©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
J108/J109/J110/MMBFJ108
Absolute Maximum Ratings * TA=25°C unless otherwise noted
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Electrical Characteristics TA=25°C unless otherwise noted
* Pulse Test: Pulse Width 300µs, Duty Cycle 2.0%
Symbol Parameter Value Units
VDG Drain-Gate Voltage 25 V
VGS Gate-So urce Voltage -25 V
IGF Forward Gate Current 10 mA
TJ, Tstg Operating and Storage Junction Temperature Range -55 ~ +150 °C
Symbol Parameter Test Co ndition Min. Max. Units
Off Characteristics
V(BR)GSS Gate-Source Breakdwon Voltage IG = -10µA, VDS = 0 -25 V
IGSS Gate Reverse Current VGS = -15V, VDS = 0
VGS = -15V, VDS = 0, TA = 100°C-3.0
-200 nA
nA
VGS(off) Gate -Sou r ce C u t o ff Voltage VDS = 15V, ID = 10nA 108
109
110
-3.0
-2.0
-0.5
-10
-6.0
-4.0
V
V
V
On Characteristics
IDSS Zero-Gate Voltage Drain Current * VDS = 15V, IGS = 0 108
109
110
80
40
10
mA
mA
mA
rDS(on) Drain-Source On Resistance VDS 0.1V, VGS = 0 108
109
110
8.0
12
18
Small Signal Characteristics
Cdg(on)
Csg(off) Drain Ga te & So u rce Gate On
Capacitance VDS = 0, VGS = 0, f = 1.0MHz 85 pF
Cdg(on) Drain-Gate Off Capacitance VDS = 0, VGS = -10, f = 1.0MHz 15 pF
Csg(off) Source-Gate Off Capacitance VDS = 0, VGS = -10, f = 1.0MHz 15 pF
J108/J109/J110/MMBFJ108
N-Channel Switch
This device is designed for digital switching
applications where very low on resistance is
mandatory.
Sourced from Process 58.
1. Drain 2. Source 3. Gate
1
2
3
TO-92
1
1. Drain 2. Source 3. Gate
SuperSOT-3
Marking: I8
©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
J108/J109/J110/MMBFJ108
Thermal Charac teris tics TA=25°C unless otherwise noted
* Device mounted on FR-4 PCB 1.6” × 1.6” × 0.06"
Symbol Parameter Max. Units
J108 - 110 *MMBFJ108
PDTotal Device Dissipation
Derate above 25°C625
5.0 350
2.8 mW
mW/°C
RθJC Thermal Resistance, Junction to Case 125 °C/W
RθJA Thermal Resistance, Junction to Ambient 357 556 °C/W
©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
J108/J109/J110/MMBFJ108
Typical Characteristics
Figure 1 . C om mon Drain-Source Figure 2. Parameter Inte r a c tions
Figure 3 . C om mon Drain-Source Figure 4. C om mon Drain-Source
Figure 5. Normalized Drain Resistance vs
Bias Voltage Figure 6. Noise Voltage vs Frequency
Common Drain-Source
0 0.4 0.8 1.2 1.6 2
0
20
40
60
80
100
V - DRAIN-SOURCE VOLTAGE (V)
I - DRAIN CURRENT (mA)
DS
D
T = 25
TYP V = - 5.0 V
GS(off)
A
- 4.0 V
- 5.0 V
- 3.0 V
- 2.0 V
- 1.0 V
V = 0 V
GS
°
°°
°C
Parameter Interactions
0.1 0.5 1 5 10
5
10
50
100
10
50
100
500
1,000
V - GATE CUTOFF VOLTAGE (V)
r - DRAIN "ON" RE SISTANCE
GS (OFF)
DS
I @ V = 5.0V, V = 0 PULSED
r @ V = 100mV, V = 0
V @ V = 5.0V, I = 3.0 nA
GS(off)
DSS
rDS
IDSS
(
)
DS DS
D
GS
GS
DSS
I - DRAIN CURRENT (mA)
DS
DS
___ __
Common Drain-Source
-20-16-12-8-40
10
100
V - GATE-SOURCE VOLTAGE (V)
C (C ) - CAPACITANCE (pF)
GS
ts
C (V = 5.0V)
iss
f = 0.1 - 1.0 MHz
DS
C (V = 0 )
rss DS
rs
Common Drain-Source
012345
0
10
20
30
40
50
V - DRAIN-SOURCE VOL TAGE (V)
I - DRAIN CURRENT (mA)
DS
D
- 0.4 V - 0.5 V
- 0.3 V
- 0.2 V
- 0.1 V
V = 0 V
GS
T = 25
TYP V = - 0.7 V
GS(off)
A°
°°
°C
Normalized Drain Resistance
vs Bias Voltage
0 0.2 0.4 0.6 0.8 1
1
2
5
10
20
50
100
V /V - NORMALIZED GATE-SOURCE VOLTAGE (V)
r - NORMALIZED RESISTANCE
GS
DS
r =
DS
V @ 5.0V, 10 µ
µµ
µA
GS(off)
r DS
________
V
GS(off)
V
GS
1 -
GS(off)
Noise Volt age vs Frequency
0.01 0.03 0.1 0.5 1 2 10 100
1
5
10
50
100
f - FREQUENCY (kH z)
e - NOISE VOLTAGE (nV / Hz)
n
V = 10V
BW = 6.0 Hz @ f = 10 Hz, 100 Hz
= 0.21 @ f
1.0 kHz
DG
I = 10 mA
D
I = 1.0 mA
D
©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
J108/J109/J110/MMBFJ108
Typical Characteristics (Continued)
Figur e 7 . Sw itch ing Tur n - O n Tim e vs
Gate-Source Cutoff Voltage Figur e 8. Switchi ng Turn-On Time vs Drain Current
Figure 9. On Resistance vs Drain Current Figure 10. Output Conductance vs Drain Current
Figure 11. Transconductance vs Drain Current Figure 12. Power Dissipation vs Ambient Temperature
ON
GS(off)
Switching Turn-On Time vs
Gate-Source Cuto ff Voltage
-10-8-6-4-20
0
2
4
6
8
10
V - GATE-SOURC E C UTOFF VOLTAGE (V)
t - TURN-ON TIME (ns)
T = 25
V = 1.5V
V = - 12V
GS(off)
A
DD
I = 30 mA
D
I = 10 mA
D
°
°°
°C
GS(off)
ON
Switching Turn-On Time
vs Dr ain Cur r ent
0 5 10 15 20 25
0
10
20
30
40
50
I - DRAIN CURREN T (mA)
t - TURN-OFF TIME (ns)
D
OFF
V = - 8.5V
V = - 5.5V
V = - 3.5V
GS(off)
GS(off)
GS(off)
T = 25
V = 1.5V
V = - 12V
GS(off)
A
DD
°
°°
°C
On Resistance vs Drain Current
1 10 100
1
5
10
50
100
I - DRAIN CURRENT (mA)
r - DRAIN "ON" RESISTA NCE
D
DS
V = - 3.0V
GS(off)
25
(
)
125
25
125
V = - 5.0V
GS(off)
V = 0
GS
- 55
°
°°
°C
°
°°
°C
°
°°
°C
°
°°
°C
°
°°
°C
Output Conductance
vs Drain Current
0.1 1 10
1
10
100
I - DRAIN CURRENT (mA)
g - OUTPUT CONDUCTANCE ( mhos)
D
os
VGS(off)
T = 25
f = 1.0 kHz
V = 5.0V
DG
µ
µµ
µ
A
10V
15V 20V
5.0V
5.0V
10V
15V
20V
- 4.0V 10V 15V
20V
- 2.0V
- 1.0V
°
°°
°C
Transconductance
vs Drain Current
0.1 1 10
1
10
100
I - DRAIN CURRENT (mA)
g - TRANSCONDUCTANCE (mmhos)
D
fs
V = - 1.0V
V = - 3.0V
V = - 5.0V
GS(off)
GS(off)
GS(off)
T = 25
V = 10V
f = 1.0 kHz
A
DG
T = - 55
T = 25
T = 125
A
A
A
°
°°
°C
°
°°
°C
°
°°
°C
°
°°
°C
0 255075100125150
0
100
200
300
400
500
600
700
SuperSOT-3 TO-92
PD - POWER DISSIPATION(mW)
TEM PERATUR E (oC)
Package Dimensions
J108/J109/J110/MMBFJ108
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
0.46 ±0.10
1.27TYP
(R2.29)
3.86MAX
[1.27 ±0.20]1.27TYP
[1.27 ±0.20]
3.60 ±0.20
14.47 ±0.40
1.02 ±0.10
(0.25) 4.58 ±0.20
4.58 +0.25
–0.15
0.38 +0.10
–0.05
0.38 +0.10
–0.05
TO-92
©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
J108/J109/J110/MMBFJ108
Package Dimensions (Continued)
Dimensions in Millimeters
SuperSOT-3
©2002 Fairchild Semiconductor Corporation Rev. I1
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intended to be an exhaustive list of all such trademarks.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devic es or syst em s
which, (a) ar e intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production T his datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconduct or reserv es the right to make
changes at any time without notice in order to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
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