Multilayer Ceramic Capacitor
-HighVoltage-
Multilayer Ceramic Capacitor - High Voltage
- 1 -
■INTRODUCTION
SAMSUNG (Electro-Mechanics) mid/high voltage MLCC products with C0G(NP0) and X7R
temperature characteristics are designed for commercial and industrial applications up to DC 3 KV,
including power supply and voltage multiplier circuits applications. The specially-designed internal
and external structures are capable of enhancing high voltage performance of chips. Various sizes
and voltage ratings are available for corresponding capacitance ranges. Please contact and
consult the local offices/headquarter of SAMSUNG Electro-Mechanics.
■FEATURE AND APPLICATION
●Feature
-MiniatureSize
- Wide Capacitance and Voltage Range
- Highly Reliable Performance in High-voltage
- Tape & Reel for Surface Mount Assembly
- Low ESR
●Application
- Input Signal Filtering Circuit of Modem and LAN Interface
- General High Voltage Circuits
- Inverter Circuits with a Liquid Backlight
Multilayer Ceramic Capacitor - High Voltage
- 2 -
■STRUCTURE
Multilayer Ceramic Capacitor - High Voltage
- 3 -
■APPEARANCE AND DIMENSION
L
BW
TW
CODE EIA CODE DIMENSION ( mm )
L W T(MAX) BW
10 0603 1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.3 + 0.2/-0.1
21 0805 2.0 ±0.1 1.25 ±0.1 1.25±0.1 0.5 + 0.2/-0.3
31 1206 3.2 ±0.2 1.6 ±0.2 1.6 ±0.2 0.5 + 0.2/-0.3
32 1210 3.2 ±0.3 2.5 ±0.2 2.5 ±0.2 0.6 + 0.2/-0.1
42 1810 4.5 ±0.4 2.0 ±0.2 2.0 ±0.2 0.8 + 0.2/-0.1
43 1812 4.5 ±0.4 3.2 ±0.3 2.5 ±0.2 0.8 + 0.2/-0.1
55 2220 5.7 ±0.4 3.2 ±0.4 2.5 ±0.2 0.8 + 0.2/-0.1
Multilayer Ceramic Capacitor - High Voltage
- 4 -
■PREVIOUS PART NUMBERING
Symbol EIA Code Temperature
Coefficient(PPM/℃)
※Temperature
Characteristics Operation
Temperature Range
CC0G(CH) 0±30 CΔ-55 ~ +125℃
▶CLASS Ⅰ(Temperature Compensation)
Temperature
Characteristics below 2.0pF 2.2 ~ 3.9pF above 4.0pF above 10pF
CΔC0G C0G C0G C0G
Symbol EIA Code Capacitance Change
(ΔC:%) Operation
Temperature Range
BX7R ±15 -55 ~ +125℃
▶CLASS Ⅱ(High Dielectric Constant)
SAMSUNG Multilayer Ceramic Capacitor
Type(Size)
Capacitance Temperature Characteristics
Nominal Capacitance
Capacitance Tolerance
Rated Voltage
Thickness Option
Packaging Type
CL42C270JKNE
CAPACITANCE TEMPERATURE CHARACTERISTIC
※Temperature Characteristics
●
3
●
7
●
8
●
2
●
6
●
3
●
4
●
5
●
2●
6
●
3●
4●
5●
7●
8
●
1
●
1
Multilayer Ceramic Capacitor - High Voltage
- 5 -
Temperature
Characteristics Symbol Tolerance Applicable Capacitance & Range
C
(C0G)
C±0.25pF 0.5 ~ 10pF
D±0.5pF
J±5%
E-24 Series for over 10pFK±10%
M±20%
B(X7R)
J±5%
E-12 SeriesK±10%
M±20%
※Please Consult us for special tolerances.
※:Option
Symbol Rated Voltage(Vdc) Symbol Rated Voltage(Vdc)
C100Vdc H630Vdc
D200Vdc I1000Vdc
E250Vdc J2000Vdc
G500Vdc K3000Vdc
RATED VOLTAGE
CAPACITANCE TOLERANCE
The nominal capacitance value is expressed in pico-Farad(pF) and identified by three-
digit number, first two digits represent significant figures and last digit specifies the
number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal
point and the last digit becomes significant.
example)
100 : 10 ×10o=10pF
102 : 10 ×102= 1000pF
020 : 2 ×10o=2pF
1R5 : 1.5pF
NOMINAL CAPACITANCE
●
5
●
6
●
4
Multilayer Ceramic Capacitor - High Voltage
- 6 -
Symbol Packaging Symbol Packaging
BBulk DPaper Tape, 13" Reel
PCassette EEmbossed Tape, 7" Reel
CPaper Tape, 7" Reel FEmbossed Tape, 13" Reel
Series Capacitance Step
E- 3 1.0 2.2 4.7
E- 6 1.0 1.5 2.2 3.3 4.7 6.8
E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
E-24 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.1
※Standard Capacitance is " Each step ×10n"
▶STANDARD CAPACITANCE STEP
PACKAGING TYPE
THICKNESS OPTION
Symbol Description of the Code
NStandard thickness (please refer to standard thickness table on next page)
AThinner than standard thickness
BThicker than standard thickness
※Please consult us for other termination type.
●
7
●
8
Multilayer Ceramic Capacitor - High Voltage
- 7 -
■NEW PART NUMBERING
CL42C270JKFNNNC
●
1●
2●
3●
4●
5●
6●
7●
8●
9●
10 ●
11
●
1PRODUCT ABBREVIATION
Symbol Product Abbreviation
CL SAMSUNG Multilayer Ceramic Capacitor
●
2SIZE(mm)
Symbol Size(mm)
Length Width
10 1.6 0.8
21 2.0 1.2
31 3.2 1.6
32 3.2 2.5
42 4.5 2.0
43 4.5 3.2
55 5.7 5.0
SAMSUNG Multilayer Ceramic Capacitor
Size(mm)
Capacitance Temperature Characteristic
Nominal Capacitance
Capacitance Tolerance
Rated Voltage
Thickness Option
Product & Plating Method
Samsung Control Code
Reserved For Future Use
Packaging Type
●
7
●
8
●
2
●
6
●
3
●
4
●
5
●
1
●
9
●
10
●
11
Multilayer Ceramic Capacitor - High Voltage
- 8 -
●
3CAPACITANCE TEMPERATURE CHARACTERISTIC
Symbol Temperature Characteristics Temperature
Range
CClass ⅠCOG C△0±30(ppm/℃)-55 ~ +125℃
BClass ⅡX7R X7R ±15% -55 ~ +125℃
※Temperature Characteristic
Temperature
Characteristics Below 2.0pF 2.2 ~ 3.9pF Above 4.0pF Above 10pF
CΔC0G C0G C0G C0G
●
4NOMINAL CAPACITANCE
Nominal capacitance is identified by 3 digits.
The first and second digits identify the first and second significant figures of the capacitance.
The third digit identifies the multiplier. 'R' identifies a decimal point.
●Example
Symbol Nominal Capacitance
1R5 1.5pF
103 10,000pF, 10nF, 0.01μF
104 100,000pF, 100nF, 0.1μF
●
5CAPACITANCE TOLERANCE
Symbol Tolerance Nominal Capacitance
C±0.25pF Less than 10pF
(Including 10pF)
D±0.5pF
J±5%
More than 10pF
K±10%
M±20%
Multilayer Ceramic Capacitor - High Voltage
- 9 -
●
6RATED VOLTAGE
Symbol Rated Voltage Symbol Rated Voltage
C100V H630V
D200V I1,000V
E250V J2,000V
G500V K3,000V
●
7THICKNESS OPTION
Type Symbol Thickness(T) Spec
1608 80.80 ±0.10
2012
A0.65 ±0.10
C0.85
F1.25 ±0.10
3216
C0.85 ±0.15
F1.25 ±0.15
H1.6 ±0.20
3225
F1.25
±0.20
H1.6
I2.0
J2.5
4520 F1.25 ±0.20
H1.6
4532
F1.25
±0.20
H1.6
I2.0
J2.5
5750
F1.25
±0.20
H1.6
I2.0
J2.5
Multilayer Ceramic Capacitor - High Voltage
- 10 -
●
8PRODUCT & PLATING METHOD
Symbol Electrode Termination Plating Type
APd Ag Sn_100%
NNi Cu Sn_100%
GCu Cu Sn_100%
●
9SAMSUNG CONTROL CODE
Symbol Description of the code Symbol Description of the code
AArray (2-element) NNormal
BArray (4-element) PAutomotive
CHigh - Q W3 Terminal EMI Filter
LLICC
●
10 RESERVED FOR FUTURE USE
Symbol Description of the code
NReserved for future use
●
11 PACKAGING TYPE
Symbol Packaging Type Symbol Packaging Type
BBulk FEmbossing 13" (10,000EA)
PBulk Case LPaper 13" (15,000EA)
CPaper 7" OPaper 10"
DPaper 13" (10,000EA) SEmbossing 10"
EEmbossing 7"
Multilayer Ceramic Capacitor - High Voltage
- 11 -
▶CAPACITANCE vs CHIP THICKNESS STANDARD
Description 1608
(0603) 2012 Type
(0805) 3216 Type
(1206) 3225 Type
(1210) 4520
Type
(1808) 4532 Type
(1812) 5750 Type
(2220)
Dimension
(mm)
L1.6
±0.1 2.0±0.1 3.2±0.15 3.2±
0.2 3.2±0.3 4.5±0.4 4.5±0.4 5.7±0.4
W0.8
±0.1 1.25±0.1 1.6±0.15 1.6±
0.2 2.5±0.2 2.0±0.2 3.2±0.3 5.0±0.4
T0.8
±0.1 0.65
±0.1 0.85
±0.1 1.25
±0.1 0.85
±0.15 1.25
±0.15 1.6
±0.2 1.25
±0.2 1.6
±0.2 2.0
±0.2 2.5
±0.2 1.25
±0.2 1.6
±0.2 1.25
±0.2 1.6
±0.2 2.0
±0.2 2.5
±0.2 1.6
±0.2 2.0
±0.2 2.5
±0.2
C
A
P
A
C
I
T
A
N
C
E
R
A
N
G
E
(
p
F
)
SL 100V 0.5~
680 0.5~
560 620~
910 1000 0.5~
1500 1600~
3300 3600~
3900 - - - - - - - - - - - - -
C, TC
(Except
SL,UJ)
100V 0.5~
390 0.5~
390 470~
820 1000 0.5~
2200 2700~
3300 3900~
6800 4700~
6800 8200~
10000 12000 15000
~
18000 - - 10000
~
15000 18000 22000 27000~
33000 - - -
200V - - 33~
470 560~
1000 220~
680 820~
1200 1500~
2700 3300 3900 4700 5600~
8200 - - - - - 10000~
18000 - - -
250V - - - 680 - - 2200 - - - 6800 - - - - - 12000 - - 22000
500V - - - - - 10~
560 680~
1000 470~
1000 1200~
1500 - - - - 470~
1500 1800~
2200 2700 3300~
5600 -6800 8200~
10000
630V - - - - - - 820 - - - 2200 - - - - - 4700 - - 10000
1kV - - - - - 10~
150 180~
270 -470~
560 680 820 - - 470~
680 820~
1000 1200 1500~
1800 - - 2200~
3600
2kV - - - - - - 10~47 47~
180 220 270~
330 470 10~
150 180~
220 47~
120 150~
180 220 270~
390 - - -
3kV - - - - - - - - - - - 10~
100 - - 100~
180 220 270~
390 - - 470~
820
C
A
P
A
C
I
T
A
N
C
E
R
A
N
G
E
(
n
F
)
(X7R)
100V 0.47~
10 0.22~
10 15 22~
68 1~
47 68~
100 150 2.2~
150 220 - - - - 100~
330 470 - - 680~
1000 1500 -
200V - - 0.22~1
0-0.47~
22 33~
47 68~
100 - - - - - - 47~
100 - - - - - -
250V - - 1~
3.3 4.7~1
5-22 33~
47 - - 68 100 - - - - - 150~
220 - - 330~
470
500V - - - - - 0.47~
15 22~
33 10~
33 470 - - - - 10~
47 68 100 -150 220 -
630V - - - - - - - - - - - - - - - - - - - -
1kV - - - - - 0.47~
3.3 -3.3~
6.8 - - - - - 1.5~
10 15~
22 -33 -47 68
2kV - - - - - - 0.47~
10.47~
1- - - 1 - 1~
3.3 - - - 3.3~
10 - -
Multilayer Ceramic Capacitor - High Voltage
- 12 -
■PACKAGING
●CARDBOARD PAPER TAPE
Symbol W F E P1 P2 P0 D t A B
Type
D
e
m
e
n
s
i
o
n
10
8.0
±0.3 3.5
±0.05 1.75
±0.1 4.0
±0.1 2.0
±0.05 4.0
±0.1 φ1.5
+0.1/-0 1.1
Max
1.1
±0.2 1.9
±0.2
21 1.6
±0.2 2.4
±0.2
31 2.0
±0.2 3.6
±0.2
unit:mm
●EMBOSSED PLASTIC TAPE
Symbol W F E P1 P2 P0 Dt0 t1 A B
Type
D
i
m
e
n
s
i
o
n
21
8.0
±0.3 3.5
±0.05 1.75
±0.1
4.0
±0.1 2.0
±0.05 4.0
±0.1 Φ1.5
+0.1/-0 0.6
Max
2.5
max
1.45
±0.2 2.3
±0.2
31 2.0
±0.2 3.6
±0.2
32 2.9
±0.2 3.6
±0.2
43
(42) 12
±0.3 5.6
±0.05 8.0
±0.1 3.8
max 2.5(3.6)
±0.2 4.9
±0.2
unit:mm
A
B
Feeding round holes Perforated square
holes for inserting a chip D
P0 P1P2
W
F
E
t1
t0
A
B
Feeding round holes Perforated square
holes for inserting a chip D
P0 P1P2
W
F
E
t
Multilayer Ceramic Capacitor - High Voltage
- 13 -
●TAPING SIZE
Empty Section
45 Pitch Packed Part Empty Section
50 Pitch
Loading Section
35 Pitch
STARTEND
●REEL DIMENSION
EC
D
R
A
W
B
t
Symbol A B C D E W t R
7" Reel φ178±2.0 min.φ50 φ13±0.5 21±0.8 2.0±0.5 10±1.5 0.8±0.2 1.0
13" Reel φ330±2.0 min.φ70
unit:mm
Symbol Cardboard Paper Tape Embossed Plastic Tape
7" Reel 4000 2000
13" Reel 15000 -
unit:pcs
Multilayer Ceramic Capacitor - High Voltage
- 14 -
Size 05(0402) 10(0603) 21(0805)
T≤0.85mm T≥1.0mm
Quantity 80,000 10,000~15,000 10,000 5,000
●BULK CASE PACKAGING
- Bulk case packaging can reduce the stock space and transportation costs.
- The bulk feeding system can increase the productivity.
- It can eliminate the components loss.
ABT
CDE
FW
L
G
H
I
Symbol A B T C D E
Dimension 6.8±0.1 8.8±0.1 12±0.1 1.5+0.1/-0 2+0/-0.1 4.7±0.1
Symbol F W G H L I
Dimension 31.5+0.2/-0 36+0/-0.2 19±0.35 7±0.35 110±0.7 5±0.35
●QUANTITY
Multilayer Ceramic Capacitor - High Voltage
- 15 -
■CHARACTERISTIC MAP
●CLASS Ⅰ
Temperature
Characteristics Size Voltage Capacitance Range (㎊)
C0G
10
(0603) 100V
21
(0805)
100V
200V
250V
31
(1206)
100V
200V
250V
500V
630V
1000V
2000V
32
(1210)
100V
200V
250V
500V
630V
1000V
2000V
42
(1808) 2000V
3000V
43
(1812)
100V
200V
250V
500V
630V
1000V
2000V
3000V
55
(2220)
250V
500V
630V
1000V
3000V
10 100 1000 10000 100000 1000000 10000000 100000000
0.5
390
1000
6800
2700
270
47
18000
4700
1000
10
10
8200
1500
820470
22010
33000
10000
390
390
470 1800
47
100
18000
220
10
3300
470
47 470
10010
10000
470 5600
10000
6800
3600
2200
820470
2200
820
6800
2200
12000
22000
10000
4700
1000
680
33
Multilayer Ceramic Capacitor - High Voltage
- 16 -
●CLASS Ⅱ,B(X7R)
Temperature
Characteristics Size Voltage Capacitance Range (㎊)
B(X7R)
10
(0603) 100V
21
(0805)
100V
200V
250V
31
(1206)
100V
200V
250V
500V
1000V
2000V
32
(1210)
100V
250V
500V
1000V
2000V
42(1808) 2000V
43
(1812)
100V
200V
250V
500V
1000V
2000V
55
(2220)
100V
250V
500V
1000V
2000V
10 100 1000 10000 100000 1000000 10000000 100000000
10000
68000220
10000
220
1000 15000
470
150000
1000
100000470
47000
22000
33000
470
3300
1000
470
470
2200002200
68000 100000
10000 470000
1000
3300 6800
1000
470
47000 100000
150000 220000
1500 33000
10000 100000
100000
470000
1500000
680000
330000
220000150000
6800047000
100003300
330000
1000 3300
Multilayer Ceramic Capacitor - High Voltage
- 17 -
■RELIABILITY TEST DATA
NO ITEM PERFORMANCE TEST CONDITION
1APPEARANCE NO ABNORMAL EXTERIOR
APPEARANCE THROUGH MICROSCOPE(×10)
2INSULATION
RESISTANCE
10,000㏁OR 500㏁·㎌ PRODUCT
WHICHEVER IS SMALLER
(RATED VOLTAGE IS BELOW 16V
: 10,000㏁OR 100㏁·㎌)
RATED VOLTAGE SHALL BE APPLIED.
MEASUREMENT TIME IS 60 ~ 120sec
RATED VOLTAGE TIME 60 SEC.
3WITHSTANDING
VOLTAGE
NO DIELECTRIC BREAKDOWN OR
MECHANICAL BREAKDOWN VOLTAGE APPLIED in 1~5 sec
CURRENT APPLIED : 50mA BELOW
4CAPACITANCE
CLASS
Ⅰ
WITHIN THE SPECIFIED
TOLERANCE
CAPACITANCE FREQUENCY VOLTAGE
1,000㎊AND BELOW 1㎒±10% 0.5 ~ 5 Vrms
MORE THAN 1,000㎊1㎑±10% 1.0±0.2Vrms
CLASS
Ⅱ
WITHIN THE SPECIFIED
TOLERANCE
FREQUENCY VOLTAGE
1㎑±10% 1.0±0.2Vrms
5QCLASS
Ⅰ
OVER 30㎊:Q≥1,000
LESS THAN 30㎊:Q≥400 +20C
( C : CAPACITANCE )
CAPACITANCE FREQUENCY VOLTAGE
1,000㎊AND BELOW 1㎒±10% 0.5 ~ 5 Vrms
MORE THAN 1,000㎊1㎑±10%
6Tanδ
(DF)
CLASS
Ⅱ
B : 2.5% Max (0.025 Max)
C : 0.1% MAx (0.001Max)
FREQUENCY VOLTAGE
1kHz±10% 1.0±0.2Vrms
7
TEMPERATURE
COEFFICIENT
CHARACTERISTICS
CTEMP.
COEFFICIENT 0±30(ppm/℃)
THE TEMPERATURE COEFFICIENT IS CALCULATED
IN ppm/℃FOR GIVEN TEMPERATURE(T1=25℃
,T1=85℃)
TEST STEP
* MEASURE THE CAPACITANCE IN EACH STEP
AT THERMAL EQUILIBRIUM
BCAPACITANCE
CHANGE ±15%
8ADHESIVE STRENGTH
OF TERMINATION
NO INDICATION OF PEELING
OCCUR ON THE TERMINAL
ELECTRODE.
A 500g.f PRESSURE SHALL BE
APPLIED FOR 10±1 SECONDS.
500g.f
Rated voltage Applied voltage
Vr<500Vdc 200% of Vr
500Vdc≤Vr<1000Vdc 150% of Vr
1000Vdc≤Vr 120% of Vr
Step TEMPERATURE(℃)
125±2
2MIN. OPERATING TEMP.±2
325±2
4MAX. OPERATING TEMP.±2
525±2
Multilayer Ceramic Capacitor - High Voltage
- 18 -
NO ITEM PERFORMANCE TEST CONDITION
9BENDING
STRENGTH
APPEARANCE NO MECHANICAL DAMAGE SHALL
OCCUR. BENDING SHALL BE APPLIED TO
THE LIMIT(1mm) WITH 0.3mm/SEC.
20
BENDING
45±145
±1LIMIT
CAPACITANCE
CHARACTER CHANGE OF
CAPACITANCE
C(C0G)
WITHIN ±5% OR
±0.5 pF
WHICHEVER IS
LARGER
B(X7R) WITHIN ±12.5%
10 SOLDERABILITY
MORE THAN 75% OF THE TERMINAL
SURFACE IS TO BE SOLDERED
NEWLY. THERE MAY BE PINHOLES,
SPOTS. BUT THESE MUST NOT BE AT
ONE POINT
IN PB--FREE PART, MORE THAN 95%
OF THE TERMINAL SURFACE IS TO
BE SOLDERED NEWLY
SOLDER TEMPERATURE : 230±5℃
IMMERSED DEPTH : 10 ~15 mm
SOLDER : H63A
FLUX : ROSIN
*PB-FREE
SOLDER TEMPERATURE : 260±5℃
SOLDER : Sn96.5-3Ag-0.5Cu
Flux : RMA TYPE
DIPTIME:3
±0.1Sec
PRE-HEATING : AT 80~120℃
FOR 10~30SEC.
○○
50 R=340
11
RESISTANCE
TO
SOLDERING
HEAT
APPEARANCE NO MECHANICAL DAMAGE
SHALL OCCUR
DIP : SOLDER TEMPERATURE OF
270±5℃
DIPTIME:10
±1 SEC.
EACH TERMINATION SHALL BE FULLY
IMMERSED AND PREHEATED
AS FOLLOWING:
MEASURE AT ROOM TEMP. AFTER
COOLING FOR
CLASSⅠ:24±2 HOURS
CLASSⅡ:48±4 HOURS
CAPACITANCE
CHARACTERISTIC CAP. CHANGE
CLASSⅠ
WITHIN ±2.5% OR
±0.25㎊
WHICHEVER IS
LARGER
CLASSⅡBWITHIN ±7.5%
FWITHIN ±20%
Q
CLASS Ⅰ
30㎊AND OVER : Q≥1000
LESS THAN 30㎊:Q
≥400+20×C
Tanδ
CLASS Ⅱ
TO SATISFY THE SPECIFIED
INITIAL VALUE
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
WITHSTANDING
VOLTAGE
TO SATISFY THE SPECIFIED
INITIAL VALUE
STEP TEMP.(℃)TIME
(SEC.)
180~100 60
2150~180 60
Multilayer Ceramic Capacitor - High Voltage
- 19 -
NO ITEM PERFORMANCE TEST CONDITION
12 VIBRATION
TEST
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR. THE CAPACITOR SHALL BE
SUBJECTED TO A HARMONIC
MOTION HAVING A TOTAL
AMPLITUDE OF 1.5mm.
THE ENTIRE FREQUENCY RANGE,
FROM 10 TO 55Hz AND RETURN
TO 10Hz, SHALL BE TRAVERSED
IN 1 MINUTE.
THIS CYCLE SHALL BE PERFORMED
2 HOURS IN EACH THERE
MUTUALLY PERPENDICULAR
DIRECTION,
FOR TOTAL PERIOD OF 6 HOURS.
CAPACITANCE
CHARACTERISTIC CAP. CHANGE
CLASS Ⅰ
WITHIN ±2.5% OR ±
0.25㎊WHICHEVER
IS LARGER
CLASS ⅡWITHIN ±5%
Q
CLASS Ⅰ
30㎊AND OVER : Q≥1000
LESS THAN 30㎊:Q
≥400+20×C
Tanδ
CLASS Ⅱ
TO SATISFY THE SPECIFIED
INITIAL VALUE
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
13
HUMIDITY
(STEADY
STATE)
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR
TEMPERATURE : 40±2℃
RELATIVE HUMIDITY : 90~95 %RH
TEST TIME : 500 +12/-0 Hr.
MEASURE AT ROOM TEMPERATURE
AFTER COOLING FOR
CLASSⅠ:24
±2Hr.
CLASSⅡ:48
±4Hr.
CAPACITANCE
CHARACTERISTIC CAPACITANCE
CHANGE
CLASS Ⅰ
WITHIN ±5% OR
±0.5㎊WHICHEVER
IS LARGER
CLASS ⅡWITHIN ±12.5%
Q
CLASSⅠ
30㎊AND OVER : Q≥350
10 ~30㎊:Q
≥275 + 2.5×C
LESS THAN 10pF : Q≥200 + 10×C
Tanδ
CLASS Ⅱ
B : 5% MAX ( 0.05 MAX)
C : 0.1 MAX (0.001 MAX)
INSULATION
RESISTANCE
MINIMUM INSULATION RESISTANCE:
1,000 ㏁OR 50㏁·㎌ PRODUCT
WHICHEVER IS SMALLER
* THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED
AFTER THE HEAT TREATMENT OF 150 +0/-10℃, 1Hr AND SITTING OF 48±4hr AT ROOM TEMPERATURE &
ROOM HUMIDITY.
Multilayer Ceramic Capacitor - High Voltage
- 20 -
NO ITEM PERFORMANCE TEST CONDITION
14 MOISTURE
RESISTANCE
APPEARANCE NO MECHANICAL DAMAGE SHALL
OCCUR
1KV TO 3KV PRODUCTS ARE NOT
APPLIED TO THIS TEST WITHOUT
COATING THE TESTED SAMPLES
WITH EPOXY FOR INSULATION
APPLIED VOLTAGE :
RATED VOLTAGE
TEMPERATURE : 40±2℃
RELATIVE HUMIDITY:90~95%RH
TEST TIME : 500 +12/-0 Hr.
CURRENT APPLIED : 50㎃MAX.
<INITIAL MEASUREMENT>
CLASS ⅡSHOULD BE MEASURED
INITIAL VALUE AFTER BE
HEAT-TREATED FOR 1 HR IN 150℃
+0/-10℃AND BE LEFT FOR 48±4HR AT
ROOM TEMPERATURE.
<LATTER MEASUREMENT>
CLASSⅠSHOULD BE MEASURED AFTER
LEFT FOR 24±2 HRS IN ROOM
TEMPERATURE AND HUMIDITY.
CLASS ⅡSHOULD BE MEASURED
LATTERVALUEAFTERBE
HEAT-TREATED FOR 1 HR IN 150℃
+0/-10℃AND BE LEFT FOR 48±4HR AT
ROOM TEMPERATURE.
CAPACITANCE
CHARACTERIST
IC
CAPACITANCE
CHANGE
CLASS Ⅰ
WITHIN ±7.5% OR
±0.75㎊WHICHEVER
IS LARGER
CLASS ⅡWITHIN ±12.5%
Q
CLASSⅠ
30㎊AND OVER : Q≥200
30㎊AND BELOW : Q≥100 + 10/3×C
Tanδ
CLASSⅡ
B : 5% MAX ( 0.05 MAX)
C : 0.1 MAX (0.001 MAX)
INSULATION
RESISTANCE
MINIMUM INSULATION RESISTANCE:
500 ㏁OR 25㏁·㎌ PRODUCT,
WHICHEVER IS SMALLER.
15
HIGH
TEMPERATURE
RESISTANCE
APPEARANCE NO MECHANICAL DAMAGE SHALL
OCCUR
APPLIED VOLTAGE :
for Vr<500Vdc,200% OF Vr
for 500Vdc≤Vr<1000Vdc,120% OF Vr
for 1000Vdc≤Vr, Vr
TEST TIME : 1000 +48/-0 Hr.
CURRENT APPLIED : 50㎃MAX.
TEMP: MAX OPERATING TEMP±2℃
<INITIAL MEASUREMENT>
CLASS ⅡSHOULD BE MEASURED
INITIAL VALUE AFTER BE
HEAT-TREATED FOR 1 HR IN 150℃
+0/-10℃AND BE LEFT FOR 48±4HR
AT ROOM TEMPERATURE.
<LATTER MEASUREMENT>
CLASSⅠSHOULD BE MEASURED
AFTER LEFT FOR 24±2 HRS IN ROOM
TEMPERATURE AND HUMIDITY.
CLASS ⅡSHOULD BE MEASURED
LATTER VALUE AFTER BE
HEAT-TREATED FOR 1 HR IN 150℃
+0/-10℃AND BE LEFT FOR 48±4HR
AT ROOM TEMPERATURE.
CAPACITANCE
CHARACTERIST
IC CAP. CHANGE
CLASS Ⅰ
WITHIN ±3% OR
±0.3㎊, WHICHEVER IS
LARGER
CLASS ⅡWITHIN ±12.5%
Q
CLASSⅠ
30㎊AND OVER : Q ≥350
10 ~ 30 ㎊:Q≥275 + 2.5×C
LESS THAN 10㎊:Q ≥200 + 10×C
Tanδ
CLASSⅡ
B : 5% MAX (0.05 MAX)
C : 0.1% MAX (0.001 MAX)
INSULATION
RESISTANCE
MINIMUM INSULATION RESISTANCE:
1,000 ㏁OR 50㏁·㎌ PRODUCT
WHICHEVER IS SMALLER
Multilayer Ceramic Capacitor - High Voltage
- 21 -
NO ITEM PERFORMANCE TEST CONDITION
16 TEMPERATURE
CYCLE
APPEARANCE NO MECHANICAL DAMAGE SHALL
OCCUR
CAPACITORS SHALL BE SUBJECTED
TO FIVE CYCLES OF THE
TEMPERATURE CYCLE AS
FOLLOWING
STEP TEMP.(℃)TIME
(MIN)
1
MIN.
RATED TEMP.
+0/-3
30
225 2~3
3
MAX.
RATED TEMP.
+3/-0
30
425 2~3
MEASURE AT ROOM TEMPERATURE
AFTER COOLING FOR
CLASSⅠ:24
±2Hr.
CLASSⅡ:48
±4Hr.
CAPACITANCE
CHARACTERISTIC CAP. CHANGE
CLASS Ⅰ
WITHIN ±2.5%
OR ±0.25㎊
WHICHEVER IS
LARGER
CLASS ⅡWITHIN ±7.5%
Q
CLASSⅠ
30 ㎊AND OVER : Q ≥1000
LESS THAN 30㎊:Q ≥400 +20×C
Tanδ
CLASSⅡ
TO SATISFY THE SPECIFIED
INITIAL VALUE
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
Multilayer Ceramic Capacitor - High Voltage
- 22 -
■CHARACTERISTIC GRAPH
0 50 100 1000 10000
0
10
-10
-20
-30
Time(Hr)
ΔC
%
C0G
X7R
Y5V
▶CAPACITANCE CHANGE - AGING
-60 1400-20 20 60 100
Temperature(℃)
ΔC
%0
5
-5
-10
10
C0G
UJ
TH
RH
SH
▶IMPEDANCE - FREQUENCY CHARACTERISTICS
▶CAPACITANCE - DC VOLTAGE CHARACTERISTICS
C0G
0.01
0.1
1
10
100
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10
Ohm
1MHz 10MHz 100MHz 1GHz 10GHz
1000pF
100pF
10pF
X7R/Y5V
0.01
0.1
1
10
100
1.E+06 1.E+07 1.E+08 1.E+09
Ohm
0.1㎌
0.01㎌
0.001㎌
1MHz 10MHz 100MHz 1GHz
-100
-80
-60
-40
-20
0
20
40
0 5 10 15 20 25 30 35 40
DC V oltage(V dc)
C0G 50V
ΔC
%
X7R
50V
Y5V
50V
-60 1200-20 20 40 80
-80
-60
-40
-20
0
20 X7R
Y5V
Temperature(℃)
ΔC
%
▶CAPACITANCE - TEMPERATURE CHARACTERISTICS
●ELECTRICAL CHARACTERISTICS
Multilayer Ceramic Capacitor - High Voltage
- 23 -
■APPLICATION MANUAL
●Storage Condition
▶Storage Environment
The electrical characteristics of MLCCs were degraded by the environment of high temperature
or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative
humidity of less than 40℃and 70%, respectively. Guaranteed storage period is within 6 months
from the outgoing date of delivery.
▶Corrosive Gases
Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.
▶Temperature Fluctuations
Since dew condensation may occur by the differences in temperature when the MLCCs are
taken out of storage, it is important to maintain the temperature-controlled environment.
●Design of Land Pattern
When designing printed circuit boards, the shape and size of the lands must allow for the
proper amount of solder on the capacitor. The amount of solder at the end terminations has a
direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which
was due to too much amount of solder. In contrast, if too little solder is applied, the termination
strength will be insufficiently. Use the following illustrations as guidelines for proper land design.
Recommendation of Land Shape and Size
W b
a
Solder
Land
Solder Resist
2/3W < b < W
TSolder Resist
2/3T < a < T
●Adhesives
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
▶Requirements for Adhesives
They must have enough adhesion, so that, the chips will not fall off or move during the
handling of the circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly.
They should not corrode the circuit board or chip material.
Multilayer Ceramic Capacitor - High Voltage
- 24 -
They should be a good insulator.
They should be non-toxic, and not produce harmful gases, nor be harmful when touched.
▶Application Method
It is important to use the proper amount of adhesive. Too little and much adhesive will cause
poor adhesion and overflow into the land, respectively.
▶Adhesive hardening Characteristics
To prevent oxidation of the terminations, the adhesive must harden at 160℃or less, within
2 minutes or less.
●Mounting
▶Mounting Head Pressure
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum
during mounting.
▶Bending Stress
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side
of the board. When the MLCCs are mounted onto the other side, it is important to support the
board as shown in the illustration. If the circuit board is not supported, the crack occur to the
ready-installed MLCCs by the bending stress.
support pin
force
nozzle
●Flux
Although the solderability increased by the highly-activated flux, increase of activity in flux may
also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended
that a mildly activated rosin flux(less than 0.2% chlorine) be used.
Multilayer Ceramic Capacitor - High Voltage
- 25 -
●Soldering
Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during
soldering, it is exposed to potentially mechanical stress caused by the sudden temperature
change. The capacitor may also be subject to silver migration, and to contamination by the
flux. Because of these factors, soldering technique is critical.
▶Soldering Methods
Method Classification
Reflow
soldering
- Overall heating - Infrared rays
- Hot plate
- VPS(vapor phase)
- Local heating - Air heater
-Laser
- Light beam
Flow
soldering - Single wave
- Double wave -
* We recommend the reflow soldering method.
▶Soldering Profile
To avoid crack problem by sudden temperature change, follow the temperature profile in the
adjacent graph.
300
250
200
150
100
50
℃preheating soldering cooling
60~120sec 10~20sec
Reflow Soldering
300
250
200
150
100
50
℃preheating soldering cooling
△T≤150℃
60~120sec 3~4sec
Flow Soldering
▶Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot
soldering iron tip comes into direct contact with the end terminations, and operator's carelessness
may cause the tip of the soldering iron to come into direct contact with the ceramic body of
the capacitor. Therefore the soldering iron must be handled carefully, and close attention must
be paid to the selection of the soldering iron tip and to temperature control of the tip.
Multilayer Ceramic Capacitor - High Voltage
- 26 -
▶Amount of Solder
Too much
Solder
Not enough
Solder
Cracks tend to occur due
to large stress
Weak holding force may
cause bad connections or
detaching of the capacitor
Good
▶Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning,
the temperature difference(△T) must be less than 100℃
6-6. Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used,
chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip
capacitors. This means that the cleaning fluid must be carefully selected, and should always
be new.
▶Notes for Separating Multiple, Shared PC Boards.
A multi-PC board is separated into many individual circuit boards after soldering has been
completed. If the board is bent or distorted at the time of separation, cracks may occur in the
chip capacitors. Carefully choose a separation method that minimizes the bending of the
circuit board.
Multilayer Ceramic Capacitor - High Voltage
- 27 -
■CROSS REFERENCE
P/N COMPANY SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHM TAIYO
- YUDEN TDK VITRAMON
①COMPANY MODEL(MLCC) CL - - C CM GRM -ECJ MCH MK CVJ
②SIZE
(EIA/JIS)
0201(0603) 03 - - - 03 33 - Z - 063 0603 -
0402(1005) 05 0402 R07 0402 05 36 0402 015 105 1005 0402
0603(1608) 10 0603 R14 0603 105 39 0603 118 107 1608 0603
0805(2012) 21 0805 R15 0805 21 40 0805 221 212 2012 0805
1206(3216) 31 1206 R18 1206 316 42-6 1206 331 316 3216 1206
1210(3225) 32 1210 S41 1210 32 42-2 1210 432 325 3225 1210
1808(4520) 42 1808 R29 1808 42 -1808 - - - 4520 1808
1812(4532) 43 1812 S43 1812 43 43-2 1812 -43 432 4532 1812
2220(5750) 55 - - 2220 55 44-1 2221 - - 550 5650 -
③
TEMPERATURE
CHARACTERISTIC
COG(NPO) C A N G CG COG/CH N C A C COG/CH A
P2H(N150) P S - - P P2H - P - P PH -
R2H(N220) R 1 - - R R2H - R - R RH -
S2H(N330) S 3 - - S S2H - S - S SH -
T2H(N470) T O - - T T2H - T - T TH -
U2J(N750) U Z - - U U2J - U UJ UUJ -
S2L L Y - - SL SL - G SL SL SL -
X7R B C W R(X) X7R X7R B B C BJ X7R(B) Y(X)
Z5U E E Z U - Z5U Z - E - Z5U U
Y5V F G Y V Y5V Y5V Y F F F Y5V -
④NOMINAL CAPACITANCE EX) 103=10,000㎊221=220㎊225=2,200,000㎊=2.2㎌1R5=1.5㎊010=1㎊
⑤CAPACITANCE TOLERANCE B:±0.1㎊C:±0.25㎊D:±0.5㎊F:±1% G:±2% J:±5% K:±10% M:±20% Z:-20~+80%
⑥RATED
VOLTAGE
6.3V Q 6 - 9 06 6.3 -0J - J 0J -
10 V P Z 100 810 10 -1A 4 L 1A -
16 V O Y 160 416 16 160 1C 3 E 1C J
25 V A 3 250 325 25 250 1E 2 T 1E X
50 V B 5 500 550 50 500 1H 5 U 1H A
100 V C 1 101 1100 100 101 2A 1 - 2A B
200V D 2 201 2200 200 201 2D - - - C
250V E V - - 250 250 251 - - - 2E -
500V G 7 501 -500 500 501 - - - - E
630V H - - - 630 630 - - - - 2J -
1000V I A 102 -1000 1K 102 - - - 3A G
2000V J G 202 -2000 2K 202 - - - 3D -
3000V K H 302 -3000 3K 302 - - - 3F H
4000V - J - 4000 -402 - - - - -
⑦TERMINATION NICKEL BARRIER N T V C A (GRM) N - (MCH) - - X
Ag/Pd P 1 - - B (GR) P - (MC) - - F
⑧PACKAGE
BULK(VINYL) B 9 (NONE) - B PB * X - B B B
PAPER TAPING C2, 4 T, R -T, L PT TE,V,W K, L T T C, P
PLASTIC TAPING E1, 3 E, U -H, N PT -F, Y P, Q T - T, R
BULK CASE P 7 - - C PC - C C - - G
Multilayer Ceramic Capacitor - High Voltage
- 28 -
▶SAMSUNG : CL10B104KA8NNNC
CL 10 B 104 K A 8 N N N C
▶AVX : 06033C104KAT2A
0603 3 C 104 K A T 2 A
▶JOHANSON : 250R14W104KV6T
250 R14 W 104 K V 6 T
▶KEMET : C0603C104K3RAC
C0603C 104K 3R A C
Series Size
03 = 0201
05 = 0402
10 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812
55 = 2220
Dielectric
C=C0G
P=P2H
R=R2H
S=S2H
T=T2H
U=U2H
L=S2L
B=X7R
A=X5R
F=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
A=±0.05pF
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
Voltage
Q = 6.3V
P=10V
O=16V
A=25V
B=50V
C = 100V
D = 200V
E=250V
G = 500V
H = 630V
I = 1000V
Thickness
3 = 0.30
5 = 0.50
8 = 0.80
A=0.65
C = 0.85
H = 1.60
I=2.00
J = 2.50
L = 3.20
Electrode/
Termination/
Plating
A=Pd/Ag/
Sn 100%
N=Ni/Cu/
Sn 100%
G=Cu/Cu/
Sn 100%
Products
A=Array
(2-element)
B=Array
(4-element)
C=High-Q
L=LICC
N = Normal
P=Automotive
W = 3 terminal
chip
Special
Various
Packaging
B=Bulk
P = Cassette
C=Paper7"
D=Paper13"
(10,000EA)
E = Embossing 7"
F = Embossing 13"
L = Paper 13"
(15,000EA)
O=Paper10"
S = Embossing 10"
Size
0201
0402
0603
0805
1206
1210
1812
2220
2225
Voltage
4=4V
6 = 6.3V
Z=10V
Y = 16V
3=25V
B=50V
C = 100V
D = 200V
E = 250V
G = 500V
I = 1000V
Dielectric
A=C0G
C=X7R
D=X5R
E=Z5U
G=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal
point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
P = GMV,+100,-0%
Failure Rate
A=N/A
Termination
T = Sn 100%
7=GoldPlated
1=Pd/Ag
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Cassette
9=Bulk
Special
A = Standard
T = 0.66mm
S = 0.56mm
R = 0.46mm
Voltage
2
significant
figures
+
number
of zeros
Size
R07 = 0402
R14 = 0603
R15 = 0805
R18 = 1206
S41 = 1210
S43 = 1812
S47 = 2220
S48 = 2225
S49 = 1825
S54 = 3640
Dielectric
N=C0G
W=X7R
X=X5R
Z=Z5U
Y=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Termination
V = Ni Barrier
Marking
4=NoMark
6 = Marking
Packaging
E = 7" Reel Plastic
T = 7" Reel Paper
R = 13" Reel Paper
U = 13" Reel Plastic
None = Bulk
Series Size
0402
0603
0805
1206
1210
1812
2220
2225
Specification
C = Standard
A=GR900
P = Mil-C-55681
CDR01-CDR06
N = Mil-C-55681
CDR31-CDR35
Z = Mil-C-123
E=MilEquivalent
(Group A Only)
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z=+80,-20%
P = +100, 0%
Voltage
9=6.3V
8=10V
4=16V
3=25V
5=50V
1=100V
2=200V
Dielectric
G=C0G
R=X7R
P=X5R
U=Z5U
X = BX(Mil)
V=Y5V
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
P = GMV,+100,-0%
Failure Rate
A=Standard
M=1.0(Mil)
P = 0.1 (Mil)
R=0.01(Mil)
S=0.001(Mil)
Termination
C=Niw/TinPlate
H = Ni w/Solder
T=Silver
G=GoldPlated
Multilayer Ceramic Capacitor - High Voltage
- 29 -
▶KYOCERA : CM105X7R104K25AT
CM 105 X7R 104 K 25 A T
▶MURATA : GRM188R71E104KA01D
GRM 18 8 R7 1E 104 K A01 D
▶NOVACAP : 0603B104K250N_TM
1206 B 104 K 250 N - T M
▶PANASONIC : ECJ1EB1E104K
ECJ 1 E B 1E 104 K
Series Size
03 = 0201
05 = 0402
105 = 0603
21 = 0805
316 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220
Dielectric
CG
X8R
X7R
X5R
Z5U
Y5V
Y5U
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
P=+100,0%
Voltage
04 = 4V
06 = 6.3V
10 = 10V
16 = 16V
25 = 25V
50 = 50V
100 = 100V
250 = 250V
500 = 500V
1000 = 1000V
Termination
A = Ni Barrier
Packaging
T = 7" Reel (4mm Pitch)
L = 13" Reel (4mm Pitch)
H = 7" Reel (2mm Pitch)
N = 13" Reel (2mm Pitch)
B=Bulk(VinylBags)
C = Bulk Cassette
Series
Ni Barrier
Size
03 = 0201
15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220
Thickness
3=0.3mm
5=0.5mm
8=0.8mm
A=1.0mm
B = 1.25mm
C = 1.6mm
D = 2.0mm
E=2.5mm
F = 3.2mm
Dielectric
5C = C0G
R7 = X7R
R6 = X5R
E4 = Z5U
F5 = Y5V
Voltage
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2E = 250V
2H = 500V
3A = 1000V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal
point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
P=+100,0%
Individual
Specification
Code
Packaging
D = 7" Reel Paper
L = 7" Reel Plastic
J = 13" Reel Paper
K = 13" Reel Plastic
B=Bulk
C = Bulk Cassette
T=BulkTray
Size
0402
0603
0805
1005
1206
1210
1808
1812
2220
Dielectric
N=C0G
B=X7R
X=BX
Z=Z5U
Y=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
P = +100,
0%
Voltage
2
significant
figures
+
number
of zeros
Termination
P=Pd/Ag
N=NiBarrier
(Sn 100%)
Y = Ni Barrier
(Sn/Pb)
Thickness
Per Specified
Packaging
T = Reel
None = Bulk
W=WafflePack
Marking
Series Size
Z = 0201
0 = 0402
1 = 0603
2 = 0805
3 = 1206
4 = 1210
Packaging
X=Bulk
E = Paper 2mm
V = Paper 4mm
F, Y = Plastic 4mm
W = Large Reels 2mm
Z = Large Reels 4mm
C = Bulk Cassette
Dielectric
C=C0G
B = X7R, X5R
F=Y5V
Voltage
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2D = 200V
Tolerance
C=±0.25pF
D=±0.5pF
F=±1%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Multilayer Ceramic Capacitor - High Voltage
- 30 -
▶ROHM : MCH182C104KKN
MCH 18 2 C 104 K K N
▶TAIYO-YUDEN : TMK107BJ104K_T
TM K 107BJ104 K -T
▶TDK : C1608X7R1E104KT
C 1608 X7R 1E 104 K T
▶VITRAMON : VJ0603Y104KXXMC
VJ 0603 Y 104 K X X M C
Series Size
15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812
Voltag
e
4 = 10V
3 = 16V
2 = 25V
5 = 50V
Dielectric
A=C0G
C=X7R
F=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
P = +100, 0%
Packaging
K = 7" Reel Paper
P=7"ReelPlastic
L = 13" Reel Paper
Q = 13" Reel Plastic
B=Bulk
C = Bulk Cassette
Marking/Thickness
N=Marked
Special Thickness
Voltage
A=4V
J = 6.3V
L=10V
E=16V
T=25V
U = 50V
Type
M = Multilayer
V=HiQ
Termination
K = Ni Barrier
Size
105 = 0402
107 = 0603
212 = 0805
316 = 1206
325 = 1210
432 = 1812
550 = 2220
Dielectric
CG = C0G
CH = C0H
CJ = C0J
CK = C0K
BJ = X5R,
X7R
F=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
Special
Various
Packaging
T = Reel
B=Bulk
Series Size
0603 = 0201
1005 = 0402
1608 = 0603
2012 = 0805
3216 = 1206
3225 = 1210
4532 = 1812
5650 = 2220
Dielectric
CG
X7R
Z5U
Y5V
Voltage
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
Packaging
T=Reel
B=Bulk
Series Size
0402
0603
0805
1206
1210
1812
2225
Dielectric
X=BX
A,N = C0G
Y=X7R
U=Z5U
H=X8R
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
P=+100,0%
Termination
X=Silver,
Ni Barrier
Tin Plated
Voltage
J=16V
X=25V
A=50V
B=100V
C = 200V
Marking
M = Marking
A = No Marking
Packaging
C = 7" Reel Paper
T = 7" Reel Plastic
P = 13" Reel Paper
R = 13" Reel Plastic
B=Bulk
