1
Subject to change without notice.
www.cree.com/power
Datasheet: CSD02060 Rev. -
CSD02060–Silicon Carbide Schottky Diode
Zero recovery® RectifieR
VRRM = 600V
IF(AVG) = 2A
Qc = 7nC
Features
600-Volt Schottky Rectier
Zero Reverse Recovery
Zero Forward Recovery
High-Frequency Operation
Temperature-Independent Switching Behavior
Extremely Fast Swtitching
Positive Temperature Coefcient on VF
Benets
Replace Bipolar with Unipolar Rectiers
Essentially No Switching Losses
Higher Efciency
Reduction of Heat Sink Requirements
Parallel Devices Without Thermal Runaway
Applications
Switch Mode Power Supplies
Power Factor Correction
- Typical PFC Pout : 200W-400W
Motor Drives
- Typical Power : 0.50HP-1.0HP
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Package
TO-263-2 TO-220-2
Maximum Ratings
Symbol Parameter Value Unit Test Conditions Note
VRRM Repetitive Peak Reverse Voltage 600 V
VRSM Surge Peak Reverse Voltage 600 V
VDC DC Blocking Voltage 600 V
IF(AVG) Average Forward Current 2
3.5 ATC=150˚C, DC
TC=125˚C, DC
IF(PEAK) Peak Forward Current 5 A TC=125˚, TREP<1mS, Duty=0.5
IFRM Repetitive Peak Forward Surge Current 10 A TC=25˚C, tP=8.3ms, Half Sine Wave
IFSM Non-Repetitive Peak Forward Surge Current 40 A TC=25˚C, tP=10µs, Pulse
Ptot Power Dissipation 43
14 WTC=25˚C
TC=125˚C
TJ , Tstg Operating Junction and Storage Temperature -55 to
+175 ˚C
PIN 1
PIN 2 CASE
Part Number Package Marking
CSD02060A TO-220-2 CSD02060
CSD02060G TO-263-2 CSD02060
2CSD02060 Rev. -
Electrical Characteristics
Symbol Parameter Typ. Max. Unit Test Conditions Note
VFForward Voltage 1.6
2.0
1.8
2.4 VIF = 2A TJ=25°C
IF = 2A TJ=175°C
IRReverse Current 50
100
200
1000 μA VR = 600V TJ=25°C
VR = 600V TJ=175°C
QCTotal Capacitive Charge 7 nC
VR = 600V, IF = 1A
di/dt = 500 A/μs
TJ = 25°C
CTotal Capacitance
120
20
15
pF
VR = 0V, TJ = 25°C, f = 1MHz
VR = 200V, TJ = 25˚C, f = 1MHz
VR = 400V, TJ = 25˚C, f = 1MHz
Note:
This is a majority carrier diode, so there is no reverse recovery charge.
Thermal Characteristics
Symbol Parameter Typ. Max. Unit Test Conditions Note
RθJC
Thermal Resistance from Junction
to Case 4.7 °C/W
RθJA
Thermal Resistance from Junction
to Ambient 53 °C/W
Typical Performance
1.
Figure 1. Forward Characteristics
0
1
2
3
4
5
6
7
8
9
10
11
12
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
VF Forward Voltage (V)
IF Forward Current (A)
TJ = 25°C
TJ = 75°C
TJ = 125°C
TJ = 175°C
Figure 2. Reverse Characteristics
0
20
40
60
80
100
120
140
160
180
200
0 200 400 600 800
VR Reverse Voltage (V)
IR Reverse Current (µA)
TJ = 25°C
TJ = 75°C
TJ = 125°C
TJ = 175°C
4
3
2
1
0
3CSD02060 Rev. -
Figure 3. Current Derating
0
2
4
6
8
10
12
14
16
18
20
25 50 75 100 125 150 175 200
IF(AV) Forward Current (A)
Figure 4. Capacitance vs. Reverse Voltage
0
50
100
150
200
250
1 10 100 1000
VR Reverse Voltage (V)
C Capacitance (pF)
Figure 5. Transient Thermal Impedance
1.00E-03
1.00E-02
1.00E-01
1.00E+00
1.00E+01
1.00E-07 1.00E-06 1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00
time [s]
Zth [°C/W]
Typical Performance
I
F(AVG)
Forward Current (A)
6
5
4
3
2
1
0
25 50 75 100 125 150 175 200
100
80
60
40
20
0
4CSD02060 Rev. -
POS Inches Millimeters
Min Max Min Max
A.396 .406 10.058 10.312
B .297 .303 7.544 7.696
C.057 .063 1.448 1.600
D.237 .243 6.015 6.167
E.050 .070 1.270 1.778
F .048 .052 1.219 1.321
G .100 TYP 2.540 TYP
H.335 .345 8.509 8.763
J .028 .032 .711 .813
K 2˚ 4˚ 2˚ 4˚
L .170 .180 4.318 4.572
M .048 .052 1.219 1.321
N.595 .615 15.113 15.621
P 0.00 0.10 0.00 .254
QR0.018
TYP R0.022
TYP R0.457
TYP R0.559
TYP
R.090 .110 2.286 2.794
S.013 .017 .330 .432
T6.5˚ 8.5˚ 6.5˚ 8.5˚
U .103 .107 2.616 2.718
V R0.028
TYP R0.032
TYP R0.711
TYP R0.813
TYP
W—5.0˚ —5.0˚
Package Dimensions
Package TO-220-2 POS
Inches Millimeters
Min Max Min Max
A.402 .408 10.211 10.364
B .120 .124 3.048 3.150
C.106 .110 2.692 2.794
D.245 .251 6.223 6.375
E.335 .345 8.509 8.763
F .149 .153 3.784 3.886
G.220 .240 5.588 6.096
H.540 .550 13.716 13.970
J.100 REF 2.540 REF
K.080 2.032
L .050 .056 1.270 1.422
M .032 .038 .813 .956
N.197 .203 5.004 5.156
P.170 .180 4.318 4.572
Q.048 .052 1.219 1.321
R.583 .593 14.808 15.062
S6.5˚ 8.5˚ 6.5˚ 8.5˚
T6.5˚ 8.5˚ 6.5˚ 8.5˚
U 6.5˚ 8.5˚ 6.5˚ 8.5˚
V.103 .107 2.616 2.718
W .015 .021 .381 .533
X2.0˚ 4.0˚ 2.0˚ 4.0˚
Y .396 .406 10.058 10.312
NOTE:
Dimension L, M, W apply for Solder Dip Finish.1.
Package Dimensions
Package TO-263-2
PIN 1
PIN 2 CASE
PIN 1
PIN 2 CASE
55 CSD02060 Rev. -
This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body
nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited
to equipment used in the operation of nuclear facilities, life-support machines, cardiac debrillators or similar emergency medical
equipment, aircraft navigation or communication or control systems, air trafc control systems, or weapons systems.
Copyright © 2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the
Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5451
www.cree.com/power
Recommended Solder Pad Layout
TO-263-2 TO-220-2
Part Number Package Marking
CSD02060A TO-220-2 CSD02060
CSD02060G TO-263-2 CSD02060