bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACKTM TECHNOLOGY FOR USE WITH THE bq29312A FEATURES * * * * * * * * * * * * * * * * * Patented Impedance TrackTM Technology Accurately Measures Available Charge in Li-Ion and Li-Polymer Batteries Better than 1% Error Over Lifetime of the Battery Instant Accuracy - No Learning Cycle Required Supports the Smart Battery Specification SBS V1.1 Works With the TI bq29312A Analog Front-End (AFE) Protection IC to Provide Complete Pack Electronics Solution Full Array of Programmable Voltage, Current, and Temperature Protection Features Integrated Time Base Removes Need for External Crystal with Optional Crystal Input Electronics for 7.2-V, 10.8-V or 14.4-V Battery Packs With Few External Components Based on a Powerful Low-Power RISC CPU Core With High-Performance Peripherals Integrated Field Programmable FLASH Memory Eliminates the Need for External Configuration Memory Measures Charge Flow Using a High-Resolution, 16-Bit Integrating Delta-Sigma Converter - Better Than 0.65 nVh of Resolution - Self-Calibrating - Offset Error Less Than 1 V Uses 16-Bit Delta-Sigma Converter for Accurate Voltage and Temperature Measurements Extensive Data Reporting Options For Improved System Interaction Optional Pulse Charging Feature for Improved Charge Times Drives 3-, 4- or 5-Segment LED Display for Remaining Capacity Indication Supports SHA-1 Authentication Lifetime Data Logging * 38-Pin TSSOP (DBT) APPLICATIONS * * * Notebook PCs Medical and Test Equipment Portable Instrumentation DESCRIPTION The bq20z80 SBS-compliant gas gauge IC, incorporating patented Impedance TrackTM technology, is designed for battery-pack or in-system installation. The bq20z80 measures and maintains an accurate record of available charge in Li-ion or Li-polymer batteries using its integrated high-performance analog peripherals. The bq20z80 monitors capacity change, battery impedance, open-circuit voltage, and other critical parameters of the battery pack, and reports the information to the system host controller over a serial-communication bus. It is designed to work with the bq29312A analog front-end (AFE) protection IC to maximize functionality and safety, and minimize component count and cost in smart battery circuits. The Impedance Track technology continuously analyzes the battery impedance, resulting in superior gas-gauging accuracy. This enables remaining capacity to be calculated with discharge rate, temperature, and cell aging all accounted for during each stage of every cycle. AVAILABLE OPTIONS PACKAGE (1) TA 38-PIN TSSOP (DBT) Tube 38-PIN TSSOP (DBT) Tape and Reel -40C to 85C bq20z80ADBT (2) bq20z80ADBTR (3) -40C to 85C bq20z80DBT (2) bq20z80DBTR (3) (1) (2) (3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. A single tube quantity is 50 units. A single reel quantity is 2000 units Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Impedance Track is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2007, Texas Instruments Incorporated bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. SYSTEM DIAGRAM Discharge / Charge / Precharge FETs Fuse Pack + bq20z80 PCH FET Drive Supply V oltage Power Management LDO, TOUT, and Power Mode control Temperature Measurement <1% Error 768 Bytes of User Flash SMBus bq29312A PF Input Fail-Safe Protection TINT 32-kHz Clock Generator Precharge FET Drive Cell Balancing Drive LDO, Therm Output Drive & UVLO T1 System Watchdog Delay Counters System Interface RAM Registers 32 kHz Cell Balancing Algorithm and Control SBS v1.1 Data I2 C System Interface XAlert bq29312 RAM/Comms Validation 1st Level OC Protection 1st Level OV and UV Protection Pack Undervoltage Power Mode Control Cell and Pack Voltage Measurement Sleep Power Mode Control bq294xx 2-Tier Overcurrent Protection Impedance Track (TM) + Lifetime Data Logging Voltage Level Translator Pack Sense Resistor (5 m - 20 mW typ) TSSOP (DBT) (TOP VIEW) VIN TS1 TS2 PU PRES SCLK SAFE VDDD RBI SDATA VSSD SAFE NC NC SMBC SMBD DISP PFIN VSSD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 38 37 36 35 34 33 32 31 30 29 28 VSSD NC NC CLKOUT XCK1 / VSSA XCK2 / ROSC FILT VDDA VSSA VSSA 27 SR1 SR2 26 25 24 23 22 21 20 MRST XALERT LED1 LED2 LED3 LED4 LED5 NC - No internal connection 2 2 nd Level Overvoltage Protection Precharge Control Submit Documentation Feedback bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 TERMINAL FUNCTIONS TERMINAL NO. NAME I/O (1) DESCRIPTION 1 VIN I Voltage measurement input from the AFE 2 TS1 I 1st Thermistor voltage input connection to monitor temperature 3 TS2 I 2nd Thermistor voltage input connection to monitor temperature 4 PU O Output to pull up the PRES pin for system detection 5 PRES I Active low input to sense system insertion and typically requires additional ESD protection 6 SCLK I/OD 7 SAFE O Active high output to enforce additional level of safety protection; e.g., fuse blow. (Inverse of pin 12) 8 VDDD P Positive supply for digital circuitry and I/O pins 9 RBI P Backup power to the bq20z80 data registers during periods of low operating voltage. RBI accepts a storage capacitor or a battery input. 10 SDATA I/O Data transfer to and from the AFE 12 SAFE O Active low output to enforce additional level of safety protection; e.g., fuse blow. (Inverse of pin 7) 13 NC - Not used-- leave floating Not used-- leave floating Communication clock to the AFE 14 NC - 15 SMBC I/OD SMBus clock open-drain bidirectional pin used to clock the data transfer to and from the bq20z80 16 SMBD I/OD SMBus data open-drain bidirectional pin used to transfer address and data to and from the bq20z80 17 DISP I Display control for the LEDs. This pin is typically connected to bq29312A REG via a 100-k resistor and a push-button switch to VSSD. 18 PFIN I Active low input to detect secondary protector output status and allows the bq20z80 to report the status of the 2nd level protection output 20 LED5 O LED5 display segment that drives an external LED depending on the firmware configuration 21 LED4 O LED4 display segment that drives an external LED depending on the firmware configuration 22 LED3 O LED3 display segment that drives an external LED depending on the firmware configuration 23 LED2 O LED2 display segment that drives an external LED depending on the firmware configuration 24 LED1 O LED1 display segment that drives an external LED depending on the firmware configuration 25 XALERT I Input from bq29312A XALERT output. 26 MRST I Master reset input that forces the device into reset when held high 27 SR2 IA Connections for a small-value sense resistor to monitor the battery charge- and discharge-current flow 28 SR1 IA Connections for a small-value sense resistor to monitor the battery charge- and discharge-current flow 31 VDDA P Positive supply for analog circuitry 32 FILT IA Analog input connected to the external PLL filter components which are a 150-pF capacitor to VSSA, in parallel with a 61.9-k resistor and a 2200-pF capacitor in series. Place these components as close as possible to the bq20z80 to ensure optimal performance. 33 XCK2/ROSC O 32.768-kHz crystal oscillator output pin or connected to a 100-k, 50-ppm or better resistor if the internal oscillator is used. 34 XCK1/VSSA I 32.768-kHz crystal oscillator input pin or connected to VSSA if the internal oscillator is used 35 CLKOUT O 32.768-kHz output for the bq29312. This pin should be directly connected to the AFE. 36, 37 NC - Not used-- leave floating 11, 19, 38 VSSD P Negative supply for digital circuitry 29, 30 VSSA P Negative supply for analog circuitry. (1) I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power Submit Documentation Feedback 3 bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) RANGE VDDAand VDDD relative to VSS (2) Supply voltage range V(IOD) relative to VSS (2) Open-drain I/O pins VI relative to VSS (2) -0.3 V to 4.1 V -0.3 V to 6 V Input voltage range to all other pins -0.3 V to VDDA + 0.3 V TA Operating free-air temperature range -40C to 85C Tstg Storage temperature range -65C to 150C (1) (2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. VSS refers to the common node of V(SSA) and V(SSD). ELECTRICAL CHARACTERISTICS VDD = 3 V to 3.6 V, TA = -40C to 85C (unless otherwise noted) PARAMETER VDD IDD TEST CONDITIONS Supply voltage VDDA and VDDD Operating mode current TYP MAX 3.3 3.6 350 (1) bq20z80 + bq29312A 375 Sleep mode 8 (1) bq20z80 + bq29312A Output voltage low SMBC, SMBD, SDATA, SCLK, SAFE, SAFE, PU IOL = 0.5 mA A 0.1 0.4 LED1 - LED5 IOL = 10 mA VOH Output high voltage, SMBC, SMBD, SDATA, SCLK, SAFE, SAFE, PU IOH = -1 mA VIL Input voltage low SMBC, SMBD, SDATA, SCLK, XALERT, PRES, PFIN -0.3 0.8 DISP VIH CIN 0.4 VDD - 0.5 -0.3 0.8 2 6 DISP 2 VDD + 0.3 Input capacitance 5 V(AI2) Input voltage range SR1, SR2 V V V Input voltage high SMBC, SMBD, SDATA, SCLK, XALERT, PRES, PFIN V(AI1) Input voltage range VIN, TS1, TS2 V A 0.1 (1) bq20z80 + bq29312A UNIT A 28 Shutdown Mode I(SLP) Shutdown Current V V V V pF VSS- 0.3 0.8 x VDD VSS- 0.25 0.25 V Z(AI1) Input impedance SR1, SR2 0 V-1 V 2.5 M Z(AI2) Input impedance VIN, TS1, TS2 0 V-1 V 8 M (1) 4 3 No flash programming I(SLP) Low-power storage mode current VOL MIN This value does not include the bq29312A Submit Documentation Feedback bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 POWER-ON RESET VDD = 3 V to 3.6 V, TA = -40C to 85C (unless otherwise noted) TYP MAX Negative-going voltage input PARAMETER TEST CONDITIONS 2.1 2.3 2.5 V VHYS Power-on reset hysteresis 50 150 200 mV MAX UNIT 0.25 V UNIT POWER ON RESET BEHAVIOR vs FREE-AIR TEMPERATURE 2.50 140 2.45 135 2.40 130 VIT- 2.35 125 2.30 120 2.25 115 Vhys 2.20 110 2.15 105 2.10 -20 -10 V hys - Hysterisis Voltage - mV V IT - Negative Going Input Threshold Voltage - V MIN VIT- 100 0 10 20 30 40 50 60 70 80 TA - Free-Air Temperature - C INTEGRATING ADC (Coulomb Counter) CHARACTERISTICS VDD = 3 V to 3.6 V, TA = -40C to 85C (unless otherwise noted) PARAMETER V(SR) Input voltage range, V(SR2) and V(SR1) V(SROS) Input offset INL Integral nonlinearity error TEST CONDITIONS V(SR) = V(SR2) - V(SR1) MIN TYP -0.25 V 1 0.004% 0.019% TYP MAX 2 5 PLL SWITCHING CHARACTERISTICS VDD = 3 V to 3.6 V, TA = -40C to 85C (unless otherwise noted) PARAMETER t(SP) (1) Start-up time (1) TEST CONDITIONS MIN 0.5% frequency error UNIT ms The frequency error is measured from the trimmed frequency of the internal system clock which is 128 oscillator frequency, nominally 4.194 MHz. OSCILLATOR VDD = 3 V to 3.6 V, TA = -40C to 85C (unless otherwise noted) PARAMETER TEST CONDITIONS ROSC = 100 k f(exo) Frequency error from 32.768 kHz ROSC = 100 k, VDD = 3.3 V XCK1 = 12-pF XTAL f(sxo) (1) Start-up time (1) TYP MAX -2% 0.25% MIN 2% -1% 0.25% -0.25% UNIT 1% 0.25% ROSC = 100 k 250 s XCK1 = 12-pF XTAL 200 ms The start-up time is defined as the time it takes for the oscillator output frequency to be within 1% of the specified frequency. Submit Documentation Feedback 5 bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 DATA FLASH MEMORY CHARACTERISTICS VDD = 3 V to 3.6 V, TA = -40C to 85C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Data retention See (1) 10 Years Flash programming write-cycles See (1) 20,000 Cycles t(WORDPROG) Word programming time See (1) I(DDPROG) See (1) tDR (1) Flash-write supply current 2 ms 8 15 mA TYP MAX UNIT 10 100 nA Specified by design. Not production tested REGISTER BACKUP VDD = 3 V to 3.6 V, TA = -40C to 85C (unless otherwise noted) PARAMETER I(RBI) V(RBI) (1) 6 RBI data-retention input current RBI data-retention voltage TEST CONDITIONS MIN V(RBI) > 3 V, VDD < VIT (1) 1.3 Specified by design. Not production tested. Submit Documentation Feedback V bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 SMBus TIMING SPECIFICATIONS VDD = 3 V to 3.6 V, TA = -40C to 85C (unless otherwise noted) PARAMETER TEST CONDITIONS fSMB SMBus operating frequency Slave mode, SMBC 50% duty cycle fMAS SMBus master clock frequency Master mode, no clock low slave extend tBUF Bus free time between start and stop tHD:STA Hold time after (repeated) start tSU:STA Repeated start setup time tSU:STO Stop setup time MIN TYP 10 MAX 100 51.2 kHz 4.7 4 s 4.7 4 Receive mode 0 Transmit mode 300 tHD:DAT Data hold time tSU:DAT Data setup time tTIMEOUT Error signal/detect tLOW Clock low period tHIGH Clock high period See (2) tLOW:SEXT Cumulative clock low slave extend time See (3) 25 tLOW:MEXT Cumulative clock low master extend time See (4) 10 tF Clock/data fall time (VILMAX - 0.15 V) to (VIHMIN + 0.15 V) tR Clock/data rise time 0.9 VDD to (VILMAX - 0.15 V) (1) (2) (3) (4) UNIT ns 250 See (1) 25 35 4.7 4 50 300 1000 ms s ms ns The bq20z80 times out when any clock low exceeds tTIMEOUT. tHIGH:MAX. is minimum bus idle time. SMBC = 1 for t > 50 s causes reset of any transaction involving the bq20z80 that is in progress. tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop. tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop. SMBus TIMING DIAGRAM Submit Documentation Feedback 7 bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 FEATURE SET NOTE The bq20z80-V102 is designed to work with the bq29312A AFE. The bq20z80 features are only available with the bq29312A. . Primary (1st Level) Safety Features The bq20z80 supports a wide range of battery and system protection features that care easily configured. The primary safety features includes: * * * * * * * Battery cell over/undervoltage protection Battery pack over/undervoltage protection 2 independent charge overcurrent protection 3 independent discharge overcurrent protection Short circuit protection Overtemperature protection Host watchdog Secondary (2nd Level) Safety Features The secondary safety features of the bq20z80 can be used to indicate more serious faults via the SAFE (pin 7) and SAFE (pin 12) pins. These pins can be used to blow a in-line fuse to permanently disable the battery pack from charging or discharging. The secondary safety features includes: * * * * * * * * * * * Safety over voltage Battery cell imbalance 2nd level protection IC input Safety overcurrent Safety overtemperature Open thermistor Charge FET and 0 Volt Charge FET fault Discharge FET fault Fuse blow failure detection AFE communication error Internal flash data error Charge Control Features The bq20z80 charge control features includes: * * * * * * * 8 Report the appropriate charging current needed for constant current charging and the appropriate charging voltage needed for constant voltage charging to a smart charger using SMBus broadcasts. Determines the chemical state of charge of each battery cell using Impedance TrackTM and can reduce the charge difference of the battery cells in fully charged state of the battery pack gradually using cell balancing algorithm during charging. This prevents fully charged cells from overcharging causing excessive degradation and also increases the usable pack energy by preventing to early charge termination supports pre-charging/zero-volt charging support fast charging supports pulse charging detects charge termination report charging faults and also indicate charge status via charge and discharge alarms. Submit Documentation Feedback bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 FEATURE SET (continued) Gas Gauging The bq20z80 uses the Impedance TrackTM Technology to measure and calculate the available charge in battery cells. The achievable accuracy is better than the coulomb counting method over the lifetime of the battery and there is no full charge discharge learning cycle required. See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note (SLUA364) for further details. LED Display The bq20z80 can drive 3-, 4-, or 5- segment LED display for remaining capacity indication. LifeTime Data Logging Features The bq20z80 offers a lifetime data logging array, where all important measurements are stored for warranty and analysis purposes. The data monitored includes: * * * * * * * * * * * * * Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime maximum temperature minimum temperature maximum battery cell voltage minimum battery cell voltage maximum battery pack voltage minimum battery pack voltage maximum charge current maximum discharge current maximum charge power maximum discharge power maximum average discharge current maximum average discharge power average temperature Authentication The bq20z80 supports authentication by the host using SHA-1. Power Modes The bq20z80 supports 3 different power modes to reduce power consumption: * * * In Normal Mode, the bq20z80 performs measurements, calculations, protection decision, data update in 1 second intervals. Between these intervals, the bq20z80 is in a reduced power stage. In Sleep Mode, the bq20z80 performs measurements, calculations, protection decision, data update in adjustable time intervals. Between these intervals, the bq20z80 is in a reduced power stage. In Shutdown Mode the bq20z80 is completely disabled. CONFIGURATION Oscillator Function The oscillator of the bq20z80 can be set up for internal or external operation. On power up, the bq20z80 automatically attempts to start the internal oscillator. If a 100-k resistor is not connected to ROSC (pin 33), then it attempts to start the oscillator using an external 32.768-kHz crystal. NOTE Install either the 100-k ROSC resistor or the 12-pF, 32.768-kHz crystal. Do not install both. Submit Documentation Feedback 9 bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 FEATURE SET (continued) The performance of the internal oscillator depends on the tolerance of the 100-k resistor between RSOC (pin 33) and VSSA (pin 34). Choose a resistor with a tolerance of 0.1%, and 50-ppm or better temperature drift. Place this resistor as close as possible to the bq20z80. If a 12-pF crystal is used, place it as close as possible to the XCK1 (pin 34) and XCK2 (pin 33) pins. If not properly implemented, the PCB layout in this area can degrade oscillator performance. System Present Operation The bq20z80 pulls the PU pin high periodically (1 s). Connect this pin to the PRES pin of the bq20z80 via a resistor of approximately 5 k. The bq20z80 measures the PRES input during the PU-active period to determine its state. If PRES input is pulled to ground by external system, the bq20z80 detects this as system present. BATTERY PARAMETER MEASUREMENTS The bq20z80 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and a second delta-sigma ADC for individual cell and battery voltage, and temperature measurement. Charge and Discharge Counting The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage drop across a small-value sense resistor between the SR1 and SR2 pins. The integrating ADC measures bipolar signals from -0.25 V to 0.25 V. The bq20z80 detects charge activity when VSR = V(SR1)-V(SR2)is positive and discharge activity when VSR = V(SR1)-V(SR2) is negative. The bq20z80 continuously integrates the signal over time, using an internal counter. The fundamental rate of the counter is 0.65 nVh. Voltage The bq20z80 updates the individual series cell voltages through the bq29312A at one second intervals. The bq20z80 configures the bq29312A to connect the selected cell, cell offset, or bq29312A VREF to the CELL pin of the bq29312A, which is required to be connected to VIN of the bq20z80. The internal ADC of the bq20z80 measures the voltage, scales and calibrates it appropriately. This data is also used to calculate the impedance of the cell for the Impedance TrackTM gas-gauging. Current The bq20z80 uses the SR1 and SR2 inputs to measure and calculate the battery charge and discharge current using a 5 m to 20 m (typical) sense resistor. Auto Calibration The bq20z80 provides an auto-calibration feature to cancel the voltage offset error across SR1 and SR2 for maximum charge measurement accuracy. The bq20z80 performs auto-calibration when the SMBus lines stay low continuously for a minimum of 5 s. Temperature The bq20z80 TS1 and TS2 inputs, in conjunction with two identical NTC thermistors (default are Semitec 103AT), measure the battery environmental temperature. The bq20z80 can also be configured to use its internal temperature sensor. COMMUNICATIONS The bq20z80 uses SMBus v1.1 with Master Mode and package error checking (PEC) options per the SBS specification. SMBus On and Off State The bq20z80 detects an SMBus off state when SMBC and SMBD are logic-low greater than an adjustable period of time. Clearing this state requires either SMBC or SMBD to transition high. Within 1 ms, the communication bus is available. 10 Submit Documentation Feedback bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 FEATURE SET (continued) SBS Commands Table 1. SBS COMMANDS SBS Cmd Mode Name Format Size in Bytes Min Value Max Value Default Value 0x00 R/W ManufacturerAccess hex 2 0x0000 0xffff -- 0x01 R/W RemainingCapacityAlarm unsigned int 2 0 65535 -- mAh or 10mWh 0x02 R/W RemainingTimeAlarm unsigned int 2 0 65535 -- min 0x03 R/W BatteryMode hex 2 0x0000 0xffff -- 0x04 R/W AtRate signed int 2 -32768 32767 -- mA or 10mW 0x05 R AtRateTimeToFull unsigned int 2 0 65535 -- min 0x06 R AtRateTimeToEmpty unsigned int 2 0 65535 -- min 0x07 R AtRateOK unsigned int 2 0 65535 -- 0x08 R Temperature unsigned int 2 0 65535 -- 0.1K 0x09 R Voltage unsigned int 2 0 20000 -- mV 0x0a R Current signed int 2 -32768 32767 -- mA 0x0b R AverageCurrent signed int 2 -32768 32767 -- mA 0x0c R MaxError unsigned int 1 0 100 -- % 0x0d R RelativeStateOfCharge unsigned int 1 0 100 -- % 0x0e R AbsoluteStateOfCharge unsigned int 1 0 100 -- % 0x0f R RemainingCapacity unsigned int 2 0 65535 -- mAh or 10mWh 0x10 R FullChargeCapacity unsigned int 2 0 65535 -- mAh or 10mWh 0x11 R RunTimeToEmpty unsigned int 2 0 65535 -- min 0x12 R AverageTimeToEmpty unsigned int 2 0 65535 -- min 0x13 R AverageTimeToFull unsigned int 2 0 65535 -- min 0x14 R ChargingCurrent unsigned int 2 0 65535 -- mA 0x15 R ChargingVoltage unsigned int 2 0 65535 -- mV 0x16 R BatteryStatus unsigned int 2 0x0000 0xffff -- 0x17 R/W CycleCount unsigned int 2 0 65535 -- 0x18 R/W DesignCapacity unsigned int 2 0 65535 0x19 R/W DesignVoltage unsigned int 2 7000 16000 14400 0x1a R/W SpecificationInfo unsigned int 2 0x0000 0xffff 0x0031 0x1b R/W ManufactureDate unsigned int 2 0 65535 0 0x1c R/W SerialNumber hex 2 0x0000 0xffff 0x0001 0x20 R/W ManufacturerName String 11+1 -- -- Texas Instruments ASCII 0x21 R/W DeviceName String 7+1 -- -- bq20z80 ASCII 0x22 R/W DeviceChemistry String 4+1 -- -- LION ASCII 0x23 R ManufacturerData String 14+1 -- -- -- ASCII 0x2f R/W Authenticate String 20+1 -- -- -- ASCII 0x3c R CellVoltage4 unsigned int 2 0 65535 mV 0x3d R CellVoltage3 unsigned int 2 0 65535 mV 0x3e R CellVoltage2 unsigned int 2 0 65535 mV 0x3f R CellVoltage1 unsigned int 2 0 65535 mV Submit Documentation Feedback Unit mAh or 10mWh mV 11 bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 Table 2. EXTENDED SBS COMMANDS SBS Cmd Mode Name Format Size in Bytes Min Value Max Value Default Value Unit 0x45 R AFEData String 11+1 -- -- -- ASCII 0x46 R/W FETControl hex 1 0x00 0xff -- 0x4f R StateOfHealth unsigned int 1 0 100 -- 0x50 R SafetyAlert hex 2 0x0000 0xffff -- 0x51 R SafetyStatus hex 2 0x0000 0xffff -- 0x52 R PFAlert hex 2 0x0000 0xffff -- 0x53 R PFStatus hex 2 0x0000 0xffff -- 0x54 R OperationStatus hex 2 0x0000 0xffff -- 0x55 R ChargingStatus hex 2 0x0000 0xffff -- 0x57 R ResetData hex 2 0x0000 0xffff -- 0x58 R WDResetData unsigned int 2 0 65535 -- 0x5a R PackVoltage unsigned int 2 0 65535 -- 0x5d R AverageVoltage unsigned int 2 0 65535 0x60 R/W UnSealKey hex 4 0x00000000 0xffffffff -- 0x62 R/W PFKey hex 4 0x00000000 0xffffffff -- 0x63 R/W AuthenKey3 hex 4 0x00000000 0xffffffff -- 0x64 R/W AuthenKey2 hex 4 0x00000000 0xffffffff -- 0x65 R/W AuthenKey1 hex 4 0x00000000 0xffffffff -- 0x66 R/W AuthenKey0 hex 4 0x00000000 0xffffffff -- 0x70 R/W ManufacturerInfo String 8+1 -- -- -- 0x71 R/W SenseResistor unsigned int 2 0 65535 -- 0x77 R/W DataflashClass hex 2 0x0000 0xffff -- 0x78 R/W DataFlashSubClass1 hex 32 -- -- -- 0x79 R/W DataFlashSubClass2 hex 32 -- -- -- 0x7a R/W DataFlashSubClass3 hex 32 -- -- -- 0x7b R/W DataFlashSubClass4 hex 32 -- -- -- 0x7c R/W DataFlashSubClass5 hex 32 -- -- -- 0x7d R/W DataFlashSubClass6 hex 32 -- -- -- 0x7e R/W DataFlashSubClass7 hex 32 -- -- -- 0x7f R/W DataFlashSubClass8 hex 32 -- -- -- % mV mV Firmware Version Changes bq20z80-V102 to bq20z80-V110 Changes Table 3. CHANGE DETAILS CHANGE Allows alarm based on remaining battery energy bq0z80-V110 bq20z80-V102 COMMENTS Feature not available make bq20z80 compatible to bq20z90 Permanent fail fuse blow can [PRE_ZT_PF_En] in be disabled, if IT not enabled DF.Operation Cfg C added Feature not available prevents accidental fuse blow during production and testing changed max time the LED stays on after display is activated DF.LED Hold Time max time is 16s DF.LED Hold Time max time is 255s reliable LED display timings Prevent false detection of AFE_C Reset AFE comm and clear the afe_fail count in case AFE in unknown comm state at reset 12 DF.Remaining Energy Alarm added Submit Documentation Feedback Prevents a AFE_C during a WD Reset bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 Table 3. CHANGE DETAILS (continued) CHANGE Proper FET operation in presence of partial resets bq0z80-V110 bq20z80-V102 COMMENTS Clear sleep mode flag (and all CHG_off flag set while in SLEEP but Sbscc_control flags) with partial a partial reset would incorrectly clear and full resets to correct condition this flag where charge FET can remain off. Prevent false detection of PF Force full reset for attempted shutdown (prevent PF_SHUT from causing a PF condition if shutdown does not occur) Shutdown does cause a PF Allow shutdown to work correctly when the part is in sleep Fix shutdown when in sleep A race condition was occurring between sleep and shutdown that was not allowing the device to shutdown when in sleep mode. Change default charger present voltage from 12000 to 3000 mv Change default charger present voltage from 12000 to 3000 mv bq29312 will not reliably shutdown until pack+ voltage is below 3000 mv. Prevents failed shutdown attempts Meet SBS specification Change default DF:Rem Cap Alarm for mWh mode to 10% of DF:Design Capacity per SBS spec from 0 Meet SBS specification Correct SBS.AbsoluteStateOfCharge( ) to allow for values >100% per SBS the spec Correct cell balance time when number of cells < 4 cell balance duty cycle now 0.4 For persistent SC conditions Change Default AFE OC Dsg Recovery from 100 mA to 5 ma "Cell balancing time per cell has been changed to be based on the number of cells configured for use in Operation Cfg A, as below. Each number indicates the duty cycle, or the amount of time the cell balancing FET is on as opposed to being off. For example, if the duty cycle is 0.4, and the cycle time is 250 ms, the cell balancing FET will be on for 100 ms and off for 150 ms.CC1:CC0 = 3 -> 0.4CC1:CC0 = 2 -> 0.3CC1:CC0 = 1 -> 0.224" Set SBS.BatteryMode Alarm and charger bits default to on if master broadcasts disabled. Convenient setup to have BatteryMode Alarm accurately indicate broadcast state. Make RemainingCapacity writeable Add State of Health parameter unused data flash Remove unused FastCharge OverVoltage double dataflash value Faster wakeup response Check sleep wakeup every 250 ms, change from 1000 ms Check sleep wakeup every 1000 ms bq20z80-V101 to bq20z80-V102 Changes Table 4. CHANGE DETAILS CHANGE Corrected to allow display to turn off when charging and button pushed. bq0z80-V102 LED display operates correctly during charging. bq20z80-V101 COMMENTS LED display would stay on until Correct operation of the LED charging terminated after the button display under all conditions was pushed. Only occurs when LED display not configured to be always on during charging. Submit Documentation Feedback 13 bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 Table 4. CHANGE DETAILS (continued) CHANGE Allow negative LED thresholds to permit LED alarms to be disabled bq0z80-V102 COMMENTS Feature not available Allow better customization Allow zero values for ALARM Configuring zero value for the and CHARGING LED blink LED blink rates disables them. rates to disable them Feature not available Allow better customization Restore initialization of dodcharge initialized to the dodcharge in relaxed state correct value so that the correct dodcharge value is used in capacity estimation dodcharge value set to zero Improved gauging accuracy with correct initialization of dodcharge value. Only clear offset calibration flag when SMBus lines go high. Prevents offset calibration occurring just because a safety condition occurs and then clears when the SMBus lines are low. Offset calibration occurs multiple times if safety condition occurs when SMBus lines are low. More appropriate period between offset calibrations when SMBus lines are low. Change so that setting AFE Fail Limit to zero disables PF_AFE_C Configurable option to allow disabling PF_AFE_C trigger Feature not available. Allow better customization Enable LED display to turn off after charge termination and if SMBus lines are detected low and LEDs enabled during charging. LED display turns off after charge LED display stays on when charging Correct operation of the LED termination. terminates after SMBus lines are display under all conditions detected low. Set charge FET state immediately when entering sleep Charge FET state set correctly, immediately after entering sleep Change DF:Operation Cfg B [CCT = 0], so that SBS.CycleCount( ) threshold is in mAH, not in % of FCC Data flash default bases DF:Operation Cfg B [CCT = 1], SBS.CycleCount( ) calculation on making the default mAh and not % of FCC SBS.CycleCount( ) calculation to be based on % of FCC Data flash default changed to reflect common customer usage When DF:Operation Cfg B [CCT = 1], so that SBS.CycleCount( ) threshold is % of FCC, then DF:CC Threshold is used as a minimum for the SBS.CycleCount( ) threshold Use DF:CC Threshold as the Small or negative SBS.Full Charge minimum to prevent rapid Capacity( ) values (should not occur incrementing of the under normal operation) from SBS.Cyclecount( ), damaging the causing the SBS.CycleCount( ) data flash incrementing rapidly, potentially damaging the data flash Improved system reliability When exiting the relaxed state to sleep, the initial charge capacity is correctly calculated Corrected initial charge capacity calculation to be accurate when exiting relaxed state to sleep If the relaxed state was exited to sleep after a valid DOD measurement (30-minute default value), then the initial charge capacity would not be recalculated and would result in an incorrect FCC value if the sleep state was exited before another valid DOD measurement (30-minute default value) More reliable SBS:FullChargeCapacity( ) calculation under all system conditions Correct update of Remcap in relaxed state to use passed charge Charge or discharge current accumulated in a relaxed state used to update Remcap If the relaxed state was exited after the accumulation of significant charge or discharge current (over at most 100 seconds with default values), the RemCap and FCC would be in error by this charge. This is only significant if the relaxed state can exist with significant current as determined by application settings. More reliable SBS:FullChargeCapacity( ) SBS:RemainingCapacity( ) calculation under all system conditions 14 Configuring negative LED alarm threshold disables LED alarm functionality. bq20z80-V101 The CHG FET would not get set to the correct state for sleep until the first voltage measurement. Submit Documentation Feedback Quicker transition of FET to the correct state in sleep bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 Table 4. CHANGE DETAILS (continued) CHANGE bq0z80-V102 bq20z80-V101 COMMENTS Implement disable of Prevent invalid soc values from resistance update based on causing incorrect resistance accumulative scale. If the updates product of 15 consecutive (default value) resistance scale factors is less than 0.5 or more than 1.5, then resistance update is disabled until the next valid soc measurement. Sets bit 2 of Operation Status to indicate resistance update disabled. Incorrect resistance updates that could result from invalid soc values More reliable resistance updates under all system conditions Implement disable of Prevent invalid soc values from resistance update based on causing incorrect resistance estimated capacity error. updates Sets bit 2 of Operation Status to indicate resistance update disabled. Incorrect resistance updates that could result from invalid soc values More reliable resistance updates under all system conditions Disable Qmax increment if due to Grid 14 and exit of discharge Prevent unnecessary Qmax increments Qmax increments can occur due to Grid 14 and exit of discharge Improved Qmax data reliability under all system conditions. Drive all unused pins low Provides better ESD immunity Not all unused pins driven low Improved ESD immunity Initial charge capacity calculation when dod0 is measured in the overdischarged state is corrected Overdischarged state does not affect the accuracy of FCC calculations An incorrect initial charge capacity affects FCC that is calculated during discharge or a Qmax update. If FCC is not changed by a Qmax update, then reported RemainingCapacity could be negative after 5 hours of relaxation More reliable SBS:FullChargeCapacity( ) SBS:RemainingCapacity( ) calculation under all system conditions Correct calculation of FCC and RemCap when dod0 is taken when the battery is overdischarged or overcharged. This allows RemCap to go negative, or greater than FCC (though is only reported from 0 - FCC). Overcharged/Overdischarged does not affect the accuracy of FCC and RemCap calculations The RemainingCapacity will increment (or decrement) during charging (discharging) even when the battery is in an overdischarged (overcharged) state. More reliable SBS:FullChargeCapacity( ) SBS:RemainingCapacity( ) calculation under all system conditions Change cell imbalance DF:Battery Rest Time from 1 byte to 2 bytes and set the default value to 1800 seconds New feature providing improved customization Feature not available Improved customization for Cell Imbalance detection Use upper and lower limit for resistance accumulative scale. Set default values to 300% and 30%. More reliable resistance updates under all system conditions Add DF:CF MaxError limit for New feature providing improved setting SBS.BatteryMode( ) customization [CONDITION FLAG]. Set default value to 100%. Feature not available Use SBS.AtRate( ), UserRate and C/5 rate for relaxed capacity calculation, respectively, if set by Load Select; otherwise, use previous rate. Correct Host Watchdog from being reset by broadcasts Improved customization More reliable SBS:FullChargeCapacity( ) SBS:RemainingCapacity( ) calculation under all system conditions Host Watchdog functionality not affected by alarm or charger broadcasts Host Watchdog reset by alarm or charger broadcasts Submit Documentation Feedback Reliable Host Watchdog functionality under all system conditions 15 bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 Table 4. CHANGE DETAILS (continued) CHANGE bq0z80-V102 bq20z80-V101 COMMENTS The voltage table chemistry ID can be read by writing 0x0008 to ManufacturerAccess and then reading from ManufacturerAccess. The default chemistry ID is 0x0100 New feature providing more information Feature not available Improved information access SBS.BatteryMode( ) is initialized on high transition of the SMBus lines to DF:Init BatteryMode, instead of always clearing SBS.BatteryMode( ) defined bits on high transition of the SMBus lines. Customization allows for preserving SBS.BatteryMode( ) settings through SMBus line transitions Feature not available Improved customization Broadcast timers are set correctly on high transition of SMBus lines. The timers are set to 10 seconds on high transition of SMBus lines. Broadcast timer accurate regardless of CC offset calibration or entry to sleep Broadcast timer accuracy required a Improved broadcast timing CC offset calibration and entry to accuracy to meet Smart Battery sleep. Data spec bq20z80 to bq20z80-V101 Changes CHANGE bq20z80 bq20z80-V101 COMMENTS Added authentication (optional SBS command 0x2f) Command 0x2f has no function and is Command 0x2f is the not acknowledged. SBS.Authenticate( ) command to the bq20z80 to begin the SHA1 authentication. Additional feature to enable host to authenticate the battery Added Cell Balancing Cell balancing not available Added State of Charge cell balancing algorithm Additional feature to enable longer lifetime of battery Added charge fault FET Enable register When charge faults occur, FET action is taken. When charge faults occur, FET action is taken if enabled in DF:FET Enable register. Adds flexibility to system interaction Added pulse compensation for end of discharge Applications with pulsed current loads and minimum voltage requirements can have less RemainingCapacity than reported. The voltage pulses caused by pulsed Added additional feature to improve current loads are measured and used capacity prediction to better estimate RemainingCapacity. Added SBS.BatteryStatus( ) [TDA, FD] voltage thresholds SBS.BatteryStatus( ) [TDA, FD] are only set on SBS.RSOC, detection of charge termination or faults SBS.BatteryStatus( ) [TDA, FD] are now set and cleared based on SBS.Voltage( ) Adds flexibility to system interaction Added option for LEDs in series with current source LED display is only in parallel. LED display is available in series (with current source) or parallel. Adds capability for higher brightness LEDs Configured pin 7 as active high fuse blow Pin 7 is not connected. Pin 7 is now an active high reflection of SAFE (pin 12). Adds flexibility to choose different circuits driven by the permanent failure signal Added State of Health calculation (command 0x4f) Command 0x4f has no function and is Command 0x4f is the not acknowledged. SBS.StateOfHealth( ) command where SOH is the ratio of SBS.DesignCapacity( ) to SBS.FullChargeCapacity( ). Additional feature to allow host to easily determine health of the battery Added Synchronization of SBS.RemainingCapacity( ) to SBS.FullChargeCapcity( ) at charge taper termination. SBS.RemainingCapacity( ) is not affected and could be < 100% at charge termination. If DF:Operation Cfg [RMFCC] is set then SBS.RemainingCapacity( ) is updated to the value of SBS.FullChargeCapcity( ) at charge termination. Adds option to enable charge synchronization in order to display RelativeStateOfCharge as 100% at charge termination Improved thermal model A preliminary thermal mode was used. An updated thermal model is used. Improved thermal compensation of Impedance TrackTM algorithm Improved cell capacity measurement by limiting valid temperature ranges Valid voltage measurements for cell capacity estimation can occur at any temperature. Valid voltage measurements for cell capacity estimation must occur within a defined temperature range. Improves capacity estimation Improved cell capacity measurement After a full reset, it may take several minutes for voltage reading to settle to the most accurate reading. Settling time of voltage measurements after a full reset is reduced. Improves initial voltage reading accuracy Improved default resistance tables A preliminary default resistance mode was used. An updated default resistance mode is used. Improved thermal accuracy of Impedance TrackTM algorithm 16 Submit Documentation Feedback bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 CHANGE bq20z80 bq20z80-V101 COMMENTS Prevented lifetime updates until IT is enabled Data flash lifetime data is updated under all conditions. Data flash lifetime data is not updated until Impedance TrackTM is enabled. Improves suitability of lifetime data Aligned SBS.RemainingCapacity( ) with DF:Terminate Voltage SBS.RemainingCapacity( ) could be above zero when SBS.Voltage( ) reaches DF:Terminate Voltage. Forces SBS.RemainingCapacity( ) to zero when SBS.Voltage( ) is below terminate voltage Improves alignment between reporting and system status Disabled LEDs for undervoltage conditions When SBS.OperationStatus( ) [CUV or PUV] is set, then the LED display could be activated. When SBS.OperationStatus( ) [CUV or PUV] is set, the LED display is disabled. Reduces risk of deeply discharging the battery Clear SBS.BatteryStatus( ) [RCA] when not SBS.BatteryStatus( ) [DSG] SBS.BatteryStatus( ) [RCA] is not cleared when SBS.BatteryStatus( ) [DSG] is cleared. SBS.BatteryStatus( ) [RCA] is now cleared when SBS.BatteryStatus( ) [DSG] is cleared. Corrected to meet SBS specification Allowed sleep mode for undervoltage conditions When SBS.OperationStatus( ) [CUV or PUV] is set, then entry to sleep mode is disabled. When SBS.OperationStatus( ) [CUV or PUV] is set, then entry to sleep mode is allowed. Reduces risk of deeply discharging the battery Improvements made to Lifetime data Does not save maximum and minimum lifetime AverageCurrent or AveragePower. Only saves lifetime data when new values exceed old values by defined delta values Saves maximum and minimum lifetime AverageCurrent and AveragePower. Lifetime data is saved after a defined period of time even if new values do not exceed old values by defined delta values Improves lifetime data Changes made to pulse charging Voltages for pulse charging are sampled once a second. Voltages for pulse charging are sampled 4 times a second. Improves pulse charging Changes made to charging timeouts The precharge timeout timer runs when the charging current is below a defined threshold; so, it is possible that the precharge timer will run during charging taper current and cause an undesired precharge timeout during charging taper. The fast charge and precharge timeout timers only run when precharging or charging, as indicated by FCHG and PCHG bits in ChargingStatus. Improves operation of fast charge and precharge timeout timers Changes made to discharge faults Discharging fault is indicated whenever BatteryStatus [TDA] is set. Current discharging fault is not indicated for current faults detect by AFE. Separate discharging faults are indicated for voltage and temperature. Discharging fault is indicated for any safety condition resulting in turning off the discharge FET. Current discharging fault is indicated for all detected overcurrent conditions, including overcurrent detected by AFE. Temperature and voltage discharge faults are not indicated separately. Improves indication of discharging fault conditions Improvements made to calibration functions Voltage calibration functions may cause error in voltage calibration of several millivolts. Voltage calibration functions are capable of accuracy within 1 millivolt. Improved voltage calibration accuracy Protect against simultaneous writes to A SMBus-initiated data flash write A SMBus-initiated data flash write data flash may occur at the same time as a data cannot occur at the same time as any flash write initiated by the AGG, which other data flash write. my cause a data flash write error. Increased robustness of data flash writes Corrected SBS.ManufacturerAccess( ) access of SBS.ManufacturerAccess( ) access of silicon revision is not functional. silicon revision SBS.ManufacturerAccess( ) access of Allows host to determine bq20z80 silicon revision is functional. silicon revision Corrected data flash checksum operation The data flash checksum includes non-accessible portions of the data flash that change when writing the data flash checksum, invalidating the checksum. The data flash checksum only includes data flash that does not change when writing an updated data flash checksum. Data flash checksum operation works correctly. Corrections made to LED display Fixed LED thresholds cannot be selected. Fixed LED thresholds can be selected. Correct operation of LED threshold settings Erroneous readings are corrected that Erroneous SBS voltage, current, and occurred after offset calibration when temperature readings occur after sleep mode is not entered. current offset calibration if sleep mode is not entered, corrupting the lifetime data. No erroneous SBS voltage, current, Improve reliability of lifetime data and temperature readings occur after current offset calibration if sleep mode is not entered. Corrected the length of SBS.ManufacturerData( ) command SBS.ManufactureData( ) returned additional data not specified in the data sheet. Only returns the appropriate data Correct data set made available to host Changed DF:Charger Present default voltage to 12000 mV DF:Charger Present default was 16800 mV. Default changed to 12000 mV. More realistic default for most applications Corrected LED display lock-up fault when exiting sleep with LEDs on LED display locks up if LEDs are ON as the bq20z80 exits sleep mode. LED display operates normally regardless of power state transitions. Correct operation of the LED display under all conditions Submit Documentation Feedback 17 bq20z80 bq20z80A www.ti.com SLUS782 - JULY 2007 CHANGE bq20z80 Added report of any inability to write DFF as flash write error in calibration mode If writing the data flash is not allowed either due to a permanent failure or low voltage, then no indication is given when attempting to write data flash in calibration mode. bq20z80-V101 COMMENTS The inability to write data flash in Improved calibration system calibration mode is reported as a flash interaction write error. Corrected issue of improperly clearing AFE faults were detected and the AFE faults pack protected but the fault would be cleared up to three times at an interval of 250 milliseconds before the defined recovery requirements would apply. AFE faults are correctly handled, including the flags. Modified code to save open-circuit OCV data was saved after a full reset voltage (OCV) data on IT enable only, which could have disturbed the OCV not a full reset measurements if the battery was not in a completely relaxed state. OCV tables are only updated when IT Improved OCV data reliability under enabled, or the IT enable command is all system conditions resent. Corrected range check for calibration of analog-to-digital converter (ADC) offset In calibration mode, if the measurement ADC offset was out of range, no error would be reported. In calibration mode, if the measurement ADC offset is out of range, an error is reported. Improved calibration system interaction Implemented a validation time for DOD0 There is a possibility of erroneous DOD0 measurement if charge or discharge current occurs at the same time. DOD0 measurement is not saved unless the battery remains in the relaxed state for a defined time after the DOD0 measurement is made. More reliable SBS.FullChargeCapacity( ) and SBS.RemainingCapacity under all system conditions Implemented a bounds limit to a QMAX change QMAX changes are not limited to filter-bad readings. QMAX changes are bounds limited to filter-bad readings. More reliable SBS.FullChargeCapacity( ) and SBS.RemainingCapacity under all system conditions Implemented a double hit for dv/dt detection for QMAX qualification The dv/dt qualification for QMAX update requires only one sample to be valid. The dv/dt qualification for QMAX update requires two samples to be valid. More reliable SBS.FullChargeCapacity( ) and SBS.RemainingCapacity( ) under all system conditions Corrected parameter update issue caused by exiting sleep mode during current measurement If bq20z80 exits sleep during a current measurement, the SBS parameters do not update again until the pack enters and exits sleep mode again. SBS parameter updates operate normally regardless of power state transitions. Improved system interaction for sleep mode transitions Implemented an option to leave charge FET on for a nonremovable pack in sleep mode, enabled by DF:Operation Cfg B [NRCHG]. When DF:Operation Cfg B [NR] is set, When DF:Operation Cfg B [NR, then the CHG is turned off at entry to NRCHG] are set, then the CHG sleep mode. remains on at entry to sleep mode. Improved system interaction options Modified code such that if QMAX has not been updated, old valid OCV readings are discarded when a new valid OCV reading is detected and the conditions for QMAX update do not exist. Valid OCV is only discarded when all conditions for QMAX update are satisfied, but the accumulated error in the measured capacity exceeds 1% (default value). If QMAX has been updated, the same conditions for discarding an OCV reading are the same as for the bq20z80. Otherwise, old OCV readings are discarded and new OCV readings are used when the conditions for a valid OCV reading exist, but the conditions for QMAX update do not exist. Enables QMAX measurement for full charge or discharge for the first QMAX update, even if initial OCV measurement is made when battery is only partially charged. Modified code such that if QMAX has not been updated, then for QMAX update to occur, the measured capacity must be greater than or equal to 90% (default value) of design capacity. The measured capacity must be greater than 20% (default value) or a value as determined from the QMAX update filter constant for a QMAX update to occur. For the first QMAX, the measured capacity must be greater than 90% (default value) for a QMAX update to occur. If QMAX update has occurred the conditions for measured capacity are the same as for the bq20z80. Improved QMAX data reliability for the first update of QMAX Default minimum passed charge for QMAX update has been changed from 20% to 37% Internal flash value of Min Passed Charge is 20%. The default setting for the QMAX update filter constant of 64 means actual Min Passed Charge for QMAX update is 25%. Internal flash value of Min Passed Charge is 37%. This 37% is consistent with the QMAX update filter constant of 96. Improved QMAX data reliability under all system conditions. Default QMAX update filter constant has been changed from 64 to 94. Internal flash value of QMAX update filter is 64. Internal flash value of QMAX update filter is 94. Improved QMAX data reliability under all system conditions. DF:Qmax Cell 2..4 are updated to = DF:Design Capacity if not used when QMAX is updated. Ensure all QMAX values are reasonable, even if not used QMAX values for nonexistent cells will DF:Qmax Cell 2..4 written with be updated to Design Capacity. random values if not used when QMAX is updated 18 Submit Documentation Feedback Improved system interaction when faults occur PACKAGE OPTION ADDENDUM www.ti.com 20-Aug-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) BQ20Z80ADBT-V110 ACTIVE TSSOP DBT 38 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z80ADBT-V110G4 ACTIVE TSSOP DBT 38 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z80ADBTR-V110 ACTIVE TSSOP DBT 38 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z80ADBTRV110G4 ACTIVE TSSOP DBT 38 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z80DBT NRND TSSOP DBT 38 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z80DBT-V110 NRND TSSOP DBT 38 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z80DBT-V110G4 NRND TSSOP DBT 38 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z80DBTG4 NRND TSSOP DBT 38 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z80DBTR-V110 NRND TSSOP DBT 38 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z80DBTR-V110G4 NRND TSSOP DBT 38 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 20-Aug-2011 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device BQ20Z80ADBTR-V110 Package Package Pins Type Drawing TSSOP DBT 38 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.2 1.8 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ20Z80ADBTR-V110 TSSOP DBT 38 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated