FODM214AR2 - ON SEMICONDUCTOR

August, 2019 − Rev. 2

1Publication Order Number:

FODM214/D

FODM214, FODM217 Series

Single Channel, AC/DC

Sensing Input,

Phototransistor

Optocoupler In Half-Pitch

Mini-Flat 4-Pin Package

The FODM217 series consist of a gallium arsenide infrared emitting

diode driving a phototransistor. The FODM214 series consist of two

gallium arsenide infrared emitting diodes connected in inverse parallel

for AC operation. Both were built in a compact, half−pitch, mini−flat,

4−pin package. The lead pitch is 1.27 mm.

Features

•Current Transfer Ratio Ranges from 20 to 600%

at IF = ±1 mA, VCE = 5 V, TA = 25°C

♦FODM214 − 20 to 400%

♦FODM214A − 50 to 250%

at IF = 5 mA, VCE = 5 V, TA = 25°C

♦FODM217A − 80 to 160%

♦FODM217B − 130 to 260%

♦FODM217C − 200 to 400%

♦FODM217D − 300 to 600%

•Safety and Regulatory Approvals:

♦UL1577, 3750 VACRMS for 1 min

♦DIN EN/IEC60747−5−5, 565 V Peak Working Insulation Voltage

•Applicable to Infrared Ray Reflow, 260°C

Typical Applications

•Primarily Suited for DC−DC Converters

•For Ground Loop Isolation, Signal to Noise Isolation

•Communications – Adapters, Chargers

•Consumer – Appliances, Set Top Boxes

•Industrial – Power Supplies, Motor Control, Programmable Logic

Control

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MFP4 2.5x4.4, 1.27P

CASE TBD

MARKING DIAGRAM

See detailed ordering and shipping information on page 7 of

this data sheet.

ORDERING INFORMATION

PIN CONNECTIONS

1. ON = Corporate Logo

2. 21xx = Device Number

3. V = DIN EN/IEC60747−5−5 Option

4. X = One−Digit Year Code

5. YY = Digit Work Week

6. R1 = Assembly Package Code

FODM214, FODM217 Series

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SAFETY AND INSULATIONS RATING

As per DIN EN/IEC 60747−5−5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.

Compliance with the safety ratings shall be ensured by means of protective circuits.

Parameter Characteristics

Installation Classifications per DIN VDE 0110/1.89 Table 1,

For Rated Mains Voltage

< 150 VRMS I–IV

< 300 VRMS I–III

Climatic Classification 55/110/21

Pollution Degree (DIN VDE 0110/1.89) 2

Comparative Tracking Index 175

Symbol Parameter Value Unit

VPR Input−to−Output Test Voltage, Method A, VIORM x 1.6 = VPR,

Type and Sample Test with tm = 10 s, Partial Discharge < 5 pC

904 Vpeak

Input−to−Output Test Voltage, Method B, VIORM x 1.875 = VPR,

100% Production Test with tm = 1 s, Partial Discharge < 5 pC

1060 Vpeak

VIORM Maximum Working Insulation Voltage 565 Vpeak

VIOTM Highest Allowable Over−Voltage 4,000 Vpeak

External Creepage ≥ 5 mm

External Clearance ≥ 5 mm

DTI Distance Through Insulation (Insulation Thickness) ≥ 0.4 mm

TSCase Temperature (Note 1) 150 °C

IS,INPUT Input Current (Note 1) 200 mA

PS,OUTPUT Output Power (Note 1) 300 mW

RIO Insulation Resistance at TS, VIO = 500 V (Note 1) > 109W

1. Safety limit values – maximum values allowed in the event of a failure.

ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified.)

Symbol Parameter Value Units

TSTG Storage Temperature −55 to +150 °C

TOPR Operating Temperature −55 to +110 °C

TJJunction Temperature −55 to +125 °C

TSOL Lead Solder Temperature

(Refer to Reflow Temperature Profile)

260 for 10 sec °C

EMITTER

IF(average) Continuous Forward Current 50 mA

IF(peak) Peak Forward Current (1 ms pulse, 300 pps) 1 A

VRReverse Input Voltage 6 V

PDLED Power Dissipation (Note 2) 70 mW

DETECTOR

IC(average) Continuous Collector Current 50 mA

VCEO Collector−Emitter Voltage 80 V

VECO Emitter−Collector Voltage 7 V

PDCCollector Power Dissipation (Note 2) 150 mW

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

2. Functional operation under these conditions is not implied. Permanent damage may occur if the device is subjected to conditions outside

these ratings.

FODM214, FODM217 Series

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ELECTRICAL CHARACTERISTICS TA = 25°C unless otherwise specified

Symbol Parameter Device Conditions Min. Typ. Max. Units

EMITTER

VFForward Voltage FODM214 IF = ±20 mA

1.2 1.4

FODM217 IF = 20 mA

IRReverse Current FODM217 VR = 4 V 10 mA

CTTerminal Capacitance All V = 0 V, f = 1 kHz 30 250 pF

DETECTOR

BVCEO Collector−Emitter Breakdown Voltage All IC = 0.1 mA, IF = 0 mA 80 V

BVECO Emitter−Collector Breakdown Voltage All IE = 10 mA, IF = 0 mA 7 V

ICEO Collector Dark Current All VCE = 50 V, IF = 0 mA 100 nA

TRANSFER CHARACTERISTICS TA=25°C unless otherwise specified

Symbol Parameter Device Conditions Min. Typ. Max. Units

CTRCE Current Transfer Ratio

(collector−emitter)

FODM214 IF = ±1 mA, VCE = 5 V 20 400 %

FODM214A 50 250

FODM217A IF = 5 mA, VCE = 5 V 80 160

FODM217B 130 260

FODM217C 200 400

FODM217D 300 600

ICCollector Current FODM214 IF = ±1 mA, VCE = 5 V 0.2 2.5 mA

FODM217 IF = 5 mA, VCE = 5 V 4 30

CTR(SAT) Saturated Current Transfer Ratio FODM214 IF = ±8 mA, VCE = 0.4 V

FODM217 IF = 8 mA, VCE = 0.4 V

IC(SAT) Collector Current FODM214 IF = ±8 mA, VCE = 0.4 V

4.8

FODM217 IF = 8 mA, VCE = 0.4 V

VCE(SAT) Collector−Emitter Saturation Voltage FODM214 IF = ±8 mA, IC = 2.4 mA

0.4

FODM217 IF = 8 mA, IC = 2.4 mA

SWITCHING CHARACTERISTICS TA = 25°C unless otherwise specified

Symbol Parameter Conditions Min. Typ. Max. Units

tON Turn On Time IC = 2 mA, VCE = 10 V, RL = 100 W3ms

tOFF Turn Off Time IC = 2 mA, VCE = 10 V, RL = 100 W3ms

tROutput Rise Time (10%−90%) IC = 2 mA, VCE = 10 V, RL = 100 W3ms

tFOutput Fall Time (90%−10%) IC = 2 mA, VCE = 10 V, RL = 100 W3ms

ISOLATION CHARACTERISTICS

Symbol Parameter Conditions Min. Typ. Max. Units

VISO Input−Output Isolation Voltage Freq = 60 Hz, t = 1.0 min,

II−O v 10 mA (Note 3, 4)

3,750 VACRMS

RISO Isolation Resistance VI−O = 500 V (Note 3) 5 x 1010 W

CISO Isolation Capacitance Frequency = 1 MHz 0.6 1.0 pF

3. Device is considered a two terminal device: Pin 1 and 2 are shorted together and Pins 3 and 4 are shorted together.

4. 3,750 VACRMS for 1 minute duration is equivalent to 4,500 VACRMS for 1 second duration.

FODM214, FODM217 Series

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TYPICAL CHARACTERISTICS

Figure 1. Collector Power Dissipation vs. Ambient

Temperature

Figure 2. LED Power Dissipation vs. Ambient

Temperature

Figure 3. Forward Current vs. Forward Voltage Figure 4. Forward Voltage Temperature Coefficient vs.

Forward Current

Figure 5. Collector Emitter Voltage vs. Forward Current Figure 6. Collector Current vs. Collector−Emitter

Voltage

TA, AMBIENT TEMPERATURE (5C)

PDC, COLLECTOR POWER

DISSIPATION (mW)

, FORWARD VOLTAGE (V)

, FORWARD CURRENT (mA)

VCE, COLLECTOR−EMITTER

VOLTAGE (V)

PDLED, LED POWER DISSIPATION (mW)

, FORWARD CURRENT (mA)

IC, COLLECTOR CURRENT (mA)

VCE, COLLECTOR−EMITTER CURRENT (V)

0 25 50 75 100 125

100

120

140

160

0 25 50 75 100 125

TA, AMBIENT TEMPERATURE (5C)

0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

100

75°C

-55°C

25°C

110°C

110100

−0.4

−0.8

−1.2

−1.6

−2.0

−2.4

, FORWARD CURRENT (mA)

DVF/DTA, FORWARD VOLTAGE

TEMPERATURE COEFFICIENT

(mV/5C)

0 5 10 15 20

10 mA

7 mA

5 mA

3 mA

1 mA

0.5 mA

0510

FODM214 IF = 1 mA

FODM217 IF = 5 mA

FODM214, FODM217 Series

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Figure 7. Collector Current vs.

Small Collector−Emitter Voltage

Figure 8. Collector Current vs.

Forward Current

Figure 9. Collector Dark Current vs.

Ambient Temperature

Figure 10. Current Transfer Ratio vs.

Forward Current

Figure 11. Collector−Emitter Saturation vs.

Ambient Temperature

Figure 12. Collector Current vs.

Ambient Temperature

VCE, COLLECTOR−EMITTER VOLTAGE (V)

IC, COLLECTOR−CURRENT (mA)

TA, AMBIENT TEMPERATURE (5C)

VCE(SAT), COLLECTOR−EMITTER

SATURATION VOLTAGE (V)

IC, COLLECTOR CURRENT (A)

ICEO, COLLECTOR DARK

CURRENT (A)

IC, COLLECTOR CURRENT (mA)

TA, AMBIENT TEMPERATURE (5C)

, FORWARD CURRENT (mA)

, FORWARD CURRENT (A)

CTR − CURRENT TRANSFER RATIO (%)

0.0001 0.001 0.01 0.1

0.0001

0.001

0.01

0.1 10 V 5 V

VCE

= 0.4 V

−25 0 25 50 75 100

1E−11

1E−10

1E−9

1E−8

1E−7

1E−6

1E−5

24 V

10 V

5 V

VCE

= 48 V

0.0001 0.001 0.01 0.1

100

1000

10 V

5 V

VCE

= 0.4 V

−250 255075100

0.00

0.02

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0.18

IF = 20 mA

IC = 1 mA

IF = 1 mA

= 0.2 mA

= 8 mA

= 2.4 mA

−25 0 25 50 75 100

0.1

100

20 mA

10 mA

5 mA

1 mA

= 0.5 mA

0.0 0.5 1.0

FODM214 IF = 1 mA

FODM217 IF = 5 mA

FODM214, FODM217 Series

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Figure 13. Switching Time vs. Load Resistance Figure 14. Switching Time vs. Ambient

Temperature

RL, LOAD RESISTANCE (kW)

t, SWITCHING TIME (ms)

TA, AMBIENT REMPERATURE (5C)

1 10 100

0.1

100

1000

TA = 25 °C

VCC

= 5 V

= 16 mA

tOFF

tON

−25 0 25 50 75 100

100

VCC

= 10 V

= 2 mA

= 100

tOFF

tON

t, SWITCHING TIME (ms)

TEST CIRCUIT

Figure 15. Test Circuit for Switching Time

VCC

IFMonitor

90%

10%

tON tOFF

tRtF

FODM214, FODM217 Series

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REFLOW PROFILE

Figure 16. Reflow Profile

Proﬁle Freature Pb−Free Assembly Proﬁle

Temperature Min. (Tsmin) 150°C

Temperature Max. (Tsmax) 200°C

Time (tS) from (Tsmin to Tsmax) 60–120 seconds

Ramp−up Rate (tL to tP) 3°C/second max.

Liquidous Temperature (TL) 217°C

Time (tL) Maintained Above (TL)60–150 seconds

Peak Body Package Temperature 260°C +0°C / –5°C

Time (tP) within 5°C of 260°C30 seconds

Ramp−down Rate (TP to TL) 6°C/second max.

Time 25°C to Peak Temperature 8 minutes max.

ORDERING INFORMATION (Note 5)

Part Number Package Packing Method

FODM214A SOP 4−Pin Tube (100 units)

FODM214AR2 SOP 4−Pin Tape and Reel (3000 units)

FODM214AV SOP 4−Pin, DIN EN/IEC60747−5−5 Option Tube (100 units)

FODM214AR2V SOP 4−Pin, DIN EN/IEC60747−5−5 Option Tape and Reel (3000 units)

5. The product orderable part number system listed in this table also applies to the FODM214, FODM217A, FODM217B, FODM217C, and

FODM217D products.

FODM214, FODM217 Series

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PACKAGE DIMENSIONS

MFP4 2.5x4.4, 1.27P

CASE TBD

ISSUE TBD

1.27

1.52

4.837.87

0.61

TOP VIEW

FRONT VIEW SIDE VIEW

LAND PATTERN RECOMMENDATION

NOTES:

A. NO INDUSTRY STANDARD APPLIES TO

THIS PACKAGE

B. ALL DIMENSIONS ARE IN MILLIMETERS

C. DIMENSIONS DO NOT INCLUDE MOLD

FLASH OR BURRS

D. DRAWING FILENAME: MKT−MFP04Drev

2.60±0.30

2.00±0.20

0.1±0.10

1.27±0.25

4.40±0.20

0.40±0.10

5.44±0.30

7±0.45

0.25±0.05

DETAIL A

SEATING

PLANE

MIN 0.5 0.127

4°

1.30±0.30

GAGE

PLANE

DETAIL A

FODM214, FODM217 Series

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FODM214/D

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