は、導体側から補強板側を推奨致します。
尚、接着剤の接点部への付着は導通不良の原因になりますので、
染み出しが無い様お願い致します。
ABOUT FPC/FFC:
RECOMMENDED PUNCHER DIRECTION:
FROM CONDUCTOR SIDE TO STIFFNER SIDE
PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND
BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE
CAUSES THE DEFECT IN ELECTRICAL CONTINUITY.
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10
