MGC3030/3130 MGC3030/3130 3D Tracking and Gesture Controller Data Sheet Introduction Key Features Microchip's MGC3X30 are 3D gesture recognition and motion tracking controller chips based on Microchip's patented GestIC(R) technology. They enable usercommand input with natural hand and finger movements. Applying the principles of electrical nearfield sensing, the MGC3X30 contain all the building blocks to develop robust 3D gesture input sensing systems. Implemented as a low-power mixed-signal configurable controller, they provide a large set of smart functional features with integrated signal driver, a frequency adaptive input path for automatic noise suppression and a digital signal processing unit. Microchip's on-chip Colibri Suite obsoletes processing needs at the host, reduces system power consumption resulting in low software development efforts for short time-to-market success. The MGC3XXX family represents a unique solution that provides gesture information of the human hand in real time. Dedicated chip family members add position data, touch or multi touch information to the free space gesture sensing. The MGC3XXX allow the realization of a new generation of user interfaces across various industry markets. * Recognition of 3D Hand Gestures and x, y, z Positional Data (MGC3130) * Proximity and Touch Sensing * Built-in Colibri Gesture Suite (running on chip) * Advanced 3D Signal Processing Unit * Detection Range: 0 to 10 cm * Receiver Sensitivity: <1 fF * Position Rate: 200 positions/sec * Spatial Resolution: up to 150 dpi * Carrier Frequency: 44 kHz to 115 kHz * Channels Supported: - Five receive (Rx) channels - One transmit (Tx) channel * On-chip Auto Calibration * Low Noise Radiation due to Low Transmit Voltage and Slew Rate Control * Noise Susceptibility Reduction: - On-chip analog filtering - On-chip digital filtering - Automatic frequency hopping * Enables the use of Low-Cost Electrode Material including: - Printed circuit board - Conductive paint - Conductive foil - Laser Direct Structuring (LDS) - Touch panel ITO structures * Field Upgrade Capability * Operating Voltage: 3.3V (+/-5%) (single supply) * Temperature Range: -20C to +85C Applications * * * * * * * * Audio Products Notebooks/Keyboards/PC Peripherals Home Automation White Goods Switches/Industrial Switches Medical Products Game Controllers Audio Control Peripheral Features Power Features * Variety of Several Power Operation modes include: - Processing mode: 20 mA @ 3.3V, typical - Programmable Self Wake-up: 110 A @ 3.3V - Deep Sleep: 9 A @ 3.3V, typical 2012-2017 Microchip Technology Inc. * 1x I2CTM Interface for Configuration and Sensor output streaming * Five Gesture Port pins for individual mapping of gesture to EIOs Note: Advance Information This data sheet applies to parts MGC3030 and MGC3130. Throughout this document the term MGC3X30 will be representative for these two parts. DS40001667E-page 1 MGC3030/3130 TABLE 1: MGC3X30 AVAILABLE PACKAGES Part number Available Package Pins Contact/Lead Pitch Dimensions MGC3030 SSOP 28 0.65 7.80x10.50 MGC3130 QFN 28 0.5 5x5 Note: Multi Touch Finger Tracking Wake-up on Approach Deep Sleep Gesture Port Pins Rx Receive Electrodes I2CTM Ports MGC3030 Yes No Yes No Yes Yes 5 5 1 MGC3130 Yes Yes Yes No Yes Yes 5 5 1 Gesture Recognition Raw Data Streaming MGC3X30 FEATURE OVERVIEW Position Tracking TABLE 2: All dimensions are in millimeters (mm) unless specified. DS40001667E-page 2 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 Pin Diagrams FIGURE 1: 28-PIN DIAGRAM (MGC3130) V DD VSS1 NC TXD MCLR EIO7/SI3 EIO6/SI2 28 27 26 25 24 23 22 QFN VCAPS 1 21 EIO5/SI1 VINDS 2 20 EIO4/SI0 VSS2 3 19 EIO3 RX0 4 18 NC RX1 5 17 NC RX2 6 16 NC RX3 7 15 IS2 MGC3130 8 9 10 11 12 13 14 RX4 VCAPA VSS3 VCAPD EIO0/TS EIO1 EIO2 EXP-29 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 3 MGC3030/3130 FIGURE 2: 28-PIN DIAGRAM (MGC3030) VCAPD VSS3 VCAPA RX4 RX3 RX2 RX1 RX0 VSS2 VINDS VCAPS VDD VSS1 TxD SSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 DS40001667E-page 4 10 11 12 EIO7/SI3 Advance Information 13 14 NC 9 MCLR 8 EIO6/SI2 IS2 7 EIO5/SI1 EIO2 6 EIO4/SI0 EIO1 5 EIO3 4 NC 3 NC 2 NC 1 EIO0/TS MGC3030 2012-2017 Microchip Technology Inc. 2012-2017 Microchip Technology Inc. TABLE 3: PIN SUMMARY Pin Number Pin Name Pin Type Buffer Type 18 P -- Reserved: Connect to VDD. 19 P -- Reserved: Do not connect. Ground. 28-QFN 28-SSOP VCAPS 1 VINDS 2 VSS2 3 20 P -- RX0 4 21 I Analog RX1 5 22 I Analog RX2 6 23 I Analog RX3 7 24 I Analog RX4 8 25 I Analog Description Analog input channels: Receive electrode connection. Advance Information VCAPA 9 26 P -- External filter capacitor (4.7 F) connection for internal analog voltage regulator (3V). VSS3 10 27 P -- Common ground reference for analog and digital domain. VCAPD 11 28 P -- External filter capacitor (4.7 F) connection for internal digital voltage regulator (1.8V). EIO0/TS 12 1 I/O ST Extended IO0 (EIO0)/Transfer Status (TS). TS line requires external 10 kpull-up EIO1 13 2 I/O ST Extended IO1 (EIO1)/Interface Selection Pin 1 (IS1). EIO2 14 3 I/O ST Extended IO2 (EIO2)/IRQ0. 15 4 I ST Interface Selection Pin 2 (IS2). NC 16 5 -- -- Reserved: do not connect. NC 17 6 -- -- Reserved: do not connect. NC 18 7 -- -- Reserved: do not connect. EIO3 19 8 I/O ST Extended IO3 (EIO3)/IRQ1. EIO4/SI0 20 9 I/O ST Extended IO4 (EIO4)/Serial Interface 0 (SI0): I2CTM_SDA0. When I2CTM is used, this line requires an external 1.8 kpull-up. EIO5/SI1 21 10 I/O ST Extended IO5 (EIO5)/Serial Interface 1 (SI1): I2CTM_SCL0. When I2CTM is used, this line requires an external 1.8 kpull-up. EIO6/SI2 22 11 I/O ST Extended IO6 (EIO6). EIO7/SI3 23 12 I/O ST Extended IO7 (EIO7). MCLR 24 13 I/P ST Master Clear (Reset) input. This pin is an active-low Reset to the device. It requires external 10 kpull-up. TXD 25 15 O Analog Transmit electrode connection. Legend: P = Power; ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input; -- = N/A MGC3030/3130 DS40001667E-page 5 IS2 PIN SUMMARY Pin Number Pin Name Pin Type Buffer Type 14 -- -- Reserved: do not connect. 27 16 P -- Common ground reference for analog and digital domains. 28 17 P -- Positive supply for peripheral logic and I/O pins. It requires an external filtering capacitor (100 nF). 29 -- P -- Exposed pad. It should be connected to Ground. 28-QFN 28-SSOP NC 26 VSS1 VDD EXP Description Legend: P = Power; ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input; -- = N/A MGC3030/3130 DS40001667E-page 6 TABLE 3: Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 Table of Contents 1.0 Theory of Operation: Electrical Near-Field (E-Field Sensing).................................................................................................... 8 2.0 Feature Description ................................................................................................................................................................. 10 3.0 System Architecture................................................................................................................................................................ 14 4.0 Functional Description ............................................................................................................................................................. 17 5.0 Interface Description ................................................................................................................................................................ 26 6.0 Application Architecture ........................................................................................................................................................... 34 7.0 Development Support .............................................................................................................................................................. 37 8.0 Electrical Specifications ........................................................................................................................................................... 39 9.0 Packaging Information ............................................................................................................................................................. 40 The Microchip Website ........................................................................................................................................................................ 47 Customer Change Notification Service ................................................................................................................................................ 47 Customer Support ................................................................................................................................................................................ 47 Product Identification System ............................................................................................................................................................. 48 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Website; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our website at www.microchip.com to receive the most current information on all of our products. 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 7 MGC3030/3130 1.0 THEORY OF OPERATION: ELECTRICAL NEAR-FIELD (E-FIELD) SENSING FIGURE 1-1: EQUIPOTENTIAL LINES OF AN UNDISTORTED E-FIELD FIGURE 1-2: EQUIPOTENTIAL LINES OF A DISTORTED E-FIELD Microchip's GestIC is a 3D sensor technology which utilizes an electric field (E-field) for advanced proximity sensing. It allows realization of new user interface applications by detection, tracking and classification of a user's hand gestures in free space. E-fields are generated by electrical charges and propagate three-dimensionally around the surface, carrying the electrical charge. Applying direct voltages (DC) to an electrode results in a constant electric field. Applying alternating voltages (AC) makes the charges vary over time and thus, the field. When the charge varies sinusoidal with frequency f, the resulting electromagnetic wave is characterized by wavelength = c/f, where c is the wave propagation velocity -- in vacuum, the speed of light. In cases where the wavelength is much larger than the electrode geometry, the magnetic component is practically zero and no wave propagation takes place. The result is quasi-static electrical near field that can be used for sensing conductive objects such as the human body. Microchip's GestIC technology uses transmit (Tx) frequencies in the range of 100 kHz which reflects a wavelength of about three kilometers. With electrode geometries of typically less than fourteen by fourteen centimeters, this wavelength is much larger in comparison. GestIC systems work w/o wave propagation. In case a person's hand or finger intrudes the electrical field, the field becomes distorted. The field lines are drawn to the hand due to the conductivity of the human body itself and shunted to ground. The threedimensional electric field decreases locally. Microchip's GestIC technology uses a minimum number of four receiver (Rx) electrodes to detect the E-field variations at different positions to measure the origin of the electric field distortion from the varying signals received. The information is used to calculate the position, track movements (MGC3130) and to classify movement patterns (gestures, MGC3X30). Figure 1-1 and Figure 1-2 show the influence of an earth-grounded body to the electric field. The proximity of the body causes a compression of the equipotential lines and shifts the Rx electrode signal levels to a lower potential which is measured. DS40001667E-page 8 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 1.1 GestIC Technology Benefits * GestIC E-field sensors are not impacted by ambient influences such as light or sound, which have a negative impact to the majority of other 3D technologies. * GestIC technology allows gesture/position tracking processing on chip - no host processing needed. Algorithms are included in the Colibri gesture suite which runs on chip and is provided my Microchip. * The GestIC technology has a high immunity to noise, provides high update rates and resolution, low latency and is also not affected by clothing, surface texture or reflectivity. * A carrier frequency in the range of 44-115 kHz is being used with the benefit of being outside the regulated radio frequency range. In the same manner, GestIC is not affected by radio interference. * Usage of thin low-cost materials as electrodes allow low system cost at slim industrial designs. * The further use of existing capacitive sensor structures such as a touch panel's ITO coating allow additional cost savings and ease the integration of the technology. * Electrodes are invisible to the users' eye since they are implemented underneath the housing surface or integrated into a touch panel's ITO structure. * GestIC works centrically over the full sensing space. Thus, it provides full surface coverage without any detection blind spots. * Only one GestIC transmitter electrode is used for E-field generations. The benefit is an overall low power consumption and low radiated EMC noise. * Since GestIC is basically processing raw electrode signals and computes them in real time into pre-processed gestures and x, y, z positional data, it provides a highly flexible user interface technology for any kind of electronic devices. 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 9 MGC3030/3130 2.0 FEATURE DESCRIPTION 2.2.1.2 2.1 Gesture Definition The Colibri Suite's gesture recognition model detects and classifies hand movement patterns performed inside the sensing area. A hand gesture is the movement of the hand to express an idea or meaning. The GestIC(R) technology accurately allows sensing of a user's free space hand motion for contact free position tracking, as well as 3D gesture recognition based on classified movement patterns. 2.2 GestIC Library * Colibri Suite: Digital Signal Processing (DSP) algorithms and feature implementations. * System Control: MGC3X30 hardware control features such as Analog Front End (AFE) access, interface control and parameters storage. * Library Loader: GestIC Library update through the application host's interface. COLIBRI SUITE The Colibri Suite combines data acquisition, digital signal processing and interpretation. The Colibri Suite functional features are illustrated in Figure 2-1 and described in the following sections. FIGURE 2-1: Using advanced stochastic classification based on Hidden Markov Model (HMM), industry best gesture recognition rate is being achieved. The Colibri Suite includes a set of predefined hand gestures which contains flick, circular and symbol gestures as the ones outlined below: * Flick gestures MGC3X30 is being provided with a GestIC Library loader which is stored on the chip's Flash memory. Using this loader, a GestIC Library can be flashed on the MGC3X30 via I2CTM with (e.g., Aurea GUI) (see Section 7.1 "Aurea Software Package") or an embedded host controller. The GestIC Library includes: 2.2.1 Gesture Recognition (MGC3X30) FIGURE 2-2: FLICK GESTURES A flick gesture is a unidirectional gesture in a quick flicking motion. An example may be a hand movement from West to East within the sensing area, from South to North, etc. * Circular gestures FIGURE 2-3: CIRCLE GESTURES COLIBRI SUITE CORE ELEMENTS Colibri Suite Digital Signal Processing Approach Detection Position Tracking Gesture Recognition A circular gesture is a round-shaped hand movement defined by direction (clockwise/counterclockwise) without any specific start position of the user's hand. Two types of circular gestures are distinguished by GestIC technology: 1. 2.2.1.1 Position Tracking (MGC3130) The Colibri Suite's Position Tracking feature provides three-dimensional hand position over time and area. The absolute position data is provided according to the defined origin of the Cartesian coordinate system (x, y, z). Position Tracking data is continuously acquired in parallel to Gesture Recognition. With a position rate of up to 200 positions/sec., a maximum spatial resolution of 150 dpi is achieved. DS40001667E-page 10 Discrete Circles Discrete Circles are recognized after performing a hand movement inside the sensing area. The recognition result (direction: clockwise/ counterclockwise) is provided after the hand movement stops or the hand exits the detection area. The Discrete Circles are typically used as dedicated application control commands. Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 2. AirWheel An AirWheel is the recognition of continuouslyperformed circles inside the sensing area and provides information about the rotational movement in real time. It provides continuously counter information which increments/decrements according to the movement's direction (clockwise/counterclockwise). The AirWheel can be adjusted for convenient usage in various applications (e.g., volume control, sensitivity adjustment or light dimming). * Sensor Touch Gestures FIGURE 1: SENSOR TOUCH GESTURES A Sensor Touch is a multi-zone gesture that reports up to five concurrently-performed touches on the system's electrodes. The Sensor Touch provides information about touch and tapping: 1. Touch The Sensor Touch indicates an event during which a GestIC electrode is touched. This allows distinction between short and long touches. 2. Tap and Double Tap The Tap and Double Tap signalize short taps and double taps on each system electrode. The tap length and double tap interval are adjustable. - Single Tap Delay: A single tap is detected when touching the surface of an electrode first and after the hand is pulled out of the touch area. The Single Tap is only detected when the timing between the touch and the release of the touch event is smaller than the adjusted delay. Increasing the time allows the user more time to perform the tap. The range for the adjusted delay can be between 0s and 1s. - Double Tap Delay: The double tap is detected when two taps are performed within the adjusted delay. The range for the adjusted delay can be between 0s and 1s. The smaller the selected delay is, the faster the two taps have to be executed. 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 11 MGC3030/3130 FIGURE 2-4: SENSOR TOUCH DIAGRAM Touch detected Touch Max Tap Duration 0s-1s Tap detected Tap Max Tap Duration 0s-1s Max Double Tap Duration 0s-1s Tap detected Double Tap detected Double Tap 2.2.1.3 FIGURE 2: Gesture Port GESTURE PORT The Gesture Port enables a flexible mapping of Colibri Suite feature events to certain output signals at dedicated pins of the MGC3X30. The individual feature events can be mapped to one of five EIO Pins and trigger a variety of signal changes (Permanent high, Permanent low, Toggle, Pulse (100 ms), High Active, Low Active). The Gesture Port simplifies and enhances embedded system integration. It enables host-free integration based on EIOs. DS40001667E-page 12 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 2.2.1.4 Approach Detection FIGURE 3: configurable. For typical applications, the scan cycle is in a range of 20 ms to 150 ms. During the Approach scan, the activated Rx channels are monitored for signal changes which are caused by, for example, an approaching human hand and exceeding the defined threshold. This allows an autonomous wake-up of the MGC3X30 and host applications at very low-power consumption. * Calibration Scan(1): The Approach Detection feature includes the possibility to perform additional Calibration scans for the continuous adaptation of the electrode system to environmental changes. A Calibration scan is performed during the scan phase of the MGC3X30's Self Wake-up mode. Five Rx channels are active to calibrate the sensor signals. The Calibration scan is usually performed in configurable intervals from 2s to 1024s. To reduce the power consumption, the number of scans per second can be decreased after a certain time of non-user activity. Colibri Suite provides a full user flexibility to configure the starting Calibration Scans rate (Calibration Start Scan Interval), non-user activity time-out (Calibration Transition Time) and the Calibration scans rate (Calibration Final Scan Interval) which will be used afterwards. A typical implementation uses Calibration scans every 2s during the first two minutes, and every 10s afterwards, until an approach is detected. APPROACH DETECTION Approach Detection is an embedded power-saving feature of Microchip's Colibri Suite. It sends MGC3X30 to Sleep mode and scans periodically the sensing area to detect the presence of a human hand. Utilizing the in-built Self Wake-up mode, Approach Detection alternates between Sleep and Scan phases. During the Scan phases, the approach of a human hand can be detected while very low power is consumed. For more details, please see Section 4.2.4.3 "Self Wake-up Mode". A detected approach of a user exceeding configured threshold criteria will alternate the MGC3X30 from Self Wake-up to Processing mode or even the application host in the overall system. Within the Approach Detection sequence, the following scans are performed: * Approach Scan: An Approach scan is performed during the scan phase of the MGC3X30's Self Wake-up mode. Typically, one Rx channel is active but more channels can be activated via the GestIC Library. The time interval (Scan Interval) between two consecutive Approach scans is FIGURE 2-5: The timing sequence of the Approach Detection feature is illustrated in Figure 2-5. APPROACH DETECTION SEQUENCE Processing Mode Self Wake-up mode Periodic Approach Scans Current Calibration Scan Periodic Approach Scans Calibration Scan Periodic Approach Scans Calibration Scan Periodic Approach Scans Calibration Transition Time (Non-user activity timeout) 2s-255s Idle Timeout 5s-1024s I5CHSCAN = 20mA Scan Interval 20ms-150ms Calibration Start Scan Interval 2s-10s Calibration Final Scan Interval 2s-1024s Isleep = 9A I5CHSCAN: Scan Phase with 5 active RX channels: Calibration Scan Isleep: Sleep Phase 2012-2017 Microchip Technology Inc. Advance Information time DS40001667E-page 13 MGC3030/3130 3.0 SYSTEM ARCHITECTURE MGC3X30 are mixed-signal configurable controllers. The entire system solution is composed of three main building blocks (see Figure 3-1): * MGC3X30 Controller * GestIC(R) Library * External Electrodes 3.1 3.2 The embedded GestIC Library is optimized to ensure continuous and real-time free-space Gesture Recognition and Motion tracking (MGC3130) concurrently. It is fully-configurable and allows required parameterization for individual application and external electrodes. 3.3 MGC3X30 Controller The MGC3X30 feature the following main building blocks: * Low Noise Analog Front End (AFE) * Digital Signal Processing Unit (SPU) * Communication Interfaces GestIC(R) Library External Electrodes Electrodes are connected to MGC3X30. An electrode needs to be individually designed following the guide lines from the `GestIC Design Guide' for optimal E-field distribution and detection of E-field variations inflicted by a user. The MGC3X30 provide a transmit signal to generate the E-field, conditions the analog signals from the receiving electrodes and processes these data digitally on the SPU. Data exchange between the MGC3X30 and the host is conducted via the controller's communication interface or the Gesture Port. For details, please refer to Section 4.0 "Functional Description". FIGURE 3-1: MGC3X30 CONTROLLER SYSTEM ARCHITECTURE Toapplication host Communications Interfaces Signal Processing Unit GestIC(R) Library 5 Rx External Electrodes Analog Front End MGC3X30 Tx DS40001667E-page 14 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 3.3.1 ELECTRODE EQUIVALENT CIRCUIT The hand Position Tracking and Gesture Recognition capabilities of a GestIC system depends on the electrodes design and their material characteristics. A simplified equivalent circuit model of a generic GestIC electrode system is illustrated in Figure 3-2. FIGURE 3-2: ELECTRODES CAPACITIVE EQUIVALENT CIRCUITRY EARTH GROUNDED X To MGC3x30 E-field Electrode signal eRx VRxBuf CRxTx Transmitter signal eTx VTx CRxG CTxG CH System ground Earth ground System Ground EQUATION 3-1: * VTX: Tx electrode voltage * VRXBUf: MGC3X30 Rx input voltage * CH: Capacitance between receive electrode and hand (earth ground). The user's hand can always be considered as earth-grounded due to the comparable large size of the human body. * CRXTX: Capacitance between receive and transmit electrodes * CRXG: Capacitance of the receive (Rx) electrode to system ground + input capacitance of the MGC3X30 receiver circuit * CTxG: Capacitance of the transmit (Tx) electrode to system ground * eRx: Rx electrode * eTx: Tx electrode The Rx and Tx electrodes in a GestIC electrode system build a capacitance voltage divider with the capacitances CRxTx and CRxG which are determined by the electrode design. CTxG represents the Tx electrode capacitance to system ground driven by the Tx signal. The Rx electrode measures the potential of the generated E-field. If a conductive object (e.g., a hand) approaches the Rx electrode, CH changes its capacitance. This minuscule change in the femtofarad range is detected by the MGC3X30 receiver. The equivalent circuit formula for the earth-grounded circuitry is described in Equation 3-1. 2012-2017 Microchip Technology Inc. ELECTRODES EQUIVALENT CIRCUIT C RxTx V RxBuf = V Tx ----------------------------------------------C RxTx + C RxG + C H A common example of an earth-grounded device is a notebook, even with no ground connection via power supply or ethernet connection. Due to its larger form factor, it presents a high earth-ground capacitance in the range of 50 pF and thus, it can be assumed as an earth-grounded GestIC system. A brief overview of the typical values of the electrodes capacitances is summarized in Table 3-1. TABLE 3-1: ELECTRODES CAPACITANCES TYPICAL VALUES Capacity Typical Value CRXTX 10...30 pF CTXG 10...1000 pF CRXG 10...30 pF CH <1 pF Advance Information DS40001667E-page 15 MGC3030/3130 Note: 3.3.2 are separated by a thin isolating layer. The Rx electrodes are typically arranged in a frame configuration as shown in Figure 3-3. The frame defines the inside sensing area with maximum dimensions of 14x14 centimeters. An optional fifth electrode in the center of the frame may be used to improve the distance measurement and add simple touch functionality. Ideal designs have low CRxTx and CRxG to ensure higher sensitivity of the electrode system. Optimal results are achieved with CRxTx and CRxG values being in the same range. STANDARD ELECTRODE DESIGN The MGC3X30 electrode system is typically a doublelayer design with a Tx transmit electrode at the bottom layer to shield against device ground and thus, ensure high receive sensitivity. Up to five comparably smaller Rx electrodes are placed above the Tx layer providing the spatial resolution of the GestIC system. Tx and Rx FIGURE 3-3: The electrodes' shapes can be designed solid or structured. In addition to the distance and the material between the Rx and Tx electrodes, the shape structure density also controls the capacitance CRXTX and thus, the sensitivity of the system. FRAME SHAPE ELECTRODES Center East West North South Top Layer (Lateral Rx) Top Layer (Center Rx) Tx Layer DS40001667E-page 16 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 4.0 FUNCTIONAL DESCRIPTION Microchip Technology's MGC3X30 configurable controller uses up to five E-field receiving electrodes. Featuring a Signal Processing Unit (SPU), a wide range of 3D gesture applications are being preprocessed on the MGC3X30, which allows short development cycles, as no host processing is needed. Always-on 3D sensing, even for battery-driven mobile devices, is enabled due to the chip's low-power design and variety of programmable power modes. A Self Wake-up mode triggers interrupts to the application host reacting to interaction of a user with the device and supporting the host system in overall power reduction. GestIC(R) sensing electrodes are driven by a low-voltage signal with a frequency in the range of 100 kHz, which allows their electrical conductive structure to be made of any low-cost material. Even the reuse of existing conductive structures, such as a display's ITO coating, is feasible, making the MGC3X30 an overall, very cost-effective system solution. Figure 4-1 provides an overview of the main building blocks of MGC3X30. These blocks will be described in the following sections. The MGC3X30 offers one enhanced I2CTM interface in including SDA, SCL and TS line (EIO0) for data exchange with a host controller. FIGURE 4-1: MGC3X30 CONTROLLER BLOCK DIAGRAM TX signal generation Internal clock Reset block MCLR SI0 TXD Signal conditioning ADC RX1 Signal conditioning ADC RX2 Signal conditioning ADC RX3 Signal conditioning ADC RX4 Signal conditioning ADC MGC3030/ 3130 Controller 2012-2017 Microchip Technology Inc. INTERNAL BUS External electrodes RX0 Communication control (I2C) EIO0 Signal processing unit (SPU) EIO1/IS1 Host EIO2 Gesture Port and Interface Selection Power management (PMU)) unit (PMU) Advance Information EIO3 EIO6 EIO7 FLASH y memory Voltage reference ((VREF) VREF)) SI1 IS2 Low power wake-up p DS40001667E-page 17 MGC3030/3130 4.1 Reset Block The Reset block combines all Reset sources. It controls the device system's Reset signal (SYSRST). The following is a list of device Reset sources: * MCLR: Master Clear Reset pin * SWR: Software Reset available through GestIC Library Loader * WDTR: Watchdog Timer Reset A simplified block diagram of the Reset block is illustrated in Figure 4-2. FIGURE 4-2: SYSTEM RESET BLOCK DIAGRAM * VDDA Domain: This domain is powered by VDDA = 3.0V. It is generated by an embedded lowimpedance and fast linear voltage regulator. During Deep Sleep mode, the analog voltage regulator is switched off. VDDA is the internal analog power supply voltage for the ADCs and the signal conditioning. An external block capacitor, CEFCA, is required on VCAPA pin. * VDDM Domain: This domain is powered by VDDM = 3.3V. VDDM is the internal power supply voltage for the internal Flash memory. VDDM is directly powered through VDD=3.3V. FIGURE 4-3: POWER SCHEME BLOCK DIAGRAM MCLR Glitch Filter VDD Domain VCAPD Deep sleep WDT Time-out VDD WDTR SYSRST VSS1 VSS2 Software Reset (SWR) VCAPS 4.2 4.2.1 Power Control and Clocks Digital voltage regulator EIO Wakeup logic VDDC Domain SPU Digital Peripherals Reset Block Internal Osc. WDTR VDDM Domain Analog voltage regulator FLASH Memory POWER MANAGEMENT UNIT (PMU) The device requires a 3.3V 5% supply voltage at VDD. According to Figure 4-3, the used power domains are as follows: VDDA Domain VCAPA VSS3 ADC Signal Conditioning Blocks * VDD Domain: This domain is powered by VDD = 3.3V 5% (typical VDD = 3.3V). VDD is the external power supply for EIO, wake-up logic, WDTR and internal regulators. * VDDC Domain: This domain is powered by VDDC = 1.8V. It is generated by an embedded lowimpedance and fast linear voltage regulator. The voltage regulator is working under all conditions (also during Deep Sleep mode) preserving the MGC3X30 data context. VDDC is the internal power supply voltage for digital blocks, Reset block and RC oscillators. An external block capacitor, CEFCD, is required on VCAPD pin. DS40001667E-page 18 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 4.2.2 POWER SUPERVISORS During the Power-up sequence, the system is kept under Reset condition for approximately 200 s (Reset delay: tRSTDLY) after the VDD =1.5V voltage is reached (1.2V minimum). During this delay, the system Reset will remain low and the VDD should reach typically 2V. When the Reset delay is elapsed, the system Reset is released (high) and the system starts the Power-up/ Time-out (tPWRT) sequence. The system start depends on the used VDD voltage. The Power-up/Time-out period (tPWRT) after Reset takes 36 LSO cycles. (see Table 4-3). The power-up sequence begins by increasing the voltage on the VDD pin (from 0V). If the slope of the VDD rise time is faster than 4.5 V/ms, the system starts correctly. If the slope is less than 4.5 V/ms, the MCLR pin must be held low, by external circuitry, until a valid operating VDD level is reached. The system starts when (see Figure 4-4): * Power-up/Time-out period (tPWRT) is elapsed * VDD = 3.3V is already reached before the end of tPWRT timing FIGURE 4-4: POWER SUPERVISORS VDD 3.3V 2V 1.5V t1 t2 time MCLR t1: tRSTDLY: Reset delay typically 200 s, 120 s minimum t2: tPWRT: Power-up Time-out 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 19 MGC3030/3130 4.2.3 CLOCKS 4.2.4.2 Deep Sleep Mode The MGC3X30 is embedding two internal oscillators, high speed and low speed. The High-Speed Oscillator (HSO) is factory-trimmed, achieving high accuracy. During the Deep Sleep mode, VDDM and VDDA are turned off, and VDDC is still powered to retain the data of the SPU. * High-Speed Oscillator (HSO): The mode includes the following characteristics: The MGC3X30 is clocked by an internal HSO running at 22.5 MHz 10% and consuming very low power. This clock is used to generate the Tx signal, to trigger the ADC conversions and to run the SPU. During Deep Sleep mode, the HSO clock is switched off. * * * * * * Low-Speed Oscillator (LSO): This leads to the lowest possible power consumption of MGC3X30. This low-speed and ultra-low-power oscillator is typically 32 kHz with a tolerance of 10 kHz. It is used during power-saving modes. 4.2.4 OPERATION MODES MGC3X30 offers three operation modes that allow the user to balance power consumption with device functionality. In all of the modes described in this section, power saving is configured by GestIC Library messages. 4.2.4.1 Processing Mode In this mode, all power domains are enabled and the SPU is running continuously. All peripheral digital blocks are active. Gesture Recognition and Position Tracking require the Processing Operation mode. The SPU is halted The High-Speed Oscillator is shut down The Low-Speed Oscillator is running The Watchdog is switched off Host interface pins are active for wake-up The MGC3X30 will resume from Deep Sleep if one of the following events occurs: * External Interrupt (IRQ0) or I2C0 Start Bit Detection * On MCLR Reset The Deep Sleep mode can be enabled by GestIC Library messages. 4.2.4.3 Self Wake-up Mode The Self Wake-up mode is a Low-Power mode allowing an autonomous wake-up of the MGC3X30 and application host. In this mode, the MGC3X30 is automatically and periodically alternating between Sleep and Scan phases. The MGC3X30's fast wake-up, typically below 1 ms, allows to perform scans in very efficient periods and to maximize the Sleep phase. The periodic Wake-up sequence is triggered by a programmable wake-up timer running at LSO frequency and which can be adjusted by the Approach Detection feature. The MGC3X30 enters the Self Wake-up mode by a GestIC Library message or by a non-activity time-out. Non-activity means no user detection within the sensing area. The MGC3X30 will resume from Self Wake-up on one of the following events: * Wake-up timer overflow event * External Interrupt (IRQ0) or I2C0 Start Bit detection * On MCLR or WDTR DS40001667E-page 20 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 4.2.4.4 MGC3X30 Power Profile The MGC3X30 power profile is illustrated in Figure 4-5. FIGURE 4-5: MGC3X30 POWER PROFILE I IPEAK(1) = 20mA ISW1(1) = 200A ISW2(1) = 110A IDS(1) = 9A Deep Sleep Self Wake-up Wake-up IRQ from host or ICTM start detected Processing Approach detected Self Wake-up t No user interaction (Time-out) IPEAK: Processing mode with 5 Rx Channels ISW1: Self Wake-up with 150 ms Approach Scan and 10s Calibration Scan ISW2: Self Wake-up with 150 ms Approach Scan and without Calibration Scan IDS: Deep Sleep (1) These are preliminary values @ 3.3V, typical MGC3X30 current consumption for the different operation modes are summarized in Table 4-1. TABLE 4-1: CURRENT CONSUMPTION OVERVIEW Mode Current Consumption Conditions Processing mode 20 mA VDD = 3.3V 5 Rx Channels activated Self Wake-up mode 110 A VDD = 3.3V No Calibration Scan 1 Rx Channel active 200 A VDD = 3.3V Calibration Scan each 10s 1 Rx Channel active Deep Sleep mode Note: 9 A VDD = 3.3V In Processing mode, there are always five Rx channels activated. Choosing only four Rx channels in Aurea does not have an impact on the current consumption during Processing mode. The Self Wake-up mode current consumption depends on the number of active channels during Self Wake-up mode, Approach Scan and Calibration Scan repetition period. Changing these parameters results in different current consumption values. 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 21 MGC3030/3130 Figure 4-6 and Figure 4-7 describe the Self Wake-up mode current consumption according to the Approach Scan and Calibration Scan period change. FIGURE 4-6: CURRENT CONSUMPTION FOR VARYING TIME INTERVALS BETWEEN APPROACH SCANS AND CALIBRATION SCANS 1.40 1.21 Current Consumption [mA] 1.20 1.00 0.86 0.77 0.80 Calibration Scan every 1024s Calibration Scan every 2s 0.60 0.57 Calibration Scan every 10s 0.40 0.20 0.20 0.11 0.00 0 FIGURE 4-7: 50 100 150 200 Time Interval between Approach Scans[ms] CURRENT CONSUMPTION FOR A FIXED TIME INTERVAL BETWEEN APPROACH SCANS OF 20 ms Current Consumption (mA) 1.40 1.21 1.20 1.07 1.00 0.99 0.95 0.92 0.90 0.88 0.87 0.86 0.80 0.60 0.40 0.20 0.00 0 DS40001667E-page 22 2 4 6 8 Time interval between Calibration Scans (s) Advance Information 10 12 2012-2017 Microchip Technology Inc. MGC3030/3130 4.2.4.5 Table 4-2 modes. Operation Modes Summary summarizes TABLE 4-2: the MGC3X30 OPERATION MODES SUMMARY Mode Entry Exit I2CTM0/IRQ0/Approach/ MCLR/WDTR/SW Reset Processing Self Wake-up Time-out/GestIC(R) Library Message GestIC(R) Library Message Deep Sleep 4.2.5 operation Comments GestIC(R) Library Message/NonActivity Time-out/WDTR - Processing mode with up to five electrodes continuously running - Full positioning and Gesture Recognition capabilities I2CTM0/IRQ0/Wake-up Timer/ MCLR/WDTR - Scan phase with a configurable number of Rx active channels, wake-up timer is used to resume the system - Approach detection capability - Fast wake-up time - Very low-power consumption I2CTM0/IRQ0/MCLR - SPU halted, Analog Voltage Regulator OFF, Watchdog OFF - No positioning or gesture detection - Extreme low-power consumption - Needs trigger from application host to switch into Self Wake-up or Processing mode POWER-UP/DOWN SEQUENCE Figure 4-8 represents the power-up sequence timings after a Reset or Deep Sleep state. FIGURE 4-8: POWER-UP SEQUENCE TIMINGS LSO tPWRT Reset or Deep Sleep Power-Up Processing operation VREF enable tHSO HSO enable tSPUCLK SPU CLK SPU halted 2012-2017 Microchip Technology Inc. Advance Information SPU running DS40001667E-page 23 MGC3030/3130 Power-up Phases * Reset or Deep Sleep: The system is kept in Reset or is in Deep Sleep mode * Power-up: Phase when the system starts up after Reset/Deep Sleep has been released * Processing operation: Processing mode is started * Power-up Time-out TABLE 4-3: POWER-UP TIME-OUT (tPWRT) Delay in LSO Cycles Signal Symbol VREF Enable After Reset After Deep Sleep 0 0 tVREF HSO Enable SPU CLK Power-Up Time-Out tHSO 2 2 tSPUCLK 30 8 tPWRT 36 10 Signal References * * * * LSO: Low-Speed Oscillator clock HSO: High-Speed Oscillator clock VREF Enable: Voltage Reference enable signal HSO Enable: High-Speed Oscillator enable signal Figure 4-9 timings. illustrates FIGURE 4-9: the power-down sequence POWER-DOWN SEQUENCE TIMINGS LSO Processing operation Request Power down Deep sleep VREF enable HSO enable SPU CLK SPU running DS40001667E-page 24 SPU halted Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 Power-down Phases * Processing Operation: Processing mode is activated * Request: Request to enter Deep Sleep mode * Power-down: Power-down state (all analog signals are down) * Deep Sleep: Deep Sleep mode has been entered Signal References * * * * LSO: Low-Speed Oscillator clock HSO: High-Speed Oscillator clock VREF Enable: Voltage Reference enable signal HSO Enable: High-Speed Oscillator enable signal 4.3 Transmit Signal Generation The Tx signal generation block provides a bandwidth limited square wave signal for the transmit electrode. Frequency hopping adjusts automatically the Tx carrier frequency in the range of 44-115 kHz, depending on the environmental noise conditions. GestIC Library automatically selects the lowest noise working frequency in case the sensor signal is compromised. Frequencies can be enabled/disabled via the GestIC Library. 4.4 Receive (Rx) Channels There are five identical Rx channels that can be used for five respective receive electrodes. Four receive electrodes are required for Position Tracking and Gesture Recognition. A fifth electrode can be used for touch detection and to improve distance measurement. Each channel has its own analog signal conditioning stage, followed by a dedicated ADC. For specific features such as Approach Detection, individual Rx channels can be activated or deactivated via the GestIC Library. According to the electrode characteristics, the channels have to be parameterized. The signal conditioning block contains analog filtering and amplification as shown in Figure 4-10. FIGURE 4-10: VDDA/2 For individual electrode characteristics, the Rx channels can be configured as follows: * Signal matching: The received signal is sampled at a sampling rate, equal to twice the Tx frequency providing a high and low ADC sample. The signal matching block adjusts the received signal towards the same value of high and low ADC samples. The offset can be adjusted accordingly. * The matched signal output is amplified using a programmable gain amplifier to achieve a better sensitivity. 4.5 Analog-to-Digital Converter (ADC) As outlined in Section 4.4 "Receive (Rx) Channels", each Rx channel features a dedicated ADC with a trigger derived from the internal clock. ADC samples are synchronous with twice the Tx transmit frequency. 4.6 Signal Processing Unit (SPU) The MGC3X30 features a Signal Processing Unit (SPU) to control the hardware blocks and process the advanced DSP algorithms included in the GestIC Library. It provides filtered sensor data, continuous position information and recognized gestures to the application host. The host combines the information and controls its application. 4.7 Parameters Storage The MGC3X30 provides an embedded 32 kBytes Flash memory which is dedicated for the GestIC Library and storage of the individual configuration parameters. These parameters have to be set according to the individual electrode design and application. The GestIC Library and parameters are loaded into MGC3X30 with the provided software tools or, alternatively, via GestIC Library messages by the application host. For more details on the MGC3X30 tools, please refer to Section 7.0 "Development Support". SIGNAL CONDITIONING BLOCK Signal matching Buffer Rx gain Rx Input Signal Conditioning Block 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 25 MGC3030/3130 5.0 INTERFACE DESCRIPTION The MGC3X30 supports an I2CTM interface with Slave mode and the Gesture Port (five configurable EOIs). 5.1 Interface Selection The MGC3X30 interface selection pin, IS2, is used to select the I2C slave address. There are two different addresses. TABLE 5-1: IS2 MGC3X30 INTERFACE SELECTION PINS IS1 0 1 5.2 Mode (Address) 0 I2 0 2 CTM0 Slave Address 1 (0x42) I CTM0 Slave Address 2 (0x43) Extended Input Output (EIO) 5.3 Interrupt Requests MGC3X30 IRQ0 and IRQ1 interrupt lines are used by the host to wake-up the MGC3X30 from Deep Sleep and Self Wake-up modes. If a wake-up event is detected on IRQ0 or IRQ1 lines, the MGC3X30 switches to the Processing mode. 5.4 Gesture Port The MGC3X30 provides five output pins which can be used to output the Colibri Suite features events. These pins are controlled by GestIC Library to signal that an event occurred. The host does not need to monitor the I2C bus to get GestIC Library events, but only has to monitor the Gesture Port pins. This feature is used in parallel to I2C communication. The Colibri Suite Gesture Port feature mapping is illustrated in Figure 5-1. The MGC3X30 provides input/output pins with extended features. These pins are controlled by GestIC(R) Library and listed in Table 5-2. TABLE 5-2: MGC3X30 EXTENDED IOS FUNCTIONS Pin Multiplexed Functions EIO0 TS EIO1 IS1/Gesture Port EIO2 IRQ0/Gesture Port EIO3 IRQ1/SYNC/Gesture Port EIO4 SDA0 EIO5 SCL0 EIO6 Gesture Port EIO7 Gesture Port DS40001667E-page 26 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 FIGURE 5-1: GESTURE PORT MAPPING Colibri Suite Events Action Selection [0:2] Permanent high Permanent low Toggle Pulse (100ms) High active Low active EventOutput1..12 To EIOs Flick South -> North Circle ClockWise Circle Counter-ClockWise AirWheel ClockWise Gesture Sensor Touch Tap Double Tap Electrode Selection [0:2] Touch Sensor Touch Selection [0:1] AirWheel Counter-ClockWise EventInput Selection [0:1] Flick East -> West Flick North -> South Gesture Selection [0:2] Flick West -> East MGC3X30 Pins Events mapping Wake-up after Approach Detection EIO1,2,3,6,7 EventOutput 12 ... EventOutput 1 The Colibri Suite can generate up to twelve event outputs which can be mapped to any EIO (1, 2, 3, 6 or 7). It is also possible to map more than one event output by one EIO. 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 27 MGC3030/3130 TABLE 5-3: COLIBRI SUITE EVENTS Gesture Port Mapping Parameter Description Gesture Selection Selects the gestures which will be used as event. Gesture Selection can be: * Flick West/East * Flick East/West * Flick North/South * Flick South/North * Circle Clockwise * Circle Counterclockwise * AirWheel Clockwise * AirWheel Counterclockwise Sensor Touch Selection Selects the sensor touch which will be used as event. Sensor Touch Selection can be: * Touch * Tap * Double Tap Electrode Selection Selects the electrode which will be used for Sensor Touch. Electrode Selection can be: * West * East * North * South * Center Event Input Selection Selects the event which will trigger an event output on the EIOs. Event Input Selection can be: * Gesture * Sensor Touch * Wake-up after Approach Detection Action Selection Selects the signal format which will be output on the EIOs. See Figure 5-2 and Table 5-4. Action Selection can be: * Permanent High * Permanent Low * Toggle * Pulse * High Active * Low Active DS40001667E-page 28 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 FIGURE 5-2: GESTURE PORT ACTION Event Permanent high Event Permanent low Event Pulse (100ms) Event Event Event Toggle Touch detected Touch released Touch detected Touch released High active Low active TABLE 5-4: GESTURE PORT MAPPING Action Event Permanent High Permanent Low Toggle Pulse X X X X X X Single Tap X X X X Double Tap X X X X Gesture Touch Approach AirWheel 2012-2017 Microchip Technology Inc. High Active Low Active X X X X X Advance Information DS40001667E-page 29 MGC3030/3130 5.5 Communication Interfaces The MGC3X30 offer an I2CTM interface for communicating with an application host. The I2C0 port offers: Slave mode Up to 400 kHz 7-bit Addressing mode Hardware state machine for basic protocol handling * Support for repeated start and clock stretching (Byte mode) * No multi-master support I2CTM Device Write ID Address A7 A6 A5 A4 A3 A2 A1 A0 1 0 0 0 0 1 IS2 0 * * * * I2CTM Device Read ID Address I CTM Hardware Interface A summary of the hardware interface pins is shown below in Table 5-5. I2CTM MGC3X30 Pin A7 A6 A5 A4 A3 A2 A1 A0 1 0 0 0 0 1 IS2 1 PIN DESCRIPTION I2CTM Master Read Bit Timing Multiplexed Functions SCL Serial Clock to Master I2CTM SDA Serial Data to Master I2CTM Master read is to receive position data, gesture reports and command responses from the MGC3X30. The timing diagram is shown in Figure 5-4. * SCL Pin - The SCL (Serial Clock) pin is electrically open-drain and requires a pull-up resistor of typically 1.8 k (for a maximum bus load capacitance of 200 pF), from SCL to VDD. - SCL Idle state is high. * SDA Pin - The SDA (Serial Data) pin is electrically open-drain and requires a pull-up resistor of typically 1.8 k (for a maximum bus load capacitance of 200 pF), from SDA to VDD. - SDA Idle state is high. - Master write data is latched in on SCL rising edges. - Master read data is latched out on SCL falling edges to ensure it is valid during the subsequent SCL high time. I2CTM Addressing: The MGC3X30 Device ID 7-bit address is: 0x42 (0b1000010) or 0x43 (0b1000011) depending on the interface selection pin configuration (IS2+IS1). Please refer to Table 5-6. TABLE 5-6: I2CTM DEVICE ID ADDRESS * Address bits are latched into the MGC3X30 on the rising edges of SCL. * Data bits are latched out of the MGC3X30 on the rising edges of SCL. * ACK bit: - MGC3X30 presents the ACK bit on the ninth clock for address acknowledgment - I2C master presents the ACK bit on the ninth clock for data acknowledgment * The I2C master must monitor the SCL pin prior to asserting another clock pulse, as the MGC3X30 may be holding off the I2C master by stretching the clock. I2CTM Communication Steps 1. 2. 3. 4. Device ID Address, 7-bit A6 A5 A4 A3 A2 A1 A0 1 0 0 0 0 1 IS2 DS40001667E-page 30 I2CTM DEVICE READ ID ADDRESS (0x85 OR 0x87) TABLE 5-8: 2 TABLE 5-5: I2CTM DEVICE WRITE ID ADDRESS (0x84 OR 0x86) TABLE 5-7: I2CTM 5.5.1 5. SCL and SDA lines are Idle high. I2C master presents Start bit to the MGC3X30 by taking SDA high-to-low, followed by taking SCL high-to-low. I2C master presents 7-bit address, followed by a R/W = 1 (Read mode) bit to the MGC3X30 on SDA, at the rising edge of eight master clock (SCL) cycles. MGC3X30 compares the received address to its Device ID. If they match, the MGC3X30 acknowledges (ACK) the master sent address by presenting a low on SDA, followed by a lowhigh-low on SCL. I2C master monitors SCL, as the MGC3X30 may be clock stretching, holding SCL low to indicate that the I2C master should wait. Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 I2C master receives eight data bits (MSB first) presented on SDA by the MGC3X30, at eight sequential I2C master clock (SCL) cycles. The data is latched out on SCL falling edges to ensure it is valid during the subsequent SCL high time. 7. If data transfer is not complete, then: - I2C master acknowledges (ACK) reception of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL. - Go to step 5. 8. If data transfer is complete, then: - I2C master acknowledges (ACK) reception of the eight data bits and a completed data transfer by presenting a high on SDA, followed by a low-high-low on SCL. 6. I2CTM Communication Steps 1. 2. 3. 4. 5. I2CTM Master Write Bit Timing I2C master write is to send supported commands to the MGC3X30. The timing diagram is shown in Figure 5-5. * Address bits are latched into the MGC3X30 on the rising edges of SCL. * Data bits are latched into the MGC3X30 on the rising edges of SCL. * ACK bit: - MGC3X30 presents the ACK bit on the ninth clock for address acknowledgment - I2C master presents the ACK bit on the ninth clock for data acknowledgment * The master must monitor the SCL pin prior to asserting another clock pulse, as the MGC3X30 may be holding off the master by stretching the clock. 6. 7. 8. 9. SCL and SDA lines are Idle high. I2C master presents Start bit to the MGC3X30 by taking SDA high-to-low, followed by taking SCL high-to-low. I2C master presents 7-bit address, followed by a R/W = 0 (Write mode) bit to the MGC3X30 on SDA, at the rising edge of eight master clock (SCL) cycles. MGC3X30 compares the received address to its Device ID. If they match, the MGC3X30 acknowledges (ACK) the I2C master sent address by presenting a low on SDA, followed by a low-high-low on SCL. I2C master monitors SCL, as the MGC3X30 may be clock stretching, holding SCL low to indicate the I2C master should wait. I2C master presents eight data bits (MSB first) to the MGC3X30 on SDA, at the rising edge of eight master clock (SCL) cycles. MGC3X30 acknowledges (ACK) receipt of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL. If data transfer is not complete, then go to step 5. Master presents a Stop bit to the MGC3X30 by taking SCL low-high, followed by taking SDA low-to-high. 5.5.2 TRANSFER STATUS LINE MGC3X30 requires a dedicated Transfer Status line (TS) which features a data transfer status function. It is used by both I2C Master and Slave to control data flow. The TS (Transfer Status) line is electrically open-drain and requires a pull-up resistor of typically 10 k, from TS to VDD. TS Idle state is high. The MGC3X30 (I2C Slave) uses this line to inform the host controller (I2C Master) that there is data available which can be transferred. The host controller uses the TS line to indicate that data is being transferred and prevents MGC3X30 from updating its data buffer. Table 5-9 shows how the TS line is used in the different states of communication. 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 31 MGC3030/3130 TABLE 5-9: USAGE OF TRANSFER STATUS LINE MGC3X30 Host Controller TS Line Status Released (H) Released (H) High Host finished reading data (Transfer end). No more data to be transferred to the host. MGC3X30 is allowed to update the data buffer. Asserted (L) Released (H) Low Data from MGC3X30 is available to be sent, but the host has not yet started reading. If the host is busy and did not start reading before the next data update (5 ms), the MGC3X30 will assert the TS line high while updating the data buffer. Asserted (L) Asserted (L) Low Host starts reading. MGC3X30 data buffer will not be updated until the end of transfer (host releases TS high). Released (H) Asserted (L) Low MGC3X30 is ready to update the data buffer, but the host is still reading the previous data. MGC3X30 is allowed to update the data only when the host releases the TS high. MGC3X30 can update the I2C buffer only when the TS is released by both chips and a data transfer can only be started when MGC3X30 pulls the TS low. This procedure secures that: * the host is always informed when new sensor data is available * buffer updates in MGC3X30 are always completed before data is sent to the I2C bus Figure 5-3 protocol. shows FIGURE 5-3: the complete communication MGC3X30 COMMUNICATION PROTOCOL Transfer Status (TS) MGC3130 buffer can be updated I2CTM Bus MGC3130 Related Transfer TS line pulled by MGC3130 to request a data transfer TS line pulled low by master when transfer is started TS line released by master and MGC3130 when transfer is finished Note 1: The stop condition after an I2CTM data transmission is generated by the host controller (I2CTM Master) after the data transfer is completed. Thus, it is recommended to verify the amount of bytes to be read in the message header (Size field). MGC3130 buffer can be updated Non MGC3130 related transfer or Bus Idle TS line pulled by MGC3130 to request a data transfer MGC3130 Related Transfer TS line pulled low by master when transfer is started TS line released by master and MGC3130 when transfer is finished In addition to the standard I2C interface, the communication between MGC3X30 and the host controller requires a proper handling of the Transfer Status. 2: Transfer Status is only needed for data transfer from MGC3X30 to the host controller. Writing to MGC3X30 does not require the additional TS signal. DS40001667E-page 32 Advance Information 2012-2017 Microchip Technology Inc. 2012-2017 Microchip Technology Inc. I2CTM MASTER READ BIT TIMING DIAGRAM FIGURE 5-4: Address SDA R/W A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 ACK Data 1 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 Data ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 SCL S 8 9 9 9 P Address Bits Latched in Start Bit Data Bits Valid Out Data Bits Valid Out SCL may be stretched Stop Bit SCL may be stretched Advance Information I2CTM MASTER WRITE BIT TIMING DIAGRAM FIGURE 5-5: Address SDA R/W A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 ACK 0 Data ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 Data ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 SCL S Start Bit 8 9 9 9 P Address Bits Latched in Data Bits Valid Out SCL may be stretched Data Bits Valid Out SCL may be stretched Stop Bit MGC3030/3130 DS40001667E-page 33 MGC3030/3130 6.0 APPLICATION ARCHITECTURE The standard MGC3X30 implementation is a singlezone design. This configuration is based on one MGC3X30 connected to an application host via I2CTM with MGC3X30 being Slave and Application Host being Master. The following lines are needed for full I2C communication (see Figure 6-1). Data reporting and flow-control scenarios described below for I2C communication: 6.4 Reference Schematic (3.3V VDD 3.465V) The reference application schematic for the MGC3X30 is depicted below in Figure 6-2. are * SDA * SCL * EIO0 (Transfer Status Line) is toggled indicating that new data is available and checking whether the host has already started data reading or not. FIGURE 6-1: APPLICATION CIRCUITRY 10k 10k 1.8k 1.8k Vcc SDA0 SCL0 SDA SCL SDA SCL EIO0 TS GPIO MCLR MCLR X MGC3x30 6.1 GPIO Host Controller ESD Considerations The MGC3X30 provides Electrostatic Discharge (ESD) Voltage protection up to 2 kV (HBM). Additional ESD countermeasures may be implemented individually to meet application-specific requirements. 6.2 Power Noise Considerations MGC3X30 filtering capacitors are included in the reference design schematic (Please refer to Figure 6-2). 6.3 Irradiated High-Frequency Noise In order to suppress irradiated high-frequency signals, the five Rx channels of the chip are connected to the electrodes via serial 10 k resistors, as close as possible to MGC3X30. The 10 k resistor and the MGC3X30 input capacitance are building a low-pass filter with a corner frequency of 3 MHz. An Additional ferrite bead is recommended to suppress the coupling of RF noise to the Tx channel (e.g., 600 at 100 MHz). An additional ferrite bead is recommended to suppress the coupling of RF noise to the Tx channel (e.g., 600 at 100 MHz). DS40001667E-page 34 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 FIGURE 6-2: REFERENCE SCHEMATIC FOR MGC3X30 NC NC EIO7 R11(10k) R12(10k) SI1 MGC3X30 RX2 R3 SI0 RX1 1.8k RX0 R2 MCLR 1.8k EIO6 VDD TXD R10(10k) SouthElectrode SDA RESET EIO0 RX3 GPIO/IRQ 10k R4 EXP1 VCAPA VDD IS2 4.7F VSS3 C2 4.7F VCAPD VCAPS C3 100nF R7 (n.p) C1 R5 (n.p) 10k VDD 10k VDD VINDS IS2 VSS1 NC VSS2 VDD RX4 HOST SCL NC R13(10k) VDD IS1 IS2 EIO6 EIO7 EIO3 1 ExposedPadonQFN housingonly(MGC3130) EIO2 n.p:notpopulated EIO1 10k R8 10k GesturePort R6 InterfaceSelection EIO3 R1 EastElectrode WestElectrode CenterElectrode R9(10k) EIO2 EIO1 NorthElectrode 10k VDD IS1 NOTE:R5andR7arenotpopulated 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 35 MGC3030/3130 TABLE 6-1: BILL OF MATERIALS Label Qty Value R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k C1 1 100 nF Capacitor - Ceramic, 0.1 F, 10%, 6.3V C2 1 4.7 F Capacitor - Ceramic, 4.7 F, 10%, 6.3V C3 1 4.7 F Capacitor - Ceramic, 4.7 F, 10%, 6.3V R2, R3 2 1.8 k Res Thick Film 1.8 k R9, R10, R11, R12, R13 5 10 k Res Thick Film 10 k 6.5 Description Layout Recommendation This section will provide a brief description of layout hints for a proper system design. The PCB layout requirements for MGC3X30 follow the general rules for a mixed signal design. In addition, there are certain requirements to be considered for the sensor signals and electrode feeding lines. The chip should be placed as close as possible to the electrodes to keep their feeding lines as short as possible. Furthermore, it is recommended to keep MGC3X30 away from electrical and thermal sources within the system. Analog and digital signals should be separated from each other during PCB layout in order to minimize crosstalk. The individual electrode feeding lines should be kept as far as possible apart from each other. VDD lines should be routed as wide as possible. MGC3X30 requires a proper ground connection on all VSS pins, including the exposed pad (pin 29). DS40001667E-page 36 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 7.0 DEVELOPMENT SUPPORT Microchip provides software and development tools for the MGC3X30: hardware * Software: - Aurea Software Package - MGC3030/3130 Software Development Kit - MGC3030/3130 Host Reference Code * Schematics: - GestIC(R) Hardware References * Evaluation and Development Kits: - MGC3130 Hillstar Development Kit (DM160218) - MGC3030 Woodstar Development Kit (DM160226) 7.1 7.4 GestIC Hardware References The GestIC Hardware References package contains the PCB Layouts (Gerber files) for the MGC development kits (Hillstar and Woodstar) and a collection of electrode reference designs fitting both kits. In addition, the package includes designs, parameter files and host code of various demonstrators which represent complete systems for embedded or PC-based applications. New designs will be added to the package once they are available. The GestIC Hardware Reference package can be downloaded from Microchip's website via www.microchip.com/ GestICResources. Aurea Software Package The Aurea evaluation software demonstrates Microchip's GestIC technology and its features and applications. Aurea provides visualization of the MGC3X30 generated data and access to GestIC Library controls and configuration parameters. That contains the following: * * * * * * * * Visualization of hand position and user gestures Visualization of sensor data Real-time control of sensor features MGC3X30 GestIC Library update Analog front end parameterization Colibri parameterization Electrode capacitance measurement Logging of sensor values and storage in a log file 7.2 MGC3030/3130 Software Development Kit Microchip provides a standard C reference code with a Software Development Kit. The code will support developers to integrate the MGC3X30 solution into the target application. 7.3 MGC3030/3130 PIC18 Host Reference Code Microchip provides a reference code for PIC18F14K50, including GestIC Library I2CTM code and basic message decoding. 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 37 MGC3030/3130 7.5 Evaluation and Demonstration Kits A variety of demonstration, development and evaluation boards allow quick application development on fully-functional systems. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various GestIC MGC3130 applications. The first development board is the Hillstar Development Kit. It is designed to support an easy integration of Microchip's MGC3130 3D Tracking and Gesture Controller into the customer's applications. It provides MGC3130 system hardware modules and a set of electrode reference designs which can be used by customers to develop their own GestIC system. Aurea Visualization and Control Software provides full support of the Hillstar Development Kit and an easy parameterization of the customer's applications. The Woodstar Development Kit is a development platform to support an easy integration of Microchip's MGC3030. It provides MGC3030 system hardware modules and a set of electrode reference designs which can be used by customers to develop their own GestIC system. Aurea Visualization and Control Software provides full support of the Woodstar Development Kit and an easy parameterization of the customer's applications. 7.6 The MGC3X30 devices are manufactured with a builtin Library Loader (bootloader) only. There will be no GestIC library on it. The library loader contains the I2C interface and basic device programming operations so that a GestIC library can be uploaded to the MGC3X30 Flash memory. The latest GestIC library can be found in the package 'Aurea Software Package' which can be downloaded from the GestIC homepage. There are several ways to upload the library to the MGC3X30: 1. 2. Woodstar and Hillstar offer the same interface (hardware as well as software). The electrodes, the I2C-to-USB bridge as well as Aurea software can both be used for Hillstar and Woodstar development kit. For the complete list of demonstration, development and evaluation kits, please refer to the Microchip website (http://www.microchip.com/GestICGettingStarted). 3. 4. DS40001667E-page 38 GestIC Library Update Upload via Aurea Visualization and Control Software: The Aurea Graphical User Interface (GUI) can be used to perform the update. For this option, USB connectivity to a PC with Aurea Graphical User Interface (GUI) will be needed (e.g., using I2CTM-to-USB bridge of Hillstar Development Kit or Woodstar Development Kit). Please refer to "Aurea Graphical User Interface" (DS40001681), MGC3130 Hillstar Development Kit User's Guide (DS40001721) and MGC3030 Woodstar Development Kit User's Guide (DS40001777) for additional information. Upload via embedded host controller: this option will require an embedded host controller which performs the upload using the GestIC I2C commands. The GestIC library is hereby stored in the host's memory. Please refer to "MGC3030/ 3130 GestIC Library Interface Description" (DS40001718) for more details. Microchip Programming Center Pre-programmed MGC3X30 parts can be ordered through Microchip Programming Center. Please go to www.microchipdirect.com/programming/ for further information. Quick Time Programming (QTP): for larger quantities of pre-programmed parts with unique part number, please see your local Microchip sales office. Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 8.0 ELECTRICAL SPECIFICATIONS 8.1 Absolute Maximum Ratings() Ambient temperature under bias......................................................................................................... -20C to +85C Storage temperature ........................................................................................................................ -55C to +125C Voltage on pins with respect to VSS on VDD pin ............................................................................................................................ -0.3V to +3.465V on all other pins .............................................................................................................. -0.3V to (VDD + 0.3V) NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. NOTICE: This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and protect the device in an application may cause partial to complete failure of the device. NOTICE: -20C temperature operation is characterized but not tested. 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 39 MGC3030/3130 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 28-Lead QFN (5x5x0.9 mm) PIN 1 Example PIN 1 28-Lead SSOP (5.30 mm) MGC3130 MQ e3 1318017 Example MGC3030 SS e3 1318017 Legend: XX...X Y YY WW NNN e3 * Note: DS40001667E-page 40 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 9.2 Package Details The following sections give the technical details of the packages. 28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.10 C 2X TOP VIEW 0.10 C 0.10 C C SEATING PLANE A1 A 28X A3 SIDE VIEW 0.08 C 0.10 C A B D2 0.10 C A B E2 28X K 2 1 NOTE 1 N 28X L e BOTTOM VIEW 28X b 0.10 0.05 C A B C Microchip Technology Drawing C04-140C Sheet 1 of 2 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 41 MGC3030/3130 28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Standoff A1 Contact Thickness A3 Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 b Contact Width Contact Length L Contact-to-Exposed Pad K MIN 0.80 0.00 3.15 3.15 0.18 0.35 0.20 MILLIMETERS NOM 28 0.50 BSC 0.90 0.02 0.20 REF 5.00 BSC 3.25 5.00 BSC 3.25 0.25 0.40 - MAX 1.00 0.05 3.35 3.35 0.30 0.45 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-140C Sheet 2 of 2 DS40001667E-page 42 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5 mm Body [QFN] Land Pattern With 0.55 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-2140A 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 43 MGC3030/3130 /HDG3ODVWLF6KULQN6PDOO2XWOLQH 66 PP%RG\>6623@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 1 2 NOTE 1 b e c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page 44 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 45 MGC3030/3130 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (11/2012) Initial release of this data sheet. Revision B (08/2013) Updated the Power Features section; Updated Table 1; Updated section 2, Feature Description; Updated section 4.2.2; Updated Figures 4-4, 4-5 and 4-6; Updated Equation 4-1, Table 4-1; Updated Figures 4-9, 5-1 and 5-2; Updated section 6, Interface Description, Updated Figures 7-1 and 7-2; Added section 7-3, Irradiated High-Frequency Noise; Updated Tables 7-1 and 7-2; Updated section 8, Development Support; Updated the Packaging Information section; Other minor corrections. Revision C (11/2013) Updated Figure 1 and Table 1; Updated Section 2, Feature Description; Updated Section 4, Functional Description; Updated Section 6, Interface Description; Updated Figure 7-1 and 7-2; Updated Section 8, Development Support; Other minor corrections. Revision D (1/2015) Updated Packaging Marking Section; Updated 6.6.1, 5.1, 4.5, 8.5, 8.6, 4.2 Sections; Updated Figures 2-2, 4-9, 4-10, 6-1, 6-2, 7-1; Other minor corrections. Revision E (7/2017) Revised Table 3: Pin Summary. DS40001667E-page 46 Advance Information 2012-2017 Microchip Technology Inc. MGC3030/3130 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at: http://www.microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip website at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 47 MGC3030/3130 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device - X Tape and Reel Temperature Option Range /XX XXX Package Pattern Device: MGC3030,MGC3130 Tape and Reel Option: Blank T = Standard packaging (tube or tray) = Tape and Reel(1) Temperature Range: I = -40C to Package:(2) MQ SS Pattern: = = +85C (Industrial) Examples: a) Note 1: QFN SSOP 2: QTP, SQTP, Code or Special Requirements (blank otherwise) DS40001667E-page 48 MGC3130 - I/MQ Industrial temperature, QFN package Advance Information Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. For other small form-factor package availability and marking information, please visit www.microchip.com/packaging or contact your local sales office. 2012-2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, InterChip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2012-2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-1910-5 == ISO/TS 16949 == 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 49 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 Finland - Espoo Tel: 358-9-4520-820 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 DS40001667E-page 50 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-3326-8000 Fax: 86-21-3326-8021 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 France - Saint Cloud Tel: 33-1-30-60-70-00 India - Pune Tel: 91-20-3019-1500 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Germany - Heilbronn Tel: 49-7131-67-3636 Germany - Karlsruhe Tel: 49-721-625370 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Germany - Rosenheim Tel: 49-8031-354-560 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7830 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Israel - Ra'anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7289-7561 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Advance Information 2012-2017 Microchip Technology Inc. 11/07/16 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Microchip: MGC3030T-I/SS MGC3030-I/SS